Chip test fixture

Abstract

The present application discloses a chip test fixture. The chip test fixture includes: a heat sink, provided with interconnected pin holes and a receiving cavity; an insulating member, fixed in the receiving cavity, provided with a mounting hole, the mounting hole being connected to the pin hole; a power supply member, fixed to the mounting hole; wherein the heat sink is used to contact the heat sink of the chip, the pins of the chip are electrically connected to the power supply member through the pin hole, and the chip is powered on through the power supply member to test the chip. By setting the insulating member in the receiving cavity of the heat sink, the power supply member is set in the mounting hole of the insulating member, and the mounting hole is connected to the pin hole of the heat sink, the chip test fixture provided by the present application can provide reliable power supply and can achieve an increase in the value of the continuously injected test current.

Description

Technical Field

[0001] The present application relates to the technical field of chip testing equipment, and in particular to a chip testing fixture. Background Art

[0002] With the increasing expansion of semiconductor laser (LD, Laser Diode) application fields such as LD pumped solid-state laser (DPL, Diode-Pumped Solid-State Laser), pump sources of various fiber lasers, laser cutting, welding, medical and laser military applications, the requirements for semiconductor laser output power and reliability are also getting higher and higher.

[0003] Semiconductor laser chips generate a lot of waste heat during operation. In order to better dissipate heat, high-quality packaging processes are required to facilitate subsequent secondary designs, such as To_Can packaging, fiber coupling, etc. Semiconductor laser chips are often packaged in TO form, that is, they are directly packaged on a heat sink with high thermal conductivity. After packaging, semiconductor laser chips need to pass strict functional testing, and the quality of their performance parameters directly affects the quality of semiconductor lasers.

[0004] However, the existing testing methods for semiconductor laser chips have drawbacks. During the test, the chip is often unable to continuously inject a test current greater than 3A, resulting in low chip testing efficiency. Summary of the invention

[0005] The present application mainly provides a chip testing fixture to solve the problem of low chip testing efficiency caused by the inability to continuously inject a test current greater than 3A during chip testing.

[0006] In order to solve the above technical problems, a technical solution adopted by the present application is to provide a chip test fixture. The chip test fixture includes: a heat sink, provided with connected pin holes and a receiving cavity; an insulating member, fixed in the receiving cavity, provided with a mounting hole, the mounting hole being connected with the pin hole; a power supply member, fixed in the mounting hole; wherein the heat sink is used to contact with the heat sink of the chip, the pins of the chip are electrically connected to the power supply member through the pin holes, and the chip is powered on by the power supply member to test the chip.

[0007] In some embodiments, the mounting hole includes a coaxial first hole segment and a second hole segment, the aperture of the first hole segment is smaller than the aperture of the pin hole, the first hole segment is connected to the pin hole, the aperture of the first hole segment is smaller than the aperture of the second hole segment, and the power supply component is fixed to the second hole segment.

[0008] In some embodiments, the power supply component is a power supply needle tube, which includes a connected power supply connector and a tube body. The tube body is fixed to the second hole section. The power supply connector leaks out of the second hole section and is used to connect to a power supply. The pins of the chip are inserted into the tube body.

[0009] In some embodiments, the chip testing fixture further includes a clamping assembly, which is connected to the heat sink and is used to clamp the chip to the heat sink.

[0010] In some embodiments, the clamping assembly comprises:

[0011] Guide rod;

[0012] A pressing plate connected to one end of the guide rod and used for pressing the heat sink of the chip to the heat sink;

[0013] A locking member is connected to the other end of the guide rod and is used to adjust the guide rod to drive the pressing plate to press the heat sink of the chip.

[0014] In some embodiments, the pressing plate is provided with an avoidance hole, and the avoidance hole is used to position and avoid the core body of the chip.

[0015] In some embodiments, the clamping assembly further includes a base, the base is fixedly connected to the heat sink, the base is provided with a guide hole, and the guide rod is passed through the guide hole.

[0016] In some embodiments, the clamping assembly further includes a positioning column, the positioning column is disposed on the base, the pressure plate is provided with a positioning hole, and the positioning column is used to cooperate with the positioning hole.

[0017] In some embodiments, the clamping assembly further includes an elastic positioning member, a connecting hole is provided on the base, the connecting hole is connected to the guide hole, and the elastic positioning member is connected to the connecting hole for pressing against the guide rod to correct the position of the guide rod.

[0018] In some embodiments, the chip testing fixture also includes a material removal assembly, which includes a material removal ejector rod and an elastic member, wherein the material removal ejector rod is passed through the heat sink and the base, and the material removal ejector rod also presses against the base, and the elastic member is elastically compressed between the heat sink and the material removal ejector rod, and the material removal ejector rod extends from the heat sink to separate the heat sink of the chip from the heat sink.

[0019] In some embodiments, the insulating member and the heat sink are jointly arranged to form a through hole for the ejector rod to pass through.

[0020] The beneficial effect of the present application is that, different from the prior art, the present application discloses a chip test fixture. By setting the insulating member in the accommodating cavity of the heat sink, and setting the power supply member in the mounting hole of the insulating member, and the mounting hole is connected to the pin hole of the heat sink, the pins of the chip can be electrically connected to the power supply member through the pin hole to avoid contact with the heat sink and cause a short circuit, so that the power supply during chip testing is reliable, and the heat sink is in contact with the heat sink of the chip, so the heat sink can absorb and conduct the heat generated during chip testing, thereby cooling the chip under test, avoiding excessive temperature rise of the chip during continuous current injection and causing test interruption, so the chip test fixture provided by the present application can provide reliable power and can realize continuous injection of test current greater than 3A. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0022] Figure 1 It is a structural schematic diagram of an embodiment of a chip testing fixture provided by the present application;

[0023] Figure 2 It is a schematic diagram of the structure of the test chip in this application;

[0024] Figure 3 yes Figure 1 The exploded structure diagram of the chip test fixture shown;

[0025] Figure 4 yes Figure 1 The schematic diagram of the disassembly of the heat sink, insulating component and power supply component in the chip test fixture shown;

[0026] Figure 5 yes Figure 1 The schematic diagram of the assembly of the heat sink and the insulating part in the chip test fixture shown;

[0027] Figure 6 yes Figure 5 A schematic cross-sectional view of the AA direction is shown;

[0028] Figure 7 yes Figure 3 A schematic diagram of the axial structure of the base in the chip test fixture shown;

[0029] Figure 8 yes Figure 3 Schematic diagram of the axial structure of the ejector pin in the chip testing fixture shown. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0031] The terms "first", "second", "third" in the embodiments of the present application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", "third" can expressly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0032] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0033] The present application provides a chip testing fixture 100, see Figures 1 to 3 , Figure 1 is a schematic diagram of the structure of an embodiment of a chip test fixture provided by the present application, Figure 2 is a schematic diagram of the structure of the test chip in this application, Figure 3 yes Figure 1 Schematic diagram of the exploded structure of the chip test fixture shown.

[0034] The chip test fixture 100 includes a heat sink 10, an insulating member 20, a power supply member 30, a clamping assembly 40 and a blanking assembly 50. The insulating member 20 is arranged on the heat sink 10, the power supply member 30 is arranged on the insulating member 20, the heat sink 61 of the chip 60 is in contact with the heat sink 10, the pin 62 of the chip 60 is electrically connected to the power supply member 30 arranged on the insulating member 20, so as to provide a test current to the chip 60 through the power supply member 30; the clamping assembly 40 is connected to the heat sink 10, and is used to clamp the chip 60 on the heat sink 10; the blanking assembly 50 is used to separate the heat sink 61 of the chip 60 from the heat sink 10, so as to remove the chip 60 after the test.

[0035] Specifically, see Figures 4 to 6 The heat sink 10 is provided with a connected pin hole 12 and a receiving cavity 14. The pin hole 12 is used for the pins 62 of the chip 60 to pass through, and the receiving cavity 14 is used to assemble the insulating member 20. The heat sink 10 is used to contact the heat sink 61 of the chip 60, thereby cooling the chip 60 to prevent the chip 60 from being damaged due to the temperature rise during the power-on test.

[0036] In this embodiment, the heat sink 10 has a first heat sink 11 and a second heat sink 13, and the first heat sink 11 and the second heat sink 13 are connected in an L shape, wherein the first heat sink 11 is connected to an insulating member 20, a clamping assembly 40 and a blanking assembly 50, and the second heat sink 13 is used to install the chip test fixture 100 on a cooling device, and a flowing coolant passes through the cooling device. The coolant takes away the heat transferred by the chip test fixture 100 to cool the chip test fixture 100 and prevent the chip 60 from being damaged due to overheating during testing.

[0037] The pin holes 12 and the accommodating cavity 14 are provided on the first heat dissipation plate 11, wherein the number of the pin holes 12 is three and they are arranged in a triangular shape, and the three pin holes 12 are all connected to the accommodating cavity 14. The number of the pin holes 12 can also be two, etc., and the plurality of pin holes 12 can also be arranged in a straight line, which is not specifically limited in the present application.

[0038] In other embodiments, the heat sink 10 may also be in the shape of a single heat sink plate, etc., and the present application does not impose any specific limitation on this.

[0039] In this embodiment, the pin hole 12 and the accommodating cavity 14 are both in the shape of circular holes, so as to facilitate the insertion of the pin 12 and the installation of the insulating member 20, respectively; and the pin hole 12 and the accommodating cavity 14 are connected, the aperture of the accommodating cavity 14 is larger than the aperture of the pin hole 12, and the axial depth of the pin hole 12 is smaller than the axial depth of the accommodating cavity 14, so as to reduce the risk of contact between the pin 62 and the heat sink 10, thereby reducing the factors that interfere with the chip 60 during testing.

[0040] It can be seen that the heat sink 10 is a metal seat with excellent thermal conductivity. If the pin 60 contacts the heat sink 10 during testing, leakage will occur, making the test result unreliable. Therefore, it is necessary to reduce the risk of the pin 62 contacting the heat sink 10 by shortening the axial depth of the pin hole 12.

[0041] In other embodiments, the pin hole 12 and the accommodating cavity 14 may also be in the shape of a square hole or the like, and the present application does not impose any specific limitation on this.

[0042] The insulating member 20 is fixed in the accommodating cavity 14 . The mounting hole 22 is communicated with the pin hole 12 . The mounting hole 22 is used to mount the power supply member 30 to insulate the heat sink 10 and the power supply member 30 .

[0043] Specifically, the mounting hole 22 includes a coaxial first hole section 222 and a second hole section 224, the first hole section 222 is connected to the pin hole 12, and the aperture of the first hole section 222 is smaller than the aperture of the pin hole 12, so as to correct the position of the pin 62 through the first hole section 222, thereby preventing the pin 60 from contacting the heat sink 10 due to skewness.

[0044] In this embodiment, the first hole section 222 and the second hole section 224 are both circular holes, and the first hole section 222 is also coaxially arranged with the pin hole 12 to further prevent the pin 60 from contacting the heat sink 10; the aperture of the second hole section 224 is larger than the aperture of the first hole section 222, so that the end face of the first hole section 222 facing the second hole section 224 can also be used to stop the power supply component 30 to facilitate the installation of the power supply component 30.

[0045] In other embodiments, the mounting hole 22 may also be a through hole, and the aperture of the mounting hole 22 is smaller than the aperture of the pin hole 12 , and the power supply component 30 is fixed to the mounting hole 22 , so that the mounting hole 22 can both correct the position of the pin 62 and meet the installation requirements of the power supply component 30 .

[0046] The power supply component 30 is fixed to the mounting hole 22. Specifically, the power supply component 30 is fixed to the second hole section 224. The power supply component 30 is used for an external power source to provide the chip 60 with the required test current.

[0047] In this embodiment, the power supply component 30 is a power supply needle tube, which includes a connected power supply connector 32 and a tube body 34. The tube body 34 is fixed to the second hole section 224. The power supply connector 32 leaks out from the second hole section 224 and is used to connect to a power supply. The pins 62 of the chip 60 are inserted into the tube body 34 through the pin holes 12 and the first hole section 22 to be electrically connected to the tube body 34. The power supply component 30 is powered on to test the chip 60.

[0048] In other embodiments, the power supply component 30 may also be an electromagnetic probe that can magnetically attract the pin 62 when powered.

[0049] The present application sets the insulating member 20 in the accommodating cavity 14 of the heat sink 10, and sets the power supply member 30 in the mounting hole 22 of the insulating member 20, and the mounting hole 22 is communicated with the pin hole 12 of the heat sink 10, so that when the pin 62 of the chip 60 is electrically connected to the power supply member 30 through the pin hole 12, it can avoid contact with the heat sink 10 and cause a short circuit, so that the power supply to the chip 60 during testing is reliable, and the heat sink 10 is in contact with the heat sink 61 of the chip 60, so the heat sink 10 can absorb and conduct the heat generated during the test of the chip 60, thereby cooling the chip 60 under test and avoiding the chip 60 from overheating when the current is continuously injected and causing the test to be interrupted. By adopting these settings, the chip test fixture provided by the present application can provide power reliably and can realize continuous injection of a test current greater than 3A.

[0050] Continue reading Figure 3 The clamping assembly 40 includes a base 41, a guide rod 42, a pressure plate 43 and a locking member 44. The base 41 is fixedly connected to the heat sink 10, and the base 41 is provided with a guide hole 410. The guide rod 42 is inserted into the guide hole 410, and the guide rod 42 can move axially along the guide hole 410. The pressure plate 43 is connected to one end of the guide rod 42, and is used to clamp the heat sink 61 of the chip 60 to the heat sink 10, so that the chip 60 and the heat sink 10 are in close contact and have good heat dissipation; the locking member 44 is connected to the other end of the guide rod 42, and is used to adjust the guide rod 42 to move along the guide hole 410, thereby driving the pressure plate 43 to clamp the heat sink 61 of the chip 60, and the locking member 44 can also be used to lock and fix the guide rod 42.

[0051] Specifically, the base 41 is fixed to the first heat sink 11, and the base 41 can be fixed to the first heat sink 11 by screws or pins. The pressure plate 43 is in the shape of a thin plate, which is fixedly connected to one end of the guide rod 42, and the pressure plate 43 is provided with an avoidance hole 430, and the avoidance hole 430 is used to position and avoid the core 63 of the chip 60, the core 63 is arranged on the heat sink 61, and the pin 62 is electrically connected to the core 63 and passes through the heat sink 61. When the pressure plate 43 is pressed on the heat sink 61, the core 63 is positioned and matched with the avoidance hole 430, thereby preventing the pressure plate 43 from squeezing the core 63 and causing it to be damaged. The locking member 44 is a locking nut, and the other end of the guide rod 42 is provided with a thread. The locking member 44 is threadedly assembled with the guide rod 42. Rotating the locking member 44 can make the guide rod 42 move along the guide hole 410, thereby driving the pressure plate 43 to press the heat sink 61, or driving the pressure plate 43 to release the pressing of the heat sink 61. Furthermore, the other end of the guide rod 42 is also connected to a limiter 45 to prevent the locking member 44 from being separated from the guide rod 42. The locking member 44 can also be a spring, which can be sleeved on the guide rod 42 and elastically compressed between the base 41 and the other end of the guide rod 42, so that the pressure plate 43 presses the heat sink 61 through the elastic force.

[0052] In other embodiments, the clamping assembly 40 may not include the base 41. For example, a guide hole is provided on the first heat dissipation plate 11, and the guide rod 42 may be passed through the guide hole on the first heat dissipation plate 11. The present application does not impose any specific limitation on this.

[0053] In this embodiment, the clamping assembly 40 also includes an elastic positioning member (not shown), and a connecting hole 412 is provided on the base 41. The connecting hole 412 is connected to the guide hole 410. The elastic positioning member is connected to the connecting hole 412 and is used to push against the guide rod 42 to correct the position of the guide rod 42.

[0054] The elastic positioning member can be a ball plug, and connecting holes 412 are provided on both sides of the guide hole 410. The corresponding ball plug is arranged in the connecting hole 412 to apply friction to the guide rod 42, so that the guide rod 42 maintains its position and the avoidance hole 430 is aligned with the core 63. The elastic positioning member can also be an elastic ejector pin, etc., and this application does not make specific restrictions on this.

[0055] Furthermore, the clamping assembly 40 also includes a positioning column 47, which is arranged on the base 41. The pressure plate 43 is provided with a positioning hole 432. The positioning column 47 is used to cooperate with the positioning hole 432 to further ensure that the avoidance hole 430 is aligned with the core body 63, avoid the pressure plate 43 from touching the core body 63, and prevent the locking member 44 from rotating during the adjustment of the guide rod 42.

[0056] The positioning column 47 can be a positioning pin, and the base 41 is provided with two pin holes, and the corresponding positioning pins are set in the pin holes, and the positioning pins are assembled with the positioning holes 432 on the pressure plate 43, thereby ensuring that the avoidance hole 430 is aligned with the core 63 and the pressure plate 43 and the guide rod 42 do not rotate. The positioning column 47 can also be integrally connected to the base 41, and this application does not make specific limitations on this.

[0057] The unloading assembly 50 includes a unloading ejector pin 52 and an elastic member 54. The unloading ejector pin 52 is passed through the heat sink 10 and the base 41, and the unloading ejector pin 52 also presses against the base 41. The elastic member 54 is elastically compressed between the heat sink 10 and the unloading ejector pin 52. The unloading ejector pin 52 extends from the heat sink 10 to separate the heat sink 61 of the chip 60 from the heat sink 10.

[0058] In this embodiment, refer to Figures 3 to 8 The insulating member 20 and the heat sink 10 are jointly surrounded to form a through hole 24 for the ejector rod 52 to pass through. In other words, part of the side wall of the through hole 24 is located on the insulating member 20, and the other part of the side wall of the through hole 24 is located on the first heat sink 11, so that the insulating member 20 can be positioned and installed in the accommodating cavity 14 through this feature. In other embodiments, the through hole 24 can be only provided on the first heat sink 11, and this application does not make any specific limitation on this.

[0059] The base 41 is provided with a bayonet 414, and the ejector pin 52 is provided with a shoulder 520. The ejector pin 52 is inserted through the bayonet 414 and the through hole 24, and the shoulder 520 is against the bayonet 414 on the side away from the chip 60. The elastic member 54 is sleeved on the ejector pin 52 and elastically compressed between the side of the shoulder 520 facing the chip 60 and the bottom wall of the through hole 24. When the pressing plate 43 releases the pressing of the heat sink 61, by pressing the ejector pin 52, one end of the ejector pin 52 passes through the bottom wall of the through hole 24 and extends out, and then pushes the heat sink 61, so that the heat sink 61 of the chip 60 is separated from the heat sink 10, so as to facilitate the removal of the chip 60 from the chip test fixture 100, or directly make the chip 60 fall off the chip test fixture 100. The elastic member 54 can be a compression spring or an elastic sleeve, etc., which is not specifically limited in this application.

[0060] Different from the prior art, the present application discloses a chip test fixture. By setting an insulating member in the accommodating cavity of a heat sink, and setting a power supply member in the mounting hole of the insulating member, and the mounting hole is connected to the pin hole of the heat sink, the pins of the chip can avoid contact with the heat sink to cause a short circuit when they are electrically connected to the power supply member through the pin hole, so that the power supply during chip testing is reliable, and the heat sink is in contact with the heat sink of the chip, so the heat sink can absorb and conduct the heat generated during chip testing, thereby cooling the chip under test, avoiding excessive temperature rise of the chip during continuous current injection and causing test interruption, so the chip test fixture provided by the present application can provide reliable power and can realize continuous injection of test current greater than 3A.

[0061] The above descriptions are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A chip testing fixture, characterized in that: The chip test fixture comprises: The heat sink is provided with interconnected pin holes and a receiving cavity; An insulating member, fixed in the accommodating cavity, provided with a mounting hole, wherein the mounting hole is communicated with the pin hole; A power supply component, fixed to the mounting hole; The heat sink is used to contact the heat sink of the chip, the pins of the chip are electrically connected to the power supply through the pin holes, and the chip is powered on to test the chip; The chip testing fixture further comprises a clamping assembly, which is connected to the heat sink and is used to clamp the chip to the heat sink; The clamping assembly comprises: a guide rod; A pressing plate connected to one end of the guide rod and used for pressing the heat sink of the chip to the heat sink; A locking member connected to the other end of the guide rod and used to adjust the guide rod to drive the pressing plate to press the heat sink of the chip; The clamping assembly also includes a base, which is fixedly connected to the heat sink. The base is provided with a guide hole, and the guide rod is passed through the guide hole.

2. The chip testing fixture according to claim 1, characterized in that: The mounting hole includes a coaxial first hole section and a second hole section, the aperture of the first hole section is smaller than the aperture of the pin hole, the first hole section is connected to the pin hole, the aperture of the first hole section is smaller than the aperture of the second hole section, and the power supply component is fixed to the second hole section.

3. The chip testing fixture according to claim 2, characterized in that: The power supply component is a power supply needle tube, which includes a connected power supply connector and a tube body. The tube body is fixed to the second hole section. The power supply connector leaks out of the second hole section and is used to connect to a power supply. The pins of the chip are inserted into the tube body.

4. The chip testing fixture according to claim 1, characterized in that: The pressing plate is provided with an avoidance hole, and the avoidance hole is used for positioning and avoiding the core body of the chip.

5. The chip testing fixture according to claim 1, characterized in that: The clamping assembly further comprises a positioning column, which is arranged on the base. The pressing plate is provided with a positioning hole, and the positioning column is used to cooperate with the positioning hole.

6. The chip testing fixture according to claim 1, characterized in that: The clamping assembly also includes an elastic positioning member. The base is provided with a connecting hole, the connecting hole is connected to the guide hole, and the elastic positioning member is connected to the connecting hole to press against the guide rod to correct the position of the guide rod.

7. The chip testing fixture according to claim 1, characterized in that: The chip testing fixture also includes a material removal component, which includes a material removal ejector rod and an elastic member. The material removal ejector rod is passed through the heat sink and the base, and the material removal ejector rod also presses against the base. The elastic member is elastically compressed between the heat sink and the material removal ejector rod. The material removal ejector rod extends from the heat sink to separate the heat sink of the chip from the heat sink.

8. The chip testing fixture according to claim 7, characterized in that: The insulating member and the heat sink are jointly arranged to form a through hole for the ejector rod to pass through.

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