Coil assembly

Abstract

The present invention provides a coil component, which includes: a non-magnetic body having a cured product of a polymer resin; an insulating substrate embedded in the body and having a thickness of 30 μm or less; a coil portion including a first coil pattern and a second coil pattern respectively arranged on opposite first and second surfaces of the insulating substrate; and a first external electrode and a second external electrode arranged on the surface of the body to be connected to each of the first coil pattern and the second coil pattern exposed to the surface of the body.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2019-0081383 filed on Jul. 5, 2019, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a coil assembly. Background Art

[0003] An inductor is a coil component and is a representative passive electronic component used together with a resistor and a capacitor in electronic devices.

[0004] A high frequency (HF) inductor is a coil component used in a high frequency band of 100 MHz or more, and is used for noise reduction or impedance matching of a signal terminal.

[0005] Such HF inductors are generally formed by stacking a plurality of dielectric ceramic green sheets printed with conductor paste in a coil shape and sintering the stacked pieces. In this case, each turn of the coil is formed in a three-dimensional spiral shape formed in the stacking direction of the green sheets, which may be disadvantageous in an effort to make the component thinner. Summary of the invention

[0006] An aspect of the present disclosure is to provide a coil component for high frequencies that can have a low profile.

[0007] Another aspect of the present disclosure is to provide a coil component having improved component characteristics in a high frequency band.

[0008] According to one aspect of the present disclosure, a coil component includes: a non-magnetic body having a cured product of a polymer resin; an insulating substrate embedded in the body and having a thickness of 30 μm or less; a coil portion including a first coil pattern and a second coil pattern respectively arranged on opposite first and second surfaces of the insulating substrate; and a first external electrode and a second external electrode arranged on the surface of the body to be respectively connected to the first coil pattern and the second coil pattern exposed to the surface of the body.

[0009] According to another aspect of the present disclosure, a coil component includes: an insulating substrate having a thickness of 30 μm or less; a coil portion including a planar spiral coil pattern having a plurality of turns disposed on at least one surface of the insulating substrate; and a body including non-magnetic powder and a polymer resin, the body having the insulating substrate and the coil portion embedded therein and having a thickness of 0.65 mm or less. The body contacts the planar spiral coil pattern and fills a space between adjacent turns of the plurality of turns of the planar spiral coil pattern.

[0010] According to another aspect of the present disclosure, a coil component includes: a support substrate having a through hole extending through the support substrate; a coil portion including a spiral coil pattern disposed on at least one surface of the support substrate to extend around the through hole; and a non-magnetic body having the support substrate and the coil portion embedded in the non-magnetic body, extending through the through hole of the support substrate and extending between adjacent windings of the spiral coil pattern. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description taken in conjunction with the accompanying drawings, in which:

[0012] Figure 1 is a schematic diagram of a coil assembly according to a first embodiment of the present disclosure;

[0013] Figure 2 It is along Figure 1 A cross-sectional view taken along line II';

[0014] Figure 3 It is along Figure 1 A cross-sectional view taken along line II-II';

[0015] Figure 4 yes Figure 2 an enlarged view of part A;

[0016] Figure 5 is an enlarged view of a portion A of a modified example coil assembly;

[0017] Figure 6 is a graph showing a change in inductance according to an operating frequency of a coil component according to a first embodiment of the present disclosure compared with a comparative example;

[0018] Figure 7 is a schematic diagram showing a coil component according to a second embodiment of the present disclosure;

[0019] Figure 8 It is along Figure 7 A cross-sectional view taken along line III-III';

[0020] Fig. 9 It is along Figure 7 A cross-sectional view taken along line IV-IV';

[0021] Fig.10 yes Figure 8 an enlarged view of part B;

[0022] Fig.11 is an enlarged view of a portion B of a modified example coil assembly;

[0023] Fig.12 and Fig.13 is a schematic diagram of a coil component according to a third embodiment of the present disclosure viewed from the bottom side;

[0024] Fig.14 It is shown in Fig.12 A schematic diagram of a coil assembly according to a third embodiment viewed in the C direction; and

[0025] Fig.15 It is shown in Fig.12 Schematic diagram of a modified example of the third embodiment of the present disclosure viewed in the C direction. DETAILED DESCRIPTION

[0026] Hereinafter, embodiments of the present disclosure will be described as follows with reference to the accompanying drawings. The terms used in the example embodiments are used to simply describe the example embodiments and are not intended to limit the present disclosure. Unless otherwise indicated, singular terms include plural forms. The terms "include", "comprise", "constructed to", etc. in the specification are used to indicate the presence of features, quantities, steps, operations, elements, parts, or a combination thereof, and do not exclude the possibility of combining or adding one or more other features, quantities, steps, operations, elements, parts, or a combination thereof. In addition, the terms "disposed on...", "located on...", etc. may indicate that an element is located below an object, and do not necessarily mean that the element is located on an object relative to the direction of gravity.

[0027] The terms “coupled to,” “combined to,” and the like may not only indicate that elements are directly and physically in contact with each other but may also include a configuration in which one or more other elements are interposed between the elements so that the elements are also in contact with the other elements.

[0028] For convenience of description, sizes and thicknesses of elements shown in the drawings are represented as examples, and example embodiments in the present disclosure are not limited thereto.

[0029] In the drawings, the L direction is a first direction or a length direction, the W direction is a second direction or a width direction, and the T direction is a third direction or a thickness direction.

[0030] In the specification and the drawings, the same elements or elements corresponding to each other will be described using the same reference numerals, and overlapping descriptions will not be repeated.

[0031] In electronic devices, various types of electronic components can be used, and various types of coil components can be used between electronic components to remove noise or for other purposes. In other words, in electronic devices, coil components can be used as power inductors, high-frequency inductors, general magnetic beads, high-frequency magnetic beads, common mode filters, etc.

[0032] On the other hand, hereinafter, it will be described that the coil component according to the embodiment of the present disclosure is a high-frequency inductor used in a high-frequency band (100 MHz or more), but the scope of the present disclosure is not limited thereto.

[0033] (First Embodiment and Modification Examples)

[0034] Figure 1 is a schematic diagram of a coil component according to a first embodiment of the present disclosure. Figure 2 It is along Figure 1 A cross-sectional view taken along line II' of Figure 3 It is along Figure 1 A cross-sectional view taken along line II-II'. Figure 4 yes Figure 2 An enlarged view of part A of FIG. Figure 5 yes Figure 2 An enlarged view of a modified example of part A. Figure 6 is a graph showing a change in inductance according to an operating frequency of a coil component according to a first embodiment of the present disclosure compared with a comparative example.

[0035] Reference Figures 1 to 5 , the coil component 1000 according to the first embodiment of the present disclosure includes a body 100 , an insulating substrate 200 , a coil part 300 , and external electrodes 400 and 500 .

[0036] The body 100 forms the exterior of the coil component 1000 according to the present embodiment, and the insulating substrate 200 and the coil part 300 are embedded in the body 100 .

[0037] The body 100 may have a substantially hexahedral shape as a whole.

[0038] based on Figures 1 to 3 , the body 100 may include a first surface 101 and a second surface 102 opposite to each other in the length direction L, a third surface 103 and a fourth surface 104 opposite to each other in the width direction W, and a fifth surface 105 and a sixth surface 106 opposite to each other in the thickness direction T. Each of the first surface 101, the second surface 102, the third surface 103, and the fourth surface 104 of the body 100 may correspond to a wall surface of the body 100 connecting the fifth surface 105 and the sixth surface 106 of the body 100. Hereinafter, the two end surfaces of the body 100 will be referred to as the first surface 101 and the second surface 102 of the body 100, the two side surfaces of the body 100 will be referred to as the third surface 103 and the fourth surface 104 of the body 100, one surface of the body 100 will be referred to as the sixth surface 106 of the body, and the other surface of the body 100 will be referred to as the fifth surface 105 of the body. In addition, hereinafter, reference is made to Figures 1 to 3In the direction of the body 100, the fifth surface 105 and the sixth surface 106 of the body 100 may be referred to as the upper surface and the lower surface of the body 100, respectively.

[0039] The main body 100 may be formed so that the coil component 1000 formed with the external electrodes 400 and 500 described later has a length of 2.0 mm, a width of 1.2 mm, and a thickness of 0.65 mm, but is not limited thereto. Alternatively, the main body 100 may be formed so that the coil component 1000 formed with the external electrodes 400 and 500 according to the present embodiment has a length of 2.0 mm, a width of 1.6 mm, and a thickness of 0.55 mm. Alternatively, the main body 100 may be formed so that the coil component 1000 formed with the external electrodes 400 and 500 according to the present embodiment has a length of 2.0 mm, a width of 1.2 mm, and a thickness of 0.55 mm. Alternatively, the main body 100 may be formed so that the coil component 1000 formed with the external electrodes 400 and 500 according to the present embodiment has a length of 1.2 mm, a width of 1.0 mm, and a thickness of 0.55 mm. However, since the size of the coil component 1000 according to the present embodiment as described above is merely an example, the scope of the present disclosure does not exclude that the coil component 1000 may be formed to have a size smaller than or equal to the above size.

[0040] The main body 100 may be formed using a non-magnetic material, such as a material including a cured product R of a polymer resin. As an example, in the present embodiment, the main body 100 may be formed by stacking one or more insulating sheets on both surfaces of an insulating substrate 200 (a coil portion 300 to be described later is formed on the insulating substrate 200) and then thermally curing the stacked insulating sheets, the insulating sheets including a thermosetting polymer resin formed using a non-magnetic material, a curing agent, a curing accelerator, etc. In the present specification, a non-magnetic material may refer to a material having a relative magnetic permeability close to 1 (e.g., a relative magnetic permeability of 1.5 or less, a relative magnetic permeability of 1.05 or less, etc.) and being hardly affected by an external magnetic field. Therefore, the non-magnetic material in the present specification may include a paramagnetic material and a diamagnetic material.

[0041] The cured product R of the polymer resin may be formed by thermally curing one of thermosetting polymer resin, epoxy resin, polyimide, liquid crystal polymer, etc., alone or in combination, but the material of the cured product is not limited thereto.

[0042] The body 100 includes a core 110 penetrating a coil part 300 to be described later. The core 110 may be formed by filling at least a portion of the composite sheet in a through hole of the coil part 300 in a process of stacking and curing the composite sheet, but is not limited thereto.

[0043] The insulating substrate 200 is embedded in the body 100. The insulating substrate 200 is configured to support the coil part 300 which will be described later.

[0044] The insulating layer 200 may be formed using an insulating material including a thermosetting insulating resin such as an epoxy resin, a thermoplastic insulating resin such as polyimide, or a photosensitive insulating resin, or may be formed using an insulating material in which a reinforcing material such as glass fiber or an inorganic filler is impregnated in a thermosetting insulating resin or a thermoplastic insulating resin. For example, the insulating layer 200 may be formed using an insulating material such as a prepreg, ABF (Ajinomoto build-up film), FR-4, bismaleimide triazine (BT) resin, a photosensitive dielectric (PID) film, etc., but is not limited thereto.

[0045] As inorganic fillers, one or more materials selected from the group consisting of silica (SiO2), aluminum oxide (Al2O3), silicon carbide (SiC), barium sulfate (BaSO4), talc, mud, mica powder, aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3) and calcium zirconate (CaZrO3) can be used.

[0046] When the insulating layer 200 is formed using an insulating material including a reinforcing material, the insulating layer 200 may provide improved rigidity. When the insulating layer 200 is formed using an insulating material not including glass fiber, the insulating layer 200 may be advantageous in reducing the overall thickness of the coil part 300. When the insulating layer 200 is formed using an insulating material including a photosensitive insulating resin, the number of processes for forming the coil part 300 may be reduced, thereby reducing manufacturing costs, and fine vias may be formed.

[0047] In the present embodiment, the insulating substrate 200 includes an insulating resin 210 and a glass cloth 220 impregnated in the insulating resin 210. As a non-limiting example, the insulating substrate 200 may be formed by using a copper clad laminate CCL. The glass cloth 220 may mean that a plurality of glass fibers are woven.

[0048] The glass cloth may be formed of multiple layers. When the glass cloth is formed of multiple layers, the rigidity of the insulating substrate 200 can be further improved. In addition, even if the insulating substrate 200 is damaged in a process of removing a portion of the first conductive layers 311a and 312a to be described later, the shape of the insulating substrate 200 can be maintained to reduce the defect rate.

[0049] The thickness T1 of the insulating substrate 200 may be greater than or equal to 10 μm and less than or equal to 30 μm. When the thickness T1 of the insulating substrate 200 is less than 10 μm, it may be difficult to ensure sufficient rigidity in the insulating substrate 200, and thus it may be difficult to support the coil part 300 to be described later in the manufacturing process. When the thickness T1 of the insulating substrate 200 exceeds 30 μm, it may be disadvantageous to make the coil component thinner, and in the body 100 having the same volume, the volume occupied by the insulating substrate 200 will increase and the volume that can be occupied by the coil part 300 will decrease.

[0050] The coil part 300 includes planar spiral coil patterns 311 and 312 disposed on the insulating substrate 200, and the coil part 300 is embedded in the body 100 to exhibit the characteristics of the coil component. For example, when the coil component 1000 of the present embodiment is used as a high frequency (HF) inductor, the coil part 300 can be used to remove noise or match impedance of a signal terminal when used in a high frequency band (100 MHz or higher).

[0051] The coil portion 300 includes a first coil pattern 311, a second coil pattern 312, and a via 320. Specifically, based on Figure 1 , Figure 2 and Figure 3 The first coil pattern 311 is disposed on the lower surface of the insulating substrate 200, and the second coil pattern 312 is disposed on the upper surface of the insulating substrate 200. The via 320 penetrates the insulating substrate 200 and contacts and connects the first coil pattern 311 and the second coil pattern 312 to each other. In this way, the coil portion 300 can be used as one coil formed around the core 110 as a whole with one or more turns.

[0052] The first coil pattern 311 and the second coil pattern 312 each have a planar spiral shape formed by a plurality of turns around the core 110 as its central axis. As an example, the first coil pattern 311 may be based on Figure 2 The second coil pattern 312 may be wound around the core 110 as a central axis on the lower surface of the insulating substrate 200 in the direction of and may have a plurality of turns in contact with the lower surface of the insulating substrate 200. Figure 2 The core 110 is wound around the core 110 as a central axis on the upper surface of the insulation substrate 200 in a direction of , and may have a plurality of turns in contact with the upper surface of the insulation substrate 200 .

[0053] Ends of the first and second coil patterns 311 and 312 are connected to first and second external electrodes 400 and 500 to be described later. That is, an end of the first coil pattern 311 is connected to the first external electrode 400, and an end of the second coil pattern 312 is connected to the second external electrode 500.

[0054] As an example, an end of the first coil pattern 311 may be exposed to the first surface 101 of the body 100, and an end of the second coil pattern 312 may be exposed to the second surface 102 of the body 100. Each end may thus be connected to contact a corresponding one of the first external electrode 400 and the second external electrode 500 disposed on the first surface 101 and the second surface 102 of the body.

[0055] Each of the first coil pattern 311 and the second coil pattern 312 includes first conductive layers 311a and 312a formed to contact the insulating substrate 200 and second conductive layers 311b and 312b disposed on the first conductive layers 311a and 312a. Figure 4 and Figure 5 The first coil pattern 311 includes a first conductive layer 311a formed to contact the lower surface of the insulating substrate 200 and a second conductive layer 311b provided to cover the first conductive layer 311a. Figure 4 and Figure 5 The second coil pattern 312 includes a first conductive layer 312a formed to be in contact with the upper surface of the insulating substrate 200 and a second conductive layer 312b provided to cover the first conductive layer 312a.

[0056] The first conductive layers 311a and 312a may be seed layers for forming the second conductive layers 311b and 312b by electroplating. The first conductive layers 311a and 312a used as seed layers of the second conductive layers 311b and 312b may be formed to be thinner than the second conductive layers 311b and 312b. The first conductive layers 311a and 312a may be formed by a thin film process such as sputtering or an electroless plating process. When the first conductive layers 311a and 312a are formed by a thin film process such as sputtering, at least a portion of the material constituting the first conductive layers 311a and 312a may have a shape that penetrates into the insulating substrate 200. It can be confirmed that the concentration of the metal material constituting the first conductive layers 311a and 312a in the thickness direction T of the main body 100 produces a difference.

[0057] The thickness of the first conductive layers 311a and 312a may be greater than or equal to 0.5 μm and less than or equal to 3 μm. When the thickness of the first conductive layers 311a and 312a is less than 0.5 μm, it may be difficult to realize the first conductive layers 311a and 312a. When the thickness of the first conductive layers 311a and 312a exceeds 3 μm, even after the first conductive layers 311a and 312a are removed by etching from the areas other than (or except) the areas where the second conductive layers 311b and 312b are to be formed by plating, at least a portion of the first conductive layers 311a and 312a may remain. Additionally or alternatively, when the thickness of the first conductive layers 311a and 312a exceeds 3 μm, removing the first conductive layers 311a and 312a from the areas other than the areas where the second conductive layers 311b and 312b are to be formed may require over-etching, which may cause the second conductive layers 311b and 312b themselves to be etched and removed.

[0058] Reference Figure 4 , the second conductive layers 311b and 312b expose at least a portion of the side surfaces of the first conductive layers 311a and 312a. In the present embodiment, a seed layer (which becomes the structure of the first conductive layer in a subsequent process) is formed on both the upper and lower surfaces of the insulating substrate 200, a plating resist for forming the second conductive layers 311b and 312b located on the seed layer is formed on the seed layer, the second conductive layers 311b and 312b are formed by electroplating, and after removing the plating resist, the portion of the seed layer on which the second conductive layers 311b and 312b are not formed is selectively removed. Therefore, at least a portion of the side surfaces of the first conductive layers 311a and 312a formed by selectively removing the seed layer is exposed without being covered by the second conductive layers 311b and 312b. The seed layer can be formed by performing electroless plating or sputtering on the insulating substrate 200. Alternatively, the seed layer can be a copper foil of a copper clad laminate (CCL). The plating resist may be formed by applying a plating resist forming material to the seed layer and then performing a photolithography process. After the photolithography process, an opening may be formed in the plating resist in the region where the second conductive layers 311b and 312b are to be formed. The selective removal of the seed layer may be performed by a laser process or an etching process. When the seed layer is selectively removed by etching, the first conductive layers 311a and 312a may have a side surface whose cross-sectional area increases toward the insulating substrate 200.

[0059] Reference Figure 5 , the second conductive layers 311b and 312b cover the first conductive layers 311a and 312a and are in contact with the insulating substrate 200. Figure 4Unlike the case of the first conductive layer 311a and 312a having a spiral shape, the first conductive layers 311a and 312a are respectively formed on both surfaces of the insulating substrate 200, and the second conductive layers 311b and 312b are formed on the first conductive layers 311a and 312a by electroplating. When the second conductive layers 311b and 312b are formed by anisotropic plating, a plating resist may not be used, but is not limited thereto. When the second conductive layers 311b and 312b are formed by isotropic plating, a plating resist for forming the second conductive layer may be used. An opening for exposing the first conductive layers 311a and 312a is formed in the plating resist for forming the second conductive layer. The diameter of the opening is formed to be larger than the line width of the first conductive layers 311a and 312a, and as a result, the second conductive layers 311b and 312b filling the opening cover the first conductive layers 311a and 312a and contact the insulating substrate 200.

[0060] On the other hand, in the present embodiment, as described above, the coil component 1000 is formed by first forming the coil portion 300 on the insulating substrate 200, and then laminating and curing the insulating sheet on the insulating substrate 200. Therefore, the present embodiment is distinguished from the technique of first forming an insulating layer used as a main body on an insulating substrate, patterning the insulating layer into a coil-shaped form with an opening, and then forming the coil portion by plating in the opening of the coil-shaped form with a conductive material. In the latter case, a seed layer for electroplating is formed along the inner surface (inner wall and bottom) of the opening of the coil-shaped opening. On the other hand, due to the difference in the above method, in the present embodiment, compared with the latter case, the first conductive layer 311a and 312a of each turn are not formed on the side surface of the second conductive layer 311b and 312b. That is, compared with the latter case, in the present embodiment, the side surface of the second conductive layer 311b and 312b of each turn is directly in contact with the main body 100. In the latter technology, as a result of the seed layer being formed along the inner surface of the opening, the growth of the electroplating starts from the inner surface and the bottom of the opening, which may cause the generation of voids and defects and limit the increase of the aspect ratio (AR) of the opening, because the turns of the coil are formed in the opening, the aspect ratio of the opening is substantially similar to the aspect ratio of the turns of the coil. In the present embodiment, since the first conductive layers 311a and 312a (i.e., the seed layers of the second conductive layers 311b and 312b) are only provided on the lower side of the second conductive layers 311b and 312b, the above-mentioned problem can be solved. Therefore, in the present embodiment, the aspect ratio AR of each turn of the coil patterns 311 and 312 can be higher.

[0061] The via hole 320 may include at least one conductive layer. For example, when the via hole 320 is formed by electroplating, the via hole 320 may include: a seed layer formed on the inner wall of the via hole penetrating the insulating substrate 200; and an electroplating layer filling the via hole formed with the seed layer. The seed layer of the via hole 320 is formed in the same process as the first conductive layers 311a and 312a to be formed integrally, or the seed layer of the via hole 320 is formed in a different process from the first conductive layers 311a and 312a so that a boundary can be formed therebetween.

[0062] When the line width per turn of the coil patterns 311 and 312 is too small and / or the thickness per turn is too large, there may be problems with the coupling force between the body 100 and the coil patterns 311 and 312. As a non-limiting example, the aspect ratio AR per turn of the coil patterns 311 and 312 may be 3:1 to 9:1.

[0063] Each of the coil patterns 311 and 312 and the via 320 may be formed using a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), chromium (Cr), molybdenum (Mo), or an alloy thereof, but the material is not limited thereto. As a non-limiting example, when the first conductive layers 311a and 312a are formed by sputtering and the second conductive layers 311b and 312b are formed by electroplating, the first conductive layers 311a and 312a may include at least one of molybdenum (Mo), chromium (Cr), and titanium (Ti), and the second conductive layers 311b and 312b may include copper (Cu). As another non-limiting example, when the first conductive layers 311a and 312a are formed by electroless plating and the second conductive layers 311b and 312b are formed by electroplating, each of the first conductive layers 311a and 312a and the second conductive layers 311b and 312b may include copper (Cu). In this case, the density of copper (Cu) in the first conductive layers 311a and 312a may be lower than the density of copper (Cu) in the second conductive layers 311b and 312b. As another non-limiting example, the first conductive layers 311a and 312a may be formed of multiple layers by any combination of a sputtering method and an electroless plating method.

[0064] The external electrodes 400 and 500 are disposed on the surface of the body 100 and connected to the coil part 300 exposed to the surface of the body 100. In the present embodiment, one end of the first coil pattern 311 is exposed to the first surface 101 of the body 100, and one end of the second coil pattern 312 is exposed to the second surface 102 of the body 100. Therefore, the first external electrode 400 is disposed on the first surface 101 and connected to contact with the end of the first coil pattern 311 exposed to the first surface 101 of the body 100, and the second external electrode 500 is disposed on the second surface 102 and connected to contact with the end of the second coil pattern 312 exposed to the second surface 102 of the body 100.

[0065] Both the external electrodes 400 and 500 may be formed as a single layer or multiple layers. For example, the first external electrode 400 may be composed of a first layer including copper (Cu), a second layer disposed on the first layer and including nickel (Ni), and a third layer disposed on the second layer and including tin (Sn). Here, the first layer may include a seed layer formed by a vapor deposition method such as electroless plating or sputtering. Each of the second and third layers may be formed by electroplating, but is not limited thereto. As another example, the first external electrode 400 may include: a resin electrode including a conductive powder and a resin; and a plating layer, plated and formed on the resin electrode. The resin electrode may be formed by screen printing or applying a conductive paste containing a conductive powder and a resin and then curing the conductive paste.

[0066] The external electrodes 400 and 500 may include a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy thereof, but the material thereof is not limited thereto.

[0067] The external electrodes 400 and 500 may cover the first surface 101 and the second surface 102 of the body 100, respectively, and both may extend to the sixth surface 106 of the body. That is, the first external electrode 400 may cover the first surface 101 of the body 100 and extend to the sixth surface 106 of the body 100, and the second external electrode 500 may cover the second surface 102 of the body 100 and extend to the sixth surface 106 of the body 100. Since the external electrodes 400 and 500 cover the first surface 101 and the second surface 102 of the body 100, the bonding force between the external electrodes 400 and 500 and the body 100 may be improved.

[0068] Although not shown, in the present embodiment, an insulating film disposed between the coil portion 300 and the body 100 may be further included. The insulating film may include an insulating material such as polyparaxylene, but is not limited thereto, and any insulating material may be used. The insulating film may be formed by a method such as vapor deposition, but is not limited thereto, and may be formed by a method of laminating the insulating film on both surfaces of the insulating substrate 200. In the former case, the insulating film may be formed in the form of a conformal film along the surface of the insulating substrate and the coil portion. In the latter case, the insulating film may be formed in the form of a space between adjacent turns of the coil patterns 311 and 312. On the other hand, as described above, a plating resist for forming the second conductive layers 311b and 312b may be formed on the insulating substrate 200, and the plating resist may be a permanent plating resist that is not removed. In this case, the insulating film may be a plating resist used as a permanent plating resist. On the other hand, in the present disclosure, when the insulating film is formed, the insulating film is only an optional configuration, and the coil component 1000 according to the present embodiment may be manufactured by changing the manufacturing process of a typical thin film power inductor to a minimum, thereby advantageously maintaining manufacturing efficiency and reducing costs. That is, in the case of a typical power inductor, a coil portion and an insulating film may be formed on an insulating substrate to form a coil substrate, and then a magnetic composite sheet for forming a body is laminated on both surfaces of the coil substrate. In the case of forming the insulating film in this embodiment, only the remaining processes except the process for forming the body may be the same as the manufacturing process of the thin film power inductor. Therefore, high-frequency inductors and power inductors may be selectively manufactured using the same coil substrate formed to the insulating film.

[0069] Figure 6 is a graph showing a change in inductance according to an operating frequency of a coil component according to a first embodiment of the present disclosure compared with a comparative example.

[0070] In the experimental example, the thickness T1 of the insulating substrate is 30 μm, and in the comparative example, the thickness of the insulating substrate is 60 μm. Table 1 shows the inductance value of each of the experimental example and the comparative example when the frequency is 100 MHz, 500 MHz, 1.0 GHz, and 2.4 GHz.

[0071] On the other hand, in the experimental examples and the comparative examples, the remaining conditions except the thickness Tl of the insulating substrate 200, such as the number of turns of the coil portion, the line width and thickness of each turn, the space between each turn, and the length, width and thickness of the body are equal.

[0072] [Table 1]

[0073] Comparison example Inductance (nH) Experimental Example Inductance (nH) Improvement rate 100MHz 10.54 11.21 6％ 500MHz 10.14 10.85 7％ 1.0GHz 10.11 10.95 8％ 2.4GHz 11.10 12.25 9％

[0074] Refer to Table 1 and Figure 6, it can be seen that when comparing the experimental example and the comparative example, the inductance of the experimental example is higher than that of the comparative example in all frequency bands. On the other hand, the inductance difference between the comparative example and the experimental example gradually increases with the increase of the operating frequency, and it can be seen that at an operating frequency of 1 GHz or higher, the improvement rate is close to 10%. Referring to Table 1 and Figure 6 The coil component 1000 of the present embodiment can be used as a high-frequency inductor used in a high frequency band (100 MHz or higher), particularly, a frequency band of 1 GHz or higher.

[0075] (Second Embodiment and Modifications)

[0076] Figure 7 is a schematic diagram showing a coil component according to a second embodiment of the present disclosure. Figure 8 It is along Figure 7 A cross-sectional view taken along line III-III'. Fig. 9 It is along Figure 7 A cross-sectional view taken along line IV-IV'. Fig.10 yes Figure 8 An enlarged view of part B. Fig.11 yes Figure 8 An enlarged view of a modified example of part B.

[0077] Compare Figures 1 to 6 as well as Figures 7 to 11 In the coil component 2000 according to the present embodiment, the main body 100 is different from the coil component 1000 according to the first embodiment of the present disclosure. Therefore, in the present embodiment, only the main body 100 different from the main body of the first embodiment of the present disclosure will be described. In other configurations of the present embodiment, the description of the first embodiment is applicable to the modified example of the first embodiment of the present disclosure as it is.

[0078] Reference Figures 7 to 11 , the body 100 applied to the coil component 2000 according to the present embodiment may include a cured product R of a polymer resin and a non-magnetic material P dispersed in the cured product R of the polymer resin.

[0079] For example, in the present embodiment, the body 100 may be formed by laminating one or more composite sheets including a non-magnetic thermosetting polymer resin and non-magnetic powder P dispersed in the thermosetting polymer resin on both surfaces of the insulating substrate 200 on which the coil part 300 is formed, and then thermally curing the composite sheets. In order to control at least one of the magnetic, electrical, mechanical, and thermal characteristics of the coil component 2000 according to the present embodiment, the non-magnetic powder P is dispersed and disposed in the cured product R of the polymer resin, and in order to control at least one of the above characteristics, the content of the non-magnetic powder P in the body 100 may be adjusted.

[0080] The non-magnetic powder P may include at least one of an organic filler and an inorganic filler.

[0081] The organic filler may include, for example, at least one of acrylonitrile butadiene styrene (ABS), cellulose acetate, nylon, polymethyl methacrylate (PMMA), polybenzimidazole, polycarbonate, polyethersulfone, polyetheretherketone (PEEK), polyetherimide (PEI), polyethylene, polylactic acid, polyoxymethylene, polyphenylene ether, polyphenylene sulfide, polypropylene, polystyrene, polyvinyl chloride, ethylene vinyl acetate, polyvinyl alcohol, polyethylene oxide, epoxy resin and polyimide.

[0082] The inorganic filler may include one or more selected from the group consisting of silicon dioxide (SiO2), aluminum oxide (Al2O3), silicon carbide (SiC), titanium oxide (TiO2), barium sulfate (BaSO4), aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3) and calcium zirconate (CaZrO3). On the other hand, the scope of the inorganic filler of the present embodiment is not limited to the above examples, and as long as it is a ceramic material having a value of relative magnetic permeability close to 1, it is included in the inorganic filler of the present embodiment.

[0083] The non-magnetic powder P may have an average diameter of about 0.1 μm to 30 μm, but is not limited thereto.

[0084] The main body 100 may include two or more types of non-magnetic powders P dispersed in a cured product R of a polymer resin. Here, the non-magnetic powders P have different types, which means that the types of non-magnetic powders P dispersed in the cured product R of the polymer resin are distinguished from each other by any one of diameter, composition, crystallinity, and shape. As an example, the main body 100 may include two or more types of non-magnetic powders P having different diameters. The diameter of the non-magnetic powder P may represent the type of powder according to D 50 or D 90 Particle size distribution.

[0085] The volume of the non-magnetic powder P may be 50 vol% or more relative to the total volume of the cured product R of the polymer resin. In the present embodiment, since the cured product R of the polymer resin is formed by thermally curing the thermosetting polymer resin, the volume ratio (vol%) of the non-magnetic powder P dispersed in the cured product R of the polymer resin may be increased. On the contrary, as an example, when the main body is a cured product of a photocurable polymer resin, light is scattered by the non-magnetic powder P during photocuring, so the photocurability is reduced. Therefore, in such an example, there may be a limitation in increasing the volume ratio of the non-magnetic powder P. In the present embodiment, since the main body 100 is formed using a thermosetting resin, the above-mentioned problem can be solved. Therefore, in the present embodiment, when adjusting the content of the non-magnetic powder P in the composite sheet, there is no need to consider the problem caused by the content of the non-magnetic powder P in the curing process of the composite sheet. As a result, in the present embodiment, the degree of freedom in the manufacturing process and design can be increased to easily control the magnetic properties, electrical properties, mechanical properties and thermal properties of the coil component 2000 according to the present embodiment. As an example, by including 50 vol% or more of silicon dioxide (SiO2) having a relatively low coefficient of thermal expansion in the body 100, the difference in coefficient of thermal expansion between the coil component 2000 of the present embodiment and the mounting substrate or a semiconductor component mounted together on the mounting substrate can be significantly reduced. Therefore, defects of the electronic component package (e.g., warping of the package or the occurrence of voids in the package) caused by the difference in coefficient of thermal expansion between the coil component 2000 according to the present embodiment and other electronic components packaged together in the electronic package can be prevented. In addition, problems with connection reliability between the component and the mounting substrate caused by the difference in coefficient of thermal expansion between the component and the mounting substrate (e.g., cracks in the solder) can be reduced.

[0086] On the other hand, the inorganic filler included in the insulating substrate 200 described in the first embodiment of the present disclosure and the inorganic filler included in the body 100 of the present embodiment may be the same material, but are not limited thereto. As a non-limiting example, by the difference in thermal expansion coefficient between the body 100 and the insulating substrate 200, in order to prevent the body 100 and the insulating substrate 200 from being separated from each other, the inorganic filler included in the insulating substrate 200 and the inorganic filler included in the body 100 may be made using the same material as a main component and different materials as auxiliary components.

[0087] Reference Fig.10 and Fig.11, the non-magnetic powder P is in contact with each of the coil patterns 311 and 312. That is, the coil patterns 311 and 312 may be in direct contact with the body 100. In the present embodiment, unlike a typical thin film power inductor, since the non-magnetic powder P of the above-mentioned body 100 has a non-conductive property, even if a separate insulating film is not formed between the non-magnetic powder P and the coil patterns 311 and 312, it does not affect the component characteristics. However, as described above, for the advantage of manufacturing, the insulating film can be optionally provided between the coil patterns 311 and 312 and the body 100 so that the non-magnetic powder P may not contact the coil patterns 311 and 312.

[0088] On the other hand, Fig.10 and Fig.11 As shown, each of the coil patterns 311 and 312 includes first conductive layers 311 a and 312 a formed to contact the insulating substrate 200 and second conductive layers 311 b and 312 b disposed on the first conductive layers 311 a and 312 a . Fig.10 and Fig.11 are respectively corresponding to the first embodiment of the present disclosure Figure 4 and Figure 5 Therefore, since the first embodiment of the present disclosure can be applied as it is Figure 4 and Figure 5 description, so it will be omitted Fig.10 and Fig.11 Detailed description.

[0089] (Third Embodiment and Modification Examples)

[0090] Fig.12 and Fig.13 is a schematic diagram showing a coil component according to a third embodiment of the present disclosure viewed from a lower side. Fig.14 It is shown from Fig.12 Schematic diagram of observation from direction C. Fig.15 is a diagram showing a modified example of the third embodiment of the present disclosure, and provides Fig.12 The view observed in the C direction corresponds to the view.

[0091] Compare Figures 1 to 6 as well as Figures 7 to 11 Compared with the coil components 1000 and 2000 according to the first and second embodiments of the present disclosure, the coil components 1000 and 2000 according to the present embodiment are Figures 12 to 15 The coil assembly 3000 has a different arrangement form of the coil part 300 in the main body 100. Therefore, in this embodiment, only the arrangement form of the coil part 300 different from the coil part of the first embodiment and the second embodiment of the present disclosure will be described. In the remaining configurations of this embodiment, the description of the first embodiment and the second embodiment can be applied as is to the modified examples of the present disclosure.

[0092] Reference Figure 12 to Figure 14 , the coil part 300 applied to the coil component 3000 according to the present embodiment is disposed perpendicular to one surface 106 of the body 100 .

[0093] The coil part 300 is arranged perpendicular to the sixth surface 106 of the main body 100, which means that Fig.13 and Fig.14 As shown in , the surfaces of the coil patterns 311 and 312 in contact with the insulating substrate 200 are formed to be perpendicular to the sixth surface 106 of the body 100 or close to being perpendicular to the sixth surface 106 of the body 100. For example, the surface of each turn of the first coil pattern 311 in contact with the insulating substrate 200 and the sixth surface 106 of the body 100 may form an angle of 80° to 100°.

[0094] As electronic devices obtain higher performance, more electronic components are mounted on mounting boards such as printed circuit boards, etc., which are arranged in electronic devices. For this reason, it is desirable to maintain or improve the performance of electronic components while reducing any one of the length and width of the main body that determines the mounting area of ​​each electronic component. In the present embodiment, by setting the coil portion 300 to be perpendicular to the sixth surface 106 of the main body 100, the area of ​​the sixth surface 106 of the main body 100 (which may correspond to the mounting surface of the coil component 3000 according to the present embodiment) can be reduced. In addition, by setting the coil portion 300 to be perpendicular to the sixth surface 106 of the main body 100, the number of turns, the line width and thickness of each turn of the coil pattern 311 and 312 can be changed without changing the mounting area of ​​the coil component to provide different characteristics to the coil component. In addition, by setting the coil portion 300 to be perpendicular to the sixth surface 106 of the main body 100, the direction of the magnetic field formed by the coil portion 300 is parallel to the sixth surface 106 of the main body 100. Therefore, the induced current in the mounting board such as a printed circuit board can be reduced due to the magnetic field.

[0095] In the present embodiment, each of the ends 311' and 312' of the coil part 300 may be exposed to two surfaces connected to each other among the first surface 101, the second surface 102, the third surface 103, the fourth surface 104, the fifth surface 105, and the sixth surface 106. Fig.13As shown in , one end 311' of the first coil pattern 311 may be exposed to the first surface 101 of the body 100 and the sixth surface 106 of the body 100, and one end 312' of the second coil pattern 312 may be exposed to the second surface 102 of the body 100 and the sixth surface 106 of the body 100. One end 311' of the first coil pattern 311 may be continuously exposed to the first surface 101 and the sixth surface 106 of the body 100, and one end 312' of the second coil pattern 312 may be continuously exposed to the second surface 102 and the sixth surface 106 of the body 100. In the present embodiment, the external electrodes 400 and 500 are formed on the first surface 101, the second surface 102, and the sixth surface 106 of the body 100 to cover the two ends 311' and 312' of the coil part exposed to the surface of the body 100. As components are miniaturized, the exposed areas of both end portions 311 ′ and 312 ′ of the coil part 300 may be reduced, and as a result, the coupling force between the coil part 300 and the external electrodes 400 and 500 may be reduced.

[0096] In the present embodiment, the exposed area of ​​the two ends 311' and 312' of the coil part 300 exposed to the surface of the body 100 may be increased to improve the bonding force between the coil part 300 and the external electrodes 400 and 500. In the present embodiment, the coil part 300 may further include auxiliary patterns 331 and 332 corresponding to the two ends 311' and 312' of the coil patterns 311 and 312, respectively. Specifically, the coil part 300 may include a first auxiliary pattern 331, which is disposed on one surface of the insulating substrate 200 on which the first coil pattern 311 is disposed (based on the surface of the insulating substrate 200). Fig.13 The coil portion 300 is formed on the front surface of the insulating substrate 200 in the direction of the first coil pattern 311 and is spaced apart from the first coil pattern 311 and has a shape and position corresponding to one end 312' of the second coil pattern 312. In addition, the coil portion 300 may include a second auxiliary pattern 332, which is disposed on the other surface of the insulating substrate 200 on which the second coil pattern 312 is disposed (based on Fig.13The first auxiliary pattern 331 is formed on the rear surface of the insulating substrate 200 in the direction of the first coil pattern 311 and is spaced apart from the second coil pattern 312 and has a shape and position corresponding to one end 311' of the first coil pattern 311. Similar to the end 312' of the second coil pattern 312, the first auxiliary pattern 331 may be exposed to the second surface 102 and the sixth surface 106 of the body 100, and similar to the end 311' of the first coil pattern 311, the second auxiliary pattern 332 may be exposed to the first surface 101 and the sixth surface 106 of the body. Similar to the two ends 312' and 311' of the coil part, the auxiliary patterns 331 and 332 may contact the external electrodes 500 and 400. By increasing the area in which the coil part 300 contacts the external electrodes 400 and 500, the bonding force between the coil part 300 and the external electrodes 400 and 500 may be improved. In addition, when the external electrodes 400 and 500 are formed by electroplating using only the ends 311' and 312' of the coil part 300, the external electrodes 400 and 500 may be formed asymmetrically, resulting in appearance defects. Due to the auxiliary patterns 331 and 332, the above problem can be solved. On the other hand, although not shown, one end 311' of the first coil pattern 311 and the second auxiliary pattern 332 and one end 312' of the second coil pattern 312 and the first auxiliary pattern 331 can be physically and electrically connected to each other through the connection vias that penetrate the insulating substrate 200, respectively.

[0097] Fig.15 is a diagram showing a modified example of the third embodiment of the present disclosure, and is similar to Fig.12 The diagram corresponds to the diagram observed from the direction C. Fig.15 , the coil portion 300 applied to the modified example of the present embodiment may further include a plurality of connection patterns CP1 and CP2 for connecting the coil patterns 311 and 312 with the ends 311' and 312' of the coil patterns 311 and 312. Specifically, the coil portion 300 may further include: a plurality of first connection patterns CP1, which are arranged on one surface of the insulating substrate 200 to connect the first coil pattern 311 with the end 311' of the first coil pattern 311; and a plurality of second connection patterns CP2, which are arranged on the other surface of the insulating substrate 200 to connect the second coil pattern 312 with the end 312' of the second coil pattern 312.

[0098] Each of the first coil pattern CP1 and the second coil pattern CP2 may be formed into a plurality of portions spaced apart from each other. In the case of a structure in which the ends of the coil patterns are connected in a single pattern, the bonding force between the coil patterns and the main body may be weakened due to the bonding between different materials. In the present variant example, the connection patterns CP1 and CP2 for connecting the coil patterns 311 and 312 with the ends 311' and 312' of the coil patterns 311 and 312 may be formed into a plurality of portions spaced apart from each other, respectively, so that the main body 100 may extend and be disposed in the space between the separated portions of the connection patterns CP1 and CP2 that are adjacent to each other. As a result, the bonding force between the main body 100 and the coil portion 300 may be improved. That is, the plurality of connection patterns CP1 and CP2 spaced apart from each other may be used as anchors. On the other hand, in this case, as Fig.15 As shown in FIG, the region where the connection patterns CP1 and CP2 are provided in the insulating substrate 200 may have a shape corresponding to the shape of the plurality of connection patterns CP1 and CP2 spaced apart from each other. That is, the body 100 may be formed to penetrate the space between the plurality of connection patterns CP1 and CP2 and penetrate the insulating substrate 200.

[0099] As described above, according to the present disclosure, a high frequency coil assembly may be provided to have a low profile.

[0100] In addition, according to the present disclosure, component characteristics in a high frequency band can be improved.

[0101] While example embodiments have been shown and described above, it will be apparent to those skilled in the art that changes and modifications may be made without departing from the scope of the present disclosure as defined by the appended claims.

Claims

1. A coil assembly, comprising: a non-magnetic body including a cured product of a polymer resin and having one end surface and another end surface opposite to the one end surface and one surface connecting the one end surface and the other end surface to each other; an insulating substrate embedded in the body, having a through hole extending through the insulating substrate to define an inner side surface of the insulating substrate, and having a thickness of 30 μm or less; A coil portion including a first coil pattern and a second coil pattern respectively disposed on opposite first and second surfaces of the insulating substrate; as well as first and second external electrodes are disposed on a surface of the body to be connected to the first and second coil patterns, respectively, and wherein the non-magnetic body is directly disposed on the inner surface of the insulating substrate, wherein the main body further comprises non-magnetic powder dispersed in the cured product of the polymer resin, The first external electrode and the second external electrode are respectively disposed on the one end surface and the other end surface of the body, and each extends to the one surface of the body.

2. The coil assembly according to claim 1, wherein: The volume of the non-magnetic powder is 50 vol% or more relative to the total volume of the cured product of the polymer resin.

3. The coil assembly according to claim 1, wherein: The non-magnetic powder is in contact with each of the first coil pattern and the second coil pattern.

4. The coil assembly according to claim 1, wherein: The non-magnetic powder includes at least one of an organic filler and an inorganic filler.

5. The coil assembly according to claim 4, wherein: The organic filler includes at least one of acrylonitrile-butadiene-styrene, cellulose acetate, nylon, polymethyl methacrylate, polybenzimidazole, polycarbonate, polyether sulfone, polyether ether ketone, polyether imide, polyethylene, polylactic acid, polyoxymethylene, polyphenylene ether, polyphenylene sulfide, polypropylene, polystyrene, polyvinyl chloride, ethylene vinyl acetate, polyvinyl alcohol, polyethylene oxide, epoxy resin and polyimide.

6. The coil assembly according to claim 4, wherein: The inorganic filler includes at least one of silicon dioxide, aluminum oxide and titanium oxide.

7. The coil assembly according to claim 1, wherein: The insulating substrate has a thickness of 10 μm or more.

8. The coil assembly according to claim 1, wherein: Each of the first coil pattern and the second coil pattern includes a first conductive layer contacting the insulating substrate and a second conductive layer disposed on the first conductive layer.

9. The coil assembly according to claim 8, wherein: The first conductive layer includes at least one of copper, titanium, chromium and molybdenum, and The second conductive layer includes copper.

10. The coil assembly according to claim 8, wherein: The second conductive layer is absent from at least a portion of a side surface of the first conductive layer.

11. The coil assembly according to claim 8, wherein: The second conductive layer covers a side surface of the first conductive layer and contacts the insulating substrate.

12. The coil assembly according to claim 8, wherein: A side surface of the second conductive layer contacts the body.

13. The coil assembly according to claim 1, wherein: The body has a thickness of 0.65 mm or less.

14. The coil assembly according to claim 1, wherein: One end portion of the first coil pattern is exposed to the one end surface of the body, and one end portion of the second coil pattern is exposed to the other end surface of the body.

15. The coil assembly according to claim 14, wherein: The first external electrode and the second external electrode cover the one end surface and the other end surface of the body, respectively.

16. The coil assembly according to claim 14, wherein: The one end portion of the first coil pattern is exposed to the one end surface of the body and the one surface of the body, and The one end portion of the second coil pattern is exposed to the other end surface of the body and the one surface of the body.

17. The coil assembly according to claim 16, wherein: Each of the first and second opposing surfaces of the insulating substrate, on which the first and second coil patterns are respectively provided, is perpendicular to the one surface of the body.

18. A coil assembly, comprising: an insulating substrate having a through hole extending through the insulating substrate to define an inner side surface of the insulating substrate and having a thickness of 30 μm or less; a coil portion including a planar spiral coil pattern having a plurality of turns disposed on at least one surface of the insulating substrate; as well as a main body including non-magnetic powder and a polymer resin, the main body having the insulating substrate and the coil portion embedded in the main body and having a thickness of 0.65 mm or less, a first external electrode and a second external electrode, connected to opposite ends of the coil part, respectively, disposed on one end surface of the body and on another end surface opposite to the one end surface, and both extending to one surface of the body connecting the one end surface and the other end surface to each other, wherein the body contacts the planar spiral coil pattern and fills a space between adjacent turns of the plurality of turns of the planar spiral coil pattern, and Wherein, the main body is directly arranged on the inner surface of the insulating substrate.

19. The coil assembly according to claim 18, wherein: The body in contact with the planar spiral coil pattern is non-magnetic.

20. The coil assembly according to claim 19, wherein The body in contact with the planar spiral coil pattern has a relative magnetic permeability of 1.5 or less.

21. The coil assembly according to claim 18, wherein The body in contact with the planar spiral coil pattern includes a paramagnetic material or a diamagnetic material.

22. A coil assembly, comprising: a support substrate having a through hole extending through the support substrate to define an inner side surface of the support substrate; a coil portion including a spiral coil pattern provided on at least one surface of the support substrate to extend around the through hole; as well as a non-magnetic body having the support substrate embedded in and in contact with the non-magnetic body and the spiral coil pattern, extending through the through hole of the support substrate and extending between adjacent windings of the spiral coil pattern, wherein the non-magnetic body is directly disposed on the inner side surface of the support substrate, a first external electrode and a second external electrode, respectively connected to opposite ends of the coil part, disposed on one end surface of the non-magnetic body and on another end surface opposite to the one end surface, and both extending to one surface of the non-magnetic body connecting the one end surface and the other end surface to each other, The non-magnetic body includes a solidified product of a polymer resin and non-magnetic material powder dispersed in the solidified product of the polymer resin.

23. The coil assembly according to claim 22, wherein: The non-magnetic body has a relative magnetic permeability of 1.5 or less.

24. The coil assembly according to claim 22, wherein: The support substrate has a thickness of 30 μm or less.

25. The coil assembly according to claim 22, in, The nonmagnetic body directly contacts the first and second external electrodes.

26. The coil assembly according to claim 22, wherein: The spiral coil pattern includes: a first spiral coil pattern and a second spiral coil pattern, respectively disposed on opposite first and second surfaces of the support substrate to extend around the through hole; an end portion of the first spiral coil pattern disposed on the first surface of the support substrate and in contact with the first external electrode; and An end portion of the second spiral coil pattern is disposed on the second surface of the support substrate and contacts the second external electrode.

27. The coil assembly according to claim 26, wherein: The coil portion further includes: a first auxiliary pattern disposed on the second surface of the support substrate to be spaced apart from the second spiral coil pattern and to contact the first external electrode; and A second auxiliary pattern is disposed on the first surface of the support substrate to be spaced apart from the first spiral coil pattern and to contact the second external electrode.

28. The coil assembly according to claim 26, wherein: An end portion of the first spiral coil pattern and an end portion of the second spiral coil pattern are exposed to respectively opposite outer surfaces of the nonmagnetic body and are both exposed to a common outer surface of the nonmagnetic body, and An angle between the first surface of the support substrate and the common outer surface of the non-magnetic body is 80° to 100°.

29. The coil assembly according to claim 26, wherein: The coil portion further includes: a plurality of first connection patterns spaced apart from each other and each extending between the first spiral coil pattern and an end portion of the first spiral coil pattern; and A plurality of second connection patterns are spaced apart from each other and each extend between the second spiral coil pattern and an end portion of the second spiral coil pattern.

30. The coil assembly according to claim 23, wherein: The volume of the non-magnetic material powder is 50 vol% or more relative to the total volume of the cured product of the polymer resin.

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