Display device

Abstract

A display device according to an embodiment of the disclosure includes a display panel including a display area, a non-display area, and a protruding member disposed on the non-display area, and a touch sensing unit disposed on the display panel and including a touch electrode and a wiring part connected to the touch electrode. The touch sensing unit includes a first metal layer, a first insulating layer disposed on the first metal layer, a second metal layer disposed on the first insulating layer, and a plurality of contact holes disposed between the first metal layer and the second metal layer. The wiring part is formed in a double-wiring structure in which the first metal layer and the second metal layer are stacked on the non-display area, and is formed in a single-wiring structure in which any one of the first metal layer and the second metal layer is formed on the protruding member.

Description

TECHNICAL FIELD

[0001] The disclosure relates to a display device. BACKGROUND

[0002] Electronic devices such as smartphones, tablet PCs, digital cameras, notebook computers, navigation devices, and smart TVs, which provide images to users, include display devices for displaying images. The display devices include display panels that generate and display images and various input devices.

[0003] Recently, in line with the rise of smartphones or tablet PCs, touch sensing units that recognize touch inputs are being applied to display devices in large numbers. The trend is that touch sensing units are replacing existing keyboards and the like, which are physical input devices, due to the convenience of touch methods. SUMMARY

[0004] The disclosure relates to a display device including a structure of a wiring portion for improving a short defect that can occur between adjacent wiring portions in a touch sensing unit.

[0005] A display device according to an embodiment of the disclosure includes a display panel including a display area, a non-display area, and a protruding member disposed on the non-display area, and a touch sensing unit disposed on the display panel and including a touch electrode and a wiring portion connected to the touch electrode.

[0006] The touch sensing unit includes a first metal layer, a first insulating layer disposed on the first metal layer, a second metal layer disposed on the first insulating layer, and a plurality of contact holes disposed between the first metal layer and the second metal layer, the wiring portion being disposed in a double-wiring structure formed of the first metal layer and the second metal layer on the non-display area and in a single-wiring structure formed of any one of the first metal layer and the second metal layer on the protruding member.

[0007] The wiring portion can include a plurality of first touch signal lines and a plurality of second touch signal lines alternately disposed along an extension direction of the protruding member, the first touch signal lines and the second touch signal lines extending in a direction crossing the extension direction of the protruding member.

[0008] The first metal wiring of the first touch signal line formed of the first metal layer can overlap the protruding member, and the second metal wiring of the first touch signal line formed of the second metal layer can not overlap the protruding member.

[0009] The first metal wiring of the second touch signal line formed by the first metal layer can not overlap the protruding member, and the second metal wiring of the second touch signal line formed by the second metal layer can overlap the protruding member.

[0010] The width of the first metal wiring of the first touch signal line and the second touch signal line can be the same as the width of the second metal wiring.

[0011] The first metal layer and the second metal layer of the first touch signal line and the second touch signal line can be electrically connected through the contact hole.

[0012] The touch electrode can include a plurality of first touch electrodes extending in a first direction, and a second touch electrode extending in a second direction intersecting the first direction.

[0013] The first touch electrode can include a plurality of first touch sensor portions, and a plurality of first connection portions connecting the first touch sensor portions, and the second touch electrode can include a plurality of second touch sensor portions, and a plurality of second connection portions connecting the second touch sensor portions.

[0014] The first touch sensor portions, the first connection portions, and the second touch sensor portions can be formed by the second metal layer, and the second connection portions can be formed by the first metal layer.

[0015] The first touch electrode and the second touch electrode can be insulated from each other by the first insulating layer.

[0016] The protruding member can include a first protruding member configured to surround the display area, a second protruding member configured to surround the first protruding member, and a bank portion configured on one side of an outer contour of the second protruding member.

[0017] The display device can include a pad electrode configured on one side of an outer contour of the bank portion, and the wiring portion can connect the touch electrode and the pad electrode.

[0018] The second protruding member can have a height greater than a height of the first protruding member.

[0019] The touch sensing unit can further include a second insulating layer configured on the second metal layer.

[0020] A display device according to an embodiment of the present disclosure includes: a base substrate divided into a display area and a non-display area adjacent to the display area; a circuit layer disposed on the base substrate; a light emitting element layer disposed on the display area; an encapsulation layer covering the light emitting element layer; a touch sensing unit disposed above the encapsulation layer and including a touch electrode and a wiring portion connected to the touch electrode; and a protruding member disposed on the non-display area.

[0021] The touch sensing unit includes: a first metal layer; a first insulating layer disposed on the first metal layer; a second metal layer disposed on the first insulating layer; and a plurality of contact holes disposed between the first metal layer and the second metal layer, the wiring portion being disposed in a double-wiring structure formed of the first metal layer and the second metal layer on the non-display area and in a single-wiring structure formed of any one of the first metal layer and the second metal layer on the protruding member.

[0022] The wiring portion can include: a plurality of first touch signal lines and a plurality of second touch signal lines alternately disposed along an extension direction of the protruding member, the first touch signal lines and the second touch signal lines extending along a direction crossing the extension direction of the protruding member.

[0023] The first metal wiring of the first touch signal line formed of the first metal layer can overlap the protruding member, the second metal wiring of the first touch signal line formed of the second metal layer can not overlap the protruding member, the first metal wiring of the second touch signal line formed of the first metal layer can not overlap the protruding member, and the second metal wiring of the second touch signal line formed of the second metal layer can overlap the protruding member.

[0024] The first metal layer and the second metal layer of the first touch signal lines and the second touch signal lines can be electrically connected through the contact holes.

[0025] The touch sensing unit can further include: a second insulating layer disposed on the second metal layer.

[0026] The encapsulation layer can include: a first inorganic layer; a second inorganic layer; and an organic layer interposed between the first inorganic layer and the second inorganic layer.

[0027] The encapsulation layer can sequentially stack the first inorganic layer and the second inorganic layer on the protruding member.

[0028] (EFFECT OF DISCLOSURE)

[0029] A display device according to an embodiment of the disclosure, when forming a wiring portion configured to overlap with a protruding member, configures adjacent wirings in different layers from each other, thereby being able to prevent short-circuit failure between adjacent wiring portions. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 is a perspective view of a display device according to an embodiment of the disclosure.

[0031] Figure 2 is a cross-sectional view of a display device according to an embodiment of the disclosure.

[0032] Figure 3 is a plan view of a display panel according to an embodiment of the disclosure.

[0033] Figure 4 is a cross-sectional view of a display module according to an embodiment of the disclosure.

[0034] Figure 5 is an equivalent circuit diagram of a pixel according to an embodiment of the disclosure.

[0035] Figure 6 is a diagram showing a cross section of a touch sensing unit according to an embodiment of the disclosure.

[0036] Figure 7 is a plan view of a display device according to an embodiment of the disclosure.

[0037] Figures 8 to 10 is a plan view of a touch sensing unit according to an embodiment of the disclosure.

[0038] Figure 11 is a BB region of Figure 10 according to an embodiment of the disclosure.

[0039] Figure 12 is a cross-sectional view taken along Figure 7 I-I' line of according to an embodiment of the disclosure.

[0040] Figure 13 Figure 7 is a cross-sectional view taken along II-II' line of

[0041] according to an embodiment of the disclosure. Figure 14 Figure 7 is a diagram showing an AA region of

[0042] according to an embodiment of the disclosure. Figure 15 Figure 8 is a diagram showing an AA' region of

[0043] according to an embodiment of the disclosure. Figure 16This is an enlarged view illustrating an embodiment according to the present disclosure. Figure 10 The diagram of the "AA" region.

[0044] Figure 17 This is an enlarged view illustrating an embodiment according to the present disclosure. Figure 7 The diagram of region AA.

[0045] Figure 18 This is an enlarged view illustrating an embodiment according to the present disclosure. Figure 8 The diagram of region A-A'.

[0046] Figure 19 This is an enlarged view illustrating an embodiment according to the present disclosure. Figure 10 The diagram of the "AA" region.

[0047] Figure 20 This is a top view of a display device according to an embodiment of the present disclosure.

[0048] Figures 21 to 23 This is a top view of a touch sensing unit according to an embodiment of the present disclosure.

[0049] Figure 24 According to an embodiment of this disclosure, along Figure 20 A cross-sectional view taken from line III-III'.

[0050] Figure 25 According to an embodiment of this disclosure, along Figure 20 A cross-sectional view taken from the IV-IV' line.

[0051] Figure 26 This is an enlarged view illustrating an embodiment according to the present disclosure. Figure 20 The diagram of region AA.

[0052] Figure 27 This is an enlarged view illustrating an embodiment according to the present disclosure. Figure 8 The diagram of region AA'.

[0053] Figure 28 This is an enlarged view illustrating an embodiment according to the present disclosure. Figure 23 The diagram of the "AA" region.

[0054] (Explanation of reference numerals in the attached diagram)

[0055] DD: Display device

[0056] TE: Touch Electrode

[0057] TE1-1~TE1-4: First touch electrodes

[0058] TE2-1~TE2-5: Second touch electrodes

[0059] TW: Winding portion

[0060] SL1-1 to SL1-4: First touch signal lines

[0061] SL1-11 to SL1-41: First metal wires of the first touch signal lines

[0062] SL1-12 to SL1-42: Second metal wires of the first touch signal lines

[0063] SL2-1 to SL2-5: Second touch signal lines

[0064] SL2-11 to SL2-51: First metal wires of the second touch signal lines

[0065] SL2-12 to SL2-52: Second metal wires of the second touch signal lines

[0066] CH1, CH2: First and second contact holes

[0067] DAM1, DAM2: First and second protruding members

[0068] TFE: Encapsulation layer DETAILED DESCRIPTION

[0069] The same reference numerals are used to refer to the same constituent elements. Also, in the drawings, the thickness, proportions, and dimensions of the constituent elements are exaggerated for effective explanation of the technical content. "And / or" is to include all combinations of one or more of the relevant constituents.

[0070] Although the terms of first, second, and the like can be used to explain various constituent elements, the above constituent elements should not be limited by the above terms. The above terms are used only for the purpose of distinguishing one constituent element from another. For example, a first constituent element can be called a second constituent element, and similarly a second constituent element can be called a first constituent element, without departing from the scope of the disclosure. The singular expression includes the plural expression unless it is explicitly indicated otherwise in the context.

[0071] Also, the terms of "below", "lower", "above", "upper", and the like are used to explain the connection relationship of the constituents shown in the drawings. The above terms are relative concepts, and are explained based on the direction marked in the drawings.

[0072] The terms of "include" or "have" or the like should be understood as to designate the existence of the characteristics, numbers, steps, actions, constituent elements, accessories, or combinations thereof described in the specification, and do not preclude the existence or possibility of addition of one or more other characteristics, numbers, steps, actions, constituent elements, accessories, or combinations thereof.

[0073] Figure 1 is a perspective view of a display device according to an embodiment of the disclosure.

[0074] Referring to Figure 1 , a display surface IS that displays an image is parallel to a surface defined by a first direction DR1 and a second direction DR2. A normal direction of the display surface IS, i.e., a thickness direction of the display device DD indicates a third direction DR3. A front surface (or top surface) and a back surface (or bottom surface) of each component are distinguished based on the third direction DR3. However, the first direction DR1, the second direction DR2, and the third direction DR3 indicate directions that are relative concepts and can be transformed into other directions. Hereinafter, the first to third directions are directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3, respectively, and the same reference numerals are referred to.

[0075] The display surface IS of the display device DD can include a plurality of regions. The display device DD includes a display region DD-DA that displays an image, and a non-display region DD-NDA adjacent to the display region DD-DA. The non-display region DD-NDA is a region that does not display an image. For example, the display region DD-DA can be a rectangular shape. The non-display region DD-NDA can surround the display region DD-DA. However, it is not limited thereto, and the shape of the display region DD-DA and the shape of the non-display region DD-NDA can be relatively designed.

[0076] Figure 2 is a cross-sectional view of a display device according to an embodiment of the disclosure. Figure 2 shows a cross section defined by the second direction DR2 and the third direction DR3.

[0077] Referring to Figure 2 , the display device DD can include a protection film PM, a display module DM, an optical member LM, a window WM, a first adhesive member AM1, a second adhesive member AM2, and a third adhesive member AM3. The display module DM is disposed between the protection film PM and the optical member LM. The optical member LM is disposed between the display module DM and the window WM. The first adhesive member AM1 bonds the display module DM and the protection film PM, the second adhesive member AM2 bonds the display module DM and the optical member LM, and the third adhesive member AM3 bonds the optical member LM and the window WM.

[0078] The protection film PM protects the display module DM. The protection film PM provides a first outer surface OS-L exposed to the outside, and provides an adhesive surface bonded to the first adhesive member AM1. The protection film PM prevents external moisture from penetrating into the display module DM, and absorbs external impact.

[0079] The protective film PM can include a plastic film as a base substrate. The protective film PM can include a plastic film including any one selected from the group consisting of polyethersulfone (PES), polyacrylate, polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyarylate, polyimide (PI), polycarbonate (PC), poly(arylene ether sulfone), and combinations thereof.

[0080] The material constituting the protective film PM is not limited to a plastic resin, and can include an organic / inorganic composite material. The protective film PM can include a porous organic layer, and an inorganic material filled in pores of the organic layer. The protective film PM can further include a functional layer formed on the plastic film. The functional layer can include a resin layer. The functional layer can be formed by a coating method. The protective film PM can be omitted in an embodiment of the disclosure.

[0081] The window WM can protect the display module DM from external impact and provide an input surface to a user. The window WM provides a second outer surface OS-U exposed to the outside, and provides an adhesive surface adhered to the third adhesive member AM3. Figure 1 The illustrated display surface IS can be the second outer surface OS-U.

[0082] The window WM can include a plastic film. The window WM can have a multi-layer structure. The window WM can have a multi-layer structure selected from a glass substrate, a plastic film, and a plastic substrate. The window WM can further include a bezel pattern. The multi-layer structure can be formed by a continuous process or an adhesive process using an adhesive layer.

[0083] The optical member LM reduces external light reflectance. The optical member LM can include at least a polarizing film. The optical member LM can further include a phase difference film. The optical member LM can be omitted in an embodiment of the disclosure.

[0084] The display module DM can include an organic light emitting display panel DP and a touch sensing unit TS. The touch sensing unit TS is disposed on the organic light emitting display panel DP. In addition, in an embodiment, the touch sensing unit TS can also be directly disposed on the organic light emitting display panel DP. In the present specification, "directly disposed" means formed by a continuous process, except for the case of being attached using a separate adhesive layer.

[0085] The organic light emitting display panel DP generates an image corresponding to input image data. The organic light emitting display panel DP provides a first display panel face BS1-L and a second display panel face BS1-U facing in a third direction DR3. Although the organic light emitting display panel DP is illustratively explained in the present embodiment, the display panel DP is not limited thereto.

[0086] The touch sensing unit TS acquires coordinate information of an external input. The touch sensing unit TS can sense an external input in an electrostatic capacity manner.

[0087] Although not separately shown, the display module DM according to an embodiment of the present disclosure can further include an anti-reflection layer. The anti-reflection layer can include a color filter or a stacked structure of a conductive layer / insulating layer / conductive layer. The anti-reflection layer can absorb or destructively interfere with or polarize light incident from the outside to reduce external light reflectance. The anti-reflection layer can replace the function of the optical member LM.

[0088] The first, second, and third adhesive members AM1, AM2, and AM3 can each be an organic adhesive layer such as an optically clear adhesive film (OCA) or an optically clear resin (OCR) or a pressure sensitive adhesive film (PSA). The organic adhesive layer can include polyurethane-based, polyacrylate-based, polyester-based, polyepoxy-based, polyvinyl acetate-based, or the like adhesive substance.

[0089] Figure 3 is a top view of an organic light emitting display panel DP according to an embodiment of the present disclosure, Figure 4 is a cross-sectional view of a display module DM according to an embodiment of the present disclosure. For example, Figure 4 may show a portion in a cross-section under a plane parallel to a plane defined by the second direction DR2 and the third direction DR3.

[0090] Referring to Figure 3 , the organic light emitting display panel DP includes a display area DA and a non-display area NDA on a plane. The display area DA and the non-display area NDA of the organic light emitting display panel DP correspond to a display area DD-DA (refer to Figure 1 ) and a non-display area DD-NDA (refer to Figure 1 ) of the display device DD (refer to Figure 1 ), respectively. The display area DA and the non-display area NDA of the organic light emitting display panel DP do not necessarily have to correspond to the display area DD-DA (refer to Figure 1The display region DD-DA (refer to Figure 1 ) and the non-display region DD-NDA (refer to Figure 1 ) can be changed according to the structure / design of the organic light emitting display panel DP.

[0091] The organic light emitting display panel DP includes a plurality of pixels PX. A region in which the plurality of pixels PX are disposed is defined as a display region DA. In the present embodiment, a non-display region NDA can be defined along an edge of the display region DA.

[0092] The organic light emitting display panel DP includes gate lines GL, data lines DL, emission lines EL, control signal lines SL-D, initialization voltage lines SL-Vint, voltage lines SL-VDD, and a pad portion PD.

[0093] The gate lines GL are respectively connected to corresponding ones of the plurality of pixels PX, and the data lines DL are respectively connected to corresponding ones of the plurality of pixels PX. Each of the emission lines EL can be arranged in parallel with a corresponding one of the gate lines GL. The control signal lines SL-D can supply a control signal to a gate driver circuit GDC. The initialization voltage lines SL-Vint can supply an initialization voltage to the plurality of pixels PX. The voltage lines SL-VDD can be connected to the plurality of pixels PX and supply a first voltage to the plurality of pixels PX. The voltage lines SL-VDD can include a plurality of lines extending in a first direction DR1 and a plurality of lines extending in a second direction DR2.

[0094] A gate driver circuit GDC connected to the gate lines GL and the emission lines EL can be disposed at one side of the non-display region NDA. Some of the gate lines GL, the data lines DL, the emission lines EL, the control signal lines SL-D, the initialization voltage lines SL-Vint, and the voltage lines SL-VDD are disposed on the same layer, and some are disposed on different layers.

[0095] The pad portion PD can be connected to the ends of the data lines DL, the control signal lines SL-D, the initialization voltage lines SL-Vint, and the voltage lines SL-VDD.

[0096] Referring to Figure 4 , the organic light emitting display panel DP can include a base substrate SUB, a circuit layer DP-CL disposed on the base substrate SUB, an organic light emitting element layer DP-OLED disposed on the circuit layer DP-CL, and a thin film encapsulation layer TFE wrapping the organic light emitting element layer DP-OLED.

[0097] The base substrate SUB can include a plastic substrate, a glass substrate, a metal substrate, or an organic / inorganic composite material substrate, etc. The plastic substrate can include at least one of an acrylic resin, a methacrylic resin, a polyisoprene, a vinyl resin, an epoxy resin, a polyurethane resin, a cellulose resin, a siloxane resin, a polyimide resin, a polyamide resin, and a perylene resin. The base substrate SUB can be a flexible substrate. Alternatively, the base substrate SUB can be a rigid substrate.

[0098] The base substrate SUB can be divided into a display area DA and a non-display area NDA adjacent to the display area DA. The non-display area NDA can be disposed at an edge of the display area DA. However, embodiments are not limited thereto, and the non-display area NDA can be defined only at one side of the display area DA.

[0099] A circuit layer DP-CL can be disposed on the base substrate SUB. The circuit layer DP-CL can be disposed on the display area DA and the non-display area NDA of the base substrate SUB. Although not distinguished in the drawings, the circuit layer DP-CL can include at least one pixel insulating layer, a plurality of conductive layers, and a semiconductor layer. The plurality of conductive layers of the circuit layer DP-CL can constitute a signal line or a driving circuit of a pixel.

[0100] A light emitting element layer DP-OLED can include an organic light emitting diode. The light emitting element layer DP-OLED can be disposed on the display area DA. As for the organic light emitting diode, detailed descriptions are made in the description of the organic light emitting diode described later. Figure 15

[0101] An encapsulation layer TFE can be disposed on the light emitting element layer DP-OLED. The encapsulation layer TFE can wrap the light emitting element layer DP-OLED. The encapsulation layer TFE can cover and seal the light emitting element layer DP-OLED. The encapsulation layer TFE can include an inorganic layer and an organic layer. The encapsulation layer TFE can include at least two inorganic layers and an organic layer disposed therebetween. The inorganic layer protects the light emitting element layer DP-OLED from moisture / oxygen, and the organic layer protects the light emitting element layer DP-OLED from foreign substances such as dust particles. The inorganic layer can include a silicon nitride layer, a silicon oxynitride layer, and a silicon oxide layer, etc. The organic layer can include an acrylic organic substance, but is not limited thereto. The inorganic layer can be provided by an evaporation method, and the organic layer can be provided using a coating process, but embodiments are not limited thereto.

[0102] ​The touch sensing unit TS is disposed on the encapsulation layer TFE. The touch sensing unit TS can also be directly disposed on the encapsulation layer TFE. However, it is not limited thereto, and can also be that an inorganic layer is disposed on the encapsulation layer TFE, and the touch sensing unit TS is disposed on the inorganic layer. The inorganic layer can be a buffer layer. The inorganic layer can be at least one of a silicon nitride layer, a silicon oxynitride layer, and a silicon oxide layer. However, this is exemplary, and the embodiments are not limited thereto. In addition, the buffer layer can be an organic layer. Although it is described that the buffer layer is a separate configuration, the buffer layer can be a configuration included in the encapsulation layer TFE.

[0103] The touch sensing unit TS includes a touch sensor and a touch signal line. The touch sensor and the touch signal line can have a single layer or a multi-layer structure.

[0104] The touch sensor and the touch signal line can include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), poly 3,4-ethylenedioxythiophene (PEDOT), metal nanowire, graphene. The touch sensor and the touch signal line can include a metal layer, such as molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The touch sensor and the touch signal line can have the same layer structure, or have different layer structures. The specific contents of the touch sensing unit TS are described later.

[0105] Figure 5 is an equivalent circuit diagram of a pixel PX according to an embodiment of the disclosure. In Figure 5 , an i-th pixel PXij connected to a j-th data line Dj among a plurality of data lines DL (refer to Figure 3 ) is exemplarily shown. Here, i and j can each be a positive integer.

[0106] Referring to Figure 5 , the pixel PXij can include transistors T1, T2, T3, T4, T5, T6, T7, a storage capacitor Cst, and an organic light emitting diode OLED.

[0107] Although the transistors according to an embodiment of the disclosure are illustrated as P-type transistors, a person skilled in the art can configure a pixel circuit having the same function with N-type transistors.

[0108] The storage capacitor Cst can have one electrode connected to a first power voltage line ELVDD, and the other electrode connected to a gate electrode of the transistor T1.

[0109] The transistor Tl can have one electrode connected to another electrode of the transistor T5, another electrode connected to one electrode of the transistor T6, and a gate electrode connected to another electrode of the storage capacitor Cst. The transistor Tl can be referred to as a driver transistor. The transistor Tl determines an amount of a drive current flowing between the first power supply voltage line ELVDD and the second power supply voltage line ELVSS in accordance with a potential difference between the gate electrode and the source electrode.

[0110] The transistor T2 can have one electrode connected to the data line Dj, another electrode connected to one electrode of the transistor Tl, and a gate electrode connected to the current scan line Si. The transistor T2 can be referred to as a switching transistor, a scan transistor, a gate transistor, or the like. If a scan signal at an on level is applied to the current scan line Si, the transistor T2 introduces a data voltage of the data line Dj to the pixel PXij.

[0111] The transistor T3 has one electrode connected to another electrode of the transistor Tl, another electrode connected to the gate electrode of the transistor Tl, and a gate electrode connected to the current scan line Si. If a scan signal at an on level is applied to the current scan line Si, the transistor T3 causes the transistor Tl to be connected in a diode form.

[0112] The transistor T4 has one electrode connected to the gate electrode of the transistor Tl, another electrode connected to the initialization voltage line VINT, and a gate electrode connected to the previous scan line S(i-1). In other embodiments, the gate electrode of the transistor T4 can be connected to another scan line. If a scan signal at an on level is applied to the previous scan line S(i-1), the transistor T4 transmits an initialization voltage to the gate electrode of the transistor Tl, which initializes an amount of charge of the gate electrode of the transistor Tl.

[0113] The transistor T5 has one electrode connected to the first power supply voltage line ELVDD, another electrode connected to one electrode of the transistor Tl, and a gate electrode connected to the emission line Ei. The transistor T6 has one electrode connected to another electrode of the transistor Tl, another electrode connected to the anode of the organic light emitting diode OLED, and a gate electrode connected to the emission line Ei. The transistors T5 and T6 can be referred to as emission transistors. If an emission signal at an on level is applied, the transistors T5 and T6 form a drive current path between the first power supply voltage line ELVDD and the second power supply voltage line ELVSS, which causes the organic light emitting diode OLED to emit light.

[0114] The transistor T7 has one electrode connected to the anode of the organic light emitting diode OLED, another electrode connected to the initialization voltage line VINT, and a gate electrode connected to the current scan line Si. In other embodiments, the gate electrode of the transistor T7 can also be connected to other scan lines. For example, the gate electrode of the transistor T7 can also be connected to the previous scan line S(i-1) or a scan line before it, the next scan line (the i+1th scan line) or a scan line after it. If a scan signal at the on level is applied to the current scan line Si, the transistor T7 transmits the initialization voltage to the anode of the organic light emitting diode OLED, so that the amount of charge accumulated in the organic light emitting diode OLED is initialized.

[0115] The organic light emitting diode OLED has one electrode connected to the other electrode of the transistor T6 and the other electrode connected to the second power voltage line ELVSS.

[0116] Figure 6 FIG. 1 is a diagram illustrating a cross section of a touch sensing unit included in a display device according to an embodiment of the disclosure.

[0117] Referring to Figure 6 The touch sensing unit TS can include a first conductive layer TS-CL1, a first insulating layer TS-IL1, a second conductive layer TS-CL2, and a second insulating layer TS-IL2. The first conductive layer TS-CL1 can be disposed directly on the encapsulation layer TFE. However, embodiments are not limited thereto, and another inorganic layer (e.g., a buffer layer) can be further disposed between the first conductive layer TS-CL1 and the encapsulation layer TFE.

[0118] The first conductive layer TS-CL1 and the second conductive layer TS-CL2 each can have a single layer structure or a multi-layer structure stacked along a third direction DR3. The conductive layer of the multi-layer structure can include two or more layers of a transparent conductive layer and a metal layer. The conductive layer of the multi-layer structure can include metal layers including different metals from each other. The transparent conductive layer can include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), poly 3,4-ethylenedioxythiophene (PEDOT), metal nanowire, graphene. The metal layer can include molybdenum, silver, titanium, copper, aluminum, and alloys thereof.

[0119] The first conductive layer TS-CL1 and the second conductive layer TS-CL2 each include a plurality of patterns. Hereinafter, it is described that the first conductive layer TS-CL1 includes a first conductive pattern and the second conductive layer TS-CL2 includes a second conductive pattern. The first conductive pattern and the second conductive pattern each can include a touch electrode and a touch signal line.

[0120] The first insulating layer TS-IL1 and the second insulating layer TS-IL2 each can include inorganic matter or organic matter. The inorganic matter can include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. The organic matter can include at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, polyurethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin, and perylene resin.

[0121] The first insulating layer TS-IL1 and the second insulating layer TS-IL2 each can have a single layer or a multi-layer structure. The first insulating layer TS-IL1 and the second insulating layer TS-IL2 each can have at least one of an inorganic layer and an organic layer. The inorganic layer and the organic layer can be formed by a chemical vapor deposition method. On the other hand, the stack structure of the touch sensing unit is not limited to the structure shown in the drawing. For example, the second insulating layer TS-IL2 of the touch sensing unit can be omitted. Figure 6

[0122] The first insulating layer TS-IL1 can insulate the first conductive layer TS-CL1 and the second conductive layer TS-CL2, and the shape thereof is not limited. The shape of the first insulating layer TS-IL1 can be changed according to the shape of the first conductive pattern and the second conductive pattern. The first insulating layer TS-IL1 can entirely cover the encapsulation layer TFE, or include a plurality of insulating patterns. The plurality of insulating patterns can overlap the first connection part CP1 or the second connection part CP2 described later.

[0123] Although a two-layer type touch sensing unit is exemplarily shown in the present embodiment, it is not limited thereto. A single-layer type touch sensing unit includes a conductive layer and an insulating layer covering the conductive layer. The conductive layer includes a touch sensor and a wiring part connected to the touch sensor. The single-layer type touch sensing unit can acquire coordinate information by a self-capacitance method.

[0124] Figure 7 is a top view of a display device according to an embodiment of the disclosure. Figures 8 to 10 is a top view of a touch sensing unit according to an embodiment of the disclosure.

[0125] Referring to Figure 4 and Figure 7 ​The display device DD of one embodiment can include a substrate SUB, a circuit layer DP-CL, a light-emitting element layer DP-OLED, a sealing layer TFE, and a touch sensor TS and a protruding member DAM disposed on the sealing layer TFE. The organic light-emitting display panel DP can include a substrate SUB, a circuit layer DP-CL, a light-emitting element layer DP-OLED, and a sealing layer TFE. The display device DD of one embodiment can include the organic light-emitting display panel DP, the touch sensor TS, and the protruding member DAM.

[0126] As for the organic light-emitting display panel DP, the above-described content can be applied as it is in the description of the Figure 4 The display device DD of one embodiment can include a substrate SUB divided into a display region DA and a non-display region NDA. The display device DD of one embodiment can include a circuit layer DP-CL disposed on the substrate SUB and a light-emitting element layer DP-OLED disposed on the display region DA of the substrate SUB. The sealing layer TFE can be disposed so as to cover the light-emitting element layer DP-OLED.

[0127] Further, the protruding member DAM can be disposed on the non-display region NDA of the substrate SUB. At least one protruding member DAM can be disposed on the non-display region NDA. For example, one protruding member DAM can be disposed on the non-display region NDA, or two or more protruding members DAM can be disposed thereon. Further, when the protruding member DAM is disposed on the non-display region NDA, one protruding member DAM can be disposed in part of the non-display region NDA and a plurality of protruding members DAM can be disposed in the remaining part. Further, even in the case where a plurality of protruding members DAM are disposed, the number of the disposed protruding members DAM can be changed depending on the position of the non-display region NDA. Further, the sealing layer TFE can be disposed so as to cover the protruding member DAM and extend to the non-display region NDA of the substrate SUB.

[0128] The sealing layer TFE covering the protruding member DAM can be composed only of an inorganic thin film in which an organic thin film is omitted. However, embodiments are not limited thereto, and the sealing layer TFE can include both the inorganic thin film and the organic thin film disposed between the inorganic thin films in the portion covering the protruding member DAM. Further, when a plurality of protruding members DAM are disposed, the sealing layer TFE wrapping the first protruding member DAM1 closer to the display region DA can include the organic thin film disposed between the inorganic thin films. In contrast, the sealing layer TFE wrapping the second protruding member DAM2 disposed on the outer contour of the first protruding member DAM1 can be composed only of the inorganic thin film.

[0129] The protruding member DAM can be disposed on the non-display area NDA. The protruding member DAM can be disposed on the outer contour of the display area DA. The protruding member DAM can be disposed around the display area DA. The protruding member DAM can include a first protruding member DAM1 disposed in close proximity to the display area DA, and a second protruding member DAM2 disposed on the outer contour of the first protruding member DAM1. The thickness of the second protruding member DAM2 along the third direction DR3 can be greater than that of the first protruding member DAM1. For example, the first protruding member DAM1 can prevent an organic monomer formed by coating an organic thin film from flowing to the outside.

[0130] The protruding member DAM can be formed of a plurality of layers. For example, the first protruding member DAM1 can be laminated with two layers, and the second protruding member DAM2 can be laminated with three layers. On the other hand, in an embodiment, the protruding member DAM can be formed of a single layer. Figure 7 The protruding member DAM is shown as being disposed to surround the entire display area DA in Embodiment 1. However, embodiments are not limited thereto. For example, the protruding member DAM can be disposed to surround at least one side of the display area DA.

[0131] Although not shown in Embodiment 1, the display device of an embodiment can further include a side protruding member (not shown) disposed on the non-display area NDA of the base substrate SUB. The side protruding member (not shown) can be disposed on the outer contour of the second protruding member DAM2. For example, the side protruding member (not shown) can be disposed by extending from the outer contour of the second protruding member DAM2 along the first direction DR1. The side protruding member (not shown) can absorb an impact when an external stimulus is applied, thereby playing a crack prevention function of preventing the impact from being transmitted to the display area side. Figure 7 In addition, the display device of an embodiment can further include a bank BK disposed on the outer contour of the second protruding member DAM2 and disposed in close proximity to the touch pad TS-PD. On the other hand, the bank BK can be a third protruding member disposed on the outer contour of the second protruding member DAM2 and disposed by extending along the second direction DR2. The bank BK can play a spacing function so that a mask used in a manufacturing process of the organic light emitting display panel DP and the touch sensing unit TS does not directly contact the configuration of the organic light emitting display panel DP or the touch sensing unit TS. The thickness of the bank BK can be greater than the thickness of the first protruding member DAM1 or the second protruding member DAM2.

[0132] In an embodiment, the bank BK can be omitted. In addition, in an embodiment, either one of the side protruding member (not shown) and the bank BK can be omitted.

[0133]

[0134] ​The touch sensing unit TS can be disposed on the encapsulation layer TFE. The touch sensing unit TS can include touch electrodes TE1-1, TE1-2, TE1-3, TE1-4, TE2-1, TE2-2, TE2-3, TE2-4, TE2-5, and a wiring portion TW. The touch electrodes TE1-1, TE1-2, TE1-3, TE1-4, TE2-1, TE2-2, TE2-3, TE2-4, TE2-5 can be disposed on the encapsulation layer TFE of the display area DA, and the wiring portion TW can be disposed on the non-display area NDA by being connected to the touch electrodes TE1-1, TE1-2, TE1-3, TE1-4, TE2-1, TE2-2, TE2-3, TE2-4, TE2-5. A region of the wiring portion TW can be disposed on the protruding member DAM. The wiring portion TW can be disposed on the protruding member DAM along the step of the protruding member DAM. The wiring portion TW can extend from the touch electrodes TE1-1, TE1-2, TE1-3, TE1-4, TE2-1, TE2-2, TE2-3, TE2-4, TE2-5 and be connected to the touch pad TS-PD.

[0135] In Figure 7 a plan view, the touch sensing unit TS can include first touch electrodes TE1-1, TE1-2, TE1-3, TE1-4, first touch signal lines SL1-1, SL1-2, SL1-3, SL1-4 connected to the first touch electrodes TE1-1, TE1-2, TE1-3, TE1-4, second touch electrodes TE2-1, TE2-2, TE2-3, TE2-4, TE2-5, and second touch signal lines SL2-1, SL2-2, SL2-3, SL2-4, SL2-5 connected to the second touch electrodes TE2-1, TE2-2, TE2-3, TE2-4, TE2-5.

[0136] On the other hand, in Figure 7 , the first touch signal lines SL1-1, SL1-2, SL1-3, SL1-4 and the second touch signal lines SL2-1, SL2-2, SL2-3, SL2-4, SL2-5 correspond to the wiring portion TW of the present disclosure, which are connected between the touch electrodes TE and the touch pad TS-PD.

[0137] Referring to Figures 8 to 10The wiring portion TW can be a double-wiring structure in which the first metal wiring SL1-11, SL1-21, SL1-31, SL1-41, SL2-11, SL2-21, SL2-31, SL2-41, SL2-51 and the second metal wiring SL1-12, SL1-22, SL1-32, SL1-42, SL2-12, SL2-22, SL2-32, SL2-42, SL2-52 are laminated.

[0138] For example, the first touch signal line SL1-1, SL1-2, SL1-3, SL1-4 can include the first metal wiring SL1-11, SL1-21, SL1-31, SL1-41 and the second metal wiring SL1-12, SL1-22, SL1-32, SL1-42, and the second touch signal line SL2-1, SL2-2, SL2-3, SL2-4, SL2-5 can include the first metal wiring SL2-11, SL2-21, SL2-31, SL2-41, SL2-51 and the second metal wiring SL2-12, SL2-22, SL2-32, SL2-42, SL2-52. In addition, the first insulating layer TS-IL1 can be interposed between the first metal wiring SL1-11, SL1-21, SL1-31, SL1-41, SL2-11, SL2-21, SL2-31, SL2-41, SL2-51 and the second metal wiring SL1-12, SL1-22, SL1-32, SL1-42, SL2-12, SL2-22, SL2-32, SL2-42, SL2-52, and the plurality of second contact holes CH2 can be formed in the first insulating layer TS-IL1.

[0139] The first metal wiring SL1-11, SL1-21, SL1-31, SL1-41, SL2-11, SL2-21, SL2-31, SL2-41, SL2-51 can be disposed on the package layer TFE, and the first insulating layer TS-IL1 can be interposed between the first metal wiring SL1-11, SL1-21, SL1-31, SL1-41, SL2-11, SL2-21, SL2-31, SL2-41, SL2-51 and the second metal wiring SL1-12, SL1-22, SL1-32, SL1-42, SL2-12, SL2-22, SL2-32, SL2-42, SL2-52.

[0140] In addition, a plurality of second contact holes CH2 can be provided between the first metal wiring SL1-11, SL1-21, SL1-31, SL1-41, SL2-11, SL2-21, SL2-31, SL2-41, SL2-51 and the second metal wiring SL1-12, SL1-22, SL1-32, SL1-42, SL2-12, SL2-22, SL2-32, SL2-42, SL2-52. The second contact hole CH2 can electrically connect the first metal wiring SL1-11, SL1-21, SL1-31, SL1-41, SL2-11, SL2-21, SL2-31, SL2-41, SL2-51 and the second metal wiring SL1-12, SL1-22, SL1-32, SL1-42, SL2-12, SL2-22, SL2-32, SL2-42, SL2-52. The second contact hole CH2 can be formed to penetrate the first insulating layer TS-IL1.

[0141] In a case where the wiring portion TW is formed in a double-wiring structure in which the first metal wiring SL1-11, SL1-21, SL1-31, SL1-41, SL2-11, SL2-21, SL2-31, SL2-41, SL2-51 and the second metal wiring SL1-12, SL1-22, SL1-32, SL1-42, SL2-12, SL2-22, SL2-32, SL2-42, SL2-52 are laminated, it is possible to reduce the resistance of the wiring portion TW.

[0142] The touch electrode TE can be any one of the first touch electrode TE1-1, TE1-2, TE1-3, TE1-4 or the second touch electrode TE2-1, TE2-2, TE2-3, TE2-4, TE2-5.

[0143] Although the touch sensing unit TS including four first touch electrodes TE1-1, TE1-2, TE1-3, TE1-4 and five second touch electrodes TE2-1, TE2-2, TE2-3, TE2-4, TE2-5 is exemplarily shown in Figure 7 Embodiments are not limited thereto.

[0144] Each of the first touch electrodes TE1-1, TE1-2, TE1-3, TE1-4 can have a mesh shape in which a plurality of touch opening portions are defined. Each of the first touch electrodes TE1-1, TE1-2, TE1-3, TE1-4 includes a plurality of first touch sensor portions SP1 and a plurality of first connection portions CP1. The first touch sensor portions SP1 are arranged in a first direction DR1. Each of the first connection portions CP1 connects two of the first touch sensor portions SP1 adjacent to each other.

[0145] The second touch electrodes TE2-1, TE2-2, TE2-3, TE2-4, TE2-5 cross the first touch electrodes TE1-1, TE1-2, TE1-3, TE1-4 insulatively. Each of the second touch electrodes TE2-1, TE2-2, TE2-3, TE2-4, TE2-5 can have a mesh shape in which a plurality of touch opening portions are defined. Each of the second touch electrodes TE2-1, TE2-2, TE2-3, TE2-4, TE2-5 includes a plurality of second touch sensor portions SP2 and a plurality of second connection portions CP2. The second touch sensor portions SP2 are arranged along the second direction DR2. Each of the second connection portions CP2 connects two of the second touch sensor portions SP2 adjacent to each other. The second touch signal lines SL2-1, SL2-2, SL2-3, SL2-4, SL2-5 can also have a mesh shape.

[0146] The first touch electrodes TE1-1, TE1-2, TE1-3, TE1-4 are electrostatically coupled to the second touch electrodes TE2-1, TE2-2, TE2-3, TE2-4, TE2-5. With a touch sensing signal applied to the first touch electrodes TE1-1, TE1-2, TE1-3, TE1-4, a capacitor is formed between the first touch sensor portions SP1 and the second touch sensor portions SP2.

[0147] It can be that one part of the plurality of first touch sensor portions SP1, the plurality of first connection portions CP1, and the first touch signal lines SL1-1, SL1-2, SL1-3, SL1-4, one part of the plurality of second touch sensor portions SP2, the plurality of second connection portions CP2, and the second touch signal lines SL2-1, SL2-2, SL2-3, SL2-4, SL2-5 are patterned from the first conductive layer TS-CL1 shown in FIG. 1A, and the other part is patterned from the second conductive layer TS-CL2 shown in FIG. 1A. Figure 8 It can be that one part of the plurality of first touch sensor portions SP1, the plurality of first connection portions CP1, and the first touch signal lines SL1-1, SL1-2, SL1-3, SL1-4, one part of the plurality of second touch sensor portions SP2, the plurality of second connection portions CP2, and the second touch signal lines SL2-1, SL2-2, SL2-3, SL2-4, SL2-5 are patterned from the first conductive layer TS-CL1 shown in FIG. 1A, and the other part is patterned from the second conductive layer TS-CL2 shown in FIG. 1A. Figure 8 It can be that one part of the plurality of first touch sensor portions SP1, the plurality of first connection portions CP1, and the first touch signal lines SL1-1, SL1-2, SL1-3, SL1-4, one part of the plurality of second touch sensor portions SP2, the plurality of second connection portions CP2, and the second touch signal lines SL2-1, SL2-2, SL2-3, SL2-4, SL2-5 are patterned from the first conductive layer TS-CL1 shown in FIG. 1A, and the other part is patterned from the second conductive layer TS-CL2 shown in FIG. 1A.

[0148] In order to electrically connect the conductive patterns arranged on the other layer, a through-hole Figure 9 A plurality of first contact holes CH1 of the first insulating layer TS-IL1 shown in FIG. 1A are formed. Hereinafter, with reference to FIG. 1B, the first contact holes CH1 will be described. Figures 8 to 10 A touch sensing unit TS according to an embodiment will be described. In the following description, the touch sensing unit TS is described with reference to the display panel 100 shown in FIG. 1A. Figures 8 to 10 In the display panel 100 shown in FIG. 1A, the first protruding member DAM1, the second protruding member DAM2, and the third protruding member BK can be arranged in the non-display area NDA.

[0149] As shown in FIG. 1A, the display panel 100 includes a plurality of first touch electrodes TE1-1, TE1-2, TE1-3, TE1-4, a plurality of second touch electrodes TE2-1, TE2-2, TE2-3, TE2-4, TE2-5, and a plurality of touch signal lines SL1-1, SL1-2, SL1-3, SL1-4, SL2-1, SL2-2, SL2-3, SL2-4, SL2-5. Figure 8As shown, a first conductive pattern is disposed on the TFE encapsulation layer. The first conductive pattern may include a bridging pattern CP2, first metal wirings SL1-11, SL1-21, SL1-31, and SL1-41 for the first touch signal lines SL1-1, SL1-2, SL1-3, and SL1-4, and first metal wirings SL2-11, SL2-21, SL2-31, SL2-41, and SL2-51 for the second touch signal lines SL2-1, SL2-2, SL2-3, SL2-4, and SL2-5. The bridging pattern CP2 is directly disposed on the TFE encapsulation layer. The bridging pattern CP2 corresponds to... Figure 7 The second connecting part CP2 is shown.

[0150] like Figure 9 As shown, a first insulating layer TS-IL1 covering the bridging pattern CP2 is disposed on the TFE encapsulation layer. Multiple second contact holes CH2 can be formed in the first insulating layer TS-IL1, which partially expose the bridging pattern CP2, the first metal wirings SL1-11, SL1-21, SL1-31, and SL1-41 of the first touch signal lines SL1-1, SL1-2, SL1-3, and SL1-4, and the first metal wirings SL2-11, SL2-21, SL2-31, SL2-4, and SL2-51 of the second touch signal lines SL2-1, SL2-2, SL2-3, SL2-4, and SL2-5. The second contact holes CH2 can be formed by photolithography.

[0151] like Figure 10 As shown, a second conductive pattern can be configured on the first insulating layer TS-IL1. The second conductive pattern may include multiple first touch sensor units SP1, multiple first connection units CP1, and second metal wiring SL1-12, SL1-22, SL1-32, SL1-42 of the first touch signal lines SL1-1, SL1-2, SL1-3, SL1-4; multiple second touch sensor units SP2, and second metal wiring SL2-12, SL2-22, SL2-32, SL2-4, SL2-52 of the second touch signal lines SL2-1, SL2-2, SL2-3, SL2-4, SL2-5. Although not shown separately, a second insulating layer TS-IL2 covering the second conductive pattern can be configured on the first insulating layer TS-IL1.

[0152] exist Figures 7 to 10In the embodiment shown in FIG. 1, the protruding members DAM can be arranged in the non-display area NDA, and the first protruding member DAM1 and the second protruding member DAM2 can be arranged around the touch electrodes TE1-1, TE1-2, TE1-3, TE1-4, TE2-1, TE2-2, TE2-3, TE2-4, and TE2-5 arranged in the display area DA. In addition, although the wiring portion TW is shown as passing only through the protruding member DAM adjacent to the touch pad TS-PD, the embodiment is not limited thereto. The wiring portion TW can also be arranged to pass through not only the portion adjacent to the touch pad TS-PD but also other portions of the protruding member DAM. For example, the second touch signal lines SL2-1, SL2-2, SL2-3, SL2-4, and SL2-5, which are the wiring portion TW, can also be arranged to pass through at least one of the first protruding member DAM1 and the second protruding member DAM2 extending in the first direction DR1. On the other hand, the bank BK can be arranged as a third protruding member on the outer side of the second protruding member DAM2, and the wiring portion TW can pass through the bank BK to be connected to the touch pad TS-PD.

[0153] In addition, in an embodiment of the present disclosure, the first conductive pattern and the second conductive pattern can be replaced with each other. That is, the second conductive pattern can include the bridge pattern CP2.

[0154] As described above, when the wiring portion TW is arranged on the non-display area NDA, the first metal wiring SL1-11, SL1-21, SL1-31, SL1-41, SL2-11, SL2-21, SL2-31, SL2-41, and SL2-51 and the second metal wiring SL1-12, SL1-22, SL1-32, SL1-42, SL2-12, SL2-22, SL2-32, SL2-42, and SL2-52 can be formed in a double-wiring structure in which the layers are stacked. However, in the case where the wiring portion TW is arranged on the protruding member DAM, a short can occur between adjacent wirings in a photolithography process due to a step between the protruding member DAM and the remaining area of the non-display area NDA. In order to prevent this, the wiring portion TW can be formed in a single-wiring structure in which only any one of the first metal wiring SL1-11, SL1-21, SL1-31, SL1-41, SL2-11, SL2-21, SL2-31, SL2-41, and SL2-51 and the second metal wiring SL1-12, SL1-22, SL1-32, SL1-42, SL2-12, SL2-22, SL2-32, SL2-42, and SL2-52 is arranged on the protruding member DAM. Regarding the wiring portion TW arranged on the protruding member DAM, the first metal wiring SL1-11, SL1-21, SL1-31, SL1-41, SL2-11, SL2-21, SL2-31, SL2-41, and SL2-51 and the second metal wiring SL1-12, SL1-22, SL1-32, SL1-42, SL2-12, SL2-22, SL2-32, SL2-42, and SL2-52 can be formed in a single-wiring structure in which only any one of the metal wirings is arranged on the protruding member DAM. Figures 12 to 16 A detailed description will be given.

[0155] Figure 11 is a partial enlarged view of a BB region of Figure 10

[0156] Referring to Figure 11 , the first touch sensor portion SP1 overlaps with the non-light emitting region NPXA. The first touch sensor portion SP1 includes a plurality of first extension portions SP1-A extending along a fifth direction DR5 intersecting the first direction DR1 and the second direction DR2, and a plurality of second extension portions SP1-B extending along a sixth direction DR6 intersecting the fifth direction DR5. The plurality of first extension portions SP1-A and the plurality of second extension portions SP1-B can be defined as mesh lines. A line width of the mesh lines can be several micrometers.

[0157] The plurality of first extension portions SP1-A and the plurality of second extension portions SP1-B are connected to each other to form a plurality of touch opening portions TS-OP. In other words, the first touch sensor portion SP1 has a mesh shape having the plurality of touch opening portions TS-OP. Although the touch opening portions TS-OP are illustrated to correspond one-to-one to the light emitting regions PXA, the disclosure is not limited thereto. One touch opening portion TS-OP can correspond to two or more light emitting regions PXA.

[0158] The size of the light emitting regions PXA can be various. For example, the size of the light emitting regions PXA in which blue light is provided and the light emitting regions PXA in which red light is provided can be different. Accordingly, the size of the touch opening portions TS-OP can also be various. Although the size of the light emitting regions PXA is exemplarily illustrated to be various in Figure 11 , the disclosure is not limited thereto. The size of the light emitting regions PXA can be the same as each other, and the size of the touch opening portions TS-OP can also be the same as each other.

[0159] Figure 12 is a cross-sectional view taken along the I-I' line of Figure 7 . Figure 13 is a cross-sectional view taken along the II-II' line of Figure 7 .

[0160] Referring to Figure 5 , Figure 12 and Figure 13 , a pixel PXij is provided in the display region DA. Each pixel PXij can include a transistor connected to a corresponding wiring in a data line DL, a light emitting element connected to the transistor, and a capacitor Cst. The transistor can correspond to a drive transistor for controlling the light emitting element, a switching transistor for switching the drive transistor, or the like.

[0161] ​For the convenience of explanation, one transistor, one light emitting element, and one capacitor Cst are exemplarily shown with respect to one pixel PXij.

[0162] The base substrate SUB can be composed of an insulating material such as glass, resin, or the like. In addition, the base substrate SUB can be composed of a material having flexibility to be able to be bent or folded, and can have a single-layer structure or a multi-layer structure.

[0163] The buffer film BF can cover the base substrate SUB. The buffer film BF can prevent impurities from diffusing into the channel CH of the transistor. The buffer film BF can be an inorganic insulating film composed of an inorganic material. For example, the buffer film BF can be formed of silicon nitride, silicon oxide, silicon oxynitride, or the like, and can be omitted depending on the material of the base substrate SUB and the process conditions. According to the embodiment, a barrier layer can also be provided.

[0164] The active film can be located on the buffer film BF. The active film can be doped and patterned to constitute the channel CH, the source region, and the drain region of the transistor, or to constitute a wiring. The active film can be formed of a semiconductor material. The active film can be a semiconductor pattern composed of polysilicon, amorphous silicon, an oxide semiconductor, or the like. The channel CH is a semiconductor pattern which is not doped with impurities, and can be an intrinsic semiconductor. The source region, the drain region, and the wiring can be semiconductor patterns doped with impurities. As the impurities, n-type impurities, p-type impurities, other metals, or the like can be used.

[0165] The first gate insulating film GI1 can cover the channel CH and other active films. The first gate insulating film GI1 can be an inorganic insulating film composed of an inorganic material. As the inorganic material, polysiloxane, silicon nitride, silicon oxide, silicon oxynitride, or the like can be used.

[0166] The gate electrode GE of the transistor and the lower electrode LE of the capacitor can be located on the first gate insulating layer GI1. The gate electrode GE can overlap with a region corresponding to the channel CH.

[0167] The gate electrode GE and the lower electrode LE can be composed of a metal. For example, the gate electrode GE can be composed of at least one of gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), or an alloy of the metals. In addition, the gate electrode GE can be formed of a single-layer film, but is not limited thereto, and can be formed of a multi-layer film in which two or more of the metal and the alloy are stacked.

[0168] The second gate insulating film GI2 can cover the gate electrode GE and the lower electrode LE of the capacitor. The second gate insulating film GI2 can be an inorganic insulating film made of inorganic materials. As inorganic materials, polysiloxanes, silicon nitrides, silicon oxides, silicon oxynitrides, etc. can be used.

[0169] The upper electrode UE of the capacitor can be located on the second gate insulating film GI2. The upper electrode UE of the capacitor can be made of metal. For example, the upper electrode UE of the capacitor can be made of at least one of the metals such as gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy of metals. In addition, the upper electrode UE of the capacitor can be formed of a single layer film, but is not limited to this, and can be formed of a multilayer film of two or more substances selected from metals and alloys.

[0170] The lower electrode LE and the upper electrode UE of the capacitor can be positioned between the second gate insulating film GI2 to form the capacitor Cst. Although in Figure 5 The capacitor Cst is shown as a two-layer electrode structure consisting of a lower electrode LE and an upper electrode UE. However, in other embodiments, the capacitor Cst may also be composed of a three-layer electrode structure using an active film, or a three-layer electrode structure using electrodes of the same layer as the source electrode SE / drain electrode DE, or a four- or more-layer electrode structure.

[0171] Interlayer insulating film (ILD) can cover the upper electrode (UE) of a capacitor. ILD can be an inorganic insulating film composed of inorganic materials. Suitable inorganic materials include polysiloxanes, silicon nitrides, silicon oxides, and silicon oxynitrides.

[0172] The source electrode SE and drain electrode DE of the transistor can be located on the interlayer insulating film ILD. The source electrode SE and drain electrode DE can contact the source region and drain region of the active film, respectively, through contact holes formed in the interlayer insulating film ILD, the second gate insulating film GI2, and the first gate insulating film GI1.

[0173] The source electrode SE and drain electrode DE can be made of metal. For example, the source electrode SE and drain electrode DE can be made of at least one of the following metals or an alloy of metals: gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu).

[0174] Passivation films (PSVs) can cover the source electrode (SE) and drain electrode (DE) of a transistor. PSVs can be inorganic insulating films made of inorganic materials. Suitable inorganic materials include polysiloxanes, silicon nitrides, silicon oxides, and silicon oxynitrides.

[0175] The first via membrane, VIA1, can cover a passivation film PSV or a transistor. The first via membrane, VIA1, can be an organic insulating film composed of organic materials. As organic materials, organic insulating substances such as polyacrylate compounds, polyimide compounds, fluorocarbon compounds like polytetrafluoroethylene, and benzocyclobutene compounds can be used. Organic films can be deposited by methods such as evaporation.

[0176] The connection pattern CNP can be connected to the source electrode SE or drain electrode DE of the transistor through the opening of the first via film VIA1. The connection pattern CNP can be made of at least one of the following metals or an alloy of metals: gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu).

[0177] The second perforated membrane VIA2 can cover the first perforated membrane VIA1 and the connecting pattern CNP. The second perforated membrane VIA2 can be an organic insulating film made of organic materials. As organic materials, organic insulating substances such as polyacrylate compounds, polyimide compounds, fluorocarbon compounds such as polytetrafluoroethylene, and benzocyclobutene compounds can be used.

[0178] The first electrode EL1 can be connected to the connection pattern CNP through the opening of the second via membrane VIA2. Here, according to the embodiment, the first electrode EL1 can be the anode or cathode of the light-emitting element.

[0179] According to an embodiment, the second via film VIA2 and the connection pattern CNP can be omitted, and the first electrode EL1 can be directly connected to the source electrode SE or drain electrode DE of the transistor through the opening of the first via film VIA1. According to an embodiment, the passivation film PSV can also be omitted.

[0180] The first electrode EL1 can be composed of a metal film of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or their alloys, and / or indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc. The first electrode EL1 can be composed of one metal, but is not limited to this; it can also be composed of two or more metals, such as an alloy of Ag and Mg.

[0181] When an image is to be provided in the direction below the substrate SUB, the first electrode EL1 may be formed of a transparent conductive film; when an image is to be provided in the direction above the substrate SUB, the first electrode EL1 may be formed of a metal reflective film and / or a transparent conductive film.

[0182] A pixel definition film (PDL) is provided on a substrate SUB on which a first electrode EL1, etc., is formed, defining the light-emitting regions of each pixel PXij. The pixel definition film (PDL) can be an organic insulating film made of organic materials. As organic materials, organic insulating substances such as polyacrylate compounds, polyimide compounds, fluorocarbon compounds such as polytetrafluoroethylene, and benzocyclobutene compounds can be used.

[0183] The pixel definition film (PDL) can expose the top surface of the first electrode EL1 and protrude from the substrate SUB along the edge of the pixel PXij. An organic film OL can be provided in the pixel PXij region surrounded by the pixel definition film (PDL).

[0184] Organic membranes (OLs) can include low-molecular-weight or high-molecular-weight substances. Low-molecular-weight substances may include copper phthalocyanine (CuPc), N,N-di(1-naphthyl)-N,N'-diphenylbenzidine (NPB), tris-8-hydroxyquinoline aluminum (Alq3), etc. These substances can be formed by vacuum evaporation. High-molecular-weight substances may include poly(3,4-ethylenedioxythiophene) (PEDOT), poly(phenylacetylene) (PPV), and polyfluorene, etc.

[0185] Organic OL films can be provided as a single layer, or as multiple layers including various functional layers. When organic OL films are provided as multiple layers, the hole injection layer (HIL), hole transport layer (HTL), emission layer (EML), electron transport layer (ETL), and electron injection layer (EIL) can have a single or complex stacked structure. Such organic OL films can be formed using screen printing or inkjet printing methods, laser-induced thermal imaging (LITI), etc.

[0186] According to an embodiment, at least a portion of the organic film OL can be integrally formed across a plurality of first electrodes EL1, or can be provided individually corresponding to each of the plurality of first electrodes EL1.

[0187] A second electrode EL2 can be provided on the organic film OL. The second electrode EL2 can be provided per pixel PXij, but it can also be provided to cover most of the display area DA and can be shared by multiple pixels PXij.

[0188] According to the embodiment, the second electrode EL2 can be used as a cathode or an anode. The second electrode EL2 can be used as a cathode when the first electrode EL1 is an anode, and the second electrode EL2 can be used as an anode when the first electrode EL1 is a cathode.

[0189] The second electrode EL2 can be composed of metal films such as Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, etc., and / or transparent conductive films such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc. In one embodiment of this disclosure, the second electrode EL2 can be composed of multiple films including double or more metal films; for example, it can also be composed of a three-layer film of ITO / Ag / IT.

[0190] When an image is to be provided in the direction below the substrate SUB, the second electrode EL2 may be formed of a metal reflective film and / or a transparent conductive film. When an image is to be provided in the direction above the substrate SUB, the second electrode EL2 may also be formed of a transparent conductive film.

[0191] The combination of the first electrode EL1, the organic film OL, and the second electrode EL2 mentioned above can be called a light-emitting element.

[0192] An encapsulation layer TFE can be provided on the second electrode EL2. The encapsulation layer TFE can be a single layer or multiple layers. According to one embodiment of this disclosure, the encapsulation layer TFE can be composed of a first encapsulation layer ENC1, a second encapsulation layer ENC2, and a third encapsulation layer ENC3. The first encapsulation layer ENC1, the second encapsulation layer ENC2, and the third encapsulation layer ENC3 can be composed of organic and / or inorganic materials. The outermost third encapsulation layer ENC3 can be composed of inorganic materials. For example, the first encapsulation layer ENC1 can be composed of inorganic materials, the second encapsulation layer ENC2 can be composed of organic materials, and the third encapsulation layer ENC3 can be composed of inorganic materials. In the case of inorganic materials, although less moisture or oxygen permeates compared to organic materials, they are more prone to cracking due to their lower elasticity or flexibility. By forming the first encapsulation layer ENC1 and the third encapsulation layer ENC3 with inorganic materials and the second encapsulation layer ENC2 with organic materials, the propagation of cracks can be prevented. Here, the layer composed of organic materials, namely the second encapsulation layer ENC2, can be completely covered by the third encapsulation layer ENC3 so that the ends are not exposed to the outside. As organic materials, organic insulating substances such as polyacrylate compounds, polyimide compounds, fluorocarbon compounds such as polytetrafluoroethylene, and benzocyclobutene compounds can be used; as inorganic materials, polysiloxanes, silicon nitride, silicon oxide, silicon oxynitride, etc., can be used.

[0193] The organic film OL constituting the light-emitting element may be easily damaged by external moisture or oxygen. The encapsulation layer TFE protects it by covering the organic film OL. The encapsulation layer TFE can cover the display area DA and extend beyond the display area DA to the non-display area NDA. However, while organic insulating films offer advantages in terms of flexibility and elasticity, they are more susceptible to moisture or oxygen penetration compared to insulating films made of inorganic materials. In one embodiment of this disclosure, to prevent moisture or oxygen penetration through the organic insulating film, the ends of the organic insulating film can be covered by an inorganic insulating film to prevent exposure to the outside. For example, the first via film VIA1, the second via film VIA2, and the pixel definition film PDL, all made of organic materials, can extend discontinuously to the non-display area NDA and be covered by the first encapsulation layer ENC1. Therefore, the top of the pixel definition film PDL, the first via film VIA1, the second via film VIA2, and the side of the pixel definition film PDL are sealed by the encapsulation layer TFE containing inorganic material, which can prevent them from being exposed to the outside.

[0194] However, the TFE encapsulation layer can be multi-layered or made of various materials without limitation. For example, the TFE encapsulation layer can include multiple organic material layers and multiple inorganic material layers stacked alternately on top of each other.

[0195] The touch electrode TE can be located on the encapsulation layer TFE. According to an embodiment, an additional buffer film can be located between the touch electrode TE and the encapsulation layer TFE. The touch electrode TE can be composed of a metal film of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, etc., and / or a transparent conductive film of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc. According to an embodiment, when the touch electrode TE is composed of an opaque conductive film, it can include multiple openings TS-OP that expose multiple covered pixels PXij. For example, the touch electrode TE can be configured in a grid pattern. When the touch electrode TE is composed of a transparent conductive film, the touch electrode TE can also be configured as an electrode plate without openings. Next, the non-display area NDA will be described. In the following description of the non-display area NDA, to avoid repetition, descriptions already described will be omitted or briefly explained.

[0196] According to one embodiment of this disclosure, the protruding member DAM can be a multi-layered structure.

[0197] For example, when viewed in a cross-section perpendicular to the substrate SUB, the first protruding member DAM1 may include: a lower protrusion DAM1-B disposed on the substrate SUB; and an upper protrusion DAM1-T disposed on the lower protrusion DAM1-B. The cross-sectional shapes of the lower protrusion DAM1-B and the upper protrusion DAM1-T may be trapezoidal. That is, the upper protrusion DAM1-T and the lower protrusion DAM1-B may each be a trapezoidal shape in which the width of the protrusion gradually decreases from the bottom surface to the top surface. In this case, the area of ​​the upper surface of the lower protrusion DAM1-B may be larger than the area of ​​the bottom surface of the upper protrusion DAM1-T.

[0198] When viewed in a cross-section perpendicular to the substrate SUB, the second protruding member DAM2 may include a base protrusion DAM2-U, a second lower protrusion DAM2-B, and a second upper protrusion DAM2-T disposed on the substrate SUB. The cross-sectional shape of the base protrusion DAM2-U, the second lower protrusion DAM2-B, and the second upper protrusion DAM2-T may be trapezoidal. That is, each of the base protrusion DAM2-U, the second lower protrusion DAM2-B, and the second upper protrusion DAM2-T may be a trapezoidal shape in which the width of the protrusion gradually decreases from the bottom surface to the top surface. In this case, the area of ​​the upper surface of the base protrusion DAM2-U may be larger than the area of ​​the bottom surface of the lower protrusion DAM1-B, and the area of ​​the upper surface of the lower protrusion DAM1-B may be larger than the area of ​​the bottom surface of the upper protrusion DAM1-T.

[0199] The lower protrusion DAM1-B, upper protrusion DAM1-T, base protrusion DAM2-U, second lower protrusion DAM2-B, and second upper protrusion DAM2-T can be made of organic materials. Each of these components can correspond to any one of the first via film VIA1, the second via film VIA2, and the pixel definition film PDL. For example, if the lower protrusion DAM1-B and base protrusion DAM2-U are made of the same material using the same process as the first via film VIA1, then the upper protrusion DAM1-T and second lower protrusion DAM2-B can be made of the same material using the same process as the second via film VIA2, and the second upper protrusion DAM2-T can be made of the same material using the same process as the pixel definition film PDL.

[0200] According to one embodiment of the present disclosure, in the non-display area NDA including the protruding member DAM, the encapsulation layer TFE may consist only of a first encapsulation layer ENC1 and a third encapsulation layer ENC3 formed of inorganic materials.

[0201] Reference Figure 6 , Figure 7 , Figure 12 as well as Figure 13 The wiring section TW may include: a first conductive layer TS-CL1; a first insulating layer TS-IL1 disposed on the first conductive layer TS-CL1; a second conductive layer TS-CL2 disposed on the first insulating layer TS-IL1; and a plurality of second contact holes CH2 disposed between the first conductive layer TS-CL1 and the second conductive layer TS-CL2.

[0202] exist Figure 12The example illustrates the case where the wiring section TW is the second touch signal line SL2-5. The second touch signal line SL2-5 may include: a first metal wiring SL2-51 formed by a first conductive layer TS-CL1; a second metal wiring SL2-52 formed by a second conductive layer TS-CL2; and a second contact hole CH2 formed on the first insulating layer TS-IL1 and electrically connecting the first metal wiring SL2-51 and the second metal wiring SL2-52.

[0203] The first metal wiring SL2-51 of the second touch signal line SL2-5 can extend continuously and uninterruptedly along the first direction DR1 on the non-display area NDA including the protruding member DAM. A first insulating layer TS-IL1 can be disposed on the first metal wiring SL2-51 of the second touch signal line SL2-5. A second metal wiring SL2-52 of the second touch signal line SL2-5 can be disposed on the first insulating layer TS-IL1.

[0204] On the other hand, the second metal wiring SL2-52 of the second touch signal line SL2-5 can extend continuously and uninterruptedly along the first direction DR1 on the non-display area NDA, excluding the protruding member DAM. That is, the second metal wiring SL2-52 of the second touch signal line SL2-5 may not be disposed on the protruding member DAM. The second insulating layer TS-IL2 may be disposed on the second metal wiring SL2-52 of the second touch signal line SL2-5.

[0205] exist Figure 13 In the example below, the wiring section TW is illustrated as a first touch signal line SL1-1. The first touch signal line SL1-1 may include: a first metal wiring SL1-11, formed by a first conductive layer TS-CL1; a second metal wiring SL1-12, formed by a second conductive layer TS-CL2; and a second contact hole CH2, formed on the first insulating layer TS-IL1, and electrically connecting the first metal wiring SL1-11 and the second metal wiring SL1-12.

[0206] The first metal wiring SL1-11 of the first touch signal line SL1-1 can extend continuously and uninterruptedly along the first direction DR1 on the non-display area NDA, excluding the protruding member DAM. That is, the first metal wiring SL1-11 of the first touch signal line SL1-1 may not be disposed on the protruding member DAM. The first insulating layer TS-IL1 can be disposed on the first metal wiring SL1-11 of the first touch signal line SL1-1. The second metal wiring SL1-12 of the first touch signal line SL1-1 can be disposed on the first insulating layer TS-IL1.

[0207] On the other hand, the second metal wiring SL1-12 of the first touch signal line SL1-1 extends continuously and uninterruptedly along the first direction DR1 on the non-display area NDA including the protruding member DAM. The second insulating layer TS-IL2 may be disposed on the second metal wiring SL1-12 of the first touch signal line SL1-1.

[0208] For ease of illustration, a second contact hole CH2 is shown between the display area DA and the first protruding member DAM1, between the first protruding member DAM1 and the second protruding member DAM2, and in the nearby area that does not overlap with the second protruding member DAM2. However, it is not limited to this. For the electrical connection between the first metal wirings SL1-11, SL2-51 and the second metal wirings SL1-12, SL2-52 of the first touch signal line SL1-1 and the second touch signal line SL2-5, the number of second contact holes CH2 can be increased or decreased.

[0209] Figure 14 This is an enlarged view illustrating an embodiment according to the present disclosure. Figure 7 The diagram of region AA. Figure 15 This is an enlarged view illustrating an embodiment according to the present disclosure. Figure 8 The diagram of region AA'. Figure 16 This is an enlarged view illustrating an embodiment according to the present disclosure. Figure 10 The diagram of the "AA" region.

[0210] exist Figures 14 to 16 The example illustrates a wiring section TW comprising first touch signal lines SL1-1 and SL1-2, and a second touch signal line SL2-5. The first touch signal lines SL1-1 and SL1-2, and the second touch signal line SL2-5, can extend along a first direction DR1 and be arranged adjacent to each other along a second direction DR2. The protruding member DAM can extend along the second direction DR2 and be arranged adjacent to each other along the first direction DR1.

[0211] For ease of explanation, the explanation will focus on the first touch signal line SL1-1 and the second touch signal line SL2-5.

[0212] According to one embodiment of this disclosure, the second touch signal line SL2-5 may include: a first region TW-a1 configured not to overlap with the protruding member DAM; and a second region TW-b1 configured to overlap with the protruding member DAM. However, for process margin, a portion of the second region TW-b1 may not overlap with the protruding member DAM.

[0213] In the first region TW-a1, the second touch signal line SL2-5 can be configured with both the first metal wiring SL2-51 and the second metal wiring SL2-52. In the second region TW-b1, the second touch signal line SL2-5 can be configured with only the first metal wiring SL2-51.

[0214] Alternatively, the first metal wiring SL2-51 of the second touch signal line SL2-5 may have a first width W1 along the second direction DR2, and the second metal wiring SL2-52 of the second touch signal line SL2-5 may have a second width W2 along the second direction DR2. In this case, the first width W1 and the second width W2 may be the same as each other.

[0215] The first metal wiring SL2-51 and the second metal wiring SL2-52 of the second touch signal line SL2-5 can be configured with multiple second contact holes CH2 in the first region TW-a1, and can be without second contact holes CH2 in the second region TW-b1.

[0216] On the other hand, the first touch signal line SL1-1 may include: a first region TW-a2 configured not to overlap with the protruding member DAM; and a second region TW-b2 configured to overlap with the protruding member DAM. In the first region TW-a2 of the first touch signal line SL1-1, a first metal wiring SL1-11 and a second metal wiring SL1-12 may be configured. In the second region TW-b2 of the first touch signal line SL1-1, only the second metal wiring SL1-12 may be configured.

[0217] Alternatively, the first metal wiring SL1-11 of the first touch signal line SL1-1 can have a first width W3 along the second direction DR2, and the second metal wiring SL1-12 of the first touch signal line SL1-1 can have a second width W4 along the second direction DR2. In this case, the first width W3 and the second width W4 can be the same as each other.

[0218] The first metal wiring SL1-11 and the second metal wiring SL1-12 of the first touch signal line SL1-1 can be configured with multiple second contact holes CH2 in the first region TW-a2, and no second contact holes CH2 can be configured in the second region TW-b2.

[0219] Reference Figure 6 , Figure 7 as well as Figures 14 to 16 The wiring section TW can alternately arrange signal lines with a stacked structure like the first touch signal line SL1-1 and signal lines with a stacked structure like the second touch signal line SL2-5 along the extension direction of the protruding member DAM.

[0220] For example, the first touch signal line SL1-3 and the second touch signal lines SL2-2 and SL2-4 may have a stacked structure like the first touch signal line SL1-1, and the first touch signal lines SL1-2 and SL1-4 and the second touch signal lines SL2-1 and SL2-3 may have a stacked structure like the second touch signal line SL2-5.

[0221] The display device DD of one embodiment having the structure of the above-described wiring section TW can improve the short circuit problem between the wiring sections TW.

[0222] When a photoresist material is provided for patterning the wiring section TW, the stack height of the photoresist material increases at the step portion where the protruding member DAM is formed. This may reduce the patterning quality of the wiring section TW boundary portion when etching the first conductive layer TS-CL1 and the second conductive layer TS-CL2. In this case, the distance between adjacent wiring sections TW becomes closer, and local short circuits may occur in the wiring section TW. However, in the wiring section TW of this disclosure, since multiple adjacently arranged touch signal lines SL1, SL2 extend on the protruding member DAM using different conductive layers, they can be insulated by an insulating layer. Therefore, it is expected to improve the effect of reducing short circuit defects between adjacently arranged wiring sections TW.

[0223] The following describes other embodiments. In the embodiments described below, descriptions of the same configurations as those described previously are omitted or simplified, and the focus is on the differences.

[0224] Figure 17 This is an enlarged view illustrating an embodiment according to the present disclosure. Figure 7 The diagram of region AA. Figure 18 This is an enlarged view illustrating an embodiment according to the present disclosure. Figure 8 The diagram of region A-A'. Figure 19 This is an enlarged view illustrating an embodiment according to the present disclosure. Figure 10 The diagram of the "AA" region.

[0225] Reference Figures 17 to 19 ,and Figures 14 to 16 The difference in the embodiment shown is that the wiring section TW also includes a third region TW-c1'.

[0226] More specifically, the second touch signal line SL2-5' may include: a first region TW-a1' configured not to overlap with the protruding member DAM; and a second region TW-b1' configured to overlap with the protruding member DAM. However, for process margin, a portion of the second region TW-b1' may not overlap with the protruding member DAM.

[0227] The second touch signal line SL2-5' may also include a third region TW-c1', protruding from the second region TW-b1'. The third region TW-c1' may be configured to overlap with the protruding member DAM. However, for manufacturing margin, a portion of the third region TW-c1' may not overlap with the protruding member DAM.

[0228] According to one embodiment, the length of the third region TW-c1' along the first direction DR1 can be the same as the length of the second region TW-b1' along the first direction DR1. The width of the third region TW-c1' along the second direction DR2 can be less than half of the shortest distance between adjacent touch signal lines SL2-5' and SL1-1'. That is, the third region TW-c1' of the second touch signal line SL2-5' and the third region TW-c2' of the first touch signal line SL1-1' can not overlap in the plane.

[0229] The third region TW-c1' can have a rectangular shape on a plane. However, the shape of the third region TW-c1' on a plane is not limited to this, and it can have various shapes within the limit of not overlapping with the third region of adjacent touch signal lines. For example, the third region TW-c1' can have a polygonal shape including a rhombus shape and an elliptical shape including a semicircle shape on a plane.

[0230] The second touch signal line SL2-5' in the first region TW-a1' can be configured such that the first metal wiring SL2-51' and the second metal wiring SL2-52' overlap. The second touch signal line SL2-5' in the second region TW-b1' and the third region TW-c1' can be configured with only the first metal wiring SL2-51'.

[0231] The first metal wiring SL2-51' of the second touch signal line SL2-5' can have a first width W5 along the second direction DR2 in the first region TW-a1', and a second width W6 along the second direction DR2 in the second region TW-b1' and the third region TW-c1'. The second metal wiring SL2-52' of the second touch signal line SL2-5' can have a third width W7 along the second direction DR2. In this case, the first width W5 and the third width W7 can be the same as each other, and the second width W6 can be greater than the first width W5.

[0232] The first metal wiring SL2-51' and the second metal wiring SL2-52' of the second touch signal line SL2-5' can be configured with multiple second contact holes CH2 in the first region TW-a1', while the second contact holes CH2 can be omitted in the second region TW-b1' and the third region TW-c1'.

[0233] On the other hand, the first touch signal line SL1-1' may include: a first region TW-a2' configured not to overlap with the protruding member DAM; and a second region TW-b2' configured to overlap with the protruding member DAM. However, for process margin, a portion of the second region TW-b2' may not overlap with the protruding member DAM.

[0234] The first touch signal line SL1-1' may also include a third region TW-c2', protruding from the second region TW-b2'. The third region TW-c2' may be configured to overlap with the protruding member DAM. However, for process margin, a portion of the third region TW-c2' may not overlap with the protruding member DAM.

[0235] According to one embodiment, the length of the third region TW-c2' along the first direction DR1 can be the same as the length of the second region TW-b2' along the first direction DR1. The width of the third region TW-c2' along the second direction DR2 can be less than half of the shortest distance between adjacent touch signal lines SL2-5' and SL1-1'. That is, the third region TW-c1' of the second touch signal line SL2-5' and the third region TW-c2' of the first touch signal line SL1-1' can not overlap in the plane.

[0236] The third region TW-c2' can have a rectangular shape on a plane. However, the shape of the third region TW-c2' on a plane is not limited to this, and it can have various shapes within the limit of not overlapping with the third region of adjacent touch signal lines. For example, the third region TW-c2' can have a polygonal shape including a rhombus shape and an elliptical shape including a semicircle shape on a plane.

[0237] The first touch signal line SL1-1' in the first region TW-a2' can be configured such that the first metal wiring SL1-11' and the second metal wiring SL1-12' overlap. The first touch signal line SL1-1' in the second region TW-b2' and the third region TW-c2' can be configured with only the second metal wiring SL1-12'.

[0238] The second metal wiring SL1-12' of the first touch signal line SL1-1' can have a first width W8 along the second direction DR2 in the first region TW-a2', and a second width W9 along the second direction DR2 in the second region TW-b2' and the third region TW-c2'. The first metal wiring SL1-11' of the first touch signal line SL1-1' can have a third width W10 along the second direction DR2. In this case, the first width W8 and the third width W10 can be the same as each other, and the second width W9 can be greater than the first width W8.

[0239] The first metal wiring SL1-11' and the second metal wiring SL1-12' of the first touch signal line SL1-1' can be configured with multiple second contact holes CH2 in the first region TW-a2', while the second contact holes CH2 can be omitted in the second region TW-b2' and the third region TW-c2'.

[0240] Reference Figure 6 , Figure 7 and Figures 17 to 19 The wiring section TW can alternately arrange signal lines with a stacked structure like the first touch signal line SL1-1' and signal lines with a stacked structure like the second touch signal line SL2-5' along the extension direction of the protruding member DAM.

[0241] For example, the first touch signal line SL1-3 and the second touch signal lines SL2-2 and SL2-4 may have a stacked structure like the first touch signal line SL1-1', and the first touch signal lines SL1-2 and SL1-4 and the second touch signal lines SL2-1 and SL2-3 may have a stacked structure like the second touch signal line SL2-5'.

[0242] The display device DD of one embodiment having the above-described wiring section TW structure can reduce the resistance of the wiring section TW.

[0243] When a double wiring structure has a first conductive layer TS-CL1 and a second conductive layer TS-CL2 stacked in a region that does not overlap with the protruding member DAM, and a single wiring structure has a conductive layer formed only by either the first conductive layer TS-CL1 or the second conductive layer TS-CL2 in a region that overlaps with the protruding member DAM, the resistance of the wiring portion TW in the region overlapping with the protruding member DAM can be greater than the resistance of the double wiring structure with the first conductive layer TS-CL1 and the second conductive layer TS-CL2 stacked. However, by increasing the area of ​​the wiring passing through the region overlapping with the protruding member DAM, the wiring portion TW of this disclosure can be expected to reduce the resistance of the wiring portion TW.

[0244] Figure 20 This is a top view of a display device according to an embodiment of the present disclosure. Figures 21 to 23 This is a top view of a touch sensing unit according to an embodiment of the present disclosure. Figure 24 According to an embodiment of this disclosure, along Figure 20 A cross-sectional view taken from line III-III'. Figure 25 According to an embodiment of this disclosure, along Figure 20 A cross-sectional view taken from the IV-IV' line. Figure 26 This is an enlarged view illustrating an embodiment according to the present disclosure. Figure 20 The diagram of region AA. Figure 27This is an enlarged view illustrating an embodiment according to the present disclosure. Figure 8 The diagram of region AA'. Figure 28 This is an enlarged view illustrating an embodiment according to the present disclosure. Figure 23 The diagram of the "AA" region.

[0245] Reference Figures 20 to 28 When the wiring section TW' is configured on the non-display area NDA, it is in harmony with... Figures 7 to 16 The difference in the illustrated embodiment is that the first touch signal lines SL1-1', SL1-2', SL1-3', SL1-4' and the second touch signal lines SL2-1', SL2-2', SL2-3', SL2-4', SL2-5' are formed by a single wiring structure.

[0246] Specifically, in Figure 20 In the top view, the touch sensing unit TS may include: first touch electrodes TE1-1, TE1-2, TE1-3, TE1-4; first touch signal lines SL1-1', SL1-2', SL1-3', SL1-4', connected to the first touch electrodes TE1-1, TE1-2, TE1-3, TE1-4; second touch electrodes TE2-1, TE2-2, TE2-3, TE2-4, TE2-5; and second touch signal lines SL2-1', SL2-2', SL2-3', SL2-4', SL2-5', connected to the second touch electrodes TE2-1, TE2-2, TE2-3, TE2-4, TE2-5.

[0247] On the other hand, Figures 20 In this part, the first touch signal lines SL1-1', SL1-2', SL1-3', SL1-4' and the second touch signal lines SL2-1', SL2-2', SL2-3', SL2-4', SL2-5' are connected between the touch electrode TE and the touch pad TS-PD, corresponding to the wiring section TW' of this disclosure.

[0248] Reference Figures 21 to 23 The wiring section TW' can be a single wiring structure formed by any one of the first metal wiring SL1-11', SL1-21', SL1-31', SL1-41', SL2-11', SL2-21', SL2-31', SL2-41', SL2-51' and the second metal wiring SL1-12', SL1-22', SL1-32', SL1-42', SL2-12', SL2-22', SL2-32', SL2-42', SL2-52'.

[0249] According to one embodiment of the present disclosure, the touch signal lines arranged adjacently among the first touch signal lines SL1-1', SL1-2', SL1-3', SL1-4' and the second touch signal lines SL2-1', SL2-2', SL2-3', SL2-4', SL2-5' can be alternately formed on different layers of each other with reference to the first insulating layer TS-IL1.

[0250] For example, the first touch signal lines SL1-1', SL1-2', SL1-3', and SL1-4' may include the first metal wiring SL1-21', SL1-41' and the second metal wiring SL1-12', SL1-32', and the second touch signal lines SL2-1', SL2-2', SL2-3', SL2-4', and SL2-5' may include the first metal wiring SL2-11', SL2-31', SL2-51' and the second metal wiring SL2-22', SL2-42'.

[0251] Alternatively, the first metal wirings SL1-21', SL1-41', SL2-11', SL2-31', and SL2-51' may be disposed on the encapsulation layer TFE, and a first insulating layer TS-IL1 may be interposed between the first metal wirings SL1-21', SL1-41', SL2-11', SL2-31', and SL2-51' and the second metal wirings SL1-12', SL1-32', SL2-22', and SL2-42'.

[0252] On the other hand, with Figures 7 to 16 The embodiment shown differs in that the first insulating layer TS-IL1 between the first metal wirings SL1-21', SL1-41', SL2-11', SL2-31', SL2-51' and the second metal wirings SL1-12', SL1-32', SL2-22', SL2-42' may not include the second contact hole CH2.

[0253] When adjacent touch signal lines in the first touch signal lines SL1-1', SL1-2', SL1-3', SL1-4' and the second touch signal lines SL2-1', SL2-2', SL2-3', SL2-4', SL2-5' are alternately formed with wiring portions TW' on different layers with the first insulating layer TS-IL1 as a reference, the occurrence of short circuits in wiring portions TW' can be reduced, the spacing between touch signal lines on the plane can be reduced, and the unused space of the display panel DP can be reduced.

[0254] Reference Figure 6 , Figure 20 , Figure 24 as well as Figure 25The wiring section TW' may include: a first conductive layer TS-CL1; a first insulating layer TS-IL1 disposed on the first conductive layer TS-CL1; and a second conductive layer TS-CL2 disposed on the first insulating layer TS-IL1.

[0255] exist Figure 24 In the example below, we illustrate the case where the wiring section TW' is the second touch signal line SL2-5'. The second touch signal line SL2-5' may include a first metal wiring SL2-51' formed by the first conductive layer TS-CL1. The first metal wiring SL2-51' of the second touch signal line SL2-5' may extend continuously along the first direction DR1 on the non-display area NDA including the protruding member DAM.

[0256] exist Figure 25 In the example described below, the wiring section TW' is a first touch signal line SL1-1'. The first touch signal line SL1-1' may include a second metal wiring SL1-12' formed by a second conductive layer TS-CL2. The second metal wiring SL1-12 of the first touch signal line SL1-1' may extend continuously and uninterruptedly along the first direction DR1 on the non-display area NDA including the protruding member DAM. A second insulating layer TS-IL2 may be disposed on the second metal wiring SL1-12 of the first touch signal line SL1-1'.

[0257] Figure 26 This is an enlarged view illustrating an embodiment according to the present disclosure. Figure 20 The diagram of region AA. Figure 27 This is an enlarged view illustrating an embodiment according to the present disclosure. Figure 21 The diagram of region AA'. Figure 28 This is an enlarged view illustrating an embodiment according to the present disclosure. Figure 23 The diagram of the "AA" region.

[0258] exist Figures 26 to 28 The example illustrates a wiring section TW' comprising first touch signal lines SL1-1', SL1-2', and a second touch signal line SL2-5'. The first touch signal lines SL1-1', SL1-2', and the second touch signal line SL2-5' can extend along a first direction DR1 and be arranged adjacent to each other along a second direction DR2. The protruding member DAM can extend along the second direction DR2 and be arranged adjacent to each other along the first direction DR1.

[0259] For ease of explanation, the explanation will focus on the first touch signal line SL1-1' and the second touch signal line SL2-5'.

[0260] According to one embodiment of this disclosure, the second touch signal line SL2-5' may include: a first region TW-a1 configured not to overlap with the protruding member DAM; and a second region TW-b1 configured to overlap with the protruding member DAM. However, for process margin, a portion of the second region TW-b1 may not overlap with the protruding member DAM.

[0261] The second touch signal line SL2-5' can be configured with only the first metal wiring SL2-51' in both the first region TW-a1 and the second region TW-b1.

[0262] The first metal wiring SL2-51' of the second touch signal line SL2-5' may have a first width W1 along the second direction DR2.

[0263] On the other hand, the first touch signal line SL1-1' may include: a first region TW-a2 configured not to overlap with the protruding member DAM; and a second region TW-b2 configured to overlap with the protruding member DAM. The first touch signal line SL1-1' may be configured with only the second metal wiring SL1-12 in both the first region TW-a2 and the second region TW-b2.

[0264] The second metal wiring SL1-12 of the first touch signal line SL1-1' can have a second width W4 along the second direction DR2.

[0265] Reference Figure 6 , Figures 20 to 28 as well as Figures 26 to 28 Figures 26 to 28 The wiring section TW' can alternately arrange signal lines with a stacked structure like the first touch signal line SL1-1' and signal lines with a stacked structure like the second touch signal line SL2-5' along the extension direction of the protruding member DAM.

[0266] For example, the first touch signal line SL1-3' and the second touch signal lines SL2-2' and SL2-4' may have a stacked structure like the first touch signal line SL1-1', and the first touch signal lines SL1-2' and SL1-4' and the second touch signal lines SL2-1' and SL2-3' may have a stacked structure like the second touch signal line SL2-5'.

[0267] The display device DD having the above-described wiring section TW' structure can improve the short circuit problem between wiring sections TW'.

[0268] It will be understood by those skilled in the art to which this disclosure pertains that this disclosure may be implemented in other specific forms without altering its technical concept or essential features. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. The scope of this disclosure is based more on the claims than on the detailed description above, and should be interpreted as including the meaning and scope of the claims, as well as all variations or modifications derived from their equivalents, within the scope of this disclosure.

Claims

1. A display device, wherein, The display device includes: a display panel including a display area, a non-display area, and a protruding member disposed on the non-display area; a touch sensing unit disposed on the display panel and including a touch electrode and a wiring portion connected to the touch electrode, the touch sensing unit including a first metal layer, a first insulating layer disposed on the first metal layer, a second metal layer disposed on the first insulating layer, and a plurality of contact holes disposed between the first metal layer and the second metal layer, the wiring portion being disposed in a double-wiring structure formed by the first metal layer and the second metal layer on the non-display area and in a single-wiring structure formed by any one of the first metal layer and the second metal layer on the protruding member, the wiring portion including a plurality of first touch signal lines and a plurality of second touch signal lines alternately disposed along an extension direction of the protruding member, in the first metal layer and the second metal layer, a metal layer included in the single-wiring structure of the first touch signal line and a metal layer included in the single-wiring structure of the second touch signal line are different from each other. 2.The display device of claim 1, wherein the first touch signal lines and the second touch signal lines extend along a direction intersecting the extension direction of the protruding member. 3.The display device of claim 2, wherein a first metal wiring of the first touch signal line formed by the first metal layer overlaps the protruding member, and a second metal wiring of the first touch signal line formed by the second metal layer does not overlap the protruding member, a first metal wiring of the second touch signal line formed by the first metal layer does not overlap the protruding member, and a second metal wiring of the second touch signal line formed by the second metal layer overlaps the protruding member. 4.The display device of claim 2, wherein a width of the first metal wiring of the first touch signal line and a width of the second metal wiring of the second touch signal line are the same. 5.The display device of claim 4, wherein the first metal layer and the second metal layer of the first touch signal line and the second touch signal line are electrically connected through the contact holes. 6.The display device of claim 1, wherein the touch electrode includes a plurality of first touch electrodes extending along a first direction and a second touch electrode extending along a second direction intersecting the first direction. 7.The display device of claim 6, wherein the first touch electrode includes a plurality of first touch sensor portions and a plurality of first connection portions connecting the first touch sensor portions, the second touch electrode includes a plurality of second touch sensor portions and a plurality of second connection portions connecting the second touch sensor portions. 8.The display device of claim 7, wherein the first touch sensor portions, the first connection portions, and the second touch sensor portions are formed by the second metal layer, the second connection portions are formed by the first metal layer. ​ 9. The display device according to claim 6, wherein the first touch electrode and the second touch electrode cross each other insulated by the first insulating layer.

10. The display device according to claim 1, wherein the protruding member includes a first protruding member configured to surround the display region, a second protruding member configured to surround the first protruding member, and a bank portion configured to be on an outer side of the second protruding member.

11. The display device according to claim 10, wherein the display device includes a pad electrode configured to be on an outer side of the bank portion, the wiring portion connects the touch electrode and the pad electrode.

12. The display device according to claim 10, wherein a height of the second protruding member is greater than a height of the first protruding member.

13. The display device according to claim 12, wherein the touch sensing unit further includes a second insulating layer configured to be on the second metal layer.

14. A display device, wherein, including: a base substrate divided into a display region and a non-display region adjacent to the display region; a circuit layer configured to be on the base substrate; a light emitting element layer configured to be on the display region; an encapsulation layer covering the light emitting element layer; a touch sensing unit configured to be above the encapsulation layer and including a touch electrode and a wiring portion connected to the touch electrode; and a protruding member configured to be on the non-display region, the touch sensing unit includes a first metal layer, a first insulating layer configured to be on the first metal layer, a second metal layer configured to be on the first insulating layer, and a plurality of contact holes configured between the first metal layer and the second metal layer, the wiring portion is configured to be a double-wiring structure formed of the first metal layer and the second metal layer on the non-display region and a single-wiring structure formed of either one of the first metal layer and the second metal layer on the protruding member, the wiring portion includes a plurality of first touch signal lines and a plurality of second touch signal lines alternately configured along an extension direction of the protruding member, in the first metal layer and the second metal layer, a metal layer included in the single-wiring structure of the first touch signal line and a metal layer included in the single-wiring structure of the second touch signal line are different from each other.

15. The display device according to claim 14, wherein the first touch signal line and the second touch signal line extend along a direction crossing the extension direction of the protruding member.

16. The display device according to claim 15, wherein a first metal wiring of the first touch signal line formed of the first metal layer overlaps the protruding member, and a second metal wiring of the first touch signal line formed of the second metal layer does not overlap the protruding member, a first metal wiring of the second touch signal line formed of the first metal layer does not overlap the protruding member, and a second metal wiring of the second touch signal line formed of the second metal layer overlaps the protruding member.

17. The display device according to claim 16, wherein The first metal layer and the second metal layer of the first touch signal line and the second touch signal line are electrically connected through the contact hole. 18.The display device according to claim 17, wherein The touch sensing unit further includes a second insulating layer disposed on the second metal layer. 19.The display device according to claim 18, wherein The encapsulation layer includes a first inorganic layer, a second inorganic layer, and an organic layer interposed between the first inorganic layer and the second inorganic layer. 20.The display device according to claim 19, wherein The encapsulation layer sequentially stacks the first inorganic layer and the second inorganic layer on the protruding member.

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