Display device and method for manufacturing the same

Abstract

The present application relates to a display device and a method for manufacturing the same. The display device includes a display panel including a display substrate and a connection pad disposed on a side surface of the display substrate, and a circuit board including a base plate and a driving pad disposed on the base plate to face the connection pad and to be electrically contacted with the connection pad. The connection pad includes a top surface and a bottom surface, at least a portion of the top surface is recessed to define a recessed space and the top surface faces the base plate, and the bottom surface faces the side surface of the display substrate. The driving pad is disposed in the recessed space.

Description

Technical Field

[0001] The disclosure herein relates to a display device, and more particularly, to a display device and a method for manufacturing the display device. Background Art

[0002] Various display devices have been developed for use in multimedia devices such as televisions, portable phones, tablet computers, navigation systems, and game consoles.

[0003] A display device may include a display panel for displaying an image. The display panel may include a plurality of gate lines, a plurality of data lines, and a plurality of pixels connected to the plurality of gate lines and the plurality of data lines. The display device may include a circuit board for providing electrical signals for displaying an image to the gate lines or the data lines. Summary of the Invention

[0004] In the display device, the circuit board may be electrically connected to the display panel through a bonding method of connecting two pads via an anisotropic conductive film or a bonding method of directly connecting the two pads to each other.

[0005] Embodiments of the present disclosure relate to a display device in which pads of a circuit board are directly connected to pads of a display panel on a side surface of the display panel, and a method for manufacturing the display device.

[0006] In an embodiment of the present invention, a display device includes a display panel and a circuit board, the display panel including a display substrate and connection pads disposed on a side surface of the display substrate, and the circuit board including a base board and a drive pad disposed on the base board so as to face and electrically contact the connection pad. In such an embodiment, the connection pad includes a top surface and a bottom surface, at least a portion of the top surface is recessed to define a recessed space, the top surface facing the base board, and the bottom surface facing a side surface of the display substrate. In such an embodiment, the drive pad is disposed in the recessed space.

[0007] In an embodiment, an entire portion of the driving pad may overlap with the connection pad in a plan view of the circuit board, and a plan area of ​​the connection pad may be larger than a plan area of ​​the driving pad in a plan view of the circuit board.

[0008] In an embodiment, a portion of the connection pad not overlapping the driving pad in a thickness direction of the connection pad may have a thickness greater than a thickness of another portion of the connection pad overlapping the driving pad in the thickness direction of the connection pad.

[0009] In an embodiment, a thickness of a portion of the connection pad may be two or more times greater than a thickness of another portion of the connection pad.

[0010] In an embodiment, the driving pad may include a first metal layer disposed on the base board, and a second metal layer covering the first metal layer and disposed on the base board.

[0011] In an embodiment, a thickness of the first metal layer may be greater than a thickness of the second metal layer, and the first metal layer and the second metal layer may include different materials from each other.

[0012] In an embodiment, the first metal layer may include copper, and the second metal layer may include tin.

[0013] In an embodiment, the connection pad may include a material different from that of the first metal layer and the second metal layer.

[0014] In an embodiment, the display device may further include a filler covering the driving pad and the connection pad that are in electrical contact with each other, and the filler may be disposed between the base plate and the side surface of the display substrate.

[0015] In an embodiment, the display substrate may include a first display substrate and a second display substrate, the first display substrate including a first side surface, the second display substrate facing the first display substrate and including a second side surface aligned with the first side surface. The side surface of the display substrate may be defined by the first side surface and the second side surface.

[0016] In an embodiment of the present invention, a display device includes a display panel and a circuit board, wherein the display panel includes a display substrate and connection pads provided on a side surface of the display substrate, and the circuit board includes a base board and a driving pad provided on the base board to face the connection pad and to be in electrical contact with the connection pad. In such an embodiment, in a plan view of the circuit board, an entire portion of the connection pad overlaps with the driving pad, and in a plan view of the circuit board, the driving pad surrounds the connection pad.

[0017] In an embodiment, the driving pad may include a first metal layer disposed on the base board, and a second metal layer covering the first metal layer and disposed on the base board. In such an embodiment, the connection pad may include a material different from that of the first and second metal layers.

[0018] In an embodiment of the present invention, a method for manufacturing a display device includes: preparing a display substrate; forming a conductive layer by providing a conductive material onto one side surface of the display substrate; forming a plurality of connecting pads spaced apart from each other by radiating a first laser to the conductive layer; performing an alignment process in such a manner that driving pads of a circuit board respectively face the plurality of connecting pads; setting the driving pads to respectively contact the plurality of connecting pads; pressing the circuit board in such a manner that parts of the plurality of connecting pads are respectively recessed by the driving pads; and radiating a second laser to the plurality of connecting pads to harden the plurality of connecting pads.

[0019] In an embodiment, the method may further include applying heat based on a first temperature to the conductive layer after forming the conductive layer. In such an embodiment, the conductive layer may have a first hardness at the first temperature.

[0020] In an embodiment, the second laser may provide heat having a second temperature higher than the first temperature to the plurality of connection pads, and the plurality of connection pads may have the second hardness higher than the first hardness by the second laser.

[0021] In an embodiment, the intensity of the first laser may be greater than the intensity of the second laser.

[0022] In an embodiment, the first temperature may be room temperature.

[0023] In an embodiment, in a plan view of the circuit board, an entire portion of a first driving pad of the driving pad may overlap with a first connection pad of the plurality of connection pads, wherein the first connection pad corresponds to the first driving pad. In such an embodiment, in a plan view of the circuit board, the first connection pad may surround the first driving pad.

[0024] In an embodiment, pressing the circuit board and irradiating the second laser to the plurality of connection pads may be performed simultaneously with each other.

[0025] In an embodiment, the method may further include providing a filler between one side surface of the display substrate and the circuit board. The filler may completely cover the driving pad and the plurality of connection pads. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The above and other features of embodiments of the present invention will become apparent by reference to the following detailed description of exemplary embodiments when considered in conjunction with the accompanying drawings, in which:

[0027] Figure 1A is a perspective view showing a display device according to an embodiment of the present invention;

[0028] Figure 1B is a perspective view showing a display device according to an alternative embodiment of the present invention;

[0029] Figure 2A is a cross-sectional view showing a display panel according to an embodiment of the present invention;

[0030] Figure 2B is a plan view showing a display panel according to an embodiment of the present invention;

[0031] Figure 3 is a plan view showing a portion of a display panel according to an embodiment of the present invention;

[0032] Figure 4 is a diagram showing an embodiment according to the present invention Figure 3 A cross-sectional view of a driving pad of a circuit board;

[0033] Figure 5A It is along Figure 3 A cross-sectional view taken along line II' of FIG. 1 to illustrate a display device according to an embodiment of the present invention;

[0034] Figure 5B It is along Figure 3 A cross-sectional view of a display device according to an alternative embodiment of the present invention is illustrated by taking line II' of FIG.

[0035] Figure 6 is a cross-sectional view illustrating a coupling structure between a driving pad of a circuit board and a connecting pad of a display panel according to an embodiment of the present invention;

[0036] Figure 7 is a cross-sectional view illustrating a coupling structure between a driving pad of a circuit board and a connection pad of a display panel according to an alternative embodiment of the present invention; and

[0037] Figures 8A to 8F is a view illustrating a method for manufacturing a display device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0038] The present invention will now be described more fully below with reference to the accompanying drawings showing various embodiments. However, the present invention may be implemented in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the scope of the invention to those skilled in the art. Like reference numerals represent like elements throughout.

[0039] It will be understood that when an element such as a layer, region, or substrate is referred to as being “on,” “connected to,” or “coupled to” another element, the element can be directly on, directly connected to, or directly coupled to the other element, or intervening elements may be present. In contrast, when an element is referred to as being “directly on,” “directly connected to,” or “directly coupled to” another element or layer, there are no intervening elements present.

[0040] The terms used herein are for the purpose of describing specific embodiments only and are not intended to be limiting. Unless otherwise expressly indicated by the content, as used herein, the singular forms "one", "an" and "the" are intended to include plural forms (including "at least one"). "Or" means "and / or". As used herein, the term "and / or" includes any and all combinations of one or more of the relevant listed items. It will also be understood that when used in this specification, the terms "comprising" and / or "including" or "including" and / or "including" represent the presence of stated features, regions, wholes, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, regions, wholes, steps, operations, elements, parts and / or combinations thereof.

[0041] For ease of description, spatially relative terms such as "beneath," "below," "lower," "above," "upper," etc. may be used herein to describe the relationship of one element or feature to another element or feature as shown in the accompanying drawings. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, elements described as being "below" or "beneath" other elements or features will then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations) and the spatially relative descriptors used herein are interpreted accordingly.

[0042] It will be understood that although the terms first, second, etc. can be used in this article to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish an element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings herein, the first element, first component, first region, first layer or first part discussed below can be referred to as the second element, second component, second region, second layer or second part.

[0043] As used herein, "about" or "approximately" includes the stated value and the average within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0044] The exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary illustrations. In the accompanying drawings, the thicknesses of layers and regions are exaggerated for clarity. Accordingly, deviations from the illustrated shapes due to, for example, manufacturing techniques and / or tolerances are to be expected. Therefore, the exemplary embodiments should not be construed as being limited to the shapes of the regions shown herein, but rather should be understood to include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have circular or curved features. Therefore, the regions shown in the accompanying drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0045] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0046] Figure 1A is a perspective view showing a display device according to an embodiment of the present invention. Figure 1B is a perspective view showing a display device according to an alternative embodiment of the present invention.

[0047] Reference Figure 1A , an embodiment of the display device DD may include a display panel DP, a connection circuit board DDC, a main circuit board PB, and a signal controller SC.

[0048] The display device DD can display an image through the display surface DP-IS. Figure 1A As shown in , the display device DD may include a flat display surface DP-IS. However, embodiments of the present invention are not limited thereto. In alternative embodiments, the display device DD may include a curved display surface or a three-dimensional ("3D") display surface. A 3D display surface may include multiple display areas extending in different directions from each other. In one embodiment, for example, the 3D display surface may include a polygonal columnar display surface.

[0049] In an embodiment, the display device DD may be a flexible display device. However, embodiments of the present invention are not limited thereto. In an alternative embodiment, the display device DD may be a rigid display device.

[0050] In an embodiment, even though not shown in the drawings, the electronic module, camera module, and power module mounted on the mainboard may be provided in a bracket and / or housing together with the display device DD to constitute an electronic device (e.g., a mobile phone). The display device DD of this embodiment can be applied to large electronic devices (e.g., televisions and monitors) as well as small and medium-sized electronic devices (e.g., tablets, car navigation units, game consoles, and smart watches).

[0051] The display surface DP-IS may be parallel to a plane defined by the first direction DR1 and the second direction DR2. The normal direction of the display surface DP-IS (i.e., the thickness direction of the display device DD) may be indicated by a third direction DR3. Herein, it will be understood that when one or more components are observed in a plan view, one or more components may be observed in a direction opposite to the third direction DR3. In addition, a plane area or size may mean an area or size when observed in a direction opposite to the third direction DR3. The front surface (or top surface) and the rear surface (or bottom surface) of each of the components or units described below may be defined based on the third direction DR3. However, the first direction DR1, the second direction DR2, and the third direction DR3 shown in the drawings are merely exemplary, and the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 may be changed to opposite directions.

[0052] In an embodiment, the display panel DP may generate an image and may provide the generated image to a window (not shown). According to an embodiment of the present invention, the display panel DP may be, but is not limited to, an organic light-emitting display panel, a liquid crystal display panel, or a quantum dot light-emitting display panel. The organic light-emitting display panel may include an organic light-emitting element. The liquid crystal display panel may include liquid crystal molecules. The quantum dot light-emitting display panel may include quantum dots or quantum rods.

[0053] Hereinafter, for the convenience of description, an embodiment in which the display panel DP is an organic light emitting display panel will be described in detail. However, the embodiments of the present invention are not limited thereto. In other alternative embodiments, the display panel DP may be one of various other types of display panels.

[0054] In an embodiment, the display panel DP may include a first display substrate 100 and a second display substrate 200 disposed on the first display substrate 100. The display panel DP may include a display area DA and a non-display area NDA adjacent to the display area DA. Figure 1A As shown in FIG, in a plan view, the display area DA may have a rectangular shape, and the non-display area NDA may have a shape surrounding the display area DA. However, embodiments of the present invention are not limited thereto. The shapes of the display area DA and the non-display area NDA may be designed or modified differently. In one embodiment, for example, the non-display area NDA may be provided adjacent to only one side of the display area DA, or may be omitted.

[0055] The display panel DP may include a bottom surface and a top surface facing each other in the third direction DR3, and a side surface connecting the bottom surface and the top surface. The bottom surface of the display panel DP may correspond to the bottom surface of the first display substrate 100, and the top surface of the display panel DP may correspond to the top surface of the second display substrate 200.

[0056] According to an embodiment of the present invention, a connection pad group DP-PG may be provided on one of the side surfaces of the display panel DP. The connection pad group DP-PG may be electrically connected to pixels included in the display panel DP (see FIG. Figure 2B ). The connection pad group DP-PG may be provided in plurality, and the plurality of connection pad groups DP-PG may be arranged in the first direction DR1. Each of the connection pad groups DP-PG may include a plurality of connection pads DP-PD (see Figure 3 ).

[0057] The connection circuit board DDC may face one side surface of the display panel DP. The connection circuit board DDC may include a base board DCB facing one side surface of the display panel DP and a driving chip DC disposed on the base board DCB. The base board DCB may be a flexible printed circuit board having flexible characteristics.

[0058] A plurality of connection circuit boards DDC may be provided, and the plurality of connection circuit boards DDC may be arranged in the first direction DR1. The plurality of connection circuit boards DDC may be electrically connected to a plurality of connection pad groups DP-PG, respectively. Hereinafter, for ease of description, a single connection circuit board DDC and a single connection pad group DP-PG electrically connected to the connection circuit board DDC will be primarily described in detail.

[0059] According to an embodiment of the present invention, the connection circuit board DDC may further include driving pads CB-PD (see FIG. Figure 3 ). The connection pad DP-PD and the driving pad CB-PD may not be electrically connected to each other through an additional conductive film, but may be directly connected to each other. Figure 3 This is described in more detail.

[0060] The driver chip DC may be provided on the base board DCB. The driver chip DC may output a plurality of image signals corresponding to the image output from the display panel DP. The driver chip DC may transmit the image signals to the display panel DP through the base board DCB and the connection pad groups DP-PG. In an embodiment, as Figure 1AAs shown in FIG, the driving chip DC is disposed on the base board DCB. However, in an alternative embodiment, the driving chip DC may be disposed on the first display substrate 100 instead of on the side surface of the display panel DP.

[0061] The main circuit board PB can be electrically connected to one end of the connection circuit board DDC. In one embodiment, for example, the main circuit board PB can be a rigid printed circuit board. The signal controller SC can be electrically connected to the connection circuit board DDC and can transmit multiple control signals to the display panel DP via the connection circuit board DDC. The control signals can include image signals output from the driver chip DC and overall drive signals for driving the display panel DP.

[0062] Reference Figure 1B In an alternative embodiment, the display device DD may include a single connection circuit board DDCa. In such an embodiment, the display panel DP and the main circuit board PB may be electrically connected to each other via the single connection circuit board DDCa. According to an embodiment of the present invention, the connection circuit board DDCa may be directly connected to the side surface of the display panel DP without an additional conductive film.

[0063] Figure 2A is a cross-sectional view showing a display panel according to an embodiment of the present invention. Figure 2B is a plan view showing a display panel according to an embodiment of the present invention. Figure 3 is a plan view showing a portion of a display panel according to an embodiment of the present invention. Figure 4 is a diagram showing an embodiment according to the present invention Figure 3 A cross-sectional view of the driver pads of a circuit board.

[0064] Reference Figure 2A In an embodiment, each of the first display substrate 100 and the second display substrate 200 may include a plurality of layers. In one embodiment, for example, even though not shown in the drawings, the first display substrate 100 may include a base layer, a circuit element layer, and a display element layer, wherein the circuit element layer includes a signal line and a driving circuit provided on the base layer, and the display element layer includes a display element.

[0065] An internal space GP may be defined or formed between the first display substrate 100 and the second display substrate 200. The internal space GP may be maintained by an adhesive layer SLM disposed between the first display substrate 100 and the second display substrate 200. The adhesive layer SLM may overlap the non-display area NDA. In one embodiment, for example, the adhesive layer SLM may be an organic adhesive layer or an inorganic adhesive layer. The internal space GP may be sealed by the adhesive layer SLM, the first display substrate 100, and the second display substrate 200, thereby protecting the circuit element layer and the display element layer included in the first display substrate 100 from external moisture, external oxygen, and / or foreign matter such as dust particles.

[0066] In an embodiment, even if not shown in the drawings, the second display substrate 200 may include an encapsulation layer connected to the adhesive layer SLM, and an input sensing layer provided on the encapsulation layer. The input sensing layer can sense input provided from the outside. The input provided from the outside can be provided in various forms. In one embodiment, for example, the external input may include at least one of various external inputs such as a touch of a part of the user's body (e.g., a finger), a stylus, light, heat, and pressure. In an embodiment, the external input may include a proximity touch (e.g., a hover touch) and a touch of a part of the user's body. In an alternative embodiment, the input sensing layer may be omitted.

[0067] Reference Figure 2B In an embodiment, the display panel DP may include a gate driving circuit GDC, pixels PX11 to PXnm, signal lines GL1 to GLn and DL1 to DLm, and connection pad groups DP-PG1 to DP-PG5. Figure 2B The planar arrangement of the signal lines GL1 to GLn and DL1 to DLm and the pixels PX11 to PXnm is shown. The gate driving circuit GDC, the pixel driving circuits of the pixels PX11 to PXnm, and the signal lines GL1 to GLn and DL1 to DLm may be included in the circuit element layer of the first display substrate 100 described above.

[0068] Portions of the signal lines GL1 to GLn and DL1 to DLm and the pixels PX11 to PXnm may overlap the display area DA in a plan view, and the remaining portions of the signal lines GL1 to GLn and DL1 to DLm and the gate drive circuit GDC may overlap the non-display area NDA in a plan view. The signal lines GL1 to GLn and DL1 to DLm may include a plurality of gate lines GL1 to GLn and a plurality of data lines DL1 to DLm. Although not shown in the drawings, the signal lines may also include power lines.

[0069] Each of the pixels PX11 to PXnm can be connected to a corresponding one of the plurality of gate lines GL1 to GLn and a corresponding one of the plurality of data lines DL1 to DLm. Each of the pixels PX11 to PXnm can include a pixel driving circuit and a display element. Other types of signal lines can be further provided in the display panel DP depending on the configuration of the pixel driving circuit.

[0070] Pixels PX11 to PXnm may be arranged in a matrix form. However, embodiments of the present invention are not limited thereto. In an alternative embodiment, pixels PX11 to PXnm may be arranged in a pentile form. In yet another alternative embodiment, pixels PX11 to PXnm may be arranged in a diamond form.

[0071] The gate driving circuit GDC may be disposed in the non-display area NDA. In an embodiment, the gate driving circuit GDC may be integrated into the display panel DP through an oxide silicon gate driving circuit ("OSG") process or an amorphous silicon gate driving circuit ("ASG") process.

[0072] In conventional display devices, the connection pad group can completely overlap with the top surface of the first display substrate and can be provided on the base layer of the first display substrate. Therefore, the area (or size) of the non-display region can be determined by taking into account the planar area (or size) of the connection pad group.

[0073] However, according to an embodiment of the present invention, the connection pad groups DP-PG1 to DP-PG5 may be disposed or formed on one side surface of the display panel DP. Since the connection pad groups DP-PG1 to DP-PG5 are disposed on one side surface of the display panel DP, the area (or size) of the non-display area NDA of the display panel DP may be reduced by the planar area (or size) of the connection pad groups DP-PG1 to DP-PG5.

[0074] Connection pad groups DP-PG1 to DP-PG5 may be respectively provided on one side surface of the display panel DP to be connected to a data line group. Here, each of the data line groups may include a corresponding data line from among the data lines DL1 to DLm. In one embodiment, for example, the connection pads in the first connection pad group DP-PG1 may respectively electrically contact the data lines in the corresponding first data line group from among the data line groups.

[0075] Figure 3 Shown included in Figure 2B Implementation of the connection pad DP-PD in one of the connection pad groups DP-PG1 to DP-PG5 shown in . Figure 3An embodiment of a driving pad CB-PD included in one of the connection circuit boards DDC is shown. In one embodiment, for example, the connection pad DP-PD may include silver (Ag) or carbon (C).

[0076] In an embodiment, Figure 3 As shown in , one end of the data line DL can be directly connected to the connection pad DP-PD. In this article, it should be understood that when components "A" and "B" are directly connected to each other, components "A" and "B" are in contact with each other without an intervening component located therebetween. In such an embodiment, the driving pad CB-PD provided on the base board DCB can be directly connected to the connection pad DP-PD. In addition, in Figure 3 Also shown are gate lines GL intersecting the data lines DL and a plurality of pixels PX arranged in a matrix form.

[0077] According to an embodiment of the present invention, the driving pads CB-PD of the connection circuit board DDC and the connection pads DP-PD of the display panel DP may be electrically connected to each other without passing through an additional conductive film, but may be directly connected to each other. As a result, in such an embodiment, a short circuit between two adjacent driving pads of the connection circuit board DDC and / or between two adjacent connection pads of the display panel DP may be effectively prevented.

[0078] Reference Figure 4 , the driving pad CB-PD may include a first metal layer PY1 and a second metal layer PY2. The first metal layer PY1 may be disposed on a base board DCB of the connection circuit board DDC. The second metal layer PY2 may completely cover the first metal layer PY1 and may be disposed on the base board DCB. The thickness of the first metal layer PY1 may be greater than the thickness of the second metal layer PY2. In one embodiment, for example, the second metal layer PY2 may be a covering layer covering the surface of the first metal layer PY1. In such an embodiment, the connection pad DP-PD of the display panel DP may be directly connected to the second metal layer PY2.

[0079] According to an embodiment of the present invention, the first metal layer PY1, the second metal layer PY2 and the connection pad DP-PD may include materials different from each other. In one embodiment, for example, as described above, the connection pad DP-PD may include silver (Ag). In one embodiment, for example, the first metal layer PY1 may include copper (Cu), and the second metal layer PY2 may include tin (Sn). In such an embodiment, the second metal layer PY2 including tin (Sn) completely covers the first metal layer PY1 including copper (Cu), thereby suppressing or preventing the first metal layer PY1 from undergoing an oxidation reaction with the outside. However, the materials of the first metal layer PY1 and the second metal layer PY2 are not limited thereto. In an alternative embodiment, each of the first metal layer PY1 and the second metal layer PY2 may include one of the other metal materials.

[0080] Figure 5A It is along Figure 3 A cross-sectional view of a display device according to an embodiment of the present invention is illustrated by taking line II' of FIG. Figure 5B It is along Figure 3 A cross-sectional view of a display device according to an alternative embodiment of the present invention is illustrated by taking line II' of FIG.

[0081] Reference Figure 5A In an embodiment, the first display substrate 100 may include a base layer BS, an insulating layer IL, and data lines DL. The base layer BS may include a synthetic resin substrate or a glass substrate. The insulating layer IL and the data lines DL may be disposed on the base layer BS and may be included in the reference image of the first display substrate 100. Figure 2A The circuit components layer described in Figure 5A In an embodiment, the first display substrate 100 includes a single insulating layer IL. However, embodiments of the present invention are not limited thereto. In an alternative embodiment, the first display substrate 100 may include a plurality of insulating layers.

[0082] The first display substrate 100 may include a bottom surface DP-DS and a first side surface DP-SS1. The bottom surface DP-DS of the first display substrate 100 may correspond to the bottom surface of the base layer BS or the display panel DP (see FIG. Figure 1A ). The second display substrate 200 may include a top surface DP-US and a second side surface DP-SS2. The top surface DP-US of the second display substrate 200 may correspond to the top surface of the display panel DP. The top surface of the first display substrate 100 may face the second display substrate 200, and the bottom surface of the second display substrate 200 may face the first display substrate 100.

[0083] The first side surface DP-SS1 of the first display substrate 100 may be aligned with the second side surface DP-SS2 of the second display substrate 200 in the third direction DR3. One side surface of the display panel DP facing the connection circuit board DDC may be defined by the first and second side surfaces DP-SS1 and DP-SS2.

[0084] The connection pad DP-PD may be provided on the first side surface DP-SS1 and the second side surface DP-SS2 aligned with each other. The connection pad DP-PD may have a single overall shape and may be provided on the first side surface DP-SS1 and the second side surface DP-SS2. Figure 5A As shown in FIG, the connection pad DP-PD may not overlap with the top surface DP-US of the display panel DP.

[0085] However, the embodiments of the present invention are not limited thereto. In an alternative embodiment, at least a portion of the connection pad DP-PD may overlap with the top surface DP-US of the display panel DP. Figure 5B As shown in FIG, a portion of the connection pad DP-PDa may be disposed between the first display substrate 100 and the second display substrate 200. In such an embodiment, the portion of the connection pad DP-PDa between the first display substrate 100 and the second display substrate 200 may be connected to the adhesive layer SLM.

[0086] Return to reference Figure 5A In an embodiment, the driving pads CB-PD of the connection circuit board DDC may be directly connected to the connection pads DP-PD of the display panel DP. Each of the driving pads CB-PD and the connection pads DP-PD may include a metal material, and the driving pads CB-PD and the connection pads DP-PD may be electrically connected to each other. Figure 1A ) can be transmitted to the data line DL through the driving pad CB-PD and the connecting pad DP-PD.

[0087] According to an embodiment of the present invention, when viewed in the second direction DR2, the entire portion of the driving pad CB-PD may overlap with the connection pad DP-PD, and when viewed in the second direction DR2, the plane area (or size) of the connection pad DP-PD may be larger than the plane area (or size) of the driving pad CB-PD. In an embodiment, at least a portion of the driving pad CB-PD may be inserted into the connection pad DP-PD.

[0088] In an embodiment, during the process of bonding the driving pad CB-PD and the connecting pad DP-PD to each other, the connecting pad DP-PD may have a first hardness. In such an embodiment, the connecting pad DP-PD may be hardened to have the first hardness based on external heat having a first temperature, and the first temperature may be, for example, room temperature. Room temperature may be a temperature in the range of approximately 15 degrees Celsius to approximately 25 degrees Celsius or in the range of approximately 21 degrees Celsius to approximately 23 degrees Celsius. In such an embodiment, the connecting pad DP-PD having the first hardness may have a flexible state in which its shape can be deformed by external pressure.

[0089] In the process of combining the driving pad CB-PD and the connecting pad DP-PD with each other, the driving pad CB-PD may press the upper portion of the connecting pad DP-PD having a first hardness by external pressure. As a result, at least a portion of the driving pad CB-PD may be inserted into the connecting pad DP-PD. Thereafter, the connecting pad DP-PD may be hardened by external heat having a second temperature higher than the first temperature, and thus the connecting pad DP-PD may have a second hardness higher than the first hardness. Herein, the connecting pad DP-PD having the second hardness may have a state in which its shape is not deformed by external pressure. Specifically, when the connecting pad DP-PD is exposed to external heat having a second temperature, the connecting pad DP-PD may be hardened in a state in which the connecting pad DP-PD and the driving pad CB-PD are directly connected to each other.

[0090] Will refer to it later Figures 8A to 8F The bonding process between the driving pad CB-PD and the connection pad DP-PD is described in more detail.

[0091] Figure 6 is a cross-sectional view illustrating a coupling structure between a driving pad of a circuit board and a connection pad of a display panel according to an embodiment of the present invention. Figure 7 is a cross-sectional view illustrating a coupling structure between a driving pad of a circuit board and a connection pad of a display panel according to an alternative embodiment of the present invention.

[0092] Reference Figure 6In an embodiment, the connection pads DP-PD may be provided on the first side surface DP-SS1 of the first display substrate 100 and the second side surface DP-SS2 of the second display substrate 200. In such an embodiment, the connection pads DP-PD are provided on both the first side surface DP-SS1 and the second side surface DP-SS2 of the first display substrate 100 and the second display substrate 200. However, embodiments of the present invention are not limited thereto. In an alternative embodiment, the connection pads DP-PD may be provided on only one of the first side surface DP-SS1 of the first display substrate 100 and the second side surface DP-SS2 of the second display substrate 200.

[0093] According to an embodiment of the present invention, the connection pad DP-PD may include a top surface and a bottom surface opposite the top surface, wherein at least a portion of the top surface is recessed to define a recessed space HM. The top surface of the connection pad DP-PD may face the connection circuit board DDC. The bottom surface of the connection pad DP-PD may face the first side surface DP-SS1 of the first display substrate 100 and the second side surface DP-SS2 of the second display substrate 200.

[0094] The driving pad CB-PD may include a first pad portion and a second pad portion, wherein the first pad portion is arranged in a recessed space HM defined in the top surface of the connecting pad DP-PD, and the second pad portion does not contact the connecting pad DP-PD. The height SP of the recessed space HM may correspond to the thickness of the first pad portion of the driving pad CB-PD. According to an embodiment of the present invention, the recessed space HM of the connecting pad DP-PD may be formed by pressurizing the driving pad CB-PD. In one embodiment, for example, the driving pad CB-PD may press the upper portion of the connecting pad DP-PD having a first hardness with a predetermined pressure or greater, and thus the first pad portion of the driving pad CB-PD may be inserted into the connecting pad DP-PD.

[0095] In an embodiment, as described above, at least a portion of the top surface of the connection pad DP-PD may be recessed by the driving pad CB-PD. Therefore, a thickness H1 of a portion of the connection pad DP-PD that does not overlap with the driving pad CB-PD in its thickness direction may be greater than a thickness H2 of another portion of the connection pad DP-PD that overlaps with the driving pad CB-PD in its thickness direction. In an embodiment, the thickness H1 of the portion may be two or more times greater than the thickness H2 of the other portion.

[0096] Reference Figure 7In an alternative embodiment, the connection pad DP-PDz may be provided on the first side surface DP-SS1 and the second side surface DP-SS2. When viewed from a plan view in the thickness direction of the connection pad DP-PDz, the entire portion of the connection pad DP-PDz may overlap with the drive pad CB-PD, and the planar area (or size) of the connection pad DP-PDz may be smaller than the planar area (or size) of the drive pad CB-PD. In a plan view of the connection circuit board DDC, the drive pad CB-PD may surround the connection pad DP-PDz.

[0097] In the process of bonding the connection pad DP-PDz and the driving pad CB-PD to each other, the connection pad DP-PDz may be hardened based on a first temperature corresponding to room temperature, and thus the connection pad DP-PDz may have a first hardness. The driving pad CB-PD may press the connection pad DP-PDz having the first hardness by external pressure. In such an embodiment, the driving pad CB-PD may press the connection pad DP-PDz as a whole.

[0098] Thereafter, the connection pad DP-PDz may be hardened by external heat having a second temperature higher than the first temperature, and thus the connection pad DP-PDz may have a second hardness higher than the first hardness. Figure 5A As described, the connection pad DP-PDz having the first hardness may have a flexible state in which the shape is deformed by external pressure, and the connection pad DP-PDz having the second hardness may have a state in which the shape is not deformed by external pressure.

[0099] When the connection pad DP-PDz is exposed to an environment having a second temperature, the connection pad DP-PDz may be hardened in a state where the connection pad DP-PDz and the driving pad CB-PD are directly connected to each other. In such an embodiment, the connection pad DP-PDz may have the second hardness and may be in contact with the driving pad CB-PD.

[0100] Figures 8A to 8F is a view illustrating a method for manufacturing a display device according to an embodiment of the present invention.

[0101] Reference Figure 8A In an embodiment, a first display substrate 100 and a second display substrate 200 facing each other in the third direction DR3 may be provided. In such an embodiment, as described above with reference to Figure 2AAs described above, the first display substrate 100 and the second display substrate 200 can be coupled to each other via an adhesive layer SLM. In such an embodiment, the second display substrate 200 can be provided as an encapsulation substrate. However, embodiments of the present invention are not limited thereto. In alternative embodiments, the second display substrate 200 can be provided as an encapsulation layer (i.e., a thin film encapsulation layer), and the adhesive layer SLM can be omitted.

[0102] Reference Figure 8B , a conductive layer DP-PDM including a conductive material may be provided or formed on the first side surface DP-SS1 of the first display substrate 100 and the second side surface DP-SS2 of the second display substrate 200. In one embodiment, for example, the conductive material may be a metal material such as silver (Ag). The first side surface DP-SS1 of the first display substrate 100 and the second side surface DP-SS2 of the second display substrate 200 may be defined as one side surface DP-SS of the display panel DP. The conductive layer DP-PDM may be provided or formed on one side surface DP-SS of the display panel DP by one of a variety of methods such as a screen printing method and a metal deposition method.

[0103] According to an embodiment of the present invention, the conductive layer DP-PDM can be hardened by at least two heating processes. Figure 8B As shown in FIG, in a first process of heating the conductive layer DP-PDM, when the conductive layer DP-PDM is formed on one side surface DP-SS of the display panel DP, the heating device HTD may apply external heat having a first temperature to the conductive layer DP-PDM. The conductive layer DP-PDM may have a first hardness due to the external heat having the first temperature corresponding to room temperature. According to an embodiment of the present invention, the shape of the conductive layer DP-PDM having the first hardness may be deformable by external pressure.

[0104] Reference Figure 8C , the conductive layer DP-PDM may be divided into a plurality of connection pads DP-PD by the laser module LD. Portions of the conductive layer DP-PDM corresponding to portions between the connection pads DP-PD may be removed by laser irradiation from the laser module LD, thereby forming the connection pads DP-PD. Therefore, the connection pads DP-PD may be spaced apart from each other in the first direction DR1.

[0105] In an embodiment, even if Figure 8C Not shown, but each of the connection pads DP-PD can be connected to Figure 3 The corresponding ones of the data lines DL shown in FIG. 5 are in electrical contact.

[0106] Reference Figure 8D, a connection circuit board DDC and a main circuit board PB may be prepared. The connection circuit board DDC and the main circuit board PB may be provided in a state where the connection circuit board DDC and the main circuit board PB are coupled to each other. The connection circuit board DDC may include a driver chip DC provided on the top surface of the base board DCB and a plurality of driver pads CB-PD provided on the bottom surface of the base board DCB.

[0107] According to an embodiment of the present invention, an alignment process can be performed in such a manner that the driving pads CB-PD of the connecting circuit board DDC face the connecting pads DP-PD of the display panel DP, respectively, and then, the driving pads CB-PD of the connecting circuit board DDC can be made to contact the connecting pads DP-PD of the display panel DP, respectively.

[0108] Thereafter, the upper portion of the connection circuit board DDC may be pressed by the pressing device ATD. The driving pads CB-PD may respectively press the upper portions of the connection pads DP-PD by an external force provided via the pressing device ATD. As a result, the top surface of the connection pads DP-PD may have a concave space HM formed by the pressure provided by the driving pads CB-PD (see Figure 6 ), and the driving pads CB-PD may be disposed in the recessed space HM. In a plan view of the connection circuit board DDC, the connection pads DP-PD may surround the driving pads CB-PD corresponding thereto.

[0109] Reference Figure 8E , portions of the driving pads CB-PD may be respectively inserted into the connection pads DP-PD. In such an embodiment, the driving pads CB-PD may be respectively embedded in the recessed spaces HM defined in the connection pads DP-PD.

[0110] According to an embodiment of the present invention, reference may be made to Figure 8D Describe the process of pressing the DDC to connect the circuit board, and at the same time, you can Figure 8E The connection pads DP-PD shown in FIG are irradiated with laser light. In such an embodiment, the process of pressing the connection circuit board DDC and the process of irradiating the connection pads DP-PD with laser light can be performed simultaneously. The laser light can increase the temperature of the connection pads DP-PD to a second temperature higher than the first temperature, thereby hardening the connection pads DP-PD. In one embodiment, for example, the laser light can provide high heat of 100 degrees Celsius or higher.

[0111] In an embodiment, from the reference Figure 8C The intensity of the laser light outputted by the laser module LD (hereinafter referred to as the "first laser light") may be different from that of the reference laser. Figure 8EIn one embodiment, for example, referring to Figure 8C The intensity of the first laser used to remove the portion of the conductive layer DP-PDM described above may be greater than that of the reference Figure 8E Describes the intensity of the second laser.

[0112] The second laser may impart a second hardness to the connection pad DP-PD that is higher than the first hardness. Due to the second hardness of the connection pad DP-PD, the connection pad DP-PD and the driving pad CB-PD embedded therein may be maintained in contact.

[0113] Reference Figure 8F A filler RS ​​may be provided or formed between the base board DCB of the connection circuit board DDC and one side surface DP-SS of the display panel DP. The filler RS ​​may be an adhesive resin that connects the connection circuit board DDC and the display panel DP. The filler RS ​​may completely cover the driving pads CB-PD provided on the base board DCB and the connection pads DP-PD provided on one side surface DP-SS of the display panel DP.

[0114] Since the driving pads CB-PD and the connecting pads DP-PD are covered by the filler RS, the driving pads CB-PD and the connecting pads DP-PD can be protected from the influence of the external air. As a result, the driving pads CB-PD and the connecting pads DP-PD can be effectively prevented from being oxidized by the external air.

[0115] According to an embodiment of the present invention, the driving pads of the connection circuit board can be directly connected to the connection pads of the display panel, respectively. As a result, a short circuit can be effectively prevented between two adjacent driving pads of the connection circuit board and / or between two adjacent connection pads of the display panel.

[0116] In an embodiment of the present invention, the connection pad may be provided on one side surface of the display panel. As a result, the area (or size) of the non-display region of the display device may be reduced.

[0117] Although the present invention has been described with reference to exemplary embodiments, it will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. Therefore, it should be understood that the above embodiments are not restrictive, but illustrative. Therefore, the scope of the present invention is to be determined by the broadest permissible interpretation of the appended claims and their equivalents, and should not be restricted or limited by the foregoing description.

Claims

1. A display device comprising: A display panel comprising a display substrate and connection pads, the connection pads being provided on a side surface of the display substrate, the side surface of the display substrate intersecting with a display surface on which an image is displayed; as well as A circuit board includes a base board and a driving pad, wherein the driving pad is arranged on the base board to face the connecting pad and electrically contact the connecting pad. in the connection pad includes a top surface and a bottom surface, at least a portion of the top surface is recessed toward the side surface of the display substrate to define a recessed space and the top surface faces the base board, and the bottom surface faces the side surface of the display substrate, and The driving pad is disposed in the concave space, and the connection pad covers the entirety of a bottom surface of the driving pad facing the top surface of the connection pad and at least a portion of a side surface intersecting the top surface of the connection pad.

2. The display device according to claim 1, wherein In a plan view of the circuit board, the entire portion of the driving pad overlaps the connection pad, and In the plan view of the circuit board, a planar area of ​​the connection pad is larger than a planar area of ​​the driving pad.

3. The display device according to claim 1, wherein A portion of the connection pad that does not overlap with the driving pad in a thickness direction of the connection pad has a thickness greater than a thickness of another portion of the connection pad that overlaps with the driving pad in the thickness direction of the connection pad.

4. The display device according to claim 1, wherein The driving pad includes: A first metal layer is provided on the base plate; and The second metal layer covers the first metal layer and is disposed on the base plate.

5. The display device according to claim 1, further comprising: a filler covering the driving pad and the connecting pad that are in electrical contact with each other, Wherein, the filling member is arranged between the base plate and the side surface of the display substrate. The display device according to claim 1 , wherein: The display substrate comprises: a first display substrate including a first side surface; and a second display substrate facing the first display substrate and including a second side surface aligned with the first side surface, The side surface of the display substrate is defined by the first side surface and the second side surface.

7. A method for manufacturing a display device, the method comprising: preparing a display substrate; forming a conductive layer by providing a conductive material onto one side surface of the display substrate; forming a plurality of connection pads spaced apart from each other by irradiating a first laser onto the conductive layer; performing an alignment process in such a manner that the driving pads of the circuit board respectively face the plurality of connection pads; Disposing the driving pads to be in contact with the plurality of connecting pads respectively; pressing the circuit board in such a manner that portions of the plurality of connection pads are respectively recessed through the driving pads; as well as A second laser is irradiated toward the plurality of connection pads to harden the plurality of connection pads.

8. The method according to claim 7, further comprising: After forming the conductive layer, heat based on a first temperature is applied to the conductive layer, wherein the conductive layer has a first hardness by the first temperature.

9. The method according to claim 8, wherein The second laser provides heat having a second temperature higher than the first temperature to the plurality of connection pads, and in, The second laser light causes the plurality of connection pads to have a second hardness higher than the first hardness.

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