Energy storage device

Abstract

A method for manufacturing an energy storage device is disclosed. Such a method includes providing a first stack on a first side of a substrate and providing a second stack on a second side of the substrate opposite the first side of the substrate. In an example, the first groove and the third groove are formed in the first stack at different depths from each other, and the second groove and the fourth groove are formed in the second stack at different depths from each other. In other examples, the first groove is formed in the first stack and the second groove is formed in the second stack, substantially aligned with the first groove, but having a different depth than the first groove.

Description

Technical Field

[0001] The invention relates to a method for producing an energy storage device, an energy storage device and an intermediate structure for producing an energy storage device. Background Art

[0002] Energy storage devices such as solid-state thin-film batteries can be produced by forming a stack of layers on a substrate. The stack of layers typically includes a first electrode layer, a second electrode layer, and an electrolyte layer between the first electrode layer and the second electrode layer. The combination of the stack and substrate can then be cut into individual parts to form individual batteries.

[0003] It would be desirable to provide a method of manufacturing an energy storage device that is simpler or more efficient than known manufacturing methods. Summary of the invention

[0004] According to a first aspect of the present invention, there is provided a method for manufacturing an energy storage device, the method comprising:

[0005] providing a first stack on a first side of a substrate, the first stack comprising a first electrode layer, a second electrode layer, and a first electrolyte layer between the first electrode layer and the second electrode layer, the first electrode layer being closer to the first side of the substrate than the second electrode layer;

[0006] providing a second stack on a second side of the substrate opposite the first side of the substrate, the second stack comprising a third electrode layer, a fourth electrode layer, and a second electrolyte layer between the third electrode layer and the fourth electrode layer, the third electrode layer being closer to the second side of the substrate than the fourth electrode layer;

[0007] forming a first groove in a first side of the first stack, the first side of the first stack being opposite to a second side of the first stack, the second side of the first stack being in contact with the first side of the substrate, the first groove having a first depth;

[0008] forming a second groove in a first side of the second stack, the first side of the second stack being opposite to a second side of the second stack, the second side of the second stack being in contact with the second side of the substrate, the second groove having a second depth;

[0009] forming a third groove in the first side of the first stack, the third groove having a third depth different from the first depth; and

[0010] A fourth groove is formed in the first side of the second stack, the fourth groove having a fourth depth different from the second depth.

[0011] Forming the first and third grooves in the first side of the first stack allows the first stack to be processed from a single direction. Similarly, forming the second groove and the fourth groove in the first side of the second stack also allows the second stack to be processed from a single direction (e.g., opposite to the direction in which the first stack is processed). Therefore, this is conducive to mirror processing on opposite sides of the same substrate, which can occur simultaneously or in at least partially overlapping time intervals. Therefore, the method can be more efficient than other methods. For example, other situations in which stacks are processed from multiple directions to form grooves in the stack may not be easily adapted to double-sided processing such as in the method according to the first aspect of the present invention. In these other cases, the stack on the second side of the substrate may interfere with the formation of grooves in the first side of the substrate. However, the method according to the examples herein can eliminate such interference and simplify the formation of grooves in a double-sided structure, which, for example, includes two stacks on opposite sides of the same substrate. Therefore, this method allows a multi-stack energy storage device to be formed in an efficient manner. The method is scalable and can be performed as part of an efficient continuous manufacturing process (e.g., a roll-to-roll process).

[0012] Furthermore, by providing the first and second stacks on opposite sides of the same substrate, the ratio of active material to substrate can be increased compared to examples where the stacks are provided on only one side of the substrate. The energy storage fabrication can therefore have an increased energy density.

[0013] In the example, the first groove is substantially aligned with the second groove, and the third groove is substantially aligned with the fourth groove. By aligning the first groove and the second groove, and the third groove and the fourth groove, a multi-stack battery for an energy storage device can be formed more efficiently. For example, the multi-stack structure formed by the method according to the first aspect of the present invention can be divided into separate batteries or separate energy storage devices by cutting the multi-stack structure along a first axis corresponding to the first and second grooves and along a second axis corresponding to the third and fourth grooves. Therefore, the number of cutting operations can be reduced compared to other situations where the first groove and the second groove or the third groove and the fourth groove are not aligned with each other.

[0014] In the example, the first groove and the second groove are formed without cutting the substrate, the third groove is formed without cutting the first electrode layer, and the fourth groove is formed without cutting the third electrode layer. However, in other examples, the first groove is formed without cutting the first electrode layer, the second groove is formed without cutting the substrate, the third groove is formed without cutting the substrate, and the fourth groove is formed without cutting the third electrode layer. In both cases, the efficiency of the method can be improved. For example, a smaller amount of material can be removed during the formation of the groove. Therefore, the groove can be formed faster and more efficiently than in other cases where a large amount of material is removed.

[0015] In an example, the first depth is substantially the same as the second depth, and the third depth is substantially the same as the fourth depth. In such a case, different substances of the same active layer (e.g., different substances of the first or second electrode layer) may be exposed along the same side of the energy storage device after subsequent processing. This allows multiple substances of the same layer in different stacks (e.g., multiple anodes or multiple cathodes) to be connected in parallel, for example, using an electrical connector arranged on the side of the energy storage device on which each layer is exposed. This, for example, reduces the risk of short circuits compared to other situations where multiple substances of the same layer are exposed on different respective sides of the energy storage device.

[0016] In other examples, the first depth is substantially the same as the fourth depth, and the third depth is substantially the same as the second depth. With this arrangement, different active layers can be exposed along the same side of the energy storage device after subsequent processing. For example, an anode (e.g., which corresponds to a portion of the second electrode layer) and a cathode (e.g., which corresponds to a portion of the first electrode layer) can be exposed alternately along one side of the energy storage device. This provides greater flexibility for connecting the energy storage device to an external circuit. For example, this allows different active layers along the same side of the energy storage device to be connected in series, such as using an electrical connector arranged on a side of the energy storage device to which each layer is exposed. For example, if the anode and cathode are alternately exposed along that side of the energy storage device, a stacked anode can be connected to a different stacked cathode on that side of the energy storage device to connect the stacks in series.

[0017] In an example, at least one of the first depth of the first groove, the second depth of the second groove, the third depth of the third groove, or the fourth depth of the fourth groove is substantially perpendicular to the plane of the first side of the substrate. By forming the first, second, third, or fourth groove in this manner, subsequent deposition of electrically insulating material within the first, second, third, or fourth groove can be simplified compared to examples in which the groove is at an angle relative to the plane of the surface of the substrate. For example, such an arrangement of the grooves can facilitate or otherwise help the electrically insulating material move into the corresponding grooves and improve contact between the electrically insulating material and the exposed surface within the corresponding groove (e.g., the exposed surface of the first or second electrode layer). This can reduce the risk of short circuits during subsequent use of the energy storage device formed in this manner.

[0018] In the example, forming the first groove and forming the third groove use a first at least one laser beam directed to the first side of the substrate, and forming the second groove and forming the fourth groove use a second at least one laser beam directed to the second side of the substrate. This allows the grooves to be formed using a laser ablation process. Laser ablation can be performed quickly and is relatively easy to control, so that the depth of the groove can be precisely controlled.

[0019] In an example, the method includes folding a substrate to provide a multi-stack arrangement, the multi-stack arrangement comprising:

[0020] a first portion of a first stack on a first portion of a first side of a substrate;

[0021] a first portion of a second stack on a first portion of a second side of the substrate, the first portion of the second side of the substrate being opposite the first portion of the first side of the substrate, the first portion of the second stack overlapping the first portion of the first stack;

[0022] a second portion of the first stack on a second portion of the first side of the substrate, the second portion of the first stack overlapping the first portion of the first stack and the first portion of the second stack; and

[0023] A second portion of the second stack on a second portion of the second side of the substrate, the second portion of the second side of the substrate being opposite to the second portion of the first side of the substrate, the second portion of the second stack overlapping the first portion of the first stack, the first portion of the second stack, and the second portion of the first stack.

[0024] This multi-stack arrangement, for example, has improved energy density compared to other examples where there is a single stack per unit substrate.

[0025] In an example, after folding the substrate, the first groove is between the first portion of the first stack and the third portion of the first stack, the third portion of the first stack being on a third portion of the first side of the substrate, in substantially the same plane as the first portion of the first stack, and the method includes cutting the multi-stack arrangement along a longitudinal axis substantially aligned with the first groove. Thus, the number of cutting operations may be less than otherwise, thereby increasing the efficiency of the method.

[0026] In an example, the energy storage device is a first energy storage device, and cutting the multi-stack arrangement separates a first precursor of the first energy storage device from a second precursor of the second energy storage device. In such an example, the first precursor includes a first portion of the first stack, a first portion of the second stack, a second portion of the first stack, and a second portion of the second stack. Thus, this allows multiple energy storage devices to be formed from a single multi-stack arrangement. For example, a continuous manufacturing process can be used to form multiple energy storage devices. Therefore, the manufacturing efficiency of the energy storage device is higher compared to other methods of manufacturing a single energy storage device at a time (e.g., batch processing).

[0027] According to a second aspect of the present invention, there is provided a method for manufacturing an energy storage device, the method comprising:

[0028] providing a first stack on a first side of a substrate, the first stack comprising a first electrode layer, a second electrode layer, and a first electrolyte layer between the first electrode layer and the second electrode layer, the first electrode layer being closer to the first side of the substrate than the second electrode layer;

[0029] providing a second stack on a second side of the substrate opposite the first side of the substrate, the second stack comprising a third electrode layer, a fourth electrode layer, and a second electrolyte layer between the third electrode layer and the fourth electrode layer, the third electrode layer being closer to the second side of the substrate than the fourth electrode layer;

[0030] forming a first groove in a first side of the first stack, the first side of the first stack being opposite to a second side of the first stack, the second side of the first stack being in contact with the first side of the substrate, the first groove having a first depth; and

[0031] A second groove is formed in a first side of the second stack, substantially aligned with the first groove, the first side of the second stack being opposite to a second side of the second stack, the second side of the second stack being in contact with the second side of the substrate, the second groove having a second depth different from the first depth.

[0032] For the first aspect of the invention, the second aspect of the invention facilitates forming a multi-stack arrangement, wherein the first stack is arranged on a first side of the substrate and the second stack is arranged on a second side of the substrate. This allows the first stack and the second stack to be processed simultaneously with each other, which can improve the efficiency of forming the first stack and the second stack. In addition, compared to an example in which the stack is arranged on only one side of the substrate, the ratio of active material to substrate can be increased. The energy storage device can therefore have an increased energy density.

[0033] In addition, where the second depth of the second groove is different from the first depth of the first groove, after subsequent processing, the exposed surface within the second groove may include a surface of a different layer than the exposed surface within the first groove. For example, a cathode (e.g., corresponding to a portion of the first electrode layer) may be exposed within the first groove, while an anode (e.g., corresponding to a portion of the second electrode layer) may be exposed within the second groove. Due to the alignment between the first groove and the second groove, in this case, the exposed portions of the cathode and the anode may be aligned along the same side of the energy storage device. In this way, the cathode and the anode may be connected in series, for example using an electrical connector arranged on a side of the energy storage device on which each layer is exposed. In this way, the first and second stacks may be connected in series.

[0034] In an example, the first groove is formed without cutting the first electrode layer, and the second groove is formed without cutting the substrate. Such an example can be more efficient by removing a smaller amount of material, thereby allowing the groove to be formed faster.

[0035] In an example, forming the first groove uses a first at least one laser beam directed to a first side of the substrate and forming the second groove uses a second at least one laser beam directed to a second side of the substrate. This allows the grooves to be formed using a laser ablation process, which is generally fast and precise.

[0036] According to a third aspect of the present invention, there is provided a multi-stack structure for an energy storage device, the multi-stack structure comprising:

[0037] a first stack on a first side of a substrate, the first stack comprising:

[0038] a first electrode;

[0039] a second electrode; and

[0040] a first electrolyte between a first electrode and a second electrode, the first electrode being closer to the first side of the substrate than the second electrode;

[0041] a second stack on a second side of the substrate opposite the first side of the substrate, the second stack comprising:

[0042] a third electrode;

[0043] a fourth electrode; and

[0044] a second electrolyte between a third electrode and a fourth electrode, the third electrode being closer to the second side of the substrate than the fourth electrode;

[0045] a first electrical insulator in contact with the first exposed surface of the first electrode and the first exposed surface of the first electrolyte and not in contact with at least a portion of the first exposed surface of the second electrode;

[0046] a second electrical insulator in contact with the first exposed surface of the third electrode and the first exposed surface of the second electrolyte and not in contact with at least a portion of the first exposed surface of the fourth electrode;

[0047] a third electrical insulator in contact with the second exposed surface of the first electrode, the second exposed surface of the first electrolyte, and the second exposed surface of the second electrode; and

[0048] A fourth electrical insulator contacts the second exposed surface of the third electrode, the second exposed surface of the second electrolyte, and the second exposed surface of the fourth electrode.

[0049] As explained with reference to the first and second aspects of the invention, such a multi-stack structure, for example, has a larger ratio of active material to inert material. The active material of the energy storage device may include chemically active components of the energy storage device, such as electrodes and electrolytes. For example, the active material may include the material of the first and third electrodes, such as cathodes, and the material of the second and fourth electrodes, such as anodes. In contrast, the inert material of the energy storage device may include chemically inert components that do not participate in the storage or transfer of chemical energy. The inert material may be or include the material of the substrate. By having a larger ratio of active material to inert material, the energy density of the multi-stack structure may be greater than other structures having a smaller ratio of active material to inert material.

[0050] The first, second, third and fourth electrical insulators for example reduce the risk of a short circuit which might otherwise occur if the first and second electrodes or the third and fourth electrodes were in electrical contact with each other.

[0051] In examples, the first electrical insulator is substantially aligned with the second electrical insulator, and the third electrical insulator is substantially aligned with the fourth electrical insulator. However, in other examples, the first electrical insulator is substantially aligned with the fourth electrical insulator, and the third electrical insulator is substantially aligned with the second electrical insulator. In either case, further processing of the multi-stack arrangement can be simplified. For example, due to the alignment of the individual pairs of electrical insulators, the multi-stack arrangement can be provided with a relatively smooth or flat surface, which surface can be, for example, a side of the multi-stack arrangement. With this arrangement, subsequent deposition of conductive material for connecting the exposed portion of the electrode to an external circuit may be more direct than in other examples in which the surface of the multi-stack arrangement device is non-planar.

[0052] In the example, the first electrical insulator is arranged on the first side of the first stack, the second electrical insulator is arranged on the first side of the second stack, the third electrical insulator is arranged on the second side of the first stack opposite to the first side of the first stack, and the fourth electrical insulator is arranged on the second side of the second stack opposite to the second side of the second stack. Therefore, on the first side of the first stack, the first electrical insulator can insulate the first exposed surface of the first electrode (which can also be on the first side of the stack) from the first exposed surface of the second electrode. Similarly, on the second side of the stack, the second electrical insulator can insulate the second exposed surface of the second electrode (which can also be on the second side of the stack) from the second exposed surface of the first electrode. The third and fourth electrical insulators can similarly insulate the exposed surfaces of the third and fourth electrodes from each other. In this way, short circuits can be effectively prevented or reduced.

[0053] In an alternative example, the first electrical insulator is arranged on a first side of the first stack, the fourth electrical insulator is arranged on a first side of the second stack, the third electrical insulator is arranged on a second side of the first stack opposite to the first side of the first stack, and the second electrical insulator is arranged on a second side of the second stack opposite to the second side of the second stack. Such an example can also prevent or reduce short circuits.

[0054] In the example, at least one of the following:

[0055] The third electrical insulator overlaps the second exposed surface of the first electrode, and a plane of the second exposed surface of the first electrode is substantially parallel to a plane of the first side of the substrate; or

[0056] The fourth electrical insulator overlaps the second exposed surface of the third electrode, and a plane of the second exposed surface of the third electrode is substantially parallel to a plane of the second side of the substrate.

[0057] With this arrangement, the second exposed surface of the first electrode and the second exposed surface of the third electrode may each form a respective shelf or ledge onto which the electrically insulating material forming the third and fourth electrical insulators may be deposited directly.

[0058] In an example, the thickness of the substrate in a direction perpendicular to the plane of the first side of the substrate is substantially equal to or greater than at least one of the following: the first thickness of the first stack or the second thickness of the second stack in a direction perpendicular to the plane of the first side of the substrate. In this case, the multi-stack structure can be directly manufactured, for example, using the method according to the first or second aspect of the present invention. For example, the depth of the groove (which can then be at least partially filled with an electrically insulating material, for example to form an electrical insulator) can be more easily controlled. Compared with other methods in which the groove is formed by processing the same stack from different sides of the same substrate, the depth of the groove can be more easily controlled using the method according to the first or second aspect of the present invention (wherein each groove in the same stack is formed from the same side of the substrate). These other methods may be prone to causing the groove depth to deviate from the desired depth, where the thickness of the substrate is substantially the same as or greater than the thickness of the stack in which the groove is to be formed. However, by forming the groove from the same side, this deviation in the groove depth can be reduced.

[0059] According to a fourth aspect of the present invention, there is provided a multi-stack structure for an energy storage device, the multi-stack structure comprising:

[0060] a first stack on a first side of a substrate, the first stack comprising:

[0061] a first electrode;

[0062] a second electrode; and

[0063] a first electrolyte between a first electrode and a second electrode, the first electrode being closer to the first side of the substrate than the second electrode;

[0064] a second stack on a second side of the substrate opposite the first side of the substrate, the second stack comprising:

[0065] a third electrode;

[0066] a fourth electrode; and

[0067] a second electrolyte between a third electrode and a fourth electrode, the third electrode being closer to the second side of the substrate than the fourth electrode;

[0068] a first electrical insulator in contact with the exposed surface of the first electrode, the exposed surface of the first electrolyte, and the exposed surface of the second electrode; and

[0069] A second electrical insulator contacts the exposed surface of the third electrode and the exposed surface of the second electrolyte and is not in contact with at least a portion of the exposed surface of the fourth electrode.

[0070] As explained with reference to the third aspect of the invention, such a multi-stack structure has, for example, a greater energy density than a single-stack structure.

[0071] In an example, the first electrical insulator is substantially aligned with the second electrical insulator.In such a case, further processing of the multi-stack arrangement may be simplified, for example due to a flatter surface of the multi-stack arrangement.

[0072] In an example, the third electrical insulator overlaps the exposed surface of the first electrode, and the plane of the exposed surface of the first electrode is substantially parallel to the plane of the first side of the substrate. With this arrangement, the exposed surface of the first electrode can form a shelf or ledge on which the electrically insulating material forming the first electrical insulator can be directly deposited.

[0073] In an example, the thickness of the substrate in a direction perpendicular to the plane of the first side of the substrate is substantially equal to or greater than at least one of the following: the first thickness of the first stack or the second thickness of the second stack in a direction perpendicular to the plane of the first side of the substrate. Such a multi-stack structure can be manufactured with improved precision, for example, using the method according to the first or second aspect of the invention.

[0074] According to a fifth aspect of the present invention, there is provided an apparatus comprising: a first inkjet material deposition component arranged to deposit material on a first side of a stack for an energy storage device; a second inkjet material deposition component arranged to deposit material on a second side of the stack, the second side being opposite to the first side; and a plurality of rollers arranged to guide the movement of the stack between the first inkjet material deposition component and the second inkjet material deposition component so that the first side of the stack is presented as a top-down inkjet material deposition for material from the first inkjet material deposition component to the stack, and so that the second side of the stack is presented as a top-down inkjet material deposition for material from the second inkjet material deposition component to the stack.

[0075] Performing inkjet material deposition from the top down, such as inkjet printing, can allow materials to be accurately and efficiently deposited onto the stack.Even in the case where the stack includes layers on both sides of the substrate, ensuring that both sides of the stack are presented as top-down printing can allow materials to be accurately and efficiently deposited onto the stack.

[0076] In an example, the apparatus is arranged to perform the method according to the first aspect.

[0077] Other features will become apparent from the following description, given by way of example only, which refers to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0078] Figure 1 is a schematic diagram of a stack for an energy storage device according to an example;

[0079] Figure 2 It is used for processing according to the example Figure 1 A schematic diagram of an example of stacking to manufacture an energy storage device;

[0080] Figures 3a to 3e is a schematic diagram illustrating a method of manufacturing an energy storage device according to an example;

[0081] Figures 4a to 4f is a schematic diagram illustrating a method of manufacturing an energy storage device according to another example;

[0082] Figure 5 is a schematic diagram of an intermediate structure for manufacturing an energy storage device according to an example;

[0083] Figure 6 is a schematic diagram of an intermediate structure for manufacturing an energy storage device according to another example;

[0084] Figure 7 is a schematic diagram showing an example of processing of an intermediate structure in a roll-to-roll process;

[0085] Figure 8 is a schematic diagram showing another example of processing of an intermediate structure in a roll-to-roll process;

[0086] Fig. 9 is a schematic diagram showing a folded intermediate structure for an energy storage device according to an example;

[0087] Fig.10 It is shown Fig. 9 Schematic diagram of the cutting of the folded intermediate structure;

[0088] Fig.11 is shown by cutting Fig. 9 Schematic diagram of a multi-stacked structure formed by a folded intermediate structure shown;

[0089] Fig.12 is a schematic diagram showing an example of a portion of a precursor of an energy storage device; and

[0090] Fig.13 is a schematic diagram showing the arrangement of a deposition apparatus. DETAILED DESCRIPTION

[0091] Details of the methods, structures and devices according to the examples will become apparent with reference to the accompanying drawings, according to the examples. In this specification, many specific details of certain examples are set forth for the purpose of explanation. Reference to "example" or similar language in the specification means that a particular feature, structure or characteristic described in conjunction with the example is included in at least one example, but not necessarily in other examples. It should also be noted that certain examples are schematically described, in which certain features are omitted and / or must be simplified in order to facilitate explanation and understanding of the concepts underlying the examples.

[0092] Figure 1 A stack 100 of layers for an energy storage device is shown. For example, Figure 1 The stack 100 may be used as part of a thin film energy storage device having a solid electrolyte.

[0093] exist Figure 1 In the embodiment, stack 100 is on substrate 102. Substrate 102 is, for example, glass or polymer and can be rigid or flexible. Substrate 102 is generally planar. Figure 1 The stack 100 is shown as being in direct contact with the substrate 102, but in other examples, there may be one or more additional layers between the stack 100 and the substrate 102. Therefore, unless otherwise specified, references herein to an element being "on" another element should be understood to include direct or indirect contact. In other words, an element on another element may be contacting the other element, or not contacting the other element, but rather typically supported by one or more intermediate elements, but still located above or overlapping the other element.

[0094] Figure 1 The stack 100 includes a first electrode layer 104, an electrolyte layer 106, and a second electrode layer 108. Figure 1 In the example of FIG. 1 , the second electrode layer 108 is farther from the substrate 102 than the first electrode layer 104 , and the electrolyte layer 106 is located between the first electrode layer 104 and the second electrode layer 108 .

[0095] The first electrode layer 104 may serve as a positive current collecting layer. In such an example, the first electrode layer 104 may form a positive electrode layer (i.e., may correspond to a cathode during discharge of a battery of an energy storage device including the stack 100). The first electrode layer 104 may include a material suitable for storing lithium ions through a stable chemical reaction, such as lithium cobalt oxide, lithium iron phosphate, or an alkali metal polysulfide salt.

[0096] In alternative examples, there may be a separate positive current collecting layer that may be located between the first electrode layer 104 and the substrate 102. In these examples, the separate positive current collecting layer may include nickel foil; however, it will be appreciated that any suitable metal may be used, such as aluminum, copper, or steel, or metallized materials including metallized plastics, such as aluminum on polyethylene terephthalate (PET).

[0097] The second electrode layer 108 can be used as a negative current collector layer. In this case, the second electrode layer 108 can form a negative electrode layer (which can correspond to the anode during discharge of a battery of an energy storage device including the stack 100). The second electrode layer 108 may include lithium metal, graphite, silicon, or indium tin oxide (ITO). For the first electrode layer 104, in other examples, the stack 100 may include a separate negative current collector layer, which may be on the second electrode layer 108, and the second electrode layer 108 is between the negative current collector layer and the substrate 102. In examples where the negative current collector layer is a separate layer, the negative current collector layer may include nickel foil. However, it should be understood that any suitable metal can be used for the negative current collector layer, such as aluminum, copper or steel, or a metallized material including a metallized plastic, such as aluminum on polyethylene terephthalate (PET).

[0098] The first and second electrode layers 104, 108 are generally conductive. Therefore, current can flow through the first electrode layer 104 and the second electrode layer 108 due to the flow of ions or electrons through the first electrode layer 104 and the second electrode layer 108.

[0099] The electrolyte layer 106 may include any suitable material that is ionically conductive but is also an electrical insulator, such as lithium phosphorus oxynitride (LiPON). As described above, the electrolyte layer 106 is, for example, a solid layer and may be referred to as a fast ion conductor. The solid electrolyte layer may have a structure between a liquid electrolyte and a crystalline solid, where the liquid electrolyte, for example, lacks a regular structure and contains ions that can move freely. Crystalline materials, for example, have a regular structure with an ordered arrangement of atoms that may be arranged in a two-dimensional or three-dimensional lattice. The ions of a crystalline material are generally immobile and therefore may not be able to move freely throughout the material.

[0100] For example, stack 100 may be fabricated by depositing first electrode layer 104 on substrate 102. Electrolyte layer 106 is subsequently deposited on first electrode layer 104, and second electrode layer 108 is then deposited on electrolyte layer 106. Each layer of stack 100 may be deposited by flooding, which provides a simple and efficient way to produce highly uniform layers, although other deposition methods are possible.

[0101] Figure 1 The stack 100 can also be processed to make an energy storage device. Figure 2The schematic diagram shows the Figure 1 An example of processing of a stack 100 is shown.

[0102] exist Figure 2 , stack 100 and substrate 102 together form an intermediate structure 110 for manufacturing an energy storage device. In this example, intermediate structure 110 is flexible, allowing it to be wound around a roll 112 as part of a roll-to-roll manufacturing process (sometimes referred to as a reel-to-reel manufacturing process). Intermediate structure 110 can be gradually unwound from roll 112 and further processed.

[0103] exist Figure 2 In an example of , a groove may be formed through the intermediate structure 110 (e.g., through the stack 100) using a first laser 114. The first laser 114 is arranged to apply a laser beam 116 to the intermediate structure 110 to remove a portion of the intermediate structure 100, thereby forming the groove in the stack 100. This process may be referred to as laser ablation.

[0104] After forming the grooves, electrically insulating materials can be deposited in at least some of the grooves using a material deposition system 118. The material deposition system 118 fills at least some of the grooves with a liquid 120 such as an organic suspension liquid material, for example. The liquid 120 can then be solidified in the groove to form an electrically insulating plug in the groove. Electrically insulating materials can be considered non-conductive and can therefore conduct a relatively small amount of current when subjected to an electric field. Typically, electrically insulating materials (sometimes referred to as insulators) conduct less current than semiconductor materials or conductive materials. However, there is still a small amount of current flowing through the electrically insulating material under the influence of an electric field, because even insulators may include a small amount of charge carriers that carry current. In the examples herein, such a material can be considered electrically insulating, where the material is electrically insulating enough to perform the function of an insulator. For example, this function can be performed in the case where the material fully insulates one element from another element to avoid a short circuit.

[0105] Reference Figure 2 After depositing the electrically insulating material, the intermediate structure 110 is cut along at least some of the grooves to form individual cells for an energy storage device. Figure 2 In the example shown, hundreds or potentially thousands of cells may be cut from a roll of intermediate structure 110, thereby allowing for the manufacture of multiple batteries in an efficient manner.

[0106] exist Figure 2In the embodiment of the present invention, a cutting operation is performed using a second laser 122, which is arranged to apply a laser beam 124 to the intermediate structure 110. Each cut may, for example, pass through the center of the insulating plug, so that the plug is divided into two parts, each part forming a protective covering on the exposed surface including the edge to which it has been attached. Cutting through the entire stack in this way forms the exposed surfaces of the first and second electrode layers 104, 108.

[0107] Although not in Figure 2 1 and 2 (illustratively only), but it should be understood that after depositing the electrically insulating material, the intermediate structure 110 can be folded back on itself to form a z-folded structure having at least ten layers, possibly hundreds of layers, and possibly even thousands of layers, with each insulating plug aligned. The laser cutting process performed by the second laser 122 can then be used to cut the z-folded structure for each of the aligned plug groups in a single cutting operation.

[0108] After cutting the battery, electrical connectors can be arranged along opposite sides of the battery so that a first electrical connector on one side of the battery contacts the first electrode layer 104 (which can be considered to form the first electrode after the battery has been separated from the rest of the intermediate structure 110), but is prevented from contacting other layers by an electrically insulating material. Similarly, a second electrical connector on the opposite side of the battery can be arranged to contact the second electrode layer 108 (which can be considered to form the second electrode after the battery has been separated from the rest of the intermediate structure 110), but is prevented from contacting other layers by an insulating material. Thus, the insulating material can reduce the risk of short circuits between the first and second electrode layers 104, 108 and other layers in each battery. The first and second electrical connectors can be, for example, metal materials applied to the edge of the stack 110 (or to the edge of the intermediate structure 110) by sputtering. Thus, the batteries can be effectively and easily connected in parallel.

[0109] Figures 3a to 3e (collectively, FIG. 3 ) is a schematic diagram illustrating features of an example method of manufacturing an energy storage device. Figure 1 The features of FIG. 3 that are identical to the corresponding features are marked with the same reference numerals. The corresponding description shall apply. Figures 3a to 3e In each of the , the same reference numerals are used to denote the same elements. However, for clarity, Figures 3a to 3e Not all components are labeled in each of the Figures 3a to 3e The processing is applied sequentially to the same stack, so there can be Figures 3a to 3e One of but not in Figures 3a to 3e Another element marked in .

[0110] exist Figure 3a3 includes providing a stack 100 on a surface 126 of a substrate 102. In this example, the stack 100 and the surface 102 are Figure 1 However, in other examples, the method according to FIG. 3 can be applied to Figure 1 Other stacks with different structures or layers shown.

[0111] The layers of stack 100 (in this case, first electrode layer 104, electrolyte layer 106, and second electrode layer 108) can be arranged sequentially. However, in other examples, a partially assembled substrate can be provided. For example, the stack including the first electrode layer, the electrolyte layer, and the second electrode layer can be arranged on the substrate before providing the substrate.

[0112] exist Figure 3a 1, a first groove 128a, a second groove 128b, and a third groove 128c are formed in a first side 130 of the stack 100. The first, second, and third grooves 128a-128c may be collectively referred to using reference numeral 128. The first side 130 of the stack 100 is opposite to the second side of the stack 100, which is on the surface 126 of the substrate 102. Thus, the first side 130 of the stack 100 is, for example, an exposed surface of the stack 100 that is not in contact with or covered by another component. In this example, the first side 130 of the stack 100 is an upper surface of the stack 100, although this need not be the case in other examples.

[0113] The groove is, for example, a channel, groove or trench that may be continuous or discontinuous. In some examples, the groove may be elongated. The groove may extend partially through the layers of stack 100, or extend through all layers of stack 100 to expose a portion of substrate 102. The groove provides, for example, a channel for subsequent deposition of other materials such as liquids or other fluids.

[0114] exist Figure 3a In the embodiment, the first groove 128a has a first depth d1, the second groove 128b has a second depth d2, and the third groove 128c has a third depth d3. The first depth d1 is substantially the same as the third depth d3, while the first depth d1 is different from the second depth d2. Figure 3aEach depth d1, d2, d3 of the groove 128 is intercepted in the direction of the plane of the surface 126 of the substrate 102. A direction can be considered to be substantially perpendicular to a plane, where the direction is completely perpendicular to the plane or approximately perpendicular to the plane, such as within a measurement tolerance or within an angle deviation of plus or minus 5, 10, or 20 degrees from the vertical direction. In this case, the groove 128 can be considered to extend or otherwise elongated in the direction. In these cases, the groove 128 can also be elongated in a different direction, such as elongated in a direction perpendicular to the direction (for example, refer to Figure 3a For example, the central axis of the groove extending from the mouth or opening of the groove toward the base of the groove can be in a direction substantially perpendicular to the plane of the surface 126 of the substrate 102.

[0115] However, in other examples, some or all of the grooves 128 may extend along axes that are at an angle different from substantially perpendicular to the plane of the surface 126 of the substrate 102. For example, some or all of the grooves 128 may have inner surfaces that are at an acute angle (e.g., less than 90 degrees) relative to the plane of the surface 126 of the substrate 102. However, in contrast to examples such as Figure 3a This may make it more difficult to subsequently deposit material within recess 128, as compared to the example of Figure 3a In the embodiment of the present invention, the inner surface of the groove 128 is substantially perpendicular to the plane of the surface 126 of the substrate 102 .

[0116] The first, second and third grooves 128a, 128b, 128c divide the layers of the stack 100 into different parts. Figure 3a , the first groove 128a separates the first electrode layer 108 into a first portion 108a and a second portion 108b. The first groove 128a also separates the electrolyte layer 106 into a first portion 106a and a second portion 106b. The second groove 128b separates the second portion 108b of the first electrode layer 108 from a third portion 108c of the first electrode layer 108. The second groove 128b also separates the second portion 106b of the electrolyte layer 106 from the third portion 106c of the electrolyte layer 106. In addition, the second groove 128b separates the second electrode layer 104 into a first portion 104a and a second portion 104b. Figure 3a , the third groove 128c separates the third portion 108c of the first electrode layer 108 from the fourth portion 108d of the first electrode layer 108, and separates the third portion 106c of the electrolyte layer 106 from the fourth portion 106d of the electrolyte layer 106. Unlike the second groove 128b, neither the first groove 128a nor the third groove 128c separates a portion of the second electrode layer 104.

[0117] exist Figure 3a, the first groove 128a has a first surface that includes the first exposed surface 132a of the second electrode layer 108. In this example, the first exposed surface 132a of the second electrode layer 108 is the surface of the first portion 108a of the second electrode layer 108. However, the first surface of the first groove 128a also includes the exposed surface of the second portion 108b of the second electrode layer 108 and the exposed surfaces of the first and second portions 106a, 106b of the electrolyte layer 106. The first surface of the first groove 128a additionally includes the exposed surface of the first portion 104a of the first electrode layer 104, which in this example is the upper surface of the first portion 104a of the first electrode layer 104. Therefore, in this example, the first groove 128a is formed through the second electrode layer 108 and the electrolyte layer 106. Therefore, the exposed surfaces of the second electrode layer 108 and the electrolyte layer 106 form the sides of the first groove 128a, while the exposed surface of the first electrode layer 104 forms the base or bottom area of ​​the first groove 128a. The first groove 128 a does not extend through the first electrode layer 104 or the substrate 102 .

[0118] The exposed surface of the groove is, for example, a surface that is not covered or otherwise in contact with another layer after the groove is formed. Thus, for example, after the groove is formed, the exposed surface is, for example, not covered, exposed, or otherwise displayed. The exposed surface can, for example, correspond to a wall, side, sidewall, or side of the groove. Thus, the exposed surface can be or include any surface within the groove that is not covered. For example, the exposed surface can be or include a vertical wall of the groove or a generally upwardly extending inner surface of the groove that extends in an upward direction relative to the substrate 102. Figure 3a This is the case in , where the first surface of the first groove 128a (e.g., the exposed surface of the first groove 128a) includes the sides of the first and second portions 108a, 108b of the first electrode layer 108 and the sides of the first and second portions 106a, 106b of the electrolyte layer 106. Alternatively, the exposed surface can be or include a horizontal wall of the groove or a wall or other surface of the groove that extends in a plane that is generally parallel to the horizontal plane or the plane of the surface 126 of the substrate 102. For example, the exposed surface can be or include a horizontal bottom surface of the groove, which is, for example, the deepest surface of the groove, which can be closest to the substrate 102. In other examples, the groove can include one or more shelf or ledge portions, which can extend in a plane that is generally parallel to the horizontal plane or the plane of the substrate.

[0119] The second groove 128b has a second surface that includes an exposed surface 134 of the first electrode layer 104. In this example, the exposed surface 134 of the first electrode layer 104 is a surface of the first portion 104a of the first electrode layer 104 (in this example, a surface of a side of the first portion 104a of the first electrode layer 104 that extends away from the plane of the surface 126 of the substrate 102). However, the second surface of the second groove 128b also includes exposed surfaces of the second and third portions 106b, 106c of the electrolyte layer 106 and exposed surfaces of the second and third portions 108b, 108c of the second electrode layer 108. Therefore, in this example, the second groove 128b is formed through the second electrode layer 108, the electrolyte layer 106, and the first electrode layer 104, which, for example, form the side of the second groove 128b. Although Figure 3a The surface 126 of the substrate 102 corresponds to the base of the second groove 128b, but the second groove 128b does not extend through the substrate 102. The second groove 128b is located between the first groove 128a and the third groove 128c.

[0120] The third groove 128c has a third surface, which includes the second exposed surface 132b of the second electrode layer 108. In this example, the second exposed surface 132b of the second electrode layer 108 is the surface of the third portion 108c of the second electrode layer 108. However, the third surface of the third groove 128c also includes the exposed surface of the third portion 106c of the electrolyte layer 106 and the exposed surfaces of the fourth portions 108d, 106d of the second electrode layer 108 and the electrolyte layer 106. The third surface of the third groove 128c also includes the exposed surface of the second portion 104b of the first electrode layer 104, which corresponds to the base of the third groove 128c, for example. Therefore, in this example, the third groove 128c is formed through the second electrode layer 108 and the electrolyte layer 106, which, for example, form the side of the third groove 128c. However, the third groove 128c does not extend through the first electrode layer 104 and the substrate 102.

[0121] Since the first depth d1 of the first groove 128a and the third depth d3 of the third groove 128c are different from the second depth d2 of the second groove 128b, the second groove 128b extends through the first electrode layer 104, while the depths of the first groove 128a and the third groove 128c are not enough to extend through the first electrode layer 104. This exposes the side surface of the second electrode layer 108 in the first groove 128a and the third groove 128c (which can be considered as the inner surface or sidewall of the first groove 128a and the third groove 128c). The side surface of the first electrode layer 104 is not exposed in the first groove 128a and the third groove 128c. On the contrary, the upper surface of the first electrode layer 104 forms the base of the first groove 128a and the third groove 128c. However, the side surface of the first electrode layer 104 is exposed in the second groove 128b that is deeper than the first groove 128a and the third groove 128c. However, in other examples, the side surface of the same layer can be exposed in each groove, and the side surfaces of different parts of the same layer can be exposed in different grooves. However, in this case, the first groove and the third groove may have substantially the same depth as each other, but be different from the depth of the second groove.

[0122] exist Figure 3a In the embodiment, the first groove 128a is spaced apart from the second groove 128b and is substantially parallel to the second groove 128b, and the second groove 128b is spaced apart from the third groove 128c and is substantially parallel to the third groove 128c. When the two grooves are completely parallel to each other or within the manufacturing tolerance range, or are parallel to each other within a range of less than 20 degrees, 15 degrees, 10 degrees or 5 degrees, the two grooves can be considered to be substantially parallel to each other. In other words, the first, second and third grooves 128 extend in substantially the same direction as each other. This can simplify the formation of the first, second and third grooves 128.

[0123] exist Figure 3a In the embodiment, the groove 128 has a substantially constant cross-section or a uniform cross-section. The cross-section of the groove is, for example, taken in a direction perpendicular to the depth of the groove and can therefore correspond to the width of the groove. Figure 3aIn the embodiment of the present invention, the groove 128 is cylindrical. However, in other examples, the groove may have a different shape. For example, the cross-section of the groove may increase or decrease in size away from the base of the groove, or the size may be uneven. Some or all of the grooves 128 may have substantially the same width as each other, such as exactly the same width or the same width within a manufacturing tolerance, or have a deviation of less than 20%, 15%, 10% or 5%. It may be more direct to manufacture grooves 128 with the same width as each other rather than different widths. For example, this can eliminate the need to adjust the manufacturing equipment between the formation of adjacent grooves, otherwise it may be necessary to form grooves of different widths. The width of the groove can be intercepted in a direction parallel to the plane of the surface 126 of the substrate 102, which direction can be perpendicular to the depth of the groove. However, in other examples, one or more grooves may have a width and / or shape different from another groove.

[0124] In e.g. Figure 3a In the example of, the first distance D1 between the first groove 128a and the second groove 128b in the direction parallel to the plane of the surface 126 of the substrate 102 is substantially the same as the second distance D2 between the second groove 128b and the third groove 128c in the same direction. For example, two distances are exactly the same, within the measurement uncertainty, or within 20%, 15%, 10% or 5% of each other, and can be considered to be substantially the same. With this arrangement, the grooves 128 can be made more directly than in other cases where the grooves 128 are formed at irregular intervals. In addition, this can make it easier to align the grooves with each other in a z-folded arrangement.

[0125] Some or all of the grooves may be formed using laser ablation. "Laser ablation" may refer to the removal of material from the stack 100 using a laser-based process. The removal of material may include any of a number of physical processes. For example, the removal of material may include (but is not limited to) melting, melt expulsion, vaporization (or sublimation), photon decomposition (single photon), photon decomposition (multi-photon), mechanical shock, thermomechanical shock, other shock-based treatments, surface plasma processing, and removal by evaporation (ablation). Laser ablation, for example, involves irradiating the surface of one or more layers to be removed with a laser beam. For example, this results in a portion of one or more layers being removed. The amount of layer removed by laser ablation can be controlled by controlling the properties of the laser beam, such as the wavelength of the laser beam or the pulse length of a pulsed laser beam. Laser ablation generally allows the formation of grooves to be controlled in a direct and rapid manner. However, in other examples, alternative methods may be used to form some or all of the grooves, such as photolithography.

[0126] In an example using laser ablation, the groove 128 may be formed using at least one laser beam directed to a first side of the substrate 102, which corresponds to, for example, a surface 126 of the substrate 102 on which the stack 100 is arranged. For example, the at least one laser beam may be directed toward the first side 130 of the stack 100. By directing the at least one laser beam toward the first side 130 of the stack 100, the at least one laser beam may thus be directed toward the first side of the substrate 102. In order to direct the at least one laser beam toward the first side of the substrate 102, the laser arranged to generate the at least one laser beam may itself be located at the first side of the substrate 102 (e.g., facing the first side 130 of the stack 100). Alternatively, although the at least one laser beam may be located at a different location, it may still be directed to the first side of the substrate 102 using a suitable optical device. For example, the at least one laser beam may be generated using a laser ablation system that includes a laser and an optical element, such as a mirror or other reflector, to deflect the at least one laser beam generated by the laser toward the first side of the substrate 102.

[0127] As such, the groove 128 may be formed by applying at least one laser beam from a single side of the stack 100. This may simplify the formation of the groove 128 compared to a case where the laser beam is applied from different respective sides of the stack 100.

[0128] from Figure 3a As can be seen, the first groove 128a, the second groove 128b, and / or the third groove 128c can be formed without cutting the substrate 102. In an example, the substrate 102 can be relatively thick compared to the stack 100. For example, the thickness of the substrate 102 in a direction perpendicular to the plane of the surface 126 of the substrate 102 is substantially the same as or greater than the thickness of the stack 100 in the same direction, where substantially the same, for example, means that the thickness is exactly the same, the same within a manufacturing tolerance range, or is substantially similar, such as within 20%, 15%, 10%, or 5% of each other. In this case, it may be more direct to control the depth of the groove by cutting the groove from the first side 130 of the stack 100 without cutting the substrate 102 than cutting the groove through the substrate 102 into the stack 100.

[0129] exist Figure 3a In the embodiment, the first groove 128a and the third groove 128c are formed without cutting the first electrode layer 108 and the substrate 102. The second groove 128b is formed without cutting the substrate 102. This improves the formation efficiency of the groove 128, for example, while still producing a groove 128 having a shape or size suitable for forming an energy storage device, compared to other examples in which additional material is removed.

[0130] exist Figure 3bIn the embodiment of the present invention, the electrically insulating material 136 is deposited in the first, second and third grooves 128 (although in some cases, the electrically insulating material may not be deposited in one or more grooves 128). The electrically insulating material 136 can be provided as a first liquid, for example using an inkjet material deposition process (such as an inkjet printing process). This involves, for example, ejecting or otherwise propelling droplets of the electrically insulating material 136 from a nozzle into the grooves 128. The electrically insulating material 136 can be an ink, such as a dielectric ink. A suitable dielectric ink is DM-INI-7003, available from Dycotec Materials Ltd., Unit 12 Star West, Westmead Industrial Estate, Westlea, Swindon, SN5 7SW, UK. In general, the electrically insulating material 126 can be any suitable dielectric material. The dielectric material is, for example, an electrical insulator, which can be polarized when an electric field is applied. Such dielectric materials also typically have a low electrical conductivity. Although in Figure 3b In the embodiment shown in FIG. 1 , the same electrically insulating material 136 is deposited in each recess 128 , but it should be understood that in other examples, different electrically insulating materials may be deposited in one or more recesses 128 .

[0131] An electrically insulating material 136 is deposited in the first groove 128a to insulate the first exposed surface 132a of the second electrode layer 108 from the first electrode layer 104. Similarly, an electrically insulating material 136 is deposited in the second groove 128b to insulate the exposed surface 134 of the first electrode layer 104 from the second electrode layer 108. An electrically insulating material 136 is deposited in the third groove 128c to insulate the second exposed surface 132b of the second electrode layer 108 from the first electrode layer 104. In this way, the risk of a short circuit between the first electrode layer 104 and the second electrode layer 108 can be reduced.

[0132] After providing the electrically insulating material 136 in the second groove 128b, a portion of the electrically insulating material 136 may be removed. Figure 3c 128, or a different device or system that still applies the same process as that used to form recess 128, to remove the portion of electrically insulating material 136. For example, laser ablation may be used to remove the portion of electrically insulating material 136. However, other methods are also possible. For example, as will be appreciated by a skilled person, different methods may be used to create recess 128 and remove a portion of electrically insulating material 136.

[0133] By removing a portion of the electrically insulating material 136, a third exposed surface 138 of the second electrode layer 108 is exposed. Figure 3cIn FIG. 1 , the third exposed surface 138 of the second electrode layer 108 is a surface of the third portion 108 b of the second electrode layer 108 , but this is only an example. Figure 3c In the example of FIG. 1 , in addition to exposing the surface of the second portion 108 b of the second electrode layer 108, the surface of the third portion 108 c of the second electrode layer 108 is also exposed (although this need not be the case). A conductive material may then be deposited to contact the third exposed surface 138 of the second electrode layer 108 to connect the second electrode layer 108 to an external circuit.

[0134] After deposition of the electrically insulating material 136, a cutting process may be applied, such as Figure 3d As shown. Figure 3d In the example, the intermediate structure of the stack 100 and the substrate 126 is cut along a first axis 140a aligned with the first groove 128a, a second axis 140b aligned with the second groove 128b, and a third axis 140c aligned with the third groove 128c. These axes are collectively represented by the reference numeral 140. In this example, each of the axes 140 is aligned with the center of the corresponding groove 128, but in other cases, such axes may not be aligned in this manner. As shown in reference Figure 2 It is noted that the cutting operation can be performed using a laser, but this is merely an example. By cutting the intermediate structure in this way, the intermediate structure can be separated into individual cells.

[0135] like Figure 3d As shown, cutting the intermediate structure allows the formation of cells 142 for energy storage devices, such as Figure 3e As shown. Figure 3e 142a-142e, four cells 142a-142e are formed, but generally a large number of cells may be formed from the stack 100. The first cell 142a includes a first portion 108a of the second electrode layer 108 (considered to correspond to the second electrode), a first portion 106a of the electrolyte layer 106 (which may be considered to correspond to the electrolyte), a first portion 104a of the first electrode layer 104 (which may be considered to correspond to the first electrode), and a first portion 102a of the first substrate 102. The second, third, and fourth cells 142b, 142c, 142d include similar layers to the first cell 142a. Components of the second, third, and fourth cells 142b, 142c, 142d that are similar to corresponding components of the first cell 142a are indicated with the same reference numerals, but are respectively appended with "b", "c", or "d" instead of "a".

[0136] exist Figure 3e In the embodiment, the first electrical insulator is in contact with an exposed surface of a portion of the first electrode layer 104 and an exposed surface of a portion of the electrolyte layer 106, but is not in contact with at least a portion of an exposed surface of a portion of the second electrode layer 108. Figure 3eThe second electrical insulator is denoted by reference numeral 144 and appended with "a", "b", "c" or "d" depending on whether it is associated with the first, second, third or fourth battery 142a-142d, respectively. The second electrical insulator is in contact with an exposed surface of a portion of the second electrode layer 108 and an exposed surface of a portion of the electrolyte layer 106, but not in contact with at least a portion of the exposed surface of the first electrode layer 104. The second electrical insulator is Figure 3e denoted by reference numeral 146 and appended with an "a", "b", "c" or "d" depending on whether it is associated with the first, second, third or fourth battery 142a-142d, respectively.

[0137] exist Figure 3e , the first cell 142a and the fourth cell 142d include the second electrical insulator 146a, 146d, but lack the first electrical insulator. However, the first cell 142a and the fourth cell 142d may be further processed to add the first electrical insulator, which may be similar to the first electrical insulator 144b, 144c of the second and third cells 142b, 142c.

[0138] The functions of the first electrical insulator 144b and the second electrical insulator 146b will now be explained with reference to the second battery 142b. Figure 3e , the first electrical insulator 144b of the second battery 142b contacts the exposed surface of the second portion 104b of the first electrode layer 104b and the exposed surface of the second portion 106b of the electrolyte layer 106. Thus, the first electrical insulator 144b insulates the second portion 104b of the first electrode layer 104b from the second portion 108b of the second electrode layer 108b. The second electrical insulator 146b of the second battery 142b also insulates the second portion 104b of the first electrode layer 104b from the second portion 108b of the second electrode layer 108b. However, the second electrical insulator 146b of the second battery 142b achieves this by contacting the exposed surface of the second portion 106b of the electrolyte layer 106 with the exposed surface of the second portion 108b of the second electrode layer 108.

[0139] In this example, the first electrical insulator 144b is arranged on a first side of the second battery 142b, and the second electrical insulator 146b is arranged on a second side of the second battery 142b opposite the first side. The side of the battery corresponds to the side of a stack of batteries, for example. It can be considered that the electrical insulator is arranged on the side of the battery or stack, wherein the electrical insulator contacts at least a portion of the exposed surface of the side of the battery or stack. For example, the electrical insulator can extend along the side of the battery or stack (although it is not required). In, for example Figure 3eIn an example of , the first side of the battery or stack and the second side of the battery or stack may each be substantially perpendicular to the plane of the surface 126 of the substrate 102. In this case, the first side or the second side of the battery or stack itself need not be planar, but may have a non-planar surface. However, the first or second side may be substantially or approximately perpendicular to the plane of the surface 126, such that the center plane of the first or second side is precisely, within manufacturing tolerances, or within 20 degrees, 15 degrees, 10 degrees, or 5 degrees perpendicular to the plane of the surface. In this case, the first or second electrical insulator 144b, 146b may extend substantially away from the surface 126 of the substrate 102. For example, the first or second electrical insulator 144b, 146b may extend approximately vertically to cover a portion of the side of the stack of second batteries 142b.

[0140] By this arrangement, the exposed surface of the second portion 104b of the first electrode layer 104 of the second battery 142b remains uncovered by the second electrical insulator 146b. The exposed surface of the second portion 108b of the second electrode layer 108 of the second battery 142b is also not covered by the first electrical insulator 144b. In this way, the exposed portions of the first electrode layer 104 and the second electrode layer 108 are on the opposite side of the second battery 142b. This allows the first electrode layer 104 and the second electrode layer 108 to be connected to an external circuit by arranging a conductive material on the opposite side of the second battery 142b and contacting the exposed portions of the first electrode layer 104 and the second electrode layer 108. Therefore, this reduces the risk of a short circuit between the first electrode layer 104 and the second electrode layer 108.

[0141] Figure 3e The third battery 142c is a mirror image of the second battery 142b. In this way, Figure 3c The second groove 128b may be filled with an electrically insulating material 136, which after being cut and separated into two parts forms a first electrical insulator 144b, 144c of the second and third batteries 142b, 142c. The third battery 142c may be connected to an external circuit similarly to the second battery 142b.

[0142] Similar to Figure 3e Multiple cells of battery 142 can be connected in parallel to form a multi-battery energy storage device. For example, a first electrical connector can be used to connect each of the multiple first electrode layers to each other, and a second electrical connector can be used to connect each of the multiple second electrode layers to each other. Thus, the first electrical connector and the second electrical connector can provide contact points for terminals of the energy storage device. For example, the first electrical connector and the second electrical connector can provide contact points for the negative terminal and the positive terminal of the energy storage device, respectively. The negative terminal and the positive terminal can be electrically connected across a load to power the load, thereby providing a multi-battery energy storage device.

[0143] Figures 4a to 4f (collectively referred to as FIG. 4 ) is a schematic diagram illustrating a method of manufacturing an energy storage device according to another example. Figures 3a to 3e Similar features of FIG. 4 are labeled with the same reference numerals increased by 100. The corresponding description shall apply. Figures 4a to 4f In each of the , the same reference numerals are used to denote the same elements. However, for clarity, Figures 4a to 4f Not all components are labeled in each of the Figures 4a to 4f The processing is applied sequentially to the same stack, so there can be Figures 4a to 4f One of but not in Figures 4a to 4f Another element marked in .

[0144] exist Figure 4a , a stack 200 is provided on a substrate 202. The stack 200 includes a first electrode layer 204, an electrolyte layer 206, and a second electrode layer 208. However, the stack 200 also includes another series of layers on top of the second electrode layer 208. In this example, the another series of layers includes two further electrolyte layers 206', 206", another first electrode layer 204' and another second electrode layer 208'. The first further electrolyte layer 206' separates the another first electrode layer 204' from the second electrode layer 208. The second further electrolyte layer 206" separates the another second electrode layer 208' from the first electrode layer 204'. Elements of FIG. 4 having the same reference numerals but with an apostrophe ' or double apostrophe '" attached may be the same as corresponding elements without such attachment. The corresponding description should be adopted.

[0145] exist Figure 4b 3, first, second and third precursor grooves 148a, 148b, 148c are formed on a first side of the stack 200. The first, second and third precursor grooves 148a, 148b, 148c may be collectively referred to as precursor grooves 148. Similar to FIG. 3, the first side of the stack 200 is, for example, opposite to the second side of the stack 200, which contacts the surface 226 of the substrate 202. Precursor grooves are grooves that are, for example, formed and subsequently subjected to further processing (e.g., widening or partially filling with other elements) to form subsequent grooves. Precursor grooves may be formed using the same or similar methods as those used to form the grooves 128 of FIG. 3. For example, laser ablation or an alternative process such as photolithography may be used to form the precursor grooves.

[0146] Figure 4b The precursor grooves 148 are formed to have substantially the same depth as each other. This can simplify the formation of the precursor grooves 148. However, in other examples, one or more precursor grooves can be formed to have a different depth than the other precursor grooves. Figure 4c4 , each precursor groove 148 is formed to pass through another second electrode layer 208', a second another electrolyte 206", another first electrode layer 204', a first another electrolyte layer 206', a second electrode layer 208, an electrolyte layer 206 and a first electrode layer 204. However, in other examples, the precursor groove 148 can be formed to pass through a different layer. In addition, in some cases, the stack 200 can include different layers from the stack 200 of FIG. 4. For example, the first another electrolyte layer 206' between the second electrode layer 208 and the another first electrode layer 206' can be omitted. Instead, a different layer (such as an insulating layer) can separate the second electrode layer 208 from the another first electrode layer 206'.

[0147] In such Figure 4b In an example of , the cross-section of the precursor groove 148 may have a stepped shape, wherein the width of the precursor groove increases toward the mouth of the precursor groove (eg, in a direction away from the substrate 202). Figure 4d As shown, this allows certain layers to be uncovered or otherwise exposed, for example for subsequent connection to conductive materials. Figure 4b The shape of the precursor groove 148 is only an example. In other examples, the precursor groove 148 can have different shapes and / or sizes. For example, similar to Figure 3a In contrast to the grooves 128 , some or all of the precursor grooves 148 may alternatively have a constant cross-section.

[0148] Figure 4c An electrically insulating material 236 is shown provided in the precursor recess 148. Figure 3b Electrically insulating material 236 is provided as described.

[0149] After providing the electrically insulating material 236, a groove 228 similar to the groove 128 of FIG. 3 may be provided. Figure 4d Schematically illustrated in FIG. 2 , which shows the formation of a first groove 228 a and a second groove 228 b (although it should be understood that the third groove can be formed similarly to the formation of the first groove 228 a ).

[0150] exist Figure 4d In the embodiment, first groove 228a is formed through the electrically insulating material 236 in first precursor groove 148a. Second groove 228b is formed through the electrically insulating material in second precursor groove 148b. Figure 4d , but it should be understood that the third groove can be formed through the electrically insulating material 236 in the third precursor groove 148c in a manner similar to the formation of the first groove 228a.

[0151] The electrically insulating material 236 may be removed to form the first and second recesses 128a, 128b of FIG. 3 in a manner similar to the removal of the electrically insulating material 136 to form the first and second recesses 128a, 128b of FIG. Figure 4d For example, the first groove 228a and the second groove 228b may be formed by laser ablation of a portion of the electrically insulating material 236 or by removing a portion of the electrically insulating material 236 using a different technique.

[0152] The first recess 228a can be formed by first removing the first portion of the electrically insulating material 236 in the first region R1 of the first precursor recess 148a. After removing the first portion of the electrically insulating material 236, the electrically insulating material can be separated into first electrical insulators 244a, 244b, which contact the surfaces of the first and second portions of the electrolyte layers 206a, 206b and the surfaces of the first and second portions of the first electrode layers 204a, 204b. In this way, the first electrical insulators 244a, 244b electrically insulate the first and second electrode layers 204, 208 from each other.

[0153] Subsequently, the first recess 228a can be widened by removing a second portion of the electrically insulating material 236 in the second region R2 of the first precursor recess 148a. The second region R2 is wider than the first region R1, for example, in a direction parallel to the plane of the surface 226 of the substrate 202.

[0154] exist Figure 4d In the example of , the second region R2 is wide enough so that the removal of the second portion of the electrically insulating material 236 in the second region R2 exposes the surfaces of the first and second portions 208a, 208b of the second electrode layer 208 within the first recess 228a. In this way, the first surface of the first recess 228a includes the first exposed surface of the second electrode layer 208, which in this case is the exposed surface of the first portion 208a of the second electrode layer 208.

[0155] In this way, the widening of the first groove 228a causes the second electrical insulators 246a, 246b to contact the surfaces of the first and second parts 206a', 206b' of the first further electrolyte layer 206, respectively, within the first groove 228a. The second electrical insulators 246a, 246b also contact the surfaces of the first and second parts 204a', 204b' of the further first electrode layer 204, respectively, within the first groove 228a. The second electrical insulators 246a, 246b also remain in contact with the surfaces of the first and second parts 206a", 206b" of the second further electrolyte layer 206", respectively, within the first groove 228a. This electrically insulates the first and second parts 204a', 204b' of the further first electrode layer 204' from the first and second parts 208a, 208b of the second electrode layer 208. In this way, the surfaces of the first and second parts 204a', 204b' of the further first electrode layer 204 (e.g., the surfaces of the further first electrode layer 204 facing the first groove) The first portion 208a of the second electrode layer 208 is insulated from the first groove 228a by the electrically insulating material 236. Similarly, the surfaces of the first and second portions 208a', 208b' of the other second electrode layer 208 (e.g. corresponding to the side or side of the other first electrode layer 204 facing the first groove 228a) are insulated from the first groove 228a by the electrically insulating material 236. This surface of the first portion 208a' of the other second electrode layer 208 may be referred to as a first exposed surface of the other second electrode layer 208 because it may be exposed later.

[0156] After removing the second portion of the electrically insulating material 236, a third portion of the electrically insulating material 236 is removed in the third region R3 of the first precursor recess 148a. The third region R3 is, for example, wider than the first and second regions R1, R2 in a direction parallel to the plane of the surface 226 of the substrate 202. By removing the third portion of the electrically insulating material 236, the surfaces of the first and second portions 208a', 208b' of the further second electrode layer 208' are exposed within the first recess 228a. For example, this exposes the first exposed surface of the further second electrode layer 208. This allows the further second electrode layer 208' to be connected to an external circuit, for example, by a conductive material deposited in contact with the first exposed surface of the further second electrode layer 208'.

[0157] from Figure 4dIt can be seen that after widening the first groove 228a, the first portion of the first groove 228a (e.g., between the first and second portions 204a, 204b of the first electrode layer 204) is narrower than the second portion of the first groove 228a (e.g., between the first and second portions 204a', 204b' of the other first electrode layer 204'). The first portion of the first groove 228a is, for example, closer to the substrate 202 than the second portion of the first groove 228a. Therefore, the cross-section of the first groove 228a may, for example, be widened away from the substrate 202 (or toward the mouth of the first groove 228a). This may facilitate further processing of the stack 200, such as depositing other components such as conductive materials. However, Figure 4d The shape of the first groove 148 is only an example.

[0158] Similar treatment as the first groove 228a may be applied to the second groove 228b. Figure 4d As shown, the first portion of the electrically insulating material 236 removed during the first widening of the second groove 228b can be larger than the first portion of the electrically insulating material 236 removed during the first widening of the first groove 228a. In this way, the exposed surfaces of the second portion 204b and the third portion 204c of the first electrode layer 204 can be formed within the second groove 228b by removing the first portion of the electrically insulating material 236. For example, the formation of the second groove 228b can include forming the second groove 228b through the electrically insulating material 236 in the second precursor groove 148b to form the second groove 228b having a second surface that includes an exposed surface of the first electrode layer 204 (e.g., an exposed surface of the second portion 204b of the first electrode layer 204). In contrast, during the formation of the second groove 228b, the faces or sides of the second and third portions 208b, 208c of the second electrode layer 208 can remain covered by the electrically insulating material 236 or otherwise insulated. Similarly, the faces or sides of the second and third portions 204a', 204b' of the further first electrode layer 204a' may be kept insulated by the electrically insulating material 236. In this way, an exposed surface referred to as the further first electrode layer 204a', such as the surface of the second portion 204a' of the further first electrode layer 204a', may be kept insulated from the second recess 228b by the electrically insulating material 236. However, a second widening of the second recess 228b, for example by removing a second portion of the electrically insulating material 236, may expose the exposed surfaces of the second and third portions 204b', 204c' of the further first electrode layer 204' within the second recess 228b. In this way, the second surface of the second recess 228b may include the exposed surface of the further first electrode layer 204a'. The faces or sides of the second and third portions 208b', 208c' of the further second electrode layer 208 may remain covered by the electrically insulating material 236 or otherwise insulated.

[0159] The third groove may be formed through the third precursor groove 228c in a similar manner as the first groove 228a is formed through the first precursor groove 228a. Thus, after forming the first, second, and third grooves in a stack 200 such as the stack 200 of FIG. 4 , the first surface of the first groove 228a may include the first exposed surface of the other second electrode layer 208′ and the first exposed surface of the second electrode layer 208. Similarly, the second surface of the second groove 228b may include the exposed surface of the other first electrode layer 204′ and the exposed surface of the first electrode layer 204. The third surface of the third groove may include the second exposed surface of the other second electrode layer 208′ and the exposed surface of the second electrode layer 208.

[0160] After forming the first, second, and third grooves in the stack 200, the Figure 4e The intermediate structure of the substrate 202 of the stack 200 is shown cut. Figure 4e The cleavage of the intermediate structure in Figure 3d For example, the intermediate structure may be cut along a first axis 240a and a second axis 240b (collectively indicated by reference numeral 240) aligned with the first groove 228a and the second groove 228b, respectively. The intermediate structure may also be cut along a third axis aligned with the third groove.

[0161] Cutting of intermediate structures Figure 4f The three batteries 242a-242c are collectively represented by reference numeral 242. The battery 242 may be similar to Figure 3e The batteries 142 are connected together to form a multi-battery energy storage device.

[0162] Figure 5 3 is a schematic diagram of an intermediate structure for an energy storage device according to an example. Figure 5 Features are marked with the same reference numerals increased by 200. A corresponding description shall apply.

[0163] Figure 5 The intermediate structure 150 includes a first stack 300 on a first surface 326 of a substrate 302. The intermediate structure 150 also includes a second stack 300' on a second surface 326' of the substrate 302 opposite to the first surface 326. The first stack 300 is the same as the stack 100 of FIG. 3. The second stack 300' is the same as the first stack 300. However, the second stack 300' is arranged on a side of the substrate 302 opposite to the first stack 300. For ease of reference, the first electrode layer 304a' of the second stack 300' can be referred to as the third electrode layer. Similarly, the second electrode layer 308' of the second stack 300' can be referred to as the fourth electrode layer.

[0164] The first stack 300 and the second stack 300' can each be manufactured as shown in FIG. 3 to form grooves 152, 152' in the first stack 300 and the second stack 300'. The grooves 152, 152' of the first stack 300 and the second stack 300' can be similar to the grooves 128 described with reference to FIG. 3. However, the grooves 152' in the second stack 300' can be formed from the opposite direction of the grooves 152 in the first stack 300. For example, the first stack 300 can be disposed on the first surface 326 of the substrate 302, which can be considered to correspond to the first side of the substrate 302. The grooves 152 can then be formed in the first stack 300. In a similar manner, the second stack 300' can be disposed on the second surface 326' of the substrate 302', which can be considered to correspond to the second side of the substrate 302. The grooves 152' can then be formed in the second stack 300'.

[0165] The grooves 152, 152' in the first stack 300 and the second stack 300' can be formed using laser ablation (as described with reference to FIG. 3) or another technique for removing material. In the case where the grooves 152, 152' are formed using laser ablation, the first and third grooves 152a, 152b can be formed using a first at least one laser beam directed toward a first side of the substrate 302 (e.g., toward the first surface 326). In this case, the second groove 152a' and the fourth groove 152b' can be formed using a second at least one laser beam directed toward a second side of the substrate 302 opposite the first side (e.g., toward the second surface 326'). The fifth and sixth grooves 152c, 152c' can also be formed using the first and second at least one laser beam, respectively.

[0166] The first and second at least one laser beams may be generated using separate laser ablation systems, respectively. For example, the first at least one laser beam may be generated by a first laser ablation system disposed on a first side of substrate 302. Conversely, the second at least one laser beam may be generated by a second laser ablation system disposed on a second side of substrate 302. This may be more straightforward than other arrangements because it may eliminate the need for complex optical equipment to direct the first and second at least one laser beams to desired locations on the first and second sides of substrate 302, respectively. The first and second laser ablation systems may be the same or different from each other.

[0167] However, in other examples, the same laser ablation system can be used to generate the first and second at least one laser beam. For example, the laser ablation system can be arranged to generate laser pulses and direct some laser pulses toward the first side of the substrate 302 and others toward the second side of the substrate 302. For example, an optical device, such as a beam splitter, or a mirror or other reflector, can be used to selectively deflect a portion of the laser beam toward the first side or the second side. In this way, a single laser ablation device can be used to generate the first and second at least one laser beam.

[0168] exist Figure 5 , the intermediate structure includes a first groove 152a, a second groove 152a', a third groove 152b, and a fourth groove 152b'. The first groove 152a and the third groove 152b are formed through the first stack 300, and may be similar to the first groove 128a and the second groove 128b of FIG. 3 . The second groove 152a' and the fourth groove 152b' are formed through the second stack 300', and may also be similar to the first groove 128a and the second groove 128b of FIG. 3 (but formed through the second stack 300' instead of the first stack 300). In this example, the intermediate structure also includes a fifth groove 152c in the first stack 300 and a sixth groove 152c' in the second stack 300', but the fifth and sixth grooves may be omitted in other examples. Figure 5 In the embodiment, the third groove 152b is between the first and fifth grooves 152a, 152c in the first stack 300, and the fourth groove 152b' is between the second and sixth grooves 152a', 152c' in the second stack 300', but this is merely an example.

[0169] In such Figure 5 In the example of FIG. 3 , the first depth of the first groove 152a is different from the third depth of the third groove 152b (where each of these depths can be obtained in the same direction as the depths d1, d2, d3 of the groove 128 of FIG. 3 ). Similarly, the second depth of the second groove 152a' can be different from the fourth depth of the fourth groove 152b'. Therefore, this makes it possible to Fig.11 Further described), the surfaces of the different layers are exposed on the opposite sides of the first stack 300 and the second stack 300'. Figure 5 In the embodiment, the fifth depth of the fifth groove 152c is substantially the same as the first depth of the first groove 152a, and the sixth depth of the sixth groove 152c' is substantially the same as the second depth of the second groove 152a'. However, this is not necessarily the case.

[0170] exist Figure 5In the example of , the first groove 152a is substantially aligned with the second groove 152a', and the third groove 152b is substantially aligned with the fourth groove 152b'. Figure 5 In the embodiment of the present invention, the fifth groove 152c is also substantially aligned with the sixth groove 152c', but this need not be the case. When two grooves extend or are positioned along a common axis, or when one groove at least substantially overlaps the other groove, the two grooves can be considered to be substantially aligned with each other. For example, the cross-sections of such grooves can be in line with each other. Such an example is Figure 5 , where the first groove 152a and the second groove 152a' are each elongated in the vertical direction and are stacked one on top of the other (although separated by the substrate 302 and the first electrode layers 304a, 304a' of the first and second stacks 300, 300'), so that the first groove 152a overlaps the second groove 152a'.

[0171] exist Figure 5 , the first stack 300 and the second stack 300' are identical to each other and aligned with each other, but on opposite sides of the substrate 302. Therefore, the first, third and fifth depths of the first, third and fifth grooves 152a, 152b, 152c of the first stack 300 are substantially the same as the second, fourth and sixth depths of the second, fourth and sixth grooves 152a', 152b', 152c' of the second stack 300'. However, in other cases, one or more grooves 152 of the first stack 300 may have a different depth than one or more grooves 152' of the second stack 300'. For example, grooves that are aligned with each other but in different corresponding stacks may have different depths from each other. For example, the first depth may be substantially the same as the fourth depth, and the third depth may be substantially the same as the second depth. For example, where the first groove and the second groove are substantially aligned with each other and the third groove and the fourth groove are substantially aligned with each other, or the alignment between the grooves of the first stack and the grooves of the second stack is different Figure 5 This may be the case in the other examples shown.

[0172] Figure 6 Another schematic diagram of an intermediate structure 450 for manufacturing an energy storage device is shown. Figure 5 The corresponding characteristics are similar Figure 6 Features are labeled with the same reference numerals beginning with a "4" instead of a "1" or a "3".

[0173] Figure 6 The intermediate structure 450 is similar to Figure 5 The intermediate structure. Figure 6 The first stack 400 with Figure 5The first stack 300 is the same as that of the first stack 300 and is also arranged on the first surface 426 of the substrate 402. However, the second surface 426′ arranged on the substrate 402 Figure 6 The second stack 400' is different from Figure 5 The second stack 300'.

[0174] In particular, Figure 5 The second stack 300' is Figure 5 Thus, the first, third and fifth depths of the first, third and fifth grooves 152a, 152b, 152c of the first stack 300 are substantially the same as the second, fourth and sixth depths of the second, fourth and sixth grooves 152a', 152b', 152c' of the second stack 300', respectively. Figure 6 The first depth of the first groove 452a of the first stack 400 is different from the second depth of the second groove 452a' of the second stack 400'. The first groove 452a is substantially aligned with the second groove 452a', but on opposite sides of the substrate 402.

[0175] exist Figure 6 In the example of, the third and fifth grooves 452b, 452c of the first stack 400 are also aligned with the fourth and sixth grooves 452b', 452c' of the second stack 400. In this case, the third and fifth depths of the third and fifth grooves 452b, 452c of the first stack 400 are different from the fourth and sixth depths of the second and sixth grooves 452b', 452c', respectively. However, this is not necessary. In fact, other examples may include a plurality of aligned groove pairs (each pair of grooves includes a groove in the first stack and a groove in the second stack that is aligned with the groove in the first stack). In this case, some groove pairs may have substantially the same depth as each other. Other pairs may include two grooves with different depths from each other.

[0176] Figure 6 The second, fourth and sixth grooves 452a', 452b', 452c' may be similar to Figure 5 The second, fourth and sixth grooves 152a', 152b', 152c' are formed by forming the first electrode layer 404 and the substrate 402 of the first stack 400, but have different depths. Figure 6 The first groove 452a is formed so that the first groove 452a passes through the second electrode layer 408 and the electrolyte layer 406 without extending into the first electrode layer 404 of the first stack 400. Figure 64. However, the second groove 452a' can be formed through the second electrode layer 408', the electrolyte layer 406' and the first electrode layer 404' of the second stack 400'. In this way, the second groove 452a' can separate the first electrode layer 404' of the second stack 400' into the first part 404a' and the second part 404b'. In this case, the second groove 452a' also separates the first part 406a' of the electrolyte layer 406' from the second part 406b' of the electrolyte layer 406', and separates the first part 408a' of the second electrode layer 408' from the second part 408b' of the second electrode layer 408' in the second stack 400'.

[0177] Similarly, Figure 6 The third groove 452b can be formed through the second electrode layer 408, the electrolyte layer 406, and the first electrode layer 404 of the first stack 400 (e.g., without cutting the substrate 402). However, the third groove 452b can be formed through the second electrode layer 408' and the electrolyte layer 406' of the second stack 400'. Figure 6 The fourth groove 452b' is formed in the second stack 400' without cutting the first electrode layer 404' and the substrate 402 of the second stack 400'. In this way, the fourth groove 452b' separates the second portion 406b' of the electrolyte layer 406' from the third portion 406c' of the electrolyte layer 406' in the second stack 400'. The fourth groove 452b' also separates the second portion 408b' of the second electrode layer 408' from the third portion 408c' of the second electrode layer 408c' in the second stack 400'.

[0178] exist Figure 6 4 , without cutting the first electrode layer 404 and the substrate 402 of the first stack 400, the fifth groove 452c is formed to pass through the second electrode layer 408 and the electrolyte layer 406 of the first stack 400. The sixth groove 452c' is formed through the second electrode layer 408', the electrolyte layer 406' and the first electrode layer 404' of the second stack 400'. The sixth groove 452c' thus separates the second portion 404b' of the first electrode layer 404' from the third portion 404c' of the first electrode layer 404' in the second stack 400'. The sixth groove 452c' also separates the third portion 406c' of the electrolyte layer 406' from the fourth portion 406d' of the electrolyte layer 406', and separates the third portion 408c' of the second electrode layer 408' from the fourth portion 408d' of the second electrode layer 408' in the second stack 400'.

[0179] In the formation of Figure 5 or Figure 6 After the intermediate structure shown, the intermediate structure can be further processed (such as reference Figure 2In some examples, further processing of the intermediate structure may include cutting the intermediate structure into one or more strips prior to folding the intermediate structure.

[0180] For example, now specifically refer to Figure 7 , schematically showing the process of rolling to rolling type Figure 5 An example of further processing of the intermediate structure 150. Figure 7 As shown, the intermediate structure 150 is provided by a reel 154 so as to travel in a first direction 156. The grooves 152 in the first stack 300 in the intermediate structure 150 are arranged in a Figure 7 However, Figure 5 As shown, the intermediate structure 150 also includes a groove 152' in the second stack 300'. Figure 7 The intermediate structure 150 is shown in plan view in FIG. Thus, the second stack 300 ′ (below the first stack 300 ) is located at Figure 7 Covered in. Figure 7 The intermediate structure 150 also includes a registration feature 158. The registration feature is, for example, different from a groove in the stack. For example, the registration feature can be a recess in the stack that, for example, extends only partially through an upper layer of the stack (rather than extending through at least one layer of the stack). In this case, the registration feature can have a different size or shape than the groove in the stack. The registration feature generally indicates a folding point at or toward which the stack (or an intermediate structure including the stack) will be folded. Folding the intermediate structure can allow the intermediate structure to be effectively divided into battery cells. The registration feature can be formed by laser ablation or other methods. For example, the registration feature can be formed by depositing material on the stack, such as printing material. As another example, the registration feature can be formed by drawing a line or forming some other mark in the stack (e.g., without having to use laser ablation). In Figure 7 In the example shown, the groove 152 and the registration feature 158 (in this example in the form of a recess parallel to the groove 152) are elongated in a direction perpendicular to the first direction of travel 156. However, in other examples, other registration features are possible. In addition, in some cases, the registration feature can be omitted.

[0181] like Figure 7 As schematically shown in FIG. 1 , the intermediate structure 150 may be cut into a plurality of strips 160 (in Figure 7Only one is shown in the figure). For example, the strips 160 can be formed by laser cutting the intermediate structure 150 in a direction parallel to the first travel direction 156. Each strip 156 is elongated in a direction perpendicular to the length of the grooves 152. Each strip 156 can then be folded at or toward the registration features 158 (e.g., during a folding process and / or by a folding machine as described above) to produce a folded intermediate structure 162. By forming the registration features 158, the folding points of the folded strips 156 can be effectively and reliably identified. For example, the intermediate structure 150 can be processed by a folding machine, and the registration features 158 can provide a means by which the folding machine can effectively register (i.e., identify and / or align) the points at which the intermediate structure 150 is to be folded, for example, without having to count the number of grooves between each fold.

[0182] It should be understood that although Figure 7 Only one fold is shown in FIG. 1 , but in other examples, there may be many folds such that the folded intermediate structure 162 includes many stacks, such as dozens or hundreds of stacks.

[0183] As another example, now refer to Figure 8 , schematically shows another example of further processing of the intermediate structure 150. Figure 8 As shown, the intermediate structure 150 is provided by the reel 164 so as to travel in the second direction 166. The intermediate structure 150 is, for example, Figure 7 The intermediate structure 150 provided by the scroll 154 is the same. However, the grooves 152 and the registration features 158 (in this example in the form of recesses parallel to the grooves 152) are elongated in a direction parallel to the second direction of travel 166. Forming the grooves 152 and / or the registration features 158 in this orientation can allow the laser source and / or ablation beam generated thereby to be provided by a static laser system relative to which the intermediate structure 150 can be moved, for example, to form the grooves 152 and / or the registration features 158 in a substantially continuous process, which can be effective. Similarly, the grooves 152' (in Figure 8 The grooves 152 of the first stack 300 may overlap with the grooves 152 of the first stack 300. The grooves 152' of the second stack 300' may also be elongated in a direction parallel to the second direction of travel 166. Therefore, the laser source or ablation beam used to form the grooves 152' in the second stack 300' may also be stationary relative to the intermediate structure 150. Figure 5 As described, separate or combined laser systems may be used to form the grooves 152, 152' in the first stack 300 and the second stack 300', respectively.

[0184] like Figure 8As schematically shown in FIG. 1 , the intermediate structure 150 may be cut into a plurality of strips 168 (in Figure 8 Only one is shown in the figure). For example, the strips 168 can be formed by laser cutting the intermediate structure 150 in a direction perpendicular to the second travel direction 166. Again, each strip 168 is elongated in a direction perpendicular to the length of the grooves 152 in the first stack 300. Then, each strip 168 can be folded at or toward the registration features 158 (e.g., during a folding process and / or by a folding machine) to produce a folded intermediate structure 170. It should be understood that although in Figure 8 Only one fold is shown in FIG. 1 , but in other examples, there may be many folds such that the folded intermediate structure 170 includes many stacks, such as dozens or hundreds of stacks.

[0185] It will be appreciated that in some examples, Figure 7 The folded intermediate structure 162 can be Figure 8 The folded intermediate structures 170 are substantially the same (eg, indistinguishable). However, according to Figure 8 The cutting of the intermediate structure 150 substantially parallel to the second travel direction 166 may allow for parallel processing of each strip 168 produced and may therefore allow for an efficient production process.

[0186] A cutting device (not shown) arranged to cut the intermediate structure 150 to form the strips 160, 168 may be provided. The cutting device may form part of the device and / or folding machine for forming the grooves 152, 152' in the first stack 300 and the second stack 300', or may be a separate device. For example, the cutting device may include a laser cutter arranged to cut the intermediate structure 150 into the strips 160, 168. The folding machine (not shown) may include a device for identifying or recognizing the registration feature 158. For example, the recognition device may include a camera or other sensor arranged to recognize the registration feature 158 of the intermediate structure 150 that is different from the groove 152 of the first stack 300. A folding machine arranged to fold the intermediate structure 150 at or toward the recognized registration mark may allow the folding machine to reliably and efficiently fold the intermediate structure 150, for example, without having to count the number of grooves between each fold. However, this is only an example, and other folding machines may be used in other examples.

[0187] Fig. 9 is a schematic diagram illustrating a folded intermediate structure 172 for an energy storage device according to an example. Fig. 9 The folded intermediate structure 172 is obtained by folding the substrate 302, which is Figure 5The first, second, third, fourth, fifth and sixth stacks 300, 300', 300", 300"', 300"", 300""' are arranged on Fig. 9 The first stack 300 and the second stack 300' are Figure 5 The first stack 300 and the second stack 300' are identical. The description should be adopted accordingly. In fact, Fig. 9 Each stack 300-300''"' is identical to every other stack and differs only in position relative to the substrate 302. Thus, features of the second stack 300' that are identical to corresponding features of the first stack 300 are marked by the same reference numerals plus a prime sign ''. Features of the third stack 300'' that are identical to corresponding features of the first stack 300 are marked by the same reference numerals plus two prime signs ''. Features of the fourth stack 300'' that are identical to corresponding features of the first stack 300 are marked by the same reference numerals plus three prime signs ''. Features of the fifth stack 300'' that are identical to corresponding features of the first stack 300 are marked by the same reference numerals plus four prime signs ''. Features of the sixth stack 300''" that are identical to corresponding features of the first stack 300 are marked by the same reference numerals plus five prime signs '''.

[0188] The first, fourth and fifth stacks 300 , 300 ′″, 300 ″″ are arranged on the first surface 326 of the substrate 302 . The second, third and sixth stacks 300 ′, 300 ″, 300 ′″ are arranged on a second surface 326 ′ of the substrate 302 opposite to the first surface 326 .

[0189] Thus, the folded intermediate structure 172 can be Figure 7 and 8 The folded intermediate structures 162 and 170 are similar or identical. Figure 7 and Figure 8 As shown, the intermediate structure 150 can be obtained after cutting it into strips 160, 168. Fig. 9 The folded intermediate structure 172 may be obtained by folding the intermediate structure 150 multiple times, for example, Figure 7 and 8 shown.

[0190] exist Fig. 9In the example of , the folded intermediate structure 172 is folded in a z-folding manner. In other words, the second stack 300' is folded below the first stack 300. The third stack 300" is folded below the second stack 300'. The fourth stack 300"' is folded below the third stack 300". The fifth stack 300"" is folded below the fourth stack 300"'. The sixth stack 300""' is folded below the fifth stack 300"". With this arrangement, the planes defined by the layers of each of the stacks 300-300""' are substantially parallel to each other. However, due to the folding of the substrate 302, the second stack 300' is inverted compared to the first stack 300. Similarly, the fourth stack 300"' is inverted compared to the third stack 300"", and the sixth stack 300""' is inverted compared to the fifth stack 300"". The first, third and fifth stacks 300, 300", 300"" are arranged in the same direction as each other, but are arranged in different corresponding planes, for example, substantially parallel to each other. Two planes may be considered substantially parallel to one another when they are completely parallel to one another or within manufacturing tolerances, or within a range of less than 20 degrees, 15 degrees, 10 degrees, or 5 degrees.

[0191] The distance between each fold is substantially the same, e.g., exactly the same, the same within manufacturing tolerances, or has a deviation of less than 20%, 15%, 10%, or 5%. For example, the fold points can be equally spaced along the length of the intermediate structure including the stacks 300-300""', e.g., along the length of the strips 160, 168. In this way, each of the stacks 300-300""' can have the same width as each other, so that the stacks 300-300""' are registered or aligned with each other.

[0192] The folded intermediate structure 172 can then be Fig.10 As shown, it is segmented. Fig.10 As can be seen in FIG. 1 , each stack 300-300""' is aligned with each other, for example so that one of the stacks (in Fig.10 Each of the grooves is filled with insulating material 336) and is aligned with the corresponding grooves of the adjacent stack (e.g., in Fig.10 The first axis 174a corresponding to the first groove 152a of the first stack 300 is aligned with the center of the first groove 152a of the first stack 300, and the ... Fig.10 Extends in the vertical direction. Similarly, Fig.10 The second axis 174b corresponds to the central axis of the third groove 152b of the first stack 300, Fig.10 The third axis 174 c corresponds to the central axis of the fifth groove 152 c of the first stack 300 .

[0193] For example, after folding the substrate 302, the first groove 152a of the first stack 300 is between the first portion 175a of the first stack 300 on the first portion of the first surface 326 of the substrate 302 and the third portion 175b of the first stack on the third portion of the first side of the substrate 302 on substantially the same plane as the first portion of the first stack 300. The first portion 175a of the first stack 300 includes the first electrode layer 308a and the first portion of the electrolyte layer 306a of the first stack 300. The first portion 175a of the first stack 300 also includes a first subportion 304aa of the first portion 304a of the first electrode layer 304 of the first stack 300. The first subportion 304aa is, for example, a portion of the first portion 304a of the first electrode layer 304 in Fig.10 The section on the left side of the first axis 174a. Fig.10 , the third portion 175 b of the first stack 300 includes the second electrode layer 308 b and the second portion of the electrolyte layer 306 b , and the second subportion 304 ab of the first portion 304 of the first electrode layer 304 of the first stack 300 .

[0194] The second groove 152b separates the third portion 175b of the first stack 300 from the fourth portion 175c of the first stack 300, which includes the second electrode layer 308c and the third portion of the electrolyte layer 306c of the first stack 300. The fourth portion 175c of the first stack 300 also includes a first sub-portion 304ba of the second portion 304b of the first electrode layer 304 of the first stack 300.

[0195] Similarly, the third groove 152c separates the fourth portion 175c of the first stack 300 from the fifth portion 175d of the first stack 300, which includes the second electrode layer 308d and the fourth portion of the electrolyte layer 306d of the first stack 300. The fifth portion 175d of the first stack 300 also includes a first sub-portion 304ba of the second portion 304b of the first electrode layer 304 of the first stack 300.

[0196] exist Fig.10 , the folded intermediate structure 172 is cut along a first axis 174a, which can be considered to be a longitudinal axis that is substantially aligned with the first groove 152a. The axis along which the folded intermediate structure 172 is cut can extend through the entire folded intermediate structure 172, thereby dividing the folded intermediate structure into a plurality of multi-stack structures. Each of the multi-stack structures can be considered to correspond to a precursor of a corresponding energy storage device. For example, cutting the folded intermediate structure 172 along the first axis 174a can separate a first precursor 176a to a first energy storage device from a second precursor 176b to a second energy storage device. In Fig.10, the first precursor 176a includes a portion of each stack 300 - 300'""' substantially aligned with one another. The first precursor 176a includes the first portion 175a of the first stack 300 and a portion of each other stack 300'-300'""' that overlaps the first portion 175a of the first stack 300.

[0197] exist Fig.10 In the example of , it can be seen that the folded intermediate structure 172 includes a first portion of a second stack 300' on a first portion of a second surface 326' of the substrate 302. The first portion of the second surface 326' is, for example, opposite to the first portion of the first surface 326 on which the first portion 175a of the first stack 300 is arranged. Thus, in this case, the first portion 175a of the first stack 300 is opposite to the first portion of the second stack 300'. Therefore, the first portion of the second stack 300' may be overlapped by the first portion 175a of the first stack 300. Fig.10 , the first portion of the second stack 300' includes the second electrode layer 308a' and the first portion of the electrolyte layer 306a' of the second stack 300'. The first portion of the second stack 300' also includes a first sub-portion 304aa' of the first portion 304a' of the first electrode layer 304' of the second stack 300. The first sub-portion 304aa' is, for example, a portion of the first portion 304a' of the first electrode layer 304'. Fig.10 A section on the left side of the first axis 174a.

[0198] exist Fig.10 In the example of , the folded intermediate structure 172 also includes a second portion of the first stack 300 on a second portion of the first surface 326 of the substrate 302. The second portion of the first stack 300 is overlapped by the first portion 175a of the first stack 300 and the first portion of the second stack 300'. Fig.10 , the second portion of the first stack 300 can be considered to correspond to a portion of the fourth stack 300'". The second portion of the first stack 300 can therefore be considered to include the second electrode layer 308a'' and the first portion of the electrolyte layer 306a'' of the fourth stack 300''. The second portion of the first stack 300 can also be considered to include a first sub-portion 304aa'' of the first portion 304a'' of the first electrode layer 304'' of the fourth stack 300''.

[0199] Fig.10 The folded intermediate structure 172 also includes a second portion of the second stack 300' on a second portion of the second surface 326' of the substrate 302. The second portion of the second stack 300' is surrounded by the first portion 175a of the first stack 300, the first portion of the second stack 300' and the second portion of the first stack 300 (at Fig.10In the fourth stack 300' "part) overlap. Fig.10 , the second portion of the second stack 300' can therefore be considered to correspond to a portion of the sixth stack 300""'. The second portion of the second stack 300' can therefore be considered to include the second electrode layer 308a""' and the first portion of the electrolyte layer 306a""' of the sixth stack 300""'. The second portion of the second stack 300' can also be considered to include the first sub-portion 304aa""' of the first portion 304a""' of the first electrode layer 304""' of the sixth stack 300""'.

[0200] The folded intermediate structure 172 can be cut along an axis aligned with each groove in the first stack 300. Fig.10 In the embodiment, the folded intermediate structure 172 is cut along the second axis 174b aligned with the third groove 152b and the third axis 174c aligned with the fifth groove 152c. In this way, the folded intermediate structure 172 is segmented into the first, second, third and fourth precursors 176a-176d.

[0201] It should be noted that Fig.10 In the example of FIG. 1 , each groove is filled with electrically insulating material 336 before segmenting folded intermediate structure 172. Thus, a cut is formed in each groove through electrically insulating material 336. However, in other examples, folded intermediate structure may be segmented before electrically insulating material is deposited in some or all of the grooves.

[0202] exist Fig.11 The schematic diagram shows the Fig.10 Each precursor may be considered to correspond to a multi-stack structure for an energy storage device.

[0203] Corresponds to Fig.11 The multi-stack structure of the first precursor 176a in the first stack 300 includes a portion of the first stack 300 (which itself can be considered to correspond to the first stack). After segmentation, the first portion 308a of the second electrode layer 308 of the first stack 300 can be considered to correspond to the second electrode of the first stack. The first portion 306a of the electrolyte layer 306 of the first stack 300 can be considered to correspond to the first electrolyte of the first stack. Similarly, the first sub-portion 304aa of the first portion 304a of the first electrode layer 304 of the first stack 300 can be considered to correspond to the first electrode of the first stack. The first electrode is closer to the substrate 302 than the second electrode.

[0204] Fig.11The first precursor 176a in also includes a portion of the second stack 300' (which itself can be considered to correspond to the second stack). After segmentation, the first portion 308a' of the second electrode layer 308' can be considered to correspond to the fourth electrode of the second stack. The first portion 306a' of the electrolyte layer 306' can be considered to correspond to the second electrolyte of the second stack. Similarly, the first sub-portion 304aa' of the first portion 304a' of the first electrode layer 304' can be considered to correspond to the third electrode of the second stack. The third electrode is closer to the substrate 302 than the fourth electrode.

[0205] exist Fig.11 , first electrical insulator 178a contacts the first exposed surface of the first electrode and the first exposed surface of the first electrolyte, but does not contact at least a portion of the first exposed surface of the second electrode. Similarly, second electrical insulator 178b contacts the first exposed surface of the third electrode and the first exposed surface of the second electrolyte, but does not contact at least a portion of the first exposed surface of the fourth electrode. Third electrical insulator 178c contacts the second exposed surface of the first electrode, the second exposed surface of the first electrolyte, and the second exposed surface of the second electrode. Fourth electrical insulator 178d contacts the second exposed surface of the third electrode, the second exposed surface of the second electrolyte, and the second exposed surface of the fourth electrode. Fig.11 The electrical insulators 178a-178d are similar to those of reference Figure 3e The descriptions of electrical insulators 144a-144d and 146a-146c shall apply accordingly.

[0206] Fig.11 The electrical insulators 178a-178d are formed, for example, by cutting through the folded intermediate structure 172 during segmentation. Fig.10 The electrically insulating material 336 is formed as shown. Fig.11 In the example of FIG. 1 , the first electrical insulator 178a is substantially aligned with the second electrical insulator 178b. The third electrical insulator 178c is substantially aligned with the fourth electrical insulator 178d, although this is not required.

[0207] Fig.11 The first electrical insulator 178a is arranged on a first side of the first stack, and the second electrical insulator 178b is arranged on a first side of the second stack. The third electrical insulator 178c is arranged on a second side of the first stack, and the fourth electrical insulator 178d is arranged on a second side of the second stack. The first side of the first stack is opposite to the second side of the first stack, and the first side of the second stack is opposite to the second side of the second stack. Fig.11 In the embodiment, the first sides of the first and second stacks are aligned with each other, and the second sides of the first and second stacks are aligned with each other, although this is merely an example.

[0208] exist Fig.11, the third electrical insulator 178c overlaps the second exposed surface of the first electrode, and the plane of the second exposed surface of the first electrode is substantially parallel to the plane of the first side of the substrate 302. The fourth electrical insulator 178d is overlapped by the second exposed surface of the third electrode, and the plane of the second exposed surface of the third electrode is substantially parallel to the plane of the second side of the substrate 302. In this way, the second exposed surface of the first electrode forms a shelf or ledge to support the third electrical insulator 178c.

[0209] However, in other examples, first electrical insulator 178a (which insulates the first electrode and the first electrolyte of the first stack) can be substantially aligned with fourth electrical insulator 178d (which insulates the second electrolyte and the fourth electrode of the second stack) instead of second electrical insulator 178b. In this case, second electrical insulator 178b (which insulates the third electrode and the second electrolyte of the second stack) can be substantially aligned with third electrical insulator 178c (which insulates the first electrolyte and the second electrode of the first stack).

[0210] In this case, the first electrical insulator 178a can be arranged on the first side of the first stack, the fourth electrical insulator 178d can be arranged on the first side of the second stack, the third electrical insulator 178c can be arranged on the second side of the first stack, and the second electrical insulator 178b can be arranged on the second side of the second stack. In this way, the positions of the electrical insulators 178 relative to the first stack 300 and the second stack 300' can be different. Fig.11 The position shown is to expose the Fig.11 The exposed surfaces of the different first, second, third or fourth electrodes are exposed.

[0211] Fig.12 is a schematic diagram showing an example of a portion of a precursor 476 of an energy storage device, which may be similar to Fig.11 However, despite Fig.11 The precursors 176a, 176b are composed of Figure 5 The folded intermediate structure of the first and second stacks 300, 300' is formed, but Fig.12 The precursor 476 consists of Figure 6 A folded intermediate structure of the first and second stacks 400 , 400 ′ is formed. Fig.12 The characteristics of Fig.11 Corresponding features of the present invention are marked with the same reference numerals, but beginning with "4" instead of "1" or "3". A corresponding description should be adopted.

[0212] exist Fig.12400). In the example, the first electrical insulator 478a is in contact with the exposed surface of the first electrode (e.g., it corresponds to the exposed surface of the first sub-portion 404aa of the first portion 404a of the first electrode layer 404 of the stack 400). The first electrical insulator 478a overlaps with the exposed surface of the first electrode in this example, and the plane of the exposed surface of the first electrode is substantially parallel to the plane of the first side of the substrate 402. In this case, the exposed surface of the first electrode can be, for example, the upper surface of the first electrode, which forms a ledge or shelf for supporting an electrically insulating material, which subsequently forms the first electrical insulator. The first electrical insulator 478a also contacts the exposed surface of the first electrolyte (e.g., it corresponds to the exposed surface of the first portion 406a of the electrolyte layer 406 of the first stack 400) and the exposed surface of the second electrode (e.g., it corresponds to the exposed surface of the first portion 408a of the second electrode layer 408 of the first stack 400).

[0213] exist Fig.12 , the second electrical insulator 478b is aligned with the first electrical insulator 478a (although this is not required). However, the second electrical insulator 478b contacts the exposed surface of the third electrode (e.g., it corresponds to the exposed surface of the first sub-portion 404aa" of the first portion 404a' of the first electrode layer 404' of the second stack 400'). The second electrical insulator 478b also contacts the exposed portion of the second electrolyte (e.g., it corresponds to the exposed surface of the first portion 406a' of the electrolyte layer 406' of the second stack 400') but does not contact at least a portion (in this example, all) of the exposed surface of the fourth electrode (e.g., it corresponds to the exposed surface of the first portion 408a' of the second electrode layer 408' of the second stack 400').

[0214] Similarly, in Fig.12 , the third electrical insulator 478c insulates the first electrolyte and the first electrode of the first stack, and the fourth electrical insulator 478d insulates the second electrolyte and the fourth electrode of the second stack. In this example, the third electrical insulator 478c and the fourth electrical insulator 478d are substantially aligned with each other. Fig.12 In the embodiment of the present invention, the first and second electrical insulators are arranged on one side of the precursor 476, and the third and fourth electrical insulators are arranged on the opposite side of the precursor 476. However, the electrical insulators 476a-476d generally extend in a direction perpendicular to the plane of the substrate 402 to insulate a portion of each side of the precursor 476 while leaving certain surfaces exposed for subsequent connection to an external circuit via a conductive material.

[0215] Fig.11 and 12 The precursors 176a, 176b, 478 may each be considered a multi-stack structure, and may also each be considered to correspond to a cell of an energy storage device.

[0216] The above examples should be understood as illustrative examples. Further examples are contemplated. For example, a method similar to that of FIG. 4 may be used to form a Figure 3e A cell similar to cell 142 of the type shown in FIG. 1 , wherein a precursor recess at least partially filled with an electrically insulating material is formed prior to subsequent selective ablation of the electrically insulating material.

[0217] For ease of explanation, Figure 3d and Figure 4e A cut of the intermediate structure without the z-folding process is shown. However, it should be understood that in some cases, similar to Figure 3d and Figure 4e The intermediate structure can be subjected to a z-folding process to form a Figure 2 The z-folded structure described above can then be cut to separate the intermediate structure into batteries. In this case, the electrically insulating materials 136, 236 in the grooves 128, 228 can be aligned in a z-folded arrangement. The intermediate structure can then be cut along an axis aligned with the electrically insulating materials 136, 236 (e.g., which corresponds to the axis 140, 240 aligned with the grooves 128, 228). This can further increase the efficiency of the method by reducing the number of cutting operations compared to examples where such a z-folded arrangement is not formed. For example, a method similar to that described in reference can be used. Figures 7 to 10 Describe the processes for folding and cutting Figure 3d and Figure 4e The intermediate structure shown.

[0218] It should be understood that in reference to Figures 7 to 12 In the described examples, stacks having different structures may be used instead of any stack 300 - 300''''.

[0219] In addition, references such as Figures 5 to 10 The stack 200 of FIG. 4 may be fabricated using any of the double-sided processing techniques described herein.

[0220] In the examples described herein, the first stack on the first side of the substrate has the same layer order as the second stack on the second side of the substrate opposite to the first side. For example, the first electrode layer of the first stack may be closer to the first side of the substrate than the second electrode layer of the first stack. Similarly, the first electrode layer of the second stack may be closer to the second side of the substrate than the second electrode layer of the second stack. However, in other examples, the first stack and the second stack may have different layer orders from each other. For example, the deposition order of the layers of the second stack may be opposite to the deposition order of the layers of the first stack. For example, although the first electrode layer of the first stack (e.g., cathode) may be closer to the first side of the substrate than the second electrode layer of the first stack (e.g., anode), in such an example, the second electrode layer of the second stack (e.g., anode) may be closer to the second side of the substrate than the first electrode layer of the second stack (e.g., cathode). This can help manage coating stress. Such an example can be manufactured as described in the examples herein, but a different layer order is used for the first stack than for the second stack.

[0221] For example, in Figure 6 In a similar example, the order of the layers of the second stack can be opposite to the order of the layers of the first stack. In such a case, after subsequent processing, portions of different instances of the same type of layer can be exposed on the same side of the energy storage device. For example, a portion of the first electrode layer of each of the first and second stacks (or a portion of the second electrode layer of each of the first and second stacks) can be exposed on the same side of the energy storage device after cutting through the first stack and the second stack, such as Figure 7 , 8 Or 10. This therefore allows the respective electrode layers of the first and second stacks to be connected in parallel.

[0222] In the case of double-sided deposition by inkjet material deposition (e.g., inkjet printing), even in the case where the anode, electrolyte, and cathode layers are also formed on the second side 302b of the substrate layer 302, e.g., as described with reference to Figure 5 As described, it may also be beneficial to maintain a top-down arrangement for inkjet material deposition.

[0223] Fig.13 An exemplary arrangement of a deposition apparatus 1310 is schematically shown that facilitates top-down inkjet material deposition (such as inkjet printing) of an ink material onto a stack having layers formed on both sides 302a, 302b of a substrate 302.

[0224] Reference Fig.13, the deposition device 1310 includes rollers 1320a, 1320b, 1320c, and the rollers 1320a, 1320b, 1320c are arranged to guide the movement of the stack so that a first side of the stack is presented for top-down inkjet material deposition of ink material from a first inkjet material deposition component (e.g., inkjet printing nozzle 1330'), such as inkjet printing, and a second side of the stack is presented for top-down inkjet material deposition of ink material from a second inkjet material deposition component (e.g., inkjet printing nozzle 1330").

[0225] More specifically, if Fig.13 As shown, for example as part of a roll-to-roll type process, the stack travels on rollers 1320a, 1320b, 1320c in a first travel direction 1340. The stack passes through the first roller 1320a and the second roller 1320b and is tensioned therebetween with the first side of the stack facing upward toward the first nozzle 1330'. When the stack passes through the second roller 1320b, the stack is inverted. The stack passes through the second roller 1320b and the third roller 1320c and is tensioned therebetween with the second side of the stack facing upward toward the second nozzle 1330". In this way, top-down printing of ink material can be provided in a roll-to-roll type process, which process can, for example, be substantially continuous. This can provide efficient battery production. Performing inkjet printing from the top down can allow for accurate and efficient deposition of ink material.

[0226] It should be understood that any feature described with respect to any one example can be used alone or in combination with other features described, and can also be used in combination with one or more features of any combination of any other examples or other examples. In addition, equivalents and modifications not described above may also be adopted without departing from the scope of the appended claims.

Claims

1. A method for manufacturing an energy storage device, the method comprising: providing a first stack on a first side of a substrate, the first stack comprising a first electrode layer, a second electrode layer, and a first electrolyte layer between the first electrode layer and the second electrode layer, the first electrode layer being closer to the first side of the substrate than the second electrode layer; providing a second stack on a second side of the substrate opposite the first side of the substrate, the second stack comprising a third electrode layer, a fourth electrode layer, and a second electrolyte layer between the third electrode layer and the fourth electrode layer, the third electrode layer being closer to the second side of the substrate than the fourth electrode layer; forming a first groove in a first side of the first stack, the first side of the first stack being opposite to a second side of the first stack, the second side of the first stack being in contact with the first side of the substrate, the first groove having a first depth; forming a second groove in a first side of the second stack, the first side of the second stack being opposite to a second side of the second stack, the second side of the second stack being in contact with the second side of the substrate, the second groove having a second depth; forming a third groove in the first side of the first stack, the third groove having a third depth different from the first depth; and A fourth groove is formed in the first side of the second stack, the fourth groove having a fourth depth different from the second depth.

2. The method according to claim 1, wherein: The first groove is substantially aligned with the second groove, and the third groove is substantially aligned with the fourth groove.

3. The method according to claim 1 or 2, wherein: The first groove and the second groove are formed without cutting the substrate, the third groove is formed without cutting the first electrode layer, and the fourth groove is formed without cutting the third electrode layer.

4. The method according to claim 1 or 2, wherein: The first depth is substantially the same as the second depth, and the third depth is substantially the same as the fourth depth.

5. The method according to claim 1 or 2, wherein: The first groove is formed without cutting the first electrode layer, the second groove is formed without cutting the substrate, the third groove is formed without cutting the substrate, and the fourth groove is formed without cutting the third electrode layer.

6. The method according to claim 1 or 2, wherein: The first depth is substantially the same as the fourth depth, and the third depth is substantially the same as the second depth.

7. The method according to claim 1 or 2, wherein: At least one of the first depth of the first groove, the second depth of the second groove, the third depth of the third groove, or the fourth depth of the fourth groove is substantially perpendicular to a plane of the first side of the substrate.

8. The method according to claim 1 or 2, wherein: forming the first groove and forming the third groove using a first at least one laser beam directed to a first side of the substrate; and Forming the second groove and forming the fourth groove use a second at least one laser beam directed to the second side of the substrate.

9. The method of claim 1 or 2, comprising folding the substrate to provide a multi-stack arrangement, the multi-stack arrangement comprising: a first portion of a first stack on a first portion of a first side of a substrate; a first portion of a second stack on a first portion of a second side of the substrate, the first portion of the second side of the substrate being opposite the first portion of the first side of the substrate, the first portion of the second stack overlapping the first portion of the first stack; a second portion of the first stack on a second portion of the first side of the substrate, the second portion of the first stack overlapping the first portion of the first stack and the first portion of the second stack; and A second portion of the second stack on a second portion of the second side of the substrate, the second portion of the second side of the substrate being opposite to the second portion of the first side of the substrate, the second portion of the second stack overlapping the first portion of the first stack, the first portion of the second stack, and the second portion of the first stack.

10. The method according to claim 9, wherein: After folding the substrate: the first groove being between a first portion of the first stack and a third portion of the first stack, the third portion of the first stack being on a third portion of the first side of the substrate in substantially the same plane as the first portion of the first stack; and The method includes cutting the multi-stack arrangement along a longitudinal axis substantially aligned with the first groove.

11. The method according to claim 10, wherein: The energy storage device is a first energy storage device, and cutting the multi-stack arrangement separates: A first precursor of a first energy storage device and a second precursor of a second energy storage device, the first precursor comprising a first portion of a first stack, a first portion of a second stack, a second portion of the first stack, and a second portion of the second stack.

12. A method of manufacturing an energy storage device, comprising: providing a first stack on a first side of a substrate, the first stack comprising a first electrode layer, a second electrode layer, and a first electrolyte layer between the first electrode layer and the second electrode layer, the first electrode layer being closer to the first side of the substrate than the second electrode layer; providing a second stack on a second side of the substrate opposite the first side of the substrate, the second stack comprising a third electrode layer, a fourth electrode layer, and a second electrolyte layer between the third electrode layer and the fourth electrode layer, the third electrode layer being closer to the second side of the substrate than the fourth electrode layer; forming a first groove in a first side of the first stack, the first side of the first stack being opposite to a second side of the first stack, the second side of the first stack being in contact with the first side of the substrate, the first groove having a first depth; and A second groove is formed in a first side of the second stack, substantially aligned with the first groove, the first side of the second stack being opposite to a second side of the second stack, the second side of the second stack being in contact with the second side of the substrate, the second groove having a second depth different from the first depth.

13. The method according to claim 12, wherein: The first groove is formed without cutting the first electrode layer, and the second groove is formed without cutting the substrate.

14. The method according to claim 12 or 13, wherein: forming the first groove using a first at least one laser beam directed toward a first side of the substrate; and Forming the second groove uses a second at least one laser beam directed toward the second side of the substrate.

15. An energy storage device formed according to the method of any one of claims 1 to 14.

16. A multi-stack structure for an energy storage device, the multi-stack structure comprising: a first stack on a first side of a substrate, the first stack comprising: a first electrode; a second electrode; and a first electrolyte between a first electrode and a second electrode, the first electrode being closer to the first side of the substrate than the second electrode; a second stack on a second side of the substrate opposite the first side of the substrate, the second stack comprising: a third electrode; a fourth electrode; and a second electrolyte between a third electrode and a fourth electrode, the third electrode being closer to the second side of the substrate than the fourth electrode; a first electrical insulator in contact with the first exposed surface of the first electrode and the first exposed surface of the first electrolyte and not in contact with at least a portion of the first exposed surface of the second electrode; a second electrical insulator in contact with the first exposed surface of the third electrode and the first exposed surface of the second electrolyte and not in contact with at least a portion of the first exposed surface of the fourth electrode; a third electrical insulator in contact with the second exposed surface of the first electrode, the second exposed surface of the first electrolyte, and the second exposed surface of the second electrode; and A fourth electrical insulator contacts the second exposed surface of the third electrode, the second exposed surface of the second electrolyte, and the second exposed surface of the fourth electrode.

17. The multi-stack structure according to claim 16, wherein: The first electrical insulator is substantially aligned with the second electrical insulator, and the third electrical insulator is substantially aligned with the fourth electrical insulator.

18. The multi-stack structure according to claim 17, wherein: The first electrical insulator is arranged on a first side of the first stack, the second electrical insulator is arranged on a first side of the second stack, the third electrical insulator is arranged on a second side of the first stack opposite to the first side of the first stack, and the fourth electrical insulator is arranged on a second side of the second stack opposite to the second side of the second stack.

19. The multi-stack structure according to claim 16, wherein: The first electrical insulator is substantially aligned with the fourth electrical insulator, and the third electrical insulator is substantially aligned with the second electrical insulator.

20. The multi-stack structure according to claim 19, wherein: The first electrical insulator is arranged on a first side of the first stack, the fourth electrical insulator is arranged on a first side of the second stack, the third electrical insulator is arranged on a second side of the first stack opposite to the first side of the first stack, and the second electrical insulator is arranged on a second side of the second stack opposite to the second side of the second stack.

21. The multi-stack structure according to any one of claims 16 to 20, wherein: At least one of the following: The third electrical insulator overlaps the second exposed surface of the first electrode, and a plane of the second exposed surface of the first electrode is substantially parallel to a plane of the first side of the substrate; or The fourth electrical insulator overlaps the second exposed surface of the third electrode, and a plane of the second exposed surface of the third electrode is substantially parallel to a plane of the second side of the substrate.

22. The multi-stack structure according to any one of claims 16 to 20, wherein: The thickness of the substrate in a direction perpendicular to a plane of the first side of the substrate is substantially equal to or greater than at least one of: a first thickness of the first stack or a second thickness of the second stack in a direction perpendicular to the plane of the first side of the substrate.

23. A multi-stack structure for an energy storage device, the multi-stack structure comprising: a first stack on a first side of a substrate, the first stack comprising: a first electrode; a second electrode; and a first electrolyte between a first electrode and a second electrode, the first electrode being closer to the first side of the substrate than the second electrode; a second stack on a second side of the substrate opposite the first side of the substrate, the second stack comprising: a third electrode; a fourth electrode; and a second electrolyte between a third electrode and a fourth electrode, the third electrode being closer to the second side of the substrate than the fourth electrode; a first electrical insulator in contact with the exposed surface of the first electrode, the exposed surface of the first electrolyte, and the exposed surface of the second electrode; and A second electrical insulator contacts the exposed surface of the third electrode and the exposed surface of the second electrolyte and is not in contact with at least a portion of the exposed surface of the fourth electrode.

24. The multi-stack structure of claim 23, wherein: The first electrical insulator is substantially aligned with the second electrical insulator.

25. The multi-stack structure according to claim 23 or 24, wherein: The first electrical insulator overlaps the exposed surface of the first electrode, and a plane of the exposed surface of the first electrode is substantially parallel to a plane of the first side of the substrate.

26. The multi-stack structure according to claim 23 or 24, wherein: The thickness of the substrate in a direction perpendicular to a plane of the first side of the substrate is substantially equal to or greater than at least one of: a first thickness of the first stack or a second thickness of the second stack in a direction perpendicular to the plane of the first side of the substrate.

27. An energy storage device comprising the multi-stack structure according to any one of claims 16 to 26.

28. An apparatus for manufacturing an energy storage device, comprising: a first inkjet material deposition component arranged to deposit material on a first side of a stack for an energy storage device; a second inkjet material deposition component arranged to deposit material on a second side of the stack, the second side being opposite to the first side; and a plurality of rollers arranged to guide movement of the stack between the first inkjet material deposition component and the second inkjet material deposition component such that a first side of the stack is presented for top-down inkjet material deposition of material from the first inkjet material deposition component onto the stack, and such that a second side of the stack is presented for top-down inkjet material deposition of material from the second inkjet material deposition component onto the stack, Wherein the device is arranged to perform the method according to any one of claims 1 to 14.

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