Automatic laser marking machine for wafer samples

Abstract

The present invention provides an automatic laser marking machine for wafer samples, and relates to the technical field of automatic laser marking. The automatic laser marking machine for wafer samples provided by the present invention comprises: a marking device, a material storage and pushing device, and a transfer device; the marking device and the material storage and pushing device are arranged relative to each other, and the transfer device is arranged downstream of the material storage and pushing device; the material storage and pushing device is used to store materials and convey the materials to move in a direction close to the marking device; the transfer device transfers the materials marked in the material storage and pushing device. The automatic laser marking machine for wafer samples provided by the present invention can alleviate the technical problem that the materials to be marked and the marked materials are easily mixed in the prior art.

Description

Technical Field

[0001] The invention relates to the technical field of automatic laser marking, in particular to an automatic laser marking machine for wafer samples. Background Art

[0002] In the prior art, laser marking is used to mark blanks, thereby forming codes, QR codes, bar codes and other labels. During the marking process, the material to be marked and the marked material are easily mixed, which is not conducive to distinguishing the marked materials. In addition, the distance between the material and the marking device needs to be strictly controlled during the marking process, otherwise the label cannot be accurately marked on the material. Summary of the invention

[0003] The object of the present invention is to provide an automatic laser marking machine for wafer samples, so as to alleviate the technical problem in the prior art that the material to be marked and the marked material are easily mixed.

[0004] In a first aspect, the present invention provides an automatic laser marking machine for wafer samples, comprising: a marking device, a material storage and pushing device, and a transfer device;

[0005] The marking device is arranged opposite to the material storage and pushing device, and the transfer device is arranged downstream of the material storage and pushing device;

[0006] The material storage and pushing device is used to store materials and convey the materials to move in a direction close to the marking device;

[0007] The transfer device transfers the material that has been marked in the material storage and pushing device.

[0008] In combination with the first aspect, the present invention provides a first possible implementation manner of the first aspect, wherein the material storage and pushing device comprises: a material storage barrel and a material pusher, wherein a fixed end of the material pusher is connected to the material storage barrel;

[0009] The material storage barrel is used to store the material, and the pusher is used to push the material in the material storage barrel out.

[0010] In combination with the first possible implementation of the first aspect, the present invention provides a second possible implementation of the first aspect, wherein the storage barrel comprises: a guide ring, a base and a guide rod;

[0011] A plurality of guide rods are connected between the guide ring and the base, and the plurality of guide rods are arranged at intervals around the axis of the guide ring.

[0012] In combination with the first possible implementation manner of the first aspect, the present invention provides a third possible implementation manner of the first aspect, wherein the pusher comprises: a pushing cylinder and a pushing working piece, and the pushing working piece is connected to the movable end of the pushing cylinder.

[0013] In combination with the first aspect, the present invention provides a fourth possible implementation manner of the first aspect, wherein the transfer device comprises: a suction cup and a transfer drive, and the suction cup is connected to the transfer drive.

[0014] In combination with the fourth possible implementation of the first aspect, the present invention provides a fifth possible implementation of the first aspect, wherein the transfer drive comprises: a swing arm and a motor, the suction cup is connected to one end of the swing arm, the other end of the swing arm is connected to the drive shaft of the motor, and the extension direction of the swing arm is perpendicular to the drive shaft.

[0015] In combination with the first aspect, the present invention provides a sixth possible implementation of the first aspect, wherein the automatic laser marking machine for wafer samples also includes a positioner, which is installed between the marking device and the material storage and pushing device, and the positioner has a positioning surface adapted to the material.

[0016] In combination with the sixth possible implementation manner of the first aspect, the present invention provides a seventh possible implementation manner of the first aspect, wherein the positioner is transmission-connected to the positioning drive member.

[0017] In combination with the seventh possible implementation manner of the first aspect, the present invention provides an eighth possible implementation manner of the first aspect, wherein the positioner has a first station and a second station;

[0018] At the first station, the positioner is facing the material storage pushing device;

[0019] At the second station, the positioner is located beside the storage material pushing device.

[0020] In combination with the first aspect, the present invention provides a ninth possible implementation manner of the first aspect, wherein the marking device, the material storage and pushing device and the transfer device are respectively installed on a workbench, and a material discharge hopper is installed on the workbench.

[0021] The embodiments of the present invention bring the following beneficial effects: a marking device and a material storage and pushing device are arranged relative to each other, a transfer device is arranged downstream of the material storage and pushing device, materials are stored in the material storage and pushing device and conveyed toward the marking device, and the transfer device transfers the marked materials in the material storage and pushing device, thereby separating the materials to be marked from the marked materials, thereby avoiding mixing of the materials to be marked and the marked materials.

[0022] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the related technologies, the drawings required for use in the specific embodiments or the related technical descriptions will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 A front view of the automatic laser marking machine for wafer samples provided by an embodiment of the present invention;

[0025] Figure 2 A top view of the automatic laser marking machine for wafer samples provided by an embodiment of the present invention;

[0026] Figure 3 A schematic diagram of a material storage barrel of an automatic laser marking machine for wafer samples provided in an embodiment of the present invention.

[0027] Icons: 001 - marking device; 002 - material storage and pushing device; 210 - material storage barrel; 211 - guide ring; 212 - base; 213 - guide rod; 220 - pusher; 221 - push cylinder; 222 - push working piece; 003 - transfer device; 310 - suction cup; 320 - transfer drive; 321 - swing arm; 322 - motor; 004 - positioner; 005 - workbench; 006 - hopper. DETAILED DESCRIPTION

[0028] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance. Physical quantities in formulas, if not separately marked, should be understood as basic quantities of the base units of the International System of Units, or derived quantities derived from the basic quantities through mathematical operations such as multiplication, division, differentiation or integration.

[0030] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0031] Embodiment 1

[0032] like Figure 1 As shown, the automatic laser marking machine for wafer samples provided by the embodiment of the present invention includes: a marking device 001, a material storage and pushing device 002 and a transfer device 003; the marking device 001 and the material storage and pushing device 002 are arranged opposite to each other, and the transfer device 003 is arranged downstream of the material storage and pushing device 002; the material storage and pushing device 002 is used to store materials and transport the materials toward the direction close to the marking device 001; the transfer device 003 transfers the materials marked in the material storage and pushing device 002.

[0033] Specifically, the marking device 001 uses a laser marking device to form a permanent mark on the surface of the material, and the material storage and pushing device 002 can store the material and transport the material toward the marking device 001, thereby adjusting the distance between the material and the marking device 001. The transfer device 003 can remove the marked material from the material storage and pushing device 002, thereby separating the material to be marked from the marked material.

[0034] In the embodiment of the present invention, the material storage and pushing device 002 includes: a material storage barrel 210 and a pusher 220, the fixed end of the pusher 220 is connected to the material storage barrel 210; the material storage barrel 210 is used to store materials, and the pusher 220 is used to push out the materials in the material storage barrel 210.

[0035] Specifically, the storage barrel 210 can be used to store materials. When the storage barrel 210 stores a wafer workpiece, the wafer workpiece can move along the axial direction of the storage barrel 210 and cooperate with the wafer workpiece through the inner side wall of the storage barrel 210 to prevent the wafer workpiece from flipping over.

[0036] like Figure 1 and Figure 3 As shown, the storage barrel 210 includes: a guide ring 211, a base 212 and a guide rod 213; a plurality of guide rods 213 are connected between the guide ring 211 and the base 212, and the plurality of guide rods 213 are arranged at intervals around the axis of the guide ring 211.

[0037] Specifically, there is a gap between any two adjacent guide rods 213, and when the wafer workpiece moves in the storage barrel 210, the gas in the storage barrel 210 can flow through the gap, thereby ensuring the balance of air pressure inside and outside the storage barrel 210. The inner diameter of the guide ring 211 is larger than the radial dimension of the material, so that the material can enter and exit the inner cavity of the storage barrel 210 through the opening of the guide ring 211.

[0038] Furthermore, the pusher 220 includes a pushing cylinder 221 and a pushing working piece 222 , and the pushing working piece 222 is connected to the movable end of the pushing cylinder 221 .

[0039] Specifically, an annular structure is adopted, and the inner diameter of the annular structure is smaller than the radial dimension of the material, and the pusher 220 can pass through the annular structure and extend into the storage barrel 210. The pusher cylinder 221 is telescopically driven to drive the pusher working piece 222 to move, and the pusher working piece 222 pushes the material out of the storage barrel 210.

[0040] like Figure 1 and Figure 2 As shown, the transfer device 003 includes: a suction cup 310 and a transfer driving component 320, and the suction cup 310 is connected to the transfer driving component 320.

[0041] Specifically, the suction cup 310 can absorb the wafer workpiece, and the transfer drive 320 drives the suction cup 310 to move, so that the marked wafer workpiece can be removed from the storage barrel 210.

[0042] Furthermore, the transfer drive component 320 includes: a swing arm 321 and a motor 322, the suction cup 310 is connected to one end of the swing arm 321, the other end of the swing arm 321 is connected to the driving shaft of the motor 322, and the extension direction of the swing arm 321 is perpendicular to the driving shaft.

[0043] Specifically, the motor 322 drives the swing arm 321 to rotate around the rotation axis, and the swing arm 321 drives the suction cup 310 to move, thereby transporting the wafer workpiece.

[0044] like Figure 1As shown, the automatic laser marking machine for wafer samples also includes a positioner 004, which is installed between the marking device 001 and the material storage and pushing device 002, and the positioner 004 has a positioning surface adapted to the material.

[0045] Specifically, the pusher 220 pushes the material to move along the material storage barrel 210 , and the material abuts against the positioning surface of the positioner 004 , thereby ensuring that the position of the material relative to the marking device 001 is fixed.

[0046] Furthermore, the positioner 004 is transmission-connected to the positioning drive member.

[0047] The positioning drive can drive the positioner 004 to move. When the positioner 004 is facing the opening of the storage barrel 210, the pusher 220 pushes the material from the storage barrel 210 to move toward the marking device 001 until the material abuts against the positioner 004, and the marking device 001 marks the material. When marking is completed, the pusher 220 shrinks, the positioning drive drives the positioner 004 to move away from the opening of the storage barrel 210, and the transfer drive 320 drives the suction cup 310 to absorb the marked material, thereby separating the material to be marked from the marked material.

[0048] Furthermore, the positioner 004 has a first station and a second station; at the first station, the positioner 004 is directly opposite to the material storage pushing device 002; at the second station, the positioner 004 is located beside the material storage pushing device 002.

[0049] Specifically, the positioner 004 has an opening, and the marking device 001 can pass through the opening to mark the material at the first station. The end surface of the positioner 004 facing away from the marking device 001 forms a positioning surface, and when the pusher 220 pushes the material to abut against the positioning surface, the marking device 001 starts to mark the material. At the second station, the positioner 004 avoids the opening of the storage barrel 210, so as to prevent the positioner 004 from blocking the transport drive 320 from transporting the marked material.

[0050] like Figure 1 and Figure 2 As shown, the marking device 001 , the material storage and pushing device 002 and the transfer device 003 are respectively installed on the workbench 005 , and the material hopper 006 is installed on the workbench 005 .

[0051] Specifically, a plurality of discharge hoppers 006 are respectively installed on the workbench 005 , and the wafer workpieces can be stored in the discharge hoppers 006 , and the materials to be marked and the marked materials are stored separately, so as to avoid mixing the materials to be marked and the marked materials.

[0052] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An automatic laser marking machine for wafer samples, characterized in that: include: A marking device (001), a material storage and pushing device (002) and a transfer device (003); The marking device (001) is arranged opposite to the material storage and pushing device (002), and the transfer device (003) is arranged downstream of the material storage and pushing device (002); The material storage and pushing device (002) is used to store materials and transport the materials toward a direction close to the marking device (001); The transfer device (003) transfers the material that has been marked in the material storage and pushing device (002); The automatic laser marking machine for wafer samples further comprises a positioner (004), the positioner (004) being installed between the marking device (001) and the material storage and pushing device (002), and the positioner (004) having a positioning surface adapted to the material; The marking device (001), the material storage and pushing device (002) and the transfer device (003) are respectively installed on a workbench (005), and a material discharge hopper (006) is installed on the workbench (005).

2. The automatic laser marking machine for wafer samples according to claim 1, characterized in that: The material storage and pushing device (002) comprises: a material storage barrel (210) and a material pusher (220), wherein a fixed end of the material pusher (220) is connected to the material storage barrel (210); The material storage barrel (210) is used to store the material, and the pusher (220) is used to push the material out of the material storage barrel (210).

3. The automatic laser marking machine for wafer samples according to claim 2, characterized in that: The material storage barrel (210) comprises: a guide ring (211), a base (212) and a guide rod (213); The plurality of guide rods (213) are connected between the guide ring (211) and the base (212), and the plurality of guide rods (213) are arranged at intervals around the axis of the guide ring (211).

4. The automatic laser marking machine for wafer samples according to claim 2, characterized in that: The pusher (220) comprises a push cylinder (221) and a push working piece (222), wherein the push working piece (222) is connected to the movable end of the push cylinder (221).

5. The automatic laser marking machine for wafer samples according to claim 1, characterized in that: The transfer device (003) comprises: a suction cup (310) and a transfer driving component (320), and the suction cup (310) is connected to the transfer driving component (320).

6. The automatic laser marking machine for wafer samples according to claim 5, characterized in that: The transfer drive member (320) comprises: a swing arm (321) and a motor (322), the suction cup (310) is connected to one end of the swing arm (321), the other end of the swing arm (321) is connected to the drive shaft of the motor (322), and the extension direction of the swing arm (321) is perpendicular to the drive shaft.

7. The automatic laser marking machine for wafer samples according to claim 1, characterized in that: The positioner (004) is in transmission connection with the positioning drive member.

8. The automatic laser marking machine for wafer samples according to claim 7, characterized in that: The positioner (004) has a first station and a second station; At the first workstation, the positioner (004) faces the material storage pushing device (002); At the second workstation, the positioner (004) is located beside the material storage pushing device (002).

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