Gold finger cleaning device

Abstract

The present invention discloses a gold finger cleaning device, comprising: a frame, a workbench is arranged on the frame, a drive shaft column is arranged on the workbench; a drive mechanism, the drive mechanism is arranged on the drive shaft column; a dust-free cloth mechanism, the dust-free cloth mechanism is connected to the drive mechanism; a wiping mechanism, the wiping mechanism is connected to the drive mechanism and arranged below the dust-free cloth mechanism, the wiping mechanism is used to wipe the gold finger; a detection and positioning mechanism, the detection and positioning mechanism is arranged on one side of the wiping mechanism; a support frame assembly, the support frame assembly is connected to a width adjustment mechanism. The technical solution of the present invention saves manpower for wiping and detection, and can improve production capacity.

Description

Technical Field

[0001] The invention relates to the technical field of PCB board cleaning equipment, and in particular to a gold finger cleaning device. Background Art

[0002] Gold fingers refer to the golden strips of metal that various boards are inserted into the slots. After low-pressure injection molding of the wiring harness, the gold fingers of the PCB board may be dirty and need to be cleaned to ensure its signal transmission performance.

[0003] At present, in the cleaning of gold fingers, the existing cleaning equipment is inefficient and difficult to clean the gold fingers during large-scale production of PCB boards. Summary of the invention

[0004] The main purpose of the present invention is to provide a gold finger cleaning device, aiming to solve the current technical problem of low gold finger cleaning efficiency.

[0005] To achieve the above object, the present invention provides a gold finger cleaning device, comprising:

[0006] A frame, wherein the frame is provided with a workbench, and the workbench is provided with a drive shaft column;

[0007] A driving mechanism, wherein the driving mechanism is arranged on the driving shaft column;

[0008] A dust-free cloth mechanism, wherein the dust-free cloth mechanism is connected to the driving mechanism;

[0009] A wiping mechanism, the wiping mechanism is connected to the driving mechanism and is arranged below the dust-free cloth mechanism, and the wiping mechanism is used to wipe the gold finger;

[0010] A detection and positioning mechanism, wherein the detection and positioning mechanism is arranged on one side of the wiping mechanism;

[0011] The support frame assembly includes a plurality of groups of support frames, the support frame assembly is arranged between the drive shaft columns and below the wiping mechanism, the support frame assembly is connected to a width adjustment mechanism, and the width adjustment mechanism is used to adjust the distance between each group of support frames.

[0012] Optionally, the driving mechanism includes: a Y-axis active module, a Y-axis driven module, a Z-axis module and an X-axis module;

[0013] A crossbeam is arranged on the top of the driving shaft column, the Y-axis active module and the Y-axis driven module are arranged on the crossbeam, the X-axis module is slidably connected to the Y-axis active module and the Y-axis driven module, and the Z-axis module is slidably connected to the X-axis module.

[0014] Optionally, the wiping mechanism and the dust-free cloth mechanism are both connected to the Z-axis module.

[0015] Optionally, the dust-free cloth mechanism comprises a receiving wheel and a discharging wheel, and the dust-free cloth is wound around the receiving wheel after being released by the discharging wheel;

[0016] The material receiving wheel is arranged on the material receiving shaft, the material discharging wheel is arranged on the material discharging shaft, and both the material receiving shaft and the material discharging shaft are arranged on a material receiving and discharging bracket, and the material receiving shaft is also connected to a material receiving motor.

[0017] Optionally, the wiping mechanism includes a wiping frame, a plurality of rotating shafts are arranged on the wiping frame, a tensioning wheel and a transition wheel are arranged on the rotating shaft, and the dust-free cloth is connected to the wiping head through the tensioning wheel and the transition wheel;

[0018] The wiping frame is connected to the ruler frame, and a plurality of wiping heads are arranged at the bottom of the ruler frame. The wiping heads include cleaning pressure heads, and the cleaning pressure heads press the dust-free cloth to wipe the gold finger;

[0019] The cleaning pressure head is also connected to a pressure sensor and a buffer spring, and the buffer spring is connected between the cleaning pressure head and the scale frame.

[0020] Optionally, the detection and positioning mechanism comprises a CCD camera, the CCD camera is connected to an adjustment plate, and the adjustment plate is connected to the wiping mechanism;

[0021] A light source is also arranged on the adjustment plate, and the light source is arranged at the bottom of the CCD camera.

[0022] Optionally, the width adjustment mechanism comprises a linear slide rail and an adjustment screw, the support frame is slidably connected to the linear slide rail, and the support frame is vertically arranged to the linear slide rail;

[0023] The adjusting lead screw is arranged in parallel with the linear slide rail, and an adjusting knob is also arranged at one end of the lead screw. The distance between the support frames can be adjusted by rotating the lead screw with the adjusting knob.

[0024] Optionally, the support frame is also connected to a clamping and positioning mechanism, and when the carrier board holding the PCB board reaches the workbench, the clamping and positioning mechanism clamps and lifts the carrier board and places the carrier board on the support frame.

[0025] Optionally, the clamping and positioning mechanism comprises a plurality of lifting cylinders, and the lifting cylinders are slidably connected to the side of the support frame;

[0026] The lifting cylinder is also connected to a clamping plate, and when clamping, the clamping plate abuts against the carrier plate.

[0027] Optionally, the cleaning device further comprises a control mechanism, which controls the actions of the driving mechanism, the dust-free cloth mechanism, the wiping mechanism and the detection and positioning mechanism.

[0028] The technical solution of the present invention uses a detection and positioning mechanism, a wiping mechanism and a driving mechanism to detect whether the positioning and placement are correct before cleaning and wiping, and after wiping, the detection and positioning mechanism can also be used to detect whether the wiping is qualified, which saves manpower for detection and can improve production capacity. The support frame assembly adjusts the width between the support frames through the width adjustment mechanism, which can adapt to different working environments and improve the applicability of the cleaning device. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0030] Figure 1 It is a structural schematic diagram of an embodiment of a gold finger cleaning device of the present invention;

[0031] Figure 2 It is a structural schematic diagram of an embodiment of a gold finger cleaning device of the present invention;

[0032] Figure 3 It is a structural schematic diagram of an embodiment of a driving mechanism of a gold finger cleaning device of the present invention;

[0033] Figure 4 It is a structural schematic diagram of an embodiment of a dust-free cloth mechanism and a wiping mechanism of a gold finger cleaning device of the present invention;

[0034] Figure 5 It is a structural schematic diagram of an embodiment of a cleaning head of a gold finger cleaning device of the present invention;

[0035] Figure 6 It is a structural schematic diagram of an embodiment of a support frame assembly of a gold finger cleaning device of the present invention;

[0036] Description of Figure Numbers:

[0037]

[0038]

[0039] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0042] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0044] The invention provides a gold finger cleaning device.

[0045] In the embodiment of the present invention, Figure 1-6 As shown, the gold finger cleaning device comprises:

[0046] A frame, wherein the frame is provided with a workbench 101, and a driving shaft column 102 is provided on the workbench 101;

[0047] A driving mechanism 200, wherein the driving mechanism 200 is disposed on the driving shaft column 102;

[0048] A dust-free cloth mechanism 300, wherein the dust-free cloth mechanism 300 is connected to the driving mechanism 200;

[0049] A wiping mechanism 400, which is connected to the driving mechanism 200 and disposed below the dust-free cloth mechanism 300, and is used to wipe the gold finger;

[0050] A detection and positioning mechanism 500, wherein the detection and positioning mechanism 500 is disposed on one side of the wiping mechanism 400;

[0051] The support frame assembly 600 includes a plurality of groups of support frames 601. The support frame assembly 600 is arranged between the drive shaft columns 102 and below the wiping mechanism 400. The support frame assembly 600 is connected to a width adjustment mechanism 700, and the width adjustment mechanism 700 is used to adjust the distance between each group of support frames 601.

[0052] In this embodiment, a machine cover is also provided on the frame, and an inlet and an outlet for transporting the carrier 900 are provided on the machine cover, as well as an observation port for easy viewing. Four drive shaft columns 102 are provided, and the drive mechanism 200 drives the dust-free cloth mechanism 300 and the wiping mechanism 400 to move to complete the cleaning. Each group of support frames 601 includes two support frames 601 arranged in parallel, and the support frames 601 are arranged parallel to the direction of movement of the carrier 900.

[0053] The technical solution of the present invention uses the detection and positioning mechanism 500, the wiping mechanism 400 and the driving mechanism 200 to detect whether the positioning and placement are correct before cleaning and wiping, and after wiping, the detection and positioning mechanism 500 can also be used to detect whether the wiping is qualified, which saves manpower for detection and can improve production capacity. The support frame assembly 600 adjusts the width between the support frames through the width adjustment mechanism, which can adapt to different working environments and improve the applicability of the cleaning device.

[0054] Optionally, the driving mechanism 200 includes: a Y-axis active module 202, a Y-axis driven module 203, a Z-axis module 204 and an X-axis module 201;

[0055] A crossbeam 103 is arranged on the top of the driving shaft column 102, and the Y-axis active module 202 and the Y-axis driven module 203 are arranged on the crossbeam 103. The X-axis module 201 is slidably connected to the Y-axis active module 202 and the Y-axis driven module 203, and the Z-axis module 204 is slidably connected to the X-axis module 201.

[0056] In this embodiment, the crossbeam 103 spans over the two drive shaft columns 102, and the crossbeam 103 is vertically arranged with the support frame 601. Among them, a Y-axis active module 202 is arranged on one crossbeam 103, and a Y-axis driven module 203 is arranged on the other crossbeam 103. The X-axis module 201 spans and slides between the Y-axis active module 202 and the Y-axis driven module 203, so that the X-axis module 201 can slide along the Y-axis. The Z-axis module 204 is slidably connected to the X-axis module 201 and slides in the X-axis direction.

[0057] Furthermore, the wiping mechanism 400 and the dust-free cloth mechanism 300 are both connected to the Z-axis module 204 .

[0058] In this way, the wiping mechanism 400 and the dust-free cloth mechanism 300 can slide in the Z-axis direction to adjust their height. Thus, the driving mechanism 200 drives the wiping mechanism 400 and the dust-free cloth mechanism 300 to move in the X, Y, and Z directions to adjust the position with the gold finger, which is convenient for wiping and improves the accuracy and wiping efficiency.

[0059] Optionally, the dust-free cloth mechanism 300 includes a receiving wheel 301 and a discharging wheel 302, and the dust-free cloth is wound around the receiving wheel 301 after being released by the discharging wheel 302;

[0060] The receiving wheel 301 is arranged on the receiving shaft 303 , the unloading wheel 302 is arranged on the unloading shaft 304 , and both the receiving shaft 303 and the unloading shaft 304 are arranged on a receiving and unloading bracket 305 , and the receiving shaft 303 is also connected to a receiving motor 306 .

[0061] In this embodiment, the material receiving and unloading bracket 305 is connected to the Z-axis module 204 through a fixed block, and a plurality of receiving wheels 301 and unloading wheels 302 are provided. Correspondingly, one receiving wheel 301 and one unloading wheel 302 correspond to a cleaning head 405 of a wiping mechanism 400, so that several gold fingers can be wiped at one time, thereby improving the wiping efficiency. In the specific implementation process, one unloading wheel 302 is provided on a unloading shaft 304, and a plurality of receiving wheels 301 are provided on a unloading shaft 303. The plurality of unloading wheels 302 are staggered and cooperate with the corresponding receiving wheels 301. The receiving motor 306 drives the receiving shaft 303 to rotate, and the dust-free cloth is collected by the receiving wheel 301 after passing through the cleaning head 405 from the unloading wheel 302.

[0062] Furthermore, the wiping mechanism 400 includes a wiping frame 401, a plurality of rotating shafts 402 are arranged on the wiping frame 401, a tensioning wheel 403 and a transition wheel 404 are arranged on the rotating shaft 402, and the dust-free cloth is connected to the wiping head through the tensioning wheel 403 and the transition wheel 404;

[0063] The wiping frame 401 is connected to the scale frame 406, and a plurality of wiping heads are arranged at the bottom of the scale frame 406. The wiping heads include a cleaning pressure head 405, and the cleaning pressure head 405 presses the dust-free cloth to wipe the gold finger;

[0064] The cleaning pressure head 405 is also connected to a pressure sensor 407 and a buffer spring 408 , and the buffer spring 408 is connected between the cleaning pressure head 405 and the scale frame 406 .

[0065] In the specific implementation process, the wiping frame 401 can be integrated with the material receiving and releasing bracket 305 of the dust-free cloth mechanism 300 to save space and installation procedures. A corresponding number of rotating shafts 402 are respectively arranged on both sides of the wiping frame 401, and a number of tensioning wheels 403 and transition wheels 404 are arranged on the rotating shafts 402, and each dust-free cloth corresponds to a tensioning wheel 403 and a transition wheel 404.

[0066] One end of the scale frame 406 is fixed on the wiping frame 401. The scale frame is provided with a scale to facilitate adjusting the distance between the wiping heads and improve the accuracy of wiping. Furthermore, a detergent spray head is provided next to the wiping head to continuously spray detergent during the wiping process to improve the wiping effect. The driving mechanism 200 drives the wiping mechanism 400 to move in different directions, so that the wiping head can wipe the gold fingers at different positions to improve the accuracy.

[0067] In practice, when the cleaning head 405 presses the gold finger for wiping, the pressing force may be too large or too small, so a pressure sensor 407 is provided on the cleaning head 405, and the pressure sensor 407 can transmit the pressure value to the control mechanism in time to control the pressure of the cleaning head 405. When the pressure is too large, the buffer spring 408 can buffer a certain amount of pressure to protect the PCB board from being crushed.

[0068] The specific wiping process is:

[0069] The X, Y, and Z axes drive the wiping assembly to move above the fixture to wipe the first group of 4 products (8 positions to be wiped) at a time (the dust-free cloth moves with the wiping head during wiping), divided into 2 wipes. After completion, the dust-free cloth mechanism 300 sends a new dust-free cloth, and the Y-axis module of the wiping mechanism 400 moves forward 60mm (the dust-free cloth moves with the wiping head during wiping). The wiping mechanism 400 continues to wipe the second group of 4 products (8 positions to be wiped), and the wiping head presses down the dust-free cloth and moves to complete the wiping, divided into 2 wipes. After completion, the dust-free cloth mechanism 300 sends a new dust-free cloth, and the Y-axis module of the wiping module continues to move forward 60mm to wipe the third group of products (4 products) (the dust-free cloth moves with the wiping head during wiping), divided into 2 wipes;

[0070] Once you are done, then return to a safe location;

[0071] Repeat the actions in sequence.

[0072] Optionally, the detection and positioning mechanism 500 includes a CCD camera 501, the CCD camera 501 is connected to an adjustment plate 502, and the adjustment plate 502 is connected to the wiping mechanism 400;

[0073] A light source 503 is also disposed on the adjustment plate 502 , and the light source 503 is disposed at the bottom of the CCD camera 501 .

[0074] The CCD camera 501 adjusts the observation accuracy by adjusting the position on the adjustment plate 502. The detection precision positioning mechanism moves synchronously with the wiping mechanism 400 to achieve detection before wiping. In addition, the lens of the CCD camera 501 is opposite to the light source 503.

[0075] Specifically, the procedures for detecting positioning and detecting wiping effect are as follows:

[0076] The CCD mechanism moves to the top of the carrier plate 900 driven by the X, Y and Z axes, and then the Z axis moves downward. Driven by the X and Y axes, each product is photographed by the CCD in turn to detect whether the placement and positioning are OK.

[0077] or:

[0078] Check whether there is dirt, water marks, dust, etc. If not, then clean OK;

[0079] If any of them is positioning NG, the equipment will alarm and the operator will handle it;

[0080] If all positioning is OK, start wiping.

[0081] or:

[0082] If any one of them is cleaning NG, the equipment will alarm and the operator will handle it;

[0083] If everything is cleaned OK, then the wiping is finished.

[0084] Optionally, the width adjustment mechanism 700 includes a linear slide rail 701 and an adjustment screw 702, the support frame 601 is slidably connected to the linear slide rail 701, and the support frame 601 is vertically arranged to the linear slide rail 701;

[0085] The adjusting screw 702 is arranged in parallel with the linear guide rail 701 , and an adjusting knob 703 is also arranged at one end of the screw. The distance between the supporting frames 601 can be adjusted by rotating the screw with the adjusting knob 703 .

[0086] In this embodiment, a support plate is arranged between the drive shaft columns 102, the support plate is arranged parallel to the support frame 601, and the width adjustment mechanism 700 is mounted on the support plate. Specifically, support plates are arranged on both sides of the support frame assembly 600, and the adjustment screw 702 and the linear slide rail 701 span and penetrate the two support plates. The support frame 601 is also slidably connected to the linear slide rail 701 through a slider, and the support frame 601 is threadedly connected to the screw. In this way, the distance between the support frames 601 can be adjusted by rotating the screw.

[0087] Optionally, the support frame 601 is also connected to a clamping and positioning mechanism 800 , and when the carrier plate 900 holding the PCB board reaches the workbench 101 , the clamping and positioning mechanism 800 clamps and lifts the carrier plate 900 and places the carrier plate 900 on the support frame 601 .

[0088] In the specific implementation process, the workbench 101 is connected to the conveyor line, and the carrier 900 is transported by the conveyor line. In addition, a number of evenly distributed placement slots are set on the carrier 900, and the PCB boards are neatly arranged in the placement slots. When the carrier 900 reaches the clamping and positioning mechanism 800 of the workbench 101, the clamping and positioning mechanism 800 works. As an optional solution, a photoelectric monitoring component is set on the clamping and positioning mechanism 800, and when the photoelectric monitoring component detects the carrier 900, the clamping and positioning mechanism 800 is triggered to start action.

[0089] Furthermore, the clamping and positioning mechanism 800 includes a plurality of lifting cylinders 801, and the lifting cylinders 801 are slidably connected to the side of the support frame 601;

[0090] The lifting cylinder 801 is also connected to a clamping plate 802 . When clamping, the clamping plate 802 abuts against the carrier plate 900 .

[0091] In the specific implementation process, a pressure plate is also provided on the support frame 601. After the clamping plate 802 clamps and lifts the carrier 900, the top of the carrier 900 still contacts the pressure plate, so that the stability of the carrier 900 can be improved. When wiping, the carrier 900 will not move, ensuring the effectiveness of wiping. Specifically, two lifting cylinders 801 are respectively on both sides of the carrier 900, and jointly clamp and lift one carrier 900.

[0092] Optionally, the cleaning device further comprises a control mechanism, and the control mechanism controls the actions of the driving mechanism 200 , the dust-free cloth mechanism 300 , the wiping mechanism 400 and the detection and positioning mechanism 500 .

[0093] In this embodiment, the control mechanism is an interconnected control system that jointly controls each step of the cleaning device to achieve automatic loading and unloading and multiple groups of wiping, thereby improving the wiping efficiency.

[0094] Thus, the wiping process of the gold finger wiping device provided in this embodiment is as follows:

[0095] 1. The operator places the carrier (including the product) into the conveyor line and transports it to the clamping and positioning mechanism and stops;

[0096] 2. After the carrier plate is automatically positioned and clamped, the cylinder top is lifted up and separated from the conveyor line;

[0097] 3. First use CCD to take pictures of the entire PCB board on the carrier board in sequence to check whether all are placed OK. If NG, the equipment will alarm and the operator will handle it. If OK, wipe it;

[0098] 4. Then the wiping mechanism and the dust-free cloth mechanism (including the alcohol spray valve) move together to wipe the gold fingers on the first group of 4 PCBs at the same time (the dust-free cloth and the cleaning head move together during wiping). After wiping the first gold finger, the Z axis is lifted, the dust-free cloth moves 40mm, and then the second gold finger is wiped;

[0099] 5. After completion, the dust-free cloth mechanism sends a new dust-free cloth, the Y-axis active module and the Y-axis driven module of the wiping mechanism move forward 60mm (the dust-free cloth moves with the wiping head during wiping), the cleaning pressure head moves downward to contact the dust-free cloth, continues to move downward to contact the gold finger, and starts to wipe the second group of 4 products (8 positions to be wiped). After wiping the first gold finger, the Z axis is lifted, the dust-free cloth moves 40mm, and then the second gold finger is wiped;

[0100] 6. After completion, the dust-free cloth mechanism sends a new dust-free cloth, and the Y-axis module without the wiping component moves forward 60mm (the dust-free cloth moves with the wiping head during wiping), the wiping head moves downward to contact the dust-free cloth, and continues to move downward to contact the gold finger, and starts to wipe the third group of 4 products (8 positions to be wiped). After wiping the first position, the Z axis is lifted, the dust-free cloth moves 40mm, and then the second gold finger is wiped;

[0101] 7. Wipe the components back to a safe location and wait;

[0102] 8. After completion, the cylinder automatically retracts, the positioning mechanism releases, the product returns to the conveyor line, and the dust-free cloth mechanism delivers a new dust-free cloth and waits;

[0103] 9. Then the conveyor line completely delivers the carrier plate (including 12 products);

[0104] 10. The reflow line refluxes the empty board;

[0105] 11. Repeat the actions in sequence.

[0106] The above descriptions are only optional embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural changes made using the contents of the present invention's specification and drawings, or directly / indirectly applied in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A gold finger cleaning device, characterized in that: include: A frame, wherein the frame is provided with a workbench, and the workbench is provided with a drive shaft column; A driving mechanism, wherein the driving mechanism is arranged on the driving shaft column; A dust-free cloth mechanism, wherein the dust-free cloth mechanism is connected to the driving mechanism; A wiping mechanism, the wiping mechanism is connected to the driving mechanism and is arranged below the dust-free cloth mechanism, and the wiping mechanism is used to wipe the gold finger; A detection and positioning mechanism, wherein the detection and positioning mechanism is arranged on one side of the wiping mechanism; A support frame assembly, the support frame assembly includes a plurality of groups of support frames, the support frame assembly is arranged between the drive shaft columns and below the wiping mechanism, the support frame assembly is connected to a width adjustment mechanism, and the width adjustment mechanism is used to adjust the distance between each group of the support frames; The support frame is also connected to a clamping and positioning mechanism. When the carrier board containing the PCB board reaches the workbench, the clamping and positioning mechanism clamps and lifts the carrier board and places the carrier board on the support frame. The clamping and positioning mechanism includes a plurality of lifting cylinders, which are slidably connected to the side of the support frame; the lifting cylinders are also connected to a clamping plate, and when clamping, the clamping plate abuts against the carrier plate; The width adjustment mechanism comprises a linear slide rail and an adjustment screw, the support frame is slidably connected to the linear slide rail, and the support frame is vertically arranged to the linear slide rail; The adjusting lead screw is arranged in parallel with the linear slide rail, and an adjusting knob is also arranged at one end of the lead screw. The distance between the support frames can be adjusted by rotating the lead screw with the adjusting knob.

2. The gold finger cleaning device according to claim 1, characterized in that: The driving mechanism includes: a Y-axis active module, a Y-axis driven module, a Z-axis module and an X-axis module; A crossbeam is arranged on the top of the driving shaft column, the Y-axis active module and the Y-axis driven module are arranged on the crossbeam, the X-axis module is slidably connected to the Y-axis active module and the Y-axis driven module, and the Z-axis module is slidably connected to the X-axis module.

3. The gold finger cleaning device according to claim 2, characterized in that: The wiping mechanism and the dust-free cloth mechanism are both connected to the Z-axis module.

4. The gold finger cleaning device according to claim 1, characterized in that: The dust-free cloth mechanism comprises a receiving wheel and a discharging wheel, and the dust-free cloth is wound around the receiving wheel after being released by the discharging wheel; The receiving wheel is arranged on the receiving shaft, the unloading wheel is arranged on the unloading shaft, and both the receiving shaft and the unloading shaft are arranged on a receiving and unloading bracket, and the receiving shaft is also connected to a receiving motor.

5. The gold finger cleaning device according to claim 4, characterized in that: The wiping mechanism comprises a wiping frame, on which a plurality of rotating shafts are arranged, on which a tensioning wheel and a transition wheel are arranged, and the dust-free cloth is connected to the wiping head via the tensioning wheel and the transition wheel; The wiping frame is connected to the ruler frame, and a plurality of wiping heads are arranged at the bottom of the ruler frame. The wiping heads include cleaning pressure heads, and the cleaning pressure heads press the dust-free cloth to wipe the gold finger; The cleaning pressure head is also connected to a pressure sensor and a buffer spring, and the buffer spring is connected between the cleaning pressure head and the scale frame.

6. The gold finger cleaning device according to claim 1, characterized in that: The detection and positioning mechanism includes a CCD camera, the CCD camera is connected to an adjustment plate, and the adjustment plate is connected to the wiping mechanism; A light source is also arranged on the adjustment plate, and the light source is arranged at the bottom of the CCD camera.

7. The gold finger cleaning device according to any one of claims 1 to 6, characterized in that: The cleaning device also includes a control mechanism, which controls the actions of the driving mechanism, the dust-free cloth mechanism, the wiping mechanism and the detection and positioning mechanism.

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