Method for judging whether parts are defective, recording medium and placement machine

Abstract

The present invention relates to a method for judging whether a part is defective, a recording medium and a placement machine. The method for judging whether a part is defective based on a side image of a part picked up by a placement machine according to an embodiment of the present invention may include the following steps: obtaining a side image of the part when it is picked up by the placement machine; extracting an image of an area of ​​interest including at least a portion of a portion of the part in contact with the placement machine from the side image; and determining whether the part is defective based on whether the image of the area of ​​interest meets a predetermined defect judgment condition.

Description

Technical Field

[0001] Embodiments of the present invention relate to a method for judging whether a part is defective based on a side image of a picked-up part, a recording medium, and a chip mounter. Background Art

[0002] A placement machine is a device that automatically mounts surface mount components on a printed circuit board. It is composed of a component supply unit that provides components to be mounted on the printed circuit board, a drive unit or a suction nozzle that actually moves the components onto the printed circuit board, etc. Summary of the invention

[0003] The purpose of the present invention is to correctly judge whether the picked-up parts are defective.

[0004] Furthermore, the present invention prevents defects of printed circuit boards by performing an action of confirming whether a picked-up part is defective before mounting the part.

[0005] According to one embodiment of the present invention, a method for judging whether a part is defective based on a side image of the part picked up by a placement machine may include the following steps: acquiring a side image of the part when it is picked up by the placement machine; extracting an image of an area of ​​interest including at least a part of the part that contacts the placement machine from the side image; and determining whether the part is defective based on whether the image of the area of ​​interest meets predetermined defect judgment conditions.

[0006] The step of determining whether the part is defective may include the following steps: determining the state of the part as one of a normal state and a defective state based on whether the area corresponding to the part and the area corresponding to the placement machine within the image of the area of ​​interest meet predetermined conditions.

[0007] In the step of determining the state of the part as one of a normal state and a defective state, when the sum of the number of pixels included in the area corresponding to the part and the number of pixels included in the area corresponding to the placement machine is greater than a predetermined first critical number, the state of the part can be judged as a normal state.

[0008] In the step of determining the state of the part as one of a normal state and a defective state, when the sum of the number of pixels included in the area corresponding to the part and the number of pixels included in the placement machine is less than a predetermined first critical number, the state of the part can be judged as a defective state.

[0009] The step of determining whether the part is defective may include the step of determining the state of the part as one of a normal state and a defective state based on whether an area in the image of the region of interest corresponding to the interval between the part and the placement machine meets a predetermined condition.

[0010] In the step of determining the state of the part as one of a normal state and a defective state, when the number of pixels included in the area corresponding to the interval is less than a predetermined second critical number, the state of the part may be determined as a normal state.

[0011] In the step of determining the state of the component as one of a normal state and a defective state, when the number of pixels included in the area corresponding to the interval is greater than a predetermined second critical number, the state of the component may be determined as a defective state.

[0012] The step of determining whether the part is defective may include the step of determining whether the part includes a defect including information about a direction in which the part is tilted based on a pattern of an area corresponding to a spacing between the part and the mounter within the image of the region of interest.

[0013] The step of extracting the image of the area of ​​interest includes the step of determining the size of the area of ​​interest, and the step of determining the size of the area of ​​interest may include the following steps: confirming a first length as the length in the first direction of the suction nozzle that contacts the part in the placement machine; confirming a second length as the length of the part in the first direction; and determining the length of the area of ​​interest in the first direction based on the shorter length of the first length and the second length.

[0014] According to one embodiment of the present invention, a placement machine that determines whether a part is defective based on a side image of a picked-up part may include: a suction nozzle that picks up the part; an image acquisition device that acquires a side image of the suction nozzle that has picked up the part; a light irradiation unit that is arranged face to face with the image acquisition device and irradiates a light source to the suction nozzle that is arranged between the light irradiation unit and the image acquisition device; and a control unit that determines whether the part is defective based on the side image.

[0015] The control unit can extract an image of an area of ​​interest including at least a portion of the part in contact with the placement machine in the side image, and determine whether the part is defective based on whether the image of the area of ​​interest meets a predetermined defect judgment condition.

[0016] The control unit determines the state of the part as one of a normal state and a defective state based on whether an area corresponding to the part and an area corresponding to the mounter within the image of the region of interest satisfy a predetermined condition.

[0017] The control unit may determine that the state of the component is a normal state when the total number of pixels included in the area corresponding to the component and the number of pixels included in the area corresponding to the mounter is greater than a predetermined first critical number.

[0018] The control unit may determine the state of the part as a defective state when the total number of pixels included in the area corresponding to the part and the number of pixels included in the area corresponding to the placement machine is less than a predetermined first critical number.

[0019] The control section determines the state of the part as one of a normal state and a defective state based on whether a region corresponding to the interval between the part and the mounter within the image of the region of interest satisfies a predetermined condition.

[0020] The control unit may determine that the state of the part is a normal state when the number of pixels included in the area corresponding to the interval is less than a predetermined second critical number.

[0021] The control unit may determine that the state of the component is a defective state when the number of pixels included in the area corresponding to the interval is equal to or larger than a predetermined second threshold number.

[0022] The control section determines whether a part includes a defect including information on a direction in which the part is tilted based on a pattern of a region corresponding to a space between the part and the mounter within the image of the region of interest.

[0023] The control unit confirms a first length in the first direction as the length of the suction nozzle in contact with the part in the placement machine, confirms a second length in the first direction as the length of the part, and determines the length of the area of ​​interest in the first direction based on the shorter length of the first length and the second length.

[0024] According to the present invention, it is possible to correctly judge whether the picked-up parts are defective, thereby reducing the production ratio of defective printed circuit boards and further improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a diagram schematically showing the structure of a chip mounter according to an embodiment of the present invention.

[0026] Figure 21 is a diagram showing a side surface of the component 200 when the suction nozzle 140 is located on a virtual line connecting the image acquisition device 150 and the light irradiation unit 160 .

[0027] Figure 3 Is the nozzle 140 Figure 2 An example of a side image 310 of a part 200 captured by the image capture device 150 in the state of being arranged as shown.

[0028] Figure 4 as well as Figure 5 3 is an example of an image of the region of interest 313 extracted through the above process.

[0029] Figure 6 4 is a diagram showing a region of interest 410 when a defective part is picked up.

[0030] Figure 7 is a diagram showing a region of interest 420 when another type of defective part is picked up.

[0031] Figure 8 The flowchart is for explaining a method for determining whether a component 200 is defective, which is performed by the placement machine 100 according to an embodiment of the present invention.

[0032] Description of reference numerals:

[0033] 100: Chip mounter 110: Control unit

[0034] 120: Memory 130: Communication unit

[0035] 140: Suction nozzle 150: Image acquisition device

[0036] 160: Light irradiation unit 200: Parts DETAILED DESCRIPTION

[0037] The present invention can be subjected to various changes and can have various embodiments, and specific embodiments will be shown in the drawings and described in detail in the specification. Figure 1 The advantages and features of the present invention and methods for achieving the advantages and features of the present invention will be clearly understood by referring to the embodiments described in detail below. The present invention can be implemented in various forms and is not limited to the embodiments disclosed below.

[0038] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. When describing with reference to the accompanying drawings, the same or corresponding components are denoted by the same reference numerals, and repeated descriptions thereof will be omitted.

[0039] In the following embodiments, the terms "first" and "second" are not restrictive, but are used to distinguish one constituent element from another constituent element. In the following embodiments, unless the context clearly indicates other meanings, the singular expression also includes the plural expression. In the following embodiments, the terms "including" or "having" mean the existence of the features or constituent elements recorded in the specification, and do not exclude the possibility of adding more than one other features or constituent elements. For the convenience of explanation, the size of the constituent elements in the drawings may be enlarged or reduced. For example, the size and shape of each structure in the drawings are expressed as arbitrary sizes and shapes for the convenience of explanation, so the present invention is not necessarily limited to the content shown.

[0040] Figure 1 It is a diagram schematically showing the structure of a chip mounter according to an embodiment of the present invention.

[0041] The chip mounter 100 according to an embodiment of the present invention determines whether the part 200 is defective based on the side image of the part 200 picked up by the suction nozzle 140. The chip mounter 100 according to an embodiment of the present invention as described above may include a control unit 110, a memory 120, a communication unit 130, a suction nozzle 140, an image acquisition device 150, and a light irradiation unit 160.

[0042] In the present invention, the chip mounter 100 or chip mounter system refers to a device of various forms and / or structures that automatically mounts surface mount components on a printed circuit board.

[0043] Therefore, in addition to Figure 1 In addition to the components shown, the placement machine 100 may also include other components such as a parts supply unit (not shown) and a driving unit (not shown). The parts supply unit (not shown) supplies parts to be installed on the printed circuit board, and the driving unit (not shown) is attached with a suction nozzle and actually moves the parts to the printed circuit board.

[0044] In the present invention, the "defect" of the part 200 may mean all states in which the part 200 is not suitable for the production of printed circuit boards. Therefore, the defect of the part 200 includes not only the situation in which the part 200 cannot be used due to the defect of the part itself, but also the situation in which the part 200 has no defect but the picking state of the nozzle 140 is not suitable or the part cannot be used due to the defect of the nozzle 140 (e.g., slight defect of the nozzle 140, contamination of the nozzle 140, etc.).

[0045] The control unit 110 according to an embodiment of the present invention controls the various components of the placement machine 100 according to a predetermined control signal, so that the placement machine 100 can determine whether the part 200 is defective. For example, the control unit 110 can control the suction nozzle 140 to move to a position suitable for acquiring an image, and can also control the image acquisition device 150 to acquire a side image of the part 200 picked up by the suction nozzle 140.

[0046] According to an embodiment of the present invention, the control unit 110 may include all kinds of devices capable of processing data, such as a processor. Among them, "processor" may, for example, mean a device having a physically structured circuit to execute functions represented as codes or instructions included in a program, and built into hardware. As an example of a data processing device built into hardware as described above, it may include a microprocessor, a central processing unit (CPU), a processor core, a multiprocessor, an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA), and the like, but the scope of the present invention is not limited thereto.

[0047] The memory 120 according to an embodiment of the present invention performs a function of temporarily or permanently storing data, instructions, programs, program codes, or a combination thereof processed by the control unit 110. In addition, the memory 120 may also temporarily and / or permanently store the side image of the part 200 acquired by the image acquisition device 150. The memory 120 as described above may include a magnetic storage medium or a flash storage medium, but the scope of the present invention is not limited thereto.

[0048] The communication unit 130 according to an embodiment of the present invention means hardware and / or software for performing the function of transmitting and receiving data between the chip mounter 100 and an external device. For example, the communication unit 130 can perform the function of transmitting the defect of the part 200 determined by the chip mounter 100 to the user's terminal (not shown). However, this is only an exemplary function, and the function of the communication unit 130 is not limited to this.

[0049] The suction nozzle 140 according to an embodiment of the present invention means a member of various forms for picking up the part 200. For example, the suction nozzle 140 may be a member that uses air pressure to pick up the part 200. However, the member that uses air pressure as described above is only exemplary, and the concept of the present invention is not limited thereto. A member that temporarily picks up a part according to a control signal may be used as the suction nozzle 140 of the present invention regardless of its name.

[0050] The image acquisition device 150 according to an embodiment of the present invention can acquire an image for determining whether the picked-up part 200 has defects. For example, the image acquisition device 150 can acquire a side image of the part 200 when the part 200 is picked up by the suction nozzle 140 .

[0051] The image acquisition device 150 according to an embodiment of the present invention may also include an optical unit (not shown) for acquiring an image, a sensor control unit (not shown) for processing the acquired image, etc. Here, the optical unit (not shown) may include a lens for converting light (Light) into an electrical signal and an image sensor. The lens may be a lens group consisting of more than one lens. The image sensor may convert an image input through the lens into an electrical signal. For example, the image sensor may be a semiconductor element such as a charge-coupled device (Charge-Coupled Device) or a complementary metal oxide semiconductor (Complementary Metal Oxide Semiconductor) that can convert an optical signal into an electrical signal (illustrated by an image in the present invention).

[0052] According to an embodiment of the present invention, the light irradiation unit 160 may irradiate light toward the part 200 when the image acquisition device 150 acquires a side image of the part 200 .

[0053] On the other hand, in order for the image acquisition device 150 to acquire a more appropriate side image of the part 200 , the light irradiation unit 160 according to an embodiment of the present invention may sandwich the suction nozzle 140 between the image acquisition device 150 and be arranged face to face with the image acquisition device 150 .

[0054] Therefore, in one embodiment of the present invention, the light irradiation unit 160 can be arranged so that the suction nozzle 140 for picking up the part 200 is located on the virtual line connecting the image acquisition device 150 and the light irradiation unit 160. At this time, the image acquisition device 150 can be arranged in a neat manner so that the virtual line is consistent with the optical axis of the image acquisition device 150, and the light irradiation unit 160 can also be arranged in a neat manner so that the central axis of the light irradiation unit 160 is consistent with the virtual line. However, the above arrangement is only exemplary, and the concept of the present invention is not limited thereto.

[0055] The chip mounter 100 according to an embodiment of the present invention may include more components in addition to the above components. For example, the chip mounter 100 may further include a display unit (not shown) indicating the result of the judgment whether the part 200 is defective, and may further include an input unit (not shown) for receiving user input. However, this is exemplary, and the concept of the present invention is not limited to this.

[0056] The following description will focus on the method by which the control unit 110 of the mounter 100 determines whether the picked-up component 200 is defective.

[0057] According to an embodiment of the present invention, the control unit 110 may control the suction nozzle 140 to pick up the part 200 .

[0058] The control unit 110 according to an embodiment of the present invention can perform the picking of the component 200 as described above in a part of the component mounting process. That is, the method for determining whether a component is defective according to an embodiment of the present invention can correspond to a part of the component mounting process.

[0059] In an example in which the suction nozzle 140 picks up a part using suction force according to an embodiment of the present invention, the control unit 110 may appropriately adjust the suction pressure of the suction nozzle 140 for picking up the part.

[0060] According to an embodiment of the present invention, the control unit 110 can use the image acquisition device 150 to acquire a side image of the part 200 when the part 200 is picked up by the suction nozzle 140 .

[0061] To this end, the control unit 110 according to an embodiment of the present invention moves the suction nozzle 140 appropriately in three-dimensional space, making it easier to obtain the side image. For example, the control unit 110 can move the suction nozzle 140 so that the suction nozzle 140 is located on a virtual line connecting the image acquisition device 150 and the light irradiation unit 160. Of course, the suction nozzle 140 may have already picked up the part 200 at this time.

[0062] Figure 2 The figure shows the side surface of the component 200 when the suction nozzle 140 is located on a virtual line connecting the image acquisition device 150 and the light irradiation unit 160 .

[0063] According to an embodiment of the present invention, the control unit 110 is configured to control the suction nozzle 140 of the picked-up part 200 to be located at a position such as Figure 2 In the state of the position shown, you can get Figure 3 A side view of part 200 is shown.

[0064] According to an embodiment of the present invention, the control unit 110 turns on the light of the light irradiation unit 160 when the image acquisition device 150 acquires the side image of the part 200, so that the interval (or gap) between the suction nozzle 140 and the part 200 can be well represented in the image. Of course, when the image acquisition device 150 is not used, the control unit 110 can turn off the light of the light irradiation unit to prevent unnecessary power consumption.

[0065] Figure 3 Is the nozzle 140 Figure 2 An example of a side image 310 of a part 200 captured by the image capturing device 150 in the state of being arranged as shown. Figure 3 As shown, the image 310 may include an area 311 corresponding to the suction nozzle 140 and an area 312 corresponding to the side of the part 200. Of course, in addition to the two areas 311 and 312 mentioned above, the image 310 may also include an area corresponding to the interval between the suction nozzle 140 and the part 200 and an area corresponding to the air.

[0066] According to an embodiment of the present invention, the control unit 110 may extract an image of a region of interest 313 including at least a portion of a portion where the part 200 contacts the suction nozzle 140 from the side image 310 .

[0067] Here, the control unit 110 according to an embodiment of the present invention may predetermine the size of the region of interest to extract the image when extracting the image of the region of interest 313. For example, the control unit 110 may determine the first direction (eg, Figure 2 The control unit 110 may determine the length of the region of interest in the first direction based on the shorter length of the confirmed first length and the second length. In this case, the control unit 110 may also apply a predetermined scale factor (Scale Factor) to the shorter length of the two to determine the length of the region of interest in the first direction. In this case, the scale factor may be a number less than 1.

[0068] As an example, Figure 3 As shown, when the lengths of the nozzle 140 and the part 200 in the first direction are the same, the control unit 110 may apply a proportional factor of 0.7 to the length of one of the nozzle 140 and the part 200 in the first direction, so that the length of the region of interest in the first direction is shorter than the length of the nozzle 140 in the first direction. However, this is only exemplary, the concept of the present invention is not limited thereto, and the proportional factor may be appropriately set according to the use and / or purpose of the placement machine 100.

[0069] Figure 4as well as Figure 5 is an example of an image of the region of interest 313 extracted through the above process. According to an embodiment of the present invention, the control unit 110 can determine whether the part 200 is defective based on whether the image of the region of interest 313 satisfies a predetermined defect judgment condition. At this time, the control unit 110 uses a variety of defect judgment conditions to determine whether the part 200 is defective.

[0070] According to an embodiment of the present invention, the control unit 110 determines the state of the part 200 as either a normal state or a defective state based on whether the area 313-2 corresponding to the part 200 and the area 313-1 corresponding to the suction nozzle 140 in the image of the area of ​​interest 313 meet predetermined conditions.

[0071] For example, when the total number of pixels included in the area 313 - 2 corresponding to the part 200 and the total number of pixels included in the area 313 - 1 corresponding to the suction nozzle 140 is greater than a predetermined first critical number, the control unit 110 determines that the state of the part 200 is normal.

[0072] However, on the contrary, when the sum of the number of pixels included in the area 313-2 corresponding to the part 200 and the number of pixels included in the area 313-1 corresponding to the suction nozzle 140 is less than a predetermined first critical number, the control unit 110 determines that the state of the part 200 is a defective state.

[0073] The reason why the defect of the part 200 can be determined by the two regions 313-1 and 313-2 as described above is that when the surface of the picked-up part 200 (i.e., the surface in contact with the suction nozzle 140) is not flat due to the defect of the part 200, the number of pixels occupied by the two regions 313-1 and 313-2 in the region of interest 313 is reduced. Therefore, the control unit 110 determines whether the part 200 has a defect based on the number of pixels constituting the region of interest 313.

[0074] The control unit 110 according to another embodiment of the present invention determines the state of the part as one of a normal state and a defective state according to whether the area 313 - 3 corresponding to the interval between the part 200 and the suction nozzle 140 within the image of the area of ​​interest 313 satisfies a predetermined condition.

[0075] For example, when the number of pixels included in the area 313-3 corresponding to the interval is less than a predetermined second critical number, the control unit 110 determines the state of the part 200 as a normal state, and when the number of pixels in the area 313-3 corresponding to the interval is greater than the second critical number, the control unit 110 determines the state of the part 200 as a defective state. The basis for the determination is that when the surface of the picked-up part 200 (i.e., the surface in contact with the suction nozzle 140) is uneven due to a defect of the part 200, the number of pixels occupied by the area 313-3 corresponding to the interval in the region of interest 313 will increase.

[0076] In an optional embodiment, the control unit 110 according to an embodiment of the present invention determines whether the part includes a defect including information about the direction in which the part 200 is tilted based on the pattern of the area 313-3 corresponding to the interval between the part 200 and the suction nozzle 140 within the image of the area of ​​interest 313.

[0077] Figure 6 4 is a diagram showing the region of interest 410 when a defective part 200 is picked up. Figure 6 When the surface of the picked-up part 200 shown is not flat due to a defect of the part 200, the pixels occupied by the area 413 corresponding to the interval in the region of interest 313 will increase, and the pixels occupied by the area corresponding to the suction nozzle 140 and the area corresponding to the part 200 will decrease. The control unit 110 determines whether the part 200 has a defect according to the above process based on the number of pixels in the area 413 or the sum of the number of pixels in the areas 411 and 412.

[0078] Figure 7 4 is a diagram showing an area of ​​interest 420 when picking up another type of defective part. The following description assumes that the part 200 is picked up in a tilted state. Figure 7 .

[0079] The control unit 110 according to an alternative embodiment of the present invention determines whether the part includes a defect including information about the direction in which the part 200 is tilted based on the pattern of the area 423 corresponding to the interval between the part 200 and the suction nozzle 140 within the image of the region of interest 420. Figure 7 In the case of FIG. 4 , the control unit 110 determines that the part 200 is in a defective state of being tilted by -5° with respect to the Y direction based on the image of the region of interest 420. However, this is merely an example and the concept of the present invention is not limited thereto.

[0080] Figure 8 The flowchart is for explaining a method for determining whether a component 200 is defective by a chip mounter 100 according to an embodiment of the present invention. Figures 1 to 7 A detailed description of the contents described in the Figures 1 to 7 Refer to it together.

[0081] The placement machine 100 according to an embodiment of the present invention can use the image acquisition device 150 to acquire a side image of the part 200 when the part 200 is picked up by the suction nozzle 140 ( S81 ).

[0082] To this end, the placement machine 100 according to an embodiment of the present invention appropriately moves the suction nozzle 140 in three-dimensional space to make it easier to obtain the side image. For example, the placement machine 100 moves the suction nozzle 140 so that the suction nozzle 140 is located on the virtual line connecting the image acquisition device 150 and the light irradiation unit 160. Of course, the suction nozzle 140 may have already picked up the part 200 at this time.

[0083] According to an embodiment of the present invention, the placement machine 100 is located at a position where the nozzle 140 for picking up the part 200 is located. Figure 2 In the state of the position shown, it is possible to obtain Figure 3 A side view of part 200 is shown.

[0084] According to an embodiment of the present invention, the chip mounter 100 turns on the light of the light irradiation unit when the image acquisition device 150 acquires the side image of the part 200, so that the interval (or gap) between the suction nozzle 140 and the part 200 is better represented in the image. Of course, when the chip mounter 100 is not in use and the image acquisition device is in a state, the light of the light irradiation unit can also be turned off to prevent unnecessary power consumption.

[0085] like Figure 3 As shown, the image 310 may include an area 311 corresponding to the nozzle 140 and an area 312 corresponding to the side of the part 200. Of course, in addition to the two areas 311 and 312 mentioned above, an area corresponding to the interval between the nozzle 140 and the part 200 and an area corresponding to the air may also be included.

[0086] The mounter 100 according to an embodiment of the present invention may extract an image of a region of interest 313 including at least a portion of a portion where the part 200 contacts the suction nozzle 140 from the side image 310 ( S82 ).

[0087] Here, the placement machine 100 according to an embodiment of the present invention can predetermine the size of the region of interest when extracting the image of the region of interest 313. For example, the placement machine can confirm that the nozzle 140 is facing the first direction (for example, Figure 2The first length of the length of the part 200 in the +X direction) can also be confirmed, and the second length of the length of the part 200 in the first direction can also be confirmed. In addition, the placement machine 100 determines the length of the region of interest in the first direction based on the shorter length of the confirmed first length and the second length. At this time, the placement machine 100 can also apply a predetermined scale factor (Scale Factor) to the shorter length of the two to determine the length of the region of interest in the first direction. At this time, the scale factor can be a number less than 1.

[0088] As an example, Figure 3 As shown, when the lengths of the nozzle 140 and the part 200 in the first direction are the same, the placement machine 100 may apply a proportional factor of 0.7 to the length of one of the nozzle 140 and the part 200 in the first direction, so that the length of the region of interest in the first direction is shorter than the length of the nozzle 140 in the first direction. However, this is only exemplary, the concept of the present invention is not limited thereto, and the proportional factor may be appropriately set according to the use and / or purpose of the placement machine 100.

[0089] According to an embodiment of the present invention, the chip mounter 100 can determine whether the part 200 is defective based on whether the image of the region of interest 313 satisfies a predetermined defect judgment condition (S83). At this time, the chip mounter 100 uses a variety of defect judgment conditions to determine whether the part 200 is defective. Figures 4 to 5 To explain.

[0090] According to an embodiment of the present invention, the placement machine 100 determines the state of the part 200 as either a normal state or a defective state based on whether the area 313-2 corresponding to the part 200 and the area 313-1 corresponding to the suction nozzle 140 in the image of the area of ​​interest 313 meet predetermined conditions.

[0091] For example, when the sum of the number of pixels included in the area 313-2 corresponding to the part 200 and the number of pixels included in the area 313-1 corresponding to the suction nozzle 140 is greater than a predetermined first critical number, the placement machine 100 determines that the state of the part 200 is normal.

[0092] However, on the contrary, when the sum of the number of pixels included in the area 313-2 corresponding to the part 200 and the number of pixels included in the area 313-1 corresponding to the suction nozzle 140 is less than a predetermined first critical number, the placement machine 100 determines that the state of the part 200 is a defective state.

[0093] The reason why the defect of the part 200 can be determined by the two regions 313-1 and 313-2 as described above is that when the surface of the picked-up part 200 (i.e., the surface in contact with the suction nozzle 140) is not flat due to the defect of the part 200, the number of pixels occupied by the two regions 313-1 and 313-2 in the region of interest 313 is reduced. Therefore, the placement machine 100 determines whether the part 200 has a defect based on the number of pixels constituting the region of interest 313.

[0094] According to another embodiment of the present invention, the placement machine 100 determines the state of the part as one of a normal state and a defective state according to whether the area 313-3 corresponding to the interval between the part 200 and the suction nozzle 140 in the image of the area of ​​interest 313 satisfies a predetermined condition.

[0095] For example, when the number of pixels included in the area 313-3 corresponding to the interval is less than a predetermined second critical number, the placement machine 100 determines the state of the part 200 as a normal state, and when the number of pixels in the area 313-3 corresponding to the interval is greater than the second critical number, the state of the part 200 is determined to be a defective state. The basis for the determination is that when the surface of the picked-up part 200 (i.e., the surface in contact with the suction nozzle 140) is uneven due to a defect of the part 200, the number of pixels occupied by the area 313-3 corresponding to the interval in the region of interest 313 will increase.

[0096] In an alternative embodiment, the mounter 100 according to an embodiment of the present invention determines whether the part includes a defect including information about the direction in which the part 200 is tilted based on the pattern of the area 313 - 3 corresponding to the interval between the part 200 and the suction nozzle 140 within the image of the area of ​​interest 313 .

[0097] The above-described embodiment of the present invention can be embodied in the form of a computer program that can be executed on a computer through a variety of components, and the computer program described above can be recorded in a medium that can be read by a computer. Among them, the medium may include magnetic media such as hard disks, floppy disks and tapes, optical recording media such as CD-ROMs and DVDs, magneto-optical media such as floptical disks, and hardware devices such as ROMs, RAMs, and flash memories that are specially configured to store and execute computer instructions. Further, the medium may include an intangible medium that is implemented in a form that can be transmitted on a network, for example, a medium that can be implemented in the form of software or an application program and can be transmitted and circulated through a network.

[0098] On the other hand, the computer program may be a program specially designed and constructed for the present invention or recognized and usable by those skilled in the field of computer software. In the example of a computer program, it may include not only machine language codes made by a compiler, but also high-level language codes that can be executed by a computer using an interpreter, etc.

[0099] The specific implementation described in the present invention is an embodiment, and any method is not intended to limit the scope of the present invention. For the sake of brevity of the specification, the existing electronic structure, control system, software, and other functional aspects of the system may be omitted. In addition, the line connections or connecting parts between the constituent elements shown in the drawings are exemplary functional connections and / or physical or circuit connections, which can be replaced in actual devices, or can be presented as additional multiple functional connections, physical connections, or circuit connections. In addition, as long as there is no specific mention such as "necessary", "important", etc., it may not be a constituent element that is necessary for the application of the present invention.

[0100] Therefore, the concept of the present invention cannot be determined to be limited to the embodiments described above, and all scopes of the claims and equivalents or equivalent changes to the claims belong to the scope of the concept of the present invention.

Claims

1. A method for determining whether a part is defective, as a method for determining whether the part is defective based on a side image of a part picked up by a placement machine, comprising the following steps: Acquire a side image of the part when it is picked up by the placement machine; Extracting an image of a region of interest including at least a portion of a portion of the part in contact with the placement machine from the side image; and Whether the part is defective is determined based on the number of pixels included in the region of interest.

2. The method for determining whether a part is defective according to claim 1, wherein: The step of determining whether the part is defective comprises the following steps: The state of the part is determined as one of a normal state and a defective state based on whether the area corresponding to the part and the area corresponding to the placement machine within the image of the region of interest meet a predetermined condition.

3. The method for determining whether a part is defective according to claim 1, wherein: The step of determining whether the part is defective comprises the following steps: The state of the part is determined as one of a normal state and a defective state based on whether a region corresponding to the interval between the part and the mounter within the image of the region of interest satisfies a predetermined condition.

4. The method for determining whether a part is defective according to claim 1, wherein: The step of determining whether the part is defective comprises the following steps: Whether the part includes a defect including information about a direction in which the part is tilted is determined based on a pattern of an area within the image of the region of interest corresponding to the interval between the part and the placement machine.

5. The method for determining whether a part is defective according to claim 1, wherein: The step of extracting an image of the region of interest comprises the step of determining the size of the region of interest, The step of determining the size of the region of interest comprises the following steps: confirming a first length which is a length in a first direction of a nozzle in contact with the part in the placement machine; determining a second length that is a length of the part in the first direction; and The length of the region of interest in the first direction is determined based on the shorter length of the first length and the second length. 6 . A recording medium recording a computer program for executing the method according to claim 1 through claim 5 by a computer.

7. A chip mounter, as a chip mounter for judging whether a picked-up part is defective based on a side image of the picked-up part, comprising: a suction nozzle for picking up the part; An image acquisition device for acquiring a side image of the part when it is picked up by the suction nozzle; a light irradiation unit arranged face to face with the image acquisition device, irradiating light to the suction nozzle arranged between the light irradiation unit and the image acquisition device; as well as a control unit, determining whether the part is defective based on the side image, The control unit extracts an image of a region of interest including at least a portion of the part in contact with the placement machine from the side image, and determines whether the part is defective based on the number of pixels included in the region of interest.

8. The chip mounter according to claim 7, wherein: The control section determines the state of the part as one of a normal state and a defective state based on whether a region corresponding to the part and the mounter within the image of the region of interest satisfies a predetermined condition.

9. The chip mounter according to claim 7, wherein: The control section determines the state of the part as one of a normal state and a defective state based on whether a region corresponding to the interval between the part and the mounter within the image of the region of interest satisfies a predetermined condition.

10. The chip mounter according to claim 7, wherein: The control section determines whether the part includes a defect including information on a direction in which the part is tilted based on a pattern of a region corresponding to a space between the part and the mounter within the image of the region of interest.

11. The chip mounter according to claim 7, wherein: The control unit confirms a first length in the first direction as the length of the suction nozzle in contact with the part in the placement machine, confirms a second length in the first direction as the length of the part, and determines the length of the area of ​​interest in the first direction based on the shorter length of the first length and the second length.

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