Display device

Abstract

A display device includes a first through-hole, a plurality of pixels in a display area around the first through-hole, a first layer in an intermediate area between the first through-hole and the display area and including a first hole or recess, and a second layer on the first layer and including a second hole overlapping the first hole or recess, and the second layer includes a tip extending further toward a center of the second hole than an inner surface of the first layer defining the first hole or recess, each of the plurality of pixels includes a light emitting diode including a pixel electrode, an opposite electrode, and an intermediate layer between the pixel electrode and the opposite electrode, and at least one organic material layer of the intermediate layer is broken at the tip.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2019-0133261, filed on October 24, 2019, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] One or more aspects of the implementation relate to a display device. Background Technology

[0004] Display devices have been used for a variety of purposes. Moreover, because the thickness and weight of display devices have been reduced, their applications have expanded.

[0005] In display devices, various functions associated with the display device are being added along with the increase in display area. As a method of adding various functions while increasing the area, research has been ongoing on display devices that have areas within the display area for providing various functions other than image display. Summary of the Invention

[0006] According to one or more embodiments, the display device includes a transmissive region inside the display area in which components are placed. One or more embodiments include structures that improve the performance of preventing moisture penetration in a display device having a transmissive region. However, the above aspects are provided as examples, and the scope of this disclosure is not limited thereto.

[0007] Other aspects will be set forth in part in the description which follows, and will be apparent in part from the description, or may be learned by practicing the embodiments presented in this disclosure.

[0008] According to one or more embodiments, a display device includes: a first through-hole; a plurality of pixels in a display area surrounding the first through-hole, the plurality of pixels including two pixels spaced apart from each other, the first through-hole being between the two pixels; a first layer in an intermediate region between the first through-hole and the display area, the first layer including the first hole or recess; and a second layer on the first layer, the second layer including a second hole overlapping the first hole or recess, wherein the second layer includes a tip extending further toward the center of the second hole than the inner surface of the first layer, the inner surface defining the first hole or recess, each of the plurality of pixels including a light-emitting diode, the light-emitting diode including a pixel electrode, a counter electrode, and an intermediate layer between the pixel electrode and the counter electrode, and at least one organic material layer of the intermediate layer being broken at the tip.

[0009] At least one organic material layer may include one or more selected from hole transport layers, hole injection layers, electron injection layers, and electron transport layers.

[0010] The opposite electrode can be disconnected at the tip.

[0011] The first layer may include an organic insulating material, and the second layer may include a metal.

[0012] The display device may further include a substrate on which a plurality of pixels are disposed, and at least one inorganic insulating layer between the substrate and the pixel electrodes.

[0013] The first layer may be on at least one inorganic insulating layer, and the second layer may extend beyond the first layer and directly contact the upper surface of at least one inorganic insulating layer.

[0014] The display device may further include at least one organic insulating layer between at least one inorganic insulating layer and a pixel electrode, and the first layer may include the same material as the material included in the at least one organic insulating layer.

[0015] A portion of the substrate may be bent about a bending axis extending along the bending region, and at least one inorganic insulating layer may include an opening in the bending region.

[0016] The display device may further include an organic insulating layer in an opening of at least one inorganic insulating layer, and the first layer may include the same material as the material included in the organic insulating layer.

[0017] The display device may further include an inorganic passivation layer on the second layer.

[0018] The inorganic passivation layer can continuously cover the side and bottom surfaces of the second layer as well as the internal surface of the first layer.

[0019] According to one or more embodiments, a display device includes: a substrate; a display layer on the substrate, the display layer including a plurality of pixels; a thin-film encapsulation layer on the display layer, the thin-film encapsulation layer including at least one inorganic encapsulation layer and at least one organic encapsulation layer; a first via between two adjacent pixels among the plurality of pixels, the first via penetrating the substrate, the display layer and the thin-film encapsulation layer; and a first groove around the first via, the first groove being defined in a first layer and a second layer on the first layer, wherein the first groove includes a first hole or recess in the first layer and a second hole in the second layer, the second layer including a tip extending further toward the center of the second hole than the inner surface of the first layer, the inner surface defining the first hole or recess, and at least one organic material layer in the display layer being broken at the first groove.

[0020] Each of the plurality of pixels may include a light-emitting diode, the light-emitting diode including a pixel electrode, a counter electrode and an emitting layer between the pixel electrode and the counter electrode, and at least one organic material layer may be between the pixel electrode and the counter electrode.

[0021] At least one organic material layer may include one or more selected from hole transport layers, hole injection layers, electron injection layers, and electron transport layers.

[0022] The display layer may include at least one inorganic insulating layer between the substrate and the pixel electrode, and the first layer may be on at least one inorganic insulating layer.

[0023] The first layer may include organic insulating materials.

[0024] The second layer can bypass the first layer and directly contact the upper surface of at least one inorganic insulating layer.

[0025] The second layer may include metal or inorganic insulating materials.

[0026] The display device may further include an inorganic passivation layer on the second layer.

[0027] The inorganic passivation layer can continuously cover the side and bottom surfaces of the second layer as well as the internal surface of the first layer.

[0028] A portion of the substrate may be bent about a bending axis extending along the bending region, and at least one inorganic insulating layer may include an opening in the bending region.

[0029] The display device may further include an organic insulating layer in an opening of at least one inorganic insulating layer, and the first layer may include the same material as the material included in the organic insulating layer.

[0030] The display device may further include a second groove around the first through hole, and a barrier wall between the first groove and the second groove.

[0031] The barrier wall may include multiple stacked barrier wall layers, and a gap layer may be between two adjacent barrier wall layers, the gap layer comprising metal.

[0032] The gap layer may include a first layer and a second layer below the first layer, the first layer having an edge that protrudes further outward than the edge of the second layer, and at least one organic material layer may be broken at an eave structure formed by the edges of the first layer and the second layer.

[0033] Other aspects, features, and advantages of this disclosure will become better understood from the accompanying drawings, claims, and detailed description. Attached Figure Description

[0034] The above and other aspects, features, and advantages of certain embodiments of this disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, wherein:

[0035] Figure 1 This is a perspective view of the display device according to the embodiment;

[0036] Figure 2 For along Figure 1 A cross-sectional view of the display device according to the embodiment, taken from line II-II';

[0037] Figure 3 A cross-sectional view of an electronic device including a display device according to an embodiment;

[0038] Figure 4 This is a plan view of the display panel according to the embodiment;

[0039] Figure 5 This is a perspective view of a substrate in a display panel according to an embodiment;

[0040] Figure 6 This is an equivalent circuit diagram of pixels in a display panel according to an embodiment;

[0041] Figure 7 A plan view of the display panel according to an embodiment is shown in part;

[0042] Figure 8 This is a cross-sectional view of the display device according to an embodiment;

[0043] Figure 9 and Figure 10 Here is a cross-sectional view of a groove structure according to some embodiments;

[0044] Figure 11 This is a cross-sectional view of the display panel according to the embodiment;

[0045] Figure 12 A cross-sectional view of the display device according to an embodiment is shown in part;

[0046] Figures 13 to 15 To illustrate a cross-sectional view of a groove structure according to some embodiments; and

[0047] Figure 16 To show the barrier wall Figure 12 An enlarged cross-sectional view of region XVI. Detailed Implementation

[0048] The embodiments will now be described in more detail with reference to the accompanying drawings, some examples of which are illustrated in the accompanying drawings, wherein the same reference numerals refer to the same elements throughout. In this regard, the embodiments may take different forms and should not be construed as limited to the description set forth herein. Therefore, with reference to the drawings, only some exemplary embodiments are described below to explain aspects of this description. As used herein, the term “and / or” includes any and all combinations of one or more of the associated enumerated items. Throughout this disclosure, the expression “at least one of a, b, and c” indicates only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0049] Some exemplary embodiments will now be described in further detail with reference to the accompanying drawings. Regardless of the figures, the same or corresponding components are given the same reference numerals, and redundant explanations may be omitted.

[0050] Although terms such as "first" and "second" can be used to describe various components, such components are not limited by these terms. The terms are used to distinguish one component from another.

[0051] A singular expression may encompass a plural expression unless it has a distinctly different meaning in the context.

[0052] In this specification, it should be understood that the terms “comprising,” “having,” and “including” are intended to indicate the presence of the features, figures, steps, actions, components, parts, or combinations thereof disclosed in the specification, but are not intended to exclude the possibility that one or more other features, figures, steps, actions, components, parts, or combinations thereof may be present or added.

[0053] It should be understood that when a layer, region, or component is referred to as being "formed" "on" another layer, region, or component, it may be formed directly or indirectly on that other layer, region, or component. That is, for example, one or more intermediate layers, regions, or components may exist.

[0054] For ease of explanation, the dimensions of the components in the accompanying drawings may be enlarged. In other words, because the dimensions and thicknesses of the components in the accompanying drawings can be interpreted arbitrarily for ease of explanation, the implementation is not limited to this.

[0055] When a particular implementation method can be carried out differently, the specific process sequence may be performed differently than the order in which it is described. For example, two consecutively described processes may be performed substantially simultaneously or in the reverse order of their description.

[0056] In the following embodiments, when layers, areas, or elements are referred to as “connections,” it should be understood that they may be directly connected, or there may be one or more intermediate portions between layers, areas, or elements. For example, when layers, areas, or elements are referred to as “electrical connections,” they may be directly electrically connected, or layers, areas, or elements may be indirectly electrically connected and there may be one or more intermediate portions.

[0057] Unless otherwise specified, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which the exemplary embodiments of the inventive concept pertain. It should be further understood that terms, such as those defined in common dictionaries, should be interpreted as having meanings consistent with their meanings in the context of the relevant field and will not be interpreted in an ideal or overly formal sense unless expressly so defined herein.

[0058] Figure 1 This is a perspective view of the display device 1 according to an embodiment.

[0059] refer to Figure 1 The display device 1 may include a display area DA and an outer peripheral area PA surrounding the display area DA (e.g., surrounding the display area DA). A transmissive area TA and an intermediate area MA surrounding the transmissive area TA (e.g., surrounding the transmissive area TA) may be inside the display area DA.

[0060] Multiple pixels, such as an array of pixels, may be present in the display area DA. The display area DA can display an image via the array of pixels. The display area DA corresponds to the effective area for displaying the image. In an embodiment, the display area DA may completely surround the transmissive area TA.

[0061] Components that can provide any of the various functions to the display device 1 may be located in the transmissive zone TA. For example, when the components include a light sensor, a camera, etc., light emitted from the sensor, light traveling to the sensor, or light traveling toward the camera may pass through the transmissive zone TA.

[0062] The intermediate region MA is located between the transmissive region TA and the display region DA, and may surround the transmissive region TA (e.g., encircle the transmissive region TA). The intermediate region MA may be a type of non-display area in which no pixels are placed. Lines configured to provide signals or voltages (e.g., predetermined signals or voltages) to pixels adjacent to the transmissive region TA may be in the intermediate region MA. Slots, which will be described later, may be in the intermediate region MA.

[0063] Similar to the central area MA, the outer peripheral area PA can be a non-display area where no pixels are placed. Various types of lines, circuits, etc., can be placed in the outer peripheral area PA.

[0064] In one embodiment, each pixel in the display device 1 may include a light-emitting diode (LED) as a display element that emits light of a certain color (e.g., a predetermined color). In another embodiment, the LED may include an organic light-emitting diode (OLED) comprising an organic material as an emitting layer. In yet another embodiment, the LED may include an inorganic LED. In yet another embodiment, the LED may include quantum dots as an emitting layer. For ease of description, the case in which the LED comprises an organic LED will be described herein.

[0065] Figure 1The diagram shows the transmissive region TA at the center of the display region DA in the width direction (e.g., ±x direction) of the display device 1, but the implementation is not limited to this. In another embodiment, the transmissive region TA may be offset to the left or right in the width direction of the display device 1. In another embodiment, the transmissive region TA may be located at any of a variety of positions (e.g., upper, middle, or lower) in the longitudinal direction (e.g., ±y direction) of the display device 1.

[0066] Figure 1 The display device 1 shown may include a transmissive area TA; however, in another embodiment, the display device 1 may include multiple transmissive areas TA.

[0067] Figure 2 For along Figure 1 A cross-sectional view of display device 1 taken from line II-II'; and Figure 3 This is a cross-sectional view of an electronic device 2 including a display device 1 according to an embodiment.

[0068] refer to Figure 2 In one embodiment, the display device 1 may include a display panel 10, and an input sensing unit 40 and an optical function unit 50 on the upper surface of the display panel 10. In another embodiment, the window 60 may be bonded to an element below it, such as the optical function unit 50, via, for example, an optically clear adhesive (OCA).

[0069] The display panel 10 may include a plurality of light-emitting diodes (LEDs) in the display area DA. The display panel 10 may include lines (e.g., data lines, scan lines, drive voltage lines, common voltage lines, etc.) for providing signals or voltages to each of the plurality of LEDs and transistors electrically connected to the plurality of LEDs respectively.

[0070] The input sensing unit 40 can obtain coordinate information based on external input (e.g., a touch event). The input sensing unit 40 may include touch electrodes and traces connected to the touch electrodes. The input sensing unit 40 may be located on the display panel 10. The input sensing unit 40 can sense external input using mutual capacitance or self-capacitance methods.

[0071] In one embodiment, the input sensing unit 40 may be directly on the display panel 10. In another embodiment, the input sensing unit 40 may be manufactured separately and attached to the display panel 10 via an adhesive layer (such as optically clear adhesive OCA). In other embodiments, such as Figure 2 As shown, the input sensing unit 40 may be directly on the display panel 10, and in this case, the adhesive layer may not be between the input sensing unit 40 and the display panel 10.

[0072] In one embodiment, the optical functional unit 50 may include an anti-reflective layer. The anti-reflective layer reduces the reflectivity of light (external light) incident from the outside through the window 60 onto the display panel 10. In another embodiment, the anti-reflective layer may include a retarder and a polarizer. The retarder may be a film-type or a liquid crystal coating-type, and may include a λ / 2 retarder and / or a λ / 4 retarder. The polarizer may be a film-type or a liquid crystal coating-type. A film-type polarizer may include a stretched synthetic resin film, and a liquid crystal coating-type polarizer may include liquid crystal arranged in a specific orientation. The retarder and polarizer may further include a protective film.

[0073] In another embodiment, the antireflective layer may include a structure comprising a black matrix and color filters. The color filters may be arranged considering the color of light emitted from each of the pixels in the display panel 10. In another embodiment, the antireflective layer may include a destructive interference structure. The destructive interference structure may include a first reflective layer and a second reflective layer disposed on different layers. The first reflected light and the second reflected light reflected by the first reflective layer and the second reflective layer, respectively, may destructively interfere with each other, and thus reduce the reflectivity of external light.

[0074] In one embodiment, the optical functional unit 50 may include a lens layer. The lens layer may improve the luminous efficiency of light emitted from the display panel 10 or reduce chromatic aberration. The lens layer may include a layer having a concave or convex lens shape and / or may include multiple layers with different refractive indices. The optical functional unit 50 may include both an anti-reflective layer and a lens layer, or may include either an anti-reflective layer or a lens layer.

[0075] refer to Figure 3 The display device 1 may be included in various types of electronic devices 2 (e.g., mobile phones, tablet PCs, laptops, smartwatches, etc.). The electronic device 2 includes a housing HS with internal space, and the display panel 10 may be located within the housing HS. The window 60 may be attached to the housing HS. As described above, the input sensing unit 40 and the optical function unit 50 are located on the upper surface of the display panel 10.

[0076] The component CP is located within the housing HS and can be placed between the display panel 10 and the inner bottom surface of the housing HS. The component CP can be located within the transmissive area TA. The transmissive area TA can be referred to as the component area in which the component CP is placed.

[0077] Component CP may include electronic components. For example, component CP may be an electronic component that uses light. For example, electronic components may include sensors that receive light, such as infrared sensors, cameras that capture images by receiving light, sensors that output and sense light to measure distance or identify fingerprints, small lamps that illuminate light, etc.

[0078] Electronic components using light can utilize light of various wavelengths, such as visible light, infrared light, and ultraviolet light. In one embodiment, when component CP includes a camera, the transmittance of display device 1 in the transmission region TA can be about 70% or greater. In another embodiment, when component CP includes a sensor, the transmittance of display device 1 in the transmission region TA can be less than 70%, for example, about 50% or greater, or 60% or greater.

[0079] In an embodiment, to prevent or substantially prevent a decrease in transmittance due to elements in the path of light emitted from or traveling toward the component CP, the display device 1 may include an opening OP (see Figure 2 The opening OP can be created by partially removing at least one of the elements included in the display device 1 (e.g., display panel 10, input sensing unit 40, optical function unit 50, and window 60). In an embodiment, Figure 2 The display panel 10, the input sensing unit 40, and the optical function unit 50 are shown to include first through holes to third through holes 10H, 40H, and 50H that define the opening OP, respectively.

[0080] refer to Figure 2 The display panel 10 includes a first through-hole 10H extending from the upper surface of the display panel 10 to the lower surface, the input sensing unit 40 includes a second through-hole 40H extending from the upper surface of the input sensing unit 40 to the lower surface, and the optical function unit 50 includes a third through-hole 50H extending from the upper surface of the optical function unit 50 to the lower surface. The first through-hole to the third through-hole 10H, 40H and 50H are in the transmission region TA and can overlap each other.

[0081] Figure 4 This is a plan view of the display panel 10 according to the embodiment; and Figure 5 This is a perspective view of the substrate 100 in the display panel 10 according to an embodiment.

[0082] refer to Figure 4 The display panel 10 includes pixels P on the substrate 100. Pixels P are in the display area DA to provide an image. Each of the pixels P may include a display element capable of emitting light of a certain color, such as a light-emitting diode.

[0083] The first through-hole 10H can be located in the display area DA. Because the first through-hole 10H is located in the display area DA, the pixel P can be located on the opposite side of the first through-hole 10H. For example, the first through-hole 10H can be located between two adjacent pixels P.

[0084] The intermediate region MA may have a region surrounding (e.g., around) the first through-hole 10H. Lines (e.g., data lines, scan lines, drive voltage lines, etc.) configured to apply signals or voltages to pixels P surrounding the first through-hole 10H may be partially located in the intermediate region MA. The intermediate region MA may include a groove as described later, which is a structure for preventing or substantially preventing moisture infiltration.

[0085] The peripheral area PA may surround the display area DA (e.g., encircle the display area DA). Scan drivers, data drivers, etc., may be located within the peripheral area PA. The pads PAD may be located within the peripheral area PA. The pads PAD may be adjacent to the edge of the substrate 100. In some embodiments, the pads PAD are not covered by an insulating layer but are exposed and electrically connected to the flexible printed circuit board (FPCB). The FPCB electrically connects a controller to the pads PAD and can supply signals or electrical power transmitted from the controller to the pads PAD. In some embodiments, the data driver may be located within the FPCB. To transmit signals or voltages from the FPCB to the pixel P, the pads PAD may be connected to multiple lines 20.

[0086] In one embodiment, the peripheral region PA may include a curved region BA. The curved region BA may be located between the pad PAD and the display area DA. The curved region BA may extend in a direction intersecting the direction in which its centerline 20 extends. The curved region BA may extend in a direction parallel to the edge of the substrate 100. Based on the curved region BA, the substrate 100 may include or be divided into a first region 1A including the display area DA and a second region 2A opposite to the first region 1A. The curved region BA is located between the first region 1A and the second region 2A. The first region 1A includes a portion of the display area DA and the peripheral region PA, and the second region 2A may include only a portion of the peripheral region PA.

[0087] The display panel 10 can be bent around the bending area BA. In this respect, Figure 5 The substrate 100 of the display panel 10 is shown to be bent. The substrate 100 is bent about a bending axis BAX extending in the y-direction, and therefore, the display panel 10 can also be bent in the same way as the substrate 100. The substrate 100 may comprise any of a variety of flexible or bendable materials (e.g., polymer resin). Figure 5 The bending of substrate 100 is explained, but the layers on substrate 100 included in display panel 10 can also be bent together with substrate 100.

[0088] like Figure 4As shown, each of the lines 20 may include: a first portion 21 and a second portion 22 on opposite sides of the bend region BA, and a third portion 23 connecting the first portion 21 and the second portion 22. The first portion 21 is between the display area DA and the bend region BA, the second portion 22 may be between the bend region BA and the pad PAD, and the third portion 23 may be in the bend region BA.

[0089] When the substrate 100 is bent about the bending axis BAX, the line 20 may break, or the layers on and / or under the line 20 may be peeled off. To prevent or substantially prevent this, as described above, the line 20 includes a first portion 21 and a second portion 22 separated from each other, a bending region BA between the first portion 21 and the second portion 22, and the first portion 21 and the second portion 22 may be connected to each other via a third portion 23 comprising a material having relatively high flexibility.

[0090] Figure 6 This is an equivalent circuit diagram of pixel P in a display panel according to an embodiment.

[0091] refer to Figure 6 A light-emitting diode, such as an organic light-emitting diode (OLED), can be connected to a pixel circuit PC. The pixel circuit PC may include a first thin-film transistor T1, a second thin-film transistor T2, and a storage capacitor Cst. Each of the pixels P can emit light from the organic light-emitting diode OLED, such as red, green, blue, or white light.

[0092] The second thin-film transistor T2 is a switching thin-film transistor connected to the scan line SL and the data line DL, and is configurable to transfer the data voltage input from the data line DL to the first thin-film transistor T1 based on the switching voltage input from the scan line SL. A storage capacitor Cst is connected to the second thin-film transistor T2 and the drive voltage line PL and can store a voltage corresponding to the difference between the voltage transferred from the second thin-film transistor T2 and the first power supply voltage ELVDD supplied to the drive voltage line PL.

[0093] The first thin-film transistor T1 is a driving thin-film transistor connected to the driving voltage line PL and the storage capacitor Cst, and can control the driving current flowing from the driving voltage line PL into the organic light-emitting diode (OLED) according to the voltage value stored in the storage capacitor Cst. The OLED can emit light with a certain brightness according to the driving current. The opposite electrode (e.g., the cathode) of the OLED can receive a second power supply voltage ELVSS.

[0094] Figure 6The pixel circuit PC is described as including two thin-film transistors and one storage capacitor, but the implementation is not limited to this. The number of thin-film transistors and the number of storage capacitors can vary depending on the design of the pixel circuit PC. For example, in addition to the two thin-film transistors described above, the pixel circuit PC may include four or more thin-film transistors.

[0095] Figure 7 A plan view of the display panel 10 according to an embodiment is shown in part.

[0096] refer to Figure 7 Pixel P is located in the display area DA, and the first through-hole 10H may be defined between adjacent pixels P. For example, in a plan view, pixel P is located above and below the first through-hole 10H, and to the left and right of the first through-hole 10H.

[0097] One or more slots G may be located in the intermediate region MA to prevent or substantially prevent moisture from seeping in through the first through-hole 10H and from damaging the light-emitting diodes in the pixel P. In an embodiment, multiple slots G may be provided as concentric circles. The multiple slots G may be spaced apart from each other. Figure 7 Two slots G are shown, but three or more slots G can be provided.

[0098] Figure 8 This is a cross-sectional view of the display device according to an embodiment; and Figure 9 and Figure 10 Cross-sectional views of the groove structure according to each embodiment are shown. Figure 8 The image shows the display panel 10 and the touch sensing part of the display device, and the optical function part is omitted for ease of description.

[0099] refer to Figure 8 The display panel 10 (including: a substrate 100; a display layer 200 including an array of multiple pixels; and a thin-film encapsulation layer 300) includes a first through-hole 10H corresponding to a transmissive region TA, and the input sensing portion 40 on the display panel 10 includes a second through-hole 40H corresponding to the transmissive region TA. The first through-hole 10H can penetrate the substrate 100, the display layer 200, and the thin-film encapsulation layer 300. The first through-hole 10H and the second through-hole 40H overlap each other and are configured as shown above. Figure 2 The described opening OP.

[0100] refer to Figure 8In the display area DA, the substrate 100 may include a polymer resin. In one embodiment, the substrate 100 may include a base layer comprising the polymer resin and an inorganic insulating layer on the base layer. For example, the substrate 100 may include two base layers and an inorganic insulating layer on each base layer. The polymer resin may include any one of polyethersulfone, polyarylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate, cellulose triacetate, and cellulose acetate propionate.

[0101] A buffer layer 201 may be present on the substrate 100 to prevent or substantially prevent impurities from penetrating into the semiconductor layer Act of the thin-film transistor (TFT). The buffer layer 201 may comprise an inorganic insulating material, such as silicon nitride, silicon oxynitride, and / or silicon oxide. The buffer layer 201 may have a single-layer or multi-layer structure comprising the inorganic insulating material described above.

[0102] The pixel circuit PC may be located on the buffer layer 201. The pixel circuit PC includes a thin-film transistor (TFT) and a storage capacitor Cst. The thin-film transistor (TFT) may include a semiconductor layer Act, a gate electrode GE, a source electrode SE, and a drain electrode DE.

[0103] Despite Figure 8 Not shown, but the data line DL of the pixel circuit PC is electrically connected to the switching thin-film transistor in the pixel circuit PC. In one embodiment, a top-gate transistor is shown where the gate electrode GE is above the semiconductor layer Act, and the gate insulating layer 203 is between the gate electrode GE and the semiconductor layer Act. However, in another embodiment, the thin-film transistor TFT may be a bottom-gate transistor.

[0104] In one embodiment, the semiconductor layer Act may include polycrystalline silicon. In another embodiment, the semiconductor layer Act may include any of amorphous silicon, oxide semiconductor, and organic semiconductor. The gate electrode GE may include a low-resistance metallic material. The gate electrode GE may include a conductive material, including any of molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti), and the gate electrode GE may have a single-layer or multi-layer structure including the materials described above.

[0105] The gate insulating layer 203 between the semiconductor layer Act and the gate electrode GE may include inorganic insulating materials, such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, etc. The gate insulating layer 203 may have a single-layer or multi-layer structure including the materials described above.

[0106] In one embodiment, the source electrode SE and drain electrode DE may be on the same layer as the data line DL, and may include the same material as the data line DL. The source electrode SE, drain electrode DE, and data line DL may include highly conductive materials. The source electrode SE and drain electrode DE may include conductive materials comprising molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may have a single-layer or multi-layer structure comprising the aforementioned materials. In another embodiment, the source electrode SE, drain electrode DE, and data line DL may have a multi-layer structure comprising a titanium layer, an aluminum layer, and a titanium layer (Ti / Al / Ti).

[0107] The storage capacitor Cst may include a lower electrode CE1 and an upper electrode CE2 that overlap each other, with a first interlayer insulating layer 205 between them. The storage capacitor Cst may overlap with a thin-film transistor (TFT). In this regard, Figure 8 The diagram illustrates a structure where the gate electrode GE of the thin-film transistor TFT is the lower electrode CE1 of the storage capacitor Cst. In another embodiment, the storage capacitor Cst may not overlap with the thin-film transistor TFT. The storage capacitor Cst may be covered by a second interlayer insulating layer 207. The upper electrode CE2 of the storage capacitor Cst may include a conductive material, such as molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may have a single-layer or multi-layer structure including the materials described above.

[0108] The first interlayer insulation layer 205 and / or the second interlayer insulation layer 207 may each comprise an inorganic insulating material, such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, etc. The first interlayer insulation layer 205 and the second interlayer insulation layer 207 may each have a single-layer structure or a multi-layer structure comprising the materials mentioned above.

[0109] The pixel circuit PC, including a thin-film transistor (TFT) and a storage capacitor (Cst), can be covered by a first organic insulating layer 209. The first organic insulating layer 209 may have a flat upper surface.

[0110] The pixel circuit PC can be electrically connected to the pixel electrode 221. For example, as... Figure 8 As shown, a contact metal layer CM can be disposed between a thin-film transistor (TFT) and a pixel electrode 221. The contact metal layer CM can be connected to the TFT via contact holes in a first organic insulating layer 209, and the pixel electrode 221 can be connected to the contact metal layer CM via contact holes in a second organic insulating layer 211 on the contact metal layer CM. The contact metal layer CM can include a conductive material, including any one of molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti), and can have a single-layer or multi-layer structure. In an embodiment, the contact metal layer CM can have a multi-layer structure including Ti / Al / Ti.

[0111] The first organic insulating layer 209 and / or the second organic insulating layer 211 may comprise organic insulating materials, such as any one of general polymers (e.g., polymethyl methacrylate (PMMA) or polystyrene (PS)), polymer derivatives having phenolic groups, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluoride polymers, p-xylyl polymers, vinyl alcohol polymers, and blends thereof. In an embodiment, the first organic insulating layer 209 and / or the second organic insulating layer 211 may comprise polyimide.

[0112] Pixel electrode 221 may be located on the second organic insulating layer 211. Pixel electrode 221 may include a conductive oxide, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), or aluminum zinc oxide (AZO). In another embodiment, pixel electrode 221 may include a reflective layer comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or compounds thereof. In another embodiment, pixel electrode 221 may further include a transparent conductive oxide material layer comprising ITO, IZO, ZnO, or In2O3 on and / or below the reflective layer.

[0113] A pixel defining layer 215 may be present on the pixel electrode 221. In one embodiment, the pixel defining layer 215 includes an opening exposing the upper surface of the pixel electrode 221, but covering the edge of the pixel electrode 221. In one embodiment, the pixel defining layer 215 may include an organic insulating material. In another embodiment, the pixel defining layer 215 may include an inorganic insulating material, such as silicon nitride, silicon oxynitride, or silicon oxide. In yet another embodiment, the pixel defining layer 215 may include both organic and inorganic insulating materials.

[0114] Intermediate layer 222 includes emitting layer 222b. Intermediate layer 222 may include a first functional layer 222a below emitting layer 222b and / or a second functional layer 222c on emitting layer 222b. Emitting layer 222b may include a polymeric organic material or a low molecular weight organic material that emits light of a certain color (e.g., a predetermined color).

[0115] The first functional layer 222a may have a single-layer or multi-layer structure. For example, when the first functional layer 222a comprises a polymeric organic material, the first functional layer 222a may include a hole transport layer (HTL) with a single-layer structure, and may include poly-(3,4)-ethylene-dioxothiophene (PEDOT) or polyaniline (PANI). When the first functional layer 222a comprises a low molecular weight organic material, the first functional layer 222a may include a hole injection layer (HIL) and an HTL.

[0116] The second functional layer 222c is optional. In embodiments, for example, the second functional layer 222c may be formed when the first functional layer 222a and the emitter layer 222b comprise polymeric organic materials. The second functional layer 222c may have a single-layer or multi-layer structure. In embodiments, the second functional layer 222c may include an electron transport layer (ETL) and / or an electron injection layer (EIL).

[0117] The emitting layer 222b of the intermediate layer 222 may be present in each pixel of the display area DA. The emitting layer 222b may be patterned to correspond to the pixel electrode 221. In an embodiment, unlike the emitting layer 222b, the first functional layer 222a and / or the second functional layer 222c in the intermediate layer 222 may be provided integrally on the substrate 100 in both the intermediate area MA and the display area DA.

[0118] The counter electrode 223 may include a conductive material with a low work function. In one embodiment, for example, the counter electrode 223 may include a (semi-)transparent layer comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), or alloys thereof. In another embodiment, the counter electrode 223 may further include a layer comprising ITO, IZO, ZnO, or In2O3 on a (semi-)transparent layer comprising the aforementioned materials. In one embodiment, the counter electrode 223 may be integrally provided in the intermediate region MA and the display region DA. In one embodiment, the first functional layer 222a, the second functional layer 222c, and the counter electrode 223 may be manufactured by a thermal evaporation method.

[0119] In some embodiments, the capping layer 230 may be placed on the opposing electrode 223. For example, the capping layer 230 may include a LiF layer and may be formed by thermal evaporation. In some embodiments, the capping layer 230 may be omitted.

[0120] In one embodiment, spacer 217 may be formed on pixel defining layer 215 and may include an organic insulating material, such as polyimide. In another embodiment, spacer 217 may include an inorganic insulating material, or a combination of organic and inorganic insulating materials.

[0121] The spacer 217 may comprise a material that is different from or the same as the material of the pixel defining layer 215. In one embodiment, the pixel defining layer 215 and the spacer 217 may comprise polyimide. In another embodiment, the pixel defining layer 215 and the spacer 217 may be manufactured together using a masking process employing a halftone mask.

[0122] The organic light-emitting diode (OLED) can be covered by a thin-film encapsulation layer 300. In an embodiment, the thin-film encapsulation layer 300 may include at least one organic encapsulation layer and at least one inorganic encapsulation layer, and Figure 8 The thin-film encapsulation layer 300 is shown to include a first inorganic encapsulation layer 310, a second inorganic encapsulation layer 330, and an organic encapsulation layer 320 between the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330. In another embodiment, the stacking order and number of the organic and inorganic encapsulation layers may be varied.

[0123] In embodiments, the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may comprise one or more inorganic materials selected from alumina, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may each have a single-layer structure or a multi-layer structure comprising the materials mentioned above. In embodiments, the organic encapsulation layer 320 may comprise polymer-based materials, and may include acrylic-based resins (such as polymethacrylate and polyacrylic acid), epoxy-based resins, polyimide, polyethylene, etc. In embodiments, the organic encapsulation layer 320 may comprise acrylate polymers.

[0124] The materials included in the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may be different from each other. For example, the first inorganic encapsulation layer 310 may include silicon oxynitride and the second inorganic encapsulation layer 330 may include silicon nitride. The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may have different thicknesses. In one embodiment, the thickness of the first inorganic encapsulation layer 310 may be greater than the thickness of the second inorganic encapsulation layer 330. In another embodiment, the thickness of the second inorganic encapsulation layer 330 may be greater than the thickness of the first inorganic encapsulation layer 310, or the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may have the same thickness.

[0125] refer to Figure 8 The intermediate region MA, one or more grooves G may be located in the intermediate region MA. The organic material layers included in the intermediate layer 222, such as the first functional layer 222a and / or the second functional layer 222c, may be disconnected (or separated) by the grooves G.

[0126] In one embodiment, the groove G may be in a first layer 240 and a second layer 250 comprising materials different from each other. In one embodiment, the first layer 240 may comprise an organic insulating material, and the second layer 250 may comprise an inorganic insulating material or a metal. In one embodiment, the second layer 250 may comprise a metal.

[0127] refer to Figure 9 and Figure 10The first layer 240 may be on the second interlayer insulating layer 207 (which is an inorganic insulating layer), and the second layer 250 may be on the upper surface of the first layer 240. The thickness T of the first layer 240 may be greater than the thickness t of the second layer 250.

[0128] The first layer 240 may include an organic insulating material, such as any one of general polymers, polymer derivatives having phenolic groups, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluoride polymers, p-xylyl polymers, vinyl alcohol polymers, and blends thereof. In some embodiments, the first layer 240 may be formed prior to the formation of the first organic insulating layer 209, for example, as will be discussed later. Figure 11 The process described is used to form the organic material layer.

[0129] The second layer 250 may be in direct contact with the upper surface of the first layer 240 and may include a metal. In embodiments, the second layer 250 may include molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may have a single-layer or multi-layer structure including the materials described above. In some embodiments, the second layer 250 may include the same material as that included in the source electrode SE or drain electrode DE of the data line DL or the thin-film transistor TFT.

[0130] The groove G may have an undercut structure or an overcut structure. The groove G may include a second hole 250h in the second layer 250 and a first hole 240h in the first layer 240. In an embodiment, the groove G can be manufactured by an etching process (e.g., isotropic etching). Depending on the degree of etching, such as... Figure 9 The diagram shows a groove G forming a second hole 250h in the second layer 250 and a first hole 240h in the first layer 240, or as shown in the diagram. Figure 10 The diagram illustrates a groove G forming a second hole 250h in a second layer 250 and a recess 240r in a first layer 240. When the first layer 240 includes the recess 240r, the depth d of the recess 240r may be less than the thickness T of the first layer 240. In some embodiments, the depth d of the recess 240r may be about 3 μm or greater.

[0131] In this embodiment, the bottom surface of the groove G may be flush with the bottom surface of the first layer 240 or the upper surface of the second interlayer insulating layer 207, such as... Figure 9 As shown in the diagram. In another embodiment, the bottom surface of the groove G may be located between the upper surface and the bottom surface of the first layer 240, such as... Figure 10 As shown, it is located between the upper surface of the first layer 240 and the upper surface of the second interlayer insulating layer 207.

[0132] Compared to the inner surface of the first layer 240 defining the first hole 240h or recess 240r, the end portion of the second layer 250 defining the second hole 250h may extend further toward the center of the second hole 250h. For example, the second layer 250 may include a tip 251 or a pair of tips 251 when viewed in cross-section, which defines the second hole 250h and extends further toward the center of the second hole 250h than the inner surface of the first layer 240.

[0133] Each of the tips 251 may have a first width W1, and in an embodiment, the first width W1 may be about 2 μm or greater. The first width W1 of the tip 251 may correspond to the distance in the horizontal direction from the edge of the upper surface of the first layer 240 directly below the tip 251 to the edge of the tip 251.

[0134] The groove G having the above structure can be manufactured before forming the intermediate layer 222. Among the layers on the substrate 100, layers including organic materials can serve as pathways for water travel. For example, as... Figure 8 As shown, when the display panel 10 includes the first through-hole 10H, moisture can travel in a direction parallel to the upper surface of the substrate 100 (hereinafter referred to as the lateral direction). However, according to the embodiment, the organic material layers, such as the first functional layer 222a and / or the second functional layer 222c, can be broken or separated due to the eaves or undercut structure of the groove G. In the embodiment, the first functional layer 222a and / or the second functional layer 222c can be manufactured by a thermal evaporation method, and when the first functional layer 222a and / or the second functional layer 222c are deposited, the first functional layer 222a and / or the second functional layer 222c can be formed discontinuously due to the structure of the tip 251.

[0135] Similarly, the counter electrode 223 and / or the capping layer 230 can be formed by thermal evaporation and, due to the structure of the tip 251, can have a discontinuous structure. In this embodiment, Figure 8 , Figure 9 and Figure 10 The diagram shows a structure in which the first functional layer 222a, the second functional layer 222c, the counter electrode 223, and the capping layer 230 are disconnected at the tip 251. In an embodiment, some portions of the first functional layer 222a, the second functional layer 222c, the counter electrode 223, and the capping layer 230 may be on the bottom surface of the groove G.

[0136] In one embodiment, the barrier wall PW may be located between slots G. In another embodiment, the barrier wall PW may comprise multiple barrier wall layers stacked sequentially. In yet another embodiment, the barrier wall PW may comprise a first barrier wall layer PW1, a second barrier wall layer PW2, and a third barrier wall layer PW3, such as... Figure 8As shown in the figure. The first barrier wall layer PW1 may include the same material as the first organic insulating layer 209, the second barrier wall layer PW2 may include the same material as the second organic insulating layer 211, and the third barrier wall layer PW3 may include the same material as the pixel defining layer 215 and / or the spacer 217.

[0137] The barrier wall PW can be separated from the first layer 240. For example, the first barrier wall layer PW1, the second barrier wall layer PW2, and the third barrier wall layer PW3 can be separated from the first layer 240. Between the barrier wall PW and the first layer 240, the second layer 250 can extend beyond the first layer 240 and directly contact the inorganic insulating layer (e.g., the second interlayer insulating layer 207) below the first layer 240. The second layer 250 can extend beyond the outer surface of the first layer 240 and directly contact the upper surface of the second interlayer insulating layer 207.

[0138] In the comparative example, when the layers included in the barrier wall PW come into contact with the first layer 240, an organic material path can be formed through which moisture travels. However, according to the embodiment, the layers included in the barrier wall PW and the first layer 240 are separated from each other, and / or the second interlayer insulation layer 207 (i.e., the inorganic insulation layer) and the second layer 250, which includes metal, are in direct contact with each other, and therefore, the path of moisture travel can be blocked.

[0139] Reference above Figure 7 The groove G described is identical to the one with an annular shape surrounding the first through-hole 10H, wherein the stacked structure including the first layer 240 and the second layer 250 defining the groove G may have an annular shape surrounding the first through-hole 10H in the plan view. Similarly, the barrier wall PW may also have an annular shape surrounding the first through-hole 10H in the plan view. The first layer 240 defining one groove G, the barrier wall PW, and the first layer 240 defining another groove G may have an annular shape surrounding the first through-hole 10H while being spaced apart from or separated from each other.

[0140] The thin-film encapsulation layer 300 may also be located in the intermediate region MA. Compared to the first functional layer 222a, the second functional layer 222c, the opposing electrode 223, and / or the capping layer 230, the first inorganic encapsulation layer 310 may have relatively superior stepped coverage. The first inorganic encapsulation layer 310 may be continuous, such as... Figure 8 As shown in the figure. For example, the first inorganic encapsulation layer 310 may continuously and completely cover the inner surface of the trench G. In an embodiment, the first inorganic encapsulation layer 310 may be formed by a chemical vapor deposition method.

[0141] In one embodiment, the organic encapsulation layer 320 may overlap with the slot G closest to the display area DA. The slot G closest to the display area DA may be at least partially filled with the material included in the organic encapsulation layer 320.

[0142] Because the second inorganic encapsulation layer 330 has a relatively superior stepped coverage similar to the first inorganic encapsulation layer 310, the second inorganic encapsulation layer 330 can continuously cover a portion of the groove G, for example, the inner surface of the groove G between the barrier wall PW and the first through hole 10H.

[0143] The input sensing unit 40 may be located on the display panel 10, which includes a substrate 100, a display layer 200 on the substrate 100 including pixel circuitry PC and organic light-emitting diode (OLED), and a thin-film encapsulation layer 300. In some embodiments, the input sensing unit 40 may be located directly on the display panel 10.

[0144] In one embodiment, the input sensing unit 40 may include a first insulating layer 410, a second insulating layer 420, a third insulating layer 440, and a fourth insulating layer 460 stacked sequentially. The input sensing unit 40 may include a first conductive layer 430 between the second insulating layer 420 and the third insulating layer 440, and a second conductive layer 450 between the third insulating layer 440 and the fourth insulating layer 460. The first conductive layer 430 and / or the second conductive layer 450 may include touch electrodes for sensing touch input, and traces connected to the touch electrodes.

[0145] In some embodiments, the first insulating layer 410, the second insulating layer 420, or the third insulating layer 440 may comprise inorganic insulating materials, such as silicon oxide, silicon nitride, or silicon oxynitride, and the fourth insulating layer 460 may comprise an organic insulating material. For example, the organic insulating material in the fourth insulating layer 460 may comprise a photoresist (negative or positive) or a polymer-based organic material. The first conductive layer 430 and / or the second conductive layer 450 may comprise a metal or a transparent conductive oxide (TCO). In some embodiments, the first conductive layer 430 and / or the second conductive layer 450 may comprise a conductive material, including any one of molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti).

[0146] In one embodiment, the first insulating layer 410, the second insulating layer 420, the third insulating layer 440, and the fourth insulating layer 460 may be integrally provided in the display area DA and the intermediate area MA. Unlike the aforementioned layers, the planarization layer 415 may be in the intermediate area MA. In a plan view, the planarization layer 415 may have a ring shape around the first via 10H (e.g., surrounding the first via 10H).

[0147] Planarization layer 415 may include an organic insulating layer. In some embodiments, planarization layer 415 may include a polymer-based material. For example, planarization layer 415 may include silicone-based resins, acrylic-based resins, epoxy-based resins, polyimide, polyethylene, etc. Planarization layer 415 may include a material different from that included in organic encapsulation layer 320.

[0148] A portion of the planarization layer 415 adjacent to the display area DA may overlap with the organic encapsulation layer 320. The second inorganic encapsulation layer 330 and the first insulating layer 410 may be located between the overlapping organic encapsulation layer 320 and the planarization layer 415.

[0149] The organic encapsulation layer 320 is located on one side of the barrier wall PW, and in the intermediate region MA, the area not covered by the organic encapsulation layer 320 can be covered by the planarization layer 415. Because the planarization layer 415 is located in the area of ​​the intermediate region MA not covered by the organic encapsulation layer 320, the planarity of the display panel 10 around the first via 10H can be increased. Therefore, it is possible to prevent or substantially prevent the input sensing unit 40 and / or the optical function unit 50 (see...) on the display panel 10 from being... Figure 2 The peeling off of )

[0150] Figure 11 This is a cross-sectional view of the display panel 10 according to an embodiment.

[0151] Figure 11 The display area DA can have the same characteristics as the reference above. Figure 8 The stacking structure of the described display area DA is the same as the stacking structure, and further description thereof may be omitted. The display panel 10 may include a curved area BA in its outer region, as referenced above. Figure 4 and Figure 5 describe.

[0152] refer to Figure 11 The peripheral region PA, including the curved region BA, is shown in the figure (see Figure 4 The inorganic insulating structure IL on the substrate 100 may include an opening IL-OP. The inorganic insulating structure IL may include at least one inorganic insulating layer. In some embodiments, the inorganic insulating structure IL may include a buffer layer 201, a gate insulating layer 203, a first interlayer insulating layer 205, and / or a second interlayer insulating layer 207. The openings 201a of the buffer layer 201, 203a of the gate insulating layer 203, 205a of the first interlayer insulating layer 205, and / or 207a of the second interlayer insulating layer 207 overlap each other and form the opening IL-OP of the inorganic insulating structure IL. In embodiments, the width OW of the opening IL-OP may be greater than the width of the bending region BA. In some embodiments, when the substrate 100 includes two base layers and an inorganic insulating layer on each base layer, the inorganic insulating layer at the uppermost layer of the substrate 100 may also include an opening corresponding to the opening IL-OP. In this case, the substrate layer of the substrate 100 can be exposed through the opening IL-OP, and the exposed portion of the substrate layer can be in direct contact with the organic insulating layer 260, which will be described later.

[0153] Organic insulating layer 260 may be present in the bending region BA. Organic insulating layer 260 may at least partially fill an opening in at least one inorganic insulating layer. For example, organic insulating layer 260 may at least partially fill an opening IL-OP in the inorganic insulating structure IL. In embodiments, organic insulating layer 260 may be present only in the bending region BA. Organic insulating layer 260 may include organic insulating materials such as acrylic, benzocyclobutene (BCB), polyimide, hexamethyldisiloxane (HMDSO), etc. In embodiments, organic insulating layer 260 may be present in the bending region BA. Figure 8 The first layer described is 240 (see Figure 8 It is manufactured in the same process as the first layer 240 and may include the same material as the first layer 240.

[0154] The inorganic insulation structure IL includes an opening IL-OP in the bending region BA and can prevent or reduce the generation of cracks in at least one inorganic insulation layer due to bending stress. Furthermore, because the organic insulation layer 260 can absorb the stress generated during bending, the problem of crack generation can be prevented or reduced.

[0155] The first portion 21 of the wire in the first region 1A and the second portion 22 of the wire in the second region 2A may be separated from each other around the bending region BA. In one embodiment, the first portion 21 and the second portion 22 may be on, for example, the gate insulating layer 203. In another embodiment, the first portion 21 and / or the second portion 22 may be on, for example, the first interlayer insulating layer 205.

[0156] The first portion 21 and the second portion 22 are electrically connected to each other via a third portion 23 on the organic insulating layer 260. The third portion 23 extends across the bending region BA. One end of the third portion 23 is connected to the first portion 21 via contact holes penetrating the first interlayer insulating layer 205 and the second interlayer insulating layer 207, while overlapping the first portion 21. The other end of the third portion 23 is connected to the second portion 22 via contact holes penetrating the first interlayer insulating layer 205 and the second interlayer insulating layer 207, while overlapping the second portion 22.

[0157] The third part 23 may include a material having a relatively higher flexibility than the first part 21 and / or the second part 22, such as aluminum. In an embodiment, the third part 23 may be made of a material with relative flexibility to the above reference. Figure 8 The second layer 250 described (see Figure 8 It is formed using the same process as the second layer 250, and may include the same material as the second layer 250.

[0158] In one embodiment, one or more protective layers may be present in the peripheral region PA. In one embodiment, Figure 11A first protective layer 271 and a second protective layer 272 are shown. In an embodiment, the first protective layer 271 and the second protective layer 272 may comprise an organic insulating material. The first protective layer 271 and / or the second protective layer 272 protect the third portion 23 of the line and may adjust the neutral plane of the display panel 10 or disperse bending stress during bending.

[0159] Figure 12 A cross-sectional view of the display device according to an embodiment is shown in part; Figures 13 to 15 This is a cross-sectional view of a groove structure according to some embodiments; and Figure 16 To illustrate the barrier wall PW Figure 12 A magnified cross-sectional view of region XVI. For ease of description, Figure 12 The display panel 10 and input sensing unit 40 of the display device are shown, but the optical function unit is omitted.

[0160] refer to Figure 12 The display area DA, Figure 12 The display area DA can have the same characteristics as the reference above. Figure 8 The stacking structure of the described display area DA is the same as the stacking structure, and further description of it may be omitted.

[0161] refer to Figure 12 The intermediate region MA, slot G can be located in the first layer 240' and the second layer 250'. (See reference) Figure 12 and Figure 13 The first layer 240' may be on the second interlayer insulating layer 207 (which is an inorganic insulating layer), and the second layer 250' may be on the upper surface of the first layer 240'.

[0162] In some embodiments, the first layer 240' may include an organic insulating material. In some embodiments, the first layer 240' may be conductive through contact with... Figure 12 The first organic insulating layer 209 shown is manufactured using the same process as the first organic insulating layer 209, and may include the same material as the first organic insulating layer 209.

[0163] In one embodiment, the second layer 250' may be in direct contact with the upper surface of the first layer 240' and may include metal. In another embodiment, the second layer 250' may be in direct contact with the upper surface of the first layer 240'. Figure 12 The contact metal layer CM shown is formed in the same process as the contact metal layer CM, and may include the same material as the contact metal layer CM.

[0164] In an embodiment, the groove G may have an undercut structure or an overhang structure. The groove G may include a second hole 250h' in the second layer 250' and a first hole 240h' in the first layer 240'. The groove G may be formed by an etching process (e.g., isotropic etching), and Figure 12 and Figure 13The second hole 250h' in the second layer 250' and the first hole 240h' in the first layer 240' define the groove G. In another embodiment, refer to the above. Figure 10 Description: a recess, not the first hole 240h', can be found in the first layer 240'.

[0165] Compared to the inner surface defining the first hole 240h' or the recessed first layer 240', the end portion of the second layer 250' defining the second hole 250h' may further extend toward the center of the second hole 250h' to form a tip 251' or a pair of tips 251' in a cross-sectional view. As described above, the organic material layers in the intermediate layer 222, such as the first functional layer 222a and / or the second functional layer 222c, may be separated or disconnected due to the tips 251'. Similarly, the opposing electrode 223 and / or the capping layer 230 may be separated or disconnected due to the undercut or overhang structure.

[0166] The thin-film encapsulation layer 300 may include a first inorganic encapsulation layer 310, an organic encapsulation layer 320, and a second inorganic encapsulation layer 330. Because the first inorganic encapsulation layer 310 has relatively superior stepped coverage, such as... Figure 12 and Figure 13 As shown, the first inorganic encapsulation layer 310 can continuously cover the inner surface of the groove G. The structure of the thin-film encapsulation layer 300 and the structure of the input sensing unit 40 on the thin-film encapsulation layer 300 are similar to those described above. Figure 8 The descriptions are the same.

[0167] Figure 12 and Figure 13 The inner surfaces of the groove G are shown, for example, the side and bottom surfaces of the tip 251' and the inner side surface of the first layer 240' are in direct contact with the first inorganic encapsulation layer 310. In some embodiments, the inorganic passivation layer PVX may be located between the inner surface of the groove G and the first inorganic encapsulation layer 310.

[0168] refer to Figure 14 The inorganic passivation layer PVX can be on the second layer 250'. For example, it can be formed after the formation of the second layer 250' and the formation of the intermediate layer 222 (see...). Figure 8 An inorganic passivation layer PVX is formed prior to this. Although not shown in the accompanying drawings, the inorganic passivation layer PVX may extend to the display area DA (see figure). Figure 8 Furthermore, in this case, the inorganic passivation layer PVX can be used as a contact metal layer CM in the display area DA (see...). Figure 12 ) and between the second organic insulating layer 211.

[0169] Inorganic passivation PVX layers can include inorganic insulating materials such as silicon oxide, silicon nitride, and silicon oxynitride. Inorganic passivation PVX layers can be obtained through methods such as chemical vapor deposition.

[0170] In this embodiment, the inorganic passivation layer PVX can continuously and completely cover the inner surface of the groove G. For example, the inorganic passivation layer PVX can cover the upper surface, side surface and bottom surface of the second layer 250', and can continuously cover the inner surface of the first layer 240' and the upper surface of the second interlayer insulating layer 207 below the first layer 240'.

[0171] After the inorganic passivation layer PVX is formed, a first functional layer 222a, a second functional layer 222c, a counter electrode 223, and / or a capping layer 230 may be formed. The first functional layer 222a, the second functional layer 222c, the counter electrode 223, and / or the capping layer 230 may be disconnected or separated at the pair of tips 251'.

[0172] In one embodiment, the first inorganic encapsulation layer 310 formed after the capping layer 230 continuously covers the inner surface of the groove G and can directly contact the inorganic passivation layer PVX in some areas.

[0173] Figure 14 The first layer 240' is shown to have a single-layer structure; however, in some embodiments, the first layer 240' may include multiple layers.

[0174] refer to Figure 15 In an embodiment, the first layer 240 may include a first sublayer 241 and a second sublayer 242. In an embodiment, the first sublayer 241 may include the same as the one referenced above. Figure 12 The first organic insulating layer 209 described herein is made of the same material as the second organic insulating layer 211, and the second sublayer 242 may comprise the same material as the second organic insulating layer 211. In another embodiment, the first sublayer 241 may comprise the same material as described above. Figure 11 The organic insulating layer 260 is made of the same material as the first organic insulating layer 209, and the second sublayer 242 may include the same material as the first organic insulating layer 209.

[0175] The second layer 250” may include a metallic or inorganic insulating material. The second hole 250h” of the second layer 250” and the first hole or recess 240r” of the first layer 240” may define a groove G. The second layer 250” may include a tip 251” or a pair of tips 251” projecting toward the center of the second hole 250h” in a cross-sectional view. The pair of tips 251” may project further toward the center of the second hole 250h” compared to the inner surface of the first layer 240” to form an undercut structure or an overhang structure.

[0176] As referenced above Figure 14 The inorganic passivation layer PVX may be on the second layer 250”, and the first functional layer 222a, the second functional layer 222c, the opposite electrode 223 and / or the capping layer 230 may be disconnected or separated at the pair of tips 251”.

[0177] In one embodiment, as described above, the inorganic passivation layer PVX can continuously cover the inner surface of the groove G, and the first inorganic encapsulation layer 310 can partially contact the inorganic passivation layer PVX in direct contact. In another embodiment, the inorganic passivation layer PVX can be omitted.

[0178] Return to reference Figure 12 The barrier wall PW can be located between multiple slots G. The barrier wall PW can include multiple barrier wall layers, such as a first barrier wall layer PW1, a second barrier wall layer PW2, and a third barrier wall layer PW3. In an embodiment, the first barrier wall layer PW1 can include the same material as the first organic insulating layer 209, the second barrier wall layer PW2 can include the same material as the second organic insulating layer 211, and the third barrier wall layer PW3 can include the same material as the pixel defining layer 215 and / or the spacer 217.

[0179] A metal gap layer 280 may be present between adjacent barrier wall layers, for example, between the second barrier wall layer PW2 and the third barrier wall layer PW3. The gap layer 280 may have a fine undercut structure, and in some embodiments, the first functional layer 222a and / or the second functional layer 222c may be disconnected or separated. Similarly, the opposing electrode 223 and / or the capping layer 230 may be disconnected or separated.

[0180] refer to Figure 12 and Figure 16 The gap layer 280 may include a metal. In one embodiment, the gap layer 280 may include at least two layers having different etch selectivity ratios. In one embodiment, the gap layer 280 may include a first layer 281, a second layer 282, and a third layer 283. In one embodiment, the first layer 281 and the third layer 283 may have the same material as each other, and the second layer 282 may have a different material than the first layer 281 and the third layer 283. In one embodiment, the first layer 281 and the third layer 283 may include a transparent conductive oxide material, such as ITO, and the second layer 282 may include a metal, including silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or compounds thereof. In one embodiment, the second layer 282 may have a thickness greater than the thickness of the first layer 281 and the third layer 283.

[0181] In the implementation, during the manufacturing of the display panel 10 (see...), Figure 12During the process, the edges of the gap layer 280 can be etched, and the second layer 282 can be further etched than the first layer 281 and the third layer 283. In this case, in the lateral direction, the edge of the first layer 281 can protrude more than the edge of the second layer 282, and the edge of the first layer 281 can perform substantially the same function as the tip in the groove G described above. That is, the edge of the first layer 281 protrudes more than the edge of the second layer 282, and then the gap layer 280 can have an undercut structure or an overhang structure.

[0182] When the sum of the thicknesses of the first functional layer 222a, the second functional layer 222c, and the opposing electrode 223, or the sum of the thicknesses of the first functional layer 222a, the second functional layer 222c, the opposing electrode 223, and the capping layer 230 is less than the thickness of the gap layer 280, the first functional layer 222a, the second functional layer 222c, the opposing electrode 223, and / or the capping layer 230 can be disconnected or separated. In this regard, Figure 16 The first functional layer 222a, the second functional layer 222c, the opposite electrode 223, and the capping layer 230 are shown to be disconnected at the edge of the gap layer 280.

[0183] The display device according to one or more embodiments can prevent or substantially prevent damage to light-emitting diodes due to moisture introduced through through holes or openings, and can simplify the process or reduce costs by using layers included in the display layer.

[0184] It should be understood that the embodiments described herein are for descriptive purposes only and are not intended to be limiting. The description of features or aspects in each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the figures, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit and scope set forth by the appended claims.

Claims

1. A display device, comprising: First through hole; A plurality of pixels in a display area surrounding the first through-hole, the plurality of pixels including two pixels spaced apart from each other, the first through-hole being between the two pixels; A first layer in the intermediate region between the first through-hole and the display area, the first layer including a first hole or recess; and A second layer directly on top of the first layer, the second layer including a second hole overlapping the first hole or the recess. The second layer includes a tip that extends further toward the center of the second hole than the inner surface of the first layer, the inner surface defining the first hole or the recess. Each of the plurality of pixels includes a light-emitting diode (LED), the LED including a pixel electrode, a counter electrode, and an intermediate layer between the pixel electrode and the counter electrode. At least one organic material layer of the intermediate layer breaks at the tip, and The first layer comprises an organic insulating material, and the second layer comprises a metal.

2. The display device according to claim 1, wherein the at least one organic material layer comprises one or more selected from the group consisting of a hole transport layer, a hole injection layer, an electron injection layer, and an electron transport layer.

3. The display device according to claim 1, wherein the opposing electrode is disconnected at the tip.

4. The display device according to claim 1, further comprising: A substrate on which the plurality of pixels are arranged; as well as At least one inorganic insulating layer between the substrate and the pixel electrode.

5. The display device according to claim 4, wherein the first layer is on the at least one inorganic insulating layer, and The second layer passes over the first layer and is in direct contact with the upper surface of the at least one inorganic insulating layer.

6. The display device according to claim 4, further comprising: At least one organic insulating layer between the at least one inorganic insulating layer and the pixel electrode. The first layer comprises the same material as the material included in the at least one organic insulating layer.

7. The display device of claim 4, wherein a portion of the substrate is bent about a bending axis extending along the bending region, and The at least one inorganic insulating layer includes an opening in the bending region.

8. The display device according to claim 7, further comprising: An organic insulating layer within the opening of the at least one inorganic insulating layer. The first layer comprises the same material as that included in the organic insulating layer.

9. The display device according to claim 1, further comprising: An inorganic passivation layer on the second layer.

10. The display device according to claim 9, wherein the inorganic passivation layer continuously covers the side surface and bottom surface of the second layer and the inner surface of the first layer.

11. A display device, comprising: substrate; A display layer on the substrate, the display layer comprising a plurality of pixels; A thin-film encapsulation layer on the display layer, the thin-film encapsulation layer comprising at least one inorganic encapsulation layer and at least one organic encapsulation layer; A first via between two adjacent pixels in the plurality of pixels, the first via penetrating the substrate, the display layer and the thin film encapsulation layer; and A first groove surrounding the first through-hole, the first groove being defined in a first layer and a second layer directly on the first layer. The first groove includes a first hole or recess in the first layer and a second hole in the second layer. The second layer includes a tip that extends further toward the center of the second hole than the inner surface of the first layer, the inner surface defining the first hole or the recess. At least one organic material layer in the display layer is broken at the first groove, and The first layer comprises an organic insulating material, and the second layer comprises a metal.

12. The display device of claim 11, wherein each of the plurality of pixels includes a light-emitting diode, the light-emitting diode including a pixel electrode, a counter electrode, and an emitting layer between the pixel electrode and the counter electrode, and The at least one organic material layer is located between the pixel electrode and the opposite electrode.

13. The display device according to claim 12, wherein the at least one organic material layer comprises one or more selected from the group consisting of a hole transport layer, a hole injection layer, an electron injection layer, and an electron transport layer.

14. The display device according to claim 12, wherein the display layer comprises: At least one inorganic insulating layer between the substrate and the pixel electrode, and The first layer is on the at least one inorganic insulating layer.

15. The display device of claim 14, wherein the second layer extends over the first layer and is in direct contact with the upper surface of the at least one inorganic insulating layer.

16. The display device according to claim 14, further comprising an inorganic passivation layer on the second layer.

17. The display device of claim 16, wherein the inorganic passivation layer continuously covers the side surface and bottom surface of the second layer and the inner surface of the first layer.

18. The display device of claim 14, wherein a portion of the substrate is bent about a bending axis extending along the bending region, and The at least one inorganic insulating layer includes an opening in the bending region.

19. The display device according to claim 18, further comprising: An organic insulating layer within the opening of the at least one inorganic insulating layer. The first layer comprises the same material as that included in the organic insulating layer.

20. The display device according to claim 11, further comprising: A second groove around the first through hole; and The barrier wall between the first slot and the second slot.

21. The display device of claim 20, wherein the barrier wall comprises a plurality of stacked barrier wall layers, and A gap layer is formed between two adjacent barrier wall layers in the plurality of barrier wall layers, the gap layer comprising metal.

22. The display device of claim 21, wherein the gap layer comprises a first layer and a second layer below the first layer, the first layer comprising an edge that protrudes further outward than the edge of the second layer, and The at least one organic material layer is broken at the eaves structure formed by the edge of the first layer and the edge of the second layer.

23. An electronic device comprising: The display device according to any one of claims 1-22; as well as An assembly located below the display device and corresponding to the first through-hole of the display device, wherein the assembly includes a sensor or a camera.

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