A decoupled dual-polarized low-frequency oscillator and an embedded dual-band array antenna

Abstract

The present invention discloses a decoupled dual-polarized low-frequency oscillator and an embedded dual-band array antenna, belonging to the field of communication technology. It includes a low-frequency array and a high-frequency array arranged on a reflector. Each low-frequency oscillator of the low-frequency array includes four oscillator radiators. The oscillator arms and baluns of the oscillator radiators are respectively truncated into four parts and arranged at intervals. The electrical size of each part is less than the half wavelength corresponding to the highest frequency point of the operating frequency band of the high-frequency oscillator. At the same time, the interrupted oscillator arms and baluns are connected through a microstrip decoupling circuit board. By adjusting the parameters of the microstrip decoupling circuit board, the present invention can minimize the induced current on the low-frequency oscillator arms, thereby greatly reducing the negative impact on the high-frequency oscillators inside and outside the low-frequency oscillator cavity. At the same time, it reduces the electrical size of the entire antenna array, realizes miniaturization, and has strong stability.

Description

Technical Field

[0001] The present invention relates to the field of communication technologies, and particularly to a decoupled dual-polarized low-frequency oscillator and an embedded dual-band array antenna. Background Art

[0002] With the development of mobile communication technologies and the increasing surge in the system's demand for miniaturization, multiple antennas operating in different frequency bands are often integrated on a communication platform to meet different communication standards. Due to the compression of size, the spacing between antennas operating in different frequency bands becomes smaller and smaller, resulting in increasing coupling between them. How to reduce the coupling of antennas in different frequency bands under such circumstances has become a key issue in the development of antenna arrays at the present stage.

[0003] In engineering design, taking a base station antenna as an example, as Figure 1 shown, a reliable existing method is a dual-band nested structure. In the design, the antenna operating in the higher frequency band can be placed inside the cavity of the antenna operating in the lower frequency band, so as to minimize the mutual influence between the high-frequency and low-frequency antennas. However, this nested structure can only reduce the influence of the low-frequency oscillator on the high-frequency oscillator inside its cavity, and for the high-frequency oscillator outside the cavity of the low-frequency oscillator, its negative impact is still very large. Therefore, it is necessary to design a new type of low-frequency oscillator with filtering characteristics to reduce the negative impact on the high-frequency oscillators inside and outside the cavity, thereby contributing to the design of small-size, dual-band antenna arrays. Summary of the Invention

[0004] The technical problems to be solved by the present invention are: to provide a decoupled dual-polarized low-frequency oscillator, whose negative impact on the high-frequency oscillators inside and outside the cavity is greatly reduced; and at the same time to provide an embedded dual-band array antenna, which can reduce the electrical size of the entire antenna array, achieve miniaturization, and has strong stability.

[0005] A decoupled dual-polarized low-frequency oscillator includes four oscillator radiators with dual-polarized orthogonality. Each oscillator radiator includes two oscillator arms and a balun. The two oscillator arms are symmetrically arranged with respect to the balun. The balun includes two balun arms arranged in parallel and separated. The tops of the two balun arms are respectively connected to the corresponding oscillator arms, and the bottoms are commonly connected to a base. Each oscillator arm is truncated into two oscillator arm sub-units. The two oscillator arm sub-units are arranged at intervals and a first microstrip decoupling circuit board is connected between them; each balun arm is truncated into two balun arm sub-units. The two balun arm sub-units are arranged at intervals and a second microstrip decoupling circuit board is connected between them; a feeding piece is connected between the two oscillator arm sub-units at the middle position of each oscillator radiator.

[0006] Further, the electrical sizes of the oscillator arm sub-units and the balun arm sub-units are both smaller than the half wavelength corresponding to the highest frequency point of the operating frequency band of the high-frequency oscillators integrated on the same reflector.

[0007] Furthermore, the four oscillator arm sub-units on each oscillator radiator are centrosymmetrically distributed with respect to the balun, and the four balun arm sub-units on each oscillator radiator are centrosymmetrically distributed with respect to the longitudinal axis of the balun.

[0008] Further, a microstrip decoupling structure is printed on one side of the first microstrip decoupling circuit board, and the other side is closely attached to the two truncated oscillator arm sub-units; a microstrip decoupling structure is printed on one side of the second microstrip decoupling circuit board, and the other side is closely attached to the two truncated balun arm sub-units.

[0009] Furthermore, the microstrip decoupling structure includes a meandered line equivalent to a parallel circuit of an inductor L1 and a capacitor C1, and microstrip lines equivalent to series capacitors C2 located on both sides of the meandered line.

[0010] Furthermore, the meandered line is in an S shape, and by designing the parameters of the meandered line, the equivalent inductor L1 and capacitor C1 are changed so that the induced current generates a minimum amplitude in the high-frequency band.

[0011] Furthermore, the oscillator arm sub-units, the balun arm sub-units, the first microstrip decoupling circuit board, and the second microstrip decoupling circuit board are all fixed on the dielectric support frame by dielectric screws.

[0012] Furthermore, the dielectric support frame includes an annular fixing frame and four support legs evenly distributed under the fixing frame. The two balun arms of each oscillator radiator are arranged on the left and right sides of the support legs, and the oscillator arms are arranged on the outer periphery of the fixing frame.

[0013] An embedded dual-band array antenna includes a reflector, a low-frequency array and a high-frequency array provided on the reflector. The low-frequency array and the high-frequency array are correspondingly provided with at least one low-frequency oscillator and at least one high-frequency oscillator. The low-frequency oscillator is the decoupled dual-polarization low-frequency oscillator described in any one of the above, and a high-frequency oscillator is embedded inside the low-frequency oscillator.

[0014] Further, a high-frequency oscillator is provided between every two adjacent low-frequency oscillators, and the high-frequency oscillators inside and outside the low-frequency oscillator jointly form a high-frequency array.

[0015] Furthermore, the low-frequency oscillators in each low-frequency array and the high-frequency oscillators in each high-frequency array are linearly arranged at equal intervals of 0.5 - 1 times the wavelength of the center frequency of the operating frequency band.

[0016] Furthermore, the reflector of the high-frequency oscillator located inside the low-frequency oscillator is placed above the base, and the reflectors of the high-frequency oscillators located inside and outside the low-frequency oscillator do not contact the low-frequency oscillator.

[0017] Furthermore, the high-frequency oscillator includes a box-shaped reflector, two mutually perpendicular dielectric support plates, and a dielectric plate horizontally placed on the dielectric support plates; the dielectric support plates are vertically arranged on the box-shaped reflector, and the microstrip balun structure is printed on both sides of the dielectric support plates, and two mutually perpendicular radiator oscillator pairs are printed on the dielectric plate.

[0018] The beneficial effects brought by the present invention are as follows:

[0019] 1. For the decoupled dual-polarized low-frequency oscillator of the present invention, the oscillator arms and the balun are respectively truncated into four parts and arranged at intervals, and a microstrip decoupling circuit is also introduced, so that in the embedded dual-band array, the influence on the S parameters and radiation patterns of the high-frequency oscillators inside and outside the low-frequency oscillator cavity is greatly reduced.

[0020] 2. The meandering lines on the microstrip decoupling circuit board form a parallel resonance circuit in the high-frequency band, which plays a role in suppressing the induced current on the low-frequency oscillator; the two microstrip lines on both sides form a series resonance circuit in the low-frequency band to ensure that it does not affect the radiation of the low-frequency oscillator. By designing the parameters of the meandering lines on the microstrip decoupling circuit board, the amplitude of the induced current on the low-frequency oscillator in the high-frequency band can be reduced to the lowest value, thereby reducing the influence of the low-frequency oscillator on the high-frequency oscillator.

[0021] 3. The truncated low-frequency oscillator arms, balun, and microstrip decoupling circuit board are fixed on the dielectric support frame by dielectric screws, ensuring the stability of the assembly of the low-frequency oscillator.

[0022] 4. This antenna can reduce the electrical size of the entire antenna, achieve miniaturization, and has a good effect of suppressing the cross polarization of the antenna. Description of the Drawings

[0023] Figure 1 is a schematic diagram of the arrangement structure of the embedded dual-band array antenna;

[0024] Figure 2 is a schematic diagram of the structure of part of the details of the embedded dual-band array antenna of the present invention;

[0025] Figure 3 is a schematic diagram of the structure of the low-frequency oscillator of the present invention;

[0026] Figure 4 is a schematic diagram of the structure of the support frame of the present invention;

[0027] Figure 5 is a structural diagram of the microstrip decoupling circuit board;

[0028] Figure 6It is the equivalent circuit diagram of the microstrip decoupling circuit board;

[0029] Figure 7 It is the amplitude comparison diagram of the induced current on the oscillator arms of the low-frequency oscillator using the prior art and the low-frequency oscillator of the present invention;

[0030] Figure 8A It is the simulation schematic diagram of the radiation pattern at the 1.7 GHz frequency point when an ordinary low-frequency oscillator of the prior art is placed around the high-frequency oscillator;

[0031] Figure 8B It is the simulation schematic diagram of the radiation pattern at the 1.7 GHz frequency point when the low-frequency oscillator of the present invention is placed around the high-frequency oscillator;

[0032] Figure 9A It is the simulation schematic diagram of the radiation pattern at the 2.2 GHz frequency point when an ordinary low-frequency oscillator of the prior art is placed around the high-frequency oscillator;

[0033] Figure 9B It is the simulation schematic diagram of the radiation pattern at the 2.2 GHz frequency point when the low-frequency oscillator of the present invention is placed around the high-frequency oscillator;

[0034] Figure 10A It is the simulation schematic diagram of the radiation pattern at the 2.7 GHz frequency point when an ordinary low-frequency oscillator of the prior art is placed around the high-frequency oscillator;

[0035] Figure 10B It is the simulation schematic diagram of the radiation pattern at the 2.7 GHz frequency point when the low-frequency oscillator of the present invention is placed around the high-frequency oscillator.

[0036] Reference numerals: 1. Reflector, 2. Low-frequency array, 3. High-frequency array, 4. Low-frequency oscillator, 5. High-frequency oscillator; 41a. First oscillator radiator, 41b. Second oscillator radiator, 41c. Third oscillator radiator, 41d. Fourth oscillator radiator, 41e. Base, 42a. First oscillator arm sub-unit, 42b. Second oscillator arm sub-unit, 42c. Third oscillator arm sub-unit, 42d. Fourth oscillator arm sub-unit, 42e. Feeding sheet, 42f. Preset through-hole, 43a. First microstrip decoupling circuit board, 43b. Circular through-hole, 44a. First balun arm sub-unit, 44b. Second balun arm sub-unit, 44c. Third balun arm sub-unit, 44d. Fourth balun arm sub-unit, 45a. Second microstrip decoupling circuit board, 46. Support frame, 47a. Meandering line, 47b. First microstrip line, 47c. Second microstrip line; 51. Box-shaped reflector, 52. Dielectric board, 53. Dielectric support plate. Detailed implementation manners

[0037] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0038] Figure 1 The layout structure of an embedded dual - band array antenna is schematically shown, including a reflector 1, a column of low - frequency arrays 2 and a column of high - frequency arrays 3 arranged on the reflector. The low - frequency array 2 and the high - frequency array 3 are correspondingly provided with at least two low - frequency oscillators 4 and at least two high - frequency oscillators 5. The low - frequency array 2 and the high - frequency array 3 are embeddedly distributed. Preferably, every other high - frequency oscillator 5 is embedded in a low - frequency oscillator 4, that is, a high - frequency oscillator 5 is arranged between every two adjacent low - frequency oscillators 4. The high - frequency oscillators 5 inside and outside the low - frequency oscillator 4 together form the high - frequency array 3. The distance between adjacent low - frequency oscillators 4 in the low - frequency array 2 is twice the distance between adjacent high - frequency oscillators 5 in the high - frequency array 3. Each low - frequency oscillator 4 in each low - frequency array 2 and each high - frequency oscillator 5 in each high - frequency array 3 are linearly arranged at equal intervals of 0.5 - 1 times the wavelength of the center frequency of the operating frequency band.

[0039] The above - mentioned low - frequency oscillators 4 and high - frequency oscillators 5 can be applied to multi - band dual - polarized cellular base station antennas. Optionally, the low - frequency array 2 operates in the frequency band of 698 - 960 MHz; the high - frequency array 3 operates in the frequency band of 1710 - 2690 MHz. The present invention is not limited to these specific frequency bands and can be used in other multi - band configurations.

[0040] Figure 2 A part of the embedded dual - band array antenna according to an embodiment of the present invention is schematically shown, including a reflector 1, a low - frequency oscillator 4 and two high - frequency oscillators 5 arranged on the reflector 1. Among them, one high - frequency oscillator 5 is placed above the base 41e inside the low - frequency oscillator 4, and the other is placed outside the low - frequency oscillator 4. The reflectors of the high - frequency oscillators 5 inside and outside the low - frequency oscillator 4 do not contact the low - frequency oscillator 4.

[0041] As Figure 2 shown, the high - frequency oscillators 5 placed inside and outside the low - frequency oscillator 4 are exactly the same. The high - frequency oscillator 5 includes a box - shaped reflector 51, a horizontally placed dielectric plate 52 and two mutually perpendicular dielectric support plates 53. Two mutually perpendicular radiator oscillator pairs are printed on the horizontally placed dielectric plate 52 for providing radiation in two polarizations. The two mutually perpendicular dielectric support plates 53 are printed with microstrip balun structures on both sides, which have the functions of balancing current and impedance transformation and are used for balanced feeding of the two radiator oscillator pairs. It should be noted that the selection of high - frequency oscillators in the present invention is not limited to the one in this embodiment.

[0042] As Figure 2As shown in the figure, the low-frequency oscillator 4 includes four exactly identical oscillator radiators: the first oscillator radiator 41a, the second oscillator radiator 41b, the third oscillator radiator 41c, and the fourth oscillator radiator 41d. Among them, the first oscillator radiator 41a and the third oscillator radiator 41c provide radiation of one polarization, and the second oscillator radiator 41b and the fourth oscillator radiator 41d provide radiation of another polarization, and the two polarization directions are perpendicular to each other. Each oscillator radiator corresponds to two oscillator arms, a balun, a feeding patch, and four microstrip decoupling circuit boards. The two oscillator arms are symmetrically spaced about the balun. The balun includes two balun arms arranged in parallel and separated. The tops of the two balun arms are respectively connected to the corresponding oscillator arms. The lower ends of the balun are commonly connected to a hollow cylindrical base 41e.

[0043] Figure 3 Figure 4 shows a more detailed schematic diagram of the assembly structure of the low-frequency oscillator 4. Figure 4 Figure 5 shows a schematic diagram of the support frame structure. Taking the first oscillator radiator 41a as an example, each oscillator arm is truncated into two oscillator arm sub-units. That is, the oscillator arm of the first oscillator radiator 41a is truncated into four parts: the first oscillator arm sub-unit 42a, the second oscillator arm sub-unit 42b, the third oscillator arm sub-unit 42c, and the fourth oscillator arm sub-unit 42d. The four truncated oscillator arm sub-units are centrosymmetrically distributed about the balun. Among them, the first oscillator arm sub-unit 42a and the fourth oscillator arm sub-unit 42d are exactly the same, the second oscillator arm sub-unit 42b and the third oscillator arm sub-unit 42c are exactly the same, and the electrical lengths of these four parts are all less than half of the wavelength at the highest frequency point in the working frequency band of the high-frequency oscillator, so as to reduce the influence on the high-frequency oscillator.

[0044] There is a preset through hole 42f on the third oscillator arm sub-unit 42c for passing the coaxial feeder. A feeding patch 42e is connected to the second oscillator arm sub-unit 42b and the third oscillator arm sub-unit 42c. One end of the feeding patch 42e is connected to the second oscillator arm sub-unit 42b, and the other end is connected to the inner conductor of the coaxial feeder.

[0045] The two oscillator arm sub-units of each oscillator arm are fixedly connected by the first microstrip decoupling circuit board 43a. The first microstrip decoupling circuit board 43a is printed with a microstrip decoupling structure on one side and closely adheres to the two truncated oscillator arm sub-units on the other side. Circular through holes 43b are opened at the left and right edges of the first microstrip decoupling circuit board 43a for passing the dielectric screws. Each first microstrip decoupling circuit board 43a and the corresponding oscillator arm sub-unit are fixed on the dielectric support frame 46 by the dielectric screws.

[0046] As Figure 3As shown, the balun corresponding to each oscillator radiator is truncated into four balun arm sub-units, and the four balun arm sub-units located on the same oscillator radiator are centrosymmetrically distributed about the longitudinal axis of the balun. Taking the first oscillator radiator 41a as an example, the balun is truncated into four parts: the first balun arm sub-unit 44a, the second balun arm sub-unit 44b, the third balun arm sub-unit 44c, and the fourth balun arm sub-unit 44d. Among them, the first balun arm sub-unit 44a and the fourth balun arm sub-unit 44d are exactly the same, and the second balun arm sub-unit 44b and the third balun arm sub-unit 44c are exactly the same. Similarly, the electrical lengths of these four parts are all less than half of the wavelength at the highest frequency point in the operating frequency band of the high-frequency oscillator, so as to reduce the influence on the high-frequency oscillator.

[0047] The two truncated balun arm sub-units on the same balun arm are fixedly connected through the second microstrip decoupling circuit board 45a. One side of the second microstrip decoupling circuit board 45a is printed with a microstrip decoupling structure, and the other side is closely attached to the two balun arm sub-units on the same balun arm. The second microstrip decoupling circuit board 45a and the truncated balun arm sub-units are both fixed on the dielectric support frame 46 through dielectric screws. The upper ends of the first balun arm sub-unit 44a and the fourth balun arm sub-unit 44d are respectively connected to the second oscillator arm sub-unit 42b and the third oscillator arm sub-unit 42c, and the lower ends are commonly connected to the hollow cylindrical base 41e.

[0048] As Figure 4 shown, the dielectric support frame 46 is supported on the reflector 1, and its shape is fitted with the low-frequency oscillator 4, and it can be processed and manufactured by 3D printing. When the printing material of the dielectric support frame is determined, the relevant parameters of the low-frequency oscillator should be readjusted according to the dielectric constant and loss tangent of the material to achieve impedance matching. The through holes at the corresponding positions on the support frame are used to pass through the dielectric screws, which play a role in supporting and fixing the truncated oscillator arms, baluns, and microstrip decoupling circuit boards, ensuring the stability of the assembly of the low-frequency oscillator. Specifically, during implementation, the two balun arms of each oscillator radiator are arranged on the left and right sides of the support legs of the support frame 46, and the oscillator arms are arranged on the outer periphery of the annular fixing frame of the support frame 46.

[0049] Figure 5 、 Figure 6The structure and equivalent circuit diagram of a microstrip decoupling circuit board are given. The microstrip decoupling structure includes a meander line 47a and a first microstrip line 47b and a second microstrip line 47c located on both sides of the meander line 47a. Among them, the meander line 47a constitutes a parallel resonance circuit with a filtering function, which is equivalent to the parallel connection of an inductor L1 and a capacitor C1. When this circuit is excited by a plane wave, the induced current will generate a minimum amplitude in the high-frequency band. By adjusting the parameters s, d, and g of the meander line, the equivalent inductance L1 and capacitance C1 can be changed, thereby adjusting the parallel resonance point and the induced current suppression bandwidth. The meander line is overall in an "S" shape, where g refers to the length of the area covered by the meander line on the circuit board, s refers to the length of the vertical bending part of the meander line from the first microstrip line 47b, and d refers to the distance between two adjacent horizontal bending parts. For a low-frequency oscillator antenna, the introduction of the meander line structure increases the inductance. In this example, capacitors are generated between the first microstrip line 47b and the second microstrip line 47c on both sides of the microstrip decoupling circuit board and the corresponding truncated oscillator arm sub-units, which is equivalent to C2 in the circuit diagram and is used to offset the inductance introduced by the meander line structure and improve the impedance matching of the low-frequency oscillator antenna.

[0050] Preferably, in this embodiment, by changing the parameters s, d, and g of the meander line, the values of the inductance L1 and capacitance C1 of the parallel resonance are changed, so that the induced current on the low-frequency oscillator arm forms a parallel resonance near the center frequency point of the operating frequency band of the high-frequency oscillator, generating a minimum amplitude of the induced current, thereby reducing the induced current generated on the low-frequency oscillator arm when the high-frequency oscillator operates, and ensuring that the influence of the low-frequency oscillator on the performance of the high-frequency oscillator is minimized.

[0051] Figure 7 It is a comparison diagram of the amplitudes of the induced currents on the oscillator arms of a low-frequency oscillator using the prior art and a low-frequency oscillator using the present invention under the excitation state of a plane wave. The low-frequency oscillator of the prior art refers to a low-frequency oscillator whose oscillator arm is not truncated and the microstrip decoupling circuit structure is not introduced. In the figure, m refers to the amplitude of the induced current on the oscillator arm of the low-frequency oscillator using the prior art; n refers to the amplitude of the induced current on the oscillator arm of the low-frequency oscillator using the present invention. From the results, the induced current on the oscillator arm of the low-frequency oscillator with the microstrip decoupling circuit structure introduced is significantly lower than that on the oscillator arm of the unchanged low-frequency oscillator.

[0052] Figure 8A and Figure 8B are respectively the front and back comparison of the radiation patterns at the 1.7 GHz frequency point when a common low-frequency oscillator of the prior art and the low-frequency oscillator of the present invention are placed around the high-frequency oscillator.

[0053] Figure 9A and Figure 9B are respectively the front and back comparison of the radiation patterns at the 2.2 GHz frequency point when a common low-frequency oscillator of the prior art and the low-frequency oscillator of the present invention are placed around the high-frequency oscillator.

[0054] Figure 10A and Figure 10B When placing a conventional low-frequency oscillator of the prior art and the low-frequency oscillator of the present invention around a high-frequency oscillator respectively, the radiation pattern before and after comparison at the 2.7 GHz frequency point.

[0055] Judging from the comparison results, when placing the decoupled dual-polarized low-frequency oscillator of the present invention around the high-frequency oscillator, the radiation patterns of three frequency points are all significantly improved.

[0056] It should be noted that Figure 2 、 Figure 3 The low-frequency oscillator shown in [[ ]] is only one of the embodiments. For other low-frequency oscillators with similar structures that affect the S parameters and radiation patterns of the high-frequency oscillator in the base station array, the microstrip decoupling filter circuit proposed in the present invention can, through the fine-tuning of its own structure and the combined design with specific low-frequency oscillators, achieve the suppression of the induced current on the low-frequency oscillator unit in the array and reduce the influence on the high-frequency oscillator. The low-frequency oscillator adopted in this embodiment is just one of the special cases.

[0057] It should be clear that the structures, ratios, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those who are familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention. Therefore, they do not have any technical substance. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope covered by the technical content disclosed in the present invention.

[0058] The above is only the preferred embodiment of the present invention. For those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and modifications can be made, and these improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A decoupled dual-polarized low-frequency oscillator, comprising four dual-polarized orthogonal oscillator radiators, each radiator comprising two oscillator arms and a balun, the two oscillator arms being symmetrically arranged about the balun, the balun comprising two balun arms arranged in parallel and separately, the top ends of the two balun arms being respectively connected to the corresponding oscillator arms, and the bottom ends being commonly connected to a base, characterized in that: Each dipole arm is cut into two dipole arm subunits, the two dipole arm subunits are spaced apart and a first microstrip decoupling circuit board is connected therebetween; each balun arm is cut into two balun arm subunits, the two balun arm subunits are spaced apart and a second microstrip decoupling circuit board is connected therebetween; a feed plate is connected between the two dipole arm subunits in the middle of each dipole radiator; One side of the first microstrip decoupling circuit board is printed with a microstrip decoupling structure, and the other side is closely attached to the two truncated vibrator arm subunits; one side of the second microstrip decoupling circuit board is printed with a microstrip decoupling structure, and the other side is closely attached to the two truncated balun arm subunits.

2. The decoupled dual-polarized low-frequency oscillator according to claim 1, characterized in that: The electrical dimensions of the dipole arm subunit and the balun arm subunit are both smaller than the half wavelength corresponding to the highest frequency point in the working frequency band of the high-frequency dipole integrated on the same reflector.

3. The decoupled dual-polarized low-frequency oscillator according to claim 2, characterized in that: The four dipole arm subunits on each dipole radiator are distributed symmetrically about the center of the balun, and the four dipole arm subunits on each dipole radiator are distributed symmetrically about the longitudinal axis of the balun.

4. The decoupled dual-polarized low-frequency oscillator according to claim 2, characterized in that: The microstrip decoupling structure includes a meandering line equivalent to a parallel circuit of an inductor L1 and a capacitor C1, and microstrip lines located on both sides of the meandering line equivalent to series capacitors C2.

5. The decoupled dual-polarized low-frequency oscillator according to claim 4, characterized in that: The meandering line is S-shaped, and the equivalent inductance L1 and capacitance C1 are changed by parameter design of the meandering line so that the induced current has a minimum amplitude in the high frequency band.

6. The decoupled dual-polarized low-frequency oscillator according to claim 1, characterized in that: The dipole arm subunit, the balun arm subunit, the first microstrip decoupling circuit board and the second microstrip decoupling circuit board are all fixed on the dielectric support frame by dielectric screws.

7. The decoupled dual-polarized low-frequency oscillator according to claim 6, characterized in that: The medium support frame includes an annular fixing frame and four supporting legs evenly distributed below the fixing frame. The two balun arms of each oscillator radiator are arranged on the left and right sides of the supporting legs, and the oscillator arms are arranged on the periphery of the fixing frame.

8. An embedded dual-band array antenna, comprising a reflector, a low-frequency array and a high-frequency array disposed on the reflector, wherein the low-frequency array and the high-frequency array are respectively provided with at least one low-frequency oscillator and at least one high-frequency oscillator, characterized in that: The low-frequency oscillator is the decoupled dual-polarization low-frequency oscillator according to any one of claims 1 to 7, and a high-frequency oscillator is embedded inside the low-frequency oscillator.

9. The embedded dual-band array antenna according to claim 8, characterized in that: A high-frequency vibrator is arranged between every two adjacent low-frequency vibrators, and the high-frequency vibrators inside and outside the low-frequency vibrators together form a high-frequency array.

10. The embedded dual-band array antenna according to claim 9, characterized in that: The low-frequency oscillators in each low-frequency array and the high-frequency oscillators in each high-frequency array are linearly arranged with equal spacing of 0.5-1 times the wavelength of the center frequency of the working frequency band.

11. The embedded dual-band array antenna according to claim 10, characterized in that: The reflector of the high frequency vibrator located inside the low frequency vibrator is placed above the base, and the reflectors of the high frequency vibrator located inside and outside the low frequency vibrator do not contact the low frequency vibrator.

12. The embedded dual-band array antenna according to claim 11, characterized in that: The high-frequency oscillator includes a box-shaped reflector, two mutually perpendicular dielectric support plates and a dielectric plate placed horizontally on the dielectric support plate; the dielectric support plate is vertically arranged on the box-shaped reflector, and the dielectric support plate is printed with a microstrip balun structure on both sides, and two mutually perpendicular radiator oscillator pairs are printed on the dielectric plate.

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