Substrate processing device and substrate processing method

Abstract

The present invention provides a substrate processing device and a substrate processing method, which can improve the temperature controllability in a processing tank in a batch type device for processing multiple substrates. The substrate processing device comprises: a processing tank for storing a processing liquid, in which multiple substrates are immersed; a plurality of liquid supply parts, the plurality of liquid supply parts including a supply path for supplying the processing liquid into the processing tank and a heating mechanism for heating the processing liquid in the middle of the supply path; and a plurality of in-tank temperature sensors, the plurality of in-tank temperature sensors measuring the temperature of the processing liquid at multiple locations in the processing tank.

Description

Technical Field

[0001] The present disclosure relates to a substrate processing device and a substrate processing method. Background Art

[0002] The substrate processing device described in Patent Document 1 has a processing tank, a circulation line, a pump, a heater, at least two temperature sensors and a controller. The processing tank is used to store a processing liquid, and the substrate is immersed in the processing liquid. The circulation line is used to return the processing liquid taken out from the processing tank to the processing tank. The pump, the heater and a temperature sensor are arranged in the middle of the circulation line. Another temperature sensor is arranged in the tank of the processing tank. The controller controls the heat generation of the heater based on the detected temperatures of the at least two temperature sensors.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2018-133558 Summary of the invention

[0006] Problem that the invention aims to solve

[0007] One embodiment of the present disclosure provides a technology capable of improving the temperature controllability in a processing tank.

[0008] Solutions for solving problems

[0009] A substrate processing device involved in one embodiment of the present disclosure comprises: a processing tank, which is used to store a processing liquid, and a plurality of substrates are immersed in the processing liquid; a plurality of liquid supply parts, the plurality of liquid supply parts including a supply path for supplying the processing liquid into the tank of the processing tank and a heating mechanism for heating the processing liquid in the middle of the plurality of supply paths; and a plurality of in-tank temperature sensors, the plurality of in-tank temperature sensors measuring the temperature of the processing liquid at a plurality of locations in the tank of the processing tank.

[0010] Effects of the Invention

[0011] According to one embodiment of the present disclosure, it is possible to improve the temperature controllability in a processing tank of a batch-type device that processes a plurality of substrates. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a front cross-sectional view showing a substrate processing apparatus according to one embodiment.

[0013] Figure 2A It is a side cross-sectional view showing the arrangement of a plurality of liquid supply units and a plurality of in-tank temperature sensors according to one embodiment.

[0014] Figure 2B Yes means Figure 2A A plan view showing the arrangement of the horizontal tubes of each of the plurality of liquid supply units shown.

[0015] Figure 3 This is a diagram showing the components of a control unit according to one embodiment using functional blocks.

[0016] Figure 4 It is a side cross-sectional view showing the arrangement of a plurality of liquid supply units and a plurality of in-tank temperature sensors according to the first modified example.

[0017] Figure 5 This is a diagram showing the components of the control unit according to the first modification example using functional blocks.

[0018] Fig. 6A It is a side cross-sectional view showing the arrangement of a plurality of liquid supply units and a plurality of in-tank temperature sensors according to a second modification.

[0019] Figure 6B Yes means Fig. 6A A top view of the arrangement of multiple liquid supply sections is shown.

[0020] Figure 7 It is a side cross-sectional view showing the arrangement of a plurality of liquid supply parts according to a third modification.

[0021] Figure 8 It is a side cross-sectional view showing the arrangement of a plurality of liquid supply parts according to a fourth modification.

[0022] Description of Reference Numerals

[0023] 1: substrate processing device; 2: substrate; 5: processing tank; 6: liquid supply unit; 61: supply path; 63: heating mechanism; 81: tank temperature sensor. DETAILED DESCRIPTION

[0024] The following is an explanation of the embodiments of the present disclosure with reference to the accompanying drawings. In addition, in each of the drawings, the same or corresponding structures are marked with the same reference numerals, and the description is sometimes omitted. In this specification, the X-axis direction, the Y-axis direction, and the Z-axis direction are directions perpendicular to each other. The X-axis direction and the Y-axis direction are horizontal directions, and the Z-axis direction is a vertical direction.

[0025] Figure 1 1 is a front cross-sectional view of a substrate processing apparatus according to an embodiment. The substrate processing apparatus 1 is a batch type that immerses a plurality of substrates 2 in a processing liquid 3 for processing, and the substrate processing apparatus 1 has a processing tank 5. The processing tank 5 is used to store the processing liquid 3, and the plurality of substrates 2 are immersed in the processing liquid 3 in the tank of the processing tank 5 for processing.

[0026] The substrate 2 includes, for example, a silicon wafer, a silicon oxide film, and a silicon nitride film. The silicon oxide film and the silicon nitride film are repeatedly and alternately stacked to form a stacked film. The stacked film includes an opening that penetrates the stacked film in the thickness direction.

[0027] The processing liquid 3 is, for example, an etching liquid used to etch the substrate 2. The processing liquid 3 is, for example, an aqueous phosphoric acid solution, which is maintained in a boiling state in the processing tank 5, and the processing liquid 3 enters the opening of the stacked film to selectively etch the silicon oxide film and the silicon nitride film to remove it.

[0028] The treatment tank 5 is, for example, a double tank, and includes an inner tank 51 for storing the treatment liquid 3 and an outer tank 52 for recovering the treatment liquid 3 overflowing from the inner tank 51. The outer tank 52 surrounds the upper portion of the inner tank 51.

[0029] exist Figure 1 In the embodiment, the lower portion of the inner tank 51 is disposed outside the outer tank 52, but may also be disposed inside the outer tank 52. That is, the outer tank 52 may accommodate the inner tank 51 therein.

[0030] In the inner tank 51, a plurality of substrates 2 are immersed in the processing liquid 3 and processed by the processing liquid 3. A cover 53 may be disposed above the inner tank 51 to keep the processing liquid 3 warm and to suppress scattering.

[0031] The substrate processing apparatus 1 includes a liquid supply unit 6 for supplying the processing liquid 3 into the processing tank 5. The liquid supply unit 6 includes a supply path 61 for circulating the processing liquid 3. The supply path 61 may be a flow path for supplying a new processing liquid 3 supplied from the outside of the processing tank 5 to the processing tank 5, but in the present embodiment, it is a circulation path for returning the processing liquid 3 taken out of the processing tank 5 to the processing tank 5. The circulation path is used, for example, to return the processing liquid 3 taken out of the outer tank 52 to the inner tank 51. The processing liquid 3 can be reused.

[0032] The liquid supply unit 6 has a liquid delivery mechanism 62, a heating mechanism 63, a heating temperature sensor 64, and a flow meter 65 in the middle of the supply path 61. The liquid delivery mechanism 62 is, for example, a pump, which delivers the treatment liquid 3. The heating mechanism 63 is, for example, an electric heater, which heats the treatment liquid 3. The heating temperature sensor 64 measures the temperature of the treatment liquid 3 at a position downstream of the heating mechanism 63. The output change of the heating mechanism 63 is immediately reflected in the measured value of the heating temperature sensor 64. The heating temperature sensor 64 can be arranged near the heating mechanism 63 to improve the responsiveness to the output change of the heating mechanism 63. The flow meter 65 measures the flow rate of the treatment liquid 3 downstream of the liquid delivery mechanism 62. The output change of the liquid delivery mechanism 62 is immediately reflected in the measured value of the flow meter 65.

[0033] The liquid supply unit 6 has a nozzle 66 at the front end of the supply path 61 for spraying the processing liquid 3 into the processing tank 5. The nozzle 66 sprays the processing liquid 3 into the inner tank 51. The nozzle 66 can spray a mixed fluid of the processing liquid 3 and gas. Figure 2A The nozzles 66A and 66B shown are L-shaped and include vertical pipes 69A and 69B and horizontal pipes 67A and 67B extending horizontally from the lower ends of the vertical pipes 69A and 69B.

[0034] like Figure 1 As shown, the horizontal tube 67 is a hollow rod extending in the arrangement direction (X-axis direction) of the substrate 2 at a position lower than the substrate 2, and a plurality of horizontal tubes 67 are provided at intervals in the Y-axis direction. Each of the plurality of horizontal tubes 67 has a plurality of ejection ports 68 at intervals in the length direction thereof, and the plurality of ejection ports 68 eject the processing liquid 3 toward the top. Thus, a curtain-like upward flow can be formed in the inner tank 51.

[0035] The substrate processing device 1 has a substrate holding portion 7 for holding a plurality of substrates 2. The substrate holding portion 7 has a plurality of holding rods 71 ​​for holding the outer periphery of the substrate 2 at intervals in the circumferential direction, and a connecting plate (not shown) connected to one end of each of the plurality of holding rods 71. Each of the plurality of holding rods 71 ​​extends from the connecting plate in the arrangement direction of the substrates 2, i.e., the X-axis direction, and has a plurality of holding grooves at intervals in the longitudinal direction thereof. The plurality of holding rods 71 ​​hold the substrate 2 vertically through the holding grooves.

[0036] The substrate holding unit 7 moves up and down between a standby position and a processing position. The standby position is a position for delivering a plurality of substrates 2 to a conveying device (not shown) and is set above the processing position. The processing position is a position for immersing a plurality of substrates 2 in the processing liquid 3.

[0037] The substrate holding unit 7 receives the unprocessed substrate 2 from the transport device at the standby position, then descends to the processing position, and ascends to the standby position again after a predetermined time, and transfers the processed substrate 2 to the transport device at the standby position. Thereafter, the same operation is repeated.

[0038] When the substrate holding part 7 is raised or lowered, the cover 53 is opened to avoid interference with the substrate holding part 7. On the other hand, when the substrate holding part 7 stops at the standby position or the processing position, the cover 53 is closed. By closing the cover 53, the processing liquid 3 can be kept warm and the scattering of the processing liquid 3 can be suppressed.

[0039] The control unit 9 is, for example, a computer. Figure 1As shown, the control unit 9 includes a CPU (Central Processing Unit) 91 and a storage medium 92 such as a memory. The storage medium 92 stores programs for controlling various processes performed in the substrate processing apparatus 1. The control unit 9 controls the operation of the substrate processing apparatus 1 by causing the CPU 91 to execute the programs stored in the storage medium 92. In addition, the control unit 9 includes an input interface 93 and an output interface 94. The control unit 9 receives signals from the outside through the input interface 93 and sends signals to the outside through the output interface 94.

[0040] The above-mentioned program is stored in a storage medium readable by a computer, for example, and is installed from the storage medium to the storage medium 92 of the control unit 9. Examples of the storage medium readable by a computer include a hard disk (HD), a floppy disk (FD), a compact disk (CD), a magneto-optical disk (MO), a memory card, etc. In addition, the program may be downloaded from a server via a network and installed in the storage medium 92 of the control unit 9.

[0041] Figure 2A It is a side cross-sectional view showing the arrangement of a plurality of liquid supply units and a plurality of in-tank temperature sensors according to one embodiment. Figure 2B Yes means Figure 2A A plan view showing the arrangement of the horizontal tubes of each of the plurality of liquid supply units shown.

[0042] The substrate processing apparatus 1 includes a plurality of liquid supply units 6A and 6B, each of which includes a heating mechanism 63. The output of the heating mechanism 63 can be adjusted for each of the liquid supply units 6A and 6B, so that the distribution of the temperature in the inner tank 51 can be easily adjusted. Hereinafter, the temperature in the inner tank 51 is also referred to as "tank temperature".

[0043] The processing liquid 3 is temperature-controlled by the plurality of liquid supply units 6A and 6B, and then supplied to the inner tank 51, and then overflows from the inner tank 51 and is recovered to the Figure 1 The outer tank 52 is shown. The process liquid 3 is mixed in the outer tank 52, and the temperature of the process liquid 3 becomes uniform.

[0044] Therefore, the plurality of liquid supply units 6A and 6B can take out the processing liquid 3 from the same position of the outer tank 52. In this case, a common passage is provided that connects one outlet of the outer tank 52 and the supply paths 61 of the plurality of liquid supply units 6A and 6B.

[0045] However, the plurality of liquid supply parts 6A and 6B may also take out the processing liquid 3 from different positions of the outer tank 52. In this case as well, if each of the plurality of liquid supply parts 6A and 6B includes a heating mechanism 63, the output of the heating mechanism 63 can be adjusted for each liquid supply part 6A and 6B, so that the distribution of the temperature in the tank can be easily adjusted.

[0046] The substrate processing apparatus 1 includes a plurality of in-tank temperature sensors 81, and measures the temperature of the processing liquid 3 at a plurality of locations in the inner tank 51. Based on the measurement values ​​of the plurality of in-tank temperature sensors 81, the distribution of the in-tank temperature can be obtained.

[0047] The distribution of the in-tank temperature is obtained as data in which the positions of the measurement points of the plurality of in-tank temperature sensors 81 are associated with the measurement values ​​at the measurement points. The positions of the measurement points are read out and used, and are stored in advance in the storage medium 92 .

[0048] The distribution of the temperature in the tank may also include data associating the position of a prediction point other than the measurement point with the prediction value at the prediction point. The prediction point may be set between a plurality of measurement points or may be set outside a plurality of measurement points. For example, the prediction value is obtained by a common prediction method such as interpolation or extrapolation.

[0049] The distribution of the temperature in the tank is horizontal in this embodiment, but it can also be vertical, or horizontal and vertical. In addition, the distribution of the temperature in the tank can be one-dimensional, two-dimensional, or three-dimensional.

[0050] According to the present embodiment, the distribution of the tank temperature is obtained based on the measurement values ​​of the plurality of tank temperature sensors 81, so that the actual distribution can be brought close to the target distribution. As a result, the controllability of the tank temperature can be improved.

[0051] like Figure 2B As shown, when viewed from above, the inner tank 51 is divided into a first zone ZA and a second zone ZB in the horizontal direction, and a plurality of liquid supply parts 6A and 6B are configured to spray the processing liquid 3 from different liquid supply parts 6 to each zone ZA and ZB. The boundary line between adjacent zones ZA and ZB is virtual. Figure 2B In the embodiment, the groove inside the inner groove 51 is divided into two zones ZA and ZB in the arrangement direction of the substrate 2, but it may be divided into three or more zones.

[0052] As described above, the plurality of zones ZA and ZB are obtained by dividing the groove of the inner groove 51, for example, in the arrangement direction (X-axis direction) of the substrates 2. By dividing the plurality of substrates 2 into a plurality of groups in the arrangement direction, the processing conditions of the substrates 2 can be adjusted for each group. When a processing problem occurs in a substrate 2 of a specific group, the processing conditions of the substrates 2 of the group can be changed, thereby improving the yield rate.

[0053] The first liquid supply unit 6A includes a first supply path 61A, a first liquid delivery mechanism 62A, a first heating mechanism 63A, a first heating temperature sensor 64A, a first flow meter 65A, and a first nozzle 66A. The first nozzle 66A includes a first horizontal pipe 67A and a first ejection port 68A. In addition, the first nozzle 66A includes a first vertical pipe 69A.

[0054] The first horizontal tube 67A is a hollow rod extending in the arrangement direction (X-axis direction) of the substrate 2, and a plurality of the first horizontal tubes 67A may be arranged at intervals in the Y-axis direction. The first ejection port 68A is arranged in the first zone ZA, but not in the second zone ZB. In other words, the first liquid supply unit 6A ejects the processing liquid 3 to the first zone ZA, but not to the second zone ZB.

[0055] Similarly, the second liquid supply unit 6B includes a second supply path 61B, a second liquid delivery mechanism 62B, a second heating mechanism 63B, a second heating temperature sensor 64B, a second flow meter 65B, and a second nozzle 66B. The second nozzle 66B has a second horizontal pipe 67B and a second ejection port 68B. In addition, the second nozzle 66B has a second vertical pipe 69B.

[0056] The second horizontal tube 67B is a hollow rod extending in the arrangement direction (X-axis direction) of the substrate 2, and a plurality of the second horizontal tubes 67B may be arranged at intervals in the Y-axis direction. The second ejection port 68B is arranged in the second zone ZB, but not in the first zone ZA. In other words, the second liquid supply unit 6B ejects the processing liquid 3 to the second zone ZB, but not to the first zone ZA.

[0057] As described above, the plurality of liquid supply parts 6A and 6B are arranged so as to eject the processing liquid 3 to each zone ZA and ZB from different liquid supply parts 6. The liquid supply part (e.g., liquid supply part 6A) ejecting the processing liquid 3 to any one zone (e.g., zone ZA) and the liquid supply part (e.g., liquid supply part 6B) ejecting the processing liquid 3 to any other zone (e.g., zone ZB) do not need to be completely identical.

[0058] For example, the plurality of liquid supply parts 6A and 6B are arranged so that the plurality of liquid supply parts 6A and 6B do not repeatedly eject the processing liquid 3 to each of the plurality of zones ZA and ZB. The plurality of liquid supply parts 6A and 6B eject the processing liquid 3 to a different one of the zones selected from the plurality of zones ZA and ZB. For the same zone (for example, the first zone ZA), only one liquid supply part (for example, the first liquid supply part 6A) ejects the processing liquid.

[0059] As described above, if the processing liquid 3 is ejected from different liquid supply units 6 for each zone ZA, ZB, the temperature of the processing liquid 3 can be adjusted for each zone ZA, ZB, and the horizontal distribution of the temperature in the tank can be easily adjusted.

[0060] In each of the plurality of zones ZA and ZB, one or more (in Figure 2A (a) a tank temperature sensor 81. Therefore, the horizontal distribution of the temperature in the tank can be measured. In addition, the heating temperature of the processing liquid 3 can be adjusted while monitoring the temperature in the tank of the processing liquid 3 for each zone ZA, ZB.

[0061] Figure 3 This is a diagram showing the components of a control unit according to one embodiment using functional blocks. Figure 3 The functional blocks shown in the figure are conceptual and do not necessarily have to be physically configured as shown. All or part of the functional blocks can be dispersed / integrated in arbitrary units in terms of function or physical structure to form each functional block. All or any part of each processing function implemented by each functional block can be implemented by a program executed by the CPU, or implemented as hardware based on wired logic. Figure 5 Same in.

[0062] like Figure 3 As shown, the control unit 9 includes a heating temperature setting unit 95 and a heating control unit 96. The heating temperature setting unit 95 obtains the distribution of the temperature in the tank based on the measurement values ​​BPV of the plurality of tank temperature sensors 81, and sets the target value HSV of the heating temperature of the processing liquid 3 achieved by the heating mechanism 63 based on the obtained distribution. The heating control unit 96 controls the heating mechanism 63 based on the target value HSV of the heating temperature.

[0063] The heating temperature setting unit 95 obtains the distribution of the temperature in the tank based on the measured values ​​BPV of the plurality of tank temperature sensors 81, and sets the target value HSV of the heating temperature of the treatment liquid 3 achieved by the heating mechanism 63 based on the deviation between the obtained distribution and the target distribution. The target value HSV is obtained by performing a calculation to make the deviation zero. This calculation uses, for example, PI calculation or PID calculation.

[0064] Regarding the target distribution of the temperature in the tank, the temperature pre-stored in the storage medium 92 is read and used. The target distribution of the temperature in the tank may be a uniform distribution or a non-uniform distribution, and the target distribution may be appropriately updated based on the inspection results of the substrate 2 processed by the processing liquid 3. The target distribution of the temperature in the tank is determined in a manner that can reduce processing problems of the substrate 2, and may sometimes be determined as a non-uniform distribution.

[0065] As described above, the heating temperature setting unit 95 sets the target value HSV of the heating temperature of the heating mechanism 63 based on the deviation between the actual distribution of the temperature in the tank and its target distribution, thereby making the actual distribution of the temperature in the tank consistent with the target distribution, thereby reducing processing problems of the substrate 2.

[0066] The heating temperature setting unit 95 may set a common target value HSV for all the liquid supply units 6, but in the present embodiment, a target value HSV is set for each liquid supply unit 6. Specifically, the heating temperature setting unit 95 obtains the deviation between the measured value BPV in the first zone ZA and its target value BSV, and sets the target value HSV of the heating temperature of the processing liquid 3 achieved by the first heating mechanism 63A based on the obtained deviation. In addition, the heating temperature setting unit 95 obtains the deviation between the measured value BPV in the second zone ZB and its target value BSV, and sets the target value HSV of the heating temperature of the processing liquid 3 achieved by the second heating mechanism 63B based on the obtained deviation. Since the heating temperature of the processing liquid 3 can be adjusted for each liquid supply unit 6, the distribution of the temperature in the tank can be easily adjusted.

[0067] When the heating temperature setting unit 95 sets the target value HSV for each liquid supply unit 6 , the heating control unit 96 is provided for each liquid supply unit 6 .

[0068] The heating control unit 96 controls the heating mechanism 63 based on the deviation between the target value HSV of the heating temperature and the measured value HPV of the heating temperature sensor 64. The heating control unit 96 controls the output of the heating mechanism 63 so that the deviation between the target value HSV and the measured value HPV is zero. The output calculation uses, for example, PI calculation or PID calculation.

[0069] The time until the output change of the heating mechanism 63 is reflected in the measured value HPV of the heating temperature is shorter than the time until the output change of the heating mechanism 63 is reflected in the measured value BPV of the temperature in the tank. Therefore, if the target value HSV of the heating temperature is corrected based on the deviation between the target value BSV of the temperature in the tank and the measured value BPV, and the output of the heating mechanism 63 is controlled based on the deviation between the target value HSV of the heating temperature and the measured value HPV, the responsiveness can be improved, and the measured value BPV of the temperature in the tank can be made consistent with the target value BSV in a short time.

[0070] Figure 3 The control shown is the so-called cascade control. In cascade control, a feedback loop is formed by a main loop and a sub-loop. Figure 3 In the cascade control shown, as described above, the target value HSV of the heating temperature is corrected so that the deviation between the target value BSV of the tank temperature and the measured value BPV is zero, and the output of the heating mechanism 63 is controlled so that the deviation between the target value HSV of the heating temperature and the measured value HPV is zero.

[0071] Figure 4 1 is a side cross-sectional view showing the arrangement of a plurality of liquid supply units and a plurality of in-tank temperature sensors according to the first variant. Figure 2B The following mainly describes the differences between this modification and the above-described embodiment.

[0072] In this modified example, a plurality of tank temperature sensors 81D and 81U are arranged in each of the plurality of zones ZA and ZB at intervals in the vertical direction. Therefore, the vertical distribution of the tank temperature can be obtained for each of the plurality of zones ZA and ZB, and the vertical distribution of the tank temperature can be made close to the target distribution.

[0073] The vertical distribution of the temperature in the tank can be adjusted by the flow rate of the treatment liquid 3 ejected vertically upward from the horizontal pipe 67. The opening area of ​​the ejection port 68 is fixed, so the greater the flow rate of the treatment liquid 3, the faster the flow rate of the treatment liquid 3, and the heat of the treatment liquid 3 is not easily taken away from the ejection port 68 until it reaches the liquid surface. Therefore, the greater the flow rate of the treatment liquid 3, the smaller the difference in the temperature in the tank in the vertical direction.

[0074] The substrate processing apparatus 1 includes a plurality of liquid supply units 6, each of which includes a liquid delivery mechanism 62. The output of the liquid delivery mechanism 62 can be adjusted for each liquid supply unit 6, so that the vertical distribution of the temperature in the tank can be easily adjusted.

[0075] In addition, the plurality of tank temperature sensors 81D and 81U are arranged above the horizontal pipe 67, and the lower tank temperature sensor 81D is closer to the horizontal pipe 67 than the upper tank temperature sensor 81U. Therefore, the time until the output change of the heating mechanism 63 is reflected in the measurement value HPV of the lower tank temperature sensor 81D is shorter than the time until the output change of the heating mechanism 63 is reflected in the measurement value HPV of the upper tank temperature sensor 81U.

[0076] Figure 3The heating temperature setting unit 95 shown can obtain the measured value BPV of the tank temperature from the upper tank temperature sensor 81U, but in order to improve responsiveness, it can also obtain the measured value BPV of the tank temperature from the lower tank temperature sensor 81D. The heating temperature setting unit 95 can obtain the deviation between the measured value BPV of the lower tank temperature sensor 81D and its target value BSV, and set the target value HSV of the heating temperature of the processing liquid 3 achieved by the heating mechanism 63 based on the obtained deviation.

[0077] on the other hand, Figure 5 The flow rate setting unit 97 shown can obtain the measured value BPV of the tank temperature from the tank temperature sensors 81D and 81U on the upper and lower sides.

[0078] Figure 5 This is a diagram showing the components of the control unit according to the first modification example using functional blocks. Figure 5 The functional blocks shown can be used with Figure 3 The functional blocks shown may be used in combination or individually.

[0079] like Figure 5 As shown in FIG. 1 , the control unit 9 includes a flow rate setting unit 97 and a liquid supply control unit 98. The flow rate setting unit 97 obtains the vertical distribution of the temperature in the tank based on the measured values ​​BPV of the plurality of tank temperature sensors 81D and 81U, and sets the target value FSV of the flow rate of the treatment liquid 3 achieved by the liquid supply mechanism 62 based on the obtained vertical distribution. The vertical distribution is represented by, for example, a temperature gradient in the vertical direction (temperature change per unit length). The liquid supply control unit 98 controls the liquid supply mechanism 62 based on the target value FSV of the flow rate.

[0080] The flow rate setting unit 97 obtains the vertical distribution of the temperature in the tank based on the measured values ​​BPV of the plurality of tank temperature sensors 81D and 81U, and sets the target value FSV of the flow rate of the treatment liquid 3 achieved by the liquid feeding mechanism 62 based on the deviation between the obtained vertical distribution and the target distribution. The target value FSV is obtained by performing a calculation to make the above-mentioned deviation zero. This calculation uses, for example, PI calculation or PID calculation.

[0081] As described above, the flow setting unit 97 sets the target value FSV of the flow rate of the liquid supply mechanism 62 based on the deviation between the actual vertical distribution of the temperature in the tank and its target distribution, thereby making the actual vertical distribution of the temperature in the tank consistent with the target distribution, and reducing processing problems of the substrate 2.

[0082] The flow rate setting unit 97 may set a common target value FSV for all the liquid supply units 6, but in the present embodiment, the target value FSV is set for each liquid supply unit 6. Specifically, the flow rate setting unit 97 obtains the deviation between the vertical distribution in the first zone ZA and the target distribution, and sets the target value FSV of the flow rate of the processing liquid 3 achieved by the first liquid feeding mechanism 62A based on the obtained deviation. In addition, the flow rate setting unit 97 obtains the deviation between the vertical distribution in the second zone ZB and the target distribution, and sets the target value FSV of the flow rate of the processing liquid 3 achieved by the second liquid feeding mechanism 62B based on the obtained deviation. Since the flow rate of the processing liquid 3 can be adjusted for each liquid supply unit 6, the vertical distribution of the temperature in the tank can be easily adjusted.

[0083] When the flow rate setting unit 97 sets the target value FSV for each liquid supply unit 6 , the liquid supply control unit 98 is provided for each liquid supply unit 6 .

[0084] The liquid supply control unit 98 controls the liquid supply mechanism 62 based on the deviation between the target value FSV of the flow rate and the measured value FPV of the flow meter 65. The liquid supply control unit 98 controls the output of the liquid supply mechanism 62 so that the deviation between the target value FSV and the measured value FPV is zero. The output calculation uses, for example, PI calculation or PID calculation.

[0085] The time until the output change of the liquid supply mechanism 62 is reflected in the measured value FPV of the flow rate is shorter than the time until the output change of the liquid supply mechanism 62 is reflected in the measured value BPV of the temperature in the tank. Therefore, if the target value FSV of the flow rate is calibrated based on the deviation of the vertical distribution of the temperature in the tank from its target distribution, and the output of the liquid supply mechanism 62 is controlled based on the deviation of the target value FSV of the flow rate and the measured value FPV, the responsiveness can be improved, so that the measured value BPV of the temperature in the tank can be made consistent with the target value BSV in a short time.

[0086] Figure 5 The control shown is the so-called cascade control. In cascade control, a feedback loop is formed by a main loop and a sub-loop. Figure 5 In the cascade control shown, as described above, the target flow value FSV is corrected so that the deviation between the vertical distribution of the temperature in the tank and its target distribution is zero, and the output of the liquid feeding mechanism 62 is controlled so that the deviation between the target flow value FSV and the measured value FPV is zero.

[0087] Fig. 6A It is a side cross-sectional view showing the arrangement of a plurality of liquid supply units and a plurality of in-tank temperature sensors according to a second modification. Figure 6B Yes means Fig. 6A Hereinafter, the differences between this modification and the above-mentioned embodiment and the above-mentioned first modification will be mainly described.

[0088] like Fig. 6A As shown, the in-tank temperature sensor 81 can be mounted on the horizontal pipe 67 of the liquid supply unit 6. No special member is required to support the in-tank temperature sensor 81. In addition, the horizontal pipe 67 is arranged below the substrate 2 immersed in the processing liquid 3, so that the in-tank temperature sensor 81 can be arranged two-dimensionally in a horizontal plane below the substrate 2, and the temperature distribution in the horizontal plane below the substrate 2 can be obtained.

[0089] In addition, the in-tank temperature sensor 81 may also be mounted on the cover 53. There is no need for a dedicated member for supporting the in-tank temperature sensor 81. In addition, the cover 53 is arranged above the substrate 2 immersed in the processing liquid 3, so that the in-tank temperature sensor 81 can be arranged two-dimensionally in a horizontal plane above the substrate 2, and the temperature distribution in the horizontal plane above the substrate 2 can be obtained.

[0090] Furthermore, the tank temperature sensors 81 may be arranged two-dimensionally on the horizontal pipe 67 and two-dimensionally on the cover 53. The temperature distribution in the horizontal plane below the substrate 2 and the temperature distribution in the horizontal plane above the substrate 2 can be obtained, thereby obtaining the three-dimensional temperature distribution in the tank.

[0091] Furthermore, it is of course possible to obtain the three-dimensional temperature distribution in the tank based on the measurement value of the tank temperature sensor 81 installed in a member other than the horizontal pipes 67 and 53 .

[0092] like Figure 6B As shown, the groove of the inner groove 51 may be divided into a plurality of zones ZA1, ZA2, ZA3, ZA4, ZB1, ZB2, ZB3, and ZB4 in the arrangement direction (X-axis direction) of the substrate 2 and in the orthogonal direction (Y-axis direction) when viewed from above. In other words, the groove of the inner groove 51 may be divided into a plurality of zone groups ZA and ZB in the X-axis direction, and these zone groups ZA and ZB may be further divided into a plurality of zones in the Y-axis direction. The zone group ZA is divided into zones ZA1, ZA2, ZA3, and ZA4, and the zone group ZB is divided into zones ZB1, ZB2, ZB3, and ZB4.

[0093] The plurality of liquid supply parts 6A1, 6A2, 6A3, 6A4, 6B1, 6B2, 6B3, 6B4 are arranged so as to eject the processing liquid 3 to each of the zones ZA1, ZA2, ZA3, ZA4, ZB1, ZB2, ZB3, ZB4 from different liquid supply parts 6. The liquid supply part (e.g., liquid supply part 6A1) ejecting the processing liquid 3 to any one of the zones (e.g., zone ZA1) and the liquid supply part (e.g., liquid supply part 6A2) ejecting the processing liquid 3 to any other zone (e.g., zone ZA2) may not completely coincide with each other.

[0094] As described above, in a plan view, the tank is divided into a plurality of zone groups ZA and ZB in the arrangement direction of the substrates 2, and the processing liquid 3 is ejected from a different liquid supply unit 6 for each of these zone groups ZA and ZB. Therefore, the plurality of substrates 2 can be divided into a plurality of groups in the arrangement direction, and the processing conditions of the substrates 2 can be adjusted for each group. When a processing problem occurs in a specific group of substrates 2, the processing conditions of the substrates 2 in the group can be changed, and the yield rate can be improved.

[0095] In addition, as described above, when viewed from above, the inside of the groove (e.g., the zone group ZA) is divided into a plurality of zones (e.g., ZA1, ZA2, and ZA3) in a direction perpendicular to the arrangement direction of the substrates 2, and the processing liquid 3 is ejected from a different liquid supply unit 6 for each of these zones. Therefore, a substrate 2 can be divided into a plurality of zones in a direction perpendicular to the arrangement direction, and the processing conditions of the substrate 2 can be adjusted for each zone. In the case where a processing problem occurs in a specific zone of a substrate 2, the processing conditions of the substrate 2 in the zone can be changed, and the yield can be improved. This effect can also be obtained when the groove of the inner groove 51 is divided into a plurality of zones only in a direction perpendicular to the arrangement direction of the substrate 2.

[0096] In this modification, the number of divided zones is greater than that of the above-mentioned embodiment and the above-mentioned first modification, but the temperature in the tank is controlled for each zone. Figure 3 and Figure 5 Controls shown.

[0097] In a plan view, one or more tank temperature sensors 81 are arranged for each of the plurality of zones ZA1, ZA2, ZA3, ZA4, ZB1, ZB2, ZB3, and ZB4. Therefore, the horizontal distribution of the temperature in the tank can be measured. In addition, the heating temperature of the treatment liquid 3 by the heating mechanism 63 can be adjusted while monitoring the temperature in the tank of the treatment liquid 3 for each of the zones ZA1, ZA2, ZA3, ZA4, ZB1, ZB2, ZB3, and ZB4.

[0098] When a plurality of in-tank temperature sensors 81 are arranged in a horizontally separated manner in one zone, a measurement value selected from these in-tank temperature sensors 81 can be used to control the heating temperature of the processing liquid 3 achieved by the heating mechanism 63. The selection method of the in-tank temperature sensor 81 is not particularly limited, but for example, the sensor closest to the part where the processing problem occurs on the substrate 2 can be selected, and it can be appropriately updated based on the inspection result of the substrate 2. In addition, the average value of the measurement values ​​of the plurality of in-tank temperature sensors 81 can be used to control the heating temperature of the processing liquid 3 achieved by the heating mechanism 63.

[0099] In addition, at least one set of in-tank temperature sensors 81 is configured for each of the plurality of zones ZA1, ZA2, ZA3, ZA4, ZB1, ZB2, ZB3, and ZB4. A set of in-tank temperature sensors 81 includes a plurality of in-tank temperature sensors 81 that are configured to be separated in the vertical direction. The vertical distribution of the in-tank temperature can be measured. In addition, the flow rate of the treatment liquid 3 reached by the liquid delivery mechanism 62 can be adjusted while monitoring the vertical distribution of the in-tank temperature for each of the zones ZA1, ZA2, ZA3, ZA4, ZB1, ZB2, ZB3, and ZB4.

[0100] When a plurality of groups of in-tank temperature sensors 81 are arranged in a zone separated in the horizontal direction, a group of measured values ​​selected from the plurality of groups can be used to control the flow rate of the processing liquid 3 reached by the liquid delivery mechanism 62. The selection method of selecting one group from the plurality of groups is not particularly limited, for example, the group closest to the part where the processing problem occurs on the substrate 2 can be selected, and it can be appropriately updated based on the inspection result of the substrate 2. In addition, the average value of the plurality of groups of measured values ​​can be used to control the flow rate of the processing liquid 3 reached by the liquid delivery mechanism 62.

[0101] Figure 7 1 is a side cross-sectional view showing the arrangement of a plurality of liquid supply units according to the third modification. Figure 2B The same as above, so the illustration is omitted. In addition, the top view showing the configuration of the horizontal pipe of this modified example can be the same as Figure 6B The following mainly describes the differences between this modification and the above-described embodiment.

[0102] In the above-mentioned embodiment, the plurality of liquid supply parts 6A and 6B are arranged so that the plurality of liquid supply parts 6A and 6B do not repeatedly eject the processing liquid 3 to each of the plurality of zones ZA and ZB. The plurality of liquid supply parts 6A and 6B eject the processing liquid 3 to a different one of the zones selected from the plurality of zones ZA and ZB. For the same zone (for example, the first zone ZA), only one liquid supply part (for example, the first liquid supply part 6A) ejects the processing liquid.

[0103] On the other hand, in this modified example, the first liquid supply part 6A and the second liquid supply part 6B repeatedly eject the processing liquid 3 to the first zone ZA. However, the processing liquid 3 is ejected only from the second liquid supply part 6B to the second zone ZB. Therefore, the liquid supply parts 6A and 6B that eject the processing liquid 3 to the first zone ZA and the liquid supply part 6B that ejects the processing liquid 3 to the second zone ZB are not completely identical and therefore different.

[0104] In this variation, as in the above-described embodiment, the processing liquid 3 is ejected from different liquid supply units 6 for each zone ZA, ZB, so that the temperature of the processing liquid 3 can be adjusted for each zone ZA, ZB, and the horizontal distribution of the temperature in the tank can be easily adjusted.

[0105] In this modified example, as described above, the treatment liquid 3 is repeatedly ejected from both the first liquid supply part 6A and the second liquid supply part 6B for the first zone ZA, and the treatment liquid 3 is ejected only from the second liquid supply part 6B for the second zone ZB. Therefore, the heating temperature setting part 95 first sets the target value HSV of the heating temperature of the treatment liquid 3 achieved by the second heating mechanism 63B, and then sets the target value HSV of the heating temperature of the treatment liquid 3 achieved by the first heating mechanism 63A based on the target value HSV. Similarly, the flow rate setting part 97 first sets the target value FSV of the flow rate of the treatment liquid 3 achieved by the second liquid feeding mechanism 62B, and then sets the target value FSV of the flow rate of the treatment liquid 3 achieved by the first liquid feeding mechanism 62A based on the target value FSV.

[0106] However, if the plurality of liquid supply units 6A and 6B are arranged so that the plurality of liquid supply units 6A and 6B do not repeatedly discharge the processing liquid 3 to each of the plurality of zones ZA and ZB as in the above-mentioned embodiment, it is easy to set the target value HSV of the heating temperature and the target value FSV of the flow rate. This is because the target values ​​HSV and FSV can be set independently for each of the liquid supply units 6A and 6B.

[0107] Figure 8 1 is a side cross-sectional view showing the arrangement of a plurality of liquid supply units according to the fourth modification. Figure 2B The same as above, so the illustration is omitted. In addition, the top view showing the configuration of the horizontal pipe of this modified example can be the same as Figure 6B The following mainly describes the differences between this modification and the above-described embodiment.

[0108] The substrate processing apparatus 1 of this modification example includes a third liquid supply unit 6C and a fourth liquid supply unit 6D in addition to the first liquid supply unit 6A and the second liquid supply unit 6B. Alternatively, the substrate processing apparatus 1 may include only the third liquid supply unit 6C and the fourth liquid supply unit 6D.

[0109] In this modification, the inner tank 51 (e.g., the zone group ZA) is divided into a plurality of zones ZA1 and ZA2 in the vertical direction. The plurality of liquid supply units 6C and 6D are configured to spray the processing liquid 3 from different liquid supply units 6 to each of the plurality of zones ZA1 and ZA2 arranged in the vertical direction.

[0110] The third liquid supply unit 6C includes a third supply path 61C, a third liquid feeding mechanism 62C, a third heating mechanism 63C, a third heating temperature sensor 64C, a third flow meter 65C, and a third nozzle 66C. The third nozzle 66C includes a third vertical pipe 69C and a third discharge port 68C.

[0111] The third vertical pipe 69C is disposed at an end of the inner tank 51 in the arrangement direction of the substrates 2. The third vertical pipe 69C is a hollow rod extending in the vertical direction, and a plurality of third vertical pipes 69C may be arranged at intervals in the Y-axis direction. The third ejection port 68C ejects the processing liquid 3 toward the arrangement direction of the substrates 2.

[0112] The third discharge port 68C is disposed in the lower zone ZA1 of the two zones ZA1 and ZA2 arranged in the vertical direction, but not in the upper zone ZA2. That is, the third liquid supply unit 6C discharges the processing liquid 3 to the lower zone ZA1, but not to the upper zone ZA2.

[0113] Similarly, the fourth liquid supply unit 6D includes a fourth supply path 61D, a fourth liquid delivery mechanism 62D, a fourth heating mechanism 63D, a fourth heating temperature sensor 64D, a fourth flow meter 65D, and a fourth nozzle 66D. The fourth nozzle 66D has a fourth vertical pipe 69D and a fourth discharge port 68D.

[0114] The fourth vertical pipe 69D is disposed at the end of the inner tank 51 in the arrangement direction of the substrates 2. The fourth vertical pipe 69D is a hollow rod extending in the vertical direction, and a plurality of fourth vertical pipes 69D may be arranged at intervals in the Y-axis direction. The fourth ejection port 68D ejects the processing liquid 3 in the arrangement direction of the substrates 2.

[0115] The fourth discharge port 68D is disposed in the upper zone ZA2 of the two zones ZA1 and ZA2 arranged in the vertical direction, but not in the lower zone ZA1. That is, the fourth liquid supply unit 6D discharges the processing liquid 3 to the upper zone ZA2, but not to the lower zone ZA1.

[0116] In this variation, as in the above-mentioned embodiment, the processing liquid 3 is sprayed from a different liquid supply unit 6 for each zone ZA1, ZA2 arranged in the vertical direction, so that the temperature of the processing liquid 3 can be adjusted for each zone ZA1, ZA2, thereby easily adjusting the vertical distribution of the temperature in the tank.

[0117] For each of the plurality of zones ZA1 and ZA2 arranged in the vertical direction, one or more (in Figure 8 (a) a tank temperature sensor 81. Therefore, the vertical distribution of the temperature in the tank can be measured. In addition, the heating temperature of the treatment liquid 3 can be adjusted while monitoring the temperature in the tank of the treatment liquid 3 for each zone ZA1 and ZA2.

[0118] In addition, in this variation, similarly to the above-mentioned embodiment, the processing liquid 3 is sprayed in the horizontal direction from different liquid supply parts 6 for each zone ZA1, ZA2 arranged in the vertical direction, so that the flow rate of the processing liquid 3 can be adjusted for each zone ZA1, ZA2, and the horizontal distribution of the temperature in the tank can also be adjusted.

[0119] The above describes the embodiments of the substrate processing device and the substrate processing method involved in the present disclosure, but the present disclosure is not limited to the above embodiments, etc. Various changes, corrections, substitutions, additions, deletions and combinations can be made within the scope of the claims. These also naturally belong to the technical scope of the present disclosure.

[0120] The treatment liquid 3 in the above embodiment is a phosphoric acid aqueous solution, but the technology disclosed in the present invention can also be applied to other treatment liquids other than phosphoric acid aqueous solution. The treatment liquid 3 can be any liquid as long as it can etch the substrate 2, for example, it can be ammonia water. In addition, an organic solvent can be used instead of water.

[0121] The substrate 2 in the above embodiment includes a silicon wafer 21, a silicon oxide film 22, and a silicon nitride film 23, but the structure of the substrate 2 is not particularly limited. For example, the substrate 2 may include a silicon carbide substrate, a gallium oxide substrate, a gallium nitride substrate, a sapphire substrate, or a glass substrate, etc., instead of the silicon wafer 21.

Claims

1. A substrate processing device, comprising: A processing tank, which is used to store a processing liquid, and a plurality of substrates are immersed in the processing liquid; a plurality of liquid supply parts, each of which includes a supply path for supplying the treatment liquid into the treatment tank and a heating mechanism for heating the treatment liquid in the middle of the supply path; A plurality of in-tank temperature sensors, wherein the plurality of in-tank temperature sensors measure the temperature of the processing liquid at a plurality of locations in the processing tank; a heating temperature setting unit that obtains a distribution of the in-tank temperature of the processing tank based on the measurement values ​​of the plurality of in-tank temperature sensors, and sets a target value of the heating temperature of the processing liquid achieved by the heating mechanism based on a deviation between the obtained distribution and a target distribution of the in-tank temperature; and A heating control unit controls an output of the heating mechanism based on the target value of the heating temperature.

2. The substrate processing device according to claim 1, characterized in that: The processing tank is divided into a plurality of zones in the horizontal direction, and the plurality of liquid supply parts are configured to spray the processing liquid to each zone from different liquid supply parts. At least one of the in-tank temperature sensors is disposed in each of the plurality of zones arranged in the horizontal direction.

3. The substrate processing device according to claim 2, characterized in that: In at least one of the plurality of zones arranged in the horizontal direction, a plurality of the in-tank temperature sensors are arranged to be separated from each other in the vertical direction.

4. The substrate processing device according to claim 1, characterized in that: The heating temperature setting unit sets a target value of the heating temperature for each of the liquid supply units.

5. The substrate processing device according to claim 1 or 4, characterized in that: The plurality of liquid supply parts each have a heating temperature sensor for measuring the temperature of the processing liquid downstream of the heating mechanism. The heating control unit controls the output of the heating mechanism based on a deviation between a target value of the heating temperature and a measurement value of the heating temperature sensor.

6. The substrate processing apparatus according to any one of claims 1 to 3, characterized in that: The supply path of the liquid supply unit is a circulation path for returning the treatment liquid taken out from the treatment tank to the treatment tank.

7. The substrate processing apparatus according to any one of claims 1 to 3, characterized in that: The processing tank is divided into a plurality of zones along the vertical direction, and the plurality of liquid supply parts are configured to spray the processing liquid from different liquid supply parts to each zone. At least one of the tank temperature sensors is disposed in each of the plurality of zones arranged in the vertical direction.

8. A substrate processing device, comprising: A processing tank, which is used to store a processing liquid, and a plurality of substrates are immersed in the processing liquid; a plurality of liquid supply parts, each of which includes a supply path for supplying the treatment liquid into the treatment tank and a heating mechanism for heating the treatment liquid in the middle of the supply path; as well as a plurality of in-tank temperature sensors, wherein the plurality of in-tank temperature sensors measure the temperature of the processing liquid at a plurality of locations in the processing tank; in, The liquid supply unit includes a liquid delivery mechanism for delivering the processing liquid through the supply path. The substrate processing device further comprises: a liquid delivery control unit, which controls the output of the liquid delivery mechanism; as well as a flow rate setting unit that obtains a distribution of the in-tank temperature of the treatment tank based on the measured values ​​of the plurality of in-tank temperature sensors, and sets a target value of the flow rate of the treatment liquid achieved by the liquid feeding mechanism based on a deviation between the obtained distribution and a target distribution of the in-tank temperature, The liquid supply control unit controls the output of the liquid supply mechanism based on the target value of the flow rate.

9. A substrate processing method, comprising: A processing liquid is stored in the processing tank, and a plurality of substrates are immersed in the processing liquid; measuring the temperature of the treatment liquid at a plurality of locations in the treatment tank to obtain a temperature distribution in the tank; as well as The heating temperature of the supplied treatment liquid is adjusted at a plurality of locations in the treatment tank so that a deviation between the obtained distribution and the target distribution becomes zero.

10. The substrate processing method according to claim 9, characterized in that: The target value of the heating temperature of the treatment liquid is corrected so that the deviation between the obtained distribution and the target distribution of the temperature in the tank is zero, and the output of the heating mechanism for heating the treatment liquid is controlled so that the deviation between the corrected target value and the measured value is zero.

11. A substrate processing method, comprising: A processing liquid is stored in the processing tank, and a plurality of substrates are immersed in the processing liquid; measuring the temperature of the treatment liquid at a plurality of locations in the treatment tank to obtain a temperature distribution in the tank; as well as The flow rates of the supplied processing liquid are adjusted at a plurality of locations in the processing tank so that a deviation between the obtained distribution and a target distribution of the temperature in the tank becomes zero.

12. The substrate processing method according to claim 11, characterized in that: The target value of the flow rate of the processing liquid is corrected so that the deviation between the obtained distribution and the target distribution of the temperature in the tank is zero, and the output of the liquid delivery mechanism for delivering the processing liquid is controlled so that the deviation between the corrected target value and the measured value is zero.

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