Display device

By providing protective components and adhesive layers on the display panel of the display device, stress concentration and welding defects caused by bending are solved, and higher display panel stability and welding quality are achieved.

CN112017536BActive Publication Date: 2025-03-11SAMSUNG DISPLAY CO LTD
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Patent Information

Application Number
CN202010459083.6
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2019-05-31
Filing Date
2020-05-27
Publication Date
2025-03-11
Estimated Expiration
2040-05-27

AI Technical Summary

Technical Problem

In a display device, bending causes concentration of stress, cracks may occur, and there are bond defects between the printed circuit board and the pads of the display panel.

Method used

The display device design is adopted that includes a display panel, a first protective member and a second protective member. A second protective member is provided on the pad portion of the display panel, and a first protective member is provided on other parts of the display panel, so that stress caused by bending is reduced by the adhesive layer and the protective film, and welding defects are prevented.

Benefits of technology

It effectively reduces the stress caused by bending, prevents cracks in the display panel, and improves the quality of the bonding between the printed circuit board and the display panel pad.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present application relates to a display device. The display device includes a display panel, a first protective member and a second protective member. The display panel includes a front portion, a first side portion extending from the front portion, and a pad portion extending from the first side portion. The pad is located on the pad portion, the first side portion is bendable, and each of the front portion and the first side portion displays an image. The first protective member is located below the display panel and overlaps with the front portion and the first side portion. The second protective member is located below the display panel, in the same layer as the first protective member when the display panel is in an unbent state, and overlaps with the pad portion. The second protective member has a greater bending stiffness than the bending stiffness of the first protective member.
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Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Korean Patent Application No. 10-2019-0064854, filed on May 31, 2019, and all rights arising therefrom, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] Embodiments of the present invention relate to a display device and a method of manufacturing the display device, and more particularly, to a display device capable of displaying images on a plurality of display surfaces and a method of manufacturing the display device. Background Art

[0004] Various display devices have been widely used in multimedia equipment such as televisions, mobile phones, navigation systems, computer display screens, and game consoles.

[0005] According to recent market demands, research is being conducted to reduce the non-display area on the display device where no image is displayed. In addition, attempts are being made to expand the display area through which the user recognizes the image on the display device. Summary of the invention

[0006] In a display device, an image can be displayed not only on the front surface of the display device but also on the side surface of the display device. In such a display device, when the display device is bent to form the side surface, cracks may occur in components in the display device due to the concentration of stress in the bent area.

[0007] Embodiments of the present invention provide a display device including a display panel capable of reducing stress caused by bending, and a method of manufacturing the display panel.

[0008] Embodiments of the present invention provide a display device in which a bonding defect between a printed circuit board and a pad of a display panel is reduced, and a method of manufacturing the same.

[0009] According to an embodiment of the present invention, a display device includes a display panel, a first protective member, and a second protective member, wherein: the display panel includes a front portion, a first side portion extending from the front portion, and a pad portion extending from the first side portion, wherein the pad is located on the pad portion, the first side portion is bendable, and each of the front portion and the first side portion displays an image; the first protective member is located below the display panel and overlaps the front portion and the first side portion; the second protective member is located below the display panel and directly contacts the display panel, wherein the second protective member overlaps the pad portion. In this embodiment, the first protective member includes a first protective film and a first adhesive layer located between the display panel and the first protective film.

[0010] In an exemplary embodiment, the first protective member and the second protective member may be spaced apart from each other.

[0011] In an exemplary embodiment, the first protective member and the second protective member may include different materials from each other.

[0012] In an exemplary embodiment, when the display panel is in an unbent state, the second protective member may be disposed in the same layer as the first protective member.

[0013] In an exemplary embodiment, the second protective member may include a radical polymerization type pressure sensitive adhesive ("PSA") or a cation polymerization type PSA. In such an embodiment, the radical polymerization type PSA or the cation polymerization type PSA may include an oligomer, a monomer, a photopolymerization initiator, and an additive.

[0014] In an exemplary embodiment, when the display panel is in an unbent state, the first protection member may not overlap the pad.

[0015] In an exemplary embodiment, the second protective member may have a bending rigidity greater than that of the first protective member.

[0016] In exemplary embodiments, the first adhesive layer may have a modulus in a range from about 20 kilopascals (kPa) to about 45 kPa.

[0017] In an exemplary embodiment, the display device may further include a second protective film on the second protective member and a second adhesive layer between the second protective member and the second protective film.

[0018] In an exemplary embodiment, the second protective film may include a material substantially the same as that of the first protective film.The second adhesive layer may include a material substantially the same as that of the first adhesive layer.

[0019] In an exemplary embodiment, the front portion may be substantially rectangular in shape when viewed in a plan view. In such an embodiment, the first side portion may extend from the first side of the front portion. In such an embodiment, the display panel may further include a second side portion, a third side portion, and a fourth side portion extending from the second side, the third side, and the fourth side of the front portion, respectively, and the second side portion to the fourth side portion are bendable.

[0020] In an exemplary embodiment, the display device may further include a flexible printed circuit board attached to the pad.

[0021] In an exemplary embodiment, the display device may further include a bracket located under the display panel and supporting the display panel.

[0022] In an exemplary embodiment, the display device may further include a window member on the display panel and covering the front portion and the first side portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The above and other features of the present invention will become more apparent through a more detailed description of embodiments of the present invention with reference to the accompanying drawings, in which:

[0024] Figure 1 A perspective view showing a front surface of a display device according to an exemplary embodiment of the present invention and a side surface connected to the front surface is shown;

[0025] Figure 2 Shown along Figure 1 A cross-sectional view taken along line II';

[0026] Figure 3 shows a plan view showing a display panel in an unbent state according to an exemplary embodiment of the present invention;

[0027] Figure 4 Shown along Figure 3 A cross-sectional view taken along line II-II' of FIG. 1 , showing a display panel and components connected to the display panel;

[0028] Figure 5 A cross-sectional view showing a portion of an exemplary embodiment of a display panel is shown;

[0029] Figure 6 shows a cross-sectional view showing a display panel and some components of a display device according to an exemplary embodiment of the present invention;

[0030] Figure 7 Shown along Figure 1 A cross-sectional view taken along line II' of FIG. 1 , which shows a display device according to an alternative exemplary embodiment of the present invention;

[0031] Figure 8 Shown along Figure 1 A cross-sectional view taken along line II' of FIG. 1 , which shows a display device according to another alternative exemplary embodiment of the present invention;

[0032] 9A to 9C shows a cross-sectional view illustrating a method of manufacturing a display device according to an exemplary embodiment of the present invention; and

[0033] Fig. 10A and Fig. 10B A plan view illustrating a method of manufacturing a display device according to an exemplary embodiment of the present invention is shown. DETAILED DESCRIPTION

[0034] The present invention will now be described more fully below with reference to the accompanying drawings showing various embodiments. However, the present invention can be implemented in many different forms and should not be construed as being limited to the embodiments set forth herein. Instead, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the scope of the present invention to those skilled in the art. The same reference numerals represent the same elements throughout.

[0035] In this specification, when a specific component (or region, layer, part, etc.) is referred to as being "on" another component(s), "connected to" or "coupled to" another component(s), the specific component may be directly set on the other component(s), directly connected to the other component(s) or directly coupled to the other component(s), or at least one intervening component may be located between the specific component and the other component(s).

[0036] The same reference numerals indicate the same components. In addition, in the drawings, in order to effectively illustrate the technical contents, the thickness, proportion and size of the components are exaggerated.

[0037] The terms used herein are for the purpose of describing specific embodiments only and are not intended to be limiting. Unless otherwise expressly indicated, as used herein, the singular forms "a", "an", and "the" are intended to include plural forms (including "at least one"). "Or" means "and / or". The term "and / or" includes one or more combinations defined by the relevant components.

[0038] It will be understood that although the terms first, second, etc. may be used herein to describe various components, these components should not be limited by these terms. These terms are only used to distinguish one component from another component. For example, a first component may be referred to as a second component, and a second component may be referred to as a first component, without departing from the scope of the present invention. Unless the context clearly indicates otherwise, the singular form is intended to also include the plural form.

[0039] Additionally, terms such as "below," "lower," "above," and "upper" are used herein to describe one component's relationship to other components as illustrated in the drawings. Relative terms are intended to encompass different orientations in addition to the orientation depicted in the drawings.

[0040] Unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meanings as those generally understood by those of ordinary skill in the art. In addition, terms, such as those defined in commonly used dictionaries, should be understood to have the same meanings as those in the art, or to have the meanings defined in the art according to the context, and should not be understood as idealized or overly formal meanings, unless explicitly defined in this article.

[0041] It should be understood that terms such as “comprises,” “includes,” and “has” are used to specify the presence of stated features, integers, steps, operations, parts, elements, or combinations thereof, but do not exclude the presence or addition of one or more other features, integers, steps, operations, parts, elements, or combinations thereof.

[0042] Hereinafter, embodiments of the present invention will be described in detail using the accompanying drawings.

[0043] Figure 1 A perspective view showing a front surface of a display device according to an exemplary embodiment of the present invention and a side surface connected to the front surface is illustrated.

[0044] In an exemplary embodiment, the display device EA may display images IM1 and IM2 on the front surface SF1 and on one or more of the first, second, third, and fourth side surfaces SF3, SF4, SF5, and SF6 connected to the front surface SF1 in response to an electrical signal, and may also detect an external input.

[0045] In an exemplary embodiment, if Figure 1 As shown in , the display apparatus EA may show an image IM1 displayed on the front surface SF1 and an image IM2 displayed on the third side surface SF5.

[0046] The external input may include a user's body, light, heat, pressure, or any number of types of input. In an exemplary embodiment, the external input may include contact touch or proximity touch. In an exemplary embodiment, as Figure 1 As shown in , the display device EA can be, for example, a smart phone, but is not limited thereto. Optionally, the display device EA can be used in a variety of products including a display, such as a television, a display screen, a tablet computer, a game console, and a smart watch. Herein, the external input can be classified into force and touch.

[0047] The front surface SF1 of the display device EA may be parallel to a plane defined by the first direction DR1 and the second direction DR2. In an exemplary embodiment, when viewed in a plan view, the display device EA may have a longer side extending in the first direction DR1 and a shorter side extending in the second direction DR2. The third direction DR3 may be defined by a normal direction of the front surface SF1 of the display device EA, or by a thickness direction of the display device EA. However, the first direction DR1, the second direction DR2, and the third direction DR3 are relative concepts and may represent other directions.

[0048] Figure 2 Shown along Figure 1 A cross-sectional view taken along line II'.

[0049] The display device EA may include a display panel DP, a first protective member PT1, a second protective member PT2, a window member WM, a printed circuit board FPC, and a housing HS.

[0050] The display panel DP may display an image. The display panel DP may be flexible. In an exemplary embodiment, the display panel DP may be an organic light emitting display panel.

[0051] An image may be displayed on the display panel DP which is bent to overlap the front surface SF1 and the first, second, third, and fourth side surfaces SF3, SF4, SF5, and SF6 of the display apparatus EA.

[0052] The first protective member PT1 and the second protective member PT2 may be attached to the rear surface of the display panel DP. The first protective member PT1 and the second protective member PT2 will be described in more detail later.

[0053] The printed circuit board FPC may be attached to the display panel DP. The printed circuit board FPC may provide an external signal to the display panel DP, or may transmit a signal received from the display panel DP to the outside. The printed circuit board FPC may include a drive circuit chip IC. However, the present invention is not limited thereto, and optionally, the drive circuit chip IC may be mounted on the display panel DP.

[0054] The window member WM may be disposed on the display panel DP. The window member WM may cover the display panel DP and may have a shape similar to that of the display panel DP. The window member WM may constitute one or more of the front surface SF1 and the first side surface SF3, the second side surface SF4, the third side surface SF5, and the fourth side surface SF6 of the display device EA.

[0055] The housing HS and the window member WM may form the appearance of the display device EA. Figure 2 As shown in , the housing HS may constitute the rear surface of the display device EA, and may constitute the area between the first side surface SF3, the second side surface SF4, the third side surface SF5, and the fourth side surface SF6 of the display device EA. However, the present invention is not limited thereto. Optionally, the housing HS may be omitted, and the display panel DP and the window member WM may cover the entire external area of ​​the display device EA.

[0056] Figure 3 A plan view showing a display panel in an unbent state according to an exemplary embodiment of the present invention is shown. Figure 4 Shown along Figure 3 A cross-sectional view taken along line II-II' of FIG. 1 shows the display panel and components connected to the display panel.

[0057] Reference Figures 2 to 4 , an exemplary embodiment of the display panel DP may include a front portion SP1, a pad portion PP, and first, second, third, and fourth side portions SP3, SP4, SP5, and SP6.

[0058] In such an embodiment, an image may be displayed on the front portion SP1 and each of the first side portion SP3, the second side portion SP4, the third side portion SP5, and the fourth side portion SP6. Therefore, the display panel DP may display images on at least five surfaces.

[0059] The front portion SP1 may have a rectangular shape with rounded edges.

[0060] The first side portion SP3 may extend from the first boundary line or the first side of the front portion SP1. The second side portion SP4 may extend from the second boundary line or the second side of the front portion SP1. The third side portion SP5 may extend from a third boundary line of the front portion SP1 opposite to the first boundary line, and may face the first side portion SP3. The fourth side portion SP6 may extend from a fourth boundary line of the front portion SP1 opposite to the second boundary line, and may face the second side portion SP4. The first side portion SP3, the second side portion SP4, the third side portion SP5, and the fourth side portion SP6 may be spaced apart from each other.

[0061] The pad portion PP may extend from the second side portion SP4. The pad portion PP may not display an image. However, the present invention is not limited thereto, and alternatively, the pad portion PP may display an image in a region thereof adjacent to the second side portion SP4.

[0062] The display panel DP may be bent around four boundary lines of the front portion SP1. The display panel DP may have curvatures near boundaries between the front portion SP1 and the first, second, third, and fourth sides SP3, SP4, SP5, and SP6.

[0063] The display panel DP may also be bent around a boundary between the pad portion PP and the second side portion SP4. On the display panel DP in the bent state, the front portion SP1 and the pad portion PP may be spaced apart from each other in the third direction DR3 while facing each other.

[0064] The pad portion PP may include pads PD. The pads PD may be spaced apart from each other in the second direction DR2. The pads PD may be connected to the printed circuit board FPC and may exchange signals with the printed circuit board FPC.

[0065] In an exemplary embodiment, if Figure 4As shown in , the display device EA may further include an anti-reflection layer RP and an adhesive layer AD disposed between the window member WM and the display panel DP.

[0066] The anti-reflection layer RP may prevent external light from being reflected from the inside of the display panel DP, thereby making the inside of the display panel DP invisible to the user. In an exemplary embodiment, the anti-reflection layer RP may include an optical film stack (such as a polarizing film and a λ / 4 wavelength film) for preventing reflection of external light. In an optional exemplary embodiment, the anti-reflection layer RP may include a color filter and a black matrix.

[0067] The adhesive layer AD may be disposed between the anti-reflection layer RP and the window member WM, and may couple the anti-reflection layer RP and the window member WM to each other. The adhesive layer AD may include an optically clear adhesive ("OCA") or an optically clear resin ("OCR").

[0068] The first protective member PT1 may be disposed under the display panel DP. The first protective member PT1 may be attached to the base layer (see Figure 5 The bottom surface of the display panel SUB) is formed, wherein the bottom surface constitutes a rear surface of the display panel DP.

[0069] The first protective member PT1 may overlap the front SP1 and the first, second, third, and fourth sides SP3, SP4, SP5, and SP6 of the display panel DP. The first protective member PT1 may not overlap the pad PD.

[0070] The second protective member PT2 may be disposed in the same layer as the first protective member PT1. The second protective member PT2 may overlap the pad portion PP. The second protective member PT2 may have a material different from that of the first protective member PT1. The second protective member PT2 may be spaced apart from the first protective member PT1.

[0071] The first protective member PT1 may include a first adhesive layer PSA1 and a first protective film PF1. The first protective member PT1 may serve to absorb an impact applied to a lower portion of the display panel DP.

[0072] The first protection film PF1 may include at least one polymer material, for example, one or more of polyimide, polyethylene terephthalate ("PET"), polycarbonate, polyethylene naphthalate, polyarylate ("PAR"), and polyetherimide.

[0073] The first adhesive layer PSA1 may be disposed between the display panel DP and the first protection film PF1, and may couple the display panel DP and the first protection film PF1 to each other.

[0074] In an exemplary embodiment, the display panel DP may be bent around a boundary line of the front portion SP1, and the first protective member PT1 may overlap not only the front portion SP1 but also the first side portion SP3, the second side portion SP4, the third side portion SP5, and the fourth side portion SP6. In such an embodiment, the first protective film PF1 may reduce stress generated when the display panel DP is bent. In an exemplary embodiment, the first adhesive layer PSA1 may have a modulus in a range of about 20 kilopascals (kPa) to about 45 kPa. Therefore, in such an embodiment, the first protective member PT1 including the first adhesive layer PSA1 may reduce stress generated by bending of the display panel DP.

[0075] The second protective member PT2 may have a greater bending rigidity than that of the first protective member PT1. Therefore, the second protective member PT2 may have a smaller deformation caused by an external impact applied in the third direction DR3 than the first protective member PT1.

[0076] The second protective member PT2 may have a single-layer structure and may be directly attached to the base layer (see Figure 5 The second protective member PT2 may have a modulus greater than that of the first adhesive layer PSA1.

[0077] The second protective member PT2 may include a pressure-sensitive adhesive ("PSA"). The PSA may include an oligomer, a monomer, a photopolymerization initiator, and an additive. The PSA may be of a free radical polymerization type or a cationic polymerization type. The oligomer of the free radical polymerization type PSA may include one of polyester acrylate, epoxy acrylate, polyurethane acrylate, polyether acrylate, and silicone acrylate. The monomer of the free radical polymerization type PSA may include a monofunctional monomer or a multifunctional monomer. The photopolymerization initiator of the free radical polymerization type PSA may include benzoin ether or benzoin amine. The additive of the free radical polymerization type PSA may include a tackifier, a filler, or a polymerization inhibitor. The oligomer of the cationic polymerization type PSA may include an alicyclic epoxy resin, a glycidyl ether resin, an epoxy acrylate, or a vinyl ether. The monomer of the cationic polymerization type PSA may include an epoxy monomer, a vinyl ether, or a cyclic ether. The photopolymerization initiator of the cationic polymerization type PSA may include a diazonium salt, an iodine salt, a sulfonium salt, or a metallocene compound. The additive of the cationic polymerization type PSA may include a silane coupling agent.

[0078] In an exemplary embodiment, a compression process may be performed to bond the pad PD of the pad portion PP to the printed circuit board FPC. If the first protective member PT1 including the first adhesive layer PSA1 having a relatively low modulus under the display panel DP has a structure extending to the pad portion PP, when a bonding process is performed on the printed circuit board FPC and the pad PD, the first adhesive layer PSA1 may be deformed due to pressure, so that the pressure applied between the printed circuit board FPC and the pad PD is reduced, and thus a bonding defect may subsequently occur.

[0079] According to an exemplary embodiment of the present invention, the front portion SP1 and the first side portion SP3, the second side portion SP4, the third side portion SP5, and the fourth side portion SP6 may overlap with the first protective member PT1 including the first adhesive layer PSA1 having a relatively low modulus, and thus this may be able to reduce stress caused by bending. In this embodiment, since the pad portion PP overlaps with the second protective member PT2 having a relatively large bending rigidity, a compression process may be effectively performed on the printed circuit board FPC and the pad PD.

[0080] Figure 5 A cross-sectional view showing a portion of an exemplary embodiment of the display panel DP is illustrated.

[0081] An exemplary embodiment of the display panel DP may include a base layer SUB, a circuit element layer DP-CL, a display element layer DP-OLED, and an encapsulation layer TFE.

[0082] The circuit element layer DP-CL includes transistors. In an exemplary embodiment, Figure 5 As shown in FIG. 1 , the circuit element layer DP-CL may include a first transistor T1 and a second transistor T2 for driving a single organic light emitting diode OLED.

[0083] The circuit element layer DP-CL includes at least one inorganic layer, at least one organic layer and a circuit element. Figure 5 As shown in FIG. 1 , the circuit element layer DP-CL may include an inorganic buffer layer BFL, a first intermediate inorganic layer 10 , a second intermediate inorganic layer 20 , and an intermediate organic layer 30 .

[0084] The inorganic layer may include silicon nitride, silicon oxynitride, silicon oxide, etc. The organic layer may include one or more of acrylic-based resin, methacrylic-based resin, vinyl-based resin, epoxy-based resin, polyurethane-based resin, cellulose-based resin, siloxane-based resin, polyimide-based resin, polyamide-based resin, and perylene-based resin. The circuit element may include a conductive pattern and / or a semiconductor pattern.

[0085] The buffer layer BFL increases the adhesive force between the base layer SUB and the conductive pattern or the semiconductor pattern. Although not shown, a barrier layer may be further provided on the top surface of the base layer SUB to prevent the introduction of foreign substances. The buffer layer BFL and the barrier layer may be selectively provided or omitted.

[0086] The buffer layer BFL is provided to have thereon a semiconductor pattern OSP1 (also referred to as a first semiconductor pattern) of the first transistor T1 and a semiconductor pattern OSP2 (also referred to as a second semiconductor pattern) of the second transistor T2. The first semiconductor pattern OSP1 and the second semiconductor pattern OSP2 may include at least one material selected from amorphous silicon, polysilicon, and metal oxide semiconductor.

[0087] The first intermediate inorganic layer 10 is disposed on the first semiconductor pattern OSP1 and the second semiconductor pattern OSP2. In this embodiment, the control electrode GE1 (also referred to as the first control electrode) of the first transistor T1 and the control electrode GE2 (also referred to as the second control electrode) of the second transistor T2 may be disposed on the first intermediate inorganic layer 10. The first control electrode GE1 and the second control electrode GE2 may be made by the same photolithography process as that used to manufacture the scan line.

[0088] In an exemplary embodiment, the second intermediate inorganic layer 20 covering the first control electrode GE1 and the second control electrode GE2 is disposed on the first intermediate inorganic layer 10. The input electrode DE1 (also referred to as the first input electrode) and the output electrode SE1 (also referred to as the first output electrode) of the first transistor T1 are disposed on the second intermediate inorganic layer 20, and the input electrode DE2 (also referred to as the second input electrode) and the output electrode SE2 (also referred to as the second output electrode) of the second transistor T2 are disposed on the second intermediate inorganic layer 20.

[0089] The first input electrode DE1 and the first output electrode SE1 are connected to the first semiconductor pattern OSP1 through the first through hole CH1 and the second through hole CH2, respectively, each of which is defined or formed to pass through the first intermediate inorganic layer 10 and the second intermediate inorganic layer 20. The second input electrode DE2 and the second output electrode SE2 are connected to the second semiconductor pattern OSP2 through the third through hole CH3 and the fourth through hole CH4, respectively, each of which is defined or formed to pass through the first intermediate inorganic layer 10 and the second intermediate inorganic layer 20. In an alternative exemplary embodiment, one or more of the first transistor T1 and the second transistor T2 may have a bottom gate structure.

[0090] The second intermediate inorganic layer 20 is provided with the intermediate organic layer 30 thereon covering the first input electrode DE1, the second input electrode DE2, the first output electrode SE1, and the second output electrode SE2. The intermediate organic layer 30 may provide a planarized surface.

[0091] The display element layer DP-OLED is disposed on the intermediate organic layer 30. The display element layer DP-OLED may include a pixel defining layer PDL and an organic light emitting diode OLED. The pixel defining layer PDL may include an organic material substantially the same as that of the intermediate organic layer 30. The first electrode AE ​​is disposed on the intermediate organic layer 30. The first electrode AE ​​is connected to the second output electrode SE2 through a fifth through hole CH5, which is defined or formed to pass through the intermediate organic layer 30. An opening OP is defined in the pixel defining layer PDL. The opening OP of the pixel defining layer PDL exposes at least a portion of the first electrode AE.

[0092] The display panel DP may be defined with a light emitting region PXA and a non-light emitting region NPXA. The non-light emitting region NPXA may surround the light emitting region PXA. In an exemplary embodiment, the light emitting region PXA is defined to correspond to a portion of the first electrode AE ​​exposed to the opening OP. The light emitting region PXA is a region that emits light output from the organic light emitting diode OLED, and the non-light emitting region NPXA is a region that blocks light output from the organic light emitting diode OLED. Although not shown, the non-light emitting region NPXA may be defined between a plurality of light emitting regions PXA. In an exemplary embodiment, the non-light emitting region NPXA is a single connected region. However, for ease of description, the non-light emitting region NPXA may be divided into a plurality of regions to represent a specific region of the non-light emitting region NPXA.

[0093] The hole control layer HCL may be provided in common in the emission region PXA and the non-emission region NPXA. Although not shown, a common layer such as the hole control layer HCL may be provided or formed on the entire surface of the base layer SUB or provided or formed to cover the entire surface of the base layer SUB.

[0094] The emission layer EML is disposed on the hole control layer HCL. The emission layer EML may be disposed in a region corresponding to the opening OP. In an exemplary embodiment, for example, the emission layer EML may be formed as a plurality of separate sheets respectively disposed in a plurality of light emitting regions PXA. The emission layer EML may include an organic material and / or an inorganic material. In an exemplary embodiment, the emission layer EML may be a patterned layer as described above, but is not limited thereto. Alternatively, the emission layer EML may be disposed in common in a plurality of light emitting regions PXA. In such an embodiment, the emission layer EML may generate red light, green light, blue light, or white light, and is not limited to the color of the light generated from the emission layer EML. In an exemplary embodiment, the emission layer EML may have a multilayer structure.

[0095] The electron control layer ECL is disposed on the emission layer EML. Although not shown, the electron control layer ECL may be disposed or formed in common in the plurality of light emitting areas PXA.

[0096] The second electrode CE is disposed on the electron control layer ECL. The second electrode CE is disposed in common in the plurality of light emitting areas PXA.

[0097] The encapsulation layer TFE is disposed on the second electrode CE. The encapsulation layer TFE is disposed in common in the plurality of light emitting areas PXA. In an exemplary embodiment, the encapsulation layer TFE directly covers the second electrode CE.

[0098] The encapsulation layer TFE may include at least one encapsulation inorganic layer and at least one encapsulation organic layer. The encapsulation inorganic layer and the encapsulation organic layer may be alternately stacked on each other.

[0099] In an exemplary embodiment, the encapsulation layer TFE may include first and second encapsulation inorganic layers IOL1 and IOL2 and a first encapsulation organic layer OL1. Alternatively, the encapsulation layer TFE may include only the first encapsulation organic layer OL1.

[0100] The first encapsulation inorganic layer IOL1 , the first encapsulation organic layer OL1 , and the second encapsulation inorganic layer IOL2 may be sequentially stacked on the second electrode CE.

[0101] The first encapsulation organic layer OL1 may be formed by using an inkjet printing process or by coating a composite material (including an acrylic-based monomer). The first encapsulation inorganic layer 1OL1 and the second encapsulation inorganic layer 1OL2 may include the same inorganic material as each other or different inorganic materials from each other. The materials constituting the first encapsulation inorganic layer 1OL1 and the second encapsulation inorganic layer 1OL2 may include, but are not specifically limited to, silicon nitride, silicon oxynitride, silicon oxide, etc.

[0102] In an exemplary embodiment, the encapsulation layer TFE and the second electrode CE may be further disposed with a capping layer covering the second electrode CE therebetween. In such an embodiment, the encapsulation layer TFE may directly cover the capping layer.

[0103] The display panel DP may further include a touch sensing unit TS.

[0104] The touch sensing unit TS acquires coordinate information of an external input. The touch sensing unit TS may be directly disposed on the encapsulation layer TFE. Herein, the phrase "directly disposed" does not include the meaning of attachment using an adhesive layer, and includes the meaning of "formed by a continuous process". However, the present invention is not limited thereto, and the touch sensing unit TS may be attached to the encapsulation layer TFE through an adhesive layer.

[0105] Figure 6 2 is a cross-sectional view showing a display panel and some components of a display device according to an exemplary embodiment of the present invention. Figure 6 , a portion of the display panel is shown corresponding to the Figure 3 A cross-sectional view taken along line II-II'.

[0106] Reference Figure 6 , the exemplary embodiment of the display device EA1 may further include a second protection film PF2 and a second adhesive layer PSA2.

[0107] The second protective film PF2 and the second adhesive layer PSA2 may be disposed to overlap the second protective member PT2 but may not overlap the first protective member PT1. The second adhesive layer PSA2 may be disposed between the second protective member PT2 and the second protective film PF2 and may couple the second protective member PT2 and the second protective film PF2 to each other.

[0108] In an exemplary embodiment, the second adhesive layer PSA2 may include a material substantially the same as that of the first adhesive layer PSA1. However, the present invention is not limited thereto, and alternatively, the second adhesive layer PSA2 may include a material different from that of the first adhesive layer PSA1.

[0109] In an exemplary embodiment, the second protection film PF2 may include a material substantially the same as that of the first protection film PF1. However, the present invention is not limited thereto, and alternatively, the second protection film PF2 may include a material different from that of the first protection film PF1.

[0110] Figure 7 Shown along Figure 1 1 is a cross-sectional view taken along line II' of FIG. 1 , which illustrates a display device according to an alternative exemplary embodiment of the present invention.

[0111] In an exemplary embodiment, if Figure 7 As shown in FIG. 1 , in addition to the display device EA2 further including a bracket BR, the display device EA2 can be the same as that described above with reference to FIG. Figure 2 The display devices EA described are essentially identical.

[0112] The bracket BR may be disposed under the display panel DP and may support the display panel DP. The bracket BR may include a material having a greater rigidity than that of the display panel DP. Figure 7 As shown in , a single bracket BR supports the entire area of ​​the display panel DP, but is not limited thereto. Alternatively, a plurality of brackets BR may be provided. The bracket BR may support a portion of the display panel DP.

[0113] The bracket BR may be divided into a front bracket FB, a side bracket LB, and a rear bracket RB. The front bracket FB, the side bracket LB, and the rear bracket RB may be integrally formed as a single unitary body.

[0114] The front bracket FB can support the front of the display panel DP (see Figure 3 The side bracket LB may support the first side, the second side, the third side and the fourth side of the display panel DP (see Figure 3 SP3, SP4, SP5 and SP6), and the rear bracket RB can support the pad portion of the display panel DP (see Figure 3 The rear bracket RB and the front bracket FB may face each other in the third direction DR3.

[0115] The rear bracket RB can also support the printed circuit board FPC.

[0116] The front bracket FB, the side bracket LB and the rear bracket RB may provide or define an inner space of the bracket BR. The inner space of the bracket BR may accommodate electronic components (such as a battery, a main printed circuit board or any type of sensor) that may be used for the operation of the display device EA2.

[0117] In an exemplary embodiment, although not shown, other members such as one or more of a heat radiation layer and a cushion layer may be provided between the bracket BR and the first protective member PT1.

[0118] In an exemplary embodiment, the bracket BR and the housing HS (see Figure 2 ) may be spaced apart from each other. Alternatively, the bracket BR and the housing HS may be connected to each other, or may be integrally formed as a single unitary body.

[0119] Figure 8 Shown along Figure 11 is a cross-sectional view taken along line II′ of FIG. 1 , which shows a display device according to another alternative exemplary embodiment of the present invention.

[0120] In addition to bracket BR1, Figure 8 The display device EA3 and Figure 7 The display device EA2 is basically the same.

[0121] In this embodiment, the bracket BR1 can be divided into a front bracket FB1 and a side bracket LB1. In an exemplary embodiment, for example, Figure 8 The bracket BR1 may have a structure that does not include Figure 7 The structure of the rear bracket RB of the bracket BR shown in FIG.

[0122] The front bracket FB1 can support the front of the display panel DP (see Figure 3 The side bracket LB1 may support the first side, the second side, the third side and the fourth side of the display panel DP (see Figure 3 In this embodiment, the front bracket FB1 and the side bracket LB1 may support the pad portion of the display panel DP (see Figure 3 The pad portion PP may be bent along the side support LB1 and the front support FB1.

[0123] The front bracket FB1 can also support the printed circuit board FPC.

[0124] In an exemplary embodiment, although not shown, other members such as one or more of a heat radiation layer and a cushion layer may be provided between the bracket BR1 and the first protective member PT1.

[0125] 9A to 9C A cross-sectional view illustrating a method of manufacturing a display device according to an exemplary embodiment of the present invention is shown.

[0126] For ease of description, reference will be made to 9A to 9C For setting or forming the above-mentioned reference on the display panel DP Figures 2 to 4 A process of describing the first protective member PT1 and the second protective member PT2 is described.

[0127] In an exemplary embodiment, a display panel DP is formed or prepared. The display panel DP may correspond to the above-mentioned Figure 3 The display panel is depicted in a cross-sectional view taken along line II-II'.

[0128] Reference Fig. 9A , a second protective member PT2 is disposed or formed on the pad portion PP including the pad PD of the display panel DP.

[0129] The second protective member PT2 may be formed by directly coating a curable material on one surface of the pad portion PP and then curing the curable material. The curable material may include, for example, a thermally curable material, a photocurable material, or a naturally curable material.

[0130] However, the present invention is not limited thereto, and in an alternative exemplary embodiment, a deposition process may be performed to form the second protection member PT2. In an exemplary embodiment, for example, a deposition material may be deposited on one surface of the display panel DP, and then a patterning process using an etching mask may be performed to form the second protection member PT2 overlapping the pad portion PP.

[0131] Reference Fig. 9B , a first protective member PT1 may be disposed or formed on the front SP1 and the second side SP4 of the display panel DP. The formation of the first protective member PT1 may include disposing or forming a first adhesive layer PSA1 on the front SP1 and the second side SP4, and then disposing or forming a first protective film PF1 on the first adhesive layer PSA1.

[0132] Then, refer to Fig. 9C , the pad PD and the printed circuit board FPC may be compressed to be bonded to each other.

[0133] Afterwards, if Figure 4 As shown in FIG. 1 , the anti-reflection layer RP may be disposed or formed on the display panel DP, and then the window member WM may be attached to the anti-reflection layer RP using an adhesive layer AD.

[0134] Fig. 10A and Fig. 10B A plan view illustrating a method of manufacturing a display device according to an exemplary embodiment of the present invention is shown.

[0135] Reference Fig. 10A , forming or preparing a mother substrate OG. The mother substrate OG may include a plurality of display panels DP-1 to DP-6 and a dummy area DMA. The dummy area DMA may be disposed between the display panels DP-1 to DP-6, and the dummy area DMA and the display panels DP-1 to DP-6 may be formed as a single unitary body. In this embodiment, the display panels DP-1 to DP-6 are cut from the mother substrate OG to form the mother substrate OG described above with reference to FIG. Figures 2 to 4 A display panel DP is described.

[0136] Each of the display panels DP-1 to DP-6 of the mother substrate OG may include a front portion, a side portion, and a pad portion.

[0137] On one surface of the mother substrate OG, a second protective member layer PTL2 is formed to overlap with a pad portion of each of the display panels DP-1 to DP-6. The second protective member layer PTL2 may include the same Figures 2 to 4 The material of the second protective member PT2 is substantially the same material as described.

[0138] Then, refer to Fig. 10B , forming a first protective member layer PTL1 on one surface of the mother substrate OG on which the second protective member layer PTL2 is formed, and thus overlapping the front and side portions of each of the display panels DP-1 to DP-6. The first protective member layer PTL1 may include the same Figures 2 to 4 The material of the first protective member PT1 described is substantially the same material.

[0139] Thereafter, the mother substrate OG is cut along the boundaries between the display panels DP-1 to DP-6, thereby forming a display device having the following structure: the first protection member PT1 and the second protection member PT2 are as described above with reference to FIG. Fig. 9A and Fig. 9B The ground is attached to the display panel DP.

[0140] According to an embodiment of a display device and a method of manufacturing the same according to the present invention, it may be possible to reduce stress generated when a display panel is bent.

[0141] In such an embodiment, it may also be possible to prevent a bonding defect between the printed circuit board and the pad of the display panel.

[0142] The present invention should not be construed as being limited to the exemplary embodiments set forth herein. Rather, these exemplary embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the inventive concept to those skilled in the art.

[0143] While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit or scope of the invention as defined by the following claims.

Claims

1. A display device, comprising: a display panel comprising a front portion, a first side portion extending from the front portion, and a pad portion extending from the first side portion, wherein a pad is located on the pad portion, the first side portion is bendable, and each of the front portion and the first side portion displays an image; a first protection member located below the display panel and overlapping the front portion and the first side portion; and a second protective member, located below the display panel and in direct contact with the display panel, wherein the second protective member partially overlaps the pad, Wherein, the first protection component comprises: a first protective film; and A first adhesive layer is located between the display panel and the first protective film. Wherein, when the display panel is in an unbent state, the front portion, the first side portion and the pad portion are sequentially arranged in one direction, wherein, when the display panel is in a bent state, the display panel is bent around a boundary between the front portion and the first side portion, and the first protective member overlapping the front portion and the first side portion is in a bent state, Wherein, the display device further includes: a second protective film, located on the second protective member; and a second adhesive layer located between the second protective member and the second protective film, and The second protective film includes a material that is the same as that of the first protective film, and the second adhesive layer includes a material that is the same as that of the first adhesive layer.

2. The display device according to claim 1, wherein: The first protection member and the second protection member are spaced apart from each other.

3. The display device according to claim 1, wherein: The first protection member and the second protection member include materials different from each other.

4. The display device according to claim 1, wherein: When the display panel is in an unbent state, the second protective member is disposed in the same layer as the first protective member.

5. The display device according to claim 1, wherein: The second protective member includes a radical polymerization type pressure sensitive adhesive or a cation polymerization type pressure sensitive adhesive, and The free radical polymerization type pressure sensitive adhesive or the cationic polymerization type pressure sensitive adhesive comprises an oligomer, a monomer, a photopolymerization initiator and an additive.

6. The display device according to claim 1, wherein: When the display panel is in an unbent state, the first protection member does not overlap the pad.

7. The display device according to claim 1, wherein: The second protective member has a bending rigidity greater than that of the first protective member.

8. The display device according to claim 1, wherein: The first adhesive layer has a modulus in a range from 20 kPa to 45 kPa.

9. The display device according to claim 1, wherein: When viewed in plan, the front portion has a rectangular shape, The first side portion extends from a first side of the front portion, and The display panel further includes a second side portion, a third side portion, and a fourth side portion extending from the second side, the third side, and the fourth side of the front portion, respectively, wherein the second side portion to the fourth side portion are bendable.

10. The display device according to claim 1, further comprising: A flexible printed circuit board is attached to the pads.

11. The display device according to claim 1, further comprising: The bracket is located below the display panel and supports the display panel.

12. The display device according to claim 1, further comprising: A window member is located on the display panel and covers the front portion and the first side portion.

Citation Information

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