Display device

Abstract

The display device includes an array substrate and a conductive connection pad. The array substrate includes a pixel array configured on a base substrate, side terminals configured on the base substrate, and transfer wiring electrically connected to the side terminals and the pixel array, and has an inclined side surface. The conductive connection pad is configured on a side surface of the array substrate so as to contact the side terminals and extend along the inclined side surface of the array substrate toward the lower surface of the array substrate.

Description

Technical Field

[0001] The present invention relates to a display device, and more particularly to a display device and a method for manufacturing the display device. Background Art

[0002] Typically, a display device includes a display panel and a driver that provides a driving signal to the display panel. The driver may be a driver chip that is directly bonded to a substrate of the display panel or connected to a pad portion of the display panel via a flexible circuit film or the like.

[0003] According to the conventional method, the driver chip or the flexible circuit film with the driver chip mounted thereon is bonded to the upper surface of the substrate of the display panel. Therefore, the area used to bond the driver chip to the display panel increases the frame.

[0004] To reduce the bezel, technology is being developed that bonds a flexible circuit film to the side of a display panel. One end of the flexible circuit film is bonded to the side of the display panel and extends downward. This structure creates a curved area within the flexible circuit film, potentially increasing the overall thickness of the display device. Summary of the Invention

[0005] An object of the present invention is to provide a display device with reduced frame and thickness.

[0006] Another object of the present invention is to provide a method for manufacturing the display device.

[0007] However, the present invention is not limited to the above-mentioned objects, and various extensions can be made without departing from the spirit and scope of the present invention.

[0008] To achieve the aforementioned objectives of the present invention, exemplary embodiments of the present invention relate to a display device comprising an array substrate and conductive connection pads. The array substrate comprises a pixel array disposed on a base substrate, side terminals disposed on the base substrate, and transfer wiring electrically connected to the side terminals and the pixel array, wherein the array substrate has an inclined side surface. The conductive connection pads are disposed on the side surface of the array substrate so as to contact the side terminals and extend along the inclined side surface of the array substrate toward the lower surface of the array substrate.

[0009] According to one embodiment, the display device further includes a cover substrate combined with the array substrate.

[0010] According to one embodiment, the display device further includes: a filling component, disposed between the array substrate and the cover substrate, and covering the side terminals.

[0011] According to an embodiment, the conductive connection pad is in contact with a side surface of the filling member.

[0012] According to one embodiment, the filling member has a shape protruding from the side terminal in a horizontal direction, and the conductive connection pad is in contact with a lower surface of the filling member.

[0013] According to one embodiment, the cover substrate has an inclined side surface.

[0014] According to one embodiment, the cover substrate has vertical side surfaces.

[0015] According to an embodiment, the inclined side surface of the array substrate has a circular shape.

[0016] According to one embodiment, the side terminal includes a plurality of conductive layers.

[0017] According to one embodiment, an end portion of the transfer wiring is away from the conductive connection pad.

[0018] According to one embodiment, the display device further includes an external driving device bonded to the conductive connection pad on the lower surface of the array substrate and providing a driving signal or power to the transfer wiring through the conductive connection pad and the side terminal.

[0019] According to various exemplary embodiments of the present invention, a method for manufacturing a display device includes preparing an array substrate comprising a pixel array disposed on a base substrate, a transfer wiring electrically connected to the pixel array, and a conductive pattern electrically connected to the transfer wiring. A portion of the array substrate is removed to form an inclined side surface, and side terminals are formed that are exposed from the conductive pattern through the inclined side surface. Furthermore, conductive connection pads are formed that contact the side terminals and extend along the inclined side surface of the array substrate toward the lower surface of the array substrate.

[0020] (Effects of the Invention)

[0021] According to exemplary embodiments of the present invention, the size of the peripheral area of the display panel can be reduced by bonding the lower surface of the display panel to the external driving device.

[0022] Furthermore, since the external driver device does not need to be bent to connect it to the display panel, the space required to secure the bending area can be eliminated. This can further reduce the thickness of the display device. Furthermore, since the external driver device does not need to be bent, a rigid substrate can be used instead of the flexible circuit film, thus preventing damage caused by bending.

[0023] In addition, the display panel has inclined side surfaces, so that conductive connection pads extending continuously on the lower surface and side surfaces of the display panel can be formed through the same deposition process. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a plan view showing a display panel according to an embodiment of the present invention.

[0025] Figure 2 1 is a cross-sectional view showing a bonding region of a display device according to an embodiment of the present invention.

[0026] Figure 3 This is a side view showing a bonding region of a display device according to an embodiment of the present invention.

[0027] Figure 4 is a cross-sectional view showing a display area of a display device according to an embodiment of the present invention.

[0028] Figures 5 to 15 sectional views illustrating a method for manufacturing a display device according to each embodiment of the present invention.

[0029] Figure 16 and Figure 17 4 is a cross-sectional view showing a bonding region of a display device according to each embodiment of the present invention. DETAILED DESCRIPTION

[0030] Hereinafter, a display device and a manufacturing method thereof according to each exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the accompanying drawings, the same or similar components are given the same or similar reference numerals.

[0031] Figure 1 It is a plan view showing a display panel according to an embodiment of the present invention.

[0032] Reference Figure 1 A display panel 10 according to an embodiment of the present invention includes a display area DA and a peripheral area surrounding the display area DA. The display area DA can generate light or adjust the transmittance of light provided by an external light source to display an image. The peripheral area can be defined as an area where no image is displayed.

[0033] According to one embodiment, the display panel 10 may be an organic light-emitting display panel. For example, an array of pixels PX including light-emitting elements is arranged in the display area DA, thereby generating light in response to a drive signal. Signal wiring and power wiring that provide drive signals and power to the pixels PX may be arranged in the display area DA. For example, gate lines GL extending in a first direction D1 and providing gate signals to the pixels PX, data lines DL extending in a second direction D2 intersecting the first direction D1 and providing data signals to the pixels PX, and power lines PL extending in the second direction D2 and providing power to the pixels PX may be arranged in the display area DA.

[0034] The peripheral region may include transmission wiring for transmitting drive signals or power to the display area DA, a circuit portion for generating drive signals, and the like. For example, the peripheral region may include a driver unit DR for generating gate signals, control signal wiring DSL for transmitting control signals to the driver unit DR, fan-out wiring FL for transmitting data signals to the data lines DL, and power transmission wiring PBL for transmitting power to the power lines PL.

[0035] According to an embodiment, the peripheral area includes a sealing area SA where a sealing member is disposed. The sealing area SA may have a shape surrounding the display area DA.

[0036] The transmission wiring extends toward one side of the peripheral area. The transmission wiring is electrically connected to a side terminal. The side terminal is electrically connected to an external driving device. Thus, the transmission wiring can be electrically connected to the external driving device to receive transmission of drive signals, control signals, power, and the like.

[0037] The area where the side terminals are arranged can be defined as a bonding area BA. For example, in the bonding area BA, the side terminals can be arranged along the first direction D1. In the bonding area BA, a filling member FM covering the side terminals can be configured (refer to Figure 2 ).

[0038] Figure 2 1 is a cross-sectional view showing a bonding region of a display device according to an embodiment of the present invention. Figure 3 1 is a side view showing a bonding area of a display device according to an embodiment of the present invention. Figure 2 It can be along Figure 1 Cross-sectional view along line II'.

[0039] Reference Figure 2 and Figure 3The display panel may include an array substrate 100, a cover substrate 220 combined with the array substrate 100, a sealing member SM disposed between the array substrate 100 and the cover substrate 220, and a filling member FM disposed between the array substrate 100 and the cover substrate 220. The filling member FM may extend along the first direction D1.

[0040] The display panel may have an inclined side surface in the bonding area BA. For example, at least one of the array substrate 100 and the cover substrate 220 may have an inclined side surface in the bonding area BA.

[0041] On one side of the display panel, the side surface of the side terminal SC contacts the conductive connection pad CP. The conductive connection pad CP extends along the side surface of the display panel toward the lower surface of the array substrate 100. An external driving device is engaged at the portion of the conductive connection pad CP disposed on the lower surface of the array substrate 100. In this way, the external driving device and the transfer wiring can be electrically connected. The side terminal SC can be covered by a filling member FM. The contact surface between the side terminal SC and the conductive connection pad CP can be essentially defined by the exposed side surface of the side terminal.

[0042] For example, the external driving device may include a circuit substrate 300 on which a driving chip is mounted. The driving chip may provide a data signal to the transmission wiring through the circuit substrate 300. The circuit substrate 300 may include a flexible circuit film or a rigid circuit substrate.

[0043] The circuit substrate 300 may be electrically connected to a printed circuit substrate on which a control unit is mounted. The printed circuit substrate on which the control unit is mounted may provide control signals, power, etc. to the transmission wiring through the circuit substrate 300 .

[0044] Figure 4 is a cross-sectional view showing a display area of a display device according to an embodiment of the present invention.

[0045] Reference Figure 4 The pixel unit configured in the display area DA may include a transistor configured on the base substrate 110 and a light emitting element electrically connected to the transistor. According to one embodiment, the light emitting element may be an organic light emitting diode.

[0046] A buffer layer 120 may be disposed on the base substrate 110 . An active pattern AP may be disposed on the buffer layer 120 .

[0047] For example, the base substrate 110 may include glass, quartz, sapphire, a polymer substance, etc. According to one embodiment, the base substrate 110 may include a transparent rigid substance such as glass.

[0048] The buffer layer 120 can reduce or block foreign matter, moisture, or external air from penetrating from the bottom of the base substrate 110 and can planarize the upper surface of the base substrate 110. For example, the buffer layer 120 can include an inorganic material such as oxide or nitride.

[0049] A first gate metal pattern including a gate electrode GE may be disposed on the active pattern AP, and a first insulating layer 130 may be disposed between the active pattern AP and the gate electrode GE.

[0050] A second gate metal pattern including a gate wiring pattern GP may be disposed on the gate electrode GE. The gate wiring pattern GP may include a capacitor electrode for forming a capacitor, wiring for transmitting various signals, and the like.

[0051] A second insulating layer 140 may be disposed between the gate electrode GE and the gate wiring pattern GP. A third insulating layer 150 may be disposed on the gate wiring pattern GP.

[0052] For example, the active pattern AP may include silicon or a metal oxide semiconductor. According to one embodiment, the active pattern AP may include polysilicon, which may be doped with N-type impurities or P-type impurities.

[0053] In other embodiments, or in other transistors not shown, the active pattern AP may include a metal oxide semiconductor. For example, the active pattern AP may include a two-component compound (AB) containing indium (In), zinc (Zn), gallium (Ga), tin (Sn), titanium (Ti), aluminum (Al), hafnium (Hf), zirconium (Zr), magnesium (Mg), etc. x ), three-component compound (AB x C y ), four-component compound (AB x C y D z ) etc. For example, the active pattern AP may include zinc oxide (ZnO x ), gallium oxide (GaO x ), titanium oxide (TiO x ), tin oxide (SnO x ), indium oxide (InO x), indium-gallium oxide (IGO), indium-zinc oxide (IZO), indium-tin oxide (ITO), gallium-zinc oxide (GZO), zinc-magnesium oxide (ZMO), zinc-tin oxide (ZTO), zinc-zirconium oxide (ZnZr x O y ), indium-gallium-zinc oxide (IGZO), indium-zinc-tin oxide (IZTO), indium-gallium-hafnium oxide (IGHO), tin-aluminum-zinc oxide (TAZO) and indium-gallium-tin oxide (IGTO), etc.

[0054] The first insulating layer 130, the second insulating layer 140 and the third insulating layer 150 may include silicon oxide (SiO x ), silicon nitride (SiN x ), silicon carbide, or a combination thereof, and may also include insulating metal oxides such as aluminum oxide, tantalum oxide, hafnium oxide, zirconium oxide, titanium oxide, etc. For example, the first insulating layer 130, the second insulating layer 140, and the third insulating layer 150 may each have a single layer or multilayer structure of silicon nitride or silicon oxide, and may have different structures from each other.

[0055] The gate electrode GE and the gate wiring pattern GP may include a metal, a metal alloy, a metal nitride, a conductive metal oxide, etc. For example, the gate electrode GE may include gold (Au), silver (Ag), aluminum (Al), copper (Cu), nickel (Ni), platinum (Pt), magnesium (Mg), chromium (Cr), tungsten (W), molybdenum (Mo), titanium (Ti), tantalum (Ta), or an alloy thereof, and may have a single-layer structure or a multi-layer structure including different metal layers.

[0056] A first source metal pattern may be disposed on the third insulating layer 150. The first source metal pattern may include a source electrode SE and a drain electrode DE electrically contacting the active pattern AP. The source electrode SE and the drain electrode DE may each pass through the lower insulating layer and contact the active pattern AP.

[0057] A fourth insulating layer 160 may be disposed on the first source metal pattern. A second source metal pattern may be disposed on the fourth insulating layer 160. The second source metal pattern may include a connection electrode CE for electrically connecting the drain electrode DE to the organic light-emitting diode 210. According to one embodiment, the second source metal pattern may further include a mesh power wiring for preventing a voltage drop in the power supplied to the organic light-emitting diode 210. A fifth insulating layer 170 may be disposed on the second source metal pattern.

[0058] The first source metal pattern and the second source metal pattern may include a metal, a metal alloy, a metal nitride, a conductive metal oxide, or the like. For example, the first source metal pattern and the second source metal pattern may include gold (Au), silver (Ag), aluminum (Al), copper (Cu), nickel (Ni), platinum (Pt), magnesium (Mg), chromium (Cr), tungsten (W), molybdenum (Mo), titanium (Ti), tantalum (Ta), or alloys thereof, and may have a single-layer structure or a multi-layer structure including different metal layers. According to one embodiment, the first source metal pattern and the second source metal pattern may have a multi-layer structure including aluminum.

[0059] The fourth insulating layer 160 and the fifth insulating layer 170 may include an organic substance, such as phenolic resin, acrylic resin, polyimide resin, polyamide resin, siloxane resin, epoxy resin, etc.

[0060] An organic light-emitting diode 210 may be disposed on the fifth insulating layer 170. The organic light-emitting diode 210 may include a first electrode 212 in contact with the connecting electrode CE, a light-emitting layer 214 disposed on the first electrode 212, and a second electrode 216 disposed on the light-emitting layer 214. The light-emitting layer 214 of the organic light-emitting diode 210 may be disposed within an opening of a pixel definition layer 180 disposed on the fifth insulating layer 170. The first electrode 212 may be a lower electrode of the organic light-emitting diode 210, and the second electrode 216 may be an upper electrode of the organic light-emitting diode 210.

[0061] The first electrode 212 can function as an anode. For example, the first electrode 212 can be formed as a transmissive electrode or a reflective electrode depending on the type of light emission. When the first electrode 212 is formed as a transmissive electrode, the first electrode 212 may include indium-tin oxide, indium-zinc oxide, zinc-tin oxide, indium oxide, zinc oxide, tin oxide, etc. When the first electrode 212 is formed as a reflective electrode, it may include gold (Au), silver (Ag), aluminum (Al), copper (Cu), nickel (Ni), platinum (Pt), magnesium (Mg), chromium (Cr), tungsten (W), molybdenum (Mo), titanium (Ti), etc., and may also have a stacked structure with the material used in the transmissive electrode.

[0062] The pixel definition layer 180 has an opening that exposes at least a portion of the first electrode 212. For example, the pixel definition layer 180 may include an organic insulating material.

[0063] The light emitting layer 214 may be a single layer or a multilayer structure including at least one of a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, an electron injection layer, etc. The light emitting layer 214 may include a low molecular weight organic compound or a high molecular weight organic compound.

[0064] In one embodiment, the light-emitting layer 214 can emit red, green, or blue light. In other embodiments, when the light-emitting layer 214 emits white light, the light-emitting layer 214 can include a multilayer structure including a red light-emitting layer, a green light-emitting layer, and a blue light-emitting layer, or can include a single layer structure including red, green, and blue light-emitting substances.

[0065] The second electrode 216 may be formed as a transmissive electrode or a reflective electrode according to the light emitting type of the display device including the transistor. For example, the second electrode 216 may include metal, alloy, metal nitride, metal fluoride, conductive metal oxide, or a combination thereof.

[0066] For example, the second electrode 216 may extend continuously across a plurality of pixels on the display area.

[0067] A cover substrate 220 is disposed on the organic light emitting diode 210. For example, the cover substrate 220 may include glass, quartz, sapphire, a polymer material, etc. According to one embodiment, the cover substrate 220 may include a transparent rigid material such as glass.

[0068] For example, a spacer for supporting the cover substrate 220 may be disposed under the cover substrate 220. The spacer may be disposed between the cover substrate 220 and the organic light emitting diode 210, or between the second electrode 216 of the organic light emitting diode 210 and the pixel definition layer 180.

[0069] The space between the cover substrate 220 and the organic light emitting diode 210 may be maintained in a vacuum state or filled with a gas or a sealing member. For example, the sealing member may include an organic layer, an inorganic layer, or a combination thereof.

[0070] Reference Figure 2 and Figure 3 In the bonding area BA, the transfer wiring TL may extend toward the side of the display panel. According to one embodiment, the transfer wiring TL may be a fan-out wiring FL. However, the embodiments of the present invention are not limited thereto, and the transfer wiring TL may be a power transfer wiring PBL, a control signal wiring DSL, or a bridge wiring connected thereto.

[0071] In the bonding area BA, a buffer layer 122 and a first insulating layer 132 may be disposed between the transfer wiring TL and the base substrate 110. The buffer layer 122 and the first insulating layer 132 may be disposed between the buffer layer 120 (see FIG. 1 ) in the display area DA. Figure 4 ) and the first insulating layer 130 (refer to Figure 4 ) extends, or may be formed of the same layer as the buffer layer 120 and the first insulating layer 130 of the display area DA.

[0072] According to an embodiment, the transfer wiring TL may be connected to the gate electrode GE (refer to Figure 4 ) are formed on the same layer and are arranged on the same layer.

[0073] The side terminals SC may be electrically connected to the transfer lines TL and may extend toward the side of the display panel to be exposed to the outside. According to one embodiment, the side terminals SC may have a multi-layer structure.

[0074] For example, the side terminal SC may include a first conductive layer SC1 extending from the transfer line TL, a second conductive layer SC2 disposed on the first conductive layer SC1, a third conductive layer SC3 disposed on the second conductive layer SC2, and a fourth conductive layer SC4 disposed on the third conductive layer SC3. However, the embodiments of the present invention are not limited thereto and may have different configurations as needed or according to the configuration of the display area. For example, the side terminal SC may include more than one conductive layer. Preferably, the side terminal SC may include two or more conductive layers to increase the contact area.

[0075] According to an embodiment, the transfer wiring TL and the first conductive layer SC1 extending therefrom may be formed of the same layer as the gate electrode GE and disposed on the same layer. The second conductive layer SC2 may be formed of the gate wiring pattern GP (see FIG. 1 ) of the display area DA. Figure 4 ) and are disposed on the same layer. The third conductive layer SC3 may be formed from the same layer as the first source metal pattern of the display area DA and are disposed on the same layer. The fourth conductive layer SC4 may be formed from the same layer as the second source metal pattern of the display area DA and are disposed on the same layer.

[0076] For example, a second insulating layer 142 may be disposed between the first conductive layer SC1 and the second conductive layer SC2, a third insulating layer 152 may be disposed between the second conductive layer SC2 and the third conductive layer SC3, and a fourth insulating layer 162 may be disposed between the third conductive layer SC3 and the fourth conductive layer SC4. A fifth insulating layer 172 may be disposed on the fourth conductive layer SC4.

[0077] For example, the second conductive layer SC2 may pass through the second insulating layer 142 and contact the first conductive layer SC1, the third conductive layer SC3 may pass through the third insulating layer 152 and contact the second conductive layer SC2, and the fourth conductive layer SC4 may pass through the fourth insulating layer 162 and contact the third conductive layer SC3.

[0078] The second insulating layer 142, the third insulating layer 152, the fourth insulating layer 162 and the fifth insulating layer 170 can be formed from the second insulating layer 140, the third insulating layer 152, the fourth insulating layer 162 and the fifth insulating layer 170 of the display area DA (refer to FIG. Figure 4 ) extends from or is formed by the same layer as these layers.

[0079] In the region overlapping with the sealing member SM or in the bonding area BA, at least one of the buffer layer 122, the first insulating layer 132, the second insulating layer 142, the third insulating layer 152, the fourth insulating layer 162, and the fifth insulating layer 172 may be partially removed or omitted as needed. For example, the insulating layer including an organic substance may be removed from the lower portion of the sealing member SM.

[0080] According to one embodiment, a filling member FM is disposed between the array substrate 100 and the cover substrate 220 in the bonding area BA. The filling member FM fills the space between the side terminals SC and the cover substrate 220 in the bonding area BA. This prevents the sealing member SM from being damaged or foreign matter from entering the panel during the process of forming the conductive connection pads CP or the grinding process.

[0081] For example, the filling member FM may include a curing resin such as polyurethane resin, silicone resin, acrylic resin, epoxy resin, phenolic resin, or the like.

[0082] exist Figure 2 2 shows a case where the filling member FM is away from the sealing member SM, but the embodiments of the present invention are not limited thereto, and the filling member FM and the sealing member SM may be in contact with each other.

[0083] A conductive connection pad CP is disposed on a side surface of the display panel and contacts the side terminals SC. The conductive connection pad CP may extend in an oblique direction along the side surface of the display panel. The conductive connection pad CP may extend downward along the side surface of the display panel, such that a portion of the conductive connection pad CP is disposed on the lower surface of the display panel.

[0084] The conductive connection pads CP may include metal. For example, a metal such as gold (Au), silver (Ag), aluminum (Al), copper (Cu), nickel (Ni), platinum (Pt), magnesium (Mg), chromium (Cr), tungsten (W), molybdenum (Mo), titanium (Ti), or tantalum (Ta) may be deposited to form a metal layer, and the metal layer may be patterned using a laser or the like to form the conductive connection pads CP.

[0085] The conductive connection pads CP may be coupled to the circuit substrate 300 via a conductive connection member CM.

[0086] The conductive connecting member CM can be formed using various methods. For example, the conductive connecting member CM may be an anisotropic conductive film (ACF) dispersed with conductive particles. In other embodiments, the conductive connecting member CM may be a conductive bump that is bonded to the circuit substrate 300 and to the conductive connecting pad CP by ultrasonic welding or the like. However, the embodiments of the present invention are not limited thereto, and various known bonding methods may be used.

[0087] Although not shown, in order to protect the exposed portion of the conductive connection pad CP, a coating layer made of a curable resin or the like may be formed on the side surface of the display panel.

[0088] According to various embodiments of the present invention, the size of the peripheral area of the display panel can be reduced by bonding the lower surface of the display panel to the external driving device.

[0089] Furthermore, since the external driver device does not need to be bent to connect it to the display panel, the space required to secure the bending area can be eliminated. Consequently, the thickness of the display device can be reduced. Furthermore, since the external driver device does not need to be bent, a rigid substrate or the like can be used instead of a flexible circuit film, thus preventing damage caused by bending.

[0090] In addition, the display panel has inclined side surfaces, so that conductive connection pads extending continuously on the lower surface and side surfaces of the display panel can be formed through the same deposition process.

[0091] Figures 5 to 8 It is a cross-sectional view showing a method for manufacturing a display device according to an embodiment of the present invention. Figures 5 to 8 The bonding area of the display device is shown.

[0092] Reference Figure 5A buffer layer 122 is formed on a base substrate 110. A first insulating layer 132 is formed on the buffer layer 122. A transfer wiring TL is formed on the first insulating layer 132. A second insulating layer 142 is formed on the transfer wiring TL. An end portion of the transfer wiring TL may define a first conductive pattern CL1. A second conductive pattern CL2 is formed on the second insulating layer 142, contacting the first conductive pattern CL1. A third insulating layer 152 is formed on the second conductive pattern CL2. A third conductive pattern CL3 is formed on the third insulating layer 152, contacting the second conductive pattern CL2. A fourth insulating layer 162 is formed on the third conductive pattern CL3. A fourth conductive pattern CL4 is formed on the fourth insulating layer 162, contacting the third conductive pattern CL3. A fifth insulating layer 172 is formed on the fourth conductive pattern CL4.

[0093] The insulating layer and the conductive pattern can be formed during the process of forming transistors or organic light emitting diodes in the display area.

[0094] The base substrate 110 , the pixel array formed on the base substrate 110 , and the structure of the bonding area BA may be referred to as an array substrate 100 .

[0095] Reference Figure 6 A cover substrate 220 is disposed on the array substrate 100. In order to combine the cover substrate 220 and the array substrate 100 and encapsulate the light emitting elements of the display area, a sealing member SM may be formed between the cover substrate 220 and the array substrate 100.

[0096] For example, the sealing member SM may be formed of a polymer curable resin or glass frit. According to one embodiment, after applying glass frit to the sealing region and placing the cover substrate 220 on the glass frit, the sealing member SM may be formed by sintering the glass frit using heat, ultraviolet rays, laser, or the like.

[0097] In addition, a filling member FM may be provided between the side terminals SC and the cover substrate 220 .

[0098] According to one embodiment, the filler member FM may be formed by applying a curable resin to the bonding area before bonding the cover substrate 220 and the array substrate 100. The curing of the curable resin may be performed before or after bonding the cover substrate 220. For example, the curable resin may be formed from a photocurable composition. The photocurable composition may include an epoxy resin, a polyurethane resin, a silicone resin, an acrylic resin, a phenolic resin, or the like as an adhesive component.

[0099] According to other embodiments, the filler member FM may be formed of glass frit. Therefore, the filler member FM may be made of the same material as the sealing member SM. When the filler member FM is formed of glass frit, the organic insulating layer may be preferably removed from the bonding area BA where the filler member FM is disposed.

[0100] According to other embodiments, the filling member FM may be formed by side-injecting a curing resin after combining the array substrate 100 and the cover substrate 220 .

[0101] According to another embodiment, the filling member FM may be formed after cutting the display panel. In this case, a grinding process or a polishing process may be performed to expose the side terminals and flatten the side surface of the display panel.

[0102] Reference Figure 7 , cutting (scribing) a portion of the display panel to form an inclined side surface.

[0103] The display panel may be cut using a cutting member 410 such as a cutting wheel. According to one embodiment, to form an inclined side surface of the display panel, the cutting member 410 may cut the display panel in a direction inclined to the upper or lower surface of the display panel.

[0104] Reference Figure 8 After removing a portion of the first conductive pattern CL1, the second conductive pattern CL2, the third conductive pattern CL3, and the fourth conductive pattern CL4, the remaining conductive layers (SC1, SC2, SC3, SC4) form side terminals SC. Side surfaces of the side terminals SC are exposed through the side surfaces of the display panel.

[0105] As the display panel is cut in an oblique direction, the cover substrate 220 and the array substrate 100 may have inclined side surfaces. For example, the length of the upper surface of the cover substrate 220 may be greater than the length of the lower surface of the cover substrate 220, and the length of the upper surface of the array substrate 100 may be greater than the length of the lower surface of the array substrate 100. Furthermore, the length of the lower surface of the cover substrate 220 may be greater than the length of the upper surface of the array substrate 100. As a result, the lower surface and side surfaces of the array substrate 100 may form an obtuse angle, while the upper surface and side surfaces of the cover substrate 220 may form an acute angle.

[0106] In addition, the side terminals SC and the filling member FM may also have inclined side surfaces. However, the embodiments of the present invention are not limited thereto, and at least one of the side terminals SC and the filling member FM may substantially have a vertical side surface.

[0107] Then, conductive connection pads CP are formed to contact the side terminals SC and extend along the side surfaces and the bottom surface of the display panel.

[0108] For example, a mask MK having an opening is disposed below the display panel. The mask MK may have an opening that exposes the lower surface and inclined side surfaces of the display panel. A metal layer is formed in the areas exposed by the openings by deposition such as sputtering. This allows the formation of a metal layer that contacts the side terminals SC and extends along the side and lower surfaces of the display panel.

[0109] Then, the metal layer is patterned using a laser or the like to form an array of a plurality of conductive connection pads CP that are spaced apart from each other so as to contact corresponding side terminals.

[0110] For example, a portion of the conductive connection pad CP may be in contact with a side surface of the filling member FM. In addition, the conductive connection pad CP may extend to be in contact with a side surface of the cover substrate 220 .

[0111] Then, an external driving device including a driving portion is connected to the conductive connection pad CP disposed on the lower surface of the display panel, thereby forming a Figure 2 The display device shown.

[0112] According to the conventional side bonding method, the external driving device is bonded to the side of the display panel. The side of the display panel may not be smooth after the cutting process. Therefore, in order to reduce the roughness of the bonding surface, the side of the display panel needs to be ground or polished.

[0113] According to an embodiment of the present invention, the external driving device is not bonded to the side surface of the display panel but is bonded to the lower surface of the display panel, thereby omitting a grinding process or a polishing process for reducing the roughness of the bonding surface.

[0114] Furthermore, by forming the inclined side surfaces of the display panel, a continuous metal layer can be formed on the side surfaces and the bottom surface of the display panel through a single deposition process in the process of forming the conductive connection pads.

[0115] The embodiments of the present invention may have various configurations. Hereinafter, other embodiments of the present invention will be described.

[0116] Figures 9 to 11 A cross-sectional view illustrating a method for manufacturing a display device according to an embodiment of the present invention.

[0117] Reference Figure 9, the array substrate 100 and the cover substrate 220 can be cut in different directions. According to one embodiment, the array substrate 100 can be cut in a direction inclined with respect to the lower surface of the array substrate 100 , and the cover substrate 220 can be cut in a direction perpendicular to the upper surface of the cover substrate 220 .

[0118] Reference Figure 10 The cut cover substrate 220 has vertical side surfaces. Thus, the bezel of the display device can be reduced by reducing the size of the bonding area BA. The filler member FM disposed between the cover substrate 220 and the array substrate 100 can have side surfaces that are connected to the side surfaces of the cover substrate 220 and extend in a vertical direction.

[0119] Then, a conductive connection pad CP is formed to contact the side terminals SC and extend along the side and lower surface of the display panel. According to one embodiment, the end of the conductive connection pad CP and the vertical side of the cover substrate 220 can be substantially located on the same vertical line. Therefore, the length of the upper surface and the lower surface of the cover substrate 220 can be the same, and the length of the upper surface of the array substrate 100 can be greater than the length of the lower surface of the array substrate 100. In addition, as Figure 11 As shown, in the display device according to one embodiment, the filling component may be omitted.

[0120] Figure 12 It is a cross-sectional view showing a method for manufacturing a display device according to an embodiment of the present invention.

[0121] Reference Figure 12 , the array substrate 100 may be cut in a direction inclined with respect to the lower surface of the array substrate 100 , and the cover substrate 220 may be cut in a direction perpendicular to the upper surface of the cover substrate 220 .

[0122] The cut cover substrate 220 may have a vertical side surface. The filling member FM disposed between the cover substrate 220 and the array substrate 100 may have a side surface connected to the side surface of the cover substrate 220 and extending in a vertical direction.

[0123] The cover substrate 220 or the filling member FM may protrude in a horizontal direction from a side end of the array substrate 100 .

[0124] The conductive connection pad CP contacts the side terminals SC and extends along the side and lower surface of the display panel. A portion of the conductive connection pad CP may extend horizontally along the lower surface of the filler member FM. This configuration can increase the contact area between the conductive connection pad CP and the side terminals SC, thereby improving connection reliability.

[0125] Figures 13 to 15 It is a cross-sectional view showing a method for manufacturing a display device according to an embodiment of the present invention.

[0126] Reference Figure 13 , the array substrate 100 is cut in a direction perpendicular to the lower surface of the array substrate 100 , and the cover substrate 220 may be cut in a direction perpendicular to the upper surface of the cover substrate 220 .

[0127] Therefore, the cut display panel has vertical side surfaces. In order to form inclined side surfaces on the display panel, a grinding process may be additionally performed.

[0128] Reference Figure 14 , using a grindstone 420, a ring-shaped inclined side surface is formed on the display panel.

[0129] Reference Figure 15 , forming a conductive connection pad CP that contacts the side terminal SC and extends along the side surface and lower surface of the display panel.

[0130] Figure 16 and Figure 17 is a cross-sectional view showing a display device according to an embodiment of the present invention.

[0131] Reference Figure 16 The transfer wiring TL does not extend to the side of the display panel. Therefore, the end of the transfer wiring TL is far away from the conductive connection pad CP. Therefore, the side terminal SC can be composed of the conductive layers arranged on the transfer wiring TL.

[0132] According to one embodiment, the transfer lines TL are not exposed from the side surface of the display panel, so that the transfer lines TL can be prevented from being damaged during the side surface processing step of the display panel.

[0133] Reference Figure 17 , the transfer wiring TL can be formed by connecting to the gate wiring pattern GP (refer to Figure 4 ) are formed on the same layer. The transfer wiring TL is electrically connected to the side terminal SC. The side terminal SC may include a second conductive layer SC2 extending from the transfer wiring TL, a first conductive layer SC1 disposed below the second conductive layer SC2, a third conductive layer SC3 disposed on the second conductive layer SC2, and a fourth conductive layer SC4 disposed on the third conductive layer SC3.

[0134] The embodiments of the present invention are not limited to the above-mentioned configuration, and the transfer wiring TL may also be formed of a metal layer used to form the source electrode SE or the connection electrode CE.

[0135] The above describes the structure of an organic light-emitting display device as an example, but the embodiments of the present invention are not limited thereto. For example, the embodiments of the present invention can be applied to the bonding structures of various display devices such as liquid crystal display devices, electroluminescent display devices, and micro-LED display devices.

[0136] As described above, the present invention has been described with reference to the exemplary embodiments. However, those skilled in the art will appreciate that various modifications and variations can be made to the present invention without departing from the spirit and scope of the invention as described in the claims.

[0137] (Industrial Applicability)

[0138] The present invention is applicable to various display devices. For example, the present invention is applicable to various display devices such as display devices for vehicles, ships, and aircraft, portable communication devices, display devices for presentations or information transmission, and medical display devices.

Claims

1. A display device comprising: An array substrate comprising a pixel array arranged on a base substrate, side terminals arranged on the base substrate, and transfer wiring electrically connected to the side terminals and the pixel array, and having an inclined side surface; a conductive connection pad, disposed on a side surface of the array substrate and in contact with the side terminal, extending along the inclined side surface of the array substrate toward the lower surface of the array substrate, and in contact with the inclined side surface of the array substrate and the lower surface of the array substrate; as well as An external driving device is bonded to the conductive connection pad on the lower surface of the array substrate, and provides a driving signal or power to the transfer wiring through the conductive connection pad and the side terminal.

2. The display device according to claim 1, wherein Also includes: A cover substrate is combined with the array substrate.

3. The display device according to claim 2, wherein: Also includes: The filling component is disposed between the array substrate and the cover substrate and covers the side terminals.

4. The display device according to claim 3, wherein: The conductive connection pad is in contact with a side surface of the filling member.

5. The display device according to claim 3, wherein The filling member has a shape that protrudes horizontally from the side terminal, and the conductive connection pad is in contact with a lower surface of the filling member.

6. The display device according to claim 2, wherein: The cover substrate has an inclined side surface.

7. The display device according to claim 2, wherein: The cover substrate has vertical side surfaces.

8. The display device according to claim 1, wherein The inclined side surface of the array substrate has a circular shape.

9. The display device according to claim 1, wherein The side terminal includes a plurality of conductive layers.

10. The display device according to claim 1, wherein An end portion of the transfer wiring is away from the conductive connection pad.

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