A patch type ultraviolet sensor

Abstract

The present invention relates to the field of sensor technology, and in particular to a patch type ultraviolet sensor. The patch type ultraviolet sensor of the present invention comprises a seat, an ESD electrostatic protection Zener tube, an ultraviolet chip, a positive electrode pad and a negative electrode pad. An installation cavity is provided at one end of the seat, and a positive electrode pad and a negative electrode pad are fixedly attached to the bottom of the installation cavity. The ESD electrostatic protection Zener tube and the ultraviolet chip are arranged in the installation cavity, and the positive and negative electrodes of the two are respectively welded to the positive electrode pad and the negative electrode pad located in the installation cavity. The other end of the seat is fixedly attached to a positive electrode pad and a negative electrode pad that are spaced apart from each other, and the positive electrode pads and the negative electrode pads at both ends of the seat correspond to each other, and the two positive electrode pads and the two negative electrode pads are respectively connected and conducted, and a lens is installed on the open side of the installation cavity. Advantages: simple production process, good heat dissipation performance, and relatively stable overall performance.

Description

Technical Field

[0001] The present invention relates to the technical field of sensors, and in particular to a patch type ultraviolet sensor. Background Art

[0002] The UV sensor is a sensor that uses photosensitive elements to convert UV signals into electrical signals. Its structure generally includes a shell and a UV chip built into the shell, and pins connected to UV rays are led out from the outside of the shell. The process itself is relatively complicated, and there is no overall heat dissipation design, the heat dissipation performance is poor, and the optical power is also relatively average. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a patch type ultraviolet sensor, which effectively overcomes the defects of the prior art.

[0004] The technical solution of the present invention to solve the above technical problems is as follows:

[0005] A patch type ultraviolet sensor comprises a seat, an ESD electrostatic protection Zener, an ultraviolet chip, a positive electrode pad and a negative electrode pad. An installation cavity is provided at one end of the seat, and a spaced positive electrode pad and a spaced negative electrode pad are fixedly bonded to the bottom of the installation cavity. The ESD electrostatic protection Zener and the ultraviolet chip are arranged in the installation cavity, and the positive and negative electrodes of the two are respectively welded to the positive electrode pad and the negative electrode pad located in the installation cavity. The other end of the seat is fixedly bonded to the positive electrode pad and the negative electrode pad, which are spaced apart from each other, and the positive electrode pad and the negative electrode pad at both ends of the seat correspond to each other, the two positive electrode pads and the two negative electrode pads are respectively connected and conducted, and a lens is sealed and installed on the open side of the installation cavity.

[0006] Based on the above technical solution, the present invention can also be improved as follows.

[0007] Furthermore, the seat body includes a substrate and an annular enclosure, one end of the enclosure is fitted and fixed to one end of the substrate, an annular ceramic lining is provided on the inner side thereof, the lens is seal-mounted at the other end of the enclosure, and the installation cavity is formed between the enclosure, the ceramic lining and the substrate.

[0008] Furthermore, the substrate is a ceramic plate.

[0009] Furthermore, a stepped installation groove is formed between the other end of the enclosure and the corresponding end of the ceramic liner, and the lens is sealed and installed in the installation groove.

[0010] Furthermore, the lens is a hemispherical quartz glass cover structure, and its flat end is embedded in the installation groove and sealed and connected to each other.

[0011] Furthermore, a connecting portion which is fitted and fixed to the base plate is integrally formed on the outer side of one end of the enclosure.

[0012] Furthermore, the wavelength emitted by the above-mentioned ultraviolet chip is 220-280nm.

[0013] Furthermore, the two positive electrode pads and the two negative electrode pads are connected and conducted respectively through via holes penetrating the base body and metals embedded in the via holes.

[0014] The beneficial effects of the present invention are: simple production process, good heat dissipation performance and relatively stable performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic structural diagram of the patch type ultraviolet sensor of the present invention;

[0016] Figure 2 It is a schematic diagram of the structure of the patch type ultraviolet sensor of the present invention.

[0017] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0018] 1. Base body; 2. ESD electrostatic protection Zener; 3. UV chip; 4. Positive electrode pad; 5. Negative electrode pad; 6. Lens; 7. Via hole; 11. Substrate; 12. Enclosure; 121. Ceramic lining; 211. Connecting part. DETAILED DESCRIPTION

[0019] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0020] Example: Figure 1 and 2 As shown, the patch type ultraviolet sensor of this embodiment is the transmitting end of the sensor, including a base body 1, an ESD electrostatic protection Zener 2, an ultraviolet chip 3, a positive electrode pad 4 and a negative electrode pad 5. An installation cavity is provided at one end of the base body 1, and a piece of the above-mentioned positive electrode pad 4 and a piece of the above-mentioned negative electrode pad 5 are fixedly bonded to the bottom of the above-mentioned installation cavity. The above-mentioned ESD electrostatic protection Zener 2 and the ultraviolet chip 3 are arranged in the above-mentioned installation cavity, and the positive and negative electrodes of the two are respectively welded to the positive electrode pad 4 and the negative electrode pad 5 located in the above-mentioned installation cavity. The other end of the above-mentioned base body 1 is bonded and fixed with a piece of the above-mentioned positive electrode pad 4 and a piece of the negative electrode pad 5 distributed at an interval, and the positive electrode pad 4 and the negative electrode pad 5 at both ends of the above-mentioned base body 1 correspond to each other, the two pieces of the above-mentioned positive electrode pad 4 and the two pieces of the above-mentioned negative electrode pad 5 are respectively connected and conducted, and a lens 6 is sealed and installed on the open side of the above-mentioned installation cavity.

[0021] The sensor is provided with flat pads on both sides, which can improve the heat dissipation performance of the entire sensor, thereby improving the performance of the entire sensor. When installed and used, no complicated wiring is required. The positive electrode pad 4 and the negative electrode pad 5 at the other end of the base body 1 can be fitted into the installation position. The overall structure is flat, the light-emitting angle is large, and the emitted ultraviolet light power is greatly improved. The design of the entire product reduces the cost by about 2 / 3 compared with existing sensors.

[0022] As a preferred embodiment, the base body 1 includes a substrate 11 and an annular enclosure 12, one end of the enclosure 12 is fitted and fixed to one end of the substrate 11, an annular ceramic lining 121 is provided on the inner side thereof, the lens 6 is sealed and installed on the other end of the enclosure 12, and the installation cavity is formed between the enclosure 12, the ceramic lining 121 and the substrate 11.

[0023] In this embodiment, the base body 1 has a simple structural design, a simple production process, and a low production cost. The open end of the installation cavity formed by the enclosure 12 and the substrate 11 has a large emission range, so that the emission angle of the light is large, and the optical power is significantly improved compared to traditional ultraviolet sensors (about 1-2 times).

[0024] The specific shape of the enclosure 12 is determined according to actual needs, and can be designed into a variety of shapes, such as a square ring, a circular ring, or other regular annular structures.

[0025] The above-mentioned enclosure 12 is preferably made of copper.

[0026] Preferably, the substrate 11 is a ceramic plate, which has good hardness, wear resistance, corrosion resistance, and insulation performance, so that the performance of the entire sensor is more stable and not easy to be damaged.

[0027] Generally, the substrate 11 can be designed as a rectangular plate with rounded corners, or can be designed as other structures, such as a circle, or other regular structures, and can be produced and processed according to actual needs.

[0028] Preferably, a stepped mounting groove is formed between the other end of the enclosure 12 and the corresponding end of the ceramic lining 121, and the lens 6 is sealed and mounted in the mounting groove.

[0029] In this embodiment, the mounting groove is formed so that one end of the lens 6 is embedded therein, and there is no seam outside, so the sealing performance is high.

[0030] Preferably, the lens 6 is a hemispherical quartz glass cover structure, the flat end of which is embedded in the mounting groove and sealed and connected to each other.

[0031] In this solution, a spherical cover structure is adopted so that the emitted light has a larger luminous angle (range).

[0032] Preferably, a connecting portion 211 which is fitted and fixed to the substrate 11 is integrally formed on the outer side of one end of the enclosure 12. The enclosure 12 and the substrate 11 are connected via the connecting portion 211. The structures fit compactly and firmly. Generally, the enclosure 12 and the substrate 11 are constructed and formed in a vacuum environment.

[0033] Optimally, the wavelength emitted by the ultraviolet chip 3 is 220-280 nm.

[0034] The specific wavelength can be determined according to actual needs, and different types of ultraviolet chips 3 can be used.

[0035] Preferably, the two positive electrode pads 4 and the two negative electrode pads 5 are connected and conducted respectively through a via hole 7 penetrating the base body 1 and metal embedded in the via hole 7 .

[0036] Specifically, the two positive electrode pads 4 at both ends of the substrate 11 (base body 1) are located in corresponding positions, and the two negative electrode pads 5 are also located in corresponding positions, and two via holes are provided between the two corresponding pads.

[0037] Of course, the above-mentioned positive electrode pad 4 and negative electrode pad 5 can also be provided with four pieces respectively, that is to say, there are two positive electrode pads 4 and two negative electrode pads 5 in the installation cavity, and there are two positive electrode pads 4 and two negative electrode pads 5 at the other end of the base body 1, and the positive and negative electrode pads in the installation cavity correspond one by one to the positive and negative electrode pads at the other end of the base body 1, and the corresponding two positive electrode pads 4 or two negative electrode pads 5 are connected and conducted through the national control penetrating the substrate 11 and the metal strip embedded in the via 7. In the installation cavity, the ESD electrostatic protection Zener 2 and the ultraviolet chip 3 are respectively connected to a positive electrode pad 4 and a negative electrode pad 5.

[0038] The patch-type ultraviolet sensor of this embodiment is suitable for use in many fields and occasions such as ozone monitoring, ocean monitoring, environmental monitoring, water quality monitoring, atmospheric monitoring, and biological monitoring.

[0039] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A patch type ultraviolet sensor, characterized in that: The invention comprises a base (1), an ESD electrostatic protection Zener (2), an ultraviolet chip (3), a positive electrode pad (4) and a negative electrode pad (5); one end of the base (1) is provided with an installation cavity; the bottom of the installation cavity is fixedly provided with a positive electrode pad (4) and a negative electrode pad (5) which are spaced apart; the ESD electrostatic protection Zener (2) and the ultraviolet chip (3) are arranged in the installation cavity; the positive and negative electrodes of the two are respectively welded to the positive electrode pad (4) and the negative electrode pad (5) which are spaced apart; the other end of the base (1) is fixedly provided with a positive electrode pad (4) and a negative electrode pad (5) which are spaced apart; the positive electrode pad (4) and the negative electrode pad (5) at both ends of the base (1) correspond to each other; the two positive electrode pads (4) and the two negative electrode pads (5) are respectively connected and conducted; and a lens (6) is sealed and installed on the open side of the installation cavity.

2. A patch type ultraviolet sensor according to claim 1, characterized in that: The seat body (1) comprises a base plate (11) and an annular enclosure (12); one end of the enclosure (12) is fitted and fixed to one end of the base plate (11); an annular ceramic lining (121) is provided on the inner side of the enclosure; the lens (6) is sealed and mounted on the other end of the enclosure (12); and the mounting cavity is formed between the enclosure (12), the ceramic lining (121) and the base plate (11).

3. A patch type ultraviolet sensor according to claim 2, characterized in that: The substrate (11) is a ceramic plate.

4. A patch type ultraviolet sensor according to claim 2, characterized in that: A stepped mounting groove is formed between the other end of the enclosure (12) and the corresponding end of the ceramic lining (121), and the lens (6) is sealed and mounted in the mounting groove.

5. A patch type ultraviolet sensor according to claim 4, characterized in that: The lens (6) is a hemispherical quartz glass cover structure, the flat end of which is embedded in the installation groove and is sealed and connected to each other.

6. A patch type ultraviolet sensor according to claim 2, characterized in that: A connecting portion (211) is integrally formed on the outer side of one end of the enclosure (12) and is fitted and fixed to the base plate (11).

7. A patch type ultraviolet sensor according to any one of claims 1 to 6, characterized in that: The wavelength emitted by the ultraviolet chip (3) is 220-280 nm.

8. A patch type ultraviolet sensor according to any one of claims 1 to 6, characterized in that: The two positive electrode pads (4) and the two negative electrode pads (5) are connected and conducted respectively via via holes (7) penetrating the base body (1) and metals embedded in the via holes (7).

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