A quartz cutting device with a quartz product cutting limit device

Abstract

The present invention discloses a quartz cutting device with a quartz product cutting limiting device, which includes a support mechanism, a cutting mechanism and a limiting mechanism. The cutting mechanism and the limiting mechanism are arranged on the upper surface of the support mechanism, and the cutting mechanism is located on one side of the limiting mechanism. A cutting port is arranged at one end of the cutting machine, and a water tank is connected to the cutting port through a conduit, and one end of the conduit penetrates through the cutting port. One end of the discharge chute is located directly below the cutting port. During cutting, the quartz wafer is located on the upper surface of the discharge chute for cutting operations. The water tank uses the conduit to reduce the dust generated during cutting, avoiding the phenomenon of dust diffusion. Through the elastic stretching of the spring, when adjusting the fixed block, the fixed block will automatically rebound to fix and limit the limiting block. Coupled with the sliding connection between the limiting block and the sliding groove, it is convenient to perform cutting operations on quartz wafers with different radii.

Description

Technical Field

[0001] The present invention relates to the technical field of cutting, and specifically to a quartz cutting device with a quartz product cutting limit device. Background Art

[0002] Quartz, a geological term, generally refers to low-temperature quartz, which is the most widely distributed mineral in the quartz family. Broadly defined, quartz also includes high-temperature quartz, coesite, etc. Its main component is SiO 2 , colorless and transparent, often containing a small amount of impurity components, and becoming semi-transparent or opaque crystals. It has a hard texture. Quartz is a mineral resource with very stable physical and chemical properties. The crystal belongs to the oxide mineral of the trigonal system. Quartz block is also known as silica stone, which is mainly the raw material for producing quartz sand, and also the raw material for quartz refractory materials and smelting ferrosilicon. The present invention is a quartz cutting device with a quartz product cutting limit device designed and improved for the cutting of quartz wafers.

[0003] At present, when quartz is being cut, it is easy to generate dust. With the operation of the cutting device, the dust is driven to spread, endangering human health. It is not convenient to classify and store the cut-off scraps during cutting, and it is not convenient to clean the cutting table.

[0004] To solve the above problems, a quartz cutting device with a quartz product cutting limit device is proposed. Summary of the Invention

[0005] The purpose of the present invention is to provide a quartz cutting device with a quartz product cutting limit device, thereby solving the problems in the prior art that when quartz is being cut, it is easy to generate dust. With the operation of the cutting device, the dust is driven to spread, endangering human health. It is not convenient to classify and store the cut-off scraps during cutting, and it is not convenient to clean the cutting table.

[0006] To achieve the above purpose, the present invention provides the following technical solution: A quartz cutting device with a quartz product cutting limit device, including a support mechanism, a cutting mechanism, and a limit mechanism. The cutting mechanism and the limit mechanism are arranged on the upper surface of the support mechanism, and the cutting mechanism is located on one side of the limit mechanism. The support mechanism includes a support table and a filtering component, and the filtering component is arranged inside the support table;

[0007] The cutting mechanism includes a cutting machine, a water tank, a conduit, and a cutting port. One end of the cutting machine is provided with the cutting port. The water tank is connected to the cutting port through the conduit, and one end of the conduit penetrates through the cutting port;

[0008] The limiting mechanism includes a limiting block and a fixing component. The limiting block is arranged on the upper surface of the support platform, and the fixing component is arranged inside the support platform, and one end of the fixing component is connected to one side of the limiting block.

[0009] Preferably, the support platform includes an elastic cavity, a discharge chute, a first filter screen, a placement groove and a sliding groove. An elastic cavity is formed inside the support platform, and the fixing component is arranged inside the elastic cavity. A discharge chute is formed on the upper surface of the support platform, and a first filter screen is installed at the bottom of the discharge chute. A placement groove is formed inside the support platform. A sliding groove is formed on the upper surface of the support platform. A limiting through groove is formed at one end of the inner wall of the elastic cavity.

[0010] Preferably, one end of the discharge chute is located directly below the cutting port, and the discharge chute is communicated with the placement groove through the first filter screen, and through holes are formed at the bottom of the placement groove.

[0011] Preferably, the filtering component includes a placement rack and a second filter screen, and the second filter screen is embedded on the upper surface of the placement rack.

[0012] Preferably, a bridging block is arranged on one inner wall of the placement rack, and the second filter screen is in an inclined state through the bridging block.

[0013] Preferably, a limiting groove is formed on one side of the limiting block, and the limiting groove is in line with the limiting through groove.

[0014] Preferably, the fixing component includes a spring and a fixing block, and the spring is arranged on both sides of the fixing block.

[0015] Preferably, one end of the fixing block is elastically movably connected to the elastic cavity through the spring, and the spring is in a stretched state.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0017] 1. For a quartz cutting device with a quartz product cutting limiting device proposed by the present invention, a cutting port is arranged at one end of the cutting machine, a water tank is connected to the cutting port through a conduit, and one end of the conduit penetrates through the cutting port. One end of the discharge chute is located directly below the cutting port. During cutting, the quartz wafer is located on the upper surface of the discharge chute for cutting operation. The water tank uses the conduit to reduce dust generated during cutting, avoiding the phenomenon of dust diffusion.

[0018] 2. For a quartz cutting device with a quartz product cutting limiting device proposed by the present invention, the discharge chute is communicated with the placement groove through the first filter screen, and the placement groove is in an inclined structure, so that the cut scraps slide and are received through the first filter screen, and the slurry passes through the first filter screen and is classified and received again in cooperation with the filtering component, facilitating the sorting operation of the support platform.

[0019] 3. A quartz cutting device with a quartz product cutting limit device proposed by the present invention. A limit groove is provided on one side of the limit block, and the limit groove coincides with the limit through groove. One end of the fixing block is elastically movably connected to the elastic cavity through a spring, and the spring is in a stretched state. Through the elastic stretching of the spring, when the fixing block is adjusted, the fixing block will automatically rebound to fix and limit the limit block. Then, in combination with the sliding connection between the limit block and the sliding groove, it is convenient to perform cutting operations on quartz wafers with different radii.

[0020] 4. A quartz cutting device with a quartz product cutting limit device proposed by the present invention. The second filter screen is embedded in the upper surface of the placement rack. A bridging block is provided on one inner wall of the placement rack. The second filter screen is in an inclined state through the bridging block. Through the inclined second filter screen, the filtering efficiency of the slurry is improved, and a relatively clear water source is filtered out. It is collected in cooperation with the through holes and can perform dust reduction operations again, saving resource consumption. Description of the Drawings

[0021] Figure 1 is a schematic diagram of the overall structure of the present invention;

[0022] Figure 2 is a schematic diagram of the overall disassembled three-dimensional structure of the present invention;

[0023] Figure 3 is a schematic diagram of the partial enlarged structure of the present invention;

[0024] Figure 4 is a schematic diagram of the cross-sectional structure of the elastic cavity of the present invention;

[0025] Figure 5 is a schematic diagram of the disassembled three-dimensional structure of the filter assembly of the present invention.

[0026] In the figure: 1. Support mechanism; 11. Support table; 111. Elastic cavity; 1111. Limit through groove; 112. Discharge chute; 113. First filter screen; 114. Placement groove; 1141. Through hole; 115. Sliding groove; 12. Filter assembly; 121. Placement rack; 1211. Bridging block; 122. Second filter screen; 2. Cutting mechanism; 21. Cutting machine; 22. Water tank; 23. Conduit; 24. Cutting port; 3. Limit mechanism; 31. Limit block; 311. Limit groove; 32. Fixing component; 321. Spring; 322. Fixing block. Detailed Embodiments

[0027] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0028] Please refer to Figures 1-3 , a quartz cutting device with a quartz product cutting limiting device, including a support mechanism 1, a cutting mechanism 2 and a limiting mechanism 3. The cutting mechanism 2 and the limiting mechanism 3 are arranged on the upper surface of the support mechanism 1, and the cutting mechanism 2 is located on one side of the limiting mechanism 3. The support mechanism 1 includes a support table 11 and a filtering component 12. The filtering component 12 is arranged inside the support table 11. The cutting mechanism 2 includes a cutting machine 21, a water tank 22, a conduit 23 and a cutting opening 24. One end of the cutting machine 21 is provided with the cutting opening 24. The water tank 22 is connected to the cutting opening 24 through the conduit 23, and one end of the conduit 23 penetrates through the cutting opening 24. The support table 11 includes an elastic cavity 111, a discharge chute 112, a first filter screen 113, a placement groove 114 and a sliding groove 115. An elastic cavity 111 is formed inside the support table 11, and a fixing component 32 is arranged inside the elastic cavity 111. A discharge chute 112 is formed on the upper surface of the support table 11, and a first filter screen 113 is installed at the bottom of the discharge chute 112. A placement groove 114 is formed inside the support table 11. A sliding groove 115 is formed on the upper surface of the support table 11. A limiting through groove 1111 is formed at one end of the inner wall of the elastic cavity 111. One end of the discharge chute 112 is located directly below the cutting opening 24, and the discharge chute 112 is communicated with the placement groove 114 through the first filter screen 113. A through hole 1141 is formed at the bottom of the placement groove 114. By arranging the cutting opening 24 at one end of the cutting machine 21, connecting the water tank 22 to the cutting opening 24 through the conduit 23, and one end of the conduit 23 penetrating through the cutting opening 24, and one end of the discharge chute 112 being located directly below the cutting opening 24, during cutting, the quartz wafer is located on the upper surface of the discharge chute 112 for cutting operation. The water tank 22 dusts the dust generated during cutting through the conduit 23 to avoid the phenomenon of dust diffusion. Through the communication between the discharge chute 112 and the placement groove 114 through the first filter screen 113, and the placement groove 114 being in an inclined structure, the cut-off scraps slide and are received through the first filter screen 113, and the slurry passes through the first filter screen 113 and is classified and received again in cooperation with the filtering component 12, facilitating the sorting operation of the support table 11.

[0029] Please refer to Figure 2 and 4, a quartz cutting device with a cutting limit device for quartz products. The limit mechanism 3 includes a limit block 31 and a fixing component 32. The limit block 31 is arranged on the upper surface of the support table 11, and the fixing component 32 is arranged inside the support table 11. One end of the fixing component 32 is connected to one side of the limit block 31. A limit groove 311 is formed on one side of the limit block 31, and the limit groove 311 coincides with the limit through groove 1111. The fixing component 32 includes a spring 321 and a fixing block 322. The spring 321 is arranged on both sides of the fixing block 322. One end of the fixing block 322 is elastically and movably connected to the elastic cavity 111 through the spring 321, and the spring 321 is in a stretched state. Through the elastic stretching of the spring 321, when the fixing block 322 is adjusted, the fixing block 322 will automatically rebound to fix and limit the limit block 31. Coupled with the sliding connection between the limit block 31 and the sliding groove 115, it is convenient to perform cutting operations on quartz wafers with different radii.

[0030] Please refer to Figure 5 , a quartz cutting device with a cutting limit device for quartz products. The filtering component 12 includes a placement rack 121 and a second filter screen 122. The second filter screen 122 is embedded in the upper surface of the placement rack 121. A bridging block 1211 is arranged on one inner wall of the placement rack 121. The second filter screen 122 is in an inclined state through the bridging block 1211. Through the inclined second filter screen 122, the filtering efficiency of the slurry is improved, and a relatively clear water source is filtered out. It is collected in cooperation with the through hole 1141, and the dust reduction operation can be carried out again, saving resource consumption.

[0031] In summary, a quartz cutting device with a quartz product cutting limit device proposed by the present invention includes a support mechanism 1, a cutting mechanism 2, and a limit mechanism 3. The cutting mechanism 2 and the limit mechanism 3 are arranged on the upper surface of the support mechanism 1, and the cutting mechanism 2 is located on one side of the limit mechanism 3. A cutting port 24 is provided at one end of the cutting machine 21, and the water tank 22 is connected to the cutting port 24 through a conduit 23, and one end of the conduit 23 penetrates through the cutting port 24. One end of the discharge chute 112 is located directly below the cutting port 24. When cutting, the quartz wafer is located on the upper surface of the discharge chute 112 for cutting operations. The water tank 22 dusts the dust generated during cutting through the conduit 23 to avoid the phenomenon of dust diffusion. The discharge chute 112 is connected to the placement groove 114 through the first filter screen 113. The placement groove 114 is in an inclined structure, so that the cut scraps slide and are stored through the first filter screen 113, and the slurry passes through the first filter screen 113 and is sorted and stored again by the filter assembly 12, which is convenient for the sorting operation of the support table 11. A limit groove 311 is provided on one side of the limit block 31, and the limit groove 311 coincides with the limit through groove 1111. One end of the fixing block 322 is elastically connected to the elastic cavity 111 through a spring 321, and the spring 321 is in a stretched state. Through the elastic stretching of the spring 321, when the fixing block 322 is adjusted, the fixing block 322 will automatically rebound to fix and limit the limit block 31. Combined with the sliding connection between the limit block 31 and the sliding groove 115, it is convenient to cut quartz wafers with different radii. The second filter screen 122 is embedded in the upper surface of the placement rack 121. A bridging block 1211 is provided on one side inner wall of the placement rack 121. The second filter screen 122 is in an inclined state through the bridging block 1211. Through the inclined second filter screen 122, the filtering efficiency of the slurry is improved, and relatively clear water is filtered out and collected through the through hole 1141, which can perform dust reduction operations again and save resource consumption.

[0032] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0033] Although embodiments of the present invention have been shown and described, those of ordinary skill in the art will appreciate that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A quartz cutting device with a cutting limit device for quartz products, comprising a support mechanism (1), a cutting mechanism (2) and a limit mechanism (3). The cutting mechanism (2) and the limit mechanism (3) are arranged on the upper surface of the support mechanism (1), and the cutting mechanism (2) is located on one side of the limit mechanism (3). Characterized in that: The support mechanism (1) includes a support table (11) and a filtering component (12), and the filtering component (12) is arranged inside the support table (11). The cutting mechanism (2) includes a cutting machine (21), a water tank (22), a conduit (23) and a cutting opening (24). One end of the cutting machine (21) is provided with the cutting opening (24), the water tank (22) is connected to the cutting opening (24) through the conduit (23), and one end of the conduit (23) penetrates through the cutting opening (24). The limit mechanism (3) includes a limit block (31) and a fixing component (32). The limit block (31) is arranged on the upper surface of the support table (11), the fixing component (32) is arranged inside the support table (11), and one end of the fixing component (32) is connected to one side of the limit block (31). The support table (11) includes an elastic cavity (111), a discharge chute (112), a first filter screen (113), a placement groove (114) and a sliding groove (115). An elastic cavity (111) is opened inside the support table (11), and the fixing component (32) is arranged inside the elastic cavity (111). A discharge chute (112) is opened on the upper surface of the support table (11), and a first filter screen (113) is installed at the bottom of the discharge chute (112). A placement groove (114) is opened inside the support table (11). A sliding groove (115) is opened on the upper surface of the support table (11). A limit through groove (1111) is opened at one end of the inner wall of the elastic cavity (111). The filtering component (12) includes a placement rack (121) and a second filter screen (122), and the second filter screen (122) is embedded on the upper surface of the placement rack (121).

2. The quartz cutting device with a cutting limit device for quartz products according to claim 1, Characterized in that: One end of the discharge chute (112) is located directly below the cutting opening (24), and the discharge chute (112) is communicated with the placement groove (114) through the first filter screen (113), and a through hole (1141) is opened at the bottom of the placement groove (114).

3. The quartz cutting device with a cutting limit device for quartz products according to claim 1, Characterized in that: A bridging block (1211) is arranged on one side inner wall of the placement rack (121), and the second filter screen (122) is in an inclined state through the bridging block (1211).

4. The quartz cutting device with a cutting limit device for quartz products according to claim 1, Characterized in that: A limit groove (311) is opened on one side of the limit block (31), and the limit groove (311) coincides with the limit through groove (1111).

5. A quartz cutting device with a quartz product cutting limit device according to claim 1, characterized in that: The fixing component (32) includes a spring (321) and a fixing block (322), and the spring (321) is arranged on both sides of the fixing block (322).

6. A quartz cutting device with a quartz product cutting limit device according to claim 5, characterized in that: One end of the fixing block (322) is elastically and movably connected to the elastic cavity (111) through the spring (321), and the spring (321) is in a stretched state.

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