A continuous purification device for plating solution

By designing a continuous purification device for the plating solution, and using filtration, dosing adjustment, electrolysis of impurities and activated carbon adsorption systems, the problem that the plating solution purification equipment in the prior art cannot achieve continuous purification, and the purity and production efficiency of the plating solution are improved.

CN112160017BActive Publication Date: 2025-04-18JIANGSU JIUTIAN PHOTOELECTRIC TECH CO LTD
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Patent Information

Application Number
CN202011142310.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2020-10-23
Publication Date
2025-04-18
Estimated Expiration
2040-10-23

AI Technical Summary

Technical Problem

In the prior art, the plating solution purification equipment cannot achieve continuous purification treatment, which makes it difficult to ensure the purity of the plating solution, and requires intermittent production suspension for purification, which affects production efficiency.

Method used

A continuous purification device for plating solution is designed, including a plating solution storage tank, dosing tank, electrolytic tank, primary activated carbon adsorption tank and secondary activated carbon adsorption tank. The continuous purification of the plating solution is achieved through filtration, dosing adjustment, electrolysis and activated carbon adsorption systems.

Benefits of technology

The stability and continuous purification of the plating solution are achieved, the purity of the plating solution is improved, the production stoppage of the electroplating process is avoided, and the production efficiency is improved.

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Abstract

The invention discloses a plating solution continuous purification device, comprising a plating solution storage tank, a dosing tank, an electrolytic tank, a primary activated carbon adsorption tank and a secondary activated carbon adsorption tank; a first liquid inlet is arranged on the side wall of the dosing tank, the first liquid inlet is connected to the plating solution storage tank through an inflow pipe, and a filtering device is arranged on the inflow pipe; an electrode group for electrolytic removal of impurities is arranged in the electrolytic tank; a first overflow port is arranged on the side wall of the secondary activated carbon adsorption tank, and the first overflow port is connected to the plating solution storage tank through an outflow pipe. The invention effectively improves the purity of the plating solution, avoids stopping the electroplating process during the purification of the plating solution and causing production delays, thereby improving production efficiency.
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Description

Technical Field

[0001] The invention relates to the field of electroplating equipment, and in particular to a continuous purification device for plating solution. Background Art

[0002] As a branch of the electroplating industry, high-speed plate electroplating has gradually occupied an important position with its advantages of high line speed, high production capacity and low cost. High-speed electroplating usually requires the use of storage tanks and plating tanks to circulate each other to achieve continuous electroplating solution circulation, while traditional rack plating and roller plating only require plating tanks for electroplating operations. However, both continuous electroplating and roller-mounted plating require purification of the plating solution. The purification of traditional roller-mounted plating solutions is usually an intermittent operation, using the production stoppage gap to filter, electrolyze, and adsorb activated carbon on the solution in the plating tank. Summary of the invention

[0003] The purpose of the present invention is to provide a continuous plating solution purification device to solve the problem that the plating solution purification equipment in the prior art cannot continuously purify the plating solution.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0005] The present invention discloses a continuous plating solution purification device, comprising a plating solution storage tank, a dosing tank, an electrolytic tank, a primary activated carbon adsorption tank and a secondary activated carbon adsorption tank;

[0006] The dosing tank, electrolytic tank, primary activated carbon adsorption tank and secondary activated carbon adsorption tank are connected in sequence according to the purification process, and their height is higher than the plating solution storage tank;

[0007] A first liquid inlet is provided on the side wall of the dosing tank, the first liquid inlet is connected to the plating solution storage tank through an inflow pipe, and a filtering device is provided on the inflow pipe;

[0008] The electrolytic cell is provided with an electrode group for electrolytic removal of impurities;

[0009] A first overflow port is arranged on the side wall of the secondary activated carbon adsorption tank, and the first overflow port is connected with the plating solution storage tank through an outflow pipe.

[0010] Furthermore, the dosing tank, electrolytic tank, primary activated carbon adsorption tank and secondary activated carbon adsorption tank are arranged as an integrated structure;

[0011] A second liquid inlet is provided at the bottom of the partition between the dosing tank and the electrolytic tank;

[0012] A second overflow port is provided on the top of the partition between the electrolytic cell and the primary activated carbon adsorption tank;

[0013] A third liquid inlet is provided at the bottom of the partition between the primary activated carbon adsorption tank and the secondary activated carbon adsorption tank.

[0014] Furthermore, the electrode group includes a nickel plate as an anode plate and an iron plate as a cathode plate.

[0015] Furthermore, the plating solution storage tank is configured as an underground tank.

[0016] Furthermore, the plating solution storage tank, the dosing tank, the electrolytic tank, the primary activated carbon adsorption tank and the secondary activated carbon adsorption tank are all welded by PP plates.

[0017] Furthermore, a Ph electrode probe is provided in the plating solution storage tank.

[0018] Compared with the prior art, the beneficial technical effects of the present invention are:

[0019] The present invention discloses an automatic regulating and continuous purification device for plating solution. The plating solution is lifted from a storage tank to a dosing tank, an electrolytic tank and an activated carbon adsorption tank through a filtering device, so that the plating solution is filtered, regulated by dosing, electrolytically removed impurities and treated by an activated carbon adsorption system, thereby achieving the purpose of stable and continuous purification. The present invention effectively improves the purity of the plating solution, avoids stopping the electroplating process when purifying the plating solution and causing production delays, thereby improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present invention will be further described below in conjunction with the accompanying drawings.

[0021] Figure 1 It is a schematic structural diagram of the continuous purification device of plating solution of the present invention.

[0022] Explanation of the reference numerals: 1. plating solution storage tank; 2. dosing tank; 3. electrolytic cell; 4. primary activated carbon adsorption tank; 5. secondary activated carbon adsorption tank; 6. first liquid inlet; 7. inlet pipe; 8. filtering device; 9. first overflow port; 10. outflow pipe; 11. second liquid inlet; 12. second overflow port; 13. third liquid inlet; 14. Ph electrode probe. DETAILED DESCRIPTION

[0023] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0024] like Figure 1 As shown, this embodiment discloses a plating solution continuous purification device, including a plating solution storage tank 1, a dosing tank 2, an electrolytic tank 3, a primary activated carbon adsorption tank 4 and a secondary activated carbon adsorption tank 5.

[0025] The dosing tank 2, the electrolytic tank 3, the primary activated carbon adsorption tank 4 and the secondary activated carbon adsorption tank 5 are connected in sequence according to the purification process, and the height is higher than the plating solution storage tank 1. In this embodiment, the dosing tank 2, the electrolytic tank 3, the primary activated carbon adsorption tank 4 and the secondary activated carbon adsorption tank 5 are set as an integrated structure, all of which are welded with 15mm thick PP plates. A second liquid inlet 11 is opened at the bottom of the partition between the dosing tank 2 and the electrolytic tank 3; a second overflow port 12 is opened at the top of the partition between the electrolytic tank 3 and the primary activated carbon adsorption tank 4; a third liquid inlet 13 is opened at the bottom of the partition between the primary activated carbon adsorption tank 4 and the secondary activated carbon adsorption tank 5.

[0026] A first liquid inlet 6 is provided on the side wall of the dosing tank 2, and the first liquid inlet 6 is connected to the plating solution storage tank 1 through an inflow pipe 7, and a filter device 8 is provided on the inflow pipe 7. The plating solution in the liquid storage tank 1 is lifted to the dosing tank 2 through the filter device 8, and the filter device 8 is equipped with a self-priming pump with a flow rate of 400L / min to lift the solution, and a filter element with a filter pore size of 5um is equipped to filter the solution.

[0027] A first overflow port 9 is provided on the side wall of the secondary activated carbon adsorption tank 5. The first overflow port 9 is connected to the plating solution storage tank 1 through an outflow pipe 10. The filtered plating solution overflows into the plating solution storage tank 1 by gravity. In order to make the height of the plating solution storage tank 1 lower than the above-mentioned functional tanks, the plating solution storage tank 1 is set as an underground tank, which is buried under the ground surface. The plating solution storage tank 1 is also welded with 15mm thick PP plate.

[0028] A dosing port is provided on the dosing tank 2, and chemicals are added manually according to the concentration of the plating solution through the dosing port on the dosing tank 2. The chemicals mainly include nickel sulfate, nickel chloride, and boric acid.

[0029] A Ph electrode probe 14 is provided in the plating solution storage tank 1. The Ph electrode probe 14 is electrically connected to the control system. The Ph electrode probe 14 monitors the pH value in the plating solution storage tank 1 and feeds back an electrical signal to the control system. The control system controls the flow pump to add acid or alkali into the dosing tank 2. The acid-base adjustment in the plating solution storage tank 1 is automatically started by the system according to the pH setting range.

[0030] An electrode group for electrolytic dedoping is provided in the electrolytic cell 3; the electrode group includes a nickel plate as an anode plate and an iron plate as a cathode plate.

[0031] When in use, activated carbon bags are placed in the secondary activated carbon adsorption tank 5 and the primary activated carbon adsorption tank 4. The function of the activated carbon bags is to adsorb organic impurities decomposed by additives in the plating solution.

[0032] The purification process of the present invention is as follows:

[0033] After the plating solution in the plating solution storage tank 1 is lifted to the dosing tank 2 through the filtering device 8, it flows to the electrolytic tank 3 through the second liquid inlet 11, and the electrode group in the electrolytic tank 3 electrolytically removes impurities from the plating solution. The plating solution after electrolytic de-impurification flows to the primary activated carbon adsorption tank 4 through the second overflow port 12, and after the primary activated carbon adsorption, the plating solution flows to the secondary activated carbon adsorption tank 5 through the third liquid inlet 13 for secondary activated carbon adsorption, and finally the purified plating solution flows back to the plating solution storage tank 1 through the outflow pipe 10 again. By repeating the above purification operation, continuous purification of the plating solution can be achieved.

[0034] The embodiments described above are only descriptions of the preferred modes of the present invention, and are not intended to limit the scope of the present invention. Without departing from the design spirit of the present invention, various modifications and improvements made to the technical solutions of the present invention by ordinary technicians in this field should all fall within the protection scope determined by the claims of the present invention.

Claims

1. A continuous plating solution purification device, characterized in that: It comprises a plating solution storage tank (1), a dosing tank (2), an electrolytic tank (3), a primary activated carbon adsorption tank (4) and a secondary activated carbon adsorption tank (5); The dosing tank (2), the electrolytic tank (3), the primary activated carbon adsorption tank (4) and the secondary activated carbon adsorption tank (5) are connected in sequence according to the purification process, and are higher than the plating solution storage tank (1); A first liquid inlet (6) is provided on the side wall of the dosing tank (2), the first liquid inlet (6) is connected to the plating solution storage tank (1) through an inflow pipe (7), and a filtering device (8) is provided on the inflow pipe (7); The electrolytic cell (3) is provided with an electrode group for electrolytic removal of impurities; A first overflow port (9) is provided on the side wall of the secondary activated carbon adsorption tank (5), and the first overflow port (9) is connected to the plating solution storage tank (1) through an outflow pipe (10); The electrode group includes a nickel plate as an anode plate and an iron plate as a cathode plate; A Ph electrode probe (14) is arranged in the plating solution storage tank (1).

2. The continuous plating solution purification device according to claim 1, characterized in that: The dosing tank (2), the electrolytic tank (3), the primary activated carbon adsorption tank (4) and the secondary activated carbon adsorption tank (5) are arranged as an integrated structure; A second liquid inlet (11) is provided at the bottom of the partition between the dosing tank (2) and the electrolytic tank (3); A second overflow port (12) is provided on the top of the partition between the electrolytic cell (3) and the primary activated carbon adsorption tank (4); A third liquid inlet (13) is provided at the bottom of the partition between the primary activated carbon adsorption tank (4) and the secondary activated carbon adsorption tank (5).

3. The continuous plating solution purification device according to claim 1, characterized in that: The plating solution storage tank (1) is configured as an underground tank.

4. The continuous plating solution purification device according to claim 1, characterized in that: The plating solution storage tank (1), the dosing tank (2), the electrolytic tank (3), the primary activated carbon adsorption tank (4) and the secondary activated carbon adsorption tank (5) are all welded with PP plates.

Citation Information

Patent Citations

  • Continuous electrolysis equipment for reducing concentration of copper sulfate in plating solution

    CN210117426U

  • Plating solution continuous purification device

    CN212505148U

  • Method for removing impurity in plating liquid and device therefor

    JP1998036999A