Stacking of Energy Storage Devices

Abstract

A method for determining one or more characteristics of a stack of energy storage devices, comprising obtaining a stack of energy storage devices, the stack comprising one or more layers; laser ablating the stack to form incisions through the one or more layers, thereby generating one or more laser ablation products; analyzing the laser ablation products using a mass spectrometry-based analytical technique to thereby determine one or more characteristics of the stack. Also disclosed is an apparatus for determining one or more characteristics of a stack of energy storage devices.

Description

Technical Field

[0001] The present invention relates to a stack for an energy storage device and, more particularly but not exclusively, to methods and apparatus for processing stacks for energy storage devices. Background Art

[0002] Known methods of producing energy storage devices such as solid-state thin-film batteries including electrode layers, electrolyte layers and current collector layers are to first form a stack comprising a first current collector layer, an electrode layer, an electrolyte layer, a second electrode layer and a second current collector layer formed on a substrate. The stack is then cut into individual parts to form individual cells. Then, for example, a protective layer can be coated on each cell to prevent passivation and possible short circuits of the layers.

[0003] To form an electrical connection to the cell, for example to electrically connect the current collectors of a plurality of cells stacked one on top of the other, part of the protective layer can be removed, for example by etching. Alternatively, a mask can be applied prior to the coating process to ensure that a portion of each current collector is exposed.

[0004] However, known formation and processing of stacks for energy storage devices such as solid-state thin-film batteries can be inefficient and / or of limited reliability, making effective commercialization difficult. Accordingly, there is a desire to provide effective and / or reliable methods for forming and processing stacks for energy storage devices. Summary of the Invention

[0005] According to a first aspect of the present invention, there is provided a method comprising: obtaining a stack for an energy storage device, the stack comprising one or more layers; laser ablating the stack to form a cut at least partially through the one or more layers, thereby producing one or more laser ablation products; and analyzing the laser ablation products using a mass spectrometry-based analytical technique to determine one or more characteristics of the stack. In an example, the stack is laser ablated to form a cut through (i.e., completely through) the one or more layers.

[0006] Analyzing the laser ablation products using a mass spectrometry-based technique can allow for the rapid and effective determination of one or more characteristics of the stack. These characteristics can be used, for example, to inform upstream production and / or downstream processing of the stack, which in turn can allow for the effective and / or reliable production of energy storage devices. The rapid (e.g., real-time or near real-time) determination of one or more characteristics of the stack can allow, for example, the production and / or processing of the stack to be carried out rapidly in a roll-to-roll type production process, which can be effective.

[0007] In an example, the method includes correlating the location of the laser ablation with one or more determined characteristics. This can allow for the determination of location-dependent characteristics of the stack. For example, the characteristics can include quality control information. Correlating the characteristic with the location of the laser ablation that produced the laser ablation product on which the characteristic is based can be used, for example, to determine specific regions of the stack that meet quality control criteria. This can provide improved granularity or specificity of the information used to inform upstream production and / or downstream processing of the stack, and can thus in turn allow for the efficient and / or reliable production of energy storage devices.

[0008] In an example, the location includes at least one location in the plane of the stack. The location including at least one location in the plane of the stack can, for example, allow the determined characteristics to be related to specific regions along the length or width of the stack. This can provide improved granularity or specificity of the information used to inform upstream production and / or downstream processing of the stack, and can thus in turn allow for the efficient and / or reliable production of energy storage devices.

[0009] In an example, the method includes moving the stack simultaneously or intermittently with the laser ablation in a first direction, and the location includes locations along an axis parallel to the first direction. This can, for example, allow the determined characteristics to be related to locations along the length of the stack, for example, in the case of moving or processing the stack in a roll-to-roll arrangement. This information can be used, for example, to inform upstream production and / or downstream processing of the stack, and can thus in turn allow for the efficient and / or reliable production of energy storage devices.

[0010] In an example, the method includes moving the stack simultaneously or intermittently with the laser ablation in a first direction, and the location includes locations along an axis perpendicular to the first direction. This can, for example, allow the determined characteristics to be related to locations across the width of the stack, for example, in the case of moving or processing the stack in a roll-to-roll arrangement. This information can be used, for example, to inform upstream production and / or downstream processing of the stack, and can thus in turn allow for the efficient and / or reliable production of energy storage devices.

[0011] In an example, the location includes the depth into the stack. In some examples, this can be used, for example, to determine whether each layer of the stack has the correct or desired thickness. This information can be used to adjust the stack production process accordingly, and can thus, for example, allow for improved stack production. In some examples, the depth of the laser ablation related to the determined characteristics of the stack can be used to determine the components in different layers of the stack. This can be used, for example, to inform upstream production and / or downstream processing of the stack, and can thus in turn allow for the efficient and / or reliable production of energy storage devices.

[0012] In an example, the method includes storing data representing a relevant location and data representing one or more determined characteristics in association with each other in a storage medium. For example, this can allow the data to be effectively used for further processing of the stack, such as folding the stack and / or dividing the stack into cells.

[0013] In an example, the method includes determining parameters for processing a stack for laser ablation based on the relevant location and one or more determined characteristics. This can allow further processing of the stack, such as folding or dividing the stack, to be performed based on simple parameters, which can reduce the data processing required at components arranged to perform further processing of the stack, which can provide more effective and / or reliable further processing of the stack.

[0014] In an example, the parameter includes the number of energy storage device cells to be included in a given energy storage device formed from the stack by laser ablation. For example, based on the relevant location and one or more determined characteristics, the number of defective cells that will be produced by a given portion of the stack can be determined, so that more cells will be included in the energy storage device including the given portion of the stack in order to compensate for the defective cells. This can allow further processing of the stack, such as folding the stack and / or dividing the stack into cells, to compensate for certain characteristics of the stack. This can allow reliable production of energy storage devices. This can also reduce or eliminate the need to perform quality control procedures on the energy storage devices produced from the stack, which can allow efficient production of energy storage devices.

[0015] In an example, the method includes processing the stack for laser ablation based on the relevant location and one or more determined characteristics and / or based on the determined parameters. As mentioned, this can allow effective and / or reliable processing of the stack and thus allow reliable and / or efficient production of energy storage devices.

[0016] In an example, the method includes: moving the stack relative to a laser beam for laser ablation; laser ablating the stack to form additional cuts through one or more layers, thereby producing one or more additional laser ablation products; analyzing the additional laser ablation products using a mass spectrometry-based analysis technique to determine one or more additional characteristics of the stack; and associating the location of the additional laser ablation with the one or more determined additional characteristics. This can allow, for example, repetition in a roll-to-roll type of processing of the stack, such as continuously or near continuously characterizing the stack. Moving the stack in a roll-to-roll type of processing, for example, can provide effective processing of the stack and thus efficient production of energy storage devices.

[0017] In an example, the method includes using the determined one or more characteristics, or the associated location and the determined one or more characteristics, to adjust the production of the obtained stack. This can allow for improved control of the production of the stack, which can provide reliable and / or efficient stack production and, in turn, reliable and / or efficient production of an energy storage device.

[0018] In an example, the determined one or more characteristics include one or more of the following: identification of one or more laser ablation products, identification of one or more components of one or more layers of the stack, and quality control parameters of the stack. For example, the identification of one or more components of one or more layers of the stack can be derived from the identification of one or more laser ablation products. Determining the identification of one or more laser ablation products or the components of the layers of the stack can allow, for example, for improved control of laser ablation. For example, if the identification of a laser ablation product or a component of the stack indicates that the laser ablation is directed at an undesired or unwanted layer of the stack, the laser ablation can be adjusted accordingly. Determining the identification of one or more laser ablation products or the components of the stack can allow, for example, for determining whether the components of the stack or the proportion of the components of the stack are as desired, and / or whether there are impurities in the stack, which can be used to inform and / or adjust the production of the stack. The quality control parameters can be, for example, parameters indicating whether the stack or a layer of the stack meets a quality control standard or the degree to which it meets, for example, related to the desired or expected thickness, components, proportion of components, and / or impurities of the stack or a layer of the stack.

[0019] In an example, mass spectrometry-based techniques include inductively coupled plasma mass spectrometry, ICP-MS. This can provide a particularly rapid analysis of the laser ablation products and, therefore, can allow for a more rapid determination of one or more characteristics, which can help improve the timeliness of providing information to upstream production and / or downstream processing of the stack. This can allow for faster production and / or processing of the stack, which can improve efficiency.

[0020] According to a second aspect of the present invention, there is provided an apparatus for determining one or more characteristics of a stack of an energy storage device, the stack comprising one or more layers, the apparatus comprising: a laser system arranged to laser ablate the stack in use to form a cut at least partially through one or more layers, thereby generating one or more laser ablation products in use; an analyzer arranged to analyze the laser ablation products generated in use, thereby determining one or more characteristics of the stack; and a correlator arranged to correlate the location of the laser ablation with the one or more characteristics determined; wherein the location includes at least one location in a plane of the stack ablated by the laser system in use. In an example, the location includes at least one location in a plane substantially perpendicular to an axis defined by a laser beam generated by the laser system, the laser beam ablating the stack in use. In an example, the laser system is arranged to laser ablate the stack in use so as to form a cut through (i.e., completely through) one or more layers.

[0021] Correlating the determined characteristics with the location of the laser ablation based on which the characteristics are determined can be used, for example, to determine specific regions of the stack that meet quality control criteria. This can provide improved granularity or specificity of information for informing upstream production and / or downstream processing of the stack, and can thus in turn allow for the effective and / or reliable production of energy storage devices. The location including at least one location in a plane of the stack can, for example, allow the determined characteristics to be related to specific regions along the length or width of the stack. This can provide improved granularity or specificity of information for informing upstream production and / or downstream processing of the stack, and can thus in turn allow for the effective and / or reliable production of energy storage devices.

[0022] In an example, the analyzer is arranged to analyze the laser products generated in use using a mass spectrometry-based technique, thereby determining one or one characteristic of the stack. Analyzing the laser ablation products using a mass spectrometry-based technique can allow for the rapid and effective determination of one or more characteristics of the stack. Rapid (e.g., real-time or near real-time) determination of one or more characteristics of the stack can allow, for example, for the rapid execution of production and / or processing of the stack in a roll-to-roll type of production process, which can be effective.

[0023] In an example, in use, simultaneously or intermittently with the laser ablation, the stack is moved in a travel direction, and the correlator is arranged to correlate the location of the laser ablation with the one or more characteristics determined based on the speed of movement of the stack. Determining the location based on the travel speed of the stack can provide a cost-effective and efficient correlation of the characteristics with the location in a direction parallel to the travel direction of the stack, for example, without the need for a device that directly measures the travel of the stack.

[0024] Other features and advantages of the present invention will become apparent from the following description of the preferred embodiments of the present invention given by way of example only, which description is made with reference to the accompanying drawings. Description of the Drawings

[0025] Figure 1 is a schematic diagram showing a stack for an energy storage device according to an example;

[0026] Figure 2 shows a way of processing Figure 1 the stack to manufacture an energy storage device according to an example;

[0027] Figure 3 is a flowchart showing a method of analyzing a stack according to an example;

[0028] Figure 4 is a schematic diagram showing a way of analyzing a stack according to a first example;

[0029] Figure 5 is a schematic diagram showing a way of analyzing a stack according to a second example;

[0030] Figure 6 is a schematic diagram showing a system including a device for analyzing a stack according to an example;

[0031] Figure 7 is a schematic diagram showing a stack and storage characteristics of the stack according to an example;

[0032] Figure 8 shows a schematic diagram of a stack according to an example; and

[0033] Figures 9 to 12 schematically shows Figure 8 an exemplary further processing of the stack of Detailed Description of the Invention

[0034] According to an example, with reference to the accompanying drawings, details of the method, structure, and device according to the example will become apparent. In this specification, for purposes of explanation, many specific details of certain examples are set forth. References in the specification to "an example" or similar language mean that a particular feature, structure, or characteristic described in connection with that example is included in at least one example, but not necessarily in other examples. It should also be noted that certain examples are described schematically, where some features are omitted and / or must be simplified for ease of explanation and understanding of the concepts underlying the examples.

[0035] Figure 1 shows a stack 100 of layers for an energy storage device. For example, Figure 1Stack 100 can be used as part of a thin-film energy storage device with a solid electrolyte. In these cases, stack 100 can be referred to as energy storage device stack 100.

[0036] Stack 100 includes a substrate 102, a cathode layer 104, an electrolyte layer 106, and an anode layer 108. In Figure 1 the example, anode layer 108 is farther from substrate 102 than cathode layer 104, and electrolyte layer 106 is located between cathode layer 104 and anode layer 108. Substrate 102 contacts cathode layer 104 and supports the stack. Although in this example, substrate 102 contacts cathode layer 104, in other examples, there may be other layers (not shown) between substrate 102 and cathode layer 104.

[0037] In some examples, substrate 102 can be a nickel foil or can include a nickel foil; however, it should be understood that any suitable metal can be used, such as aluminum, copper, or steel, or a metallized material including a metallized plastic, such as aluminum on polyethylene terephthalate (PET).

[0038] Cathode layer 104 can be used as a positive current collector layer. Cathode layer 104 can form a positive electrode layer (i.e., the cathode during discharge of the battery corresponding to the energy storage device including stack 100). Cathode layer 104 can include a material suitable for storing lithium ions through a stable chemical reaction, such as lithium cobalt oxide, lithium iron phosphate, or an alkali metal polysulfide salt.

[0039] Anode layer 108 can be used as a negative current collector layer. Anode layer 108 can form a negative electrode layer (i.e., the anode during discharge of the battery corresponding to the energy storage device including stack 100). Anode layer 108 can include lithium metal, graphite, silicon, or indium tin oxide.

[0040] In some examples, anode layer 108 can include a negative current collector and a separate negative electrode layer (not shown). In these examples, the negative electrode layer can include lithium metal, graphite, silicon, or indium tin oxide, and / or the negative current collector can include a nickel foil. However, it should be understood that any suitable metal can be used, such as aluminum, copper, or steel, or a metallized material including a metallized plastic, such as aluminum on polyethylene terephthalate (PET).

[0041] The electrolyte layer 106 can include any suitable material that is ion-conductive, but it is also an electrical insulator, such as lithium phosphorous oxynitride (LiPON). The electrolyte layer 106 can be a solid layer and can be referred to as a fast ion conductor. The solid electrolyte layer can have a structure intermediate between a liquid electrolyte and a crystalline solid. A liquid electrolyte, for example, lacks a regular structure and contains ions that can move freely. A crystalline material, for example, has a regular structure with an ordered arrangement of atoms that can be arranged as a two-dimensional or three-dimensional lattice. The ions in a crystalline material are typically immobile and thus may not be able to move freely throughout the material.

[0042] For example, the stack 100 can be fabricated by depositing the cathode layer 104 on the substrate 102. Subsequently, the electrolyte layer 106 is deposited on the cathode layer 104, and then the anode layer 108 is deposited on the electrolyte layer 106. Each layer of the stack 100 can be deposited by overflow deposition, which provides a simple and effective way to produce highly uniform layers, although other deposition methods are possible.

[0043] Figure 1 The stack 100 can be processed to fabricate an energy storage device.

[0044] In Figure 2 is schematically shown an overall overview of an example of processing that can be applied to Figure 1 the stack 100.

[0045] In Figure 2 this example, the stack 100 is processed to fabricate an energy storage device. In this example, the stack 100 is flexible, allowing it to be wound around a roller 112, for example, as part of a roll-to-roll manufacturing process (sometimes referred to as a shaft-to-shaft manufacturing process). The stack 100 can be gradually unwound from the roller 112 and processed.

[0046] In Figure 2 this example, a first laser 114 can be used to form a groove in the stack 100. The first laser 114 is arranged to apply a laser beam 116 to the stack 100 to remove portions of the stack 100 by laser ablation, thereby forming the groove.

[0047] After forming the grooves, an insulating material system 118 can be used to introduce an electrically insulating material into at least some of the grooves. The electrically insulating material can be considered non-conductive and thus can conduct a relatively small amount of current when subjected to an electric field. Generally, the current conducted by an electrically insulating material (sometimes called an insulator) is less than that of a semiconductor material or a conductive material. However, there is still a small amount of current flowing through the electrically insulating material under the influence of an electric field because even an insulator may include a small amount of charge carriers that carry current. In the examples herein, a material can be considered electrically insulating where the material is electrically insulating enough to perform the function of an insulator. For example, this function can be performed in cases where the material sufficiently insulates one element from another to prevent short circuits.

[0048] Referring Figure 2 , after introducing the electrically insulating material, the stack 110 is cut to form individual cells for the energy storage device. In some examples, hundreds or even possibly thousands of cells can be cut from a roll of the stack 100, thus allowing multiple cells to be manufactured in an efficient manner.

[0049] In Figure 2 , a cutting operation is performed using a second laser 122 that is arranged to apply a laser beam 124 to the stack 100. Each cut can, for example, pass through the center of an insulating plug such that the plug is divided into two parts, each part forming a protective covering on the exposed surface including the edge to which it is attached.

[0050] Although not shown in Figure 2 (for illustrative purposes only), it should be understood that after introducing the insulating material (or otherwise), the stack can be folded back on itself to form a z-fold structure that, for example, has dozens of layers, possibly hundreds of layers, or even possibly thousands of layers, where each insulating plug is aligned. Then, the laser cutting process performed by the second laser 122 can be used to cut the z-fold structure for each of the aligned groups of plugs in a single cutting operation.

[0051] After cutting the cells, electrical connectors can be provided along opposite sides of the cells such that a first electrical connector on one side of the cell contacts the (multiple) cathode layers 104, but contact with other layers is prevented by the electrically insulating material. Similarly, a second electrical connector on the opposite side of the cell can be arranged to contact the (multiple) anode layers 108, but contact with other layers is prevented by the insulating material. Thus, the insulating material can reduce the risk of short circuits occurring between the anode layer and the cathode layers 104, 108, and other layers in each cell. The first and second electrical connectors can, for example, include a metallic material applied by sputtering to the edges of the stack 110 (or to the edges of the intermediate structure 110). Thus, the cells can be effectively connected in parallel.

[0052] The foregoing description provides a general overview of an example of a stack 100 for an energy storage device, as well as examples of processes that can be applied to the stack 100 (e.g., for manufacturing an energy storage device). The following description provides exemplary methods and devices for analyzing and processing a stack 200 (which can be the same as or similar to the stack 100 described with reference to Figure 1 ), which can provide improvements in the efficiency and / or reliability of the processing of the stack 200, and thus, for effectively producing an energy storage device, such as a battery produced therefrom.

[0053] Reference Figure 3 , schematically illustrates a method of analyzing a stack 200 of an energy storage device according to an example.

[0054] Broadly speaking, the method includes obtaining, in step 201, a stack 200 for an energy storage device, the stack 200 including one or more layers. The method further includes, in step 203, laser ablating the stack 200 to form a cut that at least partially penetrates the one or more layers, thereby producing one or more laser ablation products. The method further includes, in step 205, using a mass spectrometry-based analytical technique to analyze the laser ablation products, thereby determining one or more characteristics of the stack 200.

[0055] As explained in more detail below, the method can allow for the rapid and effective determination of the characteristics of the stack. These characteristics can be used, for example, to inform the upstream production and / or downstream processing of the stack, which in turn can allow for the effective and / or reliable production of an energy storage device therefrom.

[0056] Now referring to Figure 4 , schematically illustrates a stack 200 of an energy storage device (i.e., which can be obtained according to an example of step 201 of the method described with reference to Figure 3 ). The stack 200 is shown being subjected to laser energy from a laser beam 216 to cause laser ablation, which in turn forms a cut 212 and produces laser ablation products 210 (according to an example of step 203 of the method described with reference to Figure 3 ). The laser ablation products 210 are analyzed (by a mass spectrometer 219) to determine one or more characteristics of the stack 200 (according to an example of step 205 of the method described with reference to Figure 3 ).

[0057] It should be noted that in some cases, the laser ablation product 210 can be considered a "by-product" because the stack 200 in which the cut 212 is formed can be the main or desired "product" of the laser ablation, while the removed or ejected laser ablation product 210 can be considered a secondary product or by-product. However, it should be understood that as used herein, the term "laser ablation product 210" refers to those laser ablation products ejected from or otherwise removed from the stack 200.

[0058] The stack 200 can be the same as or similar to the stack Figure 1 described. In Figure 4 the example shown, the energy storage device stack 200 includes a base layer 202, a cathode layer 204, an electrolyte layer 206, and an anode layer 208. These can be the same as or similar to the layers of the stack 100 Figure 1 described. For example, the cathode layer 204 can include a cathode electrode and a cathode current collector ( Figure 4 not shown in Figure 3 ), while the anode layer 208 can include an anode electrode and an anode current collector ( Figure 4 not shown in

[0059] As Figure 4 shown, the device 224 includes a laser system 218 and an analyzer 220. The laser beam 216 generated by the laser system 218 is directed to the stack 200 to apply laser ablation to the stack 200. As used herein, "laser ablation" can refer to using a laser-based process to remove material from the stack 200. This removal of material can include any one or more of a plurality of physical processes. For example, the removal of material can include (but is not limited to) melting, melt ejection, vaporization (or sublimation), photodecomposition (single photon), photodecomposition (multi-photon), mechanical shock, thermomechanical shock, other shock-based processes, surface plasmon processing, and removal by evaporation (ablation).

[0060] The laser ablation forms one or more cuts 212 through the layers of the stack 202 - 208. As Figure 4 shown in the example, the laser ablation forms cuts 212 through each of the anode layer 208, the electrolyte layer 206, and the cathode layer 204, but not through the base layer 202. In Figure 4In the example, the cut is in the form of a groove 212. As used herein, the term "groove" can refer to a channel, slot, or trench that can be continuous or discontinuous, and in some examples can be elongated and can extend only partially through the layers 202-208 of the stack 200. In some examples, the method can include laser ablation of the stack 200 to form a plurality of grooves 212( Figure 4 not shown in Figure 8 but see, for example, 9 ). A plurality of grooves 212 can be formed to partially divide the stack 200 into partial cells, but those individual cells are not (at this stage) completely separated. This can allow for improved further processing and disposal of the stack 200, which can increase efficiency.

[0061] As Figure 4 shown, the depth of the groove 212 extends into the stack 200 in a direction substantially perpendicular to the plane of the layers 202-208. That is, as Figure 4 shown, the depth extends in a direction parallel to the z-axis. The groove 212 has a width that is substantially perpendicular to the depth (in the Figure 4 sense that the width and depth of the groove 212 are in the plane of the page). That is, the groove has a width that extends in a direction parallel to the x-axis, as Figure 4 shown. The groove 212 has a length that extends in a direction substantially parallel to the plane of the layers 202-208 and substantially perpendicular to the width (i.e., in the Figure 4 sense of entering and / or leaving the plane of the page). That is, as Figure 4 shown, the groove 212 has a length that extends in a direction parallel to the y-axis. In an example where a plurality of such grooves 212 are formed in the stack 200, each groove can be formed substantially parallel to each other in the depth and length directions.

[0062] It should be noted that Figure 4 (similar to other figures) is a schematic diagram for illustrative purposes only. For example, Figure 4 the dimensions and relative spacing of the features shown (e.g., layers 202-208, groove 212, etc.) are only schematic and are only used to illustrate the example structures and processes described herein.

[0063] As Figure 4 shown, the groove 212 is formed in the first side 200a of the stack. In some examples, the method can include: laser ablating the stack 200 from a second side 200b of the stack 200 that is opposite the first side 200a of the stack 200 to form one or more second grooves( Figure 4 not shown in Figure 8)。In these examples, for instance, each additional groove (not shown) can be formed through the base layer 202, the cathode layer 204, and the electrolyte layer 206, but not through the anode layer 208. As will be described in more detail with reference to Figures 8 to 12 Cutting the stack 200 in this manner to form grooves can provide for effective further processing of the stack.

[0064] As Figure 4 shown, the stack 200 is laser ablated to form incisions or grooves 212 through one or more of the layers 202 - 208, generating one or more laser ablation products 210. Laser ablation can be performed under vacuum conditions and / or in the presence of an inert gas. As Figure 4 shown, laser ablation forms a cloud or plume 210 of laser ablation products. As described, laser ablation of the stack 200 can result in the removal of material 200 from the stack through one or more combinations of physical processes. The laser ablation products 210 can include material removed from the stack 200 by laser ablation, such as particles of the material. For example, the material of the stack 200 can be evaporated, vaporized, sublimated, and / or mechanically or thermomechanically shocked from the stack body 200 to form a cloud or plume 210 of laser ablation products.

[0065] In some examples, the laser ablation products 210 can include substances or particles derived from the material of the stack 200. For example, in cases where laser ablation causes decomposition of the material of the stack body 210, the laser ablation products 210 can include component particles or substances of the material of the stack 200. As another example, in examples where laser ablation causes ionization of the material of the stack 200, the laser ablation products 210 can include ionized particles or substances (or derivatives thereof) of the material of the stack 200. As another example, in examples where laser ablation causes or results in a reaction of the material of the stack with one or more substances, the laser ablation products 210 can include the products of such reaction, or in fact include particles or substances derived from such reaction products.

[0066] In any case, it will be understood that the laser ablation products 210 generated by laser ablation can characterize the stack 200 or one or more of its layers 202-208. For example, the laser ablation products 210 generated at any given time can be related to the materials of the layers 202-208 of the stack 200 that are laser ablated at that given time. For example, the laser ablation product 210 can identify the layers 202-208 of the stack that are ablated at that given time. The laser ablation products 210 can characterize the quality of the layers 202-208 of the stack 200 that are laser ablated. For example, the laser ablation products 210 can characterize or otherwise indicate the relative proportions of the components of the layers 202-208, e.g., whether the correct or expected relative proportions of the components of the layers 202-208 are indeed present. As another example, the laser ablation products 210 can characterize or otherwise indicate the presence of any impurities in the layers 202-208.

[0067] As Figure 4 shown, the laser ablation products 210 are analyzed by an analyzer 220 to determine one or more characteristics of the stack 200.

[0068] In some examples, the determined characteristics can include, for example, the identity of one or more of the laser ablation products 210. For example, mass spectrometry can be performed on the laser ablation products 210 to determine the masses of their constituent particles or substances. These masses can be mapped to the identity of the laser ablation products 210. The determined characteristics can include the identity of one or more components of one or more layers of the stack 200. For example, the determined identity of the laser ablation products 210 can be mapped to known components of the stack 200.

[0069] In some examples, the determined characteristics can include quality control parameters of the stack 200 or one or more of its layers 202-208. For example, the quality control parameters can indicate the proportions of the components in the stack, and / or the presence and / or severity of any defects, such as impurities present in the stack. The determined quality control parameters can be compared with quality control standards to determine whether the stack 200 meets these standards. As another example, the quality control parameters themselves can indicate whether the stack 200 meets a predetermined quality control standard or the degree to which it meets a predetermined quality control standard. For example, the determined identity of the components of the stack 200 or one or more of its layers 202-208 can be used, for example, to check whether the components are present in the expected or correct proportions, and / or whether any of the identified components represent unwanted impurities in the stack 200 (e.g., components that are not expected to be or should not be in the stack 200).

[0070] In some examples, the determined characteristics can be stored by the analyzer 220 in a computer-readable storage device 222 such as a computer memory 222. As referenced Figure 6and Figure 7 As described in more detail, determining the characteristics of the stack 200 can inform upstream production and / or downstream processing of the stack 200 and, as a result, can allow for an increase in the efficiency and / or reliability of the production and / or processing of the stack 200.

[0071] The laser ablation products 210 can be those formed by laser ablation to form the groove(s) 212 in the stack 200. As described with reference to Figures 8 to 12 in more detail, the formation of the groove(s) 212 can be performed as part of the processing of the stack 200 to produce an energy storage device. Thus, for example, compared to providing separate devices for laser ablating the stack to form the groove(s) 212 and for laser ablating the stack to produce the laser ablation products 210 to be analyzed, the analyzed laser ablation products 210 produced by forming the groove(s) 212 can effectively determine the characteristics of the stack 200.

[0072] The analyzer 220 can include a mass spectrometer 219. That is, mass spectrometry-based techniques can be used to analyze the laser ablation products 210 to determine one or more characteristics of the stack 200. In this example, the analyzer 220 includes a collection element 214, in this example a sampling tube 214, which is arranged to collect a sample of the cloud of ablation products 210 and transmit the sample to the mass spectrometer 219 for analysis.

[0073] Mass spectrometry-based techniques can include, but are not limited to, any one of secondary ion mass spectrometry (SIMS), time-of-flight mass spectrometry (TOF-MS), and inductively coupled plasma mass spectrometry (ICP-MS). That is, the mass spectrometer 219 can be, but is not limited to, any one of a secondary ion mass spectrometer, a time-of-flight mass spectrometer, and an inductively coupled plasma mass spectrometer. For example, in SIMS, a primary ion beam can be directed at the laser ablation products 210, and the secondary ions ejected therefrom can be collected and their mass analyzed. As another example, in TOF-MS, the laser ablation products 210 can be ionized (or may already have been ionized due to the laser ablation itself), and the mass-to-charge ratio of these ions can be determined using time-of-flight measurements. As another example, in ICP-MS, an inductively coupled plasma can be used to ionize the laser ablation products 210 and determine the mass-to-charge ratio of these ions. It will be appreciated that in some examples, any mass spectrometry-based technique can be used.

[0074] Analyzing the laser ablation product 210 using mass spectrometry-based techniques can provide a relatively rapid analysis, such as real-time or near-real-time analysis of the laser ablation product 210. For example, compared to spectroscopy-based techniques, these mass spectrometry-based techniques can allow for a relatively rapid analysis. In mass spectrometry-based techniques, inductively coupled plasma mass spectrometry (ICP-MS) can provide a particularly rapid analysis of the laser ablation product 210. The relatively rapid mass spectrometry-based techniques can, for example, allow for the relatively rapid determination of the characteristics of the stack 200 based on the analysis of the laser ablation product 210. This can allow the analyzer 220 to accurately characterize the stack 200, such as different parts of the stack 200, even when the cuts or grooves 212 in the stack are formed relatively rapidly. For example, the cut or (plural) grooves 112 can be formed as part of a roll-to-roll type production process, as referenced Figure 2 as described. The relatively rapid formation of the cut or groove 210 can provide an efficient battery production process. As referenced Figure 6 as described, the relatively rapid analysis of the laser ablation product can allow for substantially real-time or near-real-time adjustment of the stack production process based on the determined characteristics of the stack, which can allow for the efficient production of the stack.

[0075] In some examples, the analysis of the laser ablation product 210 can be performed without using mass spectrometry-based techniques, i.e., the analyzer 220 does not necessarily have to include a mass spectrometer 219, and in these examples, other analysis techniques can be used. For example, spectroscopy techniques can be used to analyze the laser ablation product 210. For example, X-ray photoelectron spectroscopy (XPS), X-ray fluorescence (XRF), or laser-induced breakdown spectroscopy (LIBS) can be used to analyze the laser ablation product 210. For example, in XPS, the laser ablation product 210 can be irradiated with an X-ray beam while measuring the kinetic energy and the number of electrons escaping from the product. For example, in XRF, the laser ablation product 210 can be excited by a primary X-ray source, and the fluorescence (or secondary) X-rays emitted from the laser ablation product 210 can be analyzed. For example, in LIBS, the laser ablation beam 216 can atomize and excite the material of the stack 200 to form the laser ablation product 210, or a different laser (not shown) can atomize and excite the laser ablation product 210, and the light emitted from the excited atoms can be analyzed to identify their atoms.

[0076] In some examples, the method can include correlating the location of the laser ablation with one or more determined characteristics.

[0077] In some examples, the location of the laser ablation can include the depth of the laser ablation into the stack 200. That is, the location can include along a direction parallel to Figure 4The position of the axis of the z-axis in the sense of. For example, laser ablation can be applied to the first side 200a of the stack 200, and the laser ablation can successively form incisions or grooves 212 through the anode layer 208, the electrolyte layer 206, and the cathode layer 202.

[0078] The depth to which the laser ablation 200 penetrates into the stack 200 can be determined, for example, based on the number of pulses of the laser ablation applied to the stack 200 at a given position and / or the duration of the laser ablation. For example, it can be known in advance that each pulse of the laser ablation produces an incision 212 having a depth of, for example, 1 micron. Thus, it can be determined that after, for example, five pulses, the laser ablation occurs at a depth of 5 microns into the stack 200. Therefore, the characteristics determined by analyzing the laser ablation products 210 produced by each pulse of the laser ablation can be related to the corresponding depth into the stack 200 provided by that pulse.

[0079] In some examples, the depth of the laser ablation related to the determined characteristics of the stack 200 can be used to determine whether each layer 204-208 of the stack 200 has the correct or expected thickness. For example, the determined characteristics can include the identification of the laser ablation products. It can be known in advance that the first layer (e.g., the anode layer 208) produces laser ablation products with a first identification, and the second layer (e.g., the electrolyte layer 206) produces laser ablation products with a second identification. It may be desired that the thickness of the first layer (e.g., the anode layer 208) is 5 microns. Thus, for example, if it is determined that laser products with a second identification are produced at a laser ablation depth of only 3 microns into the stack 200, it can be determined that the first layer (e.g., the anode layer 208) is too thin, for example, not meeting the quality control standards. As referenced Figure 6 As described, this information can be used to adjust the stack production process accordingly, that is, adjusted so that the production process produces a stack 200 that does meet the quality control standards.

[0080] In some examples, the depth of the laser ablation related to the determined characteristics of the stack can be used to determine the components in the different layers 202-208 of the stack 208. For example, it can be known (or assumed) that each of the anode layer 208 and the electrolyte layer 206 has a thickness of 5 microns, and the depth cut by each laser ablation pulse is, for example, 1 micron. In this case, the laser ablation products 210 from the first set of five laser ablation pulses can be used to determine the components of the anode layer 202, and the laser ablation products 210 from the second set of five laser ablation pulses can be used to determine the components of the electrolyte layer 206 (and so on). As described, the determined components can be compared with the expected or desired components to determine whether each layer 202-208 of the stack meets the quality control standards. As referenced Figure 6As described, this information can be used to adjust the stacking production process accordingly, i.e., adjusted such that the production process produces stacks 200 that do meet the quality control criteria.

[0081] In some examples, the location of the laser ablation can include at least one location in the plane of the stack 200. That is, the location can include a location in the plane of any one of the layers 202 - 208 of the stack. That is, the location can include a location in a plane parallel to the plane defined by the x and y axes in the sense of Figure 4 . For example, the location can include a location along an axis parallel to the Figure 4 z - axis in the sense of. Alternatively or additionally, the location can include a location along an axis parallel to the Figure 4 z - axis in the sense of. In an example where the location includes a location along an axis parallel to the x - axis and a location along an axis parallel to the y - axis, the location can include coordinates in the xy - plane.

[0082] Associating the determined property with the location of the laser ablation in the plane of the stack 200 can provide a granular characterization of the stack to be provided, such as quality control information. For example, as mentioned, the determined property can include a quality control parameter that indicates, for example, whether the components of the stack 200 are as desired or not. Associating this information with the location in the plane of the stack 200 corresponding to the information (e.g., relative to the depth perpendicular to the plane of the stack 200) can identify specific regions of the stack that do meet the quality control criteria and specific regions of the stack that do not meet the quality control criteria. As referenced Figure 6 and Figure 7 described in more detail, this can provide improved control of the upstream production and / or downstream processing of the stack and, thus, can produce energy storage batteries more effectively and / or reliably.

[0083] In some examples, the location of the laser ablation in the plane of the stack 200 can be determined based on the position of the laser system 218 relative to the stack 200. For example, in some examples, the laser system 218 (or its components) can be controlled to direct the laser ablation beam 216 to different locations in the plane of the stack 200. For example, the laser system 218 (or its components) can be controlled to move in a plane parallel to the plane of the stack 200. The location of the laser ablation in the plane of the stack 200 can be determined based on the position of the laser system 218 (or its components) in a plane parallel to the plane of the stack 200. For example, this can be determined based on the position of the laser system 218 (or its components) that is controlled to be positioned and / or based on a sensor (not shown) that is arranged to sense the position of the laser system 218 (or its components).

[0084] In some examples, the method can include moving the stack simultaneously or intermittently with laser ablation in a first direction 238. For example, as Figure 5 shown, the stack 200 can be unrolled from the reel 258 such that a substantially flat portion travels in the first direction 238. As Figure 5 shown, in the sense of Figure 4 and 5 , the first direction 238 is parallel to the y-axis. When the stack 200 travels in the first direction 238, for example, laser ablation as described with respect to Figure 4 is applied to the stack 200 to form the grooves 212 in the stack. As Figure 5 shown, the grooves 212 so formed extend in a direction parallel to the first direction 238 (i.e., are elongated). The laser ablation is provided by a laser beam 216 provided from a laser system 218. In some examples, the laser system 218 can be disposed on a stationary fixture (not shown), and the stack can be moved relative to the stationary fixture (not shown) in the first direction 238. In some examples, the stack 200 can be moved in a roll-to-roll type process (e.g., as described with reference to Figure 2 ), where the stack 200 is unrolled from a first reel 258 for laser ablation and wound onto a second reel (not shown) once the laser ablation is performed. The first travel direction 236 can be between the two reels.

[0085] In some examples, the location of the laser ablation can include a location along an axis parallel to the first direction 238 (e.g., a location along the y-axis in the sense of Figure 5 ).

[0086] For example, the location of the laser ablation in a direction along the axis parallel to the first direction 238 can be determined by measuring the travel distance of the stack 200 in the first direction 238. For example, casters (not shown, but see, e.g., Figure 6A roller 610 or other device for measuring the movement of stack 200 in the first direction 238 can record the travel distance of stack 200 in the first direction 238 relative to the (fixed) laser system 218. As another example, sensors can be arranged to sense the rotation of the reel 258, thereby inferring the distance traveled by stack 200. For example, the circumference or radius or diameter of stack 200 on the reel 258 can be known in advance or measured, and can be used together with the degree of sensed rotation of the reel 258 to determine the distance traveled by stack 200 (e.g., if the reel 258 rotates one full turn, stack 200 will travel a distance equal to one circumference of stack 200 on the reel 258, or 2π times the radius of stack 200 on the reel 258). Each characteristic of stack 200 determined by analyzing the laser ablation product 210 can be related (e.g., associated) with the travel distance recorded when the characteristic was determined (or related to some predetermined offset between characteristic determination and travel distance recording). In this way, the determined characteristics can be related to the position along the axis parallel to the travel direction 238 corresponding to that characteristic.

[0087] As another example, the position of laser ablation in the direction along the axis parallel to the first direction 238 can be determined based on the travel speed of stack 200 in the first direction 238. For example, the speed at which stack 200 is unrolled from the reel 258 can be measured or predetermined. The speed at which stack 200 is unrolled from the reel 258 can be constant or can have a predetermined profile with respect to time. The time at which each given laser ablation is performed, at which the laser ablation product 210 is generated, can be recorded, and a given characteristic is determined based on the laser ablation product 210. This time can be relative to the start time when stack 200 starts to move in the first direction 238. Then, the speed 238 at which the stack moves in the first direction 238 can be used to infer the given time relative to the start time, at which a given position in the direction parallel to the travel direction 238 of stack 200 will be laser ablated. The given time can be compared with the recording time of each characteristic, thereby correlating the characteristic with the position in the direction parallel to the travel direction 238 associated with the characteristic. Determining the position based on the travel speed of stack 200 can provide a correlation between the characteristic and the position in the direction parallel to the travel direction 238 of stack 200 without directly measuring the device for the travel of stack 200, and thus cost-effective analysis can be performed.

[0088] In some examples, the position of laser ablation (related to the determined characteristic) can include a position along the axis perpendicular to the first direction 238 (e.g., in Figure 5 the sense of the position along the y-axis).

[0089] For example, the position of laser ablation in the direction along the axis perpendicular to the first direction 238 can be determined based on the position at which the laser system 218 (or its components) is positioned along the axis perpendicular to the first direction 238. For example, this can be determined based on the position of the laser system (or its components) that is controlled to be positioned and / or based on a sensor (not shown) that is arranged to sense the position of the laser system (or its components).

[0090] In some examples, there may be multiple laser ablation beams (not shown), for example, spanning the stack at regular intervals along an axis parallel to the x-axis in the sense of Figure 5 . The multiple laser ablation beams can be provided by a corresponding plurality of laser sources (not shown) spaced apart on the stack 200. As another example, there may be one laser source whose beam is split or otherwise manipulated to provide multiple laser ablation beams. In these examples, the position of laser ablation in the direction along the axis perpendicular to the first direction 238 can be determined based on the position at which the laser ablation beam is located or is controlled to be located along the axis perpendicular to the first direction 238. For example, the position of each of the multiple laser ablation beams in the direction along the axis perpendicular to the first direction 238 may be known in advance. Each of the multiple laser ablation beams can be controlled to be applied sequentially (e.g., one at a time). The characteristics determined by analyzing the laser ablation products of the laser ablation from one of the given beams can be associated with the known position along the x-axis of the given beam, thereby allowing the determined characteristics to be correlated with the position along the axis perpendicular to the first direction 238.

[0091] Associating the determined characteristics with the position along the axis perpendicular to the first direction 238 can allow for the determination and consideration of variations in characteristics, such as quality control characteristics, in the direction perpendicular to the first direction in the stack 200. As described in more detail with reference to Figure 6 and Figure 7 This can provide improved control of the upstream production and / or downstream processing of the stack and, thus, can produce energy storage batteries more efficiently and / or more reliably.

[0092] It should be understood that for different parts of the same stack 200, laser ablation and analysis of its laser ablation products can be performed multiple times, for example, substantially continuously, to determine the characteristics of the stack 200 at the relevant positions of the laser ablation. For example, in some examples, the method can include moving (e.g., along a first direction 238) the stack 200 relative to a laser beam 216 for laser ablation, laser ablating the stack 200 to form additional incisions (not shown) through one or more layers of the stack 200, thereby generating one or more additional laser ablation products (not shown), analyzing (e.g., using a mass spectrometry-based analysis technique) the additional laser ablation products, thereby determining one or more additional characteristics of the stack 200, and correlating the positions of the additional laser ablation with the one or more additional characteristics determined.

[0093] In some examples, the method can include storing the relevant positions and the one or more characteristics determined in association with each other in a storage medium 222. For example, the relevant positions and the associated characteristics of the stack 200 determined for that position can be stored in association with each other in the form of a table or other data structure. In some examples, the data representing the determined characteristics and the data representing the associated relevant positions can be stored in association with each other. This relevant information can be used to inform upstream production and / or downstream processing of the stack.

[0094] Now referring to Figure 6 , a schematic diagram of a system 600 for the production and processing of a stack 200 according to an example is shown. The system 600 includes a deposition component 602, a device 224 for laser ablation and analysis of the stack 200, and a splitting component 601.

[0095] The deposition component 602 is configured to deposit one or more of a cathode layer 204, an electrolyte layer 206, and an anode layer 208 onto a base layer 202, thereby producing the stack 200. The deposition component 602 includes a controller 606 and a deposition element 604. The controller 606 is arranged to control the deposition of materials through the deposition element 604. The controller 606 can be arranged to control the deposition of materials by the deposition element 604 based on one or more characteristics (and in some examples the relevant positions) of the stack 200 determined by the device 224.

[0096] The device 224 can be associated with reference to Figure 4The described device is the same or similar. Device 224 is used to laser ablate stack 200 and determine one or more characteristics of stack 200 (and in some examples, associate the determined characteristics with the location of the associated laser ablation). Device 224 includes a laser system 218 that is arranged to laser ablate stack 200 in use so as to form a cut through one or more layers of stack 200, thereby generating one or more laser ablation products in use. Device 224 includes an analyzer 220 that is arranged to analyze the laser ablation products generated in use, thereby determining one or more characteristics of stack 200. Device 224 may include a correlator (not shown, but may be provided by a suitable processing system, such as including a processor and a memory) that is arranged to associate the location of the laser ablation with the one or more determined characteristics. For example, the location may include at least one location in the plane of stack 200 that is ablated by laser system 218 in use. For example, the location may include at least one location in a plane that is substantially perpendicular to the axis defined by laser beam 216 generated by laser system 218, which laser beam ablates stack 200 in use.

[0097] In some examples, analyzer 220 may include a mass spectrometer and may be arranged to use mass spectrometry-based techniques to analyze the laser products generated in use, thereby determining one or one characteristic of stack 200. In some examples, in use, simultaneously or intermittently with the laser ablation, the stack may be moved in a first travel direction 238, and the correlator may be arranged to associate the location of the laser ablation with the one or more determined characteristics based on the speed at which stack 200 moves, for example as referenced Figure 5 as described. Device 224 includes a memory or storage 222 that is arranged to store the determined characteristics of stack 200 (such as together with the location associated with each determined characteristic). Device 224 includes a roller 610 that may be used, for example, to determine the location of a given laser ablation of the stack in a direction parallel to the first direction 238, for example as referenced Figure 4 and Figure 5 as described.

[0098] The splitting member 601 is used to split stack 200 into cells. The splitting member 601 includes a controller 608 that is arranged to control the further processing of stack 200. For example, the further processing of stack 200 may be the same or similar to that described hereinafter with reference to Figures 8 to 12 For example, the splitting member 602 may cut the stack into strips (for example, see strip 260 of Figure 9 ), and / or fold stack 200 into a Z-fold type arrangement (for example, see the folded stack 262 of Figure 10 ), and / or split the (folded) stack 200 into energy storage devices (for example, seeFigure 12 of the energy storage device 270b).

[0099] Referring to Figure 6 , a sheet or web of the substrate 202 is unwound from the reel 250 in a first direction 238 and reaches the deposition member 602. The deposition element 604 of the deposition member 602 deposits the cathode layer 204, the electrolyte layer 206, and the anode layer 208 onto the substrate 202, thereby forming the stack 200. The deposition of the layers can be the same as or similar to that described with reference to Figure 1 and 2 . The stack 200 then reaches the device 224, which can apply the method described with reference to Figures 3 to 5 , i.e., laser ablating the stack 200 to form incisions; then, analyzing the laser ablation products; and determining one or more characteristics of the stack 200 (which can be related to the location where the laser ablation occurs) based on the analysis. The determined characteristics (and related locations) can be stored in the storage device 222. Then, the laser-ablated stack 200 is transferred to the dividing member 601, which can then divide the stack 200 into energy storage devices, e.g., as described with reference to Figures 8 to 12 .

[0100] In the Figure 6 example, the stack 200 is fed from the deposition member 602 to the device 224, and the deposition by the deposition member 602 occurs before the laser ablation and the analysis of the laser ablation products by the device 224. In one or both of these aspects, the deposition and / or the deposition member 602 can be said to be upstream of the laser ablation and analysis and / or the device 224. Conversely, the stack 200 is fed from the device 224 to the dividing member 601, and the division is performed by the dividing member 224 after the laser ablation and the analysis of the laser ablation products by the device 224. In one or both of these aspects, the division and / or the dividing member 601 can be said to be downstream of the laser ablation and analysis and / or the device 224.

[0101] The one or more determined characteristics and / or the related locations referred to above with reference to Figure 4 and Figure 5 and the one or more determined characteristics can be used in the control of the upstream production of the stack 200 by the deposition member 602 and / or in the control of the downstream division of the stack 200 by the dividing member 601 to provide an efficient and / or reliable production of energy storage cells.

[0102] For example, in some examples, the method can include using the one or more determined characteristics, or the related location and the one or more determined characteristics, to adjust the production of the obtained stack 200.

[0103] For example, when stack 200 is fed through device 224 along a first direction 224, device 224 can determine characteristics of stack 200, such as quality control parameters. For example, the quality control parameters can relate to, for example, a determined thickness and / or composition of anode layer 208 of stack 200. The characteristics can be transmitted or otherwise provided to controller 606 of deposition component 602. Deposition component 602 can control deposition based on the characteristics. This can occur substantially in real time or near real time.

[0104] The quality control parameters can be transmitted or otherwise provided to controller 606 of deposition component 602 such that controller 606 can control deposition of anode layer 208 by deposition element 604 based on the quality control parameters. For example, the quality control parameters can indicate that the determined thickness of anode layer 208 deviates from an expected or desired thickness of anode layer 208, and controller 606 can control deposition element 604 to adjust the deposition thickness of anode layer 208 accordingly. For example, the determined thickness can be related to the position of the stack along a direction perpendicular to the first direction 238. In such a case, the characteristics and the associated position can indicate that the anode layer is thicker on one side of the stack than on the other side. Controller 606 can thus control deposition element 604 to adjust the deposition profile accordingly along a direction perpendicular to the first direction 238. As another example, the quality control parameters can indicate that the determined composition of the anode layer deviates from an expected composition, and controller 606 can control deposition element 604 to adjust the composition of deposited anode layer 208 accordingly. Controlling upstream production of stack 200 based on the determined characteristics of stack 200, or the associated position and the determined one or more characteristics, can reduce production of stacks 200 that do not meet quality control standards and can thus improve the efficiency of energy storage battery production.

[0105] Controlling upstream production of stack 200 based on the determined characteristics of stack 200, or the associated position and the determined one or more characteristics, can be advantageous compared to systems in which samples are taken from a batch and then subjected to post - processing analysis. In these cases, if a defect is found in the sample, the entire product may need to be scrapped or investigated. However, rapid analysis of laser ablation products and subsequent control of the deposition process based on deviations of the characteristics of stack 200 from the analysis described herein can allow quality control to be implemented during (continuous) production of stack 200 without the need to perform separate quality control steps on stack 200, enabling more efficient processing.

[0106] In some examples, the method can include, after laser ablation and analysis of its laser ablation products, processing stack 200 based on the relative positions and determined one or more characteristics of stack 200. For example, the relative positions and determined one or more characteristics of stack 200 can be transmitted or otherwise communicated or provided to segmentation component 601. The controller 608 of segmentation component 601 can control the segmentation of stack 200 into cells, which is affected by or based on the provided relative positions and determined one or more characteristics of stack 200.

[0107] For example, the relative positions and determined one or more characteristics of stack 200 can indicate that a certain portion of stack 200 is below quality control standards, and thus, for example, that particular portion should not be included in the energy storage device to be produced by segmentation component 601.

[0108] As another example, a certain portion of stack 200 can be included in the energy storage device produced by segmentation component 601, but it can be determined that that particular portion will not produce a valid cell, and thus the segmentation of stack 200 will be performed to compensate for the presence of the invalid cell. For example, as described with reference to Figures 9 to 12 Stack 200 can be folded and segmented to produce an energy storage device including dozens, possibly hundreds, or possibly thousands of cells. For example, it may be desirable for each energy storage device produced by segmentation component 601 to consist of, for example, 500 valid cells. It can be determined from the relative positions and determined one or more characteristics of stack 200 that a given portion of stack 200 (to be included in a given energy storage device) will result in two cells being invalid. Segmentation component 601 can use this information to adjust the segmentation of stack 200 such that the final energy storage device has 502 cells. That is, the energy storage device includes 500 valid cells, and two cells are determined to be invalid. Thus, processing stack 200 based on the relative positions and determined one or more characteristics of stack 200 can allow for reliable production of energy storage devices, which can in turn increase the efficiency of energy storage device production. Additionally, this can reduce or eliminate the need to apply a separate quality control procedure to the produced energy storage devices, since the energy storage devices have been produced in a manner that already compensates for defects that may be present in stack 200 that makes up the energy storage devices. This can increase the efficiency of the cell production process.

[0109] In some examples, the method can include determining a parameter for processing the laser-ablated stack 200 based on the relative position and one or more determined characteristics. For example, the parameter can include the number of energy storage device cells formed from the laser-ablated stack 200 that will be included in a given energy storage device. For example, according to the previous example, the device 224 or the segmentation component 601 can determine that a given portion of the stack 200 will produce two defective cells based on the relative position and one or more determined characteristics, and thus 502 cells will be included in the energy storage device including the given portion of the stack 200 to compensate for the ineffectiveness of these two cells. The parameter can be stored in the storage device 222 of the device 224 and / or sent or provided to the segmentation component 601, which can store the parameter in its own storage device (not shown). Thus, the segmentation can be performed based on a simple parameter, which can reduce the processing required at the segmentation component 601 and thus allow for an efficient segmentation process for providing reliable energy storage devices.

[0110] As Figure 6 shown, the stack 200 (to which laser ablation has been applied) can reach the segmentation component 601 directly from the device 224. However, in other examples, the laser-ablated stack 200 can instead be wound onto another reel for segmentation processing at different times and / or locations. For example, as Figure 7As shown, the laser-ablated stack 200 can be wound around a reel 270. The reel can have an identifier such as "23X", which can associate the stack 200 on the reel 270 with a data file 271 that includes the relevant positions associated with the stack 200 and one or more determined characteristics (or determined parameters). The data file 271 can be stored in a storage medium 273, which can be with the stack 200 on the reel 270. As another example, the data file 271 can be stored in a central memory (not shown), and the identifier can associate the reel 270 with the data file 273 in the central memory, and the file can then be accessed accordingly. As another example, the stack 200 on the reel 270 can be provided with a label or code or other machine-readable device, such as a radio frequency identification (RFID) tag that carries the data file 271 itself. In each of these examples, or when the stack 200 from the reel 270 is to be further processed, the data file 273 can be provided to the segmentation component 601. For example, the stack 200 on the reel 270 can be loaded into the segmentation component 601, and the segmentation component 601 can read the data file 271 associated with the reel 270. Thus, the segmentation component 601 knows the determined characteristics of each part of the stack 200 on the reel 270 from the data file 273. For example, when the segmentation component 601 unwinds the stack 200 from the reel 270, the segmentation component 601 can read from the data file 271 the characteristics of the part of the stack 200 associated with the distance of the unwound stack 200. Thus, the segmentation component 601 can process the stack 200 into an energy storage device based on the relevant positions and the one or more accordingly determined characteristics (or determined parameters), such that even if there are still some invalid cells in the energy storage device, each energy storage device has the same number of valid cells.

[0111] Thus, determining the relevant positions and the one or more determined characteristics of the stack 200 can improve not only the upstream production of the stack 200 but also the further downstream processing of the stack 200, which can provide for the production of reliable and / or efficient energy storage devices.

[0112] In the following, reference is made to Figures 8 to 12 the further processing of the stack 200 according to an example to produce an energy storage device. This further processing can be, for example, the processing performed by Figure 6 the segmentation component 601. As described, the relevant positions and the one or more determined characteristics (or determined parameters) of the stack 200 can be used in the further processing to increase the efficiency and / or reliability of the production of the energy storage device.

[0113] In some examples, further processing may include providing an insulating or dielectric material 246 into one or more cuts or grooves formed by laser ablation.

[0114] For example, referring Figure 8 to Figure 4 , a stack 200 according to an example is schematically shown. Similar to Figure 8 that shown, Figure 4 the stack 200 is formed by a base layer 202, a cathode layer 204, an electrolyte layer 206, and an anode layer 208, all of which may be the same as or similar to those described with reference to Figure 4 . Again similar to Figure 8 , Figures 3 to 6 the stack 200 of

[0115] has a cut or groove 212a formed in a first side 200a of the stack 200 that passes through the anode layer 202, the electrolyte layer 206, and the cathode layer 204 but not through the base layer 202. The cut or groove 212a may be formed by laser ablation, and the laser ablation products 210 thereof are analyzed to determine one or more characteristics of the stack 200, as described with reference to Figure 8 . Figure 8 In an example of Figure 8 , the stack 200 has two additional grooves 210a, 210b formed therein. Each additional groove 210a, 210b is formed in a second side 200b of the stack 200 that passes through the base layer 202, the cathode layer 204, and the electrolyte layer 206 but not through the anode layer 208. Each additional groove 210a, 210b may be substantially the same as the groove 212a in the first side o200a of the stack, except that they are formed in the second side of the stack 200b (and thus extend through different layers of the stack 200 compared to the groove 212a). One of the additional grooves 210a is

[0116] Laser ablation is performed to form grooves 210a, 212a, 210b that expose the surface of at least the electrode layers 204, 208 of the stack 200, such as the edges. As Figure 8 shown, taking the first groove 210a formed from the first side 200a of the stack 200 as an example, the laser ablation for forming the first groove 210a exposes the edge of the base layer 202a, the edge 204b of the cathode layer 204, and the edge 206a of the electrolyte layer 206. Similarly, for the second groove 212a formed from the second side 200b of the stack, the laser ablation exposes the edge 202a of the anode layer 208, the edge 206a of the electrolyte layer 206, and the edge 204a of the cathode layer 204.

[0117] An insulating material 246 can be provided in each of the grooves 210a, 212a, 210b. For example, the insulating material 246 can be deposited in each of the first grooves 210a, 212a, 210b, for example similar to that described in reference Figure 2 Thus, the insulating material 246 is provided on the exposed surfaces, such as the edges 202a, 204a, 206a, 208a, so as to provide electrical insulation between the exposed edges 204a, 208a of the first electrodes 202, 206 (i.e., one of the cathode layer 204 and the anode layer 208) and the exposed edges 204a, 208a of the second electrodes 202, 206 (i.e., the other of the cathode layer 204 and the anode layer 208). This can avoid direct electrical contact between the charged anode layer 206 and the cathode layer 202 and thus short circuit during laser ablation and / or during further processing of the stack 200. As described in more detail below, providing the insulating material 246 in the grooves 210a, 212a, 210b can reduce the need to provide insulation on the folded stack edges at a later stage of further processing of the stack 200, which in turn can allow for more efficient further processing of the stack 200.

[0118] In some examples, the further processing can include folding the stack 200. For example, in some examples, the further processing of the stack 200 can include cutting the stack 200 into one or more strips 254, 260 before folding the stack 200.

[0119] For example, now specifically referring to Figure 9 , the stack 200 is provided by a reel 258 so as to travel in the first direction 238. The stack includes a plurality of grooves 212 formed therein. The grooves 212 can be, for example, as described with reference to Figure 3 and Figure 8The described formation. A plurality of first grooves 212 are elongated in a direction parallel to the first travel direction 238. Forming the grooves 212 in this orientation can allow the laser source and / or the resulting ablation beam to be provided by a stationary laser system, and the stack 200 can be moved relative to the stationary laser system, e.g., to form the grooves 152 in a substantially continuous process, which can be effective.

[0120] As Figure 9 schematically shown in, the stack 200 (in which the first grooves 212 are formed) can be cut into a plurality of tapes 260 (only one is shown in Figure 9 ). For example, the tapes 260 can be formed by laser cutting (not shown) the stack 200 along a direction perpendicular to the first travel direction 238. For example, Figure 6 the splitting member 601 can include a laser cutter (not shown) that is arranged to cut the stack 200 into tapes 260. Each tape 260 is elongated in a direction perpendicular to the extension of the first grooves 212. Then, each tape 260 can be folded (e.g., during and / or by a folding machine) at or toward a pre-marked registration feature to produce a folded stack 262. It should be understood that although only one fold is shown in Figure 9 , in other examples, there can be many folds such that the folded stack 262 includes many layers stacked on top of each other, e.g., dozens or hundreds of layers (see also Figure 10 ).

[0121] Now referring to Figure 10 , an example of the folded stack 262 is shown. The folded stack 262 can be produced by, for example, the folding process and / or folding machine described with reference to Figure 9 . As Figure 10 shown, the folded stack 262 has four stacked layers 200a - 200d (each stacked layer includes a stack 200 formed by the method described with reference to Figures 3 to 6 ). The stacks are folded in a "zigzag fold" arrangement. In other words, the second stacked layer 200b is folded back on the first stacked layer 200a such that the planes defined by the layers of the first stacked layer 200a and the second stacked layer 200b are substantially parallel to each other. Similarly, the third stacked layer 200c is folded back on the second stacked layer 200b, and the fourth stacked layer 200d is folded back on the third stacked layer 200c. The stack 200 can be folded such that each stacked layer 200a - 200d is registered or aligned with each other. For example, the stack 200 can be folded such that each stacked layer 200a - 200d has the same length such that the stacked layers 200a - 200d are registered or aligned with each other. The portions 264 of the stacked layers 200a - 200d at the folds (i.e., away from the central portion of the folded stack 256) can be removed and / or considered as waste.

[0122] In some examples, further processing can include dividing the folded stack 262 into energy storage devices 270a, 270b.

[0123] For example, referring Figure 11 , the central portion of the folded stack 262 is shown in more detail. As Figure 11 shown, each stack layer 200a - 200d is aligned with each other, that is, such that the grooves of one stack layer 200a (e.g., each filled with insulating material 246) are aligned with the corresponding grooves of the adjacent stack layer 200b (i.e., vertical alignment in the sense of Figure 11 ). Each stack layer includes a base layer 202, a cathode layer 204, an electrolyte layer 206, and an anode layer 202. It should be noted that since the second stack layer 200b is folded back onto the first stack layer 200a, the second stack layer 200b is inverted compared to the first stack layer 200a, and similarly, the third stack layer 200c is inverted compared to the second stack layer 200b, and the fourth stack layer 200d is inverted compared to the third stack layer 200c.

[0124] As Figure 11 schematically shown in, further processing can include cell division, that is, dividing the folded stack into cells of the energy storage devices 270a, 270b. In this example, cell division includes laser ablation 266a - 266c to form incisions 268a - 268c through all the first to fourth stack layers 200a - 200d at each position where the grooves are aligned. It should be understood that in an example where the grooves are filled with insulating material 246, the incisions 268a - 268c include incisions through the insulating material 246. The incisions 268a - 268c divide the folded stack into energy storage devices 270a, 270b. Figure 6 The dividing member 601 shown in

[0125] can include a cutting device (e.g., a laser cutting device) to form incisions 268a - 268c through the folded stack 200. Figure 12 An example of the cut energy storage device 270b is shown in

[0126] The energy storage device 270b actually includes four cells A - D. The battery energy storage device 270b includes layers in the following order (in Figure 12from bottom to top in the sense of): In battery A: the first base layer 202a, the first cathode layer 204a, the first electrolyte layer 206a, the first anode layer 208a; in the second battery B: the second anode layer 208b, the second electrolyte layer 206b, the second cathode layer 204b, the second base 202b; in the third battery C: the third base 202c, the third cathode layer 204c, the third electrolyte layer 206c, the third anode layer 208c, and in the additional battery D: the fourth anode layer 208d, the fourth electrolyte layer 206d, the fourth cathode layer 204d, and the fourth base 202d.

[0127] As described, the formation of the grooves in the stack 200 and the insulating material 246 disposed in the first groove, the folding and dividing described provide for the divided energy storage device 270b, on only the first side 72 of the device (on the Figure 12 sense of being the right side) expose the surfaces including the anode layers 208a - 208d, and all other layers are insulated by the insulating material 246 on the first side 272. Moreover, only the surfaces including the base layers 202a - 202d are exposed on the second opposite side 274 of the device 270b, and all other layers are insulated by the insulating material 246 on the second side 272. As described, the base layers 202a - 202d may include a conductive material, such as nickel.

[0128] The first side 272 of the device 270b may be coated with a first conductive material (not shown) to electrically connect all the anode layers 208a - 208d together, and the second side 274 of the device 270b may be coated with a second conductive material (not shown) to electrically connect all the base layers 202a - 202d (and thus all the cathode layers 204a - 204d) together. For example, a sputtered metal layer may be applied on both sides 272, 274 of the device 270b. In this way, for example, the first conductive material may provide contact for the first terminal of the energy storage device 270b (e.g., the positive terminal of the energy storage device 270b), and the second conductive material provides contact for the second terminal of the energy storage device 270b (e.g., the negative terminal of the energy storage device 270b). In other words, in effect, the four batteries A - D of the energy storage device 270b are connected in parallel. The positive and negative terminals may be electrically connected across a load to power the load. Connecting the batteries A - D in parallel may provide a relatively high discharge rate for the energy storage device 270b, which may be useful in certain applications.

[0129] Also as referenced Figure 6 described, the stack 200 can be further processed into the energy storage device 270b based on the determined characteristics and relative positions of the stack 200. For example, related to forming, for example Figure 12Certain determined characteristics associated with a portion of the stack 200 of battery A of the energy storage device 270b as shown may indicate that the portion is below certain quality control standards and thus indicate that battery A will not be effective (e.g., non-functional). Based on this information, the segmentation component 601 may determine that additional batteries (not shown) will be included in the energy storage device 270b in order to compensate for the ineffective battery A. Thus, the segmentation component 601 may, for example, fold the stack 200 or the stack tape 260 such that additional stack layers 200a - 200d are included in the folded stack 262. Thus, it can be ensured that the resulting energy storage device 270b has four effective batteries (even if the energy storage device 270b has one ineffective battery A). In this way, the determined characteristics and associated positions (or parameters) of the stack 200 can be used to provide that each of the resulting energy storage devices 270b can have the same effective capacity, regardless of the presence of certain ineffective batteries.

[0130] Thus, processing the stack 200 based on the associated positions and determined one or more characteristics of the stack 200 can allow for reliable production of energy storage devices, which can in turn improve the efficiency of energy storage device production. Additionally, this can reduce or eliminate the need to apply a separate quality control procedure to the produced energy storage devices, as the energy storage devices have been produced in a manner that has compensated for the defects that may be present in the constituent stack 200. This can improve the efficiency of the battery production process.

[0131] Although in some of the foregoing examples, the laser ablation products 210 analyzed to determine one or more characteristics of the stack 200 (associated with the location of laser ablation in some examples) are produced by laser ablating the stack to form one or more incisions or grooves 212, 210a, 212a, 210b, it should be understood that this is not necessarily the case. In some examples, the analyzed laser ablation products can be the products of laser ablation forming any incision through one or more layers of the stack 200. For example, alternatively or additionally, the analyzed laser ablation products can be those produced by laser ablation to cut the stack into the tape 260, as referred to Figure 9 as described, and / or the laser ablation products produced by laser ablation to divide the folded stack 260 into batteries, as referred to Figure 11 as described.

[0132] The above examples should be understood as illustrative examples of the present invention. It should be understood that any characteristic described with respect to any one example can be used alone or in combination with other described characteristics, and can also be combined with one or more characteristics of any other example or any combination of other examples. Additionally, equivalents and modifications not described above can also be employed without departing from the scope of the present invention as defined in the appended claims.

Claims

1. A method for determining one or more characteristics of a stack of energy storage devices during the manufacture of the stack of energy storage devices, comprising: Obtaining a stack of energy storage devices, the stack comprising one or more layers; Laser ablating the stack to form a cut at least partially through one or more layers, thereby producing one or more laser ablation products, wherein the formation of the cut is performed as part of the processing of the stack to manufacture an energy storage device; Analyzing the laser ablation products using a mass spectrometry-based analysis technique to determine one or more characteristics of the stack, wherein the method comprises associating the location of the laser ablation with the one or more determined characteristics, wherein the method comprises moving the stack simultaneously or intermittently with the laser ablation in a first direction.

2. The method according to claim 1, wherein: The location includes at least one location in the plane of the stack.

3. The method according to claim 2, wherein, The location includes a location along an axis parallel to the first direction.

4. The method according to claim 2, wherein, The location includes a location along an axis perpendicular to the first direction.

5. The method according to any one of claims 1 to 4, wherein The location includes the depth into the stack.

6. The method according to any one of claims 1 to 4, wherein, The method comprises storing data representing the relevant location and data representing the one or more determined characteristics in association with each other in a storage medium.

7. The method according to claim 6, wherein The method comprises determining parameters for processing the stack for laser ablation based on the relevant location and the one or more determined characteristics.

8. The method according to claim 7, wherein: The parameters include the number of energy storage device cells to be included in a given energy storage device formed by laser ablating the stack.

9. The method according to claim 7, wherein: The method comprises processing the laser ablated stack based on the relevant location and the one or more determined characteristics and / or based on the determined parameters.

10. The method according to any one of claims 1 to 4, wherein The method comprises: moving the stack relative to a laser beam for laser ablation; laser ablating the stack to form additional cuts through one or more layers, thereby producing one or more additional laser ablation products; analyzing the additional laser ablation products using a mass spectrometry-based analysis technique to determine one or more additional characteristics of the stack; and associating the location of the additional laser ablation with the one or more determined additional characteristics.

11. The method according to claim 6, wherein, The method comprises adjusting the production of the obtained stack using the one or more determined characteristics, or the relevant location and the one or more determined characteristics.

12. The method according to any one of claims 1 to 4, wherein The one or more determined characteristics include one or more of the following: the identity of one or more laser ablation products, the identity of one or more components of one or more layers of the stack, and quality control parameters of the stack.

13. The method according to any one of claims 1 to 4, wherein The mass spectrometry-based analysis technique includes inductively coupled plasma mass spectrometry ICP-MS.

14. An apparatus for determining one or more characteristics of a stack of energy storage devices during the manufacture of the stack of energy storage devices, the stack comprising one or more layers, the apparatus comprising: A laser system arranged to laser ablate the stack in use to form a cut at least partially through one or more layers, thereby producing one or more laser ablation products in use, wherein the formation of the cut is performed as part of the processing of the stack to manufacture an energy storage device; An analyzer arranged to analyze laser ablation products generated in use to determine one or more characteristics of the stack; And A correlator arranged to correlate the location of laser ablation with the one or more determined characteristics; Wherein the location includes at least one location in the plane of the stack ablated by the laser system in use, Wherein the analyzer is arranged to analyze laser ablation products generated in use using mass spectrometry-based analysis techniques to determine one or more characteristics of the stack, Wherein, in use, simultaneously or intermittently with laser ablation, the stack moves in a travel direction, and wherein the correlator is arranged to correlate the location of laser ablation with the one or more determined characteristics based on the speed of stack movement.

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