Fixing device, fixing method, and detection apparatus

Abstract

The application discloses a fixing device, a fixing method and a detection equipment, and relates to the technical field of detection equipment, and discloses the following technical scheme: a fixing disc comprises opposite disc surfaces and a back surface, the disc surface comprises a bearing area, the bearing area is provided with a vacuum adsorption area for adsorbing a to-be-supported object; a plurality of support assemblies are arranged on the fixing disc, the support assembly comprises a support surface for supporting the to-be-supported object, and the distance between the support surface and the back surface is greater than the distance between the surface of the vacuum adsorption area and the back surface; wherein, the support assemblies are distributed on the edges of the bearing area, and the support assemblies are detachably connected with the fixing disc; or the support assemblies are used for moving from the edges of the bearing area to the periphery of the bearing area. The device can fix the to-be-supported object in a non-contact mode with the disc surface or in a vacuum adsorption mode, can realize compatibility of to-be-supported objects with different fixing requirements, avoids adoption of two different fixing devices, and thus improves detection efficiency and reduces detection cost.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor detection equipment, in particular to a device for fixing a wafer during wafer production and detection. BACKGROUND

[0002] At present, during the operation of a wafer detection device, a wafer is taken out from a wafer cassette by a mechanical arm, placed on a wafer fixing device, and then fixed on the wafer fixing device by vacuum or electrostatic adsorption.

[0003] For a conventional wafer (the back surface of which can be contacted), the wafer is fixed on the wafer fixing device by vacuum adsorption or the like, and for a special requirement wafer (such as a wafer whose front surface and back surface are both completely uncontactable or only the back surface is allowed to be contacted in a small range), a special fixing method is required, mainly including self-friction and Bernoulli fixing methods.

[0004] For the self-friction fixing method, a small area of the wafer back surface is contacted during fixing, and the friction between the rubber material and the wafer is used to fix the wafer. This method is limited by the friction, so the detection speed is affected to a certain extent, and the dust and other pollution between the rubber fixing part and the wafer will affect the fixing ability. In addition, the aging of the rubber will affect the fixing accuracy and reliability, which must also be considered.

[0005] For the Bernoulli fixing method, the Bernoulli fixing method only uses the Bernoulli principle and does not require a vacuum generator. The product is sucked without contact in a cyclone manner. Since there is no fixed constraint in the wafer movement direction, the detection speed is greatly affected. For this reason, the industry often uses edge limiting or back auxiliary fixing methods, but this will make some special requirement wafers unable to be used. In addition, the stability of this method for fixing the wafer is difficult to guarantee.

[0006] The above two fixing methods have limitations in some specific implementations, resulting in uncertain factors or reduced efficiency in the subsequent processing and detection of wafers. SUMMARY

[0007] The present application aims to provide a fixing device. The device can fix the to-be-supported object by a non-contact method with the disc surface or by vacuum adsorption, can realize compatibility of to-be-supported objects with different fixing requirements, avoids the use of two different fixing devices, and thus improves the detection efficiency and reduces the detection cost.

[0008] Another object of the present application is to provide a method for fixing a to-be-supported object by using the fixing device.

[0009] It is another object of the present application to provide a detection device provided with the fixing device.

[0010] To achieve the above objects, the present application provides a fixing device, comprising:

[0011] a fixing disc comprising opposite disc surface and back surface, the disc surface comprising a carrying area for carrying the object to be supported, at least part of the carrying area being provided with a vacuum adsorption area for adsorbing the object to be supported;

[0012] a plurality of supporting assemblies, the supporting assemblies comprising a supporting surface for supporting the object to be supported, the distance between the supporting surface and the back surface being greater than the distance between the surface of the vacuum adsorption area and the back surface;

[0013] wherein the supporting assemblies are distributed at the edge of the carrying area, and the supporting assemblies are detachably connected to the fixing disc; or the supporting assemblies are used to move from the edge of the carrying area to the periphery of the carrying area.

[0014] Preferably, the supporting assemblies comprise:

[0015] a clamping mechanism comprising a clamping fixing column and at least two positioning columns, the positioning columns being detachably connected to the fixing disc by one end thereof and being distributed along the edge of the carrying area on the disc surface of the fixing disc;

[0016] the clamping fixing column being movably arranged on the fixing disc and being capable of moving between a first position and a second position; in the first position, the clamping fixing column is on the distribution circumference of the positioning columns; in the second position, the clamping fixing column is outside the distribution circumference of the positioning columns.

[0017] Preferably, the clamping mechanism further comprises a supporting column for supporting the object to be supported from the edge position of the back surface of the object to be supported, the supporting column comprising opposite first end and second end, the supporting column being detachably connected to the fixing disc by the first end and being distributed in the circumferential direction with the positioning columns on the disc surface of the fixing disc.

[0018] Preferably, the positioning columns are provided with a positioning surface for radially positioning the object to be supported and a first supporting surface for supporting the object to be supported from the edge of the object to be supported, and the second end of the supporting column is provided with a second supporting surface for supporting the object to be supported from the edge of the object to be supported.

[0019] Preferably, the first supporting surface of the positioning column and the second supporting surface of the supporting column are located in the same plane and are higher than the surface of the vacuum adsorption area.

[0020] Preferably, the first support surface of the positioning column and the second support surface of the support column are inclined surfaces inclined to the disc surface of the fixing disc, so as to only contact the edge fillet of the to-be-supported object after the to-be-supported object is placed.

[0021] Preferably, the number of the positioning columns is two, and the moving direction of the clamping fixing column is perpendicular to the connecting line between the two positioning columns; the number of the support columns is two, and the two support columns are respectively located on the two sides of the moving direction of the clamping fixing column.

[0022] Preferably, the first support surface of the positioning column is an annular stepped surface formed at the upper end of the positioning column, and the positioning surface is the outer circumferential surface of a cylindrical boss formed at the upper end of the positioning column and perpendicular to the annular stepped surface.

[0023] Preferably, a threaded hole corresponding to the positioning column and the support column is formed in the disc surface of the fixing disc, and the connecting end of the positioning column and the support column is detachably connected to the threaded hole through external threads.

[0024] Preferably, the disc surface of the fixing disc is provided with a pick-and-place mechanism avoiding area; the pick-and-place mechanism avoiding area includes at least one opening area formed in the disc surface, and the shape of the opening area is matched with the outer shape of a mechanical hand for picking and placing the to-be-supported object.

[0025] Preferably, the clamping driving component for driving the clamping fixing column to move is further included, the clamping driving component is arranged on the fixing disc, the clamping fixing column is connected to the clamping force output end of the clamping driving component, and the clamping driving component drives the clamping fixing column to reciprocate between the first position and the second position.

[0026] Preferably, the upper sheet monitoring device is further included, the upper sheet monitoring device includes an in-position sensing piece moving together with the clamping fixing column; the fixing disc is further provided with an in-position sensor, and in the clamping in-position state, the in-position sensing piece moves to a position triggering the in-position sensor.

[0027] Preferably, the upper sheet monitoring device is further included, the upper sheet monitoring device includes an over-position sensing piece moving together with the clamping fixing column; the fixing disc is further provided with an over-position sensor, and in the clamping over-position state, the over-position sensing piece moves to a position triggering the over-position sensor.

[0028] Preferably, the detection process state monitoring device is further included, the detection process state monitoring device includes at least one set of light barriers arranged on the outer edge of the fixing disc, and the light barrier path of the light barriers is parallel to the upper surface of the to-be-supported object and has a spacing from the upper surface of the to-be-supported object.

[0029] Preferably, two sets of the pair of sensors are provided, and the pair of paths of the two sets of the pair of sensors cross radially in the upper region of the bearing area.

[0030] To achieve the above-mentioned another object, the present application provides a fixing method using the fixing device, comprising:

[0031] For fixing the to-be-supported object which cannot be contacted from the back or which is allowed to be contacted at the edge part, the support assembly is connected to the fixing disc or moved to the edge of the bearing area, the to-be-supported object is placed on the support assembly, and the to-be-supported object is supported by the support surface of the support assembly.

[0032] For fixing the to-be-supported object which can be contacted from the back, the support assembly is detached from the fixing disc or moved to the periphery of the bearing area, the to-be-supported object is placed on the bearing area of the fixing disc, and the to-be-supported object is fixed by the suction force generated by the vacuum suction area.

[0033] To achieve the above-mentioned still another object, the present application provides a detection device, comprising:

[0034] The fixing device for fixing the to-be-supported object to be detected;

[0035] A detection system for detecting the to-be-supported object fixed by the fixing device;

[0036] A mechanical hand for placing the to-be-supported object on the disc surface of the fixing device before detection and taking away the to-be-supported object from the disc surface of the fixing device after detection.

[0037] The fixing device provided by the application has a vacuum adsorption area and a support assembly with a support surface on the disc surface of the fixing disc, wherein the vacuum adsorption area is suitable for fixing the back-contactable to-be-supported object by vacuum adsorption, and the support assembly is suitable for fixing the back-non-contactable or back-contactable only at the edge of the to-be-supported object by non-contact with the disc surface. Since the support assembly is detachably connected with the fixing disc or can be moved from the edge of the bearing area to the periphery of the bearing area, when the back-contactable to-be-supported object needs to be fixed, the support assembly is only needed to be detached from the fixing disc or moved to the periphery of the bearing area, so that the to-be-supported object can be fixed by the vacuum adsorption area; when the back-non-contactable or back-contactable only at the edge to-be-supported object needs to be fixed, the support assembly is only needed to be reinstalled on the fixing disc or moved to the periphery of the bearing area, so that the to-be-supported object can be fixed by non-contact with the disc surface. The fixing device can realize two functions, can realize the compatibility of special demand to-be-supported objects and ordinary to-be-supported objects, can select different fixing modes according to actual needs during use, avoids using two different fixing devices, and has the advantages of simple and convenient operation and quick conversion between the two fixing modes, so that the stability of fixing and the detection efficiency are improved, and the detection cost is reduced.

[0038] The application also provides a fixing method and a detection equipment. Since the fixing device has the above technical effects, the fixing method using the fixing device and the detection equipment provided with the fixing device also have corresponding technical effects. BRIEF DESCRIPTION OF DRAWINGS

[0039] Figure 1 FIG. 1 is a structural schematic view of a fixing device disclosed by an embodiment of the application;

[0040] Figure 2 FIG. 2 is a structural schematic view of a wafer clamping mechanism of the fixing device shown in FIG. 1; Figure 1 FIG. 3 is a structural schematic view of the fixing device shown in FIG. 1 fixing a wafer through the wafer clamping mechanism;

[0041] Figure 3 FIG. 4 is a partial enlarged view of the fixing device shown in FIG. 3 in which a positioning column contacts the edge of a wafer through a first support surface and a positioning surface;

[0042] Figure 4 FIG. 5 is a structural schematic view of an upper piece monitoring device;

[0043] Figure 5 FIG. 6 is a structural schematic view of a detection process state monitoring device;

[0044] Figure 6 FIG. 7 is a top view of the fixing device shown in FIG. 1 after the positioning column, the support column and the clamping fixing column are removed; Figure 1

[0045] In the drawings:

[0046] ​100. Wafer holding tray 101. First vacuum adsorption area 102. Second vacuum adsorption area 103. Wafer pick-and-place mechanism clearance area 200. Positioning post 201. First support surface 202. Positioning surface 300. Support post 400. Clamping and fixing post 500. Wafer (or device under test) 600. Detection process status monitoring device 601. First set of through-beam sensors 602. Second set of through-beam sensors 700. Cylinder assembly 801. Over-position sensor 802. In-position sensor 803. Feedback unit 901. Over-position sensing element 902. In-position sensing element Detailed Implementation

[0047] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0048] In this document, terms such as "upper," "lower," "left," and "right" are established based on the positional relationships shown in the accompanying drawings. Depending on the drawings, the corresponding positional relationships may change. Therefore, they should not be interpreted as an absolute limitation on the scope of protection. Moreover, relational terms such as "first" and "second" are only used to distinguish one component from another that has the same name, and do not necessarily require or imply any such actual relationship or order between these components.

[0049] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 1 This is a schematic diagram of the structure of a fixing device disclosed in an embodiment of the present invention; Figure 2 for Figure 1 The diagram shows a structural schematic of a wafer clamping device that secures a wafer via a wafer clamping mechanism. Figure 3 This is a magnified view of a portion of the wafer edge where the positioning post contacts the wafer edge via the first support surface and the positioning surface.

[0050] As shown in the figure, in one embodiment, the provided fixing device is used to conveniently transfer and fix conventional objects to be supported and special testing processes to be supported. It mainly consists of a fixing plate 100 and a clamping mechanism disposed on the fixing plate. In this embodiment, the object to be supported includes at least one of wafers whose back is not accessible or whose edge contact is permitted, and wafers whose back is accessible; it can also be other objects, such as glass.

[0051] The wafer holding disk 100 is generally a disk with a certain thickness, including a disk surface and a back surface. The disk surface used to hold the wafer 500 is provided with a first vacuum adsorption area 101 located in the center and two second vacuum adsorption areas 102 located on both sides, so as to fix the wafer 500 by vacuum adsorption.

[0052] The wafer clamping mechanism is mainly composed of positioning columns 200, support columns 300 and clamping fixing columns 400. The disc surface is provided with an installation and positioning area of the positioning columns 200 and the support columns 300, for installation and fixation of the positioning columns 200 and the support columns 300. The positioning columns 200 and the support columns 300 are distributed along the circumferential direction on the disc surface of the wafer fixing disc 100. The number of the positioning columns 200 is two, which are located on one side of the wafer fixing disc 100 in the radial direction (the formed arc is less than one-half of the circumferential direction). The number of the support columns 300 is also two, which are located on the other side of the wafer fixing disc 100 in the radial direction together with one clamping fixing column 400. The moving direction of the clamping fixing column 400 is perpendicular to the connecting line between the two positioning columns 200. The two support columns 300 are respectively located on the two sides of the clamping fixing column 400. If the moving direction of the clamping fixing column 400 is taken as a boundary, one positioning column 200 and one support column 300 located on the left side of the boundary are symmetrically distributed with the other positioning column 200 and the other support column 300 located on the right side of the boundary.

[0053] The disc surface of the wafer fixing disc 100 is provided with screw holes corresponding to the positioning columns 200 and the support columns 300. The positioning columns 200 and the support columns 300 are generally cylindrical, and the lower ends thereof are respectively provided with external threads, and are detachably connected with the screw holes through the external thread parts. According to actual needs, the positioning columns 200 and the support columns 300 can be installed on the wafer fixing disc 100 or detached from the wafer fixing disc. Of course, the detachable connection mode of the positioning columns 200 and the support columns 300 with the wafer fixing disc 100 is not limited to the screw connection, but can also be connected through clamping and the like.

[0054] The upper end of the positioning column 200 is provided with a first support surface 201 for supporting the wafer from the edge of the back of the wafer in the axial direction, and is provided with a positioning surface 202 for positioning the wafer in the radial direction. The first support surface 201 is an annular stepped surface formed on the upper end of the positioning column 200, and the positioning surface 202 is the outer circumferential surface of a cylindrical boss formed on the upper end of the positioning column 200 and perpendicular to the annular stepped surface (see Figure 3 ).

[0055] The upper end of the support column 300 is provided with a second support surface for supporting the wafer from the edge of the back of the wafer, so as to be used in cooperation with the positioning column 200. Since no radial positioning surface is designed, the support column 300 assists in supporting the wafer 500 on the other side, and does not play a positioning role. When fixed, the wafer 500 (or the measured piece) is placed on the four support surfaces composed of the positioning column 200 and the support column 300. The range of each support surface in contact with the back of the wafer 500 in the diameter direction can be determined according to the requirements of different wafers or measured pieces.

[0056] The first supporting surface of the positioning column 200 and the second supporting surface of the supporting column 300 are located in the same plane and are higher than the surface of the first vacuum adsorption area 101 and the second vacuum adsorption area 102, so as to ensure that the back surface of the wafer 500 does not contact the surface of the vacuum adsorption area when the wafer 500 is fixed by the wafer clamping mechanism.

[0057] In the embodiment, two positioning columns 200 and two supporting columns 300 are used for supporting and positioning. It can be understood that, according to different actual needs, three, four or more positioning columns 200 can be arranged to support and position the wafer, and three, four or more supporting columns 300 can be arranged to support the wafer 500, and part of the supporting columns 300 are arranged on the side where the positioning columns 200 are located. As a simpler form, only two positioning columns 200 and one supporting column 300 can be arranged. If this structure is adopted, the center line of the wafer fixing disc 100 should be located in the interior of the triangle formed by the three lines connecting the two positioning columns 200 and the one supporting column 300, so as to stably support the wafer 500 and ensure that the wafer 500 does not fall over.

[0058] The clamping fixing column 400 is radially movably installed on the wafer fixing disc 100, and the wafer fixing disc 100 is provided with a sliding groove for providing a radial movement space for the clamping fixing column. The clamping fixing column 400 can move between a first position for clamping the wafer and a second position for not clamping the wafer. In the first position, the clamping fixing column 400 clamps the wafer 500 together with the positioning surface of the positioning column 200 through the outer circumferential surface. At this time, the clamping fixing column 400 is located on the distribution circumference of the positioning column 200, and the arc formed by the clamping fixing column 400 and the positioning column 200 is greater than one-half of the circumference. In the second position, the distance between the outer circumferential surface of the clamping fixing column 400 and the positioning surface of the positioning column 200 is increased, so that the wafer 500 is not clamped. At this time, the clamping fixing column 400 is located outside the distribution circumference of the positioning column 200, away from the wafer, and does not contact the outer circumferential part of the wafer.

[0059] Specifically, the clamping driving component provides a clamping fixing force for the clamping fixing column 400. In the embodiment, a cylinder assembly 700 is used as the clamping driving component. The size of the clamping force can be set according to the actual situation of the wafer 500 with different thicknesses and warps. The cylinder assembly 700 is installed on the back surface of the wafer fixing disc 100, and the clamping fixing column 400 is connected to the extension end of the cylinder assembly 700 and can perform linear reciprocating motion with the extension and retraction of the cylinder assembly 700. When working, the clamping fixing column 400 is driven by the cylinder assembly 700 to move towards the positioning column and push the wafer 500 to move towards the positioning column. After the edge of the wafer 500 contacts the positioning surface of the positioning column 200, the wafer 500 stops moving. The clamping fixing column 400 provides a stable clamping force to fix the position of the wafer.

[0060] In some other embodiments, the clamping driving component can also be a motor, a spring, a spring piece, etc. If the motor is used as the clamping driving component, the motor can be fixed on the back of the wafer fixing disc 100 and drive the clamping fixing column 400 to make linear reciprocating motion through a transmission mechanism. If the spring or spring piece is used as the clamping driving component, one end of the spring or spring piece is connected with the wafer fixing disc 100 and the other end is connected with the clamping fixing column 400, and the clamping fixing column 400 is driven to make linear reciprocating motion through the elastic force.

[0061] In the embodiment, the wafer taking and placing mechanism avoiding area 103 is provided on the disc surface of the wafer fixing disc 100. The wafer taking and placing mechanism avoiding area 103 is two long strip-shaped opening areas formed on the disc surface. The two opening areas are respectively located at the two sides of the first vacuum adsorption area 101. The shape of the wafer taking and placing mechanism avoiding area 103 is matched with the shape of the mechanical arm for taking and placing the wafer. The wafer taking and placing mechanism avoiding area 103 has a certain width and depth and can provide sufficient operation space for the mechanical arm for taking and placing the wafer.

[0062] In addition, the positioning column 200, the supporting column 300 and the clamping fixing column 400 can be made of plastic material, or the parts of the positioning column 200, the supporting column 300 and the clamping fixing column 400 in contact with the wafer 500 are made of plastic material, so as to avoid scratching and damaging the wafer 500.

[0063] The surface form and size of the wafer fixing disc 100 are not limited. The surface form can be a continuous plane or a plane with various air channels. The size can be 300 mm or other sizes.

[0064] It is particularly noted that for the wafer 500 which cannot be contacted on the front surface and the back surface, the supporting surface of the positioning column 200 and the supporting column 300 can be provided as a downward inclined surface at a certain angle to the disc surface of the wafer fixing disc 100. After the structure is used, only the edge and the corner of the wafer 500 are contacted with the supporting surface, that is, by designing different supporting surfaces, the positioning column 200 and the supporting column 300 can support the back surface of the wafer 500 or support the edge of the wafer 500, so as to meet the fixing requirement that the back surface is not contacted at all.

[0065] Please refer to Figure 4 , Figure 4 FIG. 1 is a structural schematic diagram of the wafer fixing device.

[0066] As shown in the figure, on the basis of the above-mentioned embodiment, an upper sheet monitoring device can be further added to monitor whether the clamping and fixing of the wafer 500 is normal during the wafer fixing process.

[0067] The upper piece monitoring device has an in-position sensing piece 902 and an over-position sensing piece 901 which move together with the clamping fixed column 400, and the wafer fixing disc 100 is provided with an in-position sensor 802 and an over-position sensor 801, in the clamping in-position state, the in-position sensing piece 902 moves to the position of triggering the in-position sensor 802, and in the clamping over-position state, the over-position sensing piece 901 moves to the position of triggering the over-position sensor 801.

[0068] Specifically, the in-position sensing piece 902 and the over-position sensing piece 901 are two sensing pieces which are bent downward by 90 degrees at the two ends, and the two sensing pieces have basically the same structure, are fixed in front of and behind the moving part of the cylinder assembly 700 along the moving direction of the clamping fixed column 400, and move together with the clamping fixed column 400 when the cylinder assembly 700 drives the clamping fixed column 400 to move, the in-position sensor 802 and the over-position sensor 801 have sensing grooves which are open upward, and the bent ends of the in-position sensing piece 902 and the over-position sensing piece 901 correspond to the sensing grooves of the in-position sensor 802 and the over-position sensor 801. When the cylinder assembly 700 is pushed forward, the in-position sensing piece 902 and the over-position sensing piece 901 move forward uniformly, when the in-position sensing piece 902 enters the sensing groove of the in-position sensor 802 and blocks the in-position sensor 802, it indicates that the wafer 500 (or the measured piece) has been clamped and fixed in position, and the next detection action can be performed, at this time, if the cylinder assembly 700 further moves forward, the over-position sensing piece 901 enters the sensing groove of the over-position sensor 801 and blocks the over-position sensor 801, which indicates that the wafer 500 (or the measured piece) fails to be clamped due to some reason, and the clamping action needs to be stopped to find the failure reason, so as to ensure that the wafer 500 (or the measured piece) can be fixed at the set position.

[0069] The cylinder assembly 700 is provided with a feedback device 803, which is a magnetic switch, and functions to feedback whether the cylinder is returned to position, so as to monitor whether the cylinder is in the non-extended state, and if the cylinder is returned, the mechanical hand can perform the wafer 500 (or the measured piece) up and down operation.

[0070] Please refer to Figure 5 , Figure 5 The figure is a structure schematic diagram of the detection process state monitoring device.

[0071] As shown in the figure, on the basis of the above embodiment, a detection process state monitoring device 600 can be further added to monitor the wafer state in real time during the wafer up and detection process.

[0072] The detection process state monitoring device has two groups of opposite radiation sensors which are arranged at the outer edge of the wafer fixing disc 100, and the opposite radiation paths of the two groups of opposite radiation sensors cross in the upper area of the wafer upper surface in a radial direction.

[0073] Specifically, two sensors of the first group of the pair of sensors 601 are fixed at opposite edge positions along a radial direction of the wafer fixing disc 100, and two sensors of the second group of the pair of sensors 602 are fixed at opposite edge positions along another radial direction of the wafer fixing disc 100, and the two radial directions are in an X shape. In this way, after the wafer 500 is loaded, the pair of sensors of the two groups will intersect radially in the area above the upper surface of the wafer, and maintain a small distance from the upper surface of the wafer. When the wafer 500 is stably and reliably fixed on the wafer fixing disc 100, the wafer 500 will not block the detection light of the pair of sensors of the two groups, and when the wafer 500 tilts due to falling from the support surface of the positioning column 200 or the support column 300, it will block the detection light of the corresponding pair of sensors, and then send a feedback signal. After the system receives the feedback, it will stop detection to further find the reason for the falling or tilting of the wafer 500, and prevent the wafer 500 from falling out due to clamping failure.

[0074] Of course, by arranging a group of pair of sensors on the outer edge of the wafer fixing disc 100, the pair of sensors can also be arranged to have a detection path parallel to the upper surface of the wafer and maintain a distance from the upper surface of the wafer, so as to monitor the state of the wafer in real time during loading and detection.

[0075] By changing the positions of the positioning column 200 and the support column 300, different diameters of wafers 500 can be clamped. In the present example, the drawing only shows the fixing structure of a wafer of a certain fixed diameter, but it can be understood that by arranging mounting holes of the positioning column 200 and the support column 300 corresponding to wafers of different diameters at different positions on the wafer fixing disc 100, the purpose of changing the positioning and support positions can be achieved, thereby supporting wafers 500 of different sizes.

[0076] The above embodiments are only preferred solutions of the present application, and are not limited thereto. Based on the above, targeted adjustments can be made according to actual needs to obtain different embodiments. For example, the support column 300 is omitted, and only the positioning column 200 and the support column 300 are used to clamp the wafer; or the number of the positioning column 200, the support column 300 and the clamping fixing column 400 is further adjusted; or the positioning column 200 and the support column 300 are designed in a non-cylindrical shape; or grooves for signal lines of various detection sensors are provided on the wafer fixing disc 100, and the like. Since there are many possible ways, they will not be described one by one here.

[0077] Since the positioning column 200 and the supporting column 300 of the wafer clamping mechanism are detachably connected with the wafer fixing disc 100, when the wafer 500 which can be contacted from the back is needed to be fixed, the positioning column 200 and the supporting column 300 are only needed to be detached from the wafer fixing disc 100, and then the wafer 500 can be fixed by the vacuum suction area. When the wafer 500 which cannot be contacted from the back or is only allowed to be contacted from the edge is needed to be fixed, the positioning column 200 and the supporting column 300 are only needed to be reinstalled on the wafer fixing disc 100, and then the wafer 500 can be fixed by the wafer clamping mechanism. The same device can realize two functions, and can realize the compatibility of the special requirement wafer and the ordinary wafer. Different fixing modes can be selected according to the actual needs during use, and two different fixing devices are avoided. Moreover, the operation is simple and convenient, and the fixing stability and the detection efficiency can be improved, and the detection cost can be reduced.

[0078] In addition to the wafer fixing device, the wafer fixing method is also provided. The wafer 500 is fixed by the wafer fixing device, and the method comprises the following steps.

[0079] When the wafer 500 which cannot be contacted from the back or is only allowed to be contacted from the edge is needed to be fixed, the positioning column 200 and the supporting column 300 are connected to the wafer fixing disc or are moved to the edge of the bearing area. The wafer 500 is conveyed to above the wafer fixing disc 100 by the mechanical hand. The wafer 500 is placed on the wafer fixing disc 100 by lowering the mechanical hand. The wafer 500 is supported by the supporting surface of the positioning column 200 and the supporting column 300. The cylinder assembly 700 is controlled to push forward to provide clamping force for the clamping fixing column 400. The clamping fixing column 400 is driven to move to the direction of the positioning column, so that the clamping fixing column 400 clamps the wafer 500 together with the positioning surface of the positioning column 200 through the outer peripheral surface. After the detection is completed, the clamping fixing column 400 is driven to move in the opposite direction by the cylinder assembly 700, so that the clamping of the wafer 500 is released. The wafer 500 is taken away from the wafer fixing disc 100 by the mechanical hand.

[0080] When the wafer 500 which can be contacted from the back is needed to be fixed, the positioning column 200 and the supporting column 300 are detached from the wafer fixing disc 100 (see Figure 6 ) or are moved to the periphery of the bearing area. The wafer 500 is conveyed to above the wafer fixing disc 100 by the mechanical hand. The wafer 500 is placed on the wafer fixing disc 100 by lowering the mechanical hand. The wafer 500 is contacted with the upper surfaces of the first vacuum suction area 101 and the second vacuum suction area 102. The vacuum suction area is controlled to generate suction force to suction and fix the wafer 500. After the detection is completed, the vacuum suction area is controlled to stop generating suction force, so that the fixing of the wafer 500 is released. The wafer 500 is taken away from the wafer fixing disc 100 by the mechanical hand.

[0081] Since some parts such as the mechanical hand and the vacuum adsorption can be realized by using relevant general technologies, the present application will not be described herein.

[0082] The present application also provides a wafer detection device, which comprises:

[0083] The wafer fixing device is used for fixing the wafer 500 to be detected.

[0084] The detection system is used for detecting the wafer 500 fixed by the wafer fixing device.

[0085] The mechanical hand is used for placing the wafer 500 on the disc surface of the wafer fixing device before detection and taking away the wafer 500 from the disc surface of the wafer fixing device after detection. Other structures of the wafer detection device can refer to the prior art, and will not be described herein.

[0086] The fixing device, the fixing method and the detection device provided by the present application are described in detail above. The principles and implementation manners of the present application are described by using specific examples herein. The above description of the examples is only used for helping to understand the core idea of the present application. It should be pointed out that, for those skilled in the art, some improvements and modifications can be made to the present application without departing from the principles of the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A fixture, characterized in that The application relates to a fixing disc, a plurality of support assemblies and a clamping mechanism. The fixing disc comprises opposite disc faces and a back face, and the disc face comprises a bearing area for bearing a to-be-supported object, and at least a part of the bearing area is provided with a vacuum adsorption area for adsorbing the to-be-supported object. The support assemblies comprise support faces for supporting the to-be-supported object, and the distance between the support faces and the back face is greater than the distance between the surface of the vacuum adsorption area and the back face. The support assemblies are distributed at the edge of the bearing area, and the support assemblies are detachably connected with the fixing disc; or the support assemblies can move from the edge of the bearing area to the periphery of the bearing area. The support assemblies comprise a clamping mechanism, which comprises clamping fixing columns and at least two positioning columns. The clamping fixing columns are movably arranged on the fixing disc and can move between a first position and a second position; in the first position, the clamping fixing columns are on the distribution circumference of the positioning columns; in the second position, the clamping fixing columns are outside the distribution circumference of the positioning columns. The clamping mechanism further comprises support columns for supporting the to-be-supported object from the edge position of the back face of the to-be-supported object, and the support columns comprise opposite first ends and second ends. The first ends of the support columns are detachably connected with the fixing disc and are distributed on the disc face of the fixing disc in the circumferential direction together with the positioning columns. The positioning columns are provided with a positioning face for radially positioning the to-be-supported object and a first support face for supporting the to-be-supported object from the edge of the to-be-supported object. The second ends of the support columns are provided with a second support face for supporting the to-be-supported object from the edge of the to-be-supported object.

2. The fixture of claim 1, wherein The disc face of the fixing disc is provided with a taking and placing mechanism avoiding area.

3. The fixture of claim 2, wherein The first support face of the positioning column and the second support face of the support column are located in the same plane and are higher than the surface of the vacuum adsorption area.

4. The fixture of claim 2, wherein The first support face of the positioning column and the second support face of the support column are inclined inclined faces towards the disc face of the fixing disc, so as to only contact the edge round corners of the to-be-supported object after the to-be-supported object is placed.

5. The fixture of claim 1, wherein The number of the positioning columns is two, and the moving direction of the clamping fixing column is perpendicular to the connecting line between the two positioning columns; the number of the support columns is two and is located on the two sides of the moving direction of the clamping fixing column.

6. The fixture of claim 1, wherein The first support face of the positioning column is an annular stepped face formed on the upper end of the positioning column, and the positioning face is the outer circumferential face of a cylindrical boss formed on the upper end of the positioning column and perpendicular to the annular stepped face.

7. The fixture of claim 1, wherein The disc face of the fixing disc is provided with threaded holes corresponding to the positioning columns and the support columns, and the connecting ends of the positioning columns and the support columns are detachably connected with the threaded holes through external threads. The taking and placing mechanism avoiding area comprises at least one opening area formed on the disc face, and the shape of the opening area is matched with the external shape of a mechanical arm for taking and placing the to-be-supported object.

8. The fixture of claim 1, wherein The clamping driving part is arranged on the fixing disc, and the clamping fixed column is connected with a clamping force output end of the clamping driving part.

9. The fixture of claim 1, wherein The upper sheet monitoring device comprises an in-position sensing part which moves together with the clamping fixed column, and the fixing disc is further provided with an in-position sensor.

10. The fixture of claim 1, wherein The upper sheet monitoring device comprises an over-position sensing part which moves together with the clamping fixed column, and the fixing disc is further provided with an over-position sensor.

11. The fixture of claim 1, wherein The process state monitoring device comprises at least one set of light barrier sensors arranged on the outer edge of the fixing disc, and the light barrier paths of the light barrier sensors are parallel to the upper surface of the object to be supported and are spaced apart from the upper surface of the object to be supported.

12. The fixture of claim 11, wherein, Two sets of light barrier sensors are arranged, and the light barrier paths of the two sets of light barrier sensors are radially crossed in the upper region of the bearing area.

13. Fixing method, characterized in that, The fixing device according to any one of claims 1 to 12 is adopted, comprising: When the object to be supported is fixed on the back part which cannot be contacted or is allowed to be contacted at the edge part, the support assembly is connected to the fixing disc or is moved to the edge of the bearing area, the object to be supported is placed on the support assembly, and the object to be supported is supported by the support surface of the support assembly; When the object to be supported is fixed on the back part which can be contacted, the support assembly is separated from the fixing disc or is moved to the periphery of the bearing area, the object to be supported is placed on the bearing area of the fixing disc, the suction force of the vacuum suction area is controlled to generate suction force, and the object to be supported is suctioned and fixed.

14. A detection device, comprising: The fixing device according to any one of claims 1 to 12 is adopted, and the fixing device is used for fixing the object to be supported which is to be detected; A detection system is used for detecting the object to be supported fixed by the fixing device; A mechanical hand is used for placing the object to be supported on the disc surface of the fixing device before detection and taking away the object to be supported from the disc surface of the fixing device after detection.

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