Support components and display equipment

Abstract

The present disclosure provides a support assembly and a display device. The support assembly is used to support a display component and includes a housing, a circuit board assembly, and a heat sink assembly. The housing includes a mounting cavity; the circuit board assembly is assembled in the mounting cavity; and the heat sink assembly is assembled to the circuit board assembly. The support assembly dissipates heat from the circuit board assembly through the heat sink assembly, ensuring efficient and stable operation of the circuit board assembly.

Description

Technical Field

[0001] The present disclosure relates to the technical field of display devices, and in particular to a supporting assembly and a display device. Background Art

[0002] Typically, a display device includes a circuit board assembly, which is used to power and control the display device. However, during operation, the circuit board assembly tends to heat up. This high temperature can limit the efficient and stable operation of some components, thereby affecting the normal operation of the display device. Therefore, it is necessary to dissipate heat from the circuit board assembly to ensure the normal operation of the display device. Summary of the Invention

[0003] The present disclosure provides an improved support assembly and display device.

[0004] One aspect of the present disclosure provides a support assembly for supporting a display component; the support assembly includes:

[0005] a housing, the housing comprising a mounting cavity;

[0006] A circuit board assembly is assembled in the mounting cavity; and

[0007] The heat dissipation component is assembled on the circuit board component.

[0008] Optionally, the heat dissipation assembly is connected to the housing, and the heat of the circuit board assembly is transferred to the housing through the heat dissipation assembly.

[0009] Optionally, the circuit board assembly includes a mainboard, the heat dissipation assembly includes a mainboard heat dissipation element, the mainboard heat dissipation element is assembled on the mainboard, and one end of the mainboard heat dissipation element is connected to the housing.

[0010] Optionally, the housing includes a first connecting portion, and one end of the mainboard heat sink is connected to the first connecting portion.

[0011] Optionally, the mainboard heat sink includes a first heat dissipation portion, a second heat dissipation portion and a third heat dissipation portion connected in sequence, the first heat dissipation portion is assembled on the mainboard, the second heat dissipation portion extends toward the first connection portion, and the third heat dissipation portion is connected to the first connection portion.

[0012] Optionally, the circuit board assembly further includes a logic board, the heat dissipation assembly includes a logic board heat sink, the logic board heat sink is assembled on the logic board, and one end of the logic board heat sink is connected to the housing.

[0013] Optionally, the housing includes a second connecting portion, and one end of the logic board heat sink is connected to the second connecting portion.

[0014] Optionally, the logic board heat sink includes a graphite sheet.

[0015] Optionally, a plurality of heat dissipation holes communicating with the installation cavity are provided on the wall of the shell.

[0016] One aspect of the present disclosure provides a display device, the display device comprising:

[0017] Any of the above-mentioned support components; and

[0018] The display component includes a display screen.

[0019] Optionally, the shell of the support assembly is provided with a groove, and the display screen is arranged in the groove of the support assembly.

[0020] The technical solution provided by the present disclosure has at least the following beneficial effects:

[0021] The support assembly and display device provided by the embodiments of the present disclosure are assembled on the circuit board assembly based on the heat dissipation assembly to effectively dissipate heat from the circuit board assembly, ensuring efficient and stable operation of the circuit board assembly, and further ensuring efficient and stable operation of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 1 is a block diagram of a back panel module of a television according to an exemplary embodiment of the related art;

[0023] Figure 2 FIG2 is a schematic structural diagram of a display device according to an exemplary embodiment of the present disclosure;

[0024] Figure 3 FIG2 is a schematic diagram of a partial structure of a support assembly according to an exemplary embodiment of the present disclosure;

[0025] Figure 4 FIG2 is a schematic diagram of a partial structure of a support assembly according to an exemplary embodiment of the present disclosure;

[0026] Figure 5 FIG2 is a schematic diagram of a partial structure of a support assembly according to an exemplary embodiment of the present disclosure;

[0027] Figure 6 FIG2 is a schematic structural diagram of a mainboard heat sink and a mainboard after being assembled according to an exemplary embodiment of the present disclosure. DETAILED DESCRIPTION

[0028] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present disclosure. Rather, they are merely examples of apparatuses and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

[0029] The terms used in this disclosure are for the purpose of describing specific embodiments only and are not intended to limit the disclosure. Unless otherwise defined, the technical or scientific terms used in this disclosure should have the usual meaning understood by people with ordinary skills in the field to which this disclosure belongs. "First", "second" and similar words used in this disclosure specification and claims do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, "one" or "a" and similar words do not indicate a quantity limitation, but rather indicate the existence of at least one. Unless otherwise indicated, words such as "include" or "comprises" mean that the elements or objects appearing before "include" or "comprises" include the elements or objects listed after "include" or "comprises" and their equivalents, and do not exclude other elements or objects. Words such as "connected" or "connected" are not limited to physical or mechanical connections, and may include electrical connections, whether direct or indirect.

[0030] As used in this disclosure and the appended claims, the singular forms "a," "an," "said," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0031] Figure 1 FIG2 is a block diagram of a back panel module of a television according to an exemplary embodiment of the related art. Figure 1 , the TV includes a display screen (not shown) and a back panel module provided on the back of the display screen. The back panel module includes a circuit board assembly, and the circuit board assembly includes a main board and a power board that are staggered from each other. The upper and lower areas of the main board are heat dissipation hole areas, which are provided with heat dissipation holes to dissipate heat from the main board. The upper and lower areas of the power board are heat dissipation hole areas, which are provided with heat dissipation holes to dissipate heat from the power board. If the display screen is made into a transparent display screen, the circuit board assemblies such as the main board and the power board need to be separated from the display screen to ensure the display effect of the transparent display screen. If the main board and the power board are all arranged in a shell below the display screen, since the main board and the power board are all assembled in the mounting cavity of the shell, it is necessary to reconsider how to dissipate heat from the circuit board assembly. Based on this, the embodiment of the present disclosure provides a support assembly and a display device, which are described below in conjunction with the accompanying drawings:

[0032] Figure 2 FIG. 1 is a schematic structural diagram of a display device according to an exemplary embodiment of the present disclosure. Figure 3 FIG2 is a partial structural diagram of a support assembly according to an exemplary embodiment of the present disclosure. Figure 2 and Figure 3 , some embodiments of the present disclosure provide a display device including: a display component 100 and a supporting assembly 200 .

[0033] The display component 100 includes a display screen 110. Exemplarily, the display screen 110 may be an OLED (Organic Light-Emitting Diode) display screen or an LCD (Liquid Crystal Display) display screen. Exemplarily, the display screen 110 may be a transparent display screen, which may display a complete image. When the transparent display screen does not display a complete image or does not display an image, the transparent display screen may be transparent. Exemplarily, the display component 100 may further include a frame 120 provided at the edge of the display screen 110, and the frame 120 protects the display screen 110. Exemplarily, the display component 100 may further include a glass cover plate (not shown) attached to the display screen 110 to improve the mechanical strength of the display component 100. The display component 100 is assembled to the support assembly 200.

[0034] The support assembly 200 is applied to a display device, and includes a housing 210 , a circuit board assembly 220 , and a heat dissipation assembly 230 .

[0035] The housing 210 supports the display unit 100. The housing 210 can support the bottom, top, or side of the display unit 100. Preferably, the housing 210 supports the bottom of the display unit 100, so that the support assembly 200 acts as a base, facilitating placement of the display device. The housing 210 includes a mounting cavity 211 for assembling components such as the circuit board assembly 220. For example, the housing 210 can be made of a high-temperature-resistant metal to facilitate heat conduction and dissipation.

[0036] The circuit board assembly 220 is assembled in the mounting cavity 211. For example, the circuit board assembly 220 is electrically connected to the display component 100 to power the display component 100 or control the operation of the display component 100. Furthermore, assembling the circuit board assembly 220 in the mounting cavity 211 of the housing 210, separate from the display component 100, facilitates the realization of a transparent display screen.

[0037] The heat dissipation assembly 230 is assembled on the circuit board assembly 220 to dissipate heat from the circuit board assembly 220 .

[0038] Based on the above, the support assembly 200 and display device provided in the embodiments of the present disclosure utilize a heat dissipation assembly 230 assembled with the circuit board assembly 220 to effectively dissipate heat from the circuit board assembly 220, ensuring efficient and stable operation of the circuit board assembly 220, and thereby ensuring efficient and stable operation of the display device. Furthermore, the display device provided in the embodiments of the present disclosure utilizes the circuit board assembly 220 and heat dissipation assembly 230 assembled with the mounting cavity 211 of the housing 210 of the support assembly 200, thereby enabling the circuit board assembly 220, heat dissipation assembly 230, and display component 100 to be separated, thereby facilitating a transparent display effect for the display screen 110.

[0039] In some embodiments, the heat dissipation assembly 230 is connected to the housing 210, and the heat of the circuit board assembly 220 is transferred to the housing 210 through the heat dissipation assembly 230. In this way, the heat of the circuit board assembly 220 is transferred to the housing 210 through the heat dissipation assembly 230, that is, the heat is transferred from the high temperature area to the low temperature area. The housing 210 is cleverly used to assist in heat dissipation, so as to effectively dissipate heat from the circuit board assembly 220, ensure the efficient and stable operation of the circuit board assembly 220, and thus ensure the efficient and stable operation of the display device.

[0040] In some embodiments, continue to refer to Figure 3 The circuit board assembly 220 includes a mainboard 221, and the heat dissipation assembly 230 includes a mainboard heat sink 231. The mainboard heat sink 231 is assembled on the mainboard 221, and one end of the mainboard heat sink 231 is connected to the housing 210. The mainboard 221 is used to control the operation of the display device. There are many components on the mainboard 221, which are prone to heat. The heat of the mainboard 221 is transferred to the housing 210 through the mainboard heat sink 231 to dissipate heat from the mainboard 221, which is beneficial for the efficient and stable operation of the mainboard 221. Exemplarily, the mainboard heat sink 231 can be assembled to the mainboard 221 by means of screws or other fixing parts; exemplarily, the mainboard heat sink 231 can be bonded to the mainboard 221 by means of a thermally conductive adhesive layer, which is not specifically limited in this disclosure.

[0041] Figure 4 FIG. 1 is a partial structural diagram of a support assembly 200 according to an exemplary embodiment of the present disclosure. Figure 5 FIG2 is a partial structural diagram of a support assembly 200 according to an exemplary embodiment of the present disclosure. Figure 4 and Figure 5, the housing 210 includes a first connection portion 212, and one end of the motherboard heat sink 231 is connected to the first connection portion 212. In this way, it is convenient to connect the motherboard heat sink 231 and the motherboard 221. It should be noted that the first connection portion 212 can be any first connection portion 212 that is closer to the motherboard heat sink 231. Exemplarily, the motherboard heat sink 231 is in direct contact with the first connection portion 212 and is not fixedly connected by other components. Exemplarily, the motherboard heat sink 231 can be fixed to the first connection portion 212 by fixing members such as screws or a thermal conductive adhesive layer. Exemplarily, continue to refer to Figure 5 The first connecting portion 212 can be a first boss 202 formed by the wall of the housing 210 protruding into the mounting cavity 211. Accordingly, a mounting groove is formed on the outer side of the first boss 202 to assemble components such as control buttons. For example, the first connecting portion 212 can also be a first connecting wall protruding into the mounting cavity 211.

[0042] The motherboard heat sink 231 can be designed in a variety of structures. In some embodiments, the motherboard heat sink 231 includes at least one heat sink, one end of which is assembled to the motherboard 221 and the other end of which is connected to the first connection portion 212. It will be appreciated that when the motherboard heat sink 231 includes one or more heat sinks, the ends of a heat sink can be connected to the motherboard 221 and the first connection portion 212, respectively. Alternatively, one of the multiple heat sinks can be assembled to the motherboard 221, while the other heat sinks are connected to the first connection portion 212.

[0043] Figure 6 The figure shows a schematic diagram of the structure after the motherboard heat sink 231 and the motherboard 221 are assembled according to an exemplary embodiment of the present disclosure. Figure 4 and Figure 6The motherboard heat sink 231 includes a first heat sink 232, a second heat sink 233, and a third heat sink 234, which are connected in sequence. The first heat sink 232 is assembled on the motherboard 221, the second heat sink 233 extends toward the first connection portion 212, and the third heat sink 234 is connected to the first connection portion 212. In this way, the heat from the motherboard 221 is transferred to the housing 210 through the cooperation of the first heat sink 232, the second heat sink 233, and the third heat sink 234. This also lengthens the motherboard heat sink 231, facilitating its absorption and transfer of more heat. In addition, the connection of the third heat sink 234 to the first connection portion 212 also helps stabilize the position of the motherboard heat sink 231 and the motherboard 221. Furthermore, this allows the motherboard heat sink 231 to fully utilize the limited space inside the housing 210, thereby improving the integration of components within the housing 210. Exemplarily, the first heat dissipation portion 232 and the third heat dissipation portion 234 are parallel, and the angle formed between the second heat dissipation portion 233 and the first heat dissipation portion 232 is 20° to 90°, so that the mainboard heat dissipation element 231 forms a "Z-shaped" structure. Exemplarily, the third heat dissipation portion 234 is connected to the first connection portion 212, and the second heat dissipation portion 233 can contact the side wall of the first connection portion 212, so that the contact area between the mainboard heat dissipation element 231 and the housing 210 is increased, which is beneficial for the mainboard heat dissipation element 231 to effectively transfer the heat of the mainboard 221 to the housing 210. Exemplarily, referring to Figure 6 The first heat dissipation portion 232 is provided with a plurality of heat dissipating fins 235. Thus, the heat dissipation of the mainboard 221 is effectively performed by the plurality of heat dissipating fins 235. For example, the plurality of heat dissipating fins 235 are arranged in parallel and perpendicular to the surface of the mainboard 221. This not only facilitates the arrangement but also facilitates heat transfer through the gaps between the heat dissipating fins 235 and the heat dissipating fins 235.

[0044] In some embodiments, at least one of the heat sink 235, the first heat sink 232, the second heat sink 233, and the third heat sink 234 is made of metal. This facilitates the motherboard heat sink 231 to absorb and transfer heat. Furthermore, due to the high ductility of metal, the motherboard heat sink 231 can be easily processed into various structures, thereby facilitating its adaptation to a small installation cavity.

[0045] In some embodiments, continue to refer to Figure 3 、 Figure 4 and Figure 5The circuit board assembly 220 includes a logic board 222, and the heat dissipation assembly 230 includes a logic board heat sink 236. The logic board heat sink 236 is assembled on the logic board 222, and one end of the logic board heat sink 236 is connected to the housing 210. The logic (T-CON, Timing Controller) board 222 is used to control the timing of the signal sent by the main board 221 and convert it into a driving signal to drive the display component 100 to operate. The logic board 222 is prone to heat during the operation of the display component 100. The heat dissipation of the logic board 222 by the logic board heat sink 236 is conducive to the efficient and stable operation of the logic board 222. Exemplarily, the logic board heat sink 236 can be fixed to the logic board 222 by a fixing member. Exemplarily, the logic board heat sink 236 can be bonded to the logic board 222 by a thermally conductive adhesive layer, which is not specifically limited in the present disclosure.

[0046] In some embodiments, continue to refer to Figure 4 and Figure 5 , the housing 210 includes a second connecting portion 213, and one end of the logic board heat sink 236 is connected to the second connecting portion 213. It should be noted that the present disclosure does not limit the distance between the logic heat sink 236 and the second connecting portion 213, and the second connecting portion 213 can be any second boss or second connecting wall 203 that is closer to the logic heat sink 236. The second boss protrudes from the inner wall of the housing 210 to the mounting cavity 211, and the second connecting wall protrudes from the inner wall of the housing 210 to the mounting cavity 211. In this way, the logic board heat sink 236 transfers the heat of the logic board 222 to the housing 210. Exemplarily, the logic board heat sink 236 is in contact with the second connecting portion 213. Exemplarily, the logic board 222 is connected to the second connecting portion 213 by thermal adhesive or a fixing member.

[0047] In some embodiments, the first connection portion 212 and the second connection portion 213 can be separately provided on the housing 210. In other words, the first connection portion 212 and the second connection portion 213 are separately provided in different areas of the housing 210. In this way, the motherboard heat sink 231 transfers heat to the first connection portion 212, and the logic board heat sink 236 transfers heat to the second connection portion 213, which is beneficial for different areas of the housing 210 to receive heat respectively, thereby facilitating efficient heat dissipation of the circuit board assembly 220. For example, the first connection portion 212 and the second connection portion 213 can be arranged relative to each other, such as Figure 5 In the embodiment, the first boss 202 and the second connecting wall 203 are arranged opposite to each other.

[0048] In some embodiments, logic board heat sink 236 comprises a graphite sheet, which absorbs and conducts heat from logic board 222. For example, the area of logic board 222 is smaller than that of motherboard 221. Graphite can typically be processed into a sheet-like structure, making graphite sheets more suitable for the smaller logic board 222 than for motherboard 221. Alternatively, logic board heat sink 236 may comprise a metal heat sink.

[0049] In some embodiments, continue to refer to Figure 4 The housing 210 includes a first surface 214 and a second surface 215 opposite to the first surface 214. The display component 100 is located on one side of the first surface 214. The main board 221 and the logic board 222 are both arranged toward the first surface 214, and one of the main board 221 and the logic board 222 is closer to the first surface 214 than the other. In other words, Figure 4 For example, the main board 221 and the logic board 222 are arranged in the vertical direction. This helps to reduce the space occupied by the circuit board assembly 220 and improve the integration of the support assembly 200. For example, the logic board 222 can be arranged between the main board 221 and the first surface 214. Figure 4 In the embodiment, the logic board 222 is positioned above the main board 221. Thus, when the main board heat sink 231 includes a first heat sink 232, a second heat sink 233, and a third heat sink 234, the logic board 222 can be assembled within the space formed by the first and second heat sinks 232, 233, thereby improving the integration of the support assembly 200. Alternatively, the main board 221 can be positioned between the logic board 222 and the first surface 214.

[0050] In some embodiments, continue to refer to Figure 4 The circuit board assembly 220 further includes a power board 223 disposed toward the first surface 214. One of the power board 223 and the main board 221 is closer to the first surface 214 than the other. In this way, the display component 100 and the main board 221 are powered by the power board 223, shortening the cable lengths between the main board 221 and the logic board 222 and the display component 100, thereby improving the integration of the support assembly 200. For example, the power board 223 is disposed between the main board 221 and the second surface 215, and the logic board 222 can be disposed between the main board 221 and the first surface 214. In the embodiment of the present disclosure, continue to refer to Figure 4 At least one of the mainboard 221, logic board 222, and power board 223 can be fixedly assembled in the mounting cavity 211 of the housing 210 by means of components such as the support assembly 201. The support assembly 200 may include a plurality of support members. The mainboard 221 and logic board 222, as well as the mainboard 221 and power board 223, can also be fixedly connected by means of components such as the support assembly 201.

[0051] In some embodiments, a plurality of heat dissipation holes 217 are provided on the wall of the housing 210, which are connected to the mounting cavity 211, so that air can circulate in the mounting cavity 211 of the housing 210 and remove heat. For example, a plurality of heat dissipation holes 217 are evenly distributed on the wall of the housing 210, and some heat dissipation holes 217 and other heat dissipation holes 217 can be arranged relative to each other. For example, heat dissipation holes 217 can be provided on both the first surface 214 and the side surface 216 of the housing 210. In this way, the heat of the circuit board assembly 220 is transferred to the housing 210 through the heat dissipation assembly 230, and convection is formed in the mounting cavity 211 of the housing 210 through the heat dissipation holes 217, thereby effectively improving the heat dissipation effect. This is conducive to high integration and effective heat dissipation of the circuit board assembly 220 in a housing 210 with a small space.

[0052] In some embodiments, in conjunction with reference Figure 2 and Figure 4 The housing 210 of the support assembly 200 is provided with a groove 218, and the display screen is arranged in the groove 218 of the support assembly 200. In this way, the display component 100 is supported by the housing 210. Exemplarily, the groove 218 is provided with an interface, and the interface is connected to the circuit board assembly 220 through a cable. After the display component 100 is assembled in the groove 218, the display component 100 is electrically connected to the interface. Exemplarily, the housing 210 may include two half-shells arranged opposite to each other, and the two half-shells cooperate to form a groove 218. Each half-shell may be provided with a second connecting portion 213 that protrudes into the mounting cavity 211. The two second connecting portions 213 of the two half-shells may be two parallel second connecting walls 203, and the two second connecting walls 203 cooperate to form the groove 218. One of the second connecting portions 213 may be connected to the logic board heat sink 236 mentioned above.

[0053] In some embodiments, the mounting cavity includes at least two areas, a first area and a second area;

[0054] The main board, the logic board, and the power board are all arranged in the first area of the installation cavity;

[0055] The second area is provided with an audio component.

[0056] In this way, there is no need to set up audio components in the display part, which is conducive to achieving a high screen-to-body ratio display effect.

[0057] In some embodiments, at least two of the main board, the logic board, and the power board are staggered or arranged on the same plane.

[0058] In some embodiments, at least one of the main board, the logic board, and the power board is arranged parallel to the bottom wall of the groove.

[0059] In some embodiments, the display device comprises a transparent television.

[0060] In addition, the display device may also be other devices including the display component 100 , for example, the display screen of a notebook computer may be configured as a transparent display screen.

[0061] In some embodiments, a plurality of support members are provided in the installation cavity for supporting the mainboard, the logic board, and the power board.

[0062] For example, a first support member, a second support member and / or a third support member are provided in the installation cavity;

[0063] The first supporting member is connected to the housing and is used to support the mainboard;

[0064] The second support member is connected to the housing and is used to support the power board;

[0065] The third supporting member is used to provide support between the mainboard and the power board or between the mainboard and the logic board.

[0066] In summary, the support assembly 200 and display device provided by the embodiments of the present disclosure utilize a motherboard heat sink 231 assembled to the motherboard 221, one end of which is connected to the first connection portion 212 of the housing 210. Motherboard heat sink 231 is made of metal, transferring heat from the motherboard 221 to the housing 210 for heat dissipation. A logic board heat sink 236 is assembled to the logic board 222, one end of which is connected to the second connection portion 213 of the mounting cavity 211 of the housing 210. Logic board 222 is made of graphite, transferring heat from the logic board 222 to the housing 210. The combination of motherboard heat sink 231 and logic board heat sink 236 cleverly utilizes the housing 210 to assist in heat dissipation, effectively dissipating heat from the circuit board assembly 220. Furthermore, the air convection generated by the heat dissipation holes 217 further facilitates heat dissipation from the circuit board assembly 220 within the confined space of the housing 210, ensuring efficient and stable operation of the circuit board assembly 220. Furthermore, the logic board 222, main board 221, and power board 223 can be stacked, which improves integration. The circuit board assembly 220 and heat sink assembly 230 are assembled within the mounting cavity 211 of the housing 210 of the support assembly 200. This allows the circuit board assembly 220, heat sink assembly 230, and display unit 100 to be separated, facilitating a transparent display effect for the display screen 110.

[0067] The above-mentioned embodiments of the present disclosure can complement each other if no conflict occurs.

[0068] The above description is only a preferred embodiment of the present disclosure and is not intended to limit the present disclosure. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present disclosure should be included in the scope of protection of the present disclosure.

Claims

1. A support assembly, characterized in that: The supporting assembly is used to support the display component; the supporting assembly includes: a housing, the housing comprising a mounting cavity; A circuit board assembly is assembled in the mounting cavity; and A heat dissipation component, assembled on the circuit board component, The circuit board assembly includes a mainboard, the heat dissipation assembly includes a mainboard heat dissipation element, the mainboard heat dissipation element is assembled on the mainboard, and one end of the mainboard heat dissipation element is connected to the housing, The housing includes a first connecting portion, one end of the mainboard heat sink is connected to the first connecting portion, The mainboard heat sink comprises a first heat sink, a second heat sink and a third heat sink connected in sequence, wherein the first heat sink is assembled on the mainboard, the second heat sink extends toward the first connection portion, and the third heat sink is connected to the first connection portion. The first connecting portion is a first boss formed by making the wall of the shell protrude toward the installation cavity, and a mounting groove is formed on the outer side of the first boss.

2. The support assembly according to claim 1, wherein: The circuit board assembly further includes a logic board. The heat dissipation assembly includes a logic board heat sink. The logic board heat sink is assembled on the logic board, and one end of the logic board heat sink is connected to the housing.

3. The support assembly according to claim 2, characterized in that The housing includes a second connecting portion, and one end of the logic board heat sink is connected to the second connecting portion.

4. The support assembly according to claim 2 or 3, characterized in that: The logic board heat sink includes a graphite sheet.

5. The support assembly according to claim 1, wherein: A plurality of heat dissipation holes communicating with the installation cavity are provided on the wall of the shell.

6. A display device, characterized in that: The display device comprises: The support assembly according to any one of claims 1 to 5; and The display component includes a display screen.

7. The display device according to claim 6, wherein: The shell of the supporting assembly is provided with a groove, and the display screen is arranged in the groove of the supporting assembly.

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