A stacked module, power assembly, and power conversion device

Abstract

This invention discloses a stacked module, a power component, and a converter. The stacked module is used to electrically couple a capacitor module and a power switching module and includes: a first stacked unit and a second stacked unit; the first stacked unit is used to carry the capacitor module; the second stacked unit is used to carry the power switching module and establishes an electrical connection with the first stacked unit, so that each power switching unit is electrically coupled to the capacitor module; wherein, the second stacked unit is configured such that all power switching units carried thereafter are located on the same plane. The stacked module of this invention is suitable for improving the capacitor utilization rate in the power component and the heat sink utilization rate in the converter, thereby reducing the size of the power component and improving the power density and heat dissipation capacity of the converter.

Description

Technical Field

[0001] This invention relates to the field of power conversion technology, and more specifically, to a stacked module, power component, and power conversion device. Background Technology

[0002] A converter includes power components, and the modules within these power components are electrically coupled to each other to achieve power conversion. In converters involving AC-DC conversion, power components typically include power switch modules, capacitor modules, and corresponding electrical connection modules. The power switches within the power switch modules are electrically coupled to each other and form a power topology to achieve the corresponding conversion function. The capacitor modules are electrically coupled to the input or output terminals of the power switch modules to form a DC bus, while the electrical connection modules are used to establish the corresponding electrical connections between them.

[0003] As the power rating of converters continues to increase, the number of corresponding devices in the power components also increases, and the size of the power components also becomes larger. The conventional layout of power components is becoming increasingly difficult to meet multiple electrical indicators at the same time, which puts forward higher requirements for the design of power components.

[0004] Taking an inverter that performs DC / AC conversion as an example, its conventional power component configuration includes: three power switching units for outputting three-phase AC power, three capacitor units corresponding to each power switching unit, and three stacked busbars. Each power switching unit includes several power switch groups connected in parallel to increase power (simplest power topology), and each power switch group includes several power switches electrically coupled to form this simplest power topology. These power switches can be IGBTs or other power transistors. The three capacitor units are used to input DC power to their respective power switching units. The three stacked busbars are parallel and spaced apart, each carrying a corresponding set of power switching units and capacitor units to establish an electrical connection between them.

[0005] In practical use, the phase difference in the output three-phase AC power results in low utilization of the capacitor modules corresponding to the three power switching units. This not only wastes capacitors but also increases the size of the power components. Furthermore, since the stacked busbars are arranged in parallel and spaced intervals, the three power switching units, after being mounted on their respective stacked busbars, are also arranged in a parallel and spaced configuration. This necessitates the installation of three parallel and spaced heat sinks, which not only fails to fully utilize the heat sinks but also hinders the addition of heat pipes to each heat sink to improve heat dissipation capacity when higher heat dissipation requirements arise.

[0006] Furthermore, factors such as temperature and current sharing among the three power switching units, temperature and current sharing among the power switching groups within each power switching unit, and the layout of the heat dissipation airflow within the converter are all factors that need to be considered when modifying the configuration of the power components. Therefore, rationally arranging the power components to maximize capacitor utilization while meeting as many other electrical specifications as possible is extremely difficult, and it is also the problem that this case aims to solve. Summary of the Invention

[0007] The purpose of this invention is to provide a stacked module, a power component, and a converter. The stacked module is suitable for improving the utilization rate of capacitors in the power component and the utilization rate of heat sinks in the converter, thereby reducing the size of the power component and improving the power density and heat dissipation capacity of the converter.

[0008] To achieve the above objectives, a first aspect of the present invention provides a technical solution: a stacked module for electrically coupling a capacitor module and a power switch module; the capacitor module includes a plurality of capacitors; the power switch module includes three power switch units respectively corresponding to three-phase AC power, each power switch unit including a plurality of power switches electrically coupled to each other to achieve current conversion; it includes: a first stacked unit for carrying the capacitor module; a second stacked unit for carrying the power switch module; and a second stacked unit for establishing an electrical connection with the first stacked unit and being configured such that each power switch unit carried thereafter is located on the same plane and is electrically coupled to the capacitor module.

[0009] In technical solution one, the stacked module includes a first stacked unit and a second stacked unit, which respectively carry a capacitor module and a power switch module and are electrically connected to each other. The second stacked unit is configured such that not only are all power switch units electrically coupled to the capacitor module, but all power switch units are also located on the same plane. In this way, the three power switch units can not only share the same capacitor module, but also share the same heat sink. Therefore, it is suitable for simultaneously improving the utilization rate of capacitors and heat sinks, thereby reducing the size of the power components and improving the power density and heat dissipation capacity of the converter.

[0010] Based on technical solution one, the present invention also has technical solution two: the first stacked unit and the second stacked unit are arranged perpendicularly to each other and cooperate with each other so that the stacked module has an L-shaped structure extending along the first direction; wherein, the first stacked unit and the second stacked unit are both arranged parallel to the first direction; the capacitor module and the power switch module are respectively disposed on the outside of the corresponding stacked unit.

[0011] In technical solution two, the first stacked unit and the second stacked unit cooperate with each other to form an L-shaped structure extending along a first direction. Therefore, each power switch unit and each power switch group it contains can be arranged at intervals along the first direction in the second stacked unit. On the one hand, this makes each power switch unit equidistant from the capacitor module located in the first stacked unit, which facilitates the current sharing of each power switch unit. On the other hand, the heat dissipation duct of the power switch module can also be constructed to deliver air perpendicular to the first direction, thereby facilitating the temperature sharing of each power switch unit and each power switch group.

[0012] Based on this, since the two stacked units are perpendicular to each other and the capacitor module and power switch module are respectively located on the outside of the corresponding stacked units, the capacitor module will not be in the heat dissipation airflow of the power switch module. Therefore, it will not block the cold airflow from cooling the power switch module or be affected by the hot airflow, thus preventing it from having difficulty dissipating heat. In other words, technical solution two is suitable for ensuring that the heat dissipation airflow of the capacitor module and the power switch module does not interfere with each other, provided that the power switch units are temperature- and airflow-equivalent and the power switch groups are also temperature-equivalent.

[0013] Based on technical solution two, the present invention also has technical solution three: the stacking module is configured as an L-shaped first stack with a bending structure; the two perpendicular parts on the first stacking respectively constitute the first stacking unit and the second stacking unit.

[0014] The stacked module of technical solution three is an L-shaped first stack with a bent structure. In other words, by bending the integrated stack, the first stack unit and the second stack unit are defined to carry the capacitor module and each power switch module respectively. The capacitor module and each power switch module are naturally electrically connected because they are carried on the same stack. With the power switch groups in each power switch module also spaced along the first direction, the current path before the current flows into each power switch group extends perpendicular to the first direction. Therefore, the impedance of each current path is exactly the same, thereby naturally achieving current sharing among the power switch groups in each power switch module.

[0015] Based on technical solution three, the present invention also has technical solution four: the portion of the first stack that constitutes the second stack unit has two cuts extending perpendicular to the first direction from the end away from the first stack unit, and both cuts extend to the connection between the first stack unit and the second stack unit; the two cuts are spaced apart along the first direction to define the second stack unit into three power switch carrying areas spaced apart along the first direction; each power switch unit is respectively located in one of the power switch carrying areas.

[0016] Technical solution four involves providing two cuts in the portion constituting the second stacked unit, which define three power switch carrying areas that are completely spaced apart along the first direction. In other words, although each power switch carrying area of ​​the second stacked unit is separate, each power switch carrying area is integrated with the first stacked unit. Therefore, after each power switch unit is carried in its corresponding power switch carrying area, even if the power switches are at different heights due to unevenness of the heat sink surface, the problem of damage to the integrated stacked unit under high stress due to its excessive length along the first direction after assembly can be largely mitigated. Furthermore, since the stacked module is still an integrated structure, it remains suitable for achieving current sharing among the power switch groups.

[0017] Based on technical solution two, the present invention also has technical solution five: the stacked module is configured to include a first stacked module and three second stacked modules, all of which are planar in structure; the first stacked module constitutes the first stacked module unit; each of the second stacked modules is located on the same plane and is spaced apart along the first direction; each of the second stacked modules also overlaps with the first stacked module and is used to carry one of the power switch units, and together they constitute the second stacked module unit.

[0018] The stacked module in technical solution five adopts a split structure, which is formed by the overlapping of four planar stacks, with each second stack supporting a power switching unit. This not only improves the stress problem caused by the unevenness of the heat sink surface, but also improves the stress problem caused by bending angle errors during assembly of the integrated stack, effectively preventing stack damage during the operation of the converter.

[0019] Based on technical solution five, the present invention also has technical solution six: the first stack includes a plurality of first female and male rows that are insulated from each other and stacked, and each second stack includes a plurality of second female and male rows that are insulated from each other and stacked, the same number as the first female and male rows; each second female and male row of each second stack is correspondingly overlapped with a first female and male row of the first stack, so that each second stack overlaps with the first stack and establishes an electrical connection.

[0020] In technical solution six, the number of second sub-sub ...

[0021] To achieve the above objectives, a second aspect of the present invention provides a seventh technical solution: a power component comprising: a stacked module as described in any one of technical solutions one to five; a capacitor module comprising a plurality of capacitors and carried in a first stacked unit; a power switch module comprising three power switch units respectively corresponding to three-phase AC power, each power switch unit comprising a plurality of power switches electrically coupled to each other; the power switch module being carried in a second stacked unit.

[0022] The power component of technical solution seven inherits all its advantages due to the aforementioned stacked modules, and has a high capacitor utilization rate and heat sink utilization rate, as well as a small size and is suitable for improving the power density and heat dissipation capacity of the converter.

[0023] Based on technical solution seven, the present invention also has technical solution eight: the first stacked unit and the second stacked unit are arranged perpendicularly to each other and cooperate with each other so that the stacked module has an L-shaped structure extending along the first direction, and the first stacked unit and the second stacked unit are both arranged parallel to the first direction; the capacitor module and the power switch module are respectively disposed on the outside of the corresponding stacked unit, and each power switch unit is spaced apart along the first direction; each power switch unit includes a plurality of power switch groups that are connected in parallel and spaced apart along the first direction, and each power switch group includes a plurality of power switches that are electrically coupled to each other to realize current conversion.

[0024] The power component of technical solution eight further defines the stacked module as the stacked module of technical solution two. Therefore, by arranging each power switch unit and each power switch group contained therein at intervals along the first direction, not only are the power switch units temperature-equalized and current-equalized, but the power switch groups are also temperature-equalized. It is also suitable for achieving current-equalization of each power switch group by configuring an integrated stacked module.

[0025] Based on technical solution eight, the present invention also has technical solution nine: the power switch has a driving end, and the orientation of the driving end of each power switch is perpendicular to the first direction; the power switch module further includes a plurality of driving units for driving each power switch, the driving unit including: a driving substrate, which is disposed corresponding to the driving end of each power switch and parallel to the second stacked unit; and a driving device, which is disposed on the side of the driving substrate away from the second stacked unit.

[0026] Technical solution nine, by placing the driving device of the driving unit on the side of the driving substrate away from the second stacked unit, can ensure that the stacked module can still maintain a good current carrying capacity even when the orientation of the driving end of each power switch is perpendicular to the first direction. This plays a key role in the actual implementation of the power component of technical solution eight. Otherwise, if the current carrying capacity of the stacked module is insufficient, the normal operation of the power component cannot be guaranteed.

[0027] Specifically, the purpose of technical solution eight is to further ensure that, based on the shared capacitor and heat sink, each power switch unit has uniform temperature and current, and each power switch group also has uniform temperature, and is suitable for achieving current sharing among each power switch group. After configuring the arrangement of each power switch unit and power switch group to meet the above-mentioned electrical indicators, it also essentially limits the orientation of the drive end of each power switch to be perpendicular to the first direction.

[0028] However, in actual implementation, to facilitate the debugging and maintenance of the drive unit, the driving devices on its drive substrate are usually positioned away from the heat sink of the corresponding power switch, that is, facing the corresponding support substrate. Therefore, the drive substrate must usually be offset from the support substrate to prevent interference between the driving devices and the support substrate. Thus, in the power assembly of technical solution eight, the drive substrate of the drive unit is usually placed entirely on the side of the first stacked unit away from the second stacked unit to prevent interference between the drive unit near the first stacked module and the second stacked unit. With the connection positions of the second stacked unit and the corresponding power switch relatively fixed, this significantly shortens the distance from the connection point between the first and second stacked units to the connection points between the second stacked unit and each power switch, resulting in a significant reduction in the current-carrying capacity of the stacked module at the corresponding position.

[0029] In technical solution nine, by placing the driving device on the side of the driving substrate away from the second stacked unit, the driving device of the driving unit will not interfere with the second stacked unit. Therefore, it is unnecessary to place the driving unit on the side of the first stacked unit away from the second stacked unit, thus enabling the stacked module to maintain good current carrying capacity. In other words, the configuration of the driving unit in technical solution nine plays a crucial role in implementing power components that achieve temperature and current sharing among power switches based on shared capacitors and heat sinks.

[0030] To achieve the above objectives, a third aspect of the present invention provides a technical solution ten: a converter device comprising a power component as described in any one of technical solutions seven to nine; and a heat sink for dissipating heat for the three power switching units of the power switching module.

[0031] The converter in technical solution ten inherits all the advantages of the aforementioned power components, has high capacitor utilization and heat sink utilization, thus having high power density, and is suitable for improving heat dissipation capacity by setting heat pipes. Attached Figure Description

[0032] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 This is a perspective view of the converter device according to Embodiment 1 of the present invention;

[0034] Figure 2 This is a side view of the converter device according to Embodiment 1 of the present invention;

[0035] Figure 3 This is a perspective view of the power component according to Embodiment 1 of the present invention;

[0036] Figure 4 This is another perspective view of the power component of Embodiment 1 of the present invention;

[0037] Figure 5 This is a side view of the power component according to Embodiment 1 of the present invention;

[0038] Figure 6 This is a perspective view of the stacked module of Embodiment 1 of the present invention;

[0039] Figure 7 This is a perspective view of the stacked module of Embodiment 1 of the present invention after the insulating layer has been hidden;

[0040] Figure 8 This is an exploded view of each of the first parent and child rows of the stacked module in Embodiment 1 of the present invention;

[0041] Figure 9 This is a perspective view of the converter device according to Embodiment 2 of the present invention;

[0042] Figure 10 This is a side view of the converter device according to Embodiment 2 of the present invention;

[0043] Figure 11 This is a perspective view of the power component of Embodiment 2 of the present invention;

[0044] Figure 12 This is another perspective view of the power component of Embodiment 2 of the present invention;

[0045] Figure 13 This is a side view of the power component according to Embodiment 2 of the present invention;

[0046] Figure 14 This is a perspective view of the stacked module of Embodiment 2 of the present invention;

[0047] Figure 15 This is a perspective view of the stacked module of Embodiment 2 of the present invention after the insulating layer has been hidden;

[0048] Figure 16 This is an exploded view of the stacked module of Embodiment 2 of the present invention after the insulation layer has been hidden;

[0049] Figure 17 This is a perspective view of the converter device according to Embodiment 3 of the present invention;

[0050] Figure 18 This is a perspective view of the power component of Embodiment 3 of the present invention;

[0051] Figure 19 This is another perspective view of the power component of Embodiment 3 of the present invention;

[0052] Figure 20 This is a side view of the power component according to Embodiment 3 of the present invention;

[0053] Figure 21 This is a perspective view of the stacked module of Embodiment 3 of the present invention;

[0054] Figure 22 This is a perspective view of the stacked module of Embodiment 3 of the present invention after the insulating layer has been hidden.

[0055] Key reference numerals:

[0056] Converter 1000;

[0057] Power component 100, heat sink 200, DC input copper busbar 310, AC output copper busbar 320;

[0058] Capacitor module 110;

[0059] Power switch unit 121, power switch group 1211, first power switch 1211A, second power switch 1211B, drive unit 122, drive substrate 1221, drive device 1222;

[0060] Stacked module 130, first stacked unit 130A, second stacked unit 130B, first stacked unit 131A (131B), first female busbar 1311A (1311B), second stacked unit 132, second female busbar 1321, cutout 133, power switch carrying area 134. Detailed Implementation

[0061] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are preferred embodiments of the present invention and should not be considered as excluding other embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0062] Unless otherwise expressly defined, the use of terms such as "first," "second," or "third" in the claims, description, and accompanying drawings of this invention is for distinguishing different objects and not for describing a specific order.

[0063] Unless otherwise expressly defined, in the claims, description, and accompanying drawings of this invention, the use of directional terms such as "center," "lateral," "longitudinal," "horizontal," "vertical," "top," "bottom," "inner," "outer," "upper," "lower," "front," "rear," "left," "right," "clockwise," and "counterclockwise" to indicate orientation or positional relationships is based on the orientation and positional relationships shown in the accompanying drawings and is only for the convenience of describing the invention and simplifying the description, and is not intended to indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the specific scope of protection of this invention.

[0064] Unless otherwise expressly defined, the terms "fixed connection" or "fixed connection" used in the claims, description and drawings of this invention should be interpreted broadly to refer to any connection in which there is no displacement or relative rotation relationship between the two parties, including non-removable fixed connections, detachable fixed connections, and fixed connections by other means or components.

[0065] Example 1

[0066] Reference first Figure 1-2 and refer to Figure 1 As shown in the directional reference, Embodiment 1 of the present invention provides a converter device 1000, which is exemplary configured as an inverter and includes a cabinet (not shown in the figure), and a power component 100, a heat sink 200, a fan (not shown in the figure) and lead copper busbars located in the cabinet.

[0067] Combination Figure 3-5 The power component 100 is an inverter power component, which includes a capacitor module 110, a power switch module, and a stacked module 130.

[0068] The capacitor module 110 includes several capacitors, which are connected to DC power and form a DC bus.

[0069] The power switch module is configured as an inverter power module, which is connected to DC power and outputs three-phase AC power through DC / AC conversion. Thus, the power switch module includes three power switch units 121 corresponding to the three-phase AC power, and each power switch unit 121 includes several power switches that are electrically coupled to each other to realize DC / AC conversion.

[0070] The stacked module 130 is composed of stacked busbars for electrically coupling the capacitor module 110 and the power switch module, and includes a first stacked unit 130A and a second stacked unit 130B electrically connected to each other and used to carry the capacitor module 110 and the power switch module, respectively. The second stacked unit 130B is electrically connected to the first stacked unit 130A and is configured such that each power switch unit 121 carried thereafter is located on the same plane and is electrically coupled to the capacitor module 110.

[0071] It is worth noting that the term "carrying" in this invention refers to the natural establishment of an electrical connection between the device and the board when a mechanical connection is established. The term "electrical coupling" in this invention does not simply refer to the simple electrical connection between devices or modules, but rather to the establishment of electrical connections between devices or modules according to the circuit topology to achieve the corresponding circuit functions.

[0072] The heat sink 200 is an integrated heat sink. Since all power switch units 121 are located on the same plane after being supported by the second stacked unit 130B, the heat dissipation substrate of the heat sink 200 can be simultaneously fixed to each power switch of the three power switch units 121 and establish a heat conduction relationship to dissipate heat for each power switch unit 121 simultaneously. It goes without saying that several air gaps are formed between the heat dissipation teeth of the heat sink 200 to allow the airflow to pass through these air gaps and exchange heat with each heat dissipation tooth via convection. In this embodiment, the heat dissipation substrate is arranged perpendicular to the second direction shown in the figure, and each air gap extends along the third direction shown in the figure.

[0073] The fan (not shown in the figure) delivers air along the extension direction (third direction) of the air gap so that the airflow passes through each air gap to cool the radiator 200 and the power switch module.

[0074] The lead copper busbars include two DC input copper busbars 310 and three AC output copper busbars 320. The two DC input copper busbars 310 correspond to positive and negative DC power respectively and are both connected to the first stacked unit 130A to input DC power. The three AC output copper busbars 320 correspond to three-phase AC output respectively and are connected to the output terminals of the three power switch units 121 to lead out the three-phase AC power.

[0075] As can be seen, the stacked module 130 includes two stacked units, a first stacked unit 130A and a second stacked unit 130B, which respectively carry capacitor modules 110 and power switch modules and are electrically connected to each other. The second stacked unit 130B is configured such that each power switch unit 121 is electrically coupled to the capacitor module 110, and each power switch unit 121 is located on the same plane. In this way, the three power switch units 121 can not only share the same capacitor module 110, but also share the same heat sink. Therefore, the power component has a high capacitor utilization rate and heat sink utilization rate, thereby reducing the size of the power component and increasing the power density of the converter. The converter is also suitable for improving the overall heat dissipation capacity by setting heat pipes on the heat sink.

[0076] The following details the specific configuration of the stacked module 130 and the power component 100 in this embodiment, so that the advantages of this embodiment can be better demonstrated.

[0077] Combination Figure 6-8 In this embodiment, the stacking module 130 is configured as an L-shaped first stack 131A with a bent structure. Two perpendicular portions of the first stack 131A respectively constitute the first stacking unit 130A and the second stacking unit 130B. In other words, the first stacking unit 130A and the second stacking unit 130B are arranged perpendicularly to each other and cooperate with each other so that the stacking module 130 has an L-shaped structure extending along the first direction shown in the figure. Both the first stacking unit 130A and the second stacking unit 130B are arranged parallel to the first direction.

[0078] In the specific structure, the first stack 131A in this embodiment is composed of several first busbars 1311A that are insulated from each other and stacked. Each first busbar 1311A corresponds to a different potential and is insulated from each other by an insulating layer, which can be a PET insulating film. In this embodiment, each power switching unit 121 is a three-level power topology, so the first stack 131A includes three first busbars 1311A, which correspond to the positive, neutral and negative terminals respectively. One end of each of the two DC input copper busbars 310 is connected to positive DC and negative DC respectively, and the other end is connected to the first busbars 1311A corresponding to the positive and negative terminals respectively.

[0079] Based on the above configuration of the stacked module 130, the capacitor module 110 and the power switch module of this embodiment are respectively disposed outside the first stacked unit 130A and the second stacked unit 130B. Furthermore, the three power switch units 121 are spaced apart along the first direction, and each power switch unit 121 includes three power switch groups 1211 connected in parallel and also spaced apart along the first direction. Each power switch group 1211 includes a first power switch 1211A and a second power switch 1211B electrically coupled to each other to form a minimum power topology and realize DC / AC conversion. Both the first power switch 1211A and the second power switch 1211B are IGBT transistors.

[0080] Therefore, in this embodiment, the power component 100 and the converter 1000, since the power switch groups 1211 contained in the three power switch units 121 are all arranged at intervals along the first direction, and the fan supplies air in a third direction perpendicular to the first direction, can achieve uniform temperature for each power switch unit 121 and each power switch group 1211. Furthermore, since the three power switch units 121 are arranged at intervals along the first direction, they are equidistant from the capacitor module 110 disposed in the first stacked unit 130A, allowing the three power switch units 121 to achieve uniform current distribution.

[0081] Furthermore, since the two stacked units are perpendicular to each other and the capacitor module 110 and the power switch module are respectively located on the outside of the corresponding stacked units, the capacitor module 110 is not located in the heat dissipation airflow of the power switch module. Therefore, it will not block the cold airflow from cooling the power switch module or be affected by the hot airflow, thus preventing it from having difficulty dissipating heat. In this embodiment, the power component can not only achieve temperature and current uniformity among the power switch units 121, but also ensure that the heat dissipation airflow of the capacitor module 110 and the power switch module does not interfere with each other.

[0082] Furthermore, since the stacked module 130 in this embodiment is an integral stack, and the first stacked unit 130A and the second stacked unit 130B, which are used to carry the capacitor module 110 and each power switch module respectively, are defined by bending the integral stack, the capacitor module 110 and each power switch module are naturally electrically connected because they are carried on the same stack. Since each power switch group 1211 in each power switch module is also spaced along the first direction, the current path before the current flows into each power switch group 1211 extends perpendicular to the first direction. Therefore, the impedance of each current path is exactly the same, thereby naturally realizing the current sharing of each power switch group 1211 in each power switch module.

[0083] Continue to refer to Figure 3-5Since the power switches require driving to control their on / off state, this embodiment configures the power switches in each power switch group 1211 as follows: In this embodiment, the first power switches 1211A of each power switch group 1211 are spaced apart along the first direction, and the second power switches 1211B of each power switch group 1211 are also spaced apart along the first direction. The first power switches 1211A and second power switches 1211B of each power switch group 1211 are spaced apart along the third direction shown in the figure. In other words, each power switch is arranged along the third direction, and therefore its driving end is also oriented towards the third direction. Figure 4 In terms of the orientation shown, the driving terminals of each first power switch 1211A face downwards, and the driving terminals of each second power switch 1211B face upwards.

[0084] Correspondingly, the power switch module further includes a plurality of drive units 122 for driving each power switch. Each drive unit 122 includes a drive substrate 1221 and a drive device 1222. The drive substrate 1221 is disposed corresponding to the drive end of each power switch and is parallel to the second stacked unit 130B, while the drive device 1222 is disposed on the side of the drive substrate 1221 opposite to the second stacked unit 130B.

[0085] In this embodiment, the power switch module includes six drive units 122. Each power switch unit 121 corresponds to two drive units 122. One drive unit 122 is used to drive the three first power switches 1211A of each power switch group 1211, and the other drive unit 122 is used to drive the three second power switches 1211B of each power switch group 1211. This makes the two drive units 122 corresponding to each power switch unit 121 also spaced apart along the third direction, with one drive unit 122 located below the corresponding power switch unit 121 and the other drive unit 122 located above the corresponding power switch unit 121.

[0086] As can be seen, since the driving device 1222 is located on the side of the driving substrate 1221 facing away from the second stacked unit 130B, the driving unit 122 driving each first power switch 1211A will not interfere with the second stacked unit 130B. Therefore, it is not necessary to place it below the first stacked unit 130A to make it misaligned with the second stacked unit 130B. In this way, it can be ensured that there is still a certain distance D from the connection point between the first stacked unit 130A and the second stacked unit 130B to the connection point between the second stacked unit 130B and each power switch. This ensures that the stacked module 130 has a certain current-carrying cross-section and can maintain a good current-carrying capacity. This plays a key role in the specific implementation of a power component that can achieve temperature and current sharing among the power switches based on a shared capacitor and heat sink.

[0087] Example 2

[0088] Reference Figure 9-16 Embodiment 2 of the present invention is a variant of Embodiment 1. It also provides a converter device 1000, and the configuration is basically the same as that of Embodiment 1. The only difference is the specific structure of the stacked module 130. Therefore, this embodiment will not repeat the same parts of the two embodiments, but only introduce the differences in the specific structure of the stacked module 130 and the corresponding effects. Those skilled in the art can refer to Embodiment 1 based on the same reference numerals in the corresponding drawings to fully understand this embodiment.

[0089] Specifically, especially refer to Figure 14-16 The stacking module 130 of this embodiment includes a first stack 131B, which is planar in structure, and three second stacks 132. The first stack 131B of this embodiment directly constitutes the first stacking unit 130A of Embodiment 1. The three second stacks 132 are all located on the same plane and are spaced apart along the first direction. Each second stack 132 also overlaps with the first stack 131B and is used to carry a power switch unit 121, and together they constitute the second stacking unit 130B of Embodiment 1.

[0090] In other words, the stacked module 130 of this embodiment adopts a split structure, which is formed by the overlapping of four planar stacks, and each second stack 132 is used to support a power switch unit 121. In this way, after each power switch unit 121 is supported on the corresponding second stack 132, even if the power switches are at different heights due to the uneven surface of the heat sink 200, the problem of the integrated stack being damaged under large stress due to its excessive length along the first direction after assembly can be largely solved. Moreover, the stacked module 130 of this embodiment can also improve the stress problem caused by the bending angle error during bending of the integrated stack after assembly, effectively preventing stack damage during the operation of the converter.

[0091] Specifically, in this embodiment, the first stack 131B includes three first female busbars 1311B that are insulated from each other and stacked together. Each second stack 132 includes three second female busbars 1321 that are insulated from each other and stacked together. Each second female busbar 1321 of each second stack 132 overlaps with a first female busbar 1311B of the first stack 131B in this embodiment, so that each second stack 132 overlaps with the first stack 131B and establishes an electrical connection. It goes without saying that the three first female busbars 1311B and the correspondingly overlapped second female busbars 1321 correspond to the positive, neutral and negative terminals, respectively, so that the capacitor module 110 can be electrically coupled to each power switch unit 121, ensuring that when the stack module 130 adopts a split structure, each power switch module can still share the capacitor module 110.

[0092] However, this also reveals that, due to the limited thickness of the busbars, in this embodiment, the overlap points of each second busbar 1321 and the first busbar 1311B, and the connection points of each first power switch 1211A of different power switch groups 1211 on the second busbar 1321, are spaced apart in the first direction. This results in inconsistent current paths flowing into each power switch group 1211; that is, the current path of the power switch closer to the overlap point is shorter, while the current path of the power switch farther from the overlap point is longer. In other words, although this embodiment can effectively solve the stress problem, it cannot achieve current sharing among the power switch groups 1211 within each power switch module.

[0093] Example 3

[0094] Reference Figure 17-22 Embodiment 3 of the present invention is a variant of Embodiment 1. It also provides a converter device 1000, and its configuration is basically the same as that of Embodiments 1 and 2. The only difference is the specific structure of the stacked module 130. Therefore, this embodiment will not describe the same parts of the three embodiments, but only introduces the differences in the specific structure of the stacked module 130 and the corresponding effects. Those skilled in the art can refer to Embodiment 1 based on the same reference numerals in the corresponding drawings to fully understand this embodiment.

[0095] Special reference Figure 21-22 In this embodiment, the stacking module 130, based on the stacking module of embodiment 1 being configured as an integral stack, has a cutout 133 in the part constituting the second stacking unit 130B.

[0096] Specifically, in Embodiment 1, the portion of the first stack 131A that constitutes the second stack unit 130B has two cuts 133 extending perpendicularly to the first direction from the end away from the first stack unit 130A. Both cuts 133 extend to the connection point of the first stack unit 130A and the second stack unit 130B. The two cuts 133 are spaced apart along the first direction to define three power switch carrying areas 134 spaced apart along the first direction in the second stack unit 130B. The three power switch units 121 are respectively disposed in one of the power switch carrying areas 134.

[0097] In this embodiment, although each power switch carrying area 134 of the second stack unit 130B is separate, each power switch carrying area 134 is integrated with the first stack unit 130A. Therefore, after each power switch unit 121 is carried on the corresponding power switch carrying area 134, even if the power switches are at different heights due to the uneven surface of the heat sink 200, the problem of the integrated stack being damaged under large stress due to its excessive length along the first direction after assembly can be largely improved. Furthermore, since the stack module 130 is still an integrated structure, it is still suitable for achieving current sharing among the power switch groups 1211.

[0098] In other words, the stacked module 130, power component 100 and converter 1000 of this embodiment, in addition to having all the advantages of embodiment 1, also incorporate some of the advantages of embodiment 2, and its overall effect in actual implementation is better than the other two embodiments.

[0099] The descriptions in the specification and embodiments are used to explain the scope of protection of the present invention, but do not constitute a limitation on the scope of protection of the present invention. Modifications, equivalent substitutions, or other improvements to the embodiments of the present invention or some of its technical features that can be obtained by those skilled in the art through logical analysis, reasoning, or limited experimentation, based on the teachings of the present invention or the above embodiments, should all be included within the scope of protection of the present invention.

Claims

1. A power assembly, characterized by, include: A stacked module is used to electrically couple a capacitor module and a power switch module; the stacked module includes a first stacked unit for carrying the capacitor module; and a second stacked unit for carrying the power switch module; it is also electrically connected to the first stacked unit and configured such that each power switch unit carried thereafter is located on the same plane and is electrically coupled to the capacitor module. A capacitor module, comprising a plurality of capacitors, is carried in the first stacked unit; A power switch module includes three power switch units corresponding to three-phase AC power, each power switch unit including several power switches electrically coupled to each other; the power switch module is carried on the second stack unit; The first stacked unit and the second stacked unit are arranged perpendicularly to each other and cooperate with each other so that the stacked module has an L-shaped structure extending along the first direction. The first stacked unit and the second stacked unit are both arranged parallel to the first direction. The capacitor module and the power switch module are respectively located on the outside of the corresponding stacked unit, and each power switch unit is spaced apart along the first direction; each power switch unit includes several power switch groups that are connected in parallel and spaced apart along the first direction, and each power switch group includes several power switches that are electrically coupled to each other to realize current conversion. The power switch has a driving end, and the orientation of the driving end of each power switch is perpendicular to the first direction. The power switch module further includes a plurality of driving units for driving each of the power switches. Each driving unit includes a driving substrate, which is disposed corresponding to the driving end of each power switch and parallel to the second stacked unit. and driving devices, which are disposed on the side of the driving substrate opposite to the second stacked unit; The stacking module is configured as an L-shaped first stack with a bent structure; The two perpendicular parts on the first stack form the first stack unit and the second stack unit, respectively. The portion of the first stack that forms the second stack unit has two cuts extending perpendicular to the first direction from the end away from the first stack unit, and both cuts extend to the connection between the first stack unit and the second stack unit. The two cuts are spaced apart along the first direction to define three power switch carrying areas spaced apart along the first direction for the second stacked unit; Each power switch unit is located in one of the power switch carrying areas.

2. A converter device, characterized in that, Includes the power component as described in claim 1; and a heat sink for dissipating heat for the three power switching units of the power switching module.

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