Single-polarized packaged antenna and preparation method thereof

Abstract

The present invention provides a single-polarized packaged antenna and a preparation method thereof. The single-polarized packaged antenna comprises: a rewiring layer and a single-polarized antenna structure; the single-polarized antenna structure comprises an air cavity located in the packaging layer, with an antenna metal layer as the top and a metal wiring layer as the bottom, thereby reducing the loss of the packaged antenna in a mobile channel and making the signal transmission speed faster, so as to occupy a favorable position in the 5G market by virtue of its high speed and low latency characteristics.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor packaging and relates to a single-polarization packaged antenna and a preparation method thereof. Background Art

[0002] With the popularization of high-tech electronic products, especially in order to meet the needs of mobility, most high-tech electronic products have added wireless communication functions.

[0003] Antenna in Package (AiP) is a technology that integrates antennas and integrated circuits (ICs) in a package based on packaging materials and processes to achieve system-level wireless functions. It can carry highly integrated radio or radar transceiver modules. AiP technology conforms to the trend of increasing integration of silicon-based semiconductor processes and provides good antenna and packaging solutions for system-level wireless chips. Therefore, AiP technology has been widely used in radio and radar by chip manufacturers. AiP technology has achieved a good balance in performance, size, cost, etc., and is an important achievement in antenna technology in recent years.

[0004] With the advent of 5G (5th Generation) communications, higher requirements are placed on low latency, high speed, and large capacity communications. Among them, the main issue focuses on how to use antenna layout to reduce the loss of millimeter waves in mobile channels.

[0005] In view of this, it is necessary to design a new type of single-polarization packaged antenna and a preparation method thereof to reduce the signal loss of the packaged antenna. Summary of the invention

[0006] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a single-polarization packaged antenna and a preparation method thereof, so as to solve the problem of signal loss of the packaged antenna in the prior art.

[0007] To achieve the above-mentioned object and other related objects, the present invention provides a method for preparing a single-polarized packaged antenna, comprising the following steps:

[0008] Providing a supporting substrate, and forming a separation layer on the supporting substrate;

[0009] forming a rewiring layer on the separation layer, wherein the rewiring layer comprises a first surface in contact with the separation layer and a second surface opposite to the separation layer;

[0010] forming a metal connection column on the second surface of the rewiring layer, wherein the metal connection column is electrically connected to the rewiring layer;

[0011] forming a packaging layer, wherein the packaging layer covers the second surface of the rewiring layer and the metal connecting pillars and exposes the top surface of the metal connecting pillars;

[0012] Removing part of the encapsulation layer to form a groove penetrating the encapsulation layer to expose the metal wiring layer of the rewiring layer;

[0013] forming an air dielectric layer, wherein the air dielectric layer fills the groove;

[0014] forming an antenna metal layer on the packaging layer, wherein the antenna metal layer covers the air dielectric layer and is electrically connected to the metal connection column;

[0015] Removing the air dielectric layer to form an air cavity in the packaging layer, wherein the air cavity has the antenna metal layer as a top and the metal wiring layer as a bottom;

[0016] The separation layer and the supporting substrate are removed to expose the first surface of the rewiring layer.

[0017] Optionally, the air dielectric layer includes a PI dielectric layer.

[0018] Optionally, the step of forming the air dielectric layer includes:

[0019] Depositing an air dielectric layer material on the surface of the packaging layer, wherein the air dielectric layer material fills the groove;

[0020] exposing and developing the air dielectric layer material located in the groove;

[0021] Surface polarization is performed on the air dielectric layer material to form the air dielectric layer filling the groove.

[0022] Optionally, the method for forming the antenna metal layer includes an electroplating method, wherein the steps of preparing the antenna metal layer by the electroplating method include:

[0023] forming a metal seed layer on the surfaces of the packaging layer and the air dielectric layer;

[0024] forming a mask layer on the metal seed layer, and patterning the mask layer;

[0025] Antenna metal layer material is deposited, and the mask layer and the metal seed layer under the mask layer are removed to form the antenna metal layer.

[0026] Optionally, the mask layer includes one of a photoresist and a PI layer.

[0027] The present invention also provides a single-polarization packaged antenna, the single-polarization packaged antenna comprising:

[0028] a redistribution layer, the redistribution layer comprising a first surface and an opposite second surface;

[0029] A metal connection column formed on the second surface of the rewiring layer and electrically connected to the rewiring layer;

[0030] A packaging layer, covering the second surface of the rewiring layer and the metal connecting pillars, and the metal connecting pillars are exposed on the top surface of the packaging layer;

[0031] an air cavity penetrating the packaging layer to expose the metal wiring layer of the rewiring layer;

[0032] The antenna metal layer is located on the packaging layer and is electrically connected to the metal connection column, and the air cavity has the antenna metal layer as the top and the metal wiring layer as the bottom.

[0033] Optionally, a metal seed layer is further included between the antenna metal layer and the packaging layer.

[0034] Optionally, the metal wiring layer includes one or a combination of a copper layer, an aluminum layer, a nickel layer, a gold layer, a silver layer and a titanium layer; the antenna metal layer includes one or a combination of a copper layer, an aluminum layer, a nickel layer, a gold layer, a silver layer and a titanium layer.

[0035] Optionally, the metal connecting column includes one or a combination of a copper metal column, a gold metal column, a silver metal column and an aluminum metal column.

[0036] Optionally, the encapsulation layer includes one or a combination of a polyimide layer, a silicone layer and an epoxy resin layer.

[0037] As described above, the single-polarized packaged antenna and the preparation method thereof of the present invention form an air cavity in the packaging layer with the antenna metal layer as the top and the metal wiring layer as the bottom, thereby reducing the loss of the packaged antenna in the mobile channel and making the signal transmission faster, so as to occupy a favorable position in the 5G market with its high speed and low latency characteristics. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 Shown is a process flow chart of the preparation of the single-polarized packaged antenna in the present invention.

[0039] Figure 2 to Figure 17 It is a schematic diagram showing the structure of each step of preparing a single-polarized packaged antenna in the present invention, wherein: Fig.17 Shown is a schematic structural diagram of the single-polarized packaged antenna in the present invention.

[0040] Component number description

[0041] 101 Support base

[0042] 102 Separation Layer

[0043] 103 Rewiring Layer

[0044] 113 PI-0 Rewiring Dielectric Layer

[0045] 123 Metal seed layer

[0046] 133 M-1 Metal Wiring Layer

[0047] 143 PI-1 Rewiring Dielectric Layer

[0048] 153 M-2 Metal Wiring Layer

[0049] 163 PI-3 Rewiring Dielectric Layer

[0050] 173 M-3 Metal Wiring Layer

[0051] 104 Single-polarized antenna structure

[0052] 114 Metal connecting column

[0053] 124 Encapsulation Layer

[0054] 134 Groove

[0055] 144 PI dielectric layer material

[0056] 154 PI dielectric layer

[0057] 164 Metal seed layer

[0058] 174 Photoresist

[0059] 184 Antenna Metal Layer

[0060] 194 Air cavity DETAILED DESCRIPTION

[0061] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0062] See also Figure 1 to Figure 17It should be noted that the illustrations provided in this embodiment are only used to illustrate the basic concept of the present invention in a schematic manner, and the drawings only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0063] like Figure 1 The present embodiment provides a method for preparing a single-polarized packaged antenna. The single-polarized packaged antenna of the present embodiment forms an air cavity in the packaging layer with the antenna metal layer as the top and the metal wiring layer as the bottom, thereby reducing the loss of the packaged antenna in the mobile channel and making the signal transmission speed faster. With its high speed and low latency characteristics, it occupies a favorable position in the 5G market.

[0064] like Figure 2 to Figure 17 , which illustrates the structural schematic diagram presented in each step of preparing the single-polarized packaged antenna in this embodiment.

[0065] like Figure 2 First, a supporting substrate 101 is provided, and a separation layer 102 is formed on the supporting substrate 101 .

[0066] Specifically, the support substrate 101 may include one of a glass substrate, a metal substrate, a semiconductor substrate, a polymer substrate and a ceramic substrate; the separation layer 102 may include a polymer layer whose viscosity decreases under heating or light irradiation conditions, and the polymer layer may include an LTHC light-to-heat conversion layer. Since the glass substrate has a low cost, it is easy to form the separation layer 102 on its surface, and it can reduce the difficulty of the subsequent stripping process. Therefore, in this embodiment, the support substrate 101 is preferably a glass substrate, and the separation layer 102 is preferably coated on the surface of the support substrate 101 by a spin coating process, and the LTHC light-to-heat conversion layer is cured by an ultraviolet curing or a thermal curing process, so that in the subsequent stripping process, the LTHC light-to-heat conversion layer can be heated based on a laser to separate the support substrate 101 from the LTHC light-to-heat conversion layer.

[0067] like Figure 3 to Figure 7 , a rewiring layer 103 is formed on the separation layer 102, and the rewiring layer 103 includes a first surface in contact with the separation layer 102 and a second surface opposite to the separation layer 102.

[0068] Specifically, the rewiring layer 103 includes at least two metal wiring layers stacked together. Figure 7In this embodiment, the rewiring layer 103 includes 3 layers of the metal wiring layer, but it is not limited to this. According to needs, the rewiring layer 103 may also include only 2 layers or more layers of the metal wiring layer, such as 4 layers, 5 layers, etc. Among them, the material of the rewiring dielectric layer constituting the rewiring layer 103 may include one or a combination of epoxy resin, silica gel, PI, PBO, BCB, silicon oxide, phosphosilicate glass and fluorine-containing glass, and the material of the metal wiring layer constituting the rewiring layer 103 may include one or a combination of copper, aluminum, nickel, gold, silver and titanium. The method of making the rewiring dielectric layer may include one or a combination of physical vapor deposition and chemical vapor deposition, and the method of making the metal wiring layer may include one or a combination of physical vapor deposition, chemical vapor deposition, electroplating and chemical plating. The specific preparation method, material, number of layers and distribution morphology of the rewiring dielectric layer and the metal wiring layer can be selected according to specific needs and are not limited here.

[0069] like Figure 3 In this embodiment, a PI-0 rewiring dielectric layer 113 is first formed on the separation layer 102. Then, Figure 4 The metal seed layer 123 may be formed on the surface of the PI-0 rewiring dielectric layer 113 by evaporation or sputtering. The metal seed layer 123 may include a Ti / Cu layer. Figure 5 , forming an M-1 metal wiring layer 133 on the metal seed layer 123. The method for forming the M-1 metal wiring layer 133 may be electroplating, that is, depositing the M-1 metal wiring layer material on the metal seed layer 123, and patterning it to form the M-1 metal wiring layer 133. Of course, the method for forming the M-1 metal wiring layer 133 may also be physical vapor deposition, chemical vapor deposition, chemical plating, or a combination of physical vapor deposition, chemical vapor deposition, electroplating and chemical plating. The specific formation method is not overly limited here. Then, as Figure 6-7 , forming a PI-1 rewiring dielectric layer 143, an M-2 metal wiring layer 153, a PI-3 rewiring dielectric layer 163 and an M-3 metal wiring layer 173. The preparation method can be selected according to needs and will not be repeated here.

[0070] like Figures 8 to 16 , a single-polarized antenna structure 104 with an air cavity 194 is formed on the second surface of the rewiring layer 103 .

[0071] Specifically, Figure 8 , a metal connection column 114 is formed on the second surface of the re-distribution layer 103 , and the metal connection column 114 is electrically connected to the re-distribution layer 103 .

[0072] As a further embodiment of this embodiment, the method of forming the metal connecting column 114 may include one or a combination of wire bonding, physical vapor deposition, chemical vapor deposition, electroplating and chemical plating, and the material of the metal connecting column 114 may include one or a combination of copper, gold, silver and aluminum.

[0073] Afterwards, a packaging layer 124 is formed. The packaging layer 124 covers the second surface of the re-distribution layer 103 and the metal connecting pillars 114 , and exposes the top surfaces of the metal connecting pillars 114 .

[0074] As a further embodiment of this embodiment, the material of the encapsulation layer 124 may include one or a combination of polyimide, silicone and epoxy resin. The method of forming the encapsulation layer 124 may include one or a combination of compression molding, transfer molding, liquid sealing molding, vacuum lamination and spin coating. After the encapsulation layer 124 is formed, a chemical mechanical polishing method may be used to act on the upper surface of the encapsulation layer 124 to provide a flat encapsulation layer 124 to further improve product quality.

[0075] like Fig. 9 , a portion of the encapsulation layer 124 is removed to form a groove 134 penetrating the encapsulation layer 124 to expose the metal wiring layer of the re-wiring layer 103 .

[0076] Specifically, the method of removing the encapsulation layer 124 may include one or a combination of dry etching and wet etching. By removing part of the encapsulation layer 124, the groove 134 exposing the M-3 metal wiring layer 173 is formed in the encapsulation layer 124. The specific morphology and size of the groove 134 can be selected as needed and are not limited here.

[0077] Then, if Figure 10 to Figure 13 , forming an air dielectric layer, wherein the air dielectric layer fills the groove 134 .

[0078] As a further embodiment of this embodiment, the step of forming the air medium layer may include:

[0079] Depositing an air dielectric layer material on the surface of the packaging layer 124 , wherein the air dielectric layer material fills the groove 134 ;

[0080] exposing and developing the air dielectric layer material located in the groove 134;

[0081] The air dielectric layer material is subjected to surface polarization to form the air dielectric layer filling the groove 134 .

[0082] As a further example of this embodiment, the air dielectric layer may include a PI dielectric layer 154 .

[0083] Specifically, the air dielectric layer may be made of positive photoresist, negative photoresist or the PI dielectric layer 154. In this embodiment, the PI dielectric layer 154 with stable performance is preferably used to avoid affecting the air dielectric layer when the antenna metal layer is subsequently formed.

[0084] Specifically, Fig.10 , forming a PI dielectric layer material 144 on the surface of the packaging layer 124 to fill the groove 134. Figure 11 to Figure 13 , the PI dielectric layer material 144 in the groove 134 is exposed and developed, and a surface polarization process is used to form the PI dielectric layer 154 filling the groove 134. It is preferred that the PI dielectric layer 154 and the packaging layer 124 have the same horizontal plane to reduce the difficulty of the subsequent process of preparing the antenna metal layer.

[0085] Afterwards, if Figure 13 to Figure 15 , an antenna metal layer 184 is formed on the packaging layer 124 , the antenna metal layer 184 covers the air dielectric layer, and the antenna metal layer 184 is electrically connected to the metal connecting column 114 .

[0086] As a further embodiment of this embodiment, the method for forming the antenna metal layer 184 may include an electroplating method, wherein the steps of preparing the antenna metal layer 184 by the electroplating method may include:

[0087] Forming a metal seed layer 164 on the surfaces of the packaging layer 124 and the air dielectric layer;

[0088] forming a mask layer on the metal seed layer 164 and patterning the mask layer;

[0089] Antenna metal layer material is deposited, and the mask layer and the metal seed layer 164 under the mask layer are removed to form the antenna metal layer 184 .

[0090] As a further embodiment of this embodiment, the mask layer may include one of a photoresist and a PI layer.

[0091] Specifically, Fig.13 , forming the metal seed layer 164 on the surface of the packaging layer 124 and the PI dielectric layer 154. Then, as Fig.14 , forming a photoresist material on the metal seed layer 164, and patterning the photoresist material to form the photoresist 174. Fig.15 and Fig.16, depositing antenna metal layer material, and removing the photoresist 174 and the metal seed layer 164 located below the photoresist 174 to form the antenna metal layer 184 covering the PI dielectric layer 154 .

[0092] Afterwards, if Fig.16 , the air dielectric layer is removed to form the air cavity 194 in the packaging layer 124, wherein the air cavity 194 has the antenna metal layer 184 as the top and the metal wiring layer as the bottom.

[0093] Specifically, the method for removing the photoresist 174 and the PI dielectric layer 154 may be wet etching, but is not limited thereto. In the present embodiment, the method for forming the antenna metal layer 184 is electroplating, and the mask layer is photoresist 174, but is not limited thereto. For example, the method for forming the antenna metal layer 184 may also be physical vapor deposition, chemical vapor deposition, chemical plating, or a combination of physical vapor deposition, chemical vapor deposition, electroplating, and chemical plating, and the specific formation method is not overly limited here. The mask layer may also be the PI layer, and when the PI layer and the PI dielectric layer 154 are made of the same material, only one wet etching process may be performed to remove the PI dielectric layer 154 located in the groove 134 and on the surface of the encapsulation layer 124.

[0094] Afterwards, if Fig.17 , remove the separation layer 102 and the supporting substrate 101 to expose the first surface of the rewiring layer 103.

[0095] Specifically, after removing the separation layer 102 and the supporting substrate 101 to expose the bottom surface of the PI-0 rewiring dielectric layer 113 of the rewiring layer 103, a semiconductor chip and metal bumps electrically connected to the metal wiring layer can be formed on the rewiring layer 103 as needed, which will not be introduced here.

[0096] This embodiment also provides a single-polarized packaged antenna, and the preparation method of the single-polarized packaged antenna can adopt the above preparation method, but is not limited thereto. The single-polarized packaged antenna of this embodiment forms an air cavity in the packaging layer with the antenna metal layer as the top and the metal wiring layer as the bottom, thereby reducing the loss of the packaged antenna in the mobile channel, making the signal transmission speed faster, so as to occupy a favorable position in the 5G market with its high speed and low latency characteristics.

[0097] like Fig.17 The single-polarized packaged antenna includes: a rewiring layer 103 and a single-polarized antenna structure 104.

[0098] Specifically, the single-polarized packaged antenna includes:

[0099] A rewiring layer 103, wherein the rewiring layer 103 includes a first surface and an opposite second surface;

[0100] A metal connection column 114 is formed on the second surface of the rewiring layer 103 and is electrically connected to the rewiring layer 103;

[0101] A packaging layer 124 covers the second surface of the rewiring layer 103 and the metal connecting pillars 114, and the top surface of the packaging layer 124 exposes the metal connecting pillars 114;

[0102] An air cavity 194 penetrates the packaging layer 124 to expose the metal wiring layer of the rewiring layer 103;

[0103] The antenna metal layer 184 is located on the packaging layer 124 and is electrically connected to the metal connection column 114 , and the air cavity 194 has the antenna metal layer 184 as the top and the metal wiring layer as the bottom.

[0104] As a further embodiment of this embodiment, a metal seed layer 164 may be further included between the antenna metal layer 184 and the packaging layer 124 .

[0105] As a further embodiment of this embodiment, the metal wiring layer may include one or a combination of a copper layer, an aluminum layer, a nickel layer, a gold layer, a silver layer and a titanium layer; the antenna metal layer 184 may include one or a combination of a copper layer, an aluminum layer, a nickel layer, a gold layer, a silver layer and a titanium layer.

[0106] As a further embodiment of this embodiment, the metal connection column 114 may include one or a combination of a copper metal column, a gold metal column, a silver metal column and an aluminum metal column.

[0107] As a further embodiment of this embodiment, the packaging layer 124 may include one or a combination of a polyimide layer, a silicone layer, and an epoxy resin layer.

[0108] As a further embodiment of this embodiment, a semiconductor chip and metal bumps located on the first surface of the rewiring layer 103 may also be included.

[0109] In summary, the single-polarized packaged antenna and its preparation method of the present invention form an air cavity in the packaging layer with the antenna metal layer as the top and the metal wiring layer as the bottom, thereby reducing the loss of the packaged antenna in the mobile channel, making the signal transmission speed faster, and occupying a favorable position in the 5G market with its high speed and low latency. Therefore, the present invention effectively overcomes the various shortcomings of the prior art and has a high industrial utilization value.

[0110] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A method for preparing a single-polarized packaged antenna, characterized in that: The following steps are involved: Providing a supporting substrate, and forming a separation layer on the supporting substrate; forming a rewiring layer on the separation layer, wherein the rewiring layer comprises a first surface in contact with the separation layer and a second surface opposite to the separation layer; forming a metal connection column on the second surface of the rewiring layer, wherein the metal connection column is electrically connected to the rewiring layer; forming a packaging layer, wherein the packaging layer covers the second surface of the rewiring layer and the metal connecting pillars and exposes the top surface of the metal connecting pillars; Removing part of the encapsulation layer to form a groove penetrating the encapsulation layer to expose the metal wiring layer of the rewiring layer; forming an air dielectric layer, wherein the air dielectric layer fills the groove; forming an antenna metal layer on the packaging layer, wherein the antenna metal layer covers the air dielectric layer and is electrically connected to the metal connection column; Removing the air dielectric layer to form an air cavity in the packaging layer, wherein the air cavity has the antenna metal layer as a top and the metal wiring layer as a bottom; The separation layer and the supporting substrate are removed to expose the first surface of the rewiring layer.

2. The method for preparing the single-polarized packaged antenna according to claim 1, characterized in that: The air dielectric layer includes a PI dielectric layer.

3. The method for preparing a single-polarized packaged antenna according to claim 1, characterized in that: The steps of forming the air dielectric layer include: Depositing an air dielectric layer material on the surface of the packaging layer, wherein the air dielectric layer material fills the groove; exposing and developing the air dielectric layer material located in the groove; Surface polarization is performed on the air dielectric layer material to form the air dielectric layer filling the groove.

4. The method for preparing a single-polarized packaged antenna according to claim 1, characterized in that: The method for forming the antenna metal layer includes an electroplating method, wherein the steps of preparing the antenna metal layer by the electroplating method include: forming a metal seed layer on the surfaces of the packaging layer and the air dielectric layer; forming a mask layer on the metal seed layer, and patterning the mask layer; Antenna metal layer material is deposited, and the mask layer and the metal seed layer under the mask layer are removed to form the antenna metal layer.

5. The method for preparing the single-polarized packaged antenna according to claim 4, characterized in that: The mask layer includes one of a photoresist and a PI layer.

6. A single-polarized packaged antenna, characterized in that: The single-polarized packaged antenna comprises: a redistribution layer, the redistribution layer comprising a first surface and an opposite second surface; A metal connection column formed on the second surface of the rewiring layer and electrically connected to the rewiring layer; A packaging layer, covering the second surface of the rewiring layer and the metal connecting pillars, and the metal connecting pillars are exposed on the top surface of the packaging layer; an air cavity penetrating the packaging layer to expose the metal wiring layer of the rewiring layer; An antenna metal layer is located on the packaging layer and is electrically connected to the metal connection column, and the air cavity has the antenna metal layer as a top and the metal wiring layer as a bottom; The metal connection column includes one or a combination of a copper metal column, a gold metal column, a silver metal column and an aluminum metal column; The packaging layer includes one or a combination of a polyimide layer, a silicone layer and an epoxy resin layer.

7. The single-polarized packaged antenna according to claim 6, characterized in that: A metal seed layer is further included between the antenna metal layer and the packaging layer.

8. The single-polarized packaged antenna according to claim 6, characterized in that: The metal wiring layer includes one or a combination of a copper layer, an aluminum layer, a nickel layer, a gold layer, a silver layer and a titanium layer; the antenna metal layer includes one or a combination of a copper layer, an aluminum layer, a nickel layer, a gold layer, a silver layer and a titanium layer.

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