Display panel and display device

Abstract

The present disclosure relates to a display panel and a display device, wherein the display panel includes: a base substrate, pixels, signal lines, power lines, signal pads, power pads, and a conductive portion electrically connected to the power pads and extending from a region overlapping the power pads toward an edge of the base substrate. An opening is defined in the conductive portion by a portion of the conductive portion that is removed.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority from Korean Patent Application No. 10-2019-0097665, filed on August 9, 2019, which is hereby incorporated by reference herein in its entirety. Technical Field

[0003] The present disclosure relates to a display panel having improved product reliability and a display device including the same. Background Art

[0004] Typically, electronic devices such as mobile phones, laptop computers, and televisions include two or more electronic components, such as an electro-optical panel, a main wiring board, and a flexible wiring board. The two or more electronic components are electrically connected to each other via connections between pads. The pad portions of the two or more electronic components are coupled to each other through an alignment process and are coupled to each other using a thermal compression tool. Summary of the Invention

[0005] The present disclosure provides a display panel with improved product reliability.

[0006] The present disclosure provides a display device including the display panel.

[0007] An embodiment of the present disclosure provides a display panel, the display panel comprising: a base substrate, wherein a first area, a second area, and a third area are sequentially defined in a first direction; pixels are arranged on the first area; signal lines are arranged on the base substrate and electrically connected to the pixels; power lines are arranged on the base substrate, wherein the power lines supply power to the pixels; signal pads are arranged on the second area, the signal pads are arranged in a second direction crossing the first direction and electrically connected to the signal lines; power pads are arranged on the second area, the power pads are arranged in the second direction and electrically connected to the power lines; and conductive portions are arranged on the second area and the third area, the conductive portions are electrically connected to the power pads and extend from an area overlapping with the power pads toward an edge of the base substrate. In such an embodiment, an opening is defined in the conductive portion by a portion of the conductive portion that is removed.

[0008] In an embodiment, the conductive portion may include: a first sub-conductive portion, arranged on the second area and between the power pad and the base substrate; and a second sub-conductive portion, arranged on the second area and the third area and electrically connected to the first sub-conductive portion and the power pad, and the opening may be defined in the second sub-conductive portion.

[0009] In an embodiment, the second sub-conductive portion may include conductive strips arranged in the second direction, and the conductive strips may be spaced apart from each other in the second direction.

[0010] In an embodiment, each of the conductive strips may have a width greater than a width of each of the power pads.

[0011] In an embodiment, the number of the conductive strips may be smaller than the number of the power pads.

[0012] In an embodiment, the second sub-conductive portion may include: a conductive body extending in the second direction; and a conductive protrusion protruding from the conductive body toward the edge of the base substrate, and the width of each of the conductive protrusions in the second direction may be smaller than the width of the conductive body in the second direction.

[0013] In an embodiment, the conductive protrusions may be spaced apart from each other in the second direction.

[0014] In an embodiment, the second sub-conductive portion may include: a first conductive strip arranged in the first direction; and a second conductive strip arranged in the first direction, and the first conductive strip may be provided in a layer different from a layer in which the second conductive strip is provided.

[0015] In an embodiment, in a plan view, the first conductive strips may be arranged alternately with the second conductive strips in the first direction.

[0016] In an embodiment, each of the first conductive strip and the second conductive strip may extend in the second direction.

[0017] In an embodiment, the first conductive strip may be electrically connected to the second conductive strip.

[0018] In an embodiment, the display panel may further include an organic layer disposed to cover the conductive portion, and the organic layer may extend in the second direction.

[0019] In an embodiment, the power line may have a width greater than a width of each of the power pads.

[0020] In an embodiment, the base substrate may include: an upper surface; a first inclined surface extending from the upper surface; a side surface extending from the first inclined surface; a second inclined surface extending from the side surface; and a bottom surface extending from the second inclined surface, and the first region, the second region and the third region may be defined in the upper surface.

[0021] In an embodiment, the opening may be provided in the form of a groove defined by the removed portion of the conductive portion in a thickness direction of the conductive portion.

[0022] In an embodiment, the display panel may further include: an additional metal strip disposed on the conductive portion, and the additional metal strip may extend in the second direction.

[0023] An embodiment of the present disclosure provides a display device, the display device including a display panel and a circuit board, the display panel including: a base substrate, wherein a first region, a second region, and a third region are sequentially defined in a first direction; pixels are arranged on the first region; signal lines are arranged on the first region; power lines are arranged on the first region; signal pads are electrically connected to the signal lines and arranged on the second region; power pads are electrically connected to the power lines and arranged on the second region; and conductive portions are arranged on the second region and the third region and electrically connected to the power pads, the circuit board being arranged on the display panel and electrically connected to the power pads and the signal pads. In such an embodiment, an opening is defined in a portion of the conductive portion that overlaps the second region and the third region.

[0024] In an embodiment, the display panel may further include: an organic layer disposed on the third region to cover the conductive portion.

[0025] In an embodiment, the opening may extend in the first direction, the conductive portion may include conductive strips spaced apart from each other, the opening is between the conductive strips, each of the conductive strips may have a width equal to or greater than a width of each of the power pads, and the number of the conductive strips may be equal to or less than the number of the power pads.

[0026] In an embodiment, the conductive part may include: a conductive body extending in a second direction intersecting the first direction; and a conductive protrusion protruding from the conductive body toward the edge of the base substrate, and the width of each of the conductive protrusions in the second direction may be smaller than the width of the conductive body in the second direction.

[0027] In an embodiment, the conductive portion may include: a first conductive strip arranged in the first direction; and a second conductive strip arranged in the first direction, and the first conductive strip may be provided in a layer different from a layer in which the second conductive strip is provided.

[0028] In an embodiment, each of the first and second conductive strips may extend in a second direction crossing the first direction, the first conductive strips may be arranged alternately with the second conductive strips in a plan view, and the first conductive strips may be electrically connected to the second conductive strips.

[0029] According to the embodiment, even when peeling occurs in a portion of the conductive portion adjacent to the edge of the base substrate, the peeling can be effectively prevented from advancing in the first direction, the second direction, or both. Therefore, the reliability of the display device can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The above and other features of the present disclosure will become more apparent by reference to the following detailed description of exemplary embodiments when considered in conjunction with the accompanying drawings, in which:

[0031] Figure 1 is a perspective view showing a display device according to an exemplary embodiment of the present disclosure;

[0032] Figure 2 is an exploded perspective view showing a display device according to an exemplary embodiment of the present disclosure;

[0033] Figure 3 It is along Figure 2 A cross-sectional view taken along line II' shown in FIG.

[0034] Figure 4 is a plan view showing a display panel according to an exemplary embodiment of the present disclosure;

[0035] Figure 5 is a cross-sectional view showing a display panel according to an exemplary embodiment of the present disclosure;

[0036] Figure 6A is a display panel according to an exemplary embodiment of the present disclosure Figure 4 A plan view corresponding to an enlarged plan view of the region XX' shown in FIG;

[0037] Figure 6B It is along Figure 6A A cross-sectional view taken along line II-II' shown in FIG.

[0038] Figure 7 is a display panel according to an alternative exemplary embodiment of the present disclosure Figure 4 A plan view corresponding to an enlarged plan view of the region XX' shown in FIG;

[0039] Figure 8 is a display panel according to another alternative exemplary embodiment of the present disclosure Figure 4A plan view corresponding to an enlarged plan view of the region XX' shown in FIG;

[0040] Figure 9 is a display panel according to another alternative exemplary embodiment of the present disclosure Figure 4 A plan view corresponding to an enlarged plan view of the region XX' shown in FIG;

[0041] Figure 10 is a display panel according to another alternative exemplary embodiment of the present disclosure Figure 4 A plan view corresponding to an enlarged plan view of the region XX' shown in FIG;

[0042] Figure 11 is a display panel according to another alternative exemplary embodiment of the present disclosure Figure 4 A plan view corresponding to an enlarged plan view of the region XX' shown in FIG;

[0043] Figure 12A is a display panel according to another alternative exemplary embodiment of the present disclosure Figure 4 A plan view corresponding to an enlarged plan view of the region XX' shown in FIG; and

[0044] Figure 12B It is along Figure 12A sectional view taken along line III-III' shown in FIG. DETAILED DESCRIPTION

[0045] Hereinafter, the present disclosure will be described more fully with reference to the accompanying drawings in which various embodiments are shown. However, the present disclosure can be implemented in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the scope of the disclosure to those skilled in the art.

[0046] In the following description, it will be understood that when an element or layer is referred to as being “on,” “connected to,” or “coupled to” another element or layer, the element or layer can be directly on, directly connected to, or directly coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element or layer is referred to as being “directly on,” “directly connected to,” or “directly coupled to” another element or layer, there are no intervening elements or layers.

[0047] The same reference numerals refer to the same elements throughout. In the drawings, the thickness, proportion and size of components are exaggerated in order to effectively describe the technical contents.

[0048] As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0049] It will be understood that, although the terms first, second, etc. can be used in this article to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be restricted by these terms. These terms are only used to distinguish an element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present disclosure, the first element, component, region, layer or part discussed below can be named as the second element, component, region, layer or part. As used herein, unless the context clearly indicates otherwise, the singular "one", "a kind of" and "described (the)" are also intended to include plural forms, including "at least one (kind)".

[0050] For ease of description, spatially relative terms such as "under," "beneath," "down," "over," and "up" may be used herein to describe the relationship of one element or feature to another element(s) or feature(s) as shown in the accompanying drawings.

[0051] As used herein, "about" or "approximately" is inclusive of the stated value and means within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art, taking into account the measurements in question and errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system). For example, "about" can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the stated value.

[0052] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present disclosure belongs. It will be further understood that, unless expressly defined as such herein, terms (such as those defined in general dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense.

[0053] It will also be understood that when used in this specification, the terms “comprises” and / or “includes” or “contains” and / or “has” indicate the presence of stated features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0054] Exemplary embodiments are described herein with reference to cross-sectional views that are schematic diagrams of idealized embodiments. As such, variations in the shapes of the illustrations due to, for example, manufacturing techniques and / or tolerances are anticipated. Therefore, the embodiments described herein should not be construed as limited to the specific shapes of the regions shown herein, but rather will include deviations in shape due to, for example, manufacturing. For example, a region shown or described as flat may typically have rough and / or nonlinear features. Furthermore, sharp angles shown may be rounded. Therefore, the regions shown in the accompanying drawings are schematic in nature, and their shapes are not intended to illustrate the precise shape of the regions and are not intended to limit the scope of the claims.

[0055] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0056] Figure 1 is a perspective view illustrating a display device DD according to an exemplary embodiment of the present disclosure. Figure 2 is an exploded perspective view illustrating a display device DD according to an exemplary embodiment of the present disclosure.

[0057] Reference Figure 1 and Figure 2 , an exemplary embodiment of the display device DD may be a device that is activated in response to an electrical signal. The display device DD may be applied to various electronic devices, for example, large electronic devices such as televisions, monitors, or outdoor billboards, and small and medium-sized electronic products such as personal computers, laptop computers, personal digital assistants, navigation units, game units, mobile electronic devices, and cameras, but is not limited thereto. Hereinafter, for ease of description, reference will be made to Figure 1 and Figure 2 An exemplary embodiment in which the display device DD is a smartphone is described in detail.

[0058] The display device DD displays an image IM toward a third direction DR3 through a display surface FS that is substantially parallel to each of the first direction DR1 and the second direction DR2. The image IM includes a still image and a moving image. Figure 1 A clock application and an application icon are shown as representative examples of the image IM. The display surface FS on which the image IM is displayed corresponds to the front surface of the display device DD and the front surface of the window WP. In such an embodiment, depending on the structure of the display device DD, the display surface FS may be provided on the side surface or the rear surface of the display device DD.

[0059] In an exemplary embodiment, the front (or upper) surface and the rear (or lower) surface of each component of the display device DD are defined relative to the direction in which the image IM is displayed. In an exemplary embodiment, the third direction DR3 may be the thickness direction of the display device DD. The front surface and the rear surface face each other in the third direction DR3, and the normal direction of each of the front surface and the rear surface is substantially parallel to the third direction DR3. The direction indicated by the first direction DR1, the direction indicated by the second direction DR2, and the direction indicated by the third direction DR3 are relative to each other, and therefore, the direction indicated by the first direction DR1, the direction indicated by the second direction DR2, and the direction indicated by the third direction DR3 may be changed to other directions. In the following description, the expression "when viewed in a plan view" may refer to a state of being viewed in the third direction DR3.

[0060] In an exemplary embodiment, the display device DD may sense user input applied to the display device DD from the outside. The user input may include various types of external input, such as touch, light, heat, or pressure from a part of the user's body. In an exemplary embodiment, the display device DD may sense user input applied to the side surface or rear surface of the display device DD depending on its structure, but is not limited to a specific embodiment.

[0061] In an exemplary embodiment, the display device DD includes a window WP, an anti-reflection layer RPP, a display module DM, and a housing HU. In such an embodiment, the window WP and the housing HU are coupled to each other to provide or define the exterior of the display device DD.

[0062] The window WP comprises an optically transparent insulating material. In one exemplary embodiment, for example, the window WP comprises glass or a plastic material. The window WP has a single-layer or multi-layer structure. In an exemplary embodiment, the window WP comprises: a plurality of plastic films attached to each other by an adhesive, or a glass substrate and a plastic film attached to the glass substrate by an adhesive.

[0063] The front surface FS of the window WP defines the front surface of the display device DD as described above. The transmission area TA may be an optically transparent area. In one exemplary embodiment, for example, the transmission area TA may be a region having a visible light transmittance of about 90% or more.

[0064] The bezel area BZA may be an area having a relatively low transmittance compared to the transmission area TA. The bezel area BZA defines the shape of the transmission area TA. The bezel area BZA is disposed adjacent to the transmission area TA and surrounds the transmission area TA.

[0065] The bezel area BZA has a predetermined color. The bezel area BZA covers the peripheral area NAA of the display module DM to prevent the peripheral area NAA from being observed from the outside. However, this is merely exemplary, and in alternative exemplary embodiments, the bezel area BZA may be omitted from the window WP.

[0066] An anti-reflection layer RPP is disposed below the window WP. The anti-reflection layer RPP reduces the reflectivity of external light incident on the anti-reflection layer RPP from above the window WP. The anti-reflection layer RPP may be, but is not limited to, a polarizing film. In alternative exemplary embodiments, the anti-reflection layer RPP may be omitted or included in the display module DM.

[0067] The display module DM displays an image IM and senses an external input. The display module DM includes a front surface IS in which an active area AA and a peripheral area NAA are defined. The active area AA may be an area activated in response to an electrical signal.

[0068] In an exemplary embodiment, the active area AA is an area through which an image IM is displayed and external input is sensed. The transmissive area TA at least overlaps with the active area AA. In one exemplary embodiment, for example, the transmissive area TA overlaps the entire surface of the active area AA or at least a portion thereof. Thus, a user perceives the image IM or provides external input through the transmissive area TA, however, this is merely exemplary. In an exemplary embodiment, the area through which the image IM is displayed and the area through which external input is sensed may be separated from each other in the active area AA, or may be independently defined in the active area AA, but this is not limited to a particular embodiment.

[0069] The peripheral area NAA may be covered by the frame area BZA. The peripheral area NAA may be disposed adjacent to the active area AA. The peripheral area NAA may surround the active area AA. A driving circuit or driving line may be disposed in the peripheral area NAA to drive the active area AA.

[0070] The display module DM includes a display panel DP, an input sensing layer ISL and a driving circuit DC.

[0071] The display panel DP includes a structure or element that generates an image IM. A user perceives the image IM generated by the display panel DP from the outside through the transmissive area TA.

[0072] The input sensing layer ISL senses an external input applied from the outside. In such an embodiment, as described above, the input sensing layer ISL senses an external input applied to the window WP.

[0073] The driving circuit DC is electrically connected to the display panel DP and the input sensing layer ISL. The driving circuit DC includes a main circuit board MB, a first circuit board CF1 and a second circuit board CF2.

[0074] The first circuit board CF1 is electrically connected to the display panel DP. The first circuit board CF1 connects the display panel DP and the main circuit board MB. In an exemplary embodiment, the first circuit board CF1 may be as follows: Figure 2 The flexible circuit film shown in .

[0075] The first circuit board CF1 is connected to pads of the display panel DP disposed in the peripheral area NAA. The first circuit board CF1 provides electrical signals to the display panel DP to drive the display panel DP. The electrical signals are generated by the first circuit board CF1 or the main circuit board MB.

[0076] The second circuit board CF2 is electrically connected to the input sensing layer ISL. The second circuit board CF2 electrically connects the input sensing layer ISL to the main circuit board MB. In an exemplary embodiment, the second circuit board CF2 may be as follows: Figure 2 . In an alternative exemplary embodiment, the second circuit board CF2 may not be connected to the main circuit board MB, or the second circuit board CF2 may be omitted. In such an embodiment in which the second circuit board CF2 is omitted, the input sensing layer ISL may be electrically connected to the first circuit board CF1.

[0077] The second circuit board CF2 is connected to the pads of the input sensing layer ISL disposed in the peripheral area NAA. The second circuit board CF2 provides an electrical signal to the input sensing layer ISL to drive the input sensing layer ISL. The electrical signal is generated by the second circuit board CF2 or the main circuit board MB.

[0078] The main circuit board MB includes various drive circuits for driving the display module DM and connectors for supplying power. A first circuit board CF1 and a second circuit board CF2 are connected to the main circuit board MB. According to an exemplary embodiment of the present disclosure, the display module DM is controlled using a single main circuit board MB; however, this is merely exemplary. In an exemplary embodiment of the display module DM according to the present disclosure, the display panel DP and the input sensing layer ISL may be connected to different main circuit boards, respectively, and one of the first circuit board CF1 and the second circuit board CF2 may not be connected to the main circuit board MB, but this is not limited to a specific embodiment.

[0079] The housing HU is coupled to the window WP. The housing HU is coupled to the window WP to provide an inner space. The display module DM is accommodated in the inner space.

[0080] Housing HU is made of a relatively rigid material. In one exemplary embodiment, housing HU may be made of glass, plastic, or metal, or may be formed from a combination of frames and / or panels. Housing HU stably protects the components of display device DD housed within the interior space from external impacts.

[0081] In an alternative exemplary embodiment of the display device DD, the window WP or the input sensing layer ISL may be omitted.

[0082] Figure 3 It is along Figure 2 A cross-sectional view taken along line II' shown in FIG. Figure 3 The display panel DP and the first circuit board CF1 are shown, and other components of the display device DD are omitted for convenience of illustration and description.

[0083] Reference Figure 3 , an exemplary embodiment of the display panel DP includes a base substrate BP, a circuit layer CCL, a light emitting element layer EL, and an encapsulation layer ECL.

[0084] The base substrate BP may be a base layer on which the circuit layer CCL is provided. The base substrate BP may have a single-layer structure or a multi-layer structure of a plurality of insulating layers. For example, the base substrate BP may be a glass substrate, a plastic substrate, a film, and a stacked structure including a plurality of organic layers and / or a plurality of inorganic layers, but is not limited to a specific embodiment.

[0085] The base substrate BP includes an upper surface US, a bottom surface BS, a side surface SS, a first inclined surface SS1, and a second inclined surface SS2. The upper surface US and the bottom surface BS may be substantially parallel to a surface defined by the first direction DR1 and the second direction DR2. The upper surface US and the bottom surface BS may be opposite to each other.

[0086] The first inclined surface SS1 may extend from the upper surface US and may have a predetermined angle relative to the upper surface US. In one exemplary embodiment, for example, the angle between the first inclined surface SS1 and the upper surface US may not be a right angle, for example, an angle greater than 90 degrees. The boundary between the upper surface US and the first inclined surface SS1 may be defined as an edge EG of the base substrate BP.

[0087] The side surface SS may extend from the first inclined surface SS1 , and the side surface SS and the upper surface US may form an angle of about 90 degrees.

[0088] The second inclined surface SS2 may extend from the side surface SS and may connect the side surface SS and the bottom surface BS. In other words, the bottom surface BS may extend from the second inclined surface SS2. The angle between the second inclined surface SS2 and the bottom surface BS may not be a right angle. In one exemplary embodiment, for example, the angle between the second inclined surface SS2 and the bottom surface BS may be greater than 90 degrees.

[0089] In an exemplary embodiment, the first inclined surface SS1 and the second inclined surface SS2 may be formed by cutting portions of the base substrate BP and grinding the cut portions. According to an alternative exemplary embodiment of the present disclosure, the base substrate BP may not include the first inclined surface SS1 and the second inclined surface SS2. In such an embodiment, the edge EG of the base substrate BP may be defined at the boundary between the upper surface US and the first inclined surface SS1, which are connected to each other.

[0090] The first, second, and third regions AR1, AR2, and AR3 are sequentially defined in the base substrate BP along the first direction DR1. In one exemplary embodiment, for example, the first, second, and third regions AR1, AR2, and AR3 may be defined in the upper surface US of the base substrate BP.

[0091] The circuit layer CCL may be disposed on the base substrate BP. The circuit layer CCL may have a stacked structure of multiple conductive layers and multiple organic layers and / or inorganic layers. In one exemplary embodiment, for example, the circuit layer CCL may include multiple transistors, multiple signal lines, and multiple insulating layers.

[0092] The light-emitting element layer EL may be disposed on the circuit layer CCL. The light-emitting element layer EL may be electrically connected to the driving elements or signal lines of the circuit layer CCL. In an exemplary embodiment, the display panel DP is an organic light-emitting display panel, and the light-emitting element layer EL may include an organic light-emitting layer. In an alternative exemplary embodiment, the display panel DP is a quantum dot light-emitting display panel, and the light-emitting element layer EL may include quantum dots or quantum rods.

[0093] The encapsulation layer ECL may be disposed on the light emitting element layer EL and may cover the light emitting element layer EL. The encapsulation layer ECL may protect the light emitting element layer EL. Alternatively, the encapsulation layer ECL may be omitted or replaced with an encapsulation substrate depending on the type of the display panel DP.

[0094] The first circuit board CF1 may be coupled to a portion of the circuit layer CCL disposed on the second area AR2 of the base substrate BP. The portion of the circuit layer CCL may be, for example, a pad.

[0095] The first circuit board CF1 may include a base film BF and connection pads IPD. The base film BF may have flexibility and insulating properties. The connection pads IPD may be electrically connected to the circuit layer CCL.

[0096] The first circuit board CF1 and the display panel DP may be coupled to each other through a conductive adhesive member AM. The conductive adhesive member AM may be disposed on the second area AR2 of the base substrate BP.

[0097] The conductive adhesive member AM may have electrical conductivity and adhesive properties. In one exemplary embodiment, for example, the conductive adhesive member AM may include an anisotropic conductive film ("ACF"). The conductive adhesive member AM may include conductive particles CP and a resin layer RS. The conductive particles CP are distributed in the resin layer RS. The resin layer RS may have adhesive properties. The resin layer RS may include a heat-curable or light-curable material.

[0098] Figure 4 is a plan view illustrating a display panel DP according to an exemplary embodiment of the present disclosure.

[0099] Reference Figure 4 , an exemplary embodiment of the display panel DP may include a base substrate BP, pixels PX, a driving circuit GDC, signal lines SL, ETCL, DL, PL, and CSL, a first power line DVL1 and a second power line DVL2, a signal pad SPD, power pads PD1, PD2, PD3, and PD4, conductive portions CP1, CP2, CP3, and CP4, and a conductive line CDSL. In an exemplary embodiment, the display panel DP may further include a dummy pad DMP (in Figure 6A shown in ).

[0100] The base substrate BP sequentially defines a first area AR1, a second area AR2, and a third area AR3 along the first direction DR1. The first area AR1 may overlap the entire active area AA and a portion of the peripheral area NAA. The second area AR2 may overlap another portion of the peripheral area NAA. The third area AR3 may overlap the remaining portion of the peripheral area NAA.

[0101] Pixels PX may be arranged on the first area AR1. Each pixel PX may display or emit light having a predetermined color. In an exemplary embodiment, the pixels PX may include red pixels, green pixels, and blue pixels. According to an alternative exemplary embodiment, the pixels PX may also include white pixels. According to another alternative exemplary embodiment, the pixels PX may include cyan pixels, magenta pixels, and yellow pixels.

[0102] The driving circuit GDC may be disposed in the peripheral area NAA. The driving circuit GDC may include a scan driving circuit and a light emitting control driving circuit. The scan driving circuit may generate a plurality of scan signals, and the light emitting control driving circuit may generate a plurality of light emitting control signals.

[0103] The driving circuit GDC may include a plurality of thin film transistors formed by the same process as the pixel circuit of the pixel PX, for example, a low temperature polysilicon (“LTPS”) process or a low temperature polycrystalline oxide (“LTPO”) process.

[0104] The signal lines SL, DL, CSL, PL, and ETCL may include scan lines SL, light emission control lines ETCL, data lines DL, power lines PL, and control signal lines CSL.

[0105] The scan lines SL may extend in the second direction DR2 and may be arranged in the first direction DR1. The emission control lines ETCL may extend in the second direction DR2 and may be arranged in the first direction DR1. In such an embodiment, each emission control line ETCL may be arranged substantially parallel to a corresponding scan line of the scan lines SL. The scan lines SL receive scan signals from the drive circuit GDC, and the emission control lines ETCL may receive emission control signals from the drive circuit GDC.

[0106] The data lines DL may extend in a first direction DR1 and may be arranged in a second direction DR2. The data lines DL may apply data signals to corresponding pixels PX.

[0107] The power lines PL may extend in the first direction DR1 and may be arranged in the second direction DR2. The power lines PL may be electrically connected to the first power lines DVL1. The power lines PL may apply a first driving voltage to corresponding pixels PX.

[0108] The control signal line CSL may be electrically connected to the driving circuit GDC and may transmit a signal to drive the driving circuit GDC.

[0109] Each of the first power line DVL1 and the second power line DVL2 may apply a driving voltage to the pixel PX. In one exemplary embodiment, for example, the first power line DVL1 may receive a first driving voltage (e.g., an ELVDD voltage) and may apply the first driving voltage to the pixel PX through the power line PL. The second power line DVL2 may receive a second driving voltage (e.g., an ELVSS voltage) and may apply the second driving voltage to the second electrode CE (refer to FIG. Figure 5 ). The second driving voltage may have a voltage level lower than that of the first driving voltage.

[0110] The signal pad SPD and the power pads PD1 , PD2 , PD3 , and PD4 may be disposed on the second area AR2 .

[0111] The signal pads SPD may be arranged in the second direction DR2. The signal pads SPD may be connected to some of the signal lines SL, ETCL, DL, PL, and CSL. In one exemplary embodiment, for example, some of the signal pads SPD may be connected to the control signal line CSL, and the other pads of the signal pads SPD may be connected to the data line DL.

[0112] The power pads PD1, PD2, PD3, and PD4 may include first, second, third, and fourth power pads PD1, PD2, PD3, and PD4. The first, second, third, and fourth power pads PD1, PD2, PD3, and PD4 may be arranged in the second direction DR2.

[0113] The first and second power pads PD1 and PD2 may be connected to the first power line DVL1 , and the third and fourth power pads PD3 and PD4 may be connected to the second power line DVL2 .

[0114] In an exemplary embodiment, each of the first power line DVL1 and the second power line DVL2 may have a width greater than that of each of the control signal line CSL and the data line DL. Therefore, the number of pads connected to each of the first power line DVL1 and the second power line DVL2 may be greater than the number of pads connected to each of the control signal line CSL and the data line DL.

[0115] The conductive portions CP1 , CP2 , CP3 , and CP4 and the conductive line CDSL may be disposed on the second and third areas AR2 and AR3 .

[0116] The conductive line CDSL may be electrically connected to the signal pads SPD, and may extend from a region overlapping one end of each of the signal pads SPD toward the edge EG.

[0117] The conductive portions CP1, CP2, CP3, and CP4 may include a first conductive portion CP1 electrically connected to the first power pad PD1, a second conductive portion CP2 electrically connected to the second power pad PD2, a third conductive portion CP3 electrically connected to the third power pad PD3, and a fourth conductive portion CP4 electrically connected to the fourth power pad PD4. The first conductive portion CP1 and the second conductive portion CP2 may extend from a region overlapping with one end of the first power line DVL1 toward the edge EG. The third conductive portion CP3 and the fourth conductive portion CP4 may extend from a region overlapping with one end of the second power line DVL2 toward the edge EG.

[0118] Before completing the display panel, the display panel may further include a test area. The test area may be connected to the lower portion of the third area AR3. Test lines and test pads may be arranged in the test area. The conductive line CDSL, the first conductive portion CP1, the second conductive portion CP2, the third conductive portion CP3, and the fourth conductive portion CP4 may be electrically connected to the test line. The test area of the unfinished display panel may then be removed through a cutting process.

[0119] According to an exemplary embodiment of the present disclosure, the area in which the test lines and the test pads are arranged can be removed by a cutting process, and thus the area of the peripheral area NAA can be reduced. After the cutting process, the conductive line CDSL, the first conductive portion CP1, the second conductive portion CP2, the third conductive portion CP3, and the fourth conductive portion CP4 can remain extended toward the edge EG of the base substrate BP.

[0120] When viewed in a plan view, a portion of the first conductive portion CP1 overlaps the first power pad PD1, a portion of the second conductive portion CP2 overlaps the second power pad PD2, a portion of the third conductive portion CP3 overlaps the third power pad PD3, and a portion of the fourth conductive portion CP4 overlaps the fourth power pad PD4. In an exemplary embodiment, an opening may be defined through each of the first conductive portion CP1, the second conductive portion CP2, the third conductive portion CP3, and the fourth conductive portion CP4. For example, an opening may be defined in portions of the conductive portions CP1, CP2, CP3, and CP4 that overlap the second area AR2 and the third area AR3. This will be referred to later. Figure 6A 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 and Figure 12A The shapes of the first conductive portion CP1 , the second conductive portion CP2 , the third conductive portion CP3 , and the fourth conductive portion CP4 are described in more detail.

[0121] Figure 5is a cross-sectional view illustrating a display panel DP according to an exemplary embodiment of the present disclosure. Figure 5 The pixel PX (see Figure 4 ) is a cross-section of a portion of a ).

[0122] Reference Figure 5 , an exemplary embodiment of the display panel DP may include a base substrate BP, a circuit layer CCL, a light emitting element layer EL and an encapsulation layer ECL. Each pixel PX (refer to Figure 4 ) may include a plurality of transistors, at least one capacitor and a light emitting element layer EL. The transistors and capacitors may be included in the circuit layer CCL. For ease of illustration, Figure 5 One of the transistors, TR, is shown.

[0123] The first layer 10 may be provided on the base substrate BP. The first layer 10 may include an inorganic material. In one exemplary embodiment, for example, the inorganic material may include at least one material selected from silicon nitride, silicon oxynitride, and silicon oxide. The first layer 10 may include at least one layer selected from a buffer layer and a barrier layer. Therefore, the transistor TR may be stably provided on the base substrate BP, and oxygen or moisture introduced through the base substrate BP may be prevented from penetrating into the pixel PX (refer to FIG. Figure 4 ).

[0124] The transistor TR may be provided on the first layer 10. The transistor TR may include a semiconductor layer SP, a control electrode CNE, a first electrode IE, and a second electrode OE.

[0125] The semiconductor layer SP may be disposed on the first layer 10. The semiconductor layer SP may include polycrystalline silicon or amorphous silicon. In an exemplary embodiment, the semiconductor layer SP may include a metal oxide semiconductor. The semiconductor layer SP may include a channel region serving as a path through which electrons or holes move, a first ion-doped region, and a second ion-doped region. The first ion-doped region and the second ion-doped region may be spaced apart from each other, with the channel region interposed between the first ion-doped region and the second ion-doped region.

[0126] The second layer 20 may be disposed on the first layer 10 and may cover the semiconductor layer SP. The second layer 20 may include an inorganic material.

[0127] The control electrode CNE may be disposed on the second layer 20. The third layer 30 may be disposed on the second layer 20 and may cover the control electrode CNE. The third layer 30 may include an inorganic material.

[0128] The upper electrode UE may be provided on the third layer 30. The upper electrode UE may form or define a pixel PX (refer to Figure 4 ) capacitor.

[0129] The fourth layer 40 may cover the upper electrode UE and may be disposed on the third layer 30. The first electrode IE and the second electrode OE may be disposed on the fourth layer 40. The first electrode IE and the second electrode OE may be connected to the semiconductor layer SP via a through hole defined through the second layer 20, the third layer 30, and the fourth layer 40.

[0130] The fifth layer 50 may be provided on the fourth layer 40 and may cover the first electrode IE and the second electrode OE. In an exemplary embodiment, the fifth layer 50 may have a single layer or a multilayer structure. In such an embodiment, the single layer structure may include an organic layer, and the multilayer structure may include an organic layer and an inorganic layer stacked on each other. The fifth layer 50 may be a planarization layer that provides a flat surface on the layer below it.

[0131] Each of the first layer 10, the second layer 20, the third layer 30, the fourth layer 40, and the fifth layer 50 may be an insulating layer. In an exemplary embodiment, Figure 5 As shown in FIG, each of the first layer 10, the second layer 20, the third layer 30, the fourth layer 40, and the fifth layer 50 may have a single-layer structure, but is not limited thereto or thereby. In an alternative exemplary embodiment, for example, at least one layer selected from the first layer 10, the second layer 20, the third layer 30, the fourth layer 40, and the fifth layer 50 may include a plurality of layers.

[0132] The light emitting element layer EL may be disposed on the circuit layer CCL. The light emitting element layer EL may include a first electrode PE, a light emitting layer EML, and a second electrode CE.

[0133] The first electrode PE may be electrically connected to the transistor TR through the fifth layer 50. In an exemplary embodiment, although not shown in the figure, a separate connection electrode may be further provided between the first electrode PE and the transistor TR. In such an embodiment, the first electrode PE may be electrically connected to the transistor TR through the connection electrode.

[0134] The sixth layer 60 may be provided on the fifth layer 50. The sixth layer 60 is provided with an opening defined through the sixth layer 60. At least a portion of the first electrode PE may be exposed through the opening.

[0135] The sixth layer 60 may be a pixel defining layer.

[0136] The light-emitting layer (EML) may be disposed on the first electrode PE. The light-emitting layer (EML) may include a light-emitting material. In one exemplary embodiment, for example, the light-emitting layer (EML) may include at least one material selected from materials capable of emitting red light, green light, and blue light, respectively. The light-emitting layer (EML) may include a fluorescent material or a phosphorescent material. The light-emitting layer (EML) may include an organic light-emitting material or an inorganic light-emitting material such as quantum dots. The light-emitting layer (EML) may emit light corresponding to the potential difference between the first electrode PE and the second electrode CE.

[0137] The second electrode CE may be provided on the light emitting layer EML. The second electrode CE may be electrically connected to the second power line DVL2 (refer to FIG. Figure 4 ). Therefore, the light emitting element layer EL can receive the second power voltage (eg, ELVSS voltage) through the second electrode CE.

[0138] The second electrode CE may include a transmissive conductive material or a semi-transmissive conductive material. Thus, light generated by the light-emitting layer EML can easily travel in the third direction DR3 after passing through the second electrode CE. However, this is merely exemplary, and in alternative exemplary embodiments, the light-emitting element layer EL may operate in a rear-surface emission mode in which the first electrode PE includes a transmissive or semi-transmissive material, or in a dual-surface emission mode in which light is emitted to both the front and rear surfaces, but is not limited to a specific embodiment.

[0139] In an exemplary embodiment, although not shown in the drawings, the light emitting element layer EL may include a functional layer provided between the light emitting layer EML and the first electrode PE and between the light emitting layer EML and the second electrode CE. The functional layer may control the movement of charges introduced from the first electrode PE and the second electrode CE into the light emitting layer EML to improve the light efficiency and life of the light emitting element layer EL.

[0140] The encapsulation layer ECL may be disposed on the light emitting element layer EL to encapsulate the light emitting element layer EL. In an exemplary embodiment, although not shown in the drawings, a cover layer may be further disposed between the second electrode CE and the encapsulation layer ECL to cover the second electrode CE.

[0141] In an exemplary embodiment, the encapsulation layer ECL may include a first inorganic layer 71, an organic layer 72, and a second inorganic layer 73 sequentially stacked in the third direction DR3, but is not limited thereto or thereby. Alternatively, the encapsulation layer ECL may also include a plurality of inorganic layers and a plurality of organic layers.

[0142] The first inorganic layer 71 may cover the second electrode CE. The first inorganic layer 71 may prevent external moisture or oxygen from entering the light-emitting element layer EL. In one exemplary embodiment, for example, the first inorganic layer 71 may include at least one material selected from silicon nitride, silicon oxide, and a compound thereof. The first inorganic layer 71 may be formed by a deposition process.

[0143] The organic layer 72 may be provided on the first inorganic layer 71 so as to be in contact with the first inorganic layer 71 or directly located on the first inorganic layer 71. The organic layer 72 may provide a flat surface on the first inorganic layer 71. Uneven shapes formed on the upper surface of the first inorganic layer 71 and particles existing on the first inorganic layer 71 may be covered by the organic layer 72, and thus, the influence of the surface state of the upper surface of the first inorganic layer 71 on the components on the organic layer 72 may be effectively prevented. The organic layer 72 may include an organic material and may be formed by a solution process such as spin coating, slit coating, or an inkjet process.

[0144] The second inorganic layer 73 may be provided on the organic layer 72 to cover the organic layer 72. Compared to being provided on the first inorganic layer 71, the second inorganic layer 73 can be stably formed on a relatively flat surface of the organic layer 72. The second inorganic layer 73 can prevent external moisture or oxygen from entering the light-emitting element layer EL. The second inorganic layer 73 may include at least one material selected from silicon nitride, silicon oxide, and a compound thereof. The second inorganic layer 73 may be formed by a deposition process.

[0145] Figure 6A is a display panel according to an exemplary embodiment of the present disclosure Figure 4 The enlarged plan view of the area XX' shown in FIG. Figure 6B It is along Figure 6A sectional view taken along line II-II' shown in FIG.

[0146] Reference Figure 4 、 Figure 6A and Figure 6B In an exemplary embodiment of the display panel DP, the width of the first power line DVL1 may be greater than the width of each first power pad PD1. In such an embodiment, the width of the second power line DVL2 may be greater than the width of each third power pad PD3. The width indicates the width measured in a direction substantially parallel to the second direction DR2. In such an embodiment, the second power pad PD2 is substantially the same as the first power pad PD1, and the fourth power pad PD4 is substantially the same as the third power pad PD3. Therefore, for ease of description, the first power pad PD1 and the third power pad PD3 will be mainly described below, and any repeated detailed description of the second power pad PD2 and the fourth power pad PD4 will be omitted.

[0147] The first power line DVL1 may be connected to the first power pad PD1, and the second power line DVL2 may be connected to the third power pad PD3. Figure 6A As shown in FIG, the first power line DVL1 is connected to eight first power pads PD1, and the second power line DVL2 is connected to eight third power pads PD3. However, the number of power pads connected to one power line is not limited thereto but may be variously modified.

[0148] A portion of the first conductive portion CP1 may overlap with the first power pad PD1, a portion of the second conductive portion CP2 may overlap with the second power pad PD2, a portion of the third conductive portion CP3 may overlap with the third power pad PD3, and a portion of the fourth conductive portion CP4 may overlap with the fourth power pad PD4.

[0149] The first conductive portion CP1 may include a conductive material. In one exemplary embodiment, for example, the conductive material may include at least one material selected from molybdenum (Mo), copper (Cu), gold (Au), silver (Ag), aluminum (Al), titanium (Ti), and combinations thereof (e.g., alloys).

[0150] The first conductive portion CP1 may include a first sub-conductive portion SC1 and a second sub-conductive portion SC2. The first sub-conductive portion SC1 may be disposed on the second area AR2, and the first sub-conductive portion SC1 may be electrically connected to the plurality of first power pads PD1. The second sub-conductive portion SC2 may be disposed on the second area AR2 and the third area AR3, and may be electrically connected to the first sub-conductive portion SC1 and the first power pads PD1. In an alternative exemplary embodiment of the present disclosure, the first sub-conductive portion SC1 may be omitted. In such an embodiment in which the first sub-conductive portion SC1 is omitted, the second sub-conductive portion SC2 may be referred to as a conductive portion.

[0151] The first sub-conductive portion SC1 and the second sub-conductive portion SC2 may be disposed on the base substrate BP. Figure 6B As shown in , the first layer 11 may be provided on the base substrate BP, the second layer 21 may be provided on the first layer 11, and the first sub-conductive portion SC1 and the second sub-conductive portion SC2 may be provided on the second layer 21. The first layer 11 and the second layer 21 may include inorganic materials. In one exemplary embodiment, for example, the first layer 11 may include silicon oxide and silicon nitride, and the second layer 21 may include silicon oxide.

[0152] Since each of the second conductive portion CP2 , the third conductive portion CP3 , and the fourth conductive portion CP4 is substantially the same as the first conductive portion CP1 , any repeated detailed description thereof will be omitted hereinafter for convenience of description.

[0153] The third layer 31 may be provided on the second layer 21 and may cover a portion of each of the first and second sub-conductive portions SC1 and SC2. The third layer 31 may include an inorganic material, such as silicon nitride. The fourth layer 41 may be provided on the third layer 31. The fourth layer 41 may include an inorganic material, such as silicon oxide and silicon nitride.

[0154] The first power pad PD1 may be disposed on the third layer 31. The first power pad PD1 may make contact with the first and second sub-conductive portions SC1 and SC2, which are not covered by the third layer 31.

[0155] A plurality of openings OP may be defined in the second conductive sub-portion SC2. In one exemplary embodiment, for example, each opening OP may extend in the first direction DR1. The second conductive sub-portion SC2 may include a plurality of conductive bars CB. The conductive bars CB may be spaced apart from each other by the openings OP. In one exemplary embodiment, for example, the conductive bars CB may be spaced apart from each other in the second direction DR2. In such an embodiment, the conductive bars CB may extend in the first direction DR1.

[0156] Each conductive strip CB may have a first width WT1 that is greater than the second width WT2 of each first power pad PD1. In one exemplary embodiment, for example, the first width WT1 may be twice the second width WT2 or greater. Therefore, a portion of each conductive strip CB may overlap with at least two first power pads PD1. However, the present disclosure is not limited to or restricted thereto, and in an alternative exemplary embodiment, for example, each conductive strip CB may have a first width that is equal to the second width of each first power pad. In such an embodiment, the number of conductive strips CB may be less than the number of first power pads PD1. In one exemplary embodiment, for example, the number of conductive strips CB may be four, and the number of first power pads PD1 may be eight. However, the number of conductive strips CB and the number of first power pads PD1 are not limited thereto or restricted thereto, and various modifications may be made. In an alternative exemplary embodiment, for example, the number of conductive strips CB may be equal to the number of first power pads.

[0157] The display panel DP may further include an organic layer OGL covering the first conductive portion CP1, the second conductive portion CP2, the third conductive portion CP3, and the fourth conductive portion CP4. The organic layer OGL may be disposed on the third area AR3. The organic layer OGL may extend in the second direction DR2. The organic layer OGL may be disposed adjacent to the edge EG of the base substrate BP.

[0158] The organic layer OGL may have a first thickness greater than the second thickness of each of the first conductive portion CP1, the second conductive portion CP2, the third conductive portion CP3, and the fourth conductive portion CP4. In one exemplary embodiment, for example, the first thickness may be approximately five times the second thickness. In such an embodiment, for example, the first thickness may be approximately 14,000 angstroms and the second thickness may be approximately 2,800 angstroms, but is not limited thereto.

[0159] During a reliability test or evaluation of the display panel DP, a phenomenon in which the second sub-conductive portion SC2 adjacent to the edge EG is lifted (hereinafter referred to as a "peeling phenomenon") may occur. The reliability evaluation may be an experiment in which the display panel DP is left at a temperature of approximately 85°C and a humidity of approximately 85% for approximately 240 hours. If the second sub-conductive portion SC2 is lifted, moisture may penetrate into the lifted space, and thus, the conductive material may be corroded.

[0160] If the first conductive portion CP1 is connected to the first power pad PD1 from the edge EG in the form of a single integral electrode, the peeling phenomenon may proceed in the first direction DR1 and the second direction DR2. However, according to an exemplary embodiment of the present disclosure, the opening OP may be defined or provided in the second sub-conductive portion SC2 adjacent to the edge EG. Therefore, even if the peeling phenomenon occurs in a portion of the second sub-conductive portion SC2, the peeling phenomenon may be effectively prevented from proceeding in the second direction DR2. In such an embodiment of the present disclosure, the organic layer OGL may be provided on the second sub-conductive portion SC2 adjacent to the edge EG, and the organic layer OGL may be used to press the second sub-conductive portion SC2. Therefore, the possibility of the second sub-conductive portion SC2 being lifted and the possibility of the peeling phenomenon occurring in the second sub-conductive portion SC2 being amplified can be reduced. Therefore, the reliability of the display device DD can be improved.

[0161] Figure 7 is a display panel according to an alternative exemplary embodiment of the present disclosure Figure 4 The enlarged plan view of the area XX' shown in FIG.

[0162] In addition to the conductive part, Figure 7 The floor plan and Figure 6AThe plan views shown in are essentially the same. Figure 7 The same or similar elements shown in FIG have been utilized with reference to the above Figure 4 、 Figure 6A and Figure 6B Reference numerals identical to those used to describe the exemplary embodiments of the display panel are used, and any repeated detailed description thereof will be omitted or simplified hereinafter.

[0163] Reference Figure 4 and Figure 7 In an exemplary embodiment, the first conductive portion CP1a may include a first sub-conductive portion SC1a and a second sub-conductive portion SC2a. The first sub-conductive portion SC1a may be disposed on the second area AR2 and may be disposed between the first power pad PD1 and the base substrate BP. The second sub-conductive portion SC2a may be disposed on the second area AR2 and the third area AR3 and may be electrically connected to the first sub-conductive portion SC1a and the first power pad PD1.

[0164] A plurality of openings OPa may be defined in the second sub-conductive portion SC2a. In one exemplary embodiment, for example, each opening OPa may extend in the first direction DR1. The second sub-conductive portion SC2a may include a plurality of conductive strips CBa. The conductive strips CBa may be spaced apart from each other by the openings OPa.

[0165] In such an embodiment, the number of openings OPa may be greater than that in the above reference Figure 6A Therefore, the number of conductive strips CBa may be greater than Figure 6A In such an embodiment, the width of each conductive strip CBa may be less than Figure 6A The width of each conductive bar CB is shown in .

[0166] Figure 8 is a display panel according to another alternative exemplary embodiment of the present disclosure Figure 4 The enlarged plan view of the area XX' shown in FIG.

[0167] In addition to the conductive part, Figure 8 The floor plan and Figure 6A The plan views shown in are essentially the same. Figure 8 The same or similar elements shown in FIG have been utilized with reference to the above Figure 4 、 Figure 6A and Figure 6B Reference numerals identical to those used to describe the exemplary embodiments of the display panel are used, and any repeated detailed description thereof will be omitted or simplified hereinafter.

[0168] Reference Figure 4 and Figure 8 In an exemplary embodiment, the first conductive portion CP1b may include a first sub-conductive portion SC1b and a second sub-conductive portion SC2b. The first sub-conductive portion SC1b may be disposed on the second area AR2 and may be disposed between the first power pad PD1 and the base substrate BP. The second sub-conductive portion SC2b may be disposed on the second area AR2 and the third area AR3 and may be electrically connected to the first sub-conductive portion SC1b and the first power pad PD1.

[0169] A plurality of openings OPb may be defined in the second sub-conductive portion SC2b. Each opening OPb may extend in the first direction DR1. Each opening OPb may extend from a region adjacent to the edge EG in a direction away from the edge EG. A length LT of each opening OPb in the first direction DR1 may be shorter than a maximum width WTx of the second sub-conductive portion SC2b in the first direction DR1.

[0170] The second sub-conductive portion SC2b may include a conductive body CBB and a conductive protrusion CBP protruding from the conductive body CBB toward the edge EG. The conductive protrusion CBP may be connected to the conductive body CBB. The length of each conductive protrusion CBP in the first direction DR1 may be defined by each opening OPb.

[0171] Figure 9 is a display panel according to another alternative exemplary embodiment of the present disclosure Figure 4 The enlarged plan view of the area XX' shown in FIG.

[0172] In addition to the conductive part, Figure 9 The floor plan and Figure 6A The plan views shown in are essentially the same. Figure 9 The same or similar elements shown in FIG have been utilized with reference to the above Figure 4 、 Figure 6A and Figure 6B Reference numerals identical to those used to describe the exemplary embodiments of the display panel are used, and any repeated detailed description thereof will be omitted or simplified hereinafter.

[0173] Reference Figure 4 and Figure 9In an exemplary embodiment, the first conductive portion CP1c may include a first sub-conductive portion SC1c and a second sub-conductive portion SC2c. The first sub-conductive portion SC1c may be disposed on the second area AR2 and may be disposed between the first power pad PD1 and the base substrate BP. The second sub-conductive portion SC2c may be disposed on the second area AR2 and the third area AR3 and may be electrically connected to the first sub-conductive portion SC1c and the first power pad PD1.

[0174] The second sub-conductive portion SC2c may include a first conductive bar CB1 and a second conductive bar CB2. The first conductive bar CB1 and the second conductive bar CB2 may be provided in different layers from each other. In one exemplary embodiment, for example, the first conductive bar CB1 may be provided in the same layer as the first sub-conductive portion SC1c, and the second conductive bar CB2 may be provided in the same layer as the first power pad PD1.

[0175] Openings OPc and OPd may be defined in the second sub-conductive portion SC2c. The openings OPc and OPd may be divided into first openings OPc defined between the first conductive strips CB1 and second openings OPd defined between the second conductive strips CB2. Each of the first openings OPc and the second openings OPd may extend in the second direction DR2.

[0176] Each of the first conductive strip CB1 and the second conductive strip CB2 may extend in the second direction DR2. In such an embodiment, the first conductive strip CB1 and the second conductive strip CB2 may be arranged alternately with each other in the first direction DR1. In an exemplary embodiment, for example, one first conductive strip CB1 and one second conductive strip CB2 may be arranged alternately with each other. In such an embodiment, the first conductive strip CB1 and the second conductive strip CB2 may be electrically connected to each other.

[0177] If the second sub-conductive portion SC2c adjacent to the edge EG is peeled off from the base substrate BP, the second sub-conductive portion SC2c can be peeled off from the region adjacent to the edge EG in a direction away from the edge EG (e.g., in a direction opposite to the first direction DR1). According to an exemplary embodiment of the present disclosure, the first conductive strips CB1 and the second conductive strips CB2 can be provided in different layers and can be arranged alternately with each other in the first direction DR1. Therefore, the peeling phenomenon can be effectively prevented from advancing toward the second region AR2. Therefore, the reliability of the display device DD can be improved.

[0178] Figure 10 is a display panel according to another alternative exemplary embodiment of the present disclosure Figure 4 The enlarged plan view of the area XX' shown in FIG.

[0179] In addition to the organic layer, Figure 10 The floor plan and Figure 9 The plan views shown in are essentially the same. Figure 10 The same or similar elements shown in FIG have been utilized with reference to the above Figure 4 、 Figure 6A 、 Figure 6B and Figure 9 Reference numerals identical to those used to describe the exemplary embodiments of the display panel are used, and any repeated detailed description thereof will be omitted or simplified hereinafter.

[0180] Reference Figure 4 and Figure 10 In an exemplary embodiment, the organic layer OGL may be disposed in the third region AR3 adjacent to the edge EG. The organic layer OGL may be disposed on the second sub-conductive portion SC2c. The organic layer OGL may be used to press the second sub-conductive portion SC2c. Therefore, the possibility of the second sub-conductive portion SC2c being peeled off may be reduced. Therefore, the reliability of the display device DD may be improved.

[0181] Figure 11 is a display panel according to another alternative exemplary embodiment of the present disclosure Figure 4 The enlarged plan view of the area XX' shown in FIG.

[0182] In addition to the conductive part, Figure 11 The floor plan and Figure 9 The plan views shown in are essentially the same. Figure 11 The same or similar elements shown in FIG have been utilized with reference to the above Figure 4 、 Figure 6A 、 Figure 6B 、 Figure 9 and Figure 10 Reference numerals identical to those used to describe the exemplary embodiments of the display panel are used, and any repeated detailed description thereof will be omitted or simplified hereinafter.

[0183] Reference Figure 4 and Figure 11, the first conductive portion CP1d may include a first sub-conductive portion SC1d and a second sub-conductive portion SC2d. The first sub-conductive portion SC1d may be disposed on the second area AR2 and may be disposed between the first power pad PD1 and the base substrate BP. The second sub-conductive portion SC2d may be disposed on the second area AR2 and the third area AR3 and may be electrically connected to the first sub-conductive portion SC1d and the first power pad PD1. The second sub-conductive portion SC2d may include a first conductive bar CB1a and a second conductive bar CB2a. The first conductive bar CB1a and the second conductive bar CB2a may be disposed in different layers from each other. In an exemplary embodiment, for example, the first conductive bar CB1a may be disposed in the same layer as the first sub-conductive portion SC1d, and the second conductive bar CB2a may be disposed in the same layer as the first power pad PD1.

[0184] Each of the first conductive strips CB1a and the second conductive strips CB2a may extend in the second direction DR2. In such an embodiment, the first conductive strips CB1a and the second conductive strips CB2a may be alternately arranged with each other in the first direction DR1.

[0185] The third opening OPe may be further defined in the conductive strip closest to the edge EG among the first conductive strip CB1a and the second conductive strip CB2a. The third opening OPe may be arranged corresponding to the direction in which the edge EG extends. In one exemplary embodiment, for example, the third opening OPe may be arranged in the second direction DR2. According to an exemplary embodiment of the present disclosure, even if a peeling phenomenon occurs in a portion of the second sub-conductive portion SC2d adjacent to the edge EG, the peeling phenomenon can be prevented from advancing in the first direction DR1 and the second direction DR2. The peeling phenomenon can be effectively prevented from advancing in the first direction DR1 by the first conductive strip CB1a and the second conductive strip CB2a provided in different layers, and the peeling phenomenon can be effectively prevented from advancing in the second direction DR2 by the third opening OPe defined adjacent to the edge EG. Therefore, the reliability of the display device DD can be improved.

[0186] Figure 12A is a display panel according to another alternative exemplary embodiment of the present disclosure Figure 4 The enlarged plan view of the area XX' shown in FIG. Figure 12B It is along Figure 12A sectional view taken along line III-III' shown in FIG.

[0187] Reference Figure 4 、 Figure 12A and Figure 12BIn an exemplary embodiment, the first conductive portion CP1e may include a first sub-conductive portion SC1e and a second sub-conductive portion SC2e. The first sub-conductive portion SC1e may be disposed on the second area AR2 and may be disposed between the first power pad PD1 and the base substrate BP. The second sub-conductive portion SC2e may be disposed on the second area AR2 and the third area AR3 and may be electrically connected to the first sub-conductive portion SC1e and the first power pad PD1. The second sub-conductive portion SC2e may include a conductive layer CBL and a protrusion CBP. The conductive layer CBL may be disposed on the second layer 21, and the protrusion CBP may protrude from the conductive layer CBL. In an exemplary embodiment, for example, the protrusion CBP may include substantially the same material as the conductive layer CBL and may be integrally formed with the conductive layer CBL as a single integral unit. In an exemplary embodiment of the present disclosure, each opening may correspond to the space between two adjacent protrusions CBP. In such an embodiment, the opening may be provided in the form of a groove defined by removing a portion of the second sub-conductive portion SC2e in the thickness direction (i.e., the third direction DR3).

[0188] The third layer 31 may be disposed on the second layer 21 and may cover a portion of each of the first and second conductive sub-portions SC1e and SC2e. The third layer 31 may include an inorganic material, such as silicon nitride. The fourth layer 41 may be disposed on the third layer 31. The fourth layer 41 may include an inorganic material, such as silicon oxide or silicon nitride.

[0189] The additional metal strips ASC may be disposed on the third area AR3. In one exemplary embodiment, for example, the additional metal strips ASC may be disposed on the fourth layer 41. Each additional metal strip ASC may extend in the second direction DR2. In such an embodiment, the additional metal strips ASC may be arranged in the first direction DR1 to be spaced apart from each other. When viewed in plan, the additional metal strips ASC may not overlap with the protrusions CBP.

[0190] The additional metal strip ASC may include a material different from that of the second conductive sub-portion SC2e. In one exemplary embodiment, for example, the second conductive sub-portion SC2e may include a single metal layer, and the second conductive sub-portion SC2e may include molybdenum. Each additional metal strip ASC may include multiple metal layers. In one exemplary embodiment, for example, each additional metal strip ASC may have a structure in which titanium, aluminum, and titanium are sequentially stacked.

[0191] In an exemplary embodiment of the present disclosure, each additional metal strip ASC may have a thickness greater than that of the second sub-conductive portion SC2e. In one exemplary embodiment, for example, the thickness of each additional metal strip ASC may be approximately 7,000 angstroms, and the thickness of the second sub-conductive portion SC2e may be approximately 2,800 angstroms. Therefore, the additional metal strip ASC may be used to press the second sub-conductive portion SC2e. This reduces the likelihood of the second sub-conductive portion SC2e peeling off and the likelihood of amplifying peeling that occurs in the second sub-conductive portion SC2e. Consequently, the reliability of the display device DD may be improved.

[0192] Although some exemplary embodiments of the present disclosure have been described above, the present disclosure should not be construed as being limited to the exemplary embodiments set forth herein. Rather, these exemplary embodiments are provided so that the present disclosure will be sufficient and complete and will fully convey the concept of the present invention to those skilled in the art.

[0193] While the present disclosure has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit or scope of the present disclosure as defined thereby.

Claims

1. A display panel, wherein: The display panel includes: a base substrate, wherein a first region, a second region, and a third region are sequentially defined in a first direction; Pixels are arranged on the first area; a signal line disposed on the base substrate and electrically connected to the pixel; a power line disposed on the base substrate, wherein the power line supplies power to the pixel; signal pads disposed on the second region, the signal pads being arranged in a second direction crossing the first direction and electrically connected to the signal line; a power pad provided on the second area, the power pad being arranged in the second direction and electrically connected to the power line; and a conductive portion provided on the second region and the third region of the base substrate, the conductive portion being electrically connected to the power pad and extending from a region overlapping the power pad toward an edge of the base substrate, wherein an opening is defined in the conductive portion by the removed portion of the conductive portion to prevent peeling from occurring in a portion of the conductive portion adjacent to an edge of the base substrate.

2. The display panel according to claim 1, wherein The conductive portion includes: a first sub-conductive portion disposed on the second region and disposed between the power pad and the base substrate; and a second sub-conductive portion disposed on the second region and the third region and electrically connected to the first sub-conductive portion and the power pad, The opening is defined in the second sub-conductive portion.

3. The display panel according to claim 2, wherein: The second sub-conductive portion includes conductive strips arranged in the second direction, and The conductive strips are spaced apart from each other in the second direction.

4. The display panel according to claim 3, wherein: Each of the conductive strips has a width greater than a width of each of the power pads.

5. The display panel according to claim 3, wherein: The number of the conductive strips is smaller than the number of the power pads. The display panel according to claim 2 , wherein: The second sub-conductive portion includes: a conductive body extending in the second direction; and a conductive protrusion protruding from the conductive body toward the edge of the base substrate, Wherein, a width of each of the conductive protrusions in the second direction is smaller than a width of the conductive body in the second direction.

7. The display panel according to claim 6, wherein: The conductive protrusions are spaced apart from each other in the second direction.

8. The display panel according to claim 2, wherein: The second sub-conductive portion includes: first conductive strips arranged in the first direction; and second conductive strips arranged in the first direction, The first conductive strip is provided in a layer different from a layer in which the second conductive strip is provided.

9. The display panel according to claim 8, wherein: In a plan view, the first conductive strips and the second conductive strips are alternately arranged in the first direction.

10. The display panel according to claim 8, wherein: Each of the first conductive strip and the second conductive strip extends in the second direction.

11. The display panel according to claim 8, wherein: The first conductive strip is electrically connected to the second conductive strip.

12. The display panel according to claim 1, wherein: The display panel further includes: an organic layer, arranged to cover the conductive portion, Wherein, the organic layer extends in the second direction.

13. The display panel according to claim 1, wherein: The power line has a width greater than a width of each of the power pads.

14. The display panel according to claim 1, wherein: The base substrate comprises: upper surface; a first inclined surface extending from the upper surface; a side surface extending from the first inclined surface; a second inclined surface extending from the side surface; and a bottom surface extending from the second inclined surface, The first area, the second area and the third area are defined in the upper surface.

15. The display panel according to claim 1, wherein The opening is provided in the form of a groove defined by the removed portion of the conductive portion in a thickness direction of the conductive portion.

16. The display panel according to claim 15, wherein: The display panel further includes: an additional metal strip, provided on said conductive portion, Wherein, the additional metal strip extends in the second direction.

17. A display device, wherein: The display device includes: A display panel comprising: a base substrate in which a first area, a second area, and a third area are sequentially defined in a first direction; pixels provided on the first area; signal lines provided on the first area; power lines provided on the first area; signal pads electrically connected to the signal lines and provided on the second area; power pads electrically connected to the power lines and provided on the second area; and conductive portions provided on the second area and the third area and electrically connected to the power pads; and a circuit board disposed on the display panel and electrically connected to the power pad and the signal pad, An opening is defined in a portion of the conductive portion overlapping the second region and the third region to prevent peeling from occurring in a portion of the conductive portion adjacent to an edge of the base substrate.

18. The display device according to claim 17, wherein: The display panel further includes an organic layer disposed on the third region to cover the conductive portion.

19. The display device according to claim 17, wherein: The opening extends in the first direction, The conductive portion includes conductive strips spaced apart from each other, and the opening is between the conductive strips. Each of the conductive strips has a width equal to or greater than a width of each of the power pads, and The number of the conductive strips is equal to or smaller than the number of the power pads.

20. The display device according to claim 17, wherein The conductive portion includes: a conductive body extending in a second direction intersecting the first direction; and a conductive protrusion protruding from the conductive body toward the edge of the base substrate, Wherein, a width of each of the conductive protrusions in the second direction is smaller than a width of the conductive body in the second direction.

21. The display device according to claim 17, wherein The conductive portion includes: first conductive strips arranged in the first direction; and second conductive strips arranged in the first direction, The first conductive strip is provided in a layer different from a layer in which the second conductive strip is provided.

22. The display device according to claim 21, wherein Each of the first conductive strip and the second conductive strip extends in a second direction crossing the first direction, The first conductive strips are arranged alternately with the second conductive strips in a plan view, and The first conductive strip is electrically connected to the second conductive strip.

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