Semiconductor device package and acoustic device including semiconductor device package

Abstract

This application relates to semiconductor device packages and acoustic devices including semiconductor device packages. In particular, this application relates to a wireless earpiece including a battery, a speaker, and a chamber / space. The battery has a first surface, a second surface opposite the first surface, and a third surface extending between the first surface and the second surface. The battery is disconnected from any protection circuitry. The speaker is disposed adjacent the first surface of the battery. The chamber / space is defined by the battery and the speaker. The chamber / space is free of any electronic components.

Description

Technical Field

[0001] This disclosure generally relates to a semiconductor device package, and more specifically, to an acoustic device having said semiconductor device package. Background Technology

[0002] With technological advancements, various circuits or modules can be integrated into a single electronic device, such as an acoustic device (e.g., headphones or wireless headphones) to perform multiple functions. However, the miniaturization of electronic devices can adversely affect their performance. Summary of the Invention

[0003] In some embodiments, the present invention discloses a wireless earphone. The wireless earphone includes a battery, a speaker, and a chamber / space. The battery has a first surface, a second surface opposite to the first surface, and a third surface extending between the first and second surfaces. The battery is disconnected from any protection circuitry. The speaker is positioned adjacent to the first surface of the battery. The chamber / space is defined by the battery and the speaker. The chamber / space does not contain any electronic components.

[0004] In some embodiments, the present invention further discloses a wireless earphone. The wireless earphone includes a speaker, a battery, and a first semiconductor device package. The battery is separate from the speaker and has a first surface, a second surface opposite to the first surface, and a third surface extending between the first and second surfaces. The first semiconductor device package is disposed adjacent to the second or third surface of the battery. The first semiconductor device package includes a substrate, a feed structure, and an encapsulant. The substrate has a first surface and a second surface opposite to the first surface. The feed structure is disposed on the first surface. The encapsulant encapsulates the entire second surface of the substrate. Attached Figure Description

[0005] When read in conjunction with the accompanying drawings, various aspects of some embodiments of this disclosure will be readily understood from the following detailed description. It should be noted that the various structures may not be drawn to scale, and the dimensions of the various structures may be arbitrarily increased or decreased for clarity of explanation.

[0006] Figure 1A An exploded view of an acoustic device according to some embodiments of the present disclosure is shown.

[0007] Figure 1B As shown Figure 1A A perspective view of the assembly of the acoustic device shown.

[0008] Figure 1C Show Figure 1B The image shows a side view of the acoustic device assembly.

[0009] Figure 2AAn exploded view of an acoustic device according to some embodiments of the present disclosure is shown.

[0010] Figure 2B As shown Figure 2A A perspective view of the assembly of the acoustic device shown.

[0011] Figure 2C Show Figure 2B The image shows a side view of the acoustic device assembly.

[0012] Figure 2D Show Figure 2B Another side view of the acoustic device assembly shown in the image.

[0013] Figure 3A An exploded view of the electronic components of an acoustic device according to some embodiments of the present disclosure is shown.

[0014] Figure 3B An assembly of electronic components of an acoustic device according to some embodiments of the present disclosure is shown.

[0015] Figure 3C An exploded view of an acoustic device according to some embodiments of the present disclosure is shown.

[0016] Figure 3D As shown Figure 3C Side view of the acoustic device assembly shown.

[0017] Figure 4A An acoustic device according to some embodiments of the present disclosure is shown inserted into the human ear.

[0018] Figure 4B An acoustic device according to some other embodiments of the present disclosure is shown inserted into the human ear.

[0019] Figure 4C Show Figure 4B The acoustic device shown here falls out of the ear.

[0020] Figure 5 As shown Figure 1A and 2A The image shows a cross-sectional view of the semiconductor device package of the acoustic device.

[0021] Figure 6A The frequency response of a pair of headphones according to an embodiment of the present disclosure is shown.

[0022] Figure 6B The frequency response of another pair of headphones according to an embodiment of this disclosure is shown.

[0023] Figure 7 An exploded view of an acoustic device according to some embodiments of the present disclosure is shown. Detailed Implementation

[0024] Figure 1A An exploded view of an acoustic device 1 according to some embodiments of the present disclosure is shown. The acoustic device 1 includes a loudspeaker 10, a battery 11, a semiconductor device package 12, an interconnect structure 13, and a housing 14. The loudspeaker has a surface 10a and a surface 10b opposite to surface 10a. The battery 11 has a surface 11a, a surface 11b opposite to surface 11a, and a surface 11c extending between surfaces 11a and 11b. The battery 11 is disconnected from any protection circuitry. The battery 11 comprises a coin-type package. The battery 11 does not contain an aluminum overlay. The capacity of the battery 11 may be greater than 60 mAh. For example, the battery 11 may contain a capacity of approximately 63 mAh.

[0025] The speaker 10 is positioned adjacent to the surface 11a of the battery 11. The surface 10a of the speaker 10 faces the surface 11a of the battery 11. The surface 11a of the battery 11 can be the cathode of the battery 11. The structure of the semiconductor device package 12 is as follows: Figure 5 A cross-sectional view of the semiconductor device package 5 is shown. A speaker 10 is connected to the semiconductor device package 12 via a wire 15. The wire 15 does not penetrate the battery 11. The speaker 10 is separated from the battery 11 by a chamber / space S1. A housing 14 encloses the speaker 10, battery 11, semiconductor device package 12, and interconnect structure 13. The interconnect structure 13 connects the battery 11 and the semiconductor device package 12. The interconnect structure 13 includes a flexible printed circuit (FPC) or other interconnect structure.

[0026] Figure 1B As shown Figure 1A A perspective view of the assembly of the acoustic device 1 shown. A semiconductor device package 12 is positioned adjacent to surface 11c of the battery 11. A semiconductor device package 12 is positioned adjacent to surface 11b of the battery 11. The semiconductor device package 12 is electrically connected to surface 11c of the battery 11 via an interconnect structure 13. A speaker 10 is separated from surface 11a of the battery 11 via a chamber / space S1. The chamber / space S1 contains no electronic components. The chamber / space S1 may have a plate for separating the speaker and the battery 11. The chamber / space S1 may contain conductive wires. The chamber / space S1 may contain only conductive wires. The chamber / space S1 may not have active components. The chamber / space S1 may not have passive components. The space between surface 11b of the battery 11 and the housing 14 contains no electronic components.

[0027] Semiconductor device package 12 is disposed between housing 14 and surface 11c of battery 11. Semiconductor device package 12 is disposed between housing 14 and surface 11b of battery 11. Speaker 10 has surface 10a facing surface 11a of battery 11. Semiconductor device package 12 is disposed between housing 14, surface 11c of battery 11 and surface 10a of speaker 10. Semiconductor device package 12 is disposed between housing 14, surface 11b of battery 11 and surface 10a of speaker 10. Semiconductor device package 12 is surrounded by housing 14, surface 11c of battery 11 and surface 10a of speaker 10. Semiconductor device package 12 is surrounded by housing 14, surface 11b of battery 11 and surface 10a of speaker 10. Semiconductor device package 12 is disposed in a cavity / space defined by housing 14, surface 11c of battery 11 and speaker 10. Semiconductor device package 12 is disposed in a cavity / space defined by housing 14, surface 11b of battery 11 and speaker 10. The housing 14 encloses the speaker 10, the battery 11, and the semiconductor device package 12. The housing 14 has an end 14a and an end 14b opposite to end 14a. (Opening) Figure 1B (Not shown in the diagram) can be mounted on end 14a. Antenna pattern 16 is formed on housing 14. Feed point of semiconductor device package 12 ( Figure 1B (Not shown in the image) Contact antenna pattern 16.

[0028] See again Figure 1B Assuming the speaker 10 has a width or diameter of approximately 6 mm, the maximum distance Z1 along the z-axis between end 14a (which can fit into or be inserted into an ear) and end 14b can be equal to or less than 23 mm. For example, assuming the speaker 10 has a width or diameter of approximately 6 mm, the distance Z1 along the z-axis between end 14a (which can fit into or be inserted into an ear) and end 14b can be equal to or less than 20 mm. Accordingly, the semiconductor device package 12 can facilitate the miniaturization of the acoustic device 1. The arrangement of the semiconductor device package 12 can facilitate the miniaturization of the acoustic device 1.

[0029] For example, assuming that the speaker 10 may have a width or diameter of approximately 10 mm, then the distance Z1 along the z-axis between end 14a (which can fit or be inserted into the ear) and end 14b may be approximately 23 mm.

[0030] See Figure 1C Assuming that the loudspeaker 10 can have a width or diameter of approximately 6 mm, the maximum distance of the acoustic device 1 along the x-axis can be equal to or less than 17 mm. Furthermore, assuming that the loudspeaker 10 can have a width or diameter of approximately 6 mm, the maximum distance of the acoustic device 1 along the y-axis can be equal to or less than 20 mm.

[0031] Figure 2AAn exploded view of an acoustic device 2 according to some embodiments of the present disclosure is shown. The acoustic device 2 includes a speaker 20, a battery 21, a semiconductor device package 22, an interconnect structure 23, and a housing 24. The speaker has a surface 20a and a surface 20b opposite to surface 20a. The battery 21 has a surface 21a, a surface 21b opposite to surface 21a, and a surface 21c extending between surfaces 21a and 21b. The battery 21 is disconnected from any protection circuitry. The battery 21 comprises a coin-type package. The battery 21 does not contain an aluminum overlay. Because the battery 11 incorporates a special structure (e.g., a fuse) and a special electrolyte formulation, the battery 11 will not swell or burst after a short period of use.

[0032] The speaker 20 is positioned adjacent to the surface 21a of the battery 21. The surface 20a of the speaker 20 faces the surface 21a of the battery 21. The surface 21a of the battery 21 can be the cathode of the battery 21. The structure of the semiconductor device package 22 can be... Figure 5 A cross-sectional view of the semiconductor device package 5 is shown. The speaker 20 is separated from the battery 21 via a chamber / space S2. A housing 24 encloses the speaker 20, battery 21, semiconductor device package 22, and interconnect structure 23. The interconnect structure 23 connects the battery 21 and the semiconductor device package 22. The interconnect structure 23 includes a flexible printed circuit (FPC) or other interconnect structure.

[0033] Figure 2B As shown Figure 2A A perspective view of the assembly of the acoustic device 2 shown. A semiconductor device package 22 is positioned adjacent to surface 21c of the battery 21. A semiconductor device package 22 is positioned adjacent to surface 21b of the battery 21. The semiconductor device package 22 is electrically connected to surface 21c of the battery 21 via an interconnect structure 23. A speaker 20 is separated from surface 21a of the battery 21 via a chamber / space S2. The chamber / space S2 does not contain electronic components. The chamber / space S2 may contain a plate for separating the speaker and the battery 11. The chamber / space S2 may contain conductive wires. The chamber / space S2 may contain only conductive wires. The chamber / space S2 may not contain active components. The chamber / space S2 may not contain passive components. The space between surface 21b of the battery 21 and the housing 24 ( Figure 2B (Not indicated) It does not contain any electronic components.

[0034] Semiconductor device package 22 is disposed between housing 24 and surface 21c of battery 21. Semiconductor device package 22 is disposed between housing 24 and surface 21b of battery 21. Speaker 20 has surface 20a facing surface 21a of battery 21. Semiconductor device package 22 is disposed between housing 24, surface 21c of battery 21 and surface 20a of speaker 20. Semiconductor device package 22 is disposed between housing 24, surface 21b of battery 21 and surface 20a of speaker 20. Semiconductor device package 22 is surrounded by housing 24, surface 21c of battery 21 and surface 20a of speaker 20. Semiconductor device package 22 is surrounded by housing 24, surface 21b of battery 21 and surface 20a of speaker 20. Semiconductor device package 22 is disposed in a cavity / space defined by housing 24, surface 21c of battery 21 and speaker 20. Semiconductor device package 22 is disposed in a cavity / space defined by housing 24, surface 21b of battery 21 and speaker 20. A housing 24 encloses a speaker 20, a battery 21, and a semiconductor device package 22. The housing 24 has an end 24a and an opposite end 24b. An antenna pattern 26 is formed on the housing 24. The feed point of the semiconductor device package 22 (…) Figure 2B (Not shown in the image) Contact antenna pattern 26.

[0035] See again Figure 2B Assuming the loudspeaker 10 can have a width or diameter of approximately 10 mm, the maximum distance Z2 along the z-axis between end 24a (which can fit or be inserted into an ear) and end 24b can be equal to or less than 23 mm. Because of the use of the semiconductor device package 22, a larger loudspeaker can be accommodated and used in the acoustic device 2, which improves the acoustic performance of the acoustic device 2. Accordingly, the semiconductor device package 22 enhances the acoustic performance of the acoustic device 2. The arrangement of the semiconductor device package 22 enhances the acoustic performance of the acoustic device 2.

[0036] Connector 23 may include a sensor ( Figure 2B (Not shown in the image), it is mounted on connector 23 and positioned between surface 21c of housing 24 and battery 21. The sensor can be a proximity sensor. The proximity sensor determines the operating mode (after wearing) or standby mode. A sensing surface corresponding to the proximity sensor may be present. Figure 2B The opening on the housing 24 (not shown in the text) Figure 2B (Not indicated in the text).

[0037] Connector 23 may include another sensor 25, which is disposed on connector 23 and positioned between the housing 24 and the surface 21a of battery 21. Sensor 25 may be a heart rate sensor. The heart rate sensor can sense the heart rate of a person wearing acoustic device 2. A sensing surface corresponding to sensor 25 may be present. Figure 2BThe opening on the housing 24 (not shown in the text) Figure 2B (Not indicated in the text).

[0038] See Figure 2C Assuming that the acoustic device 2 contains a loudspeaker with a width or diameter of approximately 10 mm, the maximum distance Y1 of the acoustic device 2 along the y-axis can be equal to or less than 24 mm.

[0039] See Figure 2D Assuming that the acoustic device 2 contains a loudspeaker with a width or diameter of approximately 10 mm, the maximum distance X1 of the acoustic device 2 along the x-axis can be equal to or less than 18 mm.

[0040] Figure 3A An exploded view of the electronic components of the acoustic device is shown. Circuit boards 31, 32, and 33 of the acoustic device are connected via an interconnect structure 34. Electronic components are formed on circuit boards 31, 32, and 33. The interconnect structure 34 may include an FPC or other interconnect structures. A battery 35 may be provided in the acoustic device.

[0041] Figure 3B An assembly of electronic components of an acoustic device according to some embodiments of the present disclosure is shown. Circuit boards 31, 32, and 33 are stacked. The thickness of the stack is T1. Circuit boards 31 and 32 and interconnect structure 34 surround a battery 35. Circuit boards 32 and 33 and interconnect structure 34 surround a mechanical component 36.

[0042] Figure 3C An exploded view of the acoustic device 3 is shown. The acoustic device 3 may include a speaker 30, circuit boards 31, 32, and 33, an interconnect structure 34, a battery 35, and a housing 37. The circuit board 33 is positioned between the speaker 30 and the battery 35, which causes electromagnetic interference to the speaker 30 and thus degrades the acoustic performance of the acoustic device 3. The housing 37 encloses the speaker 30, circuit boards 31, 32, and 33, the interconnect structure 34, and the battery 35. An antenna pattern 38 is formed on the housing 37. The feed point on the circuit board 33 (…) Figure 3C (Not shown in the image) Contact antenna pattern 38.

[0043] Figure 3D As shown Figure 3C The image shows a side view of the assembly of the acoustic device 3. In some embodiments, assuming the diameter of the speaker inside the acoustic device 3 is 6 mm, the maximum distance Z3 between end 37a (which can fit or be inserted into the ear) and end 37b is equal to or greater than 23 mm. Because Figure 3B The thickness T1 shown is greater than the distance between the end 12a of the semiconductor device package 12 and the end 11a of the battery 11 along the [missing information]. Figure 1B The distance along the z-axis is such that the maximum distance Z3 of acoustic device 3 is greater than the maximum distance Z1 of acoustic device 1.

[0044] See Figure 4A , Figure 1B The acoustic device 1 shown is inserted into the ear. The center of gravity CM1 may be adjacent to or close to the end 14b. Due to the miniaturization of the acoustic device 1, when the acoustic device 1 is inserted into the ear, the acoustic device 1 can contact the point P of the ear. Therefore, the acoustic device 1 can have relatively good support for the ear. Therefore, even if the person wearing the acoustic device 1 moves or sweats, the acoustic device 1 will not easily fall out.

[0045] See Figure 4B , Figure 3D The acoustic device 3 shown is inserted into the ear. The center of gravity CM2 may be adjacent to or close to the end 37b.

[0046] The acoustic device 3, which may be relatively large in size, may have a floating main part (excluding the plug). The acoustic device 3 may be separated from the point P of the human ear. The distance D1 is between the top surface of the acoustic device 3 and the human ear.

[0047] Figure 4C This demonstrates that when the person wearing the acoustic device 3 sweats, moves, or changes position, the acoustic device 3 begins to fall out of the ear. The falling out of the acoustic device 3 may be due to factors such as... Figure 4B The unstable state shown indicates that the center of gravity CM2 may cause the acoustic device 3, which lacks ear support, to fall out of the ear relatively easily.

[0048] The expected increase in distance D2 from the top surface of the acoustic device 3 to the human ear is attributed to the drop of the acoustic device 3. Distance D2 is greater than distance D1.

[0049] Figure 5 As shown Figure 1A The diagram shows a cross-sectional view of the semiconductor device package 12 of the acoustic device 1. The semiconductor device package 5 may include a substrate 50, an electronic component 51, another electronic component 52, an encapsulant 53, and a feed structure 54.

[0050] The substrate 50 has a surface 50b and a surface 50u opposite to the surface 50b.

[0051] Semiconductor device 51 may be disposed on surface 50b of substrate 50. Electronic component 52 may be disposed on surface 50b of substrate 50. Encapsulant 53 may encapsulate electronic component 51 on surface 50b of substrate 50. Encapsulant 53 may encapsulate electronic component 52 on surface 50b of substrate 50. Shielding layer 57 is disposed on encapsulant 53 to separate semiconductor device package 5 from battery 11 or 21, such as... Figure 1A and 2A As shown in the image.

[0052] Feed structure 54 may be disposed on surface 50u of substrate 50 and is free of encapsulant or molding material. Feed structure 54 is exposed on surface 50u of substrate 50. Surface 50u of substrate 50 is free of encapsulant or molding material. Electronic component 55 is disposed on both surfaces 50b and 50u of substrate 50. Microphone 56 is disposed on surface 50u. Microphone 56 may include a semiconductor device package. Microphone 56 may include a microelectromechanical system (MEMS) device. Microphone 56 may include a MEMS device package. Microphone 56 is exposed. Sensor 52 is disposed on surface 50u of substrate 50. Connector 53 is disposed on surface 50u of substrate 50. Surface 50b includes conductive pads for battery connection. Surface 50b includes conductive pads for speaker driver connection. Feed structure 54 has surface 54u higher than microphone 56. Surface 54u is higher than sensor 52. Surface 54u is higher than connector 53. The feed structure 54 is the tallest among the components mounted on the surface 50u of the substrate 50.

[0053] Electronic components 51 and 52 may include one or more of an application processor, memory, digital signal processor, decoder / decoder, power management integrated circuit, DC converter, low dropout output, or filter. Encapsulant 53 may contain various types of molding materials. Feed structure 54 includes springs or conductive leads. Feed structure 54 includes POGO leads. Feed structure 54 also includes an antioxidant layer. Feed structure 54 is configured and can be used to feed radio frequency (RF) signals to an antenna. Electronic component 55 may include one or more of a resistor, inductor, or capacitor. Sensor 52 may include a G sensor or other sensors. Connector 53 includes a zero-insertion-force connector or board-to-board connector for peripheral functional flexible printed circuit (FPC) connections.

[0054] Figure 6A As shown Figure 3C The frequency response curves of a set of acoustic device components are shown. Figure 3D The distance Z3 of the acoustic device 3 shown can be equal to or less than 23 mm. The headphones include a speaker with a width or diameter of 6 mm. The unit of the horizontal axis is frequency (in Hz). The unit of the horizontal axis is the amplitude of the acoustic device (in dB). Figure 6A The two curves represent the frequency response curves of the left and right earphones, respectively. For example... Figure 6AAs shown, the two headphones have similar performance. Furthermore, the difference D3 between the amplitude at relatively low frequencies (approximately 20Hz to 100Hz) and the amplitude at mid-frequency frequencies (approximately 100Hz to 1kHz) is equal to or greater than approximately 19dB. The difference D4 between the amplitudes at low frequencies (approximately 20Hz to 100Hz) is equal to or greater than approximately 8dB. The smaller the difference D3, the better the acoustic performance of acoustic device 3. The smaller the difference D4, the better the acoustic performance of acoustic device 3.

[0055] Figure 6B As shown Figure 2B The frequency response curves of a set of acoustic device components are shown. Figure 2B The distance Z2 of the acoustic device 2 shown can be equal to or less than 23 mm. The headphones include a speaker with a width or diameter of 10 mm. Figure 2B The maximum distance Z2 shown is equal to or similar to that shown in the figure. Figure 3D The maximum distance Z3 is shown. The horizontal axis is in frequency (Hz). The horizontal axis is in amplitude of the acoustic device (dB). Figure 6B The two curves represent the frequency response curves of the left and right earphones, respectively. For example... Figure 6B As shown, the two headphones have similar performance. Furthermore, the difference D5 between the amplitude at relatively low frequencies (approximately 20Hz to 100Hz) and the amplitude at mid-frequency frequencies (approximately 100Hz to 1kHz) is equal to or less than approximately 14dB. The difference D6 between the amplitudes at low frequencies (approximately 20Hz to 100Hz) is equal to or less than approximately 3dB. The smaller the difference D5, the better the acoustic performance of acoustic device 2. The smaller the difference D6, the better the acoustic performance of acoustic device 2.

[0056] Figure 7 An exploded view of an acoustic device 7 according to some embodiments of the present disclosure is shown. The acoustic device 7 includes a loudspeaker 70, a battery 71, a semiconductor device package 72, an interconnect structure 73, and a housing 74. The loudspeaker has a surface 70a and a surface 70b opposite to surface 70a. The battery 71 has a surface 71a, a surface 71b opposite to surface 71a, and a surface 71c extending between surfaces 71a and 71b. The battery 71 has a different... Figure 1A and 2A The battery 11 is shown in the diagram. Battery 71 is connected to protection circuit 71d. Battery 71 contains a lithium rechargeable battery. Battery 71 includes an aluminum cover. Protection circuit 71d controls the voltage and current flowing into battery 71. Protection circuit 71d controls the voltage and current flowing out of battery 71. Protection circuit 71d prevents battery 71 from swelling or even bursting after a short period of operation.

[0057] A speaker 70 is positioned adjacent to a semiconductor device package 72. A battery 71 faces surface 72a of the semiconductor device package 72. The speaker 70 is connected to the semiconductor device package 72 via wires 75. The speaker 70 is separated from the semiconductor device package 72 via a chamber / space S3. A housing 74 encloses the speaker 70, battery 71, semiconductor device package 72, and interconnect structure 73. The interconnect structure 73 connects the battery 71 and the semiconductor device package 72. The interconnect structure 73 includes a flexible printed circuit (FPC) or other interconnect structure.

[0058] The maximum distance of the acoustic device 7 along the x-axis can be equal to or greater than 20 mm. The maximum distance of the acoustic device 7 along the y-axis can be equal to or greater than 28 mm. The maximum distance Z4 between the end 74a (which can fit into or be inserted into the ear) and the end 74b along the z-axis can be equal to or greater than 24 mm.

[0059] The size of battery 71 depends on temperature. As battery 71 operates for a short time, its temperature increases, causing its size to increase. Therefore, a relatively large space is required to house battery 71. Figure 7 (Not shown in the image) because the battery 71 will expand after use. Accordingly, the distance between the battery 71 and the semiconductor device package 72 will increase.

[0060] Assuming a lithium rechargeable battery with an aluminum coating is used as battery 71, the capacity of battery 71 may be less than 50 mAh. For example, battery 71 may contain a capacity of approximately 45 mAh.

[0061] In addition, a relatively large space is required to accommodate the battery 71. Figure 7 (Not shown in the text) because battery 71 will expand after use. Assuming that battery 11 has a capacity similar to that of battery 71, the size of acoustic device 7 containing battery 71 may be larger than the size of acoustic device 1 containing battery 11.

[0062] Unless otherwise stated, spatial descriptions such as “above,” “below,” “up,” “left,” “right,” “lower,” “top,” “bottom,” “vertical,” “horizontal,” “side,” “above,” “below,” “upper part,” “above,” “below,” etc., are relative to the orientation shown in the figures. It should be understood that the spatial descriptions used herein are for illustrative purposes only, and actual embodiments of the structures described herein can be arranged in space in any orientation or manner, provided that the advantages of the embodiments of this disclosure are not affected by such arrangements.

[0063] As used herein, the terms “approximately,” “generally,” “basically,” and “about” are used to describe and account for small variations. When used in conjunction with an event or situation, the terms can refer to situations in which the event or situation clearly occurs or situations in which the event or situation is very close to occurring. For example, when used in conjunction with a numerical value, the terms can refer to a range of variation less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if a first numerical value is within a range of variation less than or equal to ±10% of a second numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%, then the first numerical value can be considered “generally” the same as or equal to the second numerical value. For example, "generally" vertical can refer to an angular variation of less than or equal to ±10° relative to 90°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°.

[0064] If the displacement between two surfaces does not exceed 5 μm, 2 μm, 1 μm, or 0.5 μm, then the two surfaces can be considered coplanar or substantially coplanar. If the displacement between the highest and lowest points of a surface does not exceed 5 μm, 2 μm, 1 μm, or 0.5 μm, then the surface can be considered substantially flat.

[0065] As used herein, unless the context clearly indicates otherwise, the singular terms “a / an” and “the” may include multiple indicators.

[0066] As used herein, the terms “conductive,” “electrically conductive,” and “conductivity” refer to the ability to conduct electric current. Conductive materials are generally those that exhibit little or no resistance to the flow of electric current. One measure of conductivity is Siemens per meter (S / m). Typically, conductive materials are those with a conductivity greater than approximately 10⁴ S / m (e.g., at least 10⁵ S / m or at least 10⁶ S / m). The conductivity of a material may sometimes vary with temperature. Unless otherwise specified, the conductivity of a material is measured at room temperature.

[0067] Additionally, quantities, ratios, and other values ​​are sometimes presented in range format in this document. It should be understood that such range format is for convenience and brevity and should be interpreted flexibly to include not only values ​​explicitly specified as range limits, but also all individual values ​​or subranges covered within the range, as if each value and subrange were explicitly specified.

[0068] While this disclosure has been described and illustrated with reference to specific embodiments thereof, such descriptions and illustrations are not limiting. Those skilled in the art will understand that various changes and equivalents may be made and substituted without departing from the true spirit and scope of this disclosure as defined by the appended claims. Illustrations may not be drawn to scale. Differences may exist between artistic representations in this disclosure and actual equipment due to manufacturing processes and tolerances. Other embodiments of this disclosure may exist that are not specifically described. The description and drawings should be considered illustrative rather than limiting. Modifications may be made to adapt particular circumstances, materials, compositions, methods, or processes to the objectives, spirit, and scope of this disclosure. All such modifications are intended to be within the scope of the appended claims. While the methods disclosed herein have been described with reference to specific operations performed in a particular order, it should be understood that these operations may be combined, subdivided, or reordered to form equivalent methods without departing from the teachings of this disclosure. Accordingly, unless specifically indicated herein, the order and grouping of operations are not limitations of this disclosure.

[0069] As used herein, spatial relation terms such as “below,” “under,” “lower,” “above,” “upper,” “lower,” “left,” and “right,” used for ease of description, may be used to describe the relationship between one or more elements or features as shown in the figures and another element or feature(s). In addition to the orientations depicted in the figures, spatial relation terms are also intended to cover different orientations of the device in use or operation. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relation descriptors used herein shall be interpreted accordingly. It should be understood that when an element is referred to as “connected to” or “coupled to” another element, it may be directly connected to or coupled to said other element, or there may be intervening elements.

[0070] As used herein, the terms “approximately,” “generally,” “substantially,” and “about” are used to describe and account for small variations. When used in conjunction with an event or situation, the terms can refer to a situation in which the event or situation clearly occurs or is very close to occurring. As used herein with respect to a given value or range, the term “about” generally means within ±10%, ±5%, ±1%, or ±0.5% of the given value or range. A range can be expressed herein as from one endpoint to another or between two endpoints. Unless otherwise specified, all ranges disclosed herein include endpoints. The term “generally coplanar” can refer to two surfaces located along the same plane within a few micrometers (μm), for example, within 10 μm, 5 μm, 1 μm, or 0.5 μm. When referring to the same numerical value or characteristic, the term can refer to a value within ±10%, ±5%, ±1%, or ±0.5% of the average of said value.

[0071] The foregoing outlines several embodiments and detailed features of this disclosure. The embodiments described herein can be readily used as the basis for designing or modifying other processes and structures for carrying out the same or similar purposes and / or achieving the same or similar advantages of the embodiments described herein. These equivalent constructions do not depart from the spirit and scope of this disclosure, and various changes, substitutions, and modifications can be made without departing from the spirit and scope of this disclosure.

Claims

1. A wireless earphone, comprising: Semiconductor device packaging; A battery, which is packaged with the semiconductor device and disposed along a first axis of the wireless earphone; A speaker, which is positioned along the second axis of the wireless earphone, with the first axis substantially perpendicular to the second axis; as well as A housing that encloses the semiconductor device package, the battery, and the speaker; The battery has a flat surface and a curved surface, wherein the flat surface faces the speaker. The semiconductor device is packaged and disposed above the curved surface of the battery, and the speaker is disposed adjacent to the planar surface of the battery, wherein the speaker and the planar surface of the battery define a chamber having only conductive wires. The housing has an outer top surface extending upward from one end of the wireless earphone to the top of the housing, and an outer bottom surface extending downward from the end of the wireless earphone to the bottom of the housing, the end of the wireless earphone being configured to insert into the ear canal. The semiconductor device is packaged and disposed within a first space of the housing, and the battery and the speaker are disposed within a second space of the housing, the second space being adjacent to the first space, and the outer top surface of the housing overlapping the first space and the second space in a direction along the second axis. The outer bottom surface of the housing overlaps with the second space but not with the first space in the direction along the second axis.

2. The wireless earphone of claim 1, wherein the speaker is disposed between the planar surface of the battery and the end of the wireless earphone configured to be inserted into the ear canal.

3. The wireless earphone of claim 2, wherein the projection of the speaker onto the battery along the second axis is entirely within the planar surface of the battery.

4. The wireless earphone of claim 3, wherein the planar surfaces of the semiconductor device package and the battery do not overlap along the first axis and the third axis.

5. The wireless earphone of claim 1, wherein when the end of the wireless earphone is inserted into the ear canal, the semiconductor device package is above the end of the wireless earphone and also above the ear canal.

6. The wireless earphone of claim 1, wherein the semiconductor device package comprises: A substrate having a first surface and a second surface opposite to the first surface; A first electronic component is disposed on the first surface of the substrate; An encapsulating agent that encapsulates the first electronic component on the first surface of the substrate; as well as A feed structure disposed on the second surface of the substrate, the feed structure including a spring or conductive pin and also including an anti-oxidation layer, the feed structure being configured to feed a radio frequency (RF) signal to an antenna.

7. The wireless earphone of claim 6, wherein the housing includes an antenna pattern that contacts the feed structure.

8. The wireless earphone of claim 6, wherein the feed structure is the highest among the elements disposed on the second surface of the substrate.

9. The wireless earphone of claim 5, wherein the planar surface of the battery is a cathode, and wherein when the end of the wireless earphone is inserted into the ear canal, the semiconductor device is packaged and disposed around a position between the ear canal and the helix.

10. The wireless earphone of claim 1, wherein the battery comprises a lithium rechargeable battery, wherein the semiconductor device is completely encapsulated in the first space of the housing, and the battery and the speaker are completely encapsulated in the second space of the housing.

11. A wireless earphone, comprising: Semiconductor device packaging; A battery, which is packaged with the semiconductor device and disposed along a first axis of the wireless earphone; A speaker, which is separate from the battery and positioned along the second axis of the wireless earphone, the first axis being substantially perpendicular to the second axis; as well as A housing that encloses the semiconductor device package, the battery, and the speaker. The battery has a flat surface and a curved surface, wherein the flat surface faces the speaker. The semiconductor device is packaged and disposed above the curved surface of the battery, and the speaker is disposed adjacent to the planar surface of the battery, wherein the speaker and the planar surface of the battery define a chamber having only conductive wires. The housing has an outer top surface extending upward from one end of the wireless earphone to the top of the housing, and an outer bottom surface extending downward from the end of the wireless earphone to the bottom of the housing, the end of the wireless earphone being configured to insert into the ear canal. The semiconductor device is packaged and disposed within a first space of the housing, and the battery and the speaker are disposed within a second space of the housing, the second space being adjacent to the first space, and the outer top surface of the housing overlapping the first space and the second space in a direction along the second axis. The outer bottom surface of the housing overlaps with the second space but not with the first space in the direction along the second axis. The semiconductor device package further includes: A substrate having a first surface and a second surface opposite to the first surface; A feeding structure, which is disposed on the top surface; and Encapsulating agent that encapsulates the entire second surface of the substrate.

12. The wireless earphone of claim 11, wherein the speaker is disposed between the planar surface of the battery and the end of the wireless earphone configured to be inserted into the ear canal.

13. The wireless earphone of claim 11, wherein the semiconductor device package further includes a first electronic component disposed on the first surface of the substrate, the first electronic component being a microphone that includes a microelectromechanical system (MEMS) device.

14. The wireless earphone of claim 13, wherein the semiconductor device package further comprises a second electronic component package disposed on the second surface of the substrate.

15. The wireless earphone of claim 11, wherein the second surface of the substrate is free of encapsulating agent or molding material.

16. The wireless earphone of claim 11, wherein the feed structure is the highest of the elements disposed on the second surface of the substrate, and the feed structure includes a spring or conductive pin and further includes an anti-oxidation layer, the feed structure being configured to feed a radio frequency (RF) signal to an antenna.

17. The wireless earphone of claim 11, further comprising a shielding layer disposed on the encapsulant to separate the semiconductor device package from the battery.

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