Thermochemical polishing device for diamond coated wire drawing dies
The diamond coating is polished and polished by heating the metal wire through the thermochemical polishing device, which solves the problem that the prior art cannot be effectively polished, and achieves efficient polishing of the diamond coating and extends the mold life.
Patent Information
- Application Number
- CN202011070056.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2020-09-30
- Publication Date
- 2025-01-14
- Estimated Expiration
- 2040-09-30
AI Technical Summary
The existing polishing and polishing devices cannot effectively polish the inner hole surface of the diamond-coated drawing mold, resulting in the inability to obtain a smooth inner hole surface.
Using a thermochemical polishing device, the diamond coating is polished and polished by heating the metal wire, and the relative high-speed movement of the metal wire and the wire drawing mold generates heat, so that the surface temperature of the diamond coating is increased to above 700℃, achieving the polishing effect, and passing Carbon atoms diffusion or chemical reactions form metal carbides to improve polishing efficiency.
Effective polishing of diamond coating is achieved, the smoothness and wear resistance of the inner hole surface of the wire drawing mold is improved, and the service life of the mold is extended.
Smart Images

Figure CN111979548B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a device for polishing a wire drawing die having a diamond coating. Background Art
[0002] A wire drawing die is a tool used during the metal compression process to force metal through the die under the action of external force, compress the metal cross-sectional area, and obtain the required metal cross-sectional shape and size.
[0003] In order to improve the wear resistance of the wire drawing die, the applicant coated a layer of diamond coating on the inner hole surface of the wire drawing die, which greatly improved the service life of the wire drawing die. Since the wire drawing die has high precision requirements, it is necessary to grind and polish the diamond coating in the inner hole to obtain a smooth inner hole surface. However, due to the small diameter of the inner hole and the very hard and wear-resistant diamond coating, the existing grinding and polishing devices cannot grind and polish it. Summary of the invention
[0004] In view of this, the present invention provides a thermochemical polishing device for a diamond-coated wire drawing die, which grinds and polishes the diamond coating by heating a metal wire.
[0005] In order to solve the above technical problems, the technical solution of the present invention is to use a thermochemical polishing device for a diamond-coated wire drawing die, including a metal wire and a metal wire clamping device for clamping the metal wire to make a linear reciprocating motion; one end of the metal wire is wound on a pay-off wheel, and the other end is wound on a slow wire winding wheel; it also includes a power supply for heating the metal wire, and the two poles of the power supply are overlapped on the metal wire using a brush; it also includes a die clamping device for clamping the wire drawing die, the die clamping device can rotate around its axis, and the axis of the inner hole of the wire drawing die clamped by it coincides with the metal wire. The principle of the present invention is that under a certain temperature, carbon atoms diffuse into the hot metal wire or react chemically to form metal carbides. The temperature of the metal wire used for polishing cannot be too low, otherwise the polishing efficiency will be low; but the temperature cannot be too high, otherwise the metal liquefaction will contaminate the diamond film, generally 700-850℃ is more suitable.
[0006] As an improvement, a tensioning wheel for tensioning the metal wire is arranged behind the pay-off wheel and before the slow winding wheel. The metal wire is conducive to grinding and polishing after being tensioned.
[0007] As a further improvement, the mold clamping device is located between two brushes. The metal wire between the two brushes is electrically heated.
[0008] As another further improvement, the wire clamping device includes two clamps; the clamps include a U-shaped fork and two bolts threadedly matched with the left and right fork arms of the U-shaped fork, and clamps are provided at the ends of the bolts.
[0009] As an improvement, the mold clamping device includes a turntable and a clamp fixed on the turntable.
[0010] As an improvement, the power supply is a direct current power supply.
[0011] The benefit of the present invention lies in that the polishing device with the above structure is specially designed for wire drawing dies with diamond coating. The diamond coating in the inner hole is polished by a heated metal wire. The relative high-speed movement of the wire drawing die and the hot metal wire is used to generate heat through friction, so that the surface temperature of the die coating and the hot wire is increased to above 700°C, reaching the appropriate temperature for thermal dissolution of diamond, so as to better polish the coating. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Figure 1 It is a structural schematic diagram of the present invention.
[0013] Figure 2 It is a structural schematic diagram of a wire clamping device.
[0014] Markings in the figure: 1 metal wire, 2 pay-off wheel, 3 slow winding wheel, 4 tensioning wheel, 5 power supply, 6 brush, 7 wire drawing die, 8 die clamping device, 9 metal wire clamping device, 91 U-shaped fork, 92 bolt, 93 splint. DETAILED DESCRIPTION
[0015] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention is further described in detail below in conjunction with specific implementation methods.
[0016] like Figure 1 , Figure 2 As shown, the present invention includes a metal wire 1 and a metal wire clamping device 9 for clamping the metal wire 1 to perform linear reciprocating motion; in this embodiment, the metal wire 1 is arranged vertically and can perform up and down reciprocating motion. One end of the metal wire 1 is wound on the pay-off wheel 2, and the other end is wound on the slow winding wheel 3; because the metal wire 1 will be elongated and thinned after grinding, the elongated part needs to be wound up by the slow winding wheel 3 after a period of use. It also includes a power supply 5 for heating the metal wire 1, and the two poles of the power supply 5 are overlapped on the metal wire 1 by brushes 6; the power supply 5 is preferably a DC power supply. It also includes a die clamping device 8 for clamping the wire drawing die 7, and the die clamping device 8 is located between the two brushes 6. The die clamping device 8 can rotate around its axis, and the axis of the inner hole of the wire drawing die 7 clamped by it coincides with the metal wire 1.
[0017] A tensioning wheel for tensioning the metal wire 1 is arranged behind the pay-off wheel 2 and before the slow winding wheel 3 .
[0018] The wire clamping device 1 includes two clamps; the clamps include a U-shaped fork 91 and two bolts 92 threadedly matched with the left and right fork arms of the U-shaped fork 91, and a clamp 93 is provided at the end of the bolt 92. The mold clamping device 8 includes a turntable and a clamp fixed on the turntable. In order to simplify the design and avoid duplication of equipment, the wire clamping device 9 and the mold clamping device 8 can adopt the clamping device on the existing inner hole polishing machine. The specific structure of the present invention is not repeated.
[0019] When in use, first clamp the wire drawing die 7 on the die clamping device 8, then release a section of metal wire 1 from the pay-off wheel 2, and let the metal wire 1 pass through the inner hole of the wire drawing die 7 and then reel it onto the slow wire reel 3. The wire clamping device 9 clamps the metal wire 1 and moves it up and down, and the brush 6 of the power supply 5 overlaps the metal wire 1 to heat the metal wire 1. By utilizing the relative high-speed movement of the wire drawing die 7 and the hot metal wire 1, friction generates heat, so that the surface temperature of the die coating and the hot metal wire 1 is raised to above 700°C, reaching the appropriate temperature for the thermal dissolution of diamond, so as to better polish the coating. At the same time, a certain solvent is added to the polishing surface to promote the chemical reaction of the contact surface, produce metal carbide, further improve the etching of the diamond coating, and improve the polishing efficiency.
[0020] The above are only preferred embodiments of the present invention. It should be noted that the above preferred embodiments should not be regarded as limiting the present invention, and the protection scope of the present invention should be based on the scope defined by the claims. For ordinary technicians in this technical field, several improvements and modifications can be made without departing from the spirit and scope of the present invention, and these improvements and modifications should also be regarded as the protection scope of the present invention.
Claims
1. A thermochemical polishing device for a diamond-coated wire drawing die, characterized in that: It includes a metal wire and a metal wire clamping device for clamping the metal wire to make a linear reciprocating motion; one end of the metal wire is wound on a pay-off wheel, and the other end is wound on a slow winding wheel; it also includes a power supply for heating the metal wire, and the two poles of the power supply are overlapped on the metal wire by brushes; It also includes a die clamping device for clamping the wire drawing die. The die clamping device can rotate around its axis, and the axis of the inner hole of the wire drawing die clamped by the die coincides with the metal wire.
2. The thermochemical polishing device for a diamond-coated wire drawing die according to claim 1, characterized in that: A tensioning wheel for tensioning the metal wire is arranged behind the pay-off wheel and before the slow winding wheel.
3. The thermochemical polishing device for a diamond-coated wire drawing die according to claim 1, characterized in that: The mold clamping device is located between the two brushes.
4. The thermochemical polishing device for a diamond-coated wire drawing die according to claim 1, characterized in that: The wire clamping device comprises two clamps; the clamps comprise a U-shaped fork and two bolts threadedly matched with the left and right fork arms of the U-shaped fork, and clamping plates are arranged at the ends of the bolts.
5. The thermochemical polishing device for a diamond-coated wire drawing die according to claim 1, characterized in that: The mold clamping device comprises a turntable and a clamp fixed on the turntable.
6. The thermochemical polishing device for a diamond-coated wire drawing die according to claim 1, characterized in that: The power supply is a direct current power supply.
Citation Information
Patent Citations
Thermochemical polishing device of diamond coating wire-drawing die
CN212335304U