Display device

Abstract

A display device is provided. The display device according to an exemplary embodiment includes a display area and a non-display area surrounding the display area, and the display device includes: a first substrate; a second substrate, the second substrate faces the first substrate and includes a first surface facing the first substrate and a second surface that is an opposite surface to the first surface of the second substrate; a touch electrode, the touch electrode is provided on the second surface of the second substrate and is positioned in the display area; a touch pad terminal, the touch pad terminal is provided on the second surface of the second substrate, is positioned in the non-display area, and is electrically connected to the touch electrode; and a sealing member, the sealing member is interposed between the first substrate and the second substrate, and couples the first substrate and the second substrate, wherein the sealing member is positioned in the non-display area, and the touch pad terminal is provided more inward than the sealing member.

Description

Technical Field

[0001] The present invention relates to a display device. Background Art

[0002] A display device is a device for displaying moving images or still images, and the display device can be used as a display screen for various products such as televisions, laptop computers, monitors, billboards, and IoT devices, as well as portable electronic devices such as mobile phones, smart phones, tablet PCs (personal computers), smart watches, watch phones, mobile communication terminals, electronic notebooks, e-book readers, portable multimedia players (PMPs), navigation devices, and ultra mobile PCs (UMPCs).

[0003] The display device may be, for example, an organic light-emitting display device. All image displays of a display device such as an organic light-emitting display device are attributed to light transmission. Specifically, the transmittance of light may affect display quality such as brightness of the display device. Therefore, the components constituting the display device may at least partially include a transparent member, for example, a glass member.

[0004] The organic light emitting display device may include a base substrate as a glass member, a lower substrate, and an upper substrate as an encapsulation substrate. Generally, in order to join the glass members, laser sealing may be used to irradiate laser to the glass frit interposed between the upper substrate and the lower substrate.

[0005] At the same time, a touch screen can be directly formed on the upper substrate. Generally, the display device to which this method is applied is called a touch screen panel integrated display device. The touch screen can include a plurality of touch signal pads on one side, and the touch pads can be ultrasonically bonded to an external device, for example, a touch flexible printed circuit board.

[0006] However, when the above-described laser sealing is performed on the lower substrate and the upper substrate on which the touch screen is formed, the laser sealing may not be smoothly performed due to the touch signal pad formed on the upper substrate. Summary of the invention

[0007] [Technical issues]

[0008] An object of the present invention is to provide a display device in which a touch signal pad is arranged not to overlap with a sealing area to improve the bonding characteristics between an upper substrate and a lower substrate.

[0009] The purpose of the present invention is not limited to the above-mentioned technical problems, and other technical problems not mentioned will be clearly understood by those skilled in the art through the following description.

[0010] [Technical solution]

[0011] An aspect of the present invention provides a display device including a display area and a non-display area surrounding the display area, the display device including: a first substrate; a second substrate, the second substrate facing the first substrate and including a first surface facing the first substrate and a second surface opposite to the first surface of the second substrate; a touch electrode, the touch electrode is arranged on the second surface of the second substrate and is positioned in the display area; a touch pad terminal, the touch pad terminal is arranged on the second surface of the second substrate, is positioned in the non-display area, and is electrically connected to the touch electrode; and a sealing member, the sealing member is interposed between the first substrate and the second substrate, and couples the first substrate and the second substrate, wherein the sealing member is positioned in the non-display area, and the touch pad terminal is arranged more inward than the sealing member.

[0012] The touch pad terminal may not overlap the sealing member.

[0013] The display device may further include a display element, wherein the first substrate includes a first surface facing the second substrate and a second surface opposite to the first surface of the first substrate, and the display element may be provided on the first surface of the first substrate.

[0014] The display element may include an anode, a cathode, and an organic emission layer disposed between the anode and the cathode.

[0015] The display element may be sealed by the first substrate, the second substrate, and the sealing member.

[0016] The second substrate may be made of glass or quartz.

[0017] The touch electrodes may be directly disposed on the second surface of the second substrate.

[0018] The sealing member may include optically transparent frit.

[0019] The touch electrode may include a transparent electrode layer including a transparent conductive oxide.

[0020] The touch pad terminal may include: a first conductive layer including a transparent conductive oxide; and a second conductive layer disposed on the first conductive layer and including an opaque metal.

[0021] The transparent electrode layer and the first conductive layer may be made of the same material.

[0022] The second conductive layer can be made of at least one of aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), copper (Cu), molybdenum (Mo), Ti / Al / Ti, Mo / Al / Mo, Mo / AlGe / Mo, Ti / Cu and MoNb.

[0023] The display device may further include a circuit board attached to the second surface of the second substrate.

[0024] The circuit board may include a lead terminal connected to the touch pad terminal.

[0025] The touch pad terminal and the lead terminal may be ultrasonically bonded.

[0026] The first substrate may extend from one end of the second substrate to the outside of the second substrate.

[0027] The circuit board may be bent to surround a region of the first substrate extending from one end of the second substrate, and one end of the circuit board may be positioned below the second surface of the first substrate.

[0028] Another aspect of the present invention provides a display device including a display area and a non-display area surrounding the display area, the display device including: a display substrate; a packaging substrate, the packaging substrate facing the display substrate and including a first surface facing the display substrate and a second surface opposite to the first surface of the packaging substrate; a touch electrode, the touch electrode is arranged on the second surface of the packaging substrate and positioned in the display area; a touch pad terminal, the touch pad terminal is arranged on the second surface of the packaging substrate, positioned in the non-display area, and electrically connected to the touch electrode; a display element, the display element is arranged on the display area of ​​the display substrate and is sealed by the display substrate, the sealing member and the packaging substrate; and a touch element, the touch element is arranged on the packaging substrate and overlaps with the display area of ​​the display substrate, wherein the touch pad terminal overlaps with a portion of the sealing area of ​​the display substrate and includes a first pad conductive layer and a second pad conductive layer arranged on the first pad conductive layer and containing an opaque metal.

[0029] The touch electrode may include a transparent electrode layer including a transparent conductive oxide.

[0030] The transparent electrode layer and the first pad conductive layer may be made of the same material.

[0031] The second pad conductive layer can be made of at least one of aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), copper (Cu), molybdenum (Mo), Ti / Al / Ti, Mo / Al / Mo, Mo / AlGe / Mo, Ti / Cu and MoNb.

[0032] The display substrate includes a first surface facing the encapsulation substrate and a second surface opposite to the first surface of the encapsulation substrate, and the display element may be disposed on the first surface of the display substrate.

[0033] The display element may include an anode, a cathode, and an organic emission layer disposed between the anode and the cathode.

[0034] The display element may be sealed by the display substrate, the encapsulation substrate, and the sealing member.

[0035] The package substrate may be made of glass or quartz, and the touch electrodes may be directly disposed on the second surface of the package substrate.

[0036] The sealing member may include optically transparent frit.

[0037] The display device may further include a touch circuit board attached to the second surface of the package substrate, and the touch circuit board may include a lead terminal connected to the touch pad terminal.

[0038] The touch pad terminal and the lead terminal may be ultrasonically bonded.

[0039] The display substrate may extend from one end of the encapsulation substrate to the outside of the encapsulation substrate.

[0040] The touch circuit board may be bent to surround a region of the display substrate extending from one end of the package substrate, and the one end of the touch circuit board may be positioned under the second surface of the display substrate.

[0041] Details of other embodiments are included in the detailed description and accompanying drawings.

[0042] [Beneficial Effects]

[0043] The display device according to the exemplary embodiment of the present invention may improve the bonding characteristics between the upper substrate and the lower substrate by disposing the touch signal pad not to overlap the sealing area.

[0044] The effects according to the present invention are not limited to the contents described above, and include more various effects in this specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 is a plan layout diagram of a display device according to an exemplary embodiment.

[0046] Figure 2 yes Figure 1 A cross-sectional view of a display device.

[0047] Figure 3 is a plan layout diagram of an upper substrate according to an exemplary embodiment.

[0048] Figure 4 is a cross-sectional view of a touch member of a sensing area according to an exemplary embodiment.

[0049] Figure 5 is a cross-sectional view of a touch member of a sensing area according to a modified example.

[0050] Figure 6 is a plan layout diagram of a touch signal pad terminal according to an exemplary embodiment.

[0051] Figure 7 It is a cross-sectional view taken along line X1-X1'.

[0052] Figure 8 It is a cross-sectional view taken along line X2-X2' and line X3-X3'.

[0053] Fig. 9 is a perspective view illustrating a process of sealing an upper substrate and a lower substrate according to an exemplary embodiment.

[0054] Fig.10 is a plan layout diagram of a touch signal pad terminal according to another exemplary embodiment.

[0055] Fig.11 It is a cross-sectional view taken along line X4-X4'.

[0056] Fig.12 It is a cross-sectional view taken along line X5-X5' and line X6-X6'.

[0057] Fig.13 is a plan layout diagram of a touch signal pad terminal according to yet another exemplary embodiment.

[0058] Fig.14 It is a cross-sectional view taken along line X7-X7'.

[0059] Fig.15 It is a cross-sectional view taken along the line X8-X8' and the line X9-X9'.

[0060] Fig.16 is a plan layout diagram of an upper substrate according to still another exemplary embodiment.

[0061] Fig.17 is a cross-sectional view of a touch member of a sensing area according to still another exemplary embodiment.

[0062] Fig.18 is a plan layout diagram of a touch signal pad terminal according to still another exemplary embodiment.

[0063] Fig.19 It is a cross-sectional view taken along the line X10-X10'.

[0064] Fig. 20 It is a cross-sectional view taken along the line X11-X11' and the line X12-X12'.

[0065] Fig.21 is a cross-sectional view of a display device according to still another exemplary embodiment.

[0066] Fig. 22 is a plan layout diagram of an upper substrate according to still another exemplary embodiment.

[0067] Fig.23 is a flowchart illustrating a method of manufacturing a display device according to still another exemplary embodiment.

[0068] Figure 24 to Figure 26 is a perspective view showing a process of forming a touch signal pad terminal. DETAILED DESCRIPTION

[0069] The advantages and features of the present invention and the methods for achieving the advantages and features of the present invention will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in different forms. That is, the present invention is limited only by the scope of the claims.

[0070] When an element or layer is referred to as being “on” or “over” another element or layer, this includes not only being directly on or directly over the other element or layer, but also having another intervening element or layer interposed therebetween. On the other hand, when an element or layer is referred to as being “directly on” or “directly over” another element or layer, this indicates that there is no other intervening element or layer between them.

[0071] Throughout the specification, the same reference numerals are used for the same or like parts.

[0072] Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

[0073] Figure 1 is a plan layout diagram of a display device according to an exemplary embodiment, and Figure 2 yes Figure 1 A cross-sectional view of a display device.

[0074] Reference Figure 1 and Figure 2 The display device 1 may include a display panel 100 that displays an image, a panel lower sheet 200 disposed below the display panel 100, a window 300 disposed on the display panel 100, a display printed circuit board 400 attached to a display pad area D_PA of the display panel 100, and a touch printed circuit board 500 attached to a touch pad area T_PA of the display panel 100.

[0075] The display panel 100 may include a lower substrate 101 , an upper substrate 130 , various elements disposed on the lower substrate 101 , and various elements disposed on the upper substrate 130 .

[0076] The lower substrate 101 may have a rectangular shape whose corners have right angles on a plane. The lower substrate 101 may have a short side and a long side on a plane. The long side of the lower substrate 101 may be a side extending in the second direction DR2. The short side of the lower substrate 101 may be a side extending in the first direction DR1. The lower substrate 101 may be formed to be recessed inwardly in one direction toward one side of the upper substrate 130. For example, the lower substrate 101 may be formed to be retracted inwardly from one lower end of the lower substrate 101 toward one lower end of the upper substrate 130 in the second direction DR2.

[0077] The upper substrate 130 may be substantially the same as the planar shape of the lower substrate 101. That is, the upper substrate 130 may be a rectangular shape whose corners have right angles on the plane. The upper substrate 130 may have a long side and a short side on the plane. The long side of the upper substrate 130 may be a side extending in the second direction DR2. The short side of the upper substrate 130 may be a side extending in the first direction DR1. The upper substrate 130 may be arranged to extend further in one direction from one side of the lower substrate 101. For example, one side or one end of the upper substrate 130 may protrude and extend further than one side of the lower substrate 101 in the second direction DR2. The display pad area D_PA to be described later may be positioned in the extended area of ​​the lower substrate 101.

[0078] The side surface of the lower substrate 101 and the side surface of the upper substrate 130 may be aligned in the thickness direction except for a region where the lower substrate 101 protrudes further than the upper substrate 130. However, the present invention is not limited thereto, and the side surface of the lower substrate 101 and the side surface of the upper substrate 130 may not be aligned in the thickness direction including the protruding region, and may be formed such that the side surface of the lower substrate 101 protrudes further.

[0079] The planar profile of the display panel 100 may be determined according to the planar profile of the lower substrate 101 and the planar profile of the upper substrate 130. In an exemplary embodiment, the display panel 100 may be the same planar size as the lower substrate 101, and may have a rectangular shape according to the planar shape of the lower substrate 101. The display panel 100 may be formed to include a region where the upper substrate 130 and the lower substrate 101 overlap in a plane and a region where the lower substrate 101 protrudes further than the upper substrate 130, that is, a region where the lower substrate 101 extends further than the upper substrate 130 in the second direction DR2.

[0080] The lower substrate 101 may include a display area DA and a non-display area NA disposed around the display area DA. The non-display area NA of the lower substrate 101 may include a sealing area SA and a display pad area D_PA.

[0081] The display area DA may have a rectangular shape whose corners have right angles on a plane or a rectangular shape with rounded corners. The display area DA may have a short side and a long side. The short side of the display area DA may be a side extending in the first direction DR1. The long side of the display area DA may be a side extending in the second direction DR2. However, the planar shape of the display area DA is not limited to a rectangular shape, and may be a circular shape, an elliptical shape, or other various shapes.

[0082] The non-display area NA may be disposed around the display area DA. The non-display area NA may be disposed adjacent to two short sides and two long sides of the display area DA. In this case, the non-display area NA may surround all sides of the display area DA to form an edge of the display area DA. However, the present invention is not limited thereto, and the non-display area NA may be disposed adjacent to only two short sides or two long sides of the display area DA.

[0083] The sealing area SA may be disposed in an area where the upper substrate 130 and the lower substrate 101 overlap in the thickness direction. The sealing area SA may be located along an edge portion or edge area of ​​the upper substrate 130. The sealing area SA may have a rectangular frame shape continuously disposed along the edge area of ​​the upper substrate 130.

[0084] The sealing area SA may include first to fourth sealing areas SA1 to SA4. The first sealing area SA1 may be disposed adjacent to the upper short side of the display panel 100. That is, the first sealing area SA1 may be disposed adjacent to the upper short sides or upper ends of the upper substrate 130 and the lower substrate 101.

[0085] The second sealing area SA2 may be disposed adjacent to the lower short side of the display panel 100. That is, the second sealing area SA2 may be disposed adjacent to the lower short sides or lower ends of the upper substrate 130 and the lower substrate 101.

[0086] The third sealing area SA3 may be disposed adjacent to the left long side of the display panel 100. That is, the third sealing area SA3 may be disposed adjacent to the left long sides or left ends of the upper substrate 130 and the lower substrate 101.

[0087] The fourth sealing area SA4 may be disposed adjacent to the right long side of the display panel 100. That is, the fourth sealing area SA4 may be disposed adjacent to the right long sides of the upper substrate 130 and the lower substrate 101.

[0088] The sealing areas SA1 to SA4 may be areas where frit is interposed between the lower substrate 101 and the upper substrate 130 to bond the upper substrate 130 and the lower substrate 101. This will be described later.

[0089] As described above, the display pad area D_PA may be positioned on an area of ​​the lower substrate 101 further protruding than the upper substrate 130. That is, the display pad area D_PA is an area not overlapping the upper substrate 130 and may be disposed adjacent to a lower short side or lower end of the lower substrate 101.

[0090] The upper substrate 130 may include a sensing area TA and a non-display area NA disposed around the sensing area TA.

[0091] As described later, the sensing area TA of the upper substrate 130 may be a plurality of touch electrodes 151, 161, 162, and 163 (see FIG. 1 ) in which the upper substrate 130 is disposed. Figure 3 ). The sensing area TA may have substantially the same shape as the display area DA in a plane. That is, the sensing area TA has a rectangular shape having long sides and short sides, and may substantially overlap the display area DA in a thickness direction. However, the present invention is not limited thereto, and the sensing area TA may have a smaller size than the display area DA of the display panel 100 in a plane, and may partially overlap the display area DA.

[0092] The non-display area NA of the upper substrate 130 may include a sealing area SA and a touch pad area T_PA.

[0093] The sealing area SA of the upper substrate 130 refers to the same area as the sealing area SA of the lower substrate 101. That is, the sealing area SA may be provided in an area where the upper substrate 130 and the lower substrate 101 overlap in the thickness direction. The sealing area SA may be located along an edge portion or edge area of ​​the upper substrate 130. The sealing area SA may have a rectangular frame shape continuously provided along the edge area of ​​the upper substrate 130.

[0094] The touch pad area T_PA may be disposed between the sensing area TA and the second sealing area SA2 of the upper substrate 130. The touch pad area T_PA may not overlap with the second sealing area SA2 of the display panel 100 in the thickness direction. As described later, a plurality of touch signal pad terminals T_PE may be disposed in the touch pad area T_PA. The touch signal pad terminal T_PE may not overlap with the second sealing area SA2. Therefore, the sealing failure between the upper substrate 130 and the lower substrate 101 may be improved. This will be described later.

[0095] As the display panel 100, for example, an organic light emitting display panel may be applied. In the following exemplary embodiments, an organic light emitting display panel is shown as the display panel 100, but the present invention is not limited thereto, and other types of display panels such as a liquid crystal display (LCD), a quantum dot organic light emitting display panel (QD-OLED), a quantum dot liquid crystal display (QD-LCD), a quantum nano light emitting display panel (QNED), and a micro LED may be applied.

[0096] like Figure 1 As shown in FIG. 1 , the display printed circuit board 400 may be disposed on the display pad area D_PA of the display panel 100. The display printed circuit board 400 may be attached to the display pad area D_PA. One end of the display printed circuit board 400 may be attached to the display pad area D_PA.

[0097] The display printed circuit board 400 may include a first base substrate 410 , a plurality of display signal lead terminals D_LE, and a data driving chip D_IC.

[0098] The first base substrate 410 may be a flexible substrate. In an exemplary embodiment, the first base substrate 410 may be made of a flexible material such as polyimide.

[0099] A plurality of display signal lead terminals D_LE may be directly connected to the display signal pad terminal D_PE of the display pad area D_PA. As described later, the display signal lead terminal D_LE may be ultrasonically bonded to the display signal pad terminal D_PE. A plurality of display signal lead terminals D_LE may be directly connected to the display signal pad terminal D_PE without any configuration or layer between the plurality of display signal lead terminals D_LE and the display signal pad terminal D_PE. The display signal pad terminal D_PE may be electrically connected to the display printed circuit board 400 by being connected to the display signal lead terminal D_LE. The ultrasonic bonding of the display signal pad terminal D_PE and the display signal lead terminal D_LE will be described in the ultrasonic bonding between the display signal pad terminal D_PE and the display signal lead terminal D_LE.

[0100] The display signal lead terminal D_LE can be electrically connected to the data driver chip D_IC through a signal line. In the accompanying drawings, a case is shown in which the data driver integrated circuit is used as a driver chip and is connected to the display panel 100 through a flexible printed circuit board. However, the present invention is not limited to this, and the data driver integrated circuit can be implemented as a driver chip and can be used as a glass chip (COG) directly mounted on the rigid display panel 100. In addition, when the display panel 100 is flexible, the data driver integrated circuit can be used as a plastic chip (COP) directly mounted on the flexible display panel 100. Hereinafter, the case in which the data driver integrated circuit is implemented as a data driver chip D_IC and used as a thin film chip (COF) will be mainly described.

[0101] Similarly, the touch printed circuit board 500 may be disposed on the touch pad area T_PA of the display panel 100. The touch printed circuit board 500 may be attached to the touch pad area T_PA. One end of the touch printed circuit board 500 may be attached to the touch pad area T_PA.

[0102] The touch printed circuit board 500 may partially overlap the display printed circuit board 400 in the thickness direction on one surface of the display panel 100. The touch printed circuit board 500 may overlap the display pad area D_PA and the second sealing area SA2 in the thickness direction and may cover the touch printed circuit board 500 from above.

[0103] The touch printed circuit board 500 may include a second base substrate 510 and a plurality of touch signal lead terminals T_LE disposed on the second base substrate 510 .

[0104] The second base substrate 510 may be a flexible substrate. In one exemplary embodiment, the second base substrate 510 may be made of a flexible material such as polyimide.

[0105] A plurality of touch signal lead terminals T_LE may be directly connected to the touch signal pad terminal T_PE of the touch pad area T_PA. As described later, the touch signal lead terminal T_LE may be ultrasonically bonded to the touch signal pad terminal T_PE. A plurality of touch signal lead terminals T_LE may be directly connected to the touch signal pad terminal T_PE without any configuration or layer between the plurality of touch signal lead terminals T_LE and the touch signal pad terminal T_PE. The touch signal pad terminal T_PE may be electrically connected to the touch printed circuit board 500 by being connected to the touch signal lead terminal T_LE. The ultrasonic bonding of the touch signal pad terminal T_PE and the touch signal lead terminal T_LE will be described later.

[0106] The other end of the display printed circuit board 400 and the other end of the touch printed circuit board 500 may be attached to the main circuit board 600. The display printed circuit board 400 may be bent to surround one side surface located outside one side surface of the lower substrate 101, and may be disposed on the lower surface of the lower substrate 101. The touch printed circuit board 500 may be bent to surround one side surface of the upper substrate 130, the display printed circuit board 400, and one side surface of the lower substrate 101, and may be disposed on the lower surface of the lower substrate 101. The main circuit board 600 may be attached to the lower surface of the panel lower sheet 200 to be described later.

[0107] The panel lower sheet 200 may be disposed below the display panel 100. The panel lower sheet 200 may include at least one functional layer. The functional layer may be a layer that performs a heat dissipation function, an electromagnetic wave shielding function, a grounding function, a buffering function, a strength reinforcement function, a support function and / or a digital function. The functional layer may be a sheet layer made of a sheet, a film layer made of a film, a film layer, a coating, a panel or a board, etc. A functional layer may be composed of a single layer, but may also be composed of a plurality of stacked films or coatings. The functional layer may be, for example, a supporting substrate, a heat dissipation layer, an electromagnetic wave shielding layer, a shock absorbing layer or a digital converter, etc. The above-mentioned main circuit board 600 may be attached to the lower surface of the panel lower sheet 200 to be described later.

[0108] The window 300 is provided on the display panel 100. The window 300 is provided on the display panel 100 to protect the display panel 100 while transmitting light emitted from the display panel 100. The window 300 may be made of glass or the like.

[0109] The window 300 may be arranged to overlap the display panel 100 on a plane and cover the entire surface of the display panel 100. The window 300 may be larger than the display panel 100. For example, on the two short sides of the display device 1, the window 300 may protrude outward from the display panel 100. Even on the two long sides of the display device 1, the window 300 may protrude from the display panel 100, but in the case of the two short sides, the protruding distance may be greater. In addition, the window 300 may be further extended outward from the display printed circuit board 400 and the touch printed circuit board 500 attached to the display panel 100 while being bent to cover the display printed circuit board 400 and the touch printed circuit board 500.

[0110] As described above, the display panel 100 may include the lower substrate 101 and the upper substrate 130 , and may include the circuit driving layer 110 , the organic light emitting element layer 120 , the touch electrode layer 140 , and the polarization layer POL.

[0111] The lower substrate 101 and the upper substrate 130 may be rigid substrates. The upper substrate 130 may be made of a material such as glass or quartz. Figure 2 As shown in FIG. 1 , the upper substrate 130 may mostly overlap the lower substrate 101 except for the display pad area D_PA. That is, the upper substrate 130 may be disposed from the first sealing area SA1 to the second sealing area SA2.

[0112] The upper substrate 130 may be bonded or sealed with the lower substrate 101 in the first sealing area SA1 and the second sealing area SA2. The bonding or sealing of the upper substrate 130 and the lower substrate 101 may be performed by a unit seal CS. The lower surface of the upper substrate 130 and the upper surface of the lower substrate 101 in the corresponding area may be bonded or sealed to each other by the unit seal CS. The bonding of the upper substrate 130 and the lower substrate 101 may be performed by a laser sealing process. The unit seal CS may bond the upper substrate 130 and the lower substrate 101 to each other while melting a material such as glass frit and solidifying it again.

[0113] In detail, the glass frit may be interposed between the lower substrate 101 and the upper substrate 130 in the sealing area SA of the display panel 100. Thereafter, when the laser sealing device 800 (see Fig. 9 ) When laser is irradiated to the sealing area SA, the glass frit of the corresponding area is melted. While the melted glass frit is solidified, the lower substrate 101 and the upper substrate 130 can be bonded or sealed.

[0114] In the drawings, glass frit is interposed between the lower substrate 101 and the upper substrate 130 to perform a sealing process, but the present invention is not limited thereto, and the lower substrate 101 and the upper substrate 130 may be directly coupled or bonded without any configuration or layer between the lower substrate 101 and the upper substrate 130. That is, when the laser sealing device 800 irradiates the laser to the sealing area SA between the lower substrate 101 and the upper substrate 130, the lower substrate 101 and the upper substrate 130 of the corresponding area may be bonded while the interface between the lower substrate 101 and the upper substrate 130 is melted and solidified. In this case, the laser may be a femtosecond (fs) laser, but the present invention is not limited thereto.

[0115] In the display area DA and the touch pad area T_PA, the upper substrate 130 may have a shape that is recessed upward between the first sealing area SA1 and the second sealing area SA2. That is, the lower surface of the upper substrate 130 in the display area DA and the touch pad area T_PA may be recessed upward compared to the lower surface of the upper substrate 130 in the first sealing area SA1 and the second sealing area SA2. In the display area DA and the touch pad area T_PA, the upper substrate 130 and the lower substrate 101 may be spaced apart from each other. That is, the upper substrate 130 and the lower substrate 101 may have a separated space in the display area DA and the touch pad area T_PA. The circuit driving layer 110 and the organic light emitting element layer 120 may be disposed in a separated space.

[0116] The circuit driving layer 110 may be disposed in a space in which the upper substrate 130 and the lower substrate 101 are spaced apart from each other. The circuit driving layer 110 may be disposed on one surface of the lower substrate 101. The circuit driving layer 110 may be disposed in the display area DA. The circuit driving layer 110 may include an element for providing a signal to the organic light emitting element layer 120. The circuit driving layer 110 may include various signal lines, for example, a scan line (not shown), a data line (not shown), a power line (not shown), and a light emitting line (not shown). The circuit driving layer 110 may include a plurality of transistors and capacitors. The transistor may include a switching transistor (not shown) and a driving transistor provided for each pixel (not shown).

[0117] The organic light emitting element layer 120 may be disposed on the circuit driving layer 110. The organic light emitting element layer 120 may be disposed in a space in which the upper substrate 130 and the lower substrate 101 are spaced apart from each other. The organic light emitting element layer 120 may be disposed in the display area DA. The light generated from the organic light emitting element layer 120 may be emitted to the outside through the display surface. For example, the light generated from the organic light emitting element layer 120 may be emitted in an upward direction (e.g., a third direction DR3).

[0118] The plurality of display signal pad terminals D_PE may be disposed on the display pad area D_PA of the lower substrate 101. The plurality of display signal pad terminals D_PE may be disposed outside the second sealing area SA2 in the second direction DR2. The plurality of display signal pad terminals D_PE may not overlap the second sealing area SA2.

[0119] The touch electrode layer 140 and the polarization layer POL may be disposed on the upper substrate 130. The touch electrode layer 140 may be disposed on the display area DA of the upper substrate 130. As described above, since the sensing area TA mostly overlaps with the display area DA, it can be interpreted that the touch electrode layer 140 is disposed on the sensing area TA of the upper substrate 130. The touch electrode layer 140 may include a plurality of touch electrodes and a plurality of insulating layers. This will be described later.

[0120] The polarization layer POL may be disposed on the touch electrode layer 140. The polarization layer POL may be a polarization film. The polarization layer POL may be coupled to the touch electrode layer 140 through a bonding layer. The polarization layer POL may be disposed in the display area DA or the sensing area TA. The polarization layer POL may have a function of selectively transmitting and / or absorbing light from outside the display device 1 to prevent reflection of external light. In an exemplary embodiment, the polarization layer POL may be an absorptive polarization film. The polarization layer POL may include a flexible material such as polyvinyl alcohol (PVA).

[0121] However, the present invention is not limited thereto, and the polarizing film 230 may be a reflective polarizing film having a function of selectively transmitting and / or reflecting a polarization component of external light.

[0122] The above-mentioned touch signal pad terminal T_PE can be set in the touch pad area T_PA of the upper substrate 130. The touch signal pad terminal T_PE can be set in the touch pad area T_PA. The touch signal pad terminal T_PE may not overlap with the second sealing area SA2 in the thickness direction. As described above, the touch printed circuit board 500 can be attached to the touch pad area T_PA. The touch signal pad terminal T_PE can be connected to the touch signal lead terminal T_LE of the touch printed circuit board 500.

[0123] In an exemplary embodiment, the touch signal pad terminal T_PE may include an opaque metal. Therefore, when the touch signal pad terminal T_PE is formed by including an opaque metal on the upper substrate 130 and then performing a laser sealing process of the upper substrate 130 and the lower substrate 101, the laser sealing may not be performed smoothly due to the touch signal pad terminal T_PE containing the opaque metal. For example, for the laser sealing process, the laser irradiated to the sealing area SA is partially reflected by the touch signal pad terminal T_PE including the opaque metal, and therefore a sufficient amount may not be reached in the sealing area SA positioned below the touch signal pad terminal T_PE. Therefore, a bonding failure between the upper substrate 130 and the lower substrate 101 may occur. However, as shown in the exemplary embodiment, when the touch signal pad terminal T_PE is set not to overlap with the sealing area SA, even when the laser sealing process is performed after the process of setting the touch signal pad terminal T_PE is performed, the bonding failure between the upper substrate 130 and the lower substrate 101 can be improved.

[0124] Hereinafter, the touch electrode layer 140 disposed on the upper substrate 130 will be described.

[0125] Figure 3 is a plan layout diagram of an upper substrate according to an exemplary embodiment, and Figure 4 is a cross-sectional view of a touch member of a sensing area according to an exemplary embodiment.

[0126] Reference Figure 3 and Figure 4 , the upper substrate 130 includes the above-mentioned sensing area TA and the touch pad area T_PA.

[0127] In the sensing area TA of the upper substrate 130 , the touch electrode layer 140 includes a first wiring layer 150 , a first insulating layer 171 disposed on the first wiring layer 150 , a second wiring layer 160 disposed on the first insulating layer 171 , and a second insulating layer 172 disposed on the second wiring layer 160 .

[0128] The first wiring layer 150 is disposed on one surface of the upper substrate 130. The first wiring layer 150 includes a first connection electrode 151. The first connection electrode 151 of the first wiring layer 150 is disposed under a second wiring layer 160 to be described later, and electrically connects first touch electrodes 161 adjacent to each other.

[0129] The first wiring layer 150 may include a touch drive wiring 152 and a first pad electrode 153 (see Figure 6 ). The touch drive wiring 152 is connected to the first touch electrode 161 to extend toward the touch pad area T_PA and forms a first pad electrode 153 in the touch pad area T_PA. Figure 6 As shown in FIG. 1 , the first pad electrode 153 may have a shape that is slightly extended more than the touch driving wiring 152 , but the present invention is not limited thereto.

[0130] The first wiring layer 150 may be made of a conductive material. For example, the first wiring layer 150 may include: a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO); an opaque conductive metal such as aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), copper (Cu), molybdenum (Mo), Ti / Al / Ti, Mo / Al / Mo, Mo / AlGe / Mo, Ti / Cu, or MoNb; a conductive polymer such as PEDOT; a metal nanowire; a carbon nanotube; or graphene, etc. In an exemplary embodiment, the first wiring layer 150 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), copper (Cu), molybdenum (Mo), Ti / Al / Ti, Mo / Al / Mo, Mo / AlGe / Mo, Ti / Cu or MoNb, etc.

[0131] The first wiring layer 150 may include a touch drive wiring 152 and a first pad electrode 153. The touch drive wiring 152 is connected to the first touch electrode 161 to extend toward the touch pad area T_PA, and forms the first pad electrode 153 in the touch pad area T_PA. Figure 6 As shown in FIG. 1 , the first pad electrode 153 may have a shape that is slightly extended more than the touch driving wiring 152 , but the present invention is not limited thereto.

[0132] The first insulating layer 171 is disposed on the first wiring layer 150. The first insulating layer 171 covers and protects the first wiring layer 150. The first insulating layer 171 may be disposed over the entire surface of the upper substrate 130. The first insulating layer 171 may include a contact hole CH exposing the first connection electrode 151. The first touch electrode 161 to be described later may be electrically connected to the first connection electrode 151 exposed through the contact hole CH. The first insulating layer 171 may include a first sub-insulating layer 171a (see Figure 6 ) and the second sub-insulating layer 171b disposed in the touch pad area T_PA (see Figure 6 ).

[0133] The second wiring layer 160 is disposed on one surface of the first insulating layer 171. The second wiring layer 160 includes a plurality of first touch electrodes 161, a plurality of second touch electrodes 162, and a plurality of second connection electrodes 163. The first touch electrodes 161 and the second touch electrodes 162 may acquire position information of a point touched by a self-capacitance method and / or a mutual capacitance method.

[0134] The first touch electrode 161 and the second touch electrode 162 may be arranged in a matrix shape. The first touch electrode 161 and the second touch electrode 162 may have a rhombus shape, but the present invention is not limited thereto. The first touch electrode 161 may be electrically connected along the row direction (short side direction), and the second touch electrode 162 may be electrically connected along the column direction (long side direction). However, the present invention is not limited thereto, and the first touch electrode 161 may be electrically connected along the column direction, and the second touch electrode 162 may be electrically connected along the row direction. The first touch electrode 161 and the second touch electrode 162 are insulated from each other to be separated from each other.

[0135] The second wiring layer 160 includes a second connection electrode 163 connecting the second touch electrode 162. The second touch electrodes 162 adjacent in the column direction are physically connected by the second connection electrode 163. The width of the second connection electrode 163 may be smaller than the width of each of the second touch electrodes 162. The second wiring layer 160 may be physically connected to the contact hole CH. When the contact hole CH is formed of the material of the second wiring layer 160, the boundary between the contact hole CH and the first touch electrode 161 cannot be observed. However, the contact hole CH may be formed of the material of the first wiring layer 150, or may be formed of a material different from the first wiring layer 150 and the second wiring layer 160. In this case, the boundary of the contact hole CH with the first connection electrode 151 and the first touch electrode 161 can be observed.

[0136] The first touch electrodes 161 adjacent in the row direction in the second wiring layer 160 are physically separated. The second connection electrodes 163 of the second wiring layer 160 electrically connect the adjacent second touch electrodes 162. The width of the second connection electrodes 163 of the second wiring layer 160 may be smaller than the width of each of the second touch electrodes 162.

[0137] The second wiring layer 160 may include the exemplary materials described above for the first wiring layer 150. In exemplary embodiments, the second wiring layer 160 may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO).

[0138] The second insulating layer 172 is disposed on the second wiring layer 160. The second insulating layer 172 covers and protects the second wiring layer 160. The second insulating layer 172 may be disposed over the entire surface of the upper substrate 130.

[0139] Each of the first insulating layer 171 and the second insulating layer 172 may have a single layer structure or a multilayer structure. In addition, each of the first insulating layer 171 and the second insulating layer 172 may include an inorganic material, an organic material, or a composite material. In an exemplary embodiment, at least one of the first insulating layer 171 and the second insulating layer 172 may include an inorganic film. The inorganic film may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0140] In another exemplary embodiment, at least one of the first insulating layer 171 and the second insulating layer 172 may include an organic film. The organic film may include at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, polyurethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin, and perylene resin.

[0141] like Figure 6 As shown in , the first pad electrode 153 may form a touch signal pad terminal T_PE in the touch pad area T_PA. In an exemplary embodiment, the first pad electrode 153 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), copper (Cu), molybdenum (Mo), Ti / Al / Ti, Mo / Al / Mo, Mo / AlGe / Mo, Ti / Cu or MoNb. The above metals may be metals with relatively low resistance compared to the materials included in the second wiring layer 160.

[0142] Figure 5 is a cross-sectional view of a touch member of a sensing area according to a modified example. Figure 5 It is shown that the first insulating layer 171_1 in the touch electrode layer 140_1 may not extend to the outside of the second wiring layer 160 disposed on the first insulating layer 171_1 , and the second wiring layer 160 may extend to the outside of the first insulating layer 171_1 .

[0143] Hereinafter, the touch signal pad terminal T_PE will be described in detail.

[0144] Figure 6 is a plan layout diagram of a touch signal pad terminal according to an exemplary embodiment, Figure 7 is a cross-sectional view taken along line X1-X1', and Figure 8It is a cross-sectional view taken along line X2-X2' and line X3-X3'.

[0145] Reference Figures 6 to 8 , the touch signal pad terminal T_PE may include a first pad electrode 153, a second sub-insulating layer 171b, and a second pad electrode 180. The first pad electrode 153 may be physically connected to the touch drive wiring 152 and electrically connected to the touch drive wiring 152. The first pad electrode 153 may have a rectangular shape with a long side edge and a short side edge. The second sub-insulating layer 171b may be disposed on the first pad electrode 153 and may have the same shape as the first pad electrode 153 on a plane. The plane area of ​​the second sub-insulating layer 171b may be greater than the plane area of ​​the first pad electrode 153. The second sub-insulating layer 171b may be formed to extend to the outside of the first pad electrode 153. The second sub-insulating layer 171b may have a long side edge and a short side edge. Like the long side edge and the short side edge of the first pad electrode 153, the long side edge and the short side edge of the second sub-insulating layer 171b may extend in the second direction DR2 and the first direction DR1, respectively. The long side edge and the short side edge of the second sub-insulating layer 171 b may be larger than the long side edge and the short side edge of the first pad electrode 153 , respectively.

[0146] The first sub-insulating layer 171a may be disposed outside the second sub-insulating layer 171b. The first sub-insulating layer 171a may surround the long side edge and the short side edge of the second sub-insulating layer 171b.

[0147] The second sub-insulating layer 171 b may have a via hole VIA. The via hole VIA may be formed on a surface of the second sub-insulating layer 171 b in a thickness direction to expose an upper surface of the first pad electrode 153 .

[0148] The via holes VIA may extend in the first direction DR1 and may be separated to be spaced apart in the second direction DR2. Figure 6 , fifteen via holes VIA have been shown, but the number is not limited. The present invention is not limited thereto, and the via holes VIA may extend in the second direction DR2 and may be separated to be spaced apart in the first direction DR1.

[0149] The via VIA may have a long side and a short side on a plane. The via VIA may have a long side in a first direction DR1 and a short side in a second direction DR2. However, the present invention is not limited thereto, and the long side of the via VIA may extend in the second direction DR2, and the short side may extend in the first direction DR1. The via VIA may be disposed inside the first pad electrode 153 on a plane. The first pad electrode 153 may surround the insulating pattern.

[0150] The insulating pattern of the second sub-insulating layer 171b may be formed between adjacent via holes VIA. The insulating pattern may be disposed on the first pad electrode 153, and further, the insulating pattern may be disposed to extend outside the first pad electrode 153. The insulating pattern may have a shape surrounding the via hole VIA on the first pad electrode 153, and may have a shape surrounding the first pad electrode 153 on a plane located outside the first pad electrode 153, and may form an edge of the first pad electrode 153.

[0151] The second pad electrode 180 may be disposed on the first pad electrode 153 and the second sub-insulating layer 171b. The second pad electrode 180 may protrude to the outside of the first pad electrode 153 and extend. The second pad electrode 180 may cover the second sub-insulating layer 171b. All side surfaces of the second pad electrode 180 may be aligned while overlapping each side surface of the second sub-insulating layer 171b in the thickness direction. In addition, the first sub-insulating layer 171a on the plane may be disposed outside the second pad electrode 180 to surround all sides of the second pad electrode 180 from the outside. That is, the first sub-insulating layer 171a may form the edge of the second pad electrode 180. The second pad electrode 180 may cover the upper surface and side surfaces of a plurality of insulating patterns of the second sub-insulating layer 171b. The second pad electrode 180 may be disposed on the via VIA disposed between the insulating patterns to cover the exposed first pad electrode 153. The second pad electrode 180 may be electrically connected to the first pad electrode 153 through the via VIA.

[0152] The second pad electrode 180 may partially conformally reflect the lower step formed by the second sub-insulating layer 171b. That is, the second pad electrode 180 has a convex portion and a concave portion, the convex portion having a surface protruding in a region where an insulating pattern is provided, and the concave portion having a surface recessed in a region where an insulating pattern is not provided (i.e., in a region where a via hole VIA is formed). That is, the second sub-insulating layer 171b having a predetermined step below the second sub-insulating layer 171b is provided so that the second pad electrode 180 may have a concave-convex shape on the surface.

[0153] The second pad electrode 180 may be selected from the exemplary materials of the first pad electrode 153. That is, in an exemplary embodiment, the second pad electrode 180 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), copper (Cu), molybdenum (Mo), Ti / Al / Ti, Mo / Al / Mo, Mo / AlGe / Mo, Ti / Cu, or MoNb. These materials may be ultrasonically bonded to the substrate disposed on the touch printed circuit board 500 (see Figure 2 ) on the touch signal lead terminal T_LE (see Figure 2 ). This will be described in detail.

[0154] Refer again Figure 2 , the ultrasonic device may vibrate the touch signal lead terminal T_LE in the vibration direction while vibrating in a predetermined vibration direction. However, in this case, the touch signal pad terminal T_PE may vibrate slightly in the vibration direction due to the vibration transmitted through the touch signal lead terminal T_LE, but the vibration amplitude of the touch signal pad terminal T_PE may be negligible. In an exemplary embodiment, the vibration direction may be the second direction DR2. That is, the vibration direction may be the direction in which the long sides of the touch signal lead terminal T_LE and the touch signal pad terminal T_PE extend.

[0155] When the touch signal lead terminal T_LE ultrasonically vibrates on one surface of the touch signal pad terminal T_PE, a predetermined friction force is generated at the interface between one surface of the touch signal lead terminal T_LE and one surface of the touch signal pad terminal T_PE, and friction heat may be generated by the friction force. When the friction heat is sufficient to melt the material forming the touch signal lead terminal T_LE and the touch signal pad terminal T_PE, the first melting region T_LEb of the touch signal lead terminal T_LE adjacent to the touch signal pad terminal T_PE and the second melting region T_PEb of the touch signal pad terminal T_PE adjacent to the touch signal lead terminal T_LE may be melted. That is, the touch signal lead terminal T_LE may include a first non-melting region T_LEa and a first melting region T_LEb. In addition, the touch signal pad terminal T_PE may include a second non-melting region T_PEa and a second melting region T_PEb.

[0156] The first non-melting region T_LEa may be a region including only the material included in the touch signal lead terminal T_LE. The first melting region T_LEb may be a region including the material of the touch signal lead terminal T_LE and the material included in the touch signal pad terminal T_PE.

[0157] The second non-melting region T_PEa may be a region including only the material included in the touch signal pad terminal T_PE. The second melting region T_PEb may be a region including the material of the touch signal pad terminal T_PE and the material included in the touch signal lead terminal T_LE.

[0158] The first melting region T_LEb is a region where the material contained in the touch signal pad terminal T_PE diffuses to mix with the material of the touch signal lead terminal T_LE and the material of the touch signal pad terminal T_PE, and the second melting region T_PEb may be a region where the material contained in the touch signal lead terminal T_LE diffuses to mix with the material of the touch signal lead terminal T_LE and the material of the touch signal pad terminal T_PE. For example, when the touch signal pad terminal T_PE contains silver (Ag), gold (Au) or copper (Cu) and the touch signal lead terminal T_LE contains Ti / Al / Ti, the first melting region T_LEb and the second melting region T_PEb may be a region where Ti and / or Al of the touch signal lead terminal T_LE mix with silver (Ag), gold (Au) or copper (Cu) of the touch signal pad terminal T_PE.

[0159] In the first and second melting regions T_LEb and T_PEb, the touch signal lead terminals T_LE and the touch signal pad terminals T_PE may be coupled while undergoing solidification.

[0160] An interface between the touch signal lead terminal T_LE and the touch signal pad terminal T_PE (ie, an interface between the first melting region T_LEb and the second melting region T_PEb) may have a non-flat shape.

[0161] As described above, the touch signal pad terminal T_PE may include the second pad electrode 180. The second pad electrode 180 may be opaque.

[0162] Fig. 9 is a perspective view showing a process of sealing an upper substrate and a lower substrate according to an exemplary embodiment. Fig. 9 The display device 1 according to the exemplary embodiment is described (see Figure 2 ) effect.

[0163] As described above, the bonding of the upper substrate 130 and the lower substrate 101 may be performed by a laser sealing process. The cell seal CS may bond the upper substrate 130 and the lower substrate 101 to each other while melting a material such as glass frit and solidifying it again. The laser sealing process may be performed by a laser sealing device 800. The laser sealing device 800 may be moved in one direction and may irradiate a sealing area SA between the upper substrate 130 and the lower substrate 101 to bond the upper substrate 130 and the lower substrate 101.

[0164] In addition, the second pad electrode 180 of the touch signal pad terminal T_PE (see Figure 6 and Figure 7 ) may include a terminal for connecting to the touch signal lead T_LE (see Figure 2 ) Opaque metal materials such as aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), copper (Cu), molybdenum (Mo), Ti / Al / Ti, Mo / Al / Mo, Mo / AlGe / Mo, Ti / Cu or MoNb for ultrasonic bonding.

[0165] However, when an opaque metal material is included as the second pad electrode 180 of the touch signal pad terminal T_PE, the laser irradiated from the laser sealing device 800 to the sealing area SA (e.g., the second sealing area SA2) does not pass through the touch signal pad terminal T_PE and is partially reflected or absorbed by the second pad electrode 180 on the upper surface, and thus only a small part of the laser can reach the sealing area SA.

[0166] In this case, the frit in the sealing area SA interposed between the upper substrate 130 and the lower substrate 101 is not melted enough to couple the upper substrate 130 and the lower substrate 101 , and thus, the bonding characteristics of the upper substrate 130 and the lower substrate 101 may be significantly reduced.

[0167] However, in the display device 1 according to the exemplary embodiment (see Figure 2 ), the touch pad area T_PA may not overlap with the sealing area SA of the display panel 100 in the thickness direction. That is, the plurality of touch signal pad terminals T_PE may not overlap with the sealing area SA. Therefore, the laser irradiated to the sealing area SA may directly pass through the upper substrate 130 without being partially reflected or absorbed by the touch signal pad terminals T_PE. As a result, the glass material disposed in the sealing area SA can be fully melted. Therefore, even without increasing the intensity or irradiation time of the laser as the sealing light, the upper substrate 130 and the lower substrate 101 can be fully bonded.

[0168] Hereinafter, another example will be described. The same configuration as that of the embodiment already described in the following exemplary embodiment is denoted by the same reference numerals, and the description is omitted or simplified.

[0169] Fig.10 is a plan layout diagram of a touch signal pad terminal according to another exemplary embodiment, Fig.11 is a cross-sectional view taken along line X4-X4', and Fig.12 It is a cross-sectional view taken along line X5-X5' and line X6-X6'.

[0170] Reference Figures 10 to 12 According to an exemplary embodiment, the touch signal pad terminal T_PE_1 is connected to the touch signal pad terminal T_PE_1 according to Figures 6 to 8 The touch signal pad terminal T_PE is different from that of FIG. 1 in that it further includes a third pad electrode 164 and a fourth sub-insulating layer 172 b.

[0171] In more detail, the touch signal pad terminal T_PE_1 may include a first pad electrode 153, a second sub-insulating layer 171b disposed on the first pad electrode 153, a third pad electrode 164 disposed on the second sub-insulating layer 171b, a fourth sub-insulating layer 172b disposed on the third pad electrode 164, and a second pad electrode 180 disposed on the fourth sub-insulating layer 172b.

[0172] The third pad electrode 164 may be disposed on one surface of the second sub-insulating layer 171b and may at least partially conformally reflect the lower step formed by the plurality of insulating patterns of the second sub-insulating layer 171b. Thus, the third pad electrode 164 may have a surface concave-convex shape. The third pad electrode 164 may be electrically connected to the first pad electrode 153 through the first via hole VIA1 of the second sub-insulating layer 171b.

[0173] The third pad electrode 164 may be disposed in the second wiring layer 160 (see FIG. Figure 3 ). The third pad electrode 164 may be made of a material included in the second wiring layer 160. For example, the third pad electrode 164 may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO).

[0174] The third pad electrode 164 may be larger than the first pad electrode 153 and smaller than the second pad electrode 180 in a plane. The third pad electrode 164 may be disposed to extend outward from at least one side surface of the first pad electrode 153. The third pad electrode 164 may extend outward from all side surfaces of the first pad electrode 153. The second pad electrode 180 may be disposed to extend outward from at least one side surface of the third pad electrode 164. The second pad electrode 180 may extend outward from all side surfaces of the third pad electrode 164.

[0175] The fourth sub-insulating layer 172b may be disposed on one surface of the third pad electrode 164. The fourth sub-insulating layer 172b may have a second via hole VIA2 disposed between a plurality of insulating patterns and adjacent insulating patterns. The fourth sub-insulating layer 172b may be disposed on the same layer as the second insulating layer 172 of the sensing area TA. That is, the second insulating layer 172 may include a third sub-insulating layer 172a and a fourth sub-insulating layer 172b.

[0176] The second pad electrode 180 may be electrically connected to the third pad electrode 164 through a plurality of second via holes VIA2 of the fourth sub-insulating layer 172b. The second pad electrode 180 may have a concavo-convex shape on a surface by at least partially conformally reflecting a step formed by the fourth sub-insulating layer 172b.

[0177] Even in the case of an exemplary embodiment, when an opaque metal material is included as the second pad electrode 180 of the touch signal pad terminal T_PE_1, the laser irradiated from the laser sealing device 800 to the sealing area SA (e.g., the second sealing area SA2) does not pass through the touch signal pad terminal T_PE_1 and is partially reflected or absorbed by the second pad electrode 180 on the upper surface, and thus only a small part of the laser can reach the sealing area SA.

[0178] In this case, the frit in the sealing area SA interposed between the upper substrate 130 and the lower substrate 101 is not melted enough to couple the upper substrate 130 and the lower substrate 101 , and thus, the bonding characteristics of the upper substrate 130 and the lower substrate 101 may be significantly reduced.

[0179] However, the touch pad area T_PA according to the exemplary embodiment may not overlap with the sealing area SA of the display panel 100 in the thickness direction. That is, the plurality of touch signal pad terminals T_PE_1 may not overlap with the sealing area SA. Therefore, the laser irradiated to the sealing area SA may directly pass through the upper substrate 130 without being partially reflected or absorbed by the touch signal pad terminals T_PE_1. As a result, the glass material disposed in the sealing area SA can be fully melted. Therefore, even without increasing the intensity or irradiation time of the laser as the sealing light, the upper substrate 130 and the lower substrate 101 can be fully bonded.

[0180] Fig.13 is a plan layout diagram of a touch signal pad terminal according to yet another exemplary embodiment, Fig.14 is a cross-sectional view taken along line X7-X7', and Fig.15 It is a cross-sectional view taken along the line X8-X8' and the line X9-X9'.

[0181] Reference Figures 13 to 15 According to an exemplary embodiment, the touch signal pad terminal T_PE_2 is connected to the touch signal pad terminal T_PE_2 according to the exemplary embodiment. Figures 10 to 12 The touch signal pad terminal T_PE_1 is different in that the fourth sub-insulating layer 172b is not included.

[0182] In more detail, the touch signal pad terminal T_PE_2 according to an exemplary embodiment may include a first pad electrode 153, a second sub-insulating layer 171b disposed on a surface of the first pad electrode 153, a third pad electrode 164 disposed on a surface of the second sub-insulating layer 171b, and a second pad electrode 180 disposed on a surface of the third pad electrode 164.

[0183] Even in the case of an exemplary embodiment, when an opaque metal material is included as the second pad electrode 180 of the touch signal pad terminal T_PE_2, the laser irradiated from the laser sealing device 800 to the sealing area SA (e.g., the second sealing area SA2) does not pass through the touch signal pad terminal T_PE_2 and is partially reflected or absorbed by the second pad electrode 180 on the upper surface, and thus only a small part of the laser can reach the sealing area SA.

[0184] In this case, the frit in the sealing area SA interposed between the upper substrate 130 and the lower substrate 101 is not melted enough to couple the upper substrate 130 and the lower substrate 101 , and thus, the bonding characteristics of the upper substrate 130 and the lower substrate 101 may be significantly reduced.

[0185] However, the touch pad area T_PA according to the exemplary embodiment may not overlap with the sealing area SA of the display panel 100 in the thickness direction. That is, the plurality of touch signal pad terminals T_PE_2 may not overlap with the sealing area SA. Therefore, the laser irradiated to the sealing area SA may directly pass through the upper substrate 130 without being partially reflected or absorbed by the touch signal pad terminals T_PE_2. As a result, the glass material disposed in the sealing area SA can be fully melted. Therefore, even without increasing the intensity or irradiation time of the laser as the sealing light, the upper substrate 130 and the lower substrate 101 can be fully bonded.

[0186] Fig.16 is a plan layout diagram of an upper substrate according to yet another exemplary embodiment, Fig.17 is a cross-sectional view of a touch member of a sensing area according to still another exemplary embodiment, Fig.18 is a plan layout diagram of a touch signal pad terminal according to yet another exemplary embodiment, Fig.19 is a cross-sectional view taken along line X10-X10', and Fig. 20 It is a cross-sectional view taken along the line X11-X11' and the line X12-X12'.

[0187] Figures 16 to 20 It is shown that various modifications can be made to the wiring layer constituting the touch electrode layer and the touch signal pad terminal.

[0188] Reference Figures 16 to 20The display device 2 according to the exemplary embodiment is different from the display device 1 according to the exemplary embodiment in that a touch electrode layer 140_1 and a touch signal pad terminal T_PE_3 are included.

[0189] In more detail, the touch electrode layer 140_1 according to the exemplary embodiment may include a first wiring layer 150_1 and a second wiring layer 160_1. The second wiring layer 160_1 includes the same configuration and material as the second wiring layer 160 of the touch electrode layer 140 according to the exemplary embodiment, but the arrangement is different. The first wiring layer 150_1 also includes the same configuration and material as the first wiring layer 150 of the touch electrode layer 140 according to the exemplary embodiment, but the arrangement is different. In detail, the second wiring layer 160_1 may include a first touch electrode 161_1, a second touch electrode 162_1, and a second connection electrode 163_1. The first wiring layer 150_1 may include a first connection electrode 151_1, a touch drive wiring 152_1, and a first pad electrode 153_1. The second wiring layer 160_1 may be disposed on one surface of the upper substrate 130.

[0190] The first insulating layer 171 may be disposed on one surface of the second wiring layer 160_1. The first wiring layer 150_1 may be disposed on the first insulating layer 171. The first connection electrode 151_1 of the first wiring layer 150_1 may be electrically connected to the second wiring layer 160_1 through the contact hole CH_1. That is, the first connection electrode 151_1 may be electrically connected to the first touch electrode 161_1 through the contact hole CH_1.

[0191] The touch signal pad terminal T_PE_3 is different from the touch signal pad terminal T_PE according to the exemplary embodiment in that a first pad electrode 153_1 is included.

[0192] Even in the case of an exemplary embodiment, when an opaque metal material is included as the second pad electrode 180 of the touch signal pad terminal T_PE_3, the laser irradiated from the laser sealing device 800 to the sealing area SA (e.g., the second sealing area SA2) does not pass through the touch signal pad terminal T_PE_3 and is partially reflected or absorbed by the second pad electrode 180 on the upper surface, and thus only a small part of the laser can reach the sealing area SA.

[0193] In this case, the frit in the sealing area SA interposed between the upper substrate 130 and the lower substrate 101 is not melted enough to couple the upper substrate 130 and the lower substrate 101 , and thus, the bonding characteristics of the upper substrate 130 and the lower substrate 101 may be significantly reduced.

[0194] However, the touch pad area T_PA according to the exemplary embodiment may not overlap with the sealing area SA of the display panel 100 in the thickness direction. That is, the plurality of touch signal pad terminals T_PE_3 may not overlap with the sealing area SA. Therefore, the laser irradiated to the sealing area SA may directly pass through the upper substrate 130 without being partially reflected or absorbed by the touch signal pad terminals T_PE_3. As a result, the glass material disposed in the sealing area SA can be fully melted. Therefore, even without increasing the intensity or irradiation time of the laser as the sealing light, the upper substrate 130 and the lower substrate 101 can be fully bonded.

[0195] Fig.21 is a cross-sectional view of a display device according to still another exemplary embodiment, and Fig. 22 1 is a plan layout diagram of an upper substrate according to another exemplary embodiment. When the touch electrode layer 140 and the touch signal pad terminal T_PE_4 are formed on the upper substrate 130 after performing the sealing process of the upper substrate 130 and the lower substrate 101, the touch electrode layer 140 and the touch signal pad terminal T_PE_4 can be applied. Fig.21 and Fig. 22 .

[0196] Reference Fig.21 and Fig. 22 The display device 3 according to the exemplary embodiment is different from the display device 1 according to the exemplary embodiment in that the touch pad area T_PA_1 and the second sealing area SA2 partially overlap in the thickness direction.

[0197] In more detail, one side of the touch pad area T_PA_1 away from the sensing area TA may be aligned with one side of the second sealing area SA2 away from the sensing area TA. The other side of the touch pad area T_PA_1 adjacent to the sensing area TA may be disposed to further extend from the other side of the second sealing area SA2 adjacent to the sensing area TA.

[0198] The touch signal pad terminal T_PE_4 may be disposed in the touch pad area T_PA_1. The touch signal pad terminal T_PE_4 may partially overlap the second sealing area SA2.

[0199] The touch printed circuit board 500 may be attached to the touch pad area T_PA_1. The touch signal lead terminal T_LE provided on the touch printed circuit board 500 may be connected to the touch signal pad terminal T_PE_4. The touch printed circuit board 500 may overlap the second sealing area SA2 in the thickness direction.

[0200] As described above, the exemplary embodiment may be applied when the touch electrode layer 140 and the touch signal pad terminal T_PE_4 are formed after performing the sealing process of the upper substrate 130 and the lower substrate 101. The second pad electrode 180 of the touch signal pad terminal T_PE_4 may include an opaque metal material for ultrasonic bonding with the touch signal lead terminal T_LE.

[0201] The touch electrode layer 140 and the touch signal pad terminal T_PE are formed on the upper substrate 130 by processes such as deposition and patterning, and as described above, when the upper substrate 130 is joined to the lower substrate 101 by a laser sealing process, the laser irradiated to the second sealing area SA2 does not pass through the touch signal pad terminal T_PE and is partially reflected or absorbed by the opaque second pad electrode 180 on the upper surface, and thus only a small part of the laser can reach the sealing area SA.

[0202] In this case, the frit in the sealing area SA interposed between the upper substrate 130 and the lower substrate 101 is not melted enough to couple the upper substrate 130 and the lower substrate 101 , and thus, the bonding characteristics of the upper substrate 130 and the lower substrate 101 may be significantly reduced.

[0203] However, in the display device 3 according to the exemplary embodiment, after the laser sealing process of the upper substrate 130 and the lower substrate 101 is performed, the touch electrode layer 140 and the touch signal pad terminal T_PE_4 may be formed on one surface of the upper substrate 130 by processes such as deposition and patterning. In this case, the touch signal pad terminal T_PE_4 may include an opaque metal material, for example, aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), copper (Cu), molybdenum (Mo), Ti / Al / Ti, Mo / Al / Mo, Mo / AlGe / Mo, Ti / Cu, or MoNb, and thus even if the laser transmittance is low, since the touch signal pad terminal T_PE_4 is formed after the laser sealing process, the touch signal pad terminal T_PE_4 may be disposed to overlap with the sealing area SA.

[0204] Therefore, the sensing area TA and the display area DA of the display device 3 can be set to extend further in one direction. That is, since the touch signal pad terminal T_PE_4 can be set to overlap with the second sealing area SA2, the area of ​​the sensing area TA can be relatively large. In addition, the display area DA is an area in which the light emitted from the organic light emitting element layer 120 can be visually recognized from the outside, and the touch pad area T_PA_1 and the touch signal pad terminal T_PE_4 are set to overlap with the second sealing area SA2, and therefore the area can be relatively large. As a result, the viewing area of ​​the display device 3 can be increased while reducing the frame of the display device 3. Hereinafter, a method for manufacturing a display device 3 according to an exemplary embodiment will be described.

[0205] Fig.23 is a flowchart illustrating a method of manufacturing a display device according to still another exemplary embodiment, and Figure 24 to Figure 26 is a perspective view showing a process of forming a touch signal pad terminal.

[0206] Reference Figure 23 to Figure 26 According to an exemplary embodiment, a method for manufacturing a display device may include: preparing a target panel 100 including a sealing area SA between a lower substrate 101 and an upper substrate 130 as a target panel 100 including the lower substrate 101 and the upper substrate 130 (S10); injecting sealing light into the sealing area SA and welding the lower substrate 101 and the upper substrate 130 (S20); after welding the lower substrate 101 and the upper substrate 130, forming a touch signal pad terminal T_PE_4 in a touch pad area T_PA_1 overlapping with the sealing area SA of the upper substrate 130 in a thickness direction (S30); and ultrasonically bonding a touch signal lead terminal T_LE of a touch printed circuit board 500 to a touch signal pad terminal T_PE_4 of the upper substrate 130 (S40).

[0207] Figure 24 to Figure 26 FIG. 2 shows a process of forming the second pad electrode 180_1 on the first pad electrode 153_2. The second pad electrode 180_1 can be formed by coating and curing the metal paste 181 on the first pad electrode 153_2 ( Fig.25 ) and the patterning process of the metal paste 181 ( Fig.26 ) is formed. Since various manufacturing methods related thereto are well known in the art, detailed description thereof will be omitted.

[0208] The above description has focused on the embodiment, but the above description is only exemplary and does not limit the present invention. It will be apparent to those skilled in the art that various modifications and applications not described above are possible without departing from the essential features of the present embodiment. For example, the elements of the embodiments described herein may be modified and implemented. In addition, it should be interpreted that the differences associated with these changes and applications are included within the scope of the present invention as defined by the appended claims.

Claims

1. A display device, comprising a display area and a non-display area surrounding the display area, the display device comprising: A first substrate including a first surface and a second surface opposite to the first surface; a second substrate facing the second surface of the first substrate and including a first surface facing the first substrate and a second surface opposite to the first surface of the second substrate; a touch electrode, the touch electrode being disposed on the second surface of the second substrate and being positioned in the display area; a touch pad terminal, the touch pad terminal being disposed on the second surface of the second substrate, being positioned in the non-display area, and being electrically connected to the touch electrode; a display circuit board, one end of the display circuit board being positioned on the second surface of the first substrate, the display circuit board being bent to surround one side surface of the first substrate, and the other end of the display circuit board being attached to the first surface of the first substrate; a touch circuit board, comprising a touch lead terminal at one end of the touch circuit board, the touch lead terminal overlapping with the touch pad terminal in a thickness direction and directly connected by ultrasonic bonding, the touch circuit board being bent to surround the one side surface of the first substrate, the display circuit board, and one side surface of the second substrate, and the other end of the touch circuit board being attached to the first surface of the first substrate; as well as a sealing member interposed between the first substrate and the second substrate and coupling the first substrate and the second substrate, wherein the sealing member is positioned in the non-display area, and The touch pad terminal is disposed further inward than the sealing member.

2. The display device according to claim 1, wherein: The touch pad terminal does not overlap the sealing member.

3. The display device according to claim 1, further comprising: Display components, The display element is disposed on the first surface of the first substrate.

4. The display device according to claim 3, wherein: The display element includes an anode, a cathode, and an organic emission layer disposed between the anode and the cathode.

5. The display device according to claim 4, wherein: The display element is sealed by the first substrate, the second substrate, and the sealing member.

6. The display device according to claim 1, wherein: The second substrate is made of glass or quartz.

7. The display device according to claim 6, wherein: The touch electrodes are directly disposed on the second surface of the second substrate.

8. The display device according to claim 1, wherein: The sealing member includes optically transparent frit.

9. The display device according to claim 1, wherein: The touch electrode includes a transparent electrode layer including a transparent conductive oxide.

10. The display device according to claim 9, wherein: The touch pad terminal includes: a first conductive layer including a transparent conductive oxide; and a second conductive layer disposed on the first conductive layer and including an opaque metal.

11. The display device according to claim 10, wherein: The transparent electrode layer and the first conductive layer are made of the same material.

12. The display device according to claim 10, wherein: The second conductive layer is made of at least one of aluminum, platinum, palladium, silver, magnesium, gold, nickel, neodymium, iridium, chromium, calcium, titanium, tantalum, tungsten, copper, molybdenum, Ti / Al / Ti, Mo / Al / Mo, Mo / AlGe / Mo, Ti / Cu and MoNb.

13. The display device according to claim 3, wherein: The first substrate extends from one end of the second substrate to the outside of the second substrate.

14. A display device comprising a display area and a non-display area surrounding the display area, the display device comprising: A display substrate comprising a first surface and a second surface opposite to the first surface; an encapsulation substrate facing the second surface of the display substrate and comprising a first surface facing the display substrate and a second surface opposite to the first surface of the encapsulation substrate; A touch electrode, the touch electrode is disposed on the second surface of the packaging substrate and is positioned in the display area; a touch pad terminal, the touch pad terminal being disposed on the second surface of the package substrate, being positioned in the non-display area, and being electrically connected to the touch electrode; a display circuit board, one end of which is positioned below the second surface of the display substrate, the display circuit board being bent to surround one side surface of the display substrate, and the other end of which is attached to the first surface of the display substrate; a touch circuit board, comprising a touch lead terminal at one end of the touch circuit board, the touch lead terminal overlapping with the touch pad terminal in a thickness direction and directly connected by ultrasonic bonding, the touch circuit board being bent to surround the one side surface of the display substrate, the display circuit board and one side surface of the packaging substrate, and the other end of the touch circuit board being attached to the first surface of the display substrate; a display element disposed on the display region of the display substrate and sealed by the display substrate, a sealing member, and the encapsulation substrate; as well as a touch element, wherein the touch element is disposed on the packaging substrate and overlaps with the display area of ​​the display substrate, The touch pad terminal overlaps a portion of the sealing area of ​​the display substrate and includes a first pad conductive layer and a second pad conductive layer disposed on the first pad conductive layer and including an opaque metal.

15. The display device according to claim 14, wherein: The touch electrode includes a transparent electrode layer including a transparent conductive oxide.

16. The display device according to claim 15, wherein: The transparent electrode layer and the first pad conductive layer are made of the same material.

17. The display device according to claim 15, wherein: The second pad conductive layer is made of at least one of aluminum, platinum, palladium, silver, magnesium, gold, nickel, neodymium, iridium, chromium, calcium, titanium, tantalum, tungsten, copper, molybdenum, Ti / Al / Ti, Mo / Al / Mo, Mo / AlGe / Mo, Ti / Cu and MoNb.

18. The display device according to claim 14, wherein: The display element is disposed on the first surface of the display substrate.

19. The display device according to claim 18, wherein: The display element includes an anode, a cathode, and an organic emission layer disposed between the anode and the cathode.

20. The display device according to claim 19, wherein: The display element is sealed by the display substrate, the encapsulation substrate, and the sealing member.

21. The display device according to claim 14, wherein: The packaging substrate is made of glass or quartz, and the touch electrodes are directly disposed on the second surface of the packaging substrate.

22. The display device according to claim 14, wherein: The sealing member includes optically transparent frit.

23. The display device according to claim 18, wherein: The display substrate extends from one end of the packaging substrate to the outside of the packaging substrate.

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