Method of manufacturing a display module

Abstract

A method of manufacturing a display module according to an embodiment of the present application can include a step of arranging a display panel on a stage including a first magnet having a first pole; a step of arranging an adhesive member including a plurality of conductive particles on the display panel; a step of arranging a circuit portion on the adhesive member; a step of arranging a head portion including a second magnet having a second pole different from the first pole on the circuit portion; a step of aligning the plurality of conductive particles using the first magnet and the second magnet; and a step of electrically connecting the display panel and the circuit portion.

Description

Technical Field

[0001] This invention relates to an apparatus and a method for manufacturing display modules to improve reliability. Background Technology

[0002] The display module includes a display panel for displaying images and a circuit section. The display panel may include multiple gate lines, multiple data lines, and multiple pixels connected to the gate lines and data lines. The display panel can be connected to the circuit section, which provides the electrical signals required for displaying the image to the gate lines or data lines. The circuit section and the display panel can be electrically connected to each other via an anisotropic conductive film. Alternatively, the circuit section and the display panel can be electrically connected via ultrasonic bonding without using the anisotropic conductive film. Summary of the Invention

[0003] Technical problems to be solved

[0004] The purpose of this invention is to provide an apparatus and a method for manufacturing a display module with improved reliability.

[0005] Solution to the problem

[0006] A method for manufacturing a display module according to an embodiment of the present invention may include: a step of arranging a display panel on a stage, the stage including a first magnet having a first pole; a step of arranging an adhesive member including a plurality of conductive particles on the display panel; a step of arranging a circuit portion on the adhesive member; a step of arranging a head on the circuit portion, the head including a second magnet having a second pole different from the first pole; a step of aligning the plurality of conductive particles using the first magnet and the second magnet; and a step of electrically connecting the display panel and the circuit portion.

[0007] The step of aligning the aforementioned multiple conductive particles may include: forming a magnetic field in the thickness direction of the aforementioned display panel using the aforementioned first magnet and the aforementioned second magnet.

[0008] The step of aligning the plurality of conductive particles may include forming a first region having the first pole and a second region having the second pole on each of the plurality of conductive particles.

[0009] The step of aligning the aforementioned plurality of conductive particles may further include: aligning the aforementioned first region adjacent to the aforementioned head and aligning the aforementioned second region adjacent to the aforementioned platform.

[0010] The step of aligning the plurality of conductive particles may further include: applying a repulsive force between the plurality of conductive particles.

[0011] On a plane, the aforementioned multiple conductive particles can be spaced apart from each other at a predetermined interval.

[0012] Each of the plurality of conductive particles includes a core and a coating portion, the coating portion covering the core and including a strongly magnetic material, and the step of aligning the plurality of conductive particles may include: magnetizing the coating portion using the first magnet and the second magnet.

[0013] The step of electrically connecting the above-mentioned display panel and the above-mentioned circuit section may include the step of heating and pressurizing the above-mentioned adhesive component using the above-mentioned head.

[0014] The step of aligning the aforementioned multiple conductive particles and the step of electrically connecting the aforementioned display panel and the aforementioned circuit section can be performed simultaneously.

[0015] The steps of arranging the circuit section include: contacting the bottom surface of the circuit section with the adhesive component, wherein the bottom surface is flat, and the circuit section includes an insulating layer and pads electrically connected to the display panel, wherein a portion of the bottom surface may be the pads, and another portion of the bottom surface may be the insulating layer.

[0016] The effects of the invention

[0017] According to the apparatus and method for manufacturing a display module of the present invention, in the process of bonding the display panel and the circuit section, multiple conductive particles within the adhesive component can be aligned. By aligning the conductive particles, the reliability of the electrical connection between the display panel and the circuit section can be improved. Therefore, an apparatus and method for manufacturing a display module with improved reliability can be provided. Attached Figure Description

[0018] Figure 1 This is a perspective view of a display panel according to an embodiment of the present invention.

[0019] Figure 2 This is a plan view of a display module according to an embodiment of the present invention.

[0020] Figure 3 This is a flowchart illustrating a method for manufacturing a display module according to an embodiment of the present invention.

[0021] Figure 4 This is a perspective view of an apparatus for manufacturing a display module according to an embodiment of the present invention.

[0022] Figure 5 According to an embodiment of the present invention, along with Figure 4 The cross-sectional view of the plane corresponding to I-I'.

[0023] Figure 6 According to an embodiment of the present invention, along with Figure 4 The cross-sectional view of the plane corresponding to II-II'.

[0024] Figure 7 According to an embodiment of the present invention, along with Figure 4 The cross-sectional view of the plane corresponding to II-II'.

[0025] Figure 8 According to an embodiment of the present invention, along with Figure 4 The cross-sectional view of the plane corresponding to II-II'.

[0026] Figure 9 According to an embodiment of the present invention, along with Figure 4 The cross-sectional view of the plane corresponding to II-II'. Detailed Implementation

[0027] In this specification, when it is mentioned that a component (or area, layer, part, etc.) is "on", "connected to" or "linked to" another component, it means that it can be directly arranged / connected / linked to the other component, or that a third component can be arranged between them.

[0028] The same reference numerals refer to the same constituent elements. Furthermore, in the accompanying drawings, the thickness, proportions, and dimensions of the constituent elements are exaggerated for the purpose of effectively describing the technical content.

[0029] "And / or" includes all of the more than one combination that can be defined by the relevant components.

[0030] While terms such as "first," "second," etc., may be used to describe various constituent elements, these constituent elements should not be limited by such terms. The terms are used only to distinguish one constituent element from another. For example, without departing from the scope of the invention, a first constituent element may be referred to as a second constituent element, and similarly, a second constituent element may be referred to as a first constituent element. Unless the context clearly indicates otherwise, the singular expression also includes the plural expression.

[0031] In addition, terms such as "below," "lower side," "upper," and "upper side" are used to describe the relationships between the components shown in the diagram. These terms are relative concepts and are described based on the directions indicated in the diagram.

[0032] Unless otherwise defined, all terms used in this specification (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Furthermore, terms, such as those defined in commonly used dictionaries, shall be interpreted as having the meaning consistent with their meaning in the context of the relevant art and shall not be interpreted in an idealized or overly formalized sense unless expressly defined herein.

[0033] It should be understood that terms such as "including" or "having" specify the presence of features, figures, steps, operations, constituent elements, components or combinations thereof described in the specification, but do not preclude the possibility of the presence or addition of one or more other features or figures, steps, operations, constituent elements, components or combinations thereof.

[0034] In the following description, embodiments of the invention will be described with reference to the accompanying drawings.

[0035] Figure 1 This is a perspective view of a display panel according to an embodiment of the present invention.

[0036] refer to Figure 1 The display panel DP can display the image IM through the display surface IS. The display surface IS can be parallel to the surface defined by the first direction DR1 and the second direction DR2. The normal direction of the display surface IS (i.e., the thickness direction of the display panel DP) can be the third direction DR3. The third direction DR3 can be the direction that intersects with the first direction DR1 and the second direction DR2. The first direction DR1, the second direction DR2 and the third direction DR3 can be orthogonal to each other.

[0037] Furthermore, the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 are relative concepts and can be converted to other directions. Additionally, in this specification, the surfaces defined by the first direction DR1 and the second direction DR2 are defined as planes, and "observing on a plane" can be defined as observing on the third direction DR3.

[0038] In one embodiment of the present invention, a display panel DP having a planar display surface IS is shown, but it is not limited thereto. A display panel DP according to an embodiment of the present invention may include a curved display surface.

[0039] The display panel (DP) can be a rigid display panel. However, it is not limited thereto, and the display panel (DP) according to an embodiment of the present invention can include a flexible display panel (DP). In this embodiment, a display panel (DP) applicable to a mobile phone terminal is illustrated by way of example, but it is not limited thereto. The display panel (DP) according to an embodiment of the present invention can be applied to large display panels such as televisions and monitors, as well as small and medium-sized display panels such as tablet computers, car navigation systems, game consoles, and smartwatches.

[0040] The display surface IS may include a display area DA for displaying the image IM and a non-display area NDA adjacent to the display area DA. The non-display area NDA may be an area where the image IM is not displayed. Figure 1 The image shows an icon and a clock window as an example of an image IM.

[0041] The non-display area NDA can surround the display area DA. However, it is not limited to this, and the shape of the display area DA and the non-display area NDA can be designed relative to each other.

[0042] Figure 2 This is a plan view of a display module according to an embodiment of the present invention.

[0043] refer to Figure 2 The display module DM may include a display panel DP and a circuit section CP.

[0044] A display panel DP according to an embodiment of the present invention may include a light-receiving display panel or a light-emitting display panel. For example, the light-receiving display panel may be a liquid crystal display panel. The light-emitting display panel may be an organic light-emitting display panel or a quantum dot light-emitting display panel. The light-emitting layer of an organic light-emitting display panel may include an organic light-emitting material. The light-emitting layer of a quantum dot light-emitting display panel may include quantum dots and quantum rods, etc. Hereinafter, the display panel DP will be described as an organic light-emitting display panel.

[0045] The display panel DP may include scan drive circuitry DCV, signal lines SGL, and pixels PX. The area where pixels PX are arranged can be defined as the display area DA.

[0046] The scan drive circuit DCV can be arranged in the non-display area NDA. The scan drive circuit DCV can generate control signals. The scan drive circuit DCV can sequentially output these control signals to the gate line GL. The scan drive circuit DCV can also output another control signal to the drive circuit of pixel PX.

[0047] The scan drive circuit DCV may include thin-film transistors formed using the same process as the drive circuit of the pixel PX. For example, the aforementioned process may include LTPS (low-temperature polycrystalline silicon) or LTPO (low-temperature polycrystalline oxide) processes.

[0048] The signal lines SGL may include conductive materials. For example, each of the signal lines SGL may be formed of a conductive material such as gold (Au), silver (Ag), aluminum (Al), or copper (Cu). However, this is exemplary, and the signal lines SGL according to an embodiment of the present invention are not limited thereto, and may be formed of one of various conductive materials used in manufacturing the display module DM.

[0049] The signal line SGL may include the data line DL, the power line PL, the control signal line CSL, the gate line GL, and the light emission control line LCL.

[0050] Data lines DL can be connected to the corresponding pixels PX within pixels PX. Each pixel PX can be connected to the corresponding data line in data lines DL.

[0051] The power supply line PL can be connected to the pixel PX. The control signal line CSL can provide the aforementioned control signals to the scan drive circuit DCV.

[0052] Gate lines GL can extend along the second direction DR2. Gate lines GL can be connected to corresponding pixels PX in the pixel PX. Gate lines GL can be connected to the scan drive circuit DCV.

[0053] The light emission control line LCL can extend along the second direction DR2. The light emission control line LCL can be connected to the corresponding pixel PX in the pixel PX. The light emission control line LCL can be connected to the scan drive circuit DCV.

[0054] Some of the data lines DL, power lines PL, control signal lines CSL, gate lines GL, and light emission control lines LCL can be arranged on the same layer, while others can be arranged on other layers.

[0055] The circuit section CP may include a circuit film FP and a driving element IC. The circuit section CP may be referred to as a flexible circuit film or chip-on-film. However, this is exemplary, and according to an embodiment of the present invention, the circuit section CP can be configured in the form of an integrated circuit chip for direct mounting on a display panel DP.

[0056] The circuit film FP can be electrically connected to the display panel DP. For example, the circuit film FP can be electrically connected to the display circuit layer DP-CL, which includes signal lines SGL (see reference). Figure 5 ).

[0057] A driving element IC can be arranged on a circuit film FP. The driving element IC can output image signals and drive signals required for displaying the image. The driving element IC can be electrically connected to a conductive pattern in a region of the circuit film FP. The image signals and drive signals output from the driving element IC can be transmitted to the display panel DP through the circuit film FP. Simultaneously, in Figure 2 The circuit film FP shown discloses a driving element IC, but is not limited thereto. Multiple driving elements required for displaying images can be arranged on the circuit film FP.

[0058] Figure 3 This is a flowchart illustrating a method for manufacturing a display module according to an embodiment of the present invention. Figure 4 This is a perspective view of an apparatus for manufacturing a display module according to an embodiment of the present invention, and Figure 5 According to an embodiment of the present invention, along with Figure 4 The cross-sectional view of the plane corresponding to I-I'.

[0059] refer to Figures 3 to 5 The apparatus DMA for manufacturing display modules may include a stage ST and a head HD.

[0060] A display panel DP (S100) can be arranged on a stage ST. According to an embodiment of the present invention, the display panel DP can be vacuum-adsorbed onto the stage ST.

[0061] The display panel (DP) can include a base layer (SUB), a display circuit layer (DP-CL), an image realization layer (DP-OLED), and a thin-film encapsulation layer (TFE).

[0062] The base substrate SUB can be mounted on a substrate ST. The base substrate SUB can be a plastic substrate, a glass substrate, an insulating film, or a laminated structure including multiple insulating layers.

[0063] The display circuit layer DP-CL can be disposed on the base layer SUB. The display circuit layer DP-CL may include multiple insulating layers, multiple conductive layers, and semiconductor layers. The multiple conductive layers of the display circuit layer DP-CL can form signal lines SGL (see reference). Figure 2 (or pixel control circuit)

[0064] The image implementation layer DP-OLED can be arranged on the display circuit layer DP-CL. The image implementation layer DP-OLED can include organic light-emitting diodes. The image implementation layer DP-OLED can define a display area DA.

[0065] The thin-film encapsulation layer (TFE) can cover the image realization layer of a DP-OLED. The TFE can include at least one insulating layer. For example, the TFE can include at least one encapsulating inorganic film. Alternatively, the TFE can include at least one encapsulating organic film and at least one encapsulating inorganic film. The TFE can be a single encapsulation layer or multiple thin films.

[0066] In one embodiment of the present invention, the thin-film encapsulation layer (TFE) can be omitted, and the thin-film encapsulation substrate can be disposed on the image realization layer (DP-OLED). The thin-film encapsulation substrate and the display circuit layer (DP-CL) can be connected by a connecting component. The connecting component may include organic materials such as photocurable resins or photoplastic resins, or inorganic materials such as frit seals.

[0067] An adhesive component ACF (S200) can be arranged on the display panel DP. A circuit section CP (S300) can be arranged on the adhesive component ACF. The adhesive component ACF can be arranged between the display panel DP and the circuit section CP.

[0068] The adhesive component ACF can be disposed in the non-display area NDA. The adhesive component ACF can be disposed on the display circuit layer DP-CL. The adhesive component ACF can electrically connect the display circuit layer DP-CL and the circuit section CP.

[0069] The head HD can be disposed on the circuit section CP. According to an embodiment of the present invention, the head HD can vacuum-adhere the circuit section CP. The head HD can apply pressure to the circuit section CP on the third-party DR3.

[0070] The step of electrically connecting the display panel DP and the circuit section CP (S600) may include heating and pressurizing the adhesive component ACF using the head HD. For example, the head HD may be heated to 220°C while pressurizing the circuit section CP for 5 seconds, thereby electrically connecting the display panel DP and the circuit section CP. However, this is exemplary, and the temperature and time are not limited to the above example. For example, according to an embodiment of the present invention, the head HD may be heated to 150°C while pressurizing the circuit section CP for 7 seconds, thereby electrically connecting the display panel DP and the circuit section CP.

[0071] Multiple conductive particles CB (reference) Figure 6 The alignment step (S500) and the step of electrically connecting the display panel DP and the circuit section CP (S600) can be performed simultaneously.

[0072] According to the present invention, the resin layer AF-BS of the adhesive component ACF (reference) is heated by the head HD. Figure 6 It can have fluidity, and the resin layer AF-BS (reference) Figure 6 Conductive particles CB (reference) within ) Figure 6 The position of the resin layer AF-BS (reference) can be changed. That is, the DMA apparatus used to manufacture the display module can control the resin layer AF-BS (reference). Figure 6 Multiple conductive particles CB (reference) within ) Figure 6 The position of the display panel DP and the circuit section CP can be aligned with conductive particles CB (reference). Figure 6 Electrical connection. Therefore, an apparatus (DMA) and a method for manufacturing display modules can be provided to improve reliability in manufacturing display modules.

[0073] Figure 6 According to an embodiment of the present invention, along with Figure 4 The cross-sectional view of the plane corresponding to II-II'.

[0074] refer to Figure 3 and Figure 6 The display circuit layer DP-CL may also include display pads DP-PD (see reference). Figure 6 Display pad DP-PD (reference) Figure 6 ) can be respectively connected to signal line SGL (reference) Figure 2 Some electrical connections in ).

[0075] The circuit film FP may include a base film FP-BS, an insulating layer FP-IL, and pads FP-PD. In the circuit section CP (reference) Figure 2 When configured as a chip, the FP-PD pads can be placed on the driver IC (see reference). Figure 2 The protrusion below.

[0076] The insulating layer FP-IL can be disposed below the base film FP-BS. The insulating layer FP-IL can be an inorganic layer and / or an organic layer, and can have a single-layer structure or a multi-layer structure. According to an embodiment of the present invention, the insulating layer FP-IL can be a single-layer silicon oxide layer.

[0077] The pads FP-PD can be individually arranged in the contact holes defined in the insulating layer FP-IL. The thickness TK-PD of each pad FP-PD can be greater than the thickness of the insulating layer FP-IL.

[0078] The stage ST may include a first magnet MG1 having a first pole. The head HD may include a second magnet MG2 having a second pole different from the first pole described above. In a plane, the first magnet MG1 and the second magnet MG2 may overlap.

[0079] The step of aligning the plurality of conductive particles CB (S500) may include: applying a current to each of the first magnet MG1 and the second magnet MG2; forming a magnetic field MF in the thickness direction of the display panel DP; forming a first region AR1 having the first pole and a second region AR2 having the second pole on each of the plurality of conductive particles CB; aligning the first region AR1 adjacent to the head HD and aligning the second region AR2 adjacent to the stage ST; and applying a repulsive force between the conductive particles CB.

[0080] Each of the first magnet MG1 and the second magnet MG2 may include an electromagnet. The strength of the magnetic force of each of the first magnet MG1 and the second magnet MG2 can be determined according to the applied current. However, this is exemplary, and each of the first magnet MG1 and the second magnet MG2 according to an embodiment of the present invention may be a permanent magnet.

[0081] Each of the first magnet MG1 and the second magnet MG2 to which an applied current is applied may have magnetic force. For example, the first pole of the first magnet MG1 may be the S pole, and the second pole of the second magnet MG2 may be the N pole. However, this is exemplary, and according to an embodiment of the present invention, the first pole may be the N pole, and the second pole may be the S pole.

[0082] The first magnet MG1 and the second magnet MG2 can form a magnetic field MF in the thickness direction of the display panel DP. The direction of the magnetic field MF can be parallel to the third direction DR3. According to an embodiment of the present invention, the magnetic field MF can be formed in the direction from the second magnet MG2 to the first magnet MG1. However, this is exemplary, and the direction of the magnetic field MF according to an embodiment of the present invention can be changed according to the first pole of the first magnet MG1 and the second pole of the second magnet MG2.

[0083] The adhesive component ACF may include a resin layer AF-BS and multiple conductive particles CB. The adhesive component ACF may include an anisotropic conductive film. The adhesive component ACF can electrically connect the display panel DP and the circuit film FP. The resin layer AF-BS may include an adhesive resin.

[0084] Each of the plurality of conductive particles CB may include a core CR and a coating CT. The core CR may include a spherical polymer. The coating CT may cover the core CR. The coating CT may include a strongly magnetic material. For example, the coating CT may be nickel. However, this is exemplary, and the coating CT according to an embodiment of the present invention may be one of a variety of strongly magnetic materials.

[0085] The step of aligning the multiple conductive particles CB (S500) may further include the step of magnetizing the coating portion CT. The coating portion CT can be magnetized into the first pole and the second pole described above by a magnetic field MF.

[0086] Each of the multiple magnetized conductive particles CB may include a first region AR1 and a second region AR2. The first region AR1 may have the aforementioned first pole through a magnetic field MF. The second region AR2 may have the aforementioned second pole through a magnetic field MF.

[0087] The first region AR1 can be aligned adjacent to the head HD. The first region AR1 can have a different polarity than the head HD. For example, the first region AR1 can have an S pole. An attraction can be formed between the first region AR1 and the first magnet MG1.

[0088] The second region AR2 can be aligned adjacent to the stage ST. The second region AR2 can have a different polarity than the stage ST. For example, the second region AR2 can have an N pole. An attraction can be formed between the second region AR2 and the second magnet MG2.

[0089] The first region AR1 of a conductive particle CB can have the same polarity as the first region AR1 of an adjacent conductive particle CB. Repulsive forces can act between the first regions AR1 of the conductive particles CB.

[0090] The second region AR2 of a conductive particle CB can have the same polarity as the second region AR2 of an adjacent conductive particle CB. Repulsive forces can act between the second regions AR2 of the conductive particles CB.

[0091] Repulsive forces can act between multiple conductive particles CB. The conductive particles CB can be spaced apart from each other at a specified interval CBD.

[0092] According to the present invention, repulsive force can be applied between multiple conductive particles CB by means of a first magnet MG1 and a second magnet MG2. Through this repulsive force, the multiple conductive particles CB can be uniformly distributed at a predetermined interval CBD. The probability of arranging at least one conductive particle CB between display pads DP-PD and FP-PD can be increased. The probability of electrical connection failure between some of the display pads DP-PD and their corresponding counterparts in the FP-PD can be reduced. Therefore, an apparatus DMA (referencing) for manufacturing display modules with improved reliability can be provided. Figure 4 ) and methods for manufacturing display modules.

[0093] Furthermore, according to the present invention, a repulsive force can be generated between a plurality of conductive particles CB by means of a first magnet MG1 and a second magnet MG2. Through this repulsive force, the plurality of conductive particles CB can be arranged at a predetermined interval CBD. This prevents the aggregation of conductive particles CB. It also prevents electrical connections between a pad FP-PD and adjacent pads. Therefore, an apparatus DMA (referencing) for manufacturing display modules with improved reliability can be provided. Figure 4 ) and methods for manufacturing display modules.

[0094] Even when arranged in the display panel DP and circuit section CP (reference) Figure 5 The arrangement of the multiple conductive particles CB included in the adhesive component ACF between the components is irregular. According to an embodiment of the present invention, the apparatus DMA for manufacturing a display module (refer to...) Figure 4 Alternatively, the process can be achieved by aligning multiple conductive particles CB (S500) and displaying the display panel DP and circuit section CP (see reference). Figure 5 The step of electrical connection (S600) is used to align the multiple conductive particles CB.

[0095] Apparatus for manufacturing a display module according to the present invention (DMA) Figure 4 The method for manufacturing the display module, including pasting the display panel DP and the circuit section CP (see reference). Figure 5 In the process of bonding components (ACF), multiple conductive particles (CB) within the ACF can be aligned. By aligning the conductive particles (CB), the display panel (DP) and the circuit section (CP) are aligned. Figure 5 The reliability of the electrical connection state of the display module can be improved. Therefore, a device DMA (reference) for manufacturing display modules can provide improved reliability. Figure 4 ) and methods for manufacturing display modules.

[0096] Figure 7 According to an embodiment of the present invention, along with Figure 4 The cross-sectional view taken from the plane corresponding to II-II'. In the description Figure 7 At that time, for those who passed Figure 6 The constituent elements described are labeled together with the same reference numerals, and their descriptions are omitted.

[0097] refer to Figure 3 and Figure 7 The stage ST may include first magnets MG1-1, MG1-2, MG1-3 and MG1-4. The first magnets MG1-1, MG1-2, MG1-3 and MG1-4 may be spaced apart from each other in the second direction DR2.

[0098] The head HD may include second magnets MG2-1, MG2-2, MG2-3, and MG2-4. The second magnets MG2-1, MG2-2, MG2-3, and MG2-4 may be spaced apart from each other in the second direction DR2.

[0099] On the plane, the first magnets MG1-1, MG1-2, MG1-3 and MG1-4 can overlap with the second magnets MG2-1, MG2-2, MG2-3 and MG2-4 respectively.

[0100] The step of arranging the display panel DP (S100) may include: aligning the display pads DP-PD such that the display pads DP-PD overlap with the first magnets MG1-1, MG1-2, MG1-3, and MG1-4 respectively on the plane. The step of arranging the head HD (S400) may include: aligning the pads FP-PD such that the pads FP-PD overlap with the second magnets MG2-1, MG2-2, MG2-3, and MG2-4 respectively on the plane.

[0101] On the plane, each of the first magnets MG1-1, MG1-2, MG1-3 and MG1-4, the display pads DP-PD and FP-PD, and the second magnets MG2-1, MG2-2, MG2-3 and MG2-4 can be overlapped in a one-to-one correspondence.

[0102] The first magnets MG1-1, MG1-2, MG1-3 and MG1-4, and the second magnets MG2-1, MG2-2, MG2-3 and MG2-4 can form a magnetic field MF-1.

[0103] The first region AR1 can have a first pole through the magnetic field MF-1. The second region AR2 can have a second pole that is different from the first pole mentioned above through the magnetic field MF-1.

[0104] An attractive force can be formed between the first region AR1 and the first magnets MG1-1, MG1-2, MG1-3, and MG1-4. An attractive force can also be formed between the second region AR2 and the second magnets MG2-1, MG2-2, MG2-3, and MG2-4. On a plane, multiple conductive particles CB can be arranged adjacent to the first magnets MG1-1, MG1-2, MG1-3, and MG1-4, and the second magnets MG2-1, MG2-2, MG2-3, and MG2-4.

[0105] The adhesive component ACF may include a first film region FA1 and a second film region FA2, wherein the first film region FA1 overlaps with each of the first magnets MG1-1, MG1-2, MG1-3 and MG1-4, and the second film region FA2 is adjacent to the first film region FA1.

[0106] The first number of conductive particles CB overlapping each in the first membrane region FA1 can be greater than the second number of conductive particles CB overlapping each in the second membrane region FA2.

[0107] The repulsive force can act between the first region AR1 of the conductive particles CB. The repulsive force can also act between the second region AR2 of the conductive particles CB.

[0108] Conductive particles CB overlapping the first membrane region FA1 on the plane can be separated from each other by a first interval CBD-1 through the repulsive force between the conductive particles CB. Conductive particles CB overlapping the second membrane region FA2 on the plane can be separated from each other by a second interval CBD-2 through the attractive force between the conductive particles CB and the first magnets MG1-1, MG1-2, MG1-3, and MG1-4, and the second magnets MG2-1, MG2-2, MG2-3, and MG2-4. The first interval CBD-1 can be narrower than the second interval CBD-2.

[0109] According to the present invention, by utilizing the attractive forces between conductive particles CB and the first magnets MG1-1, MG1-2, MG1-3, and MG1-4, and the second magnets MG2-1, MG2-2, MG2-3, and MG2-4, and the repulsive forces between conductive particles CB, the probability of electrical connection failure between display pads DP-PD and FP-PD can be reduced, and the phenomenon of one FP-PD being electrically connected to an adjacent pad can be prevented. Therefore, an apparatus DMA (referencing) for manufacturing display modules with improved reliability can be provided. Figure 4 ) and methods for manufacturing display modules.

[0110] Figure 8 According to an embodiment of the present invention, along with Figure 4 The cross-sectional view taken from the plane corresponding to II-II'. In the description Figure 8 At that time, for those who passed Figure 6 The constituent elements described are labeled together with the same reference numerals, and their descriptions are omitted.

[0111] refer to Figure 3 and Figure 8 Layout of the circuit section CP (reference) Figure 5 Step (S300) may include making the circuit section CP (reference) Figure 5 The step of contacting the bottom surface BT-S of the adhesive component ACF with the adhesive surface.

[0112] The bottom surface BT-S can be flat. Part of the bottom surface BT-S can be the pad FP-PD, while another part of the bottom surface BT-S can be the insulating layer FP-IL1.

[0113] The thickness TK-PD1 of each pad in FP-PD can be the same as the thickness TK-IL1 of the insulating layer FP-IL1.

[0114] Figure 9 According to an embodiment of the present invention, along with Figure 4 The cross-sectional view taken from the plane corresponding to II-II'. In the description Figure 9 At that time, for those who passed Figure 7 The constituent elements described are labeled together with the same reference numerals, and their descriptions are omitted.

[0115] refer to Figure 3 and Figure 9 Layout of the circuit section CP (reference) Figure 5 Step (S300) may include making the circuit section CP (reference) Figure 5 The step of contacting the bottom surface BT-S1 of the adhesive component with the adhesive component ACF.

[0116] The bottom surface BT-S1 can be flat. Part of the bottom surface BT-S1 can be the pad FP-PD, while another part of the bottom surface BT-S1 can be the insulating layer FP-IL2.

[0117] The thickness TK-PD2 of each pad in FP-PD can be the same as the thickness TK-IL2 of the insulating layer FP-IL2.

[0118] It is understood that while the preferred embodiments of the invention have been described above, those skilled in the art or of ordinary skill in the art can make various modifications and alterations to the invention without departing from the spirit and technical scope of the invention as set forth in the claims, which will be described later. Therefore, the scope of the invention is not limited to the contents described in the detailed description of the specification, but should be defined by the claims.

Claims

1. A method for manufacturing a display module, comprising: The step of arranging a display panel on a platform, wherein the platform includes a first magnet having a first pole; The step of arranging an adhesive component comprising multiple conductive particles on the display panel; The step of arranging the circuit portion on the adhesive component; The step of arranging a head on the circuit section, wherein the head includes a second magnet having a second pole different from the first pole; The step of aligning the plurality of conductive particles using the first magnet and the second magnet; as well as The step of electrically connecting the display panel and the circuit section. The step of electrically connecting the display panel and the circuit section includes: heating and pressurizing the adhesive component using the head; The step of aligning the plurality of conductive particles includes: forming a first region having a first pole and a second region having a second pole on each of the plurality of conductive particles; and applying a repulsive force between the plurality of conductive particles.

2. The method for manufacturing a display module according to claim 1, wherein, The step of aligning the plurality of conductive particles includes: forming a magnetic field in the thickness direction of the display panel using the first magnet and the second magnet.

3. The method for manufacturing a display module according to claim 1, wherein, The step of aligning the plurality of conductive particles further includes aligning the first region adjacent to the head and aligning the second region adjacent to the platform.

4. The method for manufacturing a display module according to claim 1, wherein, On a plane, the plurality of conductive particles are spaced apart from each other at a predetermined interval.

5. The method for manufacturing a display module according to claim 1, wherein, Each of the plurality of conductive particles includes a core and a coating portion, the coating portion covering the core and comprising a strongly magnetic material, and The step of aligning the plurality of conductive particles includes: magnetizing the coating portion using the first magnet and the second magnet.

6. The method for manufacturing a display module according to claim 1, wherein, The step of aligning the plurality of conductive particles is performed simultaneously with the step of electrically connecting the display panel and the circuit section.

7. The method for manufacturing a display module according to claim 1, wherein, The steps of arranging the circuit section include: bringing the bottom surface of the circuit section into contact with the adhesive component, and... The bottom surface is flat, and the circuit section includes an insulating layer and pads electrically connected to the display panel, with a portion of the bottom surface being the pads and another portion being the insulating layer.

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