Substrate carrier and substrate carrier stack

Abstract

A substrate carrier stack comprising only one type of substrate carriers stacked or stackable on each other and carrying a corresponding plate-shaped substrate within an inner receiving space of the substrate carrier stack. The substrate carriers each comprise a positioning forming structure. If the upper substrate carrier and the lower substrate carrier are appropriately positioned relative to each other, the positioning forming structures of each pair of the upper substrate carrier and the lower substrate carrier engage or engage with each other.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to German Patent Application No. 20 2018 103 663.7 filed on June 27, 2018, U.S. Patent Application No. 16 / 185,546 filed on November 9, 2018, and German Patent Application No. 20 2019 101 793.7 filed on March 29, 2019. The entire contents of each of these applications are hereby incorporated herein by reference. Technical Field

[0003] The present disclosure generally relates to the handling, storage, processing and processing of substrates in semiconductor production. In particular, the present disclosure relates to the handling, storage, processing and processing of substrates in the form of unprocessed or pre-processed or processed semiconductor wafers. However, the substrate to be handled or stored may also be a mask or reticle or the like, which contains pattern information required to form a pattern on a semiconductor wafer, for example, in the manufacture of semiconductors or semiconductor circuits.

[0004] Since the introduction of 300mm wafer semiconductor materials, front opening pods or "FOUPs" have become the standard storage and transport method for substrates and similar materials. FOUPs have been used to isolate and hold silicon wafers used in semiconductor production. Semiconductors that are fundamental in the design of digital circuits, microprocessors, and transistors require that these wafers be kept as close to flawless condition as the storage unit will allow. Thus, FOUPs allow wafers to be transferred between other machines used in the processing and measurement of the wafers. Background Art

[0005] Previous FOUPs were generally used to store wafers from the surrounding cleanroom environment. In conventional semiconductor projects, FOUPs allow wafers to enter the equipment via a load port and a front door. Typically, a robotic handling mechanism can place the wafers into the FOUP, where the wafers are held in place by fins and retained for subsequent use. However, conventional FOUPs are hampered by methods and system designs that may contaminate their contents, scratch wafers, and delay the loading and unloading of substrate wafer contents as a result of a variety of configurations. Thus, there is a need to more efficiently and accurately accomplish the desired tasks of a FOUP.

[0006] It has long been known that, at least in some processes, the semiconductor substrate outgasses after a relatively long processing time. The gaseous components resulting from the processing are discharged into the environment. These gases may form compounds with the ambient air (particularly with oxygen and / or hydrogen, such as contained in water with air humidity), which then precipitate again on the surface of the substrate as impurities or even as a surface layer. Both are impurities, which require post-processing to remove these contaminants, otherwise the substrate will be completely unavailable for further use in production (also known as "yield loss"). Therefore, it is a long-term practice to subject semiconductor wafers to a purge treatment, that is, to immerse the semiconductor wafer in a purge gas flow (e.g., a nitrogen gas flow or a dry, clean air flow) after processing or a corresponding processing step. The purge gas flow is used to remove solid and gaseous impurities by the movement of the gas, and depending on the purge gas used, the reaction of the degassing with the ambient air can be avoided. For this reason, nitrogen is preferred as a purge gas, because the atmosphere around the substrate has only a small proportion of oxygen and hydrogen. Nitrogen is conventionally taken from gas containers stored in the factory and sent to a storage device in which the semiconductor wafers are stored after the respective processing step and before the semiconductor wafers are delivered to the next processing step.

[0007] However, it has long been known that, despite these measures, the previously described undesirable reactions and their precipitation on the substrate surface cannot be reliably and sufficiently prevented to date. Therefore, it is still common practice in the production of electronic components that the substrate is regularly removed as scrap or has to be freed from such impurities or such undesirable layers in a time- and cost-intensive manner. This process can affect a large proportion of the processed wafers, resulting in significant costs.

[0008] The new device for the storage, handling, processing and transport of substrates in the form of semiconductor wafers has been developed by TEC-SEMAG. (CH) proposed.

[0009] The open publication WO 2014 / 107818 A2 from TEC-SEM AG and published on July 17, 2014 proposes a substrate carrier and a substrate carrier stack consisting of a plurality of substrate carriers. The proposed substrate carrier stack comprises a plurality of substrate carriers which are stacked in the vertical direction such that for each pair of vertically adjacent substrate carriers in the substrate carrier stack, a respective lower substrate carrier supports a respective upper substrate carrier, wherein each substrate carrier has an outer carrier frame which extends in a horizontal frame plane around an inner region including an inner opening and is provided with a substrate seat for accommodating and carrying a plate-shaped substrate in an inner receiving space of the substrate carrier stack, wherein the inner receiving space or a part thereof is defined by the inner opening of a substrate carrier of the substrate carrier stack.

[0010] Each substrate carrier of the proposed substrate carrier stack has at least one upper support forming structure and at least one lower support forming structure at its outer carrier frame, so that the lower substrate carrier in a corresponding pair of vertically adjacent substrate carriers in the substrate carrier stack supports the upper substrate carrier with its at least one upper support forming structure at at least one lower support forming structure of the upper substrate carrier in the pair of vertically adjacent substrate carriers.

[0011] Each substrate carrier of the proposed substrate carrier stack further comprises the following features:

[0012] the outer carrier frame comprises a first frame web extending along a first frame web axis, a second frame web extending along a second frame web axis, a third frame web extending along a third frame web axis and a fourth frame web extending along a fourth frame web axis,

[0013] the first frame web axis and the fourth frame web axis intersect at a right angle at a first vertex, to which the first frame web and the fourth frame web are associated, and at a first frame vertex region of the outer carrier frame, in which the first frame web and the fourth frame web are integrally connected,

[0014] The first frame web axis intersects the second frame web axis at a right angle at a second vertex, which is associated with the first frame web and the second frame web, and at a second frame vertex region of the outer carrier frame, where the first frame web and the second frame web are integrally connected,

[0015] the third frame web axis intersects the fourth frame web axis at a right angle at a fourth vertex, to which the third frame web and the fourth frame web are associated, and at a fourth frame vertex region of the outer carrier frame, to which the third frame web and the fourth frame web are integrally connected,

[0016] The third frame web axis intersects the second frame web axis at a right angle at a third vertex, to which the third frame web and the second frame web are integrally connected, and at a third frame vertex region of the outer carrier frame, the third vertex being associated with the third frame web and the second frame web,

[0017] a plurality of substrate holding arms extending inwardly and upwardly from the outer carrier frame, overlapping the inner region and forming a substrate receptacle positioned at a distance above the vertical extension of the outer carrier frame and adapted to carry a plate-like substrate having a circular periphery and a diameter corresponding to a predetermined allowable diameter or within a predetermined allowable range of diameters given by a predetermined allowable minimum diameter and a predetermined allowable maximum diameter,

[0018] The substrate holder defines a horizontal bearing plane coplanar with the lower surface of the plate-like substrate when a plate-like substrate having a circular periphery and a diameter corresponding to a predetermined allowable diameter or a predetermined allowable maximum diameter is horizontally carried and held by the substrate holder.

[0019] Due to the described arrangement of frame webs and frame axes, the outer carrier frame of the substrate carrier thus has a substantially or at least roughly square or rectangular shape.

[0020] The disclosure content of WO 2014 / 107818 A2 is incorporated herein by reference in its entirety.

[0021] The public publication US 2017 / 0372930A1, also from TEC-SEM AG and published on December 28, 2017, discloses such a substrate carrier and such a substrate carrier stack with additional characterizing features. As proposed in US 2017 / 0372930A1, each substrate carrier of the proposed substrate carrier stack includes the following features in addition to the features mentioned above:

[0022] a plurality of dividing webs extending from the outer carrier frame through the inner region, which define an inner opening of the inner region and at least two auxiliary openings, wherein the inner opening and the substrate holder are arranged and dimensioned so that a plate-like substrate does not overlap any portion of the dividing webs, the plate-like substrate being carried by the substrate holder and having a circular perimeter and a diameter corresponding to or within a predetermined diameter range,

[0023] At least one first arcuate portion of the separating web extends in the space between the fourth frame web and the inner opening, defining at least one first auxiliary opening,

[0024] At least one second arcuate portion of the separating web extends in the space between the second frame web and the inner opening, defining at least one second auxiliary opening,

[0025] The arcuate portion has a radius of curvature adapted to a predetermined diameter or a predetermined range of diameters;

[0026] wherein the arcuate portions of the separating webs of the substrate carriers of the substrate carrier stack limit the inner accommodation space of the substrate carrier stack at least in a direction parallel to a first horizontal axis of the carrier stack (which is parallel to the first and third web frame axes of the substrate carrier);

[0027] wherein the first auxiliary opening and the second auxiliary opening of the inner region of the substrate carrier of the substrate carrier stack form at least one first purge channel and at least one second purge channel of the substrate carrier stack, the purge channels extending vertically parallel to the inner receiving space at opposite sides of the inner receiving space: and

[0028] Wherein the substrate carrier stack is provided with a purge structure that allows a horizontal purge flow within the substrate carrier stack through the spaces between the substrates held by the substrate holders of the substrate carriers.

[0029] Instead of providing openings in the opposite frame webs of the outer carrier frame for forming vertical purge channels extending through the frame webs as proposed according to WO 2014 / 107818 A2, a substantially improved solution according to US 2017 / 0372930 A1 provides purge channels defined by dividing webs in the inner region. This allows a larger opening cross section of the vertical purge channels, which are used to provide a horizontal purge flow within the substrate carrier stack through the space between the substrates held by the substrate holders of the substrate carrier. In order to enable a horizontal purge flow between the vertical purge channels, i.e. out of one of the vertical purge channels and into another of the vertical purge channels, the substrate carrier stack preferably has a suitable purge structure cooperating with the vertical purge channels.

[0030] The substrate carrier proposed according to US 2017 / 0372930 Al has two first positioning forming structures and two second positioning forming structures, which are provided in the form of two protrusions and two recesses or openings. The first pair of protrusions and adjacent recesses and the second pair of protrusions and adjacent recesses are arranged at the diametrically opposite frame vertex areas of the outer carrier frame. The corresponding protrusions can protrude into the corresponding recesses of the next substrate carrier above or below the corresponding substrate carrier in the stack. Therefore, for each pair of vertically adjacent substrate carriers, the two first positioning forming structures of the lower substrate carrier in the pair of vertically adjacent substrate carriers are combined with or engageable with a specific one of the two second positioning forming structures of the upper substrate carrier in the pair of vertically adjacent substrate carriers. This ensures or contributes to the appropriate relative positioning of the two substrate carriers of the pair of vertically adjacent substrate carriers.

[0031] According to the disclosure of US 2017 / 0372930 Al, i.e. in view of the relative arrangement of protrusions and recesses on the substrate carriers shown in the figures of US 2017 / 0372930 Al, two subtypes of these substrate carriers are required, and the two subtypes of substrate carriers are stacked alternately on each other in a substrate carrier stack to allow the corresponding protrusions of one substrate carrier to protrude into the corresponding recesses of another substrate carrier, which is a vertically adjacent substrate carrier positioned above or below in the substrate carrier stack.

[0032] Herein, the structural details of the substrate carrier and the substrate carrier stack disclosed in US 2017 / 0372930 A1 as well as some additional structural details of the substrate carrier and the substrate carrier stack developed by TEC-SEM AG and further also improved versions of such substrate carriers and such substrate carrier stacks developed by TEC-SEM AG are disclosed and described in detail. The disclosure of US 2017 / 0372930 A1 is incorporated herein by reference in its entirety.

[0033] Older substrate carriers with a substantially or roughly circular shape and substrate carrier stacks comprising such substrate carriers with a substantially or roughly circular shape and associated storage and opener devices are known from WO 2005 / 006407 A1 and WO 2007 / 006166 A2, also from TEC-SEMAG. The disclosures of WO 2005 / 006407 A1 or the corresponding publication US 2006 / 0151404 A1 and WO 2007 / 006166 A2 or the corresponding publication US 2010 / 0179681 A1 are hereby incorporated by reference in their entirety. Summary of the invention

[0034] Preferred embodiments of the present invention provide substrate carriers and substrate carrier stacks including such substrate carriers, which can be advantageously used for substrate handling, substrate storage, substrate processing, and substrate processing in semiconductor manufacturing or similar processes.

[0035] Preferred embodiments of the present invention also provide a substrate carrier and a substrate carrier stack comprising such a substrate carrier, which can be advantageously used to subject a substrate to a purge process.

[0036] Preferred embodiments of the present invention further provide substrate carriers and substrate carrier stacks including such substrate carriers, which include structure to ensure or facilitate proper relative positioning of the substrate carriers within the substrate carrier stack.

[0037] Preferred embodiments of the present invention provide substrate carriers and substrate carrier stacks comprising such substrate carriers, which achieve further advantages in at least one of the handling, substrate storage, substrate handling and substrate processing of the substrate carrier stack and its substrate carriers based on the appropriate relative positioning of the substrate carriers within the substrate carrier stack.

[0038] A preferred embodiment of the present invention provides a substrate carrier stack comprising a plurality of substrate carriers, wherein the plurality of substrate carriers are stacked in a vertical direction such that for each pair of vertically adjacent substrate carriers of the substrate carrier stack, a corresponding lower substrate carrier supports a corresponding upper substrate carrier, wherein each substrate carrier comprises an outer carrier frame extending in a horizontal frame plane around an inner area including an inner opening and provided with a substrate seat which accommodates and carries a substrate (e.g., a plate-like substrate) within an inner receiving space of the substrate carrier stack, wherein the inner receiving space or a portion thereof is defined by the inner openings of each substrate carrier of the substrate carrier stack.

[0039] Each substrate carrier includes at least one upper support forming structure and at least one lower support forming structure at its outer carrier frame, so that the lower substrate carrier in a corresponding pair of vertically adjacent substrate carriers in the substrate carrier stack supports the upper substrate carrier in the pair of vertically adjacent substrate carriers with its at least one upper support forming structure at at least one lower support forming structure of the upper substrate carrier in the pair of vertically adjacent substrate carriers.

[0040] Each substrate carrier in the substrate carrier stack further comprises the following features:

[0041] the outer carrier frame comprises a first frame web extending along a first frame web axis, a second frame web extending along a second frame web axis, a third frame web extending along a third frame web axis and a fourth frame web extending along a fourth frame web axis,

[0042] The first frame web axis and the fourth frame web axis intersect at right angles at a first vertex and at a first vertex region of the outer carrier frame, the first vertex being associated with the first frame web and the fourth frame web, the first frame web and the fourth frame web being integrally connected at the first frame vertex region,

[0043] The first frame web axis intersects the second frame web axis at a right angle at a second vertex and at a second vertex region of the outer carrier frame, the second vertex being associated with the first frame web and the second frame web, the first frame web and the second frame web being integrally connected at the second frame vertex region,

[0044] the third frame web axis intersects the fourth frame web axis at a right angle at a fourth vertex and at a fourth vertex region of the outer carrier frame, the fourth vertex being associated with the third frame web and the fourth frame web, the third frame web and the fourth frame web being integrally connected at the fourth frame vertex region,

[0045] the third frame web axis intersects the second frame web axis at a right angle at a third vertex and at a third vertex region of the outer carrier frame, the third vertex being associated with the third frame web and the second frame web, the third frame web and the second frame web being integrally connected at the third frame vertex region, and

[0046] A plurality of substrate holding arms extend inwardly and upwardly from the outer carrier frame, overlapping the inner region and forming a substrate receptacle positioned a distance above the vertical extent of the carrier frame and adapted to carry a plate-like substrate having a circular perimeter and a diameter corresponding to a predetermined allowable diameter or within a predetermined allowable range of diameters given by a predetermined allowable minimum diameter and a predetermined allowable maximum diameter.

[0047] Each substrate carrier of the substrate carrier stack includes at least one first positioning forming structure and at least one second positioning forming structure, wherein for each pair of vertically adjacent substrate carriers, the at least one first positioning forming structure of the lower substrate carrier in the pair of vertically adjacent substrate carriers is engaged or engageable with the at least one second positioning forming structure of the upper substrate carrier in the pair of vertically adjacent substrate carriers to ensure or facilitate proper relative positioning of the two substrate carriers of the pair of vertically adjacent substrate carriers.

[0048] Based on this appropriate relative positioning of the substrate carrier within the substrate carrier stack, according to further aspects of the preferred embodiments of the present invention presented below, further advantages in at least one of the handling, substrate storage, substrate handling and substrate processing of the substrate carrier stack and its substrate carriers, as well as substantial improvements over the prior art approaches, can be achieved.

[0049] Preferably, the first and second positioning forming structures are arranged and formed so that a corresponding first positioning forming structure (e.g., a protrusion and one of the openings or recesses) of one substrate carrier can engage with a corresponding second positioning forming structure (e.g., a protrusion and the other of the openings or recesses) of another substrate carrier, which is a vertically adjacent substrate carrier positioned above or below in a substrate carrier stack, even if the substrate carrier stack only includes substrate carriers that are arranged identically to the first and second positioning forming structures.

[0050] In the above discussion of the substrate carrier stack provided in the preferred embodiments of the present invention, a proper horizontal positioning of the substrate carrier stack on a horizontal support or the like (or a substantially horizontal reference plane) was assumed. This is the positioning that will typically or preferably be applied when the substrate carrier stack is used for storage, transportation, handling and processing of substrates, such as semiconductor wafers held by the respective substrate carriers. If the substrate carrier stack is positioned differently, such as on an inclined plane or even rotated about, for example, 90 degrees, the frame plane of the outer carrier frame of the respective substrate carrier would not be a "horizontal" plane in the strict sense, and some other indications related to terms such as "horizontal" or "horizontally" and "vertical" or "vertically" would also not be applicable in the strict sense. In view of these considerations, these indications should be understood as implicitly relating to the inherent Cartesian coordinate system of the substrate carrier stack, which has one vertical axis and two horizontal axes, regardless of the actual orientation of the substrate carrier stack relative to the horizontal reference plane.

[0051] With regard to the frame web axes and vertices, it should be noted that the frame axes are preferably assumed to extend at least partially within the respective associated frame web, but this is not mandatory. Furthermore, it is not mandatory that the respective vertices are assumed to be located within the respective frame vertex regions. Whether and to what extent this assumption makes sense will depend on the precise geometry of the frame webs and the frame vertex regions and therewith the outer carrier frame, which should, for example, have a roughly square or rectangular shape. In principle, it can be assumed that the frame web axes coincide with the straight centroid lines of the respective frame webs. Depending on the shape of the frame webs and their extent in the vertical direction, this assumption may have the consequence that the vertices are located above the respective associated frame vertex regions of the outer frame webs.

[0052] According to a preferred embodiment, the frame vertex regions are vertically aligned with each other and coincide with the lowermost part of the corresponding substrate carrier. In this case, it is assumed that the vertex is located in the corresponding associated frame vertex region, for example coincides with the centroid of the frame vertex region, which would make sense alternatively. According to this preferred embodiment, the frame webs extend upwards from the associated frame vertex regions. In this case, preferably, the frame webs extend along a large part of the distance between the frame vertex regions at a distance from the associated frame web axis. For this purpose, the frame webs can advantageously have a convex shape at the bottom side or bottom edge.

[0053] According to a preferred embodiment, the frame vertex regions of the outer carrier frame of the substrate carrier each include a planar or substantially planar outer vertex portion and a curved or inclined inner vertex portion, the inner vertex portion being integrally connected to the outer vertex portion and extending upward and toward the inner region from the outer vertex portion. The planar or substantially planar outer vertex portions are vertically aligned with each other and coincide with the lowest portion of the corresponding substrate carrier. The frame webs of the outer carrier frame of the substrate carrier each include a corresponding curved or inclined web portion extending along the corresponding frame web and extending upward and toward the inner region from the corresponding outer vertex portion or the corresponding lower web edge or the substantially planar outer web portion extending at least partially along the corresponding frame web. The curved or inclined web portion and the inner vertex portion, each extending between a corresponding pair of inner vertex portions and merging into the corresponding pair of inner vertex portions, are shaped in such a way that a continuous carrier frame profile is formed, which extends around the inner region and includes an upper edge and an inner edge defining the inner region. According to an advantageous variant of this preferred embodiment, the frame web has a convex shape at the lower web edge so that over a majority of the distance between the associated frame apex portions there is a vertical gap between the vertical level of the outer apex region and the lower web edge of the corresponding frame web extending therebetween.

[0054] Preferably, each substrate carrier stack includes at least two first positioning forming structures and at least two second positioning forming structures, and the at least two first positioning structures and the at least two second positioning structures are engaged or engageable with each other to ensure or facilitate the proper relative positioning of the two substrate carriers of a corresponding pair of vertically adjacent substrate carriers.

[0055] Preferably, all substrate carriers of a substrate carrier stack are of the same type (e.g., structurally identical and / or having the same structural configuration), wherein certain features of the substrate carriers have a secondary rotational symmetry with respect to a rotation about a vertical rotation axis and certain features of the substrate carriers have a primary rotational symmetry with respect to a rotation about a vertical rotation axis, such that the frame webs of the respective substrate carriers can be distinguished from one another.

[0056] If all substrate carriers of a substrate carrier stack are of the same type, then for each pair of vertically adjacent substrate carriers of the substrate carrier stack, the substrate carriers can be stacked on each other so that the first frame web of the lower substrate carrier supports the third frame web of the upper substrate carrier, the second frame web of the lower substrate carrier supports the fourth frame web of the upper substrate carrier, the third frame web of the lower substrate carrier supports the first frame web of the upper substrate carrier, and the fourth frame web of the lower substrate carrier supports the second frame web of the upper substrate carrier, so that the corresponding first and third frame vertex areas of the outer carrier frames of the substrate carriers overlap at the first vertical edge area of ​​the substrate carrier stack, the corresponding first and third frame vertex areas of the outer carrier frames of the substrate carriers overlap at the third vertical edge area of ​​the substrate carrier stack, the corresponding second and fourth frame vertex areas of the outer carrier frames of the substrate carrier overlap at the second vertical edge area of ​​the substrate carrier stack, and the corresponding second and fourth frame vertex areas of the outer carrier frames of the substrate carrier overlap at the fourth vertical edge area of ​​the substrate carrier stack.

[0057] In other words, the two substrate carriers of each pair of vertically adjacent substrate carriers of the substrate carrier stack can be rotated 180 degrees relative to each other about the vertical rotation axis to provide the substrate carrier stack.

[0058] Each substrate carrier of the substrate carrier stack can also be provided with at least one first positioning forming structure and at least one second positioning forming structure, which are arranged at diametrically opposite portions of the outer carrier frame, so that if the two substrate carriers of the pair of corresponding vertically adjacent substrate carriers are stacked on each other so that the first frame web of the lower substrate carrier supports the third frame web of the upper substrate carrier, the second frame web of the lower substrate carrier supports the fourth frame web of the upper substrate carrier, the third frame web of the lower substrate carrier supports the first frame web of the upper substrate carrier, and the fourth frame web of the lower substrate carrier supports the second frame web of the upper substrate carrier, then the at least one first positioning forming structure of the lower substrate carrier of the pair of corresponding vertically adjacent substrate carriers can be engaged with the at least one second positioning forming structure of the upper substrate carrier of the pair of corresponding vertically adjacent substrate carriers.

[0059] In other words, the positioning forming configuration can be arranged so that when a substrate carrier stack is assembled from a certain number of independent substrate carriers provided identically with the positioning forming configuration, the respective two substrate carriers of each pair of respective vertically adjacent substrate carriers of the substrate carrier stack must have been rotated 180 degrees relative to each other about the vertical rotation axis. Otherwise, the first and second positioning forming configurations will not engage with each other. If the substrate carrier stack comprises a base and a cover, as considered below, the base can comprise at least one first positioning forming configuration, which engages or is engageable with at least one second positioning forming configuration of the bottommost substrate carrier of the substrate carrier stack, and the cover can comprise at least one second positioning forming configuration, which engages or is engageable with at least one first positioning forming configuration of the topmost substrate carrier of the substrate carrier stack, so as to facilitate or even ensure proper positioning of the base and the cover relative to the substrate carriers. The described solution ensures a specific vertical order of the substrate carriers in the substrate carrier stack, which can be the basis for specific further inventive features of the substrate carrier stack to achieve further advantages and improvements over prior art solutions as described herein.

[0060] The frame apex regions of the outer carrier frame of the substrate carrier can each include a planar or substantially planar outer apex portion, wherein the first and second locating forming features can be disposed at a respective one of the planar or substantially planar outer apex portions.

[0061] Preferably, each substrate carrier is provided with at least one vertical protrusion as one of the first and second locating forming formations and with at least one recess or opening as the other of the first and second locating forming formations.

[0062] According to a preferred embodiment, each substrate holding arm of the plurality of substrate holding arms of the respective substrate carrier is arranged at the associated frame web in the area between two frame vertex areas associated with the respective frame web, wherein the substrate holding arm is arranged at the respective frame web at a varying distance from the respective nearest frame vertex area of ​​the two frame vertex areas associated with the respective frame web. Preferably, respective pairs of substrate holding arms of the respective substrate carrier, which are arranged at diametrically opposed frame web portions of two frame webs comprising parallel frame web axes, have different distances from the respective nearest frame vertex areas.

[0063] Advantageously, the substrate holding arms can be arranged in a substrate carrier stack in at least four groups of vertically staggered substrate holding arms, wherein corresponding groups of vertically directly adjacent substrate holding arms are arranged horizontally offset relative to each other, so that these adjacent substrate holding arms belonging to a corresponding pair of vertically adjacent substrate carriers do not vertically overlap at least at their upper seat elements, which together with corresponding upper seat elements of other substrate holding arms of the corresponding substrate carrier form a substrate seat.

[0064] The multiple substrate holding arms of the corresponding substrate carrier preferably include a first substrate holding arm and a second substrate holding arm and a third substrate holding arm and a fourth substrate holding arm, the first substrate holding arm and the second substrate holding arm are arranged at one of the first frame web and the second frame web in the frame web, and the third substrate holding arm and the fourth substrate holding arm are arranged at the frame web of the third frame web and the fourth frame web in the frame web whose frame web axis extends parallel to or substantially parallel to the frame web axis of the frame web where the first substrate holding arm and the second substrate holding arm are arranged.

[0065] The connection point of the first substrate holding arm where the first substrate holding arm merges into the corresponding frame web and the connection point of the fourth substrate holding arm where the fourth substrate holding arm merges into the corresponding frame web can have the same distance from the corresponding nearest frame vertex area, and the connection point of the second substrate holding arm where the second substrate holding arm merges into the corresponding frame web and the connection point of the third substrate holding arm where the third substrate holding arm merges into the corresponding frame web can have the same distance from the corresponding nearest frame vertex area. However, the distance of the connection point of the first substrate holding arm and the fourth substrate holding arm from the corresponding nearest frame vertex area can be different from the distance of the connection point of the second substrate holding arm and the third substrate holding arm from the corresponding nearest frame vertex area.

[0066] The proposed arrangement of the substrate holding arms discussed above allows or causes vertically adjacent adjacent substrate holding arms of vertically adjacent substrate carriers within a substrate carrier stack to not overlap vertically, thereby enabling a relatively small spacing, i.e., a smaller vertical distance between substrate holders within a substrate carrier stack, resulting in a high storage density for substrates within a substrate carrier stack.

[0067] According to a preferred embodiment, the substrate carriers are each provided with a set of interface elements, which are arranged at the outer periphery of the outer carrier frame, where it is possible to interact independently and directly with the corresponding substrate carrier without having to interact directly with other substrate carriers of the substrate carrier stack.

[0068] The interface element can be a protrusion that protrudes horizontally from near the outer periphery of the corresponding outer carrier frame, so that the protrusion can engage from below to independently support the corresponding substrate carrier and vertically move the corresponding substrate carrier relative to at least one other substrate carrier positioned below the corresponding substrate carrier in the substrate carrier stack.

[0069] This arrangement enables a handling or opener device to interact with the respective substrate carrier in a technically simple manner so that the respective substrate carrier can be independently supported or moved relative to at least one other substrate carrier located below the respective substrate carrier in a stack of substrate carriers, for example, to access the substrate seat of the substrate carrier for loading and unloading of the substrate.

[0070] Preferably, each substrate carrier includes a pair of protrusions protruding in a common horizontal direction and another pair of protrusions protruding in an opposite common horizontal direction, wherein each protrusion is arranged at a corresponding frame vertex area in each frame vertex area, preferably at a planar or substantially planar outer vertex portion of the corresponding frame vertex area, or at a corresponding frame web near the corresponding frame vertex area, so that the protrusions are arranged in four groups of vertically staggered protrusions at the substrate carrier stack.

[0071] Preferably, the first protrusion is arranged at the first frame apex area or at the fourth frame web near the first frame apex area, and the fourth protrusion is arranged at the fourth frame apex area or at the fourth frame web near the fourth frame apex area, the first protrusion and the fourth protrusion protrude in the same horizontal direction, and the second protrusion is arranged at the second frame apex area or at the second frame web near the second frame apex area, and the third protrusion is arranged at the third frame apex area or at the second frame web near the third frame apex area, and the second protrusion and the third protrusion protrude in the same direction, which is opposite to the horizontal direction in which the first protrusion and the second protrusion protrude.

[0072] Alternatively, the first protrusion is disposed at the first frame apex region or at the first frame web near the first frame apex region, and the second protrusion is disposed at the second frame apex region or at the first frame web near the second frame apex region, the first protrusion and the second protrusion protrude in the same horizontal direction, and the third protrusion is disposed at the third frame apex region or at the third frame web near the third frame apex region, and the fourth protrusion is disposed at the fourth frame apex region or at the third frame web near the fourth frame apex region, the third protrusion and the fourth protrusion protrude in the same direction, which is opposite to the horizontal direction in which the first protrusion and the fourth protrusion protrude.

[0073] According to a preferred embodiment, the first and fourth protrusions or the first and second protrusions are protrusions of the first type, and the second and third protrusions or the third and fourth protrusions are protrusions of the second type, wherein the protrusions of the first type and the protrusions of the second type have different shapes or / and are differently positioned at or relative to the respective frame vertex regions. This simplifies the independent interaction with the selected substrate carrier by suitable interface formation configurations, for example, with external handling or moving devices.

[0074] The protrusions can be arranged at the substrate carrier stack in multiple groups of vertically staggered protrusions, wherein the protrusions of the respective groups are arranged so that the vertically directly adjacent protrusions do not overlap vertically or do not overlap vertically completely. An enlarged vertical distance between vertically aligned protrusions is obtained, and the protrusions are preferably protrusions of the same type.

[0075] According to a preferred embodiment of the invention, the substrate carriers of the substrate carrier stack are identically provided with projections.

[0076] According to a preferred embodiment of the invention, all substrate carriers of a substrate carrier stack can be of the same type.

[0077] According to a preferred embodiment, the substrate carrier stack further comprises a cover, which is stacked on the plurality of substrate carriers such that an uppermost one of the substrate carriers supports the cover.

[0078] According to a preferred embodiment, the substrate carrier stack further comprises a base on which a plurality of substrate carriers are stacked such that the base supports a lowermost one of the substrate carriers.

[0079] According to the term used herein, the cover (if provided) and the base (if provided) belong to the stacking of substrate carriers. The stacking of substrate carriers including the cover and the base is preferably able to be handled together as an integral unit or a single structure, which can be used for the purpose of storing, transporting, handling and processing the substrates held by the corresponding substrate carriers. Therefore, the unit or the stacking of the substrate carriers can also be represented as a modular substrate holder, a substrate storage and transport device or a substrate processing device, because it includes a separate module, i.e., a substrate carrier and (if provided) a cover and (if provided) a base. In order to approach the seat of the corresponding substrate carrier so that the corresponding substrate is loaded on the substrate seat or the corresponding substrate is unloaded from the substrate seat, an opener device can be used, the opener device includes a moving mechanism, and the moving mechanism makes the upper substrate carrier and the lower substrate carrier in the corresponding pair of vertically adjacent substrate carriers of the substrate carrier stacking vertically move relative to each other, so that the gap between the upper substrate carrier and the lower substrate carrier is opened, so that the substrate seat of the lower substrate carrier can be approached from the horizontal direction to be loaded or unloaded, for example, by a robot arm. In this regard, conventional opener devices, such as the one described in WO 2014 / 107818 A2, can be readily adapted to operate on substrate carrier stacks of the kind provided by preferred embodiments of the present invention.

[0080] The base can include at least one first positioning forming structure that is engaged or engageable with at least one second positioning forming structure of a bottommost substrate carrier of the substrate carrier stack, and the cover can include at least one second positioning forming structure that is engaged or engageable with at least one first positioning forming structure of an uppermost substrate carrier of the substrate carrier stack, so that proper positioning of the base and the cover relative to the substrate carrier is facilitated or even ensured, as already described above.

[0081] According to a preferred embodiment of the present invention, each substrate carrier of the substrate carrier stack further comprises the following features:

[0082] The substrate holder defines a horizontal bearing plane, which is coplanar with the lower surface of the plate-like substrate when a plate-like substrate having a circular periphery and a diameter corresponding to the predetermined allowable diameter or the predetermined maximum allowable diameter is horizontally carried and held by the substrate holder,

[0083] a plurality of dividing webs extending from the outer carrier frame through the inner region, which define an inner opening and at least two auxiliary openings of the inner region, wherein the inner opening and the substrate holder are arranged and dimensioned such that a plate-like substrate carried by the substrate holder and having a circular perimeter and a diameter corresponding to or within a predetermined diameter range does not overlap any portion of the dividing webs,

[0084] At least one first arcuate portion of the separating web extends in the space between the fourth frame web and the inner opening, defining at least one first auxiliary opening,

[0085] At least one second arcuate portion of the separator web extends in the space between the second frame web and the inner opening, defining at least one second auxiliary opening, and

[0086] The arcuate portion has a radius of curvature adapted to a predetermined diameter or a predetermined range of diameters;

[0087] The arched portion of the dividing web of each substrate carrier of the substrate carrier stack limits the internal storage space of the substrate carrier stack at least in a direction parallel to or substantially parallel to a first horizontal axis of the carrier stack, and the first horizontal axis is parallel to or substantially parallel to a first web frame axis and a third web frame axis of the substrate carrier.

[0088] In order to allow the substrates held by the substrate carriers to be advantageously subjected to a purge treatment, the first auxiliary opening and the second auxiliary opening of the inner region of each substrate carrier in the stack of substrate carriers form at least one first purge channel and at least one second purge channel of the stack of substrate carriers, the at least one first purge channel and the at least one second purge channel extending vertically parallel or substantially parallel to the inner accommodation space at opposite sides of the inner accommodation space;

[0089] Preferably, the substrate carrier is provided with a purge structure that allows a horizontal purge flow within the stack of substrate carriers through the spaces between the substrates held by the substrate holders of the substrate carriers.

[0090] Substantial improvements over prior art approaches are achieved. According to preferred embodiments of the present invention, the first and second purge channels can have a relatively large opening cross-section, which enables and facilitates a laminar purge gas flow within the substrate carrier stack, which is desirable for efficient purge processing of substrates like semiconductor wafers.

[0091] The first and second purge channels and the purge structure allow a purge treatment of a substrate in the form of a semiconductor wafer after a corresponding processing step. Such a purge treatment is an important step in the processing of semiconductor wafers and in the manufacture of semiconductor devices. The substrate carrier and the substrate carrier stack according to the preferred embodiment of the present invention can advantageously be used to subject the wafer held in the seat of the substrate carrier to a suitable purge treatment, in which the wafer is immersed in a purge gas flow, for example, a nitrogen flow or a dry clean air flow, so that gaseous and solid contaminants (in particular outgassing from the wafer caused by previous processing steps) are purged from the substrate carrier stack.

[0092] For such a use scenario, ie subjecting a substrate accommodated in a substrate carrier stack to a purging process, the substrate carrier stack preferably comprises a base and a cover.

[0093] With reference to the specific relative arrangement of adjacent substrate carriers in a substrate carrier stack presented above, it should be noted that this relative arrangement of vertically adjacent substrate carriers has the consequence that the respective first and second auxiliary openings of the substrate carriers stacked on one another form at least one first purge channel and the respective first and second auxiliary openings of the substrate carriers stacked on one another form at least one second purge channel. To this end, the separating webs and in particular the arcuate portions of the separating webs are preferably arranged in a complementary manner so that each first arcuate portion can cooperate with the associated second arcuate portion or associated second arcuate portions of the vertically adjacent substrate carrier or substrate carriers and each second arcuate portion can cooperate with the associated first arcuate portion or associated first arcuate portions of the vertically adjacent substrate carrier or substrate carriers. According to the preferred embodiment mentioned below, which comprises two first auxiliary openings and two second auxiliary openings in the inner region of each substrate carrier, two first purge channels and two second purge channels are obtained in the substrate carrier stack.

[0094] According to a preferred embodiment, each substrate carrier includes a first dividing web, which extends between the first frame web and the third frame web and includes a first arch portion, which extends in the space between the fourth frame web and the inner opening and bridges most of the distance between the first frame web and the third frame web, preferably the vast majority, and each substrate carrier includes a second dividing web, which extends between the first frame web and the third frame web and includes a second arch portion, which extends in the space between the second frame web and the inner opening and bridges most of the distance between the first frame web and the third frame web, preferably the vast majority.

[0095] Preferably, the first dividing web comprises a first connection portion and a second connection portion, the first connection portion being merged into the first arch at one end and merged into the first frame web of the corresponding substrate carrier in the region near the first frame vertex at the other end, the second connection portion being merged into the first arch at one end and merged into the third frame web of the corresponding substrate carrier in the region near the fourth frame vertex at the other end, and the second dividing web comprises a first connection portion and a second connection portion, the first connection portion being merged into the second arch at one end and merged into the first frame web of the corresponding substrate carrier in the region near the second frame vertex at the other end, the second connection portion being merged into the second arch at one end and merged into the third frame web of the corresponding substrate carrier in the region near the third frame vertex at the other end. In addition, the first dividing web can further include a third connection area, which connects the first arch with the fourth frame web and thereby defines two first auxiliary openings of similar or identical size of the corresponding substrate carrier, and the second dividing web can include a third connection area, which connects the second arch with the second frame web and thereby defines two second auxiliary openings of similar or identical size of the corresponding substrate carrier.

[0096] It is proposed to provide a purge structure in the form of a purge passage, wherein each pair of corresponding vertically adjacent substrate carriers in a substrate carrier stack is provided with a purge passage, which passes through the arched portion of the dividing web of each substrate carrier of the pair of vertically adjacent substrate carriers, so that a corresponding part of the inner storage space is connected to a corresponding first purge channel through at least one first purge passage to allow the flow of purge gas from the first purge channel to the part of the inner storage space, or vice versa, and is connected to a corresponding second purge channel through at least one second purge passage to allow the flow of purge gas from the part of the inner storage space to the second purge channel, or vice versa.

[0097] The at least one first purge channel and the at least one first purge passage can be used as a supply purge channel and as a supply purge passage, and the at least one second purge channel and the at least one second purge passage can be used as an exhaust purge channel and as an exhaust purge passage. Alternatively, the at least one second purge channel and the at least one second purge passage can be used as a supply purge channel and as a supply purge passage, and the at least one first purge channel and the at least one first purge passage can be used as an exhaust purge channel and as an exhaust purge passage. Suitably, the arrangement enables the purge gas supplied to the at least one supply purge channel to be supplied to the gap space between the corresponding pairs of adjacent substrates (i.e., the substrate carried by the substrate holder of the upper substrate carrier and the substrate carried by the substrate holder of the lower substrate carrier) via at least one supply purge passage, and can be discharged from the gap space via at least one exhaust purge passage into the at least one exhaust purge channel, which discharges the purge gas via the at least one exhaust purge passage. For most substrate carriers of a substrate carrier stack, the proposed purge passages through the arcuate portion of a respective pair of vertically adjacent substrate carriers are suitable for use as supply purge passages as well as as exhaust purge passages and can be sufficient to achieve an appropriate purge gas flow. It is preferably assumed here that all substrate carriers carry respective substrates (which may not always be the case) and that the substrates correspond to a predetermined allowable substrate thickness or substrate thickness range for which the substrate carriers and the substrate carrier stack are designed, so that an appropriate gap space exists between the respective pair of adjacent substrates.

[0098] The substrate carrier stack can be provided with at least one supply port, which is connected to the at least one supply purge channel to supply purge gas from an external purge gas source to the substrate carrier stack, and can be provided with at least one exhaust port, which is connected to the at least one exhaust channel to exhaust the purge gas from the substrate carrier stack to an external purge gas exhaust device.

[0099] Preferably, the purge passage is defined by upper surface areas of corresponding arcuate portions of the dividing webs of the lower substrate carrier in a corresponding pair of vertically adjacent substrate carriers and by corresponding lower surface areas of corresponding arcuate portions of the dividing webs of the upper substrate carrier in a corresponding pair of vertically adjacent substrate carriers.

[0100] Preferably, the corresponding first purge passage extends completely along a corresponding one of the first and second arched portions and at least a substantial portion of the first and second connecting portions of a corresponding one of the first and second dividing webs, and is defined by the upper surface of the corresponding dividing web of the lower substrate carrier in a corresponding pair of vertically adjacent substrate carriers and the lower surface of the corresponding dividing web of the upper substrate carrier in the corresponding pair of vertically adjacent substrate carriers, wherein the corresponding second purge passage extends completely along a corresponding one of the second and first arched portions and at least a substantial portion of the first and second connecting portions of a corresponding one of the second and first dividing webs, and is defined by the upper surface of the corresponding dividing web of the lower substrate carrier in a corresponding pair of vertically adjacent substrate carriers and the lower surface of the corresponding dividing web of the upper substrate carrier in the corresponding pair of vertically adjacent substrate carriers, and wherein the first and second purge passages are positioned at opposite sides of the inner accommodating space.

[0101] Preferably, the purge passage is designed as an elongated nozzle opening, which comprises an opening width in the vertical direction which tapers towards the corresponding part of the inner accommodation space. This preferably achieves an acceleration of the horizontal purge gas flow, which helps to achieve an effective purge treatment of the substrate.

[0102] According to a preferred embodiment, most of the purge passages connect the corresponding portion of the inner receiving space, which is located between an upper bearing plane defined by a substrate seat of an upper substrate carrier in another pair of vertically adjacent substrate carriers and a lower bearing plane defined by a substrate seat of a lower substrate carrier in the other pair of vertically adjacent substrate carriers, with the corresponding first channel or with the corresponding second channel. The purge passages connecting the corresponding portion of the inner receiving space between the corresponding upper bearing plane and the corresponding lower bearing plane with the corresponding first channel or with the corresponding second channel are preferably formed as corresponding elongated curved purge passages, which extend circumferentially around the corresponding portion of the inner receiving space at a certain vertical distance from the lower bearing plane (which exceeds the predetermined allowable thickness or thickness range of the plate-like substrate for which the substrate carrier stack is designed) and at a certain vertical distance from the upper bearing plane.

[0103] According to a preferred embodiment, a majority of the substrate carriers of the substrate carrier stack comprise their corresponding arched portions, which are positioned relative to a specific associated lower substrate carrier, which is located below the corresponding substrate carrier in the substrate carrier stack in such a way that the carrying plane of the substrate seat of the associated lower substrate carrier of the substrate carrier stack intersects with the arched portions of the corresponding substrate carriers of the majority of the substrate carriers.

[0104] In principle, with the exception of a lowermost substrate carrier or preferably a predetermined number of lowermost substrate carriers in a substrate carrier stack, all substrate carriers in a substrate carrier stack will include their respective arch portions, which are positioned in the manner mentioned relative to a particular associated lower substrate carrier of the substrate carrier stack and connect respective parts of the inner accommodation space with the respective first channel and with the respective second channel.

[0105] The lowest substrate carrier or the lowest substrate carrier of a predetermined number in the stack of substrate carriers can include their corresponding arched portions, which are positioned within the vertical extension range of the cylindrical protrusion of the base, which extends upward into the inner accommodation space. The cylindrical protrusion can include a planar upper surface and a diameter corresponding to a predetermined allowable diameter of the substrate or within the predetermined allowable diameter range of the substrate. Preferably, the planar upper surface is positioned below the bearing plane of the lowest substrate carrier in the stack of substrate carriers at a certain vertical distance, and the vertical distance belongs to the same order of magnitude as the distance between the bearing planes defined by the substrate seats of a corresponding pair of vertically adjacent substrate carriers. Preferably, the vertical distance corresponds to the vertical distance between the lower surface of the upper substrate carried by the substrate seat of the upper substrate carrier in such a pair of vertically adjacent substrate carriers and the upper surface of the lower substrate carried by the substrate seat of the lower substrate carrier.

[0106] For most substrate carriers of a substrate carrier stack, a carrying plane defined by a corresponding substrate seat can be positioned below a purge passage that passes through an arcuate portion of a dividing web of each substrate carrier of a pair of vertically adjacent substrate carriers located above a corresponding substrate carrier in the substrate carrier stack.

[0107] Generally, all substrate carriers in a substrate carrier stack, except for one topmost substrate carrier or preferably a predetermined number of topmost substrate carriers in the substrate carrier stack, will have a carrying plane defined by their respective substrate holders positioned below such a purge passage provided by a substrate carrier located above the respective substrate carrier in the substrate carrier stack.

[0108] It is proposed that the above-mentioned cover includes a purge forming structure, which cooperates with at least one first purge channel and at least one second purge channel, and which provides a purge passage associated with the substrate seat of the uppermost substrate carrier or with the substrate seats of the corresponding substrate carriers of a predetermined number of uppermost substrate carriers, wherein the purge passage provided by the purge forming structure directly or indirectly connects the corresponding part of the internal accommodation space associated with the corresponding substrate seat with the corresponding first purge channel and the corresponding second purge channel. Preferably, the purge passage provided by the purge forming structure connects the corresponding part of the inner accommodation space between the planar lower surface area of ​​the cover and the supporting plane defined by the seat of the uppermost substrate carrier or between the corresponding upper supporting plane and the corresponding lower supporting plane defined by the seats of a corresponding pair of vertically adjacent substrate carriers with the corresponding first purge channel or with the corresponding second purge channel, wherein the purge passage provided by the purge forming structure is preferably formed as a corresponding slender curved purge passage, which extends circumferentially around the corresponding part of the inner accommodation space at a certain vertical distance from the lower supporting plane exceeding the predetermined allowable thickness or thickness range of the plate-like substrate designed for the substrate carrier stack and at a certain vertical distance from the upper supporting plane or the planar surface area.

[0109] The purge forming structure can include a first dividing ridge and a second dividing ridge, the first dividing ridge including a first arched region, the second dividing ridge including a second arched region, the first dividing ridge and the second dividing ridge extending in alignment with a respective one of the first and second arched portions of the first and second dividing webs of the substrate carrier, wherein the first dividing ridge preferably includes a first extension portion and a second extension portion merged into the first arched portion at a respective end, and the second dividing ridge preferably includes a first extension portion and a second extension portion merged into the second arched portion at a respective end, wherein the first and second extension portions extend in alignment with a respective one of the first and second connecting portions of the first and second dividing webs of the substrate carrier, wherein the purge passage provided by the purge forming structure includes a respective first purge passage extending through the first dividing ridge and a respective second purge passage extending through the second dividing ridge for connecting each portion of the internal accommodating space with a respective purge channel.

[0110] Preferably, the first and second purge passages provided by the purge forming structure extend in alignment with the first and second purge passages defined by the upper surfaces of the first and second dividing webs of the lower substrate carrier in a corresponding pair of vertically adjacent substrate carriers and the lower surfaces of the first and second dividing webs of the upper substrate carrier in the corresponding pair of vertically adjacent substrate carriers.

[0111] Preferably, the purge passages are arranged in a vertically staggered manner in defined equidistant vertical positions within the substrate carrier stack so that the purge passages are positioned at (a) approximately half of the vertical distance between the planar lower surface area of ​​the cover and the upper surface of the substrate carried by the substrate holder of the uppermost substrate carrier, or (b) approximately half of the vertical distance between the lower surface of the substrate carried by the substrate holder of the upper substrate carrier in a pair of vertically adjacent substrate carriers and the upper surface of the substrate carried by the substrate holder of the lower substrate carrier in the pair of vertically adjacent substrate carriers, or (c) approximately half of the vertical distance between the lower surface of the substrate carried by the substrate holder of the lowermost substrate carrier and the planar upper surface of the cylindrical protrusion of the base, if all substrate holders carry corresponding plate-like substrates having a predetermined substrate thickness and having a circular periphery having a predetermined substrate diameter for which the substrate carrier stack is designed, or (d) within the vertical extension range of the cylindrical protrusion of the base.

[0112] Advantageously, the upper support forming construction and the lower support forming construction of the respective substrate carrier can be provided in the form of an upper sealing forming construction and a lower sealing forming construction, one of the sealing forming constructions preferably comprising at least one continuous sealing lip or sealing ridge extending continuously around the inner region, and the other of the sealing forming constructions preferably comprising at least one continuous sealing surface band extending continuously around the inner region, wherein, for each pair of respective vertically adjacent substrate carriers of the substrate carrier stack, the lower sealing forming construction of the respective upper substrate carrier is engaged or engageable with the associated upper sealing forming construction of the respective lower substrate carrier for sealing the inner region and therewith the inner accommodation space from the surroundings of the substrate carrier stack. According to the above preferred embodiment, by the proposed sealing of the inner region, the at least one first purge channel and the at least one second purge channel can also be sealed from the surroundings of the substrate carrier stack. The upper seal-forming formation of the uppermost substrate carrier is engageable or engagable with the associated seal-forming formation of the cover, and the lower seal-forming formation of the lowermost substrate carrier is engageable or engagable with the associated seal-forming formation of the base to seal the inner receiving space, the at least one first purge channel, and the at least one second purge channel from the surrounding environment of the substrate carrier stack. The cover can be designed to have such a weight that the weight of the cover achieves or facilitates sufficient sealing engagement between the seal-forming formations associated with each other.

[0113] It is proposed that one of the cover and the base includes a first port communicating with a first purge passage, and one of the cover and the base includes a second port communicating with a second purge passage, so that the purge gas can be supplied to the substrate carrier stack via one of the first port and the second port that is defined and functions as a supply port, and can be discharged from the substrate carrier stack via the other of the first port and the second port that serves as a discharge port to achieve a purge gas flow through the inner accommodation space via the first and second purge passages and the purge passage. In particular, for example, one of the cover and the base can include the first port and the other of the cover and the base can include the second port. However, alternatively, one of the cover and the base can also include the first port and the second port. For example, it may be advantageous for the base to include the first port and the second port for certain interface arrangements, such as for connecting the ports to supply lines and return lines for purge gas. For other interface arrangements, it may be advantageous if the cover includes the first and second ports.

[0114] The first port can be connected to the first purge channel via a first laminar fluidizer integrated into the cover or base, respectively, to achieve or facilitate a substantially laminar purge gas flow through the first purge channel. Additionally or alternatively, the second port can be connected to the second purge channel via a second laminar fluidizer integrated into the cover or base, respectively, to achieve or facilitate a substantially laminar purge gas flow through the second purge channel. At least one of the first laminar fluidizer and the second laminar fluidizer includes at least one of a gas filter medium (e.g., a laminar fabric) and a gas distribution manifold, the gas distribution manifold being suitable for reducing or preventing turbulence of the purge gas passing therethrough.

[0115] Preferably, the first and second purge channels and the purge passage are sized and positioned to achieve or facilitate a substantially laminar purge gas flow through the inner containment space. To this end, further, the vertical distance between the bearing planes of the seats of the substrate carrier is preferably sized to achieve or facilitate a substantially laminar purge gas flow through the inner containment space.

[0116] According to a preferred embodiment, the frame apex area of ​​the outer carrier frame of the substrate carrier each includes a substantially planar outer apex portion and a curved or inclined inner apex portion, which is integrally connected to the outer apex portion and stands upright from the outer apex portion to extend upward and toward the inner area, wherein the frame webs of the outer carrier frame of the substrate carrier each include a corresponding curved or inclined web portion, which extends along the corresponding frame web and stands upright from the corresponding outer apex portion or the corresponding lower web edge or at least partially along the corresponding frame web to extend upward and toward the inner area, wherein the curved or inclined web portions each extend between and merge into a corresponding pair of inner apex portions, and the inner apex portions are shaped in such a manner as to provide a continuous carrier frame contour and extend around the inner area and include an upper edge and an inner edge that define the inner area.

[0117] In this case, the upper sealing forming structure of the corresponding substrate carrier can advantageously be provided by a continuous surface portion of the continuous carrier frame profile, wherein the continuous surface portion extends along the upper side of the continuous carrier frame profile in close proximity to the inner area around the inner area and is defined and functions as a continuous sealing surface band.

[0118] Preferably, the lower seal-forming formation of the respective substrate carrier is provided in the form of a continuous sealing lip or sealing ridge which extends around the inner region in close proximity to the inner region along the underside of the continuous carrier frame contour.

[0119] Preferably, the substrate carrier is integrally molded from a plastic material, preferably by injection molding. The substrate carrier can be molded from a plastic material that reduces static electricity. This is particularly recommended, for example, for clean room applications. Preferably, the substrate carrier is molded from polyetheretherketone (PEEK) or polycarbonate (PC).

[0120] A preferred embodiment of the present invention provides a substrate carrier stack, which includes a plurality of substrate carriers of only one type, which are stacked or stackable on each other and carry corresponding plate-shaped substrates in the internal storage space of the substrate carrier stack, wherein each substrate carrier is provided with a positioning forming structure, so that if the upper substrate carrier and the lower substrate carrier are properly positioned relative to each other, the positioning forming structures of each pair of upper substrate carriers and lower substrate carriers are mutually engaged or engageable. Certain features of the substrate carriers have a secondary rotational symmetry relative to the rotation around the vertical rotation axis and certain features of the substrate carriers have a primary rotational symmetry relative to the rotation around the vertical rotation axis. The appropriate relative positioning of the upper substrate carrier and the lower substrate carrier preferably includes a relative rotation of 180 degrees around the vertical rotation axis. The substrate carrier stack and its substrate carriers can include further features of the aforementioned substrate carrier stack and substrate carrier.

[0121] A preferred embodiment of the present invention provides a substrate carrier, which includes an outer carrier frame, which extends around an inner area including an inner opening in the frame plane and defines or is provided with a substrate seat, which accommodates and carries a plate-shaped substrate. The substrate carrier further includes at least one upper support forming structure and at least one lower support forming structure at its outer carrier frame, so that the substrate carrier can be used as a lower substrate carrier, which supports another substrate carrier of the same type with its at least one upper support forming structure at at least one lower support forming structure of another substrate carrier of the same type, which is stacked on the substrate carrier, and enables the substrate carrier to be used as an upper substrate carrier, which is supported by at least one upper support forming structure of another substrate carrier of the same type on which the substrate carrier is stacked at its at least one lower support forming structure.

[0122] The substrate carrier further includes the following features:

[0123] the outer carrier frame comprises a first frame web extending along a first frame web axis, a second frame web extending along a second frame web axis, a third frame web extending along a third frame web axis and a fourth frame web extending along a fourth frame web axis,

[0124] The first frame web axis and the fourth frame web axis intersect at right angles at a first vertex and at a first vertex region of the outer carrier frame, the first vertex being associated with the first frame web and the fourth frame web, the first frame web and the fourth frame web being integrally connected at the first frame vertex region,

[0125] The first frame web axis intersects the second frame web axis at a right angle at a second vertex and at a second vertex region of the outer carrier frame, the second vertex being associated with the first frame web and the second frame web, the first frame web and the second frame web being integrally connected at the second frame vertex region,

[0126] the third frame web axis intersects the fourth frame web axis at a right angle at a fourth vertex and at a fourth vertex region of the outer carrier frame, the fourth vertex being associated with the third frame web and the fourth frame web, the third frame web and the fourth frame web being integrally connected at the fourth frame vertex region,

[0127] The third frame web axis intersects the second frame web axis at a right angle at a third vertex and at a third vertex region of the outer carrier frame, the third vertex being associated with the third frame web and the second frame web, the third frame web and the second frame web being integrally connected at the third frame vertex region,

[0128] A plurality of substrate holding arms extend inwardly and upwardly from the outer carrier frame, overlapping the inner region and forming a substrate holder positioned a distance above the vertical extent of the carrier frame and adapted to carry a plate-like substrate having a circular perimeter and a diameter corresponding to a predetermined allowable diameter or within a predetermined allowable range of diameters given by a predetermined allowable minimum diameter and a predetermined allowable maximum diameter.

[0129] The substrate carrier includes at least one first positioning forming structure and at least one second positioning forming structure, wherein the at least one first positioning forming structure is engageable with at least one second positioning forming structure of another substrate carrier of the same type stacked on the substrate carrier, and the at least one second positioning forming structure is engageable with at least one first positioning forming structure of another substrate carrier of the same type on which the substrate carrier is stacked, so as to ensure or facilitate proper relative positioning of at least two substrate carriers of the same type stacked on each other.

[0130] Preferably, the substrate carrier is adapted to be combined with a number of further substrate carriers of the same type by stacking the substrate carriers on each other to provide a stack of substrate carriers according to the preferred embodiments of the present invention as described previously.

[0131] Advantageously, the substrate carrier can comprise one or more further features of a respective substrate carrier of a substrate carrier stack according to the preferred embodiments of the invention as described hereinbefore.

[0132] Other features and preferred embodiments of the invention according to its various aspects will become apparent from the accompanying drawings and from the detailed description that follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0133] Figure 1 is a perspective view of a substrate carrier stack according to a first preferred embodiment of the present invention, which includes a plurality of substrate carriers, a base and a cover.

[0134] Figure 2 is based on Figure 1 A perspective view of a substrate carrier stack with substrates held by the substrate carriers and the base and cover removed.

[0135] Figure 3 is a top view of a substrate carrier for holding a substrate of a first subtype according to a second preferred embodiment of the present invention, which is similar to a substrate carrier comprising a substrate according to Figure 1 and Figure 2 The substrate carrier of the first preferred embodiment of the present invention of the substrate carrier stack is slightly different.

[0136] Figure 4A is based on Figure 3 A top view of a substrate carrier without a substrate, Figure 4Bis the corresponding attached figure, in Figure 4B The axes and vertices associated with the portions of the substrate carrier have been added, and Figure 4C 2 is a corresponding drawing of a substrate carrier of a second subtype according to a second preferred embodiment of the present invention.

[0137] Figure 5 is a perspective view of a substrate carrier without a substrate according to a third preferred embodiment of the present invention, which is slightly different from the first and second preferred embodiments of the present invention.

[0138] Figure 6 is a close-up cross-sectional perspective view of a substrate retaining arm of a substrate carrier, which can be one of the substrate carriers according to each of the preceding figures.

[0139] Figure 7 is based on Figure 5 A close-up side cross-sectional view of a substrate holding arm of FIG. 1 , wherein a substrate is held by a corresponding substrate carrier.

[0140] Fig. 8A and Figure 8B is a cross-sectional perspective view of a substrate carrier stack according to a fourth preferred embodiment of the present invention, which is slightly different from the substrate carrier stack and substrate carrier of the previous figures, wherein Figure 8B Schematically indicated is a horizontal purge flow within a substrate carrier stack through the spaces between individual substrates held by the substrate carriers.

[0141] Fig. 9 is based on Fig. 8A and Figure 8B Another cross-sectional perspective view of a substrate carrier stack.

[0142] Fig.10 is a side sectional perspective view of a substrate carrier stack together with a moving mechanism of an opener device according to a fourth preferred embodiment, wherein the substrate carrier stack is shown in an open state, in which a vertical gap exists between a lower substrate carrier of an upper portion of the substrate carrier stack and an upper substrate carrier of a lower portion of the substrate carrier stack.

[0143] Fig.11A and Fig. 11B is a perspective view of a substrate carrier according to a fifth preferred embodiment of the present invention, wherein Fig.11A is a perspective view showing the upper side of a substrate carrier and Fig. 11B is a diagram showing the underside / bottom side of a substrate carrier.

[0144] Fig. 12A is a top view of the upper side of the substrate carrier of the fifth preferred embodiment of the present invention, and Fig. 12B and Fig. 12C An enlarged detail thereof is shown.

[0145] Fig.13 is based on Fig. 12A Cross-sectional side view of the substrate carrier along the cross-sectional axis XIII-XIII.

[0146] Fig.14 is based on Fig. 12A Side view of the substrate carrier in viewing direction XIV.

[0147] Fig.15 It includes according to Fig. 12A Close-up side cross-sectional view of a portion of the substrate retaining arm of the substrate carrier in section XV-XV.

[0148] Fig.16 yes Fig.13 Detail from a close-up side section of XVI.

[0149] Fig.17A is a perspective view of a plurality of substrate carriers of a substrate carrier stack according to a fifth preferred embodiment of the present invention, wherein substrates are held by respective substrate carriers in the substrate carrier stack, and Fig. 17B is based on Fig.17A The cross section of the substrate corresponds to the cross section through Fig.17A The substrate carrier and Fig.17A Detail B is a cross-sectional side view of the peripheral edge of the substrate.

[0150] Fig.18A A top view of three substrate carriers superimposed on one another of a fifth preferred embodiment of the invention is shown for illustrating the suitable rotational positioning of the substrate carriers according to a preferred embodiment of the invention relative to a vertical axis in a stack of substrate carriers, and Fig.18B is a partial top view of substrate carriers stacked on top of each other.

[0151] Fig.19 is a side view of four such substrate carriers vertically displaced relative to each other but in an appropriate rotational position for forming a substrate carrier stack.

[0152] Fig. 20 is based on Fig.19 A perspective view of the vertex region of four substrate carriers stacked upon one another having mutually engaging positioning forming structures for achieving and maintaining proper relative positioning of the substrate carriers within the substrate carrier stack.

[0153] Fig.21 A substrate carrier stack is shown which comprises substrate carriers stacked on one another according to a fifth preferred embodiment together with a base and a cover of the substrate carrier stack.

[0154] Fig.22A is a side view of a substrate carrier stack, and Fig. 22B is based on Fig.22ADetail B is a close-up side view of the interface element provided in the form of a protrusion on the substrate carrier.

[0155] Fig.23 is a top view of an exemplary preferred embodiment of a base of a substrate carrier stack according to a fifth preferred embodiment of the present invention.

[0156] Fig.24 is based on Fig.23 Direction of observation in XXIV Fig.23 Schematic side view of the base.

[0157] Fig.25 is similar to Fig. 17B The four substrate carriers of the illustrated substrate are provided with Fig.24 Side view of the base together.

[0158] Fig.26 is a top view of the underside / bottom side of an exemplary preferred embodiment of a cover of a substrate carrier stack placed upside down in accordance with a fifth preferred embodiment of the present invention.

[0159] Fig. 27 is based on Fig.26 Side sectional view of the cover placed upwards in section XXVII-XXVII.

[0160] Fig.28 is similar to Fig. 17B The four substrate carriers of the substrate of the diagram are Fig. 27 A side sectional view of the cover together.

[0161] Fig.29A , Fig.29B , Fig.29C and Fig.29D Each is a schematic top view of the upper side of a substrate carrier according to a preferred embodiment of the invention.

[0162] Fig. 30A , Fig. 30B , Fig. 30C and Fig.30D Each is a schematic top view of the upper side of a substrate carrier according to a preferred embodiment of the invention. DETAILED DESCRIPTION

[0163] Figure 1is a perspective view of a first preferred embodiment of a substrate carrier stack 10, which includes a plurality of substrate carriers 12 stacked on each other, wherein the substrate carriers are stacked on a substrate carrier stack base 14 and a cover 16 of the substrate carrier stack is stacked on the substrate carriers. According to the terminology of, for example, US 2017 / 0372930A1, the substrate carrier stack 10 can be represented as a "substrate holder", which includes a plurality of separate "modules" (i.e., substrate carriers 12), a base 14 that can be represented as a "top module" or "cap" or "upper cap" or the like, and a cover 16 that can be represented as a "bottom module" or "bottom piece" or "bottom cap" or the like. In the absence of the base 14 and the cover 16, the stacked substrate carriers 18, i.e., a plurality of independent substrate carriers 12 stacked on each other, can be represented as a "stacked module".

[0164] According to a preferred embodiment of the present invention, the base 14 and the cover 16 can be considered to be included in the substrate carrier stack 10. This substrate carrier stack including the base 14 and the cover 16 can also be denoted as a "Tec-Cell". However, it should be noted that it may not always be necessary to provide and use a base and a cover. This will depend, for example, on the specific application in which the substrate carrier is used. Therefore, a plurality of independent substrate carriers 12 stacked on each other (i.e., substrate carriers 18 stacked without the base 14 and the cover 16) can also constitute a substrate carrier stack according to a preferred embodiment of the present invention.

[0165] Each of the substrate carriers can hold a respective substrate, such as a substrate in the form of a semiconductor wafer, as will become apparent hereinafter. A substrate carrier stack can include unrelated substrate carriers or substrate carriers of different types. Preferably, plenum structures for process or purge gases and sealing structures for isolating the internal environment of the substrate carrier stack and the substrates held therewith by the substrate carriers from the surrounding environment are implemented. Each of the substrate carriers, the base, and the cover can include structures that provide or cooperate to provide such plenum structures and sealing structures for the substrate carrier stack.

[0166] like Figure 1As shown, the base 14 can include a nozzle or connector 20, which can be connected to a gas supply or returner so that gas can be introduced into the internal environment so that the substrate interacts with the gas or is treated by the gas. The gas nozzle or gas connector 20 can belong to any design and be arranged differently, such as on any side of the base 14. A plurality of such nozzles or connectors 20 can be provided. In addition, the cover 16 can be provided with one or more gas nozzles or gas connectors, such as a gas nozzle or gas connector 22, alternatively or additionally. Preferably, at least two gas nozzles or gas connectors are provided in general so that gas circulation through the internal environment of the substrate carrier stack can be achieved. In a preferred embodiment of the present invention, two such nozzles or connectors are provided so that one of the nozzles or connectors can be an inlet nozzle, an inlet connector or a manhole for the gas, and the other can be a return or exhaust nozzle or a return or exhaust connector or an outlet for the gas. It can also be pointed out that the nozzle or connector can carry any gas or other product (such as a liquid) for any reason, and the nozzle or connector can be connected to another device, which can process, pressurize or provide gas or other products, and can be in any position. However, a particularly relevant application is subjecting substrates held by substrate carriers to a purge process which involves providing a purge gas flow through the substrates within a substrate carrier stack such that a nozzle or connector introduces the purge gas into the substrate carrier stack and exhausts the purge gas from the substrate carrier stack.

[0167] Figure 2 1 is a perspective view of a stacked substrate carrier 18 (ie, a plurality of individual substrate carriers 12 stacked on top of each other without the base 14 and the cover 16). Figure 2 As shown, each substrate carrier 12 is capable of holding a corresponding substrate 30. To this end, the substrate carriers 12 each include a plurality of substrate holding arms 32, which together define a substrate seat of the corresponding substrate carrier. According to a preferred embodiment of the present invention, the corresponding substrate carrier 12 includes four substrate holding arms 32.

[0168] A plurality 34 of substrates 30 held by substrate carriers 12 of a substrate carrier stack 10 are positioned in defined vertical positions with defined vertical spaces between vertically adjacent substrates. Depending on the usage scenario, not all substrate carriers of a substrate carrier stack may hold a corresponding substrate in its corresponding substrate holder. If all substrate carriers 12 of a substrate carrier stack 10 hold corresponding substrates of the same kind, it is preferred that these substrates are positioned by the substrate holders at equidistant vertical positions.

[0169] It should be noted that the substrate carrier can include any number of substrate holding arms to allow for appropriate holding of a substrate held by a substrate holder defined by the holding end of the substrate holding arm. Typically, it is preferred that each substrate carrier includes at least three substrate holding arms. Preferably, in the preferred embodiment shown in the figures, each substrate carrier provides four substrate holding arms. In principle, the substrate holding arms can be of any design.

[0170] It should not be excluded that in an alternative preferred embodiment the substrate carrier stack or its substrate carriers can be provided with a barrier so that each substrate can be separated or isolated from the substrate above or below in the substrate carrier stack. The barrier, which preferably should not contact the substrate, can provide protection for the substrate so that in the event that the substrate may be contaminated or in the event that the substrate is cracked or broken, material from the contaminated or broken substrate does not fall onto or contaminate other substrates. Such a barrier can be formed integrally with the respective substrate carrier or can be a separate element included in the substrate carrier stack.

[0171] Figure 3 FIG. 1 is a top view of a substrate carrier 12 holding a substrate 30 according to a second preferred embodiment of the present invention. Figure 1 and Figure 2 The substrate carrier 12 of the substrate carrier stack 10 of the first preferred embodiment shown in FIG. 1 differs only slightly, so that the same reference numerals are used for both preferred embodiments. Figure 4A is a top view of the substrate carrier of the second preferred embodiment without the substrate.

[0172] Similar to the substrate carrier 12 of the first embodiment, the substrate carrier 12 of the second preferred embodiment includes an outer carrier frame 40, which includes four frame webs 42a, 42b, 42c and 42d, which are integrally connected in pairs at corresponding frame vertex regions of the outer carrier frame. The four frame vertex regions of the outer carrier frame 40 are indicated by reference numerals 44a, 44b, 44c and 44d. Figure 4B As shown, the frame webs extend along associated frame web axes Aa, Ab, Ac and Ad which intersect at right angles in pairs at respective vertices associated with respective vertex regions. Figure 3 , Figure 4A As is apparent from the other figures, where the preferred embodiment is shown as being generally square or rectangular, the outer carrier frame is at least generally square or rectangular. Figure 4B The frame web axes Aa, Ab, Ac and Ad and the vertices Va, Vb, Vc and Vd are shown, which can be easily compared with Figure 3 and Figure 4AThe frame web and frame apex regions of the outer carrier frame 40 of the substrate carrier 12 are associated.

[0173] The substrate carrier 12 of the second preferred embodiment is similar to the substrate carrier 12 of the first preferred embodiment and comprises four substrate holding arms 32 which are designated with individual reference numerals 32a, 32b, 32c and 32d and which form substrate seats for substrates with their respective free holding ends. The free holding ends may also be indicated as seats of the respective substrate holding arms. Figure 4A As shown, four substrate holding arms 32a, 32b, 32c and 32d protrude inwardly from the outer carrier frame 40 in a direction toward or approximately toward the center of the substrate holder. The length of the arm can be any length. For example, the length of the arm can be determined by the expected substrate size. In addition, in a preferred embodiment of the present invention, the arm and the substrate carrier are made in a single mold or piece so that the length is fixed. However, in other preferred embodiments of the present invention, it should not be excluded that the substrate holding arm can be adjustable via a suspension portion or an extension.

[0174] It may be appropriate that the substrate carrier 12 includes guides or latches or other forming structures along its outer side, top side and bottom side, so that the guides can interact with the lower or upper substrate carrier in the substrate carrier stack including the substrate carrier, so that the substrate carriers are fixed or interact when stacked so that the stack does not fall or become misaligned. In addition, the appropriate and predefined relative positioning of two substrate carriers in such a pair of vertically adjacent substrate carriers can be ensured or facilitated by such guides or latches or other forming structures, which can be of any type, any number and on either side of the module. According to a preferred embodiment of the present invention, at least one protrusion of a substrate carrier fits into an opening or recess in the lower or upper substrate carrier, so that the two substrate carriers become able to resist lateral movement. In addition, the appropriate and predefined relative positioning and orientation of each substrate carrier in such a pair of vertically adjacent substrate carriers and correspondingly all substrate carriers of the substrate carrier stack can be ensured or facilitated in this way.

[0175] For example, as shown in the figures, the substrate carrier 12 can be provided with protrusions 50a, 50b and recesses or openings 52a, 52b. A first pair of protrusions 50a and adjacent recesses or openings 52a and a second pair of protrusions 50b and adjacent recesses or openings 52b are arranged at diametrically opposed frame vertex regions 44a and 44c of the outer carrier frame 40. Each protrusion 50a, 50b can protrude into a corresponding corresponding opening or recess of a vertically adjacent upper substrate carrier stacked on the corresponding substrate carrier, and a corresponding corresponding protrusion of a vertically adjacent lower substrate carrier on which the corresponding substrate carrier is stacked can protrude into each opening or recess 52a, 52b. Preferably, as shown in the figures, upwardly protruding protrusions are assumed. However, alternatively, downwardly protruding protrusions are possible. In this case, each protrusion can protrude into a corresponding corresponding opening or recess of a vertically adjacent lower substrate carrier on which the corresponding substrate carrier is stacked, and a corresponding corresponding protrusion of a vertically adjacent upper substrate carrier stacked on the corresponding substrate carrier can protrude into each opening or recess. A combination of upwardly and downwardly protruding protrusions is also possible.

[0176] In principle, the protrusions and recesses or openings can be of any number and can be on any side or position on the respective substrate carriers. As discussed above, these protrusions can also assist in the self-centering and self-alignment capabilities of each substrate carrier with the underlying or upper substrate carriers, as well as assist in resisting lateral movement and de-alignment.

[0177] Figure 3 , Figure 4A and Figure 4B The arrangement of the protrusions 50a, 50b and recesses or openings 52a, 52b shown in is such that in a substrate carrier stack comprising identical substrate carriers stacked on one another, the protrusions of all substrate carriers are vertically aligned and the recesses or openings of all substrate carriers are vertically aligned so that no protrusion can engage with an associated recess or opening of a vertically adjacent lower or upper substrate carrier. This also applies when the substrate carriers are alternately stacked on one another in relative rotational positions corresponding to a rotation of 180 degrees about a vertical rotation axis so that the frame vertex areas 44a and 44c are alternately positioned above one another at diametrically opposite vertical edge areas of the substrate carrier stack. Obviously, at least two subtypes of substrate carriers are required, namely Figure 3 , Figure 4A and 4B The first subtype of substrate carrier 12 shown in FIG. Figure 4C A second subtype of substrate carrier 12 ′ is shown in FIG.

[0178] The second subtype of substrate carrier 12' comprises a first pair of protrusions 50a' and adjacent recesses or openings 52a' and a second pair of protrusions 50b' and adjacent recesses or openings 52b', which are arranged at diametrically opposed frame vertex areas 44a and 44c of the outer carrier frame 40, similar to the implementation of the first subtype of substrate carrier 12. However, compared with the first subtype of substrate carrier 12, the second subtype of substrate carrier 12' has interchanged positions of protrusions and recesses or openings. In the substrate carrier stacking, the two subtypes of substrate carriers 12 and 12' must be stacked alternately with each other so that each protrusion can protrude into the associated recess or opening of the vertically adjacent upper substrate carrier and the advantages discussed above can be achieved. In addition to the reference numerals 12', 50a', 52a' and 52b', the same reference numerals used for the first subtype of substrate carrier 12 are also used for the second subtype of substrate carrier 12', because preferably, there are no further differences between the two subtypes. In the following description, when referring to a “substrate carrier 12 ” of a substrate carrier stack, the reference numeral 12 may relate to a substrate carrier 12 of the first subtype as well as to a substrate carrier 12 ′ of the second subtype.

[0179] The substrate carriers 12, 12' according to both subtypes comprise specific formations at the outer periphery of the outer carrier frame 40, in the present case protrusions 54a, 54b, 54c and 54d, which protrude in lateral or horizontal direction and allow interaction means or mechanisms (e.g. handling, supporting or moving means or mechanisms) to interact with corresponding substrate carriers in the stack of substrate carriers. For example, as shown below in Fig.10 The mobile mechanism of the opener device exemplified in the context of can interact with the corresponding substrate carrier by engaging with such a protrusion. Therefore, these formations can be generally represented as "interface formations", and in the present case as "interface protrusions".

[0180] In the present case, there are four such interface protrusions 54a, 54b, 54c and 54d, which are located at the frame apex regions 44a, 44b, 44c and 44d, respectively. A first type of these protrusions, namely protrusions 54a and 54d, are located at the frame apex regions 44a and 44d and protrude in a lateral direction relative to the frame web 42d, while a second type of these protrusions, namely protrusions 54b and 54c, are located at the frame apex regions 44b and 44c and protrude in a lateral direction relative to the frame web 42b, such that the first type of protrusions and the second type of protrusions protrude in opposite directions from the outer carrier frame 40. The second type of protrusions 54b and 54c are located slightly more inwardly along the frame web axis Ab at the respective frame apex regions than the first type of protrusions 54a and 54d are located along the frame web axis Ad at the respective frame apex regions. This allows substrate carriers 12, 12' according to the two subtypes to be stacked alternately with each other to achieve horizontally staggered interface protrusions, as for the corresponding preferred embodiment of the present invention. Fig. 8A , Figure 8B , Fig. 9 and Fig.10 For this purpose, two subtypes of substrate carriers are stacked on top of each other in a relatively rotated relative position based on a rotation of 180° around a vertical axis, so that alternating first type and second type interface protrusions protrude from the substrate carrier stack in the lateral direction and do not overlap or only slightly overlap in the vertical direction. This facilitates the engagement of the above-mentioned interaction means or mechanisms with the corresponding substrate carriers of the substrate carrier stack.

[0181] like Fig.29A , 29B As shown in FIGS. 29A, 29B, 29C, 29D, 30A, 30B, 30C and 30D, the protrusions 54a, 54b, 54c and 54d and the substrate holding arms 32a, 32b, 32c and 32d can be formed in various configurations.

[0182] It should be noted that Figure 1 and Figure 2 The substrate carriers 12 of the substrate carrier stack 10 of the embodiment of the present invention comprise different kinds of interface protrusions which protrude from the outer carrier frame of the respective substrate carrier in the lateral or horizontal direction. Figure 1 and Figure 2 In the arrangement shown in , corresponding interface protrusions of the same type protrude from the corresponding frame web or the corresponding frame vertex area of ​​the corresponding substrate carrier and completely overlap in the vertical direction. It can be assumed that this is Figure 1 and Figure 2 The preferred embodiment of Figure 3 , Figure 4A , Figure 4B and Figure 4CThe only relevant difference between the preferred embodiments of Figure 3 , Figure 4A , Figure 4B and Figure 4C The foregoing and following detailed description of the substrate carriers 12, 12' may be understood as also Figure 1 and Figure 2 Description of corresponding details of a corresponding substrate carrier 12 of a first subtype and a corresponding substrate carrier 12 ′ of a second subtype of a substrate carrier stack.

[0183] The substrate carrier of the preferred embodiment of the present invention discussed above is provided with dividing webs 60a and 60b, which divide the inner region 62 of the respective substrate carrier 12, 12' into a plurality of openings. The outer carrier frame 40 extends around the inner region, and the dividing webs 60a and 60b extend between the frame webs 42a and 42c and are integrally connected to these frame webs 42a and 42c, so that a large inner opening 64 and two pairs of smaller inner openings 66a, 66b and 68a, 68b are formed. The large inner opening 64 is positioned between a first pair of smaller inner openings 66a, 66b extending between the frame web 42d and the dividing web 60a and a second pair of smaller inner openings 68a, 68b extending between the frame web 42b and the dividing web 60b. For example, the smaller inner openings have the same or corresponding symmetrical shapes, as shown in the respective figures. Preferably, for stability reasons, the separating webs 60a and 60b are integrally connected to the respective adjacent frame webs 42d and 42b at the middle region, respectively, so that a respective pair of smaller inner openings is obtained. Alternatively, if such an integral connection with the adjacent frame webs is not included at the middle region of the respective separating web, the respective larger inner openings 64 can be provided on both sides.

[0184] The large inner opening 64 of the substrate carrier 12, 12' defines an inner receiving space of the substrate carrier stack including the substrate carrier 12, 12'. In the inner receiving space, the substrate or semiconductor wafer is held by the corresponding substrate carrier, such as Figure 2 And there are also some other things to be discussed below Fig. 8A , Figure 8B and Fig. 9 The substrate or wafer is held in an inner region of the inner receiving space which is defined in opposite lateral directions by the respective arcuate portions of the separating webs 60a and 60b of the substrate carriers 12, 12' of the substrate carrier stack. Figure 3 As shown, the arcuate portion of the separating web has a radius of curvature adapted to the diameter of the substrate or wafer, so that the arcuate portion Figure 3 The substrate or wafer extends along a portion of the outer periphery of the substrate or wafer at a small defined radial distance in the top view of the figure. This distance can be significantly smaller than indicated in the figure.

[0185] The smaller inner openings 66a, 66b and 68a, 68b of the substrate carriers define purge gas distribution channels or purge channels 70 and 72 of the substrate carrier stack, such as Figure 3 The channel 70 can include a pair of channels 70a and 70b corresponding to the smaller inner openings 66a and 66b, and the channel 72 can include a pair of channels 72a and 72b corresponding to the smaller inner openings 68a and 68b, as shown. Figure 4A One of these distribution channels 70 and 72 (or channel pairs 70a, 70b and 72a, 72b) can define and function as a supply channel (or as a pair of supply channels), and the other can define and function as a removal or collection channel (or as a pair of removal or collection channels).

[0186] As shown, these channels or channel pairs are arranged diagonally relative to each other or in opposite lateral directions so that the substrates or wafers are arranged between these channels in the substrate carrier stack. In general, the design is not limited to the design shown in the various figures. The channels can be of any number, size and design as shown or as would be expected by a person skilled in the art. In addition, the channels can assist in distributing the gas to the substrates in any way so that air or purge gas can be provided to each substrate in a laminar manner, for example Figure 8B Schematically or symbolically shown in.

[0187] In particular, and with reference to Figure 1 , each of the channels or channel pairs can be connected in the substrate carrier stack to a corresponding nozzle or connector of the substrate carrier stack, such as the nozzle or connector 20 of the base 14 and the corresponding further nozzle or connector 22 of the cover 16, so that the substrates held by the substrate carriers can be subjected to a purge process as discussed above. The purge gas is delivered to the substrates via one of the channels or channel pairs so that the purge gas passes between adjacent substrates held by the corresponding substrate carriers within the substrate carrier stack and is collected by the other of the channels or channel pairs after having passed between the substrates, such as Figure 8B Schematically or symbolically shown in.

[0188] Figure 5 is a perspective view of a third preferred embodiment of the present invention of a substrate carrier according to a preferred embodiment of the present invention, shown without a substrate held by a substrate holding arm. This preferred embodiment differs only slightly from the first and second preferred embodiments.

[0189] Similar to the first and second preferred embodiments, Figure 5The substrate carrier 12 shown in the figure includes four substrate holding arms 32a, 32b, 32c and 32d. In the perspective view, it can be seen that there are substrate holding arms and how they are arranged and formed. In particular, it can be seen how the substrate holding arms extend inwardly and upwardly from the outer carrier frame 40 to define a substrate seat positioned at a certain vertical distance above the upper boundary of the outer carrier frame 40. Consistent with the terminology of US 2017 / 0372930A1, the outer carrier frame 40 can also be represented as a "holder body". According to alternative terminology, the term "substrate carrier body" is also suitable.

[0190] In this perspective view, it can be seen that the arm 32b is arched upward at point 64 and includes a free retaining end or seat at a point higher than the connection point of the arm to the outer carrier frame 40. It can be noted that the angle, length and degree of the arch and seat relative to the outer carrier frame can have any characteristics. In addition, when stacked, the upper or lower retainer and substrate can be offset from the lower substrate via the arm so that the substrates do not contact or contaminate each other, and so that a small distance, such as for example 0.5mm, can be maintained between the substrates. It should also be noted that the arch allows the considerable weight of the stack to be transferred from substrate carrier to substrate carrier in the substrate carrier stack, rather than being transferred through the substrate or the arm itself.

[0191] Figure 6 The substrate holding arm is one or all of the preferred embodiments described above (e.g., according to Figure 5 A close-up cross-sectional view of a substrate holding arm 32b of the preferred embodiment shown in FIG. The other three substrate holding arms of this preferred embodiment and the substrate holding arms of other preferred embodiments can be similarly shaped at their upper and inner ends defining the respective substrate holders.

[0192] Figure 6 A section of the substrate holding arm 32b is shown. This section of the arm includes an upper arcuate portion 64 and a seat portion 66 at the free end. Figure 6 As shown, the upper surface of the seat 66 can be slightly angled downward in two opposite lateral directions from the upper median line extending inward. Generally, the upper surface of the seat can be curved into a convex shape in the peripheral direction (relative to the outer edge of the substrate) or in the lateral direction. In principle, the upper arch 64 can have any suitable angle, degree or length, and the seat 66 can have any suitable length. The arm section between the upper arch 64 and the seat 66 can include a slight longitudinal projection 67, which can assist in keeping the substrate in a defined position resting on the formed substrate seat, hindering the substrate from being moved, pushed or otherwise inadvertently or accidentally removed from its proper position on the seat 66.

[0193] Figure 7 yes Figure 632b, wherein a substrate 30 is present and held on a substrate seat defined by the holding arm of the corresponding substrate carrier and the seat portion 66 of the other substrate holding arm. Figure 7 As shown, the seat 66 can be angled downwardly and inwardly relative to the rest of the structure of the substrate holding arm 32 and the substrate 30. Together with the embodiment mentioned that the seat 66 includes an upper midline from which the upper surface of the seat 66 extends slightly downwardly in two opposite lateral directions, this provides for the realization of a contact point or minute contact patch 69 between the substrate 30 and the seat 66.

[0194] In general, it is recommended to make the contact point or contact piece 69 as small as possible to reduce scratches and contamination on the substrate and allow the contact point or contact piece 69 to be positioned at the farthest edge of the substrate so that the lower surface of the substrate is not or is unlikely to be contaminated or contacted by the substrate holding arm at any other point. In addition, the longitudinal protrusion 67 can protrude closer to the outer periphery of the substrate 30 to form a stopper that limits the accommodation space of the formed substrate holder in the radial direction so that the substrate reaches and maintains a defined position on the substrate holder.

[0195] Fig. 8A and Figure 8B is a perspective cutaway view of a fourth preferred embodiment of a substrate carrier stack (or "substrate holder") comprising a plurality of substrate carriers (or "modules") according to preferred embodiments of the present invention. However, it may be assumed that the substrate carriers are not identical to the substrate carriers according to the preferred embodiments of the present invention. Figure 3 , Figure 4A , Figure 4B and Figure 4C The corresponding substrate carrier 12 of the first subtype or the corresponding substrate carrier 12' of the second subtype is substantially the same or very similar, so that the Fig. 8A and Figure 8B The substrate carrier stack 10 according to the second preferred embodiment is understood to be an example. The substrate carrier stack 10 comprises a cover 16 stacked on a substrate carrier 12. The cover 16 can be connected to Figure 1 The cover 16 of the preferred embodiment shown in is substantially identical or very similar. Furthermore, the substrate carrier stack 10 comprises a base 14 on which the substrate carriers 12 are stacked. This base 14 is only shown schematically. In principle, the base 14 can be connected to Figure 1 The base 14 of the preferred embodiment shown in FIG. 1 is substantially the same or very similar to the base 14 of the preferred embodiment shown in FIG.

[0196] Similar to the preferred embodiment described above, the substrate carrier stack 10 uses the substrate carrier 12 to hold the substrate or wafer within the internal storage space of the substrate carrier stack in a limited space configuration, so that the substrate carrier stack can store or accommodate many substrates in a limited space, and each substrate and substrate carrier is centered and aligned. As described based on the second preferred embodiment of the present invention, the substrate carrier can be designed to allow air or gas to flow through the internal purge gas distribution channel of the substrate carrier stack 10, which is defined by openings, such as openings 66 and 68 (or opening pairs 66a, 66b and 68a, 68b) of the substrate carrier. These purge gas distribution channels (one of which is in Fig. 8A The cover 16 and the base 14 are provided with a purge gas distribution and connection structure to connect the corresponding gas nozzle or gas connector with at least one associated vertical internal purge gas distribution channel of the substrate carrier stack 10. The inner space of this structure 73 of the cover 16 can be connected to the gas nozzle or gas connector 22 via a horizontal gas distribution channel 74. The input purge gas flow and the output purge gas flow are connected in Figure 8B 76 and 78, and the resulting vertical and horizontal purge gas flows are symbolically represented by further arrows. The gas distribution and connection structure and the vertical and horizontal passages enable or facilitate laminar purge gas flow passing horizontally between adjacent substrates held within a substrate carrier stack.

[0197] In the preferred embodiment, the supplied incoming purge gas flow 76 can enter the gas inlet (or "gas nozzle" or "gas connector" according to the above terminology) 22 and can then enter the vertical internal purge gas distribution channel of the substrate carrier stack via the gas distribution channel 74 and via the interior space of the structure 73 of the cover 16, similar to Fig. 8AThe purge gas distribution channel 70 shown. In this way, the supplied purge gas can be distributed in the lateral and vertical directions to penetrate and flow horizontally toward the substrate and through the space between adjacent substrates held within the internal accommodation space of the substrate carrier stack. Preferably, a laminar and uniform purge gas flow across the substrates held by the substrate carrier is achieved so that the purge gas can interact with the corresponding substrate and perform one or more desired functions, such as cleaning processes, etc. The gas flow can then enter the other vertical internal purge gas distribution channel 70 of the substrate carrier stack and can be further discharged toward the gas outlet (or "gas nozzle" or "gas connector" according to the above terms) 20 via another structure of the gas flow exit recess or base 14 to be pushed into the gas outlet 20, where the purge gas can leave the substrate carrier stack 10 as an exhaust purge gas 78. The exhausted gas may be contaminated and can be subjected to appropriate further processing, release, reuse, recycling and the like.

[0198] Fig. 9 is a further perspective cross-sectional view of a substrate carrier stack according to FIG8 . The base 14 is schematically shown to include a recess or cavity 80 which can serve as a purge gas distribution and connection structure of the base to exhaust the purge gas or, alternatively, to allow the purge gas to enter in the case of a reverse purge gas flow through the substrate carrier stack. Such gas distribution and connection structures at the entry side and at the exit side together with the mentioned vertical internal purge gas distribution channels can enable or contribute to a laminar purge gas flow passing horizontally between adjacent substrates held within the substrate carrier stack. Additional or alternative laminarizing structures can preferably be arranged at the entry side or the exit side of the substrate carrier stack or at both of these sides, preferably integrated into the base 14 and / or the cover 16, respectively.

[0199] Fig.10 is a cross-sectional perspective view of a substrate carrier stack 10 according to a preferred embodiment of the present invention, for example, similar to Fig. 8A , Figure 8B and Fig. 9 The preferred embodiment of the substrate carrier stack shown in FIG. 1 includes a plurality of substrate carriers as described above with reference to FIG. Figure 3 , Figure 4A , Figure 4B and Figure 4C Two subtypes of substrate carriers 12 and 12' are described. Fig.10, the substrate carrier stack is shown in a partially unstacked open state, together with the moving mechanism of the opener device 82, for opening a loading and unloading gap between two adjacent substrate carriers, so that a corresponding substrate 30 can be loaded on a lower substrate holder of the two adjacent substrate carriers, or so that a corresponding substrate 30 can be unloaded from the substrate holder. Such a substrate holder is represented by a substrate holding arm 32 supporting the substrate 30. For unloading or loading the substrates, a suitable loading and unloading arm arrangement can be provided, such as, for example, a robot arm device.

[0200] The moving mechanism can include support and moving arms 84 positioned at different sides or corners of the substrate carrier stack, which can interact with corresponding selected substrate carriers of the substrate carrier stack. A plurality of such arms can be provided, i.e., for example, consisting of Fig.10 The support and moving arms 84 and 86 shown in the figure represent a set of two such arms. The respective arms can be adapted to engage with associated specific protrusions of the first and second types of interface protrusions 54a, 54b, 54c and 54d, which protrude in a lateral or horizontal direction from the respective frame web or frame vertex region of the substrate carrier. In the case of vertically adjacent arms 84 and 86, one of the arms can be adapted to engage the first type of protrusion 54a of the respective substrate carrier and the other of the arms can be adapted to engage the second type of protrusion 54c of the respective substrate carrier.

[0201] By providing a corresponding set of these supporting and moving arms, a loading and unloading gap between two adjacent substrate carriers can be opened as mentioned, so that a lower partial substrate carrier stack and an upper partial substrate carrier stack are provided. Fig.10 As shown, a corresponding group of arms can carry an upper plurality of substrate carriers stacked on top of one another, which are located at a vertical distance from a lower plurality of substrate carriers stacked on top of one another.

[0202] It should be noted that Fig.10 The view of shows only one corner of the substrate carrier stack 10, and similar arms and structures can be provided at the other corner of the substrate carrier stack or at each corner of the substrate carrier stack, as already mentioned. The arm can travel up and down along the vertical extent of the substrate carrier stack, for example on a pneumatic slide, or for example by using a conveyor or belt and gear mechanism, etc. The arm can be operated to assume an engaged state to engage with the corresponding protrusions of the first and second types of the substrate carrier, and to assume a disengaged state to disengage or not engage from the corresponding protrusions of the first and second types of the substrate carrier, so that a desired pair of adjacent ones of the substrate carriers can be selected and opened to have a loading and unloading gap between them.

[0203] In the following, based on Fig.11A , Fig. 11B and the following figures describe a substrate carrier according to a fifth preferred embodiment and a substrate carrier stack comprising a plurality of substrate carriers of this kind. Fig.11A and Fig. 11B as well as Fig. 12A , Fig. 12B , Fig. 12C and Figures 13 to 16 The individual substrate carrier 112 and its details are shown, and Fig.17A and Fig. 17B , Fig.18A and Fig.18B , Fig.19 and Fig. 20 A plurality of substrate carriers 112 and substrates 130 and their cooperation and interaction within a substrate carrier stack 110 are shown and described. Figures 1 to 10 The reference numerals of the foregoing description of the preferred embodiments are used for similar or like elements, respectively increased by 100. If not otherwise stated, the foregoing description of the first to fourth preferred embodiments also applies to the fifth preferred embodiment, so that the following description can focus on the differences between the fifth preferred embodiment and the foregoing preferred embodiments, and focus on describing further structural details, which can also be applied to the foregoing preferred embodiments.

[0204] Similar to the aforementioned preferred embodiment, the substrate carrier 112 includes an outer carrier frame 140. The outer carrier frame 140 includes a first frame web 142a, a second frame web 142b, a third frame web 142c, and a fourth frame web 142d, which are merged in pairs at a first frame vertex region 144a, a second frame vertex region 144b, a third frame vertex region 144c, and a fourth frame vertex region 144d, respectively, so as to form an integral outer carrier frame 140. In addition, a first pair of substrate holding arms 132a and 132b integrally formed with the first frame web 142a protrude inwardly from the first frame web 142a, and a second pair of substrate holding arms 132c and 132d integrally formed with the third frame web 142c protrude inwardly from the third frame web 142c.

[0205] All of these structural details, including the at least roughly or even substantially square or at least rectangular shape of the substrate carrier 112, correspond to the corresponding structural details of the substrate carrier of the aforementioned preferred embodiment. However, the positioning of the substrate holding arms relative to each other and along their respective frame webs is arranged in a particular symmetrical and asymmetrical manner. The substrate holding arms 132a and 132d are positioned symmetrically relative to each other and relative to the respective adjacent frame vertex regions 144a and 144d, and the substrate holding arms 132b and 132c are positioned symmetrically relative to each other and relative to the respective adjacent frame vertex regions 144b and 144c, while the substrate holding arms 132a and 132b are positioned asymmetrically relative to each other and relative to the respective adjacent frame vertex regions 144a and 144b, and the substrate holding arms 132d and 132c are positioned asymmetrically relative to each other and relative to the respective adjacent frame vertex regions 144d and 144c.

[0206] More specifically, all four substrate holding arms are oriented inwardly from the outer carrier frame in a corresponding or similar manner to a more or less diametric or diagonal direction, and substrate holding arms 132a and 132d have the same distance from the corresponding immediately adjacent frame vertex regions 144a and 144d at their respective merging points to the corresponding frame webs, and substrate holding arms 132b and 132c have the same distance from the corresponding immediately adjacent frame vertex regions 144b and 144c at their respective merging points to the corresponding frame webs. However, substrate holding arms 132a and 132b and similarly substrate holding arms 132d and 132c have different distances from the corresponding immediately adjacent frame vertex regions at their respective merging points to the corresponding frame webs. The corresponding angular positions α and β relative to the section line XIII-XIII of the four substrate holding arms are Fig. 12A , where the angle α is smaller than the angle β. This is a significant difference relative to the previous embodiment.

[0207] Similar to the previous preferred embodiments, the substrate carrier according to the fifth preferred embodiment includes a first dividing web 160a and a second dividing web 160b, which divide the inner region 162 of the substrate carrier 112 into a large inner opening 164 and a first pair of smaller inner openings 166a and 166b and a second pair of smaller inner openings 168a and 168b. These dividing webs are integrally formed with the outer carrier frame 140, and the first dividing web 160a merges into the first frame web 142a at one end between the first substrate holding arm 132a and the adjacent frame vertex region 144a, and merges into the third frame web 142c at the other end between the fourth substrate holding arm 132d and the adjacent frame vertex region 144d. Similarly, the second divider web 160b merges into the first frame web 142a at one end between the second substrate retaining arm 132b and the adjacent frame apex region 144b and merges into the third frame web 142c at the other end between the third substrate retaining arm 132c and the adjacent frame apex region 144c.

[0208] Similar to the aforementioned preferred embodiment, the first dividing web 160a includes a first arcuate portion 202a, and the second dividing web 160b includes a second arcuate portion 202b. The first arcuate portion 202a is connected to the first frame web 142a, the third frame web 142c through three connecting portions 200a of the first dividing web 160a, and is connected to the fourth frame web 142d in the middle area of ​​the first arcuate portion 202a. Therefore, two smaller inner openings 166a and 166b are provided between the first dividing web 160a and the fourth frame web 142d, instead of only one smaller inner opening. However, according to an alternative preferred embodiment, the latter is in principle possible. Correspondingly, the second arcuate portion 202b of the second dividing web 160b is connected to the first frame web 142a, the third frame web 142c via three connecting portions 200b, and is connected to the second frame web 142b at the middle area of ​​the second arcuate portion 202b. Thus, two smaller inner openings 168a and 168b are provided between the second separating web 160b and the second frame web 142b instead of just one smaller inner opening. However, the latter is in principle possible according to an alternative preferred embodiment.

[0209] Similar to the above preferred embodiments, as shown in the figures, the diametrically opposed frame vertex regions (i.e., for example, the first frame vertex region 144a and the third frame vertex region 144c) are provided with positioning formations, i.e., positioning protrusions and positioning recesses or positioning openings. In the present preferred embodiment, the first frame vertex region 144a is provided with a pair of protrusions 150a and openings or recesses 152a. Fig. 12A Details in B and Fig. 12BAs shown in FIG. 1 , the third frame vertex region 144c is provided with a pair of protrusions 150b and recesses or openings 152b, Fig. 12A Details in C and Fig. 12C Shown in.

[0210] However, the two protrusions 150a and 150b are positioned on one side of the straight line L which is located at Fig. 12A diametrically extending between the first frame vertex region 144a and the third frame vertex region 144c above the drawing plane, and the openings or recesses 152a and 152b are positioned on the other side of the straight line L. This arrangement enables the protrusion 150a of the corresponding substrate carrier 112 to protrude into the opening or recess 152b of another substrate carrier 112 of the same type stacked thereon in an appropriate relative rotational position, and the protrusion 150b to protrude into the opening or recess 152a of the other substrate carrier 112 appropriately stacked thereon. In order to enable this mutual engagement between the protrusions 150a and 150b of the lower substrate carrier and the openings or recesses 152a and 152b of the upper substrate carrier of the same type, the two substrate carriers are to be stacked on each other in alternating relative rotational positions corresponding to a rotation of 180° about the vertical rotation axis. In this way, a substrate carrier stack can be formed by providing such alternating relative rotational positions between pairs of adjacent substrate carriers 12 in the substrate carrier stack 110. This is described below with reference to Figures 18, Fig.19 and Fig. 20 Further explanation: Thus, the substrate carrier stack 110 can comprise only one type of substrate carrier 112, without the need to provide at least two sub-types of substrate carriers.

[0211] With regard to these positioning forming structures that ensure proper relative positioning of vertically adjacent substrate carriers 112 within the substrate carrier stack 110, in the present case comprising protrusions 150a and 150b and openings or recesses 152a and 152b, it is preferred that these positioning forming structures are designed so that certain dimensional variations between substrate carriers of the same type caused by manufacturing tolerances and, if applicable, varying relative dimensions between substrate carriers caused by temperature differences between two substrate carriers or parts thereof can be tolerated. To this end, the openings or recesses 152a and 152b can include an opening width that is slightly larger than the lateral extension of the protrusions 150a and 150b. For example, if the protrusion is centrally positioned within the recess or opening, a gap of 0.25 mm can be provided between the outer periphery of the protrusion and the inner periphery of the opening or recess. In order to allow for larger dimensional deviations that may accumulate over the range of the frame web, at least one of the openings or recesses is formed to have a relative width along a diagonal or diametrical direction (e.g., such as by Fig. 12A The shape of the longitudinal extension of the direction given by the line L in the figure. Fig. 12BAs shown, Fig. 12C In contrast, the opening or recess 152a is dimensioned in this manner. For example, if the protrusion 150b of the lower substrate carrier is centrally positioned within the opening 152a, there can be a gap of 0.25 mm on both sides in the lateral direction between the protrusion 150b and the inner periphery of the opening or recess 152a, and a gap of 1 mm on both sides in the diagonal or diametric direction between the outer periphery of the protrusion 150b and the inner periphery of the longitudinally extending opening 152a. Having such a longitudinal extension of the opening for only one of the two openings provides the advantage that the engagement between the protrusion 150a of the lower substrate carrier and the opening 152b of the upper substrate carrier can define and act as a rotation center to bring the protrusion 150b of the lower substrate carrier into engagement with the opening 152a of the upper substrate carrier simply by rotating the upper substrate carrier relative to the lower substrate carrier.

[0212] It should be noted that there are other possibilities so that a plurality of substrate carriers of the same type (without any subtype) can be stacked on top of each other with mutual engagement of corresponding positioning forming structures (e.g. protrusions and openings or recesses), even without the need to rotate the substrate carriers relative to the vertical axis in the manner explained above. For example, an upward protrusion positioned at a certain point on the upper side of the substrate carrier can be accompanied by a recess at a matching point on the lower side of the substrate carrier, so that such protrusions and associated recesses of a plurality of substrate carriers are vertically aligned. In principle, such an arrangement is not excluded, but an arrangement that provides the requirement for mutual rotation of the substrate carriers relative to each other in the sense described leads to further advantages. For example, one advantage is that the mutual rotation of the substrate carriers relative to each other can compensate for or at least reduce negative effects that may be caused by production inaccuracies of the substrate carriers. Otherwise, production inaccuracies that affect the vertical extent of the corresponding substrate carriers at a certain point or area may be added continuously at the same angular position of the stack of substrate carriers, so that a significant tilting of the stack of substrate carriers may potentially be caused. A more important advantage is achieved based on the specific arrangement of the substrate holding arms mentioned, because in this way a vertical overlap of vertically adjacent substrate holding arms can be avoided, as will be described below based on Fig.18A , Fig.18B and Fig.19 This allows substrate carriers held in substrate holders of adjacent substrate carriers to be positioned at a relatively small vertical distance from one another, thereby allowing a high storage density for substrates in a stack of substrate carriers of this kind. This is also achieved by Fig.11A , Fig.13 , Fig.14 and Fig.15 The shape of the substrate holding arm of the fifth preferred embodiment is based on Figure 5 , Figure 6 and Figure 7The substrate holding arms of the fifth preferred embodiment extend less upward than the substrate holding arms of the previous preferred embodiments, so that the substrate holder is positioned at a lesser height above the upper edge of the outer carrier frame 140 than the substrate holders of the substrate holding arms of the previous preferred embodiments are positioned above the upper edge of the outer carrier frame 40.

[0213] The described inner openings 164, 166a, 166b, 168a and 168b define an inner accommodation space of the substrate carrier stack 110 similar to the corresponding openings of the previous embodiment, which accommodates the substrate 130 of the substrate carrier stack 110 and the first inner vertical purge channel or purge gas distribution channel 170a, 170b and the second inner vertical purge channel or purge gas distribution channel 170a, 170b on two opposite sides of the portion of the inner accommodation space where the substrate 130 is located. In this regard, reference can be made to the above explanations based on the previous embodiment. In addition, appropriate sealing engagement between the outer carrier frames 140 of the vertically adjacent substrate carriers 112, between the lowermost substrate carrier and the base 114, and between the uppermost substrate carrier and the cover 116 is preferred so that appropriate purge gas flow is achieved without loss and contamination from the external environment of the substrate carrier stack 110. To this end, each substrate carrier 112 is provided with a sealing lip or sealing ridge 204 extending around the inner region 162 of the substrate carrier at the underside of the outer carrier frame 140. Preferably and implemented according to the preferred embodiment shown, the sealing lip 204 is positioned adjacent to or at the inner edge of the outer carrier frame 140. In the preferred embodiment shown, for example, Fig.13 , Fig.15 , Fig.16 and Fig. 17B It can be seen in FIG. 1 that, with respect to the cross-sectional shape of the outer carrier frame 140 or the corresponding frame web, this inner edge of the outer carrier frame 140 delimiting the inner space 162 is also the upper edge of the outer carrier frame.

[0214] To achieve sealing, each substrate carrier 112 and base 114 supports the corresponding substrate carrier stacked thereon using only the sealing lip or sealing ridge 204, so that the sealing ridge or sealing lip 204 engages with the corresponding associated upper annular surface portion of the outer carrier frame 140 of the base 114 or the corresponding lower substrate carrier 112 under a relatively high pressing force. The corresponding annular surface portion of the corresponding lower element forms a support-forming structure and a seal-forming structure of the corresponding element similarly to the sealing lip or sealing ridge 204. By designing the cover to have an appropriate minimum weight, an appropriate sealing engagement between the cover 116 and the uppermost substrate carrier can be achieved.

[0215] Preferably, the engagement between the mutually associated locating and forming formations, in the preferred embodiment the projections 150a, 150b and the openings or recesses 152a, 152b, and the engagement between the sealing ridge or sealing lip 204 and the associated upper sealing annular surface portion of the outer carrier frame 140, are the only parts or elements that are in contact or at least in positive engagement with each other between vertically adjacent substrate carriers 112 in the substrate carrier stack 110. Furthermore, it is proposed that the locating engagement between the locating and forming formations is an engagement that does not result in vertically directed forces acting between adjacent substrate carriers.

[0216] Preferably, the same is true for the engagement between the uppermost substrate carrier 112 and the cover 116 and for the engagement between the base 114 and the lowermost substrate carrier 112. The vertical forces preferably act only between the respective elements of the two pairs of elements via the respective seal-forming configurations, which are the upper and lower annular sealing surface portions of the base 114 or, preferably, also the sealing ridges or sealing lips of the cover 116 according to the preferred embodiment.

[0217] For the purge treatment of the substrates 130 held by the substrate carrier 112 in the substrate carrier stack 110, a horizontal purge gas flow between vertically adjacent substrates 130 is preferred, which horizontal purge gas flow is emitted from the first vertical purge channels 170a and 170b and enters the second vertical purge channels 172a and 172b, or emitted from the second vertical purge channels 172a and 172b and enters the first vertical purge channels 170a and 170b, which are defined by the inner openings 166a and 166b and 168a and 168b, respectively. The purge gas traverses the dividing webs 160a and 160b on either side of the substrate, in particular at least the first and second arcuate portions 202a and 202b thereof. In the preferred embodiment shown, as described above, due to the relative rotational positioning of the adjacent substrate carriers, the dividing webs on either side of the inner receiving space alternately include first dividing webs 160a and second dividing webs 160b. This can be achieved in a simple manner by dimensioning the thickness of the dividing webs such that there is a gap between adjacent dividing webs, in particular at least between their adjacent arcuate portions.

[0218] However, it is preferred to provide a longitudinal purge nozzle or inline nozzle instead, which can be obtained by appropriately shaping the upper and lower surfaces of the respective dividing webs so that a nozzle opening is obtained which tapers in the inward direction in a cross-sectional view, such as Fig. 17B Preferably, the minimum opening width defining the nozzle opening is provided at or very close to the inner edge of the dividing web. Fig. 17BAs shown in , it is sufficient to appropriately shape only one of the lower surface of the partition web of the upper substrate carrier and the upper surface of the partition web of the lower substrate carrier. In terms of the overall shape of the substrate carrier, it is preferred that the lower surface of the upper substrate carrier is shaped to provide, for example, Fig. 17B By providing such a longitudinal purge nozzle or a pipeline nozzle, the flow velocity of the purge gas emitted from the corresponding vertical purge channel is accelerated during passing through the partition web, which helps to achieve a laminar purge gas flow through the space between adjacent substrates.

[0219] Fig. 17B Show Fig.17A Detail B in FIG. 1 is a cross-sectional side view of the middle region of the arcuate portions 202a and 202b of the separating webs 160a and 160b with the connecting portions 200a and 200b of the separating webs 160a and 160b and with the adjacent edge portions of the substrates 130 stored in the corresponding substrate carrier stack. Fig. 17B As shown in , the vertical purge channels on one side of the substrate 130 are horizontally connected by horizontal channels defined by adjacent connections 200a and 200b of the stacked substrate carriers, so that a horizontal purge gas flow between adjacent substrates is obtained also along the horizontal extent of these connections 200a and 200b. Fig. 17B , the corresponding line nozzle sections open inwardly toward the substrate carrier. These line nozzles preferably extend along the full extent of the arcuate sections 202a and 202b separating the webs 160a and 160b, and also extend over substantially or the full extent of two connecting sections 200a and 200b at both ends of the arcuate sections, which merge into the arcuate sections and connect them with the corresponding frame webs of the outer carrier frame 140.

[0220] Due to the substrate holding arms extending upward and inward from the upper edge of the outer carrier frame 140, the substrate 130 held by the corresponding substrate carrier 112 is preferably not positioned within the vertical range of the arched portions 202a and 202b and the connecting portion 200b of the separating webs 160a and 160b of the substrate carrier, but rather at a certain vertical distance above these elements of the corresponding substrate carrier 112. Fig. 17B The four respective edge sections of the substrate 130 shown in FIG. 1 are held by respective ones of four further substrate carriers, which are arranged in a Fig. 17B Not shown in the figure and positioned below the four shown substrate carriers in the substrate carrier stack. Fig.17A Eight substrates 130 are shown, namely Fig. 17B The four substrates 130 indicated in FIG. 1 and four additional substrates 130 are held in Fig. 17B In Fig.17Ain the corresponding substrate holders of the four substrate carriers shown in .

[0221] The vertical distance between the upper edge or edge of the outer carrier frame 140 of the substrate carrier and the corresponding substrate held in the seat of the substrate carrier can vary between preferred embodiments of the present invention. For example, the distance between the adjacent wafers held by the same sized substrate carriers 112 of the substrate carrier stack 110 is preferably in the range of 2.4mm to 3.4mm, or more preferably in the range of 2.7mm to 3.1mm. In a preferred embodiment, as shown, the distance is about 2.9mm. Of course, this is only applicable when all substrate carriers in the substrate carrier stack carry the corresponding substrates in this wafer form. If a substrate of another thickness is to be handled and stored, these parameters can be appropriately adjusted.

[0222] Assuming a typical wafer thickness of 0.8 mm, a preferred distance in height of 2.9 mm between immediately adjacent substrates of this typical wafer thickness corresponds to a spacing of 3.7 mm between immediately adjacent horizontal loading planes defined by the substrate receptacles of the substrate carriers 112 of the substrate carrier stack 110. If substrates of another thickness are handled and stored, this spacing can be appropriately adjusted. All of these parameters can be appropriately adjusted depending on the usage scenario of the substrate carrier and preferences that may apply.

[0223] The horizontal bearing planes referred to are not physical elements of the substrate holder, but are instead imaginary, theoretical or virtual geometrical constructs used to describe the positions and other relationships of real elements and between real elements, similar to horizontal frame planes associated with the outer carrier frame of the substrate carrier, frame web axes and vertices associated with the frame webs and frame vertex regions of the corresponding outer carrier frames, and other axes, such as coordinate axes and the like. These horizontal bearing planes are defined as geometrical planes that are coplanar with the lower surface of the corresponding plate-like substrate, which has a diameter corresponding to a predetermined allowable diameter or a predetermined allowable maximum diameter of the substrate holder and is horizontally carried by the corresponding substrate holder in an ideally centered position. For example, in the case where the retaining end 166 of the substrate retaining arm that defines and acts to define the seat portion 166 of the substrate holder would be inclined, for example, such as Figure 7 shown in and Fig.13 and Fig.15 It can also be noted that the lower surface of a substrate having a diameter that does not exactly coincide with the predetermined permissible diameter or the predetermined permissible maximum diameter will be held at a slight vertical distance from the virtual horizontal bearing plane defined by the substrate holder, but will be parallel to the virtual horizontal bearing plane if the substrate is perfectly centered in the substrate holder. For a substrate that is slightly off-center in the substrate holder, the lower surface of the substrate and the virtual horizontal bearing plane may extend slightly obliquely relative to each other.

[0224] Furthermore, even if the substrate is placed in an ideally centrally positioned manner within the substrate holder and has a diameter that corresponds exactly to the predetermined allowable diameter or the predetermined allowable maximum diameter associated with the substrate holder, there may be very small deviations between the virtual horizontal bearing plane associated with the substrate holder and the lower surface of the substrate due to manufacturing tolerances, which manufacturing tolerances may affect the actual arrangement and shape of the substrate holding arms, so that the lower surface of the substrate and the virtual horizontal bearing plane may not be exactly coplanar and may even show a slight tilt relative to each other.

[0225] Of course, all explanations, definitions and teachings given herein must be understood and interpreted by a person skilled in the art in view of the fact that there may always be very small deviations from ideal sizing and ideal shape caused by potentially unavoidable manufacturing tolerances. Such manufacturing tolerances may even have a rather strong impact on devices like the substrate carriers disclosed herein, especially if these substrate carriers are molded by injection molding from a suitable plastic material, as this is preferred. Such injection molding to produce substrate carriers can be advantageously carried out within acceptable manufacturing tolerances to allow for specific usage scenarios, but requires appropriate optimization of the molds and injection molding processes used for injection molding. Such optimization belongs to the work of a technician in the field of injection molding of structures of various shapes. It is recommended to provide a mold including symmetrically positioned injection positions by injection positioning marks at the bottom side of the substrate carrier 112 shown, for example, as Fig. 12A Additional and other injection sites may of course be appropriate, as Fig. 11B The symbols shown in are for illustration purposes only and are not intended to give a complete teaching for the case where the substrate carrier should be manufactured by injection molding. Of course, other suitable manufacturing methods can also be used.

[0226] Reference again Fig. 17B It is preferred that the longitudinal pipeline nozzle is positioned at a vertical height in the substrate carrier stack corresponding to the middle of the vertical distance between the lower surface of the vertically adjacent upper substrate 130 and the upper surface of the vertically adjacent lower substrate 130, assuming a substrate with a specific wafer thickness (e.g., the typical wafer thickness mentioned above) for which the substrate carrier can be specifically designed. Of course, it is assumed here that there are such adjacent substrates: one is positioned within the vertical thickness range of the separation web of the corresponding upper substrate carrier and the other is positioned within the vertical thickness range of the separation web of the corresponding lower substrate carrier, although it is not always necessary that all substrate holders of each substrate carrier of the substrate carrier stack hold the corresponding substrate.

[0227] This proposed arrangement of inline nozzles (or, if no inline nozzles are provided, alternatively longitudinal exit openings between adjacent dividing webs) facilitates achieving a desired laminar purge gas flow through the spaces between the substrates, in which the purge gas is emitted toward the spaces between the adjacent substrates at approximately equal vertical distances from the lower surface of the upper substrate and the upper surface of the lower surface. The above recommendations for sizing the distance between adjacent substrates and the resulting spacing between the horizontal support planes of the substrate holders are based on selected or typical wafer thicknesses and are given in view of the overall desire to provide a laminar horizontal purge gas flow and for relatively high storage densities of the substrates. These recommendations may need to be adjusted depending on the specific usage scenario, particularly with regard to adjustment of the spacing in the case of processing substrates having substantially different thicknesses.

[0228] like Fig. 17B As shown, there is a radial distance between the outer periphery of the arcuate portions 202a, 202b of the dividing webs 160a and 160b and the outer periphery of the substrate 130. It is preferred that the output opening of the line nozzle or substantially line opening defined by the dividing webs is located about 3 mm radially outward of the edge of the substrate (wafer edge). In order to achieve an effective purge process with a laminar horizontal purge gas flow between substrates, a purge gas flow of about 5 mm per second across the surface of the substrate is recommended, but higher or lower purge gas flows may also be suitable.

[0229] The alternating positioning of the substrate carriers 112 within the stack of substrate carriers is achieved and maintained by the positioning formation configuration provided in the present case by the protrusions 150a, 150b and the openings or recesses 152a, 152b, such that adjacent substrate carriers in the stack of substrate carriers have been rotated 180° about the vertical rotation axis, as shown in FIG. Fig.18A Three such substrate carriers are shown with appropriate alternating relative positioning, wherein the relative displacement of the three substrate carriers in the plane of the drawing would symbolically represent the vertical displacement between them, for example in the example of the four substrate carriers relatively positioned in this way. Fig.19 As shown in Fig.19 in and Fig.18A Instructions are given as Fig. 12A , 12B , 12C and 14 and the details C and B are defined and shown. Fig.19 In FIG. 1 , a small change in the position of the protrusion shown relative to the sloped upper surface portion of the outer carrier frame 140 of the substrate carrier shown can be recognized. In this regard, it should be noted that Fig.19 is corresponding to Fig. 12A The arrow XIV in FIG. 1 gives the viewing direction or corresponds to the view in the opposite viewing direction on the corresponding substrate carrier.

[0230] Fig.18Aand Fig.19 The relative arrangement of the substrate holding arms of vertically adjacent substrate carriers is shown, as achieved by the specific symmetrical and asymmetrical arrangements of the substrate holding arms explained. It is achieved that vertically adjacent substrate holding arms, e.g. Fig.19 In the figure, substrate holding arms 132a and 132c and substrate holding arms 132b and 132d do not overlap vertically and are positioned laterally displaced relative to each other. This allows for a smaller spacing of the horizontal holding planes of the substrate holders of the substrate carriers within a stack of substrate carriers and, consequently, a reduced vertical distance between immediately adjacent substrates held within a stack of substrate carriers if all substrate holders accommodate corresponding substrates. Fig.18A Two such immediately adjacent substrate holding arms are shown to have virtually no overlap due to their similar orientation inwardly in the diagonal or diametrical directions. Fig.18B , which shows apex regions 144b and 144d having adjacent segments comprising substrate retaining arms 132b and 132d of a plurality of substrate carriers appropriately stacked upon one another.

[0231] Fig. 20 The frame apex portions 144a and 144c of a plurality of substrate carriers 112 are shown appropriately stacked upon one another. Specifically, the mutual engagement of the protrusions 150a of the respective lower substrate carriers with the openings 152b of the upper substrate carriers and the lateral staggered arrangement of the interface protrusions 154a and 154c of adjacent substrate carriers within the stack of substrate carriers can be seen. This allows for simplified interaction of an external interface device (e.g., a moving device) with a respective one of the substrate carriers because there is a relatively large vertical gap between the vertically aligned interface protrusions, i.e., between the vertically adjacent interface protrusions 154a and between the vertically adjacent interface protrusions 154c.

[0232] According to the preferred embodiment shown, this lateral staggering of these interface protrusions at the four frame vertex areas of the stacked substrate carriers can be achieved using only one type of substrate carrier (without its subtypes), and the setting of the positioning forming structure (in the present case, the protrusions 150a, 150b and the openings or recesses 152a, 152b) ensures the proper stacking of these substrate carriers 112 in the substrate carrier stack 110 with the required alternating relative rotational positions of the substrate carriers, so that as described above, vertically adjacent retaining arms are alternately laterally staggered and vertically adjacent interface protrusions are alternately laterally staggered.

[0233] Fig.21 , Fig.22A and Fig. 22BAn example of a substrate carrier stack 110 according to a fifth preferred embodiment of the invention is shown. In the present case, far more than twenty-five substrate carriers 112 (e.g., twenty-seven or twenty-eight substrate carriers 112) are stacked on each other, wherein the lowest substrate carrier 112 is stacked on the base 114 and the cover 116 is stacked on the uppermost substrate carrier 112. As shown from the transversely staggered interface protrusions 154a and 154c and the transversely staggered interface protrusions 154b and 154d, the substrate carriers 112 are stacked in the explained manner rotated 180° relative to each other about the vertical axis, which is ensured by the explained positioning forming configurations, which in the present case are protrusions 150a, 150b and openings or recesses 152a, 152b. As shown in the figure, a high stacking density and a high storage density are obtained for the substrates held in the seats of the substrate carriers 112 within the substrate carrier stack 110. In principle, such a substrate carrier stack can include any number of substrate carriers, for example, in fact there are many more substrate carriers than in the non-limiting example shown. An even number of substrate carriers or alternatively an uneven number of substrate carriers can be provided in such a substrate carrier stack.

[0234] according to Fig.21 Perspective drawing and Fig.22A and Fig. 22B 1, a base 114 and a cover 116 are provided in the form of a base plate and a cover plate. Preferably, the cover plate will be provided with a suitable recess at its underside which accommodates the substrate holding arm of the uppermost substrate carrier and the substrate held thereby.

[0235] According to a preferred embodiment of the present invention, the base 114 and the cover 116 are provided with structures that allow a purge process of the substrates 130 held within the substrate carrier stack 110. Preferably, these purge structures include or have an integrated laminarisation structure, such as at least one of a laminarisation chamber, a laminarisation manifold and a laminarisation fabric, to achieve or facilitate laminar purge gas through the spaces between adjacent substrates within the substrate carrier stack.

[0236] Fig.23 and Fig.24 An example of a preferred embodiment for the base 114 is shown. Fig.23 is a top view of the upper side of the base, and Fig.24 is a rather schematic side view of the base 114 .

[0237] like Fig.24As shown, the base can include a carrier plate 210 provided with positioning protrusions 150a' and 150b' that substantially correspond to the protrusions 150a and 150b of the corresponding substrate carriers 112, so that the lowermost substrate carrier 112 of the plurality of substrate carriers of the substrate carrier stack 110 is stacked onto the base in a defined relative position, i.e., so that the protrusion 150a' engages in the opening 152b of the lowermost substrate carrier 112 and the protrusion 150b' engages in the opening 152a of the lowermost substrate carrier 112. The carrier plate 210 can be made of a metal material, for example, or alternatively of a plastic material.

[0238] The base 114 is provided with an inner body 211 on the upper side of the carrier plate 210, which is positioned inside the substrate carrier stack 110 and supports its lowermost substrate carrier 112. The inner body fastened to the carrier plate 210 can be manufactured in one piece or can be made of a plurality of elements (e.g., plate-like elements) mounted to each other. In fact, the entire base 114 can in principle be manufactured in one piece, for example, depending on its selected structure.

[0239] In the present case, the inner body 211 comprises a support base 212 for the lowermost substrate carrier 112, such as Fig.24 As shown, the support base 212 can be made of a plurality of (e.g., two) plate-like elements 212a and 212b. An annular surface band 213 extending along its outer edge on the upper surface of the support base 212 supports the lowermost substrate carrier 112 at its sealing ridge or sealing lip 204 and forms a sealing surface. The weight of the substrate carrier 112 and the cover 116 of the substrate carrier stack 110 is supported via the sealing ridge or sealing lip 204, so that sealing is achieved.

[0240] Preferably, to allow for purging of the substrates 130 within the substrate carrier stack 110, the base 114 is provided with an interface body 216 at the underside of the carrier plate 210, which is mounted to the carrier plate 210. The interface body includes an integral purge gas inlet connector or purge gas inlet, and an integral purge gas return connector or purge gas outlet. These connectors or inlets and outlets are connected via appropriate structures of the base 114, including openings in the carrier plate 210 and associated gas distribution structures or purge structures within the support base 212. These gas distribution structures or purge structures, which can include at least one of a channel and a chamber, are connected to an associated pair of vertical gas distribution channels or vertical purge channels of the substrate carrier stack via a pair of inflow openings or inflow recesses 218a and 218b and a pair of return openings or return recesses 220a and 220b, such that a purge gas entry connector or purge gas inlet is connected to one pair of these vertical channels and a purge gas return connector or purge gas outlet is connected to another pair of these vertical channels.

[0241] like Fig.23 As shown, the upwardly opening inlet openings or recesses 218a and 218b can have a shape quite similar to the shape of the openings 168a, 168b of the lowermost substrate carrier 112 stacked on the support base 212 to achieve or facilitate laminar purge flow. However, other shapes can also be selected for the inlet openings or recesses. The inflow openings or recesses 218a and 218b and the pairs of openings 168a, 168b and 166a, 166b, etc. of the substrate carriers 112 stacked on the support base 212 and subsequently stacked on each other can be considered to belong together to the pair of vertical gas distribution channels or vertical purge channels, through which the purge gas is supplied to the explained longitudinal nozzles or pipeline nozzles (or generally longitudinal openings) defined by the vertically adjacent dividing webs of the pair of vertically adjacent substrate carriers 112, so that the purge gas is horizontally emitted toward and into the space between adjacent substrates held in the seats of the corresponding substrate carriers of the substrate carrier stack.

[0242] Furthermore, for the return openings or return recesses 220a and 220b, the shapes are quite similar to the shapes of the openings 166a, 166b of the lowermost substrate carrier 112 stacked on the support base 212 and the deviations are Fig.23The shapes of these return openings or return recesses 220a and 220b shown in are possible. The return openings or recesses 220a and 220b and further pairs of openings 166a, 166b and 168a, 168b etc. of the substrate carriers 112 stacked on the support base 212 and subsequently stacked on each other can be considered to belong together to the pair of vertical gas distribution channels or vertical purge channels into which the purge gas is emitted via the explained longitudinal nozzles or pipeline nozzles (or generally longitudinal openings) defined by the vertically adjacent dividing webs of the pair of vertically adjacent substrate carriers 112 after having passed through the spaces between the adjacent substrates held in the seats of the respective substrate carriers of the substrate carrier stack.

[0243] Thus, the purge gas introduced into the substrate carrier stack via the purge gas entry connector or purge gas inlet of the interface body is supplied to the substrate via the inflow openings or recesses 218 a and 218 b and one of the two pairs of vertical purge channels and the first group of longitudinal nozzles or pipeline nozzles (or generally longitudinal openings), and is returned and discharged from the substrate carrier stack via the second group of longitudinal nozzles or pipeline nozzles (or generally longitudinal openings) and the other pair of the two pairs of vertical purge channels and the return openings or recesses 220 a and 220 b and finally the purge gas return connector or purge gas outlet of the interface body.

[0244] like Fig.24 As schematically shown in FIG. 2 , the support base 212 is realized in the form of two plate-like elements 212 a and 212 b , so that the support base 212 with the desired inner structure can be manufactured without much effort.

[0245] The base includes a cylindrical protrusion 214 with a cylindrical cross section on top of the support base 212, which can be formed integrally with the support base 212 or its upper plate-like element 212a, or can be a separate element attached thereto. The cylindrical protrusion extends into the large opening 164 of the lowermost substrate carrier 112 and has a diameter that exactly or substantially corresponds to the diameter of the substrate 130 carried in the corresponding substrate seat within the substrate carrier stack. Fig.25As shown, the cylindrical protrusion 214 has a certain height so that the lowest substrate 130 in the stack of substrate carriers held by the lowest substrate carrier of the stack of substrate carriers directly supported by the supporting base 212 has similar purge conditions as the other substrate carriers in the stack of substrate carriers. To this end, if all seats of the substrate carriers carry the corresponding substrate 130 and if the substrate has a thickness that is optimized for the substrate carrier 112 and the stack of substrate carriers 110, the distance between the upper planar surface of the cylindrical protrusion 214 and the lower surface of this substrate 130 just or approximately corresponds to the distance between the lower surface and the upper surface of the immediately adjacent substrates held in the stack of substrate carriers. In the case of the preferred embodiment shown, the three lowest substrate carriers are positioned so that their corresponding dividing webs are within the height range of the cylindrical protrusion 214, so that the line nozzles or longitudinal openings between the immediately adjacent dividing webs do not have the purpose of emitting purge gas that will pass through the substrates or between the substrates.

[0246] Fig.25 Reference Fig.17A and 17B Come to consider, Fig.17A and 17B A plurality of substrate carriers are shown positioned in a stack. Fig.25 A substrate carrier is disposed above the substrate carrier.

[0247] It should be added that, in the case of the preferred embodiment shown, the base 114 (preferably its carrier plate 210) can be provided with interface protrusions 154a', 154b', 154c' and 154d', similar to the interface protrusions 154a, 154b, 154c and 154d of the corresponding substrate carrier 112, which allow interaction with external handling and moving devices and the like.

[0248] As already at least implicitly explained above, the purpose of providing a laminar purge gas flow through the spaces between adjacent substrates in a substrate carrier stack can be achieved or contributed to if a laminar purge gas flow has entered the associated vertical channels of the substrate carrier stack formed by the openings 168a, 168b and 166a, 166b of its substrate carrier 112, respectively, through the inflow openings or recesses 218a and 218b. To this end, suitable laminar fluidization structures can be provided in the base 114, in particular in its supporting base 212, such as at least one relatively large laminar fluidization chamber, which may have a gas distribution structure, such as a dividing wall therein. Alternatively or additionally, at least one laminar fluidization fabric can be provided, through which the purge gas is emitted into the vertical supply channels in the substrate carrier stack.

[0249] The base 114 can be made of any suitable material, such as at least one of a metallic material and a plastic material, or include a plurality of parts that are combined to form the base, as indicated for the preferred embodiment shown, or are integrally formed.

[0250] Since the base 114 is provided with a purge gas inlet and a purge gas outlet in the present preferred embodiment, the cover 116 need not include such an inlet and such an outlet. Fig.26 A view of the underside of a suitable cover 116 is shown, wherein the cover 116 is considered to be placed upside down according to the view shown. Fig. 27 1 is a corresponding side view of the cover 116 , which, however, is positioned with its underside pointing downward and its upper side pointing upward in the view shown.

[0251] The cover 116 basically includes a large recess 228 corresponding to the large inner opening 64 of the respective substrate carrier 112, and a first pair of smaller recesses 222a and 222b and a second pair of smaller recesses 224a and 224b corresponding to the smaller inner openings 166a, 166b and 168a, 168b of the respective substrate carrier 112. The smaller recesses 222a, 222b and 224a, 224b are separated from the larger recess 128 by respective partition walls 240a and 240b, which correspond to the partition webs 160a and 160b of the respective substrate carrier 112. If the cover 116 is stacked on the topmost substrate carrier 112 of the substrate carrier stack 110, the first pair of smaller recesses 222a, 222b and the second pair of smaller recesses 224a, 224b extend the first and second pairs of vertical purge gas distribution channels or multiple vertical purge gas distribution channels formed by the first pair of smaller inner openings 166a and 166b and the second pair of smaller inner openings 168a and 168b, so that the vertical purge gas channels extend along the complete vertical range of the inner accommodation space of the substrate carrier stack, and the substrate held by the corresponding substrate carrier can be positioned in the substrate carrier stack. The partition walls 220a and 220b, which may also be indicated as partition ridges, include arcuate portions similar to the arcuate portions 202a and 202b of the partition webs and are provided with a corresponding set of vertically adjacent longitudinal openings 126 extending along the outer periphery of the inner receiving space, similar to the line nozzles or longitudinal openings defined by the immediately adjacent partition webs of the substrate carriers, so that a horizontal purge gas stream can be emitted for purge treatment of substrates also within the height range of the uppermost substrate held by the uppermost substrate carrier 112 of the substrate carrier stack 110, as shown. Fig.28 as well as Fig.17A , 17B and 25.

[0252] Fig.28The four substrate carriers 112 shown in FIG. 1 are positioned in a substrate carrier stack. Fig. 17B 228 of the cover 116. Smaller recesses 222a, 222b and 224a, 224b with longitudinal openings or possibly inline nozzles 226 in the dividing walls 220a and 220b provide a horizontal purge gas flow through the spaces between immediately adjacent substrates 130 and also through the space between the upper surface of the uppermost substrate carrier 112 and the lower surface of the cover within the large recess 228.

[0253] Using the base 114 and the cover 116, it is possible to obtain the same or substantially the same purge conditions for all substrates 130 within the substrate carrier stack 110. Preferably, longitudinal openings or line nozzles are arranged at equidistant vertical distances, from which the horizontal purge gas stream is emitted towards the substrates and into which the purge gas stream enters after having passed through the substrates, wherein the respective line nozzle or longitudinal opening is preferably positioned at half the height between the lower surface of the upper substrate 130 and the upper surface of the lower substrate 130, between the lower surface of the cover 116 within the recess 128 and the upper surface of the uppermost substrate 130, and between the lower surface of the lowermost substrate 130 and the upper surface of the cylindrical protrusion 214 of the base 114, again assuming that the substrates have a thickness for which the substrate carrier 112 and, thus, the substrate carrier stack 110 are optimized. However, the substrate carrier 112 and the substrate carrier stack 110 can also be used for the storage, handling and processing of substrates having other thicknesses.

[0254] It should be noted that the cover 116 preferably includes horizontally extending interface protrusions 154a', 154b', 154c' and 154d', which are formed by interface sections 224a, 224b, 224c and 224d that protrude downward from the support surface 229 of the frame portion 227 of the cover 116. The frame portion 227 is supported on the outer carrier frame 140 of the uppermost substrate carrier 112. The lower annular surface band of the frame portion 227 extending around the large recess 228 and the lower annular surface band of the outer carrier frame 140 of the uppermost substrate carrier 112 extending around its inner area 162 form mutually engaged sealing surfaces to confine the purge gas within the substrate carrier stack 110. Alternatively, one of these surfaces can be replaced by a sealing lip or sealing ridge. Preferably, the cover 116 is provided with such a sealing lip or sealing ridge at its frame portion 227, similar to the sealing lip or sealing ridge 204 of the substrate carrier 112.

[0255] In order to achieve a proper relative positioning of the cover on the uppermost substrate carrier 112 of the substrate carrier stack 110, one or more interface sections 224a, 224b, 224c and 224d can be provided with positioning formations similar to the positioning formations of the substrate carriers. In the present case, the interface section 224a is provided with an opening or recess 152b' corresponding to the opening or recess 152b of the corresponding substrate carrier 112, and the interface section 224c is provided with a longitudinally extending recess or opening 152a' similar to the opening or recess 152a of the corresponding substrate carrier 112. When the cover 116 is properly stacked on the uppermost substrate carrier 112 of the substrate carrier stack 110, then the protrusion 150b of the substrate carrier will protrude into the opening or recess 152a' of the cover 116, and the protrusion 150a of the substrate carrier will protrude into the opening 152b' of the cover 116.

[0256] It should be added that the kind of interface protrusions provided for base 114 and the kind of interface protrusions provided for base 116 are preferably adapted to each other and regardless of whether an even or odd number of substrate carriers 112 are to be provided in substrate carrier stack 110 .

[0257] The cover 116 can be made of any suitable material, for example, at least one of a metallic material and a plastic material, and can be unitary as may be the case with the preferred embodiment shown, or comprise a plurality of parts that are combined to form the cover.

[0258] As already mentioned, the substrate carriers 12 and 112 are preferably manufactured in one piece or in one corresponding part. In particular, the substrate carrier can be molded in one piece from a plastic material, preferably by injection molding. Advantageously, a plastic material comprising fibers for reinforcement can be used. For clean room applications, it is recommended to use a plastic material that reduces static electricity. Therefore, the substrate carrier is preferably molded from a so-called ESD material or electronic discharge material. For example, the plastic material can be made of or include one of polyetheretherketone (PEEK) and polycarbonate (PC).

[0259] Preferred as molding material is PEEK, in particular from Von Allmen AG, CH-8330 The variant PEEK ESD 101 or a type with similar properties is available. This substrate carrier has an increased chemical and temperature resistance, which is beneficial if the semiconductor wafers are subjected to processing or conditioning steps while being arranged in the seat of a corresponding substrate carrier, which substrate carrier will generally be part of a substrate carrier stack for jointly processing or conditioning all substrates held in the substrate carrier stack, or which can alternatively be handled individually and delivered individually to the processing or conditioning equipment. However, PC is also a very suitable molding material, in particular for substrate carriers to be used for storing and buffering semiconductor wafers in a substrate carrier stack. For example, the variant PC-CF DCL 32 or a type with similar properties with increased conductivity is recommended.

[0260] It should be noted that a substrate carrier stack according to a preferred embodiment of the present invention can be provided as a high density replacement or enhancement to existing systems and transport mechanisms such as FOUPs, thereby providing higher storage density and improved and additional and enhanced capabilities as described above. Such a substrate carrier stack may be denoted a "TecCell" or "Tec-Cell."

[0261] Although the preferred embodiments of the present invention have been described above, it should be understood that variations and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the invention. Therefore, the scope of the present invention is determined only by the following claims.

Claims

1. A substrate carrier stack comprising: a plurality of substrate carriers stacked in a vertical direction such that for each pair of vertically adjacent substrate carriers, a lower substrate carrier supports an upper substrate carrier; in Each substrate carrier of the plurality of substrate carriers includes an outer carrier frame extending in a horizontal frame plane around an inner region including an inner opening; Each of the plurality of substrate carriers includes a substrate holder to receive and carry a substrate within an inner receiving space of the stack of substrate carriers, the inner receiving space being defined by the inner openings of the plurality of substrate carriers; Each substrate carrier of the plurality of substrate carriers comprises an upper support forming formation and a lower support forming formation at the outer carrier frame, the upper support forming formation of the lower substrate carrier supporting the lower support forming formation of the upper substrate carrier; the outer carrier frame of each substrate carrier of the plurality of substrate carriers comprising a first frame web extending along a first frame web axis, a second frame web extending along a second frame web axis, a third frame web extending along a third frame web axis, and a fourth frame web extending along a fourth frame web axis; the first frame web axis intersecting the fourth frame web axis at a right angle at a first vertex of the first frame web and the fourth frame web, the first frame web and the fourth frame web being connected at a first frame vertex region of the outer carrier frame, the first frame vertex region being associated with the first frame web and the fourth frame web; the first frame web axis intersecting the second frame web axis at a right angle at a second vertex of the first frame web and the second frame web, the first frame web and the second frame web being connected at a second frame vertex region of the outer carrier frame, the second frame vertex region being associated with the first frame web and the second frame web; the third frame web axis intersecting the fourth frame web axis at a right angle at a fourth vertex of the third frame web and the fourth frame web, the third frame web and the fourth frame web being connected at a fourth frame vertex region of the outer carrier frame, the fourth frame vertex region being associated with the third frame web and the fourth frame web; the third frame web axis intersecting the second frame web axis at a right angle at a third vertex of the third frame web and the second frame web, the third frame web and the second frame web being connected at a third frame vertex region of the outer carrier frame, the third frame vertex region being associated with the third frame web and the second frame web; each substrate carrier of the plurality of substrate carriers includes a plurality of substrate retaining arms extending inwardly and upwardly from the outer carrier frame, overlapping the inner region and defining the substrate receptacle; The substrate holder is positioned at a certain distance above the outer carrier frame in the vertical direction; Each substrate carrier of the plurality of substrate carriers includes a first positioning forming formation and a second positioning forming formation, such that for each pair of vertically adjacent substrate carriers, the first positioning forming formation of the lower substrate carrier engages with the second positioning forming formation of the upper substrate carrier; each of the plurality of substrate holding arms of a respective substrate carrier being disposed at an associated one of the frame webs in an area between two frame vertex areas associated with the respective frame web, wherein the substrate holding arms are disposed at the respective frame web at varying distances from a respective nearest one of the two frame vertex areas associated with the respective frame web, such that respective pairs of substrate holding arms of the respective substrate carrier disposed at diametrically opposed frame web portions of two frame webs having parallel frame web axes have different distances from the respective nearest frame vertex areas; All of the plurality of substrate carriers have the same structure; The substrate carriers in each pair of vertically adjacent substrate carriers are stacked such that: The first frame web of the lower substrate carrier supports the third frame web of the upper substrate carrier, the second frame web of the lower substrate carrier supports the fourth frame web of the upper substrate carrier, the third frame web of the lower substrate carrier supports the first frame web of the upper substrate carrier, and the fourth frame web of the lower substrate carrier supports the second frame web of the upper substrate carrier; the first positioning forming formation and the second positioning forming formation are located at the same diametrically opposed portions of the outer carrier frame of each substrate carrier of the plurality of substrate carriers; The first positioning forming structure and the second positioning forming structure have a first-order rotational symmetry relative to the rotation around the vertical rotation axis, so that the frame webs of the corresponding substrate carriers can be distinguished from each other, and the first positioning forming structure of the lower substrate carrier in each pair of vertically adjacent substrate carriers is engaged with the second positioning forming structure of the upper substrate carrier in each pair of vertically adjacent substrate carriers only when two substrate carriers in each pair of vertically adjacent substrate carriers are stacked on each other so that the first frame web of the lower substrate carrier supports the third frame web of the upper substrate carrier, the second frame web of the lower substrate carrier supports the fourth frame web of the upper substrate carrier, the third frame web of the lower substrate carrier supports the first frame web of the upper substrate carrier, and the fourth frame web of the lower substrate carrier supports the second frame web of the upper substrate carrier, in: The upper support forming formation includes an upper seal forming formation, and the lower support forming formation includes a lower seal forming formation; a first of the upper and lower seal-forming configurations including a continuous sealing lip extending continuously around the inner region, and a second of the upper and lower seal-forming configurations including a continuous sealing surface band extending continuously around the inner region; For each pair of vertically adjacent substrate carriers, the lower seal-forming formations of the upper substrate carrier engage the upper seal-forming formations of the lower substrate carrier to seal the inner region and the inner receiving space from a region surrounding the stack of substrate carriers.

2. A substrate carrier stack according to claim 1, wherein each of the plurality of substrate carriers includes a vertical protrusion defining a first positioning forming structure of the first positioning forming structure and the second positioning forming structure, and a recess or opening defining a second positioning forming structure of the first positioning forming structure and the second positioning forming structure.

3. A substrate carrier stack according to claim 1 or 2, wherein the plurality of substrate holding arms include pairs of substrate holding arms arranged at two diametrically opposite frame web portions parallel to each other in the first frame web, the second frame web, the third frame web and the fourth frame web.

4. The substrate carrier stack of claim 1 or 2, wherein the plurality of substrate holding arms of each of the plurality of substrate carriers comprises: a first substrate retaining arm and a second substrate retaining arm disposed at one of the first frame web and the second frame web; as well as A third substrate holding arm and a fourth substrate holding arm are arranged at the frame web of one of the third frame web or the fourth frame web, and the third frame web or the fourth frame web has a frame web axis extending parallel to the frame web axis of the first frame web or the second frame web on which the first substrate holding arm and the second substrate holding arm are arranged. 5 . The substrate carrier stack according to claim 1 , wherein each substrate carrier of the plurality of substrate carriers comprises a protrusion protruding horizontally from the outer peripheral surface of the outer carrier frame.

6. A substrate carrier stack according to claim 1 or 2, wherein each of the plurality of substrate carriers comprises a first pair of protrusions protruding from the peripheral surface of the outer carrier frame in a first horizontal direction and a second pair of protrusions protruding from the peripheral surface of the outer carrier frame in a second horizontal direction different from the first horizontal direction.

7. The substrate carrier stack of claim 1 or 2, further comprising a cover stacked on the plurality of substrate carriers and supported by an uppermost substrate carrier of the plurality of substrate carriers.

8. The substrate carrier stack of claim 1 or 2, further comprising a base on which the plurality of substrate carriers are stacked, the base supporting a lowermost substrate carrier of the plurality of substrate carriers.

9. The substrate carrier stack according to claim 1 or 2, wherein The substrate holder of each of the plurality of substrate carriers defines a horizontal support plane that is coplanar with a lower surface of the substrate; each substrate carrier of the plurality of substrate carriers comprises a plurality of dividing webs extending from the outer carrier frame through the inner region to define the inner opening of the inner region and two auxiliary openings; The first arcuate portion of the plurality of partition webs extends in a first space between the fourth frame web and the inner opening to define a first auxiliary opening of the two auxiliary openings; The second arcuate portions of the plurality of partition webs extend in a second space between the second frame web and the inner opening to define a second auxiliary opening of the two auxiliary openings; The first auxiliary opening and the second auxiliary opening of the inner region of the plurality of substrate carriers collectively define a first purge channel and a second purge channel, the first purge channel and the second purge channel extending vertically parallel to the inner receiving space at opposite sides of the inner receiving space; as well as The plurality of substrate carriers includes a purge structure that creates a horizontal purge flow within the stack of substrate carriers through spaces between substrates held by substrate holders of the plurality of substrate carriers.

10. The substrate carrier stack of claim 9, wherein Each of the plurality of substrate carriers includes a first dividing web extending between the first frame web and the third frame web, and includes a first arcuate portion extending in a first space between the fourth frame web and the inner opening and bridging between the first frame web and the third frame web; and Each of the plurality of substrate carriers includes a second dividing web extending between the first frame web and the third frame web, and includes a second arched portion extending in a second space between the second frame web and the inner opening and bridging between the first frame web and the third frame web.

11. A substrate carrier stack according to claim 9, wherein the first arched portion and the second arched portion of the lowest substrate carrier or a predetermined number of substrate carriers among the multiple substrate carriers are positioned side by side with the cylindrical protrusion of the base on which the multiple substrate carriers are stacked, and the cylindrical protrusion extends upward in the vertical direction into the inner receiving space.

12. The substrate carrier stack of claim 9, further comprising: a cover stacked on the plurality of substrate carriers and supported by an uppermost substrate carrier of the plurality of substrate carriers; as well as a base on which the plurality of substrate carriers are stacked, the base supporting a lowermost substrate carrier of the plurality of substrate carriers; in the upper seal-forming formation of an uppermost substrate carrier of the plurality of substrate carriers being engaged with the seal-forming formation of the cover; The lower seal-forming structure of the lowermost substrate carrier of the plurality of substrate carriers engages with the seal-forming structure of the base to seal the inner receiving space, the first purge channel, and the The second purge channel is sealed from an area surrounding the substrate carrier stack.

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