A flip-chip LED light-emitting device and its manufacturing method

Abstract

A flip-chip LED light-emitting device and its manufacturing method include a plastic structure, a metal component, a flip-chip LED chip, and a Zener diode. The plastic structure includes a plastic bracket and a dam ring. The metal component includes a first metal component and a second metal component. The first and second metal components are connected to the plastic bracket, and the dam ring is provided on the upper end surfaces of the first and second metal components. The dam ring includes an inner region and an outer region of the dam ring, and the flip-chip LED chip is provided in the inner region of the dam ring and connected to the first and second metal components. The chip is soldered to the bracket via solder, and the chip itself has no gold wire connection, which improves device reliability. The dam ring is provided within the plastic bracket, dividing the inner portion of the plastic bracket into an inner and an outer portion. The inner portion of the dam ring is used to accommodate the flip-chip LED chip, and the outer portion of the dam ring is filled with highly reflective silicone to improve luminous efficiency. The presence of the dam ring avoids the risk of the highly reflective silicone covering the flip-chip LED chip, ensuring the high brightness of the device.

Description

Technical Field

[0001] The present invention belongs to the technical field of LEDs, and in particular relates to a flip-chip LED light-emitting device and a manufacturing method thereof. Background Art

[0002] The existing light-emitting device includes a plastic bowl, a metal part, an LED chip, a Zener diode, and a wire. The LED chip is fixed to the metal part and connected to the metal part via a wire to form a pathway. The Zener diode is fixed to the metal part and connected in reverse parallel to the two ends of the LED chip to provide static protection for the LED chip. However, this method still has the following shortcomings:

[0003] 1. Formal LEDs require the positive and negative electrodes of the LED chip to be led out through wires. During use, heat or cold can easily cause the metal wires to fall off or break, causing the LED light-emitting device to die.

[0004] 2. In order to enhance the luminous intensity of LED, it is often necessary to plate the metal surface with silver to enhance light reflection. However, the silver layer is easily oxidized and sulfurized by air, which makes the light-emitting device have poor conductivity and low luminous efficiency. Summary of the Invention

[0005] In order to overcome the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a flip-chip LED light-emitting device, aiming to solve the problems of poor conductivity and low luminous efficiency of the existing light-emitting devices.

[0006] In order to achieve the purpose, the present invention adopts the following technical solutions:

[0007] A flip-chip LED light-emitting device, comprising a plastic structure, a metal part, a flip-chip LED chip, and a Zener diode;

[0008] The plastic structure includes a plastic bracket and a dam ring;

[0009] The metal piece includes a first metal piece and a second metal piece;

[0010] The first metal member and the second metal member are connected to the plastic bracket, and the first metal member and the second metal member are separately provided, and the dam ring is provided on the upper end surfaces of the first metal member and the second metal member;

[0011] The dam ring includes an inner area of ​​the dam ring and an outer area of ​​the dam ring, and the flip-chip LED chip is arranged in the inner area of ​​the dam ring and connected to the first metal member and the second metal member;

[0012] The Zener diode is arranged on the first metal member, and the second metal member is provided with a wire connected to the Zener diode.

[0013] Preferably, the first metal part is provided with a positive electrode solid crystal area in the inner area of ​​the dam circle, and the second metal part is provided with a negative electrode solid crystal area in the inner area of ​​the dam circle. The positive and negative electrodes of the flip-chip LED chip are respectively fixed on the positive electrode solid crystal area and the negative electrode solid crystal area by soldering.

[0014] Preferably, the side cross-section of the dam ring is a stepped structure, and the side of the dam ring includes an inner part of the dam ring and an outer part of the dam ring. The thickness of the inner part of the dam ring is less than the thickness of the outer part of the dam ring, and the inner part of the dam ring surrounds to form an internal area of ​​the dam ring.

[0015] Preferably, a Zener placement area is provided on the first metal part, the Zener placement area is located between the dam ring and the plastic bracket, the intersection of the Zener placement area and the plastic bracket is an arc transition structure, and the Zener diode is provided in the Zener placement area.

[0016] Preferably, two pairs of grooves are provided on the first metal member and the second metal member, the notches of the grooves of the first metal member are arranged opposite to the notches of the grooves of the second metal member, the grooves are filled with insulating members, and the dam ring cooperates with the grooves.

[0017] Preferably, the first metal member and the second metal member are provided with through holes, the through holes are filled with fillers, and the upper surface of the fillers is connected to the dam ring.

[0018] Preferably, the area of ​​the inner region of the dam is larger than the area of ​​the flip-chip LED chip, and the flip-chip LED chip overlaps with the contact surface of the inner part of the dam.

[0019] Preferably, the space between the plastic support and the dam ring is filled with highly reflective silicone, and the Zener diode is covered by the highly reflective silicone.

[0020] Preferably, the plastic support is provided with a negative electrode identification area, and the negative electrode identification area is provided with an identification protrusion.

[0021] The present invention also includes a method for manufacturing a flip-chip LED light-emitting device, comprising the following steps:

[0022] The first metal member and the second metal member are fixedly connected to the plastic member bracket respectively, and the dam ring, the insulating member and the filling member are filled between the first metal member and the second metal member and in the through holes of the first metal member and the second metal member;

[0023] The positive and negative electrodes of the flip-chip LED chip are respectively fixedly connected to the positive electrode solid crystal area and the negative electrode solid crystal area through the solder;

[0024] Fixing the Zener diode in the Zener placement area and performing wire bonding;

[0025] Filling the space between the plastic support and the dam with highly reflective silicone, so that the Zener diode is covered by the highly reflective silicone;

[0026] Fluorescent glue is injected into the plastic bracket and heated and cured.

[0027] Compared with the prior art, the solution of the present invention has the following specific beneficial effects:

[0028] A flip-chip LED chip is used, and the chip is soldered in the bracket by soldering. The chip itself has no gold wire connection, and the device reliability is better. A dam ring is provided in the plastic bracket, which divides the inner part of the bowl of the plastic bracket into two parts, the inner and outer parts. The inside of the dam ring is used to place the flip-chip LED chip, and the outside of the dam ring is filled with highly reflective silicone to improve the luminous efficiency. The existence of the dam ring avoids the risk of highly reflective silicone covering the flip-chip LED chip, ensuring the high brightness of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0030] Figure 1 is a structural diagram of a flip-chip LED light-emitting device according to an embodiment of the present invention;

[0031] Figure 2 This is a structural diagram of a flip-chip LED light-emitting device according to an embodiment of the present invention, excluding the flip-chip LED chip;

[0032] Figure 3 is a schematic diagram of a metal member according to an embodiment of the present invention;

[0033] Figure 4 is a schematic cross-sectional view of a flip-chip LED light-emitting device according to an embodiment of the present invention, with the high-reflective silica gel and the fluorescent layer removed;

[0034] Figure 5 is a schematic cross-sectional view of a flip-chip LED light-emitting device according to an embodiment of the present invention;

[0035] Description of reference numerals:

[0036] 10-negative electrode identification area, 101-identification protrusion, 11-plastic bracket, 12-dam ring, 121-dam ring outer part, 122-dam ring inner part, 13-filling part, 14-insulating part, 21-first metal part, 22-second metal part, 211-positive electrode solid crystal area, 221-negative electrode solid crystal area, 3-flip-chip LED chip, 31-solder, 4-Zener diode, 5-wire, 6-through hole, 71-first groove, 72-second groove, 8-high reflective silicone, 9-fluorescent layer. DETAILED DESCRIPTION

[0037] In order to be able to more clearly understand the above-mentioned objects, features and advantages of the present invention, the present invention is described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. In the following description, many specific details are set forth in order to fully understand the present invention. The embodiments described are only part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0039] Depend on Figures 1 to 5 As shown, this embodiment includes a flip-chip LED light-emitting device, including a plastic structure, a metal part, a flip-chip LED chip 3, and a Zener diode 4;

[0040] The plastic structure includes a plastic bracket 11 and a dam ring 12;

[0041] The metal parts include a first metal part 21 and a second metal part 22;

[0042] The first metal member 21 and the second metal member 22 are connected to the plastic bracket 11, and the first metal member 21 and the second metal member 22 are separately provided. The dam ring 12 is provided on the upper end surfaces of the first metal member 21 and the second metal member 22;

[0043] The dam ring 12 includes an inner area of ​​the dam ring 12 and an outer area of ​​the dam ring 12. The first metal member 21 is provided with a positive electrode solidification area 211 in the inner area of ​​the dam ring 12. The second metal member 22 is provided with a negative electrode solidification area 221 in the inner area of ​​the dam ring 12.

[0044] The flip-chip LED chip 3 is arranged in the inner area of ​​the dam ring 12, and the positive and negative electrodes of the flip-chip LED chip 3 are respectively fixed on the positive electrode solid crystal area 211 and the negative electrode solid crystal area 221 by solder 31;

[0045] A Zener placement area is provided on the first metal member 21. The end surface of the Zener placement area is a convex arc structure. The Zener placement area is located between the dam ring 12 and the plastic bracket 11. The Zener diode 4 is provided in the Zener placement area. The second metal member 22 is provided with a wire 5, and the wire 5 is connected to the Zener diode 4.

[0046] Highly reflective silicone 8 is filled between the plastic support 11 and the dam ring 12 , and the Zener diode 4 is covered by the highly reflective silicone 8 .

[0047] Compared with the prior art, the solution of the present invention has the following specific beneficial effects:

[0048] 1. Using flip-chip LED chips 3, the chips are soldered in the bracket by solder 31. The chips themselves have no gold wire connection, and the reliability of the entire light-emitting device is better.

[0049] 2. A dam ring 12 is provided inside the plastic bracket 11, dividing the inner portion of the bowl of the plastic bracket 11 into two parts, the inner portion and the outer portion. The inner portion of the dam ring 12 is used to place the flip-chip LED chip 3, and the outer portion of the dam ring 12 is filled with highly reflective silicone rubber 8 to improve the luminous efficiency. The presence of the dam ring 12 avoids the risk of the highly reflective silicone rubber 8 covering the flip-chip LED chip 3, thereby ensuring the high brightness of the device.

[0050] 3. After filling with highly reflective silicone 8, a protective layer is formed to prevent the metal parts from being oxidized and sulfurized;

[0051] 4. A Zener placement area is provided. The intersection of the Zener placement area and the plastic bracket is an arc transition structure, which is beneficial to the die bonding and subsequent wire bonding operations of the Zener diode 4. The Zener diode 4 placement area is located between the dam ring 12 and the plastic bracket 11 and can be covered by high-reflective silicone 8, thereby avoiding the Zener diode 4 from absorbing light. The high-reflective silicone 8 covers the Zener diode 4 and some metal parts, thereby improving the reflectivity of light and enhancing the luminous efficiency of the device.

[0052] Specifically, the side cross-section of the dam ring 12 is a stepped structure. The side of the dam ring 12 includes an inner dam ring portion 122 and an outer dam ring portion 121. The thickness of the inner dam ring portion 122 is less than that of the outer dam ring portion 121. The inner dam ring portion 122 surrounds and forms the interior area of ​​the dam ring 12. The structure of the dam ring 12 helps to stably place the flip-chip LED within the dam ring 12, reducing the positional deviation of the flip-chip LED chip 3.

[0053] Specifically, refer to Figure 3 The first metal part 21 and the second metal part 22 are provided with two pairs of grooves, namely the first groove 71 and the second groove 72. The notches of the grooves of the first metal part 21 and the notches of the grooves of the second metal part 22 are arranged opposite to each other. The grooves are filled with insulating parts 14, and the dam ring 12 cooperates with the grooves. The first metal part 21 and the second metal part 22 are provided with through holes 6, and the through holes 6 are filled with fillers 13. The upper surface of the filler 13 is connected to the dam ring 12. The provision of grooves and through holes 6 helps to form a full dam ring 12 during the injection molding / mold top process of the bracket; at the same time, the presence of the through holes 6 can also strengthen the combination of the plastic bracket 11 and the metal parts, thereby improving the strength of the entire bracket.

[0054] Specifically, the area of ​​the inner region of the dam ring 12 is larger than the area of ​​the flip-chip LED chip 3 , and the contact surface of the flip-chip LED chip 3 and the inner part 122 of the dam ring overlap.

[0055] Specifically, a negative electrode identification area 10 is provided on the plastic support near the negative electrode die-bonding area, and the negative electrode identification area 10 is provided with an identification protrusion 101. The provided negative electrode identification area and identification protrusion structure can facilitate operators to better identify the negative electrode area and play a fool-proof role.

[0056] The present invention also includes a method for manufacturing a flip-chip LED light-emitting device, comprising the following steps:

[0057] The first metal member 21 and the second metal member 22 are fixedly connected to the plastic member bracket respectively, and the dam ring 12, the insulating member 14 and the filling member 13 are filled between the first metal member 21 and the second metal member 22 and at the through hole 6 of the first metal member 21 and the second metal member 22;

[0058] The positive and negative electrodes of the flip-chip LED chip 3 are respectively fixedly connected to the positive electrode solid crystal area 211 and the negative electrode solid crystal area 221 through the solder 31;

[0059] Fixing the Zener diode 4 in the Zener placement area and performing wire bonding;

[0060] Fill the space between the plastic support 11 and the dam ring 12 with highly reflective silicone 8, and cover the Zener diode 4 with the highly reflective silicone 8;

[0061] Fluorescent glue is injected into the plastic support 11 and heated and cured to form a fluorescent layer 9 .

[0062] The above description is merely a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Therefore, any modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention shall still fall within the scope of the technical solution of the present invention.

Claims

1. A flip-chip LED light-emitting device, characterized in that: Including plastic structure, metal parts, flip-chip LED chips, Zener diodes; The plastic structure includes a plastic bracket and a dam ring; The metal piece includes a first metal piece and a second metal piece; The first metal member and the second metal member are connected to the plastic bracket, and the first metal member and the second metal member are separately provided, and the dam ring is provided on the upper end surfaces of the first metal member and the second metal member; The dam ring includes an inner area of ​​the dam ring and an outer area of ​​the dam ring, and the flip-chip LED chip is arranged in the inner area of ​​the dam ring and connected to the first metal member and the second metal member; The Zener diode is provided on the first metal member, and the second metal member is provided with a wire, and the wire is connected to the Zener diode; The side cross-section of the dam ring is a stepped structure. The side of the dam ring includes an inner dam ring portion and an outer dam ring portion. The thickness of the inner dam ring portion is less than that of the outer dam ring portion. The inner dam ring portion surrounds and forms an inner area of ​​the dam ring. A Zener placement area is provided on the first metal member, the Zener placement area is located between the dam ring and the plastic bracket, the intersection of the Zener placement area and the plastic bracket is an arc transition structure, and the Zener diode is provided in the Zener placement area; Two pairs of grooves are provided on the first metal member and the second metal member, the notches of the grooves of the first metal member are arranged opposite to the notches of the grooves of the second metal member, the grooves are filled with insulating members, and the dam ring is matched with the grooves; Highly reflective silica gel is filled between the plastic support and the dam ring, and the Zener diode is covered by the highly reflective silica gel.

2. The flip-chip LED light-emitting device according to claim 1, characterized in that: The first metal part is provided with a positive electrode solid crystal area in the inner area of ​​the dam circle, and the second metal part is provided with a negative electrode solid crystal area in the inner area of ​​the dam circle. The positive and negative electrodes of the flip-chip LED chip are respectively fixed on the positive electrode solid crystal area and the negative electrode solid crystal area by soldering.

3. The flip-chip LED light-emitting device according to claim 1, characterized in that: The first metal member and the second metal member are provided with through holes, the through holes are filled with filling members, and the upper surfaces of the filling members are connected to the dam ring.

4. The flip-chip LED light-emitting device according to claim 1, characterized in that: The area of ​​the inner region of the dam is larger than the area of ​​the flip-chip LED chip, and the flip-chip LED chip overlaps with the contact surface of the inner part of the dam.

5. The flip-chip LED light-emitting device according to any one of claims 1 to 4, characterized in that: The plastic support is provided with a negative electrode identification area, and the negative electrode identification area is provided with an identification protrusion.

6. A method for manufacturing a flip-chip LED light-emitting device according to any one of claims 1 to 5, characterized in that: The steps include: The first metal member and the second metal member are fixedly connected to the plastic bracket respectively, and the dam ring, the insulating member and the filling member are filled between the first metal member and the second metal member and in the through holes of the first metal member and the second metal member; The positive and negative electrodes of the flip-chip LED chip are respectively fixedly connected to the positive electrode solid crystal area and the negative electrode solid crystal area through the solder; Fixing the Zener diode in the Zener placement area and performing wire bonding; Filling the space between the plastic bracket and the dam ring with highly reflective silicone, so that the Zener diode is covered by the highly reflective silicone; Fluorescent glue is injected into the plastic bracket and heated and cured.

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