Substrate processing device and rotating assembly
By forming a downward airflow between the hollow shaft and the fixed shaft of the substrate processing device, the particles generated during rotation are removed, and the substrate defects and life shortening problems caused by bearing wear are solved, and the processing quality and equipment reliability are improved.
Patent Information
- Application Number
- CN202010697613.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2019-07-18
- Filing Date
- 2020-07-20
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2040-07-20
AI Technical Summary
During substrate processing, bearing wear between the rotary chuck and the fixed shaft generates particles, resulting in substrate defects and shortened bearing life.
By forming a downward air flow between the hollow shaft and the fixed shaft, the generated particles are removed when rotated by the air flow generator, thereby reducing friction with the bearing.
It effectively reduces the adhesion of particles to the substrate and the reduction of bearing life, and improves the quality of substrate processing and the reliability of equipment.
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Figure CN112242328B_ABST
Abstract
Description
Technical Field
[0001] Embodiments of the inventive concepts described herein relate to a substrate processing apparatus and a rotating assembly. Background Art
[0002] Semiconductor devices are manufactured by performing various processes such as photolithography, vapor deposition, ashing, etching, and ion implantation. Before and after these processes, a cleaning process is performed to clean particles remaining on the substrate.
[0003] The cleaning process is performed by dispensing a cleaning solution onto the opposite surface of the substrate supported on the spin chuck. The lower surface of the substrate is cleaned by a processing liquid provided by a lower liquid dispensing unit between the spin chuck supporting the substrate and the lower surface of the substrate.
[0004] Figure 1 1 is a view showing a general substrate processing apparatus 1000 , which may include a spin chuck 1100 , a hollow shaft 1200 , a hollow motor 1300 , a fixed shaft 1400 , and a fluid distribution pipe 1500 .
[0005] A chuck pin 1110 and an elevating pin 1120 are provided on the rotary chuck 1100. The chuck pin 1110 may move in a lateral direction and support a side surface of the substrate W. The elevating pin 1120 may raise or lower the substrate W in an up-and-down direction and may support a lower surface of the substrate W. The substrate W is supported on the rotary chuck 1100 by the elevating pin 1120 and the chuck pin 1110.
[0006] The rotary chuck 1100 is coupled with the hollow shaft 1200. The hollow shaft 1200 has a space therein and is connected with the hollow motor 1300. The hollow motor 1300 rotates the hollow shaft 1200, and the hollow shaft 1200 rotates the rotary chuck 1100.
[0007] The fixed shaft 1400 is disposed in the inner space of the hollow shaft 1200. The fluid distributing pipe 1500 is disposed in the fixed shaft 1400. The fluid distributing pipe 1500 distributes the fluid to the lower surface of the substrate W. Even if the spin chuck 1100 rotates, the fixed shaft 1400 is fixed.
[0008] The bearing 1130 is disposed in a space between the fixed shaft 1400 and the spin chuck 1100. When the hollow motor 1300 rotates the spin chuck 1100, the bearing 1130 generates friction with the spin chuck 1100 and the fixed shaft 1400. Therefore, the bearing 1130 wears and generates particles P. The particles P may move upward and adhere to the substrate W. The particles P may cause defects in the substrate processing process. Moreover, if the particles P remain around the bearing 1130, when the spin chuck 1100 rotates, the particles P may generate friction with the bearing 1130. Therefore, the life of the bearing 1130 is shortened. Summary of the invention
[0009] Embodiments of the inventive concept provide a substrate processing apparatus for efficiently processing a substrate.
[0010] Also, embodiments of the inventive concept provide a substrate processing apparatus for minimizing adhesion of particles to a substrate during processing of the substrate.
[0011] Furthermore, embodiments of the inventive concept provide a substrate treating apparatus for effectively exhausting particles generated in a supporting unit.
[0012] In addition, embodiments of the present inventive concept provide a rotating assembly for effectively discharging particles generated when a body is rotated.
[0013] Technical problems to be solved by the present inventive concept are not limited to the above-mentioned problems, and any other technical problems not mentioned herein will be clearly understood by those skilled in the art to which the present inventive concept belongs from the following description.
[0014] According to an exemplary embodiment, a device for processing a substrate includes: a support unit including a support plate supporting the substrate and a rotation driving member rotating the support plate; and a lower fluid distribution unit that distributes a fluid onto a lower surface of the substrate supported on the support plate. The rotation driving member includes a hollow shaft coupled to the support plate and an actuator rotating the hollow shaft. The lower fluid distribution unit includes: a fixed shaft having an internal space and disposed in the hollow shaft; and a fluid distribution pipe that distributes the fluid and is disposed in the internal space. An airflow generating portion is formed on an outer surface of the fixed shaft to generate a downward airflow in a space between the hollow shaft and the fixed shaft when the hollow shaft rotates.
[0015] According to one embodiment, the airflow generating portion may have a spiral shape.
[0016] According to one embodiment, the device may further include a controller that controls the rotation drive member, and the controller may control the rotation drive member to rotate the hollow shaft in the same direction as the spiral direction of the airflow generating part.
[0017] According to one embodiment, the airflow generating portion may be formed as a protrusion on an outer surface of the fixing shaft.
[0018] According to one embodiment, the airflow generating portion may be formed as a groove on the outer surface of the fixing shaft.
[0019] According to one embodiment, the fluid distribution pipe may include a liquid distribution pipe that distributes the process liquid and a gas distribution pipe that distributes the drying gas, and the liquid distribution pipe and the gas distribution pipe may be disposed in the inner space.
[0020] According to one embodiment, the hollow shaft and the fixed shaft may be positioned spaced apart from each other.
[0021] According to one embodiment, a bearing may be provided in the space between the support plate and the fixed shaft.
[0022] According to an exemplary embodiment, a device for processing a substrate includes: a support unit including a support plate supporting the substrate; a rotation drive member that rotates the support plate; and a lower fluid distribution unit that distributes a fluid onto a lower surface of the substrate supported on the support plate. The rotation drive member includes a hollow shaft coupled to the support plate and an actuator that rotates the hollow shaft. The lower fluid distribution unit includes: a fixed shaft having an internal space and disposed in the hollow shaft; and a fluid distribution pipe that distributes the fluid and is disposed in the internal space. An airflow generating portion is formed on an inner surface of the hollow shaft to generate a downward airflow in a space between the hollow shaft and the fixed shaft when the hollow shaft rotates.
[0023] According to one embodiment, the airflow generating portion may have a spiral shape.
[0024] According to one embodiment, the device may further include a controller that controls the rotation drive member, and the controller may control the rotation drive member to rotate the hollow shaft in the same direction as the spiral direction of the airflow generating part.
[0025] According to one embodiment, the airflow generating portion may be formed as a protrusion on the inner surface of the hollow shaft.
[0026] According to one embodiment, the airflow generating portion may be formed as a groove on the inner surface of the hollow shaft.
[0027] According to an exemplary embodiment, a rotating assembly includes a body, a hollow shaft coupled to the body to rotate the body, and an insert disposed in the hollow shaft and positioned to be spaced apart from the hollow shaft, the insert being fixed in place when the hollow shaft rotates. An airflow generating portion is formed on an outer surface of the insert to generate a downward airflow in a space between the hollow shaft and the insert when the hollow shaft rotates.
[0028] According to one embodiment, the airflow generating portion may have a spiral shape.
[0029] According to one embodiment, the air flow generating portion may be formed as a protrusion on the outer surface of the insert.
[0030] According to one embodiment, the air flow generating portion may be formed as a groove on the outer surface of the insert.
[0031] According to an exemplary embodiment, the rotating assembly includes a body, a hollow shaft coupled to the body to rotate the body, and an insert disposed in the hollow shaft and positioned to be spaced apart from the hollow shaft, the insert being fixed in place when the hollow shaft rotates. An airflow generating portion may be formed on the inner surface of the hollow shaft to generate a downward airflow in a space between the hollow shaft and the insert when the hollow shaft rotates.
[0032] According to one embodiment, the airflow generating portion may have a spiral shape.
[0033] According to one embodiment, the airflow generating portion may be formed as a protrusion on the inner surface of the hollow shaft.
[0034] According to one embodiment, the airflow generating portion may be formed as a groove on the inner surface of the hollow shaft. BRIEF DESCRIPTION OF THE DRAWINGS
[0035] The above and other objects and features will become apparent from the following description with reference to the accompanying drawings, wherein like reference numerals refer to like parts throughout the various drawings unless otherwise specified, and wherein:
[0036] Figure 1 is a diagram showing a general substrate processing apparatus;
[0037] Figure 2 is a plan view illustrating a substrate processing apparatus according to an embodiment of the present inventive concept;
[0038] Figure 3 It is shown Figure 2 A cross-sectional view of a substrate processing apparatus;
[0039] Figure 4 is a cross-sectional view showing a portion of a support unit, a lower fluid distribution unit, and a rotation driving member according to the present inventive concept;
[0040] Figure 5 It is shown Figure 4 a view of a lower fluid distribution unit;
[0041] Figure 6 is a view showing a state in which the support unit is rotated by the rotation drive member;
[0042] Figure 7 is a view showing a lower fluid distribution unit according to another embodiment of the present inventive concept;
[0043] Figure 8 is a view showing a rotation driving member according to another embodiment of the present inventive concept;
[0044] Fig. 9 is a view showing a rotation driving member according to another embodiment of the present inventive concept;
[0045] Fig.10 is a view showing a supporting unit according to another embodiment of the present inventive concept;
[0046] Fig.11 is a view showing a supporting unit according to another embodiment of the present inventive concept;
[0047] Fig.12 is a view illustrating a rotating assembly according to an embodiment of the present inventive concept; and
[0048] Fig.13 is a view illustrating a rotation assembly according to another embodiment of the present inventive concept. DETAILED DESCRIPTION
[0049] Hereinafter, the embodiments of the inventive concept will be described in more detail with reference to the accompanying drawings so that those skilled in the art associated with the inventive concept can easily implement the inventive concept. However, the inventive concept can be implemented in various different forms and is not limited to the embodiments described herein. In addition, when describing the embodiments of the inventive concept, when the detailed descriptions related to the known functions or configurations may unnecessarily make the subject matter of the inventive concept unclear, they will be omitted. In addition, throughout the accompanying drawings, components that perform similar functions and operations have the same reference numerals.
[0050] The terms "include" and "comprising" in the specification are "open" expressions, which only indicate the existence of corresponding components, and unless there is a specific description to the contrary, other components are not excluded but may be included. Specifically, it should be understood that the terms "include", "comprising" and "having" when used in this document specify the existence of the features, integers, steps, operations, components and / or parts, but do not exclude the existence or addition of one or more other features, integers, steps, operations, components, parts and / or groups.
[0051] Unless otherwise specified, terms in the singular may include plural forms. Furthermore, in the drawings, the shapes and sizes of components may be exaggerated for clarity of illustration.
[0052] In the following, reference will be made to Figures 2 to 13 Embodiments of the inventive concept are described in detail.
[0053] Figure 2 is a plan view showing a substrate processing apparatus according to an embodiment of the present inventive concept. Figure 2, the substrate processing apparatus 1 has an indexing module 10 and a processing module 20. The indexing module 10 has a loading port 120 and a transfer frame 140. The loading port 120, the transfer frame 140, and the processing module 20 are sequentially arranged in a row. Hereinafter, the arrangement direction of the loading port 120, the transfer frame 140, and the processing module 20 is referred to as a first direction 12, a direction perpendicular to the first direction 12 when viewed from above is referred to as a second direction 14, and a direction perpendicular to a plane including the first direction 12 and the second direction 14 is referred to as a third direction 16.
[0054] The carrier 130 in which the substrate W is loaded is placed on the load port 120. A plurality of load ports 120 are provided. The load ports 120 are arranged in a row along the second direction 14. The number of the load ports 120 may be increased or decreased according to the processing efficiency and the footprint of the process module 20. The carrier 130 has a plurality of slots (not shown) formed therein, in which the substrate W is received in a horizontal position relative to the ground. A front opening unified pod (FOUP) may be used as the carrier 130.
[0055] The processing module 20 has a buffer unit 220, a transfer chamber 240 and a processing chamber 260. The transfer chamber 240 is arranged in a manner that its length direction is parallel to the first direction 12. The processing chamber 260 is arranged on the opposite side of the transfer chamber 240. On the opposite side of the transfer chamber 240, the processing chambers 260 are arranged to be symmetrical to each other relative to the transfer chamber 240. A plurality of processing chambers 260 are arranged on one side of the transfer chamber 240. Some of the processing chambers 260 are arranged along the length direction of the transfer chamber 240. In addition, other processing chambers 260 are stacked on each other. That is, the processing chambers 260 can be arranged in an A×B array on one side of the transfer chamber 240. Here, "A" represents the number of processing chambers 260 arranged in rows along the first direction 12, and "B" represents the number of processing chambers 260 arranged in columns along the third direction 16. In the case where four or six processing chambers 260 are disposed on one side of the transfer chamber 240, the processing chambers 260 may be disposed in a 2×2 or 3×2 array. The number of processing chambers 260 may be increased or decreased. Alternatively, the processing chambers 260 may be disposed only on one side of the transfer chamber 240. In another case, the processing chambers 260 may be disposed in a single layer on the opposite side of the transfer chamber 240.
[0056] The buffer unit 220 is disposed between the transfer frame 140 and the transfer chamber 240. The buffer unit 220 provides a space in which the substrate W stays before being transferred between the transfer chamber 240 and the transfer frame 140. The buffer unit 220 has a slot (not shown) formed therein in which the substrate W is placed. The slots (not shown) are spaced apart from each other along the third direction 16. The buffer unit 220 is open on one side facing the transfer frame 140 and on the opposite side facing the transfer chamber 240.
[0057] The transfer frame 140 transfers the substrate W between the bracket 130 and the buffer unit 220 located on the loading port 120. An indexing rail 142 and an indexing robot 144 are provided in the transfer frame 140. The indexing rail 142 is arranged so that its length direction is parallel to the second direction 14. The indexing robot 144 is installed on the indexing rail 142 and moves linearly in the second direction 14 along the indexing rail 142. The indexing robot 144 has a base 144a, a main body 144b and an indexing arm 144c. The base 144a is installed to be movable along the indexing rail 142. The main body 144b is connected to the base 144a. The main body 144b can move on the base 144a along the third direction 16. In addition, the main body 144b can rotate on the base 144a. The indexing arm 144c is connected to the main body 144b and can move forward and backward relative to the main body 144b. A plurality of indexing arms 144c are provided. The indexing arms 144c are driven individually. The indexing arms 144c are stacked one on another with a spacing gap therebetween along the third direction 16. Some indexing arms 144c can be used to transfer the substrate W from the processing module 20 to the carrier 130, while other indexing arms 144c can be used to transfer the substrate W from the carrier 130 to the processing module 20. Therefore, in the process of the indexing robot 144 transferring the substrate W between the carrier 130 and the processing module 200, it is possible to prevent particles generated from the substrate W to be processed from adhering to the processed substrate W.
[0058] The transfer chamber 240 transfers the substrate W between the buffer unit 220 and the processing chamber 260 and between the processing chambers 260. A guide rail 242 and a main robot 244 are provided in the transfer chamber 240. The guide rail 242 is installed so that its length direction is parallel to the first direction 12. The main robot 244 is installed on the guide rail 242 and moves linearly on the guide rail 242 along the first direction 12. The main robot 244 has a base 244a, a main body 244b and a main arm 244c. The base 244a is installed to be movable along the guide rail 242. The main body 244b is connected to the base 244a. The main body 244b can move on the base 244a along the third direction 16. In addition, the main body 244b can rotate on the base 244a. The main arm 244c is connected to the main body 244b and can move forward and backward relative to the main body 244b. A plurality of main arms 244c are provided. The main arms 244c are driven individually. The main arms 244c are stacked on each other with a spacing gap therebetween in the third direction 16.
[0059] The processing chamber 260 is equipped with a substrate processing device for performing a liquid treatment process on the substrate W. The substrate processing device may have different structures depending on the type of cleaning process performed. Optionally, the substrate processing devices in each processing chamber 260 may have the same structure. Selectively, the processing chamber 260 may be divided into a plurality of groups. The substrate processing devices in the processing chambers 260 belonging to the same group may have the same structure, and the substrate processing devices in the processing chambers 260 belonging to different groups may have different structures.
[0060] The substrate processing apparatus performs a liquid processing process on the substrate W. In this embodiment, the liquid processing process on the substrate W will be exemplified by a cleaning process. However, it is not limited to the cleaning process, and the liquid processing process may include various processes, such as a photolithography process, an ashing process, an etching process, and the like.
[0061] Figure 3 It is shown Figure 2 A cross-sectional view of a substrate processing apparatus. Figure 3 The substrate processing apparatus includes a processing container 320 , a supporting unit 340 , a lifting unit 360 , an upper fluid distributing unit 380 , a lower fluid distributing unit 400 , a bearing 500 , and a controller 550 .
[0062] The processing container 320 provides a processing space in which the substrate W is processed. The processing container 320 has a cylindrical shape opened at the top. The processing container 320 has an internal recovery bowl 322 and an external recovery bowl 326. The recovery bowls 322 and 326 recover different processing liquids for processing. The internal recovery bowl 322 has a ring around the support unit 340, and the external recovery bowl 326 has a ring around the internal recovery bowl 322. The internal space 322a of the internal recovery bowl 322 and the internal recovery bowl 322 are used as a first inlet 322a, and the processing liquid is introduced into the internal recovery bowl 322 through the first inlet 322a. The space 326a between the internal recovery bowl 322 and the external recovery bowl 326 is used as a second inlet 326a, and the processing liquid is introduced into the external recovery bowl 326 through the second inlet 326a. According to one embodiment, the inlets 322a and 326a can be located at different heights. Recovery lines 322b and 326b are connected to the bottoms of the recovery bowls 322 and 326, respectively. The process liquid introduced into the recovery bowls 322 and 326 may be transferred to an external process liquid regeneration system (not shown) through recovery lines 322 b and 326 b , and may be regenerated by the regeneration system.
[0063] The support unit 340 supports the substrate W in the processing space. The support unit 340 supports and rotates the substrate W during processing. The support unit 340 has a support plate 342, a support pin 344, a chuck pin 346 and a rotation drive member 350. The support plate 342 is arranged in a substantially circular plate shape and has an upper surface and a lower surface. The diameter of the lower surface is smaller than the diameter of the upper surface. The upper surface and the lower surface are positioned in a manner that their central axes are consistent with each other. The support pin 344 and the chuck pin 346 can be arranged on the support plate 342. The support pin 344 and the chuck pin 346 can support the lateral portion and the lower surface of the substrate W respectively. Therefore, the support plate 342 can support the substrate W.
[0064] A plurality of support pins 344 are provided. The support pins 344 are arranged at predetermined intervals on the edge portion of the upper surface of the support plate 342. The support pins 344 protrude upward from the support plate 342. The support pins 344 are arranged to be formed into a ring shape as a whole by their combination. The support pins 344 support the edge of the lower surface of the substrate W so that the substrate W is spaced a predetermined distance from the upper surface of the support plate 342.
[0065] A plurality of chuck pins 346 are provided. The chuck pins 346 are further away from the center of the support plate 342 than the support pins 344. The chuck pins 346 protrude upward from the upper surface of the support plate 342. The chuck pins 346 support the lateral portion of the substrate W so that when the support plate 342 is rotated, the substrate W does not deviate to one side from the correct position. The chuck pins 346 can move linearly between an outer position and an inner position along the radial direction of the support plate 342. The outer position is a position further away from the center of the support plate 342 than the inner position. When the substrate W is loaded onto or unloaded from the support plate 342, the chuck pins 346 are located at the outer position, and when the substrate W is processed, the chuck pins 346 are located at the inner position. The inner position is a position where the chuck pins 346 and the lateral portion of the substrate W are in contact with each other, and the outer position is a position where the chuck pins 346 and the substrate W are spaced apart from each other.
[0066] The rotation drive member 350 rotates the support plate 342. The support plate 342 can rotate around its central axis through the rotation drive member 350. The rotation drive member 350 includes a hollow shaft 352 and an actuator 354. The hollow shaft 352 has a cylindrical shape facing in the third direction 16. The upper end of the hollow shaft 352 is fixedly connected to the lower surface of the support plate 342. The actuator 354 provides a driving force to rotate the hollow shaft 352. The actuator 354 can be a motor. The actuator 354 can be a hollow electric motor with a central part open at the top and bottom. The hollow shaft 352 is rotated by the actuator 354, and the support plate 342 can rotate together with the hollow shaft 352.
[0067] The lifting unit 360 moves the processing container 320 linearly in the up-down direction. As the processing container 320 moves in the up-down direction, the height of the processing container 320 relative to the support plate 342 changes. When the substrate W is loaded onto or unloaded from the support plate 342, the lifting unit 360 lowers the processing container 320 so that the support plate 342 further protrudes upward beyond the processing container 320. Moreover, when processing is performed, the height of the processing container 320 is adjusted according to the type of processing liquid dispensed onto the substrate W, so that the processing liquid is introduced into the preset recovery bowls 322 and 326. The lifting unit 360 has a bracket 362, a movable shaft 364, and an actuator 366. The bracket 362 is fixedly attached to the outer wall of the processing container 320, and the movable shaft 364 is fixedly coupled to the bracket 362 and moves in the up-down direction by the actuator 366. Selectively, the lifting unit 360 can move the support plate 342 in the up-down direction.
[0068] The upper fluid dispensing unit 380 dispenses the processing liquid onto the upper surface of the substrate W. The upper surface of the substrate W may be a patterned surface on which a pattern is formed. A plurality of upper fluid dispensing units 380 may be provided. The upper fluid dispensing unit 380 may dispense different types of processing liquid onto the substrate W. Each upper fluid dispensing unit 380 includes a moving member 381 and a nozzle 389.
[0069] The moving member 381 moves the nozzle 389 between the processing position and the standby position. Here, the processing position is defined as a position where the nozzle 389 is relative to the substrate W supported on the support unit 340, and the standby position is defined as a position where the nozzle 389 deviates from the processing position. According to one embodiment, the processing position includes a pre-processing position and a post-processing position. The pre-processing position is a position where the nozzle 389 distributes the processing liquid to the first distribution position, and the post-processing position is a position where the nozzle 389 distributes the processing liquid to the second distribution position. The first distribution position may be a position closer to the center of the substrate W than the second distribution position, and the second distribution position may be a position including the end of the substrate W. Alternatively, the second distribution position may be an area adjacent to the end of the substrate W.
[0070] The moving member 381 includes a support shaft 386, an arm 382 and a driving member 388. The support shaft 386 is located at one side of the processing container 320. The support shaft 386 has a rod shape, and its length direction is parallel to the third direction 16. The support shaft 386 can be rotated by the driving member 388. The support shaft 386 can move up and down. The arm 382 is connected to the upper end of the support shaft 386. The arm 382 extends from the support shaft 386 at right angles thereto. The nozzle 382 is fixedly connected to the end of the arm 382. As the support shaft 386 is rotated, the nozzle 389 can swing with the arm 382. The nozzle 389 can swing between the processing position and the standby position. Optionally, the arm 382 can move forward and backward along its length direction. When viewed from above, the path of the movement of the nozzle 389 can be consistent with the central axis of the substrate W in the processing position. For example, the processing liquid may include chemicals, rinse solutions and organic solvents. The chemicals may be liquids having acid or alkaline properties. The chemicals may include sulfuric acid (H 2 SO 4 ), phosphoric acid (P 2 O 5 ), hydrofluoric acid (HF) and ammonium hydroxide (NH 4 The rinse solution can be deionized water (H 2 O). The organic solvent may be isopropyl alcohol (IPA).
[0071] The lower fluid dispensing unit 400 may clean and dry the lower surface of the substrate W. The lower fluid dispensing unit 400 may dispense fluid to the lower surface of the substrate W. The lower surface of the substrate W may be an unpatterned surface opposite to a surface on which a pattern is formed. The lower fluid dispensing unit 400 may dispense liquid simultaneously with the upper fluid dispensing unit 380. The lower fluid dispensing unit 400 may be fixed so as not to rotate.
[0072] Figure 4 is a cross-sectional view showing a portion of a support unit, a lower fluid distribution unit, and a rotation driving member according to the present inventive concept, and Figure 5 It is shown Figure 4 A view of the lower fluid distribution unit. Figure 4 and Figure 5 , the lower fluid distribution unit 400 may include a cover 410 , a fixing shaft 430 , and a fluid distribution pipe 450 .
[0073] The cover 410 may be disposed at the upper end of the fixed shaft 430. The cover 410 may have a plurality of holes formed therein. The fluid distribution pipe 450 to be described below may be inserted into the plurality of holes formed in the cover 410. The cover 410 may prevent the position of the fluid distribution pipe 450 from being changed. The cover 410 may be configured to be detachable from the fixed shaft 430.
[0074] The fixed shaft 430 may have an inner space 431. The fixed shaft 430 may be disposed in the hollow shaft 352. The fixed shaft 430 may be positioned to be spaced apart from the hollow shaft 352. The fixed shaft 430 may be positioned to be spaced apart from the inner surface of the hollow shaft 352 by a predetermined distance. In addition, the fixed shaft 430 may be inserted into a hole formed in the support plate 342. When viewed from above, the fixed shaft 430 may be inserted into a hole formed in a central area of the support plate 342. The fluid distribution tube 450 may be disposed in the inner space 431 of the fixed shaft 430.
[0075] The airflow generating part 432 may be formed on the outer surface of the fixed shaft 430. When the hollow shaft 352 and the support plate 342 rotate, the airflow generating part 432 may generate a downward airflow. When the hollow shaft 352 and the support plate 342 rotate, the airflow generating part 432 may generate a downward airflow in the space S between the hollow shaft 352 and the fixed shaft 430. The airflow generating part 432 may generate a downward airflow in the space S between the support plate 342 and the fixed shaft 430. The airflow generating part 432 may be formed on the outer surface of the fixed shaft 430 along the length direction of the fixed shaft 430. The airflow generating part 432 may have a spiral shape. The airflow generating part 432 may protrude in a direction from the central axis of the fixed shaft 430 to the outer surface of the airflow generating part 432. The airflow generating part 432 may be formed as a protrusion on the outer surface of the fixed shaft 430.
[0076] The fluid distribution pipe 450 may distribute the fluid to the lower surface of the substrate W. The fluid distribution pipe 450 may distribute the fluid to the lower surface of the substrate W supported on the support plate 342. The fluid distribution pipe 450 may include a liquid distribution pipe 452 and a gas distribution pipe 454. The liquid distribution pipe 4521 and the gas distribution pipe 454 may be disposed in the inner space 431 of the fixing shaft 430.
[0077] The liquid dispensing tube 452 distributes the processing liquid to the lower surface of the substrate W. The processing liquid distributed from the liquid dispensing tube 452 cleans the lower surface of the substrate W. The liquid dispensing tube 452 has an upwardly directed liquid dispensing end. For example, the liquid dispensing end may face upward in the vertical direction. A plurality of liquid dispensing tubes 452 may be provided. The liquid dispensing tube 452 may distribute different types of liquids. The liquid dispensing tube 452 may be fixed to the cover 410. The liquid dispensing tube 452 is positioned to be spaced apart from the center of the cover 410. The liquid dispensing tube 452 is arranged to surround the center of the cover 410. The processing liquid distributed from the liquid dispensing tube 452 may include chemicals and rinse solutions. The chemicals may be liquids having acidic or alkaline properties. The chemicals may include sulfuric acid (H 2 SO 4 ), phosphoric acid (P 2 O 5 ), hydrofluoric acid (HF) and ammonium hydroxide (NH 4 The rinse solution can be deionized water (H 2 O). Alternatively, the liquid dispensing tip may be tilted upward so as to move away from the center of the substrate W by approaching the top of the liquid dispensing tip.
[0078] The gas distribution pipe 454 distributes the drying gas. The gas distribution pipe 454 may be fixed to the cover 410. The gas distribution pipe 454 is located on the central axis of the cover 410. The gas distribution pipe 454 includes an upper distribution end. The upper distribution end may face upward in the vertical direction. The gas distributed from the gas distribution pipe 454 is supplied to the lower surface of the substrate W. The gas distributed from the gas distribution pipe 454 dries the lower surface of the substrate W. For example, the drying gas may be an inert gas or air. The inert gas may be nitrogen (N 2 ).
[0079] The bearing 500 may be disposed in the space S between the support plate 342 and the fixed shaft 430. The bearing 500 may prevent friction between the fixed shaft 430 and the support plate 342 when the support plate 342 rotates. In addition, the bearing 500 may be coupled to the fixed shaft 430. In addition, the bearing 500 may be located above the airflow generating portion 432 formed on the fixed shaft 430.
[0080] The controller 550 may control the substrate processing apparatus 1. The controller 550 may control the substrate processing device. The controller 550 may control the rotation drive member 350. The controller 550 may control the actuator 354. The controller 550 may control the rotation direction of the support unit 340 by controlling the actuator 354. The controller 550 may control the rotation drive member 350 to rotate the hollow shaft 352 in the same direction as the spiral direction of the airflow generating part 432.
[0081] Figure 6 2 is a diagram showing a state in which the support unit is rotated by the rotation drive member. Figure 6 , the support plate 342 is coupled to the hollow shaft 352. Therefore, as the hollow shaft 352 rotates, the support plate 342 also rotates. At this time, the fixed shaft 430 is fixed and does not rotate. When the support plate 342 and the hollow shaft 352 rotate, the bearing 500 disposed in the space S between the support plate 342 and the fixed shaft 430 is worn. Therefore, the bearing 500 generates impurities such as particles P. According to an embodiment of the present inventive concept, when the support plate 342 and the hollow shaft 352 rotate, a downward air flow C may be generated in the space S between the support plate 342 and the fixed shaft 430 and in the space S between the hollow shaft 352 and the fixed shaft 430. Specifically, the airflow generating portion 432 formed as a protrusion on the outer surface of the fixed shaft 430 may be set to a spiral shape. When the support plate 342 and the hollow shaft 352 rotate, an airflow is generated in the intermediate space S. The airflow generated in the intermediate space S flows downward along the airflow generating portion 432 having a spiral shape. That is, when the support plate 342 and the hollow shaft 352 rotate, a downward airflow C is generated in the intermediate space S. The downward airflow C generated in the intermediate space S flows downward together with the particles P generated by the bearing 500 .
[0082] In a general substrate processing device, when the rotary chuck rotates, the bearing disposed between the rotary chuck and the fixed shaft wears, thereby generating particles. The generated particles may move toward the substrate W and may cause defects in the substrate processing process. In addition, when the particles remain in the space between the fixed shaft and the rotary chuck, the particles additionally generate friction with the bearing, thereby shortening the life of the bearing. However, according to an embodiment of the inventive concept, when the support plate 342 and the hollow shaft 352 rotate, a downward airflow C is generated in the space S between the fixed shaft 430 and the support plate 342 and in the space S between the fixed shaft 430 and the hollow shaft 352. Therefore, the particles P generated in the intermediate space S can be effectively discharged, and the defects caused by the particles P during the substrate processing process or the reduction of the life of the bearing 500 can be minimized.
[0083] Although it has been exemplified that the airflow generating portion 432 is formed as a protrusion on the outer surface of the fixing shaft 430, the airflow generating portion 432 is not limited thereto. Figure 7 As shown in FIG. 4 , the airflow generating portion 432 may be formed as a groove on the outer surface of the fixing shaft 430 . The airflow generating portion 432 formed as the groove may be concavely formed in a direction from the outer surface of the fixing shaft 430 to the center of the fixing shaft 430 .
[0084] In the above-mentioned embodiment, it has been exemplified that the airflow generating portion 432 is formed on the outer surface of the fixed shaft 430. However, the present invention is not limited thereto. Figure 8 As shown in , the airflow generating portion 353 may be formed on the inner surface of the hollow shaft 352 to generate a downward airflow in the space S between the hollow shaft 352 and the fixed shaft 430 when the hollow shaft 352 rotates. In this case, the airflow generating portion 353 may be formed along the length direction of the hollow shaft 352. The airflow generating portion 353 may have a spiral shape. The airflow generating portion 353 may be formed as a protrusion on the inner surface of the hollow shaft 352. Alternatively, as shown in Fig. 9 As shown in , the airflow generating portion 353 may be formed as a groove on the inner surface of the hollow shaft 352. Figure 8 and Fig. 9 The functions and effects obtained by the configuration of the rotation driving member 350 shown in FIG. 1 are the same as or similar to those described above. Therefore, a detailed description thereof will be omitted.
[0085] In the above-mentioned embodiment, it has been exemplified that the airflow generating parts 432 and 353 are formed on the fixed shaft 430 and / or the hollow shaft 352. However, the present invention is not limited thereto. Fig.10 and Fig.11 As shown in FIG. 3 , the airflow generating portion 343 may be formed on the support plate 342. Similar to the airflow generating portions 432 and 353, the airflow generating portion 343 formed on the support plate 342 may be formed as a groove or a protrusion.
[0086] In the above embodiment, it has been exemplified that the airflow generating parts 432 and 353 are formed on the fixed shaft 430 and / or the hollow shaft 352. However, the inventive concept is not limited thereto. The airflow generating part may be formed on the inner surface of the actuator 354 implemented by the hollow motor.
[0087] In the above embodiment, it has been exemplified that the fixed shaft 430, the hollow shaft 352 and the support plate 342 are provided in the substrate processing device and the airflow generating parts 432, 353 and 343 are formed on the fixed shaft 430, the hollow shaft 352 and the support plate 342. However, the inventive concept is not limited thereto. The above technical concept can be applied to various rotating components that rotate the main body and the device for processing the substrate in the same manner. For example, Fig.12 As shown in , the rotating assembly 600 may include a body 610, a hollow shaft 620, an insert 630, and a bearing 650. The body 610 may have a hole formed therein. The insert 630 may be inserted into the hole formed in the body 610. The hollow shaft 620 may be coupled to the body 610. The hollow shaft 620 may be rotated by an actuator (not shown). Therefore, the body 610 coupled to the hollow shaft 620 may rotate. The bearing 650 may be provided in the space between the body 610 and the insert 630.
[0088] The insert 630 may be disposed in the hollow shaft 620. The insert 630 may be positioned to be spaced apart from the hollow shaft 620. When the hollow shaft 620 rotates, the insert 630 may be fixed in place. An airflow generating portion 632 may be formed on the outer surface of the insert 630 to generate a downward airflow in the space between the hollow shaft 620 and the insert 630. The airflow generating portion 632 may be formed along the length direction of the insert 630. The airflow generating portion 632 may have a spiral shape. The airflow generating portion 632 may be formed as a protrusion on the outer surface of the insert 630. However, not limited thereto, the airflow generating portion 632 may be formed as a groove on the outer surface of the insert 630. Therefore, the airflow generated when the hollow shaft 620 rotates may flow downward along the airflow generating portion 632 having a spiral shape. Therefore, particles generated when the bearing 650 wears may be discharged to the outside together with the downward airflow.
[0089] In the above embodiment, it has been exemplified that the airflow generating portion 632 is formed on the outer surface of the insert 630. However, the present invention is not limited thereto. Fig.13 As shown in , the airflow generating portion 622 may be formed on the inner surface of the hollow shaft 620. The airflow generating portion 622 may be formed as a protrusion on the inner surface of the hollow shaft 620. However, it is not limited thereto, and the airflow generating portion 622 may be formed as a groove on the inner surface of the hollow shaft 620. The functions and effects produced by the airflow generating portion 622 formed on the inner surface of the hollow shaft 620 are the same or similar to those described above. Therefore, a detailed description thereof will be omitted.
[0090] As described above, according to the embodiments of the present inventive concept, the present inventive concept can effectively process a substrate.
[0091] Furthermore, according to embodiments of the inventive concept, adhesion of particles to a substrate may be minimized during processing of the substrate.
[0092] Furthermore, according to an embodiment of the inventive concept, particles generated in the supporting unit may be effectively discharged.
[0093] In addition, according to an embodiment of the inventive concept, particles generated when the body is rotated may be effectively discharged.
[0094] The effects of the present inventive concept are not limited to the above-mentioned effects, and any other effects not mentioned herein can be clearly understood by those skilled in the art to which the present inventive concept belongs from this specification and the accompanying drawings.
[0095] The above description illustrates the inventive concept. In addition, the above content describes exemplary embodiments of the inventive concept, and the inventive concept can be used in various other combinations, changes and environments. That is, the inventive concept can be deformed or modified without departing from the scope of the inventive concept disclosed in the specification, the scope equivalent to the written disclosure and / or the technology or knowledge scope of those skilled in the art. The written implementation describes the best state of the technical spirit for implementing the inventive concept, and various changes can be made to the specific application and purpose of the inventive concept. Therefore, the detailed description of the inventive concept is not intended to limit the inventive concept to the disclosed implementation state. In addition, it should be interpreted that the attached claims include other implementations.
[0096] Although the present invention has been described with reference to exemplary embodiments, it is apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the present invention. Therefore, it should be understood that the above embodiments are not restrictive but illustrative.
Claims
1. An apparatus for processing a substrate, the apparatus comprising: a supporting unit including a supporting plate configured to support the substrate and a rotation driving member configured to rotate the supporting plate; and a lower fluid distribution unit configured to distribute a fluid onto a lower surface of the substrate supported on the support plate, The rotation drive member comprises: a hollow shaft connected to the support plate via a bearing; and an actuator configured to rotate the hollow shaft, Wherein the lower fluid distribution unit comprises: a fixed shaft having an inner space and disposed in the hollow shaft; and a fluid distribution pipe configured to distribute the fluid and disposed in the inner space, An airflow generating portion is formed on the outer surface of the fixed shaft to generate a downward airflow in the space between the hollow shaft and the fixed shaft when the hollow shaft rotates, and The bearing is arranged in the space between the support plate and the fixed shaft. The device according to claim 1 , wherein the airflow generating portion has a spiral shape.
3. The device according to claim 2, wherein the device further comprises a controller configured to control the rotation drive member, and The controller controls the rotation drive member to rotate the hollow shaft in the same direction as the spiral direction of the airflow generating portion.
4. The device according to any one of claims 1 to 3, wherein the airflow generating portion is formed as a protrusion on the outer surface of the fixed shaft.
5. The device according to any one of claims 1 to 3, wherein the airflow generating portion is formed as a groove on the outer surface of the fixed shaft.
6. The device according to any one of claims 1 to 3, wherein the fluid distribution tube comprises: a liquid distribution pipe configured to distribute a treatment liquid; and a gas distribution pipe configured to distribute a drying gas, and The liquid distribution pipe and the gas distribution pipe are arranged in the inner space.
7. The device according to any one of claims 1 to 3, wherein the hollow shaft and the fixed shaft are positioned to be spaced apart from each other.
8. An apparatus for processing a substrate, the apparatus comprising: a supporting unit including a supporting plate configured to support the substrate and a rotation driving member configured to rotate the supporting plate; and a lower fluid distribution unit configured to distribute a fluid onto a lower surface of the substrate supported on the support plate, The rotation drive member comprises: a hollow shaft connected to the support plate via a bearing; and an actuator configured to rotate the hollow shaft, Wherein the lower fluid distribution unit comprises: a fixed shaft having an inner space and disposed in the hollow shaft; and a fluid distribution pipe configured to distribute the fluid and disposed in the inner space, An airflow generating portion is formed on the inner surface of the hollow shaft to generate a downward airflow in the space between the hollow shaft and the fixed shaft when the hollow shaft rotates, and The bearing is arranged in the space between the support plate and the fixed shaft.
9. The device according to claim 8, wherein the airflow generating portion has a spiral shape.
10. The device of claim 8, wherein the device further comprises a controller configured to control the rotation drive member, and The controller controls the rotation drive member to rotate the hollow shaft in the same direction as the spiral direction of the airflow generating portion.
11. The device according to any one of claims 8 to 10, wherein the airflow generating portion is formed as a protrusion on the inner surface of the hollow shaft.
12. The device according to any one of claims 8 to 10, wherein the airflow generating portion is formed as a groove on the inner surface of the hollow shaft.
13. A rotating assembly comprising main body; a hollow shaft coupled to the body via a bearing to allow the body to rotate; as well as an insert disposed in the hollow shaft and positioned to be spaced apart from the hollow shaft to fix the position of the insert when the hollow shaft rotates, wherein an airflow generating portion is formed on the outer surface of the insert so as to generate a downward airflow in the space between the hollow shaft and the insert when the hollow shaft rotates, wherein a fluid distribution pipe for distributing the fluid is arranged inside the insert, and The bearing is arranged in the space between the main body and the insert. 14 . The rotating assembly of claim 13 , wherein the airflow generating portion has a spiral shape.
15. The rotating assembly of claim 14, wherein the airflow generating portion is formed as a protrusion on an outer surface of the insert.
16. The rotating assembly of claim 14, wherein the airflow generating portion is formed as a groove on an outer surface of the insert.
17. A rotating assembly comprising main body; a hollow shaft coupled to the body via a bearing to allow the body to rotate; as well as an insert disposed in the hollow shaft and positioned to be spaced apart from the hollow shaft to fix the position of the insert when the hollow shaft rotates, wherein an airflow generating portion is formed on the inner surface of the hollow shaft to generate a downward airflow in the space between the hollow shaft and the insert when the hollow shaft rotates, and wherein the airflow generating portion has a spiral shape, wherein a fluid distribution pipe for distributing the fluid is arranged inside the insert, and The bearing is arranged in the space between the main body and the insert. 18 . The rotating assembly according to claim 17 , wherein the airflow generating portion is formed as a protrusion on an inner surface of the hollow shaft.
19. The rotating assembly of claim 17, wherein the airflow generating portion is formed as a groove on an inner surface of the hollow shaft.
Citation Information
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