High Capacity Computer Modules

Abstract

The present disclosure relates to high-capacity computer modules. The present disclosure provides computer modules that can have high capacity, can simplify the design of a computer system that accommodates the module, can utilize system resources in a highly configurable manner, can provide multiple functions, and can be easily inserted into and removed from a computer system.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of and is a non-provisional application to U.S. Provisional Application No. 62 / 855,879, filed May 31, 2019, which is incorporated herein by reference. Background Art

[0003] Computer systems, such as desktop computers, servers and other systems, may include a main logic board that can support processing and other computer functions. These computer systems may also be configurable to at least a certain extent. For example, they may optionally include computer expansion cards and other types of computer modules that can provide additional functions. These computer modules may include graphics processing modules, networking modules, sound modules, data storage modules and other types of modules that can be used for graphics or other data processing functions. They may be compatible with standards such as Peripheral Component Interconnect Express (PCIe), Peripheral Component Interconnect Extended (PCI-X), Accelerated Graphics Port (AGP) or other standards. However, the capacity of these modules may be limited. Their capabilities may be insufficient in applications that require very high performance. Therefore, it may be desirable to provide computer modules with high capacity or high capabilities.

[0004] These computer modules may require resources from the computer system. The computer system may use these resources to provide an environment in which the computer modules can operate correctly. These resources can be used for power supply, cooling to provide interfaces with other circuits inside and outside the computer system, and for other reasons. In addition, these modules may not need to use all the resources available to them, or they may need additional resources. Therefore, it may be expected that these computer modules will have a reduced dependence on computer system resources. It may also be expected that they can use these resources in a highly configurable manner.

[0005] These modules may be somewhat difficult to insert and remove. Space may be limited, especially when multiple other cards are installed. Therefore, it may be desirable to easily insert or remove these cards from a computer system.

[0006] Therefore, what is needed is a computer module that can have high capacity, can simplify the design of the computer system that houses the module, can utilize system resources in a highly configurable manner, can provide multiple functions, and can be easily inserted into and removed from the computer system. Summary of the invention

[0007] Thus, embodiments of the present invention may provide a computer module that can have high capacity, can simplify the design of a computer system that accommodates the module, can utilize system resources in a highly configurable manner, can provide multiple functions, and can be easily inserted into and removed from a computer system.

[0008] These and other embodiments of the present invention can provide computer modules with high capacity. Such high capacity can be achieved by using modules of non-standard size. For example, the size of these high capacity modules can be larger than the standard size. The module can be wider than the standard module, using two, three, four or more than four slots in the computer system housing. The module can be longer, taller or longer and taller than the standard module, and is arranged to be assembled in the non-standard housing. For example, the module can be 20%, 25%, 30% or other percentages higher than the standard module (such as PCI type or other standards). These increased sizes can provide additional space or board area for the increase of capacity or capability.

[0009] These and other embodiments of the present invention can provide computer modules with high capacity by including additional data paths. For example, additional card edges can be included on the board of the module (module board), where the additional card edges can include contacts for additional data lines. These data lines can route signals between the high capacity modules and circuits in the computer system that houses these modules, such as a system host controller. For example, these additional data lines can include additional PCIe lanes. They can also include DisplayPort lanes to provide DisplayPort data to the system host controller.

[0010] The additional card edge may be a separate card edge on the same side of the module board as another card edge, the additional card edge may be on the other side of the module board, or the additional card edge may be an extension of another card edge. For example, the module board may have two card edges along the same side (or different sides), wherein the first card edge may be a PCI-type or other standard card edge, and the second card edge may be a proprietary or non-standard edge that is not a PCI-type or other standard card edge. The PCI-type card edge may have a shape and pinout that conforms to an applicable standard, such as PCI, PCIe, PCI-X, or other standards, including ISA, AGP, and other standards currently in use, under development, or to be developed in the future (collectively referred to as PCI-type or PCIe-type standards). The proprietary card edge may have a different shape and pinout, or it may have the same or similar shape or pinout. The two card edges may be inserted into separate sockets on the main logic board or other locations in the computer system, the two sockets may be integrally formed into a single socket, or both card edges may be inserted into a single socket on the main logic board. The computer module may include more than one module board. Two such module boards may have different card edges. For example, the first module board may have a PCI-type card edge, while the second module board may have a non-standard card edge. The first module board may have two card edges along the same side or different sides, one of which may be a PCI-type or other standard card edge, and the second card edge may be a proprietary or non-standard edge, while the second module board may have a single PCI-type or other standard card edge. The first module board may have two card edges along the same side or different sides, one of which may be a PCI-type or other standard card edge, and the second card edge may be a proprietary or non-standard edge, while the second module board may have two card edges along the same side or different sides, one of which may be a PCI-type or other standard card edge, and the second card edge may be a proprietary or non-standard edge. The computer module may also have three or more of these boards. These module boards may share resources, such as power supplies, heat sinks, or other resources. The module may include a bridge or other pathway for sharing data and possibly power between circuits on two or more module boards.

[0011] These and other embodiments of the present invention can simplify the design of computer systems that accommodate these high-capacity computer modules. For example, additional edges that can be included on the module board can support large-sized power contacts that are sufficient to provide power to the high-capacity modules. This can simplify the design of the computer system by reducing or eliminating the need for additional cables and connectors for delivering power to the modules. In addition, by including additional card edges, or by extending the card edges to transmit additional data paths, the need for additional data cables and connectors can be avoided.

[0012] These embodiments and other embodiments of the present invention can simplify the design of these high-capacity computer modules by utilizing one or more fans located at the front side or other sides of the computer system housing. For example, one, two, three or more than three fans can be located at the front side (or the other side) of the computer system housing. These fans can move air along the length of the high-capacity computer module and come out from the rear side (or the other side) of the computer system housing. By not including fans in the high-capacity computer module, the computer module itself can be simplified. In addition, by not including fans in the computer module, the airflow passing through the module can actually maintain laminar flow, and does not withstand the vortex and reverse flow that may originally need to be overcome by the computer system housing. The module may include heat sinks and other structures for serving as ducts to guide the laminar flow. Multiple fans that can be sufficient to cool the first number of high-capacity and standard computer modules may be included. In the case of including less than the first number of high-capacity and standard computer modules, one or more fans can be powered off or run at a slower speed. Since fans are not included in the high-capacity computer module itself, their size can be larger, and therefore less noise can be generated by operating at a lower speed.

[0013] These embodiments and other embodiments of the present invention can provide a computer including a computer module and a computer system, which work together to provide cooling for the computer module. For example, the computer module can transmit one or more parameters or other information to a system controller or other circuit in a computer system (e.g., in a computer system housing) that accommodates the computer module. These parameters or other information can be provided to the system controller from the computer module using a socket of a board in which the computer module is installed, which can be provided wirelessly, or it can be provided in other ways. At least partially in response to these one or more parameters or other information, the system controller can adjust the speed of one or more fans in the housing of the computer system. These parameters can include the temperature of one or more components in the computer module or the computer module, the power consumed by the computer module, the maximum allowable temperature of one or more components of the computer module, or other parameters or information. For example, the computer module can send the maximum allowable temperature of one or more components to the system controller in the computer system together with the current temperature of the module. Then, the system controller in the computer system can adjust the fan speed in the computer system housing to ensure that the maximum temperature is not exceeded.

[0014] In these and other embodiments of the present invention, other parameters or other information may be provided from the computer module to a system controller or other circuitry in a computer system (referred to herein as the computer system). For example, the computer module may provide an expected cooling profile to the computer system, wherein the expected cooling profile informs the computer system of a specific temperature to expect from the computer module given a specific fan speed profile. Additionally, parameters or other information identifying the type of computer module may be provided by the computer module to the computer system. These parameters or other information may be used by the computer system to adjust the speed of one or more fans in the computer system housing. For example, a computer module that houses several hard disk drives may need to operate at a different temperature than a computer module that houses several solid state drives.

[0015] In these embodiments and other embodiments of the present invention, other parameters or other information can be provided to the computer module from the system controller of the computer system. These parameters or other information can be provided to the computer module from the system controller in the computer system using the socket of the board where the computer module is installed, which can be provided wirelessly, or it can be provided in other ways. For example, the computer system can notify the computer module that all fans are working at full speed. This can then cause the computer module to reduce function, reduce clock rate, or take other actions to control or reduce its temperature. Similarly, the computer system can notify the computer module that one or more fans are not working, or it is not currently desired to increase fan speed. The computer module can then take mitigation steps to adjust its power as needed.

[0016] The speed of one or more fans in a computer system housing may also be adjusted in groups to avoid vibration or acoustic artifacts. For example, the speeds of two or more fans may be offset by a certain amount rather than running them at the same speed to avoid constructive interference that might otherwise generate or increase noise. For similar reasons, two or more fans may be controlled so that they do not rotate at frequencies that are harmonics or multiples of each other or have other relationships.

[0017] These schemes and other embodiments of the present invention can utilize system resources in a highly configurable manner. Similarly, a wide high-capacity module can have two card edges on the module board, wherein the first card edge can be a standard edge, such as a PCI-type card edge, and the second additional edge can be non-standard. These two card edges can be inserted into the sockets of the main logic board. The high-capacity computer module can be wide enough to overlap and block the adjacent card edge sockets. Typically, this may waste the function of the blocked sockets and associated circuits. In contrast, these embodiments and other embodiments of the present invention may include a multiplexer on the main logic board that can reroute signals from unused overlapping sockets (or a portion of a socket) to the sockets for additional card edges.

[0018] These and other embodiments of the present invention can provide a high-capacity computer module that provides multiple functions. For example, the larger form factor of the high-capacity computer module can allow the module to include a greater number of hard disk drives, solid-state drives, or other memory modules. The battery pack that forms the uninterruptible power supply can be arranged as a high-capacity computer module to take advantage of the larger size.

[0019] These and other embodiments of the present invention can provide a high-capacity computer module that can be easily inserted into and removed from a computer system. For example, a high-capacity computer module can include a solid front grille portion or housing wall and one or more rear inserts to help a user insert the module into a computer system. The front grille portion or housing wall can include a front insert that can fit into a slot in the rear opening of the computer system housing. In order to prevent the computer module from being inserted into an incompatible position in the computer system housing, one or more slots in the rear opening can be made larger. These larger slots can be formed to receive larger front inserts on the housing wall, wherein the larger front inserts do not fit into the remaining slots. The rear insert can fit into a slot in the inner surface of the computer system housing. The rear insert and the internal slot can help support the weight of the high-capacity computer module and help the user align the high-capacity computer module in the computer system housing.

[0020] These and other embodiments of the present invention can provide a module with a robust low-profile ejection mechanism. The low profile of the ejection mechanism can help avoid blocking the airflow from the fan through the high-capacity computer module. The ejection mechanism can be controlled by a lever that is formed to fit into an opening in the housing of the high-capacity computer module. The lever can be flush with the module housing in a closed position so that it does not form an opening in the housing that may cause eddy currents. The lever can be stable in two positions. For example, it can be in a stable position when closed (flush with the housing) and can also be stable when partially open (extending from the housing) to eject the module from the computer system housing. The user can move the lever to a partially open position by pressing the first end of the lever into the housing of the module. Then, the user can move the lever to a fully open position. That is, the user can further pull out the lever to eject the module from one or more sockets in the computer system housing. A spring can be used with the lever. When the user pulls the lever to eject the module, the spring can resist the user. When the lever is released, the spring may drive the lever back to the closed position and the user may remove the module from the computer system housing.

[0021] These and other embodiments of the present invention can provide housings and other structures that form mechanically stable computer modules. For example, a computer module may include a plate contained in a housing. The housing may include a back cover, and the plate may be fixed on the top of the back cover. The back cover may extend around the sides of the computer module and partially above the top of the computer module. The housing may also include a radiator, which may be placed on the inner surface of the top portion of the device housing or form the inner surface of the top portion of the device housing. A heat sink group or stack and a housing wall with multiple perforations or openings may form the sides of the computer module. The heat sink may have an opening between them. The openings between the heat sinks and the perforations in the housing wall may form a duct for airflow through the computer module. The heat sink, the heat sink, and the top portion of the housing wall may form a structural support for the computer module. The heat sink, the heat sink, and the housing may interlock to provide a physically stable structure and improved heat dissipation.

[0022] In these and other embodiments of the present invention, these modules can be contained in a housing that can be formed in various ways. For example, they can be formed by machining, such as by using a computer numerical control machine, stamping, forging, metal injection molding, micromachining, 3D printing or other manufacturing processes. These housings can be formed by various materials. For example, they can be formed by aluminum, steel, stainless steel, copper, bronze or other materials. In these and other embodiments of the present invention, materials that can provide good electrical shielding and thermal conductivity can be selected.

[0023] Embodiments of the present invention may provide high capacity modules that may be located in various types of devices, such as portable computing devices, tablet computers, desktop computers, laptop computers, all-in-one computers, wearable computing devices, smart phones, storage devices, portable media players, navigation systems, monitors, power supplies, video delivery systems, adapters, remote control devices, chargers, and other devices.

[0024] Various embodiments of the present invention may include one or more of these and other features described herein.The nature and advantages of the present invention may be better understood by referring to the following detailed description and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 An electronic system according to an embodiment of the present invention is shown;

[0026] Figure 2 A high capacity computer module according to an embodiment of the present invention is shown;

[0027] Figure 3 A module board for a high-capacity computer module according to an embodiment of the present invention is shown;

[0028] Figure 4 A module board for a high-capacity computer module according to an embodiment of the present invention is shown;

[0029] Figure 5 A portion of a computer system according to an embodiment of the present invention is shown;

[0030] Figure 6 A portion of a computer system according to an embodiment of the present invention is shown;

[0031] Figure 7 A portion of a main logic board for a computer system according to an embodiment of the present invention is shown;

[0032] Figure 8 A high capacity computer module with increased storage capability according to an embodiment of the present invention is shown;

[0033] Fig. 9 Another high capacity computer module with increased storage capability according to an embodiment of the present invention is shown;

[0034] Fig.10 Another high capacity computer module with increased storage capability according to an embodiment of the present invention is shown;

[0035] Fig.11 Another high capacity computer module with increased storage capability according to an embodiment of the present invention is shown;

[0036] Fig.12 A high capacity computer module according to an embodiment of the present invention is shown;

[0037] Fig.13 shows a detailed view of a lever for an ejection mechanism according to an embodiment of the present invention;

[0038] Fig.14 showing another detailed view of a lever for an ejection mechanism according to an embodiment of the present invention;

[0039] Fig.15 A bistable lever according to an embodiment of the present invention is shown;

[0040] Fig.16 Shows Fig.15 Further details of the rods;

[0041] Fig.17 is another view of a high capacity computer module according to an embodiment of the present invention;

[0042] Fig.18shows a cutaway top view of an ejection mechanism for a high capacity computer module according to an embodiment of the present invention;

[0043] Fig.19 is an exploded view of an ejection mechanism according to an embodiment of the present invention;

[0044] Fig. 20 An ejection mechanism for a high capacity computer module according to an embodiment of the present invention is shown;

[0045] Fig.21 is used for Fig. 20 Another view of the ejection mechanism of the high capacity computer module;

[0046] Fig. 22 A latch mechanism for securing a high-capacity computer module in place is shown according to an embodiment of the present invention;

[0047] Fig.23 Shows Fig. 22 further details of the latch mechanism;

[0048] Fig.24 A latch mechanism for securing a high-capacity computer module in place is shown according to an embodiment of the present invention;

[0049] Fig.25 A latch mechanism for securing a high-capacity computer module in place is shown according to an embodiment of the present invention;

[0050] Fig.26 A latch mechanism for securing a computer module in place in a computing device housing is shown according to an embodiment of the present invention;

[0051] Fig. 27 A latch mechanism for securing a computer module in place in a computing device housing is shown according to an embodiment of the present invention;

[0052] Fig.28 A portion of a high-capacity computer module and a portion of a computer system according to an embodiment of the present invention are shown;

[0053] Fig.29 A portion of a high-capacity computer module and a portion of a computer system according to an embodiment of the present invention are shown;

[0054] Fig.30 is an exploded view of a front clamping portion of a computer system housing according to an embodiment of the present invention; and

[0055] Fig.31 is an exploded view of a rear clamping portion of a computer system housing according to an embodiment of the present invention. DETAILED DESCRIPTION

[0056] Figure 1 An electronic system according to an embodiment of the present invention is shown. Figure 1 As such, the drawings are shown for illustrative purposes only and do not limit possible embodiments of the invention or the claims.

[0057] In this example, the electronic system may include a desktop computer 100 in communication with a monitor 120. The desktop computer 100 may include a computer system 110. The computer system 110 may house a high-capacity computer module 200 having a housing wall 112 (in Figure 2 1). The computer system 110 may be housed in an equipment housing that includes a computer system housing 116 and a housing wall 112 that may have one or more holes or perforations 113. The desktop computer 100 may use a high-capacity computer module 200 to provide graphics information to a monitor 120 via a cable 130. In these and other embodiments of the invention, one or more high-capacity computer modules 200 may provide graphics, sound, networking, and other functions for the computer system 110.

[0058] The cable 130 may be one of a variety of types of cables. For example, the cable may be a Universal Serial Bus (USB) cable, such as a USB Type A cable, a USB Type C cable, an HDMI, Thunderbolt, DisplayPort, Lightning, or other type of cable. The cable 130 may include a compatible connector insert 132 that plugs into the connector receptacle 114 on the desktop computer 100 and a connector receptacle (not shown) on the monitor 120. The high-capacity computer module 200 may include additional connector receptacles, audio jacks, or other connectors as well as the connector receptacle 114.

[0059] In other embodiments of the present invention, either or both of the desktop computer 100 and the monitor 120 may be modified into a portable computing device, a tablet computer, a desktop computer, a laptop computer, an all-in-one computer, a wearable computing device, a smart phone, a storage device, a portable media player, a navigation system, a monitor, a power supply, a video delivery system, an adapter, a remote control device, a charger, or other device.

[0060] Figure 2 2 shows a high-capacity computer module according to an embodiment of the present invention. The high-capacity computer module 200 can be housed in a housing 210. The module 200 can include a housing wall 112 above the front side. The housing wall 112 can include a housing that can be mounted on a computer system housing 116 (in the Figure 1The housing wall 112 may be formed in a variety of ways and may be formed from a variety of materials. Further details of the housing wall 112, including their structure, methods of manufacture, and usable materials, may be found in co-pending U.S. Provisional Patent Application No. 62 / 736,299, filed on September 25, 2018, entitled “HOUSING CONSTRUCTION,” and co-pending U.S. Patent Application No. 16 / 412,240, filed on May 14, 2019, entitled “HOUSING CONSTRUCTION,” which are incorporated herein by reference. The module 200 may include one or more fans 250, but the module 200 may also not include a fan, as follows Figure 5 and Figure 6 shown.

[0061] The high-capacity computer module 200 may include a board 220 having one or more card edges (shown here as card edges 230 and 240). In these and other embodiments of the present invention, either or both of the card edges 230 and 240 may conform to a standard, such as a PCI-type standard or other standards. For example, they may have a shape and pinout that is compatible with ISA, PCI, PCIe, PCI-X, AGP, or other standards currently in use, being developed, or that may be developed in the future (again, currently referred to herein as PCI-type or PCIe-type). Either or both of the card edges 230 and 240 may be proprietary card edges that are not PCI-type or other standard card edges. The card edges 230 and 240 may be along the same side of the board 220, they may be on different sides of the board 220, or they may be on different boards.

[0062] High-capacity computer module 200 may have various sizes. For example, module 200 may be twice, three times, four times, or more than four times the width of a conventional computer module. Module 200 may have an increased height (in the vertical direction, as shown). For example, module 200 may be 20%, 25%, 30%, 33%, or more than 33% taller than a conventional computer module. The length or depth of module 200 may also be longer than a conventional computer module. This additional volume may allow a higher degree of functionality to be included in high-capacity computer module 200 compared to a conventional computer module.

[0063] Figure 3A module board for a high-capacity computer module according to an embodiment of the present invention is shown. In this example, board 220 may include two card edges, specifically card edge 230 and card edge 240. Card edge 230 may include a plurality of contacts 232, and card edge 240 may include a plurality of contacts 242. Either or both of card edge 230 and card edge 240 may conform to a standard, such as a PCI-type standard or other standards. For example, card edge 230 may be a PCI-type card edge. That is, card edge 230 may have a shape and pinouts that conform to a PCI-type standard (such as PCIe, PCI-X, or other standards). Either or both of card edge 230 and card edge 240 may be proprietary or non-standard card edges. For example, card edge 240 may be a proprietary card edge. Card edges 230 and 240 may include one or more keying features 225 to help prevent card edges 230 and 240 from being improperly inserted such as Figure 7 226 may be included for PCI compliance and in conjunction with the Fig.21 and 22 The latch mechanisms shown operate together.

[0064] The board 220 may also include power contacts 310. Including larger sized power contacts 310 on the board 220 may simplify accommodating a high capacity computer module 200 (in Figure 2 ) of the computer system housing 116 (shown in Figure 1 For example, a high performance graphics module may require a power connection via a cable connected to the graphics module. By utilizing power contacts 310, the need for such a power cable connection may be avoided.

[0065] Including a proprietary card edge 240 can further simplify the computer system housing 116 by including additional data lines on contacts 242 (in Figure 1 20). For example, these additional data lines may include additional PCIe lanes. In these and other embodiments of the present invention, card edge 230 may transmit four, eight, 16, or other numbers of PCIe lanes. Card edge 240 may transmit an additional two, four, eight, or 16 lanes of PCIe data to board 220. Contacts 242 on card edge 240 may also include contacts for a DisplayPort lane to provide DisplayPort data to a system host controller (not shown). That is, in the case where board 220 is included in a graphics module, contacts 242 may provide DisplayPort data directly to a computer system controller, which may avoid the need for a separate cable to transmit the data, thereby simplifying the design of the computer system.

[0066] Figure 4A portion of a module board for a high-capacity computer module according to an embodiment of the present invention is shown. In this example, board 220 may include two card edges, specifically card edge 230 and card edge 240. Card edge 230 may include a plurality of contacts 232, and card edge 240 may include a plurality of contacts 242. Either or both of card edge 230 and card edge 240 may conform to a standard, such as a PCI-type standard or other standards. For example, card edge 230 may be a PCI-type card edge. That is, card edge 230 may have a shape and pinouts that conform to a PCI-type standard (such as PCIe, PCI-X, or other standards). Either or both of card edge 230 and card edge 240 may be proprietary or non-standard card edges. For example, card edge 240 may be a proprietary card edge. Card edges 230 and 240 may include one or more keying features 225 to help prevent card edges 230 and 240 from being improperly inserted such as Figure 7 540. Tab 226 and opening 227 may be included for PCI compliance and operate with a latch mechanism (not shown). Notch 229 may be relatively large in size to accommodate reinforcement structures in socket 540, such as Fig.24 Pin 547 shown.

[0067] The board 220 may also include power contacts 310. Including larger sized power contacts 310 on the board 220 may simplify accommodating a high capacity computer module 200 (in Figure 2 ) of the computer system housing 116 (shown in Figure 1 3. For example, a high performance graphics module may require a power connection through a cable connected to the graphics module. By utilizing power contact 310, the need for such a power cable connection may be avoided. Centering power contact 310 between card edge 230 and card edge 240 may reduce the trace length of the power supply.

[0068] Including a proprietary card edge 240 can further simplify the computer system housing 116 by including additional data lines on contacts 242 (in Figure 120). For example, these additional data lines may include additional PCIe lanes. In these and other embodiments of the present invention, card edge 230 may transmit four, eight, 16, or other numbers of PCIe lanes. Card edge 240 may transmit an additional two, four, eight, or 16 lanes of PCIe data to board 220. Contacts 242 on card edge 240 may also include contacts for a DisplayPort lane to provide DisplayPort data to a system host controller (not shown). That is, in the case where board 220 is included in a graphics module, contacts 242 may provide DisplayPort data directly to a computer system controller, which may avoid the need for a separate cable to transmit the data, thereby simplifying the design of the computer system.

[0069] like Figure 2 As shown, the high-capacity computer module 200 may include one or more fans 250. In these and other embodiments of the present invention, the fans 250 may be omitted from the module 200 and, instead, the fans 520 (in Figure 5 ) is placed in the computer system housing 116 of the computer system 110 (both are in Figure 1 This can help simplify the design of the computer system housing 116 and the computer module 200. For example, one, two, three, or more than three fans 520 can be located in the computer system housing 116 (shown in FIG. Figure 1 The fans 520 can move air along the length of the high-capacity computer module 200 and out the back (or other side) of the computer system housing 116. By not including fans 250 in the module 200, the airflow through the module 200 can remain laminar in nature and not be subject to eddies and reverse flows that might otherwise need to be overcome by the computer system housing 116. The computer module 200 may include heat sinks 1230 (in Fig.12 ) or other duct structures to guide the laminar flow. A plurality of fans 520 sufficient to cool a first number of high-capacity computer modules 200 and standard computer modules (not shown) may be included. In the case of including less than the first number of high-capacity computer modules 200 and standard computer modules, one or more fans 520 may be powered off or run at a slower speed. Since fans 520 are not included in the high-capacity computer modules 200 themselves, their size may be larger and therefore less noise may be generated by operating at a lower speed. The following figure shows an example.

[0070] Figure 5A portion of a computer system according to an embodiment of the present invention is shown. The computer system may include two high-capacity computer modules 200 that may be plugged into sockets 530 and 540 on a main logic board 500. The computer system may be housed in a computer system housing 116. Although in these and other embodiments of the present invention, as shown in flow path 590, fan 520 may move air from the front side 510 to the back side 511 of the computer system housing 116, the air may flow from the back side 511 of the computer system housing 116 toward the front side 510, or the air may flow in another direction. For example, the computer system housing 116 may include one or more ducts (not shown) to direct airflow into and out of the same side or different sides of the computer system housing 116. Likewise, in these and other embodiments of the present invention, fan 250 (in Figure 2 200, and instead, fans 520 may be located in computer system housing 116. By not including fans 250 in module 200, eddy currents and reverse currents that may create hot spots in module 200 may be avoided. Additionally, since fans 250 are not included in high-capacity computer module 200 itself, fans 520 may be larger in size and may therefore generate less noise by operating at a lower speed. Fans 520 may be located on main logic board 500, they may be located on computer system housing 116, or they may be located in computer system 110 (in Figure 1 The fan 520 may be at least approximately aligned with the end of the computer module 200, for example, the fan 520 may be aligned with the end of the computer module 200 having multiple heat sinks 1230 or other ventilation structures.

[0071] Figure 6 A portion of a computer system according to an embodiment of the present invention is shown. Fan 520 can move air again from the front side 510 (or rear side or other part) of the computer system housing 116, as shown here again as flow path 590. In this particular example, the computer module 200 located in front of fan 521 has been removed from sockets 530 and 540. Therefore, fan 521 can be powered off so that it stops or rotates at a lower speed. This power outage can help reduce noise and save power, as well as extend the life of fan 521. Specifically, the system can detect that the module 200 in front of fan 521 does not exist. The system can then adjust the speed of fan 521 to a slower speed, or it can stop fan 521. When the system detects that module 200 is in front of fan 521, it can adjust the speed of fans 521 and 520 to at least approximately equal, but may not set the fan to exactly the same speed to avoid acoustic artifacts. This will be further explained below.

[0072] These and other embodiments of the present invention may provide a computer including a computer module 200 and a computer system 110 that work together to provide cooling for the computer module 200. For example, the computer module 200 may transmit one or more parameters or other information to a system controller or other circuitry (not shown) in the computer system 110 that houses the computer module (e.g., in a computer system housing). These parameters or other information may be sent using the sockets 530 or 540, they may be sent wirelessly, or they may be sent in other ways. In response, at least in part, to these parameters or other information, the system controller or other circuitry in the computer system 110 (referred to as the computer system 110 for simplicity) may adjust the speed of one or more fans in the computer system housing 116. These parameters may include the computer module 200 or one or more components or circuits 290 in the computer module 200 (e.g., in a computer system housing). Figure 6 100 ), the power consumed by computer module 200, the maximum allowable temperature of one or more components or circuits 290 of computer module 200, or other parameters or information. For example, computer module 200 may send the maximum allowable temperature of one or more components or circuits 290 to computer system 110 along with the current temperature of computer module 200. Computer system 110 may then adjust the speed of fans 520 or 521 in computer system housing 116 to ensure that the maximum temperature is not exceeded.

[0073] In these and other embodiments of the invention, other parameters or other information may be provided from the computer module 200 to the computer system 110. For example, the computer module 200 may provide an expected cooling profile to the computer system 110, wherein the expected cooling profile informs the computer system 110 of a particular temperature to expect for the computer module 200 given a speed profile for a particular fan 520 or 521. Additionally, parameters or other information identifying the type of computer module 200 may be provided by the computer module 200 to the computer system 110. These parameters or other information may be used by the computer system 110 to adjust the speed of one or more fans 520 or 521 in the computer system housing 116. For example, a computer system housing 116 that houses a number of hard drives or storage modules 1020 (e.g., Fig.10 The computer module 200 (shown) may need to be connected to a computer module 200 that accommodates several solid-state drives or storage modules 820 (such as Figure 8 The computer module 200 shown in FIG. 2 operates at different temperatures.

[0074] In these and other embodiments of the present invention, other parameters or other information can be provided to the computer module 200 from the computer system 110. These parameters or other information can be sent using the socket 530 or 540, which can be sent wirelessly, or it can be sent in other ways. For example, the computer system 110 can notify the computer module 200 that all fans 520 and 521 are working at full speed. This can then cause the computer module 200 to reduce functionality, reduce clock rate, or take other actions to control or reduce its temperature. Similarly, the computer system 110 can notify the computer module 200 that one or more fans 520 or 521 are not working, or it is not currently desired to increase the speed of one or more fans 520 or 521. The computer module 200 can then take mitigation steps to adjust its power as needed.

[0075] The speed of one or more fans 520 or 521 in the computer system housing 116 may also be adjusted individually or in groups to avoid vibration or acoustic artifacts. For example, the speeds of two or more fans 520 or 521 may be offset by a certain amount, rather than running the fans 520 or 521 at the same speed, to avoid constructive interference that might otherwise increase noise. For similar reasons, two or more fans 520 or 521 may be controlled so that they do not rotate at frequencies that are harmonics or multiples of each other or have other relationships.

[0076] Likewise, embodiments of the present invention can provide computer systems and high-capacity computer modules that utilize resources in an efficient manner. For example, where a circuit and associated data path may not be available at a first socket, they may be rerouted to be available at a second socket. Examples are shown in the following figure.

[0077] Figure 7A portion of a main logic board for a computer system according to an embodiment of the present invention is shown. In this example, a high-capacity computer module 200 has been inserted into sockets 530 and 540 on a main logic board 500. Sockets 530 and 540 may be one or two separate sockets. Sockets 530 and 540 may be formed separately, or they may be formed as a single piece. In this example, the high-capacity computer module 200 may be twice the width of a conventional computer module (shown here as computer module 720) inserted into socket 534. In this example, socket 536 and its associated circuits will not be used by a second computer module because it is covered by module 200. Therefore, a portion of all signal paths associated with socket 536 may be rerouted to socket 540 by multiplexer 712, where they may be used by module 200. Multiplexer 712 may be an analog multiplexer. For example, they may be multiple pass gates or transmission gates. Multiplexer 712 may alternatively be a digital multiplexer. The use of multiplexer 712 may simplify the design of circuitry associated with main logic board 700 , as separate circuits need not be associated with both sockets 536 and 540 .

[0078] Embodiments of the present invention may provide a high capacity computer module with increased functionality. An example is shown in the following figure.

[0079] Figure 8 A high-capacity computer module with increased storage capacity according to an embodiment of the present invention is shown. In this example, the module board 810 may have an increased height, length, or height and length compared to a conventional module board. This may allow an increased number of storage modules 820 to be included on the module board 810. In this example, four storage modules 820 are shown on the module board 810. The storage module 820 may be a 2.5-inch solid-state drive or other type of storage device. Instead of a module for data storage, a battery (not shown) may be included on the module board 810. The module board 810 may include a card edge 830, which may be a standard or proprietary card edge of PCIe or other types. The module board 810 may also include one or more additional card edges as a standard card edge or a proprietary card edge. The high-capacity computer module may also include a housing wall 112.

[0080] Fig. 9Another high-capacity computer module with increased storage capacity according to an embodiment of the present invention is shown. In this example, the module board 910 may have an increased height, length, or height and length compared to a conventional module board. The housing wall 112 may also be wider than a conventional module. For example, it may be twice, three times, four times, or more than four times the width of a conventional computer module. As shown, this may allow storage modules 920 to be stacked in multiples. In this example, twenty-four storage modules 920 are shown on the module board 910. The storage module 920 may be a 2.5-inch solid-state drive or other type of storage device. Instead of a module for data storage, a battery (not shown) may be included on the module board 910. The module board 910 may include a card edge (not shown), which may be a standard or proprietary card edge of PCIe or other types. The module board 910 may also include one or more additional card edges as a standard card edge or a proprietary card edge.

[0081] Fig.10 A high-capacity computer module with increased storage capacity according to an embodiment of the present invention is shown. In this example, the module board 1010 may have an increased height, length, or height and length compared to a conventional module board. This may allow an increased number of storage modules 1020 to be included on the module board 1010. In this example, two storage modules 1020 are shown on the module board 1010. The storage module 1020 may be a 3.5-inch hard drive or other type of storage device. Instead of a module for data storage, a battery (not shown) may be included on the module board 1010. The module board 1010 may include a card edge (not shown), which may be a standard or proprietary card edge of PCIe or other types. The module board 1010 may also include one or more additional card edges as a standard card edge or a proprietary card edge. The high-capacity computer module may also include a housing wall 112.

[0082] Fig.11 Another high-capacity computer module with increased storage capacity according to an embodiment of the present invention is shown. In this example, the module board 1110 may have an increased height, length, or height and length compared to a conventional module board. The housing wall 112 may also be wider than a conventional module. For example, it may be twice, three times, four times, or more than four times the width of a conventional computer module. As shown, this may allow storage modules 1120 to be stacked in multiples. In this example, four storage modules 1120 are shown on the module board 1110. The storage module 1120 may be a 3.5-inch hard drive or other type of storage device. Instead of a module for data storage, a battery (not shown) may be included on the module board 1110. The module board 1110 may include a card edge (not shown), which may be a standard or proprietary card edge of PCIe or other types. The module board 1110 may also include one or more additional card edges as a standard card edge or a proprietary card edge.

[0083] The computer modules shown here may include one, two, or more than two module boards. Each module board may include one, two, or more than two card edges. The card edges may be proprietary card edges, or they may be card edges that comply with ISA, PCI, PCIe, PCI-X, AGP, or other standards currently in use, under development, or that may be developed in the future. For example, a computer module may include: a first module board having two card edges, wherein the first card edge is a PCIe-type card edge and the second card edge is a proprietary or non-standard card edge; and a second module board having a PCIe-type card edge. The computer module may include: a first module board having two card edges, wherein the first card edge is a PCIe-type card edge and the second card edge is a proprietary or non-standard card edge; and a second module board having two card edges, wherein the first card edge is a PCIe-type card edge and the second card edge is a proprietary or non-standard card edge.

[0084] Likewise, these and other embodiments of the present invention may provide high-capacity computer modules that are larger than conventional computer modules. As a result, these high-capacity computer modules may be correspondingly heavier. As a result, these modules may include features that make them easier to insert into a computer system housing (such as computer system housing 116 (in the example of FIG. Figure 1 )) and features removed from a computer system housing. The following figure shows an example.

[0085] Fig.12 1 shows a high-capacity computer module according to an embodiment of the present invention. The high-capacity computer module 200 can be housed in a housing 210. The housing 210 can include or support a plurality of heat sinks 1230 forming an opening. The heat sinks 1230 can extend laterally through at least a portion of the device housing 210 and be attached to a top surface 211 of the housing 210. The heat sinks 1230 can be part of a heat sink cover 2860 (in Fig.28 ). Fan 520 (in Figure 5 ) can drive air laterally through the device housing 210 between the heat sinks 1230 and out of the housing wall 112 (at Figure 1 That is, heat sink 1230 may provide a duct to direct the laminar airflow provided by one or more fans 520 through device housing 210 of computer module 200. Housing 210 may include one or more tabs, such as tab 1210. These tabs may be used to align high-capacity computer module 200 within computer system housing 116 ( Figure 1 For example, the insert tab 1210 may be inserted into a corresponding slot 2830 (in the Fig.28This can help position and support the weight of the high-capacity computer module 200. The insert 1250 can be inserted into the slot 2840 (shown in the computer system housing 116) in the computer system housing 116. Fig.28 .

[0086] These and other embodiments of the present invention may also include an ejection mechanism that can eject the board 220 (in the case of a high-capacity computer module 200) from the computer module 200. Figure 4 The card edges 230 and 240 (shown in FIG. 1 ) push out one or more corresponding sockets 530 and 540 (shown in FIG. 1 ). Figure 7 The ejection mechanism may be controlled by lever 1240. For example, lever 1240 may have a position 1242 that, when pushed by a user, ejects or begins the ejection process of high-capacity computer module 200. Further details are shown in the following figure.

[0087] Fig.13 A detailed view of a rod for an ejection mechanism according to an embodiment of the present invention is shown. Likewise, rod 1240 may be located in opening 212 of housing 210. It may be desirable that rod 1240 be stable in this position to prevent rod 1240 from accidentally extending from housing 210 and being hooked on equipment or clothing (not shown). Rod 1240 may include position 1242. Position 1242 may be identified by a raised or recessed surface, by a symbol, or may be identified in other ways. Likewise, a user may eject or begin an ejection process by pushing position 1242 of rod 1240.

[0088] Fig.14 Another detailed view of a lever for an ejection mechanism according to an embodiment of the present invention is shown. In this view, position 1242 of lever 1240 has been pushed through opening 212 to the interior of housing 210. This can have the effect of moving end 1244 away from housing 210. This action can eject or initiate ejection of high-capacity computer module 200.

[0089] In these and other embodiments of the present invention, ejection of high-capacity computer module 200 can be accomplished by the user pulling end 1244 further away from housing 210. To facilitate this action, it may be desirable for lever 1240 to be stable in the partially open position as shown, with end 1244 a distance from housing 210. This may help prevent lever 1240 from accidentally falling or moving back to a position such as when the lever 1240 is in the partially open position. Fig.13 Similarly, it is also expected that once the rod 1240 is in the closed position Fig.13 The closed position of the lever remains stable. Thus, these and other embodiments of the present invention may provide a bistable lever. An example is shown in the following figure.

[0090] Fig.15 10 shows a bistable lever according to an embodiment of the present invention. In this example, the user has moved the end 1244 of the lever 1240 away from the housing 210. When the lever 1240 is in this position, the card edges 230 and 240 (in Figure 4 ) can be accessed from its sockets 530 and 540 (in Figure 7 ) pops up.

[0091] Rod 1240 may include a plurality of magnets 1246, 1247, and 1248. Magnets 1246 and 1248 may have a first polarity, such as a north pole, and magnet 1247 may have a second polarity, such as a south pole. These magnets may be magnets 1630 (in the device housing 210) in the device housing 210. Fig.16 When the magnets are attracted, the rod 1240 may be in a stable position. When the magnets are repelled, the rod 1240 may be in an unstable position and may be magnetically driven to one of the two stable positions. The stable position may also correspond to Fig.13 The closed position in Fig.14 Partially open position shown.

[0092] Fig.16 Shows Fig.15 Further details of the rod 1240. The rod 1240 can be received in a bracket 1680 that can be attached to the housing 210. The rod 1240 can include magnets 1246, 1247, 1248, such as Fig.15 These magnets can be attracted or repelled by magnets 1630 of bracket 1680 on the inner surface of housing 210. When magnet 1246 (at Fig.15 ) and magnet 1630 are aligned, rod 1240 can be in a stable and closed position. Fig.15 ) and magnet 1630 are aligned, rod 1240 can be in a stable and partially open position. Fig.15 ) and magnet 1630 are aligned, rod 1240 may be unstable and may move to one of two stable positions.

[0093] As described above, by the user pushing position 1242, the rod 1240 can be moved from Fig.13 This moves the lever to its closed position as shown. Fig.14 To facilitate this action, the lever 1240 can be rotated about the axis 1620. When the user moves the end 1244 further away from the housing 210, the lever 1240 can be rotated about the axis 1620. Fig.15 When the user moves the end 1244 from the fully open position shown to eject the high-capacity computer module 200, the spring 1610 can be tightened. Fig.15When the position shown is released, the spring 1610 can drive the rod 1240 back to the position shown in FIG. Fig.13 Specifically, spring 1610 can provide sufficient force to drive rod 1240 through Fig.14 The partially opened stable position is reached Fig.13 closed position.

[0094] Rod 1240 may be a fulcrum that provides force to the ejection mechanism of high-capacity computer module 200. In different embodiments of the present invention, the structure through which this force is converted can be implemented in different ways. The following figure shows an example.

[0095] Fig.17 2 is another view of a high-capacity computer module according to an embodiment of the present invention. High-capacity computer module 200 may be housed in housing 210. Housing 210 may include heat sink 1230 that defines an opening in the rear of housing 210. Fan 520 (at Figure 5 12) can drive air through the heat sink 1230 and out of the housing wall 112. That is, the heat sink 1230 can provide a duct to direct laminar airflow through the device housing 210 of the computer module 200. The insert 118 of the housing wall 112 and the insert 1210 of the housing 210 can help the user insert the high-capacity computer module 200 into the computer system housing 116 (in the Figure 1 ). Likewise, the tab 118 may be mounted in a slot (not shown) in the computer system housing 116. Additionally, the presence of the card edges 230 and 240 may limit the locations in the computer system housing 116 where the computer module 200 may be inserted. Thus, one or more of the tabs 118 may be made different sizes (e.g., made larger) to mate with corresponding features of the computer system housing 116. For example, one or more of the tabs 118 may be made larger so that they fit into larger slots in the computer system housing 116, where the larger slots are appropriately positioned. This may prevent the computer module 200 from being inserted into an incompatible location in the computer system housing 116. The tab 1210 may be inserted into the slot 2830 (in Fig.28 ) to align and stabilize the high-capacity computer module 200 during insertion. Once inserted, the card edges 230 and 240 of the board 220 can be positioned as shown in FIG. Figure 7 During ejection, the end 1244 can be pulled away from the housing 210, such as Fig.15This action can be translated to the link 1710, which can move so that the wheels 1720 and 1722 push the main logic board 700 or the portion of the sockets 530 and 540, thereby pushing the card edges 230 and 240 of the high-capacity computer module 200 out of their corresponding sockets 530 and 540. The wheels 1720 and 1722 can be actual wheels, or they can be other low-friction surfaces or sliding members (sliders) that can provide low friction when the high-capacity computer module 200 is ejected. The link 1710 can be grounded through the grounding spring 1730.

[0096] Fig.18 1 shows a cross-sectional top view of an ejection mechanism for a high-capacity computer module according to an embodiment of the present invention. The lever 1240 may be located at the opening 212 (at the Fig.13 1820). Rod 1240 may rotate about axis 1620. Rod 1240 may be connected to link 1810 at point 1249 and link 1810 may be connected to coupling 1820 at point 1812. As shown, clockwise rotation of rod 1240 may pull link 1810 downward, thereby rotating coupling 1820 counterclockwise about axis 1822. Counterclockwise rotation of coupling 1820 may drive wheel 1722 out of housing 210, where it may encounter a portion of main logic board 500 or socket 530 (at Figure 7 1820 can be connected to the connecting rod 1710 at point 1824. The connecting rod 1710 can also be connected to the connecting rod 1730 at point 1832. Counterclockwise rotation of the connecting rod 1720 can push the connecting rod 1710 to the right. This can cause the connecting rod 1830 to rotate about the axis 1834. The counterclockwise rotation of the connecting rod 1830 can drive the wheel 1720 out of the housing 210, where the wheel can encounter a portion of the main logic board 500 or the socket 540 (at Figure 7 (shown in FIG. 10 ) (if present). The action of wheels 1720 and 1722 encountering a portion of the main logic board 500 or the socket 530 or 540 may cause the card edges 230 and 240 of the board 220 (in FIG. 10 ) to move toward the card edge 230 and 240 of the board 220. Figure 4 ) is pushed out from the sockets 530 and 540, thereby ejecting the high-capacity computer module 200.

[0097] After ejection, the user can release the end 1244 of the rod 1240. The spring 1610 (at Fig.16 ) can drive the rod 1240 in a counterclockwise direction to reach Fig.13This can act on the link 1810 to rotate the engagement member 1820 in a clockwise direction, thereby retracting the wheel 1722 into the housing 210. This clockwise movement can pull the engagement member 1830, also rotating it in a clockwise direction, thereby retracting the wheel 1720 into the housing 210. The board 220 can support various circuits 290.

[0098] Similarly, the user can rotate the lever 1240 in a clockwise direction to remove the socket 530 or 540 (all in Figure 7 ) removes the high capacity computer module 200. As shown, this can pull the connecting rod 1810 downward, thereby rotating the engaging member 1820 counterclockwise. This action can provide compression on the connecting rod 1710, thereby pushing the connecting rod 1710 to the right. These actions can move the wheels 1722 and 1720 out of the housing 210, where the wheels 1722 and 1720 can engage the main logic board 500 directly or through the sockets 530 or 540. However, in some cases, the card edges 230 and 240 (at Figure 4 ) may require a high level of force to pop out of the socket 530 or 540. Unfortunately, providing this force with wheels 1722 and 1720 may be enough to damage one or more of the logic board 500 or the socket 530 or 540.

[0099] To prevent such damage, link 1810 may be formed of plastic or other material that may function as a mechanical fuse. That is, link 1810 may be designed so that it breaks and disables movement of wheels 1722 and 1720 before damage may occur to logic board 500 or socket 530 or 540. It should be noted that high-capacity computer module 200 may still be removed from socket 530 or 540 on board 500, and the electrical functionality of high-capacity computer module 200 may not be impaired by the breaking of link 1810.

[0100] Fig.19 18 is an exploded view of an ejection mechanism according to an embodiment of the present invention. Rod 1240 may be supported by bracket 1680. Bracket 1680 may also support magnet 1630. Rod 1240 may rotate about axis 1620 and be held in place by fastener 1621. Rod 1240 may be attached to link 1810 at point 1249 and link 1810 may be attached to joint 1820 at point 1812. Joint 1820 may be held in place at axis 1822 by fasteners 1823 and 1825, which may extend through housing 210 (at Fig.121820 may also be attached to wheel 1722. Joint 1820 may be attached to link 1710 at point 1824. Link 1710 may also be attached to joint 1830 at point 1832. Joint 1830 may be attached to wheel 1720 and may be held in place at axis 1834 by fasteners 1833 and 1835.

[0101] This ejection mechanism and other ejection mechanisms in these and other embodiments herein and of the present invention may have a low profile. This low profile allows air to flow through the high capacity computer module 200 (in Fig.12 ), thereby improving device performance.

[0102] Fig. 20 1 shows an ejection mechanism for a high-capacity computer module according to an embodiment of the present invention. The high-capacity computer module 200 may include an ejection mechanism that can be moved about an axis 1620 (in Fig.18 ) rotating rod 1240 (in Fig.18 ). The rod 1240 may be located at point 1249 (at Fig.18 1810 and the connecting rod 1810 can be connected to the joint 1820 at point 1812. As shown, the counterclockwise rotation of the rod 1240 can pull the connecting rod 1810 upward, thereby rotating the joint 1820 clockwise about the axis 1822. The clockwise rotation of the joint 1820 can drive the wheel 1722 out of the housing 210, where the wheel can encounter a portion of the main logic board 500 or the socket 530 (at Figure 7 1820 can be connected to the connecting rod 1710 at point 1824. The connecting rod 1710 can also be connected to the connecting rod 1730 at point 1832. Clockwise rotation of the connecting rod 1720 can pull the connecting rod 1710 to the left, as shown. This can cause the connecting rod 1830 to rotate about the axis 1834. The clockwise rotation of the connecting rod 1830 can drive the wheel 1720 out of the housing 210, where the wheel can encounter a portion of the main logic board 500 or the socket 540 (at Figure 7 (shown in FIG. 10 ) (if present). The action of wheels 1720 and 1722 encountering a portion of the main logic board 500 or the socket 530 or 540 may cause the card edges 230 and 240 of the board 220 (in FIG. 10 ) to move toward the card edge 230 and 240 of the board 220. Figure 4 ) is pushed out from the sockets 530 and 540, thereby ejecting the high-capacity computer module 200.

[0103] After ejection, the user can release the end 1244 of the rod 1240 (at Fig.18 Spring 1610 (shown in Fig.16 ) can drive the rod 1240 in a clockwise direction to reach Fig.13This can act on the link 1810 to rotate the engagement member 1820 in a counterclockwise direction, thereby retracting the wheel 1722 into the housing 210. This clockwise movement can pull the engagement member 1830, causing it to rotate in a counterclockwise direction, thereby retracting the wheel 1720 into the housing 210. The board 220 can support various circuits 290.

[0104] Fig. 20 The ejection mechanism can provide various advantages. For example, during ejection, the connecting rod 1710 is under tension rather than compression, such as Fig.18 Again, this allows the connecting rod 1710 to be formed of plastic rather than metal, such as Fig.18 This can reduce the number of contacts 232 and 242 on the board 220 (such as Figure 4 ) and reduce or eliminate signal coupling between Fig.17 The ground spring 1730 shown is required.

[0105] Fig.21 is used for Fig. 20 Another view of the ejection mechanism of the high-capacity computer module of FIG. The rod 1240 can be located in the opening 212 (at the Fig.13 1240). The lever 1240 may rotate about the axis 1620. Specifically, the lever 1240 may be in a stable closed position 1240A. It may then be moved to a stable open position 1240B. The high capacity computer module may then be ejected by moving the lever 1240 to position 1240C. The lever 1240 may have a soft or pliable material 1241 on the rear surface to enable it to be gripped by a user and reduce noise or act as an acoustic damper when the lever 1240 is in the closed position 1240A.

[0106] Lever 1240 may be connected to link 1810 at point 1249 and link 1810 may be connected to engagement member 1820 at point 1812. As shown, clockwise rotation of lever 1240 may pull link 1810 upward, thereby rotating engagement member 1820 counterclockwise about axis 1822. Counterclockwise rotation of engagement member 1820 may pull wheel 1722 out of housing 210, where it may encounter a portion of main logic board 500 or socket 530 (at Figure 7 1820 can be connected to the connecting rod 1710 at point 1824. The connecting rod 1710 can also be connected to the connecting rod 1730 at point 1832. Counterclockwise rotation of the connecting rod 1720 can pull the connecting rod 1710 to the right. This can cause the connecting rod 1830 to rotate about the axis 1834. The counterclockwise rotation of the connecting rod 1830 can drive the wheel 1720 out of the housing 210, where the wheel can encounter a portion of the main logic board 500 or the socket 540 (at Figure 7 (shown in FIG. 10 ) (if present). The action of wheels 1720 and 1722 encountering a portion of the main logic board 500 or the socket 530 or 540 may cause the card edges 230 and 240 of the board 220 (in FIG. 10 ) to move toward the card edge 230 and 240 of the board 220. Figure 4 ) is pushed out from the sockets 530 and 540, thereby ejecting the high-capacity computer module 200.

[0107] After ejection, the user can release the end 1244 of the rod 1240. The spring 1610 (at Fig.16 ) can drive the rod 1240 in a counterclockwise direction to reach Fig.13 This can act on the link 1810 to rotate the engagement member 1820 in a clockwise direction, thereby retracting the wheel 1722 into the housing 210. This clockwise movement can pull the engagement member 1830, also rotating it in a clockwise direction, thereby retracting the wheel 1720 into the housing 210. The board 220 can support various circuits 290.

[0108] Similarly, the user can rotate the lever 1240 in a clockwise direction to remove the socket 530 or 540 (all in Figure 7 ) removes the high capacity computer module 200 as shown. This can pull the link 1810 upward, as shown, causing the engagement member 1820 to rotate counterclockwise. This action can provide tension on the link 1710, thereby pulling the link 1710 to the right. These actions can move the wheels 1722 and 1720 out of the housing 210, where the wheels 1722 and 1720 engage the main logic board 500 directly or through the sockets 530 or 540. However, in some cases, the card edges 230 and 240 (at Figure 4 ) may require a high level of force to pop out of the socket 530 or 540. Unfortunately, providing this force with wheels 1722 and 1720 may be enough to damage one or more of the logic board 500 or the socket 530 or 540.

[0109] To prevent such damage, link 1810 may be formed of plastic or other material that may function as a mechanical fuse. That is, link 1810 may be designed so that it breaks and disables movement of wheels 1722 and 1720 before damage may occur to logic board 500 or socket 530 or 540. It should be noted that high-capacity computer module 200 may still be removed from socket 530 or 540 on board 500, and the electrical functionality of high-capacity computer module 200 may not be impaired by the breaking of link 1810.

[0110] In these and other embodiments of the present invention, it may be desirable to have a high capacity computer module 200 (in Fig.12 ) of the plate 220 (shown in Figure 4The card edges 230 and 240 shown in FIG. 1 are held in a secure manner in the sockets 530 and 540 (in FIG. Figure 7 Thus, embodiments of the present invention may provide a latching mechanism that drives the card edges 230 and 240 of the board 220 into the sockets 530 and 540. An example is shown in the following figure.

[0111] Fig. 22 A latch mechanism for securing a high-capacity computer module in place is shown in accordance with an embodiment of the present invention. In this example, the plate 220 may include a tab 226. The tab 226 may be defined by a slotted channel 224. The latch mechanism 2010 may include a tab 2012 that may engage the tab 226. The latch mechanism 2010 may rotate about an axis 2014. When the latch mechanism 2010 is rotated in a counterclockwise manner, the tab 2012 may engage the tab 226, thereby pushing the plate 220 into the sockets 530 and 540 (in Figure 7 This can provide a seating force that pushes the card edges 230 and 240 into the receptacles 530 and 540. When the latch mechanism 2010 is rotated in a clockwise manner, the tabs 2012 can align with the vertical portion of the slotted channel 224 to allow the board 220 to be removed from the receptacles 530 and 540.

[0112] Fig.23 Shows Fig. 22 2010. The latch mechanism 2010 may include a tab 2012 that may be located in a slotted channel 224 in the plate 220. The slotted channel 224 may define a tab 226 that may support the tab 2012 when the latch mechanism 2010 is in the latched position. Similarly, the latch mechanism 2010 may rotate around an axis 2014. The latch mechanism 2010 may rotate counterclockwise through an angle 2100 that exceeds the vertical direction, as shown. Rotating beyond the angle 2100 may help ensure that the latch mechanism 2010 remains in the latched position during device operation. In these and other embodiments of the present invention, the critical angle may be at least about 7.85 degrees, 8.35 degrees, 10 degrees, 11.5 degrees, 13 degrees, or other angles. The axis 2014 may be formed with the plate 2120 , or formed separately from the plate 2120 and then attached to the plate 2120 , which may be held in place by one or more fasteners 2110 .

[0113] When the latch mechanism 2010 is in the most extreme clockwise position, the plate 220 can be inserted. In this position, the tab 2012 can pass through the vertical portion of the slotted channel 224. To secure the plate 220 in place, the latch mechanism 2010 can be driven counterclockwise so that the tab 2012 engages the tab 226. The latch mechanism 2010 can be held in place by a spring force provided by a spring or other mechanism (not shown). Figures 12 to 19 The ejection mechanism shown in FIG. 20 can be used to rotate the latch mechanism 2010 in a clockwise direction to remove the plate 220 .

[0114] Fig.24 A latching mechanism for securing a high-capacity computer module in place is shown in accordance with an embodiment of the present invention. In this example, a hockey stick hook 2400 can be fitted into opening 227 of plate 220 to secure plate 220 in place in sockets 530 and 540. Hook 2400 can be moved upward out of opening 227 to release plate 220, and moved downward to lock plate 220 in place.

[0115] It also shows Fig. 20 and Fig.21 The rod 1710 of the ejection mechanism. The rod 1240 can be actuated to move the rod 1810 and the rod 1710 so as to push the wheels 1720 and 1722 toward the main logic board 500 to eject the plate 220 or lift the wheels 1720 and 1722 away from the main logic board 500 to allow the plate 220 to be placed in the sockets 530 and 540.

[0116] The high capacity computer module that receives board 220 may place mechanical stress on sockets 530 and 540. Therefore, either or both of these sockets may be reinforced in various ways. For example, socket 540 may include a reinforcement structure, such as pin 547. Pin 547 may provide reinforcement for a portion of socket 540. This portion may be somewhat larger and may be accommodated by the size of notch 229 on board 220.

[0117] Fig.25 A latch mechanism for securing a computer module in place is shown in accordance with an embodiment of the present invention. In this example, a conventional PCIe computer module (shown here as computer module 720) can be inserted into socket 536. Hook 2401, which may be substantially similar to hook 2400 described above, can retain tab 2226, thereby securing computer module 720 in socket 536. Thus, hooks 2400 and 2401 can be used to secure conventional or high-capacity computer modules in place in their corresponding sockets. Hooks 2400 and 2401 can be moved by sliding button 2590 left or right. In Fig.26 and Fig. 27 An example of a mechanism of the movable hook 2400 is shown in FIG.

[0118] Hooks 2400 or 2401 may be used to hold computer module 720 in place. These and other embodiments of the present invention may provide additional support structures for high-capacity computer modules 200. For example, tabs 118 of housing wall 112 may be mounted to computer system housing 116 (at Figure 1The insert 1210 of the housing 210 can be assembled in the computer system housing 116 (shown in Figure 1 ) in the slot 2830 (shown in Fig.28 ) to help mechanically support the high-capacity computer module 200. Clamping screws 2822 (in Fig.28 2830) can be assembled through the opening 1211 in the insert 1210 to fix the insert 1210 in the appropriate position in the narrow slot 2830. The insert 1250 of the housing 210 can be assembled into the narrow slot 2840 (in the computer system housing 116) Fig.28 In addition, the extended surface 2510 of the housing wall 112 may include a hole 2512, such as a thumb screw 2812 (shown in Fig.28 A fastener such as that shown in FIG. 1A may be screwed into the hole. The groove 119 in the housing wall 112 may provide additional support to allow the crossbar 2804 (in the housing wall 112) to be inserted into the computer system housing 116 during insertion of the high-capacity computer module 200. Fig.28 ) fits into the groove. In this example, the heat sink cover 2860 (shown in Fig.28 200) has been removed, exposing various circuits 290 on board 220. Board 220 can be placed on top of back cover 213. Back cover 213 can wrap around the front side of computer module 200, as shown, to form a portion of housing 210.

[0119] Fig.26 A latch mechanism for securing a computer module in place in a computing device housing according to an embodiment of the present invention is shown. The latch mechanism can secure a computer module, such as a high-capacity computer module 200 (in Figure 2 ) and conventional PCIe and other computer modules 720. A user (not shown) can removably hook 2400 (in Fig.24 ) and 2401 to release or secure these computer modules. When the user moves button 2632 in the left-right, lateral or horizontal direction as shown in the figure, hook guide 2610 can move up and down or vertically as shown in the figure, thereby moving hooks 2400 and 2401 to the appropriate position to secure or release computer module 720. For example, by using bracket 2720 and bracket 2721 (in Fig. 27 26) to attach the cover 2620 to the board 500. The button 2632 can extend from the sliding plate 2630, which can be captured between the cover 2620 and the board 500. The cover 2620 can include an opening 2622 for the button 2632 and a housing 2623 for the connector 2624.

[0120] Guide pin 2640 may be located in slot 2636 to guide sliding plate 2630 and button 2632 in the left-right direction. Hook guide pin 2612 may be captured in ramp slot 2634 in sliding plate 2630. When a user moves button 2632 and sliding plate 2630 laterally or horizontally, hook guide pin 2612 may move vertically in ramp slot 2634, thereby vertically moving hook guide 2610 and hooks 2400 and 2401. For example, moving button 2632 to the left as shown may move ramp slot 2634 relative to hook guide pin 2612, causing hook guide 2610 and hook 2401 to be lowered. This may engage hook 2401 with tab 2226 on computer module 720, thereby securing computer module 720 in place in receptacle 536. The ramp slot 2834 may have a detent 2613 corresponding to the engaged position for further safety.

[0121] Fig. 27 A latch mechanism for securing a computer module in place in a computing device housing according to an embodiment of the present invention is shown. Cover 2620 may be attached to board 500, for example, by using brackets 2720 and brackets 2721. Button 2632 may extend from or otherwise be attached to a sliding plate 2630 that may be captured between cover 2620 and board 500. Cover 2620 may include an opening 2622 for button 3632 and a connector housing 2623. Guide pin 2640 may be located in slot 2636 to guide sliding plate 2630 and button 2632 in a left-right direction. Hook guide pin 2612 may be captured in a ramp slot 2634 in sliding plate 2630. Hooks 2400 and 2401 may extend from hook guide 2610. To facilitate vertical movement of the hook rail 2610, a low friction layer 2710 may be placed on the hook rail 2610 between the hook rail 2610 and the sliding plate 2630. The low friction layer may also cover the hook rail pin 2612. A similar layer may be used between the hook rail 2610 and the plate 500.

[0122] In various embodiments of the present invention, plastic parts that contact each other can cause noise. One such site can be the interface between carriage 2721 and sliding plate 2630. That is, when sliding plate 2630 moves back and forth, the edge of opening 2631 in sliding plate 2630 may encounter carriage 2721, and this may cause noise. In order to reduce this noise, the surface of carriage 2721 can be roughened, for example, by sandblasting, sanding, etching or by using another technology. This wear can reduce the noise that may originally be generated between carriage 2721 and sliding plate 2630. The worn surface can also absorb small plastic chips that may originally mess up the interior of the computer housing supporting the latch mechanism. In these and other embodiments of the present invention, low friction layer 2710 can be used to reduce noise at this position and similar positions.

[0123] Fig.28 200 and a portion of a computer system according to an embodiment of the present invention. Similarly, these and other embodiments of the present invention can provide additional support structures for the high-capacity computer module 200. For example, the insert 1210 (in Fig.25 1250 (shown in FIG. 126 ) can be inserted into the slot 2830 of the computer system housing 116. The clamping screw 2822 can be screwed or otherwise assembled through the plate 2820, the slot 2830, and the opening 1211 in the insert 1210. Fig.25 2840. A fastener such as a thumb screw 2812 may be screwed through the plate 2810 or otherwise assembled into the hole 2512 (in the extended surface 2500 of the housing wall 112) Fig.25 28). The front grille 2800 may include a crossbar 2804. The crossbar 2804 may fit into the recess 119 of the housing wall 112 for additional support and stability. The heat sink cover 2860 is shown in place. The heat sink cover 2860 may include Fig.12 The heat sink 1230 shown in FIG. The heat sink 1230 may be welded or otherwise thermally connected to the board 220 (in Fig.25 ) on various circuits 290 (shown in Fig.25 ).

[0124] Fig.29 2 and 3. A portion of a high-capacity computer module and a portion of a computer system according to an embodiment of the present invention are shown. The rear portion of the computer system housing 116 may include a slot 2840 and a rear surface 2910. The tabs 1250 of the high-capacity computer module 200 may fit into the slots 2840. The crossbars 2804 of the front grille 2800 may fit into the grooves 119 of the housing wall 112. The front grille 2800 may include a plurality of slots 2840 and a plurality of rear surfaces 2910. Fig.31The fastener opening 2801 is shown.

[0125] These and other embodiments of the present invention may provide a robust, high-capacity computer module 200 with excellent thermal management. For example, the high-capacity computer module 200 may include a device housing 210 for mechanical support and strength. The heat sink 2850 may transfer heat from the various circuits 290 (in Fig.18 1 and 2) are dissipated to device housing 210. Housing wall 112 can provide good ventilation for high-capacity computer module 200 by allowing airflow to pass through with only minimal obstruction.

[0126] For example, the computer module 200 may include a board 220 housed in a housing 210 (in Fig.25 ). The housing 210 may include a rear cover 213 (shown in Fig.25 213 may surround the sides of the computer module and extend partially over the top of the computer module. The housing 210 may also include a heat sink 2850 that may be placed on or form the inner surface of the top surface 211 of the device housing 210. The group or stack of heat sinks 1230 (in Fig.17 200) and a housing wall 112 having a plurality of holes or perforations 113 may form the sides of the computer module. The heat sink 1230 may have openings between them. The openings between the heat sink 1230 and the perforations 113 in the housing wall 112 may form a conduit for airflow through the computer module 200. The heat sink 1230, the heat sink 2850, and the top surface 211 of the housing 210 may form a structural support for the computer module 200. The heat sink 1230, the heat sink 2850, and the top surface 211 of the housing 210 may form a heat sink cover 2860, as shown in FIG. Fig.28 As shown. Heat sink 1230, heat sink 2850, back cover 213 and top surface 211 of housing 210 may interlock to provide a physically secure structure and improved heat dissipation for computer module 200. Other components such as fasteners 1823 (in Fig.19 ) can provide further structural support.

[0127] Fig.30 28 is an exploded view of the front clamping portion of the computer system housing according to an embodiment of the present invention. Plate 2810 may be coupled to front grille 2800 (at Fig.28 ), to facilitate the high-capacity computer module 200 (in Fig.28 During insertion of computer module 200, extended surface 2510 of housing wall 112 (shown in Fig.252510 and the front grille 2800. The plate 2810 may be placed against the extension surface 2510. The plate 2810, the extension surface 2510 and the front grille 2800 may be secured with fasteners 2814 which may be secured with thumb screws 2812 through openings 2811 in the plate 2810, holes 2512 in the extension surface 2510 and openings 2801 in the front grille 2800 (in Fig.29 28). These fasteners may be held in place with washers 2816. Pads 3010 may be placed between plate 2810 and extension surface 2510, between extension surface 2510 and front grille 2800, or both or other locations to reduce mechanical vibrations.

[0128] Fig.31 28 is an exploded view of the rear clamping portion of the computer system housing according to an embodiment of the present invention. The plate 2820 can be coupled to the computing system housing 116 (at Fig.28 ) to facilitate the placement of high-capacity computer modules 200 (in Fig.28 During insertion of computer module 200, device housing 210 (shown in Fig.25 The insert 1210 shown in FIG. 1200 may abut against the computing system housing 116 (shown in FIG. Fig.29 The rear surface 2910 (shown in Fig.29 The plate 2820 may be aligned with the rear surface 2910 so that the tab 1210 is located between the rear surface 2910 and the plate 2820. In this way, the plate 2820 and the rear surface 2910 may form a slot 2830 (in Fig.28 28). The clamping screw 2822 can be passed through the opening 2821 in the plate 2820, the insert 1210 (in Fig.25 ) in the opening 1211 (in Fig.25 2822 and the fastener 3110.

[0129] In these and other embodiments of the present invention, these modules can be contained in a housing that can be formed in various ways. For example, they can be formed by machining, such as by using a computer numerical control machine, stamping, forging, metal injection molding, micromachining, 3D printing or other manufacturing processes. These housings can be formed by various materials. For example, they can be formed by aluminum, steel, stainless steel, copper, bronze or other materials. In these and other embodiments of the present invention, materials that can provide good electrical shielding and thermal conductivity can be selected.

[0130] Embodiments of the present invention may provide high capacity modules that may be located in various types of devices, such as portable computing devices, tablet computers, desktop computers, laptop computers, all-in-one computers, wearable computing devices, smart phones, storage devices, portable media players, navigation systems, monitors, power supplies, video delivery systems, adapters, remote control devices, chargers, and other devices.

[0131] For the purpose of illustration and description, the above description of the embodiment of the present invention is presented. It is not intended to be exhaustive, nor is it intended to limit the present invention to the precise form, and many modifications and variations are possible according to the above teachings. This embodiment is selected and described to fully illustrate the principle of the present invention and its practical application, so that other technical personnel in the field can make full use of the present invention in various embodiments and in the case of various modifications suitable for the specific purpose envisioned. Therefore, it should be understood that the present invention is intended to cover all modifications and equivalents within the scope of the following claims.

Claims

1. A computer, comprising: A computer system, the computer system comprising: Main logic board; A first socket located on the main logic board; and A second socket located on the main logic board; and A first computer module, the first computer module comprising: A first plate, the first plate comprising: a first card edge extending from a first side of the first board and positioned in the first socket, wherein the first card edge has a first shape and a first plurality of contacts having a first pinout, and wherein the location of the first card edge on the first side and the first shape of the first card edge and the first pinout comply with the Peripheral Component Interconnect (PCI) standard; a second card edge extending from the first side and positioned in the second socket and having a second shape and a second plurality of contacts having a second pinout, wherein the second shape and the second pinout are not PCI compliant; and Multiple circuits. 2 . The computer of claim 1 , wherein the first card edge complies with the Peripheral Component Interconnect Express (PCIe) standard.

3. The computer of claim 1, wherein the first card edge complies with the Peripheral Component Interconnect (PCI-X) standard.

4. The computer according to claim 1, wherein the computer system further comprises: a third socket located on the main logic board; as well as A plurality of multiplexers are coupled between the contacts of the third socket and the contacts of the second socket.

5. The computer of claim 4, wherein the multiplexer comprises an analog multiplexer.

6. The computer of claim 1, wherein some of the second plurality of contacts on the second card edge are configured to carry DisplayPort data signals.

7. The computer of claim 1, wherein the first computer module further comprises a heat sink.

8. The computer of claim 1, wherein the plurality of circuits comprises a plurality of hard disk drives.

9. The computer of claim 1, wherein the plurality of circuits comprises a plurality of solid state drives.

10. The computer of claim 1, wherein the first computer module further comprises: case; as well as An ejection mechanism for ejecting the first card edge from the first socket and ejecting the second card edge from the second socket, the ejection mechanism comprising: a first sliding member; as well as A lever located in an opening in the housing, the lever being arranged to rotate about a first axis and attached to the first sliding member, wherein when the first card edge is inserted into the first receptacle and the second card edge is inserted into the second receptacle and the lever is rotated in a first direction about the first axis, the first sliding member extends from the housing and provides a force to eject the first card edge from the first receptacle and the second card edge from the second receptacle.

11. The computer of claim 10, further comprising a first magnet attached to the housing, wherein the lever comprises a second magnet, a third magnet, and a fourth magnet, and wherein when the lever rotates in the first direction, the second magnet, the third magnet, and the fourth magnet are sequentially aligned with the first magnet.

12. The computer of claim 11, wherein when the first magnet and the second magnet are aligned they attract each other, when the first magnet and the third magnet are aligned they repel each other, and when the first magnet and the fourth magnet are aligned they attract each other.

13. The computer of claim 12, wherein the lever is flush with the housing of the first computer module when the first magnet and the second magnet are aligned.

14. The computer of claim 13, wherein an end of the rod is spaced apart from the housing of the first computer module when the first magnet and the fourth magnet are aligned.

15. The computer according to claim 10, further comprising a second sliding member, wherein when the lever rotates about the first axis in the first direction, the second sliding member extends from the housing and provides a force to eject the first card edge from the first socket and eject the second card edge from the second socket, and Wherein the first sliding member and the second sliding member comprise wheels.

16. The computer according to claim 1, wherein the computer system further comprises: a third socket located on the main logic board, the third socket being arranged in parallel with the first socket; System controller; as well as a first fan coupled to the system controller; as well as The first computer module further comprises: A housing is provided in which the first board is housed, wherein the first computer module communicates a first parameter to the system controller using the first socket, and the system controller sets a speed of the first fan in response at least in part to the first parameter.

17. The computer of claim 16, wherein the first parameter is one of a temperature of the first computer module or a power consumption of the first computer module.

18. The computer according to claim 16, further comprising: A latch mechanism on the main logic board, the latch mechanism comprising: a hook guide comprising a plurality of hooks and movable by a user between a first position and a second position, Wherein when the hook guide is in the first position, a hook among the plurality of hooks fixes the first board of the first computer module in appropriate positions in the first socket and the second socket, and wherein when the hook guide is in the second position, the hook among the plurality of hooks releases the first board of the first computer module, so that the first computer module is removable.

19. The computer of claim 16 , wherein the computer system further comprises a second fan, and wherein when the third socket is occupied by a second computer module, a speed of the second fan is at least partially determined by the first parameter provided by the first computer module to the system controller and a second parameter provided by the second computer module to the system controller, and wherein when the third socket is not occupied, a speed of the second fan is at least partially determined by the first parameter provided by the first computer module to the system controller and the absence of a computer module in the third socket.

20. The computer of claim 16, wherein the first computer module includes a plurality of cooling fins at a first end, the first end being at least generally aligned with the first fan, wherein the plurality of cooling fins direct airflow provided by the first fan through the first computer module.

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