Photosensitive component, camera module, terminal device and preparation method

Abstract

The present application discloses a photosensitive component, a camera module, a terminal device and a preparation method, wherein the photosensitive component comprises: a circuit board, a receiving hole is provided on the circuit board, and the receiving hole penetrates the upper surface and the lower surface of the circuit board; a reinforcing plate, the reinforcing plate is overlapped and fixed with the circuit board, and the exposed area on the surface of the reinforcing plate overlaps with the receiving hole; a soft film is provided at the edge of the exposed area; a photosensitive chip, the photosensitive chip is attached to the exposed area of ​​the reinforcing plate and received in the receiving hole; the edge area of ​​the photosensitive chip is supported by the soft film. The photosensitive component, camera module and terminal device provided in the present application are used to solve the technical problems existing in the prior art that the edge position of the photosensitive chip is prone to distortion, corner light loss and sharp angle drop, which affect the imaging quality. The technical effect of improving the imaging quality is achieved.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to a photosensitive component, a camera module, a terminal device and a preparation method thereof. Background Art

[0002] With the popularization of mobile terminals, people's lives and work are inseparable from various mobile terminals. The camera function of mobile terminals is even more widely used, and users have higher and higher requirements for the image quality of the camera modules of mobile terminals.

[0003] The photosensitive chip of the existing camera module is directly pasted on the reinforcement plate or circuit board, and the light entering the camera module is prone to distortion, corner light loss, and sharp angle drop at the edge of the photosensitive chip, thereby reducing the imaging pixels of the camera module and affecting the imaging quality.

[0004] Application Contents

[0005] In view of the above problems, the present application is proposed to provide a photosensitive component, a camera module, a terminal device and a preparation method that overcome the above problems or at least partially solve the above problems.

[0006] In a first aspect, the present application provides a photosensitive component, comprising:

[0007] A circuit board, wherein a receiving hole is formed on the circuit board, and the receiving hole penetrates the upper surface and the lower surface of the circuit board;

[0008] A reinforcing plate, the reinforcing plate is overlapped and fixed with the circuit board, and an exposed area on the surface of the reinforcing plate overlaps with the containing hole; a soft film is provided at the edge of the exposed area;

[0009] A photosensitive chip is attached to the exposed area of ​​the reinforcing plate and accommodated in the accommodation hole; an edge area of ​​the photosensitive chip is supported by the soft film.

[0010] Optionally, the accommodating hole is a polygonal cavity, the exposed area is a polygonal area, and the soft film is arranged at a corner of the exposed area.

[0011] Optionally, the accommodating hole is a square cavity, the exposed area is a square area, and the soft film is arranged at the four corners of the exposed area.

[0012] Optionally, the soft film is a polyimide film.

[0013] Optionally, the middle portion of the photosensitive chip is bonded and fixed to the middle portion of the exposed area.

[0014] Optionally, the reinforcement plate is a steel plate.

[0015] Optionally, the edge area of ​​the photosensitive chip is supported by the soft film until the middle of the photosensitive surface of the photosensitive chip is lower than the edge area of ​​the photosensitive surface.

[0016] Optionally, the soft film is squeezed by the edge area of ​​the photosensitive chip, causing deformation to support and protect the photosensitive chip.

[0017] Optionally, the photosensitive component includes more than two circular soft films, and the center of each soft film is at the same distance from the inner edge of the accommodating hole.

[0018] In a second aspect, a camera module is provided, comprising: the photosensitive component described in the first aspect.

[0019] In a third aspect, a terminal device is provided, comprising: the camera module described in the second aspect.

[0020] In a fourth aspect, a method for preparing a photosensitive component is provided, wherein the method is used to prepare the photosensitive component according to any one of claims 1 to 9, and the method comprises:

[0021] Laminating the soft film on the reinforcing plate;

[0022] The circuit board with the accommodating hole is attached to the reinforcing plate so that the soft film is located at the edge of the exposed area on the surface of the reinforcing plate;

[0023] The photosensitive chip is attached to the exposed area on the surface of the reinforcing plate, and the photosensitive chip is accommodated in the accommodation hole; the edge area of ​​the photosensitive chip is supported by the soft film;

[0024] Optionally, laminating the soft film on the reinforcing plate includes: laminating a whole piece of soft film on the fixed reinforcing plate; pre-pressing and fixing the whole piece of soft film and the reinforcing plate; laser burning the whole piece of soft film to form a graphic soft film for supporting the photosensitive chip at the edge position of the preset exposed area; removing the remaining soft films except the graphic soft film, and trimming the edge of the graphic soft film.

[0025] Optionally, laminating the circuit board having the accommodating hole on the reinforcing plate includes: performing a molding process and a pressing plate flattening process on both the circuit board and the reinforcing plate; and laminating and fixing the circuit board and the reinforcing plate.

[0026] The technical solution provided in the embodiments of the present application has at least the following technical effects or advantages:

[0027] The photosensitive component, camera module, terminal device and preparation method provided in the embodiments of the present application have a receiving hole on the circuit board to accommodate the photosensitive chip attached to the reinforcement plate, and a soft film is arranged at the edge of the circuit area of ​​the reinforcement plate located in the receiving hole, and the soft film is used as a supporting point to support the edge area of ​​the photosensitive chip attached to the exposed area, so as to control the warping degree, so as to effectively avoid the phenomenon that the center of the photosensitive surface of the photosensitive chip is higher than the edge due to the edge area approaching the surface of the reinforcement plate, reduce the probability of distortion at the edge of the photosensitive chip, light loss at the corners and decrease of the acute angle, and effectively improve the imaging quality.

[0028] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Also, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0030] Figure 1 This is a three-dimensional schematic diagram of a photosensitive component in an embodiment of the present application;

[0031] Figure 2 It is a side view schematic diagram of the photosensitive component in the embodiment of the present application;

[0032] Figure 3 This is a front view of a photosensitive component in an embodiment of the present application;

[0033] Figure 4 This is a structural diagram of the camera module in the embodiment of the present application;

[0034] Figure 5 This is a structural diagram of a mobile terminal in an embodiment of the present application;

[0035] Figure 6 This is a flow chart for preparing a photosensitive component in an embodiment of the present application. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0037] In an optional embodiment, a photosensitive component is provided, such as Figure 1-3 As shown, including:

[0038] A circuit board 1, wherein a receiving hole 11 is formed on the circuit board 1, and the receiving hole 11 penetrates the upper surface and the lower surface of the circuit board 1;

[0039] A reinforcing plate 2, wherein the reinforcing plate 2 is overlapped and fixed with the circuit board 1, and an exposed area 21 on the surface of the reinforcing plate 2 overlaps with the containing hole 11; a soft film 22 is provided at the edge of the exposed area 21;

[0040] The photosensitive chip 3 is attached to the exposed area 21 of the reinforcing plate 2 and accommodated in the accommodation hole 11 ; the edge area of ​​the photosensitive chip 3 is supported by the soft film 22 .

[0041] Specifically, the photosensitive components in the camera module are often directly coated with glue in the middle of the bottom surface, and then glued to the reinforcement plate. In order to prevent the glue from overflowing, the photosensitive components are supported by solidified glue in the middle, but not in the edge area. Therefore, the photosensitive chip is often high in the middle and low around or nearly flat, which leads to problems such as light distortion, light loss and sharp angle drop at the edges.

[0042] In the present application, a receiving hole 11 is provided on the circuit board 1 to accommodate the photosensitive chip. On the one hand, it protects the edge of the photosensitive chip 3, on the other hand, it further fixes the position of the photosensitive chip 3, and on the other hand, it facilitates the bonding connection between the circuit board 1 and the photosensitive chip 3.

[0043] In addition, the present application arranges a soft film 22 at the edge of the exposed area 21 surrounded by the accommodating hole 11 of the reinforcing plate 2. On the one hand, the soft film 22 is used as a supporting point to support the edge area of ​​the photosensitive chip 3 pasted on the exposed area 21, so that the edge area will not be lower than the middle part, thereby ensuring the imaging quality. On the other hand, in the process of pressing down the photosensitive chip 3 after pasting, the height of the soft film 22 is adjustable due to its softness. The photosensitive chip 3 is in contact with the soft material to deliberately protect the chip from damage. In addition, since the height of the soft film 22 can be adjusted by squeezing, it can also absorb the assembly tolerance.

[0044] The specific structure of the photosensitive component is described below:

[0045] The circuit board 1 can be electrically connected to an external control and computing module through a flexible circuit board. A through receiving hole 11 is provided in the middle or side of the circuit board 1. The cross-sectional shape of the receiving hole 11 is not limited and can be circular or polygonal.

[0046] The upper surface of the reinforcing plate 2 is attached and fixed to the lower surface of the circuit board 1, which can be fixed by gluing or snapping, and there is no limitation here. Preferably, the reinforcing plate can be set as a steel plate, and of course it can also be other hard plates.

[0047] After the reinforcing plate 2 is overlapped and fixed to the circuit board 1, the area on the reinforcing plate 1 corresponding to the location of the receiving hole 11 on the circuit board will be exposed through the receiving hole 11, which is the exposed area 21. Therefore, the position, shape and size of the exposed area 21 and the receiving hole 11 are corresponding. If the cross section of the receiving hole 11 is circular, the exposed area 21 is also a circle of the same size. If the cross section of the receiving hole 11 is a polygon, the exposed area 21 is also a polygon of the same size.

[0048] The soft film 22 is disposed at the edge of the exposed area 21. There are many specific ways to dispose the soft film 22. For example, the soft film 22 may be disposed as follows: Figure 1 As shown, multiple independent point-shaped soft films are distributed at the edge of the exposed area 21 to serve as support points to support the edge of the photosensitive chip 3; the soft film 22 can also be set as multiple strip-shaped soft films, which are distributed in isolation along the inner side of the edge of the exposed area 21 to serve as support strips to support the edge of the photosensitive chip 3; the soft film 22 can also be set as a closed ring-shaped soft film, which is continuously distributed along the inner side of the edge of the exposed area 21 to fully support the edge of the photosensitive chip 3. There is no limitation here and they are not listed one by one.

[0049] Preferably, the thickness of the soft film can be set to 65±5um, 75±5um or 85±5um.

[0050] In the specific implementation process, the setting position of the corresponding soft film 22 may be different according to the different shapes of the exposed area 21. Take the case where the soft film 22 is a plurality of independent dot-shaped soft films as an example: if the receiving hole 11 is a polygonal cavity, the corresponding exposed area 21 is a polygonal area, and the soft film 22 is set at the corners of the exposed area 21 to support the corners where the chip is more likely to sag, so as to ensure the warping. Furthermore, if the receiving hole 11 is a square cavity, and the exposed area is a square area 21, the soft film is set at the four corners of the exposed area 21. Preferably, Figure 2 As shown, the distance between the center of each soft film 22 and the inner edge of the receiving hole is the same, which is a, and a can be set to 0.65±0.10mm. Preferably, the diameter of the dot-shaped soft film can be 0.6±0.05mm.

[0051] Furthermore, if the shape of the accommodating hole 11 does not match the shape of the photosensitive chip 3, the position of the soft film 22 is preferably set according to the shape of the photosensitive chip 3, so that the soft film 22 can be aligned with the corner supporting the photosensitive chip 3 to ensure its warping.

[0052] Preferably, the soft film 22 can be a polyimide film to obtain sufficient support and softness. The soft film 22 can also be a soft material such as a cover film that can be compressed and adjusted in height.

[0053] In the specific implementation process, the soft film 22 is pressed or pasted on the exposed area 21. The photosensitive chip 3 is pasted on the exposed area 21. Preferably, the middle part of the bottom surface of the photosensitive chip 3 and the middle part of the exposed area 21 are fixed by glue.

[0054] The edge area of ​​the photosensitive chip 3 is supported by the soft film 22 to prevent the edge area of ​​the photosensitive chip 3 from being lower than the middle part, and the soft film 22 will deform due to its softness after being subjected to force, and also protect the photosensitive chip 3 when supporting it. Preferably, the soft film 22 is arranged to support the photosensitive chip 3 until the middle part of its photosensitive surface is lower than the edge area of ​​its photosensitive surface, so as to better reduce the probability of distortion, corner light loss, and sharp angle drop at the edge position of the photosensitive chip, and effectively improve the imaging quality.

[0055] The photosensitive chip 3 is electrically connected to the circuit board, which may be bonding or wire connection, which is not limited here.

[0056] Based on the same application concept, this application also provides a camera module, such as Figure 4 As shown, it includes the photosensitive component 401 provided in the present application, and also includes a lens component 402, and the lens component 402 is arranged on the photosensitive path of the photosensitive component 401.

[0057] Based on the same application concept, the present application also provides a terminal device, such as Figure 5 As shown, it includes a camera module 501 provided in the present application, and the camera module is installed on the terminal body of the terminal device. The terminal device can be a smart phone, a notebook, a tablet or a smart watch, etc., which is not limited here.

[0058] Based on the same application concept, the present application also provides a method for preparing a photosensitive component, the method is used to prepare the aforementioned photosensitive component, such as Figure 6 As shown, the method includes:

[0059] Step S601, laminating the soft film on the reinforcing plate;

[0060] Step S602, laminating the circuit board with the receiving hole on the reinforcing plate so that the soft film is located at the edge of the exposed area on the surface of the reinforcing plate;

[0061] Step S603, attaching the photosensitive chip to the exposed area on the surface of the reinforcing plate, and accommodating the photosensitive chip in the accommodating hole; the edge area of ​​the photosensitive chip is supported by the soft film.

[0062] Specifically, the process of attaching the soft film to the reinforcing plate may include steps S6011-S6014:

[0063] Step S6011, affixing a whole piece of soft film on the fixed reinforcing plate. That is, the soft film in this step is a whole piece and has no pattern formed, and the whole piece of soft film is firstly affixed to the surface of the reinforcing plate.

[0064] Step S6012, pre-press and fix the entire soft film and the reinforcing plate. In order to better fix the soft film and the reinforcing plate and prevent the occurrence of misplaced waste plates, two pre-pressing fixations can be used: the first pre-pressing is to initially align and fix the soft film and the reinforcing plate to prevent the soft film from falling, and the position can be adjusted at this time; the second pre-pressing firmly presses and fixes the soft film on the reinforcing plate.

[0065] Step S6013, laser burns the entire soft film to form a patterned soft film for supporting the photosensitive chip at the edge of the preset exposed area. Through this step, the entire soft film can be burned into a desired shape at the preset position, for example, a circular soft film can be formed at the corner of the preset exposed area. Further, after the patterned soft film is burned, it can be pressed again to prevent the soft film from falling off due to the burning process.

[0066] Step S6014, removing the remaining soft films except the patterned soft film, and trimming the edges of the patterned soft film, that is, removing the unnecessary soft film waste, and trimming the burrs around the necessary patterned soft film.

[0067] After the patterned soft film is fixed on the reinforcing plate, the circuit board with the receiving hole is attached to the reinforcing plate. The process may include steps S6021-S6022:

[0068] Step S6021, the circuit board and the reinforcement plate are subjected to a molding process and a pressing plate flattening process. In the specific implementation process, the plate identification characters can be printed on the circuit board first, and then the circuit board and the reinforcement plate are molded. Among them, the molding of the circuit board can adopt a UV molding process to open the receiving holes of the circuit board, and punch out a circuit board of a preset size. The molding of the reinforcement plate can adopt a CNC molding process or a laser cutting process. After molding, the circuit board and the reinforcement plate are pressed to make the plate flat.

[0069] Step S6022, the circuit board and the reinforcing plate are bonded and fixed, that is, the circuit board and the reinforcing plate after molding and pressing are pressed together.

[0070] Finally, the photosensitive chip is attached and bonded, as well as other post-processing processes.

[0071] Since the method for preparing the photosensitive component provided in this embodiment is a method for preparing the photosensitive component provided in this application, wherein the structure, process parameters, etc. of the photosensitive component have been described in detail in the introduction to the photosensitive component, they will not be repeated here for the sake of brevity of the specification.

[0072] The technical solution provided in the embodiments of the present application has at least the following technical effects or advantages:

[0073] The photosensitive component, camera module, terminal device and preparation method provided in the embodiments of the present application have a receiving hole on the circuit board to accommodate the photosensitive chip attached to the reinforcement plate, and a soft film is arranged at the edge of the circuit area of ​​the reinforcement plate located in the receiving hole, and the soft film is used as a supporting point to support the edge area of ​​the photosensitive chip attached to the exposed area, so as to control the warping degree, so as to effectively avoid the phenomenon that the center of the photosensitive surface of the photosensitive chip is higher than the edge due to the edge area approaching the surface of the reinforcement plate, reduce the probability of distortion at the edge of the photosensitive chip, light loss at the corners and decrease of the acute angle, and effectively improve the imaging quality.

[0074] Furthermore, those skilled in the art will appreciate that although some embodiments herein include certain features included in other embodiments but not other features, the combination of features from different embodiments is meant to be within the scope of the present application and to form different embodiments.

[0075] It should be noted that the above embodiments illustrate the present application rather than limit the present application, and that those skilled in the art may design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference symbol between brackets should not be constructed as a limitation to the claims. The word "comprising" does not exclude the presence of components or steps not listed in the claims. The word "one" or "an" preceding a component does not exclude the presence of multiple such components. The present application may be implemented by means of hardware including several different components and by means of appropriately programmed computers. In a unit claim that lists several devices, several of these devices may be embodied by the same hardware item. The use of the words first, second, and third, etc. does not indicate any order. These words may be interpreted as names.

[0076] Although the preferred embodiments of the present application have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present application.

[0077] Obviously, those skilled in the art can make various changes and modifications to the embodiments of the present application without departing from the spirit and scope of the embodiments of the present application. Thus, if these modifications and variations of the embodiments of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A photosensitive component, characterized in that: include: A circuit board, wherein a receiving hole is formed on the circuit board, and the receiving hole penetrates the upper surface and the lower surface of the circuit board; A reinforcing plate, the reinforcing plate is overlapped and fixed with the circuit board, and an exposed area on the surface of the reinforcing plate overlaps with the containing hole; a soft film is provided at the edge of the exposed area; A photosensitive chip, the photosensitive chip is attached to the exposed area of ​​the reinforcing plate and accommodated in the accommodation hole; the edge area of ​​the photosensitive chip is supported by the soft film until the middle of the photosensitive surface of the photosensitive chip is lower than the edge area of ​​the photosensitive surface, the soft film is squeezed by the edge area of ​​the photosensitive chip, and deforms due to its softness after being subjected to force, and also protects the photosensitive chip when supporting it; The soft membranes are two or more circular soft membranes, and the distance between the center of each soft membrane and the inner edge of the accommodating hole is the same.

2. The photosensitive component according to claim 1, characterized in that: The accommodating hole is a polygonal cavity, the exposed area is a polygonal area, and the soft film is arranged at a corner position of the exposed area.

3. The photosensitive component according to claim 1, characterized in that: The accommodating hole is a square cavity, the exposed area is a square area, and the soft film is arranged at the four corners of the exposed area.

4. The photosensitive component according to claim 1, characterized in that: The soft film is a polyimide film.

5. The photosensitive component according to claim 1, characterized in that: The middle part of the photosensitive chip is bonded and fixed to the middle part of the exposed area.

6. The photosensitive component according to claim 1, characterized in that: The reinforcing plate is a steel plate.

7. A camera module, characterized in that: include: The photosensitive component according to any one of claims 1 to 6.

8. A terminal device, characterized in that: include: The camera module as described in claim 7.

9. A method for preparing a photosensitive component, characterized in that: The method is used to prepare the photosensitive component according to any one of claims 1 to 6, and the method comprises: Laminating the soft film on the reinforcing plate; The circuit board with the accommodating hole is attached to the reinforcing plate so that the soft film is located at the edge of the exposed area on the surface of the reinforcing plate; The photosensitive chip is attached to the exposed area on the surface of the reinforcing plate, and the photosensitive chip is accommodated in the accommodating hole; the edge area of ​​the photosensitive chip is supported by the soft film.

10. The method according to claim 9, characterized in that The step of laminating the soft film on the reinforcing plate comprises: Laminating the entire soft film on the fixed reinforcing plate; Pre-pressing and fixing the entire soft film and the reinforcement plate; Laser burning the entire soft film to form a patterned soft film for supporting the photosensitive chip at the edge of the preset exposed area; The remaining soft films except the patterned soft film are removed, and the edge of the patterned soft film is trimmed.

11. The method according to claim 9, characterized in that The circuit board with the accommodation hole formed therein is attached to the reinforcing plate, comprising: Performing a forming process and a pressing plate leveling process on both the circuit board and the reinforcement plate; The circuit board and the reinforcing plate are adhered and fixed.

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