High-frequency device with high-frequency signal guiding element and corresponding manufacturing method

Abstract

Embodiments of the present disclosure relate to a high-frequency device with a high-frequency signal guiding element and a corresponding manufacturing method. The high-frequency device comprises a high-frequency chip, a first connection element arranged above a chip surface of the high-frequency chip, the first connection element being designed to mechanically and electrically connect the high-frequency chip with a circuit board, and a high-frequency signal guiding element arranged above the chip surface and electrically coupled with the high-frequency chip, the high-frequency signal guiding element being covered by a non-conductive material and being designed to transport a signal in a direction parallel to the chip surface, wherein the first connection element and the high-frequency signal guiding element are arranged at the same height with respect to a direction perpendicular to the chip surface, and wherein the first connection element is spaced apart from the high-frequency signal guiding element above an area free of the non-conductive material.

Description

Technical Field

[0001] This disclosure generally relates to HF (High Frequency) technology. In particular, this disclosure relates to HF devices having HF signal guiding elements and methods for manufacturing such HF devices. Background Technology

[0002] HF devices can be used, for example, in automotive safety applications. Therefore, radar sensors can be used for blind spot detection, automatic speed control, collision avoidance systems, etc. Here, the HF device can be mounted on a circuit board, which typically requires high-cost HF laminates, for example, those used in ultra-short-range radar or waveguide feed structures. The radar antenna of the HF device is usually housed within the HF device's casing. HF device manufacturers are constantly striving to improve their products. In particular, there is a desire to reduce the size of HF devices and lower their manufacturing costs. Summary of the Invention

[0003] Various aspects relate to a high-frequency device. The high-frequency device includes a high-frequency chip. The high-frequency device also includes a first connecting element disposed above the chip surface of the high-frequency chip, the first connecting element being designed to mechanically and electrically connect the high-frequency chip to a circuit board. The high-frequency device also includes a high-frequency signal guiding element disposed above the chip surface and electrically coupled to the high-frequency chip, the high-frequency signal guiding element being covered by a non-conductive material and designed to transmit signals in a direction parallel to the chip surface. With respect to a direction perpendicular to the chip surface, the first connecting element and the high-frequency signal guiding element are disposed at the same height. The first connecting element is spaced apart from the high-frequency signal guiding element via a region without non-conductive material.

[0004] Various aspects relate to a method for manufacturing high-frequency devices. The method includes arranging a plurality of high-frequency chips, wherein each high-frequency chip includes a connection element disposed above a respective chip surface, the connection element being designed to mechanically and electrically connect the respective high-frequency chip to a circuit board. The method also includes arranging a panel having a plurality of high-frequency signal guiding elements on the chip surfaces of the high-frequency chips, wherein the high-frequency signal guiding elements are respectively covered by a non-conductive material and are designed to transmit signals in a direction parallel to the respective chip surface. The method further includes segmenting the panel to obtain a plurality of high-frequency devices, wherein each high-frequency device includes at least one high-frequency chip, a connection element, and a high-frequency signal guiding element, wherein the connection element and the high-frequency signal guiding element are arranged at the same height with respect to a direction perpendicular to the chip surface, and wherein the connection element is spaced apart from the high-frequency signal guiding element via a region without non-conductive material. Attached Figure Description

[0005] Figure 1 A cross-sectional side view of the HF device 100 according to the present disclosure is shown schematically.

[0006] Figure 2 A cross-sectional side view of the HF device 200 according to this disclosure is schematically shown.

[0007] Figure 3 A cross-sectional side view of the HF device 300 according to this disclosure is schematically shown.

[0008] Figure 4 A cross-sectional side view of the HF device 400 according to this disclosure is schematically shown.

[0009] Figure 5 A cross-sectional side view of the HF device 500 according to this disclosure is schematically shown.

[0010] Figure 6 A top view of the HF device 600 according to this disclosure is shown schematically.

[0011] Figure 7 A top view of the HF device 700 according to this disclosure is shown schematically.

[0012] Figure 8 A top view of the HF device 800 according to this disclosure is shown schematically.

[0013] Figure 9 A top view of the HF device 900 according to this disclosure is shown schematically.

[0014] Figure 10 A top view of the HF device 1000 according to this disclosure is shown schematically.

[0015] Figure 11 A top view of the HF device 1100 according to this disclosure is shown schematically.

[0016] Figure 12 A flowchart of a method for manufacturing an HF device according to the present disclosure is shown.

[0017] Figure 13 includes Figures 13A to 13G , Figures 13A to 13G A method for manufacturing an HF device according to the present disclosure is illustrated schematically.

[0018] Figure 14 contains Figures 14A to 14D , Figures 14A to 14D A method for manufacturing an HF device according to the present disclosure is illustrated schematically.

[0019] Figure 15 includes Figures 15A to 15C , Figures 15A to 15CA method for manufacturing an HF device according to the present disclosure is illustrated schematically. Detailed Implementation

[0020] The following detailed description refers to the accompanying drawings, which illustrate specific aspects and embodiments in which this disclosure may be practiced for illustrative purposes. In this regard, directional terms such as "upper," "lower," "front," and "rear" may be used to refer to the orientation of the described drawings. Because components of the described embodiments may be positioned in different orientations, these directional terms are for illustrative purposes and are not intended to be limiting. Other aspects may be used and structural or logical changes may be made without departing from the concept of this disclosure. That is, the following detailed description should not be construed as limiting.

[0021] A schematic diagram of an HF device according to this disclosure is described below. Here, the HF device may be presented in a general manner to qualitatively illustrate various aspects of this disclosure. The HF device may have other aspects, which are not shown in the drawings for simplicity. For example, various HF devices can be extended by combining any aspects described with other devices or methods according to this disclosure.

[0022] Figure 1 The HF device 100 has an HF chip 2. Figure 1 In the example, the HF chip 2 is shown without any possible additional components (such as encapsulation material). The HF device 100 also has a connecting element 6 disposed above the chip surface 4 of the HF chip 2. Figure 1 In the example, the connecting element 6 is exemplarily shown as a solder ball (or solder pad). In another example, the connecting element 6 may be constructed as a column and may be made of, for example, copper or a copper alloy. The connecting element 6 is designed to mechanically and electrically connect the HF chip 2 or the HF device 100 to a circuit board (not shown). The HF device 100 also has an HF signal guiding element 8 disposed above the chip surface 4 and electrically coupled to the HF chip 2. Figure 1 In one example, electrical coupling is provided, for instance, via solder balls. In other examples, electrical coupling can be non-contact. The HF signal guiding element 8 may include one or more electrical wires and / or one or more radiating elements.

[0023] The HF signal guiding element 8 is covered by a non-conductive material 10 and is designed to transmit signals in a direction parallel to the chip surface 4 (i.e., in the x-direction). Regarding a direction perpendicular to the chip surface 4 (i.e., regarding the y-direction), the connecting element 6 and the HF signal guiding element 8 are arranged at the same height. Therefore, the connecting element 6 and the HF signal guiding element 8 can at least partially overlap in a side view along the x-direction. The connecting element 6 is spaced apart from the HF signal guiding element 8 via a region 12. Region 12 does not contain the non-conductive material 10.

[0024] Figure 2 The HF device 200 can be considered a more detailed implementation of the HF device 100. The HF device 200 may include an HF package (or HF housing) 14 having an HF chip 2, a packaging material 16, and a redistribution layer (or redistribution layer) 18. Furthermore, the HF device 200 may have connection elements 6 and HF signal guiding elements 8 disposed above the surface 4 of the HF chip 2 or above the surface 20 of the HF package 14. The HF device 200 may have a circuit board 22 and a microcontroller 24, which may or may not be considered part of the HF device 200.

[0025] HF chip 2 can operate within different frequency ranges. Therefore, the HF signal guiding element 8, electrically coupled to HF chip 2, can be designed to transmit signals with frequencies within these ranges. In one example, HF chip 2 can operate within a high-frequency or microwave frequency range, typically from about 10 GHz to about 300 GHz. For example, circuitry integrated into HF chip 2 can correspondingly operate within a frequency range greater than about 10 GHz, and HF signal guiding element 8 can transmit signals with frequencies greater than about 10 GHz. Such microwave circuitry may include, for example, a microwave transmitter, microwave receiver, microwave transceiver, microwave sensor, or microwave detector. The apparatus described herein can be used in radar applications where the frequency of the high-frequency signal is modulated. Radar microwave devices can be used, for example, in automotive or industrial applications for range determination / distance measurement systems. For example, automatic vehicle speed control systems or vehicle collision avoidance systems can operate within microwave frequency ranges, such as in the 24 GHz, 77 GHz, or 79 GHz bands.

[0026] Alternatively or additionally, the HF chip 2 can operate within the Bluetooth frequency range. Such a frequency range may, for example, include the ISM (Industrial, Scientific, and Medical) band between approximately 2.402 GHz and approximately 2.480 GHz. Therefore, the circuitry integrated in the HF chip 2 can more generally operate in a frequency range greater than approximately 1 GHz, and the HF signal guiding element 8 can accordingly transmit signals with frequencies greater than approximately 1 GHz.

[0027] The HF chip 2 can be at least partially embedded in the encapsulation material 16. Figure 2 In one example, the sides and top of the HF chip 2 may be covered by the encapsulation material 16. In another example, the top of the HF chip 2 may be covered by the encapsulation material 16. The encapsulation material 16 protects the HF chip 2 from external influences such as moisture, leakage current, or mechanical shock. The encapsulation material 16 may include, for example, at least one of the following: molding compound, laminate, epoxy resin, filled epoxy resin, glass fiber filled epoxy resin, imide, thermoplastic, thermosetting polymer, or polymer mixture.

[0028] The redistribution layer 18 may include one or more conductor traces 26 in the form of metal layers or metal traces, which may extend substantially parallel to the lower side 4 of the HF chip 2 or parallel to the lower side 20 of the HF package 14. Multiple dielectric layers 28 may be disposed between the conductor traces 26 to electrically insulate the conductor traces 26 from each other. Furthermore, the metal layers disposed on different planes may be electrically connected to each other through multiple vias (or through-holes).

[0029] To electrically couple the terminals of HF chip 2 to connection element 6 and / or HF signal guiding element 8, the conductor trace 26 of redistribution layer 18 can perform a redistribution or rewiring function. In other words, conductor trace 26 can be designed to provide terminals of HF chip 2 at other locations in HF device 200. Figure 2 In one example, the terminals of the HF chip 2 can be redistributed to external terminals using redistribution layer 18. These external terminals can be arranged outside the outline of the HF chip 2 in a top view along the y-direction. Such an extended HF device with chip terminals can be called a "fan-out" device or a "fan-out" package. In another example, the HF device 200 can be a "fan-in" device, in which (particularly all) external terminals can be arranged within the outline of the HF chip 2 in a top view along the y-direction. The HF device 200 can, for example, be a wafer-level package, which can be manufactured, for example, according to the eWLB (embedded Wafer Level Ball Grid Array) method. Here, the underside of the HF chip 2 and the underside of the package material 16 can be located in a common plane, i.e., arranged coplanarly, due to the manufacturing process.

[0030] exist Figure 2In one example, the lower side of HF chip 2 may correspond to the active surface of HF chip 2, i.e., the chip surface shown below, in which electronic components are integrated into the semiconductor material of HF chip 2. In another example, the upper side of HF chip 2 may correspond to the active surface of HF chip 2, and there is rewiring to the lower side of HF chip 2, thereby allowing electrical contact with the integrated electronic components from the lower side of the device.

[0031] The HF chip 2 or HF package 14 can be mechanically and electrically connected to the circuit board 22 via at least one of the connecting elements 6. Here, the upper or lower side of each connecting element 6 can contact the connection area of ​​the HF package 14 or the connection area of ​​the circuit board 22. A gap 30 can be formed between the upper side of the circuit board 22 and the lower side 20 of the HF package 14. Each connecting element 6 can extend over the entire range of the gap 30 in the y-direction. In other words, the range of the gap 30 in the y-direction can be determined by the dimensions of the connecting element 6. Therefore, the connecting element 6 can have a larger extension in the y-direction than the HF signal guiding element 8.

[0032] In one example, gap 30 can be an air gap. In another example, gap 30 can be filled with material, for example, a bottom filler material. Connecting element 6 and HF signal guiding element 8 can be arranged in gap 30 and can be spaced apart from each other via gap 30 or a region of gap 30. Therefore, connecting element 6 and HF signal guiding element 8 do not necessarily need to be in physical contact.

[0033] exist Figure 2 In the example, connecting element 6 is exemplarily shown as a solder ball. In other examples, connecting element 6 may be constructed as a column and, for example, made of copper or a copper alloy. Figure 2 The side view exemplarily shows five solder balls. In other examples, such as... Figure 6 As shown, the number of connecting elements 6 can be different, and in particular, it can be more.

[0034] One or more of the connection elements in connection element 6 can be designed to transmit DC signals and / or AC signals. In addition to the HF circuitry already mentioned, the HF chip 2 may also have an integrated circuit that can operate in a non-high-frequency or low-frequency range. For example, such an integrated circuit can operate in a frequency range less than about 10 GHz, less than about 5 GHz, less than about 1 GHz, or less than about 500 MHz. Therefore, one or more of the connection elements in connection element 6 can be designed to transmit signals with these frequencies. Signals can be transmitted, for example, from the integrated low-frequency circuitry of the HF chip 2 via connection element 6 to the circuit board 22 (see signal 32A). Furthermore, signals can be forwarded via circuit board 22 to the microcontroller 24 and processed by the microcontroller 24 (see signal 32B). Conversely, signals can also be fed into the HF chip 2 via connection element 6.

[0035] One or more of the connecting elements 6 can be designed to provide a thermal path. Such a thermal path can extend substantially away from the high-frequency chip 2 in the y-direction (see Heat 34). During operation of the HF device 200, the HF chip 2 may generate heat, and this heat can be effectively dissipated from the HF chip 2. Therefore, overheating of the HF device 200 or the HF chip 2 can be avoided. In one example, the HF device 200 may also have a heat sink (not shown), which can be arranged, for example, on the underside of the circuit board 22, and can provide further heat dissipation.

[0036] The HF signal guiding element 8 and the HF chip 2 or HF package 14 can be mechanically and electrically connected via one or more second connecting elements 36. Figure 2 In the example, the connecting element 36 is exemplarily shown in the form of a solder ball. Therefore, the HF chip 2 or HF package 14 can be connected to the HF signal guiding element 8 based on the thermal heating process of the material of the connecting element 36 (e.g., melting, followed by cooling and solidification). In another example, the connecting element 36 can be designed as a column and can be made of, for example, copper or a copper alloy. With respect to the y-direction, the second connecting element 36 can have a smaller extension than the connecting element 6. One or more of the second connecting elements 36 can be designed to transmit the high-frequency signal generated by the HF chip 2 to the corresponding HF signal guiding element 8 (see signal 38).

[0037] exist Figure 2 Two HF signal guiding elements 8 are illustrated exemplarily. In another example, the number of HF signal guiding elements may be selected differently depending on the type of HF device 200. Each HF signal guiding element 8 may have a dielectric substrate 40. Metal layers 42 and 44 may be disposed on the underside and top side of the dielectric substrate 40. Figure 2In the example, the lower metal layer 44 can be an electrical ground layer. The upper metal layer 42 can be structured and form an antenna layer.

[0038] The dielectric substrate 40 may be made of or contain at least one of the following: FR-4 material, PTFE material, low-loss dielectric material, ceramic material, glass material, etc. The loss factor tanδ of the material of the dielectric substrate 40 may be less than about 0.015, particularly less than about 0.005. The relative permittivity ε of the material of the dielectric substrate 40... r It can be less than about 4, especially less than about 3.5.

[0039] Antenna layer 42 may include one or more antenna elements (or radiating elements), such as transmitting antenna elements and / or receiving antenna elements. Each antenna element may comprise multiple conductive patches (or patch antennas) that are electrically connected to each other, particularly in the form of patch rows or patch branches. Viewed along the y-direction, the radiating elements may be specifically arranged outside the outline of the HF package 14. The HF signal generated by the HF chip 2 can be transmitted to the radiating elements of antenna layer 42 via the second connecting element 36 and the signal guiding section of antenna layer 42. The radiating elements may be designed to radiate HF signals in the y-direction, particularly upwards. Antenna layer 42 and the lower metal layer 44, formed as electrically grounded, may be made of, or contain, a suitable metal or metal alloy (such as copper). In one example, the HF signal guiding element 8 may be formed of copper-clad PTFE material.

[0040] exist Figure 2 In this configuration, the lower side of the HF signal guiding element 8 may be spaced apart from the upper side of the circuit board 22. In one example, the HF signal guiding element 8 may not necessarily be designed to feed an HF signal into the circuit board 22. In another example, the HF signal may be fed into the circuit board by the HF signal guiding element 8. Such signal feeding may be performed via additional connecting elements (not shown) or in a non-contact manner. Compared to one or more connecting elements in the connecting elements 6, the HF signal guiding element 8 may have a larger extension in the x-direction. In particular, when viewed along the y-direction, the HF signal guiding element 8 may protrude beyond the outline of the HF chip 2 or the HF package 14, thereby forming a "fan-out" structure.

[0041] The HF signal guiding element 8 can be designed to transmit or redistribute HF signals in the x-direction or in a plane perpendicular to the y-direction. For this reason, a high-frequency conduction structure that can provide such redistribution can be omitted in the area of ​​the circuit board 22 located below the HF signal guiding element 8. Typically, this high-frequency conduction structure can be designed in the form of an HF laminate additionally arranged on the circuit board 22. Compared to HF devices with an additional required HF laminate, the HF device with an HF signal guiding element according to this disclosure can have a lower manufacturing cost.

[0042] One or more HF signal guiding elements 8 can be arranged within the gap 30. Therefore, the volume of the gap 30 that is otherwise unused can be used by the HF signal guiding elements 8, thereby reducing the size of the HF device 200.

[0043] The antenna element of the HF signal guiding element 8 can be arranged outside the HF package 14 or outside the package material 16. In this way, the size of the HF package 14 can be reduced and the manufacturing cost of the HF device 200 can be lowered.

[0044] Figure 3 The HF device 300 can be at least partially similar to Figure 2 The HF device 200 and includes similar components. Therefore, the above regarding Figure 2 The explanation can also be applied to Figure 3 The example shown is the reverse. For simplicity, in Figure 3 Only the left side of the HF device 300 is shown in the image.

[0045] Unlike Figure 2 The HF device 300 may additionally have a dielectric layer 46 disposed below the HF signal guiding element 8. The dielectric layer 46 may be designed to electrically insulate the HF signal guiding element 8 and the circuit board 22 from each other. Furthermore, the dielectric layer 46 may be designed to mechanically stabilize the HF signal guiding element 8, which may be elastic or flexible. The dielectric layer 46 may be made of any suitable dielectric material, such as FR-4 material.

[0046] Semiconductor package 14 can be mechanically and electrically connected to circuit board 22, for example, by means of a soldering process. Prior to the soldering process, the substantially spherical connecting element 6 can have a diameter ranging from about 250 micrometers to about 500 micrometers. During the soldering process, the connecting element 6 may deform such that, after the soldering process, the gap 30 can have an extension in the y-direction ranging from about 220 micrometers to about 440 micrometers. The HF signal guiding element 8 can have an extension in the y-direction ranging from about 100 micrometers to about 150 micrometers. A typical value for the extension of the HF signal guiding element 8 in the y-direction can be, for example, about 125 micrometers. The dielectric layer 46 can have an extension in the y-direction ranging from about 200 micrometers to about 400 micrometers. Prior to the soldering process, the substantially spherical second connecting element 36 can have a diameter of up to 100 micrometers. After the soldering process, the distance “d” between the underside of the HF package 14 and the upper side of the HF signal guiding element 8 can be in the range of about 40 micrometers to about 60 micrometers. A typical value for the distance “d” can be, for example, about 50 micrometers.

[0047] Figure 4 The HF device 400 may be at least partially similar to HF devices 200 and 300. With Figure 2 and Figure 3 The difference is that the HF device 400 may have one or more third connecting elements 48, which may be arranged below the HF signal guiding element 8. Figure 4 In the example, the third connecting element 48 is exemplarily shown as a solder ball (or solder lump). In other examples, the third connecting element 48 may be designed in other ways, such as in a columnar form, and the third connecting element 48 may be made of copper or a copper alloy, for example. The third connecting element 48 may be designed to mechanically and electrically connect the HF signal guiding element 8 to the circuit board 22. Furthermore, the third connecting element 48 may be designed to mechanically stabilize the HF signal guiding element 8, which may be elastic or flexible. As already combined Figure 2 As illustrated, the HF signal guiding element 8 may have one or more antenna elements on its upper side, which, when viewed along the y-direction, may be arranged outside the outline of the HF package 14. The antenna elements may be designed to radiate the HF signal generated in the HF chip 2 and / or receive and forward the HF signal to the HF chip 2 via the air interface.

[0048] As an alternative or additional embodiment of the described antenna element's function, the HF signal guiding element 8 can be designed to transmit HF signals from the HF chip 2 to the circuit board 22 and vice versa. That is, the HF signal guiding element 8 can be designed not only to transmit HF signals in the x-direction or in a plane perpendicular to the y-direction, but also to transmit HF signals in the y-direction. For this purpose, the HF signal guiding element 8 can have an internal electronic wiring or redistribution structure, through which the HF signal can be transmitted from the upper side of the HF signal guiding element 8 to the lower side. Figure 4 In the example, for simplicity, this internal wiring structure of the HF signal guiding element 8 is not explicitly shown. In one example, the HF signal guiding element 8 can be implemented as a sub-circuit board that can provide the described signal transmission in the y-direction. Furthermore, the sub-circuit board can also be designed to mechanically and electrically connect the HF device 400 or the HF package 14 to the circuit board 22.

[0049] exist Figure 5 In the HF device 500, the HF signal guiding element 8 may have a metal layer 50 and / or a dielectric layer 52 on its underside. The metal layer 50 may be similar to... Figure 2 The lower metal layer 44 is configured as electrically grounded and can have the same function. The metal layer 50 can also be designed to match the thermal expansion coefficients of the HF package 14 and the HF signal guiding element 8. The metal layer 50 can also be designed to mechanically stabilize the HF signal guiding element 8. The metal layer 50 can be made of, for example, steel or Invar alloy. The dielectric layer 52 can be similar to... Figure 3 The dielectric layer 46 has the same function. In one example, the dielectric layer 52 may be made of a low-loss dielectric material. In another example, the loss factor tanδ of the material of the dielectric layer 52 may be greater than the loss factor of the low-loss dielectric material.

[0050] exist Figures 1 to 5In the example, electrical coupling between the HF signal guiding element 8 and the HF package 14 or circuit board 22 is provided via connecting elements 36 or 48, respectively. Alternatively, in other examples, this electrical coupling can be implemented in a non-current-free or contactless manner. For example, the corresponding transmission of the HF signal can be achieved via capacitive coupling. The corresponding transmitter and / or receiver of the HF signal can have one or more coupling structures designed to couple the HF signal into the corresponding other components, and vice versa. The coupling structure may, for example, include one or more patch antennas. For example, the electrical coupling between the HF package 14 and the HF signal guiding element 8 provided by the second connecting element 36 can be replaced by contactless electrical coupling. For this purpose, a coupling structure can be arranged on the underside of the HF package 14, which capacitively couples the HF signal into the antenna layer 42 of the HF signal guiding element 8.

[0051] Figure 6 The HF device 600 can, for example, be similar to Figure 2 The HF device 200. The HF device 600 may have two HF signal guiding elements 8, which may be arranged on and aligned with the opposite side edges of the HF package 14. Figure 6 In the example, the HF signal guiding element 8 is arranged substantially centrally above the corresponding side edge of the HF package 14. Each HF signal guiding element 8 may have a smaller extension than the HF package 14 in both the x and z directions. The HF signal guiding elements 8 may each be substantially rectangular and extend beyond the contour of the semiconductor package 14, i.e., forming a "fan-out" structure. Figure 6 In the example, connecting element 6 can be used to transmit low-frequency signals, that is, the low-frequency terminals of the HF device 600 are not covered by the HF signal guiding element 8. Conversely, the HF signal guiding element 8 can cover the high-frequency terminals of a high-frequency device (see, for example, [reference needed]). Figure 2 (Connecting element 36 in the middle).

[0052] exist Figure 7 In the top view, the high-frequency signal guiding element 8 of the HF device 700 may have a frame-shaped structure along the contour of the HF package 14 or the contour of the HF chip contained in the HF package 14. Here, the (outer) contour of the HF package may (particularly completely) lie within the (outer) contour of the HF signal guiding element 8. Figure 7In one example, the HF signal guiding element 8 can be integrally constructed and form a closed frame-like structure. In another example, the frame-like structure may have openings at one or more locations, allowing the HF signal guiding element 8 to be constructed in multiple parts. During and / or after the manufacture of the HF device 700, the substantially frame-like structure of the HF signal guiding element 8 can stabilize the positioning of the HF device 700 and, in particular, prevent the device from tilting.

[0053] Figure 8 The HF device 800 can be similar to Figure 6 The HF device 600. With Figure 6 In contrast, the HF device 800 may additionally have one or more connecting members or connecting webs 54, which may provide stability to the HF device 800 during and / or after its manufacture. Figure 8 In the example shown, three connecting members 54 are illustrated. In other examples, the number of connecting members may differ, and is typically greater than two. Figure 7 compared to, Figure 8 The HF signal guiding element 8 can have a reduced area in the xz plane. In the x-direction, the side length of the HF package 14 can be greater than the side length of the HF signal guiding element 8. Figure 8 In the example, the side length of the HF signal guiding element 8 can be approximately half the side length "w" of the HF package 14.

[0054] although Figures 6 to 8 The geometry of the HF signal guiding element 8 is different, but Figures 6 to 8 The HF signal guiding element 8 may have the same or similar HF signal guiding structure, antenna structure and / or function.

[0055] Figure 9 The HF device 900 may have multiple HF signal guiding elements 8 arranged above the three side edges of the HF package 14. Figure 9 In the example, three HF signal guiding elements 8A are arranged above the upper edge, and two HF signal guiding elements 8B or 8C are arranged above the left and right edges of the HF package 14, respectively. The number of HF signal guiding elements 8 shown is exemplary and not limiting. Figure 9 In the example, an HF signal guiding element 8 may be provided for each HF terminal of the HF package 14 and arranged above the HF terminal.

[0056] Figure 10 The HF device 1000 can be similar to the HF device 900. Unlike... Figure 9 ,exist Figure 10 In this configuration, only one HF signal guiding element 8 is arranged above each of the three side edges of the HF package 14. For example, in Figure 10 In the HF device 900, the three HF signal guiding elements 8A can be combined into a single HF signal guiding element 8A. The same applies to HF signal guiding elements 8B and 8C.

[0057] exist Figure 11 In the HF device 1100, the HF signal guiding element 8 may have a frame-shaped structure, which is used to stabilize the HF device 1100 during and / or after its manufacture. Figure 9 and Figure 11 In the HF package 14, the same low-frequency terminal 6 may not be covered by the HF signal guiding element 8.

[0058] although Figures 9 to 11 The geometry of the HF signal guiding element 8 is different, but Figures 9 to 11 The HF signal guiding element 8 may have the same or similar HF signal guiding structure, antenna structure and / or function.

[0059] Figure 12 A flowchart of a method for manufacturing an HF device according to the present disclosure is shown. This method can be used to manufacture any of the aforementioned HF devices according to the present disclosure. The method is shown in a general manner to qualitatively illustrate aspects of the present disclosure, and the method may have other aspects. For example, the method can be extended by combining any of the aspects described in other methods or HF devices according to the present disclosure.

[0060] At position 60, multiple HF chips are arranged. Each HF chip includes a connecting element disposed above its respective chip surface, the connecting element being designed to mechanically and electrically connect the respective HF chip to a circuit board. At position 62, a panel having multiple HF signal guiding elements is arranged above the chip surfaces of the HF chips. The HF signal guiding elements are each covered with a non-conductive material and are designed to transmit signals in a direction parallel to the respective chip surface. At position 64, the panel is divided, thereby obtaining multiple HF devices. Each HF device includes at least one HF chip, a connecting element, and an HF signal guiding element. The connecting element and the HF signal guiding element are arranged at the same height with respect to a direction perpendicular to the chip surface. The connecting element is spaced apart from the HF signal guiding element via an area free of non-conductive material.

[0061] Figures 13A to 13G The method shown can be regarded as Figure 12 A more detailed implementation of the method shown is described below. Figure 13F The figure shows an HF device 1300 manufactured according to the method shown in Figure 13. The HF device 1300 can, for example, be similar to... Figure 6 HF device.

[0062] exist Figure 13A The wafer 56 may be provided with multiple HF chips or multiple HF packages 14. The HF packages 14 may be identical HF packages. For example, each HF package 14 may correspond to... Figure 2 HF package. In Figure 13A The example shows thirty HF packages 14, of which fifteen HF packages can form a first checkerboard pattern (see “a”) and another fifteen HF packages can form a second checkerboard pattern (see “b”).

[0063] exist Figure 13B For illustrative purposes, a first chessboard pattern and a second chessboard pattern formed by the HF package 14 are shown separately. Here, the first chessboard pattern may be, in particular, the opposite of the second chessboard pattern.

[0064] exist Figure 13C middle, Figure 13A The chip 56 may have been divided into individual HF packages 14. The first checkerboard pattern HF packages 14 may be arranged in the form of a first checkerboard pattern on a (particularly temporary) carrier (not shown). Figure 13C A top view of the HF package 14 is shown, in which the terminals or connecting elements of the HF package 14 can be seen. Each HF package or corresponding HF chip in the HF package 14 may include a connecting element disposed above the respective chip surface, the connecting element being designed to mechanically and electrically connect the respective HF chip to a circuit board.

[0065] exist Figure 13D In the middle, a panel 58 having multiple HF signal guiding elements 8 can be arranged in Figure 13C Above the HF package 14. According to this disclosure, panel 58 can be a composite or group of multiple HF signal guiding elements 8. Within panel 58, the HF signal guiding elements 8 can be arranged, in particular, in a periodic grid structure. Here, the HF signal guiding elements 8 can be arranged side by side with each other in the lateral direction. The specific design of the HF signal guiding elements 8 of panel 58 and their relative arrangement with each other can depend on the type of HF device(s) to be manufactured. Figure 13D In the example, the HF signal guiding element 8 is essentially constructed as a rectangle, aligned with each other about its side edges, and arranged side by side laterally in a grid-like structure. In the exemplary method of Figure 13, it is possible to manufacture elements that can be used with… Figure 2 and Figure 6The HF device is similar to the HF device. Therefore, each HF signal guiding element in HF signal guiding element 8 can be similar to the HF device. Figure 2 and Figure 6 The HF signal guiding element 8. In another example of Figures 14 and 15, the corresponding panel may have another periodic grid structure of multiple HF signal guiding elements 8, which may be arranged side by side with each other in the lateral direction. Figure 13D In this configuration, the individual HF signal guiding elements 8 can be mechanically connected to each other via a connecting web, allowing the panel 58 to be integrally constructed. The panel 58 can be arranged relative to the HF package 14 such that each HF package in the HF package 14 is covered by three HF signal guiding elements 8A to 8C. Here, the corresponding upper HF signal guiding element 8A and the corresponding lower HF signal guiding element 8C can be arranged relative to the corresponding HF package 14, as shown in... Figure 6 As shown in the image.

[0066] exist Figure 13E In this configuration, panel 58 can be at least partially divided. Here, the central HF signal guide element 8B can be removed, leaving only the upper HF signal guide element 8A and the lower HF signal guide element 8C positioned above the HF package 14. Figure 13E In one example, panel 58 may have HF signal guiding elements 8A and 8C and a connecting web. In another example, panel 58 may be split such that the connecting web is completely separated from the upper HF signal guiding element 8A and the lower HF signal guiding element 8C, and remains connected only to the middle HF signal guiding element 8B.

[0067] Figure 13F It shows the segmentation Figure 13E The HF device 1300 can be obtained after the arrangement shown. The HF device 1300 can, for example, correspond to... Figure 6 HF device.

[0068] Figure 13G The diagram shows a panel 58 after the upper HF signal guiding element 8A and the lower HF signal guiding element 8C have been separated. Therefore, the panel 58 may only include the intermediate HF signal guiding elements 8B, which can be connected to each other via a connecting web. The connecting web can be... Figure 13E The connecting web or an additional connecting web provided.

[0069] In another method step, the HF package 14 with the second checkerboard pattern can be arranged in the form of the second checkerboard pattern on a (particularly temporary) carrier (not shown). Thus, utilizing... Figure 13G Panel 58 can be used Figures 13D to 13FThe method and steps are used to manufacture another HF device 1300.

[0070] Figure 14A and Figure 14D The method shown can be regarded as Figure 12 A more detailed implementation of the method shown is provided below. Figure 14D The figure shows an HF device 1400 manufactured according to the method of FIG14. The HF device 1400 can, for example, be similar to... Figure 7 HF device 700.

[0071] exist Figure 14A Multiple HF packages 14 may be provided. In one example, the HF packages 14 may exist integrally and continuously as a wafer. In another example, the HF packages 14 may have been segmented and arranged side by side.

[0072] Figure 14B A panel 58 with multiple HF signal guiding elements 8, indicated by dashed lines, is shown. The individual HF signal guiding elements 8 can be mechanically connected to each other; that is, the panel 58 can be constructed as a single unit. Each HF signal guiding element 8 can have, for example... Figure 7 The shape shown.

[0073] exist Figure 14C In this configuration, panel 58 can be positioned above HF package 14, such that each HF signal guiding element in HF signal guiding element 8 is placed above the corresponding HF package 14, as shown in... Figure 7 As shown in the image.

[0074] exist Figure 14D In the middle, panel 58 can be divided along the dotted line, from which multiple divided HF devices 1400 can be obtained. Each HF device in HF device 1400 can be similar to Figure 7 HF device 700.

[0075] Figure 15A and Figure 15C The method shown can be regarded as Figure 12 A more detailed implementation of the method shown is described below. Figure 15C The figure shows an HF device 1500 manufactured according to the method shown in Figure 15. The HF device 1500 can, for example, be similar to... Figure 8 HF device 800.

[0076] exist Figure 15A Multiple HF packages 14 may be provided. In one example, the HF packages 14 may exist continuously as wafers. In another example, the HF packages 14 may have been segmented and arranged side by side.

[0077] exist Figure 15B In this configuration, a panel 58 having multiple HF signal guiding elements 8 can be arranged above the HF package 14. The individual HF signal guiding elements 8 can be mechanically connected to each other; that is, the panel 58 can be integrally constructed. Each HF signal guiding element 8 can have, for example... Figure 8 The shape shown. Panel 58 can be arranged above HF package 14 such that each HF signal guiding element in HF signal guiding element 8 is placed above the corresponding HF package 14.

[0078] exist Figure 15C In the middle, panel 58 can be divided, thereby obtaining multiple divided HF devices 1500. Each HF device in HF device 1500 can be similar to Figure 8 HF device 800.

[0079] Example

[0080] The following section illustrates, with examples, an HF device having an HF signal guiding element and a corresponding manufacturing method.

[0081] Example 1 is a high-frequency device comprising: a high-frequency chip; a first connecting element disposed above the chip surface of the high-frequency chip, the first connecting element being designed to mechanically and electrically connect the high-frequency chip to a circuit board; and a high-frequency signal guiding element disposed above the chip surface and electrically coupled to the high-frequency chip, the high-frequency signal guiding element being covered by a non-conductive material and designed to transmit signals in a direction parallel to the chip surface, wherein the first connecting element and the high-frequency signal guiding element are disposed at the same height with respect to a direction perpendicular to the chip surface, and wherein the first connecting element is spaced apart from the high-frequency signal guiding element via a region without non-conductive material.

[0082] Example 2 is a high-frequency device according to Example 1, wherein the high-frequency signal guiding element includes a radiating element.

[0083] Example 3 is a high-frequency device according to Example 2, wherein a high-frequency signal guiding element is covered by a dielectric substrate and has at least one structured metal layer disposed above the surface of the dielectric substrate, wherein the structured metal layer forms a radiating element.

[0084] Example 4 is a high-frequency device according to any of the preceding examples, wherein the first connecting element has a larger extension than the high-frequency signal guiding element in a direction perpendicular to the chip surface.

[0085] Example 5 is a high-frequency device according to any of the preceding examples, wherein the high-frequency signal guiding element has a larger extension than the first connecting element in a direction parallel to the chip surface.

[0086] Example 6 is a high-frequency device according to any of the preceding examples, wherein: the high-frequency chip is designed to operate at a frequency greater than 1 GHz, and the high-frequency signal guiding element is designed to transmit a signal having a frequency greater than 1 GHz.

[0087] Example 7 is a high-frequency device according to any of the preceding examples, wherein the first connecting element is designed to transmit a signal having a frequency of less than 1 GHz.

[0088] Example 8 is a high-frequency device according to any of the preceding examples, wherein the first connecting element is designed to provide a thermal path perpendicular to the chip surface in a direction away from the high-frequency chip.

[0089] Example 9 is a high-frequency device according to any of the preceding examples, wherein a high-frequency signal guiding element and a high-frequency chip are mechanically and electrically connected via a second connecting element.

[0090] Example 10 is a high-frequency device according to Example 9, wherein the first connecting element has a larger extension than the second connecting element in a direction perpendicular to the chip surface.

[0091] Example 11 is a high-frequency device according to any one of Examples 1 to 8, wherein the high-frequency signal guiding element and the high-frequency chip are electrically coupled in a non-contact manner.

[0092] Example 12 is a high-frequency device according to any of the preceding examples, wherein, in a top view of the chip surface, a high-frequency signal guiding element protrudes beyond the outline of the high-frequency chip.

[0093] Example 13 is a high-frequency device according to any of the preceding examples, wherein, in a top view of the chip surface, the high-frequency signal guiding element has a frame-shaped structure along the contour of the high-frequency chip.

[0094] Example 14 is a high-frequency device according to any of the preceding examples, wherein, in a top view of the chip surface, a high-frequency signal guiding element covers the high-frequency terminals of the high-frequency device.

[0095] Example 15 is a high-frequency device according to any of the preceding examples, wherein the high-frequency signal guiding element includes a sub-circuit board designed to mechanically and electrically connect the high-frequency device to the circuit board.

[0096] Example 16 is a high-frequency device according to Example 15, wherein the sub-circuit board is designed to transmit a high-frequency signal from a first surface of the sub-circuit board through the sub-circuit board to an opposite surface of the sub-circuit board.

[0097] Example 17 is a high-frequency device according to any of the preceding examples, further comprising: a third connecting element disposed on a surface of the high-frequency signal guiding element away from the chip surface, wherein the third connecting element is designed to mechanically and electrically connect the high-frequency signal guiding element to the circuit board.

[0098] Example 18 is a high-frequency device according to any of the preceding examples, further comprising: a circuit board, wherein the high-frequency chip is mechanically and electrically connected to the circuit board via a first connecting element; and a gap formed between the circuit board and the high-frequency chip, wherein the first connecting element and the high-frequency signal guiding element are arranged in the gap.

[0099] Example 19 is a high-frequency device according to Example 18, wherein the circuit board is arranged below the high-frequency chip and the surface facing the high-frequency chip has no high-frequency conductive structure.

[0100] Example 20 is a method for manufacturing a high-frequency device, the method comprising: arranging a plurality of high-frequency chips, wherein each high-frequency chip includes a connecting element disposed on a respective chip surface, the connecting element being designed to mechanically and electrically connect the respective high-frequency chip to a circuit board; arranging a panel having a plurality of high-frequency signal guiding elements above the chip surfaces of the high-frequency chips, wherein the high-frequency signal guiding elements are respectively covered by a non-conductive material and are designed to transmit signals in a direction parallel to the respective chip surfaces; and dividing the panel to obtain a plurality of high-frequency devices, wherein each high-frequency device includes at least one high-frequency chip, a connecting element, and a high-frequency signal guiding element, wherein the connecting element and the high-frequency signal guiding element are arranged at the same height with respect to a direction perpendicular to the chip surfaces, and wherein the connecting element is spaced apart from the high-frequency signal guiding element via a region without non-conductive material.

[0101] Example 21 is based on the method of Example 20, wherein multiple high-frequency chips are arranged in a first chessboard pattern.

[0102] Example 22 is a method according to Example 21, further comprising: arranging additional high-frequency chips in a second chessboard pattern opposite to the first chessboard pattern, wherein each of these additional high-frequency chips includes a connecting element disposed above a respective chip surface, the connecting element being designed to mechanically and electrically connect the respective high-frequency chip to a circuit board; arranging a panel above the chip surfaces of the additional high-frequency chips; and further dividing the panel to obtain additional high-frequency devices, wherein each of these additional high-frequency devices includes at least one high-frequency chip, a connecting element, and a high-frequency signal guiding element, wherein the connecting element and the high-frequency signal guiding element are arranged at the same height with respect to a direction perpendicular to the chip surface, and wherein the connecting element is spaced apart from the high-frequency signal guiding element via a region free of non-conductive material.

[0103] For the purposes of this specification, the terms “connection,” “coupling,” “electrical connection,” and / or “electrical coupling” do not necessarily mean that components must be directly connected or coupled to each other. An intermediate component may exist between components that are “connected,” “coupled,” “electrically connected,” or “electrically coupled.”

[0104] Furthermore, in this specification, the terms "above" or "on" as used, for example, with reference to a material layer constructed "above" or "on" a surface of an object, can be used to mean that the material layer is disposed "directly" (e.g., constructed, deposited, etc.) on the surface in question, for example, in direct contact with it. In this document, the terms "above" or "on" as used, for example, with reference to a material layer constructed or disposed "above" or "on" a surface, can also be used to mean that the material layer is disposed "indirectly" (e.g., constructed, deposited, etc.) on the surface in question, wherein one or more additional layers, for example, exist between the surface in question and the material layer.

[0105] Whenever the words “have,” “comprising,” “have,” “with,” or variations thereof are used in the detailed description or claims, these words are intended to be inclusive in a manner similar to the word “including.” This means that, in the sense of this specification, the words “have,” “comprising,” “have,” “have,” “including,” etc., are open-ended terms that indicate the presence of the mentioned element or feature but do not exclude other elements or features. The articles “a” or “the” should be understood to include both plural and singular meanings unless the context clearly indicates otherwise.

[0106] Furthermore, in this document, the word "exemplary" is used to mean: it serves as an example, situation, or illustration. An aspect or design described herein as "exemplary" is not necessarily to be understood as having an advantage over other aspects or designs. Rather, the use of the word "exemplary" is intended to present a concept in a concrete manner. In the sense of this application, the word "or" does not mean exclusive "or" but inclusive "or." That is, unless otherwise stated or the context allows for a different meaning, "X uses A or B" indicates any natural inclusive arrangement. That is, if X uses A, X uses B, or X uses A and B, then in each of the above cases, "X uses A or B" is satisfied. Additionally, in the sense of this application and the appended claims, the article "a / an" can generally be interpreted as "one or more," unless explicitly stated or clearly apparent from the context that it refers only to the singular. Furthermore, at least one of A and B generally refers to A or B or A and B.

[0107] This specification describes apparatus and methods for manufacturing the apparatus. The description relating to the described apparatus may also be applied to the corresponding methods, and vice versa. For example, if a particular component of the apparatus is described, the corresponding method for manufacturing the apparatus may include the operation of providing that component in a suitable manner, even if that operation is not explicitly described or shown in the accompanying drawings. Furthermore, unless otherwise explicitly stated, features of the various exemplary aspects described herein may be combined with each other.

[0108] Although this disclosure has been shown and described with reference to one or more embodiments, those skilled in the art can make equivalent changes and modifications, at least in part, based on a reading and understanding of this specification and the drawings. This disclosure includes all such modifications and changes and is limited only by the concepts of the appended claims. In particular, reference to the various functions performed by the aforementioned components (e.g., elements, resources, etc.) is intended to indicate, unless otherwise stated, that the terms used to describe these components correspond to any component that performs the specified function of the said component (which is, for example, functionally equivalent), even if it is not structurally equivalent to the disclosed structure that performs the function of the exemplary embodiments described herein. Furthermore, even if a particular feature of this disclosure is disclosed with reference to only one embodiment of different embodiments, that feature can be combined with one or more other features of other embodiments, provided that it is desired and advantageous for a given or particular application.

Claims

1. A high-frequency device, comprising: High-frequency chips; A first connecting element is disposed above the chip surface of the high-frequency chip, and the first connecting element is designed to mechanically and electrically connect the high-frequency chip to the circuit board. A high-frequency signal guiding element is disposed above the chip surface and electrically coupled to the high-frequency chip. The side of the high-frequency signal guiding element facing away from the chip surface is covered with a non-conductive material and is designed to transmit signals in a direction parallel to the chip surface. as well as A gap is formed between the circuit board and the high-frequency chip. The first connecting element and the high-frequency signal guiding element are arranged in the gap, wherein the first connecting element has a larger extension than the high-frequency signal guiding element in a direction perpendicular to the chip surface, and The first connecting element is spaced apart from the high-frequency signal guiding element via a region without the non-conductive material.

2. The high-frequency device according to claim 1, wherein the high-frequency signal guiding element includes a radiating element.

3. The high-frequency device according to claim 2, wherein the high-frequency signal guiding element is covered by a dielectric substrate made of the non-conductive material and has at least one structured metal layer disposed above the surface of the dielectric substrate, wherein the structured metal layer forms the radiating element.

4. The high-frequency device according to any one of claims 1 to 3, wherein the first connecting element has a greater extension than the high-frequency signal guiding element in a direction perpendicular to the chip surface.

5. The high-frequency device according to any one of claims 1 to 3, wherein the high-frequency signal guiding element has a greater extension than the first connecting element in a direction parallel to the surface of the chip.

6. The high-frequency device according to any one of claims 1 to 3, wherein: The high-frequency chip is designed to operate at frequencies greater than 1 GHz, and The high-frequency signal guiding element is designed to transmit signals with frequencies greater than 1 GHz.

7. The high-frequency device according to any one of claims 1 to 3, wherein the first connecting element is designed to transmit a signal having a frequency of less than 1 GHz.

8. The high-frequency device according to any one of claims 1 to 3, wherein the first connecting element is designed to provide a thermal path perpendicular to the surface of the chip in a direction away from the high-frequency chip.

9. The high-frequency device according to any one of claims 1 to 3, wherein the high-frequency signal guiding element and the high-frequency chip are mechanically and electrically connected via a second connecting element.

10. The high-frequency device of claim 9, wherein the first connecting element has a greater extension than the second connecting element in a direction perpendicular to the chip surface.

11. The high-frequency device according to any one of claims 1 to 3, wherein the high-frequency signal guiding element and the high-frequency chip are electrically coupled in a non-contact manner.

12. The high-frequency device according to any one of claims 1 to 3, wherein, in a top view of the chip surface, the high-frequency signal guiding element protrudes beyond the outline of the high-frequency chip.

13. The high-frequency device according to any one of claims 1 to 3, wherein, in a top view of the chip surface, the high-frequency signal guiding element has a frame-shaped structure along the contour of the high-frequency chip.

14. The high-frequency device according to any one of claims 1 to 3, wherein, in a top view of the chip surface, the high-frequency signal guiding element covers the high-frequency terminals of the high-frequency device.

15. The high-frequency device according to any one of claims 1 to 3, wherein the high-frequency signal guiding element includes a sub-circuit board, the sub-circuit board being designed to mechanically and electrically connect the high-frequency device to the circuit board.

16. The high-frequency device of claim 15, wherein the sub-circuit board is designed to transmit a high-frequency signal from a first surface of the sub-circuit board through the sub-circuit board to an opposite surface of the sub-circuit board.

17. The high-frequency device according to any one of claims 1 to 3, further comprising: A third connecting element is disposed on the surface of the high-frequency signal guiding element opposite to the chip surface, wherein the third connecting element is designed to mechanically and electrically connect the high-frequency signal guiding element to the circuit board.

18. The high-frequency device of claim 1, wherein the surface of the circuit board disposed below the high-frequency chip and directly facing the high-frequency chip has no high-frequency conductive structure.

19. A method for manufacturing a high-frequency device, wherein the method comprises: Multiple high-frequency chips are arranged, wherein each high-frequency chip includes a connection element arranged above a respective chip surface, the connection element being designed to mechanically and electrically connect the respective high-frequency chip to a circuit board. A panel with multiple high-frequency signal guiding elements is arranged above the chip surface of the high-frequency chip, wherein the side of the high-frequency signal guiding element facing away from the chip surface is covered with a non-conductive material and is designed to transmit signals in a direction parallel to the corresponding chip surface. A gap is formed between the circuit board and the high-frequency chip, wherein the connecting element and the high-frequency signal guiding element are arranged in the gap, wherein the connecting element has a larger extension than the high-frequency signal guiding element in a direction perpendicular to the chip surface; and The panel is divided to obtain a plurality of high-frequency devices, each of which includes at least one high-frequency chip, a connecting element, and a high-frequency signal guiding element, wherein the connecting element is spaced apart from the high-frequency signal guiding element via a region without the non-conductive material.

20. The method of claim 19, wherein the plurality of high-frequency chips are arranged in a first checkerboard pattern.

21. The method of claim 20, further comprising: Additional high-frequency chips are arranged in a second chessboard pattern opposite to the first chessboard pattern, wherein each of the additional high-frequency chips includes a connection element arranged above the respective chip surface, the connection element being designed to mechanically and electrically connect the respective high-frequency chip to the circuit board. The panel is arranged above the chip surface of the other high-frequency chip. A gap is formed between the circuit board and the additional high-frequency chip, wherein the connecting element and the high-frequency signal guiding element are arranged in the gap; as well as The panel is further divided to obtain additional high-frequency devices, each of which includes at least one high-frequency chip, a connecting element, and a high-frequency signal guiding element, wherein the connecting element is spaced apart from the high-frequency signal guiding element via a region free of the non-conductive material.

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