Miniature speaker module with high heat dissipation efficiency and smartphone including the same

Abstract

The present invention provides a micro speaker module with high heat dissipation efficiency and a smart phone including the same. The micro speaker module includes an upper shell, a lower shell and a speaker unit. The speaker unit is installed on the upper shell or the lower shell. The upper shell and the speaker unit form a front cavity. The lower shell and the speaker unit form a rear cavity and at least a part of the speaker unit is located in the rear cavity. A thermally conductive sound-absorbing material is further filled in the rear cavity. The upper shell and the lower shell are fixedly connected. A sound outlet hole is formed in the side wall of the rear cavity. In the rear cavity of the micro speaker module provided by the present invention, a thermally conductive sound-absorbing material is filled. The thermally conductive sound-absorbing material can not only improve the acoustic performance of the micro speaker module by using its high virtual rear cavity increase coefficient, but also increase the heat dissipation amount of the space around the speaker unit through its high thermal conductivity far higher than that of air, thereby improving the overall heat dissipation capacity of the micro speaker module.

Description

Technical Field

[0001] The present invention relates to a micro speaker module with high heat dissipation efficiency and a smart phone including the same, belonging to the technical field of electroacoustic products. Background Art

[0002] As a sound generating unit, the micro speaker module is one of the main electroacoustic devices in a smart phone, mainly responsible for converting the received electrical signal into an audible sound signal. As an electroacoustic transducer, during the operation of the micro speaker, in addition to converting a part of the electrical energy into mechanical energy and finally generating sound waves by radiation; most of the electrical energy is converted into heat energy, causing the temperature of the voice coil to rise. When the temperature of the voice coil exceeds a certain range, it will affect the sound effect of the micro speaker and even affect its normal use. Therefore, when designing the micro speaker module, the heat dissipation problem needs to be considered in advance. In recent years, the loudness of the speaker in the mobile phone has gradually increased, and the amplitude of the micro speaker has gradually increased, which will surely further exacerbate the generation of heat in the mobile phone speaker, causing certain heat dissipation problems.

[0003] In order to improve the acoustic performance, adding sound absorbing materials to the micro speaker has become a common means, but most sound absorbing materials do not have the function of improving the heat dissipation ability of the product.

[0004] At present, the main ways to improve the heat dissipation efficiency of the micro speaker module and reduce the temperature of the voice coil are as follows:

[0005] 1) Optimize the structure and material of the speaker of the micro speaker module. For example, use high thermal conductivity material steel, etc. to make the speaker housing of the micro speaker module.

[0006] 2) Optimize the structure of the micro speaker module. Adopt the structure with the Yoke of the speaker of the micro speaker module exposed, and use SUS material for part of the module housing to enhance the heat dissipation efficiency of the module.

[0007] 3) Paste auxiliary materials with high thermal conductivity on the housing of the micro speaker module. For example, paste a graphite sheet on the housing of the micro speaker module to enhance the heat dissipation efficiency.

[0008] The existing ways to improve the heat dissipation efficiency of the micro speaker module and reduce the temperature of the voice coil only use the method of increasing the thermal conductivity coefficient of the speaker body and the housing of the micro speaker module to improve the heat dissipation efficiency. The most efficient heat dissipation path is only concentrated on the upper and lower positions of the speaker body, and heat dissipation is carried out through the form of air convection and heat conduction. There is a lot of air in the rear cavity of the micro speaker module, and the air space occupies the vast majority of the volume in the rear cavity of the micro speaker module. Because air has a very low thermal conductivity coefficient, the product fails to efficiently use the space around the speaker for heat dissipation.

[0009] Therefore, providing a micro speaker module with high heat dissipation efficiency and a smart phone including the same has become an urgent technical problem to be solved in this field. Summary of the Invention

[0010] To address the above drawbacks and deficiencies, an object of the present invention is to provide a micro speaker module with high heat dissipation efficiency.

[0011] Another object of the present invention is to provide a smart phone including the above-mentioned micro speaker module with high heat dissipation efficiency.

[0012] To achieve the above objects, on the one hand, the present invention provides a micro speaker module with high heat dissipation efficiency, wherein the micro speaker module with high heat dissipation efficiency includes: an upper shell, a lower shell and a speaker unit; the speaker unit is installed on the upper shell or the lower shell, the upper shell and the speaker unit form a front cavity, the lower shell and the speaker unit form a rear cavity and at least a part of the speaker unit is located in the rear cavity, and a heat-conducting sound-absorbing material is filled in the rear cavity; the upper shell and the lower shell are fixedly connected; a sound outlet hole is provided on the side wall of the rear cavity.

[0013] As a specific embodiment of the above-mentioned micro speaker module of the present invention, the heat-conducting sound-absorbing material contains a heat-conducting additive.

[0014] As a specific embodiment of the above-mentioned micro speaker module of the present invention, the heat-conducting additive includes one or more of graphene, alumina, zinc oxide, magnesium oxide, quartz powder, silicon carbide, aluminum nitride and boron carbide.

[0015] As a specific embodiment of the above-mentioned micro speaker module of the present invention, the particle size range of the heat-conducting additive is 50 - 500 nm.

[0016] In a specific embodiment of the present invention, the heat-conducting additive can be a nano-powder heat-conducting additive.

[0017] As a specific embodiment of the above-mentioned micro speaker module of the present invention, the heat-conducting additive is uniformly dispersed and filled in the heat-conducting sound-absorbing material or coated on the surface of the heat-conducting sound-absorbing material.

[0018] As a specific embodiment of the above-mentioned micro speaker module of the present invention, the heat-conducting sound-absorbing material is a high heat-conducting sound-absorbing material, and its thermal conductivity is 0.2 - 20 W / mK.

[0019] As a specific embodiment of the above-mentioned micro speaker module of the present invention, the heat-conducting sound-absorbing material includes sound-absorbing particles, sound-absorbing sheets or sound-absorbing blocks.

[0020] As a specific embodiment of the above-mentioned micro-speaker module of the present invention, the sound-absorbing block has first-stage pores with a pore size range of 0.3-0.7 nm, second-stage pores with a pore size range of 20-50 nm, and third-stage pores with a pore size range of 1-100 μm. Among them, the first-stage pores are micropores of molecular sieve particles, the second-stage pores are pores formed between molecular sieve particles, and the third-stage pores include pores formed between molecular sieve particles and pores formed by array needles equal to the sound-absorbing block (such as the surface).

[0021] As a specific embodiment of the above-mentioned micro-speaker module of the present invention, the sound-absorbing block is prepared by bonding a number of molecular sieve particles or sound-absorbing particles containing a heat-conducting additive with an adhesive.

[0022] As a specific embodiment of the above-mentioned micro-speaker module of the present invention, the particle size range of the molecular sieve particles is 0.5-10 μm, the micropore diameter is 0.3-0.7 nm, and the Si / Al ratio is 200 or more, preferably 400 or more.

[0023] As a specific embodiment of the above-mentioned micro-speaker module of the present invention, the molecular sieve particles are one or more of MFI molecular sieve and / or FER molecular sieve.

[0024] As a specific embodiment of the above-mentioned micro-speaker module of the present invention, the adhesive includes an organic adhesive and / or an inorganic adhesive; based on the total weight of the sound-absorbing block being 100%, the content of the solid component of the organic adhesive in the sound-absorbing block is 5%-20%, preferably 10%-20%; based on the total weight of the sound-absorbing block being 100%, the content of the inorganic adhesive in the sound-absorbing block is 4%-15%, preferably 5%-15%.

[0025] In a specific embodiment of the present invention, based on the total weight of the sound-absorbing block being 100%, the content of the solid component of the organic adhesive in the sound-absorbing block can be 5%, 6%, 7%, 8%, 9%, 10%, 11%, 12%, 13%, 14%, 15%, 16%, 17%, 18%, 19%, 20%.

[0026] In a specific embodiment of the present invention, based on the total weight of the sound-absorbing block being 100%, the content of the inorganic adhesive in the sound-absorbing block is 4%, 5%, 6%, 7%, 8%, 9%, 10%, 11%, 12%, 13%, 14%, 15%.

[0027] As a specific embodiment of the above-mentioned micro-speaker module of the present invention, the organic adhesive includes one or a combination of several of poly(styrene acrylic acid) emulsion, poly(styrene acetic acid) emulsion, styrene-butadiene rubber emulsion, poly(styrene acrylate) emulsion, and polyacrylate emulsion.

[0028] As a specific embodiment of the above-mentioned micro-speaker module of the present invention, based on the total weight of the organic binder being 100%, the solid component content in the organic binder is 40%-60%.

[0029] In a specific embodiment of the present invention, based on the total weight of the organic binder being 100%, the solid component content in the organic binder can be 40%, 45%, 50%, 55%, 60%.

[0030] As a specific embodiment of the above-mentioned micro-speaker module of the present invention, the inorganic binder includes one or more of kaolin, silica sol, aluminum sol, and carboxymethyl cellulose.

[0031] As a specific embodiment of the above-mentioned micro-speaker module of the present invention, the method for preparing the sound-absorbing block includes the following steps:

[0032] After mixing molecular sieve particles, a binder, and a heat-conducting additive into a slurry, use a mold to extrude or press them into a sound-absorbing block, or soak a porous material in the slurry and then dry it to make a sound-absorbing block;

[0033] Preferably, the dosage of the heat-conducting additive is 0.5%-20% of the mass of the molecular sieve particles, and more preferably 1%-5%;

[0034] Or mix molecular sieve particles and a binder into a slurry, use a mold to extrude or press them into a sound-absorbing block, or soak a porous material in the slurry and then dry it to make a sound-absorbing block; finally, spray a solution prepared by mixing a heat-conducting additive and an aqueous binder solution on the surface of the sound-absorbing block;

[0035] Preferably, based on the total weight of the solution being 100%, the content of the heat-conducting additive is 1%-10%, and more preferably 2%-7%;

[0036] Still preferably, the spraying time is 1-10 min to control the thickness of the surface coating and reduce the influence on the pores on the surface of the sound-absorbing block;

[0037] Still preferably, the solid content of the aqueous binder solution is 5%-20%; more preferably, the binder includes one or more of polystyrene acrylic emulsion, polystyrene acetic acid emulsion, styrene-butadiene rubber emulsion, and carboxymethyl cellulose;

[0038] Or mix sound-absorbing particles containing a heat-conducting additive and a binder into a slurry, use a mold to extrude or press them into a sound-absorbing block, or soak a porous material in the slurry and then dry it to make a sound-absorbing block.

[0039] In a specific embodiment of the present invention, the dosage of the heat-conducting additive can be 0.5%, 1.0%, 1.5%, 2.0%, 2.5%, 3.0%, 3.5%, 4.0%, 4.5%, 5.0%, 5.5%, 6.0%, 6.5%, 7.0%, 7.5%, 8.0%, 8.5%, 9.0%, 9.5%, 10%, 10.5%, 11%, 11.5%, 12.0%, 12.5%, 13.0%, 13.5%, 14.0%, 14.5%, 15.0%, 15.5%, 16.0%, 16.5%, 17.0%, 17.5%, 18.0%, 18.5%, 19.0%, 19.5%, 20.0% of the mass of the molecular sieve particles.

[0040] In a specific embodiment of the present invention, based on the total weight of the solution being 100%, the concentration of the heat-conducting additive can be 1.0%, 1.5%, 2.0%, 2.5%, 3.0%, 3.5%, 4.0%, 4.5%, 5.0%, 5.5%, 6.0%, 6.5%, 7.0%, 7.5%, 8.0%, 8.5%, 9.0%, 9.5%, 10%.

[0041] In a specific embodiment of the present invention, the spraying time can be 1 min, 2 min, 3 min, 4 min, 5 min, 6 min, 7 min, 8 min, 9 min, 10 min.

[0042] In a specific embodiment of the present invention, the solid content of the aqueous binder solution can be 5%, 10%, 15%, 20%.

[0043] As a specific embodiment of the above-mentioned micro speaker module of the present invention, in the preparation process of the sound-absorbing block, a dispersion aid can be added to the slurry. The dispersion aid includes one or more of ethylene glycol, glycerol, polyethylene glycol, etc. The addition amount of the dispersion aid is 0.5%-3% of the weight of the molecular sieve particles.

[0044] In a specific embodiment of the present invention, the addition amount of the dispersion aid can be 0.5%, 1.0%, 1.5%, 2.0%, 2.5%, 3.0% of the weight of the molecular sieve particles.

[0045] As a specific embodiment of the above-mentioned micro speaker module of the present invention, the porous material used includes one or more of foam, asbestos and chemical fiber blocks.

[0046] As a specific embodiment of the above-mentioned micro speaker module of the present invention, the porous material is immersed in the slurry and then dried at 80-160 °C for 12-24 h to make a sound-absorbing block.

[0047] As a specific embodiment of the above-mentioned micro speaker module of the present invention, the particle size range of the sound-absorbing particles is 300-700 μm, and the sound-absorbing particles have first-stage pores with a pore size range of 0.3-0.7 nm, second-stage pores with a pore size range of 20-50 nm, and third-stage pores with a pore size range of 1-10 μm. Among them, the first-stage pores are micropores of molecular sieve particles, and the second-stage and third-stage pores are pores formed between molecular sieve particles.

[0048] As a specific embodiment of the above-mentioned micro speaker module of the present invention, the sound-absorbing particles are prepared by bonding a number of molecular sieve particles with an adhesive.

[0049] As a specific embodiment of the above-mentioned micro speaker module of the present invention, the particle size range of the molecular sieve particles is 0.5-10 μm, the micropore diameter is 0.3-0.7 nm, and the Si / Al ratio is 200 or more, preferably 400 or more.

[0050] As a specific embodiment of the above-mentioned micro speaker module of the present invention, the molecular sieve particles are a combination of one or more of MFI molecular sieve and / or FER molecular sieve.

[0051] As a specific embodiment of the above-mentioned micro speaker module of the present invention, the adhesive includes an organic adhesive and / or an inorganic adhesive; based on the total weight of the sound-absorbing particles being 100%, the content of the solid component of the organic adhesive in the sound-absorbing particles is 5%-15%; based on the total weight of the sound-absorbing particles being 100%, the content of the inorganic adhesive in the sound-absorbing particles is 4%-10%.

[0052] In a specific embodiment of the present invention, based on the total weight of the sound-absorbing particles being 100%, the content of the solid component of the organic adhesive in the sound-absorbing particles can be 5%, 6%, 7%, 8%, 9%, 10%, 11%, 12%, 13%, 14%, and 15%.

[0053] In a specific embodiment of the present invention, based on the total weight of the sound-absorbing particles being 100%, the content of the inorganic adhesive in the sound-absorbing particles is 4%, 5%, 6%, 7%, 8%, 9%, 10%.

[0054] As a specific embodiment of the above-mentioned micro speaker module of the present invention, the organic adhesive includes a combination of one or several of poly(styrene acrylic acid) emulsion, polystyrene acetic acid emulsion, styrene butadiene rubber emulsion, poly(styrene acrylate) emulsion, and polyacrylate emulsion.

[0055] As a specific embodiment of the above-mentioned micro speaker module of the present invention, based on the total weight of the organic adhesive being 100%, the content of the solid component in the organic adhesive is 40%-60%.

[0056] In a specific embodiment of the present invention, based on the total weight of the organic binder being 100%, the solid component content in the organic binder can be 40%, 45%, 50%, 55%, or 60%.

[0057] As a specific embodiment of the above-mentioned micro speaker module of the present invention, wherein the inorganic binder includes one or more of kaolin, silica sol, aluminum sol, and carboxymethyl cellulose.

[0058] As a specific embodiment of the above-mentioned micro speaker module of the present invention, wherein the preparation method of the sound-absorbing particles includes the following steps:

[0059] Mix molecular sieve microparticles, binder, and heat-conducting additive into a slurry (slurry or suspension), then granulate the slurry, and then dry the obtained particles after granulation to obtain sound-absorbing particles;

[0060] Preferably, the dosage of the heat-conducting additive is 0.5%-20% of the mass of the molecular sieve microparticles, more preferably 0.5%-10%, and further preferably 1%-5%;

[0061] Or mix molecular sieve microparticles and binder into a slurry, then granulate the slurry, and then dry the obtained particles after granulation. Finally, spray a solution prepared by mixing the heat-conducting additive and an aqueous binder solution on the surface of the dried particles to obtain sound-absorbing particles;

[0062] Preferably, based on the total weight of the solution being 100%, the content of the heat-conducting additive is 1%-10%, more preferably 2%-7%;

[0063] Also preferably, the spraying time is 1-10 min to control the thickness of the surface coating and reduce the influence on the pore channels on the surface of the sound-absorbing particles;

[0064] Also preferably, the solid content of the aqueous binder solution is 5%-20%; more preferably, the binder includes one or more of poly styrene acrylic acid emulsion, polystyrene acetic acid emulsion, styrene-butadiene rubber emulsion, and carboxymethyl cellulose.

[0065] As a specific embodiment of the above-mentioned micro speaker module of the present invention, wherein, during the preparation process of the sound-absorbing particles, a dispersion aid can be added to the slurry. The dispersion aid includes one or more of ethylene glycol, glycerol, polyethylene glycol, etc., and the addition amount of the dispersion aid is 0.5%-3% of the weight of the molecular sieve microparticles. In a specific embodiment of the present invention, the addition amount of the dispersion aid can be 0.5%, 1.0%, 1.5%, 2.0%, 2.5%, or 3.0% of the weight of the molecular sieve microparticles.

[0066] In a specific embodiment of the present invention, the dosage of the heat-conducting additive can be 0.5%, 1.0%, 1.5%, 2.0%, 2.5%, 3.0%, 3.5%, 4.0%, 4.5%, 5.0%, 5.5%, 6.0%, 6.5%, 7.0%, 7.5%, 8.0%, 8.5%, 9.0%, 9.5%, 10%, 10.5%, 11.0%, 11.5%, 12.0%, 12.5%, 13.0%, 13.5%, 14.0%, 14.5%, 15.0%, 15.5%, 16.0%, 16.5%, 17.0%, 17.5%, 18.0%, 18.5%, 19.0%, 19.5%, 20% of the mass of the molecular sieve particles.

[0067] In a specific embodiment of the present invention, based on the total weight of the solution being 100%, the concentration of the heat-conducting additive can be 1.0%, 1.5%, 2.0%, 2.5%, 3.0%, 3.5%, 4.0%, 4.5%, 5.0%, 5.5%, 6.0%, 6.5%, 7.0%, 7.5%, 8.0%, 8.5%, 9.0%, 9.5%, 10%.

[0068] In a specific embodiment of the present invention, the spraying time can be 1 min, 2 min, 3 min, 4 min, 5 min, 6 min, 7 min, 8 min, 9 min, 10 min.

[0069] In a specific embodiment of the present invention, the solid content of the aqueous binder solution can be 5%, 10%, 15%, 20%.

[0070] As a specific embodiment of the above-mentioned micro speaker module of the present invention, in the preparation process of the sound-absorbing particles, granulation can be carried out by means of fluidized bed or spray granulation; after granulation, the formed particles can be dried by means of a heat flow tower or low-temperature freeze-drying, and the present invention does not make specific requirements on the temperature and time of drying here, and those skilled in the art can reasonably select the drying parameters according to actual operation needs as long as the purpose of the present invention can be achieved.

[0071] As a specific embodiment of the above-mentioned micro speaker module of the present invention, the thickness of the sound-absorbing sheet is 100 - 1000 μm, and it has first-stage pores with a pore size range of 0.3 - 0.7 nm and second-stage pores with a pore size range of 20 - 50 nm. Among them, the first-stage pores are the micropores of the molecular sieve particles, and the second-stage pores are the pores formed between the molecular sieve particles.

[0072] As a specific embodiment of the above-mentioned micro speaker module of the present invention, the sound-absorbing sheet is prepared by directly spraying a solution containing molecular sieve particles, binder, and heat-conducting additive on the inner wall of the rear cavity of the micro speaker module.

[0073] As a specific embodiment of the above-mentioned micro speaker module of the present invention, the particle size range of the molecular sieve particles is 0.5 - 10 μm, the micropore aperture is 0.3 - 0.7 nm, and the Si / Al ratio is 200 or more, more preferably 400 or more.

[0074] As a specific embodiment of the above-mentioned micro speaker module of the present invention, the molecular sieve particles are one or more of MFI zeolite and / or FER zeolite.

[0075] As a specific embodiment of the above-mentioned micro speaker module of the present invention, the binder includes organic binder and / or inorganic binder; based on the total weight of the sound-absorbing sheet being 100%, the content of the solid component of the organic binder in the sound-absorbing sheet is 5% - 20%, preferably 10% - 20%; based on the total weight of the sound-absorbing sheet being 100%, the content of the inorganic binder in the sound-absorbing sheet is 4% - 15%, preferably 5% - 15%.

[0076] In a specific embodiment of the present invention, based on the total weight of the sound-absorbing sheet being 100%, the content of the solid component of the organic binder in the sound-absorbing sheet can be 5%, 6%, 7%, 8%, 9%, 10%, 11%, 12%, 13%, 14%, 15%, 16%, 17%, 18%, 19%, 20%.

[0077] In a specific embodiment of the present invention, based on the total weight of the sound-absorbing sheet being 100%, the content of the inorganic binder in the sound-absorbing sheet is 4%, 5%, 6%, 7%, 8%, 9%, 10%, 11%, 12%, 13%, 14%, 15%.

[0078] As a specific embodiment of the above-mentioned micro speaker module of the present invention, the organic binder includes one or a combination of several of poly styrene acrylic acid emulsion, polystyrene acetic acid emulsion, styrene butadiene rubber emulsion, polystyrene acrylate emulsion, and polyacrylate emulsion.

[0079] As a specific embodiment of the above-mentioned micro speaker module of the present invention, based on the total weight of the organic binder being 100%, the content of the solid component in the organic binder is 40% - 60%.

[0080] In a specific embodiment of the present invention, based on the total weight of the organic binder being 100%, the content of the solid component in the organic binder can be 40%, 45%, 50%, 55%, 60%.

[0081] As a specific embodiment of the above-mentioned micro-speaker module of the present invention, wherein the inorganic adhesive includes one or more of kaolin, silica sol, aluminum sol, and carboxymethyl cellulose.

[0082] As a specific embodiment of the above-mentioned micro-speaker module of the present invention, wherein the dosage of the heat-conducting additive is 0.5%-20% of the mass of the molecular sieve particles, preferably 0.5%-10%, and more preferably 1%-5%.

[0083] In a specific embodiment of the present invention, the dosage of the heat-conducting additive can be 0.5%, 1.0%, 1.5%, 2.0%, 2.5%, 3.0%, 3.5%, 4.0%, 4.5%, 5.0%, 5.5%, 6.0%, 6.5%, 7.0%, 7.5%, 8.0%, 8.5%, 9.0%, 9.5%, 10%, 10.5%, 11%, 11.5%, 12.0%, 12.5%, 13.0%, 13.5%, 14.0%, 14.5%, 15.0%, 15.5%, 16.0%, 16.5%, 17.0%, 17.5%, 18.0%, 18.5%, 19.0%, 19.5%, 20.0% of the mass of the molecular sieve particles.

[0084] As a specific embodiment of the above-mentioned micro-speaker module of the present invention, wherein a certain amount of expandable microspheres is added to the heat-conducting and sound-absorbing material.

[0085] As a specific embodiment of the above-mentioned micro-speaker module of the present invention, wherein, based on the total weight of the heat-conducting and sound-absorbing material being 100%, the addition amount of the expandable microspheres is 1wt.% - 10wt.%, and more preferably 2wt.% - 6wt.%.

[0086] In a specific embodiment of the present invention, based on the total weight of the heat-conducting and sound-absorbing material being 100%, the addition amount of the expandable microspheres can be 1.0wt.%, 1.5wt.%, 2.0wt.%, 2.5wt.%, 3.0wt.%, 3.5wt.%, 4.0wt.%, 4.5wt.%, 5.0wt.%, 5.5wt.%, 6.0wt.%, 6.5wt.%, 7.0wt.%, 7.5wt.%, 8.0wt.%, 8.5wt.%, 9.0wt.%, 9.5wt.%, 10wt.%.

[0087] As a specific embodiment of the above-mentioned micro-speaker module of the present invention, wherein the particle size range of the expandable microspheres is 200 - 400μm.

[0088] As a specific embodiment of the above-mentioned micro speaker module of the present invention, wherein the expandable microspheres are expandable microspheres with a core-shell structure, and the shell material of the expandable microspheres is an expandable polymer; the core structure of the expandable microspheres is made of a blowing agent.

[0089] As a specific embodiment of the above-mentioned micro speaker module of the present invention, wherein the expandable polymer includes one or a combination of several of polystyrene, methyl methacrylate polymer, styrene-butyl acrylate polymer, methyl methacrylate-butyl acrylate polymer, polyurethane polymer, vinyl acetate polymer, urea-formaldehyde polymer, and melamine formaldehyde polymer.

[0090] As a specific embodiment of the above-mentioned micro speaker module of the present invention, wherein the blowing agent includes one or more of petroleum ether, butane, pentane, and isopentane.

[0091] As a specific embodiment of the above-mentioned micro speaker module of the present invention, wherein a heat conduction additive is further added to the shell layer. Based on the total weight of the shell layer being 100%, the addition amount of the heat conduction additive is 1% - 20%.

[0092] In a specific embodiment of the present invention, based on the total weight of the shell layer being 100%, the addition amount of the heat conduction additive can be 1.0%, 1.5%, 2.0%, 2.5%, 3.0%, 3.5%, 4.0%, 4.5%, 5.0%, 5.5%, 6.0%, 6.5%, 7.0%, 7.5%, 8.0%, 8.5%, 9.0%, 9.5%, 10%, 12.5%, 15%, 17.5%, and 20%.

[0093] As a specific embodiment of the above-mentioned micro speaker module of the present invention, wherein the preparation method of the expandable microspheres includes the following specific steps:

[0094] Add a blowing agent to the suspended expandable polymer beads. Under the conditions of heating and pressurization, the blowing agent penetrates into the expandable polymer beads, causing the beads to swell. After cooling, it remains in the beads to form expandable microspheres. The expandable microspheres prepared by the present invention conduct heat through the shell layer, and the excess heat triggers the reaction of the blowing agent, causing itself to expand.

[0095] As a specific embodiment of the above-mentioned micro speaker module of the present invention, wherein during the preparation process of the expandable microspheres, a heat conduction additive can be added to the expandable polymer bead raw material (i.e., the expandable polymer) in advance, and then high thermal conductivity expandable polymer beads can be obtained through melt extrusion. The weight content of the heat conduction additive in the high thermal conductivity expandable polymer beads is 1% - 20%.

[0096] In addition, the present invention does not make specific requirements for the heating and pressurization conditions in the preparation process of the expandable microspheres. Those skilled in the art can reasonably set the temperature and pressure conditions according to actual operation needs, as long as the purpose of the present invention can be achieved.

[0097] As a specific embodiment of the above-mentioned micro speaker module of the present invention, when the heat-conducting sound-absorbing material is sound-absorbing particles, the lower shell is provided with a filling hole for filling sound-absorbing particles into the rear cavity.

[0098] When the heat-conducting sound-absorbing material is a sound-absorbing sheet or a sound-absorbing block, the sound-absorbing sheet or the sound-absorbing block needs to be placed in the rear cavity in advance.

[0099] As a specific embodiment of the above-mentioned micro speaker module of the present invention, helium gas is further filled in the rear cavity of the micro speaker module. Usually, the rear cavity of the micro speaker module contains air, and the present invention uses the rare gas helium to replace the air in the rear cavity so that the rear cavity is filled with helium. Since the thermal conductivity of helium is higher than that of nitrogen in the air, filling the rear cavity of the micro speaker module with helium can increase the heat dissipation capacity of the internal space of the rear cavity of the micro speaker module, thereby improving the overall heat dissipation capacity of the micro speaker module.

[0100] As a specific embodiment of the above-mentioned micro speaker module of the present invention, the side wall of the horn unit facing the rear cavity is provided with a sound outlet hole.

[0101] As a specific embodiment of the above-mentioned micro speaker module of the present invention, a mesh is arranged on the surface of the sound outlet hole, and the mesh is used to isolate the heat-conducting sound-absorbing material and can appropriately adjust the acoustic performance of the horn unit.

[0102] On the other hand, the present invention also provides a smart phone, which includes the above-mentioned micro speaker module.

[0103] The rear cavity of the micro speaker module provided by the present invention is filled with a high heat-conducting sound-absorbing material. The high heat-conducting sound-absorbing material can not only utilize its high virtual rear cavity increase coefficient to improve the acoustic performance of the micro speaker module, but also increase the heat dissipation of the space around the horn unit through its own high heat conductivity far higher than that of air, thereby improving the overall heat dissipation capacity of the micro speaker module. BRIEF DESCRIPTION OF THE DRAWINGS

[0104] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0105] Figure 1a Isometric view (back) of the micro speaker module provided in the embodiment of the present invention.

[0106] Figure 1b Isometric view (front) of the micro speaker module provided in the embodiment of the present invention.

[0107] Figure 2 Partial component diagram of the micro speaker module provided in the embodiment of the present invention.

[0108] Figure 3 Cross-sectional view of the micro speaker module provided in the embodiment of the present invention.

[0109] Figure 4 Voice coil temperature rise curve graph of the micro speaker modules provided in Embodiment 1, Comparative Example 1 and Comparative Example 2 of the present invention.

[0110] Description of main attached drawing reference numerals:

[0111] 11. Upper shell;

[0112] 12. Lower shell;

[0113] 13. Speaker unit;

[0114] 14. Filling hole;

[0115] 15. Damping;

[0116] 131. Mesh cloth;

[0117] 21. Rear cavity;

[0118] 22. Front cavity;

[0119] 31. High thermal conductivity sound absorbing material. Specific implementation manners

[0120] In order to have a clearer understanding of the technical features, objectives and beneficial effects of the present invention, the technical solutions of the present invention will be described in detail below with reference to the following specific embodiments, but it should not be construed as a limitation on the implementable scope of the present invention.

[0121] It should be noted that the term "including" and any deformation thereof in the specification and claims of the present invention and the above-mentioned drawings are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device including a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0122] In the present invention, the orientation or positional relationship indicated by terms such as "upper", "lower", "inner", "middle", etc. is based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit that the indicated device, element or component must have a specific orientation, or be constructed and operated in a specific orientation.

[0123] Moreover, in addition to being used to represent the orientation or positional relationship, some of the above terms may also be used to represent other meanings. For example, the term "upper" may also be used to represent a certain attachment relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in the present invention can be understood according to specific circumstances.

[0124] In addition, the terms "arrangement" and "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or there can be internal communication between two devices, elements or components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0125] Embodiment 1

[0126] This embodiment provides a micro speaker module, and its structural schematic diagram is as shown in Figure 1a , Figure 1b , Figure 2 and Figure 3 . It can be seen from Figure 1a , Figure 1b , Figure 2 and Figure 3 that the micro speaker module includes: an upper shell 11, a lower shell 12 and a speaker unit 13; the speaker unit 13 is installed on the upper shell 11, the upper shell 11 and the speaker unit 13 form a front cavity 22, the lower shell 12 and the speaker unit 13 form a rear cavity 21 and at least a part of the speaker unit 13 is located in the rear cavity 21, and a highly thermally conductive sound-absorbing material 31 is filled in the rear cavity 21; the upper shell 11 and the lower shell 12 are assembled and fixedly connected by ultrasonic or glue; the side wall (short-axis side wall) of the speaker unit 13 facing the rear cavity 21 is provided with a sound outlet hole, and a mesh cloth 131 is arranged on the surface of the sound outlet hole to isolate the highly thermally conductive sound-absorbing material 31.

[0127] In this embodiment, the lower shell 12 is provided with a filling hole 14 for filling sound-absorbing particles into the rear cavity 21.

[0128] In this embodiment, a damping 15 is further arranged on the lower shell 12.

[0129] In this embodiment, the position of the speaker unit in the lower shell of the micro speaker module is hollowed out. After assembly, the magnetic conductive plate of the speaker unit is exposed. The gap between the magnetic conductive plate of the speaker unit and the lower shell is sealed with glue to ensure airtightness.

[0130] Alternatively, the position of the speaker unit in the lower shell of the micro speaker module is not hollowed out, and the injection molding material is a material with a high thermal conductivity coefficient such as SUS, or the lower shell of the micro speaker module uses a steel sheet structure as much as possible.

[0131] In this embodiment, the high thermal conductivity sound absorbing material 31 is high thermal conductivity sound absorbing particles. The high thermal conductivity sound absorbing particles have a particle size range of 360 - 450 μm, an average particle size of 390 μm. The particles have first - stage pores with a size of 0.3 - 0.7 nm, an average pore diameter of 0.62 nm, second - stage pores with a size of 20 - 50 nm, an average pore diameter of 27.5 nm, and third - stage pores with a size of 1 - 10 μm, an average pore diameter of 6.2 μm.

[0132] The high thermal conductivity sound absorbing particles are prepared by bonding a number of molecular sieve particles with an adhesive. The preparation method includes the following specific steps:

[0133] Place the molecular sieve particles in a certain amount of deionized water, add a certain amount of dispersion aid, and stir to disperse evenly to obtain solution A.

[0134] Mix the adhesive and the thermal conductivity additive in a certain amount of deionized water, and stir to disperse evenly to obtain solution B.

[0135] Add solution B to solution A, and stir and mix evenly to obtain solution C.

[0136] Use spray drying method to spray - granulate and dry the solution C to prepare the high thermal conductivity sound absorbing particles.

[0137] In this embodiment, the molecular sieve particles are ZSM - 5 molecular sieves with an average particle size of 2 μm, a micropore diameter of 0.3 - 0.7 nm, an average pore diameter of 0.62 nm, and a Si / Al ratio of 420.

[0138] The adhesive is a polyacrylic acid emulsion. Based on the total weight of the emulsion being 100%, the solid component content in the emulsion is 50%; based on the total weight of the sound absorbing particles being 100%, the content of the solid component of the sound absorbing particle adhesive is 7%.

[0139] The dispersion aid is ethylene glycol, and the addition amount of the dispersion aid is 1% of the weight of the molecular sieve particles.

[0140] The thermal conductivity additive is graphene. The average particle size of the graphene particles is 200 nm, and the addition amount is 1% of the mass of the molecular sieve particles.

[0141] Example 2

[0142] This example provides a micro speaker module, which is different from the micro speaker module provided in Example 1 in that: in this Example 2, the thermal conductivity additive is graphene, the average particle size of the graphene particles is 200 nm, and the addition amount is 3% of the mass of the molecular sieve particles.

[0143] Example 3

[0144] This example provides a micro speaker module, which is different from the micro speaker module provided in Example 1 in that: in this Example 3, the thermal conductivity additive is graphene, the average particle size of the graphene particles is 200 nm, and the addition amount is 5% of the mass of the molecular sieve particles.

[0145] Example 4

[0146] This example provides a micro speaker module, which is different from the micro speaker module provided in Example 1 in that: in this Example 4, the thermal conductivity additive is graphene, the average particle size of the graphene particles is 200 nm, and the addition amount is 7% of the mass of the molecular sieve particles.

[0147] Example 5

[0148] This example provides a micro speaker module, which is different from the micro speaker module provided in Example 1 in that: in this Example 5, the thermal conductivity additive is alumina, the average particle size of the alumina particles is 200 nm, and the addition amount is 1% of the mass of the molecular sieve particles.

[0149] Example 6

[0150] This example provides a micro speaker module, which is different from the micro speaker module provided in Example 1 in that: in this Example 6, the thermal conductivity additive is alumina, the average particle size of the alumina particles is 200 nm, and the addition amount is 3% of the mass of the molecular sieve particles.

[0151] Example 7

[0152] This example provides a micro speaker module, which is different from the micro speaker module provided in Example 1 in that: in this Example 7, the thermal conductivity additive is alumina, the average particle size of the alumina particles is 200 nm, and the addition amount is 5% of the mass of the molecular sieve particles.

[0153] Example 8

[0154] This embodiment provides a micro speaker module, which is different from the micro speaker module provided in Embodiment 1 in that: in this Embodiment 8, the thermal conductive additive is alumina, the average particle size of the alumina particles is 200 nm, and the addition amount is 7% of the mass of the molecular sieve particles.

[0155] Embodiment 9

[0156] This embodiment provides a micro speaker module, which is different from the micro speaker module provided in Embodiment 1 in that: in this Embodiment 9, the thermal conductive additive is magnesia, the average particle size of the magnesia particles is 200 nm, and the addition amount is 1% of the mass of the molecular sieve particles.

[0157] Embodiment 10

[0158] This embodiment provides a micro speaker module, which is different from the micro speaker module provided in Embodiment 1 in that: in this Embodiment 10, the thermal conductive additive is magnesia, the average particle size of the magnesia particles is 200 nm, and the addition amount is 5% of the mass of the molecular sieve particles.

[0159] Embodiment 11

[0160] This embodiment provides a micro speaker module, which is different from the micro speaker module provided in Embodiment 1 in that: in this Embodiment 11, the molecular sieve particles are ZSM-5 molecular sieves with an average particle size of 2 μm, a micropore diameter of 0.3 - 0.7 nm, an average pore diameter of 0.62 nm, and an Si / Al ratio of 420;

[0161] The binder is a polyacrylic acid styrene emulsion. Based on the total weight of the emulsion being 100%, the solid component content in the emulsion is 50%; based on the total weight of the sound-absorbing particles being 100%, the content of the solid components of the sound-absorbing particle binder is 7%;

[0162] The dispersion aid is glycerol, and the addition amount of the dispersion aid is 1% of the weight of the molecular sieve particles;

[0163] The thermal conductive additive is graphene, the average particle size of the graphene particles is 200 nm, and the addition amount is 3% of the mass of the molecular sieve particles.

[0164] Embodiment 12

[0165] This embodiment provides a micro speaker module, which is different from the micro speaker module provided in Embodiment 1 in that: in this Embodiment 12, the molecular sieve particles are ZSM-5 molecular sieves with an average particle size of 3 μm, a micropore diameter of 0.3 - 0.7 nm, an average pore diameter of 0.62 nm, and an Si / Al ratio of 420;

[0166] The adhesive is a polystyrene acetic acid emulsion. Based on the total weight of the emulsion being 100%, the solid component content in the emulsion is 40%; based on the total weight of the sound-absorbing particles being 100%, the content of the solid components of the sound-absorbing particle adhesive is 9%.

[0167] The dispersion aid is glycerol, and the addition amount of the dispersion aid is 1% of the weight of the molecular sieve particles.

[0168] The thermal conductivity additive is graphene. The average particle size of the graphene particles is 200 nm, and the addition amount is 3% of the mass of the molecular sieve particles.

[0169] Example 13

[0170] This example provides a micro speaker module. Among them, the micro speaker module includes: an upper shell, a lower shell and a speaker unit; the speaker unit is installed on the upper shell, and the upper shell and the speaker unit form a front cavity. The lower shell and the speaker unit form a rear cavity and at least a part of the speaker unit is located in the rear cavity. The rear cavity is also filled with a high thermal conductivity sound-absorbing material; the upper shell and the lower shell are assembled and fixedly connected by ultrasonic or glue; the side wall (short-axis side wall) of the speaker unit facing the rear cavity is provided with a sound outlet hole, and a mesh is arranged on the surface of the sound outlet hole to isolate the high thermal conductivity sound-absorbing material.

[0171] In this example, damping is also provided on the lower shell.

[0172] In this example, the position of the speaker unit on the lower shell of the micro speaker module is hollowed out. After assembly, the magnetic conductive plate of the speaker unit is exposed, and the gap between the magnetic conductive plate of the speaker unit and the lower shell is sealed with glue to ensure no air leakage;

[0173] Or the position of the speaker unit on the lower shell of the micro speaker module is not hollowed out, and the injection molding material is a material with a high thermal conductivity coefficient such as SUS, or the lower shell of the micro speaker module uses a steel sheet structure as much as possible.

[0174] In this example, the high thermal conductivity sound-absorbing material is a high thermal conductivity sound-absorbing block. The high thermal conductivity sound-absorbing block has first-stage pores with a pore size range of 0.3 - 0.7 nm, an average pore size of 0.62 nm, second-stage pores with a pore size range of 20 - 50 nm, an average pore size of 27.5 nm, and third-stage pores with a pore size range of 1 - 100 μm, an average pore size of 60 μm;

[0175] The high thermal conductivity sound-absorbing block is prepared by bonding a number of molecular sieve particles with an adhesive. Its preparation method includes the following specific steps:

[0176] Place the molecular sieve particles in a certain amount of deionized water, add a certain amount of dispersion aid, and stir and disperse evenly to obtain solution A;

[0177] Mix the binder and the thermal conductive additive in a certain amount of deionized water, stir and disperse evenly to obtain Solution B;

[0178] Add Solution B to Solution A, stir and mix evenly to obtain Solution C;

[0179] Inject Solution C into a mold, perform vacuum degassing, and then freeze-dry or dry and cure to form a shape;

[0180] Use an array of needles to create third-level pores with an average pore diameter of 60 μm on the surface of the cured and formed sound-absorbing block, and after demolding, obtain a high thermal conductive sound-absorbing block.

[0181] In this embodiment, the molecular sieve particles are ZSM-5 molecular sieves with an average particle size of 2 μm, a micropore diameter of 0.3 - 0.7 nm, an average pore diameter of 0.62 nm, and an Si / Al ratio of 420;

[0182] The binder is a styrene-butadiene rubber emulsion. Based on the total weight of the emulsion being 100%, the solid component content in the binder is 40%; based on the total weight of the sound-absorbing block being 100%, the content of the solid component of the binder in the sound-absorbing block is 12%;

[0183] The dispersion aid is glycerol, and the addition amount of the dispersion aid is 1% of the weight of the molecular sieve particles;

[0184] The thermal conductive additive is alumina, the average particle size of the alumina particles is 500 nm, and the addition amount is 1% of the mass of the molecular sieve particles.

[0185] Example 14

[0186] This embodiment provides a micro speaker module, which is different from the micro speaker module provided in Example 13 in that: in this Example 14, the molecular sieve particles are ZSM-5 molecular sieves with an average particle size of 2 μm, a micropore diameter of 0.3 - 0.7 nm, an average pore diameter of 0.62 nm, and an Si / Al ratio of 420;

[0187] The binder is a polystyrene acetic acid emulsion. Based on the total weight of the emulsion being 100%, the solid component content in the binder is 40%; based on the total weight of the sound-absorbing block being 100%, the content of the solid component of the binder in the sound-absorbing block is 15%;

[0188] The dispersion aid is glycerol, and the addition amount of the dispersion aid is 1% of the weight of the molecular sieve particles;

[0189] The thermal conductive additive is alumina, the average particle size of the alumina particles is 500 nm, and the addition amount is 3% of the mass of the molecular sieve particles.

[0190] Example 15

[0191] This embodiment provides a micro speaker module, which is different from the micro speaker module provided in Embodiment 13 in that: in this Embodiment 15, the molecular sieve particles are ZSM-5 molecular sieves with an average particle size of 2 μm, a micropore diameter of 0.3 - 0.7 nm, an average pore diameter of 0.62 nm, and an Si / Al ratio of 420;

[0192] The binder is a silica sol solution. Based on the total weight of the solution being 100%, the solid component content in the binder is 30%; based on the total weight of the sound-absorbing block being 100%, the content of the solid component of the binder in the sound-absorbing block is 8%;

[0193] The dispersion aid is polyethylene glycol, and the addition amount of the dispersion aid is 1% of the weight of the molecular sieve particles;

[0194] The heat conduction additive is alumina. The average particle size of the alumina particles is 500 nm, and the addition amount is 5% of the mass of the molecular sieve particles.

[0195] Embodiment 16

[0196] This embodiment provides a micro speaker module, wherein the micro speaker module includes: an upper shell, a lower shell, and a speaker unit; the speaker unit is installed on the upper shell, and the upper shell and the speaker unit form a front cavity. The lower shell and the speaker unit form a rear cavity and at least a part of the speaker unit is located in the rear cavity. The rear cavity is also filled with a high heat conduction sound-absorbing material; the upper shell and the lower shell are assembled and fixedly connected by ultrasonic or glue; the side wall (short-axis side wall) of the speaker unit facing the rear cavity is provided with a sound outlet hole, and a mesh cloth is arranged on the surface of the sound outlet hole to isolate the high heat conduction sound-absorbing material.

[0197] In this embodiment, damping is also provided on the lower shell.

[0198] In this embodiment, the position of the speaker unit on the lower shell of the micro speaker module is hollowed out, and after assembly, the magnetic conductive plate of the speaker unit is exposed. Glue is used to seal the gap between the magnetic conductive plate of the speaker unit and the lower shell to ensure no air leakage;

[0199] Or the position of the speaker unit on the lower shell of the micro speaker module is not hollowed out, and the injection molding material is a material with a high heat conduction coefficient such as SUS, or as much steel sheet structure as possible is used for the lower shell of the micro speaker module.

[0200] In this embodiment, the high thermal conductivity sound-absorbing material is a high thermal conductivity sound-absorbing block, which has first-stage pores with a pore size range of 0.3 - 0.7 nm, an average pore size of 0.62 nm, second-stage pores with a pore size range of 20 - 50 nm, an average pore size of 27.5 nm, and third-stage pores with a pore size range of 1 - 100 μm, an average pore size of 60 μm;

[0201] The high thermal conductivity sound-absorbing block is prepared by bonding a number of molecular sieve particles with an adhesive, and its preparation method includes the following specific steps:

[0202] Place the molecular sieve particles in a certain amount of deionized water, add a quantitative dispersion aid, and stir to disperse evenly to obtain solution A;

[0203] Mix the adhesive and the thermal conductivity additive in a certain amount of deionized water, and stir to disperse evenly to obtain solution B;

[0204] Add solution B to solution A, and stir and mix evenly to obtain solution C;

[0205] Immerse the porous block substrate (porous material, such as one or more of foam, asbestos, and chemical fiber blocks) in solution C for 10 min, take it out and dry it in an oven at 140 °C for 12 h to make a sound-absorbing block;

[0206] In this embodiment, the molecular sieve particles are ZSM-5 molecular sieves with a particle size range of 2 μm, a micropore size of 0.3 - 0.7 nm, an average pore size of 0.62 nm, and an Si / Al ratio of 420;

[0207] The adhesive is styrene-butadiene rubber latex. Based on the total weight of the latex being 100%, the solid component content in the adhesive is 40%; based on the total weight of the sound-absorbing block being 100%, the content of the solid component of the adhesive in the sound-absorbing block is 13%;

[0208] The dispersion aid is glycerol, and the addition amount of the dispersion aid is 1% of the weight of the molecular sieve particles;

[0209] The thermal conductivity additive is alumina, the average particle size of the alumina particles is 500 nm, and the addition amount is 1% of the mass of the molecular sieve particles.

[0210] Example 17

[0211] This embodiment provides a micro speaker module, which is different from the micro speaker module provided in Example 16 in that: in this Example 17, the molecular sieve particles are ZSM-5 molecular sieves with an average particle size of 2 μm, a micropore size of 0.3 - 0.7 nm, an average pore size of 0.62 nm, and an Si / Al ratio of 420;

[0212] The binder is kaolin powder, and based on the total weight of the sound-absorbing block being 100%, the content of kaolin in the sound-absorbing block is 7%;

[0213] The dispersion aid is polyethylene glycol, and the addition amount of the dispersion aid is 1.5% of the weight of the molecular sieve particles;

[0214] The thermal conductivity additive is alumina, the average particle size of the alumina particles is 500 nm, and the addition amount is 3% of the mass of the molecular sieve particles.

[0215] Example 18

[0216] This example provides a micro-speaker module, which is different from the micro-speaker module provided in Example 16 in that: in this Example 18, the molecular sieve particles are ZSM-5 molecular sieves with an average particle size of 2 μm, a micropore diameter of 0.3 - 0.7 nm, an average pore diameter of 0.62 nm, and a Si / Al ratio of 420;

[0217] The binder is a silica sol solution. Based on the total weight of the solution being 100%, the solid component content in the binder is 30%; based on the total weight of the sound-absorbing block being 100%, the content of the binder solid component in the sound-absorbing block is 8%;

[0218] The dispersion aid is polyethylene glycol, and the addition amount of the dispersion aid is 1% of the weight of the molecular sieve particles;

[0219] The thermal conductivity additive is graphene, the average particle size of the alumina particles is 200 nm, and the addition amount is 3% of the mass of the molecular sieve particles.

[0220] Example 19

[0221] This example provides a micro-speaker module, and its structural schematic diagram is as shown in Figure 1a 、 Figure 1b 、 Figure 2 and Figure 3 shown, from Figure 1a 、 Figure 1b 、 Figure 2 and Figure 3As can be seen, the micro speaker module includes: an upper shell 11, a lower shell 12, and a speaker unit 13; the speaker unit 13 is installed on the upper shell 11, and a front cavity 22 is formed between the upper shell 11 and the speaker unit 13. The lower shell 12 and the speaker unit 13 form a rear cavity 21, and at least a part of the speaker unit 13 is located in the rear cavity 21. A highly thermally conductive sound-absorbing material 31 is also filled in the rear cavity 21; the upper shell 11 and the lower shell 12 are assembled and fixedly connected by ultrasonic or glue; an acoustic hole is formed on the side wall (short-axis side wall) of the speaker unit 13 facing the rear cavity 21, and a mesh cloth 131 is arranged on the surface of the acoustic hole to isolate the highly thermally conductive sound-absorbing material 31.

[0222] In this embodiment, the lower shell 12 is provided with a filling hole 14.

[0223] In this embodiment, a damping 15 is further provided on the lower shell 12.

[0224] In this embodiment, the position of the speaker unit of the lower shell of the micro speaker module is hollowed out, so that the magnetic conductive plate of the speaker unit is exposed after assembly, and the gap between the magnetic conductive plate of the speaker unit and the lower shell is sealed with glue to ensure airtightness;

[0225] Alternatively, the position of the speaker unit of the lower shell of the micro speaker module is not hollowed out, and the injection molding material is a material with a high thermal conductivity coefficient such as SUS, or the lower shell of the micro speaker module adopts a steel sheet structure as much as possible.

[0226] In this embodiment, the highly thermally conductive sound-absorbing material 31 is a mixture of highly thermally conductive sound-absorbing particles and expandable thermally conductive microspheres. The highly thermally conductive sound-absorbing particles have an average particle size of 380 μm, the particles have first-stage pores with a size of 0.3 - 0.7 nm and an average pore size of 0.62 nm, second-stage pores with a size of 20 - 50 nm and an average pore size of 27.5 nm, and third-stage pores with a size of 1 - 10 μm and an average pore size of 5.6 μm; the expandable thermally conductive microspheres have an average particle size of 270 μm, and the proportion of the expandable thermally conductive microspheres in the thermally conductive sound-absorbing particles is 4.5 wt%;

[0227] Among them, the highly thermally conductive sound-absorbing particles are prepared by bonding a number of molecular sieve particles with an adhesive, and its preparation method includes the following specific steps:

[0228] Place the molecular sieve particles in a certain amount of deionized water, add a certain amount of dispersion aids, and stir and disperse evenly to obtain solution A;

[0229] Mix the adhesive and the thermal conductivity additive in a certain amount of deionized water, and stir and disperse evenly to obtain solution B;

[0230] Add solution B to solution A, stir and mix evenly to obtain solution C;

[0231] The high - thermal - conductivity sound - absorbing particles are prepared by spray granulation and drying of the solution C using the spray - drying method.

[0232] In this embodiment, the molecular sieve particles are ZSM - 5 molecular sieves with an average particle size of 2 μm, a micropore diameter of 0.3 - 0.7 nm, an average pore diameter of 0.62 nm, and an Si / Al ratio of 420.

[0233] The binder is a poly(styrene - acrylic acid) emulsion; based on the total weight of the poly(styrene - acrylic acid) emulsion being 100%, the solid component content in the poly(styrene - acrylic acid) emulsion is 50%; based on the total weight of the sound - absorbing particles being 100%, the content of the binder solid component in the sound - absorbing particles is 7%.

[0234] The dispersion aid is ethylene glycol, and the addition amount of the dispersion aid is 1% of the weight of the molecular sieve particles.

[0235] The thermal - conductivity additive is graphene. The thermal - conductivity additive powder has a particle size of 200 nm, and the addition amount is 1% of the mass of the molecular sieve particles.

[0236] Among them, the preparation method of the expandable thermal - conductivity microspheres includes the following specific steps:

[0237] Add 10 wt% (calculated based on the total weight of the expandable polymer) of the thermal - conductivity additive to the expandable polymer, mix using a kneader, and then extrude expandable polymer beads.

[0238] Use a solvent to make the expandable polymer beads into suspended expandable polymer beads, add a low - boiling - point hydrocarbon (such as one or more of petroleum ether, butane, pentane, and isopentane) or a halogenated hydrocarbon compound, and under heating and pressurization conditions, make the low - boiling - point hydrocarbon or halogenated hydrocarbon compound penetrate into the expandable polymer beads to form expandable thermal - conductivity microspheres with a core - shell structure.

[0239] In this embodiment, the expandable polymer is a methyl methacrylate polymer.

[0240] Example 20

[0241] This embodiment provides a micro - speaker module. Among them, the micro - speaker module includes: an upper shell, a lower shell, and a speaker unit; the speaker unit is installed on the upper shell, the upper shell and the speaker unit form a front cavity, the lower shell and the speaker unit form a rear cavity and at least a part of the speaker unit is located in the rear cavity, and a high - thermal - conductivity sound - absorbing material is filled in the rear cavity; the upper shell and the lower shell are assembled and fixedly connected by ultrasonic or glue; the side wall (short - axis side wall) of the speaker unit facing the rear cavity is provided with a sound - outlet hole, and a mesh cloth is arranged on the surface of the sound - outlet hole to isolate the high - thermal - conductivity sound - absorbing material.

[0242] In this embodiment, a damping is further provided on the lower shell.

[0243] In this embodiment, the position of the speaker unit on the lower shell of the micro speaker module is hollowed out. After assembly, the magnetic conductive plate of the speaker unit is exposed. The gap between the magnetic conductive plate of the speaker unit and the lower shell is sealed with glue to ensure no air leakage.

[0244] Or the position of the speaker unit on the lower shell of the micro speaker module is not hollowed out, and the injection molding material is a material with a high thermal conductivity coefficient such as SUS, or the lower shell of the micro speaker module adopts a steel sheet structure as much as possible.

[0245] In this embodiment, the high thermal conductivity sound absorbing material is a high thermal conductivity sound absorbing coating (i.e., a sound absorbing sheet). The high thermal conductivity sound absorbing coating has a thickness of 200 μm, a first-stage pore with a pore size range of 0.3 - 0.7 nm and an average pore size of 0.62 nm, and a second-stage pore with a pore size of 20 - 50 nm and an average pore size of 32 nm.

[0246] The high thermal conductivity sound absorbing coating is prepared by directly spraying a solution containing raw material components such as molecular sieve particles, binder, dispersion aid, and thermal conductivity additive on the inner wall of the rear cavity of the micro speaker module. Its specific preparation method includes the following steps:

[0247] Place the molecular sieve particles in a certain amount of deionized water, add a certain amount of dispersion aid, and stir and disperse evenly to obtain solution A.

[0248] Mix the binder and thermal conductivity additive in a certain amount of deionized water, and stir and disperse evenly to obtain solution B.

[0249] Add solution B to solution A, and stir and mix evenly to obtain solution C.

[0250] Spray solution C on the inner wall of the rear cavity of the micro speaker module, and dry it at 80 - 150 °C to obtain the high thermal conductivity sound absorbing coating.

[0251] In this embodiment, the molecular sieve particles are ZSM-5 molecular sieves with an average particle size of 2 μm, a micropore size of 0.3 - 0.7 nm, an average pore size of 0.62 nm, and an Si / Al ratio of 420.

[0252] The binder is a polystyrene acetic acid emulsion. Based on the total weight of the polystyrene acetic acid emulsion being 100%, the solid component content in the polystyrene acetic acid emulsion is 40%; based on the total weight of the sound absorbing sheet being 100%, the content of the binder solid component in the sound absorbing sheet is 12%.

[0253] The dispersion aid is glycerol, and the addition amount of the dispersion aid is 2% of the weight of the molecular sieve particles.

[0254] The thermal conductive additive is graphene. The powder of the thermal conductive additive has a particle size of 200 nm, and the addition amount is 2% of the mass of the molecular sieve particles.

[0255] Example 21

[0256] This embodiment provides a micro speaker module, and its structural schematic diagram is as shown in Figure 1a , Figure 1b , Figure 2 and Figure 3 . It can be seen from Figure 1a , Figure 1b , Figure 2 and Figure 3 that the micro speaker module includes: an upper shell 11, a lower shell 12 and a speaker unit 13; the speaker unit 13 is installed on the upper shell 11, and the upper shell 11 and the speaker unit 13 form a front cavity 22. The lower shell 12 and the speaker unit 13 form a rear cavity 21, and at least a part of the speaker unit 13 is located in the rear cavity 21. A highly thermally conductive sound-absorbing material 31 is also filled in the rear cavity 21; the upper shell 11 and the lower shell 12 are assembled and fixedly connected by ultrasonic waves or glue; an acoustic hole is opened on the side wall (short-axis side wall) of the speaker unit 13 facing the rear cavity 21, and a mesh cloth 131 is arranged on the surface of the acoustic hole to isolate the highly thermally conductive sound-absorbing material 31.

[0257] In this embodiment, the lower shell 12 is provided with a filling hole 14 for filling highly thermally conductive sound-absorbing particles into the rear cavity 21.

[0258] In this embodiment, a damping 15 is further arranged on the lower shell 12.

[0259] In this embodiment, the position of the speaker unit of the lower shell of the micro speaker module is hollowed out, so that the magnetic conductive plate of the speaker unit is exposed after assembly, and the gap between the magnetic conductive plate of the speaker unit and the lower shell is sealed with glue to ensure no air leakage;

[0260] Or the position of the speaker unit of the lower shell of the micro speaker module is not hollowed out, and the injection molding material is a material with a high thermal conductivity such as SUS, or as many steel sheet structures as possible are used for the lower shell of the micro speaker module.

[0261] In this embodiment, the rear cavity of the micro speaker module is sealed with glue, and He is filled in the rear cavity (that is, the air in the rear cavity of the micro speaker module provided in Example 1 is replaced with He).

[0262] In this embodiment, the high thermal conductivity sound-absorbing material 31 is high thermal conductivity sound-absorbing particles. The high thermal conductivity sound-absorbing particles have a particle size range of 360 - 450 μm, an average particle size of 390 μm. The particles have first-stage pores with a size of 0.3 - 0.7 nm, an average pore diameter of 0.62 nm, second-stage pores with a size of 20 - 50 nm, an average pore diameter of 27.5 nm, and third-stage pores with a size of 1 - 10 μm, an average pore diameter of 6.2 μm;

[0263] The high thermal conductivity sound-absorbing particles are prepared by bonding a number of molecular sieve particles with an adhesive. The preparation method includes the following specific steps:

[0264] Place the molecular sieve particles in a certain amount of deionized water, add a certain amount of dispersion aids, and stir to disperse evenly to obtain solution A;

[0265] Mix the adhesive and thermal conductivity additive in a certain amount of deionized water, and stir to disperse evenly to obtain solution B;

[0266] Add solution B to solution A, and stir and mix evenly to obtain solution C;

[0267] Use spray drying method to spray granulate and dry the solution C to prepare the high thermal conductivity sound-absorbing particles.

[0268] In this embodiment, the molecular sieve particles are ZSM-5 molecular sieves with an average particle size of 2 μm, a micropore diameter of 0.3 - 0.7 nm, an average pore diameter of 0.62 nm, and a Si / Al ratio of 420;

[0269] The adhesive is poly(styrene-acrylic acid) emulsion. Calculated based on the total weight of the emulsion being 100%, the solid component content in the emulsion is 50%; calculated based on the total weight of the sound-absorbing particles being 100%, the content of the solid component of the sound-absorbing particle adhesive is 7%;

[0270] The dispersion aid is ethylene glycol, and the addition amount of the dispersion aid is 1% of the weight of the molecular sieve particles;

[0271] The thermal conductivity additive is graphene. The average particle size of the graphene particles is 200 nm, and the addition amount is 1% of the mass of the molecular sieve particles.

[0272] Since the thermal conductivity of helium is higher than that of nitrogen in the air, filling the rear cavity of the micro speaker module provided in this embodiment with helium can increase the heat dissipation capacity of the internal space of the rear cavity of the micro speaker module, thereby improving the overall heat dissipation capacity of the micro speaker module.

[0273] Comparative Example 1

[0274] This comparative example provides a micro speaker module, which is different from the micro speaker module provided in Embodiment 1 only in that the rear cavity of the micro speaker module in this comparative example is not filled with a highly thermally conductive sound-absorbing material. Correspondingly, the lower shell is not provided with a filling hole.

[0275] Wherein, the micro speaker module includes: an upper shell, a lower shell and a speaker unit; the speaker unit is installed on the upper shell, the upper shell and the speaker unit form a front cavity, the lower shell and the speaker unit form a rear cavity and at least a part of the speaker unit is located in the rear cavity; the upper shell and the lower shell are assembled and fixedly connected by ultrasonic or glue; the side wall (short-axis side wall) of the speaker unit facing the rear cavity is provided with a sound outlet hole, and a mesh is arranged on the surface of the sound outlet hole to isolate the highly thermally conductive sound-absorbing material.

[0276] In this comparative example, damping is also provided on the lower shell.

[0277] In this comparative example, the position of the speaker unit on the lower shell of the micro speaker module is hollowed out, so that the magnetic conductive plate of the speaker unit is exposed after assembly, and the gap between the magnetic conductive plate of the speaker unit and the lower shell is sealed with glue to ensure airtightness.

[0278] Or the position of the speaker unit on the lower shell of the micro speaker module is not hollowed out, and the injection molding material is a material with a high thermal conductivity coefficient such as SUS, or as many steel sheet structures as possible are used for the lower shell of the micro speaker module.

[0279] Comparative Example 2

[0280] This comparative example provides a micro speaker module, which is different from the micro speaker module provided in Embodiment 1 only in that the rear cavity of the micro speaker module in this comparative example is filled with ordinary sound-absorbing particles.

[0281] Wherein, the micro speaker module includes: an upper shell, a lower shell and a speaker unit; the speaker unit is installed on the upper shell, the upper shell and the speaker unit form a front cavity, the lower shell and the speaker unit form a rear cavity and at least a part of the speaker unit is located in the rear cavity, and ordinary sound-absorbing particles are also filled in the rear cavity; the upper shell and the lower shell are assembled and fixedly connected by ultrasonic or glue; the side wall (short-axis side wall) of the speaker unit facing the rear cavity is provided with a sound outlet hole, and a mesh is arranged on the surface of the sound outlet hole to isolate the highly thermally conductive sound-absorbing material.

[0282] In this comparative example, the lower shell is provided with a filling hole.

[0283] In this comparative example, damping is also provided on the lower shell.

[0284] In this comparative example, the position of the speaker unit in the lower shell of the micro speaker module is hollowed out. After assembly, the magnetic conductive plate of the speaker unit is exposed, and glue is used to seal the gap between the magnetic conductive plate of the speaker unit and the lower shell to ensure no air leakage;

[0285] Alternatively, the position of the speaker unit in the lower shell of the micro speaker module is not hollowed out, and the injection molding material is a material with a high thermal conductivity coefficient such as SUS, or the lower shell of the micro speaker module uses as much steel sheet structure as possible;

[0286] In this comparative example, the ordinary sound-absorbing particles have a particle size of 380 μm, the particles have first-stage pores with a size of 0.3 - 0.7 nm, an average pore diameter of 0.62 nm, second-stage pores with a size of 20 - 50 nm, an average pore diameter of 27.5 nm, and third-stage pores with a size of 1 - 10 μm, an average pore diameter of 6.2 μm;

[0287] The ordinary sound-absorbing particles are prepared by bonding a number of molecular sieve particles with an adhesive, and its preparation method includes the following specific steps:

[0288] Place the molecular sieve particles in a certain amount of deionized water, add a certain amount of dispersion aid, and stir to disperse evenly to obtain solution A;

[0289] Mix the adhesive in a certain amount of deionized water, and stir to disperse evenly to obtain solution B;

[0290] Add solution B to solution A, and stir and mix evenly to obtain solution C;

[0291] Use spray drying method to spray granulate and dry the solution C to prepare the ordinary sound-absorbing particles.

[0292] In this comparative example, the molecular sieve particles are ZSM-5 molecular sieves with an average particle size of 2 μm, a micropore diameter of 0.3 - 0.7 nm, an average pore diameter of 0.62 nm, and a Si / Al ratio of 420;

[0293] The adhesive is polyacrylic acid emulsion. Based on the total weight of the emulsion being 100%, the solid component content in the emulsion is 50%; based on the total weight of the sound-absorbing particles being 100%, the content of the solid component of the sound-absorbing particle adhesive is 7%;

[0294] The dispersion aid is ethylene glycol, and the addition amount of the dispersion aid is 1% of the weight of the molecular sieve particles.

[0295] Comparative Example 3

[0296] This comparative example provides a micro speaker module, which is different from the micro speaker module provided in Example 1 only in that: no thermal conductivity additive is added when preparing the sound-absorbing particles.

[0297] Test Example

[0298] The performance comparison and temperature rise comparison of the micro-speaker modules provided in Example 1, Comparative Example 1, and Comparative Example 2 are shown in Table 1 below. The temperature rise and sound pressure level at 500 Hz in Table 1 are both measured by conventional methods in the art. Example 1 (corresponding to Figure 4 medium-high thermal conductivity sound-absorbing particles), Comparative Example 1 (corresponding to Figure 4 without sound-absorbing particles), and Comparative Example 2 (corresponding to Figure 4 ordinary sound-absorbing particles). The coil temperature rise curve diagrams of the micro-speaker modules provided are as shown in Figure 4 .

[0299] Table 1

[0300] Scheme Sound pressure level at 500 Hz Temperature rise Comparative example 1 84 dB 92℃ Comparative example 2 85.9 dB 85℃ Example 1 86.1 dB 72℃

[0301] As can be seen from Table 1 above and Figure 4 , compared with the micro-speaker modules provided in Comparative Example 1 and Comparative Example 2, the micro-speaker module provided in Example 1 of the present invention has its rear cavity filled with medium-high thermal conductivity sound-absorbing particles, and the low-frequency performance of the micro-speaker module is significantly improved, and at the same time, the product temperature is also greatly reduced.

[0302] The following Table 2 shows the influence results of different thermal conductivity additives and their addition amounts on the performance of the prepared high thermal conductivity sound-absorbing particles F0 in Examples 1-10 of the present invention and Comparative Example 3. The micro-drop and F0 performance in Table 2 are both measured by conventional methods in the art. The following Table 3 shows the thermal conductivity coefficients of different materials. The following Table 4 shows the thermal conductivity coefficients of the high thermal conductivity sound-absorbing particles prepared by adding different amounts of thermal conductivity additives and the ordinary sound-absorbing particles prepared without adding thermal conductivity additives in Comparative Example 3, Example 1, Example 3, Example 5, and Example 7.

[0303] Table 2

[0304] Sample Thermal conductivity additive Additive content (wt%) Slight drop ΔF0 (Hz) 1 OK 129 2 Graphene 1 OK 131 3 Graphene 3 OK 128 4 Graphene 5 OK 127 5 Graphene 7 Slight powder falling 122 6 <![CDATA[Al2O3]]> 1 OK 129 7 <![CDATA[Al2O3]]> 3 OK 130 8 <![CDATA[Al2O3]]> 5 Slight powder falling 127 9 <![CDATA[Al2O3]]> 7 NG 126 10 MgO 1 OK 127 11 MgO 5 OK 122

[0305] Table 3

[0306] Material Thermal conductivity (W / mK) Nitrogen 0.026 He 0.155 ZSM-5 molecular sieve 0.205 Graphene 4300 <![CDATA[Al2O3]]> 45 MgO 30-60 AlN 150

[0307] Table 4

[0308]

[0309]

[0310] As can be seen from Tables 2, 3 and 4 above, with the increase of the addition amount of the thermal conductivity additive, the acoustic performance index ΔF0 of the high thermal conductivity sound-absorbing particles shows a gradually decreasing trend. Moreover, with the increase of the additive content, it will also affect the micro-drop performance of the high thermal conductivity sound-absorbing particles. However, for the thermal conductivity coefficient of the high thermal conductivity sound-absorbing particles, it gradually increases with the increase of the addition amount of the thermal conductivity additive. Therefore, the most preferred addition amount of the thermal conductivity additive is 1%-5%. At the same time, from the thermal conductivity coefficients of different materials shown in Table 3, the thermal conductivity coefficient of the conventional molecular sieve material is about 10 times that of the air thermal conductivity coefficient, and the thermal conductivity coefficients of various thermal conductivity additives are higher. At the same time, the thermal conductivity coefficient of helium is about 7-8 times that of the air thermal conductivity coefficient. Filling helium in the rear cavity of the micro speaker module can more effectively improve the heat diffusion ability of the rear cavity of the module. As shown in Example 1 and Example 21, when the same high thermal conductivity sound-absorbing particles are filled, since the rear cavity of the micro speaker module provided in Example 21 is filled with helium, it has higher thermal conductivity and can effectively reduce the temperature of the speaker module.

[0311] In summary, the rear cavity of the micro speaker module provided in the embodiment of the present invention is filled with a high thermal conductivity sound-absorbing material. The high thermal conductivity sound-absorbing material can not only improve the acoustic performance of the micro speaker module by using its high virtual rear cavity increase coefficient, but also increase the heat dissipation amount of the space around the speaker unit through its high thermal conductivity coefficient far higher than that of the air, thereby improving the overall heat dissipation ability of the micro speaker module.

[0312] The above description is only a specific embodiment of the present invention and cannot limit the scope of the invention implementation. Therefore, the replacement of equivalent components or the equivalent changes and modifications made according to the protection scope of the present invention patent should still fall within the scope covered by this patent. In addition, the technical features in the present invention, between technical features, between technical features and technical inventions, and between technical inventions can be freely combined and used.

Claims

1. A micro-speaker module, characterized in that, The micro-speaker module includes: an upper shell, a lower shell, and a speaker unit; the speaker unit is installed in the upper shell or the lower shell, the upper shell and the speaker unit form a front cavity, the lower shell and the speaker unit form a rear cavity and at least a part of the speaker unit is located in the rear cavity, a heat-conducting and sound-absorbing material is filled in the rear cavity, the heat-conducting coefficient of the heat-conducting and sound-absorbing material is 0.2-20 W / mK, the heat-conducting and sound-absorbing material contains molecular sieve particles and a heat-conducting additive, the dosage of the heat-conducting additive is 1%-5% of the mass of the molecular sieve particles, and the heat-conducting additive is uniformly dispersed and filled in the heat-conducting and sound-absorbing material or coated on the surface of the heat-conducting and sound-absorbing material; the upper shell and the lower shell are fixedly connected; a sound outlet hole is formed in the side wall of the rear cavity.

2. The micro-speaker module according to claim 1, wherein, The heat-conducting additive includes one or more of graphene, alumina, zinc oxide, magnesium oxide, quartz powder, silicon carbide, aluminum nitride, and boron carbide.

3. The micro-speaker module according to claim 1 or 2, characterized in that, The particle size range of the heat-conducting additive is 50-500 nm.

4. The micro-speaker module according to claim 1 or 2, characterized in that, The heat-conducting and sound-absorbing material includes sound-absorbing particles, sound-absorbing sheets, or sound-absorbing blocks.

5. The micro-speaker module according to claim 4, wherein The sound-absorbing block has a first-stage pore with a pore size range of 0.3-0.7 nm, a second-stage pore with a pore size range of 20-50 nm, and a third-stage pore with a pore size range of 1-100 μm.

6. The micro-speaker module according to claim 4, wherein The thickness of the sound-absorbing sheet is 100-1000 μm, and it has a first-stage pore with a pore size range of 0.3-0.7 nm and a second-stage pore with a pore size range of 20-50 nm.

7. The micro speaker module according to claim 6, wherein The sound-absorbing sheet is prepared by directly spraying a solution containing molecular sieve particles, an adhesive, and a heat-conducting additive on the inner wall of the rear cavity of the micro-speaker module.

8. The micro-speaker module according to claim 7, characterized in that, The particle size range of the molecular sieve particles is 0.5-10 μm, the micropore diameter is 0.3-0.7 nm, and the Si / Al ratio is 200 or more.

9. The micro speaker module according to claim 8, wherein, The Si / Al ratio is 400 or more.

10. The micro-speaker module according to any one of claims 7-9, characterized in that, The molecular sieve particles are one or more of MFI molecular sieve and / or FER molecular sieve.

11. The micro-speaker module according to claim 7, wherein, The adhesive includes an organic adhesive and / or an inorganic adhesive; based on the total weight of the sound-absorbing sheet being 100%, the content of the solid component of the organic adhesive in the sound-absorbing sheet is 5%-20%; based on the total weight of the sound-absorbing sheet being 100%, the content of the inorganic adhesive in the sound-absorbing sheet is 4%-15%.

12. The micro-speaker module according to claim 11, wherein The organic adhesive includes one or a combination of several of poly(styrene acrylic acid) emulsion, poly(styrene acetic acid) emulsion, styrene-butadiene rubber emulsion, poly(styrene acrylate) emulsion, and polyacrylate emulsion.

13. The micro-speaker module according to claim 11 or 12, characterized in that, Based on the total weight of the organic adhesive being 100%, the content of the solid component in the organic adhesive is 40%-60%.

14. The micro-speaker module according to claim 11, wherein, The inorganic adhesive includes one or more of kaolin, silica sol, alumina sol, and carboxymethyl cellulose.

15. The micro-speaker module according to claim 4, wherein The sound-absorbing block is prepared by bonding a number of molecular sieve particles or sound-absorbing particles containing a heat-conducting additive through an adhesive.

16. The micro-speaker module according to claim 15, characterized in that, The particle size range of the molecular sieve particles is 0.5-10 μm, the micropore diameter is 0.3-0.7 nm, and the Si / Al ratio is 200 or more.

17. The micro-speaker module according to claim 16, wherein The Si / Al ratio is 400 or more.

18. The micro-speaker module according to any one of claims 15-17, characterized in that, The molecular sieve particles are one or more of MFI molecular sieve and / or FER molecular sieve.

19. The micro-speaker module according to claim 15, wherein, The binder includes an organic binder and / or an inorganic binder; based on the total weight of the sound-absorbing block being 100%, the content of the solid component of the organic binder in the sound-absorbing block is 5%-20%; based on the total weight of the sound-absorbing block being 100%, the content of the inorganic binder in the sound-absorbing block is 4%-15%.

20. The micro-speaker module according to claim 19, wherein, The organic binder includes one or a combination of several of poly(styrene acrylic acid) emulsion, polystyrene acetic acid emulsion, styrene-butadiene rubber emulsion, polystyrene acrylate emulsion, and polyacrylate emulsion.

21. The micro speaker module according to claim 19 or 20, wherein Based on the total weight of the organic binder being 100%, the content of the solid component in the organic binder is 40%-60%.

22. The micro-speaker module according to claim 19, wherein, The inorganic binder includes one or more of kaolin, silica sol, alumina sol, and carboxymethyl cellulose.

23. The micro-speaker module according to claim 15, wherein, The method for preparing the sound-absorbing block includes the following steps: After mixing molecular sieve particles, a binder, and a heat-conducting additive into a slurry, the slurry is extruded or pressed into a sound-absorbing block using a mold or a porous material is soaked in the slurry and then dried to form a sound-absorbing block; Or after mixing molecular sieve particles and a binder into a slurry, the slurry is extruded or pressed into a sound-absorbing block using a mold or a porous material is soaked in the slurry and then dried to form a sound-absorbing block; finally, a solution prepared by mixing a heat-conducting additive and an aqueous binder solution is sprayed on the surface of the sound-absorbing block; Or after mixing sound-absorbing particles containing a heat-conducting additive and a binder into a slurry, the slurry is extruded or pressed into a sound-absorbing block using a mold or a porous material is soaked in the slurry and then dried to form a sound-absorbing block.

24. The micro-speaker module according to claim 23, wherein Based on the total weight of the solution being 100%, the content of the heat-conducting additive is 1%-10%.

25. The micro-speaker module according to claim 24, wherein, Based on the total weight of the solution being 100%, the content of the heat-conducting additive is 2%-7%.

26. The micro-speaker module according to any one of claims 23, 24-25, characterized in that, The spraying time is 1-10 min.

27. The micro-speaker module according to any one of claims 23, 24 - 25, characterized in that The solid content of the aqueous binder solution is 5%-20%.

28. The micro-speaker module according to claim 27, wherein The binder includes one or more of poly(styrene acrylic acid) emulsion, polystyrene acetic acid emulsion, styrene-butadiene rubber emulsion, and carboxymethyl cellulose.

29. The micro-speaker module according to claim 4, wherein, The particle size range of the sound-absorbing particles is 300-700 μm, and the sound-absorbing particles have first-stage pores with a pore size range of 0.3-0.7 nm, second-stage pores with a pore size range of 20-50 nm, and third-stage pores with a pore size range of 1-10 μm.

30. The micro speaker module according to claim 29, wherein, The sound-absorbing particles are prepared by bonding a number of molecular sieve particles through a binder.

31. The micro speaker module according to claim 30, wherein, The particle size range of the molecular sieve particles is 0.5-10 μm, the micropore size is 0.3-0.7 nm, and the Si / Al ratio is 200 or more.

32. The micro speaker module according to claim 31, wherein The Si / Al ratio is 400 or more.

33. The micro-speaker module according to any one of claims 30-32, characterized in that, The molecular sieve particles are one or more of MFI zeolite and / or FER zeolite.

34. The micro-speaker module according to claim 30, wherein The binder includes an organic binder and / or an inorganic binder; based on the total weight of the sound-absorbing particles being 100%, the content of the solid component of the organic binder in the sound-absorbing particles is 5%-15%; based on the total weight of the sound-absorbing particles being 100%, the content of the inorganic binder in the sound-absorbing particles is 4%-10%.

35. The micro-speaker module according to claim 34, wherein The organic binder includes one or a combination of several of poly(styrene acrylic acid) emulsion, polystyrene acetic acid emulsion, styrene-butadiene rubber emulsion, polystyrene acrylate emulsion, and polyacrylate emulsion.

36. The micro speaker module according to claim 34 or 35, characterized in that, Based on the total weight of the organic binder being 100%, the solid component content in the organic binder is 40% - 60%.

37. The micro-speaker module according to claim 34, wherein The inorganic binder includes one or more of kaolin, silica sol, aluminum sol, and carboxymethyl cellulose.

38. The micro-speaker module according to any one of claims 4 and 29-32, wherein The preparation method of the sound-absorbing particles includes the following steps: Mix molecular sieve microparticles, binder, and thermal conductivity additive into a slurry, granulate the slurry, and then dry the obtained particles after granulation to obtain sound-absorbing particles; or mix molecular sieve microparticles and binder into a slurry, granulate the slurry, dry the obtained particles after granulation, and finally spray a solution prepared by mixing the thermal conductivity additive and an aqueous binder solution on the surface of the dried particles to obtain sound-absorbing particles.

39. The micro speaker module according to claim 38, wherein Based on the total weight of the solution being 100%, the content of the thermal conductivity additive is 1% - 10%.

40. The micro speaker module according to claim 39, wherein, Based on the total weight of the solution being 100%, the content of the thermal conductivity additive is 2% - 7%.

41. The micro-speaker module according to any one of claims 38, 39-40, characterized in that, The spraying time is 1 - 10 min.

42. The micro speaker module according to any one of claims 38, 39 - 40, characterized in that, The solid content of the aqueous binder solution is 5% - 20%.

43. The micro-speaker module according to claim 42, wherein, The binder includes one or more of poly(styrene acrylic acid) emulsion, polystyrene acetate emulsion, styrene-butadiene rubber emulsion, and carboxymethyl cellulose.

44. The micro speaker module according to claim 1 or 2, characterized in that, A certain amount of expandable microspheres is added to the thermally conductive sound-absorbing material.

45. The micro-speaker module according to claim 44, wherein, Based on the total weight of the thermally conductive sound-absorbing material being 100%, the addition amount of the expandable microspheres is 1 wt.% - 10 wt.%.

46. The micro speaker module according to claim 45, wherein, Based on the total weight of the thermally conductive sound-absorbing material being 100%, the addition amount of the expandable microspheres is 2 wt.% - 6 wt.%.

47. The micro-speaker module according to any one of claims 44-46, characterized in that, The particle size range of the expandable microspheres is 200 - 400 μm.

48. The micro-speaker module according to any one of claims 44-46, characterized in that, The expandable microspheres are expandable microspheres with a core-shell structure. The shell material of the expandable microspheres is an expandable polymer; the core structure of the expandable microspheres is made from a blowing agent.

49. The micro-speaker module according to claim 48, wherein The expandable polymer includes one or a combination of several of polystyrene, methyl methacrylate polymer, styrene-butyl acrylate polymer, methyl methacrylate-butyl acrylate polymer, polyurethane polymer, vinyl acetate polymer, urea-formaldehyde polymer, and melamine formaldehyde polymer.

50. The micro-speaker module according to claim 48, wherein The blowing agent includes one or more of petroleum ether, butane, pentane, and isopentane.

51. The micro-speaker module according to claim 48, wherein, A thermal conductivity additive is also added to the shell layer. Based on the total weight of the shell layer being 100%, the addition amount of the thermal conductivity additive is 1% - 20%.

52. The micro speaker module according to claim 1 or 2, characterized in that, The lower shell is provided with a filling hole.

53. The micro speaker module according to claim 1 or 2, characterized in that, A mesh cloth is arranged on the surface of the sound outlet hole.

54. The micro-speaker module according to claim 1 or 2, characterized in that, The rear cavity of the micro speaker module is also filled with helium.

55. A smart phone, characterized in that, The smart phone includes the micro speaker module according to any one of claims 1 - 54.

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