LED lamp radiator and LED lamp

Abstract

The present application relates to an LED lamp heat sink and an LED lamp, and belongs to the technical field of LED lamps. The present application includes: a first heat sink and a second heat sink, there is a space gap between the first heat sink and the second heat sink, and the first heat sink and the second heat sink are connected by a connector, wherein one of the first heat sink and the second heat sink is used to dissipate heat from the power board of the LED lamp, and the other is used to dissipate heat from the LED lamp board of the LED lamp. Through the present application, it is helpful to ensure the heat dissipation of the LED lamp board of the LED lamp while also taking into account the heat dissipation of the power board, thereby improving the heat dissipation performance of the entire LED lamp.

Description

Technical Field

[0001] The present application belongs to the technical field of LED lamps, and in particular relates to an LED lamp heat sink and an LED lamp. Background Art

[0002] LED lamps have the advantages of energy saving and high light efficiency. When LED lamps are working, the power board drives the LED light board to make the LED lights on the LED light board emit light. When converting electrical energy into light energy, the LED light board will generate a lot of heat. Taking mining lamps as an example, their power is relatively large, perhaps hundreds of watts, and the LED light board of mining lamps will generate quite high heat. In the related technology, the LED light board is cooled by configuring a heat sink. In the actual LED lamp product, still taking the mining lamp as an example, the power board is placed on the heat sink. The problem is that when the LED light board generates too much heat, the heat conduction through the heat sink will cause the temperature of the power board to be quite high. Coupled with the heat generated by the power board itself, the reliability of the power board cannot be guaranteed. Summary of the invention

[0003] In order to overcome the problems existing in the related art at least to a certain extent, the present application provides an LED lamp heat sink and an LED lamp, which helps to ensure the heat dissipation of the LED lamp board while also ensuring the heat dissipation of the power board, thereby improving the heat dissipation performance of the entire LED lamp.

[0004] To achieve the above objectives, this application adopts the following technical solutions:

[0005] First,

[0006] The present application provides an LED lamp heat sink, comprising:

[0007] A first heat dissipation part and a second heat dissipation part, wherein there is a space between the first heat dissipation part and the second heat dissipation part, and the first heat dissipation part and the second heat dissipation part are connected by a connecting piece, wherein one of the first heat dissipation part and the second heat dissipation part is used to dissipate heat from a power board of the LED lamp, and the other is used to dissipate heat from an LED lamp board of the LED lamp.

[0008] Furthermore, the first heat dissipation portion is arranged around the second heat dissipation portion.

[0009] Furthermore, a plurality of first heat dissipation fins are formed on the first heat dissipation portion, and a plurality of second heat dissipation fins are formed on the second heat dissipation portion.

[0010] Further,

[0011] A plurality of the first heat dissipation fins are evenly distributed circumferentially on the first heat dissipation portion, and

[0012] A plurality of the second heat dissipation fins are evenly distributed in the circumferential direction on the second heat dissipation portion.

[0013] Furthermore, one of the first heat dissipation portion and the second heat dissipation portion, which is used to dissipate heat for the power board, is concavely formed with an accommodation space for accommodating the power board.

[0014] Furthermore, there are a plurality of accommodating spaces, so that when there are a plurality of power boards, each of the accommodating spaces accommodates one power board.

[0015] Furthermore, the plurality of accommodation spaces are evenly distributed circumferentially on the one for dissipating heat from the power board.

[0016] Furthermore, adjacent accommodating spaces are connected by channels.

[0017] Furthermore, a boss protruding from the first heat dissipation portion is formed on the outer peripheral side of the first heat dissipation portion, and a mounting hole is formed on the boss.

[0018] Furthermore, the first heat dissipation portion and the second heat dissipation portion are respectively provided with wire holes for external wiring connection.

[0019] Furthermore, the first heat dissipation portion is used to dissipate heat from the power board, and the second heat dissipation portion is used to dissipate heat from the LED lamp board.

[0020] Second,

[0021] The present application provides an LED lamp, comprising:

[0022] An LED lamp heat sink as described in any one of the above items;

[0023] LED light panels; and

[0024] A power board is electrically connected to the LED light board.

[0025] Furthermore, there are multiple power boards, each of which is connected in series, and the multiple power boards include a main power board and at least one slave power board, wherein the main power board is used to be electrically connected to an external power supply and to be electrically connected to the LED light board, and the main power board can control each of the slave power boards.

[0026] Furthermore, the LED lamp further comprises:

[0027] The lens plate cooperates with the LED light board so that the light emitted by the LED lamp beads on the LED light board passes through the corresponding lens on the lens plate.

[0028] Furthermore, the LED lamp further comprises:

[0029] The decorative plate is used to be installed on the front side of the LED lamp.

[0030] This application adopts the above technical solution, which has at least the following beneficial effects:

[0031] The LED lamp heat sink provided in the present application has a first heat sink and a second heat sink, one of which is used to dissipate heat for the LED lamp board of the LED lamp, and the other is used to dissipate heat for the power board of the LED lamp. There is a space gap between the two heat sinks, and they are connected by a connector to form an overall stable structure. Due to the existence of the space gap, the heat dissipation of the LED lamp board and the power board can be effectively isolated, and the influence of the heat dissipation of the LED lamp board on the heat dissipation of the power board can be effectively reduced, which helps to ensure the heat dissipation of the LED lamp board while also ensuring the heat dissipation of the power board, thereby improving the heat dissipation performance of the entire LED lamp, and also helps to improve the life of the LED lamp.

[0032] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0034] Figure 1 is a schematic diagram of a first angle structure of an LED lamp heat sink according to an exemplary embodiment;

[0035] Figure 2 is a schematic diagram of a second angle structure of an LED lamp heat sink according to an exemplary embodiment;

[0036] Figure 3 It is a structural schematic diagram showing a power supply board and an LED lamp board installed on a LED lamp heat sink according to an exemplary embodiment;

[0037] Figure 4 The figure is a schematic diagram of an exploded structure of an LED lamp according to an exemplary embodiment. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be described in detail below. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other implementation methods obtained by ordinary technicians in the field without creative work belong to the scope of protection of the present application.

[0039] See also Figure 1 , Figure 2 , Figure 3 and Figure 4 , Figure 1 is a schematic diagram of a first angle structure of an LED lamp heat sink according to an exemplary embodiment. Figure 2 is a schematic diagram of a second angle structure of an LED lamp heat sink according to an exemplary embodiment. Figure 3 is a schematic structural diagram showing a LED lamp heat sink mounted with a power supply board and an LED lamp board according to an exemplary embodiment. Figure 4 is a schematic diagram of an exploded structure of an LED lamp according to an exemplary embodiment. Figures 1 to 4 As shown, the LED lamp heat sink 11 includes:

[0040] There is a first heat dissipation part 101 and a second heat dissipation part 102, and there is a space between the first heat dissipation part 101 and the second heat dissipation part 102, and the first heat dissipation part 101 and the second heat dissipation part 102 are connected by a connecting member 103, wherein one of the first heat dissipation part 101 and the second heat dissipation part 102 is used to dissipate heat for the power board 12 of the LED lamp 1, and the other is used to dissipate heat for the LED lamp board 13 of the LED lamp 1.

[0041] See also Figures 1 to 4 The LED lamp heat sink 11 provided in the present application has a first heat sink 101 and a second heat sink 102, wherein one is used to dissipate heat from the LED lamp board 13 of the LED lamp 1, and the other is used to dissipate heat from the power board 12 of the LED lamp 1. Specifically, the first heat sink 101 can be used to dissipate heat from the power board 12 of the LED lamp 1, and the second heat sink 102 can be used to dissipate heat from the LED lamp board 13 of the LED lamp 1; or the first heat sink 101 can be used to dissipate heat from the LED lamp board 13 of the LED lamp 1, and the second heat sink 102 can be used to dissipate heat from the power board 12 of the LED lamp 1. In the present application Figure 3 and Figure 4 In the figure, the first heat dissipation part 101 is used to dissipate heat for the power board 12 of the LED lamp 1, and the second heat dissipation part 102 is used to dissipate heat for the LED lamp board 13 of the LED lamp 1, which will be explained in conjunction with the illustrations of the present application in the following description of the relevant embodiments of the present application.

[0042] There is a space between the first heat dissipation portion 101 and the second heat dissipation portion 102 , and they are connected by a connecting member 103 to form an overall stable structure. Figure 1 and Figure 2 It is shown that there are multiple connectors 103, which can ensure a stable connection between the first heat dissipation part 101 and the second heat dissipation part 102. The first heat dissipation part 101, the second heat dissipation part 102 and the connector 103 between the two can be made of the same heat dissipation material (for example, aluminum alloy), so that the LED lamp heat sink 11 can be made in one piece. Due to the existence of the space between the first heat dissipation part 101 and the second heat dissipation part 102, the first heat dissipation part 101 and the second heat dissipation part 102 are opposite to each other in the air. Although there is a connector 103 connecting the two, the influence of heat conduction of the connector 103 is very small, so that the heat dissipation of the LED lamp board 13 and the power board 12 can be effectively isolated, and the influence of the heat dissipation of the LED lamp board 13 on the heat dissipation of the power board 12 can be effectively reduced, which helps to ensure the heat dissipation of the LED lamp board 13 of the LED lamp 1 while also taking into account the heat dissipation of the power board 12, which helps to improve the heat dissipation performance of the entire LED lamp 1 and also helps to improve the life of the LED lamp 1.

[0043] See also Figure 1 and Figure 2 In one embodiment, the first heat dissipation portion 101 is disposed around the second heat dissipation portion 102 .

[0044] Specifically, in the LED lamp related technology, there is a design idea that the power board is arranged above the heat sink. Under this design idea, the hot air formed by the heat radiated by the heat sink rises, so that the power board is always in a hot air environment, which is not conducive to the performance guarantee of the power board. However, the above solution of the present application forms a first heat dissipation part 101 surrounding the second heat dissipation part 102, such as Figure 1 and Figure 2 As shown, the first heat dissipation part 101 is in the shape of a circular ring as a whole, and the second heat dissipation part 102 is in the shape of a circular disk as a whole. The circular ring is arranged around the circular disk, and the first heat dissipation part 101 and the second heat dissipation part 102 are arranged side by side in the horizontal direction with an interval, so that the LED lamp board 13 and the power board 12 are also arranged side by side in the horizontal direction with an interval. The hot air formed by the radiation heat of the first heat dissipation part 101 and the second heat dissipation part 102 rises, which can effectively overcome the shortcomings of the related technology pointed out above that the power board 12 is arranged above the radiator.

[0045] See also Figure 1 and Figure 2 In one embodiment, a plurality of first heat dissipation fins 101 a are formed on the first heat dissipation portion 101 , and a plurality of second heat dissipation fins 102 a are formed on the second heat dissipation portion 102 .

[0046] Specifically, heat dissipation fins are formed on the first heat dissipation portion 101 and the second heat dissipation portion 102 respectively, which can enhance the heat dissipation effect. Figure 1 and Figure 2 In the first heat dissipation part 101 and the second heat dissipation part 102 shown, the heat dissipation fins of the first heat dissipation part 101 and the second heat dissipation part 102 are vertically arranged on the back and are independent of each other, forming upward heat conduction and heat dissipation, and the heat conduction and heat dissipation direction is the same as the rising direction of hot air, making the heat dissipation more efficient and effectively improving the heat dissipation effect.

[0047] See also Figure 1 and Figure 2 In one embodiment, a plurality of the first heat dissipation fins 101a are evenly distributed circumferentially on the first heat dissipation portion 101 , and a plurality of the second heat dissipation fins 102a are evenly distributed circumferentially on the second heat dissipation portion 102 .

[0048] Specifically, Figure 1 and Figure 2 The first heat dissipation fins 101a on the first heat dissipation part 101 are uniformly distributed in a circular shape on the back of the first heat dissipation part 101, and each first heat dissipation fin 101a is directed from the outer edge of the first heat dissipation part 101 to the center, and the second heat dissipation fins 102a on the second heat dissipation part 102 are also uniformly distributed in a circular shape on the back of the second heat dissipation part 102, and each second heat dissipation fin 102a is directed from the outer edge of the second heat dissipation part 102 to the center. The uniform distribution on the back of each heat dissipation part can ensure the uniformity of heat dissipation.

[0049] See also Figure 2 In one embodiment, one of the first heat dissipation portion 101 and the second heat dissipation portion 102 for dissipating heat for the power board 12 is concavely formed with an accommodating space 101 b for accommodating the power board 12 .

[0050] Specifically, Figure 2 It is shown that the first heat dissipation part 101 is used to dissipate heat for the power board 12, and a receiving space 101b is formed on the front of the first heat dissipation part 101. On the one hand, the receiving space 101b can allow the power board 12 to be placed inside it, which helps to reduce the overall volume of the product. More importantly, the receiving space 101b formed by the concave portion of the first heat dissipation part 101 can further increase the heat absorption area, has a better absorption effect on the heat emitted by the power board 12, and can dissipate the heat emitted by the power board 12 more efficiently.

[0051] See also Figures 2 to 4 In one embodiment, there are a plurality of accommodating spaces 101 b so that when there are a plurality of power boards 12 , each accommodating space 101 b can accommodate one power board 12 .

[0052] Specifically, Figure 2 It is shown that the first heat dissipation part 101 has a plurality of accommodation spaces 101b on the front side. Figure 4 As shown in the figure, there are multiple power boards 12, and each accommodating space 101b is isolated from each other to maximize the heat absorption effect of each accommodating space. A power board 12 can be installed in each accommodating space 101b. Through this solution, a distributed installation pattern of the power boards 12 can be realized to achieve a distributed heat dissipation effect.

[0053] See also Figure 2 In one embodiment, the plurality of accommodating spaces 101 b are evenly distributed circumferentially on the one for dissipating heat from the power board 12 .

[0054] Specifically, in Figure 2 On the front side of the annular first heat dissipation part 101 shown, a plurality of accommodating spaces 101 b are distributed in an annular shape, and the power board 12 can be distributed around the periphery of the lamp, keeping a certain distance from the second heat dissipation part 102 .

[0055] In one embodiment, adjacent accommodating spaces 101b are connected by channels.

[0056] A channel is provided between adjacent accommodating spaces 101 b to facilitate wiring connection between adjacent power boards 12 . The channel may be in the shape of a hole or a groove.

[0057] See also Figure 1 In one embodiment, a boss 101 c protruding from the first heat dissipation portion 101 is formed on the outer peripheral side of the first heat dissipation portion 101 , and a mounting hole is formed on the boss 101 c .

[0058] Specifically, there are a plurality of bosses 101c on the periphery of the heat sink, and mounting holes are provided on the bosses 101c for use in mounting lamps.

[0059] See also Figure 1 and Figure 2 In one embodiment, the first heat dissipation portion 101 and the second heat dissipation portion 102 are respectively provided with wire holes (101d, 101e, 102b) for external wiring connection.

[0060] Specifically, Figure 1As shown, the first heat dissipation part 101 is provided with two wire holes (101d, 101e) for external wiring connection, one is the wire hole 101d for connecting the power input line of the power board 12 to the external power supply, and the other is the wire hole 101e for connecting the power output line 101f of the power board 12 to the LED light board 13. The second heat dissipation part 102 has a wire hole 102b at the center position, which connects the power output line 101f led out from the first heat dissipation part 101. The power output line 101f passes through the wire hole 102b of the second heat dissipation part 102 and is connected to the LED light board 13, so that power is supplied to the LED light board 13 through the power board 12.

[0061] See also Figure 3 and Figure 4 The present application also provides an LED lamp solution, the LED lamp 1 comprising:

[0062] The LED lamp heat sink 11 as described in any one of the above items;

[0063] LED light board 13; and

[0064] The power board 12 is electrically connected to the LED light board 13 .

[0065] Specifically, the specific description of the improvement scheme of the LED lamp 1 around the LED lamp heat sink 11 for the LED lamp board 13 and the power board 12 has been described in detail in the above-mentioned related embodiments, and will not be elaborated here.

[0066] In one embodiment, there are multiple power boards 12, and each of the power boards 12 is connected in series. The multiple power boards 12 include a main power board and at least one slave power board, wherein the main power board is used to be electrically connected to an external power supply and to be electrically connected to the LED light board 13, and the main power board can control each of the slave power boards.

[0067] The installation of each power board 12 in this solution can be applied to the above-mentioned related solution - there are multiple accommodating spaces 101b, so that when there are multiple power boards 12, each accommodating space 101b can accommodate one power board 12. For the installation of multiple power boards 12 and the coordinated installation of multiple accommodating spaces 101b, refer to the above-mentioned relevant description, and no repetition is made here.

[0068] Through the above scheme, the power board 12 is designed to be distributed, and each power board 12 has a series connection function and a separate control function. Each power board 12 can be connected in series to meet the total power requirement of the product. Through the distributed power board 12, the product can be distributedly controlled when dimming and adjusting power. For example, if the entire product requires a total power of 200w, the present invention divides 200w into 10 parts, each with 20w power, and connects the 20w power supplies in series to meet the total power requirement of 200w. When dimming by adjusting power, the power can be reduced by turning off some power boards 12 to reduce the brightness of the light.

[0069] like Figure 3 As shown, the power board 12 includes a main power board 12a and a plurality of slave power boards 12b. The main power board 12a has the function of input and output. The main power board 12a has a power input line connected to an external power source and a power output line connected to an LED light board 13. The main power board 12a and the slave power board 12b are connected in series. The main power board 12a can control the slave power board 12b. The main power board 12a can change the dimming mode of the lamp by selectively controlling the slave power board 12b. For example, the total power of the LED lamp power supply is 200w. Through the distributed design of the power board 12, it can be designed into 10 20w power boards, including: 1 main power board 12a and 19 slave power boards 12b. Through the control of the main power board 12a, one or more slave power boards 12b can be turned off separately. For example, if five slave power boards 12b are turned off, the total power of the lighting product becomes 100w, and the corresponding brightness is also reduced synchronously. The power and brightness of the LED lamp can be controlled by controlling the switch of the slave power board 12b to achieve the purpose of dimming and power adjustment.

[0070] Please refer to Figure 4 In one embodiment, the LED lamp 1 further comprises:

[0071] The lens plate 14 cooperates with the LED light board 13 so that the light emitted by the LED lamp beads on the LED light board 13 passes through the corresponding lens on the lens plate 14 .

[0072] Specifically, an LED light board 13 is installed on the front of the second heat dissipation part 102, and the second heat dissipation part 102 dissipates heat for the LED light board 13. In the related art, the LED light board 13 includes LED lamp beads and an aluminum substrate. The LED lamp beads are mounted on the aluminum substrate, and the aluminum substrate can be attached to the front of the second heat dissipation part 102 through thermal conductive silicone grease, and the two can be fixed by screws. The LED light board 13 is installed with a lens plate 14, and the lens plate 14 can be installed on the second heat dissipation part 102 by screws. The lens plate 14 is opposite to the LED light board 13, and there is a convex lens on the lens plate 14. Each lamp bead is opposite to the center of the convex lens, so that the light emitted by the LED lamp beads on the LED light board 13 passes through the corresponding lens on the lens plate 14.

[0073] Please refer to Figure 4 In one embodiment, the LED lamp 1 further comprises:

[0074] The decorative plate 15 is used to be installed on the front side of the LED lamp 1 .

[0075] Specifically, the decorative plate 15 is installed on the outer periphery of the front side of the radiator to play a decorative role.

[0076] It can be understood that the same or similar parts of the above embodiments can be referenced to each other, and the contents not described in detail in some embodiments can refer to the same or similar contents in other embodiments.

[0077] It should be noted that, in the description of this application, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, in the description of this application, unless otherwise specified, the meaning of "plurality" and "multiple" refers to at least two.

[0078] It should be understood that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there may be an intermediate element at the same time; when an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intermediate element at the same time. In addition, the "connection" used here may include wireless connection; the wording "and / or" used includes any unit and all combinations of one or more associated listed items.

[0079] Any process or method description in a flowchart or otherwise described herein may be understood to represent a module, fragment or portion of code comprising one or more executable instructions for implementing the steps of a specific logical function or process, and the scope of the preferred embodiments of the present application includes alternative implementations in which functions may not be performed in the order shown or discussed, including performing functions in a substantially simultaneous manner or in the reverse order depending on the functions involved, which should be understood by technicians in the technical field to which the embodiments of the present application belong.

[0080] It should be understood that the various parts of the present application can be implemented by hardware, software, firmware or a combination thereof. In the above-mentioned embodiments, multiple steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented by hardware, as in another embodiment, it can be implemented by any one of the following technologies known in the art or their combination: a discrete logic circuit having a logic gate circuit for implementing a logic function for a data signal, a dedicated integrated circuit having a suitable combination of logic gate circuits, a programmable gate array (PGA), a field programmable gate array (FPGA), etc.

[0081] A person skilled in the art may understand that all or part of the steps in the method for implementing the above-mentioned embodiment may be completed by instructing related hardware through a program, and the program may be stored in a computer-readable storage medium, which, when executed, includes one or a combination of the steps of the method embodiment.

[0082] In addition, each functional unit in each embodiment of the present application may be integrated into a processing module, or each unit may exist physically separately, or two or more units may be integrated into one module. The above-mentioned integrated module may be implemented in the form of hardware or in the form of a software functional module. If the integrated module is implemented in the form of a software functional module and sold or used as an independent product, it may also be stored in a computer-readable storage medium.

[0083] The storage medium mentioned above can be a read-only memory, a magnetic disk or an optical disk, etc.

[0084] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0085] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A LED lamp heat sink, characterized in that: include: A first heat dissipation portion and a second heat dissipation portion, wherein there is a space between the first heat dissipation portion and the second heat dissipation portion, and the first heat dissipation portion and the second heat dissipation portion are connected by a connecting member, wherein one of the first heat dissipation portion and the second heat dissipation portion is used to dissipate heat from a power board of the LED lamp, and the other is used to dissipate heat from an LED lamp board of the LED lamp; The first heat dissipation portion is formed to surround the second heat dissipation portion, and the first heat dissipation portion and the second heat dissipation portion are arranged in parallel in a transverse direction and are spaced apart; the first heat dissipation portion is used to dissipate heat from the power board, and the second heat dissipation portion is used to dissipate heat from the LED light board; The first heat dissipation portion is concavely formed with a receiving space for receiving the power board; there are a plurality of receiving spaces, so that when there are a plurality of power boards, each receiving space receives a power board; The front side of the second heat dissipation part is used for installing the LED light board.

2. The LED lamp heat sink according to claim 1, characterized in that: A plurality of first heat dissipation fins are formed on the first heat dissipation portion, and a plurality of second heat dissipation fins are formed on the second heat dissipation portion.

3. The LED lamp heat sink according to claim 1, characterized in that: A plurality of the first heat dissipation fins are evenly distributed circumferentially on the first heat dissipation portion, and A plurality of the second heat dissipation fins are evenly distributed in the circumferential direction on the second heat dissipation portion.

4. The LED lamp heat sink according to claim 1, characterized in that: The plurality of accommodation spaces are evenly distributed in the circumferential direction on the one for dissipating heat from the power board.

5. The LED lamp heat sink according to claim 1, characterized in that: Adjacent accommodating spaces are connected by channels.

6. The LED lamp heat sink according to claim 1, characterized in that: A boss protruding from the first heat dissipation portion is formed on the outer peripheral side of the first heat dissipation portion, and a mounting hole is formed on the boss.

7. The LED lamp heat sink according to claim 1, characterized in that: The first heat dissipation part and the second heat dissipation part are respectively provided with wire holes for external wiring connection.

8. An LED lamp, characterized in that: include: The LED lamp heat sink according to any one of claims 1 to 7; LED light board; as well as A power board is electrically connected to the LED light board.

9. The LED lamp according to claim 8, characterized in that: There are multiple power boards, each of which is connected in series. The multiple power boards include a main power board and at least one slave power board, wherein the main power board is used to be electrically connected to an external power supply and to be electrically connected to a power output line of the LED lamp board, and the main power board can control each of the slave power boards.

10. The LED lamp according to claim 8, characterized in that: The LED lamp also includes: The lens plate cooperates with the LED light board so that the light emitted by the LED lamp beads on the LED light board passes through the corresponding lens on the lens plate.

11. The LED lamp according to claim 8, characterized in that: The LED lamp also includes: The decorative plate is used to be installed on the front side of the LED lamp.

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