Semiconductor module packaging device and packaging process

Abstract

The present invention discloses a semiconductor module packaging device and packaging process, wherein the semiconductor module packaging device includes a base and a first fixing member, a clamping assembly, and a second fixing member mounted on the base. The base is used to place a mold containing a semiconductor module to be welded. The first fixing member, the clamping assembly, and the second fixing member are arranged along a first direction. The mold is located between the first fixing member and the clamping assembly. The first fixing member, the clamping assembly, and the second fixing member cooperate to generate a force on the mold, thereby compressing the semiconductor module to be welded. The semiconductor module packaging device of the present invention places the mold containing the semiconductor module to be welded on the base, and compresses the mold containing the semiconductor module to be welded by the first fixing member, the clamping assembly, and the second fixing member. This ensures that the parallelism of the semiconductor module after welding is very good, improves the welding yield rate, and greatly improves welding efficiency.

Description

Technical Field

[0001] The present invention belongs to the field of packaging, and in particular relates to a semiconductor module packaging device and a packaging process. Background Art

[0002] Traditional semiconductor modules are welded manually or simply assembled and then welded using welding equipment. Traditional semiconductor module welding has problems such as poor parallelism, low yield and low welding efficiency, which seriously restricts the industrial production and application promotion of semiconductor module packaging.

[0003] Therefore, in order to solve the above technical problems, it is necessary to provide a semiconductor module packaging device and packaging process. Summary of the Invention

[0004] In view of this, an object of the present invention is to provide a semiconductor module packaging device and packaging process to improve the parallelism, yield rate and welding efficiency of the semiconductor module.

[0005] In order to achieve the above-mentioned purpose, the technical solution provided by one embodiment of the present invention is as follows:

[0006] A semiconductor module packaging device includes a base and a first fixing member, a clamping assembly, and a second fixing member installed on the base. The base is used to place a mold containing a semiconductor module to be welded. The first fixing member, the clamping assembly, and the second fixing member are arranged along a first direction. The mold is located between the first fixing member and the clamping assembly. The first fixing member, the clamping assembly, and the second fixing member cooperate to generate a force on the mold to compress the semiconductor module to be welded.

[0007] In one embodiment, the pressing assembly includes a first movable member, which is arranged in close contact with a second fixed member. The first movable member can move along the second fixed member to loosen or press the mold.

[0008] In one embodiment, the second fixing member is provided with a first inclined surface, and the first movable member is provided with a second inclined surface. The first inclined surface fits the second inclined surface so that the first movable member can be lifted and lowered along the inclined direction of the second inclined surface.

[0009] In one embodiment, the distance between the first movable member and the mold gradually increases as the first movable member rises along the inclined direction of the second inclined surface.

[0010] In one embodiment, the pressing assembly further includes a second movable member disposed on the base, the second movable member being located between the first movable member and the mold, and the second movable member being movable in the first direction and loosening or pressing the mold under the movement of the first movable member.

[0011] In one embodiment, the pressing assembly further includes a mounting member, the mounting member is mounted in cooperation with the first movable member, and the mounting member is in line contact with the second movable member.

[0012] In one embodiment, the packaging device further includes a pressing block, which is disposed on the mold so as to apply a force to the semiconductor module to be soldered in a second direction.

[0013] Another embodiment of the present invention provides the following technical solution:

[0014] A semiconductor module packaging process, the process comprising:

[0015] S1. Install the first fixing member and the second fixing member on the base in sequence along the first direction;

[0016] S2. Place the mold on the base between the first fixing member and the second fixing member, and place the semiconductor module to be welded in the mold;

[0017] S3, placing the pressing assembly between the mold and the second fixing member;

[0018] S4. After completing the above steps, all components are placed in the welding equipment to complete the welding of the semiconductor module.

[0019] In another embodiment, the pressing assembly in S3 includes a first movable member, and S3 includes:

[0020] S3.1. Place the first movable member and the second fixed member in contact with each other, and press down the first movable member to tighten the mold.

[0021] In another embodiment, before S3.1, a first inclined surface is processed on the second fixed member, and a second inclined surface that fits the first inclined surface is processed on the first movable member.

[0022] Compared with the prior art, the present invention has the following advantages:

[0023] The semiconductor module packaging device in the present invention places a mold containing a semiconductor module to be welded on a base, and compresses the mold containing the semiconductor module to be welded by cooperating with a first fixing member, a clamping assembly, and a second fixing member, so that the parallelism of the semiconductor module after welding is very good, thereby improving the welding yield and greatly improving the welding efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments recorded in this application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0025] Figure 1 Schematic diagram of the structure of the semiconductor module packaging device of the present invention;

[0026] Figure 2 It is a schematic diagram of the partial structure of the semiconductor module and the mold in the present invention. DETAILED DESCRIPTION

[0027] The present invention will be described in detail below with reference to the various embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and any structural, methodological, or functional modifications made by a person skilled in the art based on these embodiments are all within the scope of protection of the present invention.

[0028] The present invention discloses a semiconductor module packaging device, comprising a base and a first fixing member, a clamping assembly and a second fixing member installed on the base. The base is used to place a mold with a semiconductor module to be welded. The first fixing member, the clamping assembly and the second fixing member are arranged along a first direction. The mold is located between the first fixing member and the clamping assembly. The first fixing member, the clamping assembly and the second fixing member cooperate to generate a force on the mold to compress the semiconductor module to be welded.

[0029] The present invention will be further described below with reference to specific embodiments.

[0030] Ginseng Figure 1 As shown, a semiconductor module packaging device includes a base 1, a material area 10 is provided on the base 1, and a mold 100 containing a semiconductor module to be welded is placed in the material area 10. A first trough body 11, a second trough body 12 and a third trough body 13 are opened on the base 1. The first trough body 11 and the second trough body 12 are respectively located on both sides of the material area 10. The first trough body 11, the material area 10, the second trough body 12 and the third trough body 13 are arranged in sequence along a first direction, and the first direction is the x-axis direction. The bottom of the first trough body 11 is lower than the bottom of the material area 10, the bottom of the second trough body 12 is lower than the bottom of the material area 10, and the bottom of the third trough body 13 is lower than the bottom of the second trough body 12. The material area 10 and the first trough body 11 form a step shape, and the material area 10, the second trough body 12 and the third trough body 13 form a step shape.

[0031] In this embodiment, the first groove body 11 is used to install the first fixing member 2, and the first fixing member 2 is installed in the first groove body 11 through the locking member 8. A protrusion 21 is provided on the side of the first fixing member 2. When the mold 100 is pressed, the protrusion 21 abuts against one side of the mold 100. Under the abutment of the protrusion 21, the mold 100 is partially located above the second groove body 12.

[0032] In this embodiment, the third slot 13 is used to install the second fixing member 5 , and the second fixing member 5 is installed in the third slot 13 through the locking member 8 .

[0033] In this embodiment, the second trough body 12 and the third trough body 13 are used to place the clamping assembly, and the clamping assembly includes a first movable part 3 and a second movable part 4. The first movable part 3 is placed in the third trough body 13, and the second movable part 4 is placed in the second trough body 12. The second movable part 4 can move along the first direction in the second trough body 12. The first movable part 3 is arranged in a close fit with the second fixed part 5. The first movable part 3 can move along the second fixed part 5 to loosen or clamp the mold.

[0034] Furthermore, a first inclined surface is provided on the side of the second fixing member 5 facing the mold 100, and a second inclined surface is provided on one side of the first movable member 3. The second inclined surface of the first movable member 3 and the first inclined surface of the second fixing member 5 are placed in the third groove body 13 in a fit manner. The first inclined surface and the second inclined surface are in a fit manner so that the first movable member 3 can be lifted and lowered along the inclined direction of the second inclined surface. During the lifting process, the distance between the first movable member 3 and the mold 100 gradually increases as the first movable member 3 rises along the inclined direction of the second inclined surface.

[0035] In this embodiment, the distance between the first movable part 3 and the second movable part 4 gradually decreases as the first movable part 3 descends along the inclination direction of the second inclined surface. Therefore, during the descending process of the first movable part 3, the second movable part 4 can be pushed to move toward the mold 100. The movement of the second movable part 4 cooperates with the first fixed part 2 to achieve clamping of the mold 100, and the rising of the first movable part 3 achieves the relaxation of the mold 100.

[0036] In addition, the clamping assembly also includes a mounting part 6, which is installed in cooperation with the first movable part 3, and the mounting part 6 is in line contact with the second movable part 4. A groove is provided on the side wall of the first movable part 3 facing the second movable part 4, and the mounting part 6 is embedded and fixed in the groove. The mounting part 6 is cylindrical, and the mounting part 6 is arranged vertically. Part of the mounting part 6 protrudes from the side wall and contacts the side wall of the second movable part 4 to achieve line contact. By setting the mounting part 6 to achieve line contact with the second movable part 4, the position of the semiconductor module to be welded and the welding effect are guaranteed, and the force on the semiconductor module to be welded can be balanced.

[0037] In this embodiment, the packaging device also includes a pressing block 7, which is arranged on the mold to apply a force to the semiconductor module to be welded in the second direction, where the second direction is the y-axis direction. The pressing block 7 ensures that the semiconductor module to be welded will not be bulged, skewed, etc.

[0038] The present invention also discloses a semiconductor module packaging process, comprising:

[0039] S1. Install the first fixing member 2 and the second fixing member 5 on the base 1 in sequence along the first direction. The first fixing member 2 and the second fixing member 5 are both installed on the base 1 through the locking member 8.

[0040] S2, placing the mold 100 on the base 1 between the first fixing member 2 and the second fixing member 5, and placing the semiconductor module to be welded in the mold 100, wherein Figure 2 As shown, the semiconductor module to be welded includes a tungsten-copper alloy 101, a solder sheet 102 and a chip 103. The tungsten-copper alloy 101, the solder sheet 102 and the chip 103 are placed in a mold 100 along a first direction. The tungsten-copper alloy 101 and the chip 103 are arranged alternately. The solder sheet 102 is placed between the chip 103 and the tungsten-copper alloy 101. The solder sheet 102 can be a welding consumable such as indium, gold-tin, or lead-tin.

[0041] S3. Place the pressing assembly between the mold 100 and the second fixing member 5. The pressing assembly consists of a first movable member 3 and a second movable member 4.

[0042] S4. After completing the above steps, all components are placed in a welding device to complete the welding of the semiconductor module. The welding device is a vacuum reflow oven, a common reflow oven or a heating table.

[0043] Specifically, step S3 includes:

[0044] S3.1. Place the first movable part 3 and the second fixed part 5 together, and press down the first movable part 3 to press the mold 100. The first movable part 3 can move downward by its own gravity to press the mold 100, or external force can be used to gently press down the first movable part 3.

[0045] Furthermore, step S3 also includes S3.2, placing the second movable part 4 on the base 1 between the mold 100 and the first movable part 3, and the first movable part 3 moves downward by its own gravity or moves under the slight downward pressure of an external force to push the second movable part 4 to move along the first direction to press the mold 100.

[0046] Before step S3.1, a first inclined surface is processed on the second fixed part 5, and a second inclined surface that fits the first inclined surface is processed on the first movable block 3. The first inclined surface and the second inclined surface enable the first movable part 3 to be raised and lowered along the inclined direction of the second inclined surface. During the descending process of the first movable part 3, the second movable part 4 can be pushed to move toward the mold 100. The movement of the second movable part 4 is then coordinated with the first fixed part 2 to clamp the mold 100, and the rising of the first movable part 3 realizes the loosening of the mold 100.

[0047] Before step S3.2, the mounting part 6 is fixedly installed on the first movable part 3. A groove is provided on the side wall of the first movable part 3. The groove and the second inclined surface are respectively located on both sides of the first movable part 3. The mounting part 6 is embedded in the groove. The mounting part 6 is fixed in the groove by glue or welding. The mounting part 6 is cylindrical. The mounting part 6 is vertically arranged and part of the mounting part 6 protrudes from the plane where the side wall is located, so that the mounting part 6 forms a line contact with the second movable part 4 when in contact, thereby ensuring the position of the semiconductor module to be welded and the welding effect, and balancing the force applied to the semiconductor module to be welded.

[0048] Before step S4 , the pressing block 7 is placed on the mold 100 to press the semiconductor module to be welded, ensuring that the semiconductor module to be welded does not have any bulge, tilt or other conditions.

[0049] After the semiconductor module is welded, the pressing block 7, the first movable member 3, the second movable member 4 and the mounting member 6 are removed, the semiconductor module is taken out, and the welding status is checked. At this point, the welding is completed.

[0050] It can be seen from the above technical solutions that the present invention has the following beneficial effects:

[0051] The semiconductor module packaging device in the present invention places a mold containing a semiconductor module to be welded on a base, and compresses the mold containing the semiconductor module to be welded by cooperating with a first fixing member, a clamping assembly, and a second fixing member, so that the parallelism of the semiconductor module after welding is very good, thereby improving the welding yield and greatly improving the welding efficiency.

[0052] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0053] In addition, it should be understood that although this specification is described according to embodiments, not every embodiment contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A semiconductor module packaging device, characterized in that: The packaging device includes a base and a first fixing member, a clamping assembly and a second fixing member installed on the base. The base is used to place a mold with a semiconductor module to be welded. The first fixing member, the clamping assembly and the second fixing member are arranged along a first direction. The mold is located between the first fixing member and the clamping assembly. The first fixing member, the clamping assembly and the second fixing member cooperate to generate a force on the mold to compress the semiconductor module to be welded. The clamping assembly includes a first movable member, which is fitted with the second fixing member. The first movable member can move along the second fixing member to loosen or compress the mold. The clamping assembly also includes a second movable member provided on the base. The second movable member is located between the first movable member and the mold. The second movable member can move in the first direction and relax or compress the mold under the movement of the first movable member. The clamping assembly also includes a mounting member, which is mounted in cooperation with the first movable member. The mounting member is in line contact with the second movable member. A first inclined surface is provided on the second fixing member, and a second inclined surface is provided on the first movable member. The first inclined surface is fitted with the second inclined surface so that the first movable member can be lifted and lowered along the inclined direction of the second inclined surface.

2. The semiconductor module packaging device according to claim 1, wherein: The distance between the first movable member and the mold gradually increases as the first movable member rises along the inclined direction of the second inclined surface.

3. The semiconductor module packaging device according to claim 1, wherein: The packaging device further includes a pressing block disposed on the mold so as to apply a force to the semiconductor module to be soldered in a second direction.

4. A semiconductor module packaging process, characterized in that: The process comprises: S1. Install the first fixing member and the second fixing member on the base in sequence along the first direction; S2. Place the mold on the base between the first fixing member and the second fixing member, and place the semiconductor module to be welded in the mold; S3, placing the pressing assembly between the mold and the second fixing member; S4. After completing the above steps, all components are placed in the welding equipment to complete the welding of the semiconductor module; The pressing assembly in S3 includes a first movable member and a second movable member, and S3 includes: S3.

1. Place the first movable member and the second fixed member in contact with each other, and press down on the first movable member to tighten the mold. S3.

2. Place the second movable member on the base between the mold and the first movable member. The first movable member moves downward by its own gravity or by a slight external force, thereby pushing the second movable member to move in the first direction, thereby pressing the mold. Before S3.1, a first inclined surface is machined on the second fixed member, and a second inclined surface that mates with the first inclined surface is machined on the first movable member; Before S3.2, the mounting part is fixedly installed on the first movable part, and a groove is provided on the side wall of the first movable part. The groove and the second inclined surface are respectively located on both sides of the first movable part. The mounting part is embedded in the groove. The mounting part is cylindrical, vertically arranged, and part of the mounting part protrudes from the plane where the side wall is located, so that line contact is formed when the mounting part contacts the second movable part.

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