Display device

Abstract

A display device is provided, the display device including a display panel including a display layer including light emitting elements disposed on a substrate and a sensor electrode layer disposed on the display layer. The sensor electrode layer includes first and second sound electrodes, a vibration layer electrically contacting the first and second sound electrodes and deforming in response to a first sound drive voltage applied to the first sound electrode and a second sound drive voltage applied to the second sound electrode, and a sensor electrode disposed on the vibration layer. The sensor electrode senses an input.

Description

TECHNICAL FIELD

[0001] Disclosed relates to a display device. BACKGROUND

[0002] With the development of information society, various demands for display devices are increasing. For example, display devices are being used in various electronic devices such as, for example, smart phones, digital cameras, laptop computers, navigation devices, and smart TVs.

[0003] A display device can include a display panel that can display an image and a sound generator that can emit a sound. Recently, a sound generator that can be attached to a surface of a display panel and vibrate the display panel to generate a sound is being developed. In order to further reduce the thickness and size of the sound generator, research is being conducted.

[0004] It will be appreciated that the background description provided herein is intended to be useful, but not limiting, for the purposes of understanding the technology. However, background section can also include ideas, concepts or realizations that were not part of the respective, underlying application's disclosure as of the corresponding effective filing date of the disclosure herein. SUMMARY

[0005] Embodiments can provide a display device including a sound unit included in a display panel.

[0006] Additional features of the embodiments will be set forth in the description that follows, and in part will be apparent from the description, or can be learned by practice of the disclosure herein.

[0007] According to embodiments, a display device can include a display panel, the display panel can include a display layer including light emitting elements disposed on a base, and a sensor electrode layer disposed on the display layer. The sensor electrode layer can include first and second sound electrodes, a vibration layer electrically contacting the first and second sound electrodes, wherein the vibration layer can be deformed in response to a first sound driving voltage applied to the first sound electrode and a second sound driving voltage applied to the second sound electrode, and a sensor electrode disposed on the vibration layer. The sensor electrode can sense an input.

[0008] The first and second sound electrodes can be disposed on the same layer.

[0009] The first sound electrode can include a first sound trunk electrode extending in one direction and a first sound branch electrode protruding from the first sound trunk electrode in another direction. The second sound electrode can include a second sound trunk electrode extending in the one direction and a second sound branch electrode protruding from the second sound trunk electrode in the other direction.

[0010] The first sound branch electrode and the second sound branch electrode can be alternately arranged in the one direction.

[0011] The first sound electrode can not overlap the second sound electrode in a thickness direction of the substrate.

[0012] The vibration layer can be disposed on the first sound electrode and the second sound electrode.

[0013] The sensor electrode can include a sensing electrode arranged in a first direction and a driving electrode arranged in a second direction. The sensor electrode layer can further include a first connection electrode electrically connected with adjacent ones of the driving electrodes in the second direction.

[0014] The vibration layer can be disposed on the first connection electrode.

[0015] Each of the adjacent ones of the driving electrodes in the second direction can be electrically connected to the first connection electrode through a first contact hole penetrating the vibration layer.

[0016] The sensor electrode layer can further include a first sensor insulating layer disposed on the first connection electrode.

[0017] Each of the adjacent ones of the driving electrodes in the second direction can be electrically connected to the first connection electrode through a first contact hole penetrating the first sensor insulating layer.

[0018] The first sound electrode and the second sound electrode can be disposed on the vibration layer.

[0019] The sensor electrode can be disposed on the first sound electrode and the second sound electrode.

[0020] The sensor electrode can include a sensing electrode arranged in a first direction and a driving electrode arranged in a second direction, and the sensor electrode layer can further include a first connection electrode electrically connected with adjacent ones of the driving electrodes in the second direction.

[0021] The first connection electrode can be disposed on the vibration layer.

[0022] The sensor electrode layer can further include a first sensor insulating layer disposed on the first connection electrode.

[0023] Each of the adjacent ones of the driving electrodes in the second direction can be electrically connected to the first connection electrode through a first contact hole penetrating the first sensor insulating layer.

[0024] The driving electrode and the sensing electrode can be disposed on the first sensor insulating layer.

[0025] The first sound electrode can be disposed on the vibration layer, and the vibration layer can be disposed on the second sound electrode.

[0026] The first sound electrode can be stacked with the second sound electrode in a thickness direction of the substrate.

[0027] The sensor electrode can include a sensing electrode arranged in a first direction and a driving electrode arranged in a second direction, and the sensor electrode layer can further include a first connection electrode electrically connected with adjacent ones of the driving electrodes in the second direction.

[0028] A vibration layer can be disposed on the first connection electrode.

[0029] The first connection electrode and the second sound electrode can be disposed on the same layer.

[0030] The sensor electrode layer can further include a first sensor insulating layer disposed on the first connection electrode.

[0031] Each of the adjacent ones of the driving electrodes in the second direction can be electrically connected to the first connection electrode through a first contact hole penetrating the first sensor insulating layer.

[0032] According to an embodiment, a display device can include a display panel, the display panel can include a display layer including light emitting elements disposed on a surface of a substrate, and a sound electrode layer including sound cells and disposed on an opposite surface of the substrate. Each of the sound cells can include a first sound electrode, a second sound electrode disposed on the first sound electrode, and a first vibration layer disposed between the first sound electrode and the second sound electrode. The first vibration layer can be deformed in response to a first sound driving voltage applied to the first sound electrode and a second sound driving voltage applied to the second sound electrode. The first sound electrodes of the sound cells arranged in a first direction among the sound cells can be electrically connected to each other. The second sound electrodes of the sound cells arranged in a second direction among the sound cells can be electrically connected to each other.

[0033] The sound electrode layer can further include a first sound line disposed between the first sound electrodes of the sound cells adjacent to each other in the first direction, and a second sound line disposed between the second sound electrodes of the sound cells adjacent to each other in the second direction.

[0034] The display panel can further include a light blocking layer disposed between the opposite surface of the substrate and the sound electrode layer.

[0035] The display panel can further include a bottom panel cover disposed on the sound electrode layer, the bottom panel cover can include a buffer member absorbing an external impact applied to the display panel, and the buffer member can not be stacked with the sound cells in a thickness direction of the substrate.

[0036] The buffer member can include a through-hole, and the sound cells can be disposed in the through-hole.

[0037] The bottom panel cover can further include a heat dissipation member disposed on the buffer member.

[0038] The sound electrode layer can further include vibration units spaced apart from the sound units, and each of the vibration units can include a first vibration electrode, a second vibration electrode disposed on the first vibration electrode, and a second vibration layer disposed between the first vibration electrode and the second vibration electrode. The second vibration layer can be deformed in response to a first vibration driving voltage applied to the first vibration electrode and a second vibration driving voltage applied to the second vibration electrode.

[0039] The sound units can be adjacent to the vibration units.

[0040] Each of the sound units can include a first sub-sound unit disposed adjacent to first and second side surfaces of the vibration unit, a second sub-sound unit disposed adjacent to the first side surface of the vibration unit and a third side surface, a third sub-sound unit disposed adjacent to the second side surface of the vibration unit and a fourth side surface, and a fourth sub-sound unit disposed adjacent to the third side surface of the vibration unit and the fourth side surface.

[0041] The first sound electrode of the first sub-sound unit can be electrically connected to the first sound electrode of the second sub-sound unit, the first sound electrode of the third sub-sound unit can be electrically connected to the first sound electrode of the fourth sub-sound unit, the first sound electrode of the first sub-sound unit can be spaced apart from the first sound electrode of the third sub-sound unit, and the first sound electrode of the second sub-sound unit can be spaced apart from the first sound electrode of the fourth sub-sound unit.

[0042] The second sound electrode of the first sub-sound unit can be electrically connected to the second sound electrode of the third sub-sound unit, the second sound electrode of the second sub-sound unit can be electrically connected to the second sound electrode of the fourth sub-sound unit, the second sound electrode of the first sub-sound unit can be spaced apart from the second sound electrode of the second sub-sound unit, and the second sound electrode of the third sub-sound unit can be spaced apart from the second sound electrode of the fourth sub-sound unit.

[0043] The sound electrode layer can further include a first sub-sound connection line electrically connected to the first sound electrode of the first sub-sound unit and the first sound electrode of the second sub-sound unit, a second sub-sound connection line electrically connected to the first sound electrode of the third sub-sound unit and the first sound electrode of the fourth sub-sound unit, a third sub-sound connection line electrically connected to the second sound electrode of the first sub-sound unit and the second sound electrode of the third sub-sound unit, and a fourth sub-sound connection line electrically connected to the second sound electrode of the second sub-sound unit and the second sound electrode of the fourth sub-sound unit.

[0044] The sound electrode layer can further include: a first vibration line electrically connected to first vibration electrodes of vibration units adjacent to each other in a first direction; and a second vibration line electrically connected to second vibration electrodes of vibration units adjacent to each other in a second direction.

[0045] The first vibration line can be disposed between the first sub-sound connection line and the second sub-sound connection line, and the second vibration line can be disposed between the third sub-sound connection line and the fourth sub-sound connection line.

[0046] The first vibration line can be disposed between the first sub-sound unit and the third sub-sound unit and can be disposed between the second sub-sound unit and the fourth sub-sound unit, and the second vibration line can be disposed between the first sub-sound unit and the second sub-sound unit and can be disposed between the third sub-sound unit and the fourth sub-sound unit.

[0047] The sound electrode layer can further include a shield unit spaced apart from the sound units, and the shield unit can include: a first shield electrode; a second shield electrode superposed with the first shield electrode in a thickness direction of the substrate; and a third vibration layer disposed between the first shield electrode and the second shield electrode. The third vibration layer can be deformed in response to a first shield driving voltage applied to the first shield electrode and a second shield driving voltage applied to the second shield electrode.

[0048] A first sound driving voltage applied to a first sound electrode of a sound unit adjacent to the shield unit can be equal to a second shield driving voltage applied to a second shield electrode of the shield unit, and a second sound driving voltage applied to a second sound electrode of the sound unit adjacent to the shield unit can be equal to a first shield driving voltage applied to a first shield electrode of the shield unit.

[0049] The second shield electrode can be electrically connected to at least one of the first sound electrodes, and the first shield electrode can be electrically connected to at least one of the second sound electrodes.

[0050] The sound electrode layer can further include a force sensing unit spaced apart from the sound units, and each of the force sensing units can include: a force driving electrode; a force sensing electrode spaced apart from the force driving electrode; and a force sensing layer disposed on the force driving electrode and the force sensing electrode and having a variable resistance in response to a force applied to the force sensing layer.

[0051] The force driving electrode, the force sensing electrode, and the first sound electrode are made of the same material.

[0052] Each of the force sensing units can further include a bump disposed on the force sensing layer.

[0053] The bump and the second sound electrode are made of the same material.

[0054] The sound electrode layer can further include a fixed magnet disposed on the second sound electrode, and the back cover can further include a planar coil that is stacked with the fixed magnet in a thickness direction of the base and disposed on the cushion.

[0055] The current can flow through the planar coil to generate a magnetic field of the fixed magnet and a magnetic field of the planar coil, the current can flow from one end of the planar coil to the other end of the planar coil to generate an attractive force between the fixed magnet and the planar coil, and the current can flow from the other end of the planar coil to the one end of the planar coil to generate a repulsive force between the fixed magnet and the planar coil.

[0056] According to an embodiment, a display device can include a display panel and a sensor unit, the display panel can include a base including an upper surface and a side surface extending from an edge of the upper surface, a display layer including a light emitting element disposed on a surface of the base in the upper surface and the side surface, and a sound electrode layer including a sound unit and disposed on an opposite surface of the base, and the sensor unit is disposed on the opposite surface of the base in the side surface. The sound unit can include a first sound electrode, a second sound electrode disposed on the first sound electrode, and a vibration layer disposed between the first sound electrode and the second sound electrode. The vibration layer can be deformed in response to a first sound driving voltage applied to the first sound electrode and a second sound driving voltage applied to the second sound electrode.

[0057] The sensor unit can be a fingerprint sensor unit that emits ultrasonic waves or light and detects the ultrasonic waves or light reflected by a fingerprint.

[0058] The sensor unit can be a force sensing unit that can include a force driving electrode, a force sensing electrode spaced apart from the force driving electrode, and a force sensing layer disposed on the force driving electrode and the force sensing electrode and having a variable resistance in response to a force applied to the force sensing layer.

[0059] The sound electrode layer can further include a second sound unit disposed on the opposite surface of the base in the side surface of the base.

[0060] According to an embodiment, the first sound electrode, the second sound electrode, and the vibration layer can be formed in the display device or disposed on a sensor electrode layer for sensing a touch input of a user. Accordingly, in addition to sensing a touch input of a user using a driving electrode and a sensing electrode of the sensor electrode layer, a sound can be output by vibrating the vibration layer by the first sound electrode and the second sound electrode of the sensor electrode layer. The sound can be output by using a sound unit incorporated into the display panel.

[0061] According to an embodiment, a sound electrode layer including a first sound electrode, a second sound electrode, and a vibration layer can be disposed between a base of a display panel and a bottom panel cover in a display device. Accordingly, sound can be output by vibrating the vibration layer by the first sound electrode and the second sound electrode of the sound electrode layer. Sound can be output by using a sound unit included in the display panel.

[0062] Other features and embodiments can be apparent from the following detailed description, figures and claims.

[0063] It will be understood that neither the foregoing summary nor the following detailed description should be taken as limiting on the embodiments as described or claimed. BRIEF DESCRIPTION OF DRAWINGS

[0064] The accompanying drawings, which are included to provide a further understanding of the disclosure and are incorporated in and constitute a part of this application, illustrate embodiments and together with the description serve to explain the principles of the disclosure.

[0065] FIG. 1 is a perspective view of a display device according to an embodiment;

[0066] FIG. 2 is an exploded perspective view of a display device according to an embodiment;

[0067] FIG. 3 is a block diagram illustrating a display device according to an embodiment;

[0068] FIG. 4 is a plan view illustrating a display panel according to an embodiment;

[0069] FIG. 5 is a side view illustrating an example of a display panel of FIG. 4 ;

[0070] FIG. 6 is a view illustrating a layout of a display layer of a display panel according to an embodiment;

[0071] FIG. 7 is a view illustrating a layout of a sensor electrode layer of a display panel according to an embodiment;

[0072] FIG. 8 is an enlarged plan view illustrating a portion of a sensor area of FIG. 7 ;

[0073] FIG. 9 is a view illustrating an example of a sensor driver electrically connected to a drive electrode and a sense electrode of FIG. 7 ;

[0074] FIG. 10 is an enlarged plan view illustrating a drive electrode, a sense electrode, a first connection electrode, a first sound electrode, and a shield electrode of FIG. 8 ;

[0075] FIG. 11 is a schematic cross-sectional view taken along the line I-I' of FIG. 10 ;

[0076] FIG. 12 is a schematic cross-sectional view taken along the line II-II' of FIG. 10 ;

[0077] FIG. 13 is a view showing an example of reverse piezoelectric vibration of the vibration layer by a first sound driving voltage applied to the first sound electrode and a second sound driving voltage applied to the second sound electrode according to FIG. 9 ;

[0078] FIG. 14 is a schematic cross-sectional view taken along the line I-I' of FIG. 10 ;

[0079] FIG. 15 is a schematic cross-sectional view taken along the line II-II' of FIG. 10 ;

[0080] FIG. 16 is a schematic cross-sectional view taken along the line I-I' of FIG. 10 ;

[0081] FIG. 17 is a schematic cross-sectional view taken along the line II-II' of FIG. 10 ;

[0082] FIG. 18 is a schematic cross-sectional view taken along the line I-I' of FIG. 10 ;

[0083] FIG. 19 is a schematic cross-sectional view taken along the line II-II' of FIG. 10 ;

[0084] FIG. 20 is a view showing a layout of a sensor electrode layer of a display panel according to an embodiment;

[0085] FIG. 21 is an enlarged plan view showing a part of a sensor region of FIG. 20 ;

[0086] FIG. 22 is a view showing an example of a sensor driver electrically connected to a driving electrode and a sensing electrode of FIG. 20 , and a sound driver electrically connected to a first sound electrode and a second sound electrode;

[0087] FIG. 23 is a view showing a part of a sensor region of FIG. 21enlarged plan view of the drive electrode, the sensing electrode, the first sound electrode, the first connection electrode, the second connection electrode, the third connection electrode, and the fourth connection electrode of the example;

[0088] FIG. 24 is a schematic cross-sectional view taken along line III-III' of the example of FIG. 23

[0089] FIG. 25 is a schematic cross-sectional view taken along line IV-IV' of the example of FIG. 23

[0090] FIG. 26 is a view showing a variation of the voltage applied to the first sound electrode and the second sound electrode of the example according to FIG. 22

[0091] FIG. 27 is a waveform chart showing a first sound drive voltage applied to the first sound electrode, a second sound drive voltage applied to the second sound electrode, a first shield voltage applied to the first shield electrode, and a second shield voltage applied to the second shield electrode;

[0092] FIG. 28 is a schematic cross-sectional view taken along line III-III' of the example of FIG. 23

[0093] FIG. 29 is a side view showing the display panel of the example according to FIG. 4

[0094] FIG. 30 and FIG. 31 is a view showing a layout of a sound electrode layer of a display panel according to an embodiment;

[0095] FIG. 32 is a view showing a sound unit and a bumper of a bottom panel cover of a sound electrode layer of a display panel according to an embodiment;

[0096] FIG. 33 is a schematic cross-sectional view taken along line V-V' of the example according to FIG. 30

[0097] FIG. 34 is a schematic cross-sectional view taken along line VI-VI' of the example according to FIG. 30

[0098] FIG. 35 is a view showing a layout of a sound electrode layer of a display panel according to an embodiment;

[0099] FIG. 36 is a view showing a layout of a sound electrode layer of a display panel according to an embodiment; FIG. 35 ​​​​​​​A view of the layout of the sub-sound units and vibration units of the first sound unit;

[0100] FIG. 37 It is along FIG. 36 A schematic cross-sectional view taken from line VII-VII';

[0101] FIG. 38 It is along FIG. 36 A schematic cross-sectional view taken from line VIII-VIII';

[0102] FIG. 39 It is along FIG. 36 A schematic cross-sectional view taken by line IX-IX';

[0103] FIG. 40 It is along FIG. 36 A schematic cross-sectional view taken by line X-X';

[0104] FIG. 41 This is a view showing the layout of the acoustic electrode layer of the display panel according to an embodiment;

[0105] FIG. 42 It is along FIG. 41 A schematic cross-sectional view taken by line XI-XI';

[0106] FIG. 43 It is along FIG. 41 A schematic cross-sectional view taken by line XII-XII';

[0107] FIG. 44 This is a view showing the layout of the acoustic electrode layer of the display panel according to an embodiment;

[0108] FIG. 45 It is shown FIG. 44 A view of the layout of the force driving electrode, force sensing electrode, force driving line and force sensing line of the first force sensing unit;

[0109] FIG. 46 It is along FIG. 45 A schematic cross-sectional view taken by line XIII-XIII';

[0110] FIG. 47 This is a view showing the layout of the acoustic electrode layer of the display panel according to an embodiment;

[0111] FIG. 48 It is along FIG. 47 A schematic cross-sectional view taken by line XIV-XIV';

[0112] FIG. 49 and FIG. 50 This is the basis for showing the vibration layer. FIG. 47a view of a fixed magnet's magnetic field, a planar coil's induced magnetic field, and a change in voltage applied to the first sound electrode and the second sound electrode;

[0113] FIG. 51 is a perspective view of a display device according to an embodiment;

[0114] FIG. 52 is a perspective view of a display panel according to an embodiment;

[0115] FIG. 53 is an expanded view of a display panel according to an embodiment;

[0116] FIG. 54 is a view showing an example in which a user makes an input using a force sensing unit provided on a side surface of a display device;

[0117] FIG. 55 is an expanded view of a display panel according to an embodiment;

[0118] FIG. 56 is an expanded view of a display panel according to an embodiment;

[0119] FIG. 57 is a view showing an example in which sound is output through sound units provided on a flat portion and a side surface of a display device;

[0120] FIG. 58 is a view showing an example in which sound is output through sound units according to an image displayed by a display device and haptic feedback is provided through a vibration unit; and

[0121] FIG. 59 to FIG. 61 is a view showing sound output through sound units according to an image displayed by a display device. DETAILED DESCRIPTION

[0122] Embodiments will now be described more fully with reference to the accompanying drawings. Embodiments may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Throughout the disclosure, the same drawing reference numerals are used for the same components throughout the several drawings. The thicknesses of layers and regions can be exaggerated in the drawings for clarity.

[0123] In order to describe the disclosed embodiments, some portions of the description may not be provided with reference to the drawings, and the same reference numerals are used to denote the same elements throughout the specification.

[0124] It will also be understood that, when a layer, film, region, substrate, area or element is referred to as being "on" another layer, film, region, substrate, area or element, it can be directly on the other layer, film, region, substrate, area or element or intervening layers, films, regions, substrates, areas or elements can also be present. In contrast, when an layer, film, region, substrate, area or element is referred to as being "directly on" another layer, film, region, substrate, area or element, there are no intervening layers, films, regions, substrates, areas or elements present. It will further be understood that the terms "comprises" and / or "comprising" when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0125] Furthermore, in the description, the phrase "in plan view" means when viewing the subject portion from above, and the phrase "in schematic cross-sectional view" means when viewing a schematic cross-section taken through a vertical cut of the subject portion from the side.

[0126] Additionally, the term "overlies" or variations thereof means that a first object can be above or below or to the side of a second object, or vice versa. Additionally, the term "overlies" can include superimposed, stacked, facing or oriented toward, extends over, covers or partially covers, or any other suitable term as would be appreciated and understood by one of ordinary skill in the art. The terms "facing" and "oriented toward" mean that a first element can be directly or indirectly opposite a second element. In cases where a third element is interposed between the first element and the second element, the first element and the second element can be understood to be indirectly opposite one another, although still facing one another. When elements are described as "not overlying" or variations thereof another element, this can include the elements being spaced apart from, biased away from, or separated from one another, or any other suitable term as would be appreciated and understood by one of ordinary skill in the art.

[0127] For the purposes of this description, spatially relative terms such as "below", "under", "lower", "above", "upper" and the like can be used to describe one element's or component's relationship to another element or component as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the figures. For example, if a device shown in the figures is turned over, elements described as "below" or "under" other elements or components would then be oriented "above" the other elements or components. Thus, the illustrative spatially relative terms can be interpreted differently depending on the particular orientation of the device. Thus, the terms "below" and "under" can include both lower and upper positions as they are oriented in different orientations.

[0128] Throughout this specification, where an element is claimed to be, for example, "connected with" or "coupled with" another element, it will be understood that, in addition to the element being directly connected or coupled with the other element, one or more intervening elements can also be present. It will also be understood that when the term "comprises" or "comprising" is used in this specification, it can be taken to mean that the stated features, integers, steps, or elements are present, but not excluding the presence or addition of one or more other features, integers, steps, elements, or groups thereof.

[0129] In addition, when an element is referred to as being "contacted" with or "in contact with" another element, it can be "electrically contacted" or "physically contacted" with the other element; or "indirectly contacted" or "directly contacted" with the other element.

[0130] It will be understood that, although the terms "first", "second", "third", and the like can be used herein to describe various elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. For example, a "first element" discussed in the specification can be named a "second element" or a "third element" and, similarly, a "second element" and a "third element" can be named in an analogous way, without departing from the teachings herein.

[0131] As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0132] "About" or "approximately", as used herein when used in connection with a quantity, includes the stated value and means within a reasonable range of error for the quantity measured or used under the specific circumstances that are known to those of ordinary skill in the art. For example, "about" can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the stated value.

[0133] In the specification and claims, the term "and / or" is intended to mean "either or both" of the items so conjoined. For example, "A and / or B" means "A, B, or both A and B." The term "and / or" as used in the specification and in the claims, means "and" or "or", and is intended to cover both "and" and "or". The term "and / or" as used in the specification and in the claims, means "and" or "or", and is intended to cover both "and" and "or". The phrase "at least one of" followed by a list of two or more items, means that at least one of the listed items is present at an amount of one or more. For example, the phrase "at least one of A and B" means A or B or A and B.

[0134] As used herein, the terms "unit" or "module" mean a structure or element as shown in the drawings and as described in the specification. However, the disclosure is not limited thereto. The terms "unit" or "module" are not limited to the units or modules shown in the drawings.

[0135] In the following examples, the X-axis, the Y-axis, and the Z-axis are not limited to the three axes of a rectangular coordinate system, and can be interpreted in a broader sense. For example, the X-axis, the Y-axis, and the Z-axis can be perpendicular to each other, or can represent different directions that can not be perpendicular to each other.

[0136] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined in the specification.

[0137] FIG. 1 is a perspective view of a display device according to an embodiment. FIG. 2 is an exploded perspective view of a display device according to an embodiment.

[0138] Referring to FIG. 1 and FIG. 2The display device 10 according to the embodiment is used to display moving or still images. The display device 10 can be used as a display screen for portable electronic devices (such as mobile phones, smartphones, tablet PCs, mobile communication terminals, e-notebooks, e-readers, portable multimedia players (PMPs), navigation devices, and ultra-mobile PCs (UMPCs)) and for various products (such as televisions, laptops, monitors, billboards, and the Internet of Things). Additionally, the display device 10 according to the embodiment can be applied to wearable devices (such as smartwatches, watch phones, glasses displays, and head-mounted display (HMD) devices). Furthermore, the display device 10 according to the embodiment can be used as a central information display (CID) installed in the instrument panel of a vehicle and in the center trim panel or dashboard of the vehicle, as a rearview mirror display (rearview mirror monitor) representing the rearview mirror of the vehicle, and as a display placed on the back of the front seats for rear-seat entertainment.

[0139] exist FIG. 1 and FIG. 2 In the example shown, for ease of illustration, the display device 10 according to the embodiment is applied to a smartphone. The display device 10 according to the embodiment may include a cover window 100, a display panel 300, a display circuit board 310, a display driver 320, a sensor driver 330, a sound driver 340, a bracket 600, a main circuit board 700, a battery 790, and a bottom cover 900.

[0140] As used herein, the term "upper side" refers to one side of the display panel 300 along the Z-axis direction where the cover window 100 is located, while the term "lower side" refers to the opposite side of the display panel 300 along the Z-axis direction where the bracket 600 is located. As used herein, the terms "left side," "right side," "top side," and "bottom side" refer to relative positions when the display panel 300 is viewed from above. For example, "left side" refers to the direction opposite to the direction indicated by the arrow on the X-axis, "right side" refers to the direction indicated by the arrow on the X-axis, "top side" refers to the direction indicated by the arrow on the Z-axis, and "bottom side" refers to the direction opposite to the direction indicated by the arrow on the Z-axis.

[0141] When viewed from above, the display device 10 can have a generally rectangular shape. For example, in the case of... FIG. 1The display device 10 can have a substantially rectangular shape having a shorter side in a first direction (X-axis direction) and a longer side in a second direction (Y-axis direction), as shown in a case where the display device 10 is viewed from the top. Each of the corners where the shorter side in the first direction (X-axis direction) and the longer side in the second direction (Y-axis direction) meet can be rounded (can be circular having a predetermined curvature) with a predetermined curvature or can be a right angle. The shape of the display device 10 is not limited to the substantially rectangular shape, but can be formed in other substantially polygonal shapes, a circular shape, or an elliptical shape, in a case where the display device 10 is viewed from the top.

[0142] The display device 10 can include a first area DRA1 and second areas DRA2 extending from right and left sides of the first area DRA1, respectively. The first area DRA1 can be flat or curved. The second areas DRA2 can be flat or curved. In a case where both the first area DRA1 and the second areas DRA2 can be formed in curved surfaces, the curvature of the first area DRA1 can be different from the curvature of the second areas DRA2. In a case where the first area DRA1 is formed in a curved surface, the first area DRA1 can have a constant curvature or a varying curvature. In a case where the second areas DRA2 can be formed in curved surfaces, the second areas DRA2 can have a constant curvature or a varying curvature. In a case where both the first area DRA1 and the second areas DRA2 can be formed in flat surfaces, an angle between the first area DRA1 and the second areas DRA2 can be an obtuse angle.

[0143] Although the second areas DRA2 can extend from the left and right sides of the first area DRA1, respectively, in FIG. 1 The second areas DRA2 can extend from only one of the right and left sides of the first area DRA1. Alternatively, the second areas DRA2 can extend from at least one of the upper and lower sides and the left and right sides of the first area DRA1. Alternatively, the second areas DRA2 can be removed, and the display device 10 can include only the first area DRA1.

[0144] The cover window 100 can be disposed on the display panel 300 to cover or overlap an upper surface of the display panel 300. Accordingly, the cover window 100 can protect the upper surface of the display panel 300.

[0145] The cover window 100 may include a transmissive portion DA100 corresponding to the display panel 300 and a non-transmissive portion NDA100 corresponding to other areas besides the display panel 300. The cover window 100 may be disposed in a first area DRA1 and a second area DRA2. The transmissive portion DA100 may be disposed in a portion of the first area DRA1 and a portion of each of the second areas DRA2. The non-transmissive portion NDA100 may include an opaque material that blocks light. The non-transmissive portion NDA100 may include a pattern that can be perceived by the user when no image is displayed.

[0146] The display panel 300 can be disposed below or beneath the cover window 100. The display panel 300 can be configured to overlap with the transmissive portion DA100 of the cover window 100. The display panel 300 can be disposed within a first region DRA1 and a second region DRA2. The user can view images from the display panel 300 in both the first region DRA1 and the second region DRA2.

[0147] Display panel 300 may be a light-emitting display panel that includes light-emitting elements. For example, display panel 300 may be an organic light-emitting display panel that uses organic light-emitting diodes that include organic emission layers, a micro light-emitting diode display panel that uses micro LEDs, a quantum dot light-emitting display panel that includes quantum dot light-emitting diodes that include quantum dot emission layers, or an inorganic light-emitting display panel that uses inorganic light-emitting elements that include inorganic semiconductors.

[0148] The display panel 300 can be a rigid display panel and therefore not easily bent, or it can be a flexible display panel, which can be flexible and therefore easily bent, folded, or rolled. For example, the display panel 300 can be a foldable display panel that can be folded and unfolded, a curved display panel with a curved display surface, a curved display panel with a curved area other than the display surface, a rollable display panel that can be rolled and unfolded, and a stretchable display panel that can be stretched.

[0149] The display panel 300 can be implemented as a transparent display panel, allowing a user to see objects or backgrounds below or beneath the display panel 300 from above. Alternatively, the display panel 300 can be implemented as a reflective display panel that reflects objects or backgrounds on its upper surface.

[0150] like FIG. 4 As shown, the display panel 300 may include a main region MA for displaying images and a sub-region SBA protruding from one side of the main region MA.

[0151] The display circuit board 310 can be attached in the sub-area SBA of the display panel 300. The display circuit board 310 can be attached in the sub-area SBA of the display panel 300 using an anisotropic conductive film. The display circuit board 310 can be a flexible printed circuit board (FPCB) that can be bent, a rigid printed circuit board (PCB) that can be rigid and unbendable, or a hybrid printed circuit board including a rigid printed circuit board and a flexible printed circuit board.

[0152] The display driver 320 can be disposed in the sub-area SBA of the display panel 300. The display driver 320 can receive a control signal and a supply voltage, and can generate and output a signal and a voltage for driving the display panel 300. The display driver 320 can be implemented as an integrated circuit (IC).

[0153] The sensor driver 330 and the sound driver 340 can be disposed on the display circuit board 310. Each of the sensor driver 330 and the sound driver 340 can be implemented as an integrated circuit. Alternatively, the sensor driver 330 and the sound driver 340 can be implemented as one integrated circuit. The sensor driver 330 and the sound driver 340 can be attached on the display circuit board 310.

[0154] The sensor driver 330 can be electrically connected to a sensor electrode of a sensor electrode layer of the display panel 300 through the display circuit board 310, and thus the sensor driver 330 can output a touch driving signal to the sensor electrode and can sense a voltage charged in mutual capacitance. The sound driver 340 can be electrically connected to a sound electrode of a sensor electrode layer of the display panel 300 through the display circuit board 310, and thus the sound driver 340 can output a sound driving voltage to the sound electrode.

[0155] The sensor electrode layer of the display panel 300 can sense a touch input of a user using at least one of various touch sensing schemes, such as resistance sensing and capacitance sensing. For example, in the case where a touch input of a user is sensed by using the sensor electrode layer of the display panel 300 in capacitance sensing, the sensor driver 330 applies a driving signal to a driving electrode among the sensor electrodes, and senses a voltage charged in mutual capacitance between the driving electrode and a sensing electrode through the sensing electrode among the sensor electrodes, thereby determining whether there is a touch of a user. The touch of a user can include physical contact and proximity. The physical contact of a user refers to an object such as a finger or a pen of a user being in contact with the cover window 100 disposed on the sensor electrode layer. The proximity refers to an object such as a finger or a pen of a user being close to the cover window 100 but spaced apart from the cover window 100, such as hovering above the cover window 100. The sensor driver 330 can transmit detection data based on the sensed voltage to the main processor 710, and the main processor 710 can analyze the detection data to calculate coordinates of a position where a touch input is made.

[0156] On the display circuit board 310, a power source for supplying a driving voltage applied to drive the pixels PX (see FIG. 6 ) can be provided. Also, the display driver 320 can be provided on the display circuit board 310. Alternatively, the power source can be integrated with the display driver 320 in a case where the display driver 320 and the power source can be implemented as a single integrated circuit.

[0157] A bracket 600 for supporting the display panel 300 can be provided under or below the display panel 300. The bracket 600 can include plastic, metal, or both plastic and metal. In the bracket 600, for example, a first camera hole CMH1 in which the camera device 731 can be inserted, a battery hole BaH in which the battery 790 can be provided, and a cable hole CAH through which the cable 314 connected to the display circuit board 310 can pass can be included.

[0158] The main circuit board 700 and the battery 790 can be provided under or below the bracket 600. The main circuit board 700 can be a printed circuit board or a flexible printed circuit board.

[0159] The main circuit board 700 can include a main processor 710, the camera device 731, and a main connector 711. The main processor 710 can be implemented as an integrated circuit. The camera device 731 can be provided on both the upper surface and the lower surface of the main circuit board 700, and the main processor 710 and the main connector 711 can be provided on one of the upper surface and the lower surface of the main circuit board 700.

[0160] The main processor 710 can control all functions of the display device 10. For example, the main processor 710 can output digital video data to the display driver 320 through the display circuit board 310 so that the display panel 300 displays an image. In addition, the main processor 710 receives detection data from the sensor driver 330. The main processor 710 can determine whether there is a user's touch based on the detection data, and if so, can perform an operation associated with the user's physical contact or proximity. For example, the main processor 710 can calculate the coordinates of the user's touch by analyzing the detection data, and then can run an application or perform an operation indicated by an icon touched by the user. The main processor 710 can be an application processor, a central processing unit, or a system chip implemented as an integrated circuit.

[0161] The camera device 731 processes image frames such as still images and videos obtained by an image sensor in a camera mode, and outputs them to the main processor 710. The camera device 731 can include at least one of a camera sensor (for example, a CCD, a CMOS, or the like within the spirit and scope of the disclosure), a light sensor (or an image sensor), and a laser sensor.

[0162] The cable 314 passing through the cable hole CAH of the bracket 600 can be connected to the main connector 711, and thus the main circuit board 700 can be electrically connected to the display circuit board 310.

[0163] The main circuit board 700 can further include, in addition to the main processor 710, the camera device 731, and the main connector 711, FIG. 3 the wireless communication unit 720, at least one input unit 730, at least one sensor unit 740, at least one output unit 750, at least one interface 760, a memory 770, and a power supply unit 780 as illustrated in FIG. 7.

[0164] For example, the wireless communication unit 720 can include at least one of a broadcast receiving module 721, a mobile communication module 722, a wireless Internet module 723, a near field communication module 724, and a location information module 725.

[0165] The broadcast receiving module 721 receives a broadcast signal and / or broadcast-related information from an external broadcast management server through a broadcast channel. The broadcast channel can include a satellite channel and a terrestrial channel.

[0166] The mobile communication module 722 can transmit / receive a wireless signal to / from at least one of a base station, an external terminal, and a server in a mobile communication network according to technical standards or communication schemes for mobile communications (e.g., Global System for Mobile Communications (GSM), Code Division Multiple Access (CDMA), Code Division Multiple Access 2000 (CDMA2000), Enhanced Voice-Data Optimized or Enhanced Voice-Data Only (EV-DO), Wideband CDMA (WCDMA), High-Speed Downlink Packet Access (HSDPA), High-Speed Uplink Packet Access (HSUPA), Long Term Evolution (LTE), Long Term Evolution-Advanced (LTE-A)) within the spirit and scope of the present disclosure. The wireless signal can include a voice call signal, a video call signal, or various types of data according to transmission and reception of a text / multimedia message.

[0167] The wireless Internet module 723 refers to a module for wireless Internet connection. The wireless Internet module 723 can transmit and receive wireless signals in communication networks according to wireless Internet technologies. Examples of the wireless Internet technologies include Wireless LAN (WLAN), Wireless Fidelity (Wi-Fi), Wi-Fi Direct, Digital Living Network Alliance (DLNA), in the spirit and scope of the disclosure.

[0168] The near field communication module 724 is for near field communication, and can support near field communication by using at least one of Bluetooth Low Energy (BLE), Radio Frequency Identification (RFID), Infrared Data Association (IrDA), Ultra Wideband (UWB), ZigBee, Near Field Communication (NFC), Wi-Fi, Wi-Fi Direct, and Wireless Universal Serial Bus (Wireless USB). The near field communication module 724 can support wireless communication between the display device 10 and a wireless communication system, between the display device 10 and another electronic device, or between the display device 10 and a network in which another electronic device (or an external server) can be located or disposed, through a wireless local area network. The wireless local area network can be a wireless personal area network. The other electronic device can be a wearable device that can exchange (or interwork) data with the display device 10. TM

[0169] The location information module 725 is a module for acquiring a location (or a current location) of the display device 10. Examples of the location information module 725 include a Global Positioning System (GPS) module or a Wireless Fidelity (Wi-Fi) module. For example, the display device 10 using the GPS module can acquire a location of the display device 10 by using a signal transmitted from a GPS satellite. By using the Wi-Fi module, the display device 10 can acquire a location of the display device 10 based on information of a wireless access point (AP) that transmits / receives a wireless signal to / from the Wi-Fi module. The location information module 725 refers to any module that can be used to acquire a location (or a current location) of the display device 10, and is not limited to a module that calculates or acquires a location of the display device 10 by itself.

[0170] The input unit 730 can include an image input unit such as a camera device 731 for inputting an image signal, an audio input unit such as a microphone 732 for inputting an audio signal, and an input device 733 for receiving information from a user.

[0171] The camera device 731 processes an image frame such as a still image or a moving image obtained by an image sensor in a video call mode or a recording mode. The processed image frame can be displayed on the display panel 300 or stored in the memory 770.

[0172] ​The microphone 732 processes an external sound signal into electric voice data. The processed voice data can be utilized in various ways according to a function or an application executed on the display device 10. In the microphone 732, various algorithms for removing different noises generated during a process of receiving an external sound signal can be implemented.

[0173] The main processor 710 can control an operation of the display device 10 in response to information input through the input device 733. The input device 733 can include, for example, a mechanical input device or a touch input device (such as a button, a dome switch, a jog wheel, a jog switch) located on a rear surface or a side surface of the display device 10. The touch input device can be implemented with a sensor electrode layer of the display panel 300.

[0174] The sensor unit 740 can include one or more sensors that can sense at least one of information in the display device 10, environmental information around the display device 10, and user information and generate a sensing signal associated therewith. The main processor 710 can control a driving or operation of the display device 10 based on the sensing signal or can perform data processing, a function, or an operation associated with an application installed on the display device 10. The sensor unit 740 can include at least one of a proximity sensor, an illumination sensor, an acceleration sensor, a magnetic sensor, a gravity sensor (G sensor), a gyro sensor, a motion sensor, an RGB sensor, an infrared sensor (IR sensor), a finger scan sensor, an ultrasonic sensor, an optical sensor, a battery gauge, an environmental sensor (e.g., a barometer, a hygrometer, a thermometer, a radiation sensor, a heat sensor, a gas sensor, etc. within the spirit and scope of the disclosure), and a chemical sensor (e.g., an electronic nose, a medical sensor, a biometric sensor, etc. within the spirit and scope of the disclosure).

[0175] The proximity sensor can refer to a sensor that can detect the presence of an object or a nearby object approaching a predetermined detection surface by using, for example, electromagnetic force, infrared rays, without using mechanical contact. Examples of the proximity sensor include, for example, a transmission photoelectric sensor, a direct reflection photoelectric sensor, a mirror reflection photoelectric sensor, a high-frequency oscillation proximity sensor, a capacitive proximity sensor, a magnetic proximity sensor, an infrared proximity sensor. The proximity sensor can detect not only an approach touch but also an approach touch pattern such as an approach touch distance, an approach touch direction, an approach touch speed, an approach touch time, an approach touch position, and an approach touch movement state. The main processor 710 can process data (or information) corresponding to the approach touch operation and the approach touch pattern detected by the proximity sensor, and can control the display panel 300 so that the display panel 300 displays visual information corresponding to the processed data. The ultrasonic sensor can recognize position information of an object using ultrasonic waves. The main processor 710 can calculate the position of the object based on information detected from the optical sensor and the ultrasonic sensor. Because the speed of light is different from the speed of ultrasonic waves, the time taken for light to reach the optical sensor and the time taken for ultrasonic waves to reach the ultrasonic sensor can be used to calculate the position of the object.

[0176] The output unit 750 serves to generate an output associated with a visual, an auditory, a tactile effect, etc., and the output unit 750 can include at least one of the display panel 300, the sound output unit 751, the haptic module 752, and the light output unit 753.

[0177] The display panel 300 displays (outputs) information processed by the display device 10. For example, the display panel 300 can display information on an application running on a screen of the display device 10 or user interface (UI) or graphic user interface (GUI) information according to execution screen information. The display panel 300 can include a display layer for displaying an image and a sensor electrode layer for sensing a touch input of a user. As a result, the display panel 300 can operate as one of the input devices 733 that provides an input interface between the display device 10 and the user and also as one of the output units 750 that provides an output interface between the display device 10 and the user.

[0178] The sound output unit 751 can output source data received from the wireless communication unit 720 or stored in the memory 770 in a call signal reception mode, a speech or recording mode, a voice recognition mode, a broadcast reception mode, etc. within the spirit and scope of the disclosure. The sound output unit 751 can also output sound signals associated with functions (e.g., call signal reception sound, message reception sound, etc.) performed in the display device 10, etc. within the spirit and scope of the disclosure. The sound output unit 751 can include a receiver and a speaker. At least one of the receiver and the speaker can be a sound generator that can be included in the display panel 300 and can output sound using a vibration layer that vibrates (i.e., contracts and expands) according to an electrical signal by an inverse piezoelectric effect.

[0179] The haptic module 752 can generate various tactile effects that are sensed by a user. The haptic module 752 can provide vibration as the tactile effect to the user. The strength and pattern of the vibration generated by the haptic module 752 can be controlled by the user selection or setting by the master processor 710. For example, the haptic module 752 can output vibration in a pattern of, for example, a rhythm, a beat, or a pulse, or can output vibration in a pattern of a rhythm, a beat, or a pulse, sequentially, simultaneously, or in a combined manner. In addition to vibration, the haptic module 752 can generate various types of tactile effects such as an effect by moving a pin vertically, an effect by jetting or sucking a fluid, an effect by sucking and / or expelling air through a jet or a suction hole, an effect by rubbing skins, an effect by contacting an electrode with a user's body or electrodes, an effect by stimulating a user's muscles, an effect by applying a hot or cold sensation to the user's body, an effect by using a device that can absorb or generate heat, or an effect by using a device that can distribute an electro-magnetic force. The haptic module 752 can not only transmit the tactile effect through direct contact but also allow the user to feel the tactile effect through an indirect contact. For example, the haptic module 752 can provide the tactile effect by transmitting the vibration generated in the haptic module 752 to the user through the user's clothes, through the floor, or through other media.

[0180] The light output unit 753 outputs a signal for notifying the occurrence of an event by using light of a light source. Examples of the event occurring in the display device 10 can include message reception, call signal reception, a missed call, an alarm, a schedule notice, email reception, information reception through an application, etc. within the spirit and scope of the disclosure. The signal output from the light output unit 753 is generated as the display device 10 emits light of a single color or a plurality of colors through a front surface or a rear surface. Once the display device 10 detects that the user has checked the event, the signal output can be terminated.

[0181] The interface 760 serves as a path to allow a communication between the display device 10 and various types of external devices. The interface 760 can include at least one of a wired / wireless headset port, an external charger port, a wired / wireless data port, a memory card port, a port for a user identification module, an audio input / output (I / O) port, a video I / O port, and an earphone port. When the external device is electrically connected to the interface 760 of the display device 10, an appropriate control associated with the connected external device can be executed.

[0182] The memory 770 stores data supporting various functions of the display device 10. The memory 770 can store application programs executable on the display device 10 as well as data items and instructions for operating the display device 10. At least some or a predetermined number of the application programs can be downloaded from an external server via wireless communication. The memory 770 can store application programs that can operate the main processor 710, and can temporarily store, for example, input / output data such as a phonebook, a message, a still image, a moving picture therein. The memory 770 can store haptic data provided to the haptic module 752 for vibrations of different patterns and sound data provided to the sound output unit 751 regarding various sounds. The memory 770 can include at least one of a flash memory type memory medium, a hard disk type memory medium, a solid state disk (SSD) type memory medium, a silicon disk drive (SDD) type memory medium, a multimedia card micro type memory medium, a card type memory (e.g., an SD memory or an XD memory), a random access memory (RAM), a static random access memory (SRAM), a read-only memory (ROM), an electrically programmable read-only memory (EPROM), a programmable read-only memory (PROM), a magnetic memory, a magnetic disk, and an optical disk.

[0183] The power supply unit 780 can receive power from an external power source and an internal power source to supply power to each of the elements included in the display device 10 under the control of the main processor 710. The power supply unit 780 can include a battery 790. The power supply unit 780 can include a connection port. The connection port can be an example of the interface 760 through which an external charger for power used to charge the battery can be electrically connected to the interface 760. Alternatively, the power supply unit 780 can charge the battery 790 in a wireless manner without using the connection port. The battery 790 can receive power from an external wireless power transmitter using at least one of induction coupling based on a magnetic induction phenomenon and magnetic resonance coupling based on an electromagnetic resonance phenomenon. The battery 790 can be disposed such that it does not overlap the main circuit board 700 in the third direction (Z-axis direction). The battery 790 can overlap the battery hole BaH of the bracket 600.

[0184] The bottom cover 900 can be disposed under or below the main circuit board 700 and the battery 790. The bottom cover 900 can be fastened and fixed to the bracket 600. The bottom cover 900 can form the outside of the lower surface of the display device 10. The bottom cover 900 can include plastic, metal, or plastic and metal.

[0185] The second camera hole CMH2 can be formed or disposed in the bottom cover 900, a lower surface of the camera device 731 being exposed via the second camera hole CMH2. The position of the camera device 731 and the first and second camera holes CMH1 and CMH2 in line with the camera device 731 are not limited toFIG. 1 and FIG. 2 the position of the embodiment shown in

[0186] FIG. 4 is a plan view showing a display panel according to an embodiment. FIG. 5 is a side view showing an example of the display panel of FIG. 4 FIG. 4 shows a plan view of the display panel 300 having the sub-area SBA of the display panel 300 unfolded. FIG. 5 shows a side view of the display panel 300 having the sub-area SBA curved and disposed on the lower surface of the display panel 300.

[0187] Referring to FIG. 4 and FIG. 5 , the display panel 300 can include a substrate SUB, a display layer DISL, a sensor electrode layer SENL, a polarizing film PF, and a bottom panel cover PB.

[0188] The substrate SUB can be made of an insulating material such as glass, quartz, and a polymer resin. The substrate SUB can be a rigid substrate or a flexible substrate that can be bent, folded, rolled, etc.

[0189] The substrate SUB can include a main area MA and a sub-area SBA. The main area MA can include a sensor area TSA to which a sensor electrode of the sensor electrode layer SENL can be disposed and a sensor peripheral area TPA that is a peripheral area of the sensor area TSA.

[0190] The sub-area SBA can protrude from one side of the main area MA in a second direction (Y-axis direction). As shown in FIG. 4 , a length of the sub-area SBA in a first direction (X-axis direction) can be less than a length of the main area MA in the first direction (X-axis direction). A length of the sub-area SBA in the second direction (Y-axis direction) can be less than a length of the main area MA in the second direction (Y-axis direction). However, it will be understood that the disclosure is not limited thereto. The sub-area SBA can be curved and disposed on a lower surface of the substrate SUB. The sub-area SBA can be superposed with the main area MA in a thickness direction (Z-axis direction) of the substrate SUB. The display circuit board 310 and the display driver 320 can be disposed in the sub-area SBA.

[0191] The display layer DISL can be disposed in the main area MA of the substrate SUB. The display layer DISL can include pixels and display an image. The display layer DISL can include a thin film transistor layer in which a thin film transistor can be formed or disposed, an emission layer in which an emission element that emits light can be formed, and an encapsulation layer that can encapsulate the emission layer.

[0192] ​As shown in FIG. 10, FIG. 6 The display layer DISL can be divided into a display area DA and a non-display area NDA. In the display area DA, pixels can be disposed to display an image. In the non-display area NDA, an image is not displayed. The non-display area NDA can surround or be adjacent to the display area DA. The non-display area NDA can be defined as an area from an outer side of the display area DA to an edge of the display panel 300. In addition to the pixels, for example, a scan line, a data line, a power line electrically connected to the pixels can be disposed in the display area DA. In the non-display area NDA, for example, a scan driver that can apply a scan signal to the scan line, a fan-out line that electrically connects the data line with the display driver 320 can be disposed.

[0193] The sensor electrode layer SENL can be disposed on the display layer DISL. The sensor electrode layer SENL can include sensor electrodes and can sense whether a user's touch is present. The sensor electrode layer SENL can include a first layer in which a connection electrode electrically connecting a driving electrode among the sensor electrodes can be formed or disposed, and a second layer in which the sensor electrodes can be formed or disposed.

[0194] The sensor electrode layer SENL can include a sensor area TSA and a sensor peripheral area TPA. In the sensor area TSA, sensor electrodes can be disposed to sense a user's touch input. In the sensor peripheral area TPA, the sensor electrodes can not be disposed. The sensor peripheral area TPA can surround or be adjacent to the sensor area TSA. The sensor peripheral area TPA can be defined as an area from an outer side of the sensor area TSA to an edge of the display panel 300. The sensor electrodes, the connection electrodes, and the conductive patterns can be disposed in the sensor area TSA. A sensor line electrically connected to the sensor electrodes can be disposed in the sensor peripheral area TPA.

[0195] The sensor area TSA of the sensor electrode layer SENL can overlap the display area DA of the display layer DISL. The sensor peripheral area TPA of the sensor electrode layer SENL can overlap the non-display area NDA of the display layer DISL.

[0196] A polarizing film PF can be disposed on the sensor electrode layer SENL. The polarizing film PF can include a linear polarizer and a phase retardation film such as a λ / 4 (quarter wave) plate. The phase retardation film can be disposed on the sensor electrode layer SENL, and the linear polarizer can be disposed on the phase retardation film.

[0197] A cover window 100 can be disposed on the polarizing film PF. The cover window 100 can be attached to the polarizing film PF by a transparent adhesive member such as an optical clear adhesive (OCA) film.

[0198] A bottom panel cover PB can be disposed under or below a substrate SUB of the display panel 300. The bottom panel cover PB can be attached to a lower surface of the substrate SUB of the display panel 300 by an adhesive member. The adhesive member can be a pressure sensitive adhesive (PSA). The bottom panel cover PB can include at least one of a light blocking member for absorbing light incident from the outside, a buffer for absorbing external impact, and a heat dissipation member for effectively dissipating heat from the display panel 300.

[0199] An adhesive member 391 is disposed between the display circuit board 310 and the bottom panel cover PB. The display circuit board 310 can be attached to the bottom panel cover PB using the adhesive member 391. The adhesive member 391 can be a pressure sensitive adhesive, but is not limited thereto.

[0200] A light blocking member can be disposed under or below the display panel 300. The light blocking member can block transmission of light to prevent elements disposed under the light blocking member (such as the display circuit board 310) from being seen from above the display panel 300. The light blocking member can include light absorbing materials such as black pigments and black dyes.

[0201] A buffer can be disposed under or below the light blocking member. The buffer absorbs external impact to prevent the display panel 300 from being damaged. The buffer can be composed of a single layer or multiple layers. For example, the buffer can be formed of a polymer resin such as polyurethane, polycarbonate, polypropylene, and polyethylene, or can be formed of a material having elasticity such as rubber and a sponge obtained by foaming a polyurethane-based material or an acrylic-based material.

[0202] A heat dissipation member can be disposed under or below the buffer. The heat dissipation member can include a first heat dissipation layer including graphite or carbon nanotubes and a second heat dissipation layer formed of a thin metal film such as copper, nickel, iron, and silver, the second heat dissipation layer can block electromagnetic waves and have high thermal conductivity.

[0203] FIG. 6 FIG. 1 is a view showing a layout of a display layer of a display panel according to an embodiment.

[0204] Referring to FIG. 6 , the display layer DISL can include a display area DA including pixels PX and a non-display area NDA not including the pixels PX. The pixels PX, the scan lines SL, and the data lines DL can be disposed in the display area DA. The scan lines SL can extend in a first direction (X-axis direction), and the data lines DL can extend in a second direction (Y-axis direction) intersecting the first direction (X-axis direction). The scan lines SL can be electrically connected to a scan driver 380 in the non-display area NDA. The data lines DL can be electrically connected to display pads (or "bond pads" or "solder pads") DP through fan-out lines FL in the non-display area NDA.

[0205] Each of the pixels PX can be electrically connected to at least one of the scan lines SL and at least one of the data lines DL. Each of the pixels PX can include a thin film transistor including a driving transistor and at least one switching transistor, a light emitting element, and a capacitor. In a case where a scan signal is applied from the scan line SL, each of the pixels PX receives a data voltage of the data line DL and supplies a driving current to the light emitting element according to the data voltage applied to a gate electrode of the driving transistor, so that light can be emitted.

[0206] The non-display area NDA can be a remaining area of the display layer DISL other than the display area DA. In the non-display area NDA, a scan driver 380 for applying a scan signal to the scan line SL, a scan control line SCL, a fan-out line FL for electrically connecting the data line DL with the display pad DP, and the sensor pads TP1 and TP2 electrically connected to the sensing line can be disposed.

[0207] The scan driver 380 can be electrically connected to the display pad DP through the scan control line SCL, and thus can receive a scan control signal from the display driver 320 disposed in the sub area SBA of the display panel 300. The scan driver 380 generates a scan signal according to the scan control signal and supplies the scan signal to the scan line SL. The pixel PX to which a data voltage can be supplied can be selected by the scan signal of the scan driver 380, and the data voltage can be supplied to the selected pixel PX. Although the scan driver 380 can be formed on one outer side (for example, a left outer side of the display area DA in the drawing) or disposed in the non-display area NDA, the disclosure is not limited thereto. The scan driver 380 can be formed on both outer sides (for example, a left outer side and a right outer side of the display area DA) or disposed in the non-display area NDA.

[0208] The display panel 300 can include the display pad DP electrically connected to the data line DL and the scan control line SCL, and the sensor pads TP1 and TP2 electrically connected to the sensing line. A display pad area DPA in which the display pad DP can be disposed can be disposed between a first sensor pad area TPA1 in which the first sensor pad TP1 can be disposed and a second sensor pad area TPA2 in which the second sensor pad TP2 can be disposed. As shown in FIG. 4B, the display pad area DPA can be disposed at a center of one edge of the display panel 300, the first sensor pad area TPA1 can be disposed at a left side of the edge of the display panel 300, and the second sensor pad area TPA2 can be disposed on a right side of the edge of the display panel 300. FIG. 6

[0209] FIG. 7 FIG. 4A is a view showing a layout of a sensor electrode layer of a display panel according to an embodiment. FIG. 8 ​is an enlarged plan view showing a portion of the sensor region of FIG. 7

[0210] In the example shown in FIG. 7 , the sensor electrodes TE and RE of the sensor electrode layer SENL include two kinds of electrodes (e.g., drive electrodes TE and sense electrodes RE), and mutual capacitance sensing can be performed by using two layers, for example, a drive signal can be applied to the drive electrodes TE, and then the voltage charged at the mutual capacitance can be sensed by the sense electrodes RE. However, it will be understood that the disclosure is not limited thereto. For example, the sensor electrode layer SENL can be driven by mutual capacitance sensing using one layer or by self-capacitance sensing.

[0211] For ease of explanation, FIG. 7 only the sensor electrodes TE and RE, the dummy pattern DE, the sensor lines TL1, TL2 and RL, the sensor pads TP1 and TP2, the sound electrodes SOE1 and SOE2, the sound lines SOL1 and SOL2, and the sound pads SP1 and SP2 are shown. FIG. 8 is an enlarged plan view of the region A of FIG. 7

[0212] Referring to FIG. 7 and FIG. 8 , the sensor electrode layer SENL can include a sensor region TSA for sensing a touch of a user and a sensor peripheral region TPA disposed around the sensor region TSA. The sensor region TSA can overlap with a display region DA of the display layer DISL, and the sensor peripheral region TPA can overlap with a non-display region NDA of the display layer DISL.

[0213] The sensor electrodes TE and RE can be disposed in the sensor region TSA. The sensor electrodes TE and RE can include first sensor electrodes TE and second sensor electrodes RE. In the embodiment shown in FIG. 7 and FIG. 8 , the first sensor electrodes TE are drive electrodes TE, and the second sensor electrodes RE are sense electrodes RE. In FIG. 7 and FIG. 8 , the drive electrodes TE, the sense electrodes RE, and the dummy pattern DE each have a substantially rhombus shape when the drive electrodes TE, the sense electrodes RE, and the dummy pattern DE are viewed from the top, but the disclosure is not limited thereto.

[0214] ​​The sensing electrodes RE can be arranged or disposed along a first direction (X-axis direction) and electrically connected to each other. The driving electrodes TE can be arranged or disposed along a second direction (Y-axis direction) crossing or intersecting the first direction (X-axis direction) and can be electrically connected to each other. The driving electrodes TE can be electrically separated from the sensing electrodes RE. The driving electrodes TE can be spaced apart from the sensing electrodes RE. The driving electrodes TE can be arranged or disposed in parallel with the second direction (Y-axis direction).

[0215] As shown in FIG. 8 In order to electrically separate the sensing electrodes RE from the driving electrodes TE at their intersections, the driving electrodes TE adjacent to each other in the second direction (Y-axis direction) can be electrically connected by first connection electrodes BE1, and the sensing electrodes RE adjacent to each other in the first direction (X-axis direction) can be electrically connected by second connection electrodes BE2. The first connection electrodes BE1 can be formed or disposed on different layers from the driving electrodes TE and can be electrically connected to the driving electrodes TE through first contact holes CNT1.

[0216] Each of the first connection electrodes BE1 can be bent at least once. In FIG. 8 The first connection electrodes BE1 can be bent in the shape of a less than or greater than sign "<" or ">" but the shape of the first connection electrodes BE1 is not limited thereto. Since the driving electrodes TE adjacent to each other in the second direction (Y-axis direction) can be electrically connected by the first connection electrodes BE1, the driving electrodes TE can be stably connected to each other even if any one of the first connection electrodes BE1 is disconnected. Although two adjacent ones of the driving electrodes TE can be electrically connected by two first connection electrodes BE1 in the example shown in FIG. 8 The number of the first connection electrodes BE1 is not limited thereto.

[0217] As shown in FIG. 8 The second connection electrodes BE2 are formed or disposed on the same layer as the sensing electrodes RE and can have a shape extending from the sensing electrodes RE. The sensing electrodes RE and the second connection electrodes BE2 can be formed of the same or similar materials.

[0218] By means of the first connection electrodes BE1 and the second connection electrodes BE2, the driving electrodes TE adjacent to each other in the second direction (Y-axis direction) can be electrically connected to each other, while the driving electrodes TE adjacent to each other in the first direction (X-axis direction) can be electrically insulated from each other, and in addition, the sensing electrodes RE adjacent to each other in the first direction (X-axis direction) can be electrically connected to each other, while the sensing electrodes RE adjacent to each other in the second direction (Y-axis direction) can be electrically insulated from each other. In addition, since the driving electrodes TE can be electrically insulated from the sensing electrodes RE, mutual capacitances can be formed or disposed at intersections of the driving electrodes TE and the sensing electrodes RE.

[0219] The dummy pattern DE can be electrically separated from the driving electrode TE and the sensing electrode RE. The driving electrode TE, the sensing electrode RE, and the dummy pattern DE can be configured to be separate from each other. The dummy pattern DE can be surrounded by the driving electrode TE and the sensing electrode RE respectively, or it can be adjacent to the driving electrode TE and the sensing electrode RE respectively. Each of the dummy patterns DE can be electrically floating.

[0220] The parasitic capacitance between the second electrode of the emitter layer EML and the driving electrode TE or sensing electrode RE can be reduced due to the dummy pattern DE. The advantage of reduced parasitic capacitance is that the mutual capacitance between the driving electrode TE and the sensing electrode RE can be charged more quickly. However, because the areas of the driving electrode TE and the sensing electrode RE are reduced due to the dummy pattern DE, the mutual capacitance between them is also reduced. As a result, the voltage charged in the mutual capacitance becomes more susceptible to noise. Therefore, the area of ​​the dummy pattern DE can be determined through a trade-off between parasitic capacitance and mutual capacitance.

[0221] Sensor lines TL1, TL2, and RL can be disposed in the peripheral region TPA of the sensor. Sensor lines TL1, TL2, and RL may include a sensing line RL electrically connected to the sensing electrode RE, and a first driving line TL1 and a second driving line TL2 electrically connected to the driving electrode TE.

[0222] The sensing electrode RE, located on one side of the sensor region TSA, can be electrically connected to the sensing line RL. For example, as... FIG. 7 As shown, some or a predetermined number of sensing electrodes RE, which are electrically connected in the first direction (X-axis direction), can be located at the right end and can be electrically connected to the sensing line RL. The sensing line RL can be electrically connected to the second sensor pad TP2. Therefore, the sensor driver 330 can be electrically connected to the sensing electrodes RE.

[0223] The driving electrode TE, located on one side of the sensor region TSA, can be electrically connected to the first driving line TL1, while the driving electrode TE, located on the other side of the sensor region TSA, can be electrically connected to the second driving line TL2. For example, as... FIG. 7As illustrated in FIG. 3, some or a predetermined number of the driving electrodes TE on the lowermost side among the driving electrodes TE electrically connected to each other in the second direction (Y-axis direction) can be electrically connected to the first driving line TL1, and some or a predetermined number of the driving electrodes TE disposed on the uppermost side among the driving electrodes TE can be electrically connected to the second driving line TL2. The second driving line TL2 can be connected to the driving electrodes TE on the upper side of the sensor area TSA via the left outer side of the sensor area TSA. The first driving line TL1 and the second driving line TL2 can be connected to the first sensor pad TP1. Accordingly, the sensor driver 330 can be electrically connected to the driving electrodes TE.

[0224] The sound units SU can be disposed in the sensor area TSA, and the first sound line SOL1 and the second sound line SOL2 can be disposed in the sensor peripheral area TPA. The sound units SU can be overlapped with the driving electrodes TE, the sensing electrodes RE, and the dummy pattern DE. The sound units SU can be spaced apart from each other.

[0225] Each of the sound units SU can include a first sound electrode SOE1, a second sound electrode SOE2, and a vibration layer in contact with the first sound electrode SOE1 and the second sound electrode SOE2. The vibration layer can be disposed in the sensor area TSA in whole or in part. For example, in a case where the vibration layer is disposed in a portion of the sensor area TSA, the vibration layer can be disposed in the sensor area TSA in an area in which the sound unit SU can be disposed.

[0226] The vibration layer can include an electroactive polymer, which can be deformed according to a first sound driving voltage applied to the first sound electrode SOE1 and a second sound driving voltage applied to the second sound electrode SOE2. Since the electroactive polymer is disposed in the sensor area TSA overlapped with the display area DA of the display panel 300, the electroactive polymer should be capable of transmitting light. For example, the electroactive polymer can include a ferroelectric polymer such as polyvinylidene fluoride (PVDF) and poly(vinylidene-fluoride-co-trifluoroethylene) (P(VDF-TrFE)). The electroactive polymer can include piezoelectric particles such as ZnO and BaTiO3 to increase a piezoelectric effect. In a case where the first sound driving voltage is applied to the first sound electrode SOE1 and the second sound driving voltage is applied to the second sound electrode SOE2, the vibration layer can be mechanically deformed by a converse piezoelectric effect. In addition, in a case where the vibration layer is mechanically deformed, the vibration layer can generate a voltage on the first sound electrode SOE1 and the second sound electrode SOE2 by a piezoelectric effect. Each of the sound units SU can output sound by vibrating the vibration layer by the converse piezoelectric effect.

[0227] The first sound electrodes SOE1 of the sound units SU can be electrically separated from each other. As FIG. 7As shown in FIG. 1, each of the first sound electrodes SOE1 in the sound unit SU can be electrically connected to the first sound line SOL1. The second sound electrodes SOE2 in the sound unit SU can be electrically separated from each other. As shown in FIG. 1, each of the second sound electrodes SOE2 in the sound unit SU can be electrically connected to the second sound line SOL2. FIG. 7

[0228] Alternatively, the first sound electrodes SOE1 in some or a predetermined number of the sound units SU can be electrically connected to each other. For example, the first sound electrodes SOE1 of the sound units SU disposed on one side of the sensor area TSA can be electrically connected to one first sound line SOL1. The first sound electrodes SOE1 of the sound units SU disposed on the other side of the sensor area TSA can be electrically connected to another first sound line SOL1. Also, the second sound electrodes SOE2 in some or a predetermined number of the sound units SU can be electrically connected to each other. For example, the second sound electrodes SOE2 of the sound units SU disposed on one side of the sensor area TSA can be electrically connected to one second sound line SOL2. The second sound electrodes SOE2 of the sound units SU disposed on the other side of the sensor area TSA can be electrically connected to another second sound line SOL2.

[0229] In each of the sound units SU, the first sound electrode SOE1 can be spaced apart from the second sound electrode SOE2. In each of the sound units SU, the first sound electrode SOE1 can be electrically separated from the second sound electrode SOE2.

[0230] Each of the first sound electrodes SOE1 can include a first sound stem electrode SSE1 and a first sound branch electrode SBE1. The first sound stem electrode SSE1 can extend in one direction DRN. The first sound stem electrode SSE1 can be electrically connected to the first sound line SOL1. The first sound branch electrode SBE1 can branch from the first sound stem electrode SSE1 and can extend in another direction DRT crossing the one direction DRN.

[0231] ​Each of the second sound electrodes SOE2 can include a second sound trunk electrode SSE2 and a second sound branch electrode SBE2. The second sound trunk electrode SSE2 can extend in one direction DRN and can be parallel to the first sound trunk electrode SSE1. The second sound trunk electrode SSE2 can be electrically connected to the second sound line SOL2. The second sound branch electrode SBE2 can branch from the second sound trunk electrode SSE2 and can extend in another direction DRT. The first sound branch electrode SBE1 and the second sound branch electrode SBE2 can be alternately arranged or disposed in one direction DRN. As an example, in one direction DRN, they can be arranged or disposed in the order of the first sound branch electrode SBE1, the second sound branch electrode SBE2, the first sound branch electrode SBE1, the second sound branch electrode SBE2, and so on.

[0232] The shield electrode SHE can be disposed to surround or be adjacent to the sound unit SU. The shield electrode SHE can be electrically connected to at least one of the sound pads SP1 and SP2 through a shield line. Accordingly, the shield electrode SHE can be electrically connected to the sound driver 340. The sound driver 340 can apply a shield voltage such as a ground voltage to the shield electrode SHE. Due to the shield electrode SHE, it is possible to mitigate vibration or sound generated by one sound unit SU from affecting vibration or sound generated by another sound unit SU.

[0233] The first sound electrodes SOE1 and the second sound electrodes SOE2 of the sound units SU disposed on one side of the sensor area TSA can be electrically connected to the first sound line SOL1 and the second sound line SOL2 disposed on the outer side. The first sound line SOL1 and the second sound line SOL2 can be electrically connected to the first sound pad SP1 disposed in the first sensor pad area TPA1. The first sound electrodes SOE1 and the second sound electrodes SOE2 of the sound units SU disposed on the other side of the sensor area TSA can be electrically connected to the first sound line SOL1 and the second sound line SOL2 disposed on the outer side. The first sound line SOL1 and the second sound line SOL2 can be electrically connected to the second sound pad SP2 disposed in the second sensor pad area TPA2. Accordingly, the sound driver 340 can be electrically connected to the first sound electrodes SOE1 and the second sound electrodes SOE2.

[0234] As FIG. 7As shown, in each of the sound units SU, a first sound driving voltage can be applied to the first sound electrode SOE1 via the first sound line SOL1, and a second sound driving voltage can be applied to the second sound electrode SOE2 via the second sound line SOL2. Therefore, each of the sound units SU can drive the vibrating layer PEL, which is in contact with the first sound electrode SOE1 and the second sound electrode SOE2, via the first sound driving voltage and the second sound driving voltage, thereby outputting sound. (See below for further details.) FIG. 11 Describe in detail the vibrating layer PEL of each unit in the sound unit SU.

[0235] For example, in the sensor electrode layer SENL, such as FIG. 11 In the case shown where the material is directly formed or disposed on the encapsulation layer TFEL, the distance between the second electrode of the emitter layer EML and each of the driving electrode TE, sensing electrode RE, dummy pattern DE, first connection electrode BE1, second connection electrode BE2, first acoustic electrode SOE1, second acoustic electrode SOE2, and shielding electrode SHE will be close. Therefore, a large parasitic capacitance will form between the second electrode of the emitter layer EML and each of them. This parasitic capacitance will be proportional to the area of ​​the second electrode of the emitter layer EML stacked with each of the driving electrode TE, sensing electrode RE, dummy pattern DE, first connection electrode BE1, second connection electrode BE2, first acoustic electrode SOE1, second acoustic electrode SOE2, and shielding electrode SHE. Therefore, to reduce such parasitic capacitance, when viewed from top, the driving electrode TE, sensing electrode RE, dummy pattern DE, first connection electrode BE1, second connection electrode BE2, first acoustic electrode SOE1, second acoustic electrode SOE2, and shielding electrode SHE can be formed in a grid topology.

[0236] FIG. 9 It shows the electrical connection. FIG. 7 A view of an example sensor driver with driving electrodes and sensing electrodes.

[0237] For ease of explanation, FIG. 9 Only the drive electrodes TE arranged or configured in a row along the second direction (Y-axis direction) and electrically connected to each other, and the sensing electrodes RE arranged or configured in a row along the first direction (X-axis direction) and electrically connected to each other are shown.

[0238] Reference FIG. 9 The sensor driver 330 may include a drive signal output 331, a first sensor detector 332, and a first analog-to-digital converter 333.

[0239] The drive signal output 331 can output a touch drive signal TD to the drive electrodes TE through the first drive line TL1 and output a touch drive signal TD to the drive electrodes TE through the second drive line TL2. The touch drive signal TD can include a pulse. The height of the touch drive signal can be represented as VD.

[0240] The drive signal output 331 can output the touch drive signal TD to the drive lines TL1 and TL2 in a predetermined order. For example, the drive signal output 331 can sequentially output the touch drive signal TD from the drive electrodes TE disposed on the left side of the sensor area TSA to the drive electrodes TE disposed on the right side of the sensor area TSA. FIG. 7

[0241] The first sensor detector 332 detects a voltage charged in the first mutual capacitance Cm1 through the sense line RL electrically connected to the sense electrode RE. As shown in FIG. 1B, the first mutual capacitance Cm1 can be formed or disposed between the drive electrode TE and the sense electrode RE. FIG. 9

[0242] The first sensor detector 332 can include a first operational amplifier OP1, a first feedback capacitor Cfb1, and a first reset switch RSW1. The first operational amplifier OP1 can include a first input terminal -, a second input terminal +, and an output terminal out. The first input terminal - of the first operational amplifier OP1 can be electrically connected to the sense line RL, an initialization voltage VREF can be supplied to the second input terminal +, and the output terminal out of the first operational amplifier OP1 can be electrically connected to a first storage capacitor. The first storage capacitor can be electrically connected between the output terminal out of the first operational amplifier OP1 and the ground to store an output voltage (Vout1) of the first operational amplifier OP1. The first feedback capacitor Cfb1 and the first reset switch RSW1 can be electrically connected in parallel between the first input terminal - and the output terminal out of the first operational amplifier OP1. The first reset switch RSW1 controls the connection of both ends of the first feedback capacitor Cfb1. When the first reset switch RSW1 is turned on so that both ends of the first feedback capacitor Cfb1 can be electrically connected, the first feedback capacitor Cfb1 can be reset.

[0243] The output voltage (Vout1) of the first operational amplifier OP1 can be defined as Equation 1 below:

[0244] [Equation 1]

[0245]

[0246] ​​Where Vout1 represents the output voltage of the first operational amplifier OP1, Cm1 represents the first mutual capacitance, Cfb1 represents the capacitance of the first feedback capacitor, and Vt1 represents the voltage charged in the first mutual capacitance Cm1.

[0247] The first analog-to-digital converter 333 can convert the output voltage (Vout1) stored in the first storage capacitor into first digital data and output the first digital data.

[0248] The sensor electrode layer SENL can sense, for example, FIG. 9 The voltage charged in the first mutual capacitor Cm1 shown in the figure is used to determine whether a user touches the device.

[0249] FIG. 10 It is shown in detail FIG. 8 Enlarged plan view of the driving electrode, sensing electrode, first connecting electrode, first sound electrode and shielding electrode. FIG. 10 yes FIG. 8 An enlarged plan view of region A-1.

[0250] Reference FIG. 10 When viewed from the top, the driving electrode TE, sensing electrode RE, first connecting electrode BE1, second connecting electrode BE2, first sound trunk electrode SSE1, first sound branch electrode SBE1, second sound branch electrode SBE2, and shielding electrode SHE can be formed into a grid topology.

[0251] The driving electrode TE, sensing electrode RE, dummy pattern DE, and second connecting electrode BE2 can be formed or disposed in the same layer, so some of them can be spaced apart from each other. Gaps may exist between the driving electrode TE and sensing electrode RE, between the driving electrode TE and second connecting electrode BE2, between the driving electrode TE and dummy pattern DE, and between the sensing electrode RE and dummy pattern DE. For ease of explanation, the boundaries between the driving electrode TE and sensing electrode RE, the boundaries between the driving electrode TE and second connecting electrode BE2, and the boundaries between the sensing electrode RE and second connecting electrode BE2 can be defined by… FIG. 10 The dashed line in the middle represents...

[0252] Because the first connecting electrode BE1, the first main acoustic electrode SSE1, the first branch acoustic electrode SBE1, the second branch acoustic electrode SBE2, and the shielding electrode SHE can be formed or disposed on the same layer, they can be spaced apart from each other.

[0253] The first connection electrode BE1 can be electrically connected to the driving electrodes TE through the first contact holes CNT1, respectively. One end of each of the first connection electrodes BE1 can be electrically connected to one of the driving electrodes TE adjacent to each other in the second direction (Y-axis direction) through the first contact hole CNT1. The other end of each of the first connection electrodes BE1 can be electrically connected to the other of the driving electrodes TE adjacent to each other in the second direction (Y-axis direction) through the first contact hole CNT1. The first connection electrode BE1 can be overlapped with the driving electrode TE and the sensing electrode RE in the third direction (Z-axis direction). Alternatively, the first connection electrode BE1 can be overlapped with the second connection electrode BE2 instead of the sensing electrode RE in the third direction (Z-axis direction). Alternatively, the first connection electrode BE1 can be overlapped with the second connection electrode BE2 and the sensing electrode RE in the third direction (Z-axis direction). Since the first connection electrode BE1 is formed or disposed on a different layer from the driving electrode TE, the sensing electrode RE, and the second connection electrode BE2, a short circuit can be prevented from being generated in the sensing electrode RE and / or the second connection electrode BE2 even if the first connection electrode BE1 is overlapped with the sensing electrode RE and / or the second connection electrode BE2.

[0254] The second connection electrode BE2 can be disposed between the sensing electrodes RE. The second connection electrode BE2 can be formed or disposed on the same layer as the sensing electrodes RE and can extend from each of the sensing electrodes RE. Accordingly, the second connection electrode BE2 can be electrically connected to the sensing electrodes RE without any additional contact hole.

[0255] The first sound main electrode SSE1 can be overlapped with at least one driving electrode TE and at least one sensing electrode RE in the third direction (Z-axis direction). In addition, the first sound electrode SOE1 can be overlapped with at least one dummy pattern DE in the third direction (Z-axis direction) as shown in FIG. 6B. FIG. 8

[0256] The second sound electrode SOE2 can be overlapped with at least one driving electrode TE and at least one sensing electrode RE in the third direction (Z-axis direction). Alternatively, the second sound electrode SOE2 can be overlapped with one of at least one driving electrode TE and at least one sensing electrode RE in the third direction (Z-axis direction). In addition, the second sound electrode SOE2 can be overlapped with at least one dummy pattern DE in the third direction (Z-axis direction) as shown in FIG. 6B. FIG. 8

[0257] The sub-pixels R, G, and B can include a first sub-pixel R emitting a first color light, a second sub-pixel G emitting a second color light, and a third sub-pixel B emitting a third color light. Although the first sub-pixel R, the second sub-pixel G, and the third sub-pixel B are shown in FIG. 10 ​​The first sub-pixel R is a red sub-pixel, the second sub-pixel G is a green sub-pixel, and the third sub-pixel B is a blue sub-pixel in the example shown in FIG. 1, but the disclosure is not limited thereto. Although the first sub-pixel R, the second sub-pixel G, and the third sub-pixel B have a substantially quadrangular shape in a case where the first sub-pixel R, the second sub-pixel G, and the third sub-pixel B are viewed from the top in the example shown in FIG. 1, the disclosure is not limited thereto. For example, the first sub-pixel R, the second sub-pixel G, and the third sub-pixel B can have a substantially polygonal shape other than a substantially quadrangular shape or a substantially circular shape or a substantially elliptical shape in a case where the first sub-pixel R, the second sub-pixel G, and the third sub-pixel B are viewed from the top. In addition, although the first sub-pixel R, the second sub-pixel G, and the third sub-pixel B have different sizes in the example shown in FIG. 1, the disclosure is not limited thereto. FIG. 10 Although the first sub-pixel R, the second sub-pixel G, and the third sub-pixel B have a substantially quadrangular shape in a case where the first sub-pixel R, the second sub-pixel G, and the third sub-pixel B are viewed from the top in the example shown in FIG. 1, the disclosure is not limited thereto. For example, the first sub-pixel R, the second sub-pixel G, and the third sub-pixel B can have a substantially polygonal shape other than a substantially quadrangular shape or a substantially circular shape or a substantially elliptical shape in a case where the first sub-pixel R, the second sub-pixel G, and the third sub-pixel B are viewed from the top. In addition, although the first sub-pixel R, the second sub-pixel G, and the third sub-pixel B have different sizes in the example shown in FIG. 1, the disclosure is not limited thereto. FIG. 10 Although the third sub-pixel B has the largest size and the second sub-pixel G has the smallest size, the disclosure is not limited thereto.

[0258] The pixel PX refers to a group of the sub-pixels R, G, and B that can express a gray scale. In the example shown in FIG. 1, the pixel PX can include one first sub-pixel R, two second sub-pixels G, and one third sub-pixel B. However, it will be understood that the disclosure is not limited thereto. For example, the pixel PX can include one first sub-pixel R, one second sub-pixel G, and one third sub-pixel B. FIG. 10

[0259] Because the driving electrode TE, the sensing electrode RE, the first connection electrode BE1, the second connection electrode BE2, the first sound stem electrode SSE1, the first sound branch electrode SBE1, the second sound branch electrode SBE2, and the shield electrode SHE can be formed in a mesh topology when viewed from the top, the sub-pixels R, G, and B can not be overlaid with the driving electrode TE, the sensing electrode RE, the first connection electrode BE1, the second connection electrode BE2, the first sound stem electrode SSE1, the first sound branch electrode SBE1, the second sound branch electrode SBE2, and the shield electrode SHE. Therefore, it is possible to prevent the brightness of light emitted from the sub-pixels R, G, and B from being reduced due to being shielded by the driving electrode TE, the sensing electrode RE, the first connection electrode BE1, the second connection electrode BE2, the first sound stem electrode SSE1, the first sound branch electrode SBE1, the second sound branch electrode SBE2, and the shield electrode SHE.

[0260] FIG. 11 is a schematic cross-sectional view taken along the line I-I' of FIG. 10 is a schematic cross-sectional view taken along the line II-II' of FIG. 12 is a schematic cross-sectional view taken along the line II-II' of FIG. 10 is a schematic cross-sectional view taken along the line II-II' of

[0261] Referring to FIG. 11 and FIG. 12 ​A display layer DISL including a first buffer layer BF1, a thin film transistor layer TFTL, an emission layer EML, and an encapsulation layer TFEL can be disposed on the substrate SUB.

[0262] The first buffer layer BF1 can be formed or disposed on a surface of the substrate SUB. The first buffer layer BF1 can be formed or disposed on a surface of the substrate SUB to protect the thin film transistor 120 and the organic emission layer 172 of the emission layer EML from moisture that can easily permeate through the substrate SUB. The first buffer layer BF1 can be made of a plurality of inorganic layers that are sequentially stacked with each other. For example, the first buffer layer BF1 can be made of a multi-layer in which one or more inorganic layers among a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer can be alternately stacked with each other. The first buffer layer BF1 can be omitted.

[0263] The thin film transistor layer TFTL can include the thin film transistor 120, a gate insulating layer 130, an interlayer dielectric layer 140, a protective layer 150, and a planarization layer 160.

[0264] The thin film transistor 120 can be formed or disposed on the first buffer layer BF1. Each of the thin film transistors 120 can include an active layer 121, a gate electrode 122, a source electrode 123, and a drain electrode 124. In FIG. 11 particular, the thin film transistor 120 can be implemented as a top gate transistor in which the gate electrode 122 can be positioned or disposed above the active layer 121. However, it will be understood that the disclosure is not limited thereto. The thin film transistor 120 can be implemented as a bottom gate transistor in which the gate electrode 122 can be positioned or disposed below the active layer 121, or can be implemented as a dual gate transistor in which the gate electrode 122 can be disposed above and below the active layer 121.

[0265] The active layer 121 can be formed or disposed on the first buffer layer BF1. The active layer 121 can include polycrystalline silicon, single crystalline silicon, low-temperature polycrystalline silicon, amorphous silicon, or an oxide semiconductor. For example, the oxide semiconductor can include a binary compound (AB x ), a ternary compound (AB x C y ), and a quaternary compound (AB x C y D z ) containing indium, zinc, gallium, tin, titanium, aluminum, hafnium (Hf), zirconium (Zr), magnesium (Mg), for example. For example, the active layer 121 can include an oxide containing indium, tin, and titanium; an oxide containing indium, tin, and zinc (ITZO); an oxide containing indium, gallium, and tin; or an oxide containing indium, gallium, and zinc (IGZO). A light-blocking layer for blocking external light incident on the active layer 121 can be formed or disposed between the first buffer layer BF1 and the active layer 121.

[0266] The gate insulating layer 130 can be formed or disposed on the active layer 121. As shown in FIG. 1B, the gate insulating layer 130 can be formed or disposed only in a region overlapping with the gate electrode 122 in the third direction (Z-axis direction), but the disclosure is not limited thereto. The gate insulating layer 130 can be formed of an inorganic layer such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. FIG. 11

[0267] The gate electrode 122 can be formed or disposed on the gate insulating layer 130. The gate electrode 122 can overlap with the active layer 121 in the third direction (Z-axis direction). The gate electrode 122 can be made of a single layer or multiple layers of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0268] The first interlayer dielectric layer 141 can be formed or disposed on the gate electrode 122 and the gate line. The first interlayer dielectric layer 141 can be formed of an inorganic layer such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0269] The capacitor electrode 125 can be formed or disposed on the first interlayer dielectric layer 141. The capacitor electrode 125 can overlap with the gate electrode 122 in the third direction (Z-axis direction). The capacitor electrode 125 can be made of a single layer or multiple layers of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0270] The second interlayer dielectric layer 142 can be formed or disposed on the capacitor electrode 125. The second interlayer dielectric layer 142 can be formed of an inorganic layer such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0271] The source electrode 123 and the drain electrode 124 can be formed or disposed on the second interlayer dielectric layer 142. Each of the source electrode 123 and the drain electrode 124 can be electrically connected to the active layer 121 through a contact hole penetrating the interlayer dielectric layer 140. The source electrode 123 and the drain electrode 124 can be made of a single layer or multiple layers of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0272] The protective layer 150 can be formed or disposed on the source electrode 213 and the drain electrode 124 to insulate the thin film transistor 120. The protective layer 150 can be formed of an inorganic layer such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. ​

[0273] A planarization layer 160 may be formed or disposed on the protective layer 150 to provide a flat surface across the step difference of the thin-film transistor 120. The planarization layer 160 may be formed of an organic layer such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin.

[0274] The emitter layer EML can be formed or disposed on the thin-film transistor layer TFTL. The emitter layer EML may include light-emitting elements 170 and 180.

[0275] Light-emitting elements 170 and embankments 180 can be formed or disposed on planarization layer 160. Each of the light-emitting elements 170 may include a first electrode 171, an organic emitting layer 172, and a second electrode 173. FIG. 11 In this context, the light-emitting element 170 can be an organic light-emitting diode including an organic emitting layer 172.

[0276] The first electrode 171 can be formed or disposed on the planarization layer 160. Although in FIG. 11 In the example shown, the first electrode 171 can be electrically connected to the drain electrode 124 of the thin-film transistor 120 through contact holes penetrating the protective layer 150 and the planarization layer 160, but the disclosure is not limited thereto. The first electrode 171 can also be electrically connected to the source electrode 123 of the thin-film transistor 120 through contact holes penetrating the protective layer 150 and the planarization layer 160.

[0277] In a top-emitting organic light-emitting diode (OLED) in which light is emitted from the organic emitting layer 172 toward the second electrode 173, the first electrode 171 can be made of a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), or aluminum (Al), or it can be made of a metallic material with high reflectivity, such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of APC alloy and ITO (ITO / APC / ITO). The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

[0278] In a bottom-emitting organic light-emitting diode (OLED) in which light is emitted from the organic emitting layer 172 toward the first electrode 171, the first electrode 171 can be formed of a transparent conductive material (TCO) such as ITO and IZO that can transmit light, or a semi-transmissive conductive material such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag). When the first electrode 171 is made of a semi-transmissive metallic material, the light extraction efficiency can be improved by using a microcavity.

[0279] The bank 180 can separate the first electrode 171 on the planarization layer 160 to define each of the pixels PX. The bank 180 can be formed or disposed to cover or superpose on edges of the first electrode 171. The bank 180 can be formed of an organic layer such as an acrylic resin, an epoxy resin, a phenol resin, a polyamide resin, and a polyimide resin.

[0280] In each of the pixels PX, the first electrode 171, the organic emission layer 172, and the second electrode 173 are sequentially stacked so that holes from the first electrode 171 and electrons from the second electrode 173 can combine with each other in the organic emission layer 172 to emit light.

[0281] The organic emission layer 172 can be formed or disposed on the first electrode 171 and the bank 180. The organic emission layer 172 can include an organic material and emit light of a specific color. For example, the organic emission layer 172 can include a hole transport layer, an organic material layer, and an electron transport layer. In FIG. 11 In the example shown in FIG. 1, the organic emission layer 172 of the first sub-pixel R can emit red light, the organic emission layer 172 of the second sub-pixel G can emit green light, and the organic emission layer 172 of the third sub-pixel B can emit blue light.

[0282] Optionally, the organic emission layer 172 of the pixel PX can be formed as a single layer to emit white light, ultraviolet light, or blue light. In such a case, the first sub-pixel R can superpose on a first color filter that transmits red light in the third direction (Z-axis direction), the second sub-pixel G can superpose on a second color filter that transmits green light in the third direction (Z-axis direction), and the third sub-pixel B can superpose on a third color filter that transmits blue light in the third direction (Z-axis direction). The first color filter, the second color filter, and the third color filter can be disposed on the encapsulation layer TFEL. In addition, the first sub-pixel R can superpose on a first wavelength conversion layer that converts blue light into red light in the third direction (Z-axis direction), the second sub-pixel G can superpose on a second wavelength conversion layer that converts blue light into green light in the third direction (Z-axis direction), and the third sub-pixel B can superpose on a transmission layer that outputs blue light as it is in the third direction (Z-axis direction). The first wavelength conversion layer, the second wavelength conversion layer, and the transmission layer can be disposed on the encapsulation layer TFEL. For example, the first wavelength conversion layer can be disposed between the encapsulation layer TFEL and the first color filter, the second wavelength conversion layer can be disposed between the encapsulation layer TFEL and the second color filter, and the transmission layer can be disposed between the encapsulation layer TFEL and the third color filter.

[0283] The second electrode 173 can be formed or disposed on the organic emission layer 172. The second electrode 173 can be formed or disposed to cover the organic emission layer 172 or to be stacked with the organic emission layer 172. The second electrode 173 can be a common layer formed or disposed across the pixels PX. A cap layer can be formed or disposed on the second electrode 173.

[0284] In the top emission organic light emitting diode, the second electrode 173 can be formed of a transparent conductive material (TCO) such as ITO and IZO which can transmit light or a semi-transmissive conductive material such as magnesium (Mg), silver (Ag), and an alloy of magnesium (Mg) and silver (Ag). In the case where the second electrode 173 is formed of the semi-transmissive conductive material, light extraction efficiency can be improved by using a microcavity.

[0285] In the bottom emission organic light emitting diode, the second electrode 173 can be made of a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), or aluminum (Al), or can be made of a metal material having high reflectivity such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of an APC alloy and ITO (ITO / APC / ITO).

[0286] The encapsulation layer TFEL can be formed or disposed on the emission layer EML. The encapsulation layer TFEL is disposed on the second electrode 173. The encapsulation layer TFEL can include at least one inorganic layer to prevent oxygen or moisture from penetrating into the organic emission layer 172 and the second electrode 173. In addition, the encapsulation layer TFEL can include at least one organic layer to protect the emission layer EML from foreign substances such as dust. For example, the encapsulation layer TFEL can include a first inorganic layer disposed on the second electrode 173, an organic layer disposed on the first inorganic layer, and a second inorganic layer disposed on the organic layer. The first inorganic layer and the second inorganic layer can be formed of, but not limited to, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer can be formed of, but not limited to, an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, and a polyimide resin.

[0287] The sensor electrode layer SENL can be formed or disposed on the encapsulation layer TFEL. The sensor electrode layer SENL can include a second buffer layer BF2, a driving electrode TE, a sensing electrode RE, a first sound electrode SOE1, a second sound electrode SOE2, a shield electrode SHE, a dummy pattern DE, a first connection electrode BE1, a second connection electrode BE2, a first driving line TL1, a second driving line TL2, a sensing line RL, a first sound line SOL1, a second sound line SOL2, a vibration layer PEL, and a first sensor insulating layer TINS1. FIG. 11 and FIG. 12Only the drive electrode TE, the sense electrode RE, the first connection electrode BE1, the first sound stem electrode SSE1 and the first sound branch electrode SBE1 of the first sound electrode SOE1, the shield electrode SHE, the vibration layer PEL, and the first sensor insulating layer TINS1 are shown.

[0288] The second buffer layer BF2 can be formed of an inorganic layer such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0289] The first connection electrode BE1, the first sound stem electrode SSE1 and the first sound branch electrode SBE1 of the first sound electrode SOE1, and the shield electrode SHE can be formed or disposed on the second buffer layer BF2. The second sound stem electrode SSE2 and the second sound branch electrode SBE2 of the second sound electrode SOE2 can also be formed or disposed on the second buffer layer BF2.

[0290] The first connection electrode BE1, the first sound stem electrode SSE1 and the first sound branch electrode SBE1 of the first sound electrode SOE1, the second sound stem electrode SSE2 and the second sound branch electrode SBE2 of the second sound electrode SOE2, and the shield electrode SHE can be disposed to be superimposed on the bank 180 in the third direction (Z-axis direction). The first connection electrode BE1, the first sound stem electrode SSE1 and the first sound branch electrode SBE1 of the first sound electrode SOE1, the second sound stem electrode SSE2 and the second sound branch electrode SBE2 of the second sound electrode SOE2, and the shield electrode SHE can be made of a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), or aluminum (Al), or can be made of a metal material having high reflectivity, such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of an APC alloy and ITO (ITO / APC / ITO).

[0291] The vibration layer PEL can be formed or disposed on the first connection electrode BE1, the first sound trunk electrode SSE1 and the first sound branch electrode SBE1 of the first sound electrode SOE1, the second sound trunk electrode SSE2 and the second sound branch electrode SBE2 of the second sound electrode SOE2, and the shield electrode SHE. The vibration layer PEL can include an electroactive polymer (piezoelectric polymer) or a non-piezoelectric polymer, which can be deformed according to a first sound driving voltage applied to the first sound electrode SOE1 and a second sound driving voltage applied to the second sound electrode SOE2. Since the electroactive polymer is disposed in the sensor area TSA of the display panel 300 overlapping the display area DA, the electroactive polymer should be capable of transmitting light. For example, the electroactive polymer can include a ferroelectric polymer such as polyvinylidene fluoride (PVDF) and poly(vinylidene fluoride-co-trifluoroethylene) (P(VDF-TrFE)). The non-piezoelectric polymer can include a polyester and a polyurethane.

[0292] The vibration layer PEL can be formed or disposed on the first connection electrode BE1, the first sound trunk electrode SSE1 and the first sound branch electrode SBE1 of the first sound electrode SOE1, the second sound trunk electrode SSE2 and the second sound branch electrode SBE2 of the second sound electrode SOE2, the shield electrode SHE, and the second buffer layer BF2 by printing, doctor blading, spraying, or spin coating. It is desirable for the vibration layer PEL to have a large dielectric constant, a small frequency up loss tangent, and a small leakage current. To this end, it is necessary to reduce the thickness of the vibration layer PEL or increase the area of the vibration layer PEL, and the vibration layer PEL can include piezoelectric particles or piezoelectric powder having a high dielectric constant. For example, the piezoelectric particles or piezoelectric powder can include ZnO, PbTiO3, BaTiO3, PZT (Pb(TiZr)O3), or a lead-free system such as BNT and SBT, which have a high piezoelectric constant. The piezoelectric particles or piezoelectric powder can be uniformly distributed on the vibration layer PEL, and the size of the piezoelectric particles or piezoelectric powder can be about 2 µm or less.

[0293] In the case where the vibration layer PEL can include PVDF, a copolymer in which an additive such as HFP, CTFE, and PTFE is added to PVDF can be used to form the vibration layer PEL. Alternatively, a copolymer in which an additive is added to vinylidene fluoride (VDF) or trifluoroethylene (TrFE) instead of PVDF can be used to form the vibration layer PEL.

[0294] To print or spray the copolymer containing the PVDF and the piezoelectric particles or piezoelectric powder, an apparatus such as a three-roll mill and a basket mill can be used to mix, for example, a solvent, a dispersant, a defoaming agent, and to uniformly disperse the piezoelectric particles or piezoelectric powder. In doing so, the amount of the solvent of the copolymer and the amount of the additive should be adjusted to uniformly form a thick film through printing and spraying. For example, in the case where the vibration layer PEL can be formed through silk screen printing, the copolymer can be a piezoelectric composite paste having a viscosity of about 6,000 cps at room temperature, in consideration of the mesh of the silk screen and the printing thickness. Further, in the case where the vibration layer PEL can be formed through printing, spraying, or spin coating, the ratio of the PVDF and the piezoelectric particles or piezoelectric powder can be about 6:4 to 2:8 to adjust the viscosity of the paste and exhibit excellent piezoelectric properties.

[0295] Alternatively, the vibration layer PEL can include a copolymer including a polyester or polyurethane and piezoelectric particles or piezoelectric powder. In the case where the vibration layer PEL contains piezoelectric particles or piezoelectric powder in a range of about 65% to about 70%, a polyester or polyurethane in a range of about 9% to about 20%, and a solvent in a range of about 15% to about 21%, the printing properties, piezoelectric properties, flexibility, and electrode adhesion can be improved. The piezoelectric properties can be improved and the flexibility can be improved compared to the vibration layer using only the electroactive polymer. Thus, there is an advantage in that the vibration layer PEL can be formed in a desired size.

[0296] The vibration layer PEL can include, for example, an acrylic resin, a polyester resin, to enhance adhesion with the first connection electrode BE1, the first sound main electrode SSE1 and the first sound branch electrode SBE1 of the first sound electrode SOE1, the second sound main electrode SSE2 and the second sound branch electrode SBE2 of the second sound electrode SOE2, and the shield electrode SHE. As the amount of the acrylic resin and the polyester resin increases, the amount of the PVDF decreases, and thus the piezoelectric properties of the vibration layer PEL can be deteriorated. Thus, the amount of the acrylic resin and the polyester resin can be about 6 wt% or less of the vibration layer PEL.

[0297] In the case where the first sound driving voltage is applied to the first sound electrode SOE1 and the second sound driving voltage is applied to the second sound electrode SOE2, the vibration layer PEL can be mechanically deformed by the inverse piezoelectric effect. For example, in the case where the positive first sound driving voltage is applied to the first sound electrode SOE1 and the negative second sound driving voltage is applied to the second sound electrode SOE2 and then the negative first sound driving voltage is applied to the first sound electrode SOE1 and the positive second sound driving voltage is applied to the second sound electrode SOE2, the vibration layer PEL can repeatedly expand and contract. Thus, as FIG. 13As shown in FIG. 1, the vibration layer PEL can vibrate in the third direction (Z-axis direction). Also, in the case where the vibration layer PEL is mechanically deformed, the vibration layer PEL can generate a voltage on the first sound electrode SOE1 and the second sound electrode SOE2 by a piezoelectric effect. As shown in FIG. 1, each of the sound units SU can output sound by vibrating the vibration layer PEL by the inverse piezoelectric effect. FIG. 13

[0298] The driving electrodes TE, the sensing electrodes RE, the dummy pattern DE, the second connection electrode BE2, the first driving line TL1, the second driving line TL2, the sensing line RL, the first sound line SOL1, and the second sound line SOL2 can be formed or disposed on the vibration layer PEL. The driving electrodes TE, the sensing electrodes RE, the dummy pattern DE, and the second connection electrode BE2 can be disposed to be overlapped with the bank 180 in the third direction (Z-axis direction). The driving electrodes TE, the sensing electrodes RE, the dummy pattern DE, the second connection electrode BE2, the first driving line TL1, the second driving line TL2, the sensing line RL, the first sound line SOL1, and the second sound line SOL2 can be made of a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), or aluminum (Al), or can be made of a metal material having high reflectivity, such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of an APC alloy and ITO (ITO / APC / ITO).

[0299] The vibration layer PEL can be polarized by applying a voltage to the first sound electrode SOE1 and the second sound electrode SOE2. As known in the art, the polarization can be performed by corona polarization or by directly applying an electric field.

[0300] The first contact hole CNT1 can be formed through the vibration layer PEL to expose the first connection electrode BE1. The driving electrode TE can be electrically connected to the first connection electrode BE1 through the first contact hole CNT1.

[0301] The first sensor insulating layer TINS1 can be formed or disposed on the driving electrodes TE, the sensing electrodes RE, the dummy pattern DE, the second connection electrode BE2, the first driving line TL1, the second driving line TL2, the sensing line RL, the first sound line SOL1, and the second sound line SOL2. The first sensor insulating layer TINS1 can be formed of an inorganic layer such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. Alternatively, the first sensor insulating layer TINS1 can be formed of an organic layer such as an acrylic resin, an epoxy resin, a phenol resin, a polyamide resin, or a polyimide resin.

[0302] As shown in FIG. 1, the vibration layer PEL can vibrate in the third direction (Z-axis direction). Also, in the case where the vibration layer PEL is mechanically deformed, the vibration layer PEL can generate a voltage on the first sound electrode SOE1 and the second sound electrode SOE2 by a piezoelectric effect. As shown in FIG. 1, each of the sound units SU can output sound by vibrating the vibration layer PEL by the inverse piezoelectric effect. FIG. 11 ​As illustrated in FIG. 1, the first sound electrode SOE1, the second sound electrode SOE2, and the vibration layer PEL can be formed or disposed in a sensor electrode layer SENL for sensing a touch input of a user. Accordingly, it is possible to sense a touch input of a user by using a driving electrode TE and a sensing electrode RE of the sensor electrode layer SENL, and it is also possible to output sound by vibrating the vibration layer PEL by the first sound electrode SOE1 and the second sound electrode SOE2 of the sensor electrode layer SENL. Sound can be output by using a sound unit SU included in the display panel 300.

[0303] FIG. 14 is a schematic cross-sectional view taken along a line I-I' of FIG. 10 . FIG. 15 is a schematic cross-sectional view taken along a line II-II' of FIG. 10 .

[0304] FIG. 14 and FIG. 15 Embodiments of the display panel 300 can be different from embodiments of the display panel 200 in that the vibration layer PEL can be formed or disposed in a portion of the sensor area TSA. FIG. 11 FIG. 12 With reference to and

[0305] , the vibration layer PEL can be formed or disposed in a portion of the sensor area TSA in which the sound unit SU is disposed. The vibration layer PEL can be formed or disposed in a region in which the first sound electrode SOE1 and the second sound electrode SOE2 can be disposed. The second sensor insulating layer TINS2, rather than the vibration layer PEL, can be formed or disposed in a region in which the first connection electrode BE1 and the shield electrode SHE can be disposed. FIG. 14 FIG. 15 The second sensor insulating layer TINS2 can be formed or disposed on the first connection electrode BE1 and the shield electrode SHE. The second sensor insulating layer TINS2 can be formed of an organic layer such as an acrylic resin, an epoxy resin, a phenol resin, a polyamide resin, or a polyimide resin. Alternatively, the second sensor insulating layer TINS2 can include both an inorganic layer and an organic layer.

[0306] The first contact hole CNT1 can be formed or disposed through the second sensor insulating layer TINS2, and the first connection electrode BE1 can be exposed via the first contact hole CNT1. The driving electrode TE can be electrically connected to the first connection electrode BE1 through the first contact hole CNT1. In such a case, the first contact hole CNT1 need not be formed or disposed in the vibration layer PEL.

[0307] A boundary between the vibration layer PEL and the second sensor insulating layer TINS2 can be as illustrated in

[0308] A boundary between the vibration layer PEL and the second sensor insulating layer TINS2 can be as illustrated in FIG. 14 ​The image shows the sensor electrode RE or the drive electrode TE stacked on top of each other, but the disclosure is not limited thereto. The boundary between the vibration layer PEL and the second sensor insulating layer TINS2 may not stack with either the sensor electrode RE or the drive electrode TE.

[0309] The vibration layer PEL and the second sensor insulation layer TINS2 can be as follows FIG. 14 The layers shown are not superimposed on each other in the third direction (Z-axis direction), but the disclosure is not limited thereto. A second sensor insulating layer, TINS2, can be disposed on the vibration layer PEL. In such a case, the vibration layer PEL and the second sensor insulating layer TINS2 can be superimposed on each other in the third direction (Z-axis direction).

[0310] FIG. 16 It is along FIG. 10 A schematic cross-sectional view taken from line I-I'. FIG. 17 It is along FIG. 10 A schematic cross-sectional view taken from line II-II'.

[0311] FIG. 16 and FIG. 17 The embodiments can be related to FIG. 11 and FIG. 12 The difference in the embodiment is that the first acoustic electrode SOE1, the second acoustic electrode SOE2, the shielding electrode SHE, and the first connecting electrode BE1 can be disposed on the vibrating layer PEL.

[0312] Reference FIG. 16 and FIG. 17 The vibration layer PEL can be disposed on the second buffer layer BF2. The first connecting electrode BE1, the first sound backbone electrode SSE1 and the first sound branch electrode SBE1 of the first sound electrode SOE1, the second sound backbone electrode SSE2 and the second sound branch electrode SBE2 of the second sound electrode SOE2, and the shielding electrode SHE can be formed or disposed on the vibration layer PEL.

[0313] The first sensor insulating layer TINS1 can be formed or disposed on the first connecting electrode BE1, the first acoustic backbone electrode SSE1 and the first acoustic branch electrode SBE1 of the first acoustic electrode SOE1, the second acoustic backbone electrode SSE2 and the second acoustic branch electrode SBE2 of the second acoustic electrode SOE2, and the shielding electrode SHE. The first sensor insulating layer TINS1 can be formed of an inorganic layer, such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. Optionally, the first sensor insulating layer TINS1 can include both inorganic and organic layers.

[0314] The driving electrode TE, sensing electrode RE, dummy pattern DE, second connecting electrode BE2, first driving line TL1, second driving line TL2, sensing line RL, first sound line SOL1, and second sound line SOL2 can be formed or disposed on the first sensor insulating layer TINS1. A first contact hole CNT1 can be formed or disposed through the first sensor insulating layer TINS1, and the first connecting electrode BE1 can be exposed through the first contact hole CNT1. The driving electrode TE can be electrically connected to the first connecting electrode BE1 through the first contact hole CNT1.

[0315] The second sensor insulating layer TINS2 can be formed or disposed on the driving electrode TE, sensing electrode RE, dummy pattern DE, second connection electrode BE2, first driving line TL1, second driving line TL2, sensing line RL, first sound line SOL1, and second sound line SOL2. The second sensor insulating layer TINS2 can be formed of an inorganic layer, such as a silicon nitride layer, silicon oxynitride layer, silicon oxide layer, titanium oxide layer, or aluminum oxide layer. Optionally, the second sensor insulating layer TINS2 can be formed of an organic layer, such as an acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0316] like FIG. 16 and FIG. 17 As shown, the first acoustic electrode SOE1, the second acoustic electrode SOE2, and the vibration layer PEL can be formed or disposed in the sensor electrode layer SENL for sensing user touch input. Therefore, user touch input can be sensed using the drive electrode TE and the sensing electrode RE of the sensor electrode layer SENL, and sound can be output by vibrating the vibration layer PEL through the first acoustic electrode SOE1 and the second acoustic electrode SOE2 of the sensor electrode layer SENL. Sound can be output using the sound unit SU included in the display panel 300.

[0317] FIG. 18 It is along FIG. 10 A schematic cross-sectional view taken from line I-I'. FIG. 19 It is along FIG. 10 A schematic cross-sectional view taken from line II-II'.

[0318] FIG. 18 and FIG. 19 The embodiments can be related to FIG. 16 and FIG. 17 The difference in the embodiments is that the vibration layer PEL can be formed or disposed in a portion of the sensor area TSA.

[0319] Reference FIG. 18 and FIG. 19The vibration layer PEL can be formed or disposed in a region in which the sound unit SU is disposed in the sensor region TSA. The vibration layer PEL can be formed or disposed in a region in which the first sound electrode SOE1 and the second sound electrode SOE2 can be disposed. The third sensor insulating layer TINS3, instead of the vibration layer PEL, can be formed or disposed in a region in which the first connection electrode BE1 and the shield electrode SHE can be disposed. The third sensor insulating layer TINS3 can be formed of an organic layer such as an acrylic resin, an epoxy resin, a phenol resin, a polyamide resin, or a polyimide resin. Alternatively, the third sensor insulating layer TINS3 can include both an inorganic layer and an organic layer.

[0320] The first sound electrode SOE1 and the second sound electrode SOE2 can be formed or disposed on the vibration layer PEL, and the first connection electrode BE1 and the shield electrode SHE can be formed or disposed on the third sensor insulating layer TINS3.

[0321] The boundary between the vibration layer PEL and the third sensor insulating layer TINS3 can be superposed with the sensing electrode RE or the driving electrode TE as shown in FIG. 10, but the disclosure is not limited thereto. The boundary between the vibration layer PEL and the third sensor insulating layer TINS3 can not be superposed with the sensing electrode RE or the driving electrode TE. FIG. 18

[0322] The vibration layer PEL and the third sensor insulating layer TINS3 can not be superposed with each other in the third direction (Z-axis direction) as shown in FIG. 10, but the disclosure is not limited thereto. The third sensor insulating layer TINS3 can be disposed on the vibration layer PEL. In such a case, the vibration layer PEL and the third sensor insulating layer TINS3 can be superposed with each other in the third direction (Z-axis direction). FIG. 18

[0323] FIG. 20 is a view showing a layout of a sensor electrode layer of a display panel according to an embodiment. FIG. 21 is an enlarged plan view showing a portion of a sensor region of FIG. 20 FIG. 21 is an enlarged plan view of a region B of FIG. 20

[0324] FIG. 20 Embodiments of FIG. 21 may differ from embodiments of FIG. 7 and FIG. 8 in that the first sound electrode SOE1 and the second sound electrode SOE2 can be superposed with each other in the third direction (Z-axis direction).

[0325] Reference is made to FIG. 20 and FIG. 21 ​​​​Each of the sound units SU can include sub sound units SSU1 and SSU2. Although each of the sound units SU can include one first sub sound unit SSU1 and one second sub sound unit SSU2 in the example shown in FIG. 20 , the number of sub sound units of each of the sound units SU is not limited to two.

[0326] Each of the sub sound units SSU1 and SSU2 can include a first sound electrode SOE1, a second sound electrode SOE2, and a vibration layer PEL. Referring to FIG. 20 and FIG. 21 , the second sound electrode SOE2 and the vibration layer PEL are not shown for convenience of explanation.

[0327] One of the first sound electrodes SOE1 and one of the second sound electrodes SOE2 of each of the sub sound units SSU1 and SSU2 can be stacked on each other in the third direction (Z-axis direction). The vibration layer PEL can be disposed between the first sound electrode SOE1 and the second sound electrode SOE2 stacked on each other.

[0328] The first sound electrode SOE1 of each of the sub sound units SSU1 and SSU2 can be electrically connected to the first sound line SOL1. In each of the sub sound units SSU1 and SSU2, the first sound electrodes SOE1 adjacent to each other in the first direction (X-axis direction) can be electrically connected to each other. For example, as shown in FIG. 21 , in each of the sub sound units SSU1 and SSU2, the first sound electrodes SOE1 adjacent to each other in the first direction (X-axis direction) can be electrically connected by a third connection electrode BE3.

[0329] The second sound electrode SOE2 of each of the sub sound units SSU1 and SSU2 can be electrically connected to the second sound line SOL2. In each of the sub sound units SSU1 and SSU2, the second sound electrodes SOE2 adjacent to each other in the first direction (X-axis direction) can be electrically connected to each other. For example, in each of the sub sound units SSU1 and SSU2, the second sound electrodes SOE2 adjacent to each other in the first direction (X-axis direction) can be electrically connected by a fourth connection electrode BE4. In FIG. 21 , "B-1" indicates a predetermined region of the sensor region TSA.

[0330] The first sound electrode SOE1 and the third connection electrode BE3 of the sub sound unit SSU1 and SSU2 can be made of the same or similar material on the same layer as the driving electrode TE, the sensing electrode RE, and the dummy pattern DE. The first sound electrode SOE1 and the third connection electrode BE3 of each of the sub sound unit SSU1 and SSU2 can be electrically separated from the driving electrode TE, the sensing electrode RE, and the dummy pattern DE. The first sound electrode SOE1 and the third connection electrode BE3 of the sub sound unit SSU1 and SSU2 can be spaced apart from the driving electrode TE, the sensing electrode RE, and the dummy pattern DE.

[0331] The second sound electrode SOE2 and the fourth connection electrode BE4 of the sub sound unit SSU1 and SSU2 can be made of the same or similar material on the same layer as the first connection electrode BE1. The second sound electrode SOE2 and the fourth connection electrode BE4 of each of the sub sound unit SSU1 and SSU2 can be electrically separated from the first connection electrode BE1. The second sound electrode SOE2 and the fourth connection electrode BE4 of the sub sound unit SSU1 and SSU2 can be spaced apart from the first connection electrode BE1.

[0332] The first sound electrode SOE1 of the sub sound unit SSU1 and SSU2 can be provided instead of some or a predetermined number of the dummy pattern DE. As an example, some or a predetermined number of the dummy pattern DE can be omitted, and the first sound electrode SOE1 of the sub sound unit SSU1 and SSU2 can be provided in a place where the dummy pattern DE can be omitted.

[0333] As shown in FIG. 20 and FIG. 21 Each of the first sound electrode SOE1 of the sub sound unit SSU1 and SSU2 can be surrounded by the sensing electrode RE or can be adjacent to the sensing electrode RE. However, it will be understood that the disclosure is not limited thereto. For example, each of the first sound electrode SOE1 of the sub sound unit SSU1 and SSU2 can be provided to be surrounded by the driving electrode TE or can be adjacent to the driving electrode TE. In such a case, in each of the sound unit SU, the first sound electrode SOE1 adjacent to each other in the second direction (Y-axis direction) can be electrically connected, and the second sound electrode SOE2 adjacent to each other in the second direction (Y-axis direction) can be electrically connected.

[0334] As shown in FIG. 20 and FIG. 21As shown in FIG. 1, in each of the sub sound units SSU1 and SSU2, a first sound driving voltage can be applied to the first sound electrode SOE1 through the first sound line SOL1, and a second sound driving voltage can be applied to the second sound electrode SOE2 through the second sound line SOL2. Accordingly, each of the sub sound units SSU1 and SSU2 vibrates the vibration layer PEL disposed between the first sound electrode SOE1 and the second sound electrode SOE2 by the first sound driving voltage and the second sound driving voltage, thereby outputting sound. The sound can be output by using the sound unit SU contained into the display panel 300.

[0335] On the other hand, first shield electrodes SHE1 and second shield electrodes (not shown) can be disposed between the sub sound units SSU1 and SSU2. For example, the first shield electrodes SHE1 can be disposed between the first sound electrode SOE1 of the first sub sound unit SSU1 and the first sound electrode SOE1 of the second sub sound unit SSU2. In addition, the second shield electrodes can be disposed between the second sound electrode SOE2 of the first sub sound unit SSU1 and the second sound electrode SOE2 of the second sub sound unit SSU2.

[0336] Each of the first shield electrodes SHE1 can be surrounded by or can be adjacent to the driving electrode TE. The first shield electrodes SHE1 adjacent to each other in the first direction (X-axis direction) can be electrically connected to each other through the fifth connection electrode BE5. The first shield electrodes SHE1 electrically connected to each other in the first direction (X-axis direction) can be electrically connected to the first shield line. The first shield line can be electrically connected to one of the sound pads SP1 and SP2. Accordingly, the first shield electrodes SHE1 can be electrically connected to the sound driver 340.

[0337] The second shield electrodes adjacent to each other in the first direction (X-axis direction) can be electrically connected to each other through the sixth connection electrode (not shown). The second shield electrodes electrically connected to each other in the first direction (X-axis direction) can be electrically connected to the second shield line. The second shield line can be electrically connected to the other of the sound pads SP1 and SP2. Accordingly, the second shield electrodes can be electrically connected to the sound driver 340.

[0338] One of the first shield electrodes SHE1 can be superposed on one of the second shield electrodes in the third direction (Z-axis direction). The first shield electrodes SHE1 can be made of the same or similar material on the same layer as the first sound electrode SOE1. The second shield electrodes can be made of the same or similar material on the same layer as the second sound electrode SOE2.

[0339] The sound driver 340 can apply a first shielding drive voltage to the first shielding electrode SHE1 and a second shielding drive voltage to the second shielding electrode. For example... FIG. 27 As shown, the first shielding drive voltage SHV1 applied to the first shielding electrode SHE1 can be substantially equal to the second sound drive voltage SOV2 applied to the second sound electrode SOE2 of the first sub-sound unit SSU1. The second shielding drive voltage SHV2 applied to the second shielding electrode can be substantially equal to the first sound drive voltage SOV1 applied to the first sound electrode SOE1 of the first sub-sound unit SSU1. Since the vibrating layer PEL is disposed between the first shielding electrode SHE1 and the second shielding electrode, the vibrating layer PEL can vibrate using the first shielding drive voltage SHV1 and the second shielding drive voltage SHV2, thereby enabling the output of shielded sound. Therefore, by using the first shielding electrode SHE1 and the second shielding electrode to vibrate the vibrating layer PEL, it is possible to suppress the influence of vibrations or sound generated by the first sub-sound unit SSU1 on vibrations or sound generated by the second sub-sound unit SSU2.

[0340] FIG. 22 It shows the electrical connection. FIG. 20 A view of an example of a sensor driver with driving electrodes and sensing electrodes, and a sound driver electrically connected to the first sound electrode and the second sound electrode.

[0341] FIG. 22 The embodiments can be related to FIG. 9 The difference in this embodiment is that the first sound electrode SOE1 can be electrically connected to the sound driver 340 via the first sound line SOL1, and the second sound electrode can be electrically connected to the sound driver 340 via the second sound line SOL2. For ease of explanation, FIG. 22 The second acoustic electrode is not shown.

[0342] Reference FIG. 22 The first sound electrodes SOE1, which are adjacent to each other in the first direction (X-axis direction), can be electrically connected through the third connecting electrode BE3. Therefore, the first sound electrodes SOE1, which are electrically connected to each other in the first direction (X-axis direction), can be electrically connected to the sound driver 340 through the first sound line SOL1.

[0343] Furthermore, the second sound electrodes adjacent to each other in the first direction (X-axis direction) can be electrically connected via the fourth connecting electrode BE4. Therefore, the second sound electrodes electrically connected to each other in the first direction (X-axis direction) can be electrically connected to the sound driver 340 via the second sound line SOL2. The second sound electrodes can be superimposed on the first sound electrode SOE1 in the third direction (Z-axis direction).

[0344] The sound driver 340 can apply a first sound driving voltage to the first sound electrode SOE1 through the first sound line SOL1 and can apply a second sound driving voltage to the second sound electrode through the second sound line SOL2. Accordingly, each of the sub sound units SSU1 and SSU2 vibrates the vibration layer PEL disposed between the first sound electrode SOE1 and the second sound electrode by the first sound driving voltage and the second sound driving voltage, thereby outputting sound.

[0345] FIG. 23 is an enlarged plan view illustrating the driving electrode, the sensing electrode, the first sound electrode, the first connection electrode, the second connection electrode, the third connection electrode, and the fourth connection electrode of FIG. 21 FIG. 23 is an enlarged plan view of the region B-1 of FIG. 21

[0346] Referring to FIG. 23 , when viewed from the top, the driving electrode TE, the sensing electrode RE, the first connection electrode BE1, the second connection electrode BE2, the third connection electrode BE3, the fourth connection electrode BE4, the first sound electrode SOE1, and the second sound electrode SOE2 can be formed in a mesh topology.

[0347] The driving electrode TE, the sensing electrode RE, the first sound electrode SOE1, the second connection electrode BE2, and the third connection electrode BE3 can be formed or disposed in the same layer, and thus some of them can be spaced apart from each other. There can be a gap between the driving electrode TE and the sensing electrode RE, between the driving electrode TE and the second connection electrode BE2, between the sensing electrode RE and the first sound electrode SOE1, between the second connection electrode BE2 and the third connection electrode BE3, and between the sensing electrode RE and the third connection electrode BE3. For ease of illustration, the boundaries between the driving electrode TE and the sensing electrode RE, between the driving electrode TE and the second connection electrode BE2, between the sensing electrode RE and the first sound electrode SOE1, between the second connection electrode BE2 and the third connection electrode BE3, and between the sensing electrode RE and the third connection electrode BE3 are indicated by dotted lines in FIG. 23

[0348] The first connection electrode BE1 and the second connection electrode BE2 can be substantially the same as the first connection electrode BE1 and the second connection electrode BE2 described above with reference to FIG. 10 FIG. 10 The sub-pixels R, G, and B can be substantially the same as the sub-pixels R, G, and B described above with reference to ​​​​

[0349] One end of the third connection electrode BE3 can be electrically connected to one of the first sound electrodes SOE1 adjacent to each other in the first direction (X-axis direction), and the other end of the third connection electrode BE3 can be electrically connected to the other of the first sound electrodes SOE1 adjacent to each other in the first direction (X-axis direction). The third connection electrode BE3 can be superposed on the first connection electrode BE1 in the third direction (Z-axis direction). Since the third connection electrode BE3 is formed or disposed on a different layer from the first connection electrode BE1, even though they are superposed on each other in the third direction (Z-axis direction), a short circuit is not formed or disposed between the third connection electrode BE3 and the first connection electrode BE1.

[0350] One end of the fourth connection electrode BE4 can be electrically connected to one of the second sound electrodes SOE2 adjacent to each other in the first direction (X-axis direction), and the other end of the fourth connection electrode BE4 can be electrically connected to the other of the second sound electrodes SOE2 adjacent to each other in the first direction (X-axis direction). The fourth connection electrode BE4 can be bent at least twice as shown in FIG. 11B. The fourth connection electrode BE4 can be superposed on the driving electrode TE and the sensing electrode RE in the third direction (Z-axis direction). Since the fourth connection electrode BE4 is formed or disposed on a different layer from the driving electrode TE and the sensing electrode RE, even though the fourth connection electrode BE4 is superposed on the driving electrode TE and the sensing electrode RE in the third direction (Z-axis direction), a short circuit is not formed or disposed between the fourth connection electrode BE4 and the driving electrode TE and the sensing electrode RE. FIG. 23

[0351] FIG. 24 is a schematic cross-sectional view taken along line III-III' of FIG. 23 . FIG. 25 is a schematic cross-sectional view of an example taken along line IV-IV' of FIG. 23 .

[0352] FIG. 24 Embodiments of FIG. 25 may differ from embodiments of FIG. 11 and FIG. 12 in that the second sound electrode SOE2 can be disposed on the second buffer layer BF2, and the first sound electrode SOE1 can be disposed on the vibration layer PEL.

[0353] Referring to FIG. 24 and FIG. 25 , the second sound electrode SOE2 and the first connection electrode BE1 can be formed or disposed on the second buffer layer BF2. In addition, the fourth connection electrode BE4 can be formed or disposed on the second buffer layer BF2. The vibration layer PEL can be formed or disposed on the second sound electrode SOE2, the first connection electrode BE1, and the fourth connection electrode BE4.​

[0354] In a case where the first sound driving voltage is applied to the first sound electrode SOE1 and the second sound driving voltage is applied to the second sound electrode SOE2, the vibration layer PEL can be mechanically deformed by the inverse piezoelectric effect. For example, in a case where a positive first sound driving voltage is applied to the first sound electrode SOE1 and a negative second sound driving voltage is applied to the second sound electrode SOE2 and then a negative first driving voltage is applied to the first sound electrode SOE1 and a positive second sound driving voltage is applied to the second sound electrode SOE2, the vibration layer PEL can repeatedly expand and contract. Accordingly, the vibration layer PEL can vibrate in the third direction (Z-axis direction) as shown in FIG. 1B. In addition, in a case where the vibration layer PEL is mechanically deformed, the vibration layer PEL can generate a voltage on the first sound electrode SOE1 and the second sound electrode SOE2 by the piezoelectric effect. As shown in FIG. 1C, each of the sound units SU can output sound by vibrating the vibration layer PEL by the inverse piezoelectric effect. FIG. 26 FIG. 26

[0355] The driving electrode TE, the sensing electrode RE, the first sound electrode SOE1, and the third connection electrode BE3 can be formed or disposed on the vibration layer PEL. The first contact hole CNT1 can be formed or disposed through the vibration layer PEL to expose the first connection electrode BE1. The driving electrode TE can be electrically connected to the first connection electrode BE1 through the first contact hole CNT1. The first sensor insulating layer TINS1 can be formed or disposed on the driving electrode TE, the sensing electrode RE, the first sound electrode SOE1, and the third connection electrode BE3.

[0356] FIG. 24 FIG. 25 As shown in FIGS. 1A to 1C, the first sound electrode SOE1, the second sound electrode SOE2, and the vibration layer PEL can be formed or disposed in a sensor electrode layer SENL for sensing a touch input of a user. Accordingly, it is possible to sense a touch input of a user by using the driving electrode TE and the sensing electrode RE of the sensor electrode layer SENL, and it is also possible to output sound by vibrating the vibration layer PEL by the first sound electrode SOE1 and the second sound electrode SOE2 of the sensor electrode layer SENL. The sound can be output by using the sound unit SU included in the display panel 300.

[0357] FIG. 28 is a schematic cross-sectional view taken along line III-III' of FIG. 23

[0358] FIG. 28 Embodiments of FIG. 24 ​​​​​Embodiments of the display panel 300 differ in that the vibration layer PEL can be formed or disposed in a portion of the sensor area TSA.

[0359] Referring to FIG. 28 , the vibration layer PEL can be formed or disposed in a portion of the sensor area TSA in which the sound unit SU is disposed. The vibration layer PEL can be formed or disposed in a region in which the first sound electrode SOE1 and the second sound electrode SOE2 can be disposed. Also, the vibration layer PEL can be formed or disposed in a region in which the first shield electrode SHE1 and the second shield electrode can be disposed. The second sensor insulating layer TINS2, rather than the vibration layer PEL, can be formed or disposed in a region in which the first connection electrode BE1 can be disposed.

[0360] The second sensor insulating layer TINS2 can be formed or disposed on the first connection electrode BE1. The second sensor insulating layer TINS2 can be formed of an organic layer such as an acrylic resin, an epoxy resin, a phenol resin, a polyamide resin, or a polyimide resin. Alternatively, the second sensor insulating layer TINS2 can include both an inorganic layer and an organic layer.

[0361] The first contact hole CNT1 can be formed or disposed through the second sensor insulating layer TINS2, and the first connection electrode BE1 can be exposed via the first contact hole CNT1. The driving electrode TE can be electrically connected to the first connection electrode BE1 through the first contact hole CNT1. In such a case, the first contact hole CNT1 need not be formed or disposed in the vibration layer PEL.

[0362] FIG. 29 is a side view illustrating an example of a display panel according to an embodiment. FIG. 4 is a side view illustrating an example of a display panel according to an embodiment. FIG. 29 is a side view illustrating a display panel 300 having a sub-area SBA that is curved and disposed on a lower surface of the display panel 300.

[0363] FIG. 29 Embodiments of the display panel 300 can differ in that the vibration layer PEL can be formed or disposed in a portion of the sensor area TSA. FIG. 5 Embodiments of the display panel 300 can differ in that the vibration layer PEL can be formed or disposed in a portion of the sensor area TSA. FIG. 29 According to embodiments of the display panel 300, the sound electrode can not be included in the sensor electrode layer SENL.

[0364] FIG. 30 and FIG. 31 are views illustrating a layout of a sound electrode layer of a display panel according to an embodiment. FIG. 32 is a view illustrating a sound unit and a bumper of a bottom panel cover of a display panel according to an embodiment.

[0365] FIG. 30 and FIG. 31A sound electrode layer SOEL disposed on a lower surface of a substrate SUB of the display panel 300 according to an embodiment is illustrated. FIG. 30 A layout of a lower surface of the display panel 300 having the unfolded sub-area SBA is illustrated. FIG. 31 A layout of a lower surface of the display panel 300 having the curved and disposed sub-area SBA on the lower surface of the display panel 300 is illustrated. FIG. 30 Sound units SU1, SU2, SU3, and SU4 disposed on a lower surface of a substrate SUB of the display panel 300 and a buffer 420 of a bottom panel cover PB are illustrated.

[0366] Referring to FIG. 31 and FIG. 30 , the sound units SU1, SU2, SU3, and SU4 can be disposed on a lower surface of a substrate SUB of the display panel 300. Although four sound units SU1, SU2, SU3, and SU4 can be disposed on the lower surface of the substrate SUB in the examples illustrated in FIG. 31 and FIG. 30 , the number of the sound units SU1, SU2, SU3, and SU4 is not limited to four.

[0367] Each of the sound units SU1, SU2, SU3, and SU4 can include a first sound electrode, a second sound electrode, and a vibration layer. The first sound electrode, the second sound electrode, and the vibration layer can be stacked on each other in a third direction (Z-axis direction). The vibration layer can be disposed between the first sound electrode and the second sound electrode. In a case where a first sound driving voltage is applied to the first sound electrode and a second sound driving voltage is applied to the second sound electrode, the vibration layer can be mechanically deformed by a converse piezoelectric effect. In addition, in a case where the vibration layer is mechanically deformed, the vibration layer can generate a voltage on the first sound electrode and the second sound electrode by a piezoelectric effect. Each of the sound units SU1, SU2, SU3, and SU4 can output sound by vibrating the vibration layer by the converse piezoelectric effect.

[0368] The first sound electrode of the first sound unit SU1 and the first sound electrode of the second sound unit SU2 arranged or disposed in the first direction (X-axis direction) can be electrically connected to a first horizontal sound line HSOL1 of the first sound line SOL1. The first sound electrode of the third sound unit SU3 and the first sound electrode of the fourth sound unit SU4 arranged or disposed in the first direction (X-axis direction) can be electrically connected to a second horizontal sound line HSOL2 of the first sound line SOL1.

[0369] The second sound electrode of the first sound unit SU1 and the second sound electrode of the third sound unit SU3 arranged or disposed in the second direction (Y-axis direction) can be electrically connected to the first vertical sound line VSOL1 of the second sound line SOL2. The second sound electrode of the second sound unit SU2 and the second sound electrode of the fourth sound unit SU4 arranged or disposed in the second direction (Y-axis direction) can be electrically connected to the second vertical sound line VSOL2 of the second sound line SOL2.

[0370] The first horizontal sound line HSOL1 can be electrically connected to the first sound pad SP1, the second horizontal sound line HSOL2 can be electrically connected to the second sound pad SP2, the first vertical sound line VSOL1 can be electrically connected to the third sound pad SP3, and the second vertical sound line VSOL2 can be electrically connected to the fourth sound pad SP4. In the case where the sub-area SBA is curved and disposed on the lower surface of the display panel 300, the first sound pad SP1, the second sound pad SP2, the third sound pad SP3, and the fourth sound pad SP4 can be stacked in the third direction (Z-axis direction) with the display circuit board 310. Accordingly, the first sound pad SP1, the second sound pad SP2, the third sound pad SP3, and the fourth sound pad SP4 can be electrically connected to the display circuit board 310. Accordingly, the first horizontal sound line HSOL1, the second horizontal sound line HSOL2, the first vertical sound line VSOL1, and the second vertical sound line VSOL2 can be electrically connected to the sound driver 340 disposed on the display circuit board 310.

[0371] To output sound by vibrating the vibration layer of the first sound unit SU1, the sound driver 340 can apply a first horizontal sound driving voltage to the first horizontal sound line HSOL1, and can apply a first vertical sound driving voltage to the first vertical sound line VSOL1. To output sound by vibrating the vibration layer of the second sound unit SU2, the sound driver 340 can apply a first horizontal sound driving voltage to the first horizontal sound line HSOL1, and can apply a second vertical sound driving voltage to the second vertical sound line VSOL2. To output sound by vibrating the vibration layer of the third sound unit SU3, the sound driver 340 can apply a second horizontal sound driving voltage to the second horizontal sound line HSOL2, and can apply a first vertical sound driving voltage to the first vertical sound line VSOL1. To output sound by vibrating the vibration layer of the fourth sound unit SU4, the sound driver 340 can apply a second horizontal sound driving voltage to the second horizontal sound line HSOL2, and can apply a second vertical sound driving voltage to the second vertical sound line VSOL2.

[0372] To output sound through the first and second sound units SU1 and SU2, the sound driver 340 can apply the first horizontal sound driving voltage to the first horizontal sound line HSOL1, can apply the first vertical sound driving voltage to the first vertical sound line VSOL1, and can apply the second vertical sound driving voltage to the second vertical sound line VSOL2. To output sound through the first and third sound units SU1 and SU3, the sound driver 340 can apply the first horizontal sound driving voltage to the first horizontal sound line HSOL1, can apply the second horizontal sound driving voltage to the second horizontal sound line HSOL2, and can apply the first vertical sound driving voltage to the first vertical sound line VSOL1. To output sound through the second and fourth sound units SU2 and SU4, the sound driver 340 can apply the first horizontal sound driving voltage to the first horizontal sound line HSOL1, can apply the second horizontal sound driving voltage to the second horizontal sound line HSOL2, and can apply the second vertical sound driving voltage to the second vertical sound line VSOL2. To output sound through all of the first, second, third, and fourth sound units SU1, SU2, SU3, and SU4, the sound driver 340 can apply the first horizontal sound driving voltage to the first horizontal sound line HSOL1, can apply the second horizontal sound driving voltage to the second horizontal sound line HSOL2, can apply the first vertical sound driving voltage to the first vertical sound line VSOL1, and can apply the second vertical sound driving voltage to the second vertical sound line VSOL2.

[0373] Each of the sound units SU1, SU2, SU3, and SU4 can not be overlapped with the bumper 420. To this end, the bumper 420 can include bumper holes BH overlapped with the sound units SU1, SU2, SU3, and SU4, respectively, in the third direction (Z-axis direction). The bumper holes BH can penetrate the bumper 420. Due to the bumper holes BH, a resonator (or a sound box) can be formed or disposed under or below each of the sound units SU1, SU2, SU3, and SU4. Accordingly, a sound pressure level of sound output through each of the sound units SU1, SU2, SU3, and SU4 can be increased due to the resonator.

[0374] As FIG. 31 and FIG. 33As shown in the middle, the sound units SU1, SU2, SU3, and SU4 can be arranged or disposed in an m by n matrix, where m and n are positive integers. The first sound electrodes SOE1 of the sound units arranged or disposed in the same row can be electrically connected to the same horizontal sound line, while the second sound electrodes SOE2 of the sound units arranged or disposed in the same column can be electrically connected to the same vertical sound line. Accordingly, the number of sound lines for driving the sound units SU1, SU2, SU3, and SU4 can be reduced, and sound can be output by driving the sound units SU1, SU2, SU3, and SU4 individually or simultaneously. Accordingly, the display device 10 can output monaural sound as well as multi-channel sound (e.g., binaural sound).

[0375] FIG. 30 is a schematic cross-sectional view illustrating an example taken along the line V-V' of FIG. 34 . FIG. 30 is a schematic cross-sectional view illustrating an example taken along the line VI-VI' of FIG. 33 . FIG. 34 and FIG. 33 schematically illustrate a cross-section of the fourth sound unit SU4.

[0376] Referring to FIG. 34 and FIG. 11 , the light shielding member LSM can be formed or disposed on the lower surface of the substrate SUB. Since the light shielding member LSM blocks light transmission, it is possible to prevent the sound units SU1, SU2, SU3, and SU4 from being recognized by a user on the upper surface of the display panel 300. The light shielding member LSM can include a light-absorbing material such as black pigment and black dye.

[0377] The first sound line SOL1 including the first horizontal sound line HSOL1 and the second horizontal sound line HSOL2, the second sound line SOL2 including the first vertical sound line VSOL1 and the second vertical sound line VSOL2, and the first sound electrode SOE1 can be formed or disposed on the light shielding member LSM. The first sound line SOL1, the second sound line SOL2, and the first sound electrode SOE1 can be made of the same or similar material. The first sound line SOL1 and the first sound electrode SOE1 can be electrically connected to each other. The second sound line SOL2 and the first sound electrode SOE1 can be electrically separated from each other. The first sound line SOL1, the second sound line SOL2, and the first sound electrode SOE1 can include a conductive metal material.

[0378] The vibration layer PEL can be formed or disposed on the first sound electrode SOE1. The vibration layer PEL can include a piezoelectric material or an electroactive polymer, which can be deformed according to a first sound driving voltage applied to the first sound electrode SOE1 and a second sound driving voltage applied to the second sound electrode SOE2. The piezoelectric material can include lead zirconate titanate (PZT), and the electroactive polymer can include a ferroelectric polymer such as polyvinylidene fluoride (PVDF) and poly(vinylidene fluoride-co-trifluoroethylene) (P(VDF-TrFE)). The vibration layer PEL can be formed or disposed on the first sound electrode SOE1 by printing, spraying, or spin coating. The vibration layer PEL can be similar to the vibration layer PEL described above with reference to FIGS. 1A and 1B. FIG. 34 The vibration layer PEL can be formed or disposed on the first sound electrode SOE1. The vibration layer PEL can include a piezoelectric material or an electroactive polymer, which can be deformed according to a first sound driving voltage applied to the first sound electrode SOE1 and a second sound driving voltage applied to the second sound electrode SOE2. The piezoelectric material can include lead zirconate titanate (PZT), and the electroactive polymer can include a ferroelectric polymer such as polyvinylidene fluoride (PVDF) and poly(vinylidene fluoride-co-trifluoroethylene) (P(VDF-TrFE)). The vibration layer PEL can be formed or disposed on the first sound electrode SOE1 by printing, spraying, or spin coating. The vibration layer PEL can be similar to the vibration layer PEL described above with reference to FIGS. 1A and 1B.

[0379] In a case where the first sound driving voltage is applied to the first sound electrode SOE1 and the second sound driving voltage is applied to the second sound electrode SOE2, the vibration layer PEL can be mechanically deformed by a converse piezoelectric effect. In addition, in a case where the vibration layer PEL is mechanically deformed, the vibration layer PEL can generate a voltage on the first sound electrode SOE1 and the second sound electrode SOE2 by a piezoelectric effect. Each of the sound units SU1, SU2, SU3, and SU4 can output sound by vibrating the vibration layer PEL by the converse piezoelectric effect.

[0380] The first vertical sound line VSOL1 or the second vertical sound line VSOL2 can be formed or disposed on a side surface of the vibration layer PEL. For example, the first vertical sound line VSOL1 can be formed or disposed on a side surface of the vibration layer PEL of each of the first sound unit SU1 and the third sound unit SU3. The second vertical sound line VSOL2 can be formed or disposed on a side surface of the vibration layer PEL of each of the second sound unit SU2 and the fourth sound unit SU4.

[0381] The second sound electrode SOE2 can be formed or disposed on the vibration layer PEL. The vibration layer PEL can be disposed between the first sound electrode SOE1 and the second sound electrode SOE2 in a third direction (Z-axis direction). The second sound electrode SOE2 can include a conductive metal material. In order to prevent a short circuit between the first sound electrode SOE1 and the second vertical sound line VSOL2, as shown in FIG. 1B, a length L1 of the first sound electrode SOE1 in a second direction (Y-axis direction) can be less than a length L2 of the vibration layer PEL in the second direction (Y-axis direction). FIG. 33

[0382] ​The first sound line SOL1 and the first sound electrode SOE1 can be formed by printing or spraying a silver (Ag) paste, a carbon paste, or a conductive polymer onto the light shielding member LSM. Alternatively, the first sound line SOL1 and the first sound electrode SOE1 can be formed by depositing a conductive material such as copper (Cu), aluminum (Al), silver (Ag), and indium tin oxide (ITO) on the light shielding member LSM.

[0383] The second sound electrode SOE2 and the second sound line SOL2 can be formed by printing or spraying a silver (Ag) paste, a carbon paste, or a conductive polymer onto the vibration layer PEL. Alternatively, the second sound electrode SOE2 and the second sound line SOL2 can be formed by depositing a conductive material such as copper (Cu), aluminum (Al), silver (Ag), and indium tin oxide (ITO) on the vibration layer PEL.

[0384] The adhesive member 410 can be provided on the first sound line SOL1 and the second sound line SOL2. The adhesive member 410 can be a pressure sensitive adhesive. An upper surface of the adhesive member 410 can be embossed to obtain a cushioning effect.

[0385] The cushion member 420 can be provided on the adhesive member 410. The cushion member 420 absorbs external impact to prevent the display panel 300 from being damaged. The cushion member 420 can be formed of a polymer resin such as polyurethane, polycarbonate, polypropylene, and polyethylene, or can be formed of a material having elasticity such as rubber and a sponge obtained by foaming a polyurethane-based material or an acrylic-based material.

[0386] The cushion hole BH can be formed or provided in the adhesive member 410 and the cushion member 420 to form a resonator under or below each of the sound units SU1, SU2, SU3, and SU4. The cushion hole BH can penetrate the adhesive member 410 and the cushion member 420. The sound units SU1, SU2, SU3, and SU4 can respectively overlap the cushion hole BH in the third direction (Z-axis direction). Accordingly, the sound units SU1, SU2, SU3, and SU4 can be respectively disposed in the cushion hole BH.

[0387] The heat dissipation member 430 can be provided on the cushion member 420. The heat dissipation member 430 can include a base film 431, a first heat dissipation layer 432, and a second heat dissipation layer 433. The base film 431 can be a polyimide film or a polyethylene terephthalate film. The first heat dissipation layer 432 can include graphite, carbon nanotubes, or the like, within the spirit and scope of the disclosure. The second heat dissipation layer 433 can be implemented as a metal thin film such as copper, nickel, iron, and silver, which can block electromagnetic waves and has excellent heat conductivity.

[0388] As FIG. 34 and FIG. 35As shown, the sound electrode layer SOEL, including a first sound electrode SOE1, a second sound electrode SOE2, and a resonant layer PEL, can be disposed between the base SUB and the bottom panel cover PB of the display panel 300. Therefore, the resonant layer PEL vibrates through the first sound electrode SOE1 and the second sound electrode SOE2 of the sound electrode layer SOEL, and can output sound. Sound can be output using sound units SU1, SU2, SU3, and SU4 included in the display panel 300.

[0389] FIG. 36 This is a view showing the layout of the acoustic electrode layer of the display panel according to an embodiment. FIG. 35 It is shown in detail FIG. 35 A view of the layout of the sub-sound units and vibration units of the first sound unit.

[0390] FIG. 36 The layout of the lower surface of the display panel 300 with expanded sub-regions SBA is shown. FIG. 35 Detailed illustration FIG. 35 The first sound unit, SU1.

[0391] FIG. 36 and FIG. 30 The embodiments can be related to FIG. 31 and FIG. 35 The difference in the embodiments is that each of the sound units SU1, SU2, SU3 and SU4 may include a vibration unit and a sub-sound unit.

[0392] Reference FIG. 36 and FIG. 58 Each sound unit SU may include a vibration unit and sub-sound units. For example, the first sound unit SU1 may include a first vibration unit VU1 and (1-1) sub-sound units (or first sub-sound units) SU11, (1-2) sub-sound units (or second sub-sound units) SU12, (1-3) sub-sound units (or third sub-sound units) SU13, and (1-4) sub-sound units (or fourth sub-sound units) SU14. The first vibration unit VU1 may be electrically isolated from the (1-1) sub-sound units SU11, (1-2) sub-sound units SU12, (1-3) sub-sound units SU13, and (1-4) sub-sound units SU14. The first vibration unit VU1 may be spaced apart from the (1-1) sub-sound units SU11, (1-2) sub-sound units SU12, (1-3) sub-sound units SU13, and (1-4) sub-sound units SU14.

[0393] The first vibration unit VU1 can include a first vibration electrode, a second vibration electrode, and a second vibration layer disposed between the first vibration electrode and the second vibration electrode in a third direction (Z-axis direction). Each of the (1-1) sub sound unit SU11, the (1-2) sub sound unit SU12, the (1-3) sub sound unit SU13, and the (1-4) sub sound unit SU14 can include a first sound electrode, a second sound electrode, and a first vibration layer disposed between the first sound electrode and the second sound electrode in a third direction (Z-axis direction).

[0394] The first sound electrode of the (1-1) sub sound unit SU11 and the first sound electrode of the (1-2) sub sound unit SU12 can be electrically connected to a first sub horizontal sound line (or referred to as a first sub sound connection line) SHSL1, and the first sound electrode of the (1-3) sub sound unit SU13 and the first sound electrode of the (1-4) sub sound unit SU14 can be electrically connected to a second sub horizontal sound line (or referred to as a second sub sound connection line) SHSL2. The second sound electrode of the (1-1) sub sound unit SU11 and the second sound electrode of the (1-3) sub sound unit SU13 can be electrically connected to a first sub vertical sound line (or referred to as a third sub sound connection line) SVSL1, and the second sound electrode of the (1-2) sub sound unit SU12 and the second sound electrode of the (1-4) sub sound unit SU14 can be electrically connected to a second sub vertical sound line (or referred to as a fourth sub sound connection line) SVSL2. The first vibration electrode of the first vibration unit VU1 can be electrically connected to a first horizontal vibration line (or referred to as a first vibration line) HVL1, and the second vibration electrode of the first vibration unit VU1 can be electrically connected to a first vertical vibration line (or referred to as a second vibration line) VVL1.

[0395] The first horizontal vibration line HVL1 can be electrically separated from the first sub horizontal sound line SHSL1 and the second sub horizontal sound line SHSL2. The first horizontal vibration line HVL1 can be spaced apart from the first sub horizontal sound line SHSL1 and the second sub horizontal sound line SHSL2. The first horizontal vibration line HVL1 can be disposed between the first sub horizontal sound line SHSL1 and the second sub horizontal sound line SHSL2.

[0396] The first vertical vibration line VVL1 can be electrically separated from the first sub vertical sound line SVSL1 and the second sub vertical sound line SVSL2. The first vertical vibration line VVL1 can be spaced apart from the first sub vertical sound line SVSL1 and the second sub vertical sound line SVSL2. The first vertical vibration line VVL1 can be disposed between the first sub vertical sound line SVSL1 and the second sub vertical sound line SVSL2.

[0397] The first sub-horizontal sound line SHSL1, the second sub-horizontal sound line SHSL2, the first sub-vertical sound line SVSL1, and the second sub-vertical sound line SVSL2 can be electrically connected to the sound pad SP. The first horizontal vibration line HVL1 and the first vertical vibration line VVL1 can be electrically connected to the vibration pad VP. When the sub-region SBA is bent and disposed on the lower surface of the display panel 300, the sound pad SP and the vibration pad VP can be electrically connected to the display circuit board 310.

[0398] In order to output sound by vibrating the first vibration layer of the (1-1) sub-sound units SU11, (1-2) sub-sound units SU12, (1-3) sub-sound units SU13, and (1-4) sub-sound units SU14 of the first sound unit SU1, the sound driver 340 can apply a first horizontal sound driving voltage to the first sub-horizontal sound line SHSL1 and the second sub-horizontal sound line SHSL2, and can apply a first vertical sound driving voltage to the first sub-vertical sound line SVSL1 and the second sub-vertical sound line SVSL2. Furthermore, in order to provide tactile feedback to the user by vibrating the second vibration layer of the first vibration unit VU1, the sound driver 340 can apply a first horizontal vibration driving voltage to the first horizontal vibration line HVL1, and can apply a first vertical vibration driving voltage to the first vertical vibration line VVL1.

[0399] For example, such as FIG. 36 As shown, when a user touches the fourth sound unit SU4 or when an image is present in the area adjacent to the fourth sound unit SU4, the sound driver 340 can vibrate the first vibration layer of the fourth sound unit SU4 to output a sound associated with the image (e.g., a gunshot), and can also vibrate the second vibration layer of the fourth vibration unit VU4 to provide haptic feedback. Therefore, the user can feel the vibration at the location where the sound is generated, thus experiencing a more realistic sound effect.

[0400] and FIG. 36 Similar to the first sound unit SU1, the second sound unit SU2 may include a second vibration unit VU2 and (2-1) to (2-4) sub-sound units. For example, the second sound unit SU2 may be substantially the same as the first sound unit SU1, except that the second sound unit SU2 may be electrically connected to a third sub-vertical sound line, a fourth sub-vertical sound line, and a second vertical vibration line instead of the first sub-vertical sound line SVSL1, the second sub-vertical sound line SVSL2, and the first vertical vibration line VVL1; therefore, redundant descriptions will be omitted.

[0401] and FIG. 36The third sound unit SU3 can include a third vibration unit VU3 and (3-1) to (3-4) sub sound units, similar to the first sound unit SU1 in FIG. 1. For example, except that the third sound unit SU3 can be electrically connected to the third sub horizontal sound line, the fourth sub horizontal sound line, and the second horizontal vibration line instead of the first sub horizontal sound line SHSL1, the second sub horizontal sound line SHSL2, and the first horizontal vibration line HVL1, the third sound unit SU3 can be substantially identical to the first sound unit SU1; thus, a redundant description will be omitted.

[0402] The third sound unit SU3 can include a third vibration unit VU3 and (3-1) to (3-4) sub sound units, similar to the first sound unit SU1 in FIG. 1. For example, except that the third sound unit SU3 can be electrically connected to the third sub horizontal sound line, the fourth sub horizontal sound line, and the second horizontal vibration line instead of the first sub horizontal sound line SHSL1, the second sub horizontal sound line SHSL2, and the first horizontal vibration line HVL1, the third sound unit SU3 can be substantially identical to the first sound unit SU1; thus, a redundant description will be omitted. FIG. 35 The third sound unit SU3 can include a third vibration unit VU3 and (3-1) to (3-4) sub sound units, similar to the first sound unit SU1 in FIG. 1. For example, except that the third sound unit SU3 can be electrically connected to the third sub horizontal sound line, the fourth sub horizontal sound line, and the second horizontal vibration line instead of the first sub horizontal sound line SHSL1, the second sub horizontal sound line SHSL2, and the first horizontal vibration line HVL1, the third sound unit SU3 can be substantially identical to the first sound unit SU1; thus, a redundant description will be omitted.

[0403] FIG. 36 The third sound unit SU3 can include a third vibration unit VU3 and (3-1) to (3-4) sub sound units, similar to the first sound unit SU1 in FIG. 1. For example, except that the third sound unit SU3 can be electrically connected to the third sub horizontal sound line, the fourth sub horizontal sound line, and the second horizontal vibration line instead of the first sub horizontal sound line SHSL1, the second sub horizontal sound line SHSL2, and the first horizontal vibration line HVL1, the third sound unit SU3 can be substantially identical to the first sound unit SU1; thus, a redundant description will be omitted. FIG. 37 FIG. 39 The third sound unit SU3 can include a third vibration unit VU3 and (3-1) to (3-4) sub sound units, similar to the first sound unit SU1 in FIG. 1. For example, except that the third sound unit SU3 can be electrically connected to the third sub horizontal sound line, the fourth sub horizontal sound line, and the second horizontal vibration line instead of the first sub horizontal sound line SHSL1, the second sub horizontal sound line SHSL2, and the first horizontal vibration line HVL1, the third sound unit SU3 can be substantially identical to the first sound unit SU1; thus, a redundant description will be omitted. FIG. 37 FIG. 39 The third sound unit SU3 can include a third vibration unit VU3 and (3-1) to (3-4) sub sound units, similar to the first sound unit SU1 in FIG. 1. For example, except that the third sound unit SU3 can be electrically connected to the third sub horizontal sound line, the fourth sub horizontal sound line, and the second horizontal vibration line instead of the first sub horizontal sound line SHSL1, the second sub horizontal sound line SHSL2, and the first horizontal vibration line HVL1, the third sound unit SU3 can be substantially identical to the first sound unit SU1; thus, a redundant description will be omitted. FIG. 37

[0404] FIG. 36 ​​​​is a schematic cross-sectional view taken along the line VII-VII' of FIG. 38 FIG. 36 is a schematic cross-sectional view taken along the line VIII-VIII' of FIG. 39 FIG. 36 is a schematic cross-sectional view taken along the line IX-IX' of FIG. 40 FIG. 36 is a schematic cross-sectional view taken along the line X-X' of FIG. 37 to FIG. 40

[0405] FIG. 33 Embodiments of the application can differ from embodiments of the application of FIG. 34 and FIG. 37 to FIG. 40 in that the first sound unit SU1 can comprise a vibration unit and a sub sound unit.

[0406] Referring to FIG. 38 , the first horizontal vibration line HVL1, the first vertical vibration line VVL1, the first vibration electrode VE1, the first sub horizontal sound line SHSL1, the second sub vertical sound line SVSL2, and the first sound electrode SOE1 can be formed or disposed on the light shielding member LSM. The first horizontal vibration line HVL1, the first vertical vibration line VVL1, the first vibration electrode VE1, the first sub horizontal sound line SHSL1, the second sub vertical sound line SVSL2, and the first sound electrode SOE1 can be made of the same or similar material. The first horizontal vibration line HVL1 can be electrically connected to the first vibration electrode VE1. The first vertical vibration line VVL1 can be electrically separated from the first vibration electrode VE1. The first horizontal vibration line HVL1, the first vertical vibration line VVL1, the first vibration electrode VE1, the first sub horizontal sound line SHSL1, the second sub vertical sound line SVSL2, and the first sound electrode SOE1 can comprise an electrically conductive metal material.

[0407] ​​​​The second vibration layer VPEL can be formed or disposed on the first vibration electrode VE1. The second vibration layer VPEL can include a piezoelectric material or an electroactive polymer, which can be deformed according to the first vibration driving voltage applied to the first vibration electrode VE1 and the second vibration driving voltage applied to the second vibration electrode VE2. The piezoelectric material can include lead zirconate titanate (PZT), and the electroactive polymer can include a ferroelectric polymer such as polyvinylidene fluoride (PVDF) and poly(vinylidene fluoride-co-trifluoroethylene) (P(VDF-TrFE)). The electroactive polymer can include piezoelectric particles such as ZnO and BaTiO3 to increase a piezoelectric effect. In a case in which the first vibration driving voltage is applied to the first vibration electrode VE1 and the second vibration driving voltage is applied to the second vibration electrode VE2, the second vibration layer VPEL can be deformed by a converse piezoelectric effect. Also, in a case in which the second vibration layer VPEL is mechanically deformed, the second vibration layer VPEL can generate a voltage on the first vibration electrode VE1 and the second vibration electrode VE2 by a piezoelectric effect. The first vibration unit VU1 can vibrate the second vibration layer VPEL by a converse piezoelectric effect to provide haptic feedback to the user.

[0408] The first vibration layer SPEL can be formed or disposed on the first sound electrode SOE1 of each of the (1-1)th sub sound unit SU11, the (1-2)th sub sound unit SU12, the (1-3)th sub sound unit SU13, and the (1-4)th sub sound unit SU14. The first vibration layer SPEL can include a piezoelectric material or an electroactive polymer, which can be deformed according to a first sound driving voltage applied to the first sound electrode SOE1 and a second sound driving voltage applied to the second sound electrode SOE2. In a case in which the first sound driving voltage is applied to the first sound electrode SOE1 and the second sound driving voltage is applied to the second sound electrode SOE2, the first vibration layer SPEL can be mechanically deformed by a converse piezoelectric effect. Also, in a case in which the first vibration layer SPEL is mechanically deformed, the first vibration layer SPEL can generate a voltage on the first sound electrode SOE1 and the second sound electrode SOE2 by a piezoelectric effect. Each of the (1-1)th sub sound unit SU11, the (1-2)th sub sound unit SU12, the (1-3)th sub sound unit SU13, and the (1-4)th sub sound unit SU14 can output sound by vibrating the first vibration layer SPEL by a converse piezoelectric effect.

[0409] The first vertical vibration line VVL1 can be formed or disposed on a side surface of the second vibration layer VPEL of the first vibration unit VU1. The second vibration electrode VE2 can be formed or disposed on the second vibration layer VPEL of the first vibration unit VU1. The second vibration layer VPEL can be disposed between the first vibration electrode VE1 and the second vibration electrode VE2 in the third direction (Z-axis direction). The second vibration electrode VE2 can include a conductive metal material. To prevent a short circuit between the first vibration electrode VE1 and the first vertical vibration line VVL1, as shown in FIG. 40 The length of the first vibration electrode VE1 in the second direction (Y-axis direction) can be less than the length of the second vibration layer VPEL in the second direction (Y-axis direction), as shown in

[0410] The first sub-vertical sound line SVSL1 can be formed or disposed on a side surface of the first vibration layer SPEL of each of the (1-1) sub-sound unit SU11 and the (1-3) sub-sound unit SU13. The second sub-vertical sound line SVSL2 can be formed or disposed on a side surface of the first vibration layer SPEL of each of the (1-2) sub-sound unit SU12 and the (1-4) sub-sound unit SU14. The second sound electrode SOE2 can be formed or disposed on the first sound electrode SOE1 of each of the (1-1) sub-sound unit SU11, the (1-2) sub-sound unit SU12, the (1-3) sub-sound unit SU13, and the (1-4) sub-sound unit SU14. The first vibration layer SPEL can be disposed between the first sound electrode SOE1 and the second sound electrode SOE2 in the third direction (Z-axis direction). The second sound electrode SOE2 can include a conductive metal material. To prevent a short circuit between the first sound electrode SOE1 and the first sub-vertical sound line SVSL1 in the (1-1) sub-sound unit SU11 and the (1-3) sub-sound unit SU13, as shown in FIG. 37 to FIG. 40 The length of the first sound electrode SOE1 in the second direction (Y-axis direction) can be less than the length of the first vibration layer SPEL in the second direction (Y-axis direction), as shown in

[0411] As FIG. 41As shown in FIG. 1, the sound electrode layer SOEL including the first sound electrode SOE1, the second sound electrode SOE2, the first vibration electrode VE1, the second vibration electrode VE2, the first vibration layer SPEL, and the second vibration layer VPEL can be disposed between the substrate SUB of the display panel 300 and the bottom panel cover PB. Thus, sound can be output by vibrating the first vibration layer SPEL by the first sound electrode SOE1 and the second sound electrode SOE2 of the sound electrode layer SOEL, and haptic feedback can be provided by vibrating the second vibration layer VPEL by the first vibration electrode VE1 and the second vibration electrode VE2. Sound can be output and haptic feedback can be provided by using the sound units SU1, SU2, SU3, and SU4 included in the display panel 300.

[0412] FIG. 41 FIG. 1 is a view showing a layout of a sound electrode layer of a display panel according to an embodiment.

[0413] FIG. 30 Embodiments of the display panel 300 can be applied to FIG. 31 and Embodiments of the display panel 300 can be applied to FIG. 41 Embodiments of the display panel 300 can differ from those of the display panel 200 in that shielding units SHU1, SHU2, SHU3, and SHU4 can be disposed between the sound units SU1, SU2, SU3, and SU4.

[0414] Referring to FIG. 41 , to avoid sound or vibration generated by the first sound unit SU1 and sound or vibration generated by the second sound unit SU2 from affecting each other, a first shielding unit SHU1 can be disposed between the first sound unit SU1 and the second sound unit SU2. The first sound unit SU1, the first shielding unit SHU1, and the second sound unit SU2 can be arranged or disposed along a first direction (X-axis direction). A length of the first shielding unit SHU1 in the first direction (X-axis direction) can be less than a length of the first sound unit SU1 in the first direction (X-axis direction) and a length of the second sound unit SU2 in the first direction (X-axis direction). A length of the first shielding unit SHU1 in a second direction (Y-axis direction) can be substantially equal to a length of the first sound unit SU1 in the second direction (Y-axis direction) and a length of the second sound unit SU2 in the second direction (Y-axis direction).

[0415] To avoid the sound or vibration generated by the first sound unit SU1 and the sound or vibration generated by the third sound unit SU3 from affecting each other, a second shielding unit SHU2 can be disposed between the first sound unit SU1 and the third sound unit SU3. The first sound unit SU1, the second shielding unit SHU2, and the third sound unit SU3 can be arranged or disposed along the second direction (Y-axis direction). A length of the second shielding unit SHU2 in the first direction (X-axis direction) can be substantially equal to a length of the first sound unit SU1 in the first direction (X-axis direction) and a length of the third sound unit SU3 in the first direction (X-axis direction). A length of the second shielding unit SHU2 in the second direction (Y-axis direction) can be less than a length of the first sound unit SU1 in the second direction (Y-axis direction) and a length of the third sound unit SU3 in the second direction (Y-axis direction).

[0416] To avoid the sound or vibration generated by the second sound unit SU2 and the sound or vibration generated by the fourth sound unit SU4 from affecting each other, a third shielding unit SHU3 can be disposed between the second sound unit SU2 and the fourth sound unit SU4. The second sound unit SU2, the third shielding unit SHU3, and the fourth sound unit SU4 can be arranged or disposed along the second direction (Y-axis direction). A length of the third shielding unit SHU3 in the first direction (X-axis direction) can be substantially equal to a length of the second sound unit SU2 in the first direction (X-axis direction) and a length of the fourth sound unit SU4 in the first direction (X-axis direction). A length of the third shielding unit SHU3 in the second direction (Y-axis direction) can be less than a length of the second sound unit SU2 in the second direction (Y-axis direction) and a length of the fourth sound unit SU4 in the second direction (Y-axis direction).

[0417] To avoid the sound or vibration generated by the third sound unit SU3 and the sound or vibration generated by the fourth sound unit SU4 from affecting each other, a fourth shielding unit SHU4 can be disposed between the third sound unit SU3 and the fourth sound unit SU4. The third sound unit SU3, the fourth shielding unit SHU4, and the fourth sound unit SU4 can be arranged or disposed along the first direction (X-axis direction). A length of the fourth shielding unit SHU4 in the first direction (X-axis direction) can be less than a length of the third sound unit SU3 in the first direction (X-axis direction) and a length of the fourth sound unit SU4 in the first direction (X-axis direction). A length of the fourth shielding unit SHU4 in the second direction (Y-axis direction) can be substantially equal to a length of the third sound unit SU3 in the second direction (Y-axis direction) and a length of the fourth sound unit SU4 in the second direction (Y-axis direction).

[0418] Each of the shield units SHU1, SHU2, SHU3, and SHU4 can include a first shield electrode, a second shield electrode, and a shield vibration layer (or referred to as a third vibration layer) disposed between the first shield electrode and the second shield electrode in a third direction (Z-axis direction). In a case where a first shield driving voltage is applied to the first shield electrode and a second shield driving voltage is applied to the second shield electrode, the shield vibration layer can be mechanically deformed by a converse piezoelectric effect. Also, in a case where the shield vibration layer is mechanically deformed, the shield vibration layer can generate a voltage on the first shield electrode and the second shield electrode by a piezoelectric effect. Each of the shield units SHU1, SHU2, SHU3, and SHU4 can vibrate the shield vibration layer by the converse piezoelectric effect.

[0419] The first sound electrode of the first sound unit SU1, the second shield electrode of the first shield unit SHU1, and the first sound electrode of the second sound unit SU2 can be electrically connected to a first horizontal sound line HSOL1. The first sound electrode of the third sound unit SU3, the second shield electrode of the fourth shield unit SHU4, and the first sound electrode of the fourth sound unit SU4 can be electrically connected to a second horizontal sound line HSOL2.

[0420] The second sound electrode of the first sound unit SU1, the first shield electrode of the second shield unit SHU2, and the second sound electrode of the third sound unit SU3 can be electrically connected to a first vertical sound line VSOL1. The second sound electrode of the second sound unit SU2, the first shield electrode of the third shield unit SHU3, and the second sound electrode of the fourth sound unit SU4 can be electrically connected to a second vertical sound line VSOL2.

[0421] The second shield electrode of the second shield unit SHU2 and the second shield electrode of the third shield unit SHU3 can be electrically connected to a horizontal shield line HSHL. The first shield electrode of the first shield unit SHU1 and the first shield electrode of the fourth shield unit SHU4 can be electrically connected to a vertical shield line VSHL.

[0422] The first horizontal sound line HSOL1, the second horizontal sound line HSOL2, the first vertical sound line VSOL1, and the second vertical sound line VSOL2 can be electrically connected to the sound pads SP1, SP2, SP3, and SP4, and the horizontal shield line HSHL and the vertical shield line VSHL can be electrically connected to the shield pad SHP. In a case where the sub-area SBA is bent and disposed on a lower surface of the display panel 300, the sound pads SP1, SP2, SP3, and SP4 and the shield pad SHP can be electrically connected to the display circuit board 310.

[0423] The sound driver 340 can apply a first shielding drive voltage to the vertical shielding line VSHL. The first shielding drive voltage can be substantially equal to the first vertical sound drive voltage applied to the first vertical sound line VSOL1 or the second vertical sound drive voltage applied to the second vertical sound line VSOL2. Therefore, the sound wave or vibration wave generated by the first shielding unit SHU1 can be out of phase with the sound wave or vibration wave generated by the first sound unit SU1 or the second sound unit SU2. Thus, it is possible to prevent the sound or vibration generated by the first sound unit SU1 and the sound or vibration generated by the second sound unit SU2 from interfering with each other. Furthermore, the sound wave or vibration wave generated by the fourth shielding unit SHU4 can be out of phase with the sound wave or vibration wave generated by the third sound unit SU3 or the fourth sound unit SU4. Therefore, it is possible to avoid the sound or vibration generated by the third sound unit SU3 and the sound or vibration generated by the fourth sound unit SU4 from interfering with each other.

[0424] The sound driver 340 can apply a second shielding drive voltage to the horizontal shielding line HSHL. The second shielding drive voltage can be substantially equal to the first horizontal sound drive voltage applied to the first horizontal sound line HSOL1 or the second horizontal sound drive voltage applied to the second horizontal sound line HSOL2. Therefore, the sound wave or vibration wave generated by the second shielding unit SHU2 can be out of phase with the sound wave or vibration wave generated by the first sound unit SU1 or the third sound unit SU3. Thus, it is possible to prevent the sound or vibration generated by the first sound unit SU1 and the sound or vibration generated by the third sound unit SU3 from interfering with each other. Furthermore, the sound wave or vibration wave generated by the third shielding unit SHU3 can be out of phase with the sound wave or vibration wave generated by the second sound unit SU2 or the fourth sound unit SU4. Therefore, it is possible to prevent the sound or vibration generated by the second sound unit SU2 and the sound or vibration generated by the fourth sound unit SU4 from interfering with each other.

[0425] like FIG. 42 As shown, the sound units SU1, SU2, SU3, and SU4 are arranged or configured as an m x n matrix, where m and n are positive integers, and the shielding units SHU1, SHU2, SHU3, and SHU4 can be disposed between the sound units SU1, SU2, SU3, and SU4. Therefore, it is possible to suppress the influence of the sound units SU1, SU2, SU3, and SU4 on each other.

[0426] Further, the first sound electrodes of the sound units and the second shield electrodes of the shield units arranged or disposed in the same row can be electrically connected to the same horizontal sound line, and the second sound electrodes of the sound units and the first shield electrodes of the shield units arranged or disposed in the same column can be electrically connected to the same vertical sound line. Accordingly, it is possible to reduce the number of shield lines for driving the shield units SHU1, SHU2, SHU3, and SHU4, and it is possible to shield sound by driving the shield units SHU1, SHU2, SHU3, and SHU4 individually or simultaneously.

[0427] FIG. 41 is a schematic cross-sectional view taken along the line XI-XI' of FIG. 43 . FIG. 41 is a schematic cross-sectional view taken along the line XII-XII' of FIG. 42 . FIG. 43 and FIG. 42 shows a schematic cross-section of the third shield unit SHU3.

[0428] Referring to FIG. 43 and FIG. 43 , the second vertical sound line VSOL2, the horizontal shield line HSHL, the vertical shield line VSHL, the first sound electrode SOE1, and the second shield electrode SHE2 can be formed or disposed on the light shielding member LSM. The first horizontal sound line HSOL1, the second horizontal sound line HSOL2, and the first vertical sound line VSOL1 can also be formed or disposed on the light shielding member LSM. The first horizontal sound line HSOL1, the second horizontal sound line HSOL2, the first vertical sound line VSOL1, the second vertical sound line VSOL2, the horizontal shield line HSHL, the vertical shield line VSHL, the first sound electrode SOE1, and the second shield electrode SHE2 can be made of the same or similar material. The horizontal shield line HSHL can be electrically connected to the second shield electrode SHE2. The second vertical sound line VSOL2 can be electrically separated from the second shield electrode SHE2. The first horizontal sound line HSOL1, the second horizontal sound line HSOL2, the first vertical sound line VSOL1, the second vertical sound line VSOL2, the horizontal shield line HSHL, the vertical shield line VSHL, the first sound electrode SOE1, and the second shield electrode SHE2 can include a conductive metal material.

[0429] The shield vibration layer SHPEL can be formed or disposed on the second shield electrode SHE2. The shield vibration layer SHPEL can include a piezoelectric material or an electroactive polymer, which can be deformed according to a voltage applied to the first shield electrode SHE1 and a voltage applied to the second shield electrode SHE2. The piezoelectric material can include lead zirconate titanate (PZT), and the electroactive polymer can include a ferroelectric polymer such as polyvinylidene fluoride (PVDF) and poly(vinylidene-fluoride-co-trifluoroethylene) (P(VDF-TrFE)). The electroactive polymer can include piezoelectric particles such as ZnO and BaTiO3 to increase a piezoelectric effect. The third shield unit SHU3 can provide haptic feedback to the user by vibrating the shield vibration layer SHPEL by a reverse piezoelectric effect.

[0430] The second vertical sound line VSOL2 can be formed or disposed on a side surface of the shield vibration layer SHPEL of the third shield unit SHU3. The first shield electrode SHE1 can be formed or disposed on the shield vibration layer SHPEL of the third shield unit SHU3. The shield vibration layer SHPEL can be disposed between the first shield electrode SHE1 and the second shield electrode SHE2 in the third direction (Z-axis direction). The first shield electrode SHE1 can include a conductive metal material. To prevent a short circuit between the second shield electrode SHE2 and the second vertical sound line VSOL2, as shown in FIGS. 1A and 1B, a length of the second shield electrode SHE2 in the second direction (Y-axis direction) can be less than a length of the shield vibration layer SHPEL in the second direction (Y-axis direction). FIG. 42

[0431] As shown in FIGS. 1A and 1B, the sound electrode layer SOEL including the first sound electrode SOE1 (see FIG. 1A), the second sound electrode SOE2 (see FIG. 1B), the first shield electrode SHE1, the second shield electrode SHE2, the first vibration layer SPEL (see FIG. 1A), and the shield vibration layer SHPEL can be disposed between the substrate SUB of the display panel 300 and the back panel cover PB. Accordingly, sound can be output by vibrating the first vibration layer SPEL by the first sound electrode SOE1 and the second sound electrode SOE2 of the sound electrode layer SOEL, and sound generated by the sound units SU1, SU2, SU3, and SU4 can be prevented from affecting each other by vibrating the shield vibration layer SHPEL by the first shield electrode SHE1 and the second shield electrode SHE2. Sound can be output using the sound units SU1, SU2, SU3, and SU4 included in the display panel 300, and sound generated by the sound units SU1, SU2, SU3, and SU4 can be inhibited from interfering with each other. FIG. 43 ​ As shown in FIGS. 1A and 1B, the sound electrode layer SOEL including the first sound electrode SOE1 (see FIG. 1A), the second sound electrode SOE2 (see FIG. 1B), the first shield electrode SHE1, the second shield electrode SHE2, the first vibration layer SPEL (see FIG. 1A), and the shield vibration layer SHPEL can be disposed between the substrate SUB of the display panel 300 and the back panel cover PB. Accordingly, sound can be output by vibrating the first vibration layer SPEL by the first sound electrode SOE1 and the second sound electrode SOE2 of the sound electrode layer SOEL, and sound generated by the sound units SU1, SU2, SU3, and SU4 can be prevented from affecting each other by vibrating the shield vibration layer SHPEL by the first shield electrode SHE1 and the second shield electrode SHE2. Sound can be output using the sound units SU1, SU2, SU3, and SU4 included in the display panel 300, and sound generated by the sound units SU1, SU2, SU3, and SU4 can be inhibited from interfering with each other. FIG. 39 FIG. 39 FIG. 39

[0432] ​​​​​FIG. 44 is a view showing a layout of a sound electrode layer of a display panel according to an embodiment.

[0433] FIG. 44 Embodiments of the display panel 300 can be implemented in various ways. FIG. 30 Embodiments of the display panel 300 can be implemented in various ways. FIG. 31 Embodiments of the display panel 300 can be implemented in various ways.

[0434] Referring to FIG. 44 , the force sensing units PU1, PU2, and PU3 can be disposed on a lower surface of the substrate SUB of the display panel 300. The first force sensing unit PU1 can be disposed on a right side of the display panel 300, the second force sensing unit PU2 can be disposed at a center of the display panel 300, and the third force sensing unit PU3 can be disposed on a left side of the display panel 300. However, it will be understood that the disclosure is not limited thereto. For example, the first force sensing unit PU1 can be disposed on an upper side of the display panel 300, the second force sensing unit PU2 can be disposed at a center of the display panel 300, and the third force sensing unit PU3 can be disposed on a lower side of the display panel 300.

[0435] Each of the force sensing units PU1, PU2, and PU3 can be electrically connected to one force driving line PTL and one force sensing line PRL1, PRL2, and PRL3. The first force sensing unit PU1 can be electrically connected to the force driving line PTL and the first force sensing line PRL1. The second force sensing unit PU2 can be electrically connected to the force driving line PTL and the second force sensing line PRL2. The third force sensing unit PU3 can be electrically connected to the force driving line PTL and the third force sensing line PRL3. The force sensing units PU1, PU2, and PU3 can be commonly connected to the force driving line PTL.

[0436] The force driving line PTL, the first force sensing line PRL1, the second force sensing line PRL2, and the third force sensing line PRL3 can be electrically connected to the force pad PP. In a case where the sub-area SBA is bent and disposed on the lower surface of the display panel 300, the force pad PP can be electrically connected to the display circuit board 310.

[0437] The force driver 350 can be disposed on the display circuit board 310 and can be implemented as an integrated circuit. The force driver 350 can be implemented as a single integrated circuit with the sensor driver 330 and / or the sound driver 340. The force driver 350 outputs a force driving signal to the force driving line PTL and senses a current value or a voltage value through the first force sensing line PRL1, the second force sensing line PRL2, and the third force sensing line PRL3. Accordingly, it is possible to determine whether a force is applied to the force sensing units PU1, PU2, and PU3.

[0438] AsFIG. 44 As shown in FIG. 1, the sound electrode layer SOEL can include the force sensing units PU1, PU2, and PU3, and thus the display device 10 can determine whether a force is applied by the user.

[0439] FIG. 45 is a view showing a layout of a force driving electrode, a force sensing electrode, a force driving line, and a first force sensing line of the first force sensing unit of FIG. 44 FIG. 46 is a schematic cross-sectional view taken along the line XIII-XIII' of FIG. 45

[0440] Referring to FIG. 45 and FIG. 46 , the first force sensing unit PU1 can include a force driving electrode PTE, a force sensing electrode PRE, and a force sensitive layer (or called a force sensing layer) PSL. The force driving electrode PTE can include a driving trunk electrode TSE and driving branch electrodes TBE, and the force sensing electrode PRE can include a sensing trunk electrode RSE and sensing branch electrodes RBE.

[0441] One end of the driving trunk electrode TSE in the second direction (Y-axis direction) can be electrically connected to the force driving line PTL. Each of the driving branch electrodes TBE branches from the driving trunk electrode TSE in the first direction (X-axis direction).

[0442] One end of the sensing trunk electrode RSE in the second direction (Y-axis direction) can be electrically connected to the first force sensing line PRL1. Each of the sensing branch electrodes RBE branches from the sensing trunk electrode RSE in the first direction (X-axis direction).

[0443] The driving branch electrodes TBE and the sensing branch electrodes RBE can be electrically separated from each other. The driving branch electrodes TBE and the sensing branch electrodes RBE can be arranged or disposed in parallel to each other. The driving branch electrodes TBE and the sensing branch electrodes RBE can be alternately arranged or disposed in the second direction (Y-axis direction). They can be repeatedly arranged or disposed in the second direction (Y-axis direction) in the order of the driving branch electrode TBE, the sensing branch electrode RBE, the driving branch electrode TBE, the sensing branch electrode RBE, and so on.

[0444] The force driving line PTL, the first force sensing line PRL1, the force driving electrode PTE, and the force sensing electrode PRE can be disposed on the light shielding member LSM. The force driving line PTL, the first force sensing line PRL1, the force driving electrode PTE, and the force sensing electrode PRE can be made of the same or similar materials. The force driving line PTL, the first force sensing line PRL1, the force driving electrode PTE, and the force sensing electrode PRE can include an electrically conductive material.

[0445] ​​The force sensing layer PSL can be disposed on the drive branch electrode TBE and the sense branch electrode RBE. The force sensing layer PSL can include a polymer resin having a force sensing material. The force sensing material can be a metal microparticle (or a metal nanoparticle), such as nickel, aluminum, titanium, tin, and copper. For example, the force sensing layer PSL can be a quantum tunneling composite (QTC). In the case where a force is applied in the third direction (Z-axis direction), the resistance of the force sensing layer PSL can decrease. Since the resistance of the force sensing layer PSL changes according to the force applied to the first force sensing unit PU1, the current value or the voltage value detected by the force sensing electrode PRE can change. The force driver 350 can determine whether a force is applied by the user based on the current value or the voltage value detected by the force sensing electrode PRE. Accordingly, the first force sensing unit PU1 can function as an input device for detecting an input of the user.

[0446] On the force sensing layer PSL, a bump BMP can be disposed to press the force sensing layer PSL according to the force of the user. The bump BMP can be made of the same or similar material as the second sound electrode SOE2 of each of the sound units SU1, SU2, SU3, and SU4.

[0447] FIG. 47 FIG. 1 is a view showing a layout of a sound electrode layer according to an embodiment. FIG. 48 is a schematic cross-sectional view taken along the line XIV-XIV' of FIG. 47 FIG. 1. FIG. 49 and FIG. 50 are views showing a magnetic field of a fixed magnet according to FIG. 47 embodiments, an induced magnetic field of a planar coil, and a change in a voltage applied to first and second sound electrodes.

[0448] FIG. 47 to FIG. 50 Embodiments of FIG. 1 can be different from embodiments of FIGS. 2 to 4 in that the sound electrode layer SOEL can include planar coils CP1, CP2, CP3, and CP4. FIG. 30 and FIG. 31 Embodiments of FIG. 1 can be different from embodiments of FIGS. 2 to 4 in that the sound electrode layer SOEL can include planar coils CP1, CP2, CP3, and CP4.

[0449] Referring to FIG. 47 , the first planar coil CP1, the first fixed magnet, and the first sound unit SU1 can be disposed to be stacked on each other in the third direction (Z-axis direction), and the second planar coil CP2, the second fixed magnet, and the second sound unit SU2 can be disposed to be stacked on each other in the third direction (Z-axis direction). The third planar coil CP3, the third fixed magnet, and the third sound unit SU3 can be disposed to be stacked on each other in the third direction (Z-axis direction), and the fourth planar coil CP4, the fourth fixed magnet MGN4 (see FIG. 48 ), and the fourth sound unit SU4 can be disposed to be stacked on each other in the third direction (Z-axis direction).

[0450] The first fixed magnet can be disposed on the second sound electrode SOE2 of the first sound unit SU1. The second fixed magnet can be disposed on the second sound electrode SOE2 of the second sound unit SU2. The third fixed magnet can be disposed on the second sound electrode SOE2 of the third sound unit SU3. The fourth fixed magnet MGN4 can be disposed on the second sound electrode SOE2 of the fourth sound unit SU4 as shown in FIG. 48

[0451] The planar coils CP1, CP2, CP3, and CP4 can be disposed on one surface of the base film 431 of the heat dissipation member 430. The surface of the base film 431 of the heat dissipation member 430 can face the substrate SUB. Alternatively, the surface of the base film 431 of the heat dissipation member 430 can be the opposite surface of the surface facing the substrate SUB as shown in FIG. 48

[0452] One end of the first planar coil CP1 can be electrically connected to the first coil wire CIL1, and the other end of the first planar coil CP1 can be electrically connected to the second coil wire CIL2. One end of the second planar coil CP2 can be electrically connected to the third coil wire CIL3, and the other end of the second planar coil CP2 can be electrically connected to the fourth coil wire CIL4. One end of the third planar coil CP3 can be electrically connected to the fifth coil wire CIL5, and the other end of the third planar coil CP3 can be electrically connected to the sixth coil wire CIL6. One end of the fourth planar coil CP4 can be electrically connected to the seventh coil wire CIL7, and the other end of the fourth planar coil CP4 can be electrically connected to the eighth coil wire CIL8.

[0453] The coil wires CIL1 to CIL8 can be electrically connected to the coil pad COP. In a case where the sub-area SBA is bent and disposed on the lower surface of the display panel 300, the coil pad COP can be electrically connected to the display circuit board 310.

[0454] The sound driver 340 can apply a current so that an induced magnetic field can be formed by each of the planar coils CP1, CP2, CP3, and CP4. For example, the sound driver 340 can repeatedly apply a current so that a current flows from the seventh coil wire CIL7 to the eighth coil wire CIL8 as shown in FIG. 49 FIG. 50 FIG. 49 In a case where a current flows from the seventh coil wire CIL7 to the eighth coil wire CIL8 as shown in FIG. 50 ​​​​In the case shown, where the flow flows from the eighth coil line CIL8 to the seventh coil line CIL7, a repulsive force (or attractive force) may occur between the fourth fixed magnet MGN4 and the fourth planar coil CP4.

[0455] The sound driver 340 can apply current to coil lines CIL1 to CIL8 synchronously with the sound drive voltage used to output sound through sound units SU1, SU2, SU3, and SU4. For example, the sound driver 340 can apply current to the fourth planar coil CP4, such that current flows from the seventh coil line CIL7 to the eighth coil line CIL8, while simultaneously applying a positive first horizontal sound drive voltage and a negative first vertical sound drive voltage to drive the fourth sound unit SU4. Alternatively, the sound driver 340 can apply current to the fourth planar coil CP4, such that current flows from the eighth coil line CIL8 to the seventh coil line CIL7, while simultaneously applying a negative first horizontal sound drive voltage and a positive first vertical sound drive voltage to drive the fourth sound unit SU4.

[0456] like FIG. 47 to FIG. 50 As shown, fixed magnets can be respectively disposed on the second sound electrodes SOE2 of sound units SU1, SU2, SU3, and SU4, such that planar coils CP1, CP2, CP3, and CP4 are stacked with the fixed magnets. In this case, by controlling the direction of the current flowing through each of the planar coils CP1, CP2, CP3, and CP4, attractive and repulsive forces can be generated between the fixed magnets and the planar coils CP1, CP2, CP3, and CP4. By synchronizing the vibration of the resonating layer PEL of sound units SU1, SU2, SU3, and SU4 with the vibration generated by the attractive and repulsive forces between the fixed magnets and the planar coils CP1, CP2, CP3, and CP4, the vibration displacement of sound units SU1, SU2, SU3, and SU4 can be increased. Therefore, the sound pressure level of the low-pitched sound generated by each of the sound units SU1, SU2, SU3, and SU4 can be increased.

[0457] FIG. 51 This is a perspective view of a display device according to an embodiment. FIG. 52 This is a perspective view showing the display panel according to an embodiment. FIG. 53 This is an unfolded view showing the display panel according to an embodiment.

[0458] FIG. 51 to FIG. 53 The embodiments can be related to FIG. 1 and FIG. 2 The difference in the embodiments is that images can be displayed on the side surface of the display device.

[0459] Reference FIG. 51 to FIG. 53The cover window 100 can include a top surface PS100, a first side surface SS100, a second side surface SS200, a third side surface SS300, a fourth side surface SS400, a first corner portion CS100, a second corner portion CS200, a third corner portion CS300, and a fourth corner portion CS400.

[0460] The top surface PS100 of the cover window 100 can have, but is not limited to, a substantially rectangular shape having a shorter side in the first direction (X-axis direction) and a longer side in the second direction (Y-axis direction), in a case where the cover window 100 is viewed from the top. The top surface PS100 can have other substantially polygonal shapes, a circular shape, or an elliptical shape, in a case where the top surface PS100 is viewed from the top. Corners where the shorter side and the longer side meet on the top surface PS100 can be curved with a certain or predetermined curvature. Although the top surface PS100 is flat in the example shown in FIG. 51 , the disclosure is not limited thereto. The top surface PS100 can include a curved surface.

[0461] The first side surface SS100 of the cover window 100 can extend from a first side of the top surface PS100. For example, as shown in FIG. 51 , the first side surface SS100 can extend from the left side of the top surface PS100, and can be a left side surface of the cover window 100.

[0462] The second side surface SS200 of the cover window 100 can extend from a second side of the top surface PS100. For example, as shown in FIG. 51 , the second side surface SS200 can extend from the lower side of the top surface PS100, and can be a lower side surface of the cover window 100.

[0463] The third side surface SS300 of the cover window 100 can extend from a third side of the top surface PS100. For example, as shown in FIG. 51 , the third side surface SS300 can extend from the upper side of the top surface PS100, and can be an upper side surface of the cover window 100.

[0464] The fourth side surface SS400 of the cover window 100 can extend from a fourth side of the top surface PS100. For example, as shown in FIG. 51 , the fourth side surface SS400 can extend from the right side of the top surface PS100, and can be a right side surface of the cover window 100.

[0465] The first corner portion CS100 of the cover window 100 can extend from a first corner where the first side and the second side of the top surface PS100 meet. The first corner portion CS100 can be positioned or disposed between the first side surface SS100 and the second side surface SS200.

[0466] The second corner portion CS200 of the cover window 100 can extend from the second corner where the first and third sides of the upper surface PS100 meet. The second corner portion CS200 can be positioned or disposed between the first side surface SS100 and the third side surface SS300.

[0467] The third corner portion CS300 of the cover window 100 can extend from the third corner where the second and fourth sides of the upper surface PS100 meet. The third corner portion CS300 can be positioned or disposed between the second side surface SS200 and the fourth side surface SS400.

[0468] The fourth corner portion CS400 of the cover window 100 can extend from the fourth corner where the third and fourth sides of the upper surface PS100 meet. The fourth corner portion CS400 can be positioned or disposed between the third side surface SS300 and the fourth side surface SS400.

[0469] The upper surface PS100, first side surface SS100, second side surface SS200, third side surface SS300, and fourth side surface SS400 of the cover window 100 can be formed as light-transmitting portions. The first corner portion CS100, second corner portion CS200, third corner portion CS300, and fourth corner portion CS400 can be, but are not limited to, light-blocking portions that do not transmit light. The first corner portion CS100, second corner portion CS200, third corner portion CS300, and fourth corner portion CS400 of the cover window 100 can also be formed as light-transmitting portions.

[0470] like FIG. 52 As shown, the display panel 300 may include a substrate having an upper surface PS, a first side surface SS1, a second side surface SS2, a third side surface SS3, a fourth side surface SS4, a first corner portion CS1, a second corner portion CS2, a third corner portion CS3, and a fourth corner portion CS4.

[0471] When viewing the upper surface PS of the display panel 300 from above, the upper surface PS can have, but is not limited to, a generally rectangular shape, having a shorter side in a first direction (X-axis direction) and a longer side in a second direction (Y-axis direction). When viewing the upper surface PS of the display panel 300 from above, the upper surface PS can also have other generally polygonal, generally circular, or generally elliptical shapes. The corner where the shorter and longer sides meet on the upper surface PS can be curved with a certain or predetermined curvature. Although in FIG. 52 and FIG. 53 In the example shown, the upper surface PS is flat, but the disclosure is not limited thereto. The upper surface PS may include a curved surface.

[0472] The first side surface SS1 of the display panel 300 can extend from a first side of the upper surface PS. For example, as shown in FIG. 52 and FIG. 53 , the first side surface SS1 can extend from a left side of the upper surface PS. The first side surface SS1 can be curved with respect to a first bending line BL1. The first bending line BL1 can be a boundary between the upper surface PS and the first side surface SS1. The first side surface SS1 can be a left side surface of the display panel 300.

[0473] The second side surface SS2 of the display panel 300 can extend from a second side of the upper surface PS. For example, as shown in FIG. 52 and FIG. 53 , the second side surface SS2 can extend from a lower side of the upper surface PS. The second side surface SS2 can be curved with respect to a second bending line BL2. The second bending line BL2 can be a boundary between the upper surface PS and the second side surface SS2. The second side surface SS2 can be a lower side surface of the display panel 300.

[0474] The third side surface SS3 of the display panel 300 can extend from a third side of the upper surface PS. For example, as shown in FIG. 52 and FIG. 53 , the third side surface SS3 can extend from an upper side of the upper surface PS. The third side surface SS3 can be curved with respect to a third bending line BL3. The third bending line BL3 can be a boundary between the upper surface PS and the third side surface SS3. The third side surface SS3 can be an upper side surface of the display panel 300.

[0475] The fourth side surface SS4 of the display panel 300 can extend from a fourth side of the upper surface PS. For example, as shown in FIG. 52 and FIG. 53 , the fourth side surface SS4 can extend from a right side of the upper surface PS. The fourth side surface SS4 can be curved with respect to a fourth bending line BL4. The fourth bending line BL4 can be a boundary between the upper surface PS and the fourth side surface SS4. The fourth side surface SS4 can be a right side surface of the display panel 300.

[0476] The first corner portion CS1 of the display panel 300 can extend from a first corner where the first side and the second side of the upper surface PS meet. The first corner portion CS1 can be positioned or disposed between the first side surface SS1 and the second side surface SS2.

[0477] The second corner portion CS2 of the display panel 300 can extend from a second corner where the first side and the third side of the upper surface PS meet. The second corner portion CS2 can be positioned or disposed between the first side surface SS1 and the third side surface SS3.

[0478] The third corner portion CS3 of the display panel 300 can extend from a third corner where the second side and the fourth side of the upper surface PS meet. The third corner portion CS3 can be positioned or disposed between the second side surface SS2 and the fourth side surface SS4.

[0479] The fourth corner portion CS4 of the display panel 300 can extend from a fourth corner where the third side and the fourth side of the upper surface PS meet. The fourth corner portion CS4 can be positioned or disposed between the third side surface SS3 and the fourth side surface SS4.

[0480] The pad area PDA of the display panel 300 can extend from one side of the second side surface SS2. For example, the pad area PDA can extend from the lower side of the second side surface SS2. The pad area PDA of the display panel 300 can be bent with respect to the fifth bending line BL5. The fifth bending line BL5 can be a boundary between the second side surface SS2 and the pad area PDA. The pad area PDA of the display panel 300 can be bent with respect to the fifth bending line BL5 to face the upper surface PS of the display panel 300.

[0481] The upper surface PS, the first side surface SS1, the second side surface SS2, the third side surface SS3, and the fourth side surface SS4 of the display panel 300 can be display areas in which images can be displayed. For example, the upper surface PS of the display panel 300 can be a main display area for displaying a main image, and the first side surface SS1, the second side surface SS2, the third side surface SS3, and the fourth side surface SS4 can be sub display areas for displaying sub images.

[0482] The upper surface PS of the display panel 300 can be superposed on the upper surface PS100 of the cover window 100 in the third direction (Z-axis direction), and can be disposed, for example, under or below the upper surface PS100 of the cover window 100. The first side surface SS1 of the display panel 300 can be superposed on the first side surface SS100 of the cover window 100 in the first direction (X-axis direction), and can be disposed, for example, under or below the first side surface SS100 of the cover window 100. The second side surface SS2 of the display panel 300 can be superposed on the second side surface SS200 of the cover window 100 in the second direction (Y-axis direction), and can be disposed, for example, under or below the second side surface SS200 of the cover window 100. The third side surface SS3 of the display panel 300 can be superposed on the third side surface SS300 of the cover window 100 in the second direction (Y-axis direction), and can be disposed, for example, under or below the third side surface SS300 of the cover window 100. The fourth side surface SS4 of the display panel 300 can be superposed on the fourth side surface SS400 of the cover window 100 in the first direction (X-axis direction), and can be disposed, for example, under or below the fourth side surface SS400 of the cover window 100.

[0483] The first corner portion CS1 of the display panel 300 can be superimposed on the first corner portion CS100 of the cover window 100 in the third direction (Z-axis direction). The second corner portion CS2 of the display panel 300 can be superimposed on the second corner portion CS200 of the cover window 100 in the third direction (Z-axis direction). The third corner portion CS3 of the display panel 300 can be superimposed on the third corner portion CS300 of the cover window 100 in the third direction (Z-axis direction). The fourth corner portion CS4 of the display panel 300 can be superimposed on the fourth corner portion CS400 of the cover window 100 in the third direction (Z-axis direction).

[0484] The sound units SU1, SU2, SU3, and SU4 can be positioned below or beneath the upper surface PS of the display panel 300. The sound units SU1, SU2, SU3, and SU4 can be positioned as follows: FIG. 30 and FIG. 31 The image shows an electrical connection to the sound pad via a sound line. For ease of illustration, in... FIG. 53 The sound line and sound pad are not shown.

[0485] Force sensing units PU1, PU2, PU3, and PU4 can be stacked on the side surfaces SS1, SS2, SS3, and SS4 of the display panel 300, respectively. For example, the first force sensing unit PU1 can be disposed below or under the first side surface SS1 of the display panel 300, and the second force sensing unit PU2 can be disposed below or under the second side surface SS2 of the display panel 300. The third force sensing unit PU3 can be disposed below or under the third side surface SS3 of the display panel 300, and the fourth force sensing unit PU4 can be disposed below or under the fourth side surface SS4 of the display panel 300. Each of the force sensing units PU1, PU2, PU3, and PU4 can be disposed as follows: FIG. 44 The electrical connections shown are for the force drive line and the force sensing line. For ease of illustration, in... FIG. 53 The force drive line and force sensing line are not shown. Additionally, each of the force sensing units PU1, PU2, PU3, and PU4 can be as follows: FIG. 45 and FIG. 46 The diagram shows a formation designed to sense the user's force.

[0486] like FIG. 53 As shown, force sensing units PU1, PU2, PU3, and PU4 can be stacked on the side surfaces SS1, SS2, SS3, and SS4 of the display panel 300, respectively. In this case, as... FIG. 54 As shown, when a user applies force to the first side surface SS100 of the cover window 100 of the display device 10, the display device 10 can sense the user's force through the first force sensing unit PU1 disposed below or beneath the first side surface SS1 of the display panel 300.

[0487] FIG. 55 This is an unfolded view showing the display panel according to an embodiment.

[0488] FIG. 55 The embodiments can be related to FIG. 53 The difference in the embodiments is that the first fingerprint recognition unit FD1 can be stacked with the first side surface SS1 of the display panel 300, and the second fingerprint recognition unit FD2 can be stacked with the fourth side surface SS4 of the display panel 300.

[0489] Reference FIG. 55 The first fingerprint recognition unit FD1 can be disposed below or below the first side surface SS1 of the display panel 300, and the second fingerprint recognition unit FD2 can be disposed below or below the fourth side surface SS4 of the display panel 300.

[0490] Each of the first fingerprint recognition unit FD1 and the second fingerprint recognition unit FD2 can be a fingerprint recognition module that identifies a user's fingerprint by optical scanning or ultrasonic scanning. The first fingerprint recognition unit FD1 can be disposed below or under the first side surface SS1 of the display panel 300, and the second fingerprint recognition unit FD2 can be disposed below or under the fourth side surface SS4 of the display panel 300.

[0491] If each of the first fingerprint recognition unit FD1 and the second fingerprint recognition unit FD2 acquires an image through optical scanning, it may include an optical sensor that receives light reflected from the fingerprint of the finger and converts the light into an electrical signal. The optical sensor may be a complementary metal-oxide-semiconductor (CMOS) image sensor or a charge-coupled device (CCD) image sensor. The fingerprint pattern of the finger can be sensed by the optical sensor when light is reflected by the valleys of the fingerprint and absorbed by the ridges.

[0492] If each of the first fingerprint recognition unit FD1 and the second fingerprint recognition unit FD2 acquires an image via ultrasonic scanning, it may include an ultrasonic transmitter for generating ultrasonic waves and an ultrasonic receiver for receiving ultrasonic waves. The display device 10 can obtain the fingerprint pattern based on the amplitude of the ultrasonic waves reflected from the fingerprint of the finger. A user's fingerprint has valleys and ridges, and the amplitude of the ultrasonic waves can vary depending on whether the ultrasonic waves are reflected from the valleys or ridges of the fingerprint. Therefore, the fingerprint pattern can be obtained based on the amplitude of the reflected ultrasonic waves.

[0493] Although FIG. 55The fingerprint recognition units FD1 and FD2 can be disposed on the first side surface SS1 and the fourth side surface SS4, respectively, in the example shown in FIG. 1, but the positions of the fingerprint recognition units are not limited thereto. The fingerprint recognition units, rather than the first force sensing unit PU1, can be disposed on the second side surface SS2, or the fingerprint recognition units, rather than the second force sensing unit PU2, can be disposed on the third side surface SS3. Alternatively, the fingerprint recognition units can be disposed in the flat portion of the upper surface PS.

[0494] As FIG. 55 indicated in FIG. 1, at least one fingerprint recognition sensor can be superposed with at least one of the side surfaces SS1, SS2, SS3, and SS4 of the display panel 300. In such a case, the display device 10 can recognize the fingerprint of the user through the first fingerprint recognition unit FD1 disposed under or below the first side surface SS1 and the second fingerprint recognition unit FD2 disposed under or below the fourth side surface SS4.

[0495] FIG. 56 is a perspective view showing a display panel according to an embodiment.

[0496] FIG. 56 Embodiments of FIG. 53 may differ from embodiments of in that the fifth sound unit SU5, the sixth sound unit SU6, the seventh sound unit SU7, and the eighth sound unit SU8 can be superposed with the side surfaces SS1, SS2, SS3, and SS4 of the display panel 300, respectively.

[0497] FIG. 56 Referring to FIG. 30 , the fifth sound unit SU5 can be disposed under or below the first side surface SS1 of the display panel 300, and the sixth sound unit SU6 can be disposed under or below the second side surface SS2 of the display panel 300. The seventh sound unit SU7 can be disposed under or below the third side surface SS3 of the display panel 300, and the eighth sound unit SU8 can be disposed under or below the fourth side surface SS4 of the display panel 300. The fifth sound unit SU5, the sixth sound unit SU6, the seventh sound unit SU7, and the eighth sound unit SU8 can be electrically connected to the sound pad through sound wires as shown in FIG. 31 and FIG. 56 . For convenience of explanation, the sound wires and the sound pad are not shown in

[0498] Although the display device 10 is shown as a mobile phone in FIG. 56The fifth sound unit SU5, the sixth sound unit SU6, the seventh sound unit SU7, and the eighth sound unit SU8 can be disposed in side surfaces SS1, SS2, SS3, and SS4 of the display panel 300, respectively, in the example shown in FIG. 10, but the disclosure is not limited thereto. At least one sound unit can be disposed on at least one of the side surfaces SS1, SS2, SS3, and SS4 of the display panel 300.

[0499] As FIG. 56 The fifth sound unit SU5, the sixth sound unit SU6, the seventh sound unit SU7, and the eighth sound unit SU8 can be disposed on side surfaces SS1, SS2, SS3, and SS4 of the display panel 300, respectively, as shown in FIG. 11. As FIG. 57 A user can feel as if sound is output from the upper surface PS100 and the side surfaces SS100, SS200, SS300, and SS400 of the cover window 100 of the display apparatus 10, as shown in FIG. 12. Sound can be output from all or some or a predetermined number of the side surfaces of the cover window 100 of the display apparatus 10.

[0500] FIG. 59 to FIG. 61 is a view showing sound output by a sound unit according to an image displayed by a display apparatus. In FIG. 59 to FIG. 61 In the example shown in FIG. 1, the display apparatus 10 is a television. In FIG. 59 to FIG. 61 In the example shown in FIG. 13, an image is displayed on the display apparatus 10 during an n-th frame period, an n+1-th frame period, and an n+2-th frame period.

[0501] Referring to FIG. 59 to FIG. 61 , the display apparatus 10 can calculate the object OBJ by analyzing digital video data in each of the n-th frame period to the n+2-th frame period. For example, the display apparatus 10 can calculate pixel coordinates of the object OBJ. The display apparatus 10 can select at least one sound unit to be driven to output sound according to the pixel coordinates of the object OBJ in each of the n-th frame period to the n+2-th frame period. For example, as FIG. 59 shown in FIG. 14, in a case where the object OBJ is displayed adjacent to the second sound unit SU2 during the n-th frame period, the second sound unit SU2 can be driven to output sound. Also, in a case where the object OBJ is displayed between the first sound unit SU1 and the second sound unit SU2 during the n+1-th frame period, the first sound unit SU1 and the second sound unit SU2 can be driven to output sound. Also, in a case where the object OBJ is displayed adjacent to the first sound unit SU1 during the n+2-th frame period, the first sound unit SU1 can be driven to output sound.

[0502] As FIG. 59 to FIG. 61As shown in the middle, based on the position of the object calculated from the digital video data, sound can be output by using at least one sound unit that will be driven to output sound. In this way, the user can feel as if the sound is output from the object, and thus can experience a more realistic sound associated with the displayed image.

Claims

1. A display device, the display device comprising a display panel, the display panel comprising: The display layer includes light-emitting elements disposed on a substrate; as well as The sensor electrode layer is disposed on the display layer. The sensor electrode layer includes: a first sound electrode and a second sound electrode; a vibration layer electrically contacting the first sound electrode and the second sound electrode, the vibration layer deforming in response to a first sound driving voltage applied to the first sound electrode and a second sound driving voltage applied to the second sound electrode; and a sensor electrode disposed on the vibration layer, the sensor electrode sensing input. The first acoustic electrode and the second acoustic electrode are located on the same side of the vibrating layer, and One of the sensor electrodes is stacked with one of the first sound electrode and the second sound electrode in the thickness direction of the display panel.

2. The display device according to claim 1, wherein, The first sound electrode and the second sound electrode are disposed on the same layer.

3. The display device according to claim 2, wherein, The first acoustic electrode includes: The first acoustic backbone electrode extends in one direction; and The first sound branch electrode protrudes from the first sound main electrode in another direction, and The second acoustic electrode includes: The second acoustic backbone electrode extends in said one direction; and The second sound branch electrode protrudes from the second sound trunk electrode in the other direction.

4. The display device according to claim 3, wherein, The first sound branch electrode and the second sound branch electrode are arranged alternately in one direction.

5. The display device according to claim 2, wherein, The first acoustic electrode is not stacked with the second acoustic electrode in the thickness direction of the substrate.

6. The display device according to claim 2, wherein, The vibration layer is disposed on the first sound electrode and the second sound electrode.

7. The display device according to claim 6, wherein, The sensor electrodes include: Sensing electrodes, arranged along a first direction; and The driving electrodes are arranged along the second direction, and The sensor electrode layer further includes a first connecting electrode, which is electrically connected to an adjacent driving electrode in the second direction.

8. The display device according to claim 7, wherein, The vibration layer is disposed on the first connecting electrode.

9. The display device according to claim 8, wherein, Each of the adjacent driving electrodes in the second direction is electrically connected to the first connecting electrode through a first contact hole penetrating the vibration layer.

10. The display device according to claim 7, wherein, The sensor electrode layer also includes a first sensor insulating layer disposed on the first connecting electrode.

11. The display device according to claim 10, wherein, Each of the adjacent driving electrodes in the second direction is electrically connected to the first connecting electrode through a first contact hole that penetrates the first sensor insulation layer.

12. The display device according to claim 2, wherein, The first sound electrode and the second sound electrode are disposed on the vibrating layer.

13. The display device according to claim 12, wherein, The sensor electrodes are disposed on the first sound electrode and the second sound electrode.

14. The display device according to claim 12, wherein, The sensor electrodes include: Sensing electrodes, arranged along a first direction; and The driving electrodes are arranged along the second direction, and The sensor electrode layer further includes a first connecting electrode, which is electrically connected to an adjacent driving electrode in the second direction.

15. The display device according to claim 14, wherein, The first connecting electrode is disposed on the vibration layer.

16. The display device according to claim 15, wherein, The sensor electrode layer also includes a first sensor insulating layer disposed on the first connecting electrode.

17. The display device according to claim 16, wherein, Each of the adjacent driving electrodes in the second direction is electrically connected to the first connecting electrode through a first contact hole that penetrates the first sensor insulation layer.

18. The display device according to claim 16, wherein, The driving electrode and the sensing electrode are disposed on the insulating layer of the first sensor.

19. The display device according to claim 1, wherein, The sensor electrode layer is directly disposed on the display layer, and the sensor electrode is directly disposed on the vibration layer.

20. A display device, the display device comprising a display panel, the display panel comprising: The display layer includes light-emitting elements disposed on a substrate; as well as The sensor electrode layer is disposed on the display layer. The sensor electrode layer includes: a first sound electrode and a second sound electrode; a vibration layer electrically contacting the first sound electrode and the second sound electrode, the vibration layer deforming in response to a first sound driving voltage applied to the first sound electrode and a second sound driving voltage applied to the second sound electrode; and a sensor electrode disposed on the vibration layer, the sensor electrode sensing input. The first acoustic electrode is disposed on the vibrating layer. The vibration layer is disposed on the second acoustic electrode. The sensor electrode includes: a sensing electrode arranged along a first direction; and a driving electrode arranged along a second direction. The sensor electrode layer further includes a first connecting electrode electrically connected to an adjacent driving electrode in the second direction. The vibration layer is disposed on the first connecting electrode, and Each of the adjacent driving electrodes in the second direction is electrically connected to the first connecting electrode through a first contact hole penetrating the vibration layer.

21. The display device according to claim 20, wherein, The first acoustic electrode is stacked on top of the second acoustic electrode in the thickness direction of the substrate.

22. The display device according to claim 20, wherein, The first connecting electrode and the second sound electrode are disposed on the same layer.

23. A display device, the display device comprising a display panel, the display panel comprising: The display layer includes light-emitting elements disposed on a substrate; as well as The sensor electrode layer is disposed on the display layer. The sensor electrode layer includes: a first sound electrode and a second sound electrode; a vibration layer electrically contacting the first sound electrode and the second sound electrode, the vibration layer deforming in response to a first sound driving voltage applied to the first sound electrode and a second sound driving voltage applied to the second sound electrode; and a sensor electrode disposed on the vibration layer, the sensor electrode sensing input. The first acoustic electrode is disposed on the vibrating layer. The vibration layer is disposed on the second acoustic electrode. The sensor electrode includes: a sensing electrode arranged along a first direction; and a driving electrode arranged along a second direction. The sensor electrode layer further includes a first connecting electrode electrically connected to an adjacent driving electrode in the second direction. The sensor electrode layer further includes a first sensor insulating layer disposed on the first connecting electrode, and Each of the adjacent driving electrodes in the second direction is electrically connected to the first connecting electrode through a first contact hole that penetrates the first sensor insulation layer.

24. The display device according to claim 23, wherein, The first acoustic electrode is stacked on top of the second acoustic electrode in the thickness direction of the substrate.

25. The display device according to claim 23, wherein, The first connecting electrode and the second sound electrode are disposed on the same layer.

26. The display device according to claim 20 or 23, wherein, The sensor electrode layer is directly disposed on the display layer, and the sensor electrode is directly disposed on the vibration layer.

27. A display device, the display device comprising a display panel, the display panel comprising: The display layer includes light-emitting elements disposed on the surface of the substrate; as well as A sound electrode layer, including sound units, is disposed on opposite surfaces of the substrate, wherein, Each of the sound units includes: a first sound electrode; a second sound electrode disposed on the first sound electrode; and a first vibration layer disposed between the first sound electrode and the second sound electrode, the first vibration layer deforming in response to a first sound driving voltage applied to the first sound electrode and a second sound driving voltage applied to the second sound electrode. The first sound electrodes of the sound units arranged along the first direction are electrically connected to each other, while the first sound electrodes of the sound units arranged along the second direction are not electrically connected to each other. The second sound electrodes of the sound units arranged along the second direction are electrically connected to each other, while the second sound electrodes of the sound units arranged along the first direction are not electrically connected to each other.

28. The display device according to claim 27, wherein, The acoustic electrode layer further includes: A first sound line is disposed between first sound electrodes of adjacent sound units along the first direction; and The second sound line is disposed between the second sound electrodes of the sound units that are adjacent to each other along the second direction.

29. The display device according to claim 27, wherein, The display panel also includes a light-shielding layer disposed between the opposing surface of the substrate and the acoustic electrode layer.

30. The display device according to claim 27, wherein, The display panel also includes a bottom panel cover disposed on the sound electrode layer. The bottom panel cover includes a cushioning element to absorb external impacts applied to the display panel, and The buffer is not stacked with the sound unit in the thickness direction of the substrate.

31. The display device according to claim 30, wherein, The buffer includes a through hole, and the sound unit is disposed in the through hole.

32. The display device according to claim 31, wherein, The bottom panel cover also includes a heat dissipation component disposed on the buffer.

33. The display device according to claim 27, wherein, The sound electrode layer also includes vibration units spaced apart from the sound unit, and Each of the vibration units includes: First vibrating electrode; A second vibration electrode is disposed on the first vibration electrode; and A second vibration layer is disposed between the first vibration electrode and the second vibration electrode, and the second vibration layer deforms in response to a first vibration driving voltage applied to the first vibration electrode and a second vibration driving voltage applied to the second vibration electrode.

34. The display device according to claim 33, wherein, The sound unit is adjacent to the vibration unit.

35. The display device according to claim 34, wherein, Each of the sound units includes: The first sub-sound unit is disposed adjacent to the first side surface and the second side surface of the vibration unit; The second sub-sound unit is disposed adjacent to the first side surface and the third side surface of the vibration unit; A third sub-sound unit is disposed adjacent to the second and fourth side surfaces of the vibration unit; and A fourth sub-sound unit is disposed adjacent to the third and fourth side surfaces of the vibration unit.

36. The display device according to claim 35, wherein, The first sound electrode of the first sub-sound unit is electrically connected to the first sound electrode of the second sub-sound unit. The first sound electrode of the third sub-sound unit is electrically connected to the first sound electrode of the fourth sub-sound unit. The first sound electrode of the first sub-sound unit is spaced apart from the first sound electrode of the third sub-sound unit, and The first sound electrode of the second sub-sound unit is spaced apart from the first sound electrode of the fourth sub-sound unit.

37. The display device according to claim 35, wherein, The second sound electrode of the first sub-sound unit is electrically connected to the second sound electrode of the third sub-sound unit. The second sound electrode of the second sub-sound unit is electrically connected to the second sound electrode of the fourth sub-sound unit. The second sound electrode of the first sub-sound unit is spaced apart from the second sound electrode of the second sub-sound unit, and The second sound electrode of the third sub-sound unit is spaced apart from the second sound electrode of the fourth sub-sound unit.

38. The display device according to claim 35, wherein, The acoustic electrode layer further includes: The first sub-sound connection line is electrically connected to the first sound electrode of the first sub-sound unit and the first sound electrode of the second sub-sound unit; The second sub-sound connection line is electrically connected to the first sound electrode of the third sub-sound unit and the first sound electrode of the fourth sub-sound unit; The third sub-sound connection line is electrically connected to the second sound electrode of the first sub-sound unit and the second sound electrode of the third sub-sound unit; and The fourth sub-sound connection line is electrically connected to the second sound electrode of the second sub-sound unit and the second sound electrode of the fourth sub-sound unit.

39. The display device according to claim 38, wherein, The acoustic electrode layer further includes: A first vibration line is electrically connected to the first vibration electrode of a vibration unit adjacent to each other in the first direction; and The second vibration line is electrically connected to the second vibration electrode of the vibration unit that is adjacent to each other in the second direction.

40. The display device according to claim 39, wherein, The first vibration line is disposed between the first sub-sound connection line and the second sub-sound connection line, and The second vibration line is disposed between the third sub-sound connection line and the fourth sub-sound connection line.

41. The display device according to claim 39, wherein, The first vibration line is disposed between the first sub-sound unit and the third sub-sound unit, and between the second sub-sound unit and the fourth sub-sound unit. The second vibration line is disposed between the first sub-sound unit and the second sub-sound unit, and between the third sub-sound unit and the fourth sub-sound unit.

42. The display device according to claim 27, wherein, The sound electrode layer also includes shielding units spaced apart from the sound unit, and The shielding unit includes: First shielding electrode; A second shielding electrode is stacked on top of the first shielding electrode in the thickness direction of the substrate; and A third vibration layer is disposed between the first shielding electrode and the second shielding electrode, and the third vibration layer deforms in response to a first shielding driving voltage applied to the first shielding electrode and a second shielding driving voltage applied to the second shielding electrode.

43. The display device according to claim 42, wherein, The first sound driving voltage applied to the first sound electrode of the sound unit adjacent to the shielding unit is equal to the second shielding driving voltage applied to the second shielding electrode of the shielding unit, and The second sound driving voltage applied to the second sound electrode of the sound unit adjacent to the shielding unit is equal to the first shielding driving voltage applied to the first shielding electrode of the shielding unit.

44. The display device according to claim 42, wherein, The second shielding electrode is electrically connected to at least one of the first sound electrodes, and The first shielding electrode is electrically connected to at least one of the second sound electrodes.

45. The display device according to claim 27, wherein, The sound electrode layer also includes a force sensing unit spaced apart from the sound unit, and Each of the force sensing units includes: Force-driven electrodes; Force sensing electrodes, spaced apart from the force driving electrodes; and A force-sensing layer is disposed on the force-driving electrode and the force-sensing electrode, and has a variable resistance in response to a force applied to the force-sensing layer.

46. ​​The display device according to claim 45, wherein, The force-driven electrode, the force-sensing electrode, and the first sound electrode are made of the same material.

47. The display device according to claim 45, wherein, Each of the force sensing units further includes a bump disposed on the force sensing layer.

48. The display device according to claim 47, wherein, The bump and the second acoustic electrode are made of the same material.

49. The display device according to claim 30, wherein, The sound electrode layer also includes a fixed magnet disposed on the second sound electrode, and The bottom panel cover also includes a planar coil, which is stacked with the fixed magnet in the thickness direction of the substrate and disposed on the buffer.

50. The display device according to claim 49, wherein, Current flows through the planar coil to generate the magnetic field of the fixed magnet and the magnetic field of the planar coil. The current flows from one end of the planar coil to the other end of the planar coil to generate an attractive force between the stationary magnet and the planar coil, and The current flows from the other end of the planar coil to the first end of the planar coil to generate a repulsive force between the stationary magnet and the planar coil.

51. The display device according to claim 27, wherein, The sound electrode layer also includes a vibration unit for providing tactile feedback to the user, the vibration unit being spaced apart from the sound unit.

52. A display device, the display device comprising a display panel and a sensor unit, The display panel includes: The substrate includes an upper surface and side surfaces extending from an edge of the upper surface; The display layer includes light-emitting elements disposed on the surface of the substrate in the upper surface and the side surface; as well as A sound electrode layer, including sound units, is disposed on the opposing surface of the substrate; The sensor unit is disposed on the opposite surface of the substrate in the side surface. The sound unit includes: a first sound electrode; a second sound electrode disposed on the first sound electrode; and a vibration layer disposed between the first sound electrode and the second sound electrode, the vibration layer deforming in response to a first sound driving voltage applied to the first sound electrode and a second sound driving voltage applied to the second sound electrode. The sound electrode layer further includes a second sound unit disposed on the opposite surface of the substrate in the side surface of the substrate.

53. The display device according to claim 52, wherein, The sensor unit is a fingerprint sensor unit that emits ultrasonic waves or light and detects ultrasonic waves or light reflected by the fingerprint.

54. The display device according to claim 52, wherein, The sensor unit is a force sensing unit, and the force sensing unit includes: Force-driven electrodes; Force sensing electrodes, spaced apart from the force driving electrodes; and A force-sensing layer is disposed on the force-driving electrode and the force-sensing electrode, and has a variable resistance in response to a force applied to the force-sensing layer.

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