Processor replacement kit for test systems

Abstract

An exemplary system includes: a container for containing a device under test (DUT); an antenna for exchanging signals with the DUT, wherein at least some of the signals are used to perform radiation testing of the DUT; and a cover configured to cooperate with the container to form a housing for enclosing the DUT. The housing is used to isolate the DUT at least physically or electromagnetically.

Description

Technical Field

[0001] The present specification generally relates to a processor replacement kit for a test system such as automatic test equipment (ATE). Background Art

[0002] A test system such as ATE can be configured to perform conduction testing on an electronic device such as a computer chip. In an example, a device interface board (DIB) includes customer-specific hardware that interfaces with the test system. The DIB may include a plurality of sockets, each of which may hold a separate electronic device and enable the test system to send signals to and receive signals from the electronic device. The signals may be used to test the operation of the electronic device and for other suitable purposes. Testing performed in this manner may be referred to as conduction testing because the connection between the electronic device and the DIB is a conductive connection (e.g., the connection may be metal to metal), thereby enabling the signal to flow between the test system and the electronic device via the DIB.

[0003] In contrast to conducted testing, radiated testing involves testing using wirelessly transmitted signals. For example, radiated testing can be used to test the operation of a radio frequency (RF) antenna, microwave antenna, or other type of antenna on an electronic device. Radiated testing can also be used appropriately to test components of an electronic device other than an antenna. Summary of the invention

[0004] An exemplary system includes: a container for containing a device under test (DUT); an antenna for exchanging signals with the DUT, wherein at least some of the signals are used to perform radiation testing of the DUT; and a cover configured to cooperate with the container to form a housing for enclosing the DUT. The housing is used to isolate the DUT at least one of physically or electromagnetically. The exemplary system may include one or more of the following features (alone or in combination).

[0005] The system may be configured to be connected to a device interface board (DIB) of a test system. The DIB may include a socket for receiving the DUT. The DIB may include one or more other sockets for receiving one or more other DUTs. The housing may be used to isolate the DUT from the one or more other DUTs. The DIB may include a conventional DIB, which may also be configured to be used in the absence of the housing and outside the environment of radiation testing. The housing may be used to physically and electromagnetically isolate the DUT from one or more of the following: other DUTs, dielectric materials, metallic materials, magnetic materials, or electromagnetic signals.

[0006] The cover may include a plunger that can move within the container to apply pressure to the DUT, thereby connecting the DUT to a test socket. The system may be configured to be connected to a test system that includes a socket for receiving the DUT. The antenna may be arranged to one side of the socket. The antenna may include a plurality of antennas. Each of the plurality of antennas may be arranged to one side of the socket. The antenna may be arranged below at least one of the DUT or the DIB. The socket may be part of the DIB. The antenna may be located below the DUT. The antenna may be located below the DIB. The antenna may be part of the DIB.

[0007] The DUT may have a surface including an electrical connector. The cover may include a plunger configured to hold the DUT by the surface including the electrical connector and to mount the DUT so that the electrical connector faces away from the socket. The system may include one or more electrical conduits to connect to the electrical connector. The system may be configured to connect to a test system including a socket for receiving the DUT.

[0008] The cover may include a plunger to contact the DUT. The antenna may be arranged in the plunger. The plunger may be located directly above the socket and may be configured to move relative to the socket within the container. The plunger may include a material having one or more electrical properties. The one or more electrical properties may include a range of dielectric constant, magnetic permeability, or electrical conductivity. The material may at least partially include polyetheretherketone (PEEK). The plunger may have a plurality of holes along at least a portion of the longitudinal dimension of the plunger. The plunger may have a single hole along at least a portion of the longitudinal dimension of the plunger. The plunger may be hollow along at least a portion of the longitudinal dimension of the plunger. The plunger may include a vacuum channel for holding the DUT via suction during transport to the container.

[0009] The interior of the housing may be at least partially lined with a material for suppressing echoes. The housing may be configured to accommodate the DUT and at least one other DUT. The DUT may be electromagnetically isolated from the at least one other DUT by signals having different frequency bands. The signals exchanged with the DUT may be in a first frequency band, the signals exchanged with the at least one other DUT may be in at least one second frequency band, and the first frequency band may be different from the at least one second frequency band.

[0010] The system may be part of a processor replacement kit configured as a DIB connected to a test system. The DIB may include test sockets configured to perform non-radiated tests. The processor replacement kit may be used to adjust at least one of the test sockets to perform radiated tests on the DUT.

[0011] An exemplary system includes a DIB for interfacing to a test system, wherein the DIB includes a socket, each of the sockets being used to receive a DUT. The exemplary system also includes: a socket, each of the sockets being used for a different one of the sockets; and an antenna, each of the antennas being associated with a different one of the sockets. Each antenna is used to exchange signals with a DUT in the socket. At least some of the signals are used to perform radiation testing of the DUT in the socket. The exemplary system includes a cover, the cover being configured to cooperate with the container to form a separate housing for and enclose each of the DUTs. Each separate housing isolates the DUT enclosed in the housing at least one of physically or electromagnetically. The exemplary system may include one or more of the following features (alone or in combination).

[0012] The cover may include one or more plungers, each of the one or more plungers being used to hold the DUT in the separate socket and contact the DUT. For the housing in the separate housing, the antenna in the antenna may be located on one side of the socket on the DIB. For the housing in the separate housing, the antenna in the antenna may be located below the DUT on the DIB. For the housing in the separate housing, the antenna in the antenna may be located directly above the socket on the DIB.

[0013] The cover may include a plunger for each individual housing. The plunger may have a plurality of holes along at least a portion of the longitudinal dimension of the plunger. The plunger may have a single hole along at least a portion of the longitudinal dimension of the plunger. The plunger may be hollow along at least a portion of the longitudinal dimension of the plunger. Each individual housing may be used to isolate a DUT enclosed in the housing from other DUTs in other housings in the housing, at least physically or electromagnetically. The system may be part of a replacement kit configured to adjust the socket of the DIB to perform radiated testing on the DUT.

[0014] Any two or more of the features described in this specification (including this Summary) may be combined to form implementations not specifically described herein.

[0015] The systems and techniques described herein, or portions thereof, may be implemented using and / or controlled by a computer program product that includes instructions stored on one or more non-transitory machine-readable storage media and that are executable on one or more processing devices to control (e.g., coordinate) the operations described herein. The systems and techniques described herein, or portions thereof, may be implemented as an apparatus, method, or electronic system that may include one or more processing devices and a memory storing executable instructions for implementing various operations.

[0016] The details of one or more implementations are set forth in the accompanying drawings and the following detailed description. Other features, structures, objects, and advantages will be apparent from the detailed description and drawings, and from the claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Depend on Figure 1A and Figure 1B Composition Figure 1 A side view and a cut-away perspective view of an exemplary processor replacement kit are shown.

[0018] Figure 2 An exploded perspective view of an exemplary processor replacement kit is shown.

[0019] Figure 3A , Figure 3B and Figure 3C An example plunger configuration for use with an example processor replacement kit is shown in a transparent perspective view.

[0020] Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 Components of an exemplary processor replacement kit with different antenna configurations are shown in transparent perspective.

[0021] Fig. 9 Components of an exemplary processor replacement kit including multiple housings are shown in a transparent perspective view.

[0022] Like reference numbers in different drawings indicate similar elements. DETAILED DESCRIPTION

[0023] This article describes an exemplary implementation of a processor replacement kit for a test system such as an automatic test equipment (ATE). The processor replacement kit can be configured for use with a DIB or other appropriate test system hardware. In an example, the DIB can be constructed to support conductive testing of electronic devices such as computer chips. For example, the DIB can include multiple sockets, each socket for holding an electronic device to be tested. In an example, the socket includes a compliant contact and a mechanical guide for a device under test (DUT), and the compliant contact provides a direct electrical connection to the contacts on the bottom of the DUT to provide power and control. The DIB may also include interface hardware, vias, and other appropriate circuits to form an electrical interface between the electronic device and the basic test system. Signals can be transmitted between the test system and the electronic device, so that the test system can test the electronic device.

[0024] The processor replacement kit configures the DIB (which may be configured to support only conducted testing) to also support radiated testing. For example, all or part of the processor replacement kit may be installed on the DIB, in some implementations above its socket, to configure the DIB to support radiated testing. Thus, using the processor replacement kit, a conventional DIB (which may be configured to perform only conducted testing) may also be adapted to perform radiated testing. The same DIB may be used to perform both conducted and radiated testing. This may save testing time (e.g., without having to shut down the DIB) and cost when performing the tests.

[0025] In some specific implementations, the processor replacement kit is a system including a container for accommodating a DUT. For example, as described herein, the container may be placed above a socket on a DIB. The cover is configured to cooperate with the container to form a housing for encapsulating the DUT. The housing is used to isolate the DUT physically or electromagnetically. For example, the DUT may be physically, electromagnetically, or physically and electromagnetically isolated from one or more of the following items: other DUTs, dielectric materials, metallic materials, magnetic materials, or stray wireless electromagnetic signals. The housing is also configured to limit signals (including wireless electromagnetic signals for radiation testing of the DUT) in whole or in part. One or more antennas are included near the housing for exchanging such signals with the DUT in order to perform radiation testing of the DUT. For example, the antenna may be located inside the housing.

[0026] In an example, the test site includes a combination of all the processor replacement kit hardware based on the DUT, for example, the test site includes a housing, a cover, and a plunger. The test site also includes a socket on the DIB under the processor replacement kit.

[0027] Figure 1 and Figure 2 An exemplary implementation of a processor replacement kit is shown. Not all components are shown in these two figures. Component 10 includes, but is not limited to, a container 11, a cover 12, a plunger 14 that may be part of the cover, and one or more antennas 13. As previously described, the container can cooperate with the DIB 23 and completely or partially enclose a test socket 20 on the DIB, which is also configured to perform non-radiation testing of electronic devices. In some implementations, the container 11 surrounds the socket and has only an opening at its top to receive the plunger and cover. The cover 12 can move relative to the container 11. Specifically, the cover 12 can move above the container 11 and contact the container. When in contact, the cover 12 cooperates with the container 11 to form a housing that encloses the socket 20 and therefore the DUT in the socket 20.

[0028] The exemplary cover 12 includes a pick-up element such as a plunger 14. In this example, the plunger 14 includes an arm 15 and a suction cup 16; however, the pick-up element may include any suitable components. In operation, the plunger 14 retrieves the DUT 19 and moves the DUT to a socket 20 on a DIB 23 enclosed by the container 11. Any suitable robot or robotic system (e.g., a pick-and-place robot) may be used to hold and move the cover and plunger combination. For example, the robot may move the cover and plunger combination so that the suction cup 16 contacts the device under test (DUT). Figure 1 and Figure 2 As shown, the vacuum under the suction cup causes the DUT to adhere to the suction cup. Therefore, when the cover and plunger combination moves, the DUT remains adhered to the suction cup.

[0029] The cover and plunger combination are moved to a suitable position so that the DUT is located above the socket 20 and so that the cover 12 is located above the container 11. The cover and plunger combination moves toward the socket and the container until the cover contacts the container and the DUT contacts the socket. For example, the cover 12 may first contact the container to form a housing. In this case, the plunger 14 may be moved downward within the cover 12 and through the cover until the DUT is fixed in place in the socket. In some specific implementations, the DUT is held tightly enough in the socket to allow the plunger to separate from the DUT without the DUT separating from the socket. In some specific implementations, the plunger remains in contact with the DUT during testing and is configured to separate the DUT from the socket after testing so as to remove the DUT from the socket.

[0030] In some implementations, the DUT is electrically connected to the electrical contacts in the socket 20. Conductive testing can be performed via those connections. Therefore, the DUT can be subjected to both conductive testing and radiated testing at the same time. In some implementations, the DIB is a conventional DIB, which can also be configured for use in the absence of a housing and outside the environment of radiated testing. As described above, the DIB can be used to perform conductive testing on the DUT, and can be configured to also perform radiated testing on the DUT using the processor replacement kit described herein.

[0031] The housing at least partially defines the volume surrounding the DUT. That is, in some specific implementations, the housing does not contact the DUT, but defines a chamber 25 that encloses the DUT. The chamber limits the wireless electromagnetic signal in whole or in part to its interior. As described herein, these signals are used to perform radiation testing on the DUT. In some specific implementations, the chamber is at least partially anechoic. For example, the inner wall of the chamber (e.g., the interior of the housing, including the lower side 24 of the cover 12) may be lined with one or more suitable materials to suppress (e.g., eliminate or reduce) the echo of the wireless electromagnetic signal in the chamber. Any suitable material can be used to suppress the echo. Examples of such materials include, but are not limited to, carbon-loaded air-based foam, carbon-loaded rubber, and magnetic-loaded materials. In some specific implementations, the housing may be sealed to reduce signal loss or reduce signal interference in the chamber. In some specific implementations, the housing may be shielded from electromagnetic (EM) interference. In some specific implementations, the housing prevents EM signals from entering the housing or prevents EM signals from leaving the housing. In some specific implementations, the housing may also be airtight. Thus, the housing may isolate the corresponding DUT physically, electromagnetically, or both physically and electromagnetically.

[0032] In some embodiments, the housing (including at least the container and the cover in some embodiments) may be made of metal; however, the system is not limited to the use of a metal housing. Any suitable type of metal or other material may be used. In some embodiments, the plunger 14 is made of a non-conductive material in whole or in part. In some embodiments, at least the portion of the plunger 14 extending into the chamber 25 is made of a non-conductive material to reduce interference with the signal in the chamber. In some embodiments, the plunger includes a material having one or more electrical properties within an appropriate range to reduce signal interference. Such electrical properties include, but are not limited to, a dielectric constant, a magnetic permeability, a conductivity, or a combination of a dielectric constant, a magnetic permeability, and / or a conductivity. In some embodiments, the plunger may be made of or at least partially include polyetheretherketone (PEEK). However, the plunger is not limited to a composition comprising PEEK; any suitable material may be used to implement the plunger.

[0033] In some implementations, the amount of material in the plunger can be reduced, thereby reducing the amount of material other than air in the chamber. This reduction in material can improve signal integrity in the chamber by reducing signal interference. Figure 3A , Figure 3B and Figure 3C Examples of different plunger configurations are shown in . However, the system is not limited to use with plungers having these configurations; any suitable plunger configuration may be used. Figure 3A , Figure 3B and Figure 3CIn each of the Figures, the cover 12 includes a plunger to contact the DUT, as described herein. The plunger can pass through the cover 12 and move relative to the cover to apply pressure to the DUT or separate the DUT from the socket, while, for example, the cover remains in contact with the container 11 to form a housing. Figure 3A In the example of FIG. 1 , the plunger 14A has a plurality of holes along all or part of the longitudinal dimension of the plunger. In this case, the longitudinal dimension is indicated by arrow 26. Figure 3B In the example of FIG. 1 , the plunger 14B has a single hole along all or part of the longitudinal dimension of the plunger. Figure 3C In the example of , plunger 14C is hollow along all or part of the longitudinal dimension of the plunger. Figure 3C In some embodiments, the structural portion of the plunger can be thick enough to support the pressure required to hold the DUT, force the DUT to contact at the socket, and remove the DUT from the socket. In some embodiments, the top of the plunger is covered so that the hole does not expose the interior of the housing (chamber 25) to the external environment, but this is not required.

[0034] The processor replacement kit can configure the DIB to test the DUT with a downward contact configuration or an upward contact configuration. In this regard, the exemplary DUT has electrical contacts on one surface for electrical connection with corresponding electrical contacts on the DIB or other devices. The opposite surface of the DUT generally includes a package and does not contain electrical contacts. In some specific implementations, the plunger may contact the surface containing the package so that the contacts face down or face away from the suction cup and can engage with corresponding electrical contacts on the socket of the DIB. In some specific implementations, the plunger may contact the surface containing the contacts so that the contacts face up or face the suction cup. In this case, the plunger (e.g., the suction cup of the plunger) may contact the portion of the DUT that does not contain contacts. Because the contacts are facing up, when the DUT is placed in the socket, a POP type socket can be used to achieve connection, which provides contacts on the socket side of the DUT. With these types of sockets, the bottom socket contacts the DIB, the top socket has a connection formed by the bottom socket with the DIB and establishes a connection on the side of the DUT away from the DIB when the cover is closed. In some implementations, this type of socket takes the connection from the DIB and passes the connection to the cover and then to the DUT.

[0035] Wireless electromagnetic signals are introduced into the chamber 25 via one or more test antennas, which may be located at a suitable position inside or outside the chamber. The wireless electromagnetic signals emitted from these test antennas can be used to test the antenna on the DUT or any other suitable circuit on the DUT. For example, the signal sent from one or more test antennas may be received by one or more DUT antennas. Then, responses to these signals may be sent from the DUT via the antenna of the DUT or via the electrical contacts on the test socket. In any case, the test system or test instrument may analyze these responses to determine whether the DUT antenna is operating normally, whether the DUT is operating normally, whether certain parameters of the DUT are within an acceptable range, etc. The test antenna may be a part of a processor replacement kit and may be combined at various positions above, on, in, or below the DUT or DIB. Any suitable number of test antennas may be used.

[0036] Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 An example of components of a processor replacement kit 30 is shown, which may be Figure 1 and Figure 2 The processor replacement kit 30 includes a cover 31 and a plunger 32 located above a DIB 33. Portions of the container are omitted in these figures. Each of the antennas can establish a wired or wireless connection with the test instrument.

[0037] Reference Figure 4 In some implementations, one or more test antennas 38 may be located within the DIB. Figure 5 In some implementations, one or more test antennas 38 may be located below the DIB. In this example, the antennas are located in the test instrument; however, this is not required. Figure 6 In some implementations, one or more test antennas 38 may be located below the DUT (at Figure 6 , located below a socket 39 configured to receive and hold a DUT). For example, the DUT may mate with the socket 39 on the DIB, and the test antenna may be located at any suitable location below the DUT. Figure 7 In some implementations, one or more test antennas 38 may be located on either side of the DUT or the plunger. Figure 7 As shown, the processor replacement kit may include two test antennas. One of the two test antennas may be located on one side of the DUT / test socket, and the other of the two test antennas may be located on another side of the DUT / test socket, for example, an opposite side or an adjacent side. Figure 8In some implementations, one or more test antennas 38 may be located within the plunger. For example, the test antennas within the plunger may be configured to withstand and operate with the movement of the plunger as it is used. In some implementations, each antenna is a low gain antenna positioned close to the DUT to reduce chamber size. The processor replacement kit is not limited to the antenna locations or number of antennas mentioned; any suitable location or number may be used.

[0038] Although a single processor replacement kit for a DIB test socket has been described, the DIB may include one or more other sockets to accommodate one or more other DUTs. Each DIB test socket may suitably accommodate a separate processor replacement kit of the type described herein. As described herein, each processor replacement kit may physically, electromagnetically, or physically and electromagnetically isolate a corresponding DUT.

[0039] In some specific implementations, such as Figure 2 A single chamber of chamber 25 may enclose two or more test sockets. In these examples, multiple plungers may be used in one or more covers to mount the DUTs into the sockets. In these exemplary systems, the isolation is not physical, but electromagnetic. For example, signals may be exchanged with one DUT in a first frequency band, and signals may be exchanged with at least one other DUT in at least one second frequency band different from the first frequency band. Thus, by using signals in different frequency bands, the DUTs in a single chamber are electromagnetically isolated from each other. That is, one DUT may only recognize signals in one frequency band, while another DUT may only recognize signals in a different frequency band. In this way, electromagnetic testing may be performed on different DUTs in the same chamber.

[0040] In some specific implementations, the processor replacement kit is part of a system that includes a DIB for interfacing with a test system (such as an ATE). The DIB includes a plurality of sockets, each of which is used to receive a DUT. The system includes a plurality of sockets, each of which is used for a different one of the sockets. The system includes an antenna. Each of the antennas is associated with a different one of the sockets, and each socket may include more than one antenna. Each antenna is used to exchange signals with a DUT in the socket. As described herein, at least some of the signals are used to perform radiation (i.e., non-conducted) testing on the DUT in the socket. One or more covers (e.g., a single cover) are configured to cooperate with the socket to form a separate housing for and enclose each of the DUTs. The cover may include one or more plungers, such as one plunger for each container. Multiple plungers may be actuated using different actuation mechanisms or using a single actuation mechanism. As described herein, each separate housing isolates the DUT enclosed in the housing in at least one of physical or electromagnetic grounds. Fig. 9An exemplary processor replacement kit 40 of the type described above is shown. The processor replacement kit may include any suitable features described herein, including with respect to Figures 1 to 8 Those features described above.

[0041] exist Fig. 9 In the example of , the processor replacement kit 40 includes containers 45 and 46, which individually and separately enclose multiple test sockets 42 and 43 of the DIB 47. As shown, the container can be a single continuous structure or a plurality of separate containers. Although two test sockets are shown, any appropriate number of test sockets can be enclosed. The processor replacement kit 40 includes covers 60 and 61, which, when mated with the sockets 45 and 46 in this example, respectively form two separate housings that can physically and electromagnetically isolate the DUTs contained therein. Each housing can appropriately have any of the features of the housings described herein, such as a housing including a container 11 and a cover 12. In this example, the cover 60 includes a plunger 51, and the cover 61 includes a plunger 52, each of which is used to hold a DUT and place the DUT in a corresponding test socket on the DIB, as described herein. Each plunger can have the same or different configurations. Exemplary configurations of the plungers include, but are not limited to Figure 3A , Figure 3B and Figure 3C Those configurations shown in .

[0042] As described above, placement of the DUT in the DIB socket may be contacts down or contacts up. The plungers may be actuated individually or synchronously as appropriate. As described herein, each housing formed by the contact between the cover and the lid may include one or more antennas. Each housing may have antennas placed in the same configuration or in different configurations. Exemplary antenna configurations include, but are not limited to Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 For example, in each housing, each antenna can be located on one side of a socket on the DIB, or the antenna can be located below the DUT, below the DIB, above the DUT, above the DIB, within the DIB, or any other suitable location inside or outside the housing. As described herein, each plunger can have multiple holes, a single hole, or be hollow along at least a portion of the longitudinal dimension of the plunger. Each housing is used to isolate the DUT enclosed in the housing from other DUTs in other housings in the housing, either physically or electromagnetically.

[0043] The exemplary test systems described herein may be implemented using and / or controlled by one or more computer systems including hardware or a combination of hardware and software. For example, a system for testing a DUT may include various controllers and / or processing devices located at various points in the system to control the operation of automation elements. A central computer may coordinate operations in various controllers or processing devices. The central computer, controllers, and processing devices may execute various software routines to achieve control and coordination of various automation elements.

[0044] The exemplary systems described herein may be controlled at least in part using one or more computer program products, e.g., one or more computer programs tangibly embodied in one or more information carriers (such as one or more non-transitory machine-readable media) for execution by or to control the operation of one or more data processing devices, e.g., a programmable processor, a computer, multiple computers, and / or a programmable logic component.

[0045] A computer program may be written in any form of programming language, including compiled or interpreted languages, and may be deployed in any form, including as a stand-alone program or as a module, component, subroutine, or other unit suitable for use in a computing environment. A computer program may be deployed to execute on one computer or on multiple computers at one socket or distributed across multiple sockets and interconnected by a network.

[0046] The actions associated with implementing all or part of the test may be performed by one or more programmable processors that execute one or more computer programs to perform some of the functions described herein. All or part of the test may be implemented using dedicated logic circuits such as FPGAs (field programmable gate arrays) and / or ASICs (application specific integrated circuits).

[0047] Processors suitable for computer program execution include, for example, both general and special purpose microprocessors, and any one or more processors of any kind of digital computer. Typically, the processor will receive instructions and data from a read-only storage area or a random access storage area or both. Elements of a computer (including a server) include one or more processors for executing instructions and one or more storage area devices for storing instructions and data. Typically, a computer will also include (or be operatively coupled to receive data from it or transmit data to it or both) one or more machine-readable storage media, such as a mass storage device for storing data, for example, a magnetic disk, a magneto-optical disk, or an optical disk. Machine-readable storage media suitable for embodying computer program instructions and data include all forms of non-volatile storage areas, including, by way of example, semiconductor storage area devices, such as EPROM, EEPROM, and flash storage area devices; magnetic disks, such as internal hard disks or removable disks; magneto-optical disks; and CD-ROM and DVD-ROM disks.

[0048] As used herein, any "electrical connection" may imply a direct physical connection, or a wired or wireless connection that may or may not include intermediate components but still allows electrical signals to flow between the connected components. Unless otherwise specified, any "connection" involving a circuit that allows signal flow is an electrical connection, not necessarily a direct physical connection, regardless of whether the term "connection" is modified by "electrical".

[0049] The elements of different specific implementations described herein can be combined together to form other embodiments that are not specifically illustrated above. Multiple elements can be excluded from the structure described herein without adversely affecting its operation. In addition, each individual element can be combined into one or more single elements to carry out the function described herein.

Claims

1. A system for testing a device under test (DUT), the system comprising: a container for accommodating the DUT, the container comprising walls configured to be placed over and around a socket holding the DUT, the socket being part of a device interface board (DIB) of a test system separate from the container; an antenna in the container, the antenna being used to exchange signals with the DUT, at least some of the signals being used to perform radiated testing of the DUT; and a cover configured to cooperate with the container to form a housing for enclosing the DUT, the housing including the container, separate from the socket and used to isolate the DUT at least one of physically or electromagnetically; Wherein the DIB is initially configured to support conducted testing of the DUT but not radiated testing, and wherein the system is capable of being installed on the DIB to reconfigure the DIB to support both radiated testing and conducted testing of the DUT.

2. The system of claim 1 , wherein the system is configured to be connected to the DIB, the DIB comprising one or more other sockets for receiving one or more other DUTs, the housing being used to isolate the DUT from the one or more other DUTs.

3. The system of claim 2, wherein the DIB comprises a conventional DIB that is also configurable for use in the absence of the housing and outside of the environment of radiation testing.

4. The system of claim 1, wherein the housing is used to physically and electromagnetically isolate the DUT from one or more of: other DUTs, dielectric materials, or metallic materials.

5. The system of claim 1, wherein the cover includes a plunger movable within the container to apply pressure to the DUT to connect the DUT to the socket.

6. The system according to claim 1, Wherein the antenna is arranged to one side of the socket.

7. The system according to claim 1, The antenna includes a plurality of antennas, and each of the plurality of antennas is arranged at one side of the socket.

8. The system according to claim 1, Wherein the antenna is arranged below at least one of the DUT or the DIB.

9. The system of claim 8, wherein the antenna is located below the DUT.

10. The system of claim 8, wherein the antenna is located below the DIB.

11. The system of claim 8, wherein the antenna is part of the DIB.

12. The system of claim 8, wherein the DUT has a surface including electrical connectors, the cover includes a plunger configured to retain the DUT by the surface including the electrical connectors and to mount the DUT such that the electrical connectors face away from the socket; and The system may include one or more electrical conduits to connect to the electrical connector.

13. The system according to claim 1, wherein the cover includes a plunger to contact the DUT; and Wherein the antenna is arranged within the plunger.

14. The system of claim 13, wherein the plunger is located directly above the socket and is configured to move relative to the socket within the container.

15. The system of claim 1, wherein the cover comprises a plunger to contact the DUT; and The plunger comprises a material having one or more electrical properties.

16. The system of claim 15, wherein the one or more electrical properties include a range of dielectric constant, magnetic permeability, or electrical conductivity.

17. The system of claim 15, wherein the material at least partially comprises polyetheretherketone (PEEK).

18. The system of claim 1, wherein the cover comprises a plunger to contact the DUT; and Wherein the plunger has a plurality of holes along at least a portion of a longitudinal dimension of the plunger.

19. The system of claim 1, wherein the cover comprises a plunger to contact the DUT; and Wherein the plunger has a single aperture along at least a portion of a longitudinal dimension of the plunger.

20. The system of claim 1, wherein the cover comprises a plunger to contact the DUT; and Wherein the plunger is hollow along at least a portion of a longitudinal dimension of the plunger.

21. The system of claim 1, wherein an interior of the housing is at least partially lined with a material for suppressing echoes.

22. The system of claim 1, wherein the cap comprises a plunger including a vacuum channel for holding the DUT via suction during transport to the container.

23. The system of claim 1, wherein the housing is configured to house the DUT and at least one other DUT, the DUT being electromagnetically isolated from the at least one other DUT by signals having different frequency bands.

24. The system of claim 23, wherein the signals exchanged with the DUT are in a first frequency band, the signals exchanged with the at least one other DUT are in at least one second frequency band, and the first frequency band is different from the at least one second frequency band.

25. The system of claim 1, wherein the system is part of a replacement kit configured to connect to the DIB, the DIB including test sockets configured to perform non-radiated testing, the replacement kit being used to adjust at least one of the test sockets to perform radiated testing on the DUT.

26. A system for testing a device under test (DUT), the system comprising: A device interface board DIB, the DIB is used to be handed over to the test system, the DIB includes sockets, each of the sockets is used to receive a device under test DUT, wherein the DIB is configured to implement a conducted test of each DUT and a radiated test of each DUT; a container, each of the containers being for a different one of the sockets, each container comprising a wall configured to be placed over and around a different one of the sockets, each container being separate from the different one of the sockets; antennas within respective receptacles, each of said antennas being associated with said different one of said receptacles, each antenna being operable to exchange signals with a DUT in said receptacle, at least some of said signals being operable to perform radiated testing of said DUT in said receptacle; and a cover configured to cooperate with the container to form an individual housing for and enclose each of the DUTs, each individual housing at least one of physically and electromagnetically isolating the DUT enclosed in the housing; Wherein the DIB is initially configured to support conducted testing of the DUT but not radiated testing, and wherein the container, the antenna, and the cover can be installed on the DIB to reconfigure the DIB to also support both radiated testing and conducted testing of the DUT.

27. The system of claim 26, wherein the cover comprises one or more plungers, each of the one or more plungers being used to hold a DUT in an individual socket and to contact the DUT.

28. The system of claim 26, wherein for a housing in the separate housing, an antenna in the antenna is located on one side of a socket on the DIB.

29. The system of claim 26, wherein for a housing in the separate housings, an antenna in the antennas is located below a DUT on the DIB.

30. The system of claim 26, wherein for a housing in the separate housing, an antenna in the antenna is located directly above a socket on the DIB.

31. The system of claim 26, wherein the cover includes a plunger for each individual housing, the plunger having a plurality of holes along at least a portion of a longitudinal dimension of the plunger.

32. The system of claim 26, wherein the cover includes a plunger for each individual housing, the plunger having a single aperture along at least a portion of a longitudinal dimension of the plunger.

33. The system of claim 26, wherein the cover includes a plunger for each individual housing, the plunger being hollow along at least a portion of a longitudinal dimension of the plunger.

34. The system of claim 26, wherein each individual housing is configured to at least one of physically or electromagnetically isolate a DUT enclosed in the housing from other DUTs in other of the housings.

35. The system of claim 26, wherein the system is part of a replacement kit configured to adjust the socket of the DIB to perform radiated testing on the DUT.

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