A resistance detection method, device, resistance detection machine and readable storage medium

Abstract

The present invention discloses a resistance detection method, device, resistance detection machine and readable storage medium, the method comprising: extracting two test points corresponding to an object to be detected; the two test points and the object to be detected are located in a first network; the two test points include a first test point located on the first surface of a circuit board where the object to be detected is located, and a second test point located on the second surface of the circuit board; extracting a plated through hole on the circuit board; the plated through hole is located in other networks except the first network; electrically connecting the first test point to the corresponding plated through hole; and detecting the resistance of the object to be detected based on the first test point, the second test point and the plated through hole. By implementing this method, when the two test points of the object to be detected are located on different surfaces, the detection connection line of the voltage detection loop can be as short as possible, thereby greatly reducing the possibility that it is subject to external electromagnetic interference and the resistance detection result of the object to be detected has a large error.

Description

Technical Field

[0001] The present invention relates to the field of PCB testing technology, and in particular to a resistance detection method, device, resistance detection machine and readable storage medium. Background Art

[0002] In the current PCB manufacturing process, after the outer layer circuit is completed, it is usually necessary to detect whether the circuit is conductive and whether the resistance is abnormal. At present, common resistance measurement methods include two-wire test method and four-wire test method. Among them, the two-wire test has only one test loop, and the measured resistance is actually the sum of the feeder resistance and the resistance of the circuit to be tested, that is, it is impossible to accurately measure the resistance of the circuit to be tested; and the four-wire test sets a current supply loop and a voltage measurement loop for each circuit to be tested. The current and voltage loops are independent of each other, and because the internal impedance of the voltmeter is very high, almost all the current passes through the circuit to be tested, so that the measured resistance is almost close to the resistance of the circuit to be tested. Therefore, when it is necessary to accurately measure the resistance of the circuit to be tested, the four-wire detection method is generally used.

[0003] However, when four-wire detection is used to detect an object to be detected whose test points on a circuit board are located on two surfaces of the circuit board (for example, when detecting the resistance of a plated through hole on a circuit board, since the pads at both ends of the plated through hole serve as test points, and the pads at both ends of the plated through hole are located on two surfaces of the circuit board respectively, the two test points of the plated through hole are located on two surfaces of the circuit board), the two detection connecting lines of a measurement circuit (voltage measurement circuit and current measurement circuit) need to cross the entire circuit board or even the circuit board test fixture before they can be gathered to the measurement device, resulting in a significant extension of the detection connecting lines and a greatly increased possibility of being affected by external electromagnetic interference. Since the resistance of the object to be detected on the circuit board itself is generally very small, that is, the voltage of the object to be detected is very small, therefore, external electromagnetic interference can cause a large error in the voltage measurement result, thereby causing a large error in the resistance detection result of the object to be detected. Summary of the invention

[0004] In view of this, the embodiments of the present invention provide a resistance detection method, device, resistance detection machine and readable storage medium to solve the problem that the detection connection line of the voltage detection circuit is significantly extended due to the two test points of the object to be detected being located on the two surfaces of the circuit board, and the possibility of being affected by external electromagnetic interference is increased, which may cause the voltage detection result, that is, the resistance detection result, to have a large error.

[0005] According to a first aspect, an embodiment of the present invention provides a resistance detection method, comprising the following steps: extracting two test points corresponding to an object to be detected; the two test points and the object to be detected are located in a first network; the two test points include a first test point located on the first surface of a circuit board where the object to be detected is located, and a second test point located on the second surface of the circuit board; extracting plated through holes on the circuit board; the plated through holes are located in networks other than the first network; electrically connecting the first test point to the corresponding plated through hole; and detecting the resistance of the object to be detected based on the first test point, the second test point and the plated through hole.

[0006] By electrically connecting a first test point located on the first surface of the circuit board with a corresponding plated through hole, the plated through hole is indirectly located in the first network, and the plated through hole can replace the corresponding first test point as a test point of the object to be detected; at the same time, since the plated through hole runs through the first surface and the second surface of the circuit board, electrically connecting the first test point with the corresponding plated through hole can convert the first test point located on the first surface of the circuit board to the second surface through the plated through hole, so that when the resistance of the object to be detected is detected based on the first test point, the second test point and the plated through hole, the second test point and the plated through hole (the pad located on the second surface) can be used as connection points of a voltage detection device (in this case, the second surface is a voltage test surface), so that the detection connection line used for voltage detection of the object to be detected does not need to cross the entire circuit board or even cross the test fixture before being collected to the voltage measurement device, and the detection connection line can be as short as possible, thereby greatly reducing the possibility that the detection connection line is affected by external electromagnetic interference, and the voltage detection result, that is, the resistance detection result of the object to be detected, has a large error.

[0007] In combination with the first aspect, in the first embodiment of the first aspect, the step of extracting two test points corresponding to the object to be detected includes: extracting a network information file of the first network; the network information file records the network name and the test point information in each network; extracting the two test points corresponding to the object to be detected from the network information file of the first network.

[0008] By directly extracting the test point corresponding to the object to be detected from the network information file according to the network name of the first network where the object to be detected is located, the method in the embodiment of the present invention can be automatically executed, thereby improving the resistance detection efficiency of the method.

[0009] In combination with the first aspect or the first embodiment of the first aspect, in the second embodiment of the first aspect, the step of electrically connecting the first test point to the corresponding plated through hole includes: controlling the first probe and the second probe corresponding to the first surface of the circuit board to move to the first test point position and the plated through hole position respectively; the first probe and the second probe are electrically connected; controlling the first probe and the second probe to approach the circuit board until the first probe and the second probe are electrically connected to the first test point and the plated through hole respectively.

[0010] In combination with the second embodiment of the first aspect, in the third embodiment of the first aspect, the step of detecting the resistance of the object to be detected based on the first test point, the second test point and the plated through hole includes: controlling the third probe corresponding to the first surface of the circuit board to move to the first test point position, and the fourth probe corresponding to the second surface of the circuit board to move to the second test point position; the third probe and the fourth probe are electrically connected to the current supply circuit; controlling the third probe and the fourth probe to approach the circuit board until the third probe is electrically connected to the first test point and the fourth probe is electrically connected to the second test point; controlling the fifth probe and the sixth probe corresponding to the second surface of the circuit board to move to the second test point position and the plated through hole position respectively; the fifth probe and the sixth probe are electrically connected to the voltage test circuit; controlling the fifth probe and the sixth probe to approach the circuit board until the fifth probe and the sixth probe are electrically connected to the second test point and the plated through hole respectively, to detect the resistance of the object to be detected.

[0011] In combination with the first aspect, in a fourth implementation of the first aspect, the plated through hole is a plated through hole within a predetermined range around the first test point.

[0012] In combination with the first aspect, in a fifth implementation of the first aspect, the plated through hole is a plated through hole on the circuit board that is closest to the first test point.

[0013] According to the second aspect, an embodiment of the present invention provides a resistance detection device, comprising: a first extraction module, used to extract two test points corresponding to an object to be detected; the two test points and the object to be detected are located in a first network; the two test points include a first test point located on the first surface of a circuit board where the object to be detected is located, and a second test point located on the second surface of the circuit board; a second extraction module, used to extract plated through holes on the circuit board; the plated through holes are located in networks other than the first network; an electrical connection module, used to electrically connect the first test point to the corresponding plated through hole; and a resistance detection module, used to detect the resistance of the object to be detected based on the first test point, the second test point and the plated through hole.

[0014] According to a third aspect, an embodiment of the present invention provides an electronic device, comprising: a memory and a processor, the memory and the processor being communicatively connected to each other, the memory storing computer instructions, and the processor executing the resistance detection method described in the first aspect or any one of the embodiments of the first aspect by executing the computer instructions.

[0015] According to a fourth aspect, an embodiment of the present invention provides a computer-readable storage medium, wherein the computer-readable storage medium stores computer instructions, and the computer instructions are used to enable the computer to execute the resistance detection method described in the first aspect or any one of the embodiments of the first aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 A schematic diagram of an application scenario of an embodiment of the present invention;

[0018] Figure 2 A method flow chart of a resistance detection method provided by an embodiment of the present invention;

[0019] Figure 3 Another method flow chart of a resistance detection method provided by an embodiment of the present invention;

[0020] Figure 4 A principle block diagram of a resistance detection device provided by an embodiment of the present invention;

[0021] Figure 5 A schematic diagram of the hardware structure of a resistance detection machine provided by an embodiment of the present invention;

[0022] Description of reference numerals:

[0023] 1- Circuit board;

[0024] 21-current supply device; 22-voltage detection device; 23-fourth probe; 24-fifth probe; 25-sixth probe; 26-first transmission mechanism;

[0025] 31 - first probe; 32 - second probe; 33 - third probe; 34 - second transmission mechanism. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0027] In the description of the present invention, it should be noted that the terms “first”, “second” and “third” are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0028] Figure 1 A schematic diagram of an application scenario of an embodiment of the present invention is shown, in which a resistance detection fixture is shown, including: a circuit board 1 (that is, the circuit board where the object to be detected is located), a workbench for fixing the circuit board 1 (not shown in the figure), an upper detection fixture and a lower detection fixture.

[0029] The upper detection fixture corresponds to the second surface of the circuit board 1 (that is, the test surface of the circuit board 1 to be detected), and the upper detection fixture includes: a current supply device 21, a voltage detection device 22, and a fourth probe 23, a fifth probe 24 and a sixth probe 25, wherein one of the above three probes (for example, the fourth probe 23) is electrically connected to one end of the current supply device 21, and the other two (for example, the fifth probe 24 and the sixth probe 25) are electrically connected to the voltage detection device 22. Specifically, when the fourth probe 23 is electrically connected to one end of the object to be detected, that is, the second test point (the third probe 33 in the lower detection fixture is electrically connected to the other end of the object to be detected, that is, the first test point), a current supply loop of the object to be detected is formed, and when the fifth probe 24 and the sixth probe 25 are respectively electrically connected to the test points at both ends of the object to be detected, that is, the second test point and the plated through hole (at this time, the plated through hole is electrically connected to the first test point through the first probe 31 and the second probe 32 on the lower detection fixture), a voltage detection loop of the object to be detected is formed.

[0030] The fourth probe 23, the fifth probe 24 and the sixth probe 25 are all provided with a first transmission mechanism 26 above them. The first transmission mechanism 26 can move under the control command of the controller, so that the corresponding probe moves to any position of the second surface of the corresponding circuit board 1. At the same time, the probe can also be controlled to move up and down according to the command of the controller, so that the corresponding probe can approach the second surface of the circuit board 1 until it is electrically connected to the test point on the second surface, or move away from the second surface of the circuit board 1, disconnect the electrical connection with the test point on the second surface, and enter the preparation state for the next resistance detection. This application does not specifically limit the form of the first transmission structure and the mutual cooperation relationship between the device and the corresponding probe.

[0031] The lower detection fixture corresponds to the first surface of the circuit board 1, and the lower detection fixture includes a first probe 31, a second probe 32 and a third probe 33, wherein the first probe 31 and the second probe 32 are electrically connected to each other. When one of the first probe 31 and the second probe 32 is electrically connected to the first test point and the other is electrically connected to the corresponding plated through hole, an electrical connection line is formed between the first test point and the corresponding plated through hole, so that the first test point located on the first surface of the circuit board 1 can be converted to the second surface through the plated through hole.

[0032] A second transmission mechanism 33 is provided above the first probe 31, the second probe 32 and the third probe 33. The second transmission mechanism 33 can move under the control command of the controller, so that the corresponding probe moves to any position of the first surface of the corresponding circuit board 1. At the same time, the probe can also be controlled to move up and down according to the command of the controller, so that the corresponding probe can approach the first surface of the circuit board 1 until it is electrically connected to the first test point or plated through hole on the first surface, or move away from the first surface of the circuit board 1, disconnect the electrical connection with the first test point or plated through hole on the second surface, and enter the preparation state for the next resistance detection. This application does not specifically limit the form of the second transmission structure and the mutual cooperation relationship between the device and the corresponding probe.

[0033] Example 1

[0034] Figure 2 A flow chart showing a resistance detection method according to an embodiment of the present invention is shown. The method can be used for Figure 1 The resistance detection fixture shown is used to detect the resistance of the object to be detected on the circuit board. Figure 2 As shown, the method may include the following steps:

[0035] S201: extracting two test points corresponding to the object to be detected, wherein the two test points and the object to be detected are located in a first network, and the two test points include a first test point located on a first surface of a circuit board where the object to be detected is located, and a second test point located on a second surface of the circuit board.

[0036] Here, a network includes all interconnected test points (i.e., pads) on the circuit board. Specifically, taking the plated through hole as an example, the two test points corresponding to the object to be detected can be extracted by extracting two pads on the circuit board that are located on the two surfaces of the circuit board and are interconnected, which correspond to the position of the plated through hole. In addition, when the circuit board has multiple layers, the object to be detected can also be a line in the circuit board that spans all layers of the circuit board. In this case, the two test points corresponding to the object to be detected can be extracted by obtaining the endpoints of the layer where the line is located on the two surfaces of the circuit board and extracting two interconnected pads corresponding to the position of the endpoints.

[0037] Here, two test points corresponding to the object to be detected and the plated through hole in step S202 can be extracted through the circuit board design file or the circuit board information file that is formed after the circuit board is prepared and records the connectivity relationship between all the pads on the circuit board.

[0038] S202: Extracting plated through holes on the circuit board. Here, the plated through holes are located in other networks except the first network. Here, when other test points connected to the test points corresponding to the object to be detected cannot be extracted from the first network, the method in the embodiment of the present invention is executed to select the plated through holes corresponding to the first test points from the circuit board (therefore, the selected plated through holes are obviously located in other networks except the first network), so that the first test points can be subsequently converted from the first surface to the second surface through the plated through holes.

[0039] Here, in order to facilitate operation and shorten the length of the electrical connection line between the first test point and the plated through hole, a plated through hole within a predetermined range around the first test point can be selected as the plated through hole corresponding to the first test point, or the plated through hole on the circuit board that is closest to the first test point can be selected as the plated through hole corresponding to the first test point.

[0040] S203: electrically connecting the first test point to the corresponding plated through hole.

[0041] Here, when the method is applied to Figure 1 When using the resistance detection fixture in the circuit board, the first probe and the second probe on the lower fixture corresponding to the first surface can be controlled to move to the positions of the corresponding first test point and the plated through hole respectively, and then the probes can be controlled to move toward the first surface of the circuit board until they are respectively in contact with the first test point and the plated through hole and electrically connected, thereby realizing the first test point being electrically connected to the corresponding plated through hole.

[0042] Of course, this method can also be applied to other resistance testing fixtures. For example, the robot arm can be controlled to grab two electrically connected probes at the initial position, and move them to the positions of the first test point and the plated through hole respectively, so as to electrically connect the first test point and the plated through hole respectively, thereby achieving the goal of electrically connecting the first test point to the plated through hole. There is no limitation here.

[0043] S204: Detect the resistance of the object to be detected based on the first test point, the second test point and the plated through hole. Here, the first test point and the second test point are electrically connected to the current supply loop, and the second test point and the plated through hole (the pad located on the second surface) are electrically connected to the voltage detection loop to detect the resistance of the object to be detected.

[0044] Here, when the method is applied to Figure 1When the resistance detection fixture shown is used, the third probe in the lower fixture corresponding to the first surface of the circuit board and the fourth probe in the upper fixture corresponding to the second surface of the circuit board (the third probe and the fourth probe are electrically connected to the current supply loop) are electrically connected to the first test point and the second test point respectively, and the fifth probe and the sixth probe in the upper fixture corresponding to the second surface of the circuit board (the fifth probe and the sixth probe are electrically connected to the voltage test loop) are electrically connected to the second test point and the plated through hole (the pad located on the second surface) respectively, and then the resistance of the object to be detected is detected, thereby realizing the detection of the resistance of the object to be detected based on the first test point, the second test point and the plated through hole. The specific electrical connection method of the probe and the test point can be understood by referring to the content described in step S203, and will not be repeated here.

[0045] Of course, this method can also be applied to other resistance testing fixtures. For example, the method can be implemented by controlling the manipulator to grab two probes electrically connected to the current supply device at the initial position, and move them to the positions of the first test point and the second test point, respectively, and electrically connect them to the first test point and the second test point, respectively; controlling the manipulator to grab two probes electrically connected to the voltage detection device at the initial position, and move them to the positions of the second test point and the plated through hole (the pad located on the second surface), respectively, and electrically connect them to the second test point and the plated through hole (the pad located on the second surface), thereby realizing the detection of the resistance of the object to be detected based on the first test point, the second test point and the plated through hole, without limitation here.

[0046] In an embodiment of the present invention, by electrically connecting a first test point located on the first surface of the circuit board with a corresponding plated through hole, the plated through hole is indirectly located in the first network, and the plated through hole can replace the corresponding first test point as a test point of the object to be detected; at the same time, since the plated through hole passes through the first surface and the second surface of the circuit board, electrically connecting the first test point with the corresponding plated through hole can convert the first test point located on the first surface of the circuit board to the second surface through the plated through hole, so that when the resistance of the object to be detected is detected based on the first test point, the second test point and the plated through hole, the second test point and the plated through hole (the pad located on the second surface) can be used as connection points of a voltage detection device (in this case, the second surface is a voltage test surface), so that the detection connection line used for voltage detection of the object to be detected does not need to cross the entire circuit board or even cross the test fixture before being collected to the voltage measurement device, and the detection connection line can be as short as possible, thereby greatly reducing the possibility that the detection connection line is subject to external electromagnetic interference, and the voltage detection result, that is, the resistance detection result of the object to be detected, has a large error.

[0047] Figure 3 A flow chart of a resistance detection method according to another embodiment of the present invention is shown. In the embodiment of the present invention, the method can be used for Figure 1 The resistance detection fixture shown is used to detect the resistance of the object to be detected on the circuit board. Figure 3 As shown, the method may include the following steps:

[0048] S301: Extract the network information file of the first network. Here, the network information file records the network name and the test point information in each network. Specifically, the test point information includes the names and location information of all test points (i.e., pads) interconnected on the circuit board. Here, the network information file refers to the network information file in the circuit board design file.

[0049] S302: extracting two test points corresponding to the object to be detected from the network information file of the first network. The specific content of this step can be understood with reference to the above step S201, and will not be repeated here.

[0050] S303: extracting plated through holes on the circuit board. Here, the plated through holes are located in other networks except the first network. The specific content of this step can be understood with reference to the above step S202, and will not be repeated here.

[0051] S304: Control the first probe and the second probe corresponding to the first surface of the circuit board to move to the first test point and the plated through hole, respectively. Here, the first probe and the second probe are electrically connected.

[0052] Here, if Figure 1 As shown, the first probe and the second probe are both arranged on the lower detection fixture, and the second transmission mechanism drives the first probe and the second probe to move to the position corresponding to the first test point and the position corresponding to the plated through hole (the pad located on the first surface) respectively. At this time, the first test point and the plated through hole are located within the up and down movement path of the corresponding probe.

[0053] S305: Control the first probe and the second probe to approach the circuit board until the first probe and the second probe are electrically connected to the first test point and the plated through hole respectively.

[0054] S306: Control the third probe corresponding to the first surface of the circuit board to move to the first test point, and the fourth probe corresponding to the second surface of the circuit board to move to the second test point. Here, the third probe and the fourth probe are electrically connected to the current supply loop.

[0055] Here, if Figure 1As shown, the third probe is arranged on the lower detection fixture, the fourth probe is arranged on the upper detection fixture, the second transmission mechanism drives the third probe to move to the position corresponding to the first test point, at this time, the first test point is located in the up and down movement path of the third probe, the first transmission mechanism drives the fourth probe to move to the position corresponding to the second test point, at this time, the second test point is located in the up and down movement path of the fourth probe.

[0056] S307: Control the third probe and the fourth probe to approach the circuit board until the third probe is electrically connected to the first test point and the fourth probe is electrically connected to the second test point.

[0057] S308: Control the fifth probe and the sixth probe corresponding to the second surface of the circuit board to move to the second test point and the plated through hole, respectively. Here, the fifth probe and the sixth probe are electrically connected to the voltage test loop.

[0058] Here, if Figure 1 As shown, the fifth probe and the sixth probe are both arranged on the upper detection fixture, and the first transmission mechanism drives the fifth probe and the sixth probe to move to the position corresponding to the second test point and the position corresponding to the plated through hole (the pad located on the second surface) respectively. At this time, the second test point and the plated through hole are located within the up and down movement path of the corresponding probe.

[0059] S309: Control the fifth probe and the sixth probe to approach the circuit board until the fifth probe and the sixth probe are electrically connected to the second test point and the plated through hole respectively, and detect the resistance of the object to be detected.

[0060] In an embodiment of the present invention, a test point corresponding to the object to be detected is extracted from a network information file directly according to the network name of the first network where the object to be detected is located, and the probe is electrically connected to the corresponding test point through a first transmission mechanism and a second rotation mechanism controlled by a controller, so that the methods in the embodiments of the present invention can be automatically executed, thereby improving the resistance detection efficiency of the method.

[0061] Example 2

[0062] Figure 4 FIG. 1 is a block diagram showing a resistance detection device according to an embodiment of the present invention, which can be used to implement the resistance detection method described in Embodiment 1 or any optional implementation manner thereof. Figure 4 As shown, the device includes a first extraction module 10 , a second extraction module 20 , an electrical connection module 30 and a resistance detection module 40 .

[0063] The first extraction module 10 is used to extract two test points corresponding to the object to be detected; the two test points and the object to be detected are located in the first network; the two test points include a first test point located on the first surface of the circuit board where the object to be detected is located, and a second test point located on the second surface of the circuit board.

[0064] The second extraction module 20 is used to extract the plated through holes on the circuit board. Here, the plated through holes are located in other networks except the first network.

[0065] The electrical connection module 30 is used to electrically connect the first test point to the corresponding plated through hole.

[0066] The resistance detection module 40 is used to detect the resistance of the object to be detected based on the first test point, the second test point and the plated through hole.

[0067] The embodiment of the present invention also provides a resistance detection machine, such as Figure 5 As shown, the resistance detection machine may include a processor 51 and a memory 52, wherein the processor 51 and the memory 52 may be connected via a bus or other means. Figure 5 The example of connecting through bus is taken in the following.

[0068] In some embodiments, the resistance detection machine further includes: a current supply device, a voltage detection device, a first transmission mechanism, a second transmission mechanism, and a first probe to a sixth probe. For a detailed description of the above devices, see Figure 1 And the description of the application scenario before Example 1.

[0069] The processor 51 may be a central processing unit (CPU). The processor 51 may also be other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, or a combination of the above chips.

[0070] The memory 52 is a non-transitory computer-readable storage medium that can be used to store non-transitory software programs, non-transitory computer executable programs and modules, such as program instructions / modules corresponding to the resistance detection method in the embodiment of the present invention (for example, Figure 4The processor 51 executes various functional applications and data processing of the processor by running the non-transient software programs, instructions and modules stored in the memory 52, that is, the resistance detection method in the above method embodiment is implemented.

[0071] The memory 52 may include a program storage area and a data storage area, wherein the program storage area may store an operating system and applications required for at least one function; the data storage area may store data created by the processor 51, etc. In addition, the memory 52 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one disk storage device, a flash memory device, or other non-volatile solid-state storage device. In some embodiments, the memory 52 may optionally include a memory remotely arranged relative to the processor 51, and these remote memories may be connected to the processor 51 via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0072] The one or more modules are stored in the memory 52 and when executed by the processor 51, perform the following steps: Figure 2-Figure 3 The resistance detection method shown.

[0073] For details of the above resistance tester, please refer to Figure 1-Figure 3 The corresponding related descriptions and effects in the illustrated embodiments can be understood and will not be repeated here.

[0074] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiments can be implemented by instructing the relevant hardware through a computer program, and the program can be stored in a computer-readable storage medium, and when the program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, the storage medium can be a disk, an optical disk, a read-only memory (ROM), a random access memory (RAM), a flash memory, a hard disk drive (HDD) or a solid-state drive (SSD), etc.; the storage medium can also include a combination of the above-mentioned types of memory.

[0075] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the present invention.

Claims

1. A resistance detection method, characterized in that: The steps include: Extracting two test points corresponding to the object to be detected; the two test points and the object to be detected are located in a first network; the two test points include a first test point located on a first surface of a circuit board where the object to be detected is located, and a second test point located on a second surface of the circuit board; When no other test points connected to the test points corresponding to the object to be detected are extracted from the first network, the plated through holes on the circuit board are extracted; the plated through holes are located in other networks except the first network; a network includes all the test points on the circuit board that are connected to each other; electrically connecting the first test point to the corresponding plated through hole; Detecting the resistance of the object to be detected based on the first test point, the second test point and the plated through hole; The step of electrically connecting the first test point to the corresponding plated through hole comprises: Controlling a first probe and a second probe corresponding to the first surface of the circuit board to move to a first test point position and a plated through hole position respectively; the first probe and the second probe are electrically connected; Controlling the first probe and the second probe to approach the circuit board until the first probe and the second probe are electrically connected to the first test point and the plated through hole respectively; The step of detecting the resistance of the object to be detected based on the first test point, the second test point and the plated through hole comprises: Controlling a third probe corresponding to the first surface of the circuit board to move to a first test point, and controlling a fourth probe corresponding to the second surface of the circuit board to move to a second test point; the third probe and the fourth probe are electrically connected to a current supply loop; Controlling the third probe and the fourth probe to approach the circuit board until the third probe is electrically connected to the first test point and the fourth probe is electrically connected to the second test point; Controlling a fifth probe and a sixth probe corresponding to the second surface of the circuit board to move to the second test point position and the plated through hole position respectively; the fifth probe and the sixth probe are electrically connected to the voltage test loop; The fifth probe and the sixth probe are controlled to approach the circuit board until the fifth probe and the sixth probe are electrically connected to the second test point and the plated through hole respectively, so as to detect the resistance of the object to be detected.

2. The resistance detection method according to claim 1, characterized in that: The step of extracting two test points corresponding to the object to be detected includes: Extracting a network information file of the first network; the network information file records the network name and the test point information in each network; Two test points corresponding to the object to be detected are extracted from the network information file of the first network.

3. The resistance detection method according to claim 1, characterized in that: The plated through hole is a plated through hole within a predetermined range around the first test point.

4. The resistance detection method according to claim 1, characterized in that: The plated through hole is a plated through hole on the circuit board that is closest to the first test point.

5. A resistance detection device, characterized in that: include: A first extraction module is used to extract two test points corresponding to the object to be detected; the two test points and the object to be detected are located in a first network; The two test points include a first test point located on the first surface of the circuit board where the object to be detected is located, and a second test point located on the second surface of the circuit board; A second extraction module is used to extract the plated through holes on the circuit board when other test points connected to the test points corresponding to the object to be detected are not extracted in the first network; the plated through holes are located in other networks except the first network, and the plated through holes correspond to the first test points; a network includes all the test points on the circuit board that are interconnected; An electrical connection module, used for electrically connecting the first test point to the corresponding plated through hole; A resistance detection module, used for detecting the resistance of the object to be detected based on the first test point, the second test point and the plated through hole; The electrical connection module is further used to control a first probe and a second probe corresponding to the first surface of the circuit board to move to a first test point position and a plated through hole position respectively; the first probe and the second probe are electrically connected; Controlling the first probe and the second probe to approach the circuit board until the first probe and the second probe are electrically connected to the first test point and the plated through hole respectively; The resistance detection module is further used to control the third probe corresponding to the first surface of the circuit board to move to the first test point position, and the fourth probe corresponding to the second surface of the circuit board to move to the second test point position; the third probe and the fourth probe are electrically connected to the current supply loop; Controlling the third probe and the fourth probe to approach the circuit board until the third probe is electrically connected to the first test point and the fourth probe is electrically connected to the second test point; Controlling a fifth probe and a sixth probe corresponding to the second surface of the circuit board to move to the second test point position and the plated through hole position respectively; the fifth probe and the sixth probe are electrically connected to the voltage test loop; The fifth probe and the sixth probe are controlled to approach the circuit board until the fifth probe and the sixth probe are electrically connected to the second test point and the plated through hole respectively, so as to detect the resistance of the object to be detected.

6. A resistance detection machine, characterized in that: include: A memory and a processor, wherein the memory stores computer instructions, and the processor executes the resistance detection method according to any one of claims 1 to 4 by executing the computer instructions.

7. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable the computer to execute the resistance detection method according to any one of claims 1 to 4.

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