High isolation phased array antenna module and phased array antenna array

Abstract

The embodiments of the present invention provide a high-isolation phased array antenna module and a phased array antenna array, which relate to the field of antenna technology. The high-isolation phased array antenna module includes a circuit board and a plurality of radiating units arranged in an array on the circuit board, and a first parasitic unit is arranged between two adjacent radiating units, and the first parasitic unit is used to optimize the isolation between the two adjacent radiating units. By arranging the first parasitic unit between adjacent radiating units, the isolation between the two adjacent radiating units is optimized, the mutual influence between the radiating units is avoided, and the performance of the phased array antenna after the array is optimized. Compared with the prior art, the present invention optimizes the isolation between the radiating units, improves the antenna performance, and avoids the complicated hole opening process at the same time, and the process is simple and the cost is low.

Description

Technical Field

[0001] The present invention relates to the field of antenna technology, and in particular to a high-isolation phased array antenna module and a phased array antenna array surface. Background Art

[0002] AiP (Antennas in Package) antennas are generally used as omnidirectional antennas or small-range beam scanning in mobile phone antennas or wearable smart devices. The number of units is small, such as 1x4, 2x2, or 4x4. There is no clear requirement for the isolation between adjacent units, and the array is generally arranged at a spacing of half a wavelength. According to this spacing, the isolation between adjacent units is usually -12dB to -15dB. If isolation holes are added between adjacent units, the isolation between adjacent units can be optimized to -17dB to -20dB; however, since AiP is a packaged antenna, isolation holes are generally not added unless there are special circumstances. Adding isolation holes will increase the complexity of the process and the cost will also increase. Summary of the invention

[0003] The objects of the present invention include, for example, providing a high-isolation phased array antenna module and a phased array antenna array surface, which can optimize the isolation between adjacent units, and at the same time have simple processes and low process costs.

[0004] The embodiments of the present invention can be implemented as follows:

[0005] In a first aspect, the present invention provides a high-isolation phased array antenna module, comprising a circuit board and a plurality of radiating units arranged in an array on the circuit board, a first parasitic unit being arranged between two adjacent radiating units, and the first parasitic unit being used to optimize the isolation between the two adjacent radiating units.

[0006] In an optional embodiment, each of the first parasitic units is provided with a first gap groove extending to the surface of the circuit board, the first gap groove separates the first parasitic unit into two first patches, and the two first patches are arranged opposite to each other on both sides of the first gap groove.

[0007] In an optional embodiment, a second gap groove is provided on one side opposite to the two first patches, the two second gap grooves extend in directions away from each other, and each of the second gap grooves is connected to the first gap groove.

[0008] In an optional embodiment, an extension direction of the first gap groove is parallel to a center line connecting two adjacent radiation units, and an extension direction of the second gap groove is perpendicular to an extension direction of the first gap groove.

[0009] In an optional embodiment, the width of the first gap groove is greater than the width of the second gap groove.

[0010] In an optional implementation, a plurality of second parasitic units are further disposed on the edge of the circuit board, and the second parasitic units are disposed outside the plurality of radiation units.

[0011] In an optional embodiment, a third gap groove extending to the surface of the circuit board is provided on the second parasitic unit, and the third gap groove separates the second parasitic unit into two second patches, and the two second patches are arranged opposite to each other on both sides of the third gap groove.

[0012] In an optional embodiment, a fourth gap groove is provided on the opposite side of the two second patches, the two fourth gap grooves extend in directions away from each other, each of the fourth gap grooves is connected to the third gap groove and extends outward to the edge of the circuit board.

[0013] In an optional embodiment, the width of the first parasitic unit in a direction perpendicular to the center line of two adjacent radiation units is the same as the width of the corresponding two adjacent radiation units; the width of the second parasitic unit in a direction parallel to the edge of the circuit board is the same as the width of the corresponding radiation unit.

[0014] In a second aspect, the present invention provides a phased array antenna array surface, comprising a plurality of high-isolation phased array antenna modules as described in any of the foregoing embodiments, wherein the plurality of circuit boards are spliced ​​together, and an installation gap is provided between two adjacent circuit boards.

[0015] The beneficial effects of the embodiments of the present invention include, for example:

[0016] The high-isolation phased array antenna module and phased array antenna array provided by the present invention optimize the isolation between two adjacent radiating units by setting a first parasitic unit between adjacent radiating units, avoid mutual influence between radiating units, and optimize the performance of the phased array antenna after array formation. Compared with the prior art, the present invention optimizes the isolation between radiating units, improves antenna performance, and avoids complex hole-opening processes, with simple processes and low costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 A schematic structural diagram of a high-isolation phased array antenna module provided by a first embodiment of the present invention;

[0019] Figure 2 for Figure 1 A partial enlarged schematic diagram of middle Ⅱ;

[0020] Figure 3 A schematic structural diagram of a phased array antenna surface provided in the second embodiment of the present invention.

[0021] Icon: 100-high isolation phased array antenna module; 110-circuit board; 130-radiating unit; 150-first parasitic unit; 151-first patch; 153-first gap slot; 155-second gap slot; 170-second parasitic unit; 171-second patch; 173-third gap slot; 175-fourth gap slot; 200-phased array antenna surface; 210-installation gap. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0023] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0025] In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear to indicate an orientation or position relationship, they are based on the orientation or position relationship shown in the accompanying drawings, or are the orientation or position relationship in which the product of the invention is usually placed when used. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0026] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0027] As disclosed in the background technology, the existing conventional Aip (Antennas in Package) antenna modules generally have a small number of units, generally 1x4, or 2x2, or 4x4. In the case of such a small number of units, there is generally no requirement for the isolation between the units. However, when splicing to form an array, for example, when forming a 64-channel array, the isolation between the units needs to be considered. In the prior art, isolation is usually achieved by using an opening process, that is, dense metallized through holes are opened between adjacent units to optimize the isolation between adjacent units.

[0028] However, since AiP is a packaged antenna, unless there are special circumstances, isolation holes are generally not added. Adding isolation holes usually requires drilling on the substrate and electroplating a metal layer to achieve metallization of the isolation holes. Therefore, adding isolation holes will increase the complexity of the process and the cost will also be optimized.

[0029] In order to solve the above problems, the present invention provides a novel high-isolation phased array antenna module, which can achieve the purpose of increasing isolation without drilling holes, thus saving costs. It should be noted that the features in the embodiments of the present invention can be combined with each other without conflict.

[0030] First embodiment

[0031] See also Figures 1 to 3 This embodiment provides a high-isolation phased array antenna module 100, which can optimize the isolation between adjacent units, and at the same time does not require drilling, has a simple process and low process cost.

[0032] The high-isolation phased array antenna module 100 provided in this embodiment includes a circuit board 110 and a plurality of radiating units 130 arranged in an array on the circuit board 110 , a first parasitic unit 150 is arranged between two adjacent radiating units 130 , and the first parasitic unit 150 is used to optimize the isolation between the two adjacent radiating units 130 .

[0033] In this embodiment, the first parasitic unit 150 is not electrically connected to the feeding unit under the circuit board 110. By adding the first parasitic unit 150 between two adjacent radiation units 130, the isolation between the two radiation units 130 can be effectively optimized and mutual influence between the two adjacent radiation units 130 can be avoided.

[0034] It should be noted that, in this embodiment, the circuit board 110 is a PCB board, and a plurality of radiation units 130 are arranged in an array on the surface of the circuit board 110. Specifically, in this embodiment, the high isolation phased array antenna module 100 is a 4x4 channel, that is, 16 radiation units 130 arranged in a 4x4 pattern are arranged on a single circuit board 110, and the 16 radiation units 130 are arranged in an array on the surface of the circuit board 110, and a first parasitic unit 150 is arranged between two adjacent radiation units 130. The first parasitic unit 150 is located in the middle of two adjacent radiation units 130, and has the same distance as the two adjacent radiation units 130. There are a total of 24 first parasitic units 150 on the circuit board 110, which are distributed in 3 horizontal and 3 vertical patterns between the 16 radiation units 130 on the circuit board 110, so that a first parasitic unit 150 is arranged between every two radiation units 130. Of course, the number of the radiation units 130 and the first parasitic units 150 here is only for illustration, and other high-isolation phased array antenna modules 100 such as 1×4 or 2×2 channels will not be described in detail.

[0035] In this embodiment, each first parasitic unit 150 is provided with a first gap groove 153 extending to the surface of the circuit board 110, and the first gap groove 153 separates the first parasitic unit 150 into two first patches 151, and the two first patches 151 are oppositely arranged on both sides of the first gap groove 153. Specifically, the first gap groove 153 penetrates the first parasitic unit 150 and extends downward to the surface of the circuit board 110, and separates the first parasitic unit 150 into two symmetrically arranged first patches 151, and the two first patches 151 can achieve the isolation effect on the adjacent radiation units 130.

[0036] In this embodiment, a second gap groove 155 is provided on one side opposite to the two first patches 151, and the two second gap grooves 155 extend in directions away from each other, and each second gap groove 155 is connected to the first gap groove 153. Specifically, the second gap groove 155 extends downward to the surface of the circuit board 110, and the second gap groove 155 does not penetrate the first patch 151 in the horizontal direction, so that the first patch 151 presents a C shape, and the two first patches 151 are symmetrically arranged on both sides of the first gap groove 153.

[0037] It should be noted that, in the present embodiment, the first patch 151 is formed by an etching process. Specifically, the first gap groove 153 and the second gap groove 155 are formed by patterning, thereby forming two symmetrically arranged first patches 151 .

[0038] In this embodiment, the extension direction of the first gap slot 153 is parallel to the center line of two adjacent radiation units 130, and the extension direction of the second gap slot 155 is perpendicular to the extension direction of the first gap. Specifically, the two second gap slots 155 are symmetrically distributed on both sides of the first gap slot 153, and the first gap slot 153 and the two second gap slots 155 form a cross-shaped slot structure.

[0039] In this embodiment, the width of the first parasitic unit 150 in a direction perpendicular to the center line of two adjacent radiation units 130 is the same as the width of the corresponding two adjacent radiation units 130. Specifically, the distance between the ends of the two first patches 151 that are away from each other is the same as the width of the radiation unit 130, so that the two first patches 151 are distributed flush with the two side edges of the radiation unit 130.

[0040] It should be noted that the center line of the two radiation units 130 in this embodiment refers to the line connecting the geometric centers of the two adjacent radiation units 130 . Specifically, the line passes through the corresponding first gap slot 153 and coincides with the center line of the first gap slot 153 .

[0041] In this embodiment, the width of the first gap 153 is greater than the width of the second gap 155. Specifically, the width of the first gap 153 is determined by the simulation software and is used for depth adjustment of the isolation, that is, for different isolation requirements, first gaps 153 of different widths are set. The width of the second gap 155 is also determined by the simulation software and can be used for frequency adjustment, and works together with the first gap 153 to optimize the isolation between adjacent radiation units 130.

[0042] In this embodiment, a plurality of second parasitic units 170 are further disposed at the edge of the circuit board 110, and the second parasitic units 170 are disposed outside the plurality of radiation units 130. Specifically, the outsides of the radiation units 130 disposed near the edge of the circuit board 110 are all provided with second parasitic units 170, and in this embodiment, there are also 16 second parasitic units 170, which are evenly distributed at the edges of the circuit board 110 and correspond to the peripheral radiation units 130.

[0043] It should be noted that the outer side of the plurality of radiation units 130 in this embodiment refers to the side of the radiation unit 130 away from the center point of the circuit board 110. Specifically, since the radiation unit 130 in this embodiment adopts 4x4 channels, 4 radiation units 130 are located in the inner layer, 12 radiation units 130 are located in the outer layer, the outer layer is arranged around the inner layer, and the plurality of second parasitic units 170 are distributed on the outer side of the outer layer, that is, 16 second parasitic units 170 are arranged around the outer layer and close to the edge of the circuit board 110.

[0044] In this embodiment, the second parasitic unit 170 is provided with a third gap groove 173 extending to the surface of the circuit board 110, and the third gap groove 173 separates the second parasitic unit 170 into two second patches 171, and the two second patches 171 are relatively arranged on both sides of the third gap groove 173. Specifically, the third gap groove 173 runs through the second parasitic unit 170 and extends downward to the surface of the circuit board 110, and the third gap groove 173 separates the second parasitic unit 170 into two symmetrically arranged second patches 171. When splicing to form the phased array antenna array surface, the two second patches 171 on the circuit board 110 can work together with the two second patches 171 on the adjacent circuit board 110 to achieve the isolation of the radiation units 130 on the adjacent circuit boards 110.

[0045] It should be noted that in this embodiment, the width of the third gap groove 173 is the same as the width of the first gap groove 153, which is also determined by the simulation software and is used for depth adjustment of isolation, that is, for different isolation requirements, third gap grooves 173 of different widths are set.

[0046] In this embodiment, a fourth gap groove 175 is provided on one side opposite to the two second patches 171, and the two fourth gap grooves 175 extend in directions away from each other, and each fourth gap groove 175 is connected to the third gap groove 173 and extends outward to the edge of the circuit board 110. Specifically, the fourth gap groove 175 is provided on the side of the second patch 171 away from the radiation unit 130 on the same circuit board 110, and the fourth gap groove 175 is an open gap groove, which is used to be spliced ​​with the fourth gap groove 175 on the adjacent circuit board 110 during splicing. At the same time, in the horizontal direction, the fourth gap groove 175 does not penetrate the second patch 171, so that the second patch 171 is L-shaped, which is convenient for splicing with the adjacent second patch 171.

[0047] It should be noted that in this embodiment, the distance between the second patch 171 and the corresponding radiation unit 130 is the same as the distance between the first patch 151 and the corresponding radiation unit 130, so that the second patch 171 and the first patch 151 are evenly distributed around the radiation unit 130, so that the isolation effect is better.

[0048] It should also be noted that, in the present embodiment, the width of the fourth gap slot 175 is related to the width of the mounting gap 210 on the array surface of the phased array antenna formed after the array is formed. Specifically, it can be determined according to the simulation software. The width of the fourth gap slot 175 is used to adjust the frequency. Preferably, twice the width of the fourth gap slot 175 plus the width of the mounting gap 210 is equal to the width of the second gap slot 155. Combined with the width of the third gap slot 173 being the same as the width of the first gap slot 153, the isolation between the radiation units 130 on two adjacent circuit boards 110 is the same as the isolation between the radiation units 130 on the same circuit board 110, that is, the parasitic structure around each radiation unit 130 is the same, so that the radiation performance in each channel remains consistent and the isolation between the radiation units 130 is optimized.

[0049] In this embodiment, the width of the second parasitic unit 170 in a direction parallel to the edge of the circuit board 110 is the same as the width of the corresponding radiation unit 130. Specifically, the distance between the ends of the two second patches 171 that are away from each other is the same as the width of the radiation unit 130, so that the two second patches 171 are distributed flush with the two side edges of the radiation unit 130.

[0050] In summary, this embodiment provides a high-isolation phased array antenna module 100, which optimizes the isolation between two adjacent radiating units 130 by setting a first parasitic unit 150 between adjacent radiating units 130, and avoids mutual influence between the radiating units 130. At the same time, a second parasitic unit 170 is set at the edge of the circuit board 110, so that the isolation between the radiating units 130 on the two adjacent circuit boards 110 after the array is formed is optimized, thereby optimizing the performance of the phased array antenna after the array is formed. At the same time, there is no need to use a punching process, which reduces the process difficulty and saves costs.

[0051] Second embodiment

[0052] Please continue to see Figure 3 This embodiment provides a phased array antenna array 200, including a plurality of high-isolation phased array antenna modules 100, wherein the basic structure and principle of the high-isolation phased array antenna module 100 and the technical effects produced are the same as those of the first embodiment. For the sake of brief description, for parts not mentioned in this embodiment, reference may be made to the corresponding contents in the first embodiment.

[0053] The phased array antenna plane 200 provided in this embodiment includes a plurality of high-isolation phased array antenna modules 100, and the high-isolation phased array antenna module 100 includes a circuit board 110 and a plurality of radiating units 130 arranged in an array on the circuit board 110, and a first parasitic unit 150 is arranged between two adjacent radiating units 130, and the first parasitic unit 150 is used to optimize the isolation between two adjacent radiating units 130. A plurality of second parasitic units 170 are also arranged at the edge of the circuit board 110, and the second parasitic units 170 are arranged outside the plurality of radiating units 130. The plurality of circuit boards 110 are spliced ​​together, and a mounting gap 210 is provided between two adjacent circuit boards 110.

[0054] In this embodiment, two second parasitic units 170 on adjacent circuit boards 110 are spliced ​​together, so that the isolation between the radiation units 130 on the adjacent circuit boards 110 can be optimized, so that the isolation between every two adjacent radiation units 130 after array formation is optimized.

[0055] The phased array antenna surface 200 provided in this embodiment optimizes the isolation between two adjacent radiating units 130 by disposing a first parasitic unit 150 between adjacent radiating units 130, thereby avoiding mutual influence between the radiating units 130. Meanwhile, a second parasitic unit 170 is disposed at the edge of the circuit board 110, so that the isolation between the radiating units 130 on two adjacent circuit boards 110 after array formation is optimized, thereby optimizing the performance of the phased array antenna surface 200 after array formation.

[0056] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A high isolation phased array antenna module, characterized in that: It comprises a circuit board and a plurality of radiation units arranged in an array on the circuit board, a first parasitic unit is arranged between two adjacent radiation units, and the first parasitic unit is used to optimize the isolation between the two adjacent radiation units; Each of the first parasitic units is provided with a first gap groove extending to the surface of the circuit board, the first gap groove is used to separate the first parasitic unit into two symmetrically arranged first patches, and the two first patches are arranged oppositely on both sides of the first gap groove; A second gap groove is provided on one side opposite to the two first patches, the two second gap grooves extend in directions away from each other, and each of the second gap grooves is connected to the first gap groove; The width of the first gap groove is used for depth adjustment of isolation, the width of the second gap groove is used for frequency adjustment, and the first gap groove and the second gap groove work together to optimize the isolation between adjacent radiation units; A plurality of second parasitic units are also arranged at the edge of the circuit board, and the second parasitic units are arranged outside the plurality of radiation units; a third gap groove extending to the surface of the circuit board is arranged on the second parasitic unit, and the third gap groove separates the second parasitic unit into two second patches, and the two second patches are arranged oppositely on both sides of the third gap groove; A fourth gap groove is arranged on one side opposite to the two second patches, and the two fourth gap grooves extend in directions away from each other, and each of the fourth gap grooves is connected to the third gap groove and extends outward to the edge of the circuit board.

2. The high isolation phased array antenna module according to claim 1, characterized in that: The extension direction of the first gap is parallel to a center line connecting two adjacent radiation units, and the extension direction of the second gap is perpendicular to the extension direction of the first gap.

3. The high isolation phased array antenna module according to claim 1, characterized in that: The width of the first gap groove is greater than the width of the second gap groove.

4. The high isolation phased array antenna module according to claim 1, characterized in that: The width of the first parasitic unit in a direction perpendicular to the center line of the two adjacent radiation units is the same as the width of the corresponding two adjacent radiation units; the width of the second parasitic unit in a direction parallel to the edge of the circuit board is the same as the width of the corresponding radiation unit.

5. A phased array antenna array, characterized in that: It comprises a plurality of high-isolation phased array antenna modules as described in any one of claims 1 to 4, wherein the plurality of circuit boards are spliced ​​together, and a mounting gap is provided between two adjacent circuit boards.

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