Display device

Abstract

A display device is provided. The display device includes a display panel, a flexible printed circuit board, and a shielding member, the display panel having a front surface and a rear surface opposite to the front surface and including a plurality of display pads arranged on the front surface and arranged in one direction, the flexible printed circuit board being connected to the display pads and being bent toward the rear surface of the display panel along an imaginary bending axis extending in one direction, and the shielding member being arranged on the flexible printed circuit board, wherein the flexible printed circuit board includes a first bending area and a second bending area based on an intersection with an imaginary line extending from the bending axis in a crossing direction intersecting with the one direction, the first bending area being adjacent to the display pads, the second bending area being adjacent to the rear surface of the display panel, and the shielding member covering the second bending area.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2019-0147990, filed on November 18, 2019, which is hereby incorporated by reference for all purposes as if fully set forth herein. Technical Field

[0003] Exemplary embodiments / implementations of the present invention relate generally to display devices, and more particularly, to display devices having improved reliability. Background Art

[0004] After the display panel is manufactured, the display device connects the printed circuit board to the display panel. For example, a tape automated bonding (TAB) mounting method bonds a flexible printed circuit board to the display panel using an anisotropic conductive film (ACF).

[0005] The above information disclosed in this Background section is only for understanding the background of the present inventive concept and therefore it may contain information that does not constitute prior art. Summary of the invention

[0006] The apparatus constructed according to the exemplary embodiment of the present invention can provide a display device that prevents or reduces peeling of a printed circuit board that occurs when the printed circuit board is bent.

[0007] Additional features of the inventive concept will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the inventive concept.

[0008] One or more embodiments of the present inventive concept provide a display device, including a display panel, a flexible printed circuit board, and a shielding member, the display panel having a front surface and a rear surface opposite to the front surface and including a plurality of display pads arranged on the front surface and arranged in one direction, the flexible printed circuit board being connected to the display pads and being bent toward the rear surface of the display panel along an imaginary bending axis extending in one direction, the shielding member being arranged on the flexible printed circuit board, wherein the flexible printed circuit board includes a first bending area and a second bending area based on an intersection with an imaginary line extending from the bending axis along a crossing direction intersecting with one direction, the first bending area being adjacent to the display pad, the second bending area being adjacent to the rear surface of the display panel, and the shielding member covering the second bending area.

[0009] In an embodiment, the shielding member may cover a portion of the first bending region.

[0010] In an embodiment, in the shielding member, a length of the shielding member covering a portion of the first bending region from a boundary of the first bending region and the second bending region may be 300 μm or less.

[0011] In an embodiment, the shielding member may further include an adhesive layer contacting the flexible printed circuit board, and a fabric layer disposed on the adhesive layer.

[0012] In an embodiment, the shielding member may further include an adhesive film arranged between the flexible printed circuit board and the adhesive layer, and the adhesive film may include a first adhesive layer covering the flexible printed circuit board, a film layer arranged on the first adhesive layer and including any one of polyimide (PI) and polyethylene terephthalate (PET), and a second adhesive layer arranged on the film layer.

[0013] In an embodiment, the flexible printed circuit board may include a flexible circuit board including a front surface where a shielding member is arranged and a rear surface opposite to the front surface, and a driving chip mounted on the rear surface of the flexible circuit board.

[0014] In an implementation, the display device may further include a spacer disposed on the rear surface of the flexible circuit board and surrounding the driving chip.

[0015] In an embodiment, the display panel may include a side surface connecting a front surface of the display panel and a rear surface of the display panel, and the display device may further include a stress buffering member contacting one of the side surfaces adjacent to the display pad and a rear surface of the flexible printed circuit board overlapping the first bending area.

[0016] In an embodiment, the display device may further include a protection member disposed between the display panel and the second bending region.

[0017] In an embodiment, the display device may further include a main printed circuit board connected to the second bending region, wherein the main printed circuit board is disposed on the protection member.

[0018] In an embodiment, the display panel may include side surfaces connecting a front surface of the display panel and a rear surface of the display panel, and one of the side surfaces adjacent to the display pad may include a first inclined surface inclined at a predetermined angle from the front surface of the display panel, a second inclined surface inclined at a predetermined angle from the rear surface of the display panel, and a side surface connecting the first inclined surface and the second inclined surface.

[0019] In an embodiment, the display pad and the flexible printed circuit board may be bonded using an anisotropic conductive film (ACF), and a bonding length of the anisotropic conductive film in a crossing direction intersecting one direction may be 150 μm to 250 μm. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the invention and together with the description serve to explain the inventive concept.

[0021] Figure 1 is an exploded perspective view of a display device according to an embodiment of the inventive concept.

[0022] Figure 2 is a plan view of a display panel according to an embodiment of the inventive concept.

[0023] Figure 3A is a cross-sectional view of a display panel according to an embodiment of the inventive concept.

[0024] Figure 3B is a cross-sectional view of a display panel according to an embodiment of the inventive concept.

[0025] Figure 3C is a cross-sectional view of a display panel according to an embodiment of the inventive concept.

[0026] Figure 4A is a cross-sectional view of a display device according to an embodiment of the inventive concept.

[0027] Figure 4B is a rear view of a flexible printed circuit board according to an embodiment of the present inventive concept.

[0028] Figure 4C is a cross-sectional view illustrating a flexible printed circuit board and a shielding member according to an embodiment of the inventive concept.

[0029] Figure 5 yes Figure 4A An enlarged cross-sectional view of a display panel and a flexible printed circuit board connected thereto is shown in FIG.

[0030] Fig. 6A is a cross-sectional view illustrating a flexible printed circuit board and a shielding member according to an embodiment of the inventive concept.

[0031] Figure 6B are cross-sectional views of some components of a display device according to an embodiment of the inventive concept.

[0032] Fig. 7A is a cross-sectional view illustrating a flexible printed circuit board and a shielding member according to an embodiment of the inventive concept.

[0033] Figure 7B are cross-sectional views of some components of a display device according to an embodiment of the inventive concept.

[0034] Figure 8is a cross-sectional view illustrating a flexible printed circuit board and a shielding member according to an embodiment of the inventive concept.

[0035] Fig. 9 is a cross-sectional view illustrating a flexible printed circuit board and a shielding member according to an embodiment of the inventive concept.

[0036] Fig.10 is a cross-sectional view of a display device according to an embodiment of the inventive concept.

[0037] Fig.11 is a cross-sectional view of a display device according to an embodiment of the inventive concept.

[0038] Fig.12 is a cross-sectional view of a display device according to an embodiment of the inventive concept. DETAILED DESCRIPTION

[0039] In the following description, for the purpose of explanation, many specific details are set forth in order to provide a thorough understanding of various exemplary embodiments or implementations of the present invention. As used herein, "implementation" and "implementation" are interchangeable words, which are non-limiting examples of devices or methods using one or more of the present inventions disclosed herein. However, it is apparent that various exemplary embodiments can be practiced without these specific details or with one or more equivalent arrangements. In other examples, known structures and devices are shown in block diagram form to avoid making various exemplary embodiments obscure unnecessarily. In addition, various exemplary embodiments may be different, but do not have to be exclusive. For example, without departing from the present invention, the specific shape, configuration and characteristics of the exemplary embodiment may be used or implemented in another exemplary embodiment.

[0040] Unless otherwise specified, the exemplary embodiments shown will be understood as providing exemplary features of varying details of some ways in which the inventive concept can be implemented in practice. Therefore, unless otherwise specified, the features, components, modules, layers, films, panels, regions and / or aspects of various embodiments (hereinafter individually or collectively referred to as "elements") may be combined, separated, interchanged and / or rearranged in other ways without departing from the inventive concept.

[0041] The use of cross-hatching and / or shading in the accompanying drawings is generally provided to clarify the boundaries between adjacent elements. Thus, unless otherwise specified, the presence or absence of cross-hatching or shading does not convey or indicate any preference or requirement for specific materials, material properties, dimensions, proportions, commonalities between the elements shown, and / or any other characteristics, attributes, properties, etc. of the elements. In addition, in the accompanying drawings, the size and relative size of the elements may be exaggerated for clarity and / or descriptive purposes. When the exemplary embodiments can be implemented differently, a specific processing order can be performed differently from the described order. For example, two consecutively described processes can be performed substantially simultaneously or in an order opposite to the described order. In addition, the same reference numerals represent the same elements.

[0042] When an element such as a layer is referred to as being "on" another element or layer, "connected to" or "coupled to" another element or layer, it may be directly on, directly connected to or directly coupled to another element or layer, or there may be intermediate elements or layers. However, when an element or layer is referred to as being "directly on" another element or layer, "directly connected to" or "directly coupled to" another element or layer, there are no intermediate elements or layers. For this purpose, the term "connected" may refer to a physical, electrical and / or fluid connection with or without intermediate elements. In addition, the D1 axis, the D2 axis, and the D3 axis are not limited to the three axes of a rectangular coordinate system, such as the x-axis, the y-axis, and the z-axis, and may be interpreted in a broader sense. For example, the DR1 axis, the DR2 axis, and the DR3 axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the purpose of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" may be interpreted as, for example, only X, only Y, only Z, or any combination of two or more of X, Y, and Z, for example, XYZ, XYY, YZ, and ZZ. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0043] Although the terms "first", "second", etc. may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another element. Therefore, without departing from the teachings of the present disclosure, the first element discussed below may be referred to as the second element.

[0044] Spatially relative terms, such as "under," "beneath," "below," "lower," "above," "upper," "above," "higher," "side" (e.g., as in "sidewall"), and the like, may be used herein for descriptive purposes and thereby describe the relationship of one element to another (or multiple) elements as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture other than the orientation depicted in the figures. For example, if the device in the figures is flipped, elements described as being "under" or "beneath" other elements or features would be oriented as being "above" the other elements or features. Thus, the exemplary term "under" may include both upper and lower orientations. Furthermore, the device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and therefore, the spatially relative descriptors used herein are interpreted accordingly.

[0045] The words used herein are used for the purpose of describing specific embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" as used herein are intended to include the plural forms as well. In addition, the terms "comprise", "comprising", "include" and / or "including" when used in this specification specify the presence of the features, wholes, steps, operations, elements, parts and / or groups thereof, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, parts and / or groups thereof. It should also be noted that, as used herein, the terms "substantially", "about" and other similar terms are used as approximate terms, and are not used as terms of degree, and are therefore used to explain the inherent deviations in the values ​​measured, calculated and / or provided that would be recognized by a person of ordinary skill in the art.

[0046] Various exemplary embodiments are described herein with reference to cross-sectional views and / or exploded views as schematic illustrations of idealized exemplary embodiments and / or intermediate structures. In this way, changes in the illustrated shapes, for example due to manufacturing techniques and / or tolerances, are to be expected. Therefore, the exemplary embodiments disclosed herein need not necessarily be interpreted as being limited to the specific illustrated shapes of the zones, but rather include shape deviations caused by, for example, manufacturing. In this way, the zones shown in the figures may be schematic in nature, and the shapes of these zones may not reflect the actual shapes of the zones of the device, and therefore, are not necessarily intended to be limiting.

[0047] As is conventional in the art, some exemplary embodiments are described in terms of functional blocks, units and / or modules and shown in the accompanying drawings. It will be appreciated by those skilled in the art that these blocks, units and / or modules are physically implemented by electronic (or optical) circuits such as logic circuits, discrete components, microprocessors, hard-wired circuits, memory elements, wiring connections, etc., which can be formed using semiconductor-based preparation techniques or other manufacturing techniques. In the case where blocks, units and / or modules are implemented by microprocessors or other similar hardware, they can be programmed and controlled using software (e.g., microcode) to perform the various functions discussed herein, and optionally, they can be driven by firmware and / or software. In addition, it can be expected that each block, unit and / or module can be implemented by dedicated hardware, or can be implemented as a combination of dedicated hardware that performs certain functions and processors (e.g., one or more programmed microprocessors and related circuits) that perform other functions. In addition, each block, unit and / or module of some exemplary embodiments can be physically separated into two or more interactive and discrete blocks, units and / or modules without departing from the scope of the inventive concept. Furthermore, the blocks, units and / or modules of some exemplary embodiments may be physically combined into more complex blocks, units and / or modules without departing from the scope of the inventive concept.

[0048] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by a person of ordinary skill in the art to which this disclosure is a part. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and should not be interpreted in an ideal or overly rigid sense unless expressly defined as such herein.

[0049] Figure 1 is an exploded perspective view of a display device according to an embodiment of the inventive concept. Figure 2 is a plan view of a display panel according to an embodiment of the inventive concept. Figure 3A is a cross-sectional view of a display panel according to an embodiment of the inventive concept. Figure 3B is a cross-sectional view of a display panel according to an embodiment of the inventive concept. Figure 3C is a cross-sectional view of a display panel according to an embodiment of the inventive concept.

[0050] The display device DD includes a window WM, a display panel DP, a flexible printed circuit board FPCB, a shielding member EI, a main printed circuit board MPCB, a protective member PTL, and a housing member HM.

[0051] The window WM is arranged on the upper part of the display panel DP. The window WM avoids impacts applied from the outside and penetration of foreign matter to protect the display panel DP. The window WM may be made of a transparent material capable of transmitting an image. For example, the window WM may be composed of glass, sapphire, plastic, etc. The window WM is shown as a single layer, but is not limited to this. The window WM may include a plurality of layers. At the same time, although not shown, the window WM may also include a border area corresponding to the non-display area NDA to be described later, and is not limited to any one embodiment.

[0052] The display panel DP may include a first display substrate 100 and a second display substrate 200. The second display substrate 200 may be disposed on the first display substrate 100. A grayscale display layer for generating an image may be disposed between the first display substrate 100 and the second display substrate 200. Depending on the type of the display panel, the grayscale display layer may include any one of a liquid crystal layer, an organic light emitting layer, and an electrophoretic layer.

[0053] The display panel DP may display an image through the display surface DP-IS. The display surface DP-IS may be parallel to a plane defined by the first direction axis DR1 and the second direction axis DR2. The display surface DP-IS may include a display area DA and a non-display area NDA. The non-display area NDA is defined along an edge of the display surface DP-IS. The display area DA may be surrounded by the non-display area NDA. In an embodiment of the inventive concept, the non-display area NDA may be arranged in an area on one side adjacent to the flexible printed circuit board FPCB.

[0054] The normal direction of the display surface DP-IS (i.e., the thickness direction of the display panel DP) is indicated by the third directional axis DR3. The front surface (or upper surface) and the rear surface (or lower surface) of each component described below are distinguished by the third directional axis DR3. However, the first directional axis DR1, the second directional axis DR2, and the third directional axis DR3 shown in the present embodiment are only exemplary. In the following, the first direction to the third direction are respectively defined as the directions indicated by the first directional axis DR1, the second directional axis DR2, and the third directional axis DR3, and are given the same reference numerals.

[0055] In the embodiment of the present invention, a display panel DP provided with a flat display surface DP-IS is shown, but the embodiment of the present invention is not limited thereto. The display device DD may include a curved display surface or a three-dimensional display surface. The three-dimensional display surface may include a plurality of display areas indicating different directions. In addition, the display device DD may be bent or folded based on a virtual extension line, but is not limited to any one embodiment.

[0056] The display panel DP is disposed on a lower portion of the window WM. The display panel DP generates an image and provides the image to the window WM.

[0057] According to an embodiment of the inventive concept, the display panel DP may be any one of an organic light emitting diode display panel, a liquid crystal display panel, a plasma display panel, an electrophoretic display panel, a micro-electromechanical system display panel, and an electrowetting display panel.

[0058] Reference Figure 2 , shows the planar arrangement relationship between the signal lines SGL and the pixels PX of the display panel DP. The signal lines SGL include gate lines GL, data lines DL, power lines PL, and control signal lines CSL. The gate lines GL are each connected to a corresponding pixel PX, and the data lines DL are each connected to a corresponding pixel PX. The power lines PL are connected to the pixels PX. The control signal lines CSL can provide control signals to the gate drive circuit GDC. The signal lines SGL overlap with the display area DA and the non-display area NDA.

[0059] The plurality of gate lines GL extend along the second direction DR2 and are arranged along the first direction DR1. The plurality of data lines DL and the gate lines GL are insulated while crossing each other. The plurality of data lines DL extend along the first direction DR1 and are arranged along the second direction DR2.

[0060] The auxiliary signal lines PL-D are arranged to overlap with the non-display area NDA and are connected to the data lines DL. The auxiliary signal lines PL-D connected to the data lines DL may be arranged on a different layer from the data lines DL. The data lines DL may be electrically connected to corresponding auxiliary signal lines among the auxiliary signal lines PL-D through the contact holes CH. The contact holes CH pass through at least one insulating layer arranged between the data lines DL and the auxiliary signal lines PL-D. Figure 2 Two contact holes CH are exemplarily shown.

[0061] In an embodiment of the inventive concept, the contact hole CH may be omitted. The data line DL and the auxiliary signal line PL-D may be arranged on the same layer. At this time, among the data line DL and the auxiliary signal line PL-D, the data line and the auxiliary signal line connected to each other may be defined as one signal line. At this time, the data line and the auxiliary signal line connected to each other may be defined as different parts of one signal line.

[0062] Each of the plurality of pixels PX is connected to a corresponding gate line among the plurality of gate lines GL and a corresponding data line among the plurality of data lines DL. Each of the pixels PX may include a pixel driving circuit and a display element.

[0063] Figure 2 The pixels PX are exemplarily shown in a matrix form, but embodiments of the inventive concept are not limited thereto. The pixels PX may be arranged in a pentile form.

[0064] The gate driving circuit GDC may be integrated into the display panel DP through an oxide silicon gate driver circuit (OSG) process or an amorphous silicon gate driver circuit (ASG) process.

[0065] The display panel DP according to the inventive concept includes display pads PD. The display pads PD may be arranged in the non-display area NDA. The display pads PD may be arranged along the second direction DR2.

[0066] The display pads PD are respectively connected to the corresponding pixels PX. Some of the display pads PD are connected to the corresponding pixels PX, and the remaining pads may be connected to the gate driving circuit GDC.

[0067] Refer again Figure 1 , the main printed circuit board MPCB may include a main circuit board MP and a signal control unit SC. The signal control unit SC may be connected to a signal line (not shown) arranged inside the main circuit board MP. The signal control unit SC receives image data and control signals from an external graphic control unit (not shown). The signal control unit SC may provide a control signal to the display panel DP.

[0068] The flexible printed circuit board FPCB may be connected to the display panel DP and the main printed circuit board MPCB through a conductive adhesive member. The conductive adhesive member may include an anisotropic conductive film (ACF). Hereinafter, the conductive adhesive member will be described as an anisotropic conductive film (ACF).

[0069] The flexible printed circuit board FPCB includes a flexible circuit board FP, a driving chip DC, and circuit board pads F-PD and M-PD (see FIG. Figure 4B ). The flexible circuit board FP may have flexibility. Accordingly, the flexible circuit board FP may be provided in various forms corresponding to the purpose and form of the display panel DP.

[0070] exist Figure 1 In the embodiment, for the convenience of description, one flexible printed circuit board FPCB is shown, but the embodiments of the present inventive concept are not limited thereto. A plurality of flexible printed circuit boards arranged along the second direction DR2 or a pair of flexible printed circuit boards formed by overlapping some parts thereof may be included, but the embodiments of the present inventive concept are not limited thereto.

[0071] The driving chip DC may be mounted on the flexible circuit board FP in the form of a chip on film (COF). The driving chip DC may include a driving element for driving the pixel PX, for example, a data driving circuit.

[0072] The shielding member EI is arranged on the flexible printed circuit board FPCB. The shielding member EI may expose at least a portion of the flexible printed circuit board FPCB. The shielding member EI may prevent or reduce electrical interference between other components of the display device DD and the flexible printed circuit board FPCB. In addition, the shielding member EI may block static electricity introduced from the outside and may be arranged on the flexible printed circuit board FPCB to protect the flexible printed circuit board FPCB.

[0073] The protection member PTL is disposed on the lower portion of the display panel DP. The protection member PTL may include a functional layer necessary for assisting the driving of the display panel DP. For example, the protection member PTL may include at least one of a support layer, an impact absorbing layer, a heat dissipation layer, and a light blocking layer.

[0074] The support layer supports the display panel DP. The support layer may include a thermoplastic resin. For example, the support layer may include polyethylene terephthalate (PET), and thus, may be excellent in fatigue strength, electrical properties, and heat resistance and may be less affected by temperature and humidity.

[0075] The impact absorbing layer may be a synthetic resin foam. The impact absorbing layer may be provided as a matrix layer including a plurality of pores. The pores have a porous structure and thus may easily absorb external impact applied to the display device DD.

[0076] The light blocking layer may be used to solve a problem in which components arranged on the rear surface of the display panel DP are projected through the window WM. The light blocking layer may block light emitted from the display panel DP to the rear surface.

[0077] The shell member HM accommodates the display panel DP. The shell member HM may be coupled to the window WM, and defines the appearance of the display device DD. The shell member HM absorbs impacts applied from the outside and prevents foreign matter / moisture, etc. from penetrating into the display device DD, thereby protecting the components accommodated in the shell member HM. Meanwhile, although not shown, the shell member HM may be provided in the form of a plurality of shell members coupled to each other.

[0078] Reference Figure 3A According to an embodiment of the inventive concept, the grayscale display layer of the display panel DP may be a liquid crystal layer LC. Accordingly, the display panel DP may be a liquid crystal display panel. The pixel PX of the liquid crystal display panel may include a transistor TR, a liquid crystal capacitor Clc, and a storage capacitor Cst.

[0079] The transistor TR includes a control electrode GE connected to a gate line, an active cell AL overlapping the control electrode GE, an input electrode SE connected to a data line, and an output electrode DE arranged to be spaced apart from the input electrode SE. The liquid crystal capacitor Clc includes a pixel electrode PE and a common electrode CE. The storage capacitor Cst includes the pixel electrode PE and a portion of the storage line STL overlapping the pixel electrode PE.

[0080] The control electrode GE and the storage line STL are arranged on one surface of the first base substrate BS1. The first base substrate BS1 may be any one of a glass substrate, a plastic substrate, and a substrate containing polyimide (PI). On one surface of the first base substrate BS1, a first insulating layer 10 covering the control electrode GE and the storage line STL is arranged. The first insulating layer 10 may include at least one of an inorganic material and an organic material.

[0081] On the first insulating layer 10, an active cell AL overlapping the control electrode GE is arranged. The active cell AL may include a semiconductor layer SCL and an ohmic contact layer OCL. The semiconductor layer SCL is arranged on the first insulating layer 10, and the ohmic contact layer OCL is arranged on the semiconductor layer SCL.

[0082] The semiconductor layer SCL may include amorphous silicon or crystalline silicon. In addition, the semiconductor layer SCL may include a metal oxide semiconductor. The ohmic contact layer OCL may include a dopant doped at a higher density than the semiconductor layer SCL. The ohmic contact layer OCL may include two portions spaced apart from each other. In an embodiment of the inventive concept, the ohmic contact layer OCL may have a single body shape.

[0083] The output electrode DE and the input electrode SE are arranged on the active cell AL. The output electrode DE and the input electrode SE are arranged to be spaced apart from each other. On the first insulating layer 10, a second insulating layer 20 covering the active cell AL, the output electrode DE, and the input electrode SE is arranged. A third insulating layer 30 is arranged on the second insulating layer 20. The second insulating layer 20 and the third insulating layer 30 may include at least one of an inorganic material and an organic material. The third insulating layer 30 may be a single-layer organic layer providing a flat surface. In the present embodiment, the third insulating layer 30 may include a plurality of color filters. On the third insulating layer 30, a fourth insulating layer 40 is arranged. The fourth insulating layer 40 may be an insulating layer covering the color filter.

[0084] like Figure 3A As shown in FIG, the pixel electrode PE is disposed on the fourth insulating layer 40. The pixel electrode PE is connected to the output electrode DE through a contact hole CH passing through the second insulating layer 20, the third insulating layer 30 and the fourth insulating layer 40. An alignment film (not shown) covering the pixel electrode PE may be disposed on the fourth insulating layer 40.

[0085] The second base substrate BS2 may be any one of a glass substrate, a plastic substrate, and a substrate containing polyimide (PI). On the lower surface of the second base substrate BS2, a black matrix layer BM is arranged. That is, on the black matrix layer BM, an opening corresponding to the pixel area may be defined. The spacer CS may be arranged to overlap with the black matrix layer BM.

[0086] An insulating layer covering the black matrix layer BM is disposed on the lower surface of the second base substrate BS2 . Figure 3A The fifth insulating layer 50 providing a flat surface is exemplarily shown. The fifth insulating layer 50 may include an organic material.

[0087] The common electrode CE is disposed on the lower surface of the second base substrate BS2. An alignment film (not shown) may be disposed on the common electrode CE.

[0088] The common electrode CE according to an embodiment may include a transmissive metal such as a transparent conductive oxide (TCO).

[0089] A common voltage is applied to the common electrode CE. The common voltage may have a different value from the pixel voltage, or may have the same value. In a liquid crystal display panel in a vertical alignment (VA) mode, when the common voltage and the pixel voltage have the same value, the potential difference is zero, and at this time, the common voltage may be applied to the common electrode CE in the display area DA (see Figure 1 ) displays a black screen.

[0090] at the same time, Figure 3A The cross section of the pixel PX shown in FIG. 1 is merely exemplary. The first display substrate 100 and the second display substrate 200 may be reversed in the third direction DR3. A color filter may be disposed on the second display substrate 200.

[0091] Reference Figure 3A , a liquid crystal display panel in a vertical alignment mode has been exemplarily described. However, in an embodiment of the present inventive concept, any one of an in-plane switching (IPS) mode, a fringe field switching (FFS) mode, a plane line switching (PLS) mode, and a vertical alignment (VA) mode may be applied, and the liquid crystal display panel is not limited to any one specific mode.

[0092] Reference Figure 3B , the grayscale display layer of the display panel DP according to the embodiment of the inventive concept may include an organic light emitting layer EML. Accordingly, the display panel DP may be an organic light emitting display panel. The pixel PX of the organic light emitting display panel may include a switching transistor T1, a driving transistor T2, and a light emitting diode OLED.

[0093] The organic light emitting display panel includes a display substrate 100 and an encapsulation substrate 200. The display substrate 100 includes a first base substrate BS1, a circuit element layer DP-CL arranged on the first base substrate BS1, a display element layer DP-OLED arranged on the circuit element layer DP-CL, and a cover layer CL arranged on the display element layer DP-OLED. The encapsulation substrate 200 may include a second base substrate BS2, a black matrix layer BM arranged on the second base substrate BS2, and a color conversion layer CCL.

[0094] The first base substrate BS1 may be any one of a glass substrate, a plastic substrate, and a substrate containing polyimide (PI). The circuit element layer DP-CL includes at least one insulating layer and a circuit element. The circuit element includes a signal line and a driving circuit of a pixel, etc. The circuit element layer DP-CL may be formed by a formation process of an insulating layer, a semiconductor layer, and a conductive layer by coating, deposition, etc., and a patterning process of the insulating layer, the semiconductor layer, and the conductive layer by a photolithography process.

[0095] In this embodiment, the circuit element layer DP-CL may include a buffer film BFL, a first insulating layer 10, a second insulating layer 20, and a third insulating layer 30. The first insulating layer 10 and the second insulating layer 20 may be inorganic films, and the third insulating layer 30 may be an organic film.

[0096] Figure 3B The arrangement relationship of the first semiconductor pattern OSP1, the second semiconductor pattern OSP2, the first control electrode GE1, the second control electrode GE2, the first input electrode DE1, the first output electrode SE1, the second input electrode DE2, and the second output electrode SE2, which all constitute the switching transistor T1 and the driving transistor T2, is exemplarily shown. The first through hole CH1, the second through hole CH2, the third through hole CH3, and the fourth through hole CH4 are also exemplarily shown.

[0097] The display element layer DP-OLED includes a light emitting diode OLED. The display element layer DP-OLED may include an organic light emitting diode as the light emitting diode OLED. The display element layer DP-OLED includes a pixel defining layer PDL. For example, the pixel defining layer PDL may be an organic layer.

[0098] When the third insulating layer 30 is an intermediate organic film, the first electrode AE ​​is arranged on the intermediate organic film 30. The first electrode AE ​​is connected to the second output electrode SE2 through the fifth through hole CH5 passing through the intermediate organic film 30. An opening OP is defined on the pixel defining film PDL. The opening OP of the pixel defining film PDL exposes at least a portion of the first electrode AE. The opening OP of the pixel defining film PDL is called a light emitting opening to distinguish it from other openings.

[0099] like Figure 3B As shown in , the display panel DP may include a light emitting area PXA and a non-light emitting area NPXA adjacent to the light emitting area PXA. The non-light emitting area NPXA may surround the light emitting area PXA. In this embodiment, the light emitting area PXA is defined to correspond to a certain portion of the first electrode AE ​​exposed by the light emitting area PXA.

[0100] A hole control layer HCL may be commonly arranged in the light emitting area PXA and the non-light emitting area NPXA. The hole control layer HCL includes a hole transport layer and may further include a hole injection layer. An organic light emitting layer EML is arranged on the hole control layer HCL. The organic light emitting layer EML may be commonly arranged in the light emitting area PXA and the non-light emitting area NPXA. However, embodiments of the inventive concept are not limited thereto. In an embodiment, the organic light emitting layer EML may be arranged in the light emitting area PXA and may not be arranged in the non-light emitting area NPXA. The organic light emitting layer EML may include an organic substance and / or an inorganic substance. The organic light emitting layer EML may generate a predetermined light, for example, blue light.

[0101] An electron control layer ECL is arranged on the organic light emitting layer EML. The electron control layer ECL includes an electron transport layer and may further include an electron injection layer. The hole control layer HCL and the electron control layer ECL may be formed in common in a plurality of pixels PX using an open mask. A second electrode CE is arranged on the electron control layer ECL. The second electrode CE is arranged in common in a plurality of pixels. A cover layer CL for protecting the second electrode CE may be arranged on the second electrode CE. The cover layer CL may include an organic material or an inorganic material.

[0102] The second base substrate BS2 is arranged to be spaced apart from the cover layer CL. The second base substrate BS2 may be any one of a glass substrate, a plastic substrate, and a substrate including polyimide (PI). Depending on the pixel PX, the color conversion layer CCL may transmit the first color light, or may convert the first color light into the second color light or the third color light. The color conversion layer CCL may include quantum dots.

[0103] In an embodiment of the present inventive concept, the encapsulation substrate 200 may be replaced by a thin film encapsulation layer including a plurality of inorganic layers and an organic layer sealed by the inorganic layers. At this time, the black matrix layer BM and the color conversion layer CCL may be disposed on the thin film encapsulation layer.

[0104] Reference Figure 3C , the grayscale display layer of the display panel DP according to the embodiment of the inventive concept may include an organic light emitting layer EML. Accordingly, the display panel DP may be an organic light emitting display panel. The pixel PX of the organic light emitting display panel may include a switching transistor T1, a driving transistor T2, and a light emitting diode OLED.

[0105] The organic light emitting display panel includes a lower substrate 100 and an upper substrate 200. The lower substrate 100 includes a first base substrate BS1, a circuit element layer DP-CL arranged on the first base substrate BS1, and a display element layer DP-OLED arranged on the circuit element layer DP-CL. The upper substrate 200 may include a second base substrate BS2 and an input sensing panel ISL arranged on the second base substrate BS2.

[0106] In this embodiment, the display element layer DP-OLED may further include an encapsulation layer TFE. The encapsulation layer TFE is arranged on the light emitting diode OLED and encapsulates the light emitting diode OLED. Meanwhile, although not shown, a covering layer covering the second electrode CE may be arranged between the second electrode CE and the encapsulation layer TFE.

[0107] The encapsulation layer TFE may include a first inorganic layer LIL, an organic layer OEL, and a second inorganic layer UIL, all of which are sequentially laminated in a thickness direction. However, embodiments of the inventive concept are not limited thereto, and the encapsulation layer TFE may also include a plurality of inorganic layers and a plurality of organic layers.

[0108] The first inorganic layer LIL may cover the second electrode CE. The first inorganic layer LIL may prevent external moisture or oxygen from penetrating into the light emitting diode OLED. For example, the first inorganic layer LIL may include silicon nitride, silicon oxide, or a compound thereof. The first inorganic layer LIL may be formed by a chemical vapor deposition process.

[0109] The organic layer OEL may be arranged on the first inorganic layer LIL and in contact with the first inorganic layer LIL. The organic layer OEL may provide a flat surface on the first inorganic layer LIL. Protrusions formed on the upper surface of the first inorganic layer LIL or particles present on the first inorganic layer LIL are covered by the organic layer OEL, so that the surface state of the upper surface of the first inorganic layer LIL can be prevented from affecting the components formed on the organic layer OEL. In addition, the organic layer OEL can relieve stress between contact layers. The organic layer OEL may include an organic material and may be formed by a solution process such as spin coating, slit coating, and inkjet process.

[0110] The second inorganic layer UIL is arranged on the organic layer OEL and covers the organic layer OEL. Compared with being arranged on the first inorganic layer LIL, the second inorganic layer UIL can be stably formed on a relatively flat surface. The second inorganic layer UIL encapsulates moisture and the like discharged from the organic layer OEL and prevents the moisture from being transmitted to the outside. The second inorganic layer UIL may include silicon nitride, silicon oxide, or a compound thereof. The second inorganic layer UIL may be formed by a chemical vapor deposition process.

[0111] The input sensing panel ISL is arranged on the encapsulation layer TFE. The input sensing panel ISL may be directly arranged on the encapsulation layer TFE, and may be formed with the encapsulation layer TFE through a continuous process. Therefore, the input sensing panel ISL may be referred to as a "layer". However, the embodiments of the present inventive concept are not limited thereto. The input sensing panel ISL may be provided as a separate unit, and may be arranged on the encapsulation layer TFE by an adhesive member (not shown) arranged on the encapsulation layer TFE.

[0112] The input sensing panel ISL may include a plurality of conductive patterns and a plurality of sensing insulating layers. The input sensing panel ISL may sense external input. For example, the external input may include various forms of input provided from outside the display device DD. The external input applied from the outside may be provided in various forms. For example, the external input may include not only contact through a part of the user's body (such as a hand), but also external input applied in close proximity to the display device DD or adjacent to the display device DD by a predetermined distance (e.g., hovering). In addition, the external input may have various forms, such as force, pressure, and light, but is not limited to any one embodiment.

[0113] The input sensing panel ISL may sense an external input through any one of a self-capacitance type method or a mutual capacitance type method. A conductive pattern included in the input sensing panel ISL may be variously changed corresponding to a method to be arranged and connected.

[0114] The conductive pattern is arranged to overlap with the non-light emitting area NPXA and to be spaced apart from the light emitting area PXA. Accordingly, even when the conductive pattern is arranged on the display element layer DP-OLED, interference with light generated in the pixel PX can be minimized.

[0115] Figure 4A is a cross-sectional view of a display device DD according to an embodiment of the inventive concept. Figure 4B is a rear view of a flexible printed circuit board according to an embodiment of the present inventive concept. Figure 4C is a cross-sectional view illustrating a flexible printed circuit board and a shielding member according to an embodiment of the inventive concept. Figure 5 yes Figure 4A The same / similar reference numerals are used for the display panel and the flexible printed circuit board connected thereto. Figures 1 to 3B Those components that are the same / similar to those of FIG. 1 and their redundant descriptions are omitted.

[0116] exist Figure 4AIn the embodiment, among the window WM, the display panel DP, the flexible printed circuit board FPCB, the main printed circuit board MPCB, the shielding member EI, the protection member PTL and the housing member HM of the display device DD, the window WM and the housing member HM are omitted. The main printed circuit board MPCB includes a main circuit board MP and a signal control unit SC, and the flexible printed circuit board FPCB includes a flexible circuit board FP and a driving chip DC.

[0117] The flexible printed circuit board FPCB according to the present invention may be bent at a predetermined curvature. For example, the flexible printed circuit board FPCB may be bent at a predetermined curvature based on a virtual bending axis AX extending along the second direction DR2. Accordingly, the rear surface FB of the flexible printed circuit board FPCB may be bent toward the rear surface of the display panel DP. At this time, the shielding member EI arranged on the front surface FU of the flexible printed circuit board FPCB may also be bent, and the stress applied to the shielding member EI due to the bending may be transmitted to the flexible printed circuit board FPCB.

[0118] According to the present inventive concept, the shielding member EI exposes at least a portion of the front surface FU of the flexible printed circuit board FPCB, thereby preventing or reducing the stress applied to the shielding member EI during bending from being transmitted to the flexible printed circuit board FPCB.

[0119] The protection member PTL includes a front surface PTL-U and a rear surface PTL-B opposite to the front surface PTL-U. The front surface PTL-U may contact the display panel DP.

[0120] The main printed circuit board MPCB may be arranged on the rear surface PTL-B of the protection member PTL. For example, the main printed circuit board MPCB connected to the flexible printed circuit board FPCB may contact the rear surface PTL-B of the protection member PTL during bending of the flexible printed circuit board FPCB, so that the main printed circuit board MPCB may be securely coupled to the protection member PTL.

[0121] Figure 4B A back surface FB of a flexible printed circuit board FPCB according to an embodiment of the present inventive concept is shown. The flexible printed circuit board FPCB according to the present inventive concept includes a front surface FU and a back surface FB opposite to the front surface FU. The flexible printed circuit board FPCB includes a substrate signal line SL, a driving chip DC arranged on the back surface FB, a plurality of substrate pads F-PD and M-PD exposed from the back surface FB, and a connection pad CPD.

[0122] The connection pads CPD are connected to the connection terminals of the driving chip DC. The substrate pads F-PD and M-PD may include a first pad F-PD connected to the display panel DP and a second pad M-PD connected to the main printed circuit board MPCB.

[0123] The substrate signal line SL connects the connection pad CPD and the first pad F-PD, and connects the connection pad CPD and the second pad M-PD. When the driving chip DC is omitted, the substrate signal line SL may connect the first pad F-PD and the second pad M-PD.

[0124] Another flexible printed circuit board FPCB of the present inventive concept may include first and second bending areas BA1 and BA2 arranged in the first direction DR1 based on a bending axis AX extending along the second direction DR2 .

[0125] When the flexible printed circuit board FPCB is Figure 4A When bent as shown in FIG. 1 , the first bending area BA1 and the second bending area BA2 may be divided based on an intersection between the flexible printed circuit board FPCB and an imaginary line extending in the first direction DR1 from the bending axis AX.

[0126] According to the inventive concept, the intersection point between the flexible printed circuit board FPCB and the imaginary line extending in the first direction DR1 from the bending axis AX may be defined as a point having a minimum radius of curvature in the flexible printed circuit board FPCB. Therefore, the intersection point between the flexible printed circuit board FPCB and the imaginary line extending in the first direction DR1 from the bending axis AX during bending may be a portion of the flexible printed circuit board FPCB having the maximum stress applied during bending.

[0127] Reference Figure 4C , the shielding member EI according to the present inventive concept may be arranged only on a portion of the flexible printed circuit board FPCB. For example, the shielding member EI may be arranged on a portion of the first bending area BA1 of the flexible printed circuit board FPCB, and may be arranged on the entire surface of the second bending area BA2 to cover the second bending area BA2.

[0128] According to the present invention, in the shielding member EI, a length TH of a portion of the shielding member EI covering the first bending area BA1 from a boundary between the first bending area BA1 and the second bending area BA2 may be 300 μm or less.

[0129] When the length TH of the portion of the shielding member EI covering the first bending area BA1 is greater than 300 μm, the stress applied to the shielding member EI due to bending is transmitted to the flexible printed circuit board FPCB, and as a result, the display pads PD (see FIG. 1 ) of the display panel DP are Figure 2) and the first pad F-PD of the flexible printed circuit board FPCB will peel off.

[0130] According to the inventive concept, the shielding member EI disposed on the flexible printed circuit board FPCB exposes at least a portion of the flexible printed circuit board FPCB, so that stress applied to the flexible printed circuit board FPCB by the shielding member EI can be reduced even during bending. In particular, according to the inventive concept, the shielding member EI exposes a region of the flexible printed circuit board FPCB that overlaps with a region where the display panel DP and the flexible printed circuit board FPCB are joined, so that even when the flexible printed circuit board FPCB is bent, the peeling problem of the flexible printed circuit board FPCB and the display panel DP can be solved, and a display device DD with improved reliability can be provided.

[0131] Figure 5 The first display substrate 100 shown in FIG. Figure 4A The first display substrate 100 shown in FIG.

[0132] Reference Figure 5 , the display pad PD is connected to the auxiliary signal line PL-D through the contact hole CH-P passing through the first to fourth insulating layers 10 to 40 arranged on the first base substrate BS1. The display pad PD is exposed from the first to fourth insulating layers 10 to 40. When the display pad PD is omitted, the end of the auxiliary signal line PL-D may be exposed from the first to fourth insulating layers 10 to 40.

[0133] As the flexible printed circuit board FPCB, a flexible printed circuit board FPCB including an insulating layer IL, a substrate signal line SL, a solder resist layer SR, and a first pad F-PD is exemplarily shown.

[0134] The solder resist layer SR may have an opening exposing at least a portion of the substrate signal line SL. The first pad F-PD may be connected to the substrate signal line SL exposed through the opening of the solder resist layer SR. The first pad F-PD is electrically connected to the display pad PD through the anisotropic conductive film ACF.

[0135] The anisotropic conductive film ACF according to the present embodiment may include an adhesive resin and a plurality of conductive balls dispersed in the adhesive resin. As an example, the adhesive resin may include resin.

[0136] The anisotropic conductive film ACF is disposed between the first pad F-PD and the display pad PD, and the first pad F-PD and the display pad PD may be bonded by a thermal compression process.

[0137] In the present embodiment, the bonding length AT of the anisotropic conductive film ACF in the first direction may be 150 μm to 250 μm. When the bonding length AT is less than 150 μm, the anisotropic conductive film ACF applied between the first pad F-PD and the display pad PD may not be able to bond the first pad F-PD and the display pad PD even during hot pressing, so that a peeling problem between the first pad F-PD and the display pad PD may occur. When the bonding length AT is greater than 250 μm, the area where the flexible printed circuit board FPCB contacts the display panel DP becomes wider, so that unnecessary space is generated in the display panel DP.

[0138] Fig. 6A is a cross-sectional view illustrating a flexible printed circuit board and a shielding member according to an embodiment of the inventive concept. Figure 6B are cross-sectional views of some components of a display device according to an embodiment of the inventive concept. Fig. 7A is a cross-sectional view illustrating a flexible printed circuit board and a shielding member according to an embodiment of the inventive concept. Figure 7B is a cross-sectional view of some components of a display device according to an embodiment of the inventive concept. Figures 1 to 5 Those components that are the same / similar to those of FIG. 1 and their redundant descriptions are omitted.

[0139] Reference Fig. 6A and Figure 6B , the shielding member EI-A according to the present inventive concept may be arranged only in the second bending area BA2 in the flexible printed circuit board FPCB. Accordingly, the first bending area BA1 may be exposed from the shielding member EI-A. Therefore, in a state where the flexible printed circuit board FPCB is bent along the bending axis AX, an end of the shielding member EI-A may contact a virtual line extending from the bending axis AX in the first direction DR1.

[0140] Reference Fig. 7A and Figure 7B , the shielding member EI-B according to the present inventive concept may expose the entire surface of the first bending area BA1 and a portion of the second bending area BA2 in the flexible printed circuit board FPCB. Therefore, in a state where the flexible printed circuit board FPCB is bent along the bending axis AX, the end of the shielding member EI-B may be spaced apart from the virtual line extending from the bending axis AX in the first direction DR1.

[0141] According to the present embodiment, the end of the shielding member EI-A is arranged at a point having a minimum radius of curvature when the flexible printed circuit board FPCB is bent, or the shielding member EI-B is arranged to be spaced apart from the point having a minimum radius of curvature, so that even when the flexible printed circuit board FPCB is bent, stress caused by bending of the shielding members EI-A and EI-B can be alleviated. In addition, the area where the display panel DP and the flexible printed circuit board FPCB are bonded is spaced apart from the area where the shielding members EI-A and EI-B are arranged, so that peeling between the display panel DP and the flexible printed circuit board FPCB can be alleviated even when the flexible printed circuit board FPCB is bent.

[0142] Figure 8 is a cross-sectional view illustrating a flexible printed circuit board and a shielding member according to an embodiment of the inventive concept. Fig. 9 is a cross-sectional view showing a flexible printed circuit board and a shielding member according to an embodiment of the inventive concept. Figures 1 to 7B Those components that are the same / similar to those of FIG. 1 and their redundant descriptions are omitted.

[0143] Reference Figure 8 and Fig. 9 , the shielding member EI-C according to the present embodiment may include an adhesive layer AD and a fabric layer FP. The adhesive layer AD may be arranged on and in contact with the flexible printed circuit board FPCB. The fabric layer FP is arranged on the adhesive layer AD. The fabric layer FP is a layer including fibers and is not limited to any material as long as the material has a shielding function.

[0144] In addition, refer to Fig. 9 According to the present embodiment, the shielding member EI-D may further include a shielding layer ED and an adhesive film TP. In the present embodiment, the adhesive layer AD and the fabric layer FP included in the shielding layer ED may be the same as those in the reference Figure 8 The adhesive layer AD and fabric layer FP are described to have the same configuration.

[0145] In the present embodiment, the adhesive film TP may include a first adhesive layer AH1, a film layer PI, and a second adhesive layer AH2.

[0146] The first adhesive layer AH1 may cover a portion of the flexible printed circuit board FPCB. The film layer PI is arranged on the first adhesive layer AH1 and may include a material capable of reducing stress during bending. For example, the film layer PI may include any one of polyimide (PI) and polyethylene terephthalate (PET). The second adhesive layer AH2 may be arranged on the film layer PI.

[0147] exist Fig. 9, the adhesive film TP is shown as being arranged only in the second bending area BA2 of the flexible printed circuit board FPCB. However, embodiments of the inventive concept are not limited thereto. An end of the adhesive film TP may be arranged at a boundary of the first bending area BA1 and the second bending area BA2, or a portion of the adhesive film TP may cover a portion of the first bending area BA1, but is not limited to any one embodiment.

[0148] Figure 8 The adhesive layer AD and Fig. 9 The first adhesive layer AH1 and the second adhesive layer AH2 may be provided as a tape having adhesive properties, or may be an organic adhesive layer, such as an optically transparent adhesive film (OCA) or an optically transparent resin (OCR) or a pressure-sensitive adhesive film (PSA). The organic adhesive layer may include an adhesive material, such as a polyurethane adhesive material, a polypropylene adhesive material, a polyester adhesive material, a polyepoxy adhesive material, a polyvinyl acetate adhesive material, etc., but is not limited to any one embodiment.

[0149] exist Fig. 9 , the adhesive film TP is exemplarily shown as covering a portion of the second bending area BA2. However, embodiments of the present inventive concept are not limited thereto. The adhesive film TP may cover a portion of the first bending area BA1, or an end of the adhesive film TP may overlap the bending axis AX, but is not limited to any one embodiment.

[0150] Fig.10 is a cross-sectional view of a display device DD according to an embodiment of the inventive concept. Fig.11 is a cross-sectional view of a display device DD according to an embodiment of the inventive concept. Fig.12 is a cross-sectional view of a display device DD according to an embodiment of the inventive concept. Figures 1 to 9 Those components that are the same / similar to those of FIG. 1 and their redundant descriptions are omitted.

[0151] Reference Fig.10 According to the present embodiment, the display device DD may include a display panel DP having a first display substrate 100 and a second display substrate 200, a flexible printed circuit board FPCB having a flexible circuit board FP and a driving chip DC, a shielding member EI, a main printed circuit board MPCB having a main circuit board MP and a signal control unit SC, and a protective member PTL, and may also include a spacer SP.

[0152] The display device DD according to the inventive concept may further include a spacer SP. The spacer SP may protect the driving chip DC from an external impact by covering the driving chip DC during bending.

[0153] In the bent state, the spacer SP may contact one side surface PTL-S of the protection member PTL and a portion of the rear surface DP-B of the display panel DP. The spacer SP may surround the driving chip DC by being arranged on the rear surface FB of the flexible printed circuit board FPCB where the driving chip DC is arranged. The spacer SP is not limited to any material as long as the material can absorb impact.

[0154] Reference Fig.11 According to the present embodiment, the display device DD may include a display panel DP having a first display substrate 100 and a second display substrate 200, a flexible printed circuit board FPCB having a flexible circuit board FP and a driving chip DC, a shielding member EI, a main printed circuit board MPCB having a main circuit board MP and a signal control unit SC, and a protective member PTL, and may also include a stress buffering member FM.

[0155] The display device DD according to the inventive concept may further include a stress buffering member FM. The stress buffering member FM may be arranged adjacent to the area where the display panel DP and the flexible printed circuit board FPCB are connected during bending. For example, the stress buffering member FM may be arranged on the side surface DP-S of the display panel DP adjacent to the area where the display panel DP and the flexible printed circuit board FPCB are connected among the side surfaces of the display panel DP, and on a portion of the back surface FB of the flexible printed circuit board FPCB to reduce stress applied during bending of the flexible printed circuit board FPCB. The stress buffering member FM may include a resin.

[0156] Reference Fig.12 According to the present embodiment, the display device DD may include a display panel DP having a first display substrate 100 and a second display substrate 200, a flexible printed circuit board FPCB having a flexible circuit board FP and a driving chip DC, a shielding member EI, a main printed circuit board MPCB having a main circuit board MP and a signal control unit SC, and a protective member PTL.

[0157] One of the side surfaces of the display panel DP according to the present embodiment may include inclined surfaces S1 and S3 having predetermined angles and a side surface S2 connecting the inclined surfaces S1 and S3 .

[0158] For example, among the side surfaces of the display panel DP, a side surface DP-S of the display panel DP adjacent to the area connecting the display panel DP and the flexible printed circuit board FPCB may include a first inclined surface S1 inclined at a predetermined angle from the front surface 100-U of the first display substrate 100, a second inclined surface S3 inclined at a predetermined angle from the rear surface 100-B of the first display substrate 100, and a side surface S2 extending in a third direction DR3 and connecting the inclined surfaces S1 and S3.

[0159] According to the present embodiment, one side surface of the display panel DP includes the inclined surfaces S1 and S3 , and thus, an impact applied from an edge of the display panel DP when the flexible printed circuit board FPCB is bent may be mitigated.

[0160] A display device according to an embodiment of the inventive concept includes a flexible printed circuit board connected to a display panel and bent at a predetermined radius of curvature, and a shielding member arranged on the flexible printed circuit board. The flexible printed circuit board is divided into a plurality of bending regions based on a point where the radius of curvature is the smallest, and the shielding member exposes at least a portion of one bending region, so that even during bending, stress applied to the flexible printed circuit board by the shielding member can be reduced.

[0161] As a result, even when the flexible printed circuit board is bent, the peeling problem of the flexible printed circuit board and the display panel can be solved, and a display device with improved reliability can be provided.

[0162] Although certain exemplary embodiments and implementations have been described herein, other embodiments and variations will be apparent from this description. Therefore, the inventive concept is not limited to these embodiments, but to the broader scope of the appended claims and to various obvious modifications and equivalent arrangements apparent to those of ordinary skill in the art.

Claims

1. A display device, comprising: A display panel including a front surface and a rear surface opposite to the front surface, and including a plurality of display pads arranged on the front surface and aligned in one direction; a flexible printed circuit board connected to the display pad and bent toward the rear surface of the display panel along an imaginary bending axis extending in the one direction; as well as a shielding member arranged on the flexible printed circuit board, wherein the flexible printed circuit board includes a first bending area and a second bending area based on an intersection with an imaginary line extending from the bending axis in a cross direction intersecting the one direction, the first bending area is adjacent to the display pad, the second bending area is adjacent to the rear surface of the display panel, and the shielding member covers the second bending area and completely exposes at least a portion of the first bending area spaced apart from the second bending area, and The shielding member further includes an adhesive layer in contact with the flexible printed circuit board and a fabric layer arranged on the adhesive layer, and the fabric layer is a layer including a fiber material.

2. The display device according to claim 1, wherein: The shielding member covers a portion of the first bending region.

3. The display device according to claim 2, wherein: In the shielding member, a length of the shielding member covering the portion of the first bending region from a boundary of the first bending region and the second bending region is 300 μm or less.

4. The display device according to claim 1, wherein: The shielding member further includes an adhesive film disposed between the flexible printed circuit board and the adhesive layer, and the adhesive film includes: a first adhesive layer, covering the flexible printed circuit board; a film layer disposed on the first adhesive layer and including any one of polyimide and polyethylene terephthalate; and The second adhesive layer is arranged on the film layer.

5. The display device according to claim 1, wherein: The flexible printed circuit board includes a flexible circuit board including a front surface on which the shielding member is arranged and a rear surface opposite to the front surface, and a driving chip mounted on the rear surface of the flexible circuit board. 6 . The display device of claim 5 , further comprising a spacer disposed on the rear surface of the flexible circuit board and surrounding the driving chip.

7. The display device according to claim 5, wherein: The display panel includes a side surface connecting the front surface of the display panel and the rear surface of the display panel, and the display device also includes a stress buffering member, which contacts one of the side surfaces adjacent to the display pad and a rear surface of the flexible printed circuit board overlapping the first bending area. 8 . The display device of claim 1 , further comprising a protection member disposed between the display panel and the second bending region.

9. The display device of claim 8, further comprising a main printed circuit board connected to the second bending area, wherein: The main printed circuit board is arranged on the protection member.

10. The display device according to claim 1, wherein: The display panel includes a side surface connecting the front surface of the display panel and the rear surface of the display panel, and One of the side surfaces adjacent to the display pad includes: a first inclined surface inclined at a predetermined angle from the front surface of the display panel; a second inclined surface inclined at a predetermined angle from the rear surface of the display panel; and A side surface connects the first inclined surface and the second inclined surface.

11. The display device according to claim 1, wherein: The display pad and the flexible printed circuit board are bonded using an anisotropic conductive film, and a bonding length of the anisotropic conductive film in a crossing direction intersecting the one direction is 150 μm to 250 μm.

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