Solder spot detection device and detection method

Abstract

The present invention discloses a welding spot detection device and a detection method, the welding spot detection device comprises: a frame, a workbench is arranged on the frame; a transmission component, the transmission component comprises a slide rail, the slide rail is arranged on the workbench, the workpiece to be tested is slidably connected with the slide rail, and moves along the extension direction of the slide rail; a welding spot detection component, the welding spot detection component comprises a detection component and a driving component, the driving component is arranged on the workbench and connected with the detection component; the detection component comprises a collection unit, the collection direction of the collection unit points to the workbench; the driving component comprises an angle adjustment seat, the angle adjustment seat drives the detection component to rotate in the vertical direction, the detection component also comprises an illumination light source, and the illumination light source is arranged between the collection unit and the workbench. The present invention provides a welding spot detection device and a detection method, aiming to reduce the false detection rate and missed detection rate during welding spot quality detection, and improve the welding spot quality detection efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of solder joint quality detection, and in particular to a solder joint detection device and a detection method. Background Art

[0002] PCB boards have the characteristics of high density, high precision and high reliability. After the electronic components on the PCB board are processed by soldering, the quality of the solder joints will affect the stability and performance of the PCB board. Due to the complex soldering process caused by the complex PCB structure and the wide variety of electronic components, the types of quality defects of solder joints also come with it. Due to the wide variety of solder joint defects and changes in morphology, most of the solder joint quality inspection operations of PCB boards are currently inspected by manual visual observation. However, manual inspection is affected by factors such as the technical level and proficiency of the operator, which will lead to high false detection rate and missed detection rate of solder joint quality inspection and low inspection efficiency, thus failing to meet the huge demand for PCB board solder joint quality inspection. Summary of the invention

[0003] The main purpose of the present invention is to provide a solder joint detection device and a detection method, aiming to reduce the false detection rate and missed detection rate during solder joint quality detection and improve the solder joint quality detection efficiency.

[0004] In order to achieve the above-mentioned object, the present invention provides a solder joint detection device, which comprises:

[0005] A frame, wherein a workbench is provided on the frame;

[0006] A transmission assembly, wherein the transmission assembly comprises a slide rail, the slide rail is arranged on the workbench, the workpiece to be measured is slidably connected to the slide rail, and moves along the extension direction of the slide rail;

[0007] A solder joint detection component, the solder joint detection component comprising a detection component and a driving component, the driving component being disposed on the workbench and connected to the detection component to drive the detection component to move;

[0008] The detection component includes a collection unit, which is arranged on a side of the transmission component away from the workbench, and the collection direction of the collection unit points to the workbench;

[0009] The driving assembly includes an angle adjustment seat, and the angle adjustment seat is connected to the acquisition unit to drive the detection assembly to rotate along the vertical direction;

[0010] The detection component also includes an illumination light source, and the illumination light source is arranged between the collection unit and the workbench.

[0011] Optionally, the driving assembly includes a first moving module, which is fixedly connected to the workbench and drives the collection unit to move along a first direction, and the first direction is parallel to the surface where the workbench is located.

[0012] Optionally, the driving assembly also includes a second movable module, which is slidably connected to the first movable module and slides on the first movable module along a first direction, the first direction is parallel to the surface where the workbench is located, and the second movable module drives the collection unit to move along a second direction, the second direction is parallel to the surface where the workbench is located and perpendicular to the first direction.

[0013] Optionally, the driving assembly further includes a third movable module, which is slidably connected to the second movable module and drives the collecting unit to slide along a vertical direction on the second movable module.

[0014] Optionally, the driving component further includes a rotating module, and the rotating module is connected to the third movable module and the collecting unit to drive the detecting component to rotate.

[0015] Optionally, the transmission assembly further includes a limiter, which is connected to the workbench and is arranged in the travel direction of the workpiece to be detected; the limiter includes a limiter cylinder and a limiter slide block, and the limiter cylinder drives the limiter slide block to move in a direction perpendicular to the workbench;

[0016] The limit member includes a blocking state and a non-blocking state. When the limit member is in the blocking state, the distance between the limit slider and the workbench is greater than the distance between the workpiece to be detected and the workbench. When the limit member is in the non-blocking state, the distance between the limit slider and the workbench is less than or equal to the distance between the workpiece to be detected and the workbench.

[0017] Optionally, the transmission assembly further includes a positioning member, wherein the positioning member is connected to the slide rail, and the positioning member includes a positioning cylinder and a positioning block, and the positioning cylinder drives the positioning block to move in a direction perpendicular to the slide rail.

[0018] Optionally, the welding spot detection device further includes a lifting platform, which is disposed on the workbench and can drive the workpiece to be detected to move in a direction perpendicular to the workbench.

[0019] To achieve the above object, the present application proposes a solder joint detection method, which is applied to the solder joint detection device as described in any one of the above embodiments, and the solder joint detection method includes:

[0020] Adjusting the workpiece to be inspected to a preset inspection position;

[0021] Adjusting the detection position and detection angle of the detection component according to the preset detection parameters, wherein the preset detection parameters at least include a preset detection coordinate position and a preset angle;

[0022] Controlling the detection component to obtain a welding spot detection image of the workpiece to be detected;

[0023] Determining feature information according to the welding spot detection image;

[0024] The quality of the welding spot of the workpiece to be inspected is determined according to the characteristic information.

[0025] Optionally, the step of determining the quality of the solder joints in the area to be inspected according to the characteristic information includes:

[0026] Matching the characteristic information with preset characteristic information;

[0027] If the matching degree between the characteristic information and the preset characteristic information is greater than a preset value, it is determined that the characteristic information is a defect corresponding to the preset characteristic information.

[0028] Optionally, the workpiece to be inspected includes a plurality of areas to be inspected, and the step of adjusting the inspection position and the inspection angle of the inspection component according to the preset inspection parameters, wherein the preset inspection parameters at least include a preset inspection coordinate position and a preset angle, comprises:

[0029] Determining the to-be-detected area of ​​the to-be-detected workpiece;

[0030] Adjusting the detection position and detection angle of the detection component according to the area to be detected and the preset detection parameters;

[0031] The step of determining the quality of the welding spot of the workpiece to be inspected according to the characteristic information further includes:

[0032] The detection component is adjusted to another area to be detected, and the step of adjusting the detection position and the detection angle of the detection component according to the area to be detected and the preset detection parameters is repeated until all the areas to be detected are detected.

[0033] In the technical solution proposed by the present invention, the welding spot detection device includes a frame, a workbench is provided on the frame, a transmission component, the transmission component includes a slide rail, the slide rail is arranged on the workbench, the workpiece to be tested is slidably connected with the slide rail, and moves along the extension direction of the slide rail; a welding spot detection component, the welding spot detection component includes a detection component and a driving component, the driving component is arranged on the workbench and connected to the detection component to drive the detection component to move; the detection component includes a collection unit, the collection unit is arranged on a side of the transmission component away from the workbench, and the collection direction of the collection unit points to the workbench; the driving component includes an angle adjustment seat, and the angle adjustment seat is connected to the collection unit to drive the detection component to rotate along the vertical direction. When inspecting a workpiece to be inspected, the PCB board to be inspected can be moved to the inspection position by the transmission component, and then the inspection component can be moved by the driving component to align the inspection component with the PCB board to be inspected for inspection. The solder joint inspection device can automatically inspect the PCB board, thereby solving the problem in the prior art that the solder joint quality inspection is manually inspected by operators, with high false detection rate, missed detection rate and low inspection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0035] Figure 1 It is a first structural schematic diagram of the welding point detection device of the present invention;

[0036] Figure 2 It is a second structural schematic diagram of the welding point detection device of the present invention;

[0037] Figure 3 It is a third structural schematic diagram of the welding point detection device of the present invention;

[0038] Figure 4 for Figure 3 A partial enlarged view of the middle I area;

[0039] Figure 5 It is a schematic diagram of the terminal structure of the hardware operating environment involved in the embodiment of the present invention;

[0040] Figure 6 1 is a schematic diagram of a flow chart of a solder joint detection method according to Embodiment 1 of the present invention;

[0041] Figure 7Schematic diagram of the process of solder joint detection method embodiment 2 of the present invention;

[0042] Figure 8 It is a schematic diagram of the flow of Example 3 of the solder joint detection method of the present invention.

[0043] Description of Figure Numbers:

[0044]

[0045]

[0046] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0047] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0048] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0049] In addition, in the present invention, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0050] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0051] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0052] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

[0053] like Figure 1 As shown, Figure 1 It is a schematic diagram of the device structure of the hardware operating environment involved in the embodiment of the present invention.

[0054] like Figure 1 As shown, the device may include: a controller 1001, such as a CPU, a network interface 1004, a user interface 1003, a memory 1005, and a communication bus 1002. Among them, the communication bus 1002 is used to realize the connection and communication between these components. The user interface 1003 may include a display screen (Display), an input unit such as a keyboard (Keyboard), and the optional user interface 1003 may also include a standard wired interface and a wireless interface. The network interface 1004 may optionally include a standard wired interface and a wireless interface (such as a WI-FI interface). The memory 1005 may be a high-speed RAM memory, or a stable memory (non-volatile memory), such as a disk memory. The memory 1005 may also be a storage device independent of the aforementioned controller 1001.

[0055] Those skilled in the art will understand that Figure 1 The device structure shown in the figure does not constitute a limitation of the device, and may include more or less components than shown in the figure, or combine certain components, or arrange the components differently.

[0056] like Figure 1 As shown, the memory 1005 as a computer storage medium may include an operating system, a network communication module, a user interface module and an application program.

[0057] exist Figure 1 In the server shown, the network interface 1004 is mainly used to connect to the backend server and perform data communication with the backend server; the user interface 1003 is mainly used to connect to the client (user end) and perform data communication with the client; and the controller 1001 can be used to call the application stored in the memory 1005 and perform the following operations:

[0058] Adjusting the workpiece to be inspected to a preset inspection position;

[0059] Adjusting the detection position and detection angle of the detection component according to the preset detection parameters, wherein the preset detection parameters at least include a preset detection coordinate position and a preset angle;

[0060] Controlling the detection component to obtain a welding spot detection image of the workpiece to be detected;

[0061] Determining feature information according to the welding spot detection image;

[0062] The quality of the welding spot of the workpiece to be inspected is determined according to the characteristic information.

[0063] Furthermore, the controller 1001 may call the application program stored in the memory 1005 and perform the following operations:

[0064] Matching the characteristic information with preset characteristic information;

[0065] If the matching degree between the characteristic information and the preset characteristic information is greater than a preset value, it is determined that the characteristic information is a defect corresponding to the preset characteristic information.

[0066] Furthermore, the controller 1001 may call the application program stored in the memory 1005 and perform the following operations:

[0067] Determining the to-be-detected area of ​​the to-be-detected workpiece;

[0068] Adjusting the detection position and detection angle of the detection component according to the area to be detected and the preset detection parameters;

[0069] The step of determining the quality of the welding spot of the workpiece to be inspected according to the characteristic information further includes:

[0070] The detection component is adjusted to another area to be detected, and the step of adjusting the detection position and the detection angle of the detection component according to the area to be detected and the preset detection parameters is repeated until all the areas to be detected are detected.

[0071] The invention provides a solder joint detection device and a detection method.

[0072] Please refer to Figures 1 to 4 , the solder joint detection device comprises:

[0073] A frame 100, wherein a workbench 110 is provided on the frame 100;

[0074] A transmission assembly 200, wherein the transmission assembly 200 includes a slide rail 210, wherein the slide rail 210 is disposed on the workbench 110, and the workpiece to be measured is slidably connected to the slide rail 210 and moves along an extension direction of the slide rail 210;

[0075] A solder joint detection assembly 300, wherein the solder joint detection assembly 300 includes a detection assembly 310 and a driving assembly 320, wherein the driving assembly 320 is disposed on the workbench 110 and connected to the detection assembly 310 to drive the detection assembly 310 to move;

[0076] The detection component 310 includes a collection unit 311, and the collection unit 311 is arranged on a side of the transmission component 200 away from the workbench 110, and the collection direction of the collection unit 311 points to the workbench 110;

[0077] The driving assembly 320 includes an angle adjustment seat 325 , and the angle adjustment seat 325 is connected to the acquisition unit 311 to drive the detection assembly 310 to rotate along the vertical direction.

[0078] Specifically, the acquisition unit 311 is used to acquire image information of the workpiece to be inspected 600. In a specific embodiment, the acquisition unit 311 is a CCD camera. When inspecting the workpiece to be inspected 600, the CCD camera takes pictures of the welds of the workpiece to be inspected 600 to obtain image information of the weld quality inspection. After analyzing and judging the image information, the weld defect type and weld quality of the workpiece to be inspected 600 are evaluated.

[0079] Specifically, the angle adjustment seat 325 is connected to the rotating module 324 and the detection component 310 to drive the detection component 310 to rotate along the vertical direction. Specifically, the angle adjustment seat 325 is used for adjusting the angle of the detection component 310 along the vertical direction. In a specific embodiment, when the acquisition unit 311 cannot accurately and clearly take a picture of the workpiece 600 to be detected in a direction perpendicular to the workbench 110, the acquisition direction of the detection component 310 can be adjusted by the angle adjustment seat 325, so that the acquisition direction of the acquisition unit 311 is tilted to the workbench 110. After adjusting the angle of the detection component 310, it is convenient for the detection component 310 to take pictures of the workpiece 600 to be detected from different positions, thereby acquiring accurate and clear image information.

[0080] In the technical solution proposed by the present invention, the welding spot detection device includes a frame 100, on which a workbench 110 is provided, a transmission assembly 200, and the transmission assembly 200 includes a slide rail 210, and the slide rail 210 is arranged on the workbench 110. The workpiece to be tested is slidably connected with the slide rail 210 and moves along the extension direction of the slide rail 210; a welding spot detection assembly 300, and the welding spot detection assembly 300 includes a detection assembly 310 and a driving assembly 320, and the driving assembly 320 is arranged on the workbench 1 10, and connected with the detection component 310 to drive the detection component 310 to move; the detection component 310 includes a collection unit 311, the collection unit 311 is arranged on the side of the transmission component 200 away from the workbench 110, and the collection direction of the collection unit 311 points to the workbench 110; the drive component 320 includes an angle adjustment seat 325, and the angle adjustment seat 325 is connected with the collection unit 311 to drive the detection component 310 to rotate along the vertical direction. When inspecting the workpiece 600 to be inspected, the PCB board to be inspected can be moved to the inspection position by the transmission component 200, and then the detection component 310 can be moved by the drive component 320 to align the detection component 310 with the PCB board to be inspected for inspection. Through the solder joint detection device, the PCB board can be automatically inspected, thereby solving the problem that the solder joint quality inspection in the prior art is manually inspected by operators, with high false detection rate and missed detection rate and low inspection efficiency.

[0081] In a preferred embodiment, the slide rail 210 includes a first vertical plate 211 and a second vertical plate 212, a first conveyor belt 213 is provided on one side of the first vertical plate 211 relative to the second vertical plate 212, and a second conveyor belt 214 is provided on one side of the second vertical plate 212 relative to the first vertical plate 211. The workpiece 600 to be inspected is arranged on the first conveyor belt 213 and the second conveyor belt 214, and moves along the extension direction of the slide rail 210 driven by the first conveyor belt 213 and the second conveyor belt 214. At the same time, in order to ensure that the workpiece 600 to be inspected can move between the first vertical plate 211 and the second vertical plate 212, the distance between the first vertical plate 211 and the second vertical plate 212 is greater than the width of the workpiece 600 to be inspected.

[0082] In an optional embodiment, the detection component 310 also includes an illumination light source 312, which is disposed between the collection unit 311 and the workbench 110, and is used to provide the collection unit 311 with a lighting environment suitable for detection. In a specific embodiment, the illumination light source 312 is an LED light source, and the illumination light source 312 is a hemispherical structure, the inner surface of the hemispherical structure is a light-emitting surface, and the hemispherical structure is provided with a through hole along the collection direction of the collection unit 311, so that the collection unit 311 can collect image information of the workpiece 600 to be detected through the through hole under the illumination of the illumination light source 312.

[0083] In an optional embodiment, the driving assembly 320 includes a first moving module 321, the first moving module 321 is fixedly connected to the workbench 110, and drives the detection assembly 310 to move along a first direction, and the first direction is parallel to the surface of the workbench 110. Specifically, the first motion module includes a first motion axis, a first slider slidably connected to the first motion axis, and a first motor drivingly connected to the first slider, the first motor is used to control the first slider to move along the first motion axis, the extension direction of the first motion axis is colinear with the first direction, and in a preferred embodiment, the first direction is perpendicular to the extension direction of the slide rail 210.

[0084] In an optional embodiment, the driving component 320 further includes a second moving module 322, the second moving module 322 is slidably connected to the first moving module 321 and slides on the first moving module 321 along a first direction, the first direction is parallel to the surface where the workbench 110 is located, the second moving module 322 drives the detection component 310 to move along a second direction, the second direction is parallel to the surface where the workbench 110 is located, and is perpendicular to the first direction. Specifically, the second motion module includes a second motion axis, a second slider slidably connected to the second motion axis, and a second motor drivingly connected to the second slider, the second motor is used to control the second slider to move along the second motion axis, the extension direction of the second motion axis is collinear with the second direction, and in a preferred embodiment, the second direction is collinear with the extension direction of the slide rail 210.

[0085] In an optional embodiment, the driving assembly 320 further includes a third moving module 323, the third moving module 323 is slidably connected to the second moving module 322 and drives the detection assembly 310 to slide along the vertical direction on the second moving module 322. Specifically, the third motion module includes a third motion axis, a third slider slidably connected to the third motion axis, and a third motor drivingly connected to the third slider, the third motor is used to control the third slider to move along the third motion axis, and the extension direction of the third motion axis is collinear with the vertical direction.

[0086] In an optional embodiment, the driving assembly 320 further includes a rotating module 324, and the rotating module 324 includes a rotating shaft, and the rotating shaft is connected to the detection assembly 310. Specifically, the rotating shaft is arranged perpendicular to the workbench 110, and can drive the detection assembly 310 to rotate in a horizontal direction in a self-rotating manner.

[0087] In an optional embodiment, the transmission assembly 200 further includes a limit member 400, which is connected to the workbench 110 and is arranged in the direction of travel of the workpiece 600 to be detected; the limit member 400 includes a limit cylinder 410 and a limit slider 420, and the limit cylinder 410 drives the limit slider 420 to move in a direction perpendicular to the workbench 110; in a specific embodiment, the limit member 400 includes a blocking state and a non-blocking state, and when the limit member 400 is in the blocking state, the limit cylinder 410 pushes the limit slider 420 The limit slider 420 is away from the workbench 110, so that the distance between the limit slider 420 and the workbench 110 is greater than the distance between the workpiece 600 to be detected and the workbench 110, thereby blocking the workpiece 600 to be detected. When the limit member 400 is in an unblocked state, the limit cylinder 410 pulls the limit slider 420 close to the workbench 110, so that the distance between the limit slider 420 and the workbench 110 is less than or equal to the distance between the workpiece 600 to be detected and the workbench 110.

[0088] In an optional embodiment, the transmission assembly 200 further includes a positioning member 500, wherein the positioning member 500 is connected to the slide rail 210, and the positioning member 500 includes a positioning cylinder 510 and a positioning block 520, wherein the positioning cylinder 510 drives the positioning block 520 to move in a direction perpendicular to the slide rail 210. Specifically, since the width of the workpiece 600 to be detected is smaller than the distance between the first vertical plate 211 and the second vertical plate 212, when the workpiece 600 to be detected is detected, it is necessary to accurately position the workpiece 600 to be detected. Therefore, when the workpiece 600 to be detected is moved to a preset detection position along the direction of the slide rail 210, the positioning member 500 can be used to push the workpiece 600 to be detected in the first direction and make the workpiece 600 to be detected abut against the second vertical plate 212 or the first vertical plate 211, thereby locating the position of the workpiece 600 to be detected in the second direction. In a specific embodiment, when the workpiece 600 to be detected is moved to the preset detection position along the direction of the slide rail 210, the positioning member 500 can be used to push the workpiece 600 to be detected in the first direction and make the workpiece 600 to be detected abut against the second vertical plate 212 or the first vertical plate 211, thereby locating the position of the workpiece 600 to be detected in the second direction. When it has not moved to the preset detection position, in order to prevent the positioning member 500 from blocking the workpiece 600 to be detected, the positioning cylinder 510 pulls the positioning block 520 to avoid the workpiece 600 to be detected. When the workpiece 600 to be detected moves to the preset detection position, the positioning cylinder 510 pushes the positioning block 520 to make the workpiece 600 to be detected move toward one side of the first vertical plate 211 or the second vertical plate 212, and abut against the side of the first vertical plate 211 relative to the second vertical plate 212 or the side of the second vertical plate 212 relative to the opposite plate, thereby completing the positioning of the workpiece 600 to be detected along the second direction.

[0089] In an optional embodiment, the solder joint detection device further includes a lifting platform, which is disposed on the workbench 110 and can drive the workpiece 600 to be detected to move in a direction perpendicular to the workbench 110. Specifically, the lifting platform is disposed between the first vertical plate 211 and the second vertical plate 212 and is disposed at the preset detection position. When the workpiece 600 to be detected is moved to the preset detection position, the workpiece 600 to be detected can be lifted by the lifting platform, thereby facilitating adjustment of the distance between the detection component 310 and the workpiece 600 to be detected in the vertical direction.

[0090] In a preferred embodiment, in order to better and more accurately control the various devices of the robot, a control cabinet and an industrial computer arranged in the control cabinet are arranged on the frame 100. The industrial computer is communicatively connected with the transmission component 200 and the weld spot detection component 300, and can send control commands to the transmission component 200 and the weld spot detection component 300, thereby further improving the weld spot quality detection accuracy and intelligence of the weld spot quality inspection robot.

[0091] In a preferred embodiment, the industrial computer includes an image processing module, which is used to obtain the image information of the weld quality inspection sent by the acquisition unit 311, and then analyze and judge the image information after obtaining it, so as to evaluate the weld defect type and weld quality of the workpiece 600 to be inspected.

[0092] In a preferred embodiment, the frame 100 is further provided with a protective cover and a protective door, and the protective cover and the protective door are also provided with dark glass windows for protecting the workpiece from external light noise during the detection process, and the protective cover is provided with a touch screen display, a control button and a three-color warning light, all of which are communicatively connected to the industrial computer. The touch screen display can provide interactive functions to the user, facilitating the user to set the parameters of the transmission assembly 200 and the welding point detection assembly 300, and the control button is used to control the startup and shutdown of the industrial computer. The three-color warning light can emit an alarm indicator light when the industrial computer receives an abnormal signal.

[0093] Example 1

[0094] To achieve the above object, the present application further proposes a solder joint detection method, which is applied to the solder joint detection device as described in any one of the above embodiments, and the solder joint detection method includes:

[0095] S100, moving the workpiece 600 to be inspected along a slide rail until the workpiece 600 to be inspected abuts against a stopper 400 of the welding spot inspection device;

[0096] Among them, after the welding point detection device is started, the workpiece 600 to be detected is moved toward the preset detection position along the direction of the slide rail 210 under the drive of the transmission component 200. After moving to the preset detection position, the workpiece 600 to be detected is blocked by the limit member 400, thereby determining the position of the workpiece 600 to be detected in the second direction, and then the workpiece 600 to be detected is pushed along the first direction by the positioning member 500, so that the workpiece 600 to be detected is abutted against the first vertical plate 211 or the second vertical plate 212 of the slide rail 210, thereby determining the position of the workpiece 600 to be detected in the first direction.

[0097] S200, adjusting the detection position and detection angle of the detection component 310 according to the preset detection parameters, wherein the preset detection parameters at least include a preset detection coordinate position and a preset angle;

[0098] S300, controlling the detection component 310 to obtain a welding spot detection image of the workpiece 600 to be detected

[0099] S400, determining feature information according to the welding spot detection image;

[0100] S500, determining the quality of the welding points of the workpiece 600 to be inspected according to the characteristic information.

[0101] Among them, after completing the positioning of the workpiece 600 to be inspected, the position and direction of the weld detection component 300 are adjusted. Specifically, the driving component 320 includes a first moving module 321, a second moving module 322, a third moving module 323, a rotating module 324 and an angle adjustment disk. The first moving module 321 drives the second moving module 322 to slide in the first direction, the second moving module 322 drives the third moving module 323 to slide in the second direction, and the third moving module 323 drives the detection component 310 to slide in the vertical direction. The rotating module 324 is used to control the rotation of the detection component 310 in the horizontal direction, and the angle adjustment disk is used to control the rotation of the detection component 310 in the vertical direction. First, the position of the detection component 310 in the first direction is adjusted by the first moving module 321, and then the position of the detection component 310 in the second direction is adjusted by the second moving module 322, and then the position of the detection component 310 in the vertical direction is adjusted by the third moving module 323. After determining the position of the detection component 310, the detection direction of the detection component 310 is adjusted by the rotating module 324 and the angle adjustment disk, so as to facilitate the acquisition unit 311 to capture clear welding spot detection images from different angles. In a preferred embodiment, the first motor, the second motor, the third motor and the driving device in the rotating module 324 are all servo motors or stepper motors.

[0102] Specifically, after completing the positioning of the workpiece 600 to be inspected, the welding spot detection image of the workpiece 600 to be inspected is obtained through the acquisition unit 311. Specifically, the acquisition unit 311 includes but is not limited to a camera or other equipment capable of taking pictures of the workpiece 600 to be inspected. After the acquisition unit 311 acquires the welding spot detection image of the workpiece 600 to be inspected, when there is a welding defect in the workpiece 600 to be inspected, the image of the corresponding position of the welding defect is different from the images of other corresponding positions with good welding. Therefore, the welding quality of the surface of the workpiece 600 to be inspected can be determined by taking pictures of the workpiece 600 to be inspected.

[0103] Embodiment 2,

[0104] Please refer to Figure 4 In embodiment 1, step S500 includes:

[0105] S510, matching the characteristic information with preset characteristic information;

[0106] S520: If the matching degree between the characteristic information and the preset characteristic information is greater than a preset value, determine that the characteristic information is a defect corresponding to the preset characteristic information.

[0107] The preset feature information is image information or parameter information pre-stored in the weld spot detection device for evaluating welding quality. Specifically, after determining the feature information, the size parameter or shape type of the feature information can be determined and matched with the preset feature information. In a specific embodiment, the weld in the preset feature information is a circular structure. When the weld in the acquired feature information is a rectangle or a triangle, it is determined that the shape of the weld in the weld spot detection image is different from the shape of the weld in the pre-stored feature information, so it is determined that the weld quality of the workpiece 600 to be detected does not meet the requirements. In another specific embodiment, the size of the weld in the preset feature information is less than 1.2 mm. When the size of the weld in the feature information is 0.9 mm, it is determined that the feature information has a high matching degree with the preset feature information, so it is determined that the weld meets the weld quality evaluation requirements.

[0108] In a preferred embodiment, before determining the feature information based on the weld spot detection image, the weld spot detection image needs to be preprocessed;

[0109] Among them, when acquiring the weld point detection image, in order to facilitate the extraction of feature information in the weld point detection image and to facilitate the identification of the feature information, it is necessary to perform a preprocessing operation on the weld point detection image. Specifically, the preprocessing operation includes but is not limited to grayscale processing of the weld point detection image, sharpening the weld point detection image, or black and white binarization processing of the weld point detection image.

[0110] In a preferred embodiment, during the inspection of the workpiece 600 to be inspected, the welding spot area of ​​the workpiece to be inspected is firstly illuminated vertically by the illumination light source 312, and then the welding spot area of ​​the workpiece 600 to be inspected is photographed by the acquisition unit 311 to obtain the inspection welding spot image, and in order to obtain the inspection welding spot images at different angles, the setting angle of the inspection component 310 can be adjusted by adjusting the rotating module 324 and the angle adjustment seat 325, so as to obtain the inspection welding spot images at different angles, and the acquisition unit 311 sends a plurality of the inspection welding spot images to the image processing unit, and the image processing unit pre-processes the inspection welding spot images and extracts image features, and then matches the inspection welding spot images with the standard welding spot defect pattern and the welding spot good product pattern features, so as to obtain the quality inspection result of the workpiece 600 to be inspected.

[0111] Example 3

[0112] Please refer to Figure 5 In Example 1, the workpiece 600 to be inspected includes a plurality of areas to be inspected, and the step S200 includes:

[0113] S210, determining the area to be inspected of the workpiece 600 to be inspected;

[0114] S220, adjusting the detection position and detection angle of the detection component 310 according to the area to be detected and the preset detection parameters;

[0115] The step S500 further includes:

[0116] S600, adjusting the detection component 310 to another area to be detected, and repeating the step of adjusting the detection position and detection angle of the detection component 310 according to the area to be detected and the preset detection parameters until all the areas to be detected are detected.

[0117] Among them, when the workpiece 600 to be inspected includes multiple areas to be inspected, each area to be inspected needs to be inspected one by one. Specifically, during each weld detection process, the detection position and detection angle of the detection component 310 need to be adjusted according to the area to be inspected. In a preferred embodiment, when it is necessary to illuminate the area to be inspected, the placement position of the lighting source 312 also needs to be adjusted so that the lighting source 312 can accurately illuminate the area to be inspected, so that the acquisition unit 311 can obtain a bright and clear weld detection image.

[0118] In addition, after all the areas to be inspected of the workpiece to be inspected are inspected, the limit member 400 is switched from a blocking state to an unblocking state, and the workpiece to be inspected 600 is moved through the transmission assembly 200, so that the workpiece to be inspected 600 can be transferred to the next process.

[0119] To achieve the above objectives, the present application also proposes a computer-readable storage medium, on which a solder joint detection program is stored. When the display program is executed by a processor, the steps of the solder joint detection method described in any of the above embodiments are implemented.

[0120] In some optional implementations, the processor may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or the processor may be any conventional processor, etc.

[0121] The memory may be an internal storage unit of the device, such as a hard disk or memory of the device. The memory may also be an external storage device of the device, such as a plug-in hard disk equipped on the device, a Smart Media Card (SMC), a Secure Digital (SD) card, a Flash Card, etc. Further, the memory may include both an internal storage unit of the device and an external storage device. The memory is used to store the computer program and other programs and data required by the device. The memory may also be used to temporarily store data that has been output or is to be output.

[0122] The technicians in the relevant field can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In practical applications, the above-mentioned function allocation can be completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated in a processing unit, or each unit can exist physically separately, or two or more units can be integrated in one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, which will not be repeated here.

[0123] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A solder joint detection device, characterized in that: The solder joint detection device comprises: A frame, wherein a workbench is provided on the frame; A transmission assembly, wherein the transmission assembly comprises a slide rail, the slide rail is arranged on the workbench, the workpiece to be inspected is slidably connected to the slide rail, and moves along the extension direction of the slide rail; A solder joint detection component, the solder joint detection component comprising a detection component and a driving component, the driving component being disposed on the workbench and connected to the detection component to drive the detection component to move; The detection component includes a collection unit, which is arranged on a side of the transmission component away from the workbench, and the collection direction of the collection unit points to the workbench; The driving assembly includes an angle adjustment seat, and the angle adjustment seat is connected to the collection unit to drive the detection assembly to rotate in a vertical direction; The detection component further includes an illumination light source, which is disposed between the collection unit and the workbench; the illumination light source is a hemispherical structure, the inner surface of the hemispherical structure is a light-emitting surface, and the hemispherical structure is provided with a through hole along the collection direction of the collection unit, and the collection unit collects information of the workpiece to be detected through the through hole; The transmission assembly also includes a limiter and a positioning member. The limiting member is connected to the workbench and is arranged in the moving direction of the workpiece to be detected; the limiting member includes a limiting cylinder and a limiting slider, and the limiting cylinder drives the limiting slider to move in a direction perpendicular to the workbench; the limiting member includes a blocking state and a non-blocking state, when the limiting member is in the blocking state, the distance between the limiting slider and the workbench is greater than the distance between the workpiece to be detected and the workbench, and when the limiting member is in the non-blocking state, the distance between the limiting slider and the workbench is less than or equal to the distance between the workpiece to be detected and the workbench; The positioning member is connected to the slide rail, and the positioning member comprises a positioning cylinder and a positioning block. The positioning cylinder drives the positioning block to move along a direction perpendicular to the slide rail.

2. The solder joint detection device according to claim 1, characterized in that: The driving assembly includes a first moving module, which is fixedly connected to the workbench and drives the collection unit to move along a first direction, and the first direction is parallel to the surface where the workbench is located.

3. The solder joint detection device according to claim 2, characterized in that: The driving assembly also includes a second movable module, which is slidably connected to the first movable module and slides on the first movable module along a first direction, the first direction is parallel to the surface where the workbench is located, and the second movable module drives the collection unit to move along a second direction, the second direction is parallel to the surface where the workbench is located and perpendicular to the first direction.

4. The solder joint detection device according to claim 3, characterized in that: The driving assembly further includes a third movable module, which is slidably connected to the second movable module and drives the collecting unit to slide along a vertical direction on the second movable module.

5. The solder joint detection device according to claim 4, characterized in that: The driving component further includes a rotating module, and the rotating module is connected to the third moving module and the collecting unit to drive the detecting component to rotate.

6. A solder joint detection method, characterized in that: Applied to the solder joint detection device according to any one of claims 1 to 5, the solder joint detection method comprises: Moving the workpiece to be inspected along the slide rail until the workpiece to be inspected abuts against a stopper of the welding spot inspection device; Adjusting the detection position and detection angle of the detection component according to preset detection parameters, wherein the preset detection parameters at least include a preset detection coordinate position and a preset angle; Controlling the detection component to obtain a welding spot detection image of the workpiece to be detected; Determining feature information according to the welding spot detection image; The quality of the welding spot of the workpiece to be inspected is determined according to the characteristic information.

7. The solder joint detection method according to claim 6, characterized in that: The step of determining the quality of the solder joints in the area to be inspected according to the characteristic information comprises: Matching the characteristic information with preset characteristic information; If the matching degree between the characteristic information and the preset characteristic information is greater than a preset value, it is determined that the characteristic information is a defect corresponding to the preset characteristic information.

8. The solder joint detection method according to claim 6, characterized in that: The workpiece to be inspected includes a plurality of areas to be inspected, and the step of adjusting the inspection position and the inspection angle of the inspection component according to preset inspection parameters, wherein the preset inspection parameters at least include preset inspection coordinate positions and preset angles, comprises: Determining the to-be-detected area of ​​the to-be-detected workpiece; Adjusting the detection position and detection angle of the detection component according to the area to be detected and the preset detection parameters; The step of determining the quality of the welding spot of the workpiece to be inspected according to the characteristic information further includes: The detection component is adjusted to another area to be detected, and the step of adjusting the detection position and detection angle of the detection component according to the area to be detected and the preset detection parameters is repeated until all the areas to be detected are detected.

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