Display device and method of manufacturing the same

Abstract

An embodiment of the present invention provides a display device and a method for manufacturing the same, the display device comprising: a mother substrate on which a plurality of display modules are disposed; and a mother film disposed on a rear surface of the mother substrate, wherein the mother film may include a first layer and a second layer disposed between the first layer and the mother substrate, the second layer having a thickness of approximately 40 μm to approximately 60 μm, and the thickness of the first layer may be greater than the thickness of the second layer.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2019-0088330 filed in the Korean Intellectual Property Office on July 22, 2019, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to a display device and a method for manufacturing the same, and more particularly, to a display device and a method for manufacturing the same which can reduce the occurrence of bubbles during a process of attaching a film to a rear surface of a substrate. Background Art

[0004] Recently, a light emitting diode display, which is a self-emissive display device, has attracted attention as a device for displaying images.

[0005] Unlike liquid crystal display devices, since light emitting diode displays have self-emission characteristics and do not require an additional light source, it is possible to reduce their thickness and weight. Further, light emitting diode displays have high quality characteristics such as low power consumption, high brightness, and high response speed.

[0006] Generally, a light emitting diode display includes a substrate; a plurality of thin film transistors disposed on the substrate; a plurality of insulating layers disposed between conductive lines included in the thin film transistors; and light emitting diodes connected to the thin film transistors.

[0007] Such a light emitting diode display can be manufactured by forming a plurality of display devices on one substrate and then cutting them into individual display device units. Recently, flexible display devices have attracted attention, and therefore, a flexible substrate including, for example, polyimide is also used. In this case, in order to ensure the stability of the substrate during the manufacturing process, a film or the like may be attached to the rear surface of the substrate.

[0008] The above information disclosed in the Background section is only for enhancement of understanding of the background of the inventive concept and therefore it may contain information that does not form the prior art that is already known in this country to a person of ordinary skill in the art. Summary of the invention

[0009] Embodiments have been made in an effort to provide a display device and a method of manufacturing the same, which can reduce the occurrence of bubbles during a process of attaching a film to a rear surface of a substrate.

[0010] An embodiment of the present inventive concept provides a display device, comprising: a mother substrate on which a plurality of display modules are disposed; and a mother film disposed on a rear surface of the mother substrate, wherein the mother film may include a first layer and a second layer disposed between the first layer and the mother substrate, the second layer having a thickness of approximately 40 μm to approximately 60 μm, and the thickness of the first layer may be greater than the thickness of the second layer.

[0011] The second layer may include a pressure sensitive adhesive.

[0012] The first layer may include polyethylene terephthalate (PET).

[0013] The first layer may have a thickness of about 60 μm to about 90 μm.

[0014] The mother substrate may be a flexible substrate including polyimide.

[0015] Another embodiment of the present inventive concept provides a method for manufacturing a display device, comprising: preparing a mother substrate including a plurality of display modules; and attaching a mother film to a rear surface of the mother substrate, wherein the mother film may include a first layer and a second layer disposed between the first layer and the mother substrate, and the second layer may have a thickness of about 40 μm to about 60 μm.

[0016] The second layer may include a pressure sensitive adhesive.

[0017] The first layer may include polyethylene terephthalate (PET).

[0018] The first layer may have a thickness of about 60 μm to about 90 μm.

[0019] The thickness of the first layer may be greater than the thickness of the second layer.

[0020] The manufacturing method of the display device may further include cutting the plurality of display modules into individual display modules; and removing the mother film.

[0021] Another embodiment of the inventive concept provides a method for manufacturing a display device, comprising: preparing a substrate, the substrate comprising a plurality of display modules and a plurality of dummy patterns arranged between the plurality of display modules; and cutting the substrate along a cutting line and separating the substrate into separate display modules, wherein the plurality of dummy patterns may be arranged along a direction parallel to the cutting line, and each of the plurality of dummy patterns may be provided with a groove arranged along a direction perpendicular to the cutting line.

[0022] Each of the plurality of dummy patterns may include a first organic film and a second organic film disposed on the first organic film, and the second organic film may be partially removed in a direction perpendicular to the cutting line.

[0023] The manufacturing method of the display device may further include providing an alignment mark on the substrate, wherein the second organic film on the alignment mark is removed.

[0024] The first organic film and the second organic film may be removed in a direction perpendicular to the cutting line.

[0025] The plurality of dummy patterns may not overlap with the cutting line.

[0026] A plurality of dummy patterns may overlap the cutting line.

[0027] Preparation of a substrate including a plurality of display modules and a plurality of dummy patterns arranged between the display modules may include: preparing a mother substrate including a plurality of display modules; and attaching a mother film to a rear surface of the mother substrate, wherein the mother film may include a first layer and a second layer arranged between the first layer and the mother substrate, and the second layer may include a pressure-sensitive adhesive (PSA), and the thickness of the second layer may be about 40 μm to about 60 μm.

[0028] The manufacturing method of the display device may further include removing the mother film after cutting the substrate along cutting lines to separate the substrate into individual display modules, and attaching a protective layer to a rear surface of the substrate.

[0029] According to an embodiment, a display device and a method of manufacturing the same are provided, which can reduce the occurrence of bubbles during a process of attaching a film to a rear surface of a substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 A display device according to an embodiment of the inventive concept is explained.

[0031] Figure 2 Explains along the Figure 1 A cross-sectional view taken along line II-II'.

[0032] Figure 3 Explained in detail by Figure 2 An enlarged view of the portion indicated by Area A.

[0033] Figure 4 A general display device manufacturing process is explained.

[0034] Figure 5 and Figure 6 The principle in which bubbles occur in a display device including the second layer having a thickness of 25 μm is explained.

[0035] Figure 7 A cross-sectional view of a display device according to an embodiment of the inventive concept is illustrated, the cross-sectional view being taken along Figure 5 and Figure 6 The cross-sectional views are taken from the same portion.

[0036] Figure 8 The results of the experiment according to Example 1 are explained.

[0037] Fig. 9 and Fig.10 Cutting Figure 3 The process of display device.

[0038] Fig.11 An area where bubbles occur in a display device cut to include one display module is explained.

[0039] Fig.12 A method of manufacturing a display device according to an embodiment is schematically explained.

[0040] Fig.13 A plan view and a cross-sectional view near a cutting line L1 in a display device according to an embodiment of the inventive concept are explained.

[0041] Fig.14 Explains the basis Fig.13 An embodiment of the present invention provides an image near a cutting plane of the display device.

[0042] Fig.15 In another embodiment of the present invention, Fig.13 The same district.

[0043] Fig.16 In another embodiment of the present invention, Fig.13 The same district.

[0044] Fig.17 Explains the basis Fig.16 An embodiment of the present invention provides an image near a cutting plane of the display device.

[0045] Fig.18 In another embodiment of the present invention, Fig.16 The same district.

[0046] Fig.19 An image of a comparative example according to the inventive concept is illustrated in which bubbles occur so that the alignment mark is covered.

[0047] Fig. 20 An image according to an embodiment of the inventive concept is illustrated in which no alignment mark is covered because no bubbles occur.

[0048] Figure 21 to Figure 24 In a display device according to another embodiment of the present invention, a Fig.13 The same area. DETAILED DESCRIPTION

[0049] Hereinafter, the inventive concept will be described more fully with reference to the accompanying drawings, in which embodiments of the inventive concept are shown. As will be appreciated by those skilled in the art, the described embodiments may be modified in various different ways without departing from the spirit or scope of the present disclosure.

[0050] Parts irrelevant to the description will be omitted to clearly describe the present disclosure, and like reference numerals denote like elements throughout the specification.

[0051] Further, in the drawings, for ease of description, the size and thickness of each element are arbitrarily illustrated, and the present disclosure is not necessarily limited to those illustrated in the drawings. In the drawings, for clarity, the thickness of layers, films, plates, regions, etc. are exaggerated. In the drawings, for ease of description, the thickness of some layers and regions are exaggerated.

[0052] It will be understood that when an element, such as a layer, film, region, or substrate is referred to as being "on" another element, it can be directly on the other element, or there may be intervening elements. Conversely, when an element is referred to as being "directly on" another element, there are no intervening elements. Further, in the specification, the words "on" or "above" mean placed on or below an object part, and do not necessarily mean placed on the upper side of an object part based on the direction of gravity.

[0053] In addition, unless explicitly described to the contrary, the word “comprise” and variations such as “comprises” or “comprising” will be understood to imply the inclusion of stated elements but not the exclusion of any other elements.

[0054] Further, throughout the specification, the phrase “in a plan view” means observing a target portion from the top, and the phrase “in a cross-sectional view” means observing a cross section formed by vertically cutting the target portion from the side.

[0055] Hereinafter, a display device and a method for manufacturing the same according to an embodiment of the present inventive concept will be described in detail with reference to the accompanying drawings. The present inventive concept can solve the problem of bubbles occurring during a process of attaching a film to a lower portion of a substrate in a display device and a manufacturing process thereof.

[0056] Figure 1 A display device according to an embodiment of the inventive concept is explained. Figure 1 The display device of the embodiment includes a plurality of display modules DM1, DM2, DM3, DM4, ..., DMn disposed on a mother substrate 1000. That is, Figure 1A display device including a plurality of separately operable display modules DM1, DM2, DM3, DM4, ..., DMn is explained, and the display device may be later cut into individual display modules to function as respective display devices. The mother substrate 1000 may be a flexible substrate including polyimide.

[0057] Figure 2 Explains along the Figure 1 A cross-sectional view taken along line II-II'. Figure 2 , the display device according to the present embodiment includes a mother film 2000 disposed under a mother substrate 1000. The mother film 2000 includes a first layer 2100 and a second layer 2200. The second layer 2200 may be disposed between the first layer 2100 and the mother substrate 1000.

[0058] The first layer 2100 may include polyethylene terephthalate (PET). In addition, the second layer 2200 may include a pressure sensitive adhesive (PSA). The PSA of the second layer 2200 attaches the first layer 2100 to the mother substrate 1000.

[0059] After the display device including the plurality of display modules is cut into individual display modules, the mother film 2000 may be removed.

[0060] In the present inventive concept, the thickness of the first layer 2100 may be 60 μm to 90 μm, and the thickness of the second layer 2200 may be 40 μm to 60 μm. In the present inventive concept, the thickness of the first layer 2100 may be greater than the thickness of the second layer 2200. When the thickness of the second layer 2200 is greater than the thickness of the first layer 2100, a problem of the upper protective film being damaged may occur while removing the mother film 2000. In addition, during the removal process of the mother film 2000, the upper structure of the mother substrate 1000 may be damaged.

[0061] In the present invention, the second layer 2200 including PSA has a thickness of 40 μm to 60 μm. Therefore, since the second layer 2200 has a sufficient thickness to suppress the occurrence of bubbles therein, the problem of bubbles occurring in the manufacturing process of the display device can be improved. Hereinafter, the effects of the present invention and the manufacturing process of the display device will be described in detail.

[0062] The manufacturing method of the display device according to the embodiment of the inventive concept includes preparing a mother substrate 1000 including a plurality of display modules, and attaching a mother film 2000 to the rear surface of the mother substrate 1000. The mother film 2000 includes a first layer 2100 and a second layer 2200 disposed between the first layer 2100 and the mother substrate 1000. The second layer 2200 may include PSA, and the thickness of the second layer 2200 may be about 40 μm to about 60 μm. Thereafter, the manufacturing method may further include cutting the plurality of display modules into individual display modules and removing the mother film 2000.

[0063] That is, in the display device and the manufacturing method thereof according to the present invention, since the mother film 2000 includes the second layer 2200, which has a multi-layer structure, includes PSA, and has a thickness of about 40μm to about 60μm, it is possible to improve the problem of bubbles occurring during the manufacturing process of the display device.

[0064] Hereinafter, the effects of the present inventive concept will be described in detail with reference to the accompanying drawings.

[0065] Figure 3 Explained in detail by Figure 2 An enlarged view of the portion indicated by area A. Reference Figure 3 , a first inorganic film 110, a second inorganic film 120, an intermediate film 130, a first organic film 140, a second organic film 150 and a thin film encapsulation layer 160 are disposed on the mother substrate 1000. Figure 3 , the structures of the inorganic film and the organic film are mainly shown, but may further include structures not shown.

[0066] refer to Figure 3 , the baffles D1 and D2 and the dummy pattern DP are disposed on the mother substrate 1000 between adjacent individual display modules. The display area DA includes the display module and displays an image. Figure 3 As shown in FIG. 1 , types of films stacked in the display area DA, the baffles D1 and D2 , and the dummy pattern DP may be different from each other.

[0067] refer to Figure 3 During the first cutting, the mother substrate 1000 is cut along the first cutting line L1. Thereafter, during the second cutting, the cut mother substrate is cut along the second cutting line L2. That is, by the first cutting along the first cutting line L1, only one display area DA is provided in the cut mother substrate, and by the second cutting along the second cutting line L2, the dummy pattern DP is eliminated.

[0068] Recently, in display devices, the frame size has been reduced, and the display area has been gradually increased. In addition, since many display modules are prepared on one mother substrate 1000 for cost reduction during the manufacturing process, the distance between the display modules on the mother substrate 1000 is shortened. This means that the distance between the first cutting line L1 and the second cutting line L2 and the display area DA is shortened, and therefore, bubbles are easily formed on the rear surface of the mother substrate 1000, and it is not easy to eliminate the bubbles. During the process of attaching the mother film 2000 to the mother substrate 1000, bubbles are formed on the rear surface of the mother substrate 1000.

[0069] Figure 4 The manufacturing process of a general display device is explained. Figure 4 , a plurality of display modules DM1 , DM2 , and DM3 are disposed on the mother substrate 1000 , and then an upper protective film 3000 is disposed on the plurality of display modules DM1 , DM2 , and DM3 .

[0070] The mother film 2000 is attached to the lower side of the mother substrate 1000. The mother film 2000 is a film attached in the manufacturing process, and it can be removed in the final display device. The mother film 2000 can be attached by using a roller 7000. In the manufacturing process, after the mother film 2000 is attached to the display device, some waiting time is required until the mother film 2000 is cut. The waiting time varies depending on the manufacturing process, and can be as short as 8 hours, and as long as 100 hours or more. During the waiting time, the mother film 2000 is lifted from the mother substrate 1000 to generate bubbles. In Figure 4 , the portion where bubbles are generated between adjacent display modules is indicated by arrows.

[0071] However, the display device and the method of manufacturing the same according to the present embodiment prevents the formation of bubbles by setting the thickness of the second layer 2200 including the PSA to about 40 μm to about 60 μm.

[0072] Figure 5 and Figure 6 The principle in which bubbles occur in the display device according to the comparative example including the second layer 2200 having a thickness of about 25 μm is explained. Figure 5 , by using a roller, the mother film 2000 is attached to the display device. Therefore, the mother substrate 1000 of the display device is pressed by the round surface of the roller and is curved. This is because the mother substrate 1000 is a flexible substrate including a flexible material such as polyimide.

[0073] In the case where the mother film 2000 is attached to the curved mother substrate 1000, when the thickness of the second layer 2200 used as an adhesive is not thick enough, the mother film 2000 is lifted at the curved portion of the mother substrate 1000 and bubbles indicated by arrows are formed at the curved portion of the mother substrate 1000.

[0074] Figure 6 A cross-sectional view of a display device in which bubbles are formed is illustrated. Figure 6 , when the mother substrate 1000 and the mother film 2000 are separated from each other at the bent portion of the mother substrate 1000 , bubbles occur.

[0075] Figure 7 A cross-sectional view of a display device according to an embodiment of the inventive concept is illustrated. Figure 5 and Figure 6 The cross-sectional view is the same part. Figure 7 In the display device according to the present embodiment, the thickness of the second layer 2200 of the mother film 2000 is about 40 μm to about 60 μm, which is thicker than that of the comparative example.

[0076] Accordingly, if Figure 7 , as the second layer 2200 fills the curved surface of the mother substrate 1000 without a gap provided between the mother substrate 1000 and the mother film 2000, the mother substrate 1000 remains attached. Therefore, it is possible to prevent the lifting of the mother film 2000 on the curved surface of the mother substrate 1000, and suppress the occurrence of bubbles. In addition, as the thickness of the second layer 2200 increases, the adhesive force also increases, and therefore, the mother substrate 1000 and the mother film 2000 are more firmly attached to each other and do not separate.

[0077] The bubble occurrence rate between the mother substrate 1000 and the mother film 2000 including the PSA was measured and is shown in Table 1.

[0078] In Example 1, the thickness of the first layer 2100 including PET was about 75 μm, and the thickness of the second layer 2200 including PSA was about 50 μm. After 32 hours and 100 hours after attaching the mother film 2000 to the mother substrate 1000 , the bubble occurrence rate was measured. Figure 8 The results of the experiment according to Example 1 are explained.

[0079] [Table 1]

[0080]

[0081] The measurement of the bubble generation rate is calculated by the number of substrates where bubbles occur among the test target substrates. In Example 1, in which the thickness of the second layer 2200 containing PSA is about 50 μm, the phenomenon of bubble generation after 32 hours is improved. That is, in Example 1, bubbles were not observed in any of the 46 substrates. Reference Figure 8 , it was confirmed that bubbles were hardly formed in the display device. Referring back to Table 1, in the display device according to Example 1, bubbles were not observed even after 100 hours had passed, and it was confirmed that the phenomenon of bubble generation was improved.

[0082] That is, according to the display device and the manufacturing method thereof of the present embodiment, the second layer 2200 including PSA has an increased thickness in the mother film 2000 so as to increase the adhesive force between the mother substrate 1000 and the mother film 2000, and the second layer 2200 completely fills the curved portion of the mother substrate 1000. Accordingly, it is possible to prevent the occurrence of bubbles between the mother substrate 1000 and the mother film 2000.

[0083] Hereinafter, a method for manufacturing a display device according to another embodiment of the present invention will be described. The display device and the method for manufacturing the display device described above relate to a mother substrate in which a plurality of display modules are formed on one substrate, and the method for manufacturing the display device according to the present embodiment includes a process of cutting the mother substrate (on which the plurality of display modules are placed) into individual display modules.

[0084] That is, the manufacturing method of the display device according to the present embodiment includes preparing a substrate, which in a plan view includes a plurality of display modules and dummy patterns arranged between the display modules; and cutting the substrate along cutting lines to separate the substrate into separate display modules, wherein the dummy patterns are arranged along the cutting lines and grooves are placed in a direction perpendicular to the cutting lines, in which the second organic film 150 in the dummy patterns is eliminated.

[0085] Thereafter, the manufacturing method may further include forming a protective layer on the rear surface of the substrate.By providing the grooves in the dummy pattern, bubbles occurring in the formation of the protective layer may be easily eliminated in the direction of the cutting line.

[0086] In the present embodiment, the substrate prepared when preparing a substrate including a plurality of display modules may be a substrate manufactured according to the manufacturing method of the aforementioned embodiment. That is, the substrate prepared when preparing a substrate including a plurality of display modules may be a substrate manufactured by preparing a mother substrate 1000 including a plurality of display modules and attaching the mother film 2000 to the rear surface of the mother substrate 1000.

[0087] In this case, the mother film 2000 may include a first layer 2100 and a second layer 2200 disposed between the first layer 2100 and the mother substrate 1000 , and the second layer 2200 may include PSA and have a thickness of about 40 μm to about 60 μm.

[0088] Bubbles may not be formed on the rear surface of the substrate including the plurality of display modules manufactured in this manner. However, even if the mother substrate is prepared without bubbles on the rear surface thereof, bubbles may be formed when the protective layer is attached after the mother substrate is cut into individual substrates. The manufacturing method of the display device according to the present embodiment prevents bubbles from occurring in the process of attaching the protective layer after the mother substrate is cut into individual substrates.

[0089] Fig. 9 and Fig.10 The cutting Figure 3 The process of display device. Fig. 9 Explains along the Figure 3 Next, the general display device is cut along the second cutting line L2. In this case, Fig. 9 In the embodiment, since the structure such as the dummy pattern DP is not disposed near the second cutting line L2, bubbles occurring when the protective layer is attached to the rear surface of the mother substrate 1000 may be eliminated.

[0090] However, recently, as the size of the frame of the display device is minimized, there is provided such as Fig.10 The cross section shown in . Fig.10 , the dummy pattern DP is disposed near the second cutting line L2. Therefore, when the protective layer is attached to the rear surface, a channel through which bubbles can be removed is formed. That is, the channel for eliminating bubbles is blocked by the dummy pattern DP, and therefore it is not easy to eliminate bubbles. This is because, although the dummy pattern DP corresponds to a structure placed on the mother substrate 1000, and the protective layer corresponds to a structure attached to the rear surface of the substrate, the contact property between the protective layer on the rear surface of the substrate and the substrate is affected by the structure on the mother substrate 1000. Therefore, by changing the design of the structure of the upper surface of the mother substrate 1000, it is possible to eliminate bubbles in the protective layer disposed on the rear surface of the substrate.

[0091] Fig.11 The area where bubbles occur in a display device is illustrated, the display device being cut to include a display module. Fig.11 The area indicated by "B" in FIG. 1 is an area where bubbles tend to occur.

[0092] Fig.12 A method for manufacturing a display device according to an embodiment is schematically explained. Fig.12, first, the mother film 2000 on which the plurality of display modules DM1, DM2, and DM3 are disposed is attached to the rear surface of the mother substrate 1000. The upper protective film 3000 is formed on the plurality of display modules DM1, DM2, and DM3.

[0093] The mother film 2000 may be attached by roll lamination using a roller 7000 and may include a first layer 2100 and a second layer 2200. The first layer 2100 may include PET and may have a thickness of about 60 μm to about 90 μm, and the second layer 2200 may include PSA and may have a thickness of about 40 μm to about 60 μm.

[0094] Next, refer to Fig.12 , the mother substrate 1000 is cut to separate the plurality of display modules into individual display modules.

[0095] Next, the mother film 2000 under the mother substrate 1000 is removed.

[0096] Subsequently, the protective layer 4000 is attached to the rear surface of the mother substrate 1000 from which the mother film 2000 is removed. In this case, the protective layer 4000 may be of a film type and may be attached by roller lamination using a roller 7000. In the process of attaching the protective layer 4000 on the alignment mark of the display device, bubbles may be formed, thereby hindering a subsequent alignment process.

[0097] Therefore, the method for manufacturing the display device according to the present embodiment is a method for manufacturing a display device that can easily eliminate bubbles generated when the protective layer 4000 is attached.

[0098] Fig.13 A display device according to an embodiment of the inventive concept is explained. Fig.13 , a dummy pattern DP including the second inorganic film 120, the intermediate film 130, the first organic film 140 and the second organic film 150 is arranged to overlap the first cutting line L1. In this case, a portion of the second organic film 150 is removed along a direction bb' extending perpendicularly to the first cutting line L1 to expose the first organic film 140. A groove is formed between adjacent second organic films 150.

[0099] Air bubbles can escape through the grooves. Fig.14 Explains the basis Fig.13 An image of a display device in the vicinity of a cutting line of an embodiment of the present invention. Fig.14 , the groove is indicated by an arrow. In this embodiment, the width of the groove is about 0.5 mm. Fig.13 As can be seen in the figure, the bubbles near the cutting line can be discharged through the groove.

[0100] Fig.13The structure in which the first organic film 140 disposed under the second organic film 150 is not removed is explained, but in another embodiment, the first organic film 140 may also be removed. Fig.15 As shown in FIG. 2 , when the first organic film 140 is removed, bubbles can be well discharged through the grooves formed by removing the second organic film 150 and the first organic film 140 .

[0101] Fig.16 In another embodiment of the present invention, Fig.13 The same district as the district. Fig.16 According to the display device of this embodiment Fig.13 The display device is the same as that of the display device of FIG. 1, except that the area ratio of the second organic film 150 is eliminated. Fig.13 The detailed description of the same components will be omitted.

[0102] Fig.17 Explains the basis Fig.16 An image of a display device in the vicinity of a cutting plane of an embodiment of the present invention. Fig.17 In the display device according to the embodiment, the width of the eliminated second organic film 150 is about 4.15 nm. In this case, the bubbles are completely eliminated, and it is confirmed that the Fig.17 The dotted circles indicate the alignment marks that are not covered by bubbles.

[0103] Fig.16 A structure in which the first organic film 140 is not removed and the second organic film 150 is partially removed is explained, but the first organic film 140 may also be removed. Fig.18 As shown in FIG. 1 , when the first organic film 140 is removed, bubbles can be discharged well.

[0104] Fig.19 An image of a comparative example according to the inventive concept is illustrated, in which bubbles occur such that an alignment mark is covered with the bubbles. Fig. 20 An image according to an embodiment of the inventive concept is illustrated in which the alignment mark is not covered by bubbles because bubbles do not occur. Fig.19 and Fig. 20 , which can be seen in Fig.19 In the example, the alignment mark is covered by bubbles, so it is difficult to identify the alignment mark (see the dotted circle part), but in Fig. 20 In the figure, there are no bubbles, so the alignment mark is clearly identified (see the dotted circle part).

[0105] Therefore, in the method for manufacturing the display device according to the present embodiment, it is desirable that the region where the second organic film 150 is removed overlaps with the alignment mark. When the groove of the dummy pattern DP where the second organic film 150 is removed overlaps with the alignment mark, since bubbles are removed through the groove where the first organic film 140 or the second organic film 150 is removed, it is possible to prevent the alignment mark from being covered with bubbles.

[0106] Figure 21 to Figure 23 Display devices according to other embodiments are explained. Fig.21 The display device according to this embodiment is different from the display device according to Fig.13 The display device of the embodiment of FIG. 1 is the same as that of FIG. 1 , except that the first organic film 140 and the second organic film 150 in the dummy pattern DP in the region overlapping the first cutting line L1 are also removed. Detailed description of the same components will be omitted.

[0107] Reference along Fig.21 In the cross-sectional view taken along the line d-d', when a portion of the second organic film 150 at a portion perpendicular to the first cutting line L1 is removed and the first organic film 140 and the second organic film 150 at a portion overlapping the first cutting line L1 are removed, bubbles can be more easily removed.

[0108] Fig. 22 The display device and Fig.21 The display device according to the embodiment is the same as that of FIG. 1 , except that both the second organic film 150 and the first organic film 140 are removed along the line ee'. Fig. 22 In this embodiment, since both the first organic film 140 and the second organic film 150 are removed in a direction perpendicular to the cutting line L1, bubbles may be more easily removed.

[0109] Fig.23 The implementation method and Fig.21 The embodiment is the same as that of FIG. 1 , except that the first organic film 140 is not removed at the first cutting line L1. Detailed description of the same components will be omitted.

[0110] Fig.24 The implementation method and Fig.21 The embodiment of FIG. 1 is the same as that of FIG. 2 , except that the first organic film 140 and the second organic film 150 are eliminated in a direction perpendicular to the first cutting line L1. Fig.24 In the embodiment, no organic film is provided in the channel through which the bubbles are discharged, so that the bubbles can be discharged well.

[0111] The protective layer is a structure attached to the rear surface of the mother substrate 1000, and the dummy pattern DP is a structure provided on the upper surface of the substrate, but the passage for discharging bubbles formed on the rear surface of the mother substrate 1000 is affected by the structure provided on the upper surface. Therefore, as in the manufacturing method according to the present embodiment, when a passage through which bubbles can be discharged is formed in the dummy pattern DP, bubbles formed when the protective layer is attached to the rear surface of the mother substrate 1000 can be easily removed.

[0112] As described above, according to the display device and the manufacturing method thereof according to the embodiment of the inventive concept, by increasing the thickness of the mother film 2000 that can be removed during the manufacturing process, it is possible to improve the problem that the mother substrate 1000 and the mother film 2000 are separated from each other during the extended waiting time in the manufacturing process, and bubbles are formed between the mother substrate 1000 and the mother film 2000. In addition, a groove is formed in the dummy pattern DP near the first cutting line L1 in a direction perpendicular to the first cutting line L1, and thus, a channel through which bubbles formed between the mother substrate 1000 and the protective layer 4000 can be discharged is formed so that the bubbles can be effectively removed.

[0113] While the inventive concept has been described in connection with what are presently considered to be practical embodiments, it is to be understood that the inventive concept is not limited to the disclosed embodiments, but on the contrary is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

Claims

1. A method for manufacturing a display device, comprising: preparing a substrate, the substrate comprising a plurality of display modules and a plurality of dummy patterns disposed between the plurality of display modules; and cutting the substrate along cutting lines and separating the substrate into individual display modules, wherein the plurality of dummy patterns are arranged along a direction parallel to the cutting line, and Each of the plurality of dummy patterns is provided with a groove disposed in a direction perpendicular to the cutting line.

2. The method for manufacturing a display device according to claim 1, wherein Each of the plurality of dummy patterns includes a first organic film and a second organic film disposed on the first organic film, and The second organic film is partially removed along a direction perpendicular to the cut line.

3. The method for manufacturing a display device according to claim 2, further comprising: An alignment mark is provided on the substrate, wherein the second organic film on the alignment mark is removed. 4 . The method for manufacturing a display device according to claim 3 , wherein the first organic film and the second organic film are removed in the direction perpendicular to the cutting line.

5. The method for manufacturing a display device according to claim 1, wherein The plurality of dummy patterns do not overlap with the cutting line.

6. The method for manufacturing a display device according to claim 1, wherein The plurality of dummy patterns overlap the cutting lines.

7. The method for manufacturing a display device according to claim 1, wherein preparing the substrate comprises: preparing a mother substrate including the plurality of display modules; and attaching a master film to the rear surface of the mother substrate, The mother film may include a first layer and a second layer disposed between the first layer and the mother substrate, the second layer may include a pressure-sensitive adhesive, and a thickness of the second layer may be 40 μm to 60 μm.

8. The method for manufacturing a display device according to claim 7, further comprising: After the substrate is cut along the cutting lines to separate the substrate into individual display modules, the mother film is eliminated, and a protective layer is attached to the rear surface of the substrate.

Images