Die pick-up module and die bonding apparatus comprising the same

Abstract

A die pickup module and a die bonding apparatus including the same are disclosed. The die pickup module includes a wafer stage for supporting a wafer including dies attached on a dicing tape, a die separator disposed under the dicing tape and separating a die to be picked up from the dicing tape, a non-contact pickup for picking up the die in a non-contact manner such that a front surface of the die is not contacted, a vertical driving unit moving the non-contact pickup in a vertical direction to pick up the die, and a flip driving unit for flipping the non-contact pickup to flip the die picked up by the non-contact pickup.

Description

TECHNICAL FIELD

[0001] The present invention relates to a substrate processing apparatus. BACKGROUND

[0002] Embodiments of the present invention relate to a die pick-up module and a die bonding apparatus including the same. More particularly, the present invention relates to a die pick-up module for picking up a die attached to a dicing tape in a manufacturing process of a semiconductor device, and a die bonding apparatus for bonding the die picked up by the die pick-up module to a substrate.

[0003] Generally, a semiconductor device can be formed on a silicon wafer serving as a semiconductor substrate by repeatedly performing a series of manufacturing processes. The wafer on which the semiconductor device is formed can be individualized into a plurality of dies through a dicing process, and the dies individualized through the dicing process can be bonded to a substrate such as a lead frame, a printed circuit board (PCB), and a semiconductor wafer through a die bonding process.

[0004] An apparatus for performing a die bonding process can include a die pick-up module for picking up and separating dies from a wafer that is divided into the dies, and a die bonding module for bonding the picked-up dies to a substrate. The die pick-up module can include a stage unit for supporting the wafer, a die ejector for selectively separating the dies from the wafer supported by the stage unit, and a picker for picking up the dies from the wafer and transferring to the die bonding module. The die bonding module can include a substrate stage for supporting the substrate, and a bonding head for vacuum-adsorbing the dies and bonding the dies to the substrate.

[0005] In recent years, as the integration of semiconductor devices is increased, the pad pitch on the dies is gradually reduced, and in the die bonding process, the problem of contamination of the front surface of the die bonded to the substrate becomes an issue to be solved. Particularly, in the case of a TSV (Through Silicon Via) bonding process for manufacturing a stacked semiconductor device, a plurality of electrode pads can be disposed on the front surface of the die, and a contamination problem due to contact can occur in the process of picking up the die from the wafer by the picker.

[0006] Prior Art Documents

[0007] (Patent Document 1) Korean Patent Laid-Open No. 10-2019-0034858 (Publication Date: April 3, 2019) SUMMARY

[0008] Problems to be Solved

[0009] An object of embodiments of the present application is to provide a die pick-up module capable of preventing a die from being contaminated during a die pick-up process and a die bonding apparatus including the same.

[0010] Solution to the problem

[0011] To achieve the above object, a die pick-up module according to an aspect of the present application includes: a wafer stage for supporting a wafer including dies attached to a dicing tape; a die separator disposed below the dicing tape and separating a die to be picked up from the dicing tape; a non-contact pick-up for picking up the die in a non-contact manner such that a front surface of the die is not contacted; a vertical driving unit moving the non-contact pick-up in a vertical direction to pick up the die; and a flip driving unit for flipping the non-contact pick-up to flip the die picked up by the non-contact pick-up.

[0012] According to some embodiments of the present application, the non-contact pick-up can include an ultrasonic vibration unit that holds the die in a non-contact state using ultrasonic vibration.

[0013] According to some embodiments of the present application, the non-contact pick-up can include: an ultrasonic vibration unit that provides a repulsive force for pushing the die using ultrasonic vibration; and a vacuum chuck that provides a suction force to the die using vacuum pressure to hold the die in a non-contact state.

[0014] According to some embodiments of the present application, the non-contact pick-up can include: an ultrasonic vibration unit that provides a repulsive force for pushing the die using ultrasonic vibration; and a Bernoulli chuck that forms an air flow on the die and provides a suction force to the die using negative pressure generated by the air flow to hold the die in a non-contact state.

[0015] According to some embodiments of the present application, the ultrasonic vibration unit can include: an ultrasonic vibrator for generating ultrasonic vibration; a horn for transmitting the ultrasonic vibration; and a vibration plate connected to the horn and vibrated by the ultrasonic vibration.

[0016] According to some embodiments of the present application, the vacuum chuck can be combined to an end portion of the ultrasonic vibration unit and have a vacuum hole for forming the suction force, and the vacuum hole can be connected to a vacuum pump through a vacuum line passing through the ultrasonic vibration unit.

[0017] According to some embodiments of the present application, the Bernoulli chuck can be combined to an end portion of the ultrasonic vibration unit and have an air nozzle for forming the air flow and a vacuum hole for sucking air jetted from the air nozzle, and the air nozzle can be connected to an air supply unit for providing air through an air line passing through the ultrasonic vibration unit.

[0018] According to some embodiments of the present application, the die separator can include a plurality of separator members arranged in a telescope form, and a separator driving unit to simultaneously raise the plurality of separator members and sequentially lower the plurality of separator members one by one from the outside to the inside.

[0019] According to some embodiments of the present application, the separator driving unit can include a plurality of disc-shaped flanges respectively formed at lower ends of the plurality of separator members in a horizontal direction, arranged in a vertical direction, and having diameters gradually increasing upward, a driving head arranged below the flanges and having a plurality of upper surfaces in a circular ring shape respectively opposite lower surfaces of the plurality of flanges, a head driving unit to rotationally drive the driving head, and a cam follower installed below the flanges and seated on the upper surfaces of the driving head, wherein the upper surfaces of the driving head include first inclined surfaces for simultaneously raising the plurality of separator members and second inclined surfaces for sequentially lowering the plurality of separator members.

[0020] According to some embodiments of the present application, the driving head can include a permanent magnet to provide a magnetic force such that the cam follower is in close contact with the upper surfaces of the driving head.

[0021] According to some embodiments of the present application, the die separator can further include a stopper member to maintain a gap between the separator members.

[0022] According to some embodiments of the present application, the die separator can further include a cover having an opening into which the separator members are inserted and a vacuum hole for vacuum-adsorbing a dicing tape, and a separator body combined to the cover and in a cylindrical shape with a lower portion closed.

[0023] A die bonding apparatus according to another aspect of the present application to achieve the above object can include a die pick-up module to pick up a die to be picked up from a wafer including the die attached to a dicing tape and to flip the picked-up die, and a die bonding module to bond the die flipped by the die pick-up module to a substrate, wherein the die pick-up module includes a wafer stage to support the wafer, a die separator arranged below the dicing tape and to separate the die from the dicing tape, a non-contact pick-up to pick up the die in a non-contact manner not to contact a front surface of the die, a vertical driving unit to move the non-contact pick-up in a vertical direction to pick up the die, and a flipping driving unit to flip the non-contact pick-up to flip the die such that a rear surface of the die picked up by the non-contact pick-up faces upward.

[0024] Advantageous Effects

[0025] According to the embodiment of the present application as above, the non-contact pickup can pick up the die in a non-contact manner using the repulsive force provided by the ultrasonic vibration unit and the attractive force provided by the vacuum chuck or Bernoulli chuck, and then the flip drive unit can flip the picked-up die. The bonding head can pick up the die by vacuum-sucking the back surface of the flipped die, and perform a bonding operation to attach the front surface of the die to the substrate. As above, by picking up the die in a non-contact manner, it is possible to prevent the front surface of the die from being contaminated, thereby sufficiently preventing a bonding failure due to contamination of the front surface of the die or an electrical defect between electrode pads due to contamination. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 is a schematic view for explaining a die pickup module and a die bonding apparatus including the same according to one embodiment of the present application.

[0027] Figure 2 is a schematic view for explaining Figure 1 the die pickup module shown in FIG. 1.

[0028] Figure 3 is a schematic view for explaining Figure 2 one example of the non-contact pickup shown in FIG. 2.

[0029] Figure 4 is a schematic view for explaining Figure 2 another example of the non-contact pickup shown in FIG. 3.

[0030] Figure 5 is a schematic view for explaining Figure 2 still another example of the non-contact pickup shown in FIG. 4.

[0031] Figure 6 is a schematic view for explaining Figure 2 still another example of the non-contact pickup shown in FIG. 5.

[0032] Figure 7 is a schematic view for explaining Figure 2 the die separator shown in FIG. 6.

[0033] Figure 8 is a schematic view for explaining Figure 7 the separator member and the flange shown in FIG. 7.

[0034] Figure 9 is a schematic view for explaining Figure 7 the drive head shown in FIG. 8.

[0035] Figure 10 to Figure 14 is a schematic view for explaining the use of Figure 2A schematic view of a method of picking a die using the illustrated non-contact pickers and die separator. DETAILED DESCRIPTION

[0036] Hereinafter, embodiments of the present application will be described in detail with reference to the accompanying drawings. However, the present application is not necessarily limited to the embodiments described below, but can be implemented in various other forms. The following embodiments are provided to fully convey the scope of the present application to those skilled in the art, and are not intended to limit the present application only to the embodiments.

[0037] In the embodiments of the present application, when a certain element is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or intervening elements can also be present. In contrast, when a certain element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. Terms such as first, second, third, etc. can be used to describe various items, such as various elements, structures, regions, layers, and / or portions, etc., but the items are not limited by the terms.

[0038] The specific terms used in the embodiments of the present application are used only to describe particular embodiments, and are not intended to limit the present application. In addition, unless there is a different definition, all terms including technical terms and scientific terms used herein have the same meanings as those that can be commonly understood by those skilled in the art to which the present application pertains. The above terms are interpreted to have meanings consistent with those in the context of related technology and the specification of the present application, and should not be interpreted in an idealized or overly formal sense unless explicitly defined otherwise.

[0039] Embodiments of the present application will be described with reference to schematic drawings of ideal embodiments of the present application. Therefore, variations in the shapes of the elements in the drawings (e.g., variations in the manufacturing method and / or tolerance) can be well anticipated. Thus, embodiments of the present application should not be construed as being limited to the specific shapes of the regions shown in the drawings, but should be construed to include deviations in the shapes, and the elements described in the drawings are purely schematic, and their shapes are not intended to illustrate the exact shapes of the elements, nor to limit the scope of the present application.

[0040] Figure 1 is a schematic view for explaining a die pick-up module according to an embodiment of the present application and a die bonding apparatus including the same, and Figure 2 is a schematic view for explaining Figure 1 is a schematic view of the die pick-up module illustrated.

[0041] Referring to Figure 1 and Figure 2According to an embodiment of the present invention, a die pick-up module 100 and a die bonding apparatus 10 including the same can be used to pick up dies 22 individualized by a dicing process in a manufacturing process of semiconductor devices to bond the dies 22 to a substrate 30 such as a lead frame, a printed circuit board (PCB), and a semiconductor wafer.

[0042] The die bonding apparatus 10 can include a die pick-up module 100 to pick up a die 22 to be picked up from a wafer 20 including the die 22 and to flip the picked-up die 22, and a die bonding module 500 to bond the die 22 flipped by the die pick-up module 100 to the substrate 30.

[0043] The wafer 20 can include dies 22 individualized by a dicing process, and the dies 22 can be provided in a state of being attached to a dicing tape 24. In particular, rear surfaces of the dies 22 can be attached to the dicing tape 24 such that front surfaces of the dies 22 face upward, and the dicing tape 24 can be mounted on a mounting frame 26 in a substantially circular ring shape.

[0044] The die pick-up module 100 can include a wafer stage 110 to support the wafer 20, a die separator 200 disposed below the dicing tape 24 and to separate the dies 22 from the dicing tape 24, a non-contact pick-up 300 to pick up the dies 22 in a non-contact manner such that the front surfaces of the dies 22 are not contacted to prevent the front surfaces of the dies 22 from being contaminated, a vertical driving unit 400 to vertically move the non-contact pick-up 300 to pick up the dies 22, and a flipping driving unit 410 to flip the non-contact pick-up 300 to flip the dies 22 such that the rear surfaces of the dies 22 face upward.

[0045] The die bonding module 500 can include a substrate stage 510 to support the substrate 30, a bonding head 520 to pick up the flipped dies 22 from the non-contact pick-up 300 and to bond the same to the substrate 30, a head driving unit (not shown) to pick up the dies 22 and to move the bonding head 520 in a vertical direction and a horizontal direction to bond the dies 22 to the substrate 30. For example, the die pick-up module 100 can further include a horizontal driving unit 420 to move the dies 22 to a position adjacent to the die bonding module 500, and the head driving unit can include a second vertical driving unit to move the bonding head 520 in the vertical direction and a second horizontal driving unit to move the bonding head 520 in the horizontal direction.

[0046] In addition, the rear surface of the die 22 flipped by the flipping driving unit 410 faces upward, and the front surface of the die 22 faces downward, and the non-contact pickup 300 can support the flipped die 22 in a non-contact state such that the non-contact pickup 300 does not contact the front surface of the die 22. Although not shown in detail, the bonding head 520 can include a bonding tool (not shown) for vacuum-sucking the rear surface of the flipped die 22, and the bonding tool can include a vacuum hole for vacuum-sucking the rear surface of the flipped die 22. As described above, since the die 22 can be picked up and flipped in a state of not contacting the front surface of the die 22, it is possible to sufficiently prevent the front surface of the die 22 bonded to the substrate 30 from being contaminated.

[0047] Referring to Figure 2 , a support ring 112 for supporting the dicing tape 24 can be disposed on the wafer stage 110. For example, the support ring 112 can support the dicing tape 24 between the die 22 and the mounting frame 26. In addition, a clamp 114 for clamping the mounting frame 26 can be provided on the wafer stage 110. The clamp 114 can be moved downward by a clamp driving unit (not shown), and thus the dicing tape 24 can be sufficiently expanded to easily pick up the die 22.

[0048] A die separator 200 for separating the die 22 from the dicing tape 24 can be disposed below the dicing tape 24 supported by the wafer stage 110. For example, the die separator 200 can partially separate the die 22 to be picked up from the dicing tape 24 by lifting the die 22 using a separator member 210 (see Figure 7 ), and after the die 22 is lifted, the non-contact pickup 300 can be lowered to support the die 22 in a non-contact manner. After the die 22 is supported by the non-contact pickup 300, the separator member 210 can be lowered so that the die 22 can be completely separated from the dicing tape 24.

[0049] Figure 3 is a schematic cross-sectional view for explaining Figure 2 one example of the non-contact pickup shown in FIG. 8.

[0050] Referring to Figure 3The non-contact pickup 300 can include an ultrasonic vibration unit 310 and a vacuum chuck 320 that maintain the die 22 to be picked up in a non-contact state by using ultrasonic vibration. The vacuum chuck 320 can be installed at one end of the ultrasonic vibration unit 310, and can provide a suction force to the die 22 with a vacuum pressure. The ultrasonic vibration unit 310 can provide a repulsive force that pushes the die 22 away from a die support surface 322 (as shown, a lower surface of the vacuum chuck 320) of the vacuum chuck 320 by using a periodic air compression effect of ultrasonic vibration. For example, the vacuum chuck 320 can be ultrasonically vibrated by the ultrasonic vibration unit 310, and the die 22 can be supported by the vacuum chuck 320 in a non-contact state (i.e., in a state spaced apart from the die support surface 322 by a predetermined distance) by the repulsive force generated by the ultrasonic vibration and the suction force generated by the vacuum pressure.

[0051] For example, although not shown in detail, the ultrasonic vibration unit 310 can include a pair of piezoelectric elements, and the piezoelectric elements can be applied with an alternating voltage to generate ultrasonic vibration. The ultrasonic vibration generated by the ultrasonic vibration unit 310 can be transmitted to the vacuum chuck 320, in which case the vacuum chuck 320 can function as a vibration plate. The vacuum chuck 320 can include a plurality of vacuum holes 324 for generating a suction force, and the magnitude and frequency of the alternating voltage and the vacuum pressure applied to the vacuum holes 324 can be appropriately adjusted according to the weight of the die 22 to maintain the die 22 in a non-contact state.

[0052] According to one embodiment of the present application, the ultrasonic vibration unit 310 can be installed at a central portion of the vacuum chuck 320, and as shown, the vacuum holes 324 can be connected to a vacuum pump (not shown) through a vacuum line 326 that penetrates the ultrasonic vibration unit 310.

[0053] Figure 4 is a schematic cross-sectional view illustrating Figure 2 another example of a non-contact pickup.

[0054] Referring to Figure 4 , the non-contact pickup 300 can include an ultrasonic vibration unit 312 and a Bernoulli chuck 330 that maintain the die 22 to be picked up in a non-contact state by using ultrasonic vibration. The Bernoulli chuck 330 can be installed at one end of the ultrasonic vibration unit 312, and can form an air flow on the die 22, and provide a suction force to the die 22 with a negative pressure generated by the air flow.

[0055] The Bernoulli chuck 330 can have an air nozzle 332 for forming an air flow and a plurality of vacuum holes 334 for sucking air jetted from the air nozzle 332. For example, the ultrasonic vibration unit 312 can be mounted at a central portion of the Bernoulli chuck 330, and as shown, the air nozzle 332 can be connected to an air supply unit (not shown) that provides the above-mentioned air through an air pipe 336 that penetrates the ultrasonic vibration unit 312.

[0056] In particular, the Bernoulli chuck 330 can have a die support surface 338 facing the die 22, and the air nozzle 332 can be provided at a central portion of the die support surface 338. As shown, the air nozzle 332 can jet air toward an edge portion of the die support surface 338, whereby a radial air flow can occur between the die support surface 338 and the die 22. In this case, the vacuum holes 334 can be arranged at the edge portion of the die support surface 338.

[0057] Figure 5 is a schematic cross-sectional view illustrating Figure 2 another example of a non-contact pickup shown in FIG. 1.

[0058] Referring to Figure 5 , the non-contact pickup 300 can include an ultrasonic vibration unit 340 and a vacuum chuck 350. The ultrasonic vibration unit 340 can include an ultrasonic vibrator 342 for generating ultrasonic vibrations, a horn 344 for amplifying and transferring the ultrasonic vibrations, and a vibration plate 346 connected to the horn 344 and vibrating by the ultrasonic vibrations. To amplify the ultrasonic vibrations, the horn 344 can be generally conical, and the vibration plate 346 can be mounted at an end portion of the horn 344.

[0059] The vacuum chuck 350 can be combined with the ultrasonic vibration unit 340 and can be configured to surround the vibration plate 346. The vacuum chuck 350 can have a plurality of vacuum holes 352 to provide suction force, and the vacuum holes 352 can be arranged around the vibration plate 346. In this case, a die support surface can be constituted by a lower surface of the vibration plate 346 opposite the die 22 before pickup and a lower surface of the vacuum chuck 350.

[0060] Figure 6 is a schematic cross-sectional view illustrating Figure 2 yet another example of a non-contact pickup shown in FIG. 1.

[0061] Referring to Figure 6The non-contact pickup 300 can include an ultrasonic vibration unit 360 and a Bernoulli chuck 370. The ultrasonic vibration unit 360 can include an ultrasonic vibrator 362 for generating ultrasonic vibrations, a horn 364 for amplifying and transferring the ultrasonic vibrations, and a vibration plate 366 connected to the horn 364 and vibrating by the ultrasonic vibrations.

[0062] The Bernoulli chuck 370 can be combined with the ultrasonic vibration unit 360 and configured to surround the vibration plate 366. For example, the Bernoulli chuck 370 can include an air nozzle 372 for spraying air, and the air nozzle 372 can be provided at a lower central portion of the vibration plate 366. Also, the Bernoulli chuck 370 can have a vacuum hole 374 for sucking air sprayed from the air nozzle 372, and the vacuum hole 374 can be arranged around the vibration plate 366. In this case, the die support surface can be constituted by a lower surface of the vibration plate 366 opposite the die 22 before pickup and a lower surface of the Bernoulli chuck 370.

[0063] Also, in the case where the die 22 is supported in a non-contact manner using the ultrasonic vibration units 310, 312, 340, and 360, the vacuum chucks 320 and 350, or the Bernoulli chucks 330 and 370, a support force can also be generated in a direction parallel to the die support surface due to a periodic air compression effect generated by the ultrasonic vibration units 310, 312, 340, and 360, whereby the die 22 can be prevented from falling during flipping of the non-contact pickup 300. Also, in the case where the die support surface is positioned in a horizontal direction, i.e., before and after the die is flipped, the horizontal position of the die 22 can always be kept constant on the die support surface, and thus the bond head 520 for picking up the flipped die 22 can be more easily aligned. Also, the die 22 can be picked up only by ultrasonic vibrations provided by the ultrasonic vibration units 310, 312, 340, and 360. The air compression effect generated by ultrasonic vibrations can not only generate a repulsive force but also a suction force, and thus non-contact pickup of the die 22 can also be achieved using only the ultrasonic vibration units 310, 312, 340, and 360 by changing the structural design of the die support surface of the non-contact pickup 300.

[0064] Figure 7 is a schematic cross-sectional view of a die separator, Figure 2 is a schematic plan view of the separator member and flange shown in Figure 8 is a schematic plan view of the drive head shown in Figure 7 is a schematic plan view of the separator member and flange shown in Figure 9 is a schematic plan view of the drive head shown in Figure 7 is a schematic plan view of the drive head shown in

[0065] Reference is made to Figure 7 to Figure 9The die separator 200 can be in close contact with the lower surface of the dicing tape 24, and can include a plurality of separator members 210 (210a, 210b, and 210c) arranged in a telescope form, and a separator driving unit 220 that simultaneously raises the plurality of separator members 210 and sequentially lowers the plurality of separator members 210 one by one from the outside to the inside. For example, the separator driving unit 220 can include a plurality of flanges 222 respectively formed at lower end portions of the separator members 210 in a horizontal direction, arranged in a vertical direction, and having a circular disc shape with a diameter that gradually increases upward, a driving head 224 arranged at a lower portion of the flanges 222 and having a plurality of upper surfaces of a circular ring shape respectively facing lower surfaces of the flanges 222, a head driving unit 226 for rotating the driving head 224, and a plurality of cam followers 234 installed at the lower portion of the flanges 222 and placed on the upper surfaces of the driving head 224. In detail, the upper surfaces of the driving head 224 can include a first inclined surface 224b for simultaneously raising the plurality of separator members 210 and a second inclined surface 224d for sequentially lowering the plurality of separator members 210.

[0066] In addition, the die separator 200 can include a cover 240 having an opening 244 for inserting the separator members 210 and a vacuum hole 246 for vacuum-adsorbing the dicing tape 24, and a separator body 250 combined to a lower portion of the cover 240 and having a lower-enclosed cylinder shape. The cover 240 can include an upper disc 242 having the opening 244 and the vacuum hole 246 formed thereon, and a cover body 248 of a circular tube shape combined to the upper disc 242. Although not shown, a vacuum pump (not shown) can be connected to the separator body 250, and thus a vacuum pressure can be provided inside the separator body 250 and the cover 240 to vacuum-adsorb the dicing tape 24. The opening 244 can have a rectangular shape, and the vacuum hole 246 can be formed through a circumference of the opening 244 to vacuum-adsorb the dicing tape 24.

[0067] The flanges 222 can be arranged inside the cover 240, and the separator members 210 can extend upward from the flanges 222 through the opening 244. The separator members 210 can have a rectangular tube shape, and can be arranged in a telescope form. In particular, the plurality of separator members 210 can be spaced apart from each other by a predetermined distance in order to provide a vacuum pressure to an inside of the innermost separator member 210c and between the separator members 210, so that the die 22 is partially separated from the dicing tape 24 by the vacuum pressure when the separator members 210 are raised.

[0068] According to an embodiment of the present application, the die separator 200 can include stopper members 212 disposed between the separator members 210 to maintain a gap between the respective separator members 210 and prevent the separator members 210 from rotating. Meanwhile, the size of the outermost separator member 210a can be smaller than the size of the die 22, whereby the edge portion of the die 22 can be separated from the dicing tape 24 when the separator members 210 are raised. As shown, although three separator members 210a, 210b, and 210c are used, the number of the separator members 210 can vary.

[0069] Flanges 222 can be formed at the lower portions of the respective separator members 210, respectively, and can have a disc shape. For example, as shown, the flanges 222 can have diameters that gradually increase from the lowermost flange 222c formed at the lower portion of the innermost separator member 210c toward the uppermost flange 222a formed at the lower portion of the outermost separator member 210a, and can be stacked in the vertical direction. The driving head 224 can have stepped recesses corresponding to the respective flanges 222, and the respective upper surfaces of the driving head 224 can each have a circular ring shape.

[0070] According to an embodiment of the present application, cam followers 234 in the shape of rollers can be installed at the lower portions of the flanges 222, and the cam followers 234 can be placed on the upper surfaces of the driving head 224. For example, as shown, two cam followers 234 can be installed on each of the flanges 222.

[0071] The respective upper surfaces of the driving head 224 can each include a first inclined surface 224b for raising the separator members 210 and a second inclined surface 224d for lowering the separator members 210. In addition, the upper surfaces of the driving head 224 can include a first horizontal surface 224a disposed between the lower end portions of the first and second inclined surfaces 224b and 224d, and a second horizontal surface 224c disposed between the upper end portions of the first and second inclined surfaces 224b and 224d.

[0072] The separator driving unit 220 can include a head driving unit 226 for rotating the driving head 224, and the separator members 210 can be raised and lowered by the rotation of the driving head 224. The head driving unit 226 can include a driving shaft 228 that penetrates the lower portion of the separator body 250 and is connected to the driving head 224. In addition, the head driving unit 226 can include a motor 230 for rotating the driving shaft 228 and a power transmission mechanism 232 for transmitting the rotational force of the motor 230 to the driving shaft 228.

[0073] The first inclined surface 224b and the second inclined surface 224d of the driving head 224 can be configured so that all the separator members 210 are simultaneously raised and sequentially lowered one by one from the outermost separator member 210a inward. For example, as illustrated, the first inclined surfaces 224b can be arranged at the same angle, and the first inclined surfaces 224b can raise the plurality of separator members 210 simultaneously when the driving head 224 rotates in the clockwise direction. The second inclined surfaces 224d can be arranged to be spaced apart from the first inclined surfaces 224b by a predetermined angle in the clockwise direction, and thus, the separator members 210 can sequentially lower one by one from the outermost separator member 210a inward when the driving head 224 rotates in the clockwise direction.

[0074] In addition, the driving head 224 can include a permanent magnet 236 that provides a magnetic force to allow the cam follower 234 to be in close contact with the upper surface of the driving head 224. Thus, the separator members 210 can be raised and lowered along the first inclined surfaces 224b and the second inclined surfaces 224d by rotation of the driving head 224. For example, a circular ring-shaped permanent magnet 236 can be built in the driving head 224.

[0075] Although not illustrated, unlike the above-described configuration, according to another embodiment of the present application, the separator members 210 can be raised and lowered by separate separator driving units (not shown), respectively. For example, the separator driving units can be configured by a linear driving unit including a motor and a linear motion guide, etc., or can be configured by a pneumatic cylinder, etc., differently therefrom.

[0076] Figure 10 to Figure 14 is a schematic view for explaining a method of picking up a die using the non-contact pickup and the die separator shown in Figure 2 is a schematic view for explaining a method of picking up a die using the non-contact pickup and the die separator shown in

[0077] Referring to Figure 10 , the die separator 200 can be positioned below the die 22 to be picked up. At this time, the cam follower 234 can be positioned on the first horizontal surface 224a of the driving head 224, and thus, the separator members 210 can be in a fully lowered state. Inside the cover 240, a vacuum can be provided to vacuum-adsorb the dicing tape 24 onto the cover 240 and the separator members 210, and the vacuum can be delivered not only into the vacuum holes 246 but also between the plurality of separator members 210 and inside the innermost separator member 210c.

[0078] Referring to Figure 11, the driving head 224 can be rotated in a clockwise direction by a predetermined angle, and thus the cam followers 234 can pass through the first inclined surfaces 224b of the driving head 224 and move onto the second horizontal surfaces 224c. As a result, all of the separator members 210 can be simultaneously raised to protrude from the cover 240, thereby raising the dies 22. In this case, the remaining portions of the dies 22 except for the portions supported by the separator members 210 can be separated from the dicing tape 24.

[0079] Subsequently, the non-contact pickup 300 can be lowered to a position at a predetermined distance from the front surface of the die 22 by the vertical driving unit 400, and the non-contact pickup 300 can support the die 22 in a non-contact state by repulsive force generated by the ultrasonic vibration units 310, 312, 340, 360 and attractive force generated by the vacuum chuck 320, 350 or the Bernoulli chuck 330, 370.

[0080] Referring to Figure 12 to Figure 14 , by rotation of the driving head 224, the plurality of separator members 210 can be sequentially lowered one by one from the outermost separator member 210a inward, and thus the die 22 can be completely separated from the dicing tape 24. Specifically, the cam followers 234 can pass through the second inclined surfaces 224d of the driving head 224 by rotation of the driving head 224 and move onto the first horizontal surfaces 224a, and thus the plurality of separator members 210 can be sequentially lowered one by one from the outer side to the inner side.

[0081] In addition, although not shown, a plurality of separator pins (not shown) can also be provided on the upper surface of the separator member 210 to reduce the adhesion area between the die 22 and the dicing tape 24 in the state in which the die 22 is raised. At this time, since the adhesion force between the die 22 and the dicing tape 24 can be sufficiently reduced by the separator pins in the state in which the separator member 210 is raised, the die 22 can be more easily separated from the dicing tape 24 when the separator member 210 is lowered.

[0082] As described above, after the die 22 is completely separated from the dicing tape 24, the non-contact pickup 300 can be lifted by the vertical driving unit 400, and the non-contact pickup 300 can be flipped by the flipping driving unit 410. Then, the non-contact pickup 300 can be moved to a position adjacent to the die bonding module 500 by the horizontal driving unit 420, and the bonding head 520 can pick up the flipped die 22 to bond it to the substrate 30.

[0083] According to the embodiment of the present application as described above, the non-contact picker 300 can pick up the die 22 in a non-contact manner using the repulsive force provided by the ultrasonic vibration units 310, 312, 322, 340, 360 and the suction force provided by the vacuum chuck 320, 350 or the Bernoulli chuck 330, 370, and then the flip drive unit 410 can flip the picked-up die 22. The bonding head 520 can vacuum-adsorb the back surface of the flipped die 22 to pick up the die 22, and can perform a bonding operation so that the front surface of the die 22 is attached to the substrate 30. As described above, by picking up the die 22 in a non-contact manner, it is possible to prevent the front surface of the die 22 from being contaminated, thereby being able to sufficiently prevent a bonding failure or an electrical defect between electrode pads due to contamination of the front surface of the die 22.

[0084] The above has been described with reference to preferred embodiments of the present application, but those skilled in the art will understand that various modifications and changes can be made to the present application without departing from the scope and spirit of the present application as recited in the claims.

[0085] Explanation of Reference Numerals

[0086] 10: die bonding apparatus 20: wafer

[0087] 22: die 24: dicing tape

[0088] 100: die pick-up module 110: wafer stage

[0089] 200: die separator 210: separator member

[0090] 220: separator drive unit 222: flange

[0091] 224: drive head 226: head drive unit

[0092] 234: cam follower 236: permanent magnet

[0093] 240: cover 244: opening

[0094] 246: vacuum hole 250: separator body

[0095] 300: non-contact picker 310: ultrasonic vibration unit

[0096] 320: vacuum chuck 330: Bernoulli chuck

[0097] 400: vertical drive unit 410: flip drive unit

[0098] 500: die bonding module 510: substrate stage

[0099] 520: engagement head

Claims

1. A bare die pickup module, comprising: a wafer table for supporting a wafer comprising a die attached to a dicing tape; a die separator arranged below the dicing tape and separating the die to be picked up from the dicing tape; a non-contact picker for picking up the die in a non-contact manner so as not to make contact with the front surface of the die; a vertical driving unit, moving the non-contact picker in a vertical direction to pick up the die; and a flip driving unit, configured to flip the non-contact picker to flip the die picked up by the non-contact picker; The non-contact pickup device keeps picking up the die in a non-contact manner when being flipped by the flip driving unit, thereby not contacting the front surface of the die.

2. The die pickup module according to claim 1, wherein: The non-contact pickup comprises: The ultrasonic vibration unit maintains the die in a non-contact state using ultrasonic vibration.

3. The die pickup module according to claim 1, wherein: The non-contact pickup comprises: an ultrasonic vibration unit that provides a repulsive force for pushing the die using ultrasonic vibration; and A vacuum chuck provides suction to the die using vacuum pressure to hold the die in a non-contact state.

4. The die pickup module according to claim 1, wherein: The non-contact pickup comprises: an ultrasonic vibration unit that provides a repulsive force for pushing the die using ultrasonic vibration; and A Bernoulli chuck forms an air flow on the die and provides suction to the die using negative pressure generated by the air flow, so as to hold the die in a non-contact state.

5. The die pickup module according to any one of claims 2 to 4, wherein: The ultrasonic vibration unit includes: an ultrasonic vibrator for generating the ultrasonic vibration; a speaker for transmitting the ultrasonic vibration; and A vibration plate is connected to the speaker and vibrates by the ultrasonic vibration.

6. The die pickup module according to claim 3, wherein: The vacuum chuck is coupled to an end portion of the ultrasonic vibration unit and has a vacuum hole for forming the suction force, and The vacuum hole is connected to a vacuum pump through a vacuum pipeline passing through the ultrasonic vibration unit.

7. The die pickup module according to claim 4, wherein: The Bernoulli chuck is coupled to an end portion of the ultrasonic vibration unit and has an air nozzle for forming the air flow and a vacuum hole for sucking the air ejected from the air nozzle, and The air nozzle is connected to an air supply unit for supplying the air through an air pipe penetrating the ultrasonic vibration unit.

8. The die pickup module according to claim 1, wherein: The die separator comprises: a plurality of separator members arranged in a telescopic formation; and The separator driving unit raises the plurality of separator members simultaneously and lowers the plurality of separator members one by one from the outside to the inside.

9. The die pickup module according to claim 8, wherein: The separator drive unit comprises: a plurality of disc-shaped flanges, respectively formed at lower ends of the plurality of separator members in a horizontal direction, arranged in a vertical direction, and having diameters gradually increasing upward; a drive head disposed below the flanges and having a plurality of upper surfaces in an annular shape respectively opposite to the lower surfaces of the plurality of flanges; a head drive unit for rotating the drive head; and A cam follower is mounted below the flange and is placed on the upper surface of the drive head.

10. The die pickup module according to claim 9, wherein: The upper surface of the drive head has a first inclined surface for simultaneously raising the plurality of separator members and a second inclined surface for sequentially lowering the plurality of separator members.

11. The die pickup module according to claim 10, wherein: The driving head includes a permanent magnet that provides a magnetic force so that the cam follower is in close contact with an upper surface of the driving head.

12. The die pickup module according to claim 8, wherein: The die separator further comprises: A stop member is used to maintain the spacing between the separator members.

13. The die pickup module according to claim 8, wherein: The die separator further comprises: a cover having an opening for inserting the separator member and a vacuum hole for vacuum-adsorbing the cutting tape, and The separator body is coupled to the cover and has a cylindrical shape with a closed lower portion.

14. A die bonding apparatus comprising: a die picking module for picking up a die to be picked up from a wafer including the die attached to the dicing tape and flipping the picked up die; as well as The die bonding module is used to bond the die flipped by the die pickup module to the substrate. Wherein, the bare die picking module includes: a wafer stage supporting the wafer; a die separator disposed under the dicing tape and separating the die from the dicing tape; a non-contact picker that picks up the die in a non-contact manner so as not to come into contact with the front surface of the die; a vertical driving unit, moving the non-contact picker in a vertical direction to pick up the die; and a flipping driving unit that flips the non-contact pickup to flip the die so that the rear surface of the die picked up by the non-contact pickup faces upward, The non-contact pickup device keeps picking up the die in a non-contact manner when being flipped by the flip driving unit, thereby not contacting the front surface of the die.

15. A bare die pickup module, comprising: a wafer table for supporting a wafer comprising a die attached to a dicing tape; a die separator arranged below the dicing tape and separating the die to be picked up from the dicing tape; a non-contact picker for picking up the die in a non-contact manner so as not to make contact with the front surface of the die; a vertical driving unit, moving the non-contact picker in a vertical direction to pick up the die; and a flip driving unit, configured to flip the non-contact picker to flip the die picked up by the non-contact picker; wherein the non-contact pickup keeps picking up the die in a non-contact manner when flipped by the flip driving unit so as not to contact the front surface of the die, Wherein, the non-contact pickup: An ultrasonic vibration unit is included to maintain the die in a non-contact state by utilizing ultrasonic vibration, Alternatively, the method comprises: an ultrasonic vibration unit for providing a repulsive force for pushing the die using ultrasonic vibration; and a vacuum chuck for providing a suction force to the die using vacuum pressure to keep the die in a non-contact state. Alternatively, the method includes: an ultrasonic vibration unit for providing a repulsive force for pushing the die using ultrasonic vibration; and a Bernoulli chuck for forming an air flow on the die and providing a suction force to the die using a negative pressure generated by the air flow, so as to keep the die in a non-contact state. Wherein, the ultrasonic vibration unit includes: an ultrasonic vibrator for generating the ultrasonic vibration; a speaker for transmitting the ultrasonic vibration; and a vibration plate connected to the horn and vibrating by the ultrasonic vibration, Wherein, when the non-contact pickup includes the vacuum chuck, the vacuum chuck is coupled to the end of the ultrasonic vibration unit and has a vacuum hole for forming the suction force, and the vacuum hole is connected to a vacuum pump through a vacuum pipe running through the ultrasonic vibration unit, and Wherein, when the non-contact pickup includes the Bernoulli chuck, the Bernoulli chuck is coupled to the end of the ultrasonic vibration unit and has an air nozzle for forming the air flow and a vacuum hole for sucking the air ejected from the air nozzle, and the air nozzle is connected to an air supply unit for providing the air through an air pipeline running through the ultrasonic vibration unit. Wherein, the die separator comprises: a plurality of separator members arranged in a telescopic formation; and The separator driving unit raises the plurality of separator members simultaneously and lowers the plurality of separator members one by one from the outside to the inside.

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