Heat absorption and heat preservation system for refrigeration and heat preservation box and refrigeration and heat preservation box

Abstract

A heat absorption and heat preservation system for a refrigeration and heat preservation box, comprising: an insulation body for accommodating materials that need to be refrigerated and insulated, the mouth of the insulation body being provided with threads; an insulation cavity comprising a first insulation cavity and a second insulation cavity that are connected to each other; the second insulation cavity comprising a back cover, the first insulation cavity being sealed to the mouth of the insulation body by threads; the semiconductor refrigerator being suspended in a closed space formed by the insulation body and the insulation cavity. The heat absorption and heat preservation system provided by the present invention can effectively reduce heat conduction inside the insulation body material and improve sealing efficiency. At the same time, the overall structure of the refrigeration and heat preservation box is compact, all components are reasonably arranged, and it is easy to carry.

Description

Technical Field

[0001] The invention relates to a heat absorption and heat preservation system for providing a special environment for stored materials, and in particular to a heat absorption and heat preservation system for a refrigeration and heat preservation box. Background Art

[0002] Medicines are substances or preparations for preventing, treating or diagnosing human and livestock diseases. Most modern medicines are refrigerated medicines. Some medicines need to be stored in a relatively low environment, such as insulin, which is a commonly used medicine stored at low temperatures. At present, when insulin is carried, it is often inactivated due to the high storage temperature, which affects the patient's use. For example, after a skin burn, some biological dressings and cytokines are generally used clinically to spray the wound surface to promote rapid healing of the wound surface. However, drugs containing the above-mentioned biological dressings and cytokines need to be stored in a low temperature environment to ensure their activity and efficacy, otherwise the drugs will become ineffective or even produce some harmful components. In some special or emergency environments, it is necessary to carry the above-mentioned drugs containing biological dressings and cytokines for rescue. Due to the lack of a corresponding refrigerated environment, the above-mentioned drugs are difficult to carry and store, which in turn affects emergency treatment.

[0003] There are two existing portable low-temperature storage technology methods for drugs. One is to place low-temperature auxiliary materials such as ice cubes and drugs in the same insulation device, and the other is a large electronic refrigeration refrigerator that relies on car power or portable power (the refrigeration body is located on the side or bottom of the refrigerator. Once the power is off, the refrigeration and heat dissipation body immediately starts to heat the inside of the refrigerator). The insulation structure used in both technologies is foam insulation technology. When the ambient temperature exceeds 20 degrees Celsius, the insulation effect of the temperature difference change is less than ten degrees is only about six hours. If you carry drugs that need to be stored at low temperatures, due to portability requirements, the volume of the insulation device is limited to a certain range, so the foam insulation effect is worse, which brings great inconvenience to doctors and patients when carrying drugs outside. Large volume, poor insulation, and unreasonable refrigeration / heat dissipation structure constitute the three major defects of the existing technology, and there is also the problem of high cost. Summary of the invention

[0004] The purpose of the present invention is to provide a heat absorbing and heat preservation system with small volume, compact structure and reasonable refrigeration / heat dissipation structure layout, which can be used in conjunction with a refrigeration and heat preservation box to conveniently store items that need to be stored at low temperatures.

[0005] The present invention solves the technical problem by adopting the following technical scheme: a heat absorption and insulation system for a refrigeration and insulation box, comprising: a semiconductor refrigerator, the semiconductor refrigerator comprising a refrigeration plate, a cold-end heat absorber and a hot-end radiator; an insulation body, used to accommodate materials that need to be refrigerated and insulated, the mouth of the insulation body is provided with a thread; an insulation cavity, the cold-end heat absorber is connected to the insulation cavity, and is suspended in a closed cavity formed by the insulation body and the insulation cavity.

[0006] Optionally, the heat-insulating cavity comprises a first heat-insulating cavity and a second heat-insulating cavity connected to each other, the first heat-insulating cavity is hollow, and a mouth is provided with a sealing thread adapted to a mouth of the heat-insulating body.

[0007] Optionally, the second insulation cavity includes a central groove and an annular groove at least partially surrounding the central groove, the opening of the central groove faces the docking direction with the first insulation cavity, the bottom surface of the central groove forms at least a portion of the rear surface of the insulation cavity, the opening direction of the annular groove is opposite to that of the central groove, and the bottom surface of the annular groove forms the docking surface between the second insulation cavity and the first insulation cavity.

[0008] Optionally, a receiving groove for receiving the semiconductor refrigerator is provided at the joint between the first insulation cavity and the second insulation cavity, and the cold end heat absorber includes a connecting end, and the connecting end is adapted to the receiving groove so that the cold end heat absorber is suspended inside the insulation cavity.

[0009] Optionally, the insulation chamber further includes a accommodating area, and the upper surfaces of the first insulation chamber and the second insulation chamber are respectively provided with a first accommodating area and a second accommodating area, and the first accommodating area and the second accommodating area are connected to form an accommodating space for accommodating the semiconductor refrigerator.

[0010] Optionally, a column / hole groove is provided on the second insulation cavity, and a hole groove / column is provided at a corresponding position of the first insulation cavity, and the first insulation cavity and the second insulation cavity are plugged into the column and the hole groove and fastened together with screws; or an adhesive area is provided at the joint between the second insulation cavity and the first insulation cavity, and the first insulation cavity and the second insulation cavity are connected with glue.

[0011] Optionally, it also includes a thermal insulation pad, which is arranged between the refrigeration plate and the cold end heat absorber and between the refrigeration plate and the hot end heat sink, and / or the thermal insulation pad is filled in the annular groove, and / or the thermal insulation pad is filled in the central groove.

[0012] Optionally, a positioning protrusion is provided outside the first heat preservation chamber and / or the second heat preservation chamber.

[0013] A refrigeration insulation box provided by the present invention also includes an intermediate base and a lower shell, wherein the lower shell and the intermediate base enclose a second cavity, the insulation cavity is arranged in the second cavity, and the insulation body is movably arranged in the second cavity and sealed with the insulation cavity.

[0014] Optionally, it also includes a power cavity, a temperature sensor, a power interface, a power supply, and a PCB circuit board. The power supply is arranged in the power cavity and is electrically connected to the refrigeration and insulation box body. The temperature sensor, power supply, power interface, and PCB circuit board are electrically connected respectively.

[0015] The present invention has the following beneficial effects: a heat absorption and heat preservation system is composed of a heat preservation body, a mouth rotating thread sealing structure and a suspended cold end radiator. Relying on the advantages of a cylinder having a relatively small surface area and a relatively large volume, the heat conduction contact area with the outside is minimized. At the same time, a vacuum structure is adopted to reduce heat conduction inside the heat preservation body material and improve the sealing efficiency. At the same time, the overall structure of the refrigeration and heat preservation box is compact, all components are reasonably arranged, and it is easy to carry. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 is a stereogram of an embodiment of the present invention;

[0018] Figure 2 is a schematic diagram of a semiconductor refrigerator according to an embodiment of the present invention;

[0019] Figure 3 It is a schematic diagram of the internal structure of an embodiment of the present invention;

[0020] Figure 4 is a schematic diagram of an upper housing of an embodiment of the present invention;

[0021] Figure 5 is a stereogram of an embodiment of the present invention;

[0022] Figure 6 It is a schematic diagram of the internal structure of an embodiment of the present invention;

[0023] Figure 7 It is a schematic diagram of the structure of a heat preservation chamber according to an embodiment of the present invention;

[0024] Figure 8It is a schematic diagram of the structure of an embodiment of the present invention after being installed in a vacuum insulation body.

[0025] Fig. 9 It is a schematic diagram of the structure of a power supply cavity according to an embodiment of the present invention. DETAILED DESCRIPTION

[0026] To make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be described in detail below. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other implementation methods obtained by ordinary technicians in this field without creative work belong to the scope of protection of the present invention.

[0027] It should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "top", "bottom", etc. is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and does not require that the present invention must be constructed and operated in a specific orientation, and cannot be understood as a limitation on the present invention; the terms "installed", "set", "provided with", "connected", "connected", and "set" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be an internal connection between two devices, elements or components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0028] See also Figures 1-2 The refrigeration and heat preservation box provided in this embodiment includes an upper shell 1, a lower shell 2 and an intermediate base 3 connecting the upper and lower shells (1, 2). The upper and lower shells (1, 2) are both concave cavities formed by inward concavity. The upper and lower shells (1, 2) are respectively formed with a first cavity 4 and a second cavity 5, and are respectively sealed with the intermediate base 3 by ultrasonic welding. In other embodiments, the upper and lower shells (1, 2) can also be made by a detachable connection method such as threaded fastening and bolt connection with the intermediate base 3, or by other common technical processes such as welding, bonding and integral forming.

[0029] The refrigeration core of the refrigeration insulation box provided in this embodiment adopts a semiconductor refrigerator 6, including a refrigeration plate 7, a cold end heat absorber 8, a hot end radiator 9, a thermal pad 10 and a thermal insulation pad 39. The semiconductor refrigeration plate 7 operates by using the Peltier effect. When direct current passes through a closed loop composed of two different conductors or semiconductor materials a and b, one of the two contacts in the loop absorbs heat and the other releases heat. The semiconductor refrigeration plate 7 is composed of a P-type semiconductor, an N-type semiconductor, a metal conductor, and an insulating ceramic plate. When direct current is passed through the semiconductor refrigeration plate 7, at the joint above the N-type semiconductor and the P-type semiconductor, the current flows from the N-type semiconductor to the P-type semiconductor, the temperature at the joint decreases and absorbs heat from the outside, and becomes a cold end. At the joint below the N-type semiconductor and the P-type semiconductor, the current flows from the P-type semiconductor to the N-type semiconductor, the temperature at the joint increases and releases heat to the outside, and becomes a hot end. The cold end is provided with a cold end heat absorber 8, and the hot end is provided with a hot end radiator 9.

[0030] The cold end heat absorber 8 and the hot end radiator 9 are generally distributed in the upper and lower positions relative to the semiconductor refrigeration plate 7. Surrounding heat insulation pads 39 are also distributed around the semiconductor refrigeration plate 7 to minimize the contact heat conduction between the cold end and the hot end. Preferably, the cold end heat absorber 8 and the hot end radiator 9 can adopt a multi-tooth heat dissipation fin group or a rectangular fin heat sink, which is easy to process and has low manufacturing cost, high efficiency and good heat dissipation performance. The multi-tooth heat dissipation fin group includes a plurality of fins that are parallel to each other and have gaps. The fins are arranged vertically. Preferably, the gap between two adjacent fins is 1 mm. The semiconductor refrigerator 6 can dissipate heat to the hot end radiator 9 under the heat dissipation flow of the heat dissipation system. Regardless of which design method is adopted for the semiconductor refrigerator 6, the heat of the hot end must be dissipated in time. If the heat dissipation of the hot end is not good, the cooling effect will be greatly reduced, so it is particularly necessary to strengthen the heat dissipation of the hot end. The traditional air natural convection heat dissipation method has a low heat transfer coefficient and the effect is not ideal. In order to obtain better refrigeration and heat preservation effects, the present invention provides an air-cooled heat dissipation system to achieve forced flow heat dissipation.

[0031] See also Figure 3The air-cooling heat dissipation system provided in this embodiment preferably includes two ducted fans placed side by side, namely a first ducted fan 12 and a second ducted fan 13. Each ducted fan includes a duct 11 that is generally square outside and round inside, and a fan (not shown in the figure) located inside the duct 11. Since the ends of the fan blades are restricted by the duct 11, the impact noise is reduced and the induced resistance is reduced, so that a higher wind efficiency can be obtained. In other embodiments, the number of ducted fans can be designed to be three or more if the cost permits. By using more fans, the wind force is enhanced and the heat dissipation effect is accelerated. In other embodiments, the position distribution of the ducted fans can also adapt to the design of the main structure of the refrigeration and insulation box, and a vertical stacking method can be used to form a flow channel that accelerates heat dissipation.

[0032] Preferably, a chamfer is provided at the end of the outer edge of the duct 11, and the outer surface is designed to be rectangular or square to accommodate the installation in the inner space of the refrigeration and heat preservation box. In other embodiments, the duct 11 may also be circular in design, and other shapes of ducts 11 that do not affect the heat dissipation of the air flow channel should also be understood to be included in other equivalent solutions of the present invention.

[0033] The first ducted fan 12 adopts an air intake fan and forms an air intake port 15 on the end surface of the first ducted fan 12. The second ducted fan 13 adopts an exhaust fan and forms an exhaust port 14 on the end surface of the second ducted fan 13. The directions of air intake and exhaust are controlled by the different arrangements of the fan blades. The air intake and exhaust of the first ducted fan 12 and the second ducted fan 13 form a forced flow channel, which accelerates the flow of air in the first cavity 4 formed by the upper shell 1, and further improves the heat dissipation efficiency. In other embodiments, it is also possible to use an air intake fan or an exhaust fan for both ducted fans, and it is also completely feasible to accelerate the air flow in the first cavity 4 by the wind force of the fan to achieve the effect of accelerating heat dissipation.

[0034] See also Figure 4, a plurality of heat dissipation holes arranged in zones are distributed on the surface of the upper shell 1. Preferably, the first zone heat dissipation holes 16 corresponding to the positions of the ducted fans and distributed in a circular shape are respectively arranged on the upper surfaces of the first ducted fan 12 and the second ducted fan 13, and the second zone heat dissipation holes 17 extending along the length direction of the upper shell 1 are respectively arranged on the front and rear side surfaces of the upper shell 1, and the third zone heat dissipation holes 18 connecting the upper and side surfaces are respectively arranged on the two side end surfaces of the upper shell 1, and the fourth zone heat dissipation holes 19 of different sizes are also arranged at other blank positions of the upper shell 1 to increase the exchange channels with the outside air. For example, the first zone heat dissipation holes 16 are responsible for high-speed exhaust, and the second, third, and fourth zone heat dissipation holes (17, 18, 19) are responsible for assisting air intake and suppressing turbulence to reduce airflow resistance, or the first zone heat dissipation holes 16 are responsible for rapid air intake, and the second, third, and fourth zone heat dissipation holes (17, 18, 19) are responsible for assisting exhaust and suppressing turbulence to reduce airflow resistance, thereby improving the flow rate and air cooling efficiency. In other embodiments, the heat dissipation holes may be used for exhaust or intake respectively according to different positions, distributions, sizes and shapes.

[0035] The first cavity 4 formed by the upper shell 1 can be used to accommodate the ducted fan, and together with the ducted fan, it constitutes an air-cooling heat dissipation system. The external airflow enters the first cavity 4 through the heat dissipation holes arranged in a plurality of partitions on the upper shell 1, and further reaches the upper surface of the heat sink through the suction force of the first ducted fan 12. Under the exhaust thrust of the second ducted fan 13, forced flow occurs, quickly taking away the heat on the heat sink, and is discharged through the heat dissipation holes arranged in a plurality of partitions on the upper shell 1, completing the dynamic air-cooling heat dissipation work of the entire air-cooling heat dissipation system.

[0036] A number of equally spaced support columns 20 are provided inside the upper shell 1. The support columns 20 are hollow cylinders and are fastened and assembled with the intermediate base 3 with built-in screws. Reinforcing ribs 21 for strengthening the strength of the first cavity 4 are provided between the support columns 20 or on the main supporting surface of the upper shell 1, which can effectively avoid the influence of deformation of the first cavity 4 on the air-cooled heat dissipation path.

[0037] The upper shell 1 is provided with a power interface, such as a DC-In interface 22, which can provide an external power interface for the refrigeration and heat preservation box. An inclined portion 23 is provided at one end of the upper shell 1. The cavity formed by the inclined portion 23 is used to accommodate electronic control devices such as a display screen 24, control buttons 25, temperature sensors, and circuit boards, which are convenient for viewing / controlling during use. The display screen 24 is installed on a mounting platform 26 and fixed to the inner side of the inclined portion 23 by gluing or screwing. The mounting platform 26 is also provided with control buttons 25, etc.

[0038] Preferably, the hot end radiator 9 is in the shape of a long strip extending along the length direction of the middle base 3, and is arranged at the bottom of the ducted fan and above the middle base 3, so as to accelerate the contact area with the air and effectively increase the heat dissipation area. The cold end heat absorber 8 adopts a special-shaped structure, which is different from the traditional semiconductor refrigeration and insulation box which adopts the direct contact heat absorption method. Instead, it connects the entire inner metal layer through the heat absorption and insulation system, and can be suspended and directly extended into the refrigeration and insulation cavity. The connection end 81 on the cold end heat absorber 8 is directly connected to the receiving groove 31 of the insulation cavity, and the rest of the parts are suspended and not in direct contact with the cavity that needs to be insulated, so that the refrigeration efficiency is no longer restricted by the heat conduction of the cavity, thereby improving the refrigeration efficiency.

[0039] See also Figures 6-7 The middle base 3 is a special-shaped annular frame, which is used to support and connect the upper and lower shells (1, 2) and the semiconductor refrigerator 7 and other components and equipment. The middle base 3 is formed with a storage space that can partially accommodate the heat absorption and heat preservation system. The present embodiment provides a heat absorption and heat preservation system, including two heat preservation chambers that are fixed together, namely, a first heat preservation chamber 27 and a second heat preservation chamber 28. The first heat preservation chamber 27 is hollow inside, and the second heat preservation chamber 28 is filled with an insulation pad 39. The first heat preservation chamber 27 and the second heat preservation chamber 28 are fixed together to form a refrigeration and heat preservation chamber that can accommodate the cold end heat absorber 8.

[0040] The mouth of the first insulation cavity 27 is provided with a thread, and the thread is provided at one end away from the joint of the first insulation cavity 27 and the insulation cavity 28, and is used to be fastened to the insulation body. In other embodiments, the first insulation cavity 27 and the second insulation cavity 28 can also be connected by snap connection, ultrasonic welding, or thread fastening, plug-in and other common detachable methods. The first insulation cavity 27 and the second insulation cavity 28 can also be designed as a common cavity, and the connection end 81 of the cold end heat absorber 8 is suspended in the insulation cavity and then integrally molded and cast.

[0041] The second heat preservation chamber 28 includes a central groove 41 and an annular groove 42 at least partially surrounding the central groove 41, the opening of the central groove 41 faces the docking direction with the first heat preservation chamber 27, the bottom surface of the central groove 41 forms part of the rear surface of the heat preservation chamber, the opening direction of the annular groove 42 is opposite to that of the central groove 41, and the bottom surface of the annular groove 42 forms the docking surface between the second heat preservation chamber 28 and the first heat preservation chamber 27. In this embodiment, the annular groove 42 partially surrounds the outer side of the central groove 41, and in other embodiments, the annular groove 42 can also completely surround the outer side of the central groove 41. The second heat preservation chamber 28 is provided with three columns distributed in a triangular shape, and the corresponding positions of the first heat preservation chamber 27 are provided with holes and grooves. The first heat preservation chamber 27 and the second heat preservation chamber 28 are plugged into the holes and grooves through the columns and fastened with screws. In other embodiments, the number and position of the columns and holes and grooves can also be selected according to local conditions, for example, holes and grooves are provided on the second heat preservation chamber 28, and columns are provided on the first heat preservation chamber 27. In other embodiments, the first insulation chamber 27 and the second insulation chamber 28 may also be provided with an adhesive area in the docking area. The adhesive area is provided with a stepped groove or an annular groove, and an adhesive is added to the groove or the annular groove, so that the first insulation chamber 27 and the second insulation chamber 28 are fixed by adhesive bonding. At the same time, the adhesive bonding is also more conducive to the insulation between the first insulation chamber 27 and the second insulation chamber 28, thereby reducing heat conduction.

[0042] In order to prevent the mouth of the insulation body from making direct contact with the heat source, insulation pads 39 are respectively provided in the gap of the second insulation cavity 28, in the central groove 41 of the second insulation cavity 28, and in the annular groove 42 of the second insulation cavity 28. In other embodiments, insulation pads 39 can also be provided in the above-mentioned locations by injecting insulation foam or the like.

[0043] In order to facilitate installation and fixation, positioning protrusions 36 are respectively provided on the outside of the first insulation chamber 27 and the second insulation chamber 28. The positioning protrusions 36 are connected to or abut against the middle base 3 to position and support the installation positions of the first insulation chamber 27 and the second insulation chamber 28.

[0044] The upper surface of the first heat preservation chamber 27 is provided with a first accommodating area 29, and the upper surface of the second heat preservation chamber 28 is provided with a second accommodating area 30. The positions of the first accommodating area 29 and the second accommodating area 30 correspond to each other, and they are connected to form an accommodating area that can accommodate semiconductor cooling plates 7 and the like. The second accommodating area 30 extends downward toward one side of the first accommodating area 29 to have an accommodating groove 31 that can accommodate the connecting end 81 of the cold end heat absorber 8. Preferably, the accommodating groove 31 is shaped as a fin-shaped groove to facilitate the adaptation with the connecting end 81. The end of the accommodating groove 31 is located at the joint of the first accommodating area 29 and the second accommodating area 30, so that the cold end heat absorber 8 is directly extended into the heat preservation chamber through the accommodating groove 31 in a suspended manner. In other embodiments, the position of the accommodating groove 31 can also be opened on one side of the first accommodating area 29 or one side of the second accommodating area 30, or at other positions such as the end of the second heat preservation chamber 28, and it is only necessary to ensure that the accommodating groove 31 can accommodate the connecting end 81 of the cold end heat absorber 8 and insert and suspend it into the heat preservation body.

[0045] Since the cylinder is a highly efficient heat-insulating shape second only to the sphere, it has the advantages of relatively small surface area and relatively large volume, and can minimize the heat conduction contact area with the outside world. Preferably, the present embodiment adopts a vacuum cylindrical heat-insulating body 35. In order to reduce the heat conduction inside the heat-insulating body material, the outer shell of the vacuum cylindrical heat-insulating body 35 is polished with stainless steel mirrors to maximize the reflection of electromagnetic waves of various wavelengths and reduce the heating effect of heat radiation on the heat-insulating body. When in use, the items that need to be refrigerated and insulated are placed in the vacuum cylindrical heat-insulating body 35, and the opening of the vacuum cylindrical heat-insulating body 35 is tightened by rotating the thread of the first heat-insulating cavity 27, and pushed into the second cavity 5 along the channel formed by the positioning support ribs to be fixed, so that the cold end heat absorber 8 is suspended at the opening of the inner liner of the vacuum cylindrical heat-insulating body 35, and is no longer restricted by the heat conduction of the shell, and directly cools and insulates the items stored in the cup, greatly improving the refrigeration efficiency. The threaded rotary sealing structure is adopted at the mouth, which has higher sealing efficiency and better heat preservation effect than the opening and closing door cover. In other embodiments, the connection method between the insulation body 35 and the insulation chamber can also be a snap connection, plug-in and tightened by an elastic member such as a spring, or other common detachable connection methods, and it is only necessary to ensure the sealing of the insulation body 35 and the insulation chamber after connection.

[0046] See also Figure 8The refrigeration and heat preservation box provided in this embodiment is made of food-grade plastic material to form a supporting structure, which is used to form the air duct of the air-cooling and heat dissipation system and the supporting and fixing body of the heat absorption and heat preservation system, and is also provided with a accommodating unit for the temperature control and display circuit system. The upper part of the intermediate base 3 is connected with the first duct fan 12 and the second duct fan 13, which cooperate with the upper shell 1 to form an air-cooling and heat dissipation system; the lower side of the intermediate base 3 is connected with the first heat preservation cavity 27 and the second heat preservation cavity 28, and the cold end heat absorber 8 is directly inserted into the opening of the heat preservation body in a suspended manner to form a heat absorption and heat preservation system; in the second cavity 5, the lower part of the intermediate base 3 is also evenly arranged with a number of positioning support ribs 37 along its length direction, which are used to support and position the heat preservation body 35. Preferably, the positioning support rib 37 adopts a triangular design, including two right-angled sides and an arc-shaped hypotenuse. The two right-angled sides are connected to or against the inner side of the middle seat, and the hypotenuse adopts an arc design. The contact between the hypotenuse and the right-angled side is an arc transition. The curvature of the arc-shaped side 38 is adapted to the curvature of the outer surface of the heat preservation body 35, so as to ensure that the heat preservation body 35 can be pushed in along the arc-shaped hypotenuse of the positioning support rib 37, and the positioning ensures the accuracy of the pushing direction and the stable placement of the heat preservation body 35 in the second cavity 5. Preferably, the positioning support rib 37 is designed to be symmetrically distributed up and down, and the gaps are arranged side by side. There are 8 positioning support ribs 37 arranged on the upper side and 8 positioning support ribs 37 arranged on the lower side. The upper and lower positions correspond to each other to ensure the positioning support effect. In other embodiments, the specific shape of the positioning support rib 37 can also adopt other polygonal shapes such as circular rings and convex shapes, and the position and number of the support ribs 37 can also be arranged in a denser or looser manner, as long as the stability of the heat preservation body 35 in the second cavity 5 is ensured. The positioning support ribs 37 are distributed upward and downward, and a channel 43 is formed in the middle. Since condensed water is easily generated at the cold end and is difficult to clean, the operator can conveniently wipe the condensed water along the channel.

[0047] In this embodiment, the second cavity 5 is formed by using a cavity structure to assist in positioning the support ribs 37, which can block the heat conduction between the heat preservation body 35 and the outside. In order to reduce the heat conduction of the inner liner of the heat preservation body and minimize the influence of the external heat on the temperature of the inner liner, a silver film can be coated on the surface of the heat preservation body. The silver film can reflect radiant heat and effectively prevent external heat conduction.

[0048] See also Fig. 9The refrigeration and insulation box provided in this embodiment also includes an external power supply cavity, in which a battery 34 and a circuit board 35 are arranged. The power supply cavity is detachably connected to the main body of the refrigeration and insulation box through a snap 32 structure. The snap 32 structure includes a protrusion and a groove distributed in a herringbone shape, and a protrusion and a groove are respectively arranged on one side of the refrigeration and insulation box and the corresponding side of the power supply cavity, which are detachably connected through the snap 32 structure. Electrical contacts 33 are also respectively arranged on one side of the refrigeration and insulation box and the corresponding side of the power supply cavity to ensure that the two are electrically connected. In other embodiments, other quick-release structures may also be used, such as a quick-release structure composed of a spring and a plug-in structure, a quick-release structure composed of a spring and a hook, or other common detachable connection methods such as plug-in and tenon.

[0049] Preferably, in the present embodiment, the temperature sensor adopts a patch temperature sensor, and in other embodiments, other non-contact or contact temperature sensors may also be used. The heat preservation body 35 adopts a vacuum cylindrical thermos cup, and the material is selected from 304 stainless steel, 316 stainless steel or high borosilicate glass, etc., and adopts a double-layer side wall and a single-layer bottom structure, and the double-layer structure side wall leaves space, and the space is vacuum-set, and the two ends of the side wall are sealed with food-grade silicone sealing rings to increase the heat preservation effect. The integrated controller adopts a chip model STM32F103RBT6, and the display screen 24 preferably adopts an LCD128464 liquid crystal display screen.

[0050] When the present invention is used, firstly, the material to be insulated is loaded into the vacuum cylindrical insulation body 35, the insulation body 35 is placed horizontally, and the vacuum cylindrical insulation body 35 is pushed into the passage formed by the positioning support rib 37 from the mouth of the second cavity 5, and is tightened by rotating the thread, and then the external power supply is connected through the power plug, or the battery power is directly started through the power switch to start the refrigeration and heat preservation. At this time, the semiconductor refrigerator 6 starts to work, and the internal temperature of the vacuum cylindrical insulation body is displayed in real time on the display screen 24. At the same time, if the working state is abnormal, the alarm signal module prompts a problem signal.

[0051] The order of the above implementation modes is only for the convenience of description and does not represent the advantages or disadvantages of the implementation modes.

[0052] The above is only a specific implementation of the present invention, but not a limitation thereof. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, a person of ordinary skill in the art should understand that the technical solutions described in the aforementioned embodiments can still be modified, or some of the technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A heat absorption and heat preservation system for a refrigeration and heat preservation box, characterized in that: include: A semiconductor refrigerator, comprising a cooling plate, a cold end heat absorber and a hot end radiator, wherein the cold end heat absorber and the hot end radiator are arranged above and below the cooling plate, The heat-insulating body is used to contain materials that need to be refrigerated and kept warm, and the mouth of the heat-insulating body is provided with threads; The heat preservation cavity, the cold end heat absorber is connected to the heat preservation cavity and is suspended in a closed cavity formed by the heat preservation body and the heat preservation cavity, and the cold end heat absorber includes fins that are parallel to each other and have gaps; The heat preservation cavity comprises a first heat preservation cavity and a second heat preservation cavity which are connected to each other, the first heat preservation cavity is hollow, and the mouth thereof is provided with a sealing thread which is adapted to the mouth of the heat preservation body; The second heat preservation cavity comprises a central groove and an annular groove at least partially surrounding the central groove, the opening of the central groove faces the docking direction with the first heat preservation cavity, the bottom surface of the central groove forms at least a part of the rear surface of the heat preservation cavity, the opening direction of the annular groove is opposite to that of the central groove, and the bottom surface of the annular groove forms the docking surface between the second heat preservation cavity and the first heat preservation cavity; A receiving groove for receiving the semiconductor refrigerator is provided at the joint of the first heat preservation cavity and the second heat preservation cavity. The cold end heat absorber includes a connecting end, and the connecting end is adapted to the receiving groove so that the cold end heat absorber is suspended inside the heat preservation cavity.

2. The heat absorption and heat preservation system for a refrigeration and heat preservation box according to claim 1, characterized in that: The heat preservation chamber also includes a accommodating area. The upper surfaces of the first heat preservation chamber and the second heat preservation chamber are respectively provided with a first accommodating area and a second accommodating area. The first accommodating area and the second accommodating area are connected to form an accommodating space for accommodating the semiconductor refrigerator.

3. The heat absorption and heat preservation system for a refrigeration and heat preservation box according to claim 2, characterized in that: The second insulation chamber is provided with a column / hole groove, and the corresponding position of the first insulation chamber is provided with a hole groove / column, the first insulation chamber and the second insulation chamber are plugged into the hole groove through the column, and are fastened together with screws; or the second insulation chamber and the first insulation chamber are provided with an adhesive area at the joint, and the first insulation chamber and the second insulation chamber are connected with glue.

4. The heat absorption and heat preservation system for a refrigeration and heat preservation box according to claim 3, characterized in that: It also includes a thermal insulation pad, which is arranged between the refrigeration plate and the cold end heat absorber and between the refrigeration plate and the hot end heat sink, and / or the thermal insulation pad is filled in the annular groove, and / or the thermal insulation pad is filled in the central groove.

5. The heat absorption and heat preservation system for a refrigeration and heat preservation box according to claim 4, characterized in that: A positioning protrusion is provided outside the first heat preservation cavity and / or the second heat preservation cavity.

6. A refrigeration and heat preservation box, comprising the heat absorption and heat preservation system according to any one of claims 1 to 5, characterized in that: It also includes an intermediate base and a lower shell, wherein the lower shell and the intermediate base enclose a second cavity, the heat preservation cavity is arranged in the second cavity, and the heat preservation body is movably arranged in the second cavity and sealed with the heat preservation cavity.

7. The refrigeration and heat preservation box according to claim 6, characterized in that: It also includes a power cavity, a temperature sensor, a power interface, a power supply, and a PCB circuit board. The power supply is arranged in the power cavity and is electrically connected to the refrigeration and insulation box body. The temperature sensor, the power supply, the power interface, and the PCB circuit board are electrically connected respectively.

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