An LED bracket capable of inhibiting the curing flow of fluorescent powder and a manufacturing method thereof

Abstract

The present invention discloses an LED bracket capable of inhibiting the curing flow of phosphor and a manufacturing method thereof. The LED bracket comprises a bracket body and a packaging metal part; a bracket cup is provided on the bracket body, the bottom center of the bracket cup being a chip welding location, the packaging metal part is connected to the bottom of the bracket body, and the packaging metal part is used to electrically connect to a metal lead; the side wall of the bracket body at the bracket cup is provided with multiple circles of wall protrusions from top to bottom, the multiple circles of wall protrusions forming wall serrations; the bottom wall of the bracket body at the bracket cup is provided with multiple circles of bottom protrusions from inside to outside, the multiple circles of bottom protrusions forming bottom serrations, and the bottom serrations are located on the periphery of the chip welding location. The wall serrations and bottom serrations of the present invention can disrupt the circulation of the packaging glue generated by natural convection, weaken the flow near the side wall and bottom wall of the bracket body at the bracket cup, thereby inhibiting changes in the distribution of phosphor and maintaining the consistency of the light color uniformity of the LED before and after curing to the greatest extent.

Description

Technical Field

[0001] The present invention relates to the field of lighting and display technology, and in particular to an LED bracket capable of inhibiting the solidification flow of fluorescent powder and a manufacturing method thereof. Background Art

[0002] LEDs are widely used in society, and their light color uniformity has always been one of the most important indicators. The distribution of phosphor particles in the LED encapsulant directly affects the device's light color uniformity. During LED curing, uneven heating of the encapsulant creates natural convection, which can alter the distribution of phosphor particles within the encapsulant. Flow is most intense near the center and edges of the bracket bowl, ultimately forming a circular flow from the edge to the center. This results in uneven phosphor distribution, severely impacting the device's light color uniformity. Summary of the Invention

[0003] The purpose of the present invention is to overcome the shortcomings of the existing technology and provide an LED bracket that can inhibit the curing flow of phosphor powder, thereby solving the problem that when the existing LED is cured, the natural convection caused by uneven heating of the encapsulation glue causes uneven distribution of phosphor powder, thereby affecting the light color uniformity of the device.

[0004] Another object of the present invention is to provide a method for manufacturing the above-mentioned LED bracket that can inhibit the solidification and flow of phosphor.

[0005] The technical solution of the present invention is: an LED bracket that can inhibit the solidification flow of fluorescent powder, comprising a bracket body and a packaging metal part; a bracket bowl is provided on the bracket body, the bottom center of the bracket bowl is a chip welding place, the packaging metal part is connected to the bottom of the bracket body, and the packaging metal part is used to be electrically connected to the metal lead; the side wall of the bracket body at the bracket bowl is provided with multiple circles of wall protrusions from top to bottom, and the multiple circles of wall protrusions form wall serrations, and the bottom wall of the bracket body at the bracket bowl is provided with multiple circles of bottom protrusions from inside to outside, and the multiple circles of bottom protrusions form bottom serrations, and the bottom serrations are located on the periphery of the chip welding place.

[0006] Furthermore, the bracket body is made of PPA or PA material.

[0007] Furthermore, the packaging metal part is connected to the bottom of the bracket body through PLCC packaging or planar packaging.

[0008] Furthermore, the material used for the packaging metal part is copper, silver, iron or aluminum.

[0009] Furthermore, the cross-sectional shape of the wall protrusion and the bottom protrusion is an equilateral triangle, an isosceles triangle or a square.

[0010] Furthermore, the angle between two adjacent circles of the wall protrusions is 30°, 60°, 90° or 120°, and the angle between two adjacent circles of the bottom protrusions is 30°, 60°, 90° or 120°.

[0011] Furthermore, the height of the bracket body is 0.8-5mm, the length and width are 2-7mm, the width of the bracket bowl section is 1-6mm, and the depth is 0.2-4mm.

[0012] Another technical solution of the present invention is: a method for manufacturing the above-mentioned LED bracket capable of inhibiting the solidification flow of phosphor, comprising the following steps:

[0013] Step S1: Prefabricate the mold, inject PPA or PA material into the mold, and remove the mold after molding to obtain the bracket body with the bracket bowl and cup;

[0014] Step S2: performing lathing on the side wall of the bracket bowl of the bracket body to form multiple circles of wall protrusions;

[0015] Step S3: performing lathe processing on the bottom wall of the bracket bowl of the bracket body to form multiple circles of bottom surface protrusions;

[0016] Step S4: Carry out end surface machining at the center of the bottom of the bracket bowl of the bracket body to form a chip welding location;

[0017] Step S5: Insert the packaging metal part into the bracket body obtained in step S4 to obtain an LED bracket.

[0018] Another technical solution of the present invention is: the manufacturing method of the above-mentioned LED bracket capable of inhibiting the solidification flow of phosphor comprises the following steps:

[0019] Step S1: First use computer software to build a model;

[0020] Step S2: importing the model created in step S1 into a 3D printing device, and obtaining the stent body through 3D printing;

[0021] Step S3: Insert the packaged metal parts into the bracket body obtained in step S2 to obtain an LED bracket.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] The LED bracket of the present invention can suppress the flow of fluorescent powder during curing. The side wall of the bracket bowl is provided with multiple circles of wall protrusions from top to bottom, and the multiple circles of wall protrusions form wall serrations. The bottom wall of the bracket bowl is provided with multiple circles of bottom protrusions from inside to outside, and the multiple circles of bottom protrusions form bottom serrations. When the LED packaging glue produces natural convection due to uneven heating during curing, the flow is largest at the center, side walls and bottom wall of the bracket bowl of the bracket body, forming a circulation. The wall serrations and bottom serrations can weaken the flow at the side walls and bottom wall, thereby suppressing the change of the fluorescent powder distribution and maintaining the consistency of the LED light color uniformity before and after curing to the greatest extent. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic structural diagram of an LED bracket according to embodiment 1 of the present invention.

[0025] Figure 2 This is a cross-sectional view of the LED bracket according to embodiment 1 of the present invention.

[0026] Figure 3 This is a comparison diagram of the curing flow of the LED bracket of Example 1 of the present invention and the ordinary lamp cup structure.

[0027] Figure 4 This is a comparison chart of the phosphor concentration change rate of the LED bracket of Example 1 of the present invention and the ordinary lamp cup structure.

[0028] Figure 5 This is a comparison chart of the maximum velocity of particles in the LED bracket of Example 1 of the present invention and the ordinary lamp cup structure.

[0029] Figure 6 This is a schematic structural diagram of an LED bracket according to embodiment 2 of the present invention.

[0030] Figure 7 This is a schematic structural diagram of an LED bracket according to embodiment 3 of the present invention.

[0031] Figure 8 This is a structural diagram of an LED bracket according to embodiment 4 of the present invention.

[0032] Figure 9 This is a structural diagram of an LED bracket according to embodiment 5 of the present invention.

[0033] Support bowl 100 , support body 101 , wall protrusion 102 , bottom protrusion 103 , chip welding point 104 , and packaging metal part 200 . DETAILED DESCRIPTION

[0034] The present invention will be further described in detail below with reference to the examples, but the embodiments of the present invention are not limited thereto.

[0035] Example 1

[0036] like Figure 1 As shown, this embodiment provides an LED bracket capable of suppressing the solidification and flow of phosphor, including a bracket body 101 and a packaging metal part 200 .

[0037] like Figure 1 and Figure 2 As shown, a bracket bowl 100 is provided on the bracket body, and the center of the bottom of the bracket bowl is a chip welding point 104. The encapsulated metal parts are connected to the bottom of the bracket body, and the encapsulated metal parts are used to electrically connect with the metal leads to connect with the external circuit; the side wall of the bracket body at the bracket bowl is provided with multiple circles of wall protrusions 102 from top to bottom, and the multiple circles of wall protrusions form wall serrations, and the bottom wall of the bracket body at the bracket bowl is provided with multiple circles of bottom protrusions 103 from inside to outside, and the multiple circles of bottom protrusions form bottom serrations, and the bottom serrations are located on the periphery of the chip welding point.

[0038] like Figure 3 As shown in the figure, when the LED encapsulation glue produces natural convection due to uneven heating during curing, the flow in the center, side walls and bottom walls of the bracket bowl is the largest, forming a circulation. The wall serrations and bottom serrations can weaken the circulation at the side walls and bottom walls, thereby inhibiting the curing flow of the LED encapsulation glue.

[0039] In this embodiment, the height of the bracket body is 1.0 mm, the length and width are 3.5 mm, the width of the bracket bowl section is 2.4 mm, and the depth is 0.8 mm. The bracket body is made of PPA material, and the packaging metal parts are made of copper. The packaging metal parts are connected to the bottom of the bracket body through PLCC packaging.

[0040] In this embodiment, the cross-sectional shape of the wall protrusions and the bottom protrusions is an equilateral triangle, the angle between two adjacent circles of wall protrusions is 60°, and the angle between two adjacent circles of bottom protrusions is 60°.

[0041] The wall and bottom serrations of the present invention can disrupt the circulation of the encapsulant due to natural convection, weaken the flow near the side walls and bottom wall of the bracket bowl, thereby suppressing the change of the phosphor distribution and maintaining the consistency of the LED light color uniformity before and after curing to the greatest extent. The effect diagram and data analysis are shown in Figure 3 、 Figure 4 and Figure 5 .

[0042] The method for manufacturing the LED bracket capable of inhibiting the curing flow of phosphor comprises the following steps:

[0043] Step S1: Prefabricate the mold, inject PPA or PA material into the mold, and remove the mold after molding to obtain the bracket body with the bracket bowl and cup;

[0044] Step S2: performing lathing on the side wall of the bracket bowl of the bracket body to form multiple circles of wall protrusions;

[0045] Step S3: performing lathe processing on the bottom wall of the bracket bowl of the bracket body to form multiple circles of bottom surface protrusions;

[0046] Step S4: Carry out end surface machining at the center of the bottom of the bracket bowl of the bracket body to form a chip welding location;

[0047] Step S5: Insert the packaging metal part into the bracket body obtained in step S4 to obtain an LED bracket.

[0048] Example 2

[0049] like Figure 6 As shown, the difference between this embodiment and embodiment 1 is that, in this embodiment, the angle between two adjacent circles of wall protrusions is 30°, the angle between two adjacent circles of bottom protrusions is 30°, the height of the bracket body is 0.8mm, the length and width are 2.0mm, the width of the bracket bowl section is 1mm, and the depth is 0.2mm, the bracket body is made of PA material, the packaging metal part is made of iron, and the packaging metal part is connected to the bottom of the bracket body through flat packaging.

[0050] The method for manufacturing the LED bracket capable of inhibiting the curing flow of phosphor comprises the following steps:

[0051] Step S1: First use computer software to build a model;

[0052] Step S2: importing the model created in step S1 into a 3D printing device, and obtaining the stent body through 3D printing;

[0053] Step S3: Insert the packaged metal parts into the bracket body obtained in step S2 to obtain an LED bracket.

[0054] Example 3:

[0055] like Figure 7 As shown, the difference between this embodiment and embodiment 1 is that the angle between two adjacent circles of wall protrusions is 90°, the angle between two adjacent circles of bottom protrusions is 90°, the height of the bracket body is 5mm, the length and width are 7mm, the width of the bracket bowl section is 6mm, and the depth is 4mm.

[0056] Example 4

[0057] like Figure 8 As shown, the difference between this embodiment and embodiment 1 is that the angle between two adjacent circles of wall protrusions is 120°, and the angle between two adjacent circles of bottom protrusions is 120°.

[0058] Example 5

[0059] like Figure 9 As shown, the difference between this embodiment and embodiment 1 is that the cross-sectional shape of the wall protrusion and the bottom protrusion is square.

[0060] As described above, the present invention can be better implemented. The above embodiments are only preferred embodiments of the present invention and are not intended to limit the scope of implementation of the present invention. That is, all equivalent changes and modifications made based on the content of the present invention are covered by the scope of protection required by the claims of the present invention.

Claims

1. An LED bracket capable of inhibiting the curing flow of phosphor, characterized in that: It includes a bracket body and a packaging metal part; The bracket body is provided with a bracket cup, the bottom center of the bracket cup is the chip welding point, the packaging metal part is connected to the bottom of the bracket body, and the packaging metal part is used to be electrically connected to the metal lead; The side wall of the bracket body at the bracket cup is provided with multiple circles of wall protrusions from top to bottom, and the multiple circles of wall protrusions form wall serrations. The bottom wall of the bracket body at the bracket cup is provided with multiple circles of bottom protrusions from inside to outside, and the multiple circles of bottom protrusions form bottom serrations. The bottom serrations are located on the periphery of the chip welding position. The bracket body is made of PPA or PA material; The packaging metal part is connected to the bottom of the bracket body through PLCC packaging or planar packaging.

2. The LED bracket capable of suppressing the curing flow of phosphor according to claim 1, characterized in that: The packaging metal part is made of copper, silver, iron or aluminum.

3. The LED bracket capable of suppressing the curing flow of phosphor according to claim 1, characterized in that: The cross-sectional shape of the wall surface protrusion and the bottom surface protrusion is an isosceles triangle or a square.

4. The LED bracket capable of suppressing the curing flow of phosphor according to claim 1, characterized in that: The angle between two adjacent circles of the wall protrusions is 30°, 60°, 90° or 120°, and the angle between two adjacent circles of the bottom protrusions is 30°, 60°, 90° or 120°.

5. The LED bracket capable of suppressing the curing flow of phosphor according to claim 1, characterized in that: The height of the bracket body is 0.8-5mm, the length and width are 2-7mm, the width of the bracket bowl section is 1-6mm, and the depth is 0.2-4mm.

6. A method for manufacturing an LED bracket capable of inhibiting the curing flow of phosphor according to any one of claims 1 to 5, characterized in that: The following steps are involved: Step S1: Prefabricate the mold, inject PPA or PA material into the mold, and remove the mold after molding to obtain the bracket body with the bracket bowl and cup; Step S2: performing lathing on the side wall of the bracket bowl of the bracket body to form multiple circles of wall protrusions; Step S3: performing lathe processing on the bottom wall of the bracket bowl of the bracket body to form multiple circles of bottom surface protrusions; Step S4: Carry out end surface machining at the center of the bottom of the bracket bowl of the bracket body to form a chip welding location; Step S5: Insert the packaging metal part into the bracket body obtained in step S4 to obtain an LED bracket.

7. A method for manufacturing an LED bracket capable of inhibiting the curing flow of phosphor according to any one of claims 1 to 5, characterized in that: The following steps are involved: Step S1: First use computer software to build a model; Step S2: importing the model created in step S1 into a 3D printing device, and obtaining the stent body through 3D printing; Step S3: Insert the packaged metal parts into the bracket body obtained in step S2 to obtain an LED bracket.

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