Semiconductor packaging device and manufacturing method thereof

Abstract

This invention provides a sensing module, a semiconductor device package, and a method for manufacturing the same. The sensing module includes a sensing device, a first protective film, and a second protective film. The sensing device has an active surface and a sensing region disposed adjacent to the active surface. The first protective film is disposed on the active surface of the sensing device and completely covers the sensing region. The second protective film is in contact with the first protective film and the active surface of the sensing device.

Description

Technical Field

[0001] This disclosure relates to semiconductor packaging apparatus, and more specifically, to semiconductor packaging apparatus including sensing devices. Background Technology

[0002] Sensing devices (e.g., sensors or microelectromechanical systems (MEMS)) are widely used in many applications. Generally, sensing devices have a sensing area to detect or receive environmental information (e.g., sound, pressure, temperature, humidity, gas, etc.). However, the sensing area is sensitive to the environment, and the detected information can be affected. Therefore, it is necessary to reduce the error or bias in the information detected by the sensing device. Summary of the Invention

[0003] In some embodiments, according to aspects of this disclosure, the sensing module includes a sensing device, a first protective film, and a second protective film. The sensing device has an active surface and a sensing region disposed adjacent to the active surface of the sensing device. The first protective film is disposed on the active surface of the sensing device and completely covers the sensing region. The second protective film is in contact with the first protective film and the active surface of the sensing device.

[0004] In some embodiments, according to another aspect of this disclosure, a semiconductor device package includes a substrate, a sensing device, a first protective film, and a second protective film. The sensing device is disposed on the substrate. The sensing device has an active surface facing away from the substrate and a sensing region disposed adjacent to the active surface of the sensing device. The first protective film is disposed on the active surface of the sensing device and completely covers the sensing region. The second protective film is in contact with the first protective film and the active surface of the sensing device.

[0005] In some embodiments, according to another aspect of this disclosure, a method of manufacturing an electronic module includes: (a) providing a sensing device having an active surface and a sensing region disposed adjacent to the active surface of the sensing device; (b) forming a first protective film on the active surface of the sensing device to completely cover the sensing region of the sensing device; and (c) forming a second protective film in contact with a portion of the first protective film and the active surface of the sensing device. Attached Figure Description

[0006] Some aspects of the embodiments of this disclosure are best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that the various structures may not be drawn to scale, and the dimensions of the various structures may be arbitrarily increased or decreased for clarity of explanation.

[0007] Figure 1A A cross-sectional view illustrating a sensing module according to some embodiments of the present disclosure is shown.

[0008] Figure 1B A cross-sectional view illustrating a sensing module according to some embodiments of the present disclosure is shown.

[0009] Figure 2 A cross-sectional view illustrating a sensing module according to some embodiments of the present disclosure is shown.

[0010] Figure 3A A cross-sectional view illustrating a sensing module according to some embodiments of the present disclosure is shown.

[0011] Figure 3B A top view illustrating a sensing module according to some embodiments of the present disclosure.

[0012] Figure 4 A cross-sectional view of a semiconductor device package according to some embodiments of the present invention is shown.

[0013] Figure 5A , Figure 5B and Figure 5C This describes one or more stages of the manufacturing process of a sensing module according to some embodiments of the present disclosure.

[0014] The same reference numerals are used throughout the drawings and detailed description to indicate the same or similar components. This disclosure is best understood from the following detailed description in conjunction with the accompanying drawings. Detailed Implementation

[0015] Figure 1A and Figure 1B A cross-sectional view of a sensing module 1 according to some embodiments of the present disclosure is shown. The sensing module 1 includes a sensing device 10 and a protective film 11.

[0016] The sensing device 10 has an active surface 101 and a sensing region 10s disposed adjacent to the active surface 101. The sensing region 10s of the sensing device 10 is configured to receive or detect at least one signal / information (e.g., sound, pressure, temperature, humidity, gas, or the like) from the environment. The sensing device 10 may be or includes a semiconductor die or chip. In some embodiments, the sensing device 10 may be or includes a sensor or MEMS. In some embodiments, the sensing device 10 may be or includes, for example, a pressure sensor, microphone, barometer, thermometer, hygrometer, gas detector, or the like. The sensing device 10 may include one or more conductive pads 10p that are close to, adjacent to, or embedded in and exposed on the active surface 101 of the sensing device 10.

[0017] A protective film 11 is disposed on at least a portion of the active surface 101 of the sensing device 10. For example, the protective film 11 completely covers the sensing area 10s of the sensing device 10 and exposes other portions of the active surface 101 of the sensing device 10 (e.g., conductive pad 10p). In some embodiments, the protective film 11 is attached to the active surface 101 of the sensing device 10 to protect the sensing area 10s from damage or contamination. In some embodiments, the protective film 11 comprises a material that will not affect the performance of the sensing device 10. For example, the protective film 11 may be a passivation film comprising a hydrophobic material. However, such a protective film 11 has a relatively poor connection with respect to the active surface 101 of the sensing device 10. Therefore, the edges of the protective film 11 may peel or detach from the active surface 101 of the sensing device 10, which will reduce the yield of the sensing device 10 (e.g., about 30%).

[0018] Figure 2 This illustration shows a cross-sectional view of a sensing module 2 according to some embodiments of the present disclosure. The sensing module 2 is similar to... Figure 1A The sensor module 1 shown in the figure further includes a protective film 12 in addition to the sensor module 2.

[0019] A protective film 12 is disposed on a portion of the protective film 11 and a portion of the active surface 101 of the sensing device 10. For example, the protective film 12 covers a portion of the protective film 11 that does not overlap with the sensing region 10s of the sensing device 10. For example, the protective film 12 exposes a portion of the protective film 11 covering the sensing region 10s of the sensing device 10. For example, the projection of the protective film 12 onto the active surface 101 of the sensing device 10 is spaced apart from the projection of the sensing region 10s onto the active surface 101 of the sensing device 10. The protective film 12 exposes the conductive pad 10p. The protective film 12 directly contacts a portion of the protective film 11 and a portion of the active surface 101 of the sensing device 10.

[0020] In some embodiments, protective film 12 and protective film 11 comprise different materials. In some embodiments, the bonding strength between protective film 12 and the active surface 101 of sensing device 10 is greater than the bonding strength between protective film 11 and the active surface 101 of sensing device 10. In some embodiments, protective film 12 is formed of or comprises a material containing hydroxyl groups. In some embodiments, protective film 12 is formed of or comprises a material suitable for exposure and development processes. In some embodiments, protective film 12 is a passivation film or a dielectric film. In some embodiments, protective film 12 comprises polyimide (PI), polybenzoxazole (PBO), or phenylcyclobutane (BCB). By pressing or fixing protective film 11 to the active surface 101 of sensing device 10 using protective film 12 which has a relatively strong connection with the active surface 101 of sensing device 10, the following can be eliminated: Figure 1B The problem of peeling / detachment of the protective film 11 shown in the figure will be greatly improved. This will significantly improve the yield of the sensing device 10.

[0021] Figure 3A This illustration shows a cross-sectional view of a sensing module 3 according to some embodiments of the present disclosure. The sensing module 3 is similar to... Figure 2 The sensor module 2 shown in the figure has the following differences.

[0022] The protective film 11 has one or more openings 11h to expose the active surface 101 of the sensing device 10. The openings 11h are filled with a protective film 12. For example, the protective film 12 further extends within the openings 11h and directly contacts the active surface 101 of the sensing device 10 exposed from the openings 11h. In some embodiments, the protective films 11 and 12 define a locking structure (e.g., an anchor lock). Thus, as... Figure 2 As explained, the connection between the protective film 12 and the active surface 101 of the sensing device 10 is stronger than the connection between the protective film 12 and the active surface 101 of the sensing device 10. This will greatly improve the yield of the sensing device 10 (approximately 100%).

[0023] Figure 3B Description of some embodiments according to this disclosure, such as Figure 3A The top view of sensor module 3 shown in the image. Figure 3B As shown, the protective film 11 includes a plurality of openings 11h spaced apart from each other. In some embodiments, the number, size, and shape of the openings, as well as the distance between two adjacent openings, may be adjusted or changed depending on different design requirements. In some embodiments, the openings 11h surround the sensing region 10s of the sensing device 10. The openings 11h are spaced apart from the sensing region 10s of the sensing device 10.

[0024] Figure 4 A cross-sectional view of a semiconductor device package 4 according to some embodiments of the present invention is shown. Figure 3A As shown, the semiconductor device package 4 includes a substrate 40, a package body 41, and a sensing module 3. In other embodiments, depending on different design requirements, the sensing module 3 of the semiconductor device package 4 may be composed of... Figure 1A The sensing module 1 or Figure 2 Replace sensor module 2 in the middle.

[0025] Substrate 40 may be, for example, a printed circuit board, such as a paper-based copper foil laminate, a composite copper foil laminate, or a polymer-impregnated glass fiber-based copper foil laminate. Substrate 40 may include interconnect structures, such as redistribution layers (RDLs) or grounding elements. In some embodiments, substrate 40 may be a single-layer or multi-layer substrate comprising a core layer and conductive material and / or structures. The conductive material and / or structures may comprise multiple traces. Substrate 40 may include one or more conductive pads 40p that are proximate, adjacent, or embedded in and exposed on surface 401 of substrate 40. Substrate 40 may contain solder resist (or solder mask) on surface 401 of substrate 40 to fully expose or expose at least a portion of the conductive pads 40p for electrical connection. For example, solder resist may cover a portion of conductive pad 10p.

[0026] The sensing module 3 is mounted on the surface 401 of the substrate 40. The active surface 101 of the sensing device 10 faces away from the surface 401 of the substrate 40. The conductive pad 10p of the sensing device 10 is electrically connected to the conductive pad 40p of the substrate 40 via a bonding wire 10w.

[0027] Encapsulation body 41 is disposed on surface 401 of substrate 40, and a portion of active surface 101 of transfer device 10 is exposed from protective film 11 and / or protective film 12. Encapsulation body 41 covers or encapsulates a portion of active surface 101 of transfer device 10, bonding lines 10w, and substrate 40. In some embodiments, encapsulation body 41 comprises epoxy resin with filler, molding material (e.g., epoxy molding material or other molding material), polyimide, phenolic compound or material, material having silicone dispersed therein, or combinations thereof.

[0028] Figure 5A , Figure 5B and Figure 5C This describes the various stages of the manufacturing process of the transmission module according to some embodiments of the present disclosure. In some embodiments, Figure 5A , Figure 5B and Figure 5C The operations described herein can be used to manufacture, for example Figure 3A The transmission module 3 shown in the image. Alternatively, Figure 5A , Figure 5B and Figure 5C The operations described herein can be used to manufacture other sensing modules.

[0029] See Figure 5AA sensing device 10 is provided. A protective film 11' is placed or attached to the active surface 101 of the sensing device 10 to cover the active surface 101 of the sensing device 10 (including the sensing region 10s and the conductive pad 10p). Next, a patterned mask 59 is placed on the protective film 11'. The patterned mask 59 is located above the sensing region 10s of the sensing device 10 and above a position adjacent to the edge of the sensing region 10s of the sensing device 10.

[0030] See Figure 5B A portion of the protective film 11' is removed to form the protective film 11. In some embodiments, a portion of the protective film 11' can be removed by, for example, lithography (e.g., exposure and development processes). The protective film 11 has a plurality of openings 11h to expose the active surface 101 of the sensing device 10.

[0031] See Figure 5C A protective film 12 is formed on a portion of the active surface 101 of the sensing device 10. The protective film 12 is also formed on a portion of the protective film 11. The protective film 12 is formed within the opening 11h and directly contacts the active surface 101 of the sensing device 10 exposed through the opening 11h. In some embodiments, the protective film 12 can be formed using a process similar to that used to form the protective film 11.

[0032] In describing some embodiments, the phrase "on" another component can encompass situations where the former component is directly on the latter component (e.g., in physical contact with the latter component), as well as situations where one or more intermediate components are positioned between the former and the latter components.

[0033] In the description of some embodiments, a component characterized as "light-transmitting" or "transparent" may refer to such a component having at least 80%, for example, at least 85%, or at least 90% transmittance at a relevant wavelength or wavelength range, such as the peak infrared wavelength or infrared wavelength range emitted by a light emitter. In the description of some embodiments, a component characterized as "light-shielding," "light-blocking," or "opaque" may refer to such a component having no more than 20%, for example, no more than 15%, or no more than 10% transmittance at a relevant wavelength or wavelength range, such as the peak infrared wavelength or infrared wavelength range emitted by a light emitter.

[0034] Additionally, quantities, ratios, and other values ​​are sometimes presented in range format in this document. It should be understood that such range format is used for convenience and brevity purposes and should be interpreted flexibly to include not only values ​​explicitly specified as range limits, but also all individual values ​​or subranges covered within the range, as if each value and subrange were explicitly specified.

[0035] As used herein, the terms “approximately,” “substantially,” “substantially,” and “about” are used to describe and explain small variations. When used in conjunction with an event or situation, the terms can refer to a situation where the event or situation has clearly occurred or is very close to occurring. For example, when used in conjunction with numerical values, the terms can refer to a range of variation less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%.

[0036] Although this disclosure has been described and illustrated with reference to specific embodiments thereof, such descriptions and illustrations are not limiting of this disclosure. Those skilled in the art will readily understand that various changes can be made and equivalents can be substituted within embodiments without departing from the true spirit and scope of this disclosure as defined by the appended claims. Illustrations may not be drawn to scale. Artistic representations in this disclosure may differ from actual devices due to variations in manufacturing processes, etc. Other embodiments of this disclosure may exist that are not specifically described. This specification and drawings should be considered illustrative rather than restrictive. Modifications can be made to adapt particular circumstances, materials, composition, methods, or processes to the objectives, spirit, and scope of this disclosure. All such modifications are contemplated within the scope of the appended claims. While the methods disclosed herein have been described with reference to specific operations performed in a particular order, it should be understood that these operations can be combined, subdivided, or reordered to form equivalent methods without departing from the teachings of this disclosure. Therefore, unless specifically indicated herein, the order and grouping of operations are not a limitation of this disclosure.

Claims

1. A method for manufacturing an electronic module, comprising: (a) A sensing device is provided, the sensing device having an active surface and a sensing region disposed adjacent to the active surface of the sensing device; (b) Forming a first protective film on the active surface of the sensing device to completely cover the sensing area of ​​the sensing device, wherein operation (b) further includes forming one or more openings to penetrate the first protective film to expose a portion of the active surface of the sensing device. as well as (c) Forming a second protective film in contact with a portion of the first protective film and the active surface of the sensing device, wherein the second protective film covers the top surface of a portion of the first protective film and completely fills the opening, and there are no external connecting elements in the opening, wherein the second protective film is a passivation film or a dielectric film.

2. The method of claim 1, wherein the operation (c) further comprises forming a second protective film within the opening and contacting the portion of the active surface of the sensing device exposed from the first protective film, wherein the projection of the second protective film onto the active surface of the sensing device is spaced apart from the projection of the sensing region onto the active surface of the sensing device.

3. The method of claim 1, wherein the opening surrounds the sensing region of the sensing device, wherein the first protective film and the second protective film define a locking structure, wherein the second protective film is formed by a photolithography process.

4. The method according to claim 1, wherein the bonding strength between the second protective film and the sensing device is greater than the bonding strength between the first protective film and the sensing device, wherein the first protective film is a passivation film containing a hydrophobic material, and wherein the first protective film is formed by a photolithography process.

5. The method of claim 1, wherein the operation (a) further comprises providing the sensing device on a substrate, wherein the active surface of the sensing device includes a conductive pad connected to the substrate via a conductive wire, wherein the second protective film exposes the conductive pad, wherein the sensing device has a first side surface and a second side surface relative to the first side surface, wherein the second protective film is spaced apart from the first side surface of the sensing device to partially expose the active surface, and spaced apart from the second side surface of the sensing device to partially expose the active surface.

6. The method of claim 5, further comprising a package body disposed on the substrate and in contact with the second protective film, wherein the interface between the package body and the second protective film is located between the edge of the first protective film and the conductive pad, wherein the interface between the second protective film and the package body is substantially perpendicular to the active surface.

7. The method of claim 6, wherein the encapsulation body covers the conductive pad and the conductive wire, wherein the second protective film comprises polyimide (PI), polybenzoxazole (PBO), or phenylcyclobutane (BCB).

8. The method of claim 6, wherein the second protective film is spaced apart from the conductive line by the encapsulation body, wherein the first protective film has a first side surface and a second side surface relative to the first side surface, wherein the opening of the first protective film is between the first side surface and the second side surface, wherein the second protective film laterally covers the first side surface and the second side surface.

9. The method of claim 6, wherein the top surface of the first protective film is substantially parallel to the top surface of the second protective film.

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