A method and device for evaluating the effectiveness of solder joints

Abstract

The present invention relates to a method and device for evaluating the effectiveness of a weld, the method comprising: testing and obtaining a weld safety margin; obtaining the weld performance corresponding to the three-dimensional finite element model of the weld area based on a two-dimensional finite element model of the weld area and the corresponding weld performance; and determining the effectiveness of the weld corresponding to the three-dimensional finite element model of the weld area based on the weld performance corresponding to the three-dimensional finite element model and the weld safety margin. The technical solution provided by the present invention maps the two-dimensional model of the weld and the weld performance corresponding to the two-dimensional model from two dimensions to three dimensions. Based on the weld performance corresponding to the two-dimensional finite element model, the weld performance corresponding to the three-dimensional finite element model can be correspondingly obtained. The weld performance is then compared with the safety margin corresponding to each weld performance obtained to determine the effectiveness of the weld, thereby greatly reducing the amount of calculation for the weld and allowing for faster and more accurate determination of the weld effectiveness.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of mechanical processing, and in particular to a method and device for evaluating the effectiveness of a solder joint. Background Art

[0002] Testing certain characteristics of solder joints requires building a 3D model of the solder joint. However, the 3D mathematical and physical models of solder joints are extremely complex, making the calculation of solder joint characteristics very complex and time-consuming. Furthermore, when inspecting component quality, the effectiveness of the solder joint cannot be accurately determined, affecting component usability. Summary of the Invention

[0003] In order to solve the above technical problems or at least partially solve the above technical problems, an embodiment of the present invention provides a method and device for evaluating the effectiveness of a solder joint.

[0004] This application provides a solder joint effectiveness evaluation method, including:

[0005] Test to obtain solder joint safety margin;

[0006] Obtaining solder joint performance corresponding to the three-dimensional finite element model of the solder joint area according to the two-dimensional finite element model of the solder joint area and the corresponding solder joint performance;

[0007] The validity of the solder joint corresponding to the three-dimensional finite element model of the solder joint area is determined according to the solder joint performance corresponding to the three-dimensional finite element model and the solder joint safety margin.

[0008] Furthermore, obtaining the solder joint performance corresponding to the three-dimensional finite element model of the solder joint area based on the two-dimensional finite element model of the solder joint area and the corresponding solder joint performance includes:

[0009] Obtain a two-dimensional finite element model of the solder joint area and the corresponding solder joint performance;

[0010] Constructing a three-dimensional finite element model of the solder joint area based on the two-dimensional finite element model of the solder joint area;

[0011] The solder joint performance corresponding to the two-dimensional finite element model is mapped to the three-dimensional finite element model to obtain the solder joint performance corresponding to the three-dimensional finite element model of the solder joint area.

[0012] Furthermore, the obtaining of the two-dimensional finite element model of the solder joint area and the corresponding solder joint performance includes:

[0013] Construct a finite element model of the joint between two parts;

[0014] The finite element model of the connection between the two parts is subjected to two-dimensional welding and heat treatment to obtain a two-dimensional finite element model of the welding point area and corresponding welding point performance.

[0015] Furthermore, constructing a three-dimensional finite element model of the solder joint area based on the two-dimensional finite element model of the solder joint area includes:

[0016] The two-dimensional finite element model of the solder joint area is rotated about the central axis of the solder joint area to obtain a three-dimensional finite element model of the solder joint area.

[0017] Furthermore, mapping the solder joint performance corresponding to the two-dimensional finite element model to the three-dimensional finite element model to obtain the solder joint performance corresponding to the three-dimensional finite element model of the solder joint area includes:

[0018] For each two-dimensional node in the two-dimensional finite element model of the solder joint area, multiple three-dimensional nodes corresponding to the two-dimensional node in the three-dimensional finite element model of the solder joint area are determined, and the solder joint performance corresponding to the two-dimensional node is determined as the solder joint performance corresponding to the multiple three-dimensional nodes.

[0019] Furthermore, the two-dimensional finite element model of the solder joint area is rotated about the central axis of the solder joint area to obtain a three-dimensional finite element model of the solder joint area, including:

[0020] Rotating the two-dimensional finite element model of the solder joint area about the central axis of the solder joint area to obtain an alternative model of the solder joint area;

[0021] Meshing the candidate model according to a preset three-dimensional mesh division unit to obtain a three-dimensional finite element model of the solder joint area;

[0022] The preset three-dimensional grid division unit is smaller than the two-dimensional grid division unit in the two-dimensional finite element model.

[0023] Furthermore, the three-dimensional nodes in the three-dimensional finite element model include: three-dimensional nodes corresponding to the two-dimensional nodes in the two-dimensional finite element model, and three-dimensional nodes that have no corresponding relationship with the two-dimensional nodes;

[0024] Mapping the solder joint performance corresponding to the two-dimensional finite element model to the three-dimensional finite element model to obtain the solder joint performance corresponding to the three-dimensional finite element model of the solder joint area includes:

[0025] For each two-dimensional node in the two-dimensional finite element model of the solder joint area, determine a plurality of three-dimensional nodes corresponding to the two-dimensional node in the three-dimensional finite element model of the solder joint area, and determine the solder joint performance corresponding to the two-dimensional node as the solder joint performance corresponding to the plurality of three-dimensional nodes;

[0026] The weld performance of three-dimensional nodes corresponding to the two-dimensional nodes in the two-dimensional finite element model of the weld area is interpolated to obtain the weld performance of three-dimensional nodes in the three-dimensional finite element model that have no corresponding relationship with the two-dimensional nodes.

[0027] Further, determining the validity of the solder joint corresponding to the three-dimensional finite element model of the solder joint area according to the solder joint performance corresponding to the three-dimensional finite element model and the safety margin corresponding to the solder joint performance includes:

[0028] If the solder joint performance corresponding to the three-dimensional finite element model is greater than the safety margin corresponding to the solder joint performance, determining that the solder joint has failed;

[0029] If the solder joint performance corresponding to the three-dimensional finite element model is less than or equal to the safety margin corresponding to the solder joint performance, the solder joint is determined to be valid.

[0030] Furthermore, the weld safety margin includes at least one of the following: a tensile safety margin, a shear safety margin, and a tensile-shear safety margin.

[0031] The present application also provides a solder joint effectiveness evaluation device, comprising:

[0032] Safety margin acquisition module, used to test and obtain the safety margin of solder joints;

[0033] A solder joint performance acquisition module, configured to obtain the solder joint performance corresponding to the three-dimensional finite element model of the solder joint area based on the two-dimensional finite element model of the solder joint area and the corresponding solder joint performance;

[0034] The determination module is used to determine the validity of the solder joint corresponding to the three-dimensional finite element model of the solder joint area according to the solder joint performance corresponding to the three-dimensional finite element model and the solder joint safety margin.

[0035] Compared with the closest prior art, the embodiment of the present invention first obtains the weld safety margin through testing, then obtains the weld performance corresponding to the three-dimensional finite element model of the weld area based on the two-dimensional finite element model of the weld area and the corresponding weld performance, and finally determines the validity of the weld corresponding to the three-dimensional finite element model of the weld area based on the weld performance corresponding to the three-dimensional finite element model and the weld safety margin. The technical solution provided by this application adopts a method of mapping the two-dimensional model of the weld and the weld performance corresponding to the two-dimensional model from two dimensions to three dimensions. Based on the weld performance corresponding to the two-dimensional finite element model, the weld performance corresponding to the three-dimensional finite element model can be correspondingly obtained. The weld performance is then compared with the safety margin corresponding to each weld performance obtained to determine the validity of the weld, which greatly reduces the amount of calculation for the weld and allows for faster and more accurate determination of the weld validity. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0037] Figure 1 is a flow chart showing a method for evaluating solder joint effectiveness according to an exemplary embodiment;

[0038] Figure 2 is a flow chart of a method for obtaining solder joint performance corresponding to a three-dimensional finite element model of a solder joint area according to an exemplary embodiment;

[0039] Figure 3 is a schematic diagram of a two-dimensional finite element model of a solder joint area according to an exemplary embodiment;

[0040] Figure 4 is a schematic diagram of a quarter symmetrical portion of a three-dimensional finite element model of a solder joint area according to an exemplary embodiment;

[0041] Figure 5 According to an exemplary embodiment Figure 3 Schematic diagram of a top view of a three-dimensional finite element model;

[0042] Figure 6 is a structural schematic diagram of a device for evaluating the effectiveness of a solder joint according to an exemplary embodiment;

[0043] 1-Welding point radius of the welding point area; 2-Center axis of the welding point area; 3-Boundary between the welding point area and the non-welding point area; 4-Upper plate to be welded; 5-Lower plate to be welded; 6-Center point of the welding point area; 7-Total thickness of the plate; 8-Plate area. DETAILED DESCRIPTION

[0044] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0045] Figure 1 FIG. 1 is a flow chart showing a method for evaluating solder joint effectiveness according to an exemplary embodiment. Figure 1As shown, the method is used to determine whether a solder joint on a component is effective. The solder joint effectiveness evaluation method may include the following steps:

[0046] S101: Test to obtain the solder joint safety margin.

[0047] S102: Obtaining solder joint performance corresponding to the three-dimensional finite element model of the solder joint area according to the two-dimensional finite element model of the solder joint area and the corresponding solder joint performance.

[0048] S103: Determine the validity of the solder joint corresponding to the three-dimensional finite element model of the solder joint area according to the solder joint performance corresponding to the three-dimensional finite element model and the solder joint safety margin.

[0049] The solder joint effectiveness evaluation method provided in this application first obtains the solder joint safety margin through testing, then obtains the solder joint performance corresponding to the three-dimensional finite element model based on the two-dimensional finite element model of the solder joint area and the corresponding solder joint performance, and finally determines the effectiveness of the solder joint corresponding to the three-dimensional finite element model of the solder joint area simply and conveniently based on the solder joint performance and the solder joint safety margin, thereby greatly reducing the calculation amount of the solder joint and determining the effectiveness of the solder joint faster and more accurately.

[0050] In step S101 , the solder joint safety margin is obtained by testing.

[0051] In the disclosed embodiments, shear tests, tensile tests, and shear-tensile tests on welds can be used to determine the safety margins of welds in a multi-dimensional weld zone. When the shear force, tensile force, and / or shear-tensile force of a weld in a weld zone exceed their corresponding safety margins, the weld may become detached, i.e., fail. The safety margin of a weld depends on the type of plate being welded and the type of welding torch.

[0052] In a possible implementation manner of the present disclosure, the weld safety margin includes at least one of the following: a tensile safety margin, a shear safety margin, and a tensile-shear safety margin.

[0053] In step S102, the solder joint performance corresponding to the three-dimensional finite element model of the solder joint area is obtained according to the two-dimensional finite element model of the solder joint area and the corresponding solder joint performance.

[0054] In a possible embodiment of the present disclosure, according to the two-dimensional finite element model of the solder joint area and the corresponding solder joint performance, the solder joint performance corresponding to the three-dimensional finite element model of the solder joint area is obtained, such as Figure 2 As shown, specifically including:

[0055] S1021, obtaining a two-dimensional finite element model of the solder joint area and corresponding solder joint performance.

[0056] S1022: Construct a three-dimensional finite element model of the solder joint area based on the two-dimensional finite element model of the solder joint area.

[0057] S1023 , mapping the solder joint performance corresponding to the two-dimensional finite element model to the three-dimensional finite element model to obtain the solder joint performance corresponding to the three-dimensional finite element model of the solder joint area.

[0058] In the disclosed embodiments, a finite element model of the joint of the plates to be welded is first constructed, and then two-dimensional welding and heat treatment are performed on the finite element model of the joint using finite element analysis software. The finite element model of the joint can be meshed using a preset meshing unit. In some embodiments of the present invention, a fine scale is used, and the meshing unit can be as fine as 0.05 mm (i.e., 50 μm).

[0059] In practical applications, after two-dimensional welding and heat treatment of the finite element model of the connection, the distribution of solder joint components can be calculated, and a two-dimensional finite element model of the solder joint area and the corresponding solder joint performance can be obtained. The solder joint performance includes at least one of the following: mechanical properties and thermal properties.

[0060] Among them, two-dimensional welding and heat treatment can adopt technical means commonly used by those skilled in the art, which will not be described in detail here.

[0061] like Figure 3 Figure 2 shows a schematic diagram of a two-dimensional finite element model of a solder joint area. 1 is the solder joint radius of the solder joint area. The solder joint radius 1 of the solder joint area is divided into multiple nodes i1, i2, ...im along the radial direction, where i represents the radial direction, m represents the number of nodes divided by the solder joint radius, and im represents the boundary point of the solder joint area along radial direction i. 2 is the central axis of the solder joint area. The central axis 2 of the solder joint area is divided into multiple solder joint centers k1, k2, ...kL along the axial direction k, where k represents the axial direction, L represents the number of nodes divided by the solder joint axis, and kL represents the boundary point of the solder joint area along the axial direction. 3 is the boundary between the solder joint area and the non-solder joint area.

[0062] In practical applications, the component distribution of solder joints generally includes martensite, pearlite, bainite and ferrite.

[0063] The component distribution of the solder joint in the solder joint area is affected by the two-dimensional welding and heat treatment process of the solder joint, and is related to the temperature, welding speed, cooling speed, etc. The component distribution will affect the mechanical strength and performance of the solder joint, among which martensite has the greatest impact and ferrite has the least impact.

[0064] It is understandable that the finite element analysis software may be Sysweld software or other finite element analysis software.

[0065] In a possible embodiment of the present disclosure, obtaining a two-dimensional finite element model of the solder joint area and corresponding solder joint performance specifically includes:

[0066] Construct a finite element model of the joint between two parts;

[0067] The finite element model of the connection between the two parts is subjected to two-dimensional welding and heat treatment to obtain a two-dimensional finite element model of the welding point area and corresponding welding point performance.

[0068] It is understood that the two parts may refer to two independent components or two parts of a component that need to be welded together. For example, the two parts may be two plates to be welded together.

[0069] In S1022, a three-dimensional finite element model of the solder joint area is constructed based on the two-dimensional finite element model of the solder joint area.

[0070] In practical applications, Visual Viewer software can be used in conjunction with Python scripting to rotate and replicate the two-dimensional finite element model obtained in step S1021 around the central axis 2 of the solder joint area. Multiple copies of the two-dimensional finite element model can be made to obtain a three-dimensional finite element model of the solder joint area. In practical applications, the rotational replication can be performed according to a preset rotation angle step size.

[0071] like Figure 4 Figure 1 shows a schematic diagram of a 1 / 4 symmetrical portion of a three-dimensional finite element model of the weld zone. Reference numeral 4 represents the upper plate to be welded, reference numeral 5 represents the lower plate to be welded, reference numeral 6 represents the center point of the weld zone, and reference numeral 7 represents the overall thickness of the plate.

[0072] Figure 4 In the embodiment, the overall thickness of the plate is 3 mm, the thickness of the upper plate to be welded is 1.5 mm, and the thickness of the lower plate to be welded is 1.5 mm.

[0073] Figure 5 As shown, Figure 4 Figure 8 shows a top view of a 3D finite element model. Reference numeral 8 denotes the plate area. The boundary of the cross-section of the weld zone (rotating counterclockwise around the central axis) is divided into multiple nodes j1, j2, …, jn, where n represents the number of nodes divided and is determined by the rotation angle step size.

[0074] In a possible implementation of the present disclosure, constructing a three-dimensional finite element model of the solder joint area based on the two-dimensional finite element model of the solder joint area specifically includes:

[0075] The two-dimensional finite element model of the solder joint area is rotated about the central axis 2 of the solder joint area to obtain a three-dimensional finite element model of the solder joint area.

[0076] In the embodiment of the present disclosure, the two-dimensional finite element model of the solder joint area is rotated 360 degrees (ie, one circle) about the central axis 2 of the solder joint area to obtain a three-dimensional finite element model.

[0077] In a possible embodiment of the present disclosure, rotating the two-dimensional finite element model of the solder joint area about the central axis 2 of the solder joint area to obtain a three-dimensional finite element model of the solder joint area specifically includes:

[0078] The two-dimensional finite element model of the solder joint area is rotated about the central axis 2 of the solder joint area to obtain an alternative model of the solder joint area; the alternative model is meshed according to a preset three-dimensional mesh division unit to obtain a three-dimensional finite element model of the solder joint area.

[0079] The preset three-dimensional grid division unit is smaller than the two-dimensional grid division unit in the two-dimensional finite element model.

[0080] In practical applications, the size of the mesh units in the 3D finite element model can be adjusted according to actual needs. Usually, the mesh units in the 3D finite element model are smaller than those in the 2D finite element model. Therefore, the 2D nodes in the 2D finite element model do not completely correspond to the 3D nodes in the 3D finite element model.

[0081] In S1023, the solder joint performance corresponding to the two-dimensional finite element model is mapped to the three-dimensional finite element model to obtain the solder joint performance corresponding to the three-dimensional finite element model of the solder joint area.

[0082] In one possible embodiment of the present disclosure, when a three-dimensional finite element model is obtained by rotating a two-dimensional finite element model about the central axis of the weld area, the weld performance of the two-dimensional nodes in the two-dimensional finite element model can be directly mapped to the weld performance of the corresponding three-dimensional nodes in the three-dimensional finite element model.

[0083] Specifically, for each two-dimensional node in the two-dimensional finite element model of the solder joint area, multiple three-dimensional nodes corresponding to the two-dimensional node in the three-dimensional finite element model of the solder joint area can be determined, and the solder joint performance corresponding to the two-dimensional node can be determined as the solder joint performance corresponding to the multiple three-dimensional nodes.

[0084] In practical applications, the node definition nodes in the three-dimensional finite element model are: m represents the number of nodes whose weld radius is cut, n represents the number of nodes whose weld circumference is cut in the three-dimensional finite element model, L represents the number of nodes whose weld axis is divided, and i, j, and k represent any point on the weld radius, weld circumference, and weld axis, respectively.

[0085] In the embodiment of the present application, the performance of the weld points in the two-dimensional finite element model is marked with the subscript 2D, and the performance of the weld points in the three-dimensional finite element model is marked with the subscript 3D.

[0086] Stress value σ 3D (i,j,k)=σ 2D (i,k)

[0087] Strain value ε 3D (i,j,k)=ε 2D (i,k)

[0088] Temperature value T 3D (i,j,k)=T 2D (i,k)

[0089] Among them, 0≤i≤m, 1≤j≤n, 0≤k≤L.

[0090] For a two-dimensional node (i, k) in a two-dimensional finite element model, there are n three-dimensional nodes corresponding to the two-dimensional node (i, k) in a three-dimensional finite element model.

[0091] In a possible embodiment of the present disclosure, when a three-dimensional finite element model is obtained by meshing an alternative model according to a preset three-dimensional mesh division unit, the three-dimensional nodes in the three-dimensional finite element model include: three-dimensional nodes corresponding to the two-dimensional nodes in the two-dimensional finite element model, and three-dimensional nodes that have no corresponding relationship with the two-dimensional nodes.

[0092] For 3D nodes that have a corresponding relationship with 2D nodes, direct mapping can be used to determine solder joint performance; while for 3D nodes that do not have a corresponding relationship with 2D nodes, interpolation mapping can be used to determine solder joint performance.

[0093] Specifically, for each two-dimensional node in the two-dimensional finite element model of the solder joint area, multiple three-dimensional nodes corresponding to the two-dimensional node in the three-dimensional finite element model of the solder joint area are determined, and the solder joint performance corresponding to the two-dimensional node is determined as the solder joint performance corresponding to the multiple three-dimensional nodes; based on the solder joint performance of the three-dimensional node corresponding to the two-dimensional node in the two-dimensional finite element model of the solder joint area, the solder joint performance of the three-dimensional node in the three-dimensional finite element model that has no corresponding relationship with the two-dimensional node is interpolated.

[0094] By combining the above direct mapping and interpolation mapping methods, the solder joint performance corresponding to the three-dimensional finite element model with a finer scale is obtained.

[0095] In a possible implementation manner of the present disclosure, the solder joint performance includes at least one of the following: mechanical properties and thermal properties.

[0096] In a possible implementation manner of the present disclosure, the mechanical characteristics include at least one of the following: a stress distribution result and a deformation distribution result.

[0097] In a possible implementation manner of the present disclosure, the thermal characteristics mainly refer to temperature distribution results.

[0098] In step S103, the validity of the solder joint corresponding to the three-dimensional finite element model of the solder joint area is determined according to the solder joint performance corresponding to the three-dimensional finite element model and the solder joint safety margin.

[0099] In the embodiment of the present disclosure, the solder joint safety margin obtained by the test in step S101 is compared with the solder joint performance corresponding to the three-dimensional finite element model of the solder joint area obtained in step S102 to determine the validity of the solder joint corresponding to the three-dimensional finite element model of the solder joint area.

[0100] If the solder joint performance corresponding to the three-dimensional finite element model is greater than the safety margin corresponding to the solder joint performance, determining that the solder joint has failed;

[0101] If the solder joint performance corresponding to the three-dimensional finite element model is less than or equal to the safety margin corresponding to the solder joint performance, the solder joint is determined to be valid.

[0102] If the solder joint fails, it means that the solder joint of the component has a safety hazard and the welding is unqualified. The component should be re-inspected to determine whether it needs to be re-welded. If the solder joint is effective, it means that the solder joint of the component is safe and the welding is qualified, and it can continue to be used.

[0103] Based on the same inventive concept as the above method, in another embodiment of the present disclosure, a device for evaluating the effectiveness of a solder joint is also disclosed. Figure 6 As shown, the solder joint effectiveness evaluation device includes: a safety margin acquisition module 101 , a solder joint performance acquisition module 102 and a determination module 103 .

[0104] The safety margin acquisition module 101 is configured to test and acquire the safety margin of the solder joint.

[0105] The solder joint performance acquisition module 102 is configured to obtain the solder joint performance corresponding to the three-dimensional finite element model of the solder joint area according to the two-dimensional finite element model of the solder joint area and the corresponding solder joint performance.

[0106] The determination module 103 is configured to determine the validity of the solder joint corresponding to the three-dimensional finite element model of the solder joint area according to the solder joint performance corresponding to the three-dimensional finite element model and the solder joint safety margin.

[0107] In another embodiment of the present disclosure, the solder joint performance acquisition module 102 includes an acquisition submodule, a construction submodule, and a mapping submodule.

[0108] The acquisition submodule is configured to acquire a two-dimensional finite element model of the solder joint area and corresponding solder joint performance.

[0109] The construction submodule is configured to construct a three-dimensional finite element model of the solder joint area based on the two-dimensional finite element model of the solder joint area.

[0110] The mapping submodule is configured to map the solder joint performance corresponding to the two-dimensional finite element model to the three-dimensional finite element model to obtain the solder joint performance corresponding to the three-dimensional finite element model of the solder joint area.

[0111] In another embodiment of the present disclosure, the acquisition submodule includes a construction unit and a determination unit.

[0112] The construction unit is configured to construct a finite element model of a connection between two parts;

[0113] The determining unit is configured to perform two-dimensional welding and heat treatment on the finite element model of the connection between the two parts to obtain a two-dimensional finite element model of the weld area and corresponding weld performance.

[0114] In another embodiment of the present disclosure, the building submodule includes a rotation unit.

[0115] The rotation submodule is configured to rotate the two-dimensional finite element model of the solder joint area about the central axis of the solder joint area to obtain a three-dimensional finite element model of the solder joint area.

[0116] In another embodiment of the present disclosure, the rotating unit is specifically used to

[0117] The two-dimensional finite element model of the solder joint area is rotated about the central axis of the solder joint area to obtain an alternative model of the solder joint area.

[0118] The candidate model is meshed according to a preset three-dimensional meshing unit to obtain a three-dimensional finite element model of the solder joint area.

[0119] The preset three-dimensional grid division unit is smaller than the two-dimensional grid division unit in the two-dimensional finite element model.

[0120] In another embodiment of the present disclosure, the mapping submodule is specifically configured to:

[0121] For each two-dimensional node in the two-dimensional finite element model of the solder joint area, multiple three-dimensional nodes corresponding to the two-dimensional node in the three-dimensional finite element model of the solder joint area are determined, and the solder joint performance corresponding to the two-dimensional node is determined as the solder joint performance corresponding to the multiple three-dimensional nodes.

[0122] The three-dimensional nodes in the three-dimensional finite element model include: three-dimensional nodes corresponding to the two-dimensional nodes in the two-dimensional finite element model, and three-dimensional nodes that have no corresponding relationship with the two-dimensional nodes.

[0123] In another embodiment of the present disclosure, the mapping submodule includes a corresponding unit and a non-corresponding unit.

[0124] The corresponding unit is configured to determine, for each two-dimensional node in the two-dimensional finite element model of the solder joint area, multiple three-dimensional nodes corresponding to the two-dimensional node in the three-dimensional finite element model of the solder joint area, and determine the solder joint performance corresponding to the two-dimensional node as the solder joint performance corresponding to the multiple three-dimensional nodes.

[0125] The non-corresponding unit is configured to interpolate the weld performance of three-dimensional nodes in the three-dimensional finite element model that have no corresponding relationship with the two-dimensional nodes based on the weld performance of the three-dimensional nodes corresponding to the two-dimensional nodes in the two-dimensional finite element model of the weld area.

[0126] In another embodiment of the present disclosure, the determination module 103 includes a first determination submodule and a second determination submodule. The first determination submodule is configured to determine that the solder joint is failed if the solder joint performance corresponding to the three-dimensional finite element model is greater than the safety margin corresponding to the solder joint performance.

[0127] The second determination submodule is configured to determine that the weld is valid if the weld performance corresponding to the three-dimensional finite element model is less than or equal to the safety margin corresponding to the weld performance.

[0128] It is understood that the embodiments described herein may be implemented using hardware, software, firmware, middleware, microcode, or a combination thereof. For hardware implementation, the processing unit may be implemented in one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), general-purpose processors, controllers, microcontrollers, microprocessors, other electronic units for performing the functions described herein, or a combination thereof.

[0129] For software implementation, the technology described herein can be implemented by a unit that performs the functions described herein. The software code can be stored in a memory and executed by a processor. The memory can be implemented in the processor or outside the processor.

[0130] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present invention.

[0131] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0132] In the embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are merely schematic. For example, the division of the units is merely a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0133] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0134] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0135] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solutions of the embodiments of the present invention, or the part that contributes to the prior art, or part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for enabling a computer device (which can be a personal computer, server, or network device, etc.) to perform all or part of the steps of the methods described in various embodiments of the present invention. The aforementioned storage media include various media that can store program code, such as USB flash drives, mobile hard drives, ROM, RAM, magnetic disks, or optical disks.

[0136] It should be noted that, in this document, the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or apparatus comprising the element.

[0137] It should be noted that, in this document, relational terms such as “first” and “second” are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations.

[0138] Through the description of the above implementation methods, those skilled in the art can clearly understand that the methods described in the various embodiments of the present invention can be implemented by means of software plus the necessary general hardware platform, and of course can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), and includes a number of instructions for enabling a terminal device (which can be a mobile phone, computer, server, air conditioner, or network device, etc.) to execute the methods described in the various embodiments of the present invention or the methods described in certain parts of the embodiments.

[0139] The above are only preferred embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention description and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A method for evaluating solder joint effectiveness, characterized in that: include: Test to obtain solder joint safety margin; Obtaining solder joint performance corresponding to the three-dimensional finite element model of the solder joint area according to the two-dimensional finite element model of the solder joint area and the corresponding solder joint performance; Determining the validity of the solder joint corresponding to the three-dimensional finite element model of the solder joint area according to the solder joint performance corresponding to the three-dimensional finite element model and the solder joint safety margin; The step of obtaining the solder joint performance corresponding to the three-dimensional finite element model of the solder joint area based on the two-dimensional finite element model of the solder joint area and the corresponding solder joint performance includes: Obtain a two-dimensional finite element model of the solder joint area and the corresponding solder joint performance; Constructing a three-dimensional finite element model of the solder joint area based on the two-dimensional finite element model of the solder joint area; Mapping the solder joint performance corresponding to the two-dimensional finite element model to the three-dimensional finite element model to obtain the solder joint performance corresponding to the three-dimensional finite element model of the solder joint area; The obtaining of the two-dimensional finite element model of the solder joint area and the corresponding solder joint performance includes: Construct a finite element model of the joint between two parts; The finite element model of the connection between the two parts is subjected to two-dimensional welding and heat treatment to obtain a two-dimensional finite element model of the welding point area and corresponding welding point performance.

2. A solder joint effectiveness evaluation method according to claim 1, characterized in that: Constructing a three-dimensional finite element model of the solder joint area based on the two-dimensional finite element model of the solder joint area includes: The two-dimensional finite element model of the solder joint area is rotated about the central axis of the solder joint area to obtain a three-dimensional finite element model of the solder joint area.

3. A solder joint effectiveness evaluation method according to claim 2, characterized in that: Mapping the solder joint performance corresponding to the two-dimensional finite element model to the three-dimensional finite element model to obtain the solder joint performance corresponding to the three-dimensional finite element model of the solder joint area includes: For each two-dimensional node in the two-dimensional finite element model of the solder joint area, multiple three-dimensional nodes corresponding to the two-dimensional node in the three-dimensional finite element model of the solder joint area are determined, and the solder joint performance corresponding to the two-dimensional node is determined as the solder joint performance corresponding to the multiple three-dimensional nodes.

4. A solder joint effectiveness evaluation method according to claim 2, characterized in that: The step of rotating the two-dimensional finite element model of the solder joint area about the central axis of the solder joint area to obtain a three-dimensional finite element model of the solder joint area includes: Rotating the two-dimensional finite element model of the solder joint area about the central axis of the solder joint area to obtain an alternative model of the solder joint area; Meshing the candidate model according to a preset three-dimensional mesh division unit to obtain a three-dimensional finite element model of the solder joint area; The preset three-dimensional grid division unit is smaller than the two-dimensional grid division unit in the two-dimensional finite element model.

5. A solder joint effectiveness evaluation method according to claim 4, characterized in that: The three-dimensional nodes in the three-dimensional finite element model include: three-dimensional nodes corresponding to the two-dimensional nodes in the two-dimensional finite element model, and three-dimensional nodes that have no corresponding relationship with the two-dimensional nodes; Mapping the solder joint performance corresponding to the two-dimensional finite element model to the three-dimensional finite element model to obtain the solder joint performance corresponding to the three-dimensional finite element model of the solder joint area includes: For each two-dimensional node in the two-dimensional finite element model of the solder joint area, determine a plurality of three-dimensional nodes corresponding to the two-dimensional node in the three-dimensional finite element model of the solder joint area, and determine the solder joint performance corresponding to the two-dimensional node as the solder joint performance corresponding to the plurality of three-dimensional nodes; The weld performance of three-dimensional nodes corresponding to the two-dimensional nodes in the two-dimensional finite element model of the weld area is interpolated to obtain the weld performance of three-dimensional nodes in the three-dimensional finite element model that have no corresponding relationship with the two-dimensional nodes.

6. A solder joint effectiveness evaluation method according to claim 1, characterized in that: Determining the validity of a solder joint corresponding to the three-dimensional finite element model of the solder joint area according to the solder joint performance corresponding to the three-dimensional finite element model and the safety margin corresponding to the solder joint performance includes: If the solder joint performance corresponding to the three-dimensional finite element model is greater than the safety margin corresponding to the solder joint performance, determining that the solder joint has failed; If the solder joint performance corresponding to the three-dimensional finite element model is less than or equal to the safety margin corresponding to the solder joint performance, the solder joint is determined to be valid.

7. A solder joint effectiveness evaluation method according to claim 6, characterized in that: The weld safety margin includes at least one of the following: a tensile safety margin, a shear safety margin, and a tensile-shear safety margin.

8. A device for evaluating solder joint effectiveness, the device adopting the method according to any one of claims 1 to 7, characterized in that: include: Safety margin acquisition module, used to test and obtain the safety margin of solder joints; A solder joint performance acquisition module, configured to obtain the solder joint performance corresponding to the three-dimensional finite element model of the solder joint area based on the two-dimensional finite element model of the solder joint area and the corresponding solder joint performance; a determination module, configured to determine the validity of the solder joint corresponding to the three-dimensional finite element model of the solder joint area based on the solder joint performance corresponding to the three-dimensional finite element model and the solder joint safety margin; The step of obtaining the solder joint performance corresponding to the three-dimensional finite element model of the solder joint area based on the two-dimensional finite element model of the solder joint area and the corresponding solder joint performance includes: Obtain a two-dimensional finite element model of the solder joint area and the corresponding solder joint performance; Constructing a three-dimensional finite element model of the solder joint area based on the two-dimensional finite element model of the solder joint area; Mapping the solder joint performance corresponding to the two-dimensional finite element model to the three-dimensional finite element model to obtain the solder joint performance corresponding to the three-dimensional finite element model of the solder joint area; The obtaining of the two-dimensional finite element model of the solder joint area and the corresponding solder joint performance includes: Construct a finite element model of the joint between two parts; The finite element model of the connection between the two parts is subjected to two-dimensional welding and heat treatment to obtain a two-dimensional finite element model of the welding point area and corresponding welding point performance.

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