Chip transfer table heating protection double pickup head device and process method

Abstract

A chip transfer table heating protection double pickup head device belongs to the technical field of wafer loading machine equipment. A chip transfer table heating protection double pickup head device includes a track component, a camera component, a patch component, a wafer disk chip pickup component, and a wafer disk. The device is also provided with a transfer heating table, which is arranged on the track component. The center of the position where the chip is placed on the transfer heating table is in a horizontal straight line with the patch center in the track frame, and the chip picking position center of the wafer disk chip pickup component and the chip placement center of the transfer heating table are in a horizontal line. The present invention changes the device structure and reduces the film pressing process, adds a heating transfer table, reduces the bubbles and void rate generated during the loading process, and meets higher-level product requirements.

Description

Technical Field

[0001] The invention belongs to the technical field of chip loading machine equipment, and in particular relates to a chip transfer table heating protection double pickup head device and a process method. Background Art

[0002] The main process mode adopted by the existing soft solder chip mounting equipment during the chip mounting process is: frame loading - track transportation - tinning and laminating - photo positioning - chip picking and solder mounting - cooling and unloading. The mounting method of this process is to leave a completed solder area in advance. The solder reflow has been completed during the laminating process, and then the chip is directly placed in this area. The chip is prone to bubbles and voids during the contact process with the solder, and the solder area after laminating cannot be guaranteed to be close to the chip size. There are many cases where the solder wraps the chip. After the chip is mounted, the void rate is relatively high because the chip temperature is low, while the lead frame temperature in the track is high. There is a temperature difference between the two, which causes the above phenomenon. The process technology used by the existing soft solder equipment is mostly suitable for general products with not particularly strict requirements, and cannot meet the needs of high-demand products. Summary of the invention

[0003] Based on the above technical problems, the present invention proposes a chip transfer table heating protection double pickup head device and process method. By changing the device structure and reducing the film pressing process, a heated transfer table is added, and the bubbles and voids generated during the loading process are reduced, so as to meet higher-level product requirements.

[0004] The present invention adopts the following technical solution:

[0005] A chip transfer table heating protection double pickup head device comprises a track component, a camera component, a patch component, a wafer disk chip pickup component, and a wafer disk. The patch component is provided with a wafer disk chip pickup component, one end of the wafer disk chip pickup component is fixedly connected to the patch component, and the other end is fixedly connected to a frame. A camera component is provided above the patch component. The device is also provided with a transfer heating table, which is arranged on the track component. The center of the position where the chip is placed on the transfer heating table is in a horizontal straight line with the center of the patch in the track frame, and the chip picking position center of the wafer disk chip pickup component and the chip placement center of the transfer heating table are in a horizontal line.

[0006] Furthermore, the transfer heating table includes a cover plate, a heating table, a heating table bracket, a fixing frame, a thermocouple, a heating rod, an aluminum elbow joint, and an aluminum pipe joint. The heating table is fixed on the heating table bracket. The heating table is provided with a thermocouple and a heating rod. A cover plate is provided above the heating table. The heating table bracket is provided with an aluminum elbow joint and an aluminum pipe joint on one side of the cover plate. The heating table bracket is fixed to the track assembly via a fixing frame.

[0007] Furthermore, the camera assembly includes a wafer camera assembly, a transfer heating table camera assembly, and a patch camera assembly. The three camera centers of the wafer camera assembly, the transfer heating table camera assembly, and the patch camera assembly coincide with the patch position, the transfer heating table placement position, and the wafer tray film retrieval position, respectively.

[0008] Furthermore, the patch assembly includes a fixed column, an XYZ three-directional motion motor assembly, and a pickup head assembly. The XYZ three-directional motion motor assembly is fixed on the fixed column, and the pickup head assembly is connected to the XYZ three-directional motion motor assembly.

[0009] A process method for heating and protecting a double-pickup head device for a chip transfer table includes frame loading - track conveying - tinning - photo positioning - chip picking and patching - cooling and unloading.

[0010] This structure is an upgrade of the traditional process, which is changed to: frame loading - track transportation - tinning - photo positioning - chip picking and patching - cooling and unloading. This process is also completed under heating and gas protection environment. However, this process reduces the step of lamination and adds a transfer table transition method. During the chip picking and patching process, a pickup head picks up the chip from the wafer tray and places it on the transfer table for preheating, and another pickup head takes out the chip on the transfer table and combines it with the frame after the tinning is completed. This cycle is repeated in sequence to complete the mounting process of each chip.

[0011] The advantages and effects of the present invention are:

[0012] The present invention adds a transfer heating table, puts the chip on the transfer table for preheating, and then mounts the preheated chip on the lead frame. At this time, the temperature difference will not be too large, and the void rate after the chip is mounted can be reduced. The present invention is upgraded in terms of the process, and the changed process is: frame loading - track transportation - tinning and film pressing - photo positioning - chip picking and solder mounting - cooling and unloading. Compared with the traditional process, the film pressing process is reduced, and a heating transfer table is added. After the chip is taken out from the wafer table, it is placed on the transfer table for preheating. In this process, the heated transfer table is still protected by gas to ensure that the chip will not be oxidized. Then the preheated chip is mounted with the solder after the tinning step is completed, so that the solder forms a reflux on the lower surface of the chip. On the one hand, the solder area can be close to the chip size, and on the other hand, the generation of bubbles and voids can be reduced to solve the problem of bubbles and voids in the chip mounting process. The present invention is suitable for mechanical equipment for producing products with higher specifications and technical requirements, and is a good optimization and improvement form in the current solder equipment production process. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the structure of the chip transfer table heating protection double pick-up head device of the present invention;

[0014] Figure 2 It is a schematic diagram of the main structure of the chip transfer table heating protection double pick-up head device of the present invention;

[0015] Figure 3 It is a schematic diagram of the side structure of the chip transfer table heating protection double pick-up head device of the present invention;

[0016] Figure 4 It is a schematic diagram of the top view of the chip transfer table heating protection double pick-up head device of the present invention;

[0017] Figure 5 is a schematic diagram of the track assembly structure;

[0018] Figure 6 for Figure 5 Partial magnification;

[0019] Figure 7 It is a schematic diagram of the camera assembly structure;

[0020] Figure 8 It is a schematic diagram of the structure of the camera assembly from a top view;

[0021] Fig. 9 This is a schematic diagram of the main structure of the patch component;

[0022] Fig.10 It is a schematic diagram of the top view of the structure of the patch component;

[0023] Fig.11 It is a schematic diagram of the patch group structure;

[0024] Fig.12 This is a schematic diagram of the main structure of the wafer tray chip picking component;

[0025] Fig.13 It is a schematic diagram of the side view structure of the wafer tray chip picking component;

[0026] Fig.14 This is a schematic diagram of the Wafer disk structure;

[0027] Fig.15 This is a schematic diagram of the transfer heating table structure;

[0028] Fig.16 It is a schematic diagram of the side structure of the transfer heating table;

[0029] Fig.17 This is a schematic diagram of the transfer heating table structure when viewed from above.

[0030] Components in the figure: 1 is the track assembly, 2 is the camera assembly, 3 is the patch assembly, 4 is the wafer disk chip picking assembly, 5 is the wafer disk, 6 is the transfer heating table, 7 is the track frame, 8 is the tinning position, 9 is the loading position, 10 is the wafer camera combination, 11 is the transfer heating table camera assembly, 12 is the patch camera assembly, 13 is the fixed column, 14 is the XYZ three-directional motion motor assembly, 15 is the picking head assembly, 16 is the fixed frame assembly, 17 is the YZ two-directional motion motor assembly, 18 is the brake cylinder assembly, 19 is the cover plate, 20 is the heating table, 21 is the heating table bracket, 22 is the fixed frame, 23 is the thermocouple, 24 is the heating rod, 25 is the aluminum elbow joint, and 26 is the aluminum pipe joint. DETAILED DESCRIPTION

[0031] The present invention will be further explained below in conjunction with the accompanying drawings and embodiments.

[0032] The present invention is a chip transfer table heating protection double pickup head device, comprising a track component 1, a camera component 2, a patch component 3, a wafer disk chip pickup component 4, a wafer disk 5, and a transfer heating table 6. The patch component 3 is provided with a wafer disk chip pickup component 4, one end of the wafer disk chip pickup component 4 is fixedly connected to the patch component 3, and the other end is fixedly connected to a frame, a camera component 2 is provided above the patch component 3, the transfer heating table 6 is arranged on the track component 1, the position center of the transfer heating table 6 for placing the chip is in a horizontal straight line with the patch center in the track frame, and the chip picking position center of the wafer disk chip pickup component 4 and the chip placement center of the transfer heating table are in a horizontal line. The transfer heating table 6 includes a cover plate 19, a heating table 20, a heating table bracket 21, a fixing frame 22, a thermocouple 23, a heating rod 24, an aluminum elbow pipe joint 25, and an aluminum pipe joint 26. The heating table 20 is fixed on the heating table bracket 21. The thermocouple 23 and the heating rod 24 are provided on the heating table 20. A cover plate 19 is provided above the heating table 20. The heating table bracket 21 is provided with an aluminum elbow pipe joint 25 and an aluminum pipe joint 26 on one side of the cover plate 19. The heating table bracket 21 is fixed on the track assembly 1 via the fixing frame 22.

[0033] The camera assembly 2 includes a wafer camera assembly 10, a transfer heating table camera assembly 11, and a patch camera assembly 12. The three camera centers of the wafer camera assembly 10, the transfer heating table camera assembly 11, and the patch camera assembly 12 coincide with the patch position, the transfer heating table placement position, and the wafer tray film taking position, respectively.

[0034] The wafer disk chip picking component 4 includes a fixing frame component 16, a YZ bidirectional motion motor component 17, and a brake cylinder component 18. After the wafer disk chip picking component 4 is assembled, it is installed on the patch component 3 as a whole.

[0035] The patch assembly 3 includes a fixed column 13 , an XYZ three-directional motion motor assembly 14 , and a pickup head assembly 15 . The XYZ three-directional motion motor assembly 14 is fixed on the fixed column 13 , and the pickup head assembly 15 is connected to the XYZ three-directional motion motor assembly 14 .

[0036] A process method for heating and protecting a double-pickup head device for a chip transfer table includes frame loading - track conveying - tinning - photo positioning - chip picking and patching - cooling and unloading.

[0037] The structures of the track assembly, camera assembly, patch assembly, wafer tray chip picking assembly and wafer tray in the present invention are prior art, and a transfer heating table mechanism is added. The chip is placed on the transfer table for preheating, and then the preheated chip is mounted on the lead frame. At this time, the temperature difference will not be too large, and the void rate after the chip is mounted can be reduced.

[0038] The connection method of the transfer heating table is as follows:

[0039] Connect the thermocouple 23 and the heating rod 24 to the heating table 20 respectively, and install two aluminum elbow joints 25 on the left and right ends of the cover plate 11 respectively. The nitrogen-hydrogen mixed gas flows in through the aluminum elbow joint 25 to prevent the chip from oxidizing on the transfer heating table. Connect the assembled cover plate 11 with the assembled heating table 20, connect the connected heating table 20 with the heating table bracket 21, connect the connected heating table bracket 21 with the fixing frame 22, and connect the fixing frame 22 to the guide rail assembly 1 to realize the overall connection of the transfer heating table mechanism.

[0040] Here’s how it works:

[0041] 1. The track frame realizes motion transmission on the track component through the conveying mechanism. The motion is transmitted to the tinning position of the track component for tinning.

[0042] 2. After the soldering process is completed, it moves to the patch position. The camera component takes a photo of the lead frame in place for positioning.

[0043] 3 The patch component takes out the preheated chip from the transfer heating table and fits it to the frame resting on the track to complete the patch operation.

[0044] 4. The wafer tray chip picking component picks up the chip from the wafer tray, moves it through the YZ motor axis combination and places it on the transfer heating table for preheating. This process is carried out simultaneously with step 3

[0045] Connection method of each component:

[0046] Step 1: After assembling the track assembly, install it on the equipment rack and secure it.

[0047] Step 2: Using the patch position in the track assembly as a reference, place the assembled patch assembly on the corresponding position of the rack and fix it with reference to this reference.

[0048] Step 3: Install the transfer heating table onto the track assembly, adjust the center of the chip placement position and the center of the patch in the track frame to be in a horizontal straight line, and then fix the position.

[0049] Step 4: After assembling the wafer tray chip picking component, install it as a whole on the patch component. After adjusting the center of its chip picking position and the chip placement center of the transfer heating table to be on a horizontal line, fix one end of it to the patch component and the other end to the rack.

[0050] Step 5: Install the camera assembly onto the patch assembly, adjust the three camera centers and the patch position, and fix the positions after the transfer heating table placement position and the wafer plate pick-up position coincide with each other.

Claims

1. A chip transfer table heating protection double pickup head device, comprising a track component (1), a camera component (2), a patch component (3), a wafer disk chip pickup component (4), and a wafer disk (5), wherein the patch component (3) is provided with a wafer disk chip pickup component (4), one end of the wafer disk chip pickup component (4) is fixedly connected to the patch component (3), and the other end is fixedly connected to a frame, and a camera component (2) is provided above the patch component (3), characterized in that: The device is also provided with a transfer heating table (6), the transfer heating table (6) is arranged on the track component (1), the position center of the transfer heating table (6) for placing the chip is in a horizontal straight line with the center of the patch in the track frame, and the chip picking position center of the wafer disk chip picking component (4) and the chip placement center of the transfer heating table are in a horizontal line; the transfer heating table (6) comprises a cover plate (19), a heating table (20), a heating table bracket (21), a fixing frame (22), a thermocouple (23), a heating rod (24), an aluminum elbow joint (25), and an aluminum pipe joint (26), the heating table (20) is fixed on the heating table bracket (21), the heating table (20) is provided with a thermocouple (23) and a heating rod (24), the heating table (20) is provided with a cover plate (19) above the heating table (20), and the heating table bracket (21) is provided with a cover plate (19) on the cover plate (19). An aluminum elbow joint (25) and an aluminum pipe joint (26) are provided on one side, and the heating table bracket (21) is fixed on the track component (1) via a fixing frame (22); the camera component (2) comprises a wafer camera assembly (10), a transfer heating table camera assembly (11), and a patch camera assembly (12); the centers of the three cameras of the wafer camera assembly (10), the transfer heating table camera assembly (11), and the patch camera assembly (12) respectively coincide with the patch position, the transfer heating table placement position, and the wafer disk film taking position; the patch component (3) comprises a fixed column (13), an XYZ three-directional motion motor assembly (14), and a pickup head assembly (15); the XYZ three-directional motion motor assembly (14) is fixed on the fixed column (13), and the pickup head assembly (15) is connected to the XYZ three-directional motion motor assembly (14); Here’s how it works: 1). The track frame realizes motion transmission on the track component through the conveying mechanism; the motion is transmitted to the tinning position of the track component for tinning; 2). After the soldering process is completed, it moves to the patch position; the camera component takes a photo of the lead frame in place for positioning; 3). The patch component takes out the preheated chip from the transfer heating table and fits it with the frame resting on the track to complete the patch action; 4). The wafer tray chip picking component picks up the chip from the wafer tray, moves it through the YZ motor axis combination and places it on the transfer heating table for preheating; this process is carried out simultaneously with step 3).

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