Temperature control equipment and heating plates

Abstract

A temperature control device and a heating plate are disclosed. The temperature control device includes a cooling circuit and a heating circuit. The cooling circuit includes a temperature control plate having a fluid inlet and a fluid outlet, the temperature control plate being adapted to be thermally coupled to one or more heat generating electronic components. An inlet control is fluidically coupled to the fluid inlet of the temperature control plate, and an outlet control is fluidically coupled to the fluid outlet of the temperature control plate. A cold fluid source is fluidically coupled to the inlet control, and a cold fluid return is fluidically coupled to the outlet control. The heating circuit contains less fluid than the cooling circuit, and includes a hot fluid source fluidically coupled to the inlet control and a hot fluid return fluidically coupled to the outlet control. A pump can circulate the hot fluid through at least the hot fluid supply, the temperature control plate, and the hot fluid return.

Description

Technical Field

[0001] Embodiments of the present disclosure relate generally to systems for temperature control of electronic devices, and more particularly, but not exclusively, to systems for temperature control under a variety of operating conditions. Background Art

[0002] Many modern electronic devices operate under predictable and stable temperature conditions. For example, in a data center, the ambient temperature is very tightly controlled, so all servers, routers, edge computing servers, etc. within the data center operate at known stable temperatures. In the home, the temperature is less tightly controlled, but it typically does not vary much, so even home electronic devices can operate within a higher, but still tolerable, temperature range. In both environments, the ambient temperature is such that the electronic devices typically only need to be cooled, not heated.

[0003] However, there are certain applications where electronic devices operate in uncontrolled temperature conditions where the temperature may vary greatly. Electronic devices operating outdoors are an example. Depending on the location and season, they may be forced to operate in ambient temperatures ranging from sub-zero to very hot. Since electronic devices may have problems starting up in extremely cold conditions and operating in extremely hot conditions, these applications may require not only heating but also cooling. Previous temperature control systems were usually only able to heat or cool, but not both. There are some systems that use electric heaters in the cooling loop, but these systems may not be suitable for some electronic devices. In addition, these systems are not easy to control and are relatively inefficient, and require a large space. Summary of the invention

[0004] The present disclosure provides a temperature control device and a heating plate.

[0005] According to a first aspect of an embodiment of the present disclosure, a temperature control device is provided, comprising: a cooling circuit for circulating a working fluid and at least one heating circuit for circulating a working fluid. The cooling circuit comprises: at least one temperature control plate having a fluid inlet and a fluid outlet, the temperature control plate being adapted to be thermally coupled to one or more heat-generating electronic components, an inlet control fluidically coupled to the fluid inlet of at least one temperature control plate and an outlet control fluidically coupled to the fluid outlet of at least one temperature control plate, and a cold fluid source fluidically coupled to the inlet control and a cold fluid return fluidically coupled to the outlet control. At least one heating circuit is shorter than the cooling circuit, and comprises: a hot fluid source fluidically coupled to the inlet control and a hot fluid return fluidically coupled to the outlet control, and a pump to circulate the hot fluid through at least the hot fluid source, the temperature control plate, and the hot fluid return.

[0006] In some embodiments, the inlet control, the outlet control, or both are three-way valves.

[0007] In some embodiments, the temperature control plate includes a heater to heat a fluid circulated through the temperature control plate.

[0008] In some embodiments, the temperature control plate is a cooling plate, and the heating circuit further comprises at least one heating plate separate from the cooling plate to heat the working fluid circulating through the heating circuit.

[0009] In some embodiments, the cooling circuit comprises two or more cooling plates; the heating circuit comprises two or more heating plates; or the cooling circuit comprises two or more cooling plates and the heating circuit comprises two or more heating plates.

[0010] In some embodiments, the heating plate includes: a first module and a second module. The first module includes: a thermally conductive first base having at least one heater located therein, and a plurality of first heat sinks thermally coupled to and extending from the inner side of the first base. The second module includes: a thermally conductive second base having at least one heater located therein, a side wall surrounding the periphery of the inner side of the second base, a plurality of second heat sinks thermally coupled to and extending from the inner side of the second base, and a fluid port on the outer side of the second base, the fluid port including an inlet and an outlet. Wherein, the first module is connected to the second module so that the first base, the second base and the side wall form a sealed internal cavity, wherein the sealed internal cavity is fluidically coupled to the fluid port so that the working fluid can enter and flow out of the sealed internal cavity through the fluid port.

[0011] In some embodiments, the cooling circuit is an open loop.

[0012] In some embodiments, the cooling circuit further includes a heat exchanger fluidly coupled between the cold fluid source and the cold fluid return, wherein the heat exchanger extracts heat from the working fluid received from the cold fluid return and directs the working fluid to the cold fluid source.

[0013] In some embodiments, the cooling circuit further includes a pump to circulate the working fluid through the cooling circuit.

[0014] In some embodiments, the apparatus further comprises a fan to force convection of air through the heat exchanger.

[0015] According to a first aspect of an embodiment of the present disclosure, a heating plate is provided, comprising: a first module and a second module. The first module comprises: a thermally conductive first base having at least one heater located therein, and a plurality of first heat sinks thermally coupled to the inner side of the first base and extending from the inner side of the first base. The second module comprises: a thermally conductive second base having at least one heater located therein, a side wall surrounding the periphery of the inner side of the second base, a plurality of second heat sinks thermally coupled to the inner side of the second base and extending from the inner side of the second base, and a fluid port, on the outer side of the second base, the fluid port comprising an inlet and an outlet. The first module is connected to the second module so that the first base, the second base and the side wall form a sealed internal cavity, wherein the sealed internal cavity is fluidically coupled to the fluid port so that the working fluid can enter and flow out of the sealed internal cavity through the fluid port.

[0016] In some embodiments, ends of the first plurality of heat sinks abut ends of the second plurality of heat sinks such that the first plurality of heat sinks and the second plurality of heat sinks form a flow channel within the internal cavity.

[0017] In some embodiments, the first base includes a sealing gasket around its perimeter, the sealing gasket being designed to engage with a corresponding recess in the side wall to seal the internal cavity.

[0018] In some embodiments, the heating plate further includes: an insulating cover coupled to an outer side of the first base; and, an insulating cover coupled to an outer side of the second base.

[0019] In some embodiments, the fluid port is fluidly coupled to the internal cavity via a fluid passage in the second base. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Non-limiting and non-exhaustive embodiments of the present invention are hereinafter described with reference to the following figures, wherein like reference numerals refer to like elements throughout the various views unless otherwise specified.

[0021] Figure 1A-1B is a schematic diagram of an embodiment of a temperature control system with open loop cooling.

[0022] Figure 2A-2B It can be used for Figure 1B and Figure 3B 0026] A cross-sectional view of an embodiment of a heating plate in an embodiment of a cooling system is shown in FIG. Figure 2A It is an exploded view. Figure 2B It is an assembly diagram.

[0023] Figure 3A-3B is a schematic diagram of an embodiment of a temperature control system with closed-loop cooling.

[0024] Figures 4A-4Cis a schematic diagram of another embodiment of a temperature control system with open loop cooling. DETAILED DESCRIPTION

[0025] Embodiments of systems for temperature control of electronic components are described. Specific details are described to provide an understanding of the embodiments, but one skilled in the relevant art will recognize that the invention may be practiced without one or more of the described details or with other methods, components, materials, etc. In some instances, well-known structures, materials, or operations are not shown or described in detail, but are still included within the scope of the invention.

[0026] Reference in the specification to "one embodiment" or "an embodiment" means that features, structures, or characteristics described in connection with the embodiment may be included in at least one of the described embodiments, so that the appearances of "in one embodiment" or "in an embodiment" do not necessarily refer to the same embodiment. Furthermore, in one or more embodiments, the particular features, structures, or characteristics may be combined in any suitable manner.

[0027] The disclosed embodiment is a heat transfer system for electronic devices. The system includes two loops, one for cooling and one for heating. When heating is required, the heating loop acts as a bypass loop for the cooling loop. Two different system embodiments and an innovative heating plate design are described. The disclosed embodiments enable proper thermal management of processors or electronic devices operating at different temperatures, seasons, and locations.

[0028] Figure 1A An embodiment of a temperature control system 100 is shown. The system 100 includes a cooling loop 102 and a heating loop 104, both of which are fluidly coupled to a temperature control board 108 so that they can be used to control the temperature of one or more heat-generating electronic components 106. In various operating modes, the cooling loop 102 can be operated alone, the heating loop 104 can be operated alone, or the cooling loop 102 and the heating loop 104 can be operated simultaneously to control the temperature of the electronic components 106 by heating, cooling, or a combination of both.

[0029] The temperature control board 108 is thermally coupled to the electronic component 106 so that heat exchange can be performed between the electronic component and the working fluid flowing through the temperature control board. Depending on whether the system 100 cools or heats the electronic component 106, the direction of heat exchange can be from the electronic component 106 to the working fluid, or it can be from the working fluid to the electronic component. The temperature control board 108 includes a fluid inlet and a fluid outlet 112. The inlet control 114 is coupled to the fluid inlet 110 in a flow-through manner, and the outlet control 116 is coupled to the outlet 112 in a flow-through manner. As used herein, if two elements are directly or indirectly coupled to each other, they are "flow-coupled", so that the fluid can flow between them in one or two directions. In the embodiment shown, the inlet control 114 and the outlet control 116 are both three-way valves, but in other embodiments, they can be other types of controls. For example, in other embodiments, the inlet control 114 and the outlet control 116 can be a combination of two-way valves. In other embodiments, the inlet control 114 and the outlet control 116 do not have to be the same type of control. In most cases, the inlet control 114 and the outlet control 116 are in the same open state.Alternative embodiments may omit one of the two controls 114 and 116.

[0030] Cooling circuit 102 is an open loop fluidly coupled to temperature control plate 108. Cold fluid source 120 is fluidly coupled to inlet control 114, and cold fluid return 122 is fluidly coupled to outlet control 116, such that the inlet and outlet controls regulate the flow of working fluid from the cooling circuit through temperature control plate 108.

[0031] The heating loop 104 is similarly coupled to the temperature control board 108 via an inlet control 114 and an outlet control 116, so that the inlet and outlet controls also regulate the flow of the working fluid from the heating loop through the temperature control board 108. A hot fluid source 124 is fluidly coupled to the inlet control 114, and a hot fluid return 126 is fluidly coupled to the outlet control 116. A pump 128 is fluidly coupled to the heating loop 104 to circulate the working fluid through the loop. The temperature control board 108 includes a heater 118 to heat the working fluid flowing through the temperature control board. The heating loop 104 then uses the heat generated by the heater 118 and the electronic components 106 themselves to heat the working fluid flowing through the heating loop. By selectively configuring the inlet control 114 and the outlet control 116, a cold working fluid, a hot working fluid, or a mixture of the two can be directed through the temperature control board 108. Therefore, the heating loop 104 and the cooling loop 102 are not completely separate, but are fluidly coupled to each other via the inlet control 114, the outlet control 116, and the temperature control board 108. In other words, the temperature control plate 108 is part of both the heating loop and the cooling loop in the system 100. Due to their shared coupling to the temperature control plate 108, the cooling loop and the heating loop circulate the same working fluid.

[0032] The heating loop 104 is substantially shorter than the cooling loop 102 so that the heating loop 104 can quickly heat the electronic components 106 when needed. Designing the heating loop as a short bypass loop allows the working fluid in the loop to be heated quickly because the heat that can be generated and introduced to the loop is limited to a certain period of time. By utilizing as much of the heat generated by the electronic equipment 106 as possible, the working fluid in the loop can also be heated more quickly. Since the heating loop is a much shorter loop than the cooling loop, there is less working fluid in the heating loop, and given the limited amount of heat provided, the fluid in the heating loop can be heated more quickly.

[0033] Temperature sensors may be placed at various locations in the system 100 to allow monitoring of the performance of the system. The illustrated embodiment includes three temperature sensors T1-T3:

[0034] - T1 is located downstream of the outlet 112 to measure the temperature of the working fluid leaving the temperature control plate 108. In the embodiment shown, the sensor T1 is located between the outlet 112 and the outlet control 116, but in other embodiments, T1 can be located at a different location, such as downstream of the outlet control 116 in the cold fluid return 122 or the hot fluid return 126.

[0035] - T2 is located in the cold fluid source 120 upstream of the inlet control 114 to measure the temperature of the cold working fluid.

[0036] T3 is located just upstream of the inlet 110 to measure the temperature of the working fluid entering the temperature control plate 108 .

[0037] Other embodiments of the system 100 may have more or fewer temperature sensors than shown. When the heating circuit 104 is not operating, or if the inlet control 114 and the outlet control 116 are set to stop flow through the heating circuit 104, the temperatures T2 and T3 will be the same or nearly the same. However, when only the heating circuit 104 is operating (i.e., the inlet control 114 and the outlet control 116 are set to allow flow from only the heating circuit 104 to the temperature control plate 108), or when the cooling circuit 102 and the heating circuit 104 are operating simultaneously (i.e., the inlet control 114 and the outlet control 116 are set to allow flow from both the cooling circuit 102 and the heating circuit 104 to the temperature control plate 108), T3 will generally be greater than T2.

[0038] In operation, the system 100 can operate in at least three modes: a cooling mode, a heating mode, and a hybrid mode.

[0039] Mode 1: Cooling mode, the cooling circuit recirculates for cooling;

[0040] Mode 2: Heating mode, only the heating loop recirculates for heating, and the heat can come from the heater 118, the electronic component 106, or both.

[0041] Mode three: hybrid mode, a transition mode, in hybrid mode, the purpose is to use the heat generated in the heating circuit to heat the cooling circuit and adjust the cooling circuit to the appropriate temperature, and the heat source mainly comes from 106. The design is intended to save electrical energy, so the heater 118 is turned off during the transition mode. Another purpose is to eliminate the impact of the coolant at a lower temperature. The cooling mode can be achieved by running the cooling circuit alone or by running the cooling circuit and the heating circuit together but turning off the heater 118. For example, the heating mode is called when the electronic device 106 must be started under very cold conditions. In heating mode, the inlet and outlet controls are set to form a closed heating circuit, which means that no working fluid circulates in the cooling circuit 102. Once the fluid in the heating circuit is heated to a certain temperature, the inlet and outlet controls can be adjusted to enter the hybrid mode, which mixes the working fluids from the heating circuit and the cooling circuit. In this mode, the system operates to ensure the appropriate thermal conditions of the electronic components and adjusts to the best operating conditions. When both circuits are working, the system can be adjusted and controlled to achieve the best heat transfer balance for the system. Whether in heating mode or hybrid mode, heating can be performed in a variety of ways. The working fluid may be heated by the electronics assembly 106 alone, by the heater 118 alone, or by a combination of the electronics assembly 106 and the heater 118 .

[0042] Figure 1B An embodiment of a temperature control system 150 is shown. System 150 is similar in most respects to system 100. The primary difference between system 150 and 100 is the location in the heating loop where the working fluid is heated.

[0043] System 150 includes a cooling plate 154 thermally coupled to heat generating electronic device 106. Cooling plate 154 is similar to temperature control plate 108 in most respects: it includes a fluid inlet 110 and a fluid outlet 112, as well as an inlet control 114 fluidly coupled to fluid inlet 110 and an outlet control 116 fluidly coupled to outlet 112. Cooling plate 154 allows the working fluid flowing through the cooling plate to be heated by the heat provided by the heat generating electronic component 106 itself. However, unlike temperature control plate 108, cooling plate 154 does not include a separate internal heater for heating the working fluid.

[0044] The cooling circuit 102 in the system 150 is substantially the same as the cooling circuit 102 in the system 100: it is an open loop fluidically coupled to the cooling plate 154. The cold fluid source 120 is fluidically coupled to the inlet control 114, and the cold fluid return 122 is fluidically coupled to the outlet control 116, so that the inlet and outlet controls regulate the flow of the cold working fluid through the cooling plate 154.

[0045] The heating circuit 152 is different from the heating circuit 104. As in the heating circuit 104, the hot fluid source 124 is fluidly coupled to the inlet control 114, the hot fluid return 126 is fluidly coupled to the outlet control 116, and the pump 128 is fluidly coupled to the heating circuit 104 to circulate the working fluid through the circuit. Unlike the heating circuit 104, the heating circuit 152 includes a heating plate 156 that is separate from the cooling plate 154 and located elsewhere in the heating circuit to heat the working fluid flowing through the circuit. The heating plate 156 includes one or more heaters 158 to heat the working fluid. Embodiments of the heating plate are described in detail below. Figure 2A –2B, as described below.

[0046] To allow monitoring of the performance of the system, system 150 includes the same temperature sensors T1-T3 in the same locations as system 100. However, since most of the heating now occurs at the heating plate 156 rather than the cooling plate 154, an additional temperature sensor T4 downstream of the heating plate is included in system 150 to monitor the temperature of the fluid leaving the heating plate. In the embodiment shown, temperature sensor T4 is downstream of pump 128, but in other embodiments it may be located at the outlet of the heating plate.

[0047] Although systems 150 and 100 have differences, they operate similarly and have the same modes of operation. By selectively configuring inlet control 114 and outlet control 116, cold working fluid, hot working fluid, or a mixture of both can be directed through cooling plate 154 to regulate the temperature of electronic device 106.

[0048] Figure 2A-2B Shown together are embodiments of a heating plate 200 that may be used to heat a working fluid flowing through a heating loop in systems 150 and 350 . Figure 2A It is an exploded view. Figure 2B 2 is an assembly diagram. The heating plate 200 includes a bottom module 202 and a top module 204. The bottom module 202 includes a thermally conductive base 214 in which one or more power resistors 216 are placed. The embodiment shown has three power resistors 216a-216c, evenly distributed within the base 214, but other embodiments may have more or fewer power resistors than shown, and the power resistors do not have to be evenly distributed. An electrical connection (not shown) is provided so that power can be delivered to the power resistors 216. An insulating cover 218 is coupled to the outside of the base 214 to slow down or prevent heat from being transferred from the base to the outside. A plurality of heat sinks 220 extend from the inside of the base 214 and are thermally coupled to the base so that the heat generated by the power resistors 216 can flow into the heat sink 220 by conduction.

[0049] The top module 204 includes a thermally conductive base 222 in which one or more power resistors 224 are placed. The illustrated embodiment has three power resistors 224a-224c evenly distributed within the base 222, but other embodiments may have more or fewer power resistors than shown, the power resistors need not be evenly distributed, and the number of power resistors 224 need not be the same as the number of power resistors 216. An electrical connection (not shown) is provided so that power can be delivered to the power resistors 216. An insulating cover 226 is coupled to the outside of the base 222 to slow or prevent heat from being transferred from the base to the outside. A plurality of heat sinks 228 extend from the inside of the base 222 and are thermally coupled to the base so that heat generated by the power resistors 224 can flow into the heat sinks 228 by conduction.

[0050] The top module 204 also includes a side wall 230 extending around the periphery of the inner side of the base 222, so that when the bottom module 202 and the top module 204 are assembled together, a sealed internal cavity 201 is formed (see Figure 2B ). The fluid port 114 includes an inlet and an outlet that are fluidly coupled to the sealed internal cavity through a channel 232 in the top module to allow ingress and egress of the working fluid.

[0051] The top module 204 cooperates with the bottom module 202 to form a sealed internal cavity 201 within the heating plate. The internal cavity 201 is bounded by the sidewalls 230 and the bases 214 and 222. When assembled, the ends of the heat sink 220 in the bottom module 202 abut or nearly abut the ends of the corresponding heat sink 228 of the top module, thereby forming a fluid passage in the sealed internal cavity 201. The mounting holes 210 extend through the thickness of the insulating cover 226, the base 222, and the sidewalls 230, and also extend at least partially through the thickness of the base 214. The top module 204 is secured to the bottom module 202 by fasteners 212, which in one embodiment may be mounting screws, which fit into the mounting holes 210. To seal the internal cavity 201, a sealing gasket 206 around the perimeter of the inner side of the base 214 engages a corresponding notch 208 in the sidewall 230.

[0052] In operation of the heating plate 200, the working fluid flows into the sealed internal cavity 201 through the fluid port 114, where it flows through the channel created by the heat sinks 220 and 228. At the same time, power is provided to the power resistors 216 and 224. The power resistors are thermally coupled to the heat sinks 220 and 228 so that the heat sinks are heated by the power resistors through conduction. As the working fluid flows through the channel, heat is transferred to it through the bases 214 and 222 and the heat sinks 220 and 228, thereby heating the working fluid. The heated working fluid then leaves the heating plate 200 through the fluid port 114.

[0053] Figure 3A An embodiment of a temperature control system 300 is shown. System 300 is similar to system 100 in most respects: the main difference between system 300 and 100 is the cooling circuit, which is an open loop in system 100 but a closed loop in system 300.

[0054] The system 300 includes a temperature control board 108 that is thermally coupled to the heat generating electronic components 106. The temperature control board 108 includes a fluid inlet 110 and a fluid outlet 112, wherein an inlet control 114 is fluidly coupled to the fluid inlet 110, and an outlet control 116 is fluidly coupled to the outlet 112. The temperature control board 108 allows the heat provided by the heat generating electronic components 106 themselves to heat the working fluid flowing therethrough. The temperature control board 108 also includes a heater 118 to heat the working fluid.

[0055] The heating loop 104 in system 300 is substantially the same as the heating loop in system 100: it is a closed loop fluidly coupled to the temperature control plate 108. The hot fluid source 124 is fluidly coupled to the inlet control 114, and the hot fluid return 126 is fluidly coupled to the outlet control 116, so that the inlet and outlet controls regulate the flow of the hot working fluid through the temperature control plate 108.

[0056] The cooling circuit 302 in system 300 is different from the cooling circuit 102 in system 100. In system 300, the cooling circuit is a closed loop rather than an open loop. Therefore, the cooling circuit 302 includes additional components not found in the cooling circuit 102. As in system 100, the cold fluid source 120 is coupled to the inlet control 114, and the cold fluid return 122 is coupled to the outlet control 116. The cold fluid return 122 is coupled to the valve 304 and the inlet of the heat exchanger 306. In one embodiment, the heat exchanger 306 can be an air-cooled radiator with or without a fan 308 to force convection through the radiator, but in other embodiments, it can be another type of heat exchanger. A pump 310 is coupled to the cooling circuit at the outlet of the heat exchanger 304 to circulate the working fluid through the cooling circuit. Although not shown in the figure (see Figure 1A ), system 300 may include the same temperature sensors T1-T3 at the same location as system 100.

[0057] Despite the differences between systems 300 and 100 , they operate similarly and have the same modes of operation. By selectively configuring inlet control 114 and outlet control 116 , cold working fluid, hot working fluid, or a mixture of both can be directed through temperature control plate 108 to regulate the temperature of electronic device 106 .

[0058] Figure 3B Another embodiment of a temperature control system 350 is shown. System 350 is similar to system 150 in most respects: the primary difference between system 350 and 150 is the cooling circuit.

[0059] System 350 includes a cooling plate 154 thermally coupled to heat generating electronic components 106. Cooling plate 154 includes a fluid inlet 110 and a fluid outlet 112, wherein an inlet control 114 is fluidly coupled to fluid inlet 110, and an outlet control 116 is fluidly coupled to outlet 112. Cooling plate 154 allows heat provided by heat generating electronic components 106 themselves to heat a working fluid flowing therethrough.

[0060] The heating circuit 104 in system 350 is substantially the same as the heating circuit 104 in system 150: it is a closed loop fluidically coupled to a cooling plate 154. A thermal fluid source 124 is fluidically coupled to an inlet control 114, and a thermal fluid return 126 is fluidically coupled to an outlet control 116, so that the inlet and outlet controls regulate the flow of the working fluid through the cooling plate 154. A heating plate 156 and a pump 128 are fluidly coupled in the heating circuit. In one embodiment, the heating plate 156 and the pump 128 can be combined into a single unit or module 160 that can be easily coupled and decoupled from the heating circuit and in which a single power source is required to power the resistors to generate heat and to power the pump motor.

[0061] The cooling circuit 352 in system 350 is different from the cooling circuit 102 in system 150. In system 350, the cooling circuit is a closed loop rather than an open loop. Therefore, the cooling circuit 352 includes additional components not found in the cooling circuit 102. As in system 150, the cold fluid source 120 is coupled to the inlet control 114, and the cold fluid return 122 is coupled to the outlet control 116. The cold fluid return 122 is coupled to the valve 304 and the inlet of the heat exchanger 306. In one embodiment, the heat exchanger 306 can be an air-cooled radiator with or without a fan 308 to force convection through the radiator, but in other embodiments it can be another type of heat exchanger. A pump 310 is coupled to the cooling circuit at the outlet of the heat exchanger 304 to circulate the working fluid through the cooling circuit. Although not shown in the figure (see Figure 1B ), but system 350 may include the same temperature sensors T1-T4 at the same location as system 150.

[0062] Despite the differences between systems 350 and 150 , they operate similarly and have the same modes of operation. By selectively configuring inlet control 114 and outlet control 116 , cold working fluid, hot working fluid, or a mixture of both can be directed through cooling plate 154 to regulate the temperature of electronic device 106 .

[0063] Figures 4A-4C Other embodiments of systems 100 and 150 with open loop cooling are shown, but these embodiments may also be implemented in systems 300 and 350 with closed cooling loops.

[0064] Figure 4A A system 400 is shown, which is similar in most respects to the system 100. The primary difference between the systems 400 and 100 is that the system 400 includes multiple temperature control boards 108 instead of just one. In the illustrated embodiment, the system 400 includes two identical temperature control boards 108, but in other embodiments, the system 400 may include more temperature control boards than shown, and the temperature control boards need not be identical. The illustrated embodiment also shows each temperature control board 108 thermally coupled to a separate electronic assembly 106, but in other embodiments, multiple temperature control boards 108 may be thermally coupled to the same electronic assembly 106.

[0065] Figure 4BA system 450 is shown that is similar in most respects to system 150. The primary difference between systems 450 and 150 is that system 400 includes multiple cooling plates 154 in the cooling loop 102, rather than just one, and also includes multiple heating plates 156 in the heating loop 152, rather than just one. In the illustrated embodiment, the cooling loop 102 includes two identical cooling plates 154, but in other embodiments, it may have more or fewer cooling plates than shown, and the cooling plates need not be identical. Similarly, in the illustrated embodiment, the heating loop 152 includes two identical heating plates 156, but in other embodiments, it may include more or fewer heating plates than shown, and the heating plates need not be identical. The illustrated embodiment also shows each cooling plate 154 thermally coupled to a separate electronic component 106, but in other embodiments, multiple cooling plates 154 may be thermally coupled to the same electronic component 106. In the illustrated embodiment, both heating plates 156 are serviced by a single pump 128, but in other embodiments, each heating plate 156 may be serviced by its own pump 128, for example, where there are multiple modules 160 in the circuit (see FIG. Figure 3B ).

[0066] Figure 4C System 475 is shown, which is similar to system 450 in most respects. The main difference between system 475 and 450 is that system 475 includes multiple heating circuits 152. To accommodate multiple heating circuits, in one embodiment, the inlet control 114 and the outlet control 116 can be four-way valves, but in other embodiments, the inlet and outlet controls can be something else, such as a combination of valves, and the inlet and outlet controls do not need to be the same. As in system 450, in system 475, the cooling circuit includes multiple cooling plates 154 instead of just one, and the heating circuit includes multiple heating plates 156 instead of just one. In the illustrated embodiment of system 475, the cooling circuit includes two identical cooling plates 154, but in other embodiments, the cooling circuit can have more or fewer cooling plates than shown, and the cooling plates do not need to be identical. Similarly, in the illustrated embodiment of system 450, each heating circuit 152 includes two identical heating plates 156, but in other embodiments, each heating circuit can include more or fewer heating plates than shown, the number of heating plates in each circuit does not need to be the same, and the heating plates in each circuit do not need to be identical. The illustrated embodiment also shows each cooling plate 154 thermally coupled to a separate electronic assembly 106, but in other embodiments, multiple cooling plates 154 may be thermally coupled to the same electronic assembly 106. In the illustrated embodiment, two heating plates 156 are served by a single pump 128, but in other embodiments, each heating plate 156 may be served by its own pump 128, for example, where there are multiple modules 160 in the loop (see Figure 3B ). In addition to the above, other cooling system embodiments are also possible. For example:

[0067] The design of the heating plate can be modified and customized to achieve similar effects.

[0068] The system can be customized to achieve similar functionality.

[0069] The entire heating circuit can be packaged as a single module.

[0070] The above description of the embodiments is not intended to be exhaustive or to limit the invention to the form described. Specific embodiments and examples of the invention are described herein for illustrative purposes, but various modifications are possible.

Claims

1. A temperature control device, comprising: A cooling circuit for circulating a working fluid, the cooling circuit comprising: at least one temperature control plate having a fluid inlet and a fluid outlet, the temperature control plate being adapted to be thermally coupled to one or more heat generating electronic components, an inlet control fluidly coupled to a fluid inlet of at least one temperature control plate and an outlet control fluidly coupled to a fluid outlet of at least one temperature control plate, and a source of cold fluid fluidly coupled to the inlet control and a return of cold fluid fluid fluidly coupled to the outlet control; and at least one heating circuit for circulating the working fluid, the at least one heating circuit being shorter than the cooling circuit and comprising: a thermal fluid source fluidly coupled to the inlet control and a thermal fluid return fluidly coupled to the outlet control, and a pump to circulate the thermal fluid through at least the thermal fluid source, the temperature control plate, and the thermal fluid return; The cooling circuit and the heating circuit can be operated simultaneously, and the working fluids from the heating circuit and the cooling circuit can be mixed by adjusting the inlet control and the outlet control.

2. The device according to claim 1, wherein: Inlet control, outlet control, or both are three-way valves.

3. The device according to claim 1, wherein: The temperature control plate includes a heater to heat a fluid circulated through the temperature control plate.

4. The device according to claim 1, wherein: The temperature control plate is a cooling plate, and the heating circuit further comprises at least one heating plate separate from the cooling plate to heat the working fluid circulating through the heating circuit.

5. The apparatus according to claim 4, wherein: The cooling circuit includes two or more cooling plates; The heating circuit comprises two or more heating plates; or The cooling circuit comprises two or more cooling plates, and the heating circuit comprises two or more heating plates.

6. The device according to claim 4, wherein: The heating plate includes: The first module includes: a thermally conductive first pedestal having at least one heater disposed therein, and a plurality of first heat sinks thermally coupled to and extending from the inner side of the first base; The second module includes: a thermally conductive second susceptor having at least one heater disposed therein, a side wall surrounding a periphery of an inner side of the second base, a plurality of second heat sinks thermally coupled to and extending from the inner side of the second base, and a fluid port on an outer side of the second base, the fluid port including an inlet and an outlet; Wherein, the first module is connected to the second module so that the first base, the second base and the sidewall form a sealed internal cavity, wherein the sealed internal cavity is fluidly coupled to the fluid port so that the working fluid can enter and flow out of the sealed internal cavity through the fluid port.

7. The device according to claim 1, wherein: The cooling circuit is an open loop.

8. The apparatus according to any one of claims 1 to 7, wherein the cooling circuit further comprises: A heat exchanger is fluidly coupled between the cold fluid source and the cold fluid return, wherein the heat exchanger extracts heat from the working fluid received from the cold fluid return and directs the working fluid to the cold fluid source.

9. The device according to claim 8, wherein: The cooling circuit also includes a pump to circulate the working fluid through the cooling circuit.

10. The apparatus of claim 8, further comprising a fan to force convection of air through the heat exchanger.

Images