Heat dissipation structure, cooking appliance and cooking appliance control method

Abstract

The present invention provides a heat dissipation structure, a cooking utensil and a control method for the cooking utensil. The heat dissipation structure includes: a shell, a first air outlet and a second air outlet are arranged on the shell; a heat transfer structure is arranged on the shell, the first end of the heat transfer structure is located outside the shell and is suitable for cooperating with the structure to be dissipated, and the second end of the heat transfer structure is located inside the shell; a heat transfer semiconductor is arranged inside the shell and located between the first air outlet and the second air outlet, the first end of the heat transfer semiconductor cooperates with the second end of the heat transfer structure, and the second end of the heat transfer semiconductor forms a heat dissipation end; a fan is arranged at the first air outlet and / or the second air outlet. The technical solution of the present invention solves the defect of the slow cooling speed of the cooling structure of the electric pressure cooker in the prior art.

Description

Technical Field

[0001] The present invention relates to the technical field of small household appliances, and in particular to a heat dissipation structure, a cooking utensil and a control method of the cooking utensil. Background Art

[0002] Electric pressure cookers are commonly used household appliances. At present, electric pressure cookers have a fast cooking function. The principle is to seal and pressurize the food to increase its cooking temperature, thereby shortening the cooking time. Therefore, pressure cookers have become an indispensable cooking appliance in modern fast-paced life. However, after the pressure cooking work is completed, since the pressure in the pot is higher than the atmospheric pressure, the user cannot open the lid and take out the food immediately, especially for soups, liquid or sticky foods. In order to prevent overflow, the air cannot be directly released for rapid cooling, and natural cooling requires a long waiting time. For example, when cooking porridge, the cooking time is about 35 minutes, but the natural cooling time after cooking is as long as 25 minutes, and the user experience is poor.

[0003] In order to solve the above technical problems, some electric pressure cookers in the prior art are provided with a cooling structure for cooling the cooking cavity. However, the cooling structure of the existing electric pressure cookers has the problem of insufficient cooling speed, resulting in no significant improvement in user experience. Summary of the invention

[0004] Therefore, the technical problem to be solved by the present invention is to overcome the defect of slow cooling speed of the cooling structure of the electric pressure cooker in the prior art, thereby providing a heat dissipation structure, a cooking utensil and a control method for the cooking utensil.

[0005] In order to solve the above technical problems, the present invention provides a heat dissipation structure, including: a shell, on which a first air outlet and a second air outlet are arranged; a heat transfer structure, arranged on the shell, the first end of the heat transfer structure is located outside the shell and is suitable for cooperating with the structure to be dissipated, and the second end of the heat transfer structure is located inside the shell; a heat transfer semiconductor, arranged in the shell and between the first air outlet and the second air outlet, the first end of the heat transfer semiconductor cooperates with the second end of the heat transfer structure, and the second end of the heat transfer semiconductor forms a heat dissipation end; a fan, arranged at the first air outlet and / or the second air outlet.

[0006] Optionally, the shell includes an annular side wall, and a top wall and a bottom wall arranged on the upper and lower sides of the annular side wall, wherein the heat transfer structure is arranged on the bottom wall, the first air outlet is arranged on the top wall, and the second air outlet is arranged on the annular side wall.

[0007] Optionally, the first air outlet is arranged in the middle of the top wall, and there are multiple second air outlets, which are arranged at intervals along the circumference of the annular side wall.

[0008] Optionally, the fan is disposed at the first air outlet, and the fan is configured to be able to draw air and blow air.

[0009] Optionally, the second end of the heat transfer semiconductor extends to below the first air outlet.

[0010] Optionally, there are multiple heat transfer structures, which are arranged at intervals along the circumference of the first air outlet, and there are multiple heat transfer semiconductors, which are arranged in a one-to-one correspondence.

[0011] Optionally, the heat transfer semiconductor is a fan-shaped structure.

[0012] Optionally, the heat transfer semiconductor is a multi-layer structure stacked up and down.

[0013] Optionally, the heat transfer structure includes a connecting rod and a first heat transfer head and a second heat transfer head disposed at both ends of the connecting rod, the connecting rod passes through the shell, the first heat transfer head is located inside the shell, and the second heat transfer head is located outside the shell.

[0014] Optionally, the first air outlet and the second air outlet are switchable structures.

[0015] Optionally, the heat dissipation structure further includes an annular baffle rotatably disposed on the inner side of the annular side wall, and the annular baffle is provided with a avoidance opening adapted to the second air outlet.

[0016] The present invention also provides a cooking utensil, comprising: a pot body having a cooking cavity; a pot cover arranged on the pot cover; a heat dissipation structure arranged on the pot cover, the heat dissipation structure is the above-mentioned heat dissipation structure, wherein when the pot cover is closed relative to the pot body, the first end of the heat transfer structure is located in the cooking cavity.

[0017] Optionally, the outer shell of the pot cover forms the housing.

[0018] Optionally, the cooking appliance is an electric pressure cooker or an electric rice cooker.

[0019] The present invention also provides a control method for a cooking appliance, wherein the cooking appliance is the above-mentioned cooking appliance, and the control method comprises: step S1: after cooking is completed, the heat dissipation structure is started to dissipate heat from the cooking cavity; step S2: when the pressure in the cooking cavity is less than a first preset value, the heat dissipation structure is turned off.

[0020] Optionally, step S1 includes: step S11: passing current through the heat transfer semiconductor, controlling the fan and causing the airflow to flow in from the second air outlet and out from the first air outlet; step S12: obtaining a first temperature difference between the first end of the heat transfer semiconductor and the first air outlet, and executing step S13 when the first temperature difference is less than a second preset value; step S13: changing the current direction of the heat transfer semiconductor, controlling the fan and causing the airflow to flow in from the first air outlet and out from the second air outlet; step S14: obtaining a second temperature difference between the first end of the heat transfer semiconductor and the second air outlet, and executing step S11 when the second temperature difference is less than a third preset value.

[0021] The technical solution of the present invention has the following advantages:

[0022] By utilizing the technical solution of the present invention, when the heat dissipation structure is working, the heat transfer structure transfers heat from the first end to the second end, the fan is started so that the airflow enters from the first air outlet or the second air outlet, and the airflow takes away the heat from the second end of the heat transfer semiconductor, thereby achieving heat exchange and continuously reducing the temperature of the structure to be dissipated. When the heat transfer coefficient of the heat transfer semiconductor decreases, the fan is controlled to make the airflow flow in from the opposite direction, and at the same time, the current direction of the heat transfer semiconductor is changed, thereby re-increasing the heat transfer coefficient. The above structure can ensure that the heat transfer semiconductor is always in an efficient heat transfer state, achieving the effect of rapid heat dissipation. Therefore, the technical solution of the present invention solves the defect of the slow cooling speed of the cooling structure of the electric pressure cooker in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 A schematic diagram of the three-dimensional structure of the heat dissipation structure of the present invention is shown;

[0025] Figure 2 Shows Figure 1 A cross-sectional schematic diagram of the heat dissipation structure;

[0026] Figure 3 Shows Figure 1 A schematic diagram of the structure of the heat transfer semiconductor in the heat dissipation structure;

[0027] Figure 4 Shows Figure 1 A schematic side view of the heat dissipation structure;

[0028] Figure 5 Shows Figure 4 The enlarged schematic diagram at A in the middle;

[0029] Figure 6 A schematic flow chart showing a method for controlling a cooking appliance of the present invention; and

[0030] Figure 7 Shows Figure 6 Schematic diagram of the flow chart of step S1 of the control method.

[0031] Description of reference numerals:

[0032] 10. Shell; 11. First air outlet; 12. Second air outlet; 13. Annular side wall; 14. Top wall; 15. Bottom wall; 20. Heat transfer structure; 21. Connecting rod; 22. First heat transfer head; 23. Second heat transfer head; 30. Heat transfer semiconductor; 40. Fan; 50. Annular baffle; 51. Avoidance. DETAILED DESCRIPTION

[0033] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0035] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0037] like Figure 1 and Figure 2As shown, a heat dissipation structure in this embodiment includes a housing 10, a heat transfer structure 20, a heat transfer semiconductor 30 and a fan 40. The housing 10 is provided with a first air outlet 11 and a second air outlet 12. The heat transfer structure 20 is provided on the housing 10, the first end of the heat transfer structure 20 is located outside the housing 10 and is suitable for cooperating with the structure to be dissipated, and the second end of the heat transfer structure 20 is located inside the housing 10. The heat transfer semiconductor 30 is provided inside the housing 10 and is located between the first air outlet 11 and the second air outlet 12, the first end of the heat transfer semiconductor 30 cooperates with the second end of the heat transfer structure 20, and the second end of the heat transfer semiconductor 30 forms a heat dissipation end. The fan 40 is provided at the first air outlet 11 and / or the second air outlet 12.

[0038] By using the technical solution of this embodiment, when the heat dissipation structure is working, the heat transfer structure 20 transfers heat from the first end to the second end, and the fan 40 is started so that the airflow enters from the first air outlet 11 or the second air outlet 12. The airflow takes away the heat from the second end of the heat transfer semiconductor 30, thereby achieving heat exchange and continuously reducing the temperature of the structure to be dissipated. When the heat transfer coefficient of the heat transfer semiconductor 30 decreases, the fan 40 is controlled to make the airflow flow in from the opposite direction, and at the same time, the current direction of the heat transfer semiconductor 30 is changed, thereby re-increasing the heat transfer coefficient. The above structure can ensure that the heat transfer semiconductor is always in an efficient heat transfer state, achieving the effect of rapid heat dissipation. Therefore, the technical solution of this embodiment solves the defect of the slow cooling speed of the cooling structure of the electric pressure cooker in the prior art.

[0039] It should be noted that the characteristic of the heat transfer semiconductor in this embodiment is that after the heat transfer semiconductor 30 is powered on, it can transfer heat between the first end and the second end of the heat transfer semiconductor 30. Specifically, after the semiconductor is powered on, electrons are emitted from the negative electrode (-), first passing through the P-type semiconductor, absorbing heat therefrom, and then to the N-type semiconductor, releasing heat again. Every time it passes through an NP module, heat is transferred from one side to the other, thereby achieving the effect of heat transfer. For example, in this embodiment, the first end of the heat transfer semiconductor 30 cooperates with the heat transfer structure 20 with a higher temperature, so that heat can be transferred from the first end of the heat transfer semiconductor 30 to the second end.

[0040] It should be noted that, in this embodiment, the direction of the airflow can be changed by controlling the operation of the fan 40. For example, the airflow can enter from the first air outlet 11 and be discharged from the second air outlet 12, in which case the first air outlet 11 is the air inlet and the second air outlet 12 is the air outlet; the airflow can enter from the second air outlet 12 and be discharged from the first air outlet 11, in which case the first air outlet 11 is the air outlet and the second air outlet 12 is the air inlet. Furthermore, when the fan 40 can realize exhaust and blowing, that is, the fan 40 can realize two-way air outlet, only one fan is provided at the first air outlet 11 or the second air outlet 12. When the fan 40 only has one-way air outlet, only one fan 40 is provided at the first air outlet 11 and the second air outlet 12.

[0041] like Figure 1 and Figure 2 As shown, in the technical solution of this embodiment, the housing 10 includes an annular side wall 13, and a top wall 14 and a bottom wall 15 arranged on the upper and lower sides of the annular side wall 13. Among them, the heat transfer structure 20 is arranged on the bottom wall 15, the first air outlet 11 is arranged on the top wall 14, and the second air outlet 12 is arranged on the annular side wall 13. Specifically, the above structure can enable the heat dissipation structure to achieve side air intake and top air outlet, or achieve top air intake and side air outlet.

[0042] like Figure 2 As shown, in the technical solution of this embodiment, the first air outlet 11 is arranged in the middle of the top wall 14, and there are multiple second air outlets 12, and the multiple second air outlets 12 are arranged at intervals along the circumference of the annular side wall 13. Specifically, the multiple second air outlets 12 can realize circumferential multi-directional air inlet or outlet, thereby improving the heat dissipation efficiency of the heat transfer semiconductor 30. Preferably, four second air outlets 12 are arranged in this embodiment, and the adjacent second air outlets 12 are 90 degrees in the circumferential direction.

[0043] like Figure 2 As shown, in the technical solution of this embodiment, the fan 40 is arranged at the first air outlet 11, and the fan 40 is configured to be able to exhaust and blow air. As described above, when the fan 40 is a two-way air outlet, it is sufficient to set one fan 40 at the first air outlet 11 and the second air outlet 12. In this embodiment, the fan 40 is set at the first air outlet 11. When the fan 40 exhausts air, the airflow enters from the second air outlet 12 and flows out from the first air outlet 11. When the fan 40 blows air, the airflow enters from the first air outlet 11 and flows out from the second air outlet 12.

[0044] like Figure 2 and Figure 3As shown, in the technical solution of this embodiment, the second end of the heat transfer semiconductor 30 extends to the bottom of the first air outlet 11. Specifically, the first end of the heat transfer semiconductor 30 cooperates with the second end of the heat transfer structure 20, and the second end extends to the bottom of the first air outlet 11, so the heat of the heat transfer structure 20 can be transferred to the bottom of the first air outlet 11 through the heat transfer semiconductor 30. When the fan 40 is started, it can drive the airflow to take away the heat at the second end of the heat transfer semiconductor 30, thereby achieving heat exchange.

[0045] like Figure 2 and Figure 3 As shown, in the technical solution of this embodiment, there are multiple heat transfer structures 20, and the multiple heat transfer structures 20 are arranged at intervals along the circumference of the first air outlet 11. There are multiple heat transfer semiconductors 30, and the multiple heat transfer structures 20 and the multiple heat transfer semiconductors 30 are arranged in a one-to-one correspondence. Specifically, in this embodiment, there are four heat transfer structures 20, and the structures of the four heat transfer structures 20 are the same. Correspondingly, there are also four heat transfer semiconductors 30, and a heat transfer semiconductor 30 is provided at the second end of each heat transfer structure 20 to cooperate with it. The four heat transfer semiconductors 30 are arranged radially relative to the first air outlet 11. The above structure can accelerate the heat dissipation efficiency of the heat dissipation structure.

[0046] like Figure 3 As shown, in the technical solution of this embodiment, the heat transfer semiconductor 30 is a fan-shaped structure. Specifically, the outer arc surface of the heat transfer semiconductor 30 cooperates with the heat transfer structure 20, and the inner arc surface extends to the bottom of the first air outlet 11. The four heat transfer semiconductors 30 form a roughly circular structure. The above structure can greatly increase the heat transfer area of ​​the heat transfer semiconductor 30, thereby improving the heat dissipation efficiency.

[0047] like Figure 3 As shown, in the technical solution of this embodiment, the heat transfer semiconductor 30 is a multi-layer structure stacked up and down. Specifically, the heat transfer semiconductor 30 is a sheet structure, and each heat transfer semiconductor 30 matched with the heat transfer structure 20 is four layers stacked up and down, thereby increasing the heat transfer area of ​​the heat transfer semiconductor 30 and improving the heat dissipation efficiency.

[0048] like Figure 2 As shown, in the technical solution of this embodiment, the heat transfer structure 20 includes a connecting rod 21 and a first heat transfer head 22 and a second heat transfer head 23 disposed at both ends of the connecting rod 21. The connecting rod 21 passes through the shell 10, the first heat transfer head 22 is located inside the shell 10, and the second heat transfer head 23 is located outside the shell 10. Specifically, the first heat transfer head 22 and the second heat transfer head 23 are flat structures, so the cross section of the heat transfer structure 20 is an "I"-shaped structure. Preferably, the first heat transfer head 22 and the second heat transfer head 23 are both circular structures.

[0049] Preferably, in the technical solution of this embodiment, the first air vent 11 and the second air vent 12 are switchable structures. Specifically, the switchable structure refers to the first air vent 11 and the second air vent 12 being openable or closed through structures such as baffles and grilles. Specifically, when the heat dissipation structure is not working, the first air vent 11 and the second air vent 12 are closed to prevent foreign objects such as dust and reptiles from entering. When the heat dissipation structure is working, the first air vent 11 and the second air vent 12 are opened to ensure that the airflow can circulate.

[0050] like Figure 2 , Figure 4 and Figure 5 As shown, in the technical solution of this embodiment, the heat dissipation structure also includes an annular baffle 50 rotatably arranged on the inner side of the annular side wall 13, and the annular baffle 50 is provided with a avoidance opening 51 adapted to the second air outlet 12. Specifically, when the annular baffle 50 rotates, the avoidance opening 51 can be misaligned, overlapped, or partially overlapped with the second air outlet 12. When the avoidance opening 51 and the second air outlet 12 are misaligned, the second air outlet 12 is closed. When the avoidance opening 51 overlaps with the second air outlet 12, the second air outlet 12 is opened. Accordingly, by changing the rotation angle of the annular baffle 50, the degree of opening of the second air outlet 12 can be adjusted.

[0051] The present embodiment also provides a cooking utensil, which includes a pot body, a pot cover and a heat dissipation structure. The pot body has a cooking cavity, the pot cover is arranged on the pot cover, the heat dissipation structure is arranged on the pot cover, and the heat dissipation structure is the above-mentioned heat dissipation structure. Further, when the pot cover is closed relative to the pot body, the first end of the heat transfer structure 20 is located in the cooking cavity. Specifically, the heat dissipation structure is used to achieve the effect of quickly reducing the pressure and opening the lid of the cooking utensil after cooking. When cooking is finished, the temperature and pressure in the cooking cavity are high, resulting in the user being unable to quickly open the lid. In the present embodiment, after cooking is finished, the heat transfer structure 20 of the heat dissipation structure transfers the heat in the cooking cavity from the first end to the second end. At this time, the heat transfer semiconductor 30 is powered on, and the fan 40 is started, and the heat transfer semiconductor 30 transfers the heat from the second end of the heat transfer structure 20 to the second air outlet 12, and the fan 40 starts to exhaust air, and the airflow enters from the first air outlet 11 and flows out from the second air outlet 12, thereby exchanging and taking away the heat at the second end of the heat transfer structure 20.

[0052] Preferably, the cooking utensil is an electric pressure cooker or an electric rice cooker, and the outer shell of the pot cover forms a shell. Specifically, the pot cover structures of the electric pressure cooker and the electric rice cooker generally include an inner liner and a surface cover, and the inner liner and the surface cover form a shell. The shell 10 includes an annular side wall, a bottom wall 15 and a top wall 14, and accordingly, the inner liner forms the bottom wall 15, the annular side ring of the surface cover forms the annular side wall 13, and the top plate of the surface cover forms the top wall 14. Of course, the shell 10 can also be separately arranged in the pot cover as the outer shell structure of the heat dissipation structure.

[0053] This embodiment also provides a control method for a cooking appliance, wherein the cooking appliance is the above-mentioned cooking appliance, such as Figure 6 As shown, the control method of this embodiment includes:

[0054] Step S1: After cooking is finished, the heat dissipation structure is activated to dissipate heat from the cooking cavity;

[0055] Step S2: When the pressure in the cooking cavity is less than a first preset value, the heat dissipation structure is closed.

[0056] Specifically, when cooking is finished, the pressure in the cooking cavity is high, so the user cannot open the lid. At this time, the heat dissipation structure starts to dissipate heat in the cooking cavity, thereby reducing the pressure in the cooking cavity. When the pressure in the cooking cavity is less than the first preset value, it means that the user can open the lid at this time, and the heat dissipation structure is turned off.

[0057] It should be noted that the pressure in the cooking cavity can be measured by a pressure sensor, so the acquisition method will not be described in detail in this article.

[0058] like Figure 7 As shown, further, step S1 includes:

[0059] Step S11: passing current through the heat transfer semiconductor 30, controlling the fan 40 to allow air flow to flow in from the second air outlet 12 and out from the first air outlet 11;

[0060] Step S12: obtaining a first temperature difference between the first end of the heat transfer semiconductor 30 and the first air outlet 11. When the first temperature difference is less than a second preset value, executing step S13;

[0061] Step S13: changing the current direction of the heat transfer semiconductor 30, controlling the fan 40 to make the air flow flow in from the first air outlet 11 and flow out from the second air outlet 12;

[0062] Step S14: obtaining a second temperature difference between the first end of the heat transfer semiconductor 30 and the second air outlet 12. When the second temperature difference is less than a third preset value, executing step S11.

[0063] In step S11 , after the heat transfer semiconductor 30 is powered on, it can transport the heat at the first end to the second end, and at the same time the fan 40 starts to draw air, at which time the second air outlet 12 takes in air and the first air outlet 11 discharges air.

[0064] In step S12 and step S13, when the first temperature difference is less than the second preset value, it means that the heat transfer coefficient of the heat transfer semiconductor 30 becomes low, and the fan 40 is changed to blower mode, and the first air outlet 11 takes in air, and the second air outlet 12 discharges air. At the same time, the current flowing into the heat transfer semiconductor 30 is reversed, that is, the positive and negative poles of the heat transfer semiconductor 30 are reversed, and heat is transferred from the second end of the heat transfer semiconductor 30 to the first end, thereby increasing the heat transfer coefficient of the surface of the heat transfer semiconductor 30.

[0065] In step S14, when the second temperature difference is less than the third preset value, it means that the heat transfer coefficient of the heat transfer semiconductor 30 is reduced again, and then the process returns to step S11, that is, the flow direction of the current is reversed again, and the fan 40 is turned into exhaust. In this way, steps S11 to S14 are circulated, thereby ensuring the heat transfer coefficient of the heat transfer semiconductor 30, accelerating heat dissipation, and achieving the purpose of rapid pressure reduction.

[0066] It should be noted that in step S11 and step S13 , the directions of the current flowing through the heat transfer semiconductor 30 are opposite.

[0067] It should be noted that the first temperature difference and the second temperature difference mentioned above can be measured by providing temperature sensors at the first air outlet 11 , the second air outlet 12 and the first end of the heat transfer semiconductor 30 .

[0068] During the cycle of steps S11 to S14, as long as it is detected that the pressure in the cooking cavity is less than the first preset value, the cycle is exited, that is, the heat dissipation structure is closed.

[0069] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention.

Claims

1. A cooking appliance control method, characterized in that: Cooking utensils include: A pot body having a cooking cavity; A pot cover, arranged on the pot cover; A heat dissipation structure, arranged on the pot cover, comprising: a shell (10), wherein the shell (10) is provided with a first air outlet (11) and a second air outlet (12); a heat transfer structure (20) disposed on the shell (10), wherein a first end of the heat transfer structure (20) is located outside the shell (10) and is suitable for cooperating with a structure to be cooled, and a second end of the heat transfer structure (20) is located inside the shell (10); a heat transfer semiconductor (30) disposed in the housing (10) and located between the first air outlet (11) and the second air outlet (12), the first end of the heat transfer semiconductor (30) cooperating with the second end of the heat transfer structure (20), the second end of the heat transfer semiconductor (30) forming a heat dissipation end; a fan (40) disposed at the first air outlet (11) and / or the second air outlet (12), wherein when the pot cover is closed relative to the pot body, the first end of the heat transfer structure (20) is located in the cooking cavity, The control method comprises: Step S1: After cooking is finished, the heat dissipation structure is activated to dissipate heat from the cooking cavity; Step S2: when the pressure in the cooking cavity is less than a first preset value, closing the heat dissipation structure; The step S1 comprises: Step S11: passing current through the heat transfer semiconductor (30), controlling the fan (40) and causing air flow to flow in from the second air outlet (12) and out from the first air outlet (11); Step S12: obtaining a first temperature difference between the first end of the heat transfer semiconductor (30) and the first air outlet (11), and executing step S13 when the first temperature difference is less than a second preset value; Step S13: changing the current direction of the heat transfer semiconductor (30), controlling the fan (40) and causing the airflow to flow in from the first air outlet (11) and flow out from the second air outlet (12); Step S14: obtaining a second temperature difference between the first end of the heat transfer semiconductor (30) and the second air outlet (12); when the second temperature difference is less than a third preset value, executing step S11.

2. The control method according to claim 1, characterized in that: The shell (10) comprises an annular side wall (13), and a top wall (14) and a bottom wall (15) arranged on the upper and lower sides of the annular side wall (13), wherein the heat transfer structure (20) is arranged on the bottom wall (15), the first air outlet (11) is arranged on the top wall (14), and the second air outlet (12) is arranged on the annular side wall (13).

3. The control method according to claim 2, characterized in that: The first air outlet (11) is arranged in the middle of the top wall (14), and the second air outlet (12) is multiple, and the multiple second air outlets (12) are arranged at intervals along the circumference of the annular side wall (13).

4. The control method according to claim 3, characterized in that: The fan (40) is arranged at the first air outlet (11), and the fan (40) is configured to be able to draw air and blow air.

5. The control method according to claim 3, characterized in that: The second end of the heat transfer semiconductor (30) extends to below the first air outlet (11).

6. The control method according to claim 3, characterized in that: There are a plurality of heat transfer structures (20), and the plurality of heat transfer structures (20) are arranged at intervals along the circumference of the first air outlet (11); there are a plurality of heat transfer semiconductors (30), and the plurality of heat transfer structures (20) and the plurality of heat transfer semiconductors (30) are arranged in a one-to-one correspondence.

7. The control method according to claim 1 or 6, characterized in that: The heat transfer semiconductor (30) is a fan-shaped structure.

8. The control method according to claim 1 or 6, characterized in that: The heat transfer semiconductor (30) is a multi-layer structure stacked up and down.

9. The control method according to claim 1, characterized in that: The heat transfer structure (20) comprises a connecting rod (21) and a first heat transfer head (22) and a second heat transfer head (23) arranged at two ends of the connecting rod (21); the connecting rod (21) passes through the shell (10); the first heat transfer head (22) is located inside the shell (10); and the second heat transfer head (23) is located outside the shell (10).

10. The control method according to claim 1, characterized in that: The first air outlet (11) and the second air outlet (12) are switchable structures.

11. The control method according to claim 2, characterized in that: The heat dissipation structure further comprises an annular baffle (50) rotatably arranged on the inner side of the annular side wall (13), and the annular baffle (50) is provided with a avoidance opening (51) adapted to the second air outlet (12).

12. The control method according to claim 1, characterized in that: The outer shell of the pot cover forms the housing.

13. The control method according to claim 1, characterized in that: The cooking utensil is an electric pressure cooker or an electric rice cooker.

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